A device for plating copper on a circuit board with a special-shaped hole with uniform thickness

Abstract

The application discloses a kind of thick uniformity's circuit board special-shaped hole copper plating device, it is related to circuit board special-shaped hole copper plating technical field, including copper plating frame and circuit board frame, the bottom of copper plating frame is provided with shaft body, and the bottom of shaft body is equipped with servo motor, the outside of copper plating frame bottom one side is provided with transmission assembly for assisting uniform copper plating, and transmission assembly includes built-in column, transmission gear and tooth, the end of built-in column is provided with transmission gear, and the bottom outer surface of transmission gear is engaged with tooth.The thick uniformity's circuit board special-shaped hole copper plating device, by the design of limiting component, it is convenient to fix multiple groups of different thickness circuit boards, by the design of auxiliary assembly, it can be ensured that the heat of drying frame when drying circuit board after copper plating ends is not more external, and at the same time, the excess copper plating liquid will fall to the surface of cover plate, and drop into copper plating frame through leakage hole, it is convenient to collect and use copper plating liquid.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of copper plating of irregular holes in circuit boards, in particular to a copper plating device for irregular holes in circuit boards with uniform thickness. BACKGROUND

[0002] In the process of manufacturing PCBs (printed circuit boards), copper plating of irregular holes (non-standard shaped holes) is an important step that affects the electrical conductivity and mechanical strength of the circuit board. The copper plating device for irregular holes is specially designed to handle these non-standard holes to ensure that they are uniformly plated with copper.

[0003] For example, the application with application number CN202020752024.3 relates to the production technology of printed circuit boards and discloses a circuit board copper plating device, which includes a main box body, a transmission mechanism located at the top of the main box body, and a circuit board rack connected with the transmission mechanism. The copper plating device in this application can effectively improve the uniformity of copper plating on the circuit board, improve the production efficiency of the circuit board, and has a wide range of applications. However, the thickness of the irregular holes in the circuit board is not uniform when copper plating, and the copper plating solution cannot fully contact the circuit board placed together.

[0004] Therefore, in view of the above, the existing structure and deficiencies are improved, and a copper plating device for irregular holes in circuit boards with uniform thickness is provided. SUMMARY

[0005] The purpose of the present application is to provide a copper plating device for irregular holes in circuit boards with uniform thickness to solve the problems raised in the background art.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solution: a copper plating device for irregular holes in circuit boards with uniform thickness, which includes a copper plating frame and a circuit board frame. The bottom of the copper plating frame is provided with a shaft body, and the bottom of the shaft body is installed with a servo motor. The outside of one side of the bottom of the copper plating frame is provided with a transmission assembly for assisting uniform copper plating, and the transmission assembly includes an internal column, a transmission gear, and teeth. The end of the internal column is provided with a transmission gear, and the bottom outer surface of the transmission gear is provided with teeth. One side of the transmission gear is installed with a connecting assembly for position conversion, and the connecting assembly includes a connecting shaft, a fixed plate, and a connecting plate. The outer surface of the connecting shaft is installed with a fixed plate, and the end of the fixed plate is provided with a connecting plate. The circuit board frame is arranged at the end of the connecting plate.

[0007] Further, the inside of the circuit board frame is installed with a limiting assembly for limiting the circuit board, and the limiting assembly includes an internal frame, a threaded rod, an internal slot, and a positioning plate. The threaded rods are screw-mounted at the four corners of the internal frame, and the outer surface of the threaded rods is screw-mounted with the positioning plate. The internal slots are opened at the four corners of the internal frame near the outside of the positioning plate.

[0008] Further, the servo motor is externally provided with a mounting frame, and a chassis is mounted at the bottom of the mounting frame.

[0009] Further, a connecting plate is arranged at one side of the outer surface of the chassis, and a vertical plate is mounted at one end of the connecting plate.

[0010] Further, mounting plates are fixedly mounted at both sides of the outer surface of the vertical plate through bolts, and a top plate is arranged at one side of the mounting plates.

[0011] Further, a drying frame is mounted at the outer surface of the top plate, and a heating wire tube is arranged in the drying frame.

[0012] Further, an auxiliary assembly for assisting in drying the special-shaped hole of the circuit board after copper plating is arranged at the bottom of the drying frame, and the auxiliary assembly comprises a side frame, a bottom frame and a sliding block, the bottom frame is arranged at the bottom of the side frame, and the sliding block is slidingly mounted in the bottom frame.

[0013] Further, the auxiliary assembly further comprises a cover plate and a leakage hole, and the outer surface of the sliding block is provided with the cover plate, and the leakage hole is formed in the cover plate.

[0014] The present application provides a copper plating device for circuit board special-shaped hole with uniform thickness, which has the following advantages:

[0015] 1. The copper plating frame rotates the gear to follow, so that the gear meshes with the transmission gear, and the transmission gear rotates around the built-in column, so that the entire connecting assembly follows, which is beneficial to the overturning of the circuit board frame with the circuit board placed at the end of the connecting plate. The copper plating frame is provided with a conventional copper plating solution and a copper plating electrode for copper plating operation on the circuit board. During the overturning of the circuit board frame, the copper plating solution in the copper plating frame can be stirred synchronously, which is beneficial to the contact between the copper plating solution and the circuit board placed in the circuit board frame, ensures the uniform contact between the copper plating solution and the circuit board in the circuit board frame, and facilitates the uniform thickness of the copper plating of the circuit board special-shaped hole.

[0016] 2. The design of the limiting assembly facilitates the fixation of multiple groups of circuit boards with different thicknesses. The design of the auxiliary assembly can ensure that the heat generated by the drying frame when drying the circuit board after copper plating is not too much, and the excess copper plating solution can fall to the surface of the cover plate and drip into the copper plating frame through the leakage hole, which facilitates the collection and use of the copper plating solution. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a whole structure schematic view of the copper plating device for circuit board special-shaped hole with uniform thickness.

[0018] Figure 2A schematic view of the transmission assembly and the connecting assembly structure of the copper plating device for the irregular hole of the circuit board with uniform thickness of the present application;

[0019] Figure 3 A schematic view of the limiting assembly structure of the copper plating device for the irregular hole of the circuit board with uniform thickness of the present application;

[0020] Figure 4 A schematic view of the copper plating frame and the bottom plate connecting structure of the copper plating device for the irregular hole of the circuit board with uniform thickness of the present application;

[0021] Figure 5 A schematic view of the auxiliary assembly of the copper plating device for the irregular hole of the circuit board with uniform thickness of the present application.

[0022] In the figure: 1, copper plating frame; 2, bottom plate; 3, connecting plate; 4, vertical plate; 5, mounting plate; 6, top plate; 7, drying frame; 8, transmission assembly; 801, built-in column; 802, transmission gear; 803, gear teeth; 9, connecting assembly; 901, connecting shaft; 902, fixed plate; 903, connecting plate; 10, circuit board frame; 11, limiting assembly; 1101, built-in frame; 1102, threaded rod; 1103, built-in groove; 1104, positioning plate; 12, shaft body; 13, mounting bracket; 14, servo motor; 15, heating wire tube; 16, auxiliary assembly; 1601, side bracket; 1602, bottom frame; 1603, sliding block; 1604, cover plate; 1605, leakage hole. DETAILED DESCRIPTION

[0023] The embodiments of the present application will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the present application, but cannot be used to limit the scope of the present application.

[0024] As Figure 1 , Figure 2 and Figure 4As shown, a kind of thick uniformity circuit board irregular hole copper plating device, including copper plating frame 1, base 2, connecting plate 3, stand 4, mounting plate 5, top plate 6, drying frame 7, transmission assembly 8, built-in column 801, transmission gear 802, gear teeth 803, connecting assembly 9, link shaft 901, fixed plate 902, connecting plate 903, circuit board frame 10, limiting assembly 11, built-in frame 1101, threaded rod 1102, built-in groove 1103, positioning plate 1104, shaft 12, mounting bracket 13, servo motor 14, heating wire tube 15, auxiliary assembly 16, side bracket 1601, bottom frame 1602, sliding block 1603, cover plate 1604 and leakage hole 1605, the bottom of copper plating frame 1 is provided with shaft 12, and the bottom of shaft 12 is provided with servo motor 14, the outside of servo motor 14 is provided with mounting bracket 13, and the bottom of mounting bracket 13 is provided with base 2, one side of the outer surface of base 2 is provided with connecting plate 3, one end of connecting plate 3 is provided with stand 4, and the outer surface of stand 4 is provided with mounting plate 5 on both sides by bolt fixing, and one side of mounting plate 5 is provided with top plate 6, the outside of one side of the bottom of copper plating frame 1 is provided with transmission assembly 8 for assisting uniform copper plating, and transmission assembly 8 includes built-in column 801, transmission gear 802 and gear teeth 803, the end of built-in column 801 is provided with transmission gear 802, and the bottom outer surface of transmission gear 802 is provided with gear teeth 803, one side of transmission gear 802 is provided with connecting assembly 9 for position conversion in the middle, and connecting assembly 9 includes link shaft 901, fixed plate 902 and connecting plate 903, the outer surface of link shaft 901 is provided with fixed plate 902, the end of fixed plate 902 is provided with connecting plate 903, and circuit board frame 10 is arranged at the end of connecting plate 903, the rotation of copper plating frame 1 can be realized by the design of servo motor 14 and shaft 12, the gear teeth 803 follow the movement of copper plating frame 1, so that the gear teeth 803 mesh with the transmission gear 802, so that the transmission gear 802 rotates around the built-in column 801, so that the whole connecting assembly 9 follows, which is beneficial to the circuit board frame 10 placed at the end of connecting plate 903 to be turned over, wherein copper plating frame 1 is provided with conventional copper plating solution and copper plating electrode, for copper plating operation on circuit board, the copper plating solution in copper plating frame 1 can be stirred synchronously during the turning process of circuit board frame 10, which is beneficial to the contact between copper plating solution and circuit board stacked in circuit board frame 10, to ensure that copper plating solution and circuit board in circuit board frame 10 are fully contacted and uniform, which is beneficial to the copper plating thickness uniformity of circuit board irregular hole.

[0025] As Figure 2 And Figure 3As shown, the inside of the circuit board frame 10 is mounted with a limiting assembly 11 for limiting the circuit board, and the limiting assembly 11 comprises an inner frame 1101, a threaded rod 1102, an inner groove 1103 and a positioning plate 1104, the threaded rod 1102 is threadedly installed at the four corners of the inner frame 1101, and the outer surface of the threaded rod 1102 is threadedly installed with the positioning plate 1104, the inner groove 1103 is opened at the four corners of the inside of the circuit board frame 10 close to the outside of the positioning plate 1104, by rotating the threaded rod 1102 clockwise or counterclockwise, the positioning plate 1104 outside the threaded rod 1102 can be controlled to move up or down in the inner groove 1103, so that the circuit board placed in the inner frame 1101 can be limited, wherein the positioning plate 1104 is provided in multiple groups, and the rotation of the threaded rod 1102 can synchronously control the downward movement of the multiple groups of positioning plates 1104, which is convenient for fixing the circuit boards with different thicknesses.

[0026] As shown in Figure 1 and Figure 5 As shown, the outer surface of the top plate 6 is mounted with a drying frame 7, and the inside of the drying frame 7 is provided with a heating wire tube 15, the rotation of the copper-plated frame 1 can be controlled through the design of the servo motor 14 and the shaft body 12, the copper-plated frame 1 rotates the gear teeth 803, so that the gear teeth 803 will engage with the transmission gear 802, so that the transmission gear 802 rotates around the built-in column 801, so that the entire connecting assembly 9 follows, which is convenient for the circuit board frame 10 placed at the end of the connecting plate 903 to be turned over, and the circuit board after copper plating can be turned over to the inside of the drying frame 7 through the turning over of the circuit board frame 10, and the circuit board after copper plating can be dried by using the heating wire tube 15, which is simple in structure and does not need to be manually transferred by the user in the copper plating operation area and the drying area, and the bottom of the drying frame 7 is provided with an auxiliary assembly 16 for assisting the drying of the special-shaped hole of the circuit board after copper plating, and the auxiliary assembly 16 comprises a side stand 1601, a bottom frame 1602 and a sliding block 1603, the bottom of the side stand 1601 is provided with the bottom frame 1602, and the inside of the bottom frame 1602 is slidably installed with the sliding block 1603, the auxiliary assembly 16 further comprises a cover plate 1604 and a leakage hole 1605, and the outer surface of the sliding block 1603 is provided with the cover plate 1604, and the inside of the cover plate 1604 is provided with the leakage hole 1605, which can be used for drying the special-shaped hole of the circuit board by using the drying frame 7, and the position of the sliding block 1603 and the cover plate 1604 can be slid by the design of the bottom frame 1602, so that the two cover plates 1604 can be closed at the opening at the bottom of the drying frame 7, so as to ensure that the heat of the drying frame 7 will not be scattered too much when drying the circuit board after copper plating, and the excess copper plating liquid will fall to the surface of the cover plate 1604 and drip into the copper plating frame 1 through the leakage hole 1605, which is convenient for collecting and using the copper plating liquid.

[0027] In summary, the copper-plated device for the special-shaped hole of the circuit board with uniform thickness can first be used according toFigures 1-5 The structure shown in the middle, when in use, by rotating the threaded rod 1102 clockwise or counterclockwise, the positioning plate 1104 outside the threaded rod 1102 can be controlled to move up or down in the built-in groove 1103, so that the circuit board placed in the built-in frame 1101 can be limited, wherein the positioning plate 1104 is provided with multiple groups, and the rotation of the threaded rod 1102 can synchronously control the multiple groups of positioning plates 1104 to move down, which is convenient for fixing multiple groups of circuit boards with different thicknesses. Then, through the design of the servo motor 14 and the shaft body 12, the copper plating frame 1 can be rotated, and the copper plating frame 1 rotates the gear teeth 803 to follow, so that the gear teeth 803 will mesh with the transmission gear 802, and the transmission gear 802 will rotate around the built-in column 801, so that the entire connecting assembly 9 follows, and the circuit board frame 10 with the circuit board placed at the end of the connecting plate 903 is turned over. The copper plating frame 1 is provided with a conventional copper plating liquid and a copper plating electrode, which is used for copper plating operation on the special-shaped hole of the circuit board. During the overturning process of the circuit board frame 10, the copper plating liquid in the copper plating frame 1 can be stirred synchronously, which is beneficial to the contact between the copper plating liquid and the circuit boards stacked in the circuit board frame 10, ensures that the copper plating liquid fully contacts the circuit boards in the circuit board frame 10 uniformly, and is beneficial to the uniform copper plating thickness of the special-shaped hole of the circuit board. Then, through the design of the servo motor 14 and the shaft body 12, the copper plating frame 1 can be rotated, and the copper plating frame 1 rotates the gear teeth 803 to follow, so that the gear teeth 803 will mesh with the transmission gear 802, and the transmission gear 802 will rotate around the built-in column 801, so that the entire connecting assembly 9 follows, and the circuit board frame 10 with the circuit board placed at the end of the connecting plate 903 is turned over. After the copper plating is completed, the circuit board can be turned over to the inside of the drying frame 7, and the copper plating completed circuit board can be dried by using the heating wire tube 15. The structure is simple, and the user does not need to manually transfer in the copper plating operation area and the drying area. Finally, when the drying frame 7 is used to dry the special-shaped hole of the circuit board, the sliding block 1603 and the cover plate 1604 can be positionally slid by the design of the bottom frame 1602, so that the two cover plates 1604 can close the opening at the bottom of the drying frame 7, so that the heat of the drying frame 7 when drying the copper plated circuit board will not be too much and will not be scattered outside. In addition, the excess copper plating liquid will fall to the surface of the cover plate 1604 and drip into the copper plating frame 1 through the leakage hole 1605.

[0028] The embodiments of the present application are given for example and description, and are not exhaustive or limit the present application to the disclosed forms. Many modifications and changes are obvious to those skilled in the art. The embodiments are selected and described to better illustrate the principles and practical application of the present application, and to enable those skilled in the art to understand the present application so as to design various embodiments with various modifications suitable for specific purposes.

Claims

1. A copper plating device for forming irregularly shaped holes on a circuit board with uniform thickness, comprising a copper plating frame (1) and a circuit board frame (10), characterized in that: The bottom of the copper plating frame (1) is provided with a shaft (12), and a servo motor (14) is installed at the bottom of the shaft (12). A transmission component (8) for assisting uniform copper plating is provided on the outside of one side of the bottom of the copper plating frame (1), and the transmission component (8) includes a built-in column (801), a transmission gear (802) and teeth (803). The end of the built-in column (801) is provided with a transmission gear (802), and the outer surface of the bottom of the transmission gear (802) is meshed with teeth (803). A connecting component (9) for position conversion is installed in the middle of one side of the transmission gear (802), and the connecting component (9) includes a connecting shaft (901), a fixing plate (902) and a connecting plate (903). The outer surface of the connecting shaft (901) is provided with a transmission gear (802). A fixing plate (902) is mounted on the surface, a connecting plate (903) is arranged at the end of the fixing plate (902), the circuit board frame (10) is arranged at the end of the connecting plate (903), a limiting component (11) for limiting the circuit board is installed inside the circuit board frame (10), and the limiting component (11) comprises a built-in frame (1101), a threaded rod (1102), a built-in groove (1103) and a positioning plate (1104), the threaded rod (1102) is threadedly mounted at the four corners of the built-in frame (1101), and the positioning plate (1104) is threadedly mounted on the outer surface of the threaded rod (1102), and the built-in groove (1103) is opened at the four corners of the inside of the circuit board frame (10) near the outside of the positioning plate (1104).

2. The device for electroless copper plating of special-shaped holes in a circuit board with uniform thickness according to claim 1, characterized in that: A mounting frame (13) is provided outside the servo motor (14), and a chassis (2) is installed at the bottom of the mounting frame (13).

3. The device for electroless copper plating of special-shaped holes in a circuit board with uniform thickness according to claim 2, characterized in that: A connecting plate (3) is provided on one side of the outer surface of the chassis (2), and a vertical plate (4) is installed on one end of the connecting plate (3).

4. The device for electroless copper plating of special-shaped holes in a circuit board with uniform thickness according to claim 3, characterized in that: Mounting plates (5) are fixedly mounted on both sides of the outer surface of the vertical plate (4) by means of bolts, and a top plate (6) is provided on one side of the mounting plate (5).

5. The device for electroless copper plating of special-shaped holes in a circuit board with uniform thickness according to claim 4, characterized in that: A drying frame (7) is installed on the outer surface of the top plate (6), and a heating wire tube (15) is provided inside the drying frame (7).

6. The device for electroless copper plating of special-shaped holes in a circuit board with uniform thickness according to claim 5, characterized in that: An auxiliary component (16) for assisting in drying the copper-plated special-shaped holes of a circuit board is provided at the bottom of the drying frame (7), and the auxiliary component (16) comprises a side frame (1601), a bottom frame (1602) and a slider (1603). The bottom of the side frame (1601) is provided with the bottom frame (1602), and the slider (1603) is slidably installed inside the bottom frame (1602).

7. The device for electroless copper plating of circuit board special-shaped holes with uniform thickness according to claim 6, characterized in that: The auxiliary component (16) further comprises a cover plate (1604) and a leakage hole (1605), and the outer surface of the slider (1603) is provided with the cover plate (1604), and the leakage hole (1605) is opened inside the cover plate (1604).

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