Display panel and display device

Abstract

The application provides a display panel and a display device, relates to the technical field of display, and can improve the surface flatness of the display panel. The display panel comprises a substrate, a bonding pad layer located on one side of the substrate, a bonding layer located on the side of the bonding pad layer away from the substrate, light emitting elements located on the side of the bonding layer away from the substrate, the light emitting elements comprising first light emitting elements and second light emitting elements, the first light emitting elements and the second light emitting elements being light emitting elements of different colors, a conductive reflective layer located between the bonding pad layer and the bonding layer, the conductive reflective layer comprising first reflective structures and second reflective structures, wherein the first reflective structures correspond to the first light emitting elements, the second reflective structures correspond to the second light emitting elements, and the first reflective structures are different from the second reflective structures; and / or a support layer comprising at least first support structures, the first support structures being located on the side of the bonding pad layer corresponding to the first light emitting elements and close to the substrate.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of display, and in particular, to a display panel and a display device. BACKGROUND

[0002] With the development and progress of display technologies such as flexible display panels, the requirements for the preparation efficiency and preparation quality of display panels and display devices are also increasing. In the preparation process of a traditional display panel, a bonding metal layer, a bonding layer and a light emitting element are usually arranged in sequence on one side of a substrate, the bonding layer is irradiated by laser to reach a molten state, and the light emitting element and the bonding metal layer are adhered by the bonding layer in the molten state to realize the fixation and electrical connection of the light emitting element.

[0003] However, in the preparation process of the traditional display panel, it is difficult to control the molten state of the bonding layer, which easily leads to inconsistent molten effects of different bonding layers on the same display panel, and further leads to differences in the thickness of the bonding layer after re-solidification, resulting in poor surface flatness of the display panel and affecting the display effect of the display panel. SUMMARY

[0004] Therefore, embodiments of the present application provide a display panel and a display device, which can improve the control ability of the molten state of the bonding layer in the preparation process, improve the consistency of the molten effects of different bonding layers on the same display panel, and further improve the surface flatness of the display panel and improve the display effect of the display panel.

[0005] In a first aspect, a display panel is provided, comprising:

[0006] a substrate;

[0007] a bonding pad layer located on one side of the substrate;

[0008] a bonding layer located on a side of the bonding pad layer away from the substrate;

[0009] a light emitting element located on a side of the bonding layer away from the substrate, the light emitting element comprising a first light emitting element and a second light emitting element, the first light emitting element and the second light emitting element being light emitting elements of different colors;

[0010] a conductive reflective layer located between the bonding pad layer and the bonding layer, the conductive reflective layer comprising a first reflective structure and a second reflective structure, wherein the first reflective structure corresponds to the first light emitting element, the second reflective structure corresponds to the second light emitting element, and the first reflective structure is different from the second reflective structure; and / or

[0011] a support layer comprising at least a first support structure corresponding to the first light emitting element.

[0012] In some embodiments, the first light emitting element has an emission wavelength greater than that of the second light emitting element, and the first reflective structure has a reflectivity less than that of the second reflective structure.

[0013] In some embodiments, the first reflective structure comprises a first reflective material having a reflectivity less than that of a second reflective material comprising the second reflective structure.

[0014] In some embodiments, the first light emitting element has a light transmittance of a first light transmittance, and the second light emitting element has a light transmittance of a second light transmittance, the first light transmittance being greater than the second light transmittance.

[0015] The difference between the reflectivity of the first reflective material and the reflectivity of the second reflective material is positively correlated with the difference between the first light transmittance and the second light transmittance.

[0016] In some embodiments, the first reflective structure has a thickness dimension less than or equal to that of the second reflective structure; and / or,

[0017] The orthographic projection of the bonding layer towards the substrate falls within the orthographic projection of the conductive reflective layer towards the substrate.

[0018] In some embodiments, the orthographic projection of the bonding layer towards the substrate coincides with the edge of the orthographic projection of the conductive reflective layer towards the substrate.

[0019] In some embodiments, the first light emitting element has a light transmittance of a first light transmittance, and the second light emitting element has a light transmittance of a second light transmittance, the first light transmittance being greater than the second light transmittance.

[0020] In the thickness direction of the substrate, the thickness dimension of the first support structure is positively correlated with the difference between the first light transmittance and the second light transmittance.

[0021] In some embodiments, the display panel further comprises:

[0022] a driving circuit layer between the bonding pad layer and the substrate;

[0023] The bonding pad layer comprises first and second bonding pad structures arranged at intervals, the first bonding pad structure being electrically connected to the first light emitting element, and the first bonding pad structure being located on the side of the first support structure away from the substrate.

[0024] The first support structure has an opening, and the second bonding pad structure is located in the opening, and the second bonding pad structure is electrically connected between the first light emitting element and the driving circuit layer through the opening.

[0025] In some embodiments, the support layer further comprises a second support structure, the second support structure is located between the bonding pad layer corresponding to the second light emitting element and the substrate, and the thickness size of the second support structure is smaller than the thickness size of the first support structure.

[0026] In some embodiments, the light emitting element further comprises a third light emitting element, the first light emitting element and the third light emitting element are light emitting elements of different colors.

[0027] The conductive reflective layer further comprises a third reflective structure, wherein the third reflective structure corresponds to the third light emitting element, and the first reflective structure is different from the third reflective structure.

[0028] In some embodiments, the display panel comprises a first region and a second region, the first region is connected with the second region, and the laser energy in the first region is less than the laser energy in the second region.

[0029] The reflectivity of the first reflective structure in the first region is greater than the reflectivity of the first reflective structure in the second region, and the reflectivity of the second reflective structure in the first region is greater than the reflectivity of the second reflective structure in the second region.

[0030] In a second aspect, the embodiments of the present application provide a display device, comprising:

[0031] The display panel according to any one of the first aspect.

[0032] The display panel and the display device provided by the embodiment of the present application can improve the utilization rate of laser energy by arranging the conductive reflection layer between the bonding pad layer and the bonding layer, so that the laser light emitted through the light emitting element can be reflected to the bonding layer by the conductive reflection layer. Further, different reflection structures are arranged according to light emitting elements with different light emitting colors, and the light reflection capability of the reflection structure is adjusted according to the laser transmission amount of different light emitting elements, so that the laser transmission capability of the light emitting element and the light reflection capability of the corresponding reflection structure can be balanced, and the melting state of the bonding layer corresponding to different light emitting elements is consistent under the same laser condition, and the height after melting is consistent. A support layer can be arranged on the side of the bonding pad layer close to the substrate corresponding to the light emitting element with large laser transmission amount, so that the bonding layer thickness of the light emitting element with large laser transmission amount can be increased, thereby compensating for the decrease of the bonding layer thickness of the light emitting element. Therefore, the control capability of the melting state of the bonding layer in the preparation process can be improved, the height uniformity of the bonding layer after bonding of different light emitting elements can be improved, and the surface flatness of the display panel can be further improved, and the display effect of the display panel can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the description of the embodiments of the present application or the related art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other related drawings can be obtained by those skilled in the art without any creative effort.

[0034] Figure 1 A schematic structural diagram of a display panel provided by the embodiment of the present application is shown in the figure.

[0035] Figure 2 A schematic structural diagram of another display panel provided by the embodiment of the present application is shown in the figure.

[0036] Figure 3 A schematic structural diagram of another display panel provided by the embodiment of the present application is shown in the figure.

[0037] Figure 4 A schematic structural diagram of another display panel provided by the embodiment of the present application is shown in the figure.

[0038] Figure 5 A schematic structural diagram of a display panel provided by the embodiment of the present application is shown in the figure.

[0039] Figure 6 A schematic structural diagram of another display panel provided by the embodiment of the present application is shown in the figure.

[0040] Figure 7 A schematic structural diagram of a display device provided by the embodiment of the present application is shown in the figure.

[0041] Reference Signs List:

[0042] 100 - substrate, 200 - bonding pad layer, 210 - first bonding pad structure, 220 - second bonding pad structure, 300 - bonding layer, 400 - light emitting element, 410 - first light emitting element, 420 - second light emitting element, 430 - third light emitting element, 500 - conductive reflective layer, 510 - first reflective structure, 520 - second reflective structure, 530 - third reflective structure, 600 - support layer, 610 - first support structure, 620 - second support structure, 700 - drive circuit layer. DETAILED DESCRIPTION

[0043] For the purposes of this application, reference will be made to the accompanying drawings in which embodiments of the application are illustrated. The application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and fully convey the scope of the application to those skilled in the art.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0045] It should be understood that when an element or layer is referred to as being "on" or "adjacent" or "connected" or "coupled" to another element or layer, it can be directly on, adjacent, connected or coupled to the other element or layer or one or more intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on," "directly adjacent," "directly connected" or "directly coupled" to another element or layer, there are no intervening elements or layers present. It will be appreciated that, although terms such as first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are simply used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section; for example, a first dopant type could be termed a second dopant type, and similarly, a second dopant type could be termed a first dopant type; a first dopant type and a second dopant type are different dopant types, for example, a first dopant type could be P-type and a second dopant type could be N-type, or a first dopant type could be N-type and a second dopant type could be P-type.

[0046] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and / or operation in addition to the orientations depicted in the figures. For example, if a device in the figures is inverted, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The devices can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0047] As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including", or the like, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

[0048] It should be noted that, in the preparation process of the traditional display panel, in order to improve the light extraction efficiency of the light emitting element, a light extraction structure is usually arranged on the surface of the light emitting element. However, since the preparation process of the red light emitting element is different from that of other light emitting elements, it is difficult to form a light extraction structure on the surface of the red light emitting element. In the process of fixing the light emitting element by the laser bonding process, the externally incident laser can be transmitted to the bonding layer through the light emitting element. Since the surface of the red light emitting element is flat, the amount of laser incident in the bonding layer of the red light emitting element is more than that of other light emitting elements with light extraction structures. Therefore, the height loss of the bonding layer of the red light emitting element in the bonding process is the largest, so that the heights of the light emitting elements of different colors on the display panel after the bonding is completed under the same laser condition can be inconsistent, resulting in poor surface flatness of the display panel and affecting the display effect of the display panel.

[0049] Based on the above problems, the display panel and the display device provided by the embodiments of the present application can improve the control ability of the molten state of the bonding layer in the preparation process, improve the consistency of the molten effect of different bonding layers on the same display panel, and further improve the surface flatness of the display panel and improve the display effect of the display panel.

[0050] As Figure 1As shown, the first aspect of the embodiments of the present application provides a display panel, comprising: a substrate 100, a bonding pad layer 200, a bonding layer 300, a light emitting element 400, a conductive reflective layer 500, and a support layer. Wherein the bonding pad layer 200 is located on one side of the substrate 100; the bonding layer 300 is located on the side of the bonding pad layer 200 away from the substrate 100; the light emitting element 400 is located on the side of the bonding layer 300 away from the substrate 100, and the light emitting element 400 comprises a first light emitting element 410 and a second light emitting element 420, the first light emitting element 410 and the second light emitting element 420 are light emitting elements 400 of different colors; the conductive reflective layer 500 is located between the bonding pad layer 200 and the bonding layer 300, and the conductive reflective layer 500 comprises a first reflective structure 510 and a second reflective structure 520, wherein the first reflective structure 510 corresponds to the first light emitting element 410, the second reflective structure 520 corresponds to the second light emitting element 420, and the first reflective structure 510 is different from the second reflective structure 520; the support layer 600 comprises at least a first support structure 610, and the first support structure 610 is located on the side of the bonding pad layer 200 corresponding to the first light emitting element 410 close to the substrate 100.

[0051] For example, the bonding pad layer 200 comprises a metal pad, and the material of the bonding pad layer 200 can comprise a titanium-aluminum-titanium composite material.

[0052] It should be noted that the materials and preparation processes of the first light emitting element 410 and the second light emitting element 420 with different light emitting colors are different, which will cause the surface topography to be different. Further, when external light passes through, the exit angle of the light after passing through the second light emitting element 420 will change, which is difficult to be incident to the bonding layer 300. Therefore, during the laser bonding process, the laser incident amount of the bonding layer 300 corresponding to the first light emitting element 410 and the second light emitting element 420 is different, the melting state of the bonding layer 300 under the action of the laser is different, and the height of the solidified bonding layer 300 is different, which will further cause the surface height of the light emitting element 400 connected with the substrate 100 to be different.

[0053] For example, the bonding pad layer 200 comprises a metal pad, and the material of the bonding pad layer 200 can comprise a titanium-aluminum-titanium composite material. Figure 2As shown, the surface of the first light emitting element 410 away from the substrate 100 is a flat surface, and the surface of the second light emitting element 420 away from the substrate 100 is a concave-convex surface. The laser light rays incident on the bonding layer 300 through the light emitting element 400 can include first light rays L1 and second light rays L2, the first light emitting element 410 corresponds to the first light rays L1, and the second light emitting element 420 corresponds to the second light rays L2. It can be seen that for the first light rays L1, the light path after being emitted through the first light emitting element 410 is basically unchanged, and can be directly incident on the bonding layer 300 corresponding to the first light emitting element 410, so that the bonding layer 300 corresponding to the first light emitting element 410 reaches a molten state. For the second light rays L2, the light path after being emitted through the second light emitting element 420 is changed, and cannot be directly incident on the bonding layer 300 corresponding to the second light emitting element 420, but can be incident on the surface of the second reflecting structure 520, and be re-incident on the bonding layer 300 corresponding to the second light emitting element 420 through the reflection of the second reflecting structure 520, so that the bonding layer 300 corresponding to the second light emitting element 420 reaches a molten state.

[0054] It should be noted that the first reflecting structure 510 and the second reflecting structure 520 are different, which can include that the reflectivity of the first reflecting structure 510 and the second reflecting structure 520 is different, and the shape of the first reflecting structure 510 and the second reflecting structure 520 is different.

[0055] The display panel provided by the embodiment of the present application sets the conductive reflecting layer 500 between the bonding pad layer 200 and the bonding layer 300, so that the laser light rays emitted through the light emitting element 400 can be reflected to the bonding layer 300 by the conductive reflecting layer 500, improving the utilization rate of laser energy. Further, different reflecting structures are set according to light emitting elements 400 with different light emitting colors, and the light ray reflecting ability of the reflecting structure is adjusted according to the laser transmission amount of different light emitting elements 400, so that the laser transmission ability of the light emitting element 400 and the light ray reflecting ability of the corresponding reflecting structure can be balanced, so that under the same laser condition, the molten state of the bonding layer 300 corresponding to different light emitting elements 400 is consistent, and the height after melting is consistent. The support layer 600 can be arranged on the side of the bonding pad layer 200 close to the substrate 100 corresponding to the light emitting element 400 with a large laser transmission amount, and the light emitting element 400 with a large laser transmission amount is raised, so that the thickness reduction of the bonding layer 300 of the light emitting element 400 can be compensated. Therefore, the control ability of the molten state of the bonding layer 300 in the preparation process can be improved, the height uniformity of the bonded different light emitting elements 400 can be improved, and further the surface flatness of the display panel can be improved, and the display effect of the display panel can be improved.

[0056] In some embodiments, the first light emitting element 410 has a larger emission wavelength than the second light emitting element 420, and the first reflective structure 510 has a smaller reflectivity than the second reflective structure 520.

[0057] It should be noted that the first light emitting element 410 can include a light emitting element 400 with a red light emitting color, and the second light emitting element 420 can include a light emitting element 400 with a blue or green light emitting color.

[0058] The display panel provided by the embodiments of the present application can compensate for the laser incidence on the bonding layer 300 corresponding to the second light emitting element 420 by reflecting the laser in the bonding process by the second reflective structure 520 with strong reflection ability, so that the laser incidence on the bonding layer 300 corresponding to the first light emitting element 410 and the second light emitting element 420 is equal, the control ability of the molten state of the bonding layer 300 in the preparation process can be improved, the height uniformity after bonding of different light emitting elements 400 can be improved, and the surface flatness of the display panel can be further improved, and the display effect of the display panel can be improved.

[0059] In some embodiments, the first reflective structure 510 includes a first reflective material with a smaller reflectivity than a second reflective material included in the second reflective structure 520.

[0060] For example, the first reflective structure 510 includes a first reflective material with an absorption rate greater than a second reflective material included in the second reflective structure 520. The first reflective material can include chromium oxide, titanium, nickel, etc., and the second reflective material can include silver and copper, etc.

[0061] The display panel provided by the embodiments of the present application can make the reflectivity of the first reflective structure 510 smaller than the reflectivity of the second reflective structure 520, so that the laser incidence on the bonding layer 300 corresponding to the first light emitting element 410 and the second light emitting element 420 is equal, the control ability of the molten state of the bonding layer 300 in the preparation process can be improved, the height uniformity after bonding of different light emitting elements 400 can be improved, and the surface flatness of the display panel can be further improved, and the display effect of the display panel can be improved.

[0062] In some embodiments, the first light emitting element 410 has a first light transmittance, the second light emitting element 420 has a second light transmittance, the first light transmittance is greater than the second light transmittance, and the difference between the reflectivity of the first reflective material and the reflectivity of the second reflective material is positively correlated with the difference between the first light transmittance and the second light transmittance.

[0063] It should be noted that when the first light transmittance is greater than the second light transmittance, it can be considered that the laser incident amount of the bonding layer 300 corresponding to the first light-emitting element 410 is greater than the laser incident amount of the bonding layer 300 corresponding to the second light-emitting element 420 during the laser bonding process.

[0064] The display panel provided in this application embodiment can easily control the amount of light incident on the bonding layer 300 corresponding to the first light-emitting element 410 and the bonding layer 300 corresponding to the second light-emitting element 420 to be equal, thereby making the heights of the first light-emitting element 410 and the second light-emitting element 420 equal after bonding, which can further improve the surface flatness of the display panel and improve the display effect of the display panel.

[0065] like Figure 3 As shown, in some embodiments, the thickness of the first reflective structure 510 is less than or equal to the thickness of the second reflective structure 520.

[0066] It should be noted that the thickness of the bonding layer 300 corresponding to the first light-emitting element 410 after melting and re-solidification is greater than that of the bonding layer 300 corresponding to the second light-emitting element 420. Therefore, by increasing the thickness of the second reflective structure 520, the second light-emitting element 420 can be raised, thereby further compensating for the height difference between the first light-emitting element 410 and the second light-emitting element 420 caused by the difference in light transmittance, and further improving the surface flatness of the display panel.

[0067] For example, the thickness of the first reflective structure 510 can be less than a preset thickness corresponding to the maximum reflectivity of the material of the first reflective structure 510, and the thickness of the second reflective structure 520 can be greater than a preset thickness corresponding to the maximum reflectivity of the material of the second reflective structure 520. That is, when the thickness of the first reflective structure 510 is less than or equal to the preset thickness, at least part of the light incident on the surface of the first reflective structure 510 will pass through the first reflective structure 510 without reflection. When the thickness of the second reflective structure 520 is greater than the preset thickness, the light incident on the surface of the second reflective structure 520 will not enter the interior of the second reflective structure 520. Therefore, when the thickness of the first reflective structure 510 is less than the preset thickness, by increasing the thickness of the second reflective structure 520, the amount of light absorbed by the second reflective structure 520 relative to the first reflective structure 510 can be reduced, and the amount of light reflected by the second reflective structure 520 can be increased. This can further compensate for the height difference between the first light-emitting element 410 and the second light-emitting element 420 caused by the difference in light transmittance, and further improve the surface flatness of the display panel.

[0068] likeFigure 3 As shown, in some embodiments, the orthographic projection of the bonding layer 300 toward the substrate 100 falls within the orthographic projection of the conductive reflective layer 500 toward the substrate 100.

[0069] For example, the orthographic projection area of ​​the second reflective structure 520 toward the substrate 100 is larger than the orthographic projection area of ​​the first reflective structure 510 toward the substrate 100. The orthographic projection edge of the bonding layer 300 toward the substrate 100 coincides with the orthographic projection edge of the first reflective structure 510 toward the substrate 100, and the orthographic projection edge of the bonding layer 300 toward the substrate 100 falls within the orthographic projection edge of the second reflective structure 520 toward the substrate 100.

[0070] The display panel provided in this application embodiment can increase the reflective area of ​​the conductive reflective layer 500, thereby saving the laser energy and bonding time required for laser bonding, improving the manufacturing efficiency of the display panel, and also improving the stability of the conductive reflective layer 500, avoiding the breakage of the connection between the light-emitting element 400 and the bonding pad layer 200, further improving the stability and reliability of the display panel.

[0071] like Figure 2 As shown, in some embodiments, the orthographic projection of the bonding layer 300 toward the substrate 100 coincides with the edge of the orthographic projection of the conductive reflective layer 500 toward the substrate 100.

[0072] The display panel provided in this application embodiment can avoid the distance between different reflective structures within the conductive reflective layer 500 being too close, causing electrical connections between different reflective structures, which could further lead to the burnout or abnormal display of the corresponding light-emitting element 400. This can reduce the risk of dead pixels in the display panel, improve the reliability and stability of the display panel, enhance the safety of the display panel, extend the service life of the display panel, and improve the display effect of the display panel.

[0073] In some embodiments, the light transmittance of the first light-emitting element 410 is the first light transmittance, the light transmittance of the second light-emitting element 420 is the second light transmittance, and the first light transmittance is greater than the second light transmittance; in the thickness direction of the substrate 100, the thickness dimension of the first support structure 610 is positively correlated with the difference between the first light transmittance and the second light transmittance.

[0074] It should be noted that the difference between the first light transmittance and the second light transmittance can be used to reflect the height difference between the first light-emitting element 410 and the second light-emitting element 420 after the corresponding bonding layer 300 has been melted and re-solidified in the absence of the conductive reflective layer 500. Based on the above height difference, the thickness of the first support structure 610 can be determined to compensate for the height of the bonding layer 300 corresponding to the first light-emitting element 410.

[0075] The display panel provided by the embodiment of the present application can further improve the height compensation capability of the first support structure 610, improve the surface flatness of the display panel, and improve the display effect of the display panel.

[0076] As shown in Figure 1 In some embodiments, the display panel further comprises a driving circuit layer 700. The driving circuit layer 700 is located between the bonding pad layer 200 and the substrate 100. The bonding pad layer 200 comprises a first bonding pad structure 210 and a second bonding pad structure 220 arranged at intervals. The first bonding pad structure 210 is electrically connected to the first light emitting element 410. The first bonding pad structure 210 is located on the side of the first support structure 610 away from the substrate 100. The first support structure 610 has an opening. The second bonding pad structure 220 is located in the opening. The second bonding pad structure 220 is electrically connected between the first light emitting element 410 and the driving circuit layer 700 through the opening.

[0077] For example, the driving circuit layer 700 is located inside the substrate 100.

[0078] The display panel provided by the embodiment of the present application can insulate the first bonding pad structure 210 from the driving circuit layer 700 through the first support structure 610. The second bonding pad structure 220 can be electrically connected to the driving circuit layer 700 through the opening in the first support structure 610. Therefore, the driving circuit layer 700 can drive the first light emitting element 410 to emit light, and the display effect of the display panel can be improved.

[0079] As shown in Figure 4 In some embodiments, the support layer 600 further comprises a second support structure 620. The second support structure 620 is located between the bonding pad layer 200 corresponding to the second light emitting element 420 and the substrate 100. The thickness of the second support structure 620 is smaller than the thickness of the first support structure 610.

[0080] For example, the thickness difference between the first support structure 610 and the second support structure 620 can be determined according to the difference between the first light transmittance and the second light transmittance.

[0081] The display panel provided by the embodiment of the present application can further improve the surface flatness of the display panel, improve the display effect of the display panel, and improve the display performance of the display panel by setting the thickness of the second support structure 620 to be smaller than the thickness of the first support structure 610.

[0082] As shown in Figure 5As shown, in some embodiments, the light-emitting element 400 further includes a third light-emitting element 430, and the first light-emitting element 410 and the third light-emitting element 430 are light-emitting elements 400 of different colors; the conductive reflective layer 500 further includes a third reflective structure 530, wherein the third reflective structure 530 corresponds to the third light-emitting element 430, and the first reflective structure 510 is different from the third reflective structure 530.

[0083] For example, the emission color of the third light-emitting element 430 can be either blue or green. When the second light-emitting element 420 and the third light-emitting element 430 are different, their light transmittance is different. Correspondingly, the second reflective structure 520 and the third reflective structure 530 are also different, and their light reflectance is also different.

[0084] The display device provided in this application embodiment improves the utilization rate of laser energy by providing a conductive reflective layer 500 between the bonding pad layer 200 and the bonding layer 300, so that the laser light emitted through the light-emitting element 400 can be reflected back to the bonding layer 300 by the conductive reflective layer 500. Furthermore, by providing different reflective structures corresponding to the light-emitting elements 400 with different emission colors, and adjusting the light reflection capability of the reflective structures according to the laser transmittance of different light-emitting elements 400, the laser transmittance of the light-emitting element 400 and the light reflection capability of the corresponding reflective structures can be balanced. This ensures that under the same laser conditions, the melting state and the height of the bonding layer 300 corresponding to different light-emitting elements 400 are consistent. A support layer 600 can also be provided on the side of the bonding pad layer 200 corresponding to the light-emitting element 400 with high laser transmittance closer to the substrate 100 to elevate the light-emitting element 400 with high laser transmittance, thereby compensating for the reduced thickness of the bonding layer 300 of that light-emitting element 400. Therefore, it can improve the control of the melting state of the bonding layer 300 during the preparation process, improve the height uniformity of different light-emitting elements 400 after bonding, further improve the surface flatness of the display panel, and improve the display effect of the display panel.

[0085] like Figure 6 As shown, in some embodiments, the display panel includes a first region A1 and a second region A2, the first region A1 and the second region A2 are connected, the laser energy in the first region A1 is less than the laser energy in the second region A2, the reflectivity of the first reflective structure 510 in the first region A1 is greater than the reflectivity of the first reflective structure 510 in the second region A2, and the reflectivity of the second reflective structure 520 in the first region A1 is greater than the reflectivity of the second reflective structure 520 in the second region A2.

[0086] It should be noted that in the laser bonding process of the light emitting element 400, the bonding of the light emitting element 400 is usually first performed on the transfer substrate, and then the light emitting element 400 on the transfer substrate is transferred to the display panel. Figure 6 The display panel shown corresponds to a plurality of transfer substrates, one transfer substrate corresponds to one first region A1 and one second region A2, and the first region A1 surrounds the second region A2. For the first region A1 and the second region A2 on the same transfer substrate, since the laser source is usually arranged at the center of the chamber, the distance between the light emitting element 400 in the first region A1 and the laser source is greater than that in the second region A2, so the laser energy in the first region A1 is less than that in the second region A2.

[0087] The display panel provided by the embodiments of the present application can adjust the reflection ability of the first reflection structure 510 and the second reflection structure 520 according to the absorption ability of the laser emitted by the laser source in different regions of the display panel, which can facilitate to improve the height consistency of the light emitting element 400 at different positions in the display panel, thereby further improving the surface flatness of the display panel and improving the display effect and display performance of the display panel.

[0088] As Figure 7 The second aspect of the embodiments of the present application provides a display device, which includes the display panel 1000 of any one of the above first aspects.

[0089] The display device provided by the embodiments of the present application can improve the utilization rate of laser energy by arranging the conductive reflection layer 500 between the bonding pad layer 200 and the bonding layer 300, so that the laser light emitted through the light emitting element 400 can be reflected to the bonding layer 300 by the conductive reflection layer 500. Further, by arranging different reflection structures corresponding to light emitting elements 400 of different light emitting colors, and adjusting the light reflection ability of the reflection structure according to the laser transmission amount of the different light emitting elements 400, the laser transmission ability of the light emitting element 400 and the light reflection ability of the corresponding reflection structure can be balanced, so that under the same laser condition, the melting state of the bonding layer 300 corresponding to different light emitting elements 400 is consistent, and the height after melting is consistent. A support layer 600 can also be arranged on the side of the bonding pad layer 200 close to the substrate 100 corresponding to the light emitting element 400 with large laser transmission amount, which can pad up the light emitting element 400 with large laser transmission amount, thereby compensating for the reduction in the thickness of the bonding layer 300 of the light emitting element 400. Therefore, the control ability of the melting state of the bonding layer 300 in the preparation process can be improved, the height uniformity of the bonded different light emitting elements 400 can be improved, and further the surface flatness of the display panel can be improved, and the display effect of the display panel can be improved.

[0090] In the description of the specification, the description of the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are contained in at least one embodiment or example of the present application. In the description, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.

[0091] The technical features of the above-described embodiments can be combined in any manner. For the sake of brevity, not all possible combinations of the technical features of the above-described embodiments are described, however, as long as the combination of the technical features does not result in a contradiction, it should be considered within the scope of the present disclosure.

[0092] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be noted that for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these are within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A display panel, characterized by, Comprising: a substrate; a bonding pad layer located on one side of the substrate; a bonding layer located on the side of the bonding pad layer away from the substrate; a light emitting element located on the side of the bonding layer away from the substrate, the light emitting element comprising a first light emitting element and a second light emitting element, the first light emitting element and the second light emitting element being light emitting elements of different colors; a conductive reflective layer located between the bonding pad layer and the bonding layer, the conductive reflective layer comprising a first reflective structure and a second reflective structure, wherein the first reflective structure corresponds to the first light emitting element, the second reflective structure corresponds to the second light emitting element, and the first reflective structure is different from the second reflective structure; the first light emitting element has an outgoing wavelength greater than that of the second light emitting element, and the reflectivity of the first reflective structure is less than that of the second reflective structure.

2. The display panel of claim 1, wherein: the first reflective structure comprises a first reflective material having a reflectivity less than that of a second reflective material comprising the second reflective structure.

3. The display panel of claim 2, wherein: the first light emitting element has a first light transmittance, the second light emitting element has a second light transmittance, and the first light transmittance is greater than the second light transmittance; the difference between the reflectivity of the first reflective material and the reflectivity of the second reflective material is positively correlated with the difference between the first light transmittance and the second light transmittance.

4. The display panel of claim 1, wherein: the first reflective structure has a thickness dimension less than or equal to that of the second reflective structure; and / or a projection of the bonding layer toward the substrate falls within a projection of the conductive reflective layer toward the substrate.

5. The display panel of claim 4, wherein: the projection of the bonding layer toward the substrate coincides with an edge of the projection of the conductive reflective layer toward the substrate.

6. The display panel of claim 4, wherein, Further comprising: a support layer, the support layer comprising at least a first support structure located on the side of the bonding pad layer corresponding to the first light emitting element close to the substrate; the first light emitting element has a first light transmittance, the second light emitting element has a second light transmittance, and the first light transmittance is greater than the second light transmittance; in the thickness direction of the substrate, the thickness dimension of the first support structure is positively correlated with the difference between the first light transmittance and the second light transmittance.

7. The display panel of claim 1, wherein, Further comprising: a support layer, the support layer comprising at least a first support structure located on the side of the bonding pad layer corresponding to the first light emitting element close to the substrate; a driving circuit layer located between the bonding pad layer and the substrate; the bonding pad layer comprises first and second bonding pad structures arranged at intervals, the first bonding pad structure is electrically connected to the first light emitting element, and the first bonding pad structure is located on the side of the first support structure away from the substrate; The first support structure has an opening, and the second bonding pad structure is located in the opening and electrically connected between the first light emitting element and the driving circuit layer through the opening.

8. The display panel of claim 1, wherein, Further comprising: a support layer, the support layer at least comprising a first support structure, the first support structure being located on a side of the bonding pad layer corresponding to the first light emitting element close to the substrate; the support layer further comprising a second support structure, the second support structure being located between the bonding pad layer corresponding to the second light emitting element and the substrate, and the thickness dimension of the second support structure being smaller than that of the first support structure.

9. The display panel of claim 1, wherein the light emitting element further comprises a third light emitting element, the first light emitting element and the third light emitting element being light emitting elements of different colors; the conductive reflective layer further comprises a third reflective structure, wherein the third reflective structure corresponds to the third light emitting element, and the first reflective structure is different from the third reflective structure.

10. The display panel of claim 1, wherein the display panel comprises a first region and a second region, the first region being connected to the second region, and the laser energy in the first region being less than that in the second region; the reflectivity of the first reflective structure in the first region is greater than that in the second region, and the reflectivity of the second reflective structure in the first region is greater than that in the second region.

11. A display device, characterized by comprising: including: the display panel of any one of claims 1 to 10.

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