Display panel, manufacturing method thereof and display device

Abstract

The application is suitable for the technical field of display devices, and provides a display panel, a manufacturing method thereof and a display device. The display panel comprises a substrate, an isolation structure arranged on one side of the substrate, the isolation structure surrounding an isolation opening, a light-emitting layer arranged on one side of the substrate, the light-emitting layer comprising a plurality of light-emitting units arranged at intervals, an encapsulation layer arranged on one side of the light-emitting layer away from the substrate, the encapsulation layer comprising a plurality of encapsulation units, a main part of the encapsulation unit covering one side surface of the light-emitting unit away from the substrate, a first extension part being located on one side of the isolation structure away from the substrate, and the first extension part and the isolation structure being arranged at intervals, and a pad layer arranged on one side of at least part of the isolation structure away from the substrate, a normal projection contour of the pad layer on the isolation structure at least partially overlapping a normal projection contour of the first extension part on the isolation structure. The display panel of the application can avoid the problem of dark spots of the light-emitting unit, and improve the display effect of the display panel.

Description

Technical Field

[0001] This application belongs to the field of display device technology, and in particular relates to a display panel and its manufacturing method, and a display device. Background Technology

[0002] With the development of display technology, OLED (Organic Light Emitting Diode) display panels have been widely used due to their advantages such as being thinner and lighter, brighter, having lower power consumption, faster response, and higher resolution.

[0003] During the manufacturing process of display panels using related technologies, dark spots may appear in the light-emitting units, affecting the display effect. Summary of the Invention

[0004] In view of this, embodiments of this application provide a display panel and its manufacturing method and display device to solve the problem that dark spots exist in the light-emitting units of current display panels, affecting the display effect.

[0005] A first aspect of this application provides a display panel, comprising: a substrate; an isolation structure disposed on one side of the substrate, the isolation structure forming an isolation opening; a light-emitting layer disposed on one side of the substrate, the light-emitting layer comprising a plurality of light-emitting units spaced apart from each other, the light-emitting units being correspondingly disposed with respect to the isolation opening; an encapsulation layer disposed on the side of the light-emitting layer away from the substrate, the encapsulation layer comprising a plurality of encapsulation units, each encapsulation unit being correspondingly disposed with respect to each light-emitting unit, each encapsulation unit comprising a main body portion and a first extension portion connected to each other, the main body portion covering the surface of the light-emitting unit away from the substrate, the first extension portion being located on the side of the isolation structure away from the substrate, and the first extension portion being spaced apart from the isolation structure; and a pad layer disposed on at least a portion of the isolation structure away from the substrate, the orthographic projection outline of the pad layer on the isolation structure at least partially overlapping the orthographic projection outline of the first extension portion on the isolation structure.

[0006] The aforementioned display panel, by providing an encapsulation unit including a main body and a first extension connected to each other, and by providing a pad on the side of the isolation structure away from the substrate, ensures that the orthographic projection outline of the pad on the isolation structure at least partially overlaps with the orthographic projection outline of the first extension on the isolation structure. In this way, the pad and the first extension together form a closed encapsulation structure on the isolation structure, reducing the impact of etching processes on the light-emitting unit during manufacturing, preventing moisture from invading into the light-emitting unit through gaps in the isolation structure, thus avoiding damage to the light-emitting unit, preventing the problem of dark spots in the light-emitting unit, and improving the display effect of the display panel.

[0007] In one embodiment, the pad layer includes a first sub-pad layer that at least partially covers the side surface of the isolation structure opposite to the substrate; preferably, the first sub-pad layer at least partially covers the side surface of the first extension opposite to the isolation structure.

[0008] In one embodiment, the light-emitting unit includes a first electrode, a light-emitting functional part, and a second electrode stacked sequentially, wherein the first sub-pad layer is on the same layer and made of the same material as the light-emitting functional part. By including a first sub-pad layer on the same layer and made of the same material as the light-emitting functional part in the pad layer, no additional process is required in the fabrication of the first sub-pad layer, simplifying the processing steps and reducing manufacturing costs.

[0009] In one embodiment, the padding layer further includes a second sub-padding layer that at least partially covers the side surface of the first sub-padding layer facing away from the insulating structure.

[0010] In one embodiment, the second sub-pad layer is disposed in the same layer and made of the same material as the second electrode. By including a second sub-pad layer in the same layer and made of the same material as the second electrode, the overall height of the pad layer can be increased, enabling it to better support the packaging unit and distribute stress. Furthermore, no additional steps are required in the fabrication of the second sub-pad layer, simplifying the processing steps and reducing manufacturing costs.

[0011] In one embodiment, the encapsulation unit further includes a second extension connected to the main body portion, the second extension being disposed on the side of the first extension away from the isolation structure, and the second extension at least partially covering the surface of the pad layer away from the isolation structure.

[0012] In one embodiment, the pad layer includes a central portion and a peripheral portion connected to each other. The central portion covers the side surface of the isolation structure facing away from the substrate, and the peripheral portion is at least partially sandwiched between the first extension and the second extension. By having the central portion of the pad layer cover the side surface of the isolation structure facing away from the substrate, and the peripheral portion is at least partially sandwiched between the first extension and the second extension, the encapsulation structure formed on the isolation structure is more compact, resulting in a better effect in preventing moisture intrusion.

[0013] In one embodiment, the second extensions located on the periphery of the same isolation structure are connected to each other to completely cover the surface of the pad layer facing away from the isolation structure. By connecting the second extensions located on the periphery of the same isolation structure, another closed covering structure can be formed on the surface of the pad layer facing away from the isolation structure, enhancing the effect of blocking moisture intrusion.

[0014] In one embodiment, the light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit; the pad is disposed on the isolation structure located at least partially around the first light-emitting unit; and / or the pad is disposed on the isolation structure located at least partially around the second light-emitting unit; and / or the pad is disposed on the isolation structure located at least partially around the third light-emitting unit. Thus, the pad can be disposed on the isolation structure at least partially around any one or more of the first, second, and third light-emitting units, facilitating adjustment of the actual placement of the pad according to different process steps. This allows for focused protection of light-emitting units at higher risk of moisture intrusion, while also facilitating flexible adjustments to the process steps and simplifying the manufacturing process.

[0015] In one embodiment, the padding layer is disposed on the same layer and made of the same material as the third light-emitting unit. When the first, second, and third light-emitting units are manufactured sequentially, the first light-emitting unit is at the highest risk of moisture intrusion, followed by the second light-emitting unit, and the third light-emitting unit is at the lowest risk. Therefore, by disposing the padding layer on the same layer and made of the same material as the third light-emitting unit, the first and second light-emitting units can be given focused protection, preventing moisture from intruding into the first and second light-emitting units along the sidewalls of the isolation structure, thus avoiding damage to the first and second light-emitting units and preventing the problem of dark spots appearing in the first and second light-emitting units.

[0016] In one embodiment, the display panel further includes a pixel defining layer disposed on one side of the substrate. The pixel defining layer defines a plurality of pixel openings spaced apart from each other, and each light-emitting unit is correspondingly disposed with respect to each pixel opening. The isolation structure is disposed on the side of the pixel defining layer opposite to the substrate, and the isolation structure is located between at least partially adjacent two pixel openings. By providing the pixel defining layer and the pixel openings defined by the pixel defining layer, the light-emitting units are correspondingly disposed with each pixel opening, and the isolation structure is disposed on the pixel defining layer, which facilitates the forming of the light-emitting units and the isolation structure.

[0017] In one embodiment, the isolation structure includes an isolating body and a blocking portion. The blocking portion is located on the side of the isolating body facing away from the substrate, and the orthographic projection of the isolating body on the substrate lies within the orthographic projection of the blocking portion on the substrate. The main body also covers the sidewall of the isolating body. The first extension is located on the side of the blocking portion facing away from the substrate, and the first extension and the blocking portion are spaced apart from each other. By adopting the isolation structure designed above, and placing the first extension on the side of the blocking portion facing away from the substrate, and spaced apart from the blocking portion, moisture can be effectively blocked, preventing moisture from invading into the light-emitting unit along the sidewall of the isolation structure and preventing damage to the light-emitting unit.

[0018] In one embodiment, the isolation structure further includes a base located on the side of the isolator closer to the substrate, wherein the orthographic projection of the isolator on the substrate lies within the orthographic projection of the base on the substrate. By providing a base, the effectiveness of the isolation structure in blocking moisture can be further improved.

[0019] A second aspect of this application provides a method for manufacturing a display panel, comprising: forming an isolation structure on one side of a substrate, the isolation structure surrounding an isolation opening; sequentially distributing a light-emitting layer and an encapsulation layer covering the entire surface on the side of the isolation structure away from the substrate; etching the light-emitting layer and the encapsulation layer to respectively form a light-emitting unit, an encapsulation unit, and a pad layer, wherein the light-emitting unit is disposed corresponding to the isolation opening, the encapsulation unit includes a main body portion and a first extension portion connected to each other, the main body portion covering the surface of the light-emitting unit away from the substrate, the first extension portion being located on the side of the isolation structure away from the substrate and spaced apart from the isolation structure, the pad layer being disposed on at least a portion of the side of the isolation structure away from the substrate, and the orthographic projection outline of the pad layer on the isolation structure at least partially overlapping the orthographic projection outline of the first extension portion on the isolation structure.

[0020] The display panel manufactured using the above method has a pad layer that, together with the first extension, forms a closed covering structure on the isolation structure. This reduces the impact of the etching process on the light-emitting unit during manufacturing, prevents moisture from invading the light-emitting unit through the gaps in the isolation structure, and avoids damage to the light-emitting unit. This also prevents the light-emitting unit from having dark spots and improves the display effect of the display panel.

[0021] In one embodiment, etching the light-emitting layer and the encapsulation layer to form the light-emitting unit, the encapsulation unit, and the pad layer respectively includes: etching the light-emitting layer to form a light-emitting functional portion corresponding to the isolation opening, and a first sub-pad layer that at least partially covers the side surface of the isolation structure facing away from the substrate. This configuration allows the first sub-pad layer to be etched and formed simultaneously with the light-emitting functional portion, eliminating the need for additional steps in the fabrication of the first sub-pad layer, simplifying the processing steps, and reducing manufacturing costs.

[0022] In one embodiment, etching the light-emitting layer and the encapsulation layer to form the light-emitting unit, the encapsulation unit, and the pad layer further includes etching the light-emitting layer to form a second electrode located on the side surface of the light-emitting functional portion facing away from the substrate, and a second sub-pad layer that at least partially covers the side surface of the first sub-pad layer facing away from the isolation structure. This configuration, where the second sub-pad layer is etched and formed simultaneously with the second electrode, not only increases the overall height of the pad layer, allowing it to better support the encapsulation unit and distribute stress, but also simplifies the manufacturing process and reduces production costs by eliminating the need for additional steps in the fabrication of the second sub-pad layer.

[0023] In one embodiment, etching the light-emitting layer and the encapsulation layer to form a light-emitting unit, an encapsulation unit, and a pad layer respectively includes: sequentially depositing a first light-emitting layer and a first encapsulation layer that cover the entire substrate on the side of the isolation structure away from the substrate; etching the first light-emitting layer and the first encapsulation layer to remove the portion of the first light-emitting layer located on the side of the isolation structure away from the substrate to form a first light-emitting unit and a first encapsulation unit respectively; sequentially depositing a second light-emitting layer and a second encapsulation layer that cover the entire substrate on the side of the isolation structure away from the substrate; etching the second light-emitting layer and the second encapsulation layer to remove the portion of the second light-emitting layer located on the side of the isolation structure away from the substrate to form a second light-emitting unit and a second encapsulation unit respectively; sequentially depositing a third light-emitting layer and a third encapsulation layer that cover the entire substrate on the side of the isolation structure away from the substrate; and etching the third light-emitting layer and the third encapsulation layer to form a third light-emitting unit, a third encapsulation unit, and a pad layer respectively. With this configuration, the pad layer and the third light-emitting unit are etched and formed simultaneously, which enables the pad layer to protect the first and second light-emitting units. Furthermore, no additional steps are required during the pad layer fabrication process, simplifying the processing steps and reducing manufacturing costs.

[0024] In one embodiment, the manufacturing method further includes: removing a portion of the third light-emitting layer located on the isolation structure at least partially around the third light-emitting unit.

[0025] In one embodiment, the manufacturing method further includes: removing a portion of the third light-emitting layer located on the isolation structure at least partially around the second light-emitting unit; or removing a portion of the third light-emitting layer located on the isolation structure at least partially around the first light-emitting unit.

[0026] A third aspect of this application provides a display device, including a display panel as described in the first aspect; or a display panel prepared by the method for manufacturing a display panel of the second aspect.

[0027] It is understood that the beneficial effects of the third aspect mentioned above can be found in the relevant descriptions of the first and second aspects mentioned above, and will not be repeated here. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a cross-sectional view of the overall structure of the display panel in related technologies;

[0030] Figure 2 This is a cross-sectional view of the overall structure of a display panel provided in one embodiment of this application;

[0031] Figure 3 This is a partial structural enlarged schematic diagram of the isolation structure, padding layer, and encapsulation unit in a display panel provided in one embodiment of this application;

[0032] Figure 4 This is a flowchart of a method for manufacturing a display panel according to one embodiment of this application;

[0033] Figure 5 This is a schematic diagram of the overall structure of a display device provided in one embodiment of this application.

[0034] Icon labels:

[0035] 10. Display device;

[0036] 100. Display panel;

[0037] 110. Substrate;

[0038] 120. Light-emitting layer; 121. Light-emitting unit; 1211. First electrode; 1212. Light-emitting functional part; 1213. Second electrode; 121A. First light-emitting unit; 121B. Second light-emitting unit; 121C. Third light-emitting unit.

[0039] 130. Isolation structure; 131. Isolation opening; 132. Isolation body; 133. Barrier part; 134. Base;

[0040] 140. Subbase layer; 141. First subbase layer; 142. Second subbase layer; 143. Central part; 144. Peripheral part;

[0041] 150, encapsulation layer; 151, encapsulation unit; 1511, main body; 1512, first extension; 1513, second extension;

[0042] 160. Pixel limiting layer; 161. Pixel opening. Detailed Implementation

[0043] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0044] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0045] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0046] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0047] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0048] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. "A plurality" means two or more.

[0049] like Figure 1 As shown, the display panel 1 in the related art includes a substrate 11, a light-emitting layer 12 disposed on the substrate 11, an isolation structure 14 disposed between two adjacent light-emitting units in the light-emitting layer 12, and an encapsulation layer 13 disposed on the side of the light-emitting layer 12 away from the substrate 11. The encapsulation layer 13 extends at least partially onto the isolation structure 14. External moisture can easily penetrate into the light-emitting layer 14 from the location of the encapsulation layer 13, causing dark spots to appear in the light-emitting units and affecting the display effect of the display panel 1.

[0050] To at least partially resolve the problems in the relevant technologies, please refer to Figure 2 As shown, this application embodiment provides a display panel 100, which includes: a substrate 110, a light-emitting layer 120, an isolation structure 130, a pad layer 140, and an encapsulation layer 150.

[0051] Specifically, the light-emitting layer 120, the isolation structure 130, the pad layer 140, and the encapsulation layer 150 are respectively disposed on one side of the substrate 110. The substrate 110 is used to support and carry other film layers in the display panel 100. Exemplarily, the substrate 110 can be made of materials such as glass or polyimide. In some embodiments, the substrate 110 may also include an array substrate. The array substrate is provided with a driving circuit for driving the light-emitting units 121 in the display area of ​​the display panel 100 to emit light. Under the drive of the driving circuit, different light-emitting units 121 in the display area can be excited to emit light of different colors, so that the display panel 100 can achieve a colorful display effect.

[0052] The isolation structure 130 can enclose an isolation opening 131 for at least partially accommodating the light-emitting unit 121, so that the light-emitting unit 121 can be formed without the aid of a mask. That is, in the light-emitting layer 120, an isolation structure 130 is provided between a portion of two adjacent light-emitting units 121, or an isolation structure 130 is provided between every two adjacent light-emitting units 121. The specific structural form of the isolation structure 130 is not limited, as long as it can serve to separate the two light-emitting units 121.

[0053] The composition and preparation of the isolation structure 130 are detailed in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, and CN. Further descriptions are provided in CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0054] The light-emitting layer 120 includes a plurality of light-emitting units 121 spaced apart from each other. Each light-emitting unit 121 corresponds to an isolation opening 131. For example, the light-emitting unit 121 can be a red light-emitting unit for emitting red light, a green light-emitting unit for emitting green light, a blue light-emitting unit for emitting blue light, or a white light-emitting unit for emitting white light, etc. The number of different types of light-emitting units 121, the arrangement of the plurality of light-emitting units 121, and the spacing between adjacent light-emitting units 121 can be flexibly set and are not limited here. The light-emitting unit 121 can emit light under the driving action of the driving circuit; specifically, the light-emitting material in the light-emitting unit 121 can emit light under the action of an electric field.

[0055] The encapsulation layer 150 provides encapsulation and protection for the entire display panel 100. The encapsulation layer 150 can be a single-layer structure made of inorganic or organic materials, or a multilayer structure made of at least one of these materials; no limitation is made here. The encapsulation layer 150 includes multiple encapsulation units 151, each corresponding to a light-emitting unit 121. Each encapsulation unit 151 includes a main body 1511 and a first extension 1512 connected to each other. The main body 1511 covers the side of the light-emitting unit 121 facing away from the substrate 110. The first extension 1512 is located on the side of the isolation structure 130 facing away from the substrate 110, and the first extension 1512 and the isolation structure 130 are spaced apart from each other. The main body 1511 and the first extension 1512 are different blocks on the packaging unit 151 according to their respective positions and functions. In the actual product, there may not be a clear boundary line on the packaging unit 151 to distinguish the main body 1511 and the extension 1512.

[0056] A pad 140 is disposed on at least a portion of the isolation structure 130 on the side opposite to the substrate 110. The pad 140 serves to elevate the isolation structure 130. The material, cross-sectional shape, and cross-sectional dimensions of the pad 140 are not limited. Furthermore, the pad 140 may be disposed on only a portion of the isolation structure 130, or it may be disposed on all isolation structures 130. The placement range of the pad 140 can be flexibly set according to actual usage requirements.

[0057] The orthographic projection outline of the pad 140 on the isolation structure 130 at least partially overlaps with the orthographic projection outline of the first extension 1512 on the isolation structure 130. Both the first extension 1512 and the pad 140 are located on the side of the isolation structure 130 away from the substrate 110. The pad 140 and the first extension 1512 have at least partial overlap in the isolation structure 130, so as to form a closed encapsulation structure. This can reduce the impact of the etching process on the light-emitting unit 121 during the manufacturing process and prevent moisture from invading into the light-emitting unit 121 through the gaps in the isolation structure 130.

[0058] The first extension 1512 and the pad 140 can be disposed in the same layer on the side of the isolation structure 130 away from the substrate 110 to form a closed covering structure. The first extension 1512 and the pad 140 can also be arranged in a staggered manner on the side of the isolation structure 130 away from the substrate 110, and the first extension 1512 and the pad 140 are connected by a connecting part to form a closed covering structure.

[0059] The display panel 100 of this application embodiment is provided with an encapsulation unit 151 including a main body portion 1511 and a first extension portion 1512 connected to each other, and a pad layer 140 is provided on the side of the isolation structure 130 away from the substrate 110, such that the orthographic projection outline of the pad layer 140 on the isolation structure 130 at least partially overlaps with the orthographic projection outline of the first extension portion 1512 on the isolation structure 130. In this way, the pad layer 140 and the first extension portion 1512 can form a closed encapsulation structure on the isolation structure 130, reducing the impact of the etching process on the light-emitting unit 121 during the manufacturing process, preventing moisture from entering the light-emitting unit 121 through the gaps on the isolation structure 130, thus preventing damage to the light-emitting unit 121, avoiding the problem of dark spots in the light-emitting unit 121, and improving the display effect of the display panel 100.

[0060] The padding layer 140 can be a single-layer structure formed from a single material, or a multi-layer structure formed from multiple identical or different materials. In some embodiments, the padding layer 140 may optionally include a first sub-padding layer 141, which at least partially covers the side surface of the isolation structure 130 facing away from the substrate 110. Further, the first sub-padding layer 141 at least partially covers the side surface of the first extension 1512 facing away from the isolation structure 130, that is, the first extension 1512 and the first sub-padding layer 141 are arranged alternately at different heights on the side of the isolation structure 130 facing away from the substrate 110, wherein the first extension 1512 is below and the first sub-padding layer 141 is above, and at least partially covers the side surface of the first extension 1512 facing away from the isolation structure 130. The first extension 1512 and the first sub-padding layer 141 are connected by a connecting portion to form a closed covering structure.

[0061] The luminescent material in the light-emitting unit 121 emits light under the influence of an electric field. In some embodiments, the light-emitting unit 121 optionally includes a first electrode 1211, a light-emitting functional part 1212, and a second electrode 1213 stacked sequentially. The first sub-pad layer 141 may be co-layered and made of the same material as the light-emitting functional part 1212. It should be noted that "co-layered" here means that the first sub-pad layer 141 and the light-emitting functional part 1212 are formed from the same film layer. For example, the first sub-pad layer 141 and the light-emitting functional part 1212 may be formed in the same fabrication process.

[0062] One of the first electrode 1211 and the second electrode 1213 can be an anode, and the other of the first electrode 1211 and the second electrode 1213 can be a cathode. In this way, an electric field will be generated between the first electrode 1211 and the second electrode 1213, which are arranged opposite to each other and spaced apart. The light-emitting functional unit 1212 can emit light under the action of this electric field. The light-emitting functional unit 1212 can include a multi-layer structure. For example, the light-emitting functional unit 1212 includes a hole injection unit, a hole transport unit, a light-emitting unit, an electron transport unit, an electron injection unit, etc., which are stacked. In this case, by making the first sub-pad layer 141 and the light-emitting functional unit 1212 the same layer and the same material, the first sub-pad layer 141 and the light-emitting functional unit 1212 can be formed synchronously in the same processing step. No additional process is required in the manufacturing process of the first sub-pad layer 141, which simplifies the processing steps and reduces the manufacturing cost.

[0063] Furthermore, in some embodiments, the pad 140 further includes a second sub-pad 142, which at least partially covers the side surface of the first sub-pad 141 facing away from the isolation structure 130. By including the second sub-pad 142 in the pad 140, the overall height of the pad 140 can be increased, enabling it to better provide auxiliary support and stress relief for the encapsulation unit 151.

[0064] Based on the above embodiments, the second sub-pad layer 142 and the second electrode 1213 are disposed in the same layer and made of the same material. This allows the second sub-pad layer 142 and the second electrode 1213 to be formed simultaneously in the same processing step. No additional steps are required in the fabrication of the second sub-pad layer 142, simplifying the processing and reducing manufacturing costs. It should be noted that "same layer" here means that the second sub-pad layer 142 and the second electrode 1213 are formed from the same film layer. For example, furthermore, the second sub-pad layer 142 and the second electrode 1213 can be formed in the same preparation process.

[0065] Please combine Figure 2 And see Figure 3 In some embodiments, the encapsulation unit 151 may optionally include a second extension 1513 connected to the main body 1511. The second extension 1513 is disposed on the side of the first extension 1512 opposite to the isolation structure 130, and the second extension 1513 at least partially covers the surface of the pad 140 opposite to the isolation structure 130. In this embodiment, the first extension 1512 and the second extension 1513 of the encapsulation unit 151 may be formed multiple times in different manufacturing processes.

[0066] Specifically, the pad 140 includes a central portion 143 and a peripheral portion 144 connected to each other. The central portion 143 covers the side surface of the isolation structure 130 facing away from the substrate 110, and the peripheral portion 144 is at least partially sandwiched between the first extension 1512 and the second extension 1513. It should be noted that the first sub-pad 141 and the second sub-pad 142 are different portions defined on the pad 140 along the stacking direction of the pad 140, while the central portion 143 and the peripheral portion 144 are different portions defined on the pad 140 along a direction generally parallel to the surface of the substrate 110. Therefore, the central portion 143 and the peripheral portion 144 can contain each other with the first sub-pad 141 and the second sub-pad 142. That is, the central portion 143 can include the portion of the first sub-pad 141 and the second sub-pad 142 located at a relatively central position, and the peripheral portion 144 can include the portion of the first sub-pad 141 and the second sub-pad 142 located at a relatively edge position. They are not independent of each other. At this time, the peripheral portion 144 extends at least partially between the first extension 1512 and the second extension 1513 of the encapsulation unit 151.

[0067] Due to the manufacturing process, such as Figure 3 As shown, the second extension 1513 and the isolation structure 130 are spaced apart from each other along a direction perpendicular to the surface of the substrate 110. The second extensions 1513 located on the periphery of the same isolation structure 130 are connected to each other to completely cover the side surface of the pad 140 facing away from the isolation structure 130. This arrangement can further form another closed covering structure on the side surface of the pad 140 facing away from the isolation structure 130, thereby enhancing the effect of blocking moisture intrusion.

[0068] As described above, the light-emitting layer 120 may include a plurality of light-emitting units 121 for emitting light of different colors. In some embodiments, optionally, the light-emitting unit 121 includes a first light-emitting unit 121A, a second light-emitting unit 121B, and a third light-emitting unit 121C. The pad layer 140 is disposed on the isolation structure 130 located on at least a portion of the periphery of the first light-emitting unit 121A, or the pad layer 140 is disposed on the isolation structure 130 located on at least a portion of the periphery of the second light-emitting unit 121B, or the pad layer 140 is disposed on the isolation structure 130 located on at least a portion of the periphery of the third light-emitting unit 121C, or the pad layer 140 is disposed on the isolation structure 130 located on at least a portion of the periphery of the first light-emitting unit 121A, the isolation structure 130 located on at least a portion of the periphery of the second light-emitting unit 121B, and the isolation structure 130 located on at least a portion of the periphery of the third light-emitting unit 121C.

[0069] Thus, the pad 140 can be disposed on at least part of the isolation structure 130 on one or more of the first light-emitting unit 121A, the second light-emitting unit 121B, and the third light-emitting unit 121C. This allows for adjustment of the actual placement of the pad 140 according to different process steps, thereby providing key protection for the light-emitting unit 121 which is at higher risk of moisture intrusion. It also facilitates flexible adjustment of process steps and simplifies the manufacturing process.

[0070] In some embodiments, optionally, the pad 140 is disposed on the isolation structure 130 located at least partially around the first light-emitting unit 121A, or the pad 140 is disposed on the isolation structure 130 located at least partially around the second light-emitting unit 121B, or the pad 140 is disposed on both the isolation structure 130 located at least partially around the first light-emitting unit 121A and the isolation structure 130 located at least partially around the second light-emitting unit 121B, and the pad 140 and the third light-emitting unit 121C are in the same layer and made of the same material. It should be noted that "in the same layer" here means that the pad 140 and the third light-emitting unit 121C are formed of the same film layer. For example, further, the pad 140 and the third light-emitting unit 121C can be formed in the same manufacturing process.

[0071] When the first light-emitting unit 121A, the second light-emitting unit 121B, and the third light-emitting unit 121C are sequentially formed, the first light-emitting unit 121A, which is formed first, has to endure more etching cycles. Therefore, the first light-emitting unit 121A is at a higher risk of moisture intrusion, the second light-emitting unit 121B is at the next higher risk, and the third light-emitting unit 121C is at the lowest risk. In order to solve the above problems, the pad 140 is made to be in the same layer and made of the same material as the third light-emitting unit 121C. Then the pad 140 can be formed synchronously with the third light-emitting unit 121C in the same processing step and is provided on the isolation structure 130 located on at least part of the periphery of the first light-emitting unit 121A. Alternatively, the padding layer 140 may be disposed on the isolation structure 130 located at least part of the periphery of the second light-emitting unit 121B, or simultaneously disposed on the isolation structure 130 located at least part of the periphery of the first light-emitting unit 121A and the isolation structure 130 located at least part of the periphery of the second light-emitting unit 121B, to provide key protection for the first light-emitting unit 121A and the second light-emitting unit 121B, preventing moisture from entering the first light-emitting unit 121A and the second light-emitting unit 121B through the gaps in the isolation structure 130, thus preventing damage to the first light-emitting unit 121A and the second light-emitting unit 121B and avoiding the problem of dark spots appearing in the first light-emitting unit 121A and the second light-emitting unit 121B.

[0072] To further avoid signal crosstalk between adjacent light-emitting units 121, in some embodiments, the display panel 100 may optionally include a pixel defining layer 160, which is disposed on one side of the substrate 110 and defines a plurality of pixel openings 161 spaced apart from each other. Each light-emitting unit 121 is correspondingly disposed with each pixel opening 161. An isolation structure 130 is disposed on the side of the pixel defining layer 160 away from the substrate 110 and is located between at least two partially adjacent pixel openings 161.

[0073] By setting a pixel limiting layer 160 and pixel openings 161 defined by the pixel limiting layer 160, the light-emitting unit 121 is correspondingly set with each pixel opening 161, and the isolation structure 130 is set on the pixel limiting layer 160, which facilitates the setting and shaping of the light-emitting unit 121 and the isolation structure 130.

[0074] The specific structural form of the isolation structure 130 is not limited. In some embodiments, the isolation structure 130 may optionally include an isolation body 132 and a blocking portion 133. The blocking portion 133 is located on the side of the isolation body 132 away from the substrate 110, and the orthographic projection of the isolation body 132 on the substrate 110 is located within the orthographic projection of the blocking portion 133 on the substrate 110. The main body portion 1511 also covers the sidewall of the isolation body 132. The first extension portion 1512 is located on the side of the blocking portion 133 away from the substrate 110, and the first extension portion 1512 and the blocking portion 133 are spaced apart from each other.

[0075] In other words, the isolation structure 130 includes a relatively independent isolator 132 and a blocking portion 133. The isolator 132 is located on the substrate 110 or the pixel defining layer 160, and the blocking portion 133 is located on the side of the isolator 132 facing away from the substrate 110. The area covered by the orthogonal projection of the blocking portion 133 on the substrate 110 is larger, while the area covered by the orthogonal projection of the isolator 132 on the substrate 110 is relatively smaller, so that the orthogonal projection of the blocking portion 133 on the substrate 110 can cover the orthogonal projection of the isolator 132 on the substrate 110. The cross-sectional shapes of the isolator 132 and the blocking portion 133 can be regular shapes, such as rectangles or trapezoids, or irregular shapes. Figure 2 In the illustrated embodiment, both the isolator 132 and the blocking portion 133 have trapezoidal cross-sectional shapes. By employing the isolation structure 130 designed above, and having the main body 1511 cover the sidewall of the isolator 132, with the first extension 1512 located on the side of the blocking portion 133 away from the substrate 110, and the first extension 1512 and the blocking portion 133 spaced apart from each other, moisture can be effectively blocked, preventing moisture from invading into the light-emitting unit 121 along the sidewall of the isolation structure 130, thus preventing damage to the light-emitting unit 121.

[0076] like Figure 3As shown, the isolation structure 130 also includes a base 134, which is located on the side of the insulator 132 near the substrate 110. The orthographic projection of the insulator 132 on the substrate 110 lies within the orthographic projection of the base 134 on the substrate 110. Similarly, the area covered by the orthographic projection of the base 134 on the substrate 110 is larger, while the area covered by the orthographic projection of the insulator 132 on the substrate 110 is relatively smaller, so that the orthographic projection of the base 134 on the substrate 110 can cover the orthographic projection of the insulator 132 on the substrate 110. That is, the base 134, the insulator 132, and the blocking portion 133 in the isolation structure 130 are stacked sequentially. By providing the base 134, the effect of the isolation structure 130 in blocking water vapor can be further improved.

[0077] Please combine Figures 2 to 3 And see Figure 4 This application embodiment also provides a method for manufacturing a display panel 100, including the following steps:

[0078] S102. An isolation structure 130 is formed on one side of the substrate 110, and the isolation structure 130 surrounds an isolation opening 131.

[0079] S104. A light-emitting layer 120 and an encapsulation layer 150, which are fully covered, are sequentially disposed on the side of the isolation structure 130 away from the substrate 110.

[0080] S106. The light-emitting layer 120 and the encapsulation layer 150 are etched to form a light-emitting unit 121, an encapsulation unit 151 and a pad 140, respectively. The light-emitting unit 121 is correspondingly disposed with the isolation opening 131. The encapsulation unit 151 includes a main body portion 1511 and a first extension portion 1512 connected to each other. The main body portion 1511 covers the side surface of the light-emitting unit 121 away from the substrate 110. The first extension portion 1512 is located on the side of the isolation structure 130 away from the substrate 110, and the first extension portion 1512 and the isolation structure 130 are spaced apart from each other. The pad 140 is disposed on at least a portion of the side of the isolation structure 130 away from the substrate 110. The orthographic projection outline of the pad 140 on the isolation structure 130 at least partially overlaps with the orthographic projection outline of the first extension portion 1512 on the isolation structure 130.

[0081] In the above manufacturing process, the light-emitting layer 120 is etched to simultaneously form the light-emitting unit 121 and the pad layer 140. Specifically, the light-emitting unit 121 is formed at the position corresponding to the isolation opening 131 enclosed by the isolation structure 130, and the pad layer 140 is formed at the position corresponding to the isolation structure 130. The encapsulation layer 150 is etched to form the encapsulation unit 151. In this way, no additional process is required in the fabrication of the pad layer 140, simplifying the processing steps and reducing manufacturing costs.

[0082] The display panel 100 manufactured using the above method has a pad 140 that, together with the first extension 1512, forms a closed covering structure on the isolation structure 130. This reduces the impact of the etching process on the light-emitting unit 121 during manufacturing, prevents moisture from entering the light-emitting unit 121 through the gaps in the isolation structure 130, and thus avoids damage to the light-emitting unit 121. This also prevents the light-emitting unit 121 from having dark spots and improves the display effect of the display panel 100.

[0083] In some embodiments, step S106 includes:

[0084] S1062, Etch the light-emitting layer 120 to form a light-emitting functional part 1212 corresponding to the isolation opening 131, and a first sub-pad layer 141 that at least partially covers the side surface of the isolation structure 130 facing away from the substrate 110.

[0085] In this embodiment, the first sub-pad layer 141 and the light-emitting functional part 1212 are etched and formed simultaneously, so that no additional process is required in the fabrication of the first sub-pad layer 141, simplifying the processing steps and reducing the manufacturing cost.

[0086] In one embodiment, step S106 further includes:

[0087] S1064. The light-emitting layer 120 is etched to form a second electrode 1213 located on the side surface of the light-emitting functional part 1212 away from the substrate 110, and a second sub-pad layer 142 that at least partially covers the side surface of the first sub-pad layer 141 away from the isolation structure 130.

[0088] With this configuration, the second sub-pad 142 and the second electrode 1213 are etched and formed simultaneously. This not only increases the overall height of the pad 140, enabling it to better support the packaging unit 151 and share the stress, but also eliminates the need for additional processes during the fabrication of the second sub-pad 142, simplifying the processing steps and reducing manufacturing costs.

[0089] As described above, the light-emitting layer 120 includes a plurality of light-emitting units 121 spaced apart from each other. Therefore, in some embodiments, the method for manufacturing the display panel specifically includes:

[0090] S1042. A first light-emitting layer and a first encapsulation layer, which are fully covered, are sequentially disposed on the side of the isolation structure 130 away from the substrate 110.

[0091] S1066. The first light-emitting layer and the first encapsulation layer are etched to remove the portion of the first light-emitting layer located on the side of the isolation structure 130 away from the substrate, so as to form the first light-emitting unit 121A and the encapsulation unit 151 corresponding to the first light-emitting unit 121A, respectively.

[0092] S1044. A second light-emitting layer and a second encapsulation layer are sequentially disposed on the side of the isolation structure 130 away from the substrate.

[0093] S1068. The second light-emitting layer and the second encapsulation layer are etched to remove the portion of the second light-emitting layer located on the side of the isolation structure 130 away from the substrate 110, so as to form the second light-emitting unit 121B and the encapsulation unit 151 corresponding to the second light-emitting unit 121B, respectively.

[0094] S1046. A third light-emitting layer and a third encapsulation layer, which are fully covered, are sequentially disposed on the side of the isolation structure 130 away from the substrate 110.

[0095] S10610, the third light-emitting layer and the third encapsulation layer are etched to form the third light-emitting unit 121C, the encapsulation unit 151 corresponding to the third light-emitting unit 121C, and the pad layer 140, respectively.

[0096] In other words, the substrate 110 can have multiple different light-emitting units 121, and the different light-emitting units 121 can emit different colors. The pad layer 140 can be formed simultaneously with any one of the light-emitting units 121. For example, the pad layer 140 can be formed simultaneously with the third light-emitting unit 121C, so that the pad layer 140 can protect the first light-emitting unit 121A and the second light-emitting unit 121B. Furthermore, no additional process is required during the fabrication of the pad layer 140, simplifying the processing steps and reducing manufacturing costs.

[0097] In the display panel 100, since the substrate 110 can have a variety of different light-emitting units 121, the pad layer 140 can be disposed on the isolation structure 130 located on at least one side of the different light-emitting units 121. Exemplarily, the manufacturing method of the display panel 100 may further include the following steps:

[0098] S108. Remove the portion of the third light-emitting layer located on the isolation structure 130 at least partially around the third light-emitting unit 121C.

[0099] After the third light-emitting layer, which covers the entire layer, is sequentially formed on the side of the isolation structure 130 away from the substrate 110 and etched, the third light-emitting layer is formed on the isolation structure 130 located on at least a portion of the periphery of each light-emitting unit 121. Subsequently, the portion of the third light-emitting layer located on the isolation structure 130 located on at least a portion of the periphery of the third light-emitting unit 121C can be removed, that is, the portion of the third light-emitting layer located on the isolation structure 130 located on at least a portion of the periphery of the second light-emitting unit 121B is retained, and the portion of the pad 140 located on the isolation structure 130 located on at least a portion of the periphery of the first light-emitting unit 121A is retained as the pad 140.

[0100] In some other embodiments, the method of manufacturing the display panel 100 may further include the following steps:

[0101] S110, Remove the portion of the third light-emitting layer located on the isolation structure 130 at least partially around the second light-emitting unit 121B. At this time, only the portion of the pad 140 located on the isolation structure 130 at least partially around the first light-emitting unit 121A is retained as the pad 140.

[0102] Alternatively, in step S112, the portion of the third light-emitting layer located on the isolation structure 130 at least partially around the first light-emitting unit 121A is removed. In this case, only the portion of the pad 140 located on the isolation structure 130 at least partially around the second light-emitting unit 121B is retained as the pad 140.

[0103] In summary, during the manufacturing process of the display panel 100, after the first light-emitting unit 121A is formed on the substrate 110, a portion of the structure on the isolation structure 130 that is formed simultaneously with the first light-emitting unit 121A is removed. Subsequently, the second light-emitting unit 121B is formed on the substrate 110, and a portion of the structure on the isolation structure 130 that is formed simultaneously with the second light-emitting unit 121B is removed. Then, the third light-emitting unit 121C is formed on the substrate 110, and a portion located on the isolation structure 130 is formed simultaneously with the third light-emitting unit 121C. Finally, according to actual manufacturing requirements, the portion of the third light-emitting layer located on the isolation structure 130 at least partially around the third light-emitting unit 121C is removed, and the portion of the third light-emitting layer located on the isolation structure 130 at least partially around the second light-emitting unit 121B is also removed. At this time, the portion of the third light-emitting layer located on the isolation structure 130 at least partially around the first light-emitting unit 121A is retained as a pad layer 140, and an encapsulation layer 150 is formed on the substrate 110. The pad 140 and the first extension 1512 together form a closed covering structure on the isolation structure 130. In this way, the pad 140 and the first extension 1512 together form a closed covering structure on the isolation structure 130, reducing the impact of the etching process on the first light-emitting unit 121A during the manufacturing process, preventing moisture from invading into the first light-emitting unit 121A along the side wall of the isolation structure 130, thus preventing damage to the first light-emitting unit 121A and avoiding the problem of dark spots in the first light-emitting unit 121A.

[0104] Alternatively, depending on actual manufacturing requirements, the portion of the third light-emitting layer located on at least a portion of the isolation structure 130 surrounding the third light-emitting unit 121C can be removed, as can the portion of the third light-emitting layer located on at least a portion of the isolation structure 130 surrounding the first light-emitting unit 121A. In this case, the portion of the third light-emitting layer located on at least a portion of the isolation structure 130 surrounding the second light-emitting unit 121B is retained, and an encapsulation layer 150 is formed on the substrate 110. The pad layer 140, together with the first extension 1512, can form a closed encapsulation structure on the isolation structure 130. This reduces the impact of the etching process on the second light-emitting unit 121B during manufacturing, prevents moisture from invading the second light-emitting unit 121B along the sidewall of the isolation structure 130, and thus avoids damage to the second light-emitting unit 121B, preventing the second light-emitting unit 121B from having dark spots.

[0105] Please combine Figures 2 to 3 And see Figure 5 This application also provides a display device 10, which includes a display panel 100 as described in any of the above embodiments.

[0106] The display panel 100 disclosed in this application embodiment is applied in the display device 10 to provide the function of displaying a screen. The display device 10 can be any product or component with display function, including but not limited to mobile phones, tablets, laptops, e-readers, wearable devices, remote controls, televisions, desktop computers, vehicle equipment, etc. By employing the display panel 100 in any of the above embodiments, and by providing an encapsulation unit 151 comprising a main body 1511 and a first extension 1512 connected to each other, and by providing a pad 140 on the side of the isolation structure 130 away from the substrate 110, the orthographic projection outline of the pad 140 on the isolation structure 130 at least partially overlaps with the orthographic projection outline of the first extension 1512 on the isolation structure 130. In this way, the pad 140 and the first extension 1512 can together form a closed encapsulation structure on the isolation structure 130, reducing the impact of the etching process on the light-emitting unit 121 during manufacturing, preventing moisture from invading into the light-emitting unit 121 through the gaps in the isolation structure 130, thus avoiding damage to the light-emitting unit 121, preventing the problem of dark spots in the light-emitting unit 121, and improving the display effect of the display panel 100.

[0107] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0108] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is provided on one side of the substrate, and the isolation structure encloses an isolation opening; A light-emitting layer is disposed on one side of the substrate. The light-emitting layer includes a plurality of light-emitting units spaced apart from each other. The light-emitting units are disposed corresponding to the isolation openings. Each light-emitting unit includes a first electrode, a light-emitting functional part, and a second electrode stacked sequentially. An encapsulation layer is disposed on the side of the light-emitting layer away from the substrate. The encapsulation layer includes a plurality of encapsulation units, each of which is disposed corresponding to each of the light-emitting units. Each encapsulation unit includes a main body portion and a first extension portion connected to each other. The main body portion covers the surface of the light-emitting unit away from the substrate. The first extension portion is located on the side of the isolation structure away from the substrate, and the first extension portion and the isolation structure are spaced apart from each other. as well as A pad is disposed on at least a portion of the isolation structure on the side facing away from the substrate. The orthographic projection outline of the pad on the isolation structure at least partially overlaps with the orthographic projection outline of the first extension on the isolation structure. The pad includes a first sub-pad and a second sub-pad arranged in layers. The first sub-pad at least partially covers the side surface of the isolation structure facing away from the substrate, and the second sub-pad at least partially covers the side surface of the first sub-pad facing away from the isolation structure. The first sub-pad is disposed in the same layer and with the same material as the light-emitting functional part, and the second sub-pad is disposed in the same layer and with the same material as the second electrode.

2. The display panel as described in claim 1, characterized in that, The first sub-pad layer at least partially covers the side surface of the first extension facing away from the isolation structure.

3. The display panel as described in claim 1, characterized in that, The encapsulation unit further includes a second extension connected to the main body, the second extension being disposed on the side of the first extension away from the isolation structure, and the second extension at least partially covering the surface of the pad layer away from the isolation structure.

4. The display panel as described in claim 3, characterized in that, The padding layer includes a central portion and a peripheral portion connected to each other. The central portion covers the side surface of the isolation structure opposite to the substrate, and the peripheral portion is at least partially sandwiched between the first extension and the second extension.

5. The display panel as described in claim 3, characterized in that, The second extensions located on the periphery of the same isolation structure are connected to each other to completely cover the side surface of the pad layer facing away from the isolation structure.

6. The display panel as claimed in claim 1, characterized in that, The light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit; The padding layer is disposed on the isolation structure located at least partially around the first light-emitting unit; and / or The padding layer is disposed on the isolation structure located at least partially around the second light-emitting unit; and / or The padding layer is disposed on the isolation structure located at least partially around the third light-emitting unit.

7. The display panel as described in claim 6, characterized in that, The padding layer is on the same layer as the third light-emitting unit and made of the same material.

8. The display panel as described in any one of claims 1 to 7, characterized in that, The display panel further includes a pixel defining layer, which is disposed on one side of the substrate and defines a plurality of pixel openings spaced apart from each other. Each light-emitting unit is disposed corresponding to each pixel opening. The isolation structure is disposed on the side of the pixel defining layer opposite to the substrate, and the isolation structure is located between at least partially adjacent two pixel openings.

9. The display panel as described in any one of claims 1 to 7, characterized in that, The isolation structure includes an isolation body and a blocking part. The blocking part is located on the side of the isolation body away from the substrate, and the orthographic projection of the isolation body on the substrate is located within the orthographic projection of the blocking part on the substrate. The main body also covers the sidewall of the isolator, the first extension is located on the side of the blocking portion away from the substrate, and the first extension and the blocking portion are spaced apart from each other.

10. The display panel as claimed in claim 9, characterized in that, The isolation structure further includes a base, which is located on the side of the isolation body closer to the substrate, and the orthographic projection of the isolation body on the substrate is located within the orthographic projection of the base on the substrate.

11. A method for manufacturing a display panel, characterized in that, include: An isolation structure is formed on one side of the substrate, the isolation structure enclosing an isolation opening; A light-emitting layer and an encapsulation layer, which are fully covered, are sequentially disposed on the side of the isolation structure opposite to the substrate; The light-emitting layer and the encapsulation layer are etched to form a light-emitting unit, an encapsulation unit, and a pad layer, respectively. The light-emitting unit is disposed corresponding to the isolation opening. The light-emitting unit includes a first electrode, a light-emitting functional part, and a second electrode stacked sequentially. The encapsulation unit includes a main body and a first extension connected to each other. The main body covers the side of the light-emitting unit facing away from the substrate. The first extension is located on the side of the isolation structure facing away from the substrate, and the first extension and the isolation structure are spaced apart from each other. The pad layer is disposed on at least a portion of the side of the isolation structure facing away from the substrate. The orthographic projection outline of the pad layer on the isolation structure at least partially overlaps with the orthographic projection outline of the first extension on the isolation structure. The pad layer includes a first sub-pad layer and a second sub-pad layer stacked together. The first sub-pad layer at least partially covers the side of the isolation structure facing away from the substrate, and the second sub-pad layer at least partially covers the side of the first sub-pad layer facing away from the isolation structure. The first sub-pad layer is disposed on the same layer and made of the same material as the light-emitting functional part, and the second sub-pad layer is disposed on the same layer and made of the same material as the second electrode.

12. The manufacturing method as described in claim 11, characterized in that, The etching of the light-emitting layer and the encapsulation layer to form the light-emitting unit, the encapsulation unit, and the pad layer respectively includes: The light-emitting layer is etched to form a light-emitting functional part corresponding to the isolation opening, and a first sub-pad layer that at least partially covers the side surface of the isolation structure facing away from the substrate.

13. The manufacturing method as described in claim 12, characterized in that, The etching of the light-emitting layer and the encapsulation layer to form the light-emitting unit, the encapsulation unit, and the pad layer respectively further includes: The light-emitting layer is etched to form a second electrode located on the side surface of the light-emitting functional part away from the substrate, and a second sub-pad layer that at least partially covers the side surface of the first sub-pad layer away from the isolation structure.

14. The manufacturing method as described in claim 11, characterized in that, The manufacturing method shown specifically includes: A first light-emitting layer and a first encapsulation layer, which are fully covered, are sequentially disposed on the side of the isolation structure opposite to the substrate; The first light-emitting layer and the first encapsulation layer are etched to remove the portion of the first light-emitting layer located on the side of the isolation structure away from the substrate, so as to form the first light-emitting unit and the first encapsulation unit respectively; A second light-emitting layer and a second encapsulation layer, which are fully covered, are sequentially disposed on the side of the isolation structure opposite to the substrate. The second light-emitting layer and the second encapsulation layer are etched to remove the portion of the second light-emitting layer located on the side of the isolation structure away from the substrate, so as to form the second light-emitting unit and the second encapsulation unit respectively; A third light-emitting layer and a third encapsulation layer, which are fully covered, are sequentially disposed on the side of the isolation structure opposite to the substrate; The third light-emitting layer and the third encapsulation layer are etched to form the third light-emitting unit, the third encapsulation unit, and the pad layer, respectively.

15. The manufacturing method as described in claim 14, characterized in that, The manufacturing method further includes: Remove the portion of the third light-emitting layer located on the isolation structure at least partially around the third light-emitting unit.

16. The manufacturing method as described in claim 15, characterized in that, The manufacturing method further includes: Remove the portion of the third light-emitting layer located on the isolation structure at least partially around the second light-emitting unit; or Remove the portion of the third light-emitting layer located on the isolation structure at least partially around the first light-emitting unit.

17. A display device, characterized in that, include: The display panel according to any one of claims 1 to 10; or A display panel prepared by the method of manufacturing a display panel according to any one of claims 11 to 16.

Images