Visual positioning marking machine and method and storage medium thereof

Abstract

The invention relates to a visual positioning marking machine, a visual positioning marking method and a storage medium, and relates to the technical field of visual positioning marking, in particular to a visual positioning marking machine and a marking method.The visual positioning marking machine comprises a rack, a bidirectional moving carrying table, a pre-positioning mechanism, a secondary positioning marking mechanism, a limiting assembly and a processor; through cooperation of the pre-positioning mechanism and the secondary positioning and marking mechanism, precise positioning and efficient marking of the substrate and the electronic components thereof are achieved, and the marking precision of the electronic components is improved.

Description

Technical Field

[0001] The present application relates to the field of marking equipment, and in particular to a visual positioning marking machine, method and storage medium thereof. Background Art

[0002] After the production of electronic components is completed, they usually need to be marked so that the electronic components have identified information and meet industry standards to facilitate the subsequent traceability of their production information. At the same time, the identification information can also be used as a positioning mark to facilitate the positioning of the current components during the assembly process of subsequent product processing procedures.

[0003] Usually, the size of electronic components is relatively small. In order to facilitate the marking process and make the marking position of the electronic components relatively accurate, so as to reduce the impact on the subsequent product assembly process caused by the deviation between the marking position of the electronic components and the preset position, several electronic components need to be arranged on the substrate respectively, and then the substrate with the electronic components is placed in the marking equipment, and the marking of numerous electronic components is gradually completed through the marking equipment.

[0004] There is a laser marking device that has a visual positioning module. The visual positioning module is used to position electronic components, and the required marking position is determined by recognizing images. The position information is sent to the laser module, and the laser module is used to complete the marking of the electronic components. However, due to the large number of electronic components on the same substrate, and the need for the cooperation of the visual positioning module and the laser module to complete the marking of the electronic components one by one, the speed of marking the electronic components is relatively slow, and there is room for improvement. Summary of the invention

[0005] In order to improve the accuracy of marking of electronic components, the present application provides a visual positioning marking machine, method and storage medium thereof.

[0006] In the first aspect, the visual positioning marking machine provided by the present application adopts the following technical solution: A visual positioning marking machine comprises a frame, a bidirectional movable platform, a pre-positioning mechanism, a secondary positioning marking mechanism, a limiting assembly and a processor, wherein the limiting assembly comprises a first limiting member and a second limiting member, wherein the first limiting member and the second limiting member are both used to limit a substrate, wherein the bidirectional movable platform is arranged on the frame, wherein the first limiting member and the second limiting member are arranged on the bidirectional movable platform in sequence, wherein the pre-positioning mechanism and the secondary positioning marking mechanism are sequentially mounted on the frame on one side of the bidirectional movable platform, wherein the pre-positioning mechanism is used to preliminarily position a substrate and electronic components on the substrate, wherein the secondary positioning marking mechanism is used to position the pre-positioning mechanism The substrate and the electronic components on the substrate are positioned, identified and marked after being positioned by the mechanism. The bidirectional movable platform is used to drive the first limiting member and the second limiting member to synchronously move along the frame in the X-axis or / Y-axis direction. The first waiting position and the second waiting position are respectively provided at both ends of the bidirectional movable platform along the length direction; when the first limiting member is located below the pre-positioning mechanism, the second limiting member is located on the first waiting position, and when the first limiting member is located below the secondary positioning and marking mechanism, the first limiting member is located below the pre-positioning mechanism, and the processor is electrically connected to the bidirectional movable platform, the pre-positioning mechanism and the secondary positioning and marking mechanism.

[0007] By adopting the above technical scheme, when the substrate with electronic components placed thereon is placed in the first limit piece and the second limit piece respectively, the first limit piece and the second limit piece on which the substrate is placed are driven by the bidirectional movable stage to move along the frame, and the substrate is positioned by the pre-positioning mechanism to determine the position information of the substrate and the electronic components on the substrate, and then the substrate that has been positioned by the pre-positioning mechanism is identified by the secondary positioning marking mechanism, and the marking operation of the electronic components on the substrate can be completed by the secondary positioning marking mechanism, and the first waiting position and the second waiting position are respectively provided at both ends of the movable stage along the length direction, and when the first limit piece is located below the pre-positioning mechanism, the second limit piece is located on the first waiting position, at this time, the substrate placed on the second limit piece can be moved along the second waiting position. The second limit piece is taken out, or the substrate is placed on the second limit piece. Through the above process, it is beneficial to reduce the downtime waiting time for placing the substrate, and plays a positive guiding role in improving the efficiency of electronic component marking. Compared with the method of using the positioning module and the laser module to complete the marking of electronic components one by one, the present application cooperates with the pre-positioning mechanism and the secondary positioning and marking mechanism. After the positioning is completed by the pre-positioning mechanism, it only needs to process the position information collected by the pre-positioning mechanism through the secondary positioning and marking mechanism to determine the position of the electronic components on the substrate that need to be marked. The purpose of marking the electronic components on the substrate can be completed through the secondary positioning and marking mechanism, and there is no need to identify each electronic component when marking it.

[0008] Preferably, the pre-positioning mechanism includes an adjustment component and an identification component, the adjustment component is arranged on the frame, the identification component is arranged on the adjustment component, the adjustment component is used to drive the identification component to move along the Z-axis direction of the frame, the identification component includes a first CCD camera, the first CCD camera is facing the bidirectional movable carrier platform, the first CCD camera is used to identify the substrate and the electronic components on the substrate, and the first CCD camera is electrically connected to the processor.

[0009] By adopting the above technical solution, the substrate and the electronic components on the substrate can be identified through the first CCD camera to determine the required marking position, and the position information is sent to the processor. The recognition accuracy is high, which is conducive to reducing the deviation between the marking position and the actual set position due to the deviation in the recognition position.

[0010] Preferably, positioning marks are arranged on the substrate in a rectangular array, and a plurality of electronic components are located on the substrate between the positioning marks.

[0011] By adopting the above technical solution, since the positions of the electronic components installed on the substrate are in a relatively fixed state and are all located on the substrate between the positioning marks, when the first CCD camera and the secondary positioning marking mechanism identify the substrate, they can perform preliminary positioning on it through the positioning marks to determine the positional relationship between the substrate and the electronic components. When it is necessary to determine the position information of the electronic components along the substrate, it is only necessary to determine the position information of the positioning marks, which is easy to operate.

[0012] Preferably, the secondary positioning and marking mechanism includes a second CCD camera and a laser marking machine, the second CCD camera is arranged on the laser marking machine, the laser head of the laser marking machine is facing the bidirectional movable stage, the second CCD camera is used to identify the positioning mark, and the second CCD camera is electrically connected to the processor.

[0013] By adopting the above technical solution, the positioning mark of the substrate is identified by the second CCD camera, and the identification information is sent to the processor. The processor compares the position information of the positioning mark identified by the first CCD camera and the second CCD camera to determine the specific position of the electronic components on the substrate that need to be marked, and starts marking the electronic components on the substrate through the processor pneumatic laser marking machine.

[0014] Preferably, the secondary positioning and marking mechanism further includes an exhaust component, which is disposed on one side of the laser marking machine and is used to perform air suction for the laser marking machine.

[0015] By adopting the above technical solution, the exhaust gas generated by the laser marking machine during operation is discharged through the exhaust component, thereby reducing the probability of the exhaust gas accumulating between the second CCD camera and the frame, thereby affecting the recognition accuracy of the second CCD camera.

[0016] In the second aspect, the present application provides a marking method of a visual positioning marking machine using the following technical solution: A marking method for a visual positioning marking machine, applied to the visual positioning marking machine described in the first aspect, comprising: S1. The processor controls the first limiter and the second limiter on the bidirectional movable stage on which the substrate is placed to move until the first limiter is located below the first CCD camera and the second limiter is located below the second CCD camera; S2. The processor controls the first CCD camera and the second CCD camera to start working; S3. The first CCD camera identifies the positioning mark on the substrate within the first stopper and sends the positioning mark to the processor; S4. After the processor sends the positioning mark position information to the second CCD camera and the laser marking machine, the laser marking machine starts marking the electronic components on the substrate within the second stopper; S5. After the laser marking machine completes marking of the electronic components on the substrate in the second stopper, the processor controls the bidirectional movable stage to move until the second stopper is located at the second waiting position and the first stopper is located below the second CCD camera; S6. After the laser marking machine completes marking the electronic components on the substrate in the first limiter, the processor controls the bidirectional movable stage to move until the first limiter is located at the second waiting position and the second limiter is located below the second CCD camera.

[0017] By adopting the above technical solution, through the cooperation of the bidirectional movable stage and the first CCD camera and the second CCD camera, it is helpful to reduce the downtime waiting time, and the recognition accuracy is high, which is helpful to reduce the probability of the actual marking position of the electronic component and the preset marking position not meeting the set requirements.

[0018] Preferably, A1. The processor converts the positioning mark image information into coordinate information and sets it to zero; A2. The processor identifies the image information of the electronic components between the substrate positioning marks and converts it into coordinate information, so that any electronic component has independent coordinate information; A3. The processor processes the coordinate information of the electronic components and calculates the coordinate information of the current electronic components' required marking positions.

[0019] By adopting the above technical solution, the image information is converted into coordinate information. After the processor issues control instructions to the laser marking machine, the laser marking equipment only needs to determine the marking position through the coordinate information to complete the marking of electronic components.

[0020] Preferably, B1. The processor sends the position coordinates of the positioning mark and the coordinate information of the required marking position of the electronic components to the second CCD camera and the laser marking machine; B2. The second CCD camera identifies the positioning mark on the substrate and sends the identification information to the processor to determine the coordinate information of the substrate positioning mark; B3. The processor determines the coordinate information of several electronic components located on the substrate based on the coordinate information of the positioning mark of the substrate recognized by the second CCD camera, and sends the coordinate information to the laser marking machine.

[0021] By adopting the above technical solution: the processor converts the positioning mark image information into coordinate information and sets it to zero, identifies the electronic component image information between the substrate positioning marks and converts it into coordinate information, so that each electronic component has independent coordinate information, and then processes the coordinate information of the electronic component to calculate the coordinate information of the current electronic component required for marking. In addition, the processor also sends the position coordinates of the positioning mark and the coordinate information of the electronic component required for marking to the second CCD camera and the laser marking machine. The second CCD camera identifies the positioning mark on the substrate and sends the identification information to the processor to determine the substrate positioning mark coordinate information. The processor uses the substrate positioning mark coordinate information identified by the second CCD camera as a reference to determine the coordinate information of the electronic component located on the substrate, and sends the coordinate information to the laser marking machine, thereby achieving high-precision positioning of the electronic component marking.

[0022] In a third aspect, the present application provides a computer-readable storage medium that adopts the following technical solution: A computer-readable storage medium stores a computer program that can be loaded by a processor and executes the marking method of a visual positioning marking machine described in the second aspect.

[0023] In summary, the present application includes at least one of the following beneficial technical effects: 1. After the positioning is completed by the pre-positioning mechanism, the position information collected by the pre-positioning mechanism can be processed by the secondary positioning marking mechanism to determine the position of the electronic components on the substrate to be marked. The purpose of marking the electronic components on the substrate can be completed by the secondary positioning marking mechanism, without the need to identify each electronic component once when marking it; 2. When the first CCD camera and the secondary positioning marking mechanism are identifying the substrate, they can perform preliminary positioning on it through the positioning mark to determine the positional relationship between the substrate and the electronic components. When it is necessary to determine the position information of the electronic components along the substrate, it is only necessary to determine the position information of the positioning mark, which is easy to operate; 3. Convert the image information into coordinate information. After the processor issues control instructions to the laser marking machine, the laser marking equipment only needs to determine the marking position through the coordinate information to complete the marking of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of a visual positioning marking machine according to an embodiment of the present application.

[0025] Figure 2 yes Figure 1 An enlarged structural diagram of part A in a visual positioning marking machine.

[0026] Figure 3 It is a structural schematic diagram of a substrate in a visual positioning marking machine according to an embodiment of the present application.

[0027] Figure 4 It is a step flow chart of a marking method of a visual positioning marking machine according to an embodiment of the present application.

[0028] Figure 5 It is a flow chart of the coordinate information of a processor determining a positioning mark and an electronic component located between the positioning marks in a marking method of a visual positioning marking machine in an embodiment of the present application.

[0029] Explanation of the accompanying drawings: 1. Rack; 2. Bidirectional movable carrier; 21. First waiting position; 22. Second waiting position; 3. Substrate; 31. Positioning mark; 311. Placement position; 4. Pre-positioning mechanism; 41. Adjustment component; 411. Motor screw drive mechanism; 412. Mounting seat; 42. Identification component; 421. First CCD camera; 422. Fill light; 5. Secondary positioning marking mechanism; 51. Second CCD camera; 52. Laser marking machine; 6. Limiting component; 61. First limiting member; 62. Second limiting member; 7. Processor; 8. Exhaust component; 81. Negative pressure exhaust fan; 82. Exhaust pipeline. DETAILED DESCRIPTION

[0030] The directions mentioned or possibly mentioned in this specification, such as up, down, left, right, front, back, side, above, below, X-axis, Y-axis, Z-axis, etc., are used to be defined relative to the structures shown in the drawings. The words "inside" and "outside" refer to the directions toward or away from the geometric center of a specific component, respectively. They are relative concepts, and therefore may change accordingly according to different locations and different usage conditions. Therefore, these or other directions should not be interpreted as restrictive terms.

[0031] The following is combined with Figure 1-5 This application is described in further detail.

[0032] In the first aspect, the present application embodiment discloses a visual positioning marking machine. Figure 1-Figure 3 A visual positioning marking machine includes a frame 1, a bidirectional movable platform 2, a pre-positioning mechanism 4, a secondary positioning marking mechanism 5, a limiting component 6 and a processor, the limiting component 6 includes a first limiting member 61 and a second limiting member 62, the first limiting member 61 and the second limiting member 62 are both used to limit the substrate 3, the bidirectional movable platform 2 is arranged on the frame 1, the first limiting member 61 and the second limiting member 62 are sequentially arranged on the bidirectional movable platform 2, the pre-positioning mechanism 4 and the secondary positioning marking mechanism 5 are sequentially arranged on the frame 1 on one side of the bidirectional movable platform 2, the pre-positioning mechanism 4 is used to preliminarily position the substrate 3 and the electronic components on the substrate 3, and the secondary positioning marking mechanism 5 is used to After being positioned by the positioning mechanism 4, the substrate 3 and the electronic components on the substrate 3 are positioned, identified and marked. The bidirectional movable platform 2 is used to drive the first limit member 61 and the second limit member 62 to synchronously move along the X-axis or / Y-axis direction along the frame 1. The first waiting position 21 and the second waiting position 22 are respectively provided at both ends of the bidirectional movable platform 2 along the length direction. When the first limit member 61 is located below the pre-positioning mechanism 4, the second limit member 62 is located on the first waiting position 21. When the first limit member 61 is located below the secondary positioning and marking mechanism 5, the first limit member 61 is located below the pre-positioning mechanism 4. The processor is electrically connected to the bidirectional movable platform 2, the pre-positioning mechanism 4 and the secondary positioning and marking mechanism 5.

[0033] First of all, it should be explained that the bidirectional movable platform 2 is an electric slide, including a base, an X-axis moving component, a Y-axis moving component and a fixed seat. Through the cooperation of the X-axis moving component and the Y-axis moving component, the purpose of moving the fixed seat along the X-axis or Y-axis direction is achieved. It is an existing slide, and its specific composition and working principle are not described here.

[0034] Specifically, the first stopper 61 and the second stopper 62 have the same composition and function. For the sake of convenience, the first stopper 61 is used for description below. The first stopper 61 is recessed along the thickness direction to form a cavity that matches the contour of the substrate 3. The cavity limits the position of the substrate 3 placed on the first stopper 61, so that the substrate 3 can be taken out along the first stopper 61 or the first stopper 61 can be placed on the first stopper 61.

[0035] Therefore, in the initial state, the first limiting member 61 is located below the pre-positioning mechanism 4, and the second limiting member 62 is located on the first waiting position 21. At this time, the substrate 3 in the first limiting member 61 is positioned by the pre-positioning mechanism 4, and another substrate 3 with electronic components can be placed in the second limiting member 62.

[0036] Furthermore, after the substrate 3 in the first limit member 61 is positioned by the pre-positioning mechanism 4, the processor controls the bidirectional movable platform 2 to move, so that the bidirectional movable platform 2 drives the first limit member 61 and the second limit member 62 to move until the first limit member 61 moves to the bottom of the secondary positioning and marking mechanism 5, at which time the second limit member 62 will move to the bottom of the pre-positioning mechanism 4.

[0037] Furthermore, when the first limiting member 61 moves to the bottom of the secondary positioning and marking mechanism 5, the processor controls the secondary positioning and marking mechanism 5 to start working, so as to achieve the purpose of marking the electronic components on the substrate 3 placed in the first limiting member 61. At the same time, the pre-positioning mechanism 4 will synchronously start to locate and identify the substrate 3 in the second limiting member 62 and the electronic components on the substrate 3, and send the identification information to the processor.

[0038] Furthermore, when the secondary positioning and marking mechanism 5 completes marking of the electronic components on the substrate 3 of the first limiting piece 61, the bidirectional movable carrier will drive the first limiting piece 61 to move to the second waiting position 22, and at the same time, the second limiting piece 62 moves to the bottom of the secondary positioning and marking mechanism 5, and the secondary positioning and marking mechanism 5 starts to mark the electronic components on the substrate 3 located at the second limiting piece 62. At the same time, another substrate 3 with electronic components to be marked can be placed on the first limiting piece 61.

[0039] Correspondingly, when the secondary positioning and marking mechanism 5 completes marking of the electronic components on the substrate 3 of the second limit member 62, the processor controls the movement of the bidirectional movable stage 2 until the first limit member 61 moves to the bottom of the pre-positioning mechanism 4 and the second limit member 62 is located at the first waiting position 21. In this way, the above process is repeated to realize the marking of the electronic components on the substrate 3.

[0040] Reference Figure 1 and Figure 2The pre-positioning mechanism 4 includes an adjusting component 41 and an identifying component 42 . The adjusting component 41 is arranged on the frame 1 , and the identifying component 42 is arranged on the adjusting component 41 . The adjusting component 41 is used to drive the identifying component 42 to move along the Z-axis direction of the frame 1 .

[0041] Specifically, the adjustment component 41 includes a motor screw lifting mechanism and a mounting seat 412. The motor screw lifting mechanism includes a motor and a screw. The motor is arranged on the frame 1. The screw is coaxially fixed with the output shaft of the motor. At the same time, the mounting seat 412 cooperates with the screw thread. When the output shaft of the motor rotates, the screw is coaxially fixed with the motor, so that the screw rotates synchronously with the output shaft of the motor. Because the mounting seat 412 cooperates with the screw thread, the purpose of lifting and lowering the mounting seat 412 along the screw is achieved (the lifting and lowering of the mounting seat 412 is affected by the rotation direction of the motor output shaft, which will not be elaborated here).

[0042] At the same time, the recognition component 42 includes a first CCD camera 421 and a fill light 422. The first CCD camera 421 and the fill light 422 are installed on the mounting base 412 in sequence, and the lens of the first CCD camera 421 is facing the bidirectional movable platform 2. The first CCD camera 421 is electrically connected to the processor. At the same time, the fill light 422 is used to fill in the light for the first CCD camera 421, thereby reducing the probability of insufficient light affecting the detection result of the first CCD camera 421. At the same time, the height of the first CCD camera 421 along the Z-axis direction can be adjusted by the adjustment component 41 to achieve the purpose of focusing the first CCD camera 421.

[0043] Therefore, the substrate 3 and the electronic components on the substrate 3 are identified by the first CCD camera 421 to determine the position information of the substrate 3 and the electronic components on the substrate 3, and the position information is sent to the controller.

[0044] It should be noted here that, refer to Figure 2 and Figure 3 , positioning marks 31 are arranged on the substrate 3 in a rectangular array, and a plurality of electronic components are located on the substrate 3 between the positioning marks 31 .

[0045] Specifically, four positioning marks 31 are provided, and the four positioning marks 31 are arranged symmetrically with respect to the midline of the length direction of the substrate 3 , and a placement position 311 for placing electronic components is formed between the four positioning marks 31 .

[0046] Therefore, when the first CCD camera 421 starts to scan the substrate 3, the first CCD camera 421 will use the four positioning marks 31 as a reference, capture the image between the four positioning marks 31 on the substrate 3 and send it to the processor to determine the position information of the electronic components located on the placement position 311, and send the position information to the secondary positioning marking mechanism 5. The marking processing of the electronic components on the substrate 3 can be completed through the secondary marking mechanism.

[0047] Reference Figure 1 and Figure 2 The secondary positioning and marking mechanism 5 includes a second CCD camera 51 and a laser marking machine 52. The second CCD camera 51 is arranged on the laser marking machine 52. The laser head of the laser marking machine 52 faces the bidirectional movable stage 2. The second CCD camera 51 is used to identify the positioning mark 31. The second CCD camera 51 is electrically connected to the processor.

[0048] First of all, it should be noted that the laser marking machine 52 is a conventional laser etching device, and its specific composition and working principle are not described in detail here.

[0049] Furthermore, when the substrate 3 after being identified by the first CCD camera 421 reaches under the second CCD camera 51, the second CCD camera 51 again locates the substrate 3 through the four positioning marks 31, and sends the positioning information to the controller. The controller compares the identification information of the first CCD camera 421 with that of the second CCD camera 51, and uses the identification information of the first CCD camera 421 as a reference to determine the position information of the electronic components on the substrate 3 under the second CCD camera 51, and sends it to the laser marking machine 52.

[0050] Correspondingly, after receiving the position information sent by the controller, the laser marking machine 52 starts marking the electronic components on the substrate 3 below the second CCD camera 51 .

[0051] Reference Figure 1 and Figure 2 The secondary positioning and marking mechanism 5 also includes an exhaust component 8 , which is disposed on one side of the laser marking machine 52 , and is used to suction air for the laser marking machine 52 .

[0052] Specifically, the exhaust component 8 includes a pipeline and a negative pressure exhaust fan 81, the exhaust pipeline 82 is connected to the air inlet of the negative pressure exhaust fan 81, and the air inlet of the exhaust pipeline 82 faces the laser head of the laser marking machine 52. When the laser marking machine 52 starts to mark electronic components, the smoke generated by the laser marking machine 52 during marking is sucked into the negative pressure exhaust fan 81 through the negative pressure exhaust fan 81 and discharged along the air outlet of the negative pressure exhaust fan 81, thereby reducing the probability of the smoke generated by the laser marking machine 52 during marking electronic components gathering near the laser marking machine 52 and the second CCD camera 51, thereby having a certain impact on the detection result of the second CCD camera 51.

[0053] In a second aspect, a marking method of a visual positioning marking machine is disclosed, which is applied to a visual positioning marking machine as described in the first aspect.

[0054] Reference Figure 4 ,include S1. The processor controls the first stopper 61 and the second stopper 62 of the bidirectional movable stage 2 carrying the substrate 3 to move until the first stopper 61 is located below the first CCD camera 421 and the second stopper 62 is located below the second CCD camera 51; S2. The processor controls the first CCD camera 421 and the second CCD camera 51 to start working; S3. The first CCD camera 421 identifies the positioning mark 31 on the substrate 3 within the first stopper 61 and sends the positioning mark 31 to the processor; S4. After the processor sends the position information of the positioning mark 31 to the second CCD camera 51 and the laser marker 52, the laser marker 52 starts marking the electronic components on the substrate 3 within the second stopper 62; S5. When the laser marking machine 52 completes marking of the electronic components on the substrate 3 in the second stopper 62, the processor controls the bidirectional movable stage 2 to move until the second stopper 62 is located at the second waiting position 22 and the first stopper 61 is located below the second CCD camera 51; S6. When the laser marking machine 52 completes marking the electronic components on the substrate 3 in the first limit member 61, the processor controls the bidirectional movable stage 2 to move until the first limit member 61 is located at the second waiting position 22 and the second limit member 62 is located below the second CCD camera 51.

[0055] S7. The laser marking machine 52 starts marking the electronic components on the substrate 3 located on the second limiting piece 62. At the same time, another substrate 3 with electronic components to be marked can be placed on the first limiting piece 61. When the laser marking machine 52 completes marking the electronic components on the substrate 3 on the second limiting piece 62, the processor controls the bidirectional slide to move until the first limiting piece 61 is located below the first CCD camera 421 and the second limiting piece 62 is located on the first waiting position 21.

[0056] Therefore, the above steps as shown in S1 to S7 can be cycled to achieve continuous marking of electronic components.

[0057] The principle is that, referring to Figure 5 ,include: A1. The processor converts the image information of the positioning mark 31 into coordinate information and sets it to zero; Set any one of the 31-bit references for the positioning mark and define the coordinates here as (0.00, 0.00). At the same time, the coordinate information of the other three positioning marks 31 are respectively (0.00, Y), (Y, 0.00) and (X, Y). Thus, the coordinates of any point in the enclosed rectangular area can be obtained using the four sets of reference coordinates.

[0058] A2. The processor identifies the electronic component image information between the positioning marks 31 of the substrate 3 and converts it into coordinate information, so that any electronic component has independent coordinate information (the number of coordinate points changes with the shape of the electronic component); The processor processes the image recognized by the first CCD camera 421 and converts the image position information of a plurality of electronic components located between the four sets of reference coordinates into coordinate information.

[0059] For example, if there is a standard rectangular electronic component somewhere on the substrate 3, the coordinate information converted from the image information of the electronic component is (1.22, 1.22), (1.22, 2.02), (2.02, 1.22) and (2.02, 2.02), thereby achieving the purpose of locating the current electronic component.

[0060] A3. The processor processes the coordinate information of the electronic components and calculates the coordinate information of the current electronic components' required marking positions.

[0061] After the processor has completed setting the required marking position of the current electronic component, the marking position information can be sent to the laser marking machine 52 , and the laser marking machine 52 starts marking the electronic component.

[0062] For example, if it is necessary to symmetrically mark a straight line with a length of 0.4 mm from the geometric center to both ends in the width direction of the above-mentioned standard rectangular electronic component, the laser head of the laser marking machine 52 will move to (1.62, 1.42), start the laser marking machine 52, and the laser head of the laser marking machine 52 will move along this coordinate in a straight line to (1.62, 1.82), thereby achieving the purpose of marking the current electronic component.

[0063] The specific implementation steps are: B1. The processor sends the position coordinates of the positioning mark 31 and the coordinate information of the electronic component required to be marked to the second CCD camera 51 and the laser marker 52; B2. The second CCD camera 51 identifies the positioning mark 31 on the substrate 3 and sends the identification information to the processor to determine the coordinate information of the positioning mark 31 on the substrate 3; B3. The processor determines the coordinate information of several electronic components located on the substrate 3 based on the coordinate information of the positioning mark 31 of the substrate 3 recognized by the second CCD camera 51 , and sends the coordinate information to the laser marking machine 52 .

[0064] In a third aspect, the present application provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the following steps are implemented: S1. The processor controls the first stopper 61 and the second stopper 62 of the bidirectional movable stage 2 carrying the substrate 3 to move until the first stopper 61 is located below the first CCD camera 421 and the second stopper 62 is located below the second CCD camera 51; S2. The processor controls the first CCD camera 421 and the second CCD camera 51 to start working; S3. The first CCD camera 421 identifies the positioning mark 31 on the substrate 3 within the first stopper 61 and sends the positioning mark 31 to the processor; S4. After the processor sends the position information of the positioning mark 31 to the second CCD camera 51 and the laser marker 52, the laser marker 52 starts marking the electronic components on the substrate 3 within the second stopper 62; S5. When the laser marking machine 52 completes marking of the electronic components on the substrate 3 in the second stopper 62, the processor controls the bidirectional movable stage 2 to move until the second stopper 62 is located at the second waiting position 22 and the first stopper 61 is located below the second CCD camera 51; S6. When the laser marking machine 52 completes marking the electronic components on the substrate 3 in the first limit member 61, the processor controls the bidirectional movable stage 2 to move until the first limit member 61 is located at the second waiting position 22 and the second limit member 62 is located below the second CCD camera 51.

[0065] S7. The laser marking machine 52 starts marking the electronic components on the substrate 3 located on the second limiting piece 62. At the same time, another substrate 3 with electronic components to be marked can be placed on the first limiting piece 61. When the laser marking machine 52 completes marking the electronic components on the substrate 3 on the second limiting piece 62, the processor controls the bidirectional slide to move until the first limiting piece 61 is located below the first CCD camera 421 and the second limiting piece 62 is located on the first waiting position 21.

[0066] The implementation principle of a visual positioning marking machine, method and storage medium of an embodiment of the present application is as follows: a first CCD camera 421 is used to perform image recognition on a number of electronic components on a substrate 3 and send the image to a processor; the processor processes the image and converts the position information of the electronic components in the image into coordinate information; then, through the cooperation of a second CCD camera 51 and a positioning mark 31, the reference coordinates of the current substrate 3 are determined and the reference coordinates are sent to the processor; the processor compares the coordinate information with the coordinate information of the positioning mark detected by the second CCD camera 51 to determine the specific marking coordinates of the electronic components on the current substrate 3, and feeds back the preset marking coordinates to the laser marking machine 52, thereby achieving the purpose of marking the electronic components and effectively improving the accuracy of marking the electronic components.

[0067] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM) and memory bus dynamic RAM (RDRAM).

[0068] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0069] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A visual positioning marking machine, characterized in that: The invention comprises a frame (1), a bidirectional movable platform (2), a pre-positioning mechanism (4), a secondary positioning marking mechanism (5), a limiting assembly (6) and a processor, wherein the limiting assembly (6) comprises a first limiting member (61) and a second limiting member (62), wherein the first limiting member (61) and the second limiting member (62) are both used for limiting the position of a substrate (3), the bidirectional movable platform (2) is arranged on the frame (1), the first limiting member (61) and the second limiting member (62) are arranged on the bidirectional movable platform (2) in sequence, the pre-positioning mechanism (4) and the secondary positioning marking mechanism (5) are respectively mounted on the frame (1) on one side of the bidirectional movable platform (2), the pre-positioning mechanism (4) is used for performing preliminary positioning on the substrate (3) and the electronic components on the substrate (3), and the secondary positioning marking mechanism (5) is used for the pre-positioning mechanism (4) The positioned substrate (3) and the electronic components on the substrate (3) are positioned, identified and marked, the bidirectional movable platform (2) is used to drive the first limiting member (61) and the second limiting member (62) to synchronously move along the frame (1) in the X-axis or / Y-axis direction, and the two ends of the bidirectional movable platform (2) along the length direction are respectively provided with a first waiting position (21) and a second waiting position (22); when the first limiting member (61) is located below the pre-positioning mechanism (4), the second limiting member (62) is located on the first waiting position (21); when the first limiting member (61) is located below the secondary positioning marking mechanism (5), the first limiting member (61) is located below the pre-positioning mechanism (4), and the processor is electrically connected to the bidirectional movable platform (2), the pre-positioning mechanism (4) and the secondary positioning marking mechanism (5).

2. A visual positioning marking machine according to claim 1, characterized in that: The pre-positioning mechanism (4) comprises an adjustment component (41) and an identification component (42); the adjustment component (41) is arranged on the frame (1); the identification component (42) is arranged on the adjustment component (41); the adjustment component (41) is used to drive the identification component (42) to move along the Z-axis direction of the frame (1); the identification component (42) comprises a first CCD camera (421); the first CCD camera (421) faces the bidirectional movable carrier platform; the first CCD camera (421) is used to identify the substrate (3) and the electronic components on the substrate (3); the first CCD camera (421) is electrically connected to the processor.

3. A visual positioning marking machine according to claim 2, characterized in that: Positioning marks (31) are arranged in a rectangular array on the substrate (3), and a plurality of electronic components are located on the substrate (3) between the positioning marks (31).

4. A visual positioning marking machine according to claim 3, characterized in that: The secondary positioning marking mechanism (5) comprises a second CCD camera (51) and a laser marking machine (52), wherein the second CCD camera (51) is arranged on the laser marking machine (52), the laser head of the laser marking machine (52) faces the bidirectional movable carrier (2), the second CCD camera (51) is used to identify the positioning mark (31), and the second CCD camera (51) is electrically connected to the processor.

5. A visual positioning marking machine according to claim 4, characterized in that: The secondary positioning marking mechanism (5) further comprises an air suction component (8), wherein the air suction component (8) is arranged on one side of the laser marking machine (52), and the air suction component (8) is used to perform air suction for the laser marking machine (52).

6. A marking method for a visual positioning marking machine, characterized in that: A visual positioning marking machine applied to any one of claims 1 to 5, comprising: S1. The processor controls the first limiting member (61) and the second limiting member (62) on the bidirectional movable stage (2) carrying the substrate (3) to move until the first limiting member (61) is located below the first CCD camera (421) and the second limiting member (62) is located below the second CCD camera (51); S2. The processor controls the first CCD camera (421) and the second CCD camera (51) to start working; S3. The first CCD camera (421) identifies the positioning mark (31) on the substrate (3) located in the first stopper (61), and sends the positioning mark (31) to the processor; S4. After the processor sends the position information of the positioning mark (31) to the second CCD camera (51) and the laser marking machine (52), the laser marking machine (52) starts marking the electronic components on the substrate (3) in the second stopper (62); S5. When the laser marking machine (52) completes marking the electronic components on the substrate (3) in the second stopper (62), the processor controls the bidirectional movable stage (2) to move until the second stopper (62) is located at the second waiting position (22) and the first stopper (61) is located below the second CCD camera (51); S6. After the laser marking machine (52) completes marking the electronic components on the substrate (3) in the first limit member (61), the processor controls the bidirectional movable platform (2) to move until the first limit member (61) is located at the second waiting position (22) and the second limit member (62) is located below the second CCD camera (51).

7. The marking method of a visual positioning marking machine according to claim 1, characterized in that: include A1. The processor converts the image information of the positioning mark (31) into coordinate information and sets it to zero; A2. The processor identifies the image information of the electronic components between the positioning marks (31) of the substrate (3) and converts it into coordinate information, so that any electronic component has independent coordinate information; A3. The processor processes the coordinate information of the electronic components and calculates the coordinate information of the current electronic components required to be marked; The marking method of a visual positioning marking machine according to claim 1 is characterized by comprising: B1. The processor sends the position coordinates of the positioning mark (31) and the coordinate information of the required marking position of the electronic component to the second CCD camera (51) and the laser marking machine (52); B2. The second CCD camera (51) identifies the positioning mark (31) on the substrate (3) and sends the identification information to the processor to determine the coordinate information of the positioning mark (31) on the substrate (3); B3. The processor determines the coordinate information of a plurality of electronic components located on the substrate (3) based on the coordinate information of the positioning mark (31) of the substrate (3) identified by the second CCD camera (51), and sends the coordinate information to the laser marking machine (52).

8. A computer-readable storage medium, characterized in that: A computer program is stored which can be loaded by a processor and executes a marking method of a visual positioning marking machine as described in any one of claims 6 to 8.

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