Wafer scrubbing equipment, scrubbing system, polishing equipment and wafer cleaning method

Abstract

The embodiments of the present application provide a wafer scrubbing device, a scrubbing system, a polishing device and a wafer cleaning method, wherein the wafer scrubbing device comprises: a motor, a telescopic module, a pressure sensor, a scrubbing brush and a controller; the motor and the telescopic module are respectively connected to the scrubbing brush; the controller is electrically connected to the telescopic module and the pressure sensor; wherein the motor is used to drive the scrubbing brush to rotate so that the scrubbing brush scrubs the wafer; the pressure sensor is used to detect the force between the scrubbing brush and the telescopic module, and transmit the detection result to the controller; the controller is used to control the telescopic module to perform a telescopic action according to the detection result, so that the telescopic module drives the scrubbing brush to move along the direction of the rotation axis, so as to adjust the force between the scrubbing brush and the wafer, so as to keep the pressure applied by the scrubbing brush to the wafer surface constant.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor manufacturing technology, and in particular to a wafer scrubbing device, a wafer scrubbing system, a polishing device, and a wafer cleaning method. Background Art

[0002] After polishing a wafer, it is typically necessary to scrub the wafer surface with a scrubbing brush in a scrubbing module to remove impurities. When using the scrubbing brush to clean the wafer surface, the scrubbing brush head can be used to apply constant pressure to the wafer surface, thereby scrubbing the wafer surface evenly and ensuring a good cleaning effect. However, related art techniques fail to maintain a constant pressure applied by the brush head to the wafer surface during scrubbing. Summary of the Invention

[0003] In view of this, embodiments of the present application provide a wafer scrubbing device, a wafer scrubbing system, a polishing device, and a wafer cleaning method to at least partially solve the above-mentioned problems.

[0004] According to a first aspect of an embodiment of the present application, a wafer scrubbing device is provided, comprising: a motor, a telescopic module, a pressure sensor, a scrubbing brush and a controller; the motor and the telescopic module are respectively connected to the scrubbing brush; the controller is electrically connected to the telescopic module and the pressure sensor; wherein, the motor is used to drive the scrubbing brush to rotate so that the scrubbing brush scrubs the wafer; the pressure sensor is used to detect the force between the scrubbing brush and the telescopic module, and transmit the detection result to the controller; the controller is used to control the telescopic module to perform a telescopic action according to the detection result, so that the telescopic module drives the scrubbing brush to move along the direction of the rotation axis to adjust the force between the scrubbing brush and the wafer.

[0005] In one possible implementation, the scrubbing brush includes a brush head and a first rotating shaft, the brush head is connected to the first end of the first rotating shaft; the telescopic module is connected to the second end of the first rotating shaft; the motor is connected to the first rotating shaft through a transmission assembly; the transmission assembly includes a rotating shaft seat arranged outside the first rotating shaft, and the motor is connected to the rotating shaft seat; the rotating shaft seat and the first rotating shaft are movably connected, and the first rotating shaft can move axially along the rotation axis in the rotating shaft seat; and a clamping structure that is clamped to the first rotating shaft is provided on the rotating shaft seat, and when the rotating shaft seat rotates around the rotation axis under the drive of the transmission assembly, the rotating shaft seat drives the first rotating shaft to rotate around the rotation axis through the clamping structure.

[0006] In one possible implementation, the clamping structure includes a limit bearing, which is installed on the shaft seat through a second shaft, and the axis of the second shaft is perpendicular to the rotation axis; the limit bearing includes an inner wheel surface in contact with the second shaft and an outer wheel surface opposite to the inner wheel surface; a clamping surface for abutting against the outer wheel surface is provided on the first shaft; the limit bearing is clamped to the clamping surface of the first shaft through the outer wheel surface.

[0007] In a possible implementation, the device further includes a guide sleeve, which is disposed in the rotating shaft seat, and the first rotating shaft is disposed in the guide sleeve, and the guide sleeve is used to limit the first rotating shaft from moving in a direction other than the first rotating shaft.

[0008] In one possible implementation, the transmission assembly includes a first transmission wheel, a second transmission wheel and a transition piece; the first transmission wheel is sleeved outside the rotating shaft seat, and the second transmission wheel is connected to the output shaft of the motor; and the first transmission wheel and the second transmission wheel are connected through the transition piece.

[0009] In a possible implementation, a magnetic module is provided between the telescopic module and the first rotating shaft, and the telescopic module is connected to the second end of the first rotating shaft through the magnetic module; wherein the magnetic module is used to adsorb the second end of the first rotating shaft through magnetic force.

[0010] In a possible implementation, the magnetic module contacts the second end of the first rotating shaft, and the contact between the magnetic module and the second end of the first rotating shaft is point contact.

[0011] In a possible implementation, the pressure sensor is located between the telescopic module and the magnetic module, the telescopic module is connected to the pressure sensor, and the pressure sensor is connected to the magnetic module.

[0012] In one possible implementation, the device includes a shell, the first rotating shaft is at least partially located in the shell, and the brush head is located outside the shell; the shell includes a mounting through hole, and the first end of the first rotating shaft is connected to the brush head through a connecting block located in the mounting through hole; a first protective cover covering the mounting through hole is provided between the brush head and the connecting block, and a second protective cover is provided on the shell that is sleeved on the first protective cover and the outside of the brush head.

[0013] According to a second aspect of the embodiments of the present application, a wafer scrubbing system is provided, comprising the wafer scrubbing device according to any one of the embodiments of the first aspect above.

[0014] According to a third aspect of the embodiments of the present application, a polishing device is provided, comprising the wafer scrubbing device in the embodiment of the second aspect described above.

[0015] According to the fourth aspect of the embodiment of the present application, a wafer cleaning method is provided, which uses the wafer scrubbing equipment described in the above aspects to perform wafer cleaning. The wafer cleaning method includes: positioning the wafer at the wafer scrubbing equipment; pressing the scrubbing brush against the surface of the wafer; and driving the scrubbing brush to rotate to scrub the wafer.

[0016] In one possible implementation, the wafer cleaning method further includes: detecting the force between the scrubbing brush and the telescopic module; controlling the telescopic module to perform a telescopic action according to the force between the scrubbing brush and the telescopic module to adjust the force between the scrubbing brush and the wafer.

[0017] The wafer scrubbing device provided in an embodiment of the present application includes a motor, a telescopic module, a pressure sensor, a scrubbing brush, and a controller. The motor and the telescopic module are respectively connected to the scrubbing brush, and the controller is respectively electrically connected to the telescopic module and the pressure sensor. The motor can drive the scrubbing brush to rotate so that the scrubbing brush scrubs the wafer. The pressure sensor can detect the force between the scrubbing brush and the telescopic module and transmit the detection result to the controller. The controller can control the telescopic module to perform a telescopic action based on the detection result, so that the telescopic module drives the scrubbing brush to move along the rotation axis to adjust the force between the scrubbing brush and the wafer. The force between the scrubbing brush and the wafer can be adjusted in real time according to the detection results fed back by the pressure sensor. When the force between the scrubbing brush and the wafer is greater than the target force, the force between the scrubbing brush and the wafer can be reduced. When the force between the scrubbing brush and the wafer is less than the target force, the force between the scrubbing brush and the wafer can be increased so that the force between the scrubbing brush and the wafer is maintained at the target force, thereby maintaining the pressure applied by the scrubbing brush head to the wafer surface constant. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0019] Figure 1 This is a schematic diagram of the internal structure of a wafer scrubbing system provided in an optional embodiment of the present application;

[0020] Figure 2This is a cross-sectional schematic diagram of a partial structure of a wafer scrubbing device provided in an optional embodiment of the present application;

[0021] Figure 3 is a cross-sectional schematic diagram of a partial structure of another wafer scrubbing device provided in an optional embodiment of the present application;

[0022] Figure 4 This is a partial structural diagram of a wafer scrubbing device provided in an optional embodiment of the present application;

[0023] Figure 5 yes Figure 4 A schematic diagram of a portion of the structure of the wafer scrubbing equipment from another angle;

[0024] Figure 6 yes Figure 4 Another angle diagram of part of the structure of the wafer scrubbing equipment.

[0025] Reference numerals:

[0026] 01. Wafer scrubbing system; 11. Chuck; 12. Retaining ring; 13. Chuck shaft; 14. First rotating device; 15. First lifting device; 16. Housing; 100. Wafer scrubbing equipment; 110. Scrubbing brush; 111. Brush head; 112. First rotating shaft; 1121. Rotation axis; 1122. Spherical cap structure; 1123. Clamping surface; 1131. Rotating shaft seat; 1132. Limit bearing; 1133. Second rotating shaft; 1134. First transmission wheel; 1135. Second transmission wheel; 1136. Transition piece; 114. Guide sleeve; 120. Swing arm; 121. Swing arm lifting shaft; 122. Second rotating device; 123. Second lifting device; 124. Mounting plate; 130. Motor; 131. Output shaft of motor; 140. Telescopic module; 150. Pressure sensor; 160. Magnetic module; 170. Housing; 171. Mounting through hole; 172. Connecting block; 173. First protective cover; 174. Second protective cover; 181. Fixing plate; 182. Telescopic module connecting plate; 183. Limiting block; 184. Rotating bearing; 185. Locking nut; 186. Bearing fixing seat; 187. Limiting plate. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field should fall within the scope of protection of the embodiments of the present application.

[0028] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0029] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0030] According to a first aspect of an embodiment of the present application, a wafer scrubbing device for wafer scrubbing is provided to at least partially solve the above-mentioned problem. The wafer scrubbing device can be applied to Figure 1 The wafer scrubbing system shown in FIG. Figure 1 As shown, the wafer scrubbing system 01 may include a chuck 11, a retaining ring 12, a chuck shaft 13, a first rotating device 14, a first lifting device 15, a box 16 and a wafer scrubbing device 100. The chuck 11 is used to fix the wafer, and can be a vacuum chuck 11 that uses vacuum to adsorb the wafer. The retaining ring 12 is sleeved on the outside of the chuck 11, and is used to prevent the wafer on the chuck 11 from detaching from the chuck 11. The chuck shaft 13 is connected to the chuck 11 and the retaining ring 12, and is used to drive the chuck 11 and the retaining ring 12 to rotate. The first rotating device 14 and the first lifting device 15 are respectively connected to the chuck shaft 13, and the first rotating device 14 is used to drive the chuck shaft 13 to rotate, for example, around Figure 1 The first rotating device 14 can be a servo motor or other suitable equipment, and the first lifting device 15 is used to drive the chuck shaft 13 to move up and down, for example, along Figure 1 The first lifting device 15 can be a motor such as a voice coil motor or other suitable equipment. The box 16 can be used to accommodate the chuck 11, the retaining ring 12, the chuck shaft 13, the first rotating device 14, the first lifting device 15 and other components.

[0031] like Figure 1 and Figure 2As shown, the wafer scrubbing device 100 may include a scrubbing brush 110, a swing arm 120, a swing arm lifting shaft 121, a second rotating device 122, a second lifting device 123, etc. The scrubbing brush 110 is used to scrub the wafer fixed on the chuck 11, and the scrubbing brush 110 can be installed at one end of the swing arm 120. The other end of the swing arm 120 can be provided with Figure 2 The mounting plate 124 is connected to the swing arm lifting shaft 121 through the mounting plate 124. The swing arm lifting shaft 121 is used to drive the swing arm 120 to swing around it and to drive the swing arm 120 to lift. The second rotating device 122 and the second lifting device 123 are respectively connected to the swing arm lifting shaft 121. The second rotating device 122 is used to drive the swing arm lifting shaft 121 to rotate, for example, around Figure 1 The second rotating device 122 can also be a servo motor or other suitable equipment. The second lifting device 123 is used to drive the swing arm lifting shaft 121 to move up and down, for example, Figure 1 The second lifting device 123 can also be a motor such as a voice coil motor or other suitable equipment for lifting in the middle L2 direction.

[0032] Please refer to the attached Figure 2-6 The wafer scrubbing device 100 for wafer scrubbing provided in an embodiment of the present application is described in detail.

[0033] like Figure 2 and Figure 3 As shown, an embodiment of the present application provides a wafer scrubbing device 100 for wafer scrubbing, including: a motor 130, a telescopic module 140, a pressure sensor 150, a scrubbing brush 110 and a controller.

[0034] The motor 130 and telescopic module 140 are each connected to the scrubbing brush 110. The controller is electrically connected to the telescopic module 140 and the pressure sensor 150, respectively. It should be understood that the connection (or connection) in the embodiments of this application can be direct or indirect, and is within the scope of the embodiments of this application. The motor 130, telescopic module 140, pressure sensor 150, scrubbing brush 110, and controller can all be mounted on the swing arm 120.

[0035] The motor 130 is used to drive the scrubbing brush 110 to rotate so that the scrubbing brush 110 scrubs the wafer; the pressure sensor 150 is used to detect the force between the scrubbing brush 110 and the telescopic module 140 and transmit the detection result to the controller; the controller is used to control the telescopic module 140 to perform a telescopic action based on the detection result, so that the telescopic module 140 drives the scrubbing brush 110 to move along the rotation axis 1121 to adjust the force between the scrubbing brush 110 and the wafer. It should be understood that the rotation axis 1121 in the embodiment of the present application refers to the straight line on which the rotation axis of the scrubbing brush 110 rotates, that is, Figure 3The axis indicated by 1121.

[0036] By driving the scrubbing brush 110 to rotate and move along the rotation axis 1121 respectively through the motor 130 and the telescopic module 140, the complex movement of the scrubbing brush 110 can be decomposed into two simple movements of rotation and movement along the rotation axis 1121, so that the rotation and movement along the rotation axis 1121 of the scrubbing brush 110 can be controlled respectively, thereby reducing the difficulty of controlling the movement of the scrubbing brush 110 along the rotation axis 1121, that is, reducing the difficulty of adjusting the force between the scrubbing brush 110 and the wafer, which can help to keep the force applied by the brush head 111 to the wafer surface constant.

[0037] As a feasible implementation, the telescopic module 140 may include a mechanical or hydraulic telescopic device.

[0038] For example, in some optional embodiments, the telescopic module 140 may include a voice coil motor, such as a servo-controlled voice coil motor, etc., which can be used to drive the scrubbing brush 110 to move along the direction of the rotation axis.

[0039] A voice coil motor is a direct drive motor that has the characteristics of simple structure, small size, high speed, high acceleration and fast response. The embodiment of the present application can use a voice coil motor that performs driving action along a straight line when driving.

[0040] In the embodiment of the present application, the telescopic module 140 may include a voice coil motor, so that the scrubbing brush 110 can be directly driven in a straight line by the voice coil motor, so that the scrubbing brush 110 moves along the direction of the rotation axis. There is no need to set up a conversion structure for converting the driving direction, which is conducive to simplifying the structure of the telescopic module 140 and reducing the space occupied by the telescopic module 140.

[0041] The scrubbing brush 110 can abut against the wafer fixed on the chuck 11 through the top of the brush head 111 so as to scrub the surface of the wafer by driving the brush head 111 to rotate.

[0042] It should be understood that the force acting between the scrubbing brush 110 and the telescopic module 140 is the pressure applied by the scrubbing brush 110 to the telescopic module 140, or the pressure applied by the telescopic module 140 to the scrubbing brush 110. These two forces constitute a pair of equal interacting forces. Furthermore, the pressure applied by the scrubbing brush 110 to the telescopic module 140 is derived from the reaction force exerted by the wafer on the scrubbing brush 110 when the scrubbing brush 110 applies pressure to the wafer. Therefore, the force acting between the scrubbing brush 110 and the telescopic module 140 is equal in magnitude to the pressure applied by the scrubbing brush 110 to the wafer.

[0043] The detection results transmitted to the controller by the pressure sensor 150 may include the detected force between the scrubbing brush 110 and the telescopic module 140. After receiving the detected force, the controller may compare the detected force with a preset target force. When the detected force is greater than the target force, the telescopic module 140 may be controlled to retract, thereby driving the scrubbing brush 110 to move along the rotation axis 1121 away from the wafer to reduce the force between the scrubbing brush 110 and the telescopic module 140. When the detected force is less than the target force, the telescopic module 140 may be controlled to extend, thereby driving the scrubbing brush 110 to move along the rotation axis 1121 toward the wafer to increase the force between the scrubbing brush 110 and the telescopic module 140. This continues until the detected force equals the target force, so that the pressure applied by the scrubbing brush 110 on the wafer can equal the target force. It should be understood that the preset target force is the constant force that needs to be maintained between the scrubbing brush 110 and the telescopic module 140. The target force can be a single force or a force range, both of which are within the protection scope of the embodiments of the present application.

[0044] The wafer scrubbing apparatus 100 provided in an embodiment of the present application includes a motor 130, a telescopic module 140, a pressure sensor 150, a scrubbing brush 110, and a controller. The motor 130 and the telescopic module 140 are respectively connected to the scrubbing brush 110, and the controller is respectively electrically connected to the telescopic module 140 and the pressure sensor 150. The motor 130 can drive the scrubbing brush 110 to rotate so that the scrubbing brush 110 scrubs the wafer. The pressure sensor 150 can detect the force between the scrubbing brush 110 and the telescopic module 140 and transmit the detection result to the controller. The controller can control the telescopic module 140 to perform a telescopic action based on the detection result, so that the telescopic module 140 drives the scrubbing brush 110 to move along the rotation axis 1121 to adjust the force between the scrubbing brush 110 and the wafer. The force between the scrubbing brush 110 and the wafer can be adjusted in real time according to the detection results fed back by the pressure sensor 150. When the force between the scrubbing brush 110 and the wafer is greater than the target force, the force between the scrubbing brush 110 and the wafer can be reduced. When the force between the scrubbing brush 110 and the wafer is less than the target force, the force between the scrubbing brush 110 and the wafer can be increased so that the force between the scrubbing brush 110 and the wafer is maintained at the target force, thereby maintaining the pressure applied by the brush head 111 of the scrubbing brush 110 to the wafer surface constant.

[0045] like Figure 3As shown, in some optional embodiments, the scrubbing brush 110 includes a brush head 111 and a first rotating shaft 112, wherein the brush head 111 is connected to the first end of the first rotating shaft 112; the telescopic module 140 is connected to the second end of the first rotating shaft 112; the motor 130 is connected to the first rotating shaft 112 via a transmission assembly; the transmission assembly includes a rotating shaft seat 1131 sleeved outside the first rotating shaft 112, and the motor 130 is connected to the rotating shaft seat 1131. It should be noted that the "connection" described in the embodiments of the present application can be a direct connection or an indirect connection, and the embodiments of the present application do not limit the specific implementation method of the "connection".

[0046] The shaft seat 1131 and the first shaft 112 can be movably connected, allowing the first shaft 112 to move axially along the rotation axis 1121 within the shaft seat 1131. Furthermore, by sleeved over the exterior of the first shaft 112, the shaft seat 1131 can guide the movement of the first shaft 112 along the rotation axis 1121 and, to a certain extent, restrict movement of the first shaft 112 away from the rotation axis 1121, thereby ensuring stable rotation of the first shaft 112. Furthermore, the shaft seat 1131 is provided with a snap-fit ​​structure that engages with the first shaft 112. When the shaft seat 1131 rotates about the rotation axis 1121 driven by the transmission assembly, the shaft seat 1131 drives the first shaft 112 to rotate about the rotation axis 1121 via the snap-fit ​​structure.

[0047] The first rotating shaft 112 may be provided with a mating structure that is engaged with the snap-fit ​​structure of the rotating shaft seat 1131. The snap-fit ​​structure and the mating structure may be two concave and convex structures respectively, or other suitable structures, as long as the snap-fit ​​can be achieved and the first rotating shaft 112 can be allowed to move along the rotation axis 1121.

[0048] In this embodiment of the present application, the scrubbing brush 110 includes a brush head 111 and a first rotating shaft 112. The brush head 111 is connected to the first end of the first rotating shaft 112; the telescopic module 140 is connected to the second end of the first rotating shaft 112. The motor 130 is connected to the first rotating shaft 112 via a transmission assembly. The transmission assembly includes a rotating shaft seat 1131 that is sleeved around the first rotating shaft 112. The motor 130 is connected to the rotating shaft seat 1131. The rotating shaft seat 1131 is movably connected to the first rotating shaft 112, allowing the first rotating shaft 112 to move axially within the rotating shaft seat 1131 along the rotation axis 1121. The shaft seat 1131 is provided with a clamping structure that is clamped with the first shaft 112. When the shaft seat 1131 rotates around the rotation axis 1121 driven by the transmission assembly, the shaft seat 1131 drives the first shaft 112 to rotate around the rotation axis 1121 through the clamping structure, so that the first shaft 112 drives the brush head 111 to rotate. Moreover, because the first shaft 112 can move axially along the rotation axis 1121 within the shaft seat 1131, the controller can control the telescopic module 140 to drive the first shaft 112 to move axially along the rotation axis 1121, so that the first shaft 112 can contact the brush head 111 against the surface of the wafer. That is, the embodiment of the present application can control the movement of the brush head 111 along the rotation axis 1121 while driving the brush head 111 to rotate around the rotation axis 1121, so as to adjust the force applied by the brush head 111 to the wafer during the process of the brush head 111 scrubbing the wafer surface.

[0049] like Figure 2 As shown, in some optional embodiments, the telescopic module 140, the pressure sensor 150, and the scrubbing brush 110 are located on a rotation axis 1121. The output shaft 131 of the motor 130 is parallel to the rotation axis 1121 of the scrubbing brush 110, and the orthographic projection of the motor 130 on the rotation axis 1121 is located in the region on the rotation axis 1121 where one or more of the telescopic module 140, the pressure sensor 150, and the scrubbing brush 110 are located.

[0050] In the embodiment of the present application, the telescopic module 140 , the pressure sensor 150 and the scrubbing brush 110 are located on the rotation axis 1121 , which makes it easy for the pressure sensor 150 to detect the force between the telescopic module 140 and the scrubbing brush 110 . By setting the output shaft 131 of the motor 130 parallel to the rotation axis 1121 of the scrubbing brush 110, the motor 130 can be offset relative to the telescopic module 140, the pressure sensor 150 and the scrubbing brush 110, that is, set to the side of the telescopic module 140, the pressure sensor 150 and the scrubbing brush 110, and by setting the positive projection of the motor 130 on the rotation axis 1121 to be located in the area on the rotation axis 1121 where one or more of the telescopic module 140, the pressure sensor 150 and the scrubbing brush 110 are located, the position of the motor 130 in the direction of the rotation axis 1121 can be made not to exceed the range of the telescopic module 140, the pressure sensor 150 and the scrubbing brush 110, thereby avoiding the increase in the size of the wafer scrubbing equipment 100 in the direction of the rotation axis 1121 due to the motor 130, which is conducive to the miniaturization of the wafer scrubbing equipment 100.

[0051] As a feasible implementation method, the clamping structure includes the following Figure 4 The limiting bearing 1132 is shown. The limiting bearing 1132 is mounted on the rotating shaft seat 1131 via the second rotating shaft 1133, and the axis of the second rotating shaft 1133 can be set perpendicular to the rotation axis 1121. The limiting bearing 1132 includes an inner wheel surface in contact with the second rotating shaft 1133 and an outer wheel surface opposite to the inner wheel surface; the first rotating shaft 112 is provided with a clamping surface 1123 for contacting the outer wheel surface. The clamping surface 1123 serves as a matching structure for the limiting bearing 1132, and the limiting bearing 1132 can be clamped with the clamping surface 1123 of the first rotating shaft 112 through the outer wheel surface.

[0052] The number of the limiting bearings 1132 can be one or more. Matching the shape of the outer wheel surface can be understood as possible. The outer wheel surface of the limiting bearing 1132 can be a cylindrical surface, and the engaging surface 1123 of the first rotating shaft 112 can be a flat surface. Alternatively, the outer wheel surface of the limiting bearing 1132 and the engaging surface 1123 of the first rotating shaft 112 can be a convex surface and a concave surface respectively, as long as the limiting bearing 1132 can be engaged with the first rotating shaft 112 and the first rotating shaft 112 can be allowed to move along the rotation axis 1121.

[0053] In the embodiment of the present application, the clamping structure may include a limiting bearing 1132 , which is installed on the shaft seat 1131 through the second shaft 1133 , and the axis of the second shaft 1133 is perpendicular to the rotation axis 1121 . The limiting bearing 1132 includes an inner wheel surface in contact with the second rotating shaft 1133 and an outer wheel surface opposite to the inner wheel surface; a clamping surface 1123 for abutting against the outer wheel surface is provided on the first rotating shaft 112; the limiting bearing 1132 is clamped with the clamping surface 1123 of the first rotating shaft 112 through the outer wheel surface. Since the outer wheel surface of the limiting bearing 1132 can rotate around the second rotating shaft 1133, when the first rotating shaft 112 moves along the rotation axis 1121, the friction between the clamping surface 1123 of the first rotating shaft 112 and the limiting bearing 1132 can be reduced through the rotation of the outer wheel surface of the limiting bearing 1132, thereby improving the efficiency of the first rotating shaft 112 moving along the rotation axis 1121.

[0054] like Figure 4 As shown, in some optional embodiments, the clamping structure includes four limit bearings 1132 evenly arranged around the first rotating shaft 112, and four clamping surfaces 1123 can be provided on the first rotating shaft 112, and the clamping surfaces 1123 correspond one-to-one to the limit bearings 1132.

[0055] In an embodiment of the present application, the clamping structure includes four limit bearings 1132 evenly arranged around the first rotating shaft 112, and the four clamping surfaces 1123 of the first rotating shaft 112. When the clamping structure and the first rotating shaft 112 are clamped and force is transmitted, the force between the clamping structure and the first rotating shaft 112 can be evenly dispersed on the four limit bearings 1132 and the four clamping surfaces 1123, which can effectively prevent the limit bearings 1132 or the clamping surfaces 1123 from being damaged due to stress concentration.

[0056] like Figure 3 As shown, in some optional embodiments, the wafer scrubbing equipment 100 further includes a guide sleeve 114, which is disposed in the shaft seat 1131, and the first shaft 112 is disposed in the guide sleeve 114; the guide sleeve 114 is used to guide the first shaft 112 to move axially.

[0057] When the first rotating shaft 112 moves along the rotation axis 1121, there can be relative sliding between the first rotating shaft 112 and the guide sleeve 114, and the contact surface between the guide sleeve 114 and the first rotating shaft 112 can be made as smooth as possible, thereby reducing the friction resistance encountered by the first rotating shaft 112 when moving along the rotation axis 1121.

[0058] In the embodiment of the present application, the first rotating shaft 112 can be guided to move along its axial direction by the guide sleeve 114, so that the first rotating shaft 112 can move along the rotation axis 1121 under the drive of the telescopic module 140, so as to adjust the force between the brush head 111 of the scrubbing brush 110 and the wafer under the drive of the first rotating shaft 112.

[0059] like Figure 2 and Figure 3 As shown, in some optional embodiments, the transmission assembly includes a first transmission wheel 1134, a second transmission wheel 1135 and a transition piece 1136; the first transmission wheel 1134 is sleeved outside the rotating shaft seat 1131, and the second transmission wheel 1135 is connected to the output shaft 131 of the motor 130; and the first transmission wheel 1134 and the second transmission wheel 1135 are connected via the transition piece 1136.

[0060] The first transmission wheel 1134 and the second transmission wheel 1135 can be transmission components such as gears or pulleys. The transition member 1136 can be a transmission belt or a transition gear that meshes with the first transmission wheel 1134 and the second transmission wheel 1135, respectively. For example, when the transition member 1136 is a transmission belt and the first transmission wheel 1134 and the second transmission wheel 1135 are gears, the transmission belt can be a chain that meshes with the teeth of the first transmission wheel 1134 and the second transmission wheel 1135, or it can be a toothed belt with teeth that mesh with the teeth of the first transmission wheel 1134 and the second transmission wheel 1135. When the transition member 1136 is a transmission belt and the first transmission wheel 1134 and the second transmission wheel 1135 are pulleys, the transmission belt can mesh with the first transmission wheel 1134 and the second transmission wheel 1135 through friction. Of course, the specific form of the first transmission wheel 1134, the second transmission wheel 1135, and the transition member 1136 is not limited in this embodiment of the present application, as long as they can cooperate with each other to transmit force.

[0061] In the embodiment of the present application, the transmission assembly may include a first transmission wheel 1134, a second transmission wheel 1135, and a transition piece 1136. The first transmission wheel 1134 is sleeved outside the rotating shaft seat 1131, and the second transmission wheel 1135 is connected to the output shaft 131 of the motor 130. Furthermore, the first transmission wheel 1134 and the second transmission wheel 1135 are connected via the transition piece 1136. The output shaft 131 of the motor 130 can output power through the second transmission wheel 1135, and the power is transmitted to the rotating shaft seat 1131 through the transition piece 1136 and the first transmission wheel 1134. The rotating shaft seat 1131 then drives the first rotating shaft 112 and the brush head 111 to rotate. Moreover, the motor 130 can transmit power to the rotating shaft seat 1131 indirectly through the transition piece 1136, the first transmission wheel 1134 and the second transmission wheel 1135, that is, the motor 130 does not have to directly contact the rotating shaft seat 1131, thereby reducing the restrictions on the arrangement position of the motor 130 and making the arrangement of the motor 130 more flexible.

[0062] like Figure 3 As shown, in some optional embodiments, a magnetic module 160 is provided between the telescopic module 140 and the first rotating shaft 112, and the telescopic module 140 is magnetically connected to the second end of the first rotating shaft 112 through the magnetic module 160; wherein, the magnetic module 160 is used to adsorb the second end of the first rotating shaft 112 through magnetic force.

[0063] The magnetic attraction module 160 may include a magnet or other magnetic material. A movable connection may be formed between the magnetic attraction module 160 and the first rotating shaft 112 based on magnetic attraction. When the motor 130 drives the scrubbing brush 110 to rotate, the first rotating shaft 112 may rotate relative to the magnetic attraction module 160. It should be understood that magnetic attraction refers to the attraction of magnetic materials by magnetic force.

[0064] The material of the first rotating shaft 112 may include magnetic material, such as an iron-containing alloy, so that the magnetic module 160 can adsorb the second end of the first rotating shaft 112 through magnetic force, so that when the telescopic module 140 drives the magnetic module 160 to move along the above-mentioned rotation axis 1121, the scrubbing brush 110 can be driven to move along the rotation axis 1121 through the magnetic module 160.

[0065] In the embodiment of the present application, a magnetic module 160 may be provided between the telescopic module 140 and the first rotating shaft 112. The telescopic module 140 is connected to the second end of the first rotating shaft 112 via the magnetic module 160. The magnetic module 160 is configured to attract the second end of the first rotating shaft 112 via magnetic force. The magnetic attraction of the magnetic module 160 forms a movable connection between the magnetic module 160 and the first rotating shaft 112, allowing the first rotating shaft 112 to rotate relative to the magnetic module 160. This eliminates the need for a complex mechanical structure, thereby simplifying the structural composition of the wafer scrubbing apparatus 100 and reducing the cost of the wafer scrubbing apparatus 100. The magnetic module 160 can transmit force when the telescopic module 140 is extended to push the first rotating shaft 112. When the telescopic module 140 is retracted to pull the first rotating shaft 112, the magnetic attraction force can be used to pull up the first rotating shaft 112. The magnetic module 160 can form a relatively flexible magnetic connection with the first rotating shaft 112. During the circumferential rotation of the first rotating shaft 112, the magnetic module 160 and the pressure sensor 150 can remain stationary, thereby facilitating pressure monitoring while maintaining the magnetic connection and avoiding layout difficulties such as entanglement of the wiring of the pressure sensor 150.

[0066] In some optional embodiments, the magnetic module 160 contacts the second end of the first rotating shaft 112 , and the contact between the magnetic module 160 and the second end of the first rotating shaft 112 is point contact.

[0067] Under the magnetic attraction of the magnetic module 160, the second end of the first rotating shaft 112 can contact the magnetic module 160. Figure 4-6 As shown, the second end of the first rotating shaft 112 can be provided with a structure protruding from the second end of the first rotating shaft 112 toward the magnetic module 160, so that the second end of the first rotating shaft 112 can contact the magnetic module 160 in a point contact manner through this structure. It should be understood that the above-mentioned point contact means that the contact portion between the magnetic module 160 and the second end of the first rotating shaft 112 is a single point.

[0068] In an embodiment of the present application, the magnetic module 160 contacts the second end of the first rotating shaft 112, and the contact form between the magnetic module 160 and the second end of the first rotating shaft 112 is point contact, which can reduce the contact area between the first rotating shaft 112 and the magnetic module 160 through point contact, thereby reducing the friction resistance encountered by the first rotating shaft 112 during rotation. Moreover, since the point contact does not limit the relative rotation between the first rotating shaft 112 and the magnetic module 160, the point contact can allow the second end of the first rotating shaft 112 to swing to a certain extent relative to the magnetic module 160, so that the first rotating shaft 112 has a greater degree of freedom.

[0069] like Figure 4-6As shown, in some optional embodiments, the second end of the first rotating shaft 112 is provided with a spherical cap structure 1122, which can be used to contact the magnetic module 160. The spherical cap structure 1122 protrudes from the second end of the first rotating shaft 112 toward the magnetic module 160, and the spherical cap structure 1122 can achieve point contact between the second end of the first rotating shaft 112 and the magnetic module 160. It should be understood that the portion of the spherical surface intercepted by the plane is the spherical cap, and the circle intercepted by the plane is the base of the spherical cap. In this embodiment, the base of the spherical cap structure 1122 is connected to the body of the first rotating shaft 112.

[0070] In the embodiment of the present application, a spherical cap structure 1122 is provided at the second end of the first rotating shaft 112 , and the spherical cap structure 1122 is used to contact the magnetic module 160 , so that point contact can be formed with the magnetic module 160 through any point on the spherical cap structure 1122 .

[0071] like Figure 3 As shown, in some optional embodiments, the pressure sensor 150 is located between the telescopic module 140 and the magnetic module 160. When the telescopic module 140 applies a force to the first rotating shaft 112, or when the first rotating shaft 112 applies a force to the telescopic module 140, two adjacent ones of the telescopic module 140, the pressure sensor 150, the magnetic module 160, and the first rotating shaft 112 may offset each other to transmit force.

[0072] The telescopic module 140 can be connected to the first rotating shaft 112 via a pressure sensor 150 and a magnetic module 160. The force acting between the scrubbing brush 110 and the telescopic module 140 is equal to the force acting on the pressure sensor 150 from the first rotating shaft 112 via the magnetic module 160, or the force acting between the pressure sensor 150 and the telescopic module 140. Therefore, by placing the pressure sensor 150 between the telescopic module 140 and the magnetic module 160, the force acting between the scrubbing brush 110 and the telescopic module 140 can be detected by the pressure sensor 150. Of course, the pressure sensor 150 can also be placed in other locations, such as at an end of the telescopic module 140 away from the first rotating shaft 112, and all of these are within the scope of protection of the embodiments of the present application.

[0073] In an embodiment of the present application, by arranging the pressure sensor 150 between the telescopic module 140 and the magnetic module 160, the pressure sensor 150 can be arranged on the force transmission path between the scrubbing brush 110 and the telescopic module 140, so as to accurately detect the force between the scrubbing brush 110 and the telescopic module 140.

[0074] like Figure 3As shown, in some optional embodiments, the wafer scrubbing apparatus 100 may further include a stopper 183 located between the telescopic module 140 and the first rotating shaft 112. The stopper 183 includes an accommodation space, and a through hole is provided on a side of the stopper 183 near the first rotating shaft 112, connecting the accommodation space with the exterior of the stopper 183. The accommodation space is used to accommodate the pressure sensor 150, and the through hole is used to accommodate the magnetic module 160, and the magnetic module 160 can move along the rotation axis 1121 within the through hole.

[0075] It should be understood that in order to prevent the magnetic module 160 from falling off from the through hole, the maximum distance between the second end of the first rotating shaft 112 and the limit block 183 along the direction of the rotation axis 1121 should be smaller than the size of the magnetic module 160 along the direction of the rotation axis 1121.

[0076] In the embodiment of the present application, the stop block 183 can accommodate the pressure sensor 150 and the magnetic module 160. By disposing the stop block 183 between the telescopic module 140 and the first rotating shaft 112, the pressure sensor 150 and the magnetic module 160 can be disposed between the telescopic module 140 and the first rotating shaft 112, thereby facilitating the installation of the pressure sensor 150 and the magnetic module 160. Furthermore, the magnetic module 160 can move along the rotation axis 1121 within the through hole, which can reduce restrictions on the installation of the magnetic module 160 to a certain extent, making the installation of the magnetic module 160 more flexible.

[0077] like Figure 2 and Figure 3 As shown, in some optional embodiments, the wafer scrubbing equipment 100 also includes a shell 170, the first rotating shaft 112 is at least partially located in the shell 170, and the brush head 111 is located outside the shell 170; the shell 170 includes a mounting through hole 171, and the first end of the first rotating shaft 112 is connected to the brush head 111 through a connecting block 172 located in the mounting through hole 171; a first protective cover 173 is provided between the brush head 111 and the connecting block 172 to cover the mounting through hole 171, and a second protective cover 174 is provided on the shell 170 to be sleeved on the first protective cover 173 and the outside of the brush head 111.

[0078] The brush head 111 and the first protective cover 173 can be mounted on the connecting block 172, thereby providing a stable mounting position for the brush head 111 and the first protective cover 173 through the connecting block 172, thereby ensuring the normal use of the brush head 111 and the first protective cover 173. By covering the first protective cover 173 of the mounting hole 171, it is possible to prevent impurities or dirt on the surface of the wafer from entering the mounting hole 171 and entering the interior of the housing 170 of the wafer scrubbing device 100 through the mounting hole 171 when scrubbing the wafer. By sleeved on the first protective cover 173 and the outside of the brush head 111, it is possible to block the cleaning liquid or impurities, dirt, etc. on the surface of the wafer from entering the mounting hole 171 to a greater extent, thereby preventing impurities or dirt on the surface of the wafer from adversely affecting the parts inside the housing of the wafer scrubbing device 100.

[0079] In an embodiment of the present application, the wafer scrubbing equipment 100 may further include components such as a fixing plate 181 , a telescopic module connecting plate 182 , a rotating bearing 184 , a locking nut 185 , a bearing fixing seat 186 , and a limiting plate 187 .

[0080] like Figure 3-Figure 6 As shown, a fixing plate 181 is provided between the end of the telescopic module 140 away from the pressure sensor 150 and the housing 170 of the wafer scrubbing apparatus 100. The fixing plate 181 can fix the position of the telescopic module 140. The end of the telescopic module 140 close to the pressure sensor 150 is connected to a telescopic module connecting plate 182. The pressure sensor 150 is mounted on the telescopic module connecting plate 182. A limit block 183 for accommodating the pressure sensor 150 can be installed on the telescopic module connecting plate 182 to limit the movement of the pressure sensor 150. The rotating bearing 184 can be mounted outside the rotating shaft seat 1131. The rotating shaft seat 1131 can be fixed by a locking nut 185, thereby connecting the rotating shaft seat 1131 to the inner ring of the rotating bearing 184. When the rotating shaft seat 1131 rotates, the inner ring of the rotating bearing 184 drives the rotating bearing 184 to rotate relative to the outer ring of the rotating bearing 184. This can reduce the resistance to the rotation of the rotating shaft seat 1131 while enabling the rotating bearing 184 to be installed. The bearing fixing seat 186 is provided with a mounting position, in which the rotating bearing 184 can be installed. The displacement of the bearing can be limited by a limit plate 187, thereby preventing the rotating bearing 184 from leaving the mounting position. The bearing fixing seat 186 can be connected to the housing 170 of the wafer scrubbing apparatus 100, so that the bearing can be fixed in the wafer scrubbing apparatus 100 by the bearing fixing seat 186 and the limit plate 187.

[0081] like Figure 1 As shown, according to the second aspect of the embodiment of the present application, a wafer scrubbing system 01 is also provided, including the wafer scrubbing equipment 100 in any embodiment of the first aspect of the present application.

[0082] It should be understood that the wafer scrubbing system 01 of this embodiment and the embodiment of the aforementioned wafer scrubbing equipment 100 are based on the same inventive concept, and their specific implementation methods and beneficial effects can refer to the above embodiments and will not be repeated here.

[0083] According to the third aspect of the embodiment of the present application, a polishing device is also provided, including the wafer scrubbing system 01 in the embodiment of the second aspect of the present application.

[0084] The polishing equipment of the embodiment of the present application may further include a polishing module, which performs chemical mechanical polishing on the wafer. It should be understood that chemical mechanical polishing (CMP), also known as chemical mechanical planarization (CMP), is an ultra-precision surface processing technology for global flattening. It can achieve chemical mechanical polishing of the wafer through the combined action of chemical and mechanical processes.

[0085] Specifically, the polishing module may include a carrier head, a polishing plate, a liquid supply device, a dresser, and a polishing pad. The carrier head loads the wafer to be polished and places it against the polishing pad above the polishing plate to polish the wafer using the polishing pad. The liquid supply device supplies polishing liquid between the polishing pad and the wafer. The dresser is used to dress the surface of the polishing pad. The polishing pad is placed on the polishing plate, and the carrier head and dresser can be located on either side of the polishing pad. This allows the carrier head to polish the wafer using the polishing pad while the dresser's dressing disc can simultaneously dress the polishing pad. Once the wafer is polished, the wafer surface can be scrubbed using the aforementioned wafer scrubbing equipment.

[0086] According to a fourth aspect of the embodiments of the present application, there is also provided a method for cleaning a wafer using the wafer scrubbing apparatus of the aforementioned aspect, the wafer cleaning method comprising:

[0087] S1: Positioning a wafer at the wafer scrubbing device 100 , specifically, loading the wafer onto the chuck 11 below the scrubbing brush 110 ;

[0088] S2: The scrubbing brush 110 is pressed against the surface of the wafer. Specifically, the telescopic module 140 may be used to perform a telescopic action, thereby moving the scrubbing brush 110 toward the upper surface of the wafer.

[0089] S3 : driving the scrubbing brush to rotate to scrub the wafer, for example, by the motor 130 .

[0090] In a further embodiment, the wafer cleaning method further comprises:

[0091] S4: Detecting the force between the scrubbing brush 110 and the telescopic module 140 through a pressure sensor;

[0092] S5: Control the telescopic module 140 to perform a telescopic action according to the force between the scrubbing brush 110 and the telescopic module 140, so that the telescopic module 140 drives the scrubbing brush 110 to move toward or away from the wafer along the rotation axis to adjust the force between the scrubbing brush 110 and the wafer.

[0093] It should be understood that the wafer cleaning method of the present application is not limited to the above-mentioned execution order. The order of the above-mentioned steps can be appropriately adjusted according to the actual working conditions. For example, steps S4 and S5 can be executed before step S3 to pre-adjust the force between the scrubbing brush 110 and the wafer. In addition, steps S4 and S5 can be executed in real time during the execution of step S3 to adjust the force between the scrubbing brush 110 and the wafer in real time.

[0094] It should be understood that the polishing equipment of this embodiment and the embodiment of the aforementioned wafer scrubbing equipment are based on the same inventive concept, and their specific implementation methods and beneficial effects can be referred to the above embodiments, which will not be repeated here.

[0095] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of the present application.

[0096] Those skilled in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of this application.

[0097] The above implementation methods are only used to illustrate the embodiments of the present application, and are not intended to limit the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of the present application, and the scope of patent protection of the embodiments of the present application should be defined by the claims.

Claims

1. A wafer scrubbing device, characterized in that: include: Motor, telescopic module, pressure sensor, scrubbing brush and controller; The motor and the telescopic module are respectively connected to the scrubbing brush; the controller is electrically connected to the telescopic module and the pressure sensor; The motor is used to drive the scrubbing brush to rotate so that the scrubbing brush scrubs the wafer; the pressure sensor is used to detect the force between the scrubbing brush and the telescopic module, and transmit the detection result to the controller; the controller is used to control the telescopic module to perform a telescopic action according to the detection result, so that the telescopic module drives the scrubbing brush to move along the direction of the rotation axis to adjust the force between the scrubbing brush and the wafer; The scrubbing brush comprises a brush head and a first rotating shaft, wherein a first end and a second end of the first rotating shaft are respectively connected to the brush head and the telescopic module; the motor is connected to the first rotating shaft via a transmission assembly, wherein the transmission assembly comprises a rotating shaft seat sleeved outside the first rotating shaft, wherein a clamping structure clamped with the first rotating shaft is arranged on the rotating shaft seat, wherein the clamping structure comprises a limit bearing, wherein the limit bearing is mounted on the rotating shaft seat via a second rotating shaft, wherein the axis of the second rotating shaft is perpendicular to the rotation axis; The limit bearing includes an inner wheel surface in contact with the second rotating shaft and an outer wheel surface opposite to the inner wheel surface; the first rotating shaft is provided with a clamping surface for abutting against the outer wheel surface; the limit bearing is clamped with the clamping surface of the first rotating shaft through the outer wheel surface.

2. The wafer scrubbing equipment according to claim 1, characterized in that: The motor is connected to the rotating shaft seat; The shaft seat and the first shaft are movably connected, and the first shaft can move axially along the rotation axis in the shaft seat; when the shaft seat rotates around the rotation axis driven by the transmission assembly, the shaft seat drives the first shaft to rotate around the rotation axis through the clamping structure.

3. The wafer scrubbing equipment according to claim 1, characterized in that: The clamping structure includes four limit bearings evenly arranged around the first rotating shaft. The first rotating shaft is provided with four clamping surfaces, and the clamping surfaces correspond to the limit bearings one by one.

4. The wafer scrubbing equipment according to claim 1, characterized in that: The device further comprises a guide sleeve, wherein the guide sleeve is arranged in the rotating shaft seat, the first rotating shaft is arranged in the guide sleeve, and the guide sleeve is used for guiding the first rotating shaft to move axially.

5. The wafer scrubbing device according to any one of claims 1 to 4, characterized in that: The telescopic module, the pressure sensor and the scrubbing brush are located on the rotation axis; the output shaft of the motor is parallel to the rotation axis of the scrubbing brush; and the orthographic projection of the motor on the rotation axis is located in the area on the rotation axis where one or more of the telescopic module, the pressure sensor and the scrubbing brush are located.

6. The wafer scrubbing device according to any one of claims 1 to 4, characterized in that: The transmission assembly includes a first transmission wheel, a second transmission wheel and a transition piece; The first transmission wheel is sleeved outside the rotating shaft seat, and the second transmission wheel is connected to the output shaft of the motor; and the first transmission wheel and the second transmission wheel are connected through the transition piece.

7. The wafer scrubbing device according to any one of claims 1 to 4, characterized in that: A magnetic attraction module is provided between the telescopic module and the first rotating shaft, and the telescopic module is magnetically connected to the second end of the first rotating shaft through the magnetic attraction module; wherein the magnetic attraction module is used to adsorb the second end of the first rotating shaft through magnetic force.

8. The wafer scrubbing equipment according to claim 7, characterized in that: The magnetic attraction module is in contact with the second end of the first rotating shaft, and the contact form between the magnetic attraction module and the second end of the first rotating shaft is point contact.

9. The wafer scrubbing equipment according to claim 8, characterized in that: The pressure sensor is located between the telescopic module and the magnetic attraction module.

10. The wafer scrubbing equipment according to claim 7, characterized in that: It also includes a limit block located between the telescopic module and the first rotating shaft, the limit block includes a receiving space, and a through hole connecting the receiving space with the outside of the limit block is provided on a side of the limit block close to the first rotating shaft; The accommodation space is used to accommodate the pressure sensor, the through hole is used to accommodate the magnetic attraction module, and the magnetic attraction module can move along the rotation axis in the through hole.

11. The wafer scrubbing equipment according to claim 8 or 9, characterized in that: The second end of the first rotating shaft is provided with a spherical cap structure, and the spherical cap structure is used to contact the magnetic attraction module.

12. The wafer scrubbing device according to any one of claims 1 to 4, characterized in that: The device comprises a housing, the first shaft is at least partially located in the housing, and the brush head is located outside the housing; The housing comprises a mounting through hole, and the first end of the first rotating shaft is connected to the brush head via a connecting block located in the mounting through hole; A first protective cover covering the mounting through hole is arranged between the brush head and the connecting block, and a second protective cover sleeved on the first protective cover and the outside of the brush head is arranged on the shell.

13. The wafer scrubbing device according to any one of claims 1 to 4, characterized in that: The telescopic module includes a voice coil motor, and the voice coil motor is used to drive the scrubbing brush to move along the direction of the rotation axis.

14. A wafer scrubbing system, characterized in that: A wafer scrubbing device comprising the wafer scrubbing device according to any one of claims 1 to 13.

15. A polishing device, characterized in that: Includes the wafer scrubbing system as described in claim 14.

16. A wafer cleaning method, which uses the wafer scrubbing device according to any one of claims 1 to 13 to clean the wafer, characterized in that: The wafer cleaning method comprises: Positioning the wafer at the wafer scrubbing device; placing the scrubbing brush against the surface of the wafer; The scrubbing brush is driven to rotate to scrub the wafer.

17. The wafer cleaning method according to claim 16, characterized in that: The wafer cleaning method further comprises: detecting the force between the scrubbing brush and the telescopic module; The telescopic module is controlled to perform a telescopic action according to the action force between the scrubbing brush and the telescopic module, so as to adjust the action force between the scrubbing brush and the wafer.

Images