Loudspeaker assembly

Abstract

The invention relates to a loudspeaker assembly. An electronic device may include a housing defining an aperture and a display positioned in the aperture. The display and the housing may define an interior volume in which a speaker assembly is positioned. The speaker assembly may include a speaker module and a speaker housing in fluid communication, wherein the speaker housing at least partially defines a speaker volume.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is a divisional application of the invention patent application with Chinese national application number 202010979573.9, application date September 17, 2020, and invention name “speaker assembly”.

[0003] This application claims priority to U.S. Provisional Patent Application No. 62 / 946,288, filed on December 10, 2019, and entitled “SPEAKER ASSEMBLY,” the entire disclosure of which is hereby incorporated by reference into this document. Technical Field

[0004] The embodiments generally relate to electronic devices. More specifically, the embodiments relate to a speaker assembly for an electronic device. Background Art

[0005] Over the past several decades, electronic devices have made tremendous advances in functionality. Computer components have been miniaturized while the performance they can provide has increased. Electronic devices typically include a housing that surrounds internal system components such as audio speaker assemblies, circuits, processing units, display elements, and other electronic components. The reduced size of these various components can provide more efficient use of space, greater flexibility in the placement of components within the housing, reduced housing size and use of materials, smaller device size, easier transportation and use, and other options for device design.

[0006] A challenge is to provide an integrated speaker assembly that maintains a wide frequency range and a desired level of acoustic performance while also having a reduced size. Due to the increasing demand for electronic device components with reduced size and high performance, the integrated speaker assembly can be designed to have a limited space available for the back volume. The back volume (also referred to herein as the speaker volume) is an empty air space connected to the speaker, which can provide air for pushing, thereby preventing the speaker from being overdriven. One purpose of the back volume is to accommodate the echo or negative wave emitted from the speaker so that the echo does not radiate into the surrounding atmosphere and interfere with the positive sound wave, thereby allowing the desired level of acoustic performance. The acoustic performance in the low-frequency audio range may depend on the size of the back volume. The back volume can further affect the stiffness of the diaphragm of the speaker. For example, the larger the diaphragm and the smaller the back volume, the harder the diaphragm becomes. Compared with a softer diaphragm, a hard diaphragm may require more power to produce the desired output. Therefore, it may be desirable to increase the back volume of the speaker assembly to achieve the desired performance level while reducing the amount of space occupied by the speaker assembly within the internal volume of the electronic device. Summary of the invention

[0007] According to some examples of the present disclosure, an electronic device includes: a housing defining an orifice; a display positioned in the orifice, the display and the housing defining an internal volume; a speaker housing positioned in the internal volume, the speaker housing and the housing defining a speaker volume; and a speaker module positioned in the internal volume and connected to a speaker volume fluid.

[0008] In some examples, the speaker volume has a thickness between 1.7 millimeters (mm) and 2.3 mm. The speaker volume can be between 50 cubic centimeters (cm 3 ) to 100cm 3 The speaker volume may have a length between 100 mm and 300 mm, a width between 170 mm and 180 mm, and a thickness between 1.7 mm and 3 mm.

[0009] According to some examples, the speaker module may include a first woofer having a first diaphragm and a second woofer having a second diaphragm, the first woofer being adjacent to the second woofer, the first diaphragm and the second diaphragm being configured to move in opposite directions while being acoustically in phase. The electronic device may include: a second speaker housing positioned in the interior volume and at least partially defining a second speaker volume; and a second speaker module positioned in the interior volume in fluid communication with the second speaker volume. The speaker module may include a tweeter positioned adjacent to the woofer of the speaker module.

[0010] In some examples, the display at least partially defines a first outer surface of the electronic device, and the housing at least partially defines a second outer surface of the electronic device positioned opposite the first outer surface, and the distance from the first outer surface to the second outer surface is between 9 mm and 13 mm. The speaker housing includes a five-sided box configured to be sealed to the housing to define a speaker volume. The speaker housing may include support ribs disposed within the speaker volume. The support ribs may at least partially separate the speaker volume into a first volume and a second volume in fluid communication with the first volume, the first volume being in fluid communication with the speaker module, and the second volume being in fluid communication with a port at least partially defined by the speaker housing. The wall of the speaker housing may include a flexible portion configured to be capable of oscillation and a rigid portion at least partially surrounding the flexible portion, the support ribs being in contact with the rigid portion.

[0011] In some examples, the speaker housing is positioned between the display and a surface of the housing that at least partially defines the interior volume.A first portion of the speaker module may be in fluid communication with the surrounding environment, and a second portion of the speaker may be in fluid communication with the speaker volume.

[0012] According to some examples, an electronic device includes: a housing that at least partially defines an internal volume; a speaker housing that is disposed in the internal volume, the speaker housing at least partially defines the speaker volume, and the speaker volume has a thickness between 1.7 mm and 2.3 mm; a speaker module that is disposed in the internal volume and is fluidly connected to the speaker volume; and a processor and a memory that are disposed in the internal volume.

[0013] In some examples, the speaker volume is isolated from the surrounding environment. The speaker housing can include a six-sided box. The speaker housing can define an orifice, and the electronic device can include a sealing membrane that closes the orifice, the sealing membrane being disposed between the speaker housing and the housing. The speaker module can direct negative sound waves into the speaker volume. The negative sound waves are associated with a desired acoustic output produced by the speaker.

[0014] According to some examples, the speaker system includes a housing defining an interior volume having a thickness between 1.7 mm and 2.3 mm and a width between 50 cm 3 and 100cm 3 and a speaker module, the speaker module is in fluid communication with the internal volume; the speaker system has a V of less than 2 as With V b ratio. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present disclosure will be readily understood through the following detailed description in conjunction with the accompanying drawings, in which like reference numerals refer to like structural elements, and in which:

[0016] Figure 1 A perspective view of an electronic device is shown.

[0017] Figure 2 Shows Figure 1 front view of an electronic device.

[0018] Figure 3A Shows Figure 1 Cross-sectional front view of an electronic device.

[0019] Figure 3B Shows Figure 1 A cross-sectional side view of an electronic device.

[0020] Figure 3CShows Figure 1 A cross-sectional front view of a portion of an electronic device.

[0021] Figure 4 Shows Figure 1 An exploded perspective view of an electronic device.

[0022] Figure 5A A perspective view of a speaker assembly is shown.

[0023] Figure 5B A cross-sectional side view of a speaker module is shown.

[0024] Figure 6 A front view of the speaker assembly is shown.

[0025] Fig. 7A A cross-sectional front view of a speaker assembly is shown.

[0026] Figure 7B A cross-sectional front view of an electronic device is shown.

[0027] Figure 7C A cross-sectional front view of an electronic device is shown.

[0028] Fig.7D A cross-sectional front view of a portion of an electronic device is shown.

[0029] Fig. 8A A cross-sectional front view of an electronic device is shown.

[0030] Figure 8B A cross-sectional front view of an electronic device is shown.

[0031] Figure 8C Shows Fig. 8A A cross-sectional view of a speaker assembly of an electronic device.

[0032] Fig. 9 A cross-sectional front view of an electronic device is shown.

[0033] Fig. 10A A front view of the electronic device is shown.

[0034] Fig. 10B Shows Fig. 10A A cross-sectional side view of an electronic device.

[0035] Fig.11 A cross-sectional side view of an electronic device is shown.

[0036] Fig.12 A cross-sectional top view of an electronic device is shown.

[0037] Fig.13 A cross-sectional top view of an electronic device is shown.

[0038] Fig.14A A cross-sectional side view of an electronic device is shown.

[0039] Fig. 14B A cross-sectional top view of an electronic device is shown.

[0040] Fig.15A A cross-sectional side view of an electronic device is shown.

[0041] Fig. 15B A cross-sectional side view of an electronic device is shown. DETAILED DESCRIPTION

[0042] Reference will now be made specifically to the representative examples shown in the accompanying drawings. It should be understood that the following description is not intended to limit the examples to a preferred embodiment. On the contrary, the following description is intended to cover substitutions, modifications and equivalents that may be included in the spirit and scope of the embodiments defined by the appended claims.

[0043] The following disclosure relates to an internal speaker assembly for use in an electronic device. The examples and configurations discussed herein can be applied to a variety of electronic devices, including computing devices, desktop computers, stand-alone computers, portable computers, laptop computers, notebook computers, displays (i.e., monitors), tablet computers, televisions, smart phones, or any other electronic devices and combinations thereof.

[0044] The electronic device may include a housing defining an aperture. A display such as a screen may be disposed in the aperture. The housing and the display may define an internal volume. A speaker assembly may be positioned in the internal volume. The speaker assembly may include a speaker module and a speaker housing. The speaker module may include various acoustic components such as a woofer, a tweeter, an intermediate frequency driver, and any other type of driver or speaker component. The speaker housing may at least partially define an internal speaker volume. The speaker module may be communicatively coupled to the speaker housing through a port or an adjacent aperture so that the speaker module is in fluid communication with the speaker volume to serve as a rear volume.

[0045] Generally speaking, the devices described herein are used in an upright position. As used herein, an "upright" configuration or position refers to a configuration in which the slender height dimension of the device is more parallel to the direction of gravity than the vertical direction. For example, when the electronic device is in a vertical orientation similar to a picture frame hanging on a wall or supported by a tripod, the computing device is upright. In this understanding, the terms "top", "bottom", "side", "front", "back", "rear", "upper", "lower" and other such positional terms will be understood relative to the upright electronic device, but are only used for reference purposes. For example, in some orientations of the device, the top portion of the device may be located above the bottom portion of the device, but may also be in line with the bottom portion, below it, or in other spatial relationships with the bottom portion depending on the orientation of the device. These reference terms are not intended to limit the device to any one orientation, and it should be understood that the device described herein can be used or operated in orientations other than upright. In addition, the terms "length" or "height" refer to measurements from top to bottom, the term "width" refers to measurements from side to side, and the term "thickness" refers to measurements from front to back.

[0046] The increasing desire to reduce the size of components of electronic devices (such as to allow additional space within the internal volume of the device and / or to reduce the size of the device) may pose challenges to the various electronic components, such as internal speakers, included within the housing of the electronic device. Smaller form factors often result in greater costs during the design, manufacturing, and maintenance phases of the engineering life cycle, and may not allow the same expansion options as larger form factors. In addition, it may be difficult to achieve the desired performance level of internal components (such as internal speakers) due to the thinner design.

[0047] Therefore, it is desirable that the size form factor of a speaker meet certain space constraints to fit within an electronic device housing while maintaining a wide frequency range and an acceptable level of performance. For example, due to the increasing demand for thinner devices, integrated speakers tend to have limited space available for rear volume. The rear volume of the speaker is often a limiting factor when reducing the overall thickness of an electronic device while maintaining speaker performance. Therefore, it may be desirable to increase the rear volume as much as possible within the available internal space within the electronic device.

[0048] In some examples, the electronic device includes a housing that defines an aperture. The housing can be generally cuboid in shape and can have a thickness that is many times smaller than the length or width of the housing. A display, such as a screen, can be disposed in the aperture. The display can be sized and shaped to fit securely within the aperture, substantially enclosing the aperture while leaving open space within the housing. In other words, the display can be thinner than the housing so that when the display is positioned within the housing aperture, an internal volume is defined.

[0049] In some examples, the display at least partially defines a first outer surface of the electronic device, and the housing at least partially defines a second outer surface of the electronic device positioned opposite the first outer surface, and the distance from the first outer surface to the second outer surface can be between a range of less than about 20 millimeters (mm), for example, between about 9 mm and 13 mm. The speaker assembly can be positioned within the internal volume. The speaker assembly may include a speaker module and a speaker housing. The speaker module may include various acoustic components such as a woofer, a tweeter, an intermediate frequency driver, and any other type of driver or speaker component. The speaker housing may at least partially define a volume that can be used as a rear volume of the speaker assembly.

[0050] In some examples, the speaker housing can be positioned between the display and a surface of the housing (e.g., a rear wall of the electronic device). In some examples, the entirety of the speaker housing is positioned between the display and the housing. A first portion or front side of the speaker module can be in fluid communication with the surrounding environment, and a second portion or rear side of the speaker module can be in fluid communication with the speaker volume.

[0051] The speaker housing may at least partially define an internal speaker volume. The speaker module may be communicatively coupled to the speaker housing through a port or an adjacent orifice so that the speaker module is in fluid communication with the speaker volume to serve as a rear volume. In other words, the speaker module is coupled to the speaker housing so that the sound waves emitted from the speaker module enter the speaker volume. In some examples, the speaker housing and the housing define the speaker volume. For example, one or more walls or sides of the housing may be used in combination with the speaker housing to define the speaker volume. The speaker housing may be an open five-sided box, wherein the open sides define the orifice. The speaker housing may be configured to be positioned on the inner wall of the housing so that the open end or orifice of the speaker housing is covered or closed by the inner wall of the housing. The speaker housing may then be fixed to the housing to define the speaker volume. It should be understood that by using the inner surface of the housing wall as one or more of the sides defining the speaker volume, the speaker volume may be increased while the space occupied by the speaker housing in the electronic device may be reduced.

[0052] In some examples, the speaker volume can be isolated from the surrounding environment, that is, the speaker housing can be a sealed or partially sealed system. The speaker housing can include a six-sided box, that is, the speaker housing can completely define the speaker volume. In some examples, the speaker housing can define an orifice covered or closed by a sealing membrane or a component other than the housing. The sealing membrane can be a thin layer of material and can be arranged between the speaker housing and the housing to seal the speaker volume and isolate it from the external environment. By using a thin sealing membrane, the thickness of the speaker housing can be reduced while ensuring that the speaker housing is a sealed system before the speaker housing is fixed in the electronic device housing.

[0053] The speaker volume at least partially defined by the speaker housing can have a length between 100 mm and 300 mm, a width between 170 mm and 180 mm, and a thickness between 1.7 mm and 2.3 mm. In some examples, the speaker volume can be between about 5 cubic centimeters (cm 3 ) to 500cm 3 Between, about 25cm 3 About 300cm 3 Between, about 50cm 3 About 150cm 3 Between, about 50cm 3 About 100m 3 Between, or between about 70cm 3 To about 90cm 3 Between, for example about 80cm 3 In some examples, the speaker volume can have a substantially flat cubic or ellipsoidal shape, which can allow the thickness of the speaker volume to be reduced overall while maintaining a desired level of acoustic quality. In some examples, the area of ​​the speaker housing combined with the stiffness of the speaker (V as ) and the volume of the box or housing (V b ) is less than about 2, less than about 1.75, less than about 1.5, less than about 1.25, less than about 1, or less than about 0.75 or less.

[0054] According to some examples, the speaker module includes a first woofer having a first diaphragm, and a second woofer having a second diaphragm positioned adjacent to the first woofer. The first woofer and the second woofer can be positioned side by side so as not to increase the thickness of the speaker module. It should be understood that the examples disclosed herein are not limited to woofers, but can be applied to other types of speaker drivers and combinations thereof. The first woofer and the second woofer can be acoustically in phase. The diaphragm of the first woofer and the diaphragm of the second woofer can be positioned in opposite orientations so that when the first woofer and the second woofer produce the same audio output, the diaphragms move in opposite directions. By oscillating in opposite directions while being acoustically in phase, the first woofer and the second woofer can at least partially eliminate the force generated by the operation of the speaker. This force elimination can reduce potential noise or interference of various components near the speaker module, thereby improving the sound quality. It should be understood that alternative force elimination configurations can be implemented. For example, the main woofer can be positioned between and adjacent to two smaller woofers. The force generated by the two smaller woofers can be substantially equal to and opposite to the force generated by the main woofer. Thus, when acoustically in phase, the main woofer and the two smaller woofers have the effect of substantially cancelling the forces produced.

[0055] An electronic device may include a plurality of speaker assemblies disposed in its internal volume. For example, an electronic device may include two speaker assemblies positioned in an internal volume defined by a housing. In some examples, a first speaker assembly may be positioned near the left side of the housing, and a second speaker assembly may be positioned near the right side of the housing. The first speaker assembly and the second speaker assembly may be substantially identical. In some examples, the first speaker assembly and the second speaker assembly are substantially mirror images (e.g., chiral) of each other. In some examples, the speaker housings and speaker modules of the first speaker assembly and the second speaker assembly are substantially identical, however, the placement of the speaker modules relative to the speaker housings of each speaker assembly may vary. The speaker module may include one or more tweeters positioned adjacent to one or more woofers. A tweeter may be a speaker driver that produces acoustic output in a high frequency range. The tweeter may be positioned near a port or vent leading to the surrounding environment. In some examples, the tweeter is at least partially covered by a diaphragm of the speaker module. The tweeter may be positioned between the diaphragm and the rear wall of the housing of the electronic device. In some examples, the tweeter is positioned between a main driver such as a woofer and the bottom wall of the housing, and the bottom wall defines a port leading to the surrounding environment.

[0056] As described above, it may be desirable to maximize the speaker volume while minimizing the space occupied by the speaker housing. One way to achieve this is to reduce the thickness of the walls of the speaker housing. However, by thinning the walls of the speaker housing, the structural integrity of the speaker housing may become a concern. For example, if the walls of the speaker housing are too thin, they may become fragile, and the sound waves emitted from the speaker module may cause undesirable shaking or vibration of the speaker housing. Therefore, in some examples, the speaker housing may include one or more support ribs, which are configured to support or reinforce one or more walls of the speaker housing. The support ribs may be arranged inside the speaker volume defined by the speaker housing and / or on the outer surface of the speaker housing. The support ribs may be attached to or integrally formed on one or more of the speaker housing walls and / or the housing.

[0057] In some examples, the speaker assembly can be a ported speaker assembly (e.g., a bass reflex system) that uses a port or vent defined by a speaker housing to enable sound waves from the rear side of the diaphragm to increase the efficiency of the system at low frequencies, as compared to a typical sealed or closed box speaker assembly. In some examples, the speaker assembly can be a ported system in which support ribs at least partially separate the speaker volume into a first volume and a second volume in fluid communication with the first volume. The first volume can be in fluid communication with a rear portion of a woofer of the speaker module, and the second volume can be in fluid communication with a port that is at least partially defined by the speaker housing and exits to the surrounding environment. In other words, the support ribs can both reinforce the speaker housing and guide airflow in the ported system.

[0058] In some examples, the speaker assembly can include a passive radiator system that uses sound that is otherwise trapped in the housing to excite resonance. In some examples, the passive radiator can be securely positioned within a hole in the wall of the speaker housing. In some examples, an area of ​​the speaker housing itself can act as a passive radiator. For example, the wall of the speaker housing can include a flexible portion configured to be able to oscillate, and can also include a rigid portion that at least partially surrounds the flexible portion. In some examples, the entire face of the housing wall or a portion thereof is a flexible portion configured to be able to vibrate, and the side walls of the speaker housing are rigid to support the flexible portion. In some examples, a plurality of support ribs are positioned in the speaker volume to form a rigid portion and define the flexible portion of the speaker housing.

[0059] The following will refer to Figures 1 to 15B However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these drawings is for illustrative purposes only and should not be construed as limiting.

[0060] Figure 1 A perspective view of an electronic device 100 is shown. The electronic device 100 may correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet computer, computer, mobile communication device, GPS unit, remote control device, or any other electronic device. The electronic device 100 may be referred to as an electronic device or consumer device. The electronic device 100 may include a display 108, a housing 104, a chin 112 with a vent or orifice 114, and a bracket 116. The display 108 may include a computer display, such as a liquid crystal display (LCD), an organic light emitting diode (OLED) display, or any desired display component. The display 108 may be referred to as a monitor or display screen of the electronic device 100. The housing 104 may be a shell for protecting and covering parts of the display 108. In some examples, the housing 104 may include any desired material, such as a rigid and durable material. For example, the housing 104 may include plastic, metal, ceramic, glass material, or a combination thereof. In some examples, the housing 104 may include aluminum. In some examples, the housing 104 can define a bezel (ie, a front-facing surface of the housing) that extends around the perimeter of the display 108. Figure 2 Further details of the electronic device 100 are provided.

[0061] like Figure 2 As shown, the display 108 of the electronic device 100 can extend to the outer edge periphery of the housing 104. The housing 104 can define an aperture, or can be an open shell, wherein the display 108 is positioned within the aperture to define an internal volume within the housing 104. The chin 112 can also be attached to the housing 104 to at least partially define the internal volume. In some examples, the chin 112 can be formed integrally with the housing 104. The chin 112 can be adjacent to and flush with the outer surface defined by the display 108. The chin 112 can contain internal electronic components. In some examples, the display 108 may not extend beyond the chin 112 or overlap with the chin, which can provide additional space in the internal volume of the device 100 when the chin 112 is thinner than the display 108. Therefore, the internal volume defined between the chin 112 and the housing 104 can be used for larger internal components, which may not be assembled between the rear surface of the display 108 and the housing 104 in other ways. In some examples, when the electronic device 100 is assembled, the thickness of the housing 104 and the display 108 can be approximately equal to the thickness of the chin 112 and the housing 104. Thus, in some examples, the device 100 can have a substantially constant thickness along one or both of its width and height. In some examples, the display 108 extends completely to the bottom edge of the housing 104 (i.e., there is no chin 112). Figure 3AFurther details of the electronic device 100 are provided.

[0062] Figure 3A A cross-sectional front view of an electronic device 100 is shown, which includes a speaker assembly 118 positioned in an internal volume defined by a housing 104. Although shown as including two speaker assemblies 118, in some examples, the electronic device 100 may include any desired number of speaker assemblies. Each speaker assembly 118 may include a speaker module 120 and a speaker housing 124. In some examples, the electronic device 100 may include two speaker assemblies 118 positioned on opposite sides of the housing 104, although one or more speaker assemblies 118 may be positioned in any desired position. In some examples, each speaker assembly 118 is symmetrically positioned opposite to another speaker assembly 188. In some examples, the speaker assembly 118 is disposed in an internal volume defined by the housing 104 of the electronic device 100. The speaker module 120 disposed in the internal volume may be in fluid communication with the surrounding environment through the housing 104. For example, the speaker module 120 may be in communication with a port or opening 114. The speaker module 120 may also be in fluid communication with the speaker housing 124 through a port or channel 130 therebetween.

[0063] In some examples, the speaker housing 124 is in the shape of a general cube. In some examples, one or more of the edges of the speaker housing 124 may be smooth or rounded. In some examples, the edges of the speaker housing 124 may all be smooth or rounded, so that the speaker housing 124 has no obvious corners or sides. For example, the speaker housing 124 may be in the shape of a general ellipsoid. In some examples, the speaker housing 124 may have any desired shape and may be polyhedral or even irregularly shaped. The length and width of the speaker housing may be several times its thickness, so that the speaker housing 124 has a thin or flat overall shape. In some examples, the speaker volume at least partially defined by the speaker housing 124 has a thickness between 1.5 millimeters (mm) and 3 mm, between 1.6 mm and 2.8 mm, between 1.7 mm and 2.7 mm, between 1.8 mm and 2.6 mm, between 1.9 mm and 2.5 mm, or between 2 mm and 2.4 mm (e.g., about 2.7 mm). The speaker volume may be between about 25 cm 3 About 150cm 3 between, for example, between about 70 3 To about 90cm 3The speaker volume may have a length between 100 mm and 300 mm, between 150 mm and 250 mm, or between 200 mm and 230 mm. In some examples, the speaker volume may have a width between 170 mm and 180 mm, and a thickness between 1.7 mm and 2.3 mm. Figure 3B More details of the electronic device 100 are provided.

[0064] The speaker housing 124 can be formed from sheet metal, polymers, ceramics, or other materials or combinations thereof. In some examples, the speaker housing 124 is a one-piece piece. The speaker housing 124 can be formed by any combination of additive manufacturing and / or subtractive manufacturing processes (such as CNC manufacturing processes). In some examples, the speaker housing 124 is an integral piece of the housing 104 itself and can be formed together with the housing 104 in a complete CNC manufacturing process. Figure 3B Further details of the electronic device 100 are provided.

[0065] Figure 3B A cross-sectional side view of the electronic device 100 is shown. In some examples, the display 108 at least partially defines a first outer surface 109 (e.g., front) and a first inner surface 110 of the electronic device 100, the first inner surface at least partially defining the internal volume of the device 100. The housing 104 at least partially defines a second outer surface 105 (e.g., back) and a second inner surface 106 of the electronic device 100, the second inner surface at least partially defining the internal volume and positioned opposite to the first inner surface 110. In some examples, the distance from the first inner surface 110 to the second inner surface 106 can be less than about 50 mm, less than about 40 mm, less than about 30 mm, less than about 20 mm, or even less than about 15 mm or thinner. In some examples, the distance between the first inner surface 110 and the second inner surface 106 and thus the thickness of the internal volume defined by the display 108 and the housing 104 can be between about 5 mm and about 15 mm, for example, between about 9 mm and about 13 mm.

[0066] In some examples, the speaker module 120 may be positioned near the bottom edge or area of ​​the housing 104 and may be below the display 108. For example, the speaker module 120 may be positioned in an area of ​​the internal volume that is positioned between and defined by the housing 104 and the chin 112. In some examples, the speaker housing 124 may be positioned between the housing 104 and the display 108. Thus, in some examples, a portion of the speaker assembly 118, such as the speaker housing 124, may be positioned between the display 108 and the housing 104, while another portion of the speaker assembly, such as the speaker module 120, may be positioned between the chin 112 and the housing 104. In some examples, the display 108 may include additional components 122, such as a backlight, a touch-sensitive layer, a connector, or any other additional display components, as desired. In some examples, there are no components in the internal volume between the display 108 and the housing 104 except the display 108, the display component 122, and the speaker housing 124. That is, any other components of the electronic device 100 may be positioned elsewhere in the housing, for example, above the display 108 or between the chin 112 and the housing 104 in the interior volume.

[0067] The speaker housing 124 may at least partially define a speaker volume 140. The speaker volume 140 may receive sound waves (e.g., negative waves or echoes) generated by the speaker module 120. The speaker volume 140 may be referred to as a rear volume or a speaker rear volume. The speaker volume 140 may be in fluid communication with the rear portion or back portion of the speaker module 120 through the port 130. The front portion of the speaker module 120 may be in communication with the outside or surrounding environment through the port 114. In some examples, sound waves emitted from the front portion of the speaker module 120 are allowed to leave the electronic device 100 without any housing or partition in front of them. In some examples, the port 114 includes a pattern of vents, slits, grilles, or holes to allow sound waves to pass through the front portion of the speaker module while providing some protection or physical barrier between the internal volume and the surrounding environment, and providing the device 100 with a desired decorative appearance.

[0068] Figure 3C Shows Figure 3A A close-up view of an example of a portion of electronic device 100 is shown. Figure 3A and Figure 3B As shown, the speaker module 120 can be in fluid communication with the speaker housing 124 via the port 130. The speaker module 120 can be in fluid communication with the outside or surrounding environment via the port 114, such as Figure 3BHowever, in some examples, one or more components or materials may be disposed between the speaker module 120 and the port 114 in the interior volume defined by the housing 104. In some examples, the component 115 may include an air-permeable material that may restrict an amount of airflow through the port 114 while still allowing the acoustic signal generated by the speaker module 120 to pass. In this way, the presence of the component 115 may reduce undesirable flow noise, thereby producing a clearer acoustic signal.

[0069] In some examples, component 115 can include materials such as foam and / or mesh, as described herein. In some examples, component 115 can cover or close substantially the entire area of ​​pore 114. However, in some examples, component 115 can only partially cover or close pore 114 as desired. In addition, in some examples, component 115 can include a single portion of material, but in other examples, component 115 can include multiple portions of breathable material. Figure 4 Further details of the electronic device 100 are provided.

[0070] Figure 4 An exploded perspective view of the electronic device 100 is shown. As shown, the speaker assembly 118 can be positioned between the display 108 and the housing 104. In some examples, the chin 112 is connected to the display 108 and is also connected to the housing 104 so that portions of the speaker assembly 118, such as the speaker module 120, can be at least partially sandwiched between the chin 112 and the housing 104. During manufacturing, the housing 104 can be formed, and thereafter the speaker module 120 and the speaker housing 124 can be placed or positioned within the housing 104. In some examples, the display 108 and the chin 112 can be secured to the housing 104 so that the speaker housing is positioned between the display 108 and the housing 104.

[0071] As described herein, any kind of device configuration may be configured to include any number of speaker assemblies in any number and kind of configurations. A speaker assembly or any other component of an electronic device may be formed not only from the specific materials and components described herein, but may be formed from any number of materials, components, and processes described herein in any combination. FIG. 5A to FIG. 5B Various examples of speaker assemblies and their functionality as described herein are described.

[0072] Figure 5AA speaker assembly 218 is shown, which includes a speaker module 220 connected to a speaker housing 224 via a port 230. The speaker assembly 218 can be substantially similar to the speaker assemblies described herein (such as the speaker assembly 118) and can include some or all of the features of the speaker assemblies described herein. In some examples, the thickness of the speaker module 220 is greater than the thickness of the speaker housing 224. As shown, the surface area of ​​the speaker housing 224 can be several times the surface area of ​​the speaker module 220. In some examples, the thickness of the port 230 is equal to or less than the thickness of the speaker housing 224. In some examples, the width of the speaker module 220 is approximately equal to the width of the speaker housing 224. In some examples, the width of the port 230 is equal to or less than the width of the speaker housing 224. In some examples, the width of the port 230 is equal to or less than the width of the speaker module 220.

[0073] Figure 5B A cross-sectional side view of a speaker module 320 disposed within a housing 304 of an electronic device 300 is shown. The electronic device 300 including the speaker module 320 and the housing 304 may be substantially similar to the electronic device and speaker assembly described herein, and may include some or all of the features of the electronic device and speaker assembly described herein. The speaker module 320 may include a diaphragm 325 coupled to a magnetic component 321. The magnetic component 321 may include a gap or groove in which a wound coil 323, such as a copper coil or any conductive coil that can be affected by an electromagnetic field, is disposed. In some examples, the component 323 may be any component that can generate or be affected by a desired electromagnetic field. The diaphragm 325 may be attached to the coil 323. As the electrical pulse passes through the coil 323, the direction of its magnetic field changes rapidly, resulting in alternating attraction and repulsion of the magnetic component 321, thereby causing back and forth vibrations. The coil 323 may be attached to a diaphragm that amplifies these vibrations, thereby pumping sound waves into the surrounding air.

[0074] In some examples, the electronic device 300 may also include a high-frequency range driver, such as a tweeter 338. The tweeter 338 may be positioned within a space defined by the housing 304, the sides of the magnetic component 321, and the diaphragm 325. In other words, the tweeter 338 may be located above the bottom wall of the housing 304 and below the magnetic component 321. In addition, the tweeter 338 may be positioned between the diaphragm 325 and the rear wall of the housing 304. In some examples, the tweeter 338 is positioned closer to the port 314 that leads to the external environment than the magnetic component 321. In some examples, the tweeter 338 may be considered to be part of the speaker module 320, but in some other examples, the tweeter 338 may be considered to be a separate component. Figure 6 Various examples of speaker assemblies and their functionality as described herein are described.

[0075] Figure 6 A front view of a speaker assembly 418 is shown. The speaker assembly 418 can be substantially similar to the speaker assemblies described herein and can include some or all of the features of the speaker assemblies described herein. For example, the speaker assembly 418 can include a speaker module 420 and a speaker housing 424. In some examples, the speaker module 420 is directly coupled to the speaker housing 424 (i.e., there is no channel or conduit extending between the speaker module 420 and the speaker housing 424). In some examples, the speaker module 420 may include an aperture or opening that aligns with and abuts a corresponding aperture in the speaker housing 424.

[0076] In some examples, the speaker module 420 includes a first woofer 434a, a second woofer 434b, and a tweeter 438. The first woofer 434a can be positioned adjacent to the second woofer 434b. The first woofer 434a and the second woofer 434b can be offset or side by side to reduce the thickness of the speaker module 420. In some examples, the first woofer 434a can be acoustically in phase with the second woofer 434b, and the diaphragms of the first woofer 434a and the second woofer 434b can be configured to move in opposite directions (as indicated by the arrows) when the same acoustic signal is generated. Therefore, the first woofer 434a and the second woofer 434b can at least partially eliminate the force generated by the vibrating diaphragm in the speaker module 420. This force elimination can reduce the potential noise or interference of various components near the speaker module. As discussed herein, an alternative force elimination configuration can be implemented. For example, a main woofer (not shown) can be positioned between two smaller woofers (not shown) and adjacent to the two smaller woofers. The force generated by the two smaller woofers may be equal to and opposite to the force generated by the main woofer. Thus, when acoustically in phase, the main woofer and the two smaller woofers have the effect of substantially canceling the forces generated. Fig. 7A Provides more details of the speaker assembly.

[0077] Fig. 7AA cross-sectional front view of a speaker assembly 518 including a speaker module 520 and a speaker housing 524 is shown. The speaker assembly 518 may be substantially similar to the speaker assemblies described herein and may include some or all of the features of the speaker assemblies described herein. The speaker module 520 may include a first woofer 534a and a second woofer 534b and a tweeter 538. The speaker module 520 may be in fluid communication with a speaker volume 540 defined by the speaker housing 524 through a port 530. In some examples, the speaker housing 524 may include ribs or supports 542 disposed within the speaker volume 540. The ribs 542 may be coupled to one or more sides of the speaker housing 524. In some examples, the ribs 542 may be substantially L-shaped and may be shorter in length than the speaker volume 540, for example, the length of the ribs 542 may be about 200 mm. The ribs 542 may be configured to provide structural support to one or more walls such as a front wall (not shown) of the speaker housing 540.

[0078] The ribs 542 can direct airflow within the speaker volume 540. The ribs 542 can also at least partially separate the speaker volume 540 into a first portion 544 and a second portion 546. The first portion 544 can be in direct communication with the speaker module 520, and the second portion 546 can be in direct communication with a port 548 that leads to the surrounding environment. In some examples, the port 548 can be approximately 40 mm wide, although the port 548 can have any desired size and shape. In this way, the support ribs 542 can enable the speaker housing 540 to be used as a ported speaker assembly (e.g., a bass reflex system) that uses a port or vent defined at least in part by the support ribs 542 and the housing 524, compared to a typical sealed or closed box speaker assembly, so that negative sound waves from the speaker module 520 can increase the efficiency of the system at low frequencies. In some examples, the speaker assembly 518 can be connected to the internal housing of the electronic device itself and rely on leakage in the device to propagate sound. In some examples, the speaker assembly 518 can access the surrounding environment through a port or opening in the housing of the device. Refer to the following Figure 7B Provides more details of the speaker assembly.

[0079] Figure 7BA cross-sectional view of an electronic device 500 is shown. The electronic device 500 may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. The electronic device 500 may include one or more speaker assemblies 518 disposed in a housing 504. Each speaker assembly 518 may include a speaker module 520 and a speaker housing 524. The speaker assembly 518 may be substantially similar to the speaker assemblies described herein and may include some or all of the features of the speaker assemblies described herein. As discussed herein, the speaker module 520 may include a first woofer 534a and a second woofer 534b. The first woofer 534a may be in communication with the speaker volume 540 through a first channel, opening or aperture 530a. Similarly, the second woofer 534b may be in communication with the speaker volume 540 through a second channel 530b. It should be understood that because the first woofer 534a and the second woofer 534b may be oriented in opposite directions, the first channel 534a and the second channel 534b may be connected to opposite portions or sides of each woofer 534a, 534b. In addition to the generally L-shaped ribs 542 that divide the speaker volume 540 to create a ported speaker, the speaker housing 524 may also include support ribs 543 that may support or reinforce one or more walls of the speaker housing 524. In some examples, the speaker housing 524 may have a stiffness such that the first resonant mode of the housing is greater than about 3000 Hz, greater than about 3500 Hz, greater than about 4000 Hz, greater than about 4500 Hz, or greater than about 5000 Hz or greater. These additional support ribs 543 may also be used to guide airflow within the ported speaker housing 524. For example, the ribs 542, 543 may be positioned to direct sound waves to the port 548 that leads to the surrounding environment. In some examples, the housing 524 may include ribs 543 and may not include L-shaped ribs 542. In some examples, the housing 524 may include any number of ribs 543 disposed in any number of locations and in any number of orientations. In some examples in which the housing 524 includes a plurality of ribs 543, the ribs may have the same general size or may have various or multiple sizes. Reference below Figure 7C More details are provided for an electronic device including a speaker assembly.

[0080] Figure 7CA cross-sectional view of an electronic device 500 is shown. The electronic device 500 may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. The electronic device 500 may include one or more speaker assemblies 518 disposed in a housing 504. Each speaker assembly 518 may include a speaker module 520 and a speaker housing 524. The speaker assembly 518 may be substantially similar to the speaker assemblies described herein and may include some or all of the features of the speaker assemblies described herein. As discussed herein, the speaker module 520 may include a first woofer 534a and a second woofer 534b. The first woofer 534a may be in communication with the speaker volume 540 through a first channel, opening or aperture 530a. Similarly, the second woofer 534b may be in communication with the speaker volume 540 through a second channel, opening or aperture 530b. It should be understood that because the first woofer 534a and the second woofer 534b may be oriented in opposite directions, the first channel 534a and the second channel 534b may be connected to opposite portions or sides of each woofer 534a, 534b. In some examples, the speaker housing 524 may include one or more ribs 543 that may divide the speaker volume 540, for example, to create or extend an airflow path. In some examples, the ribs 543 may have substantially the same size and shape and may be oriented in any desired position. In some examples, the ribs 543 may be oriented parallel to each other. In some examples, the speaker housing 524 may include between 1 and 10 ribs 543, for example, about 5, or between 1 and 100 ribs 543. In some examples, the ribs 543 may support or reinforce one or more walls of the speaker housing 524. In some examples, the speaker housing 524 may also include a partition 542, for example, in the form of a rib or other component, which may at least partially separate the output path 548 or the port of the speaker housing 524 from another portion of the airflow path, for example, to achieve an acoustic effect similar to a speaker with a port.

[0081] Fig.7D Shows Figure 7CA close up view of a portion of the electronic device 500 shown. In this example, one or more breathable components 531a, 531b can be disposed in one or both of the channels 530a, 530b between the speaker module 520 and the speaker housing 524. In some examples, the breathable components 531a, 531b can include materials such as foam and / or mesh, as described herein. In some examples, the breathable components 531a, 531b can substantially occupy the entire volume defined by the channels 530a, 530b. However, in some other examples, the breathable components 531a, 531b can only occupy a portion of one or both of the channels 530a, 530b. In use, the breathable components 531a, 531b can be used to reduce the velocity of air flowing through one or both of the channels 530a, 530b, thereby reducing undesirable flow noise and providing a clearer acoustic signal heard by the user. Relative to FIG. 8A to FIG. 8C Provides more details of the speaker assembly.

[0082] Fig. 8A A cross-sectional front view of an electronic device 600 is shown. The electronic device 600 may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. The electronic device 600 may include a housing 604 that contains one or more speaker assemblies 618 in an internal volume at least partially defined by the housing 604. Each speaker assembly 618 may include a speaker housing 624 connected to a speaker module 620 by one or more channels 630a, 630b. The speaker assembly 618 may be substantially similar to the speaker assemblies described herein and may include some or all of the features of the speaker assemblies described herein. The speaker module 620 may include a first woofer 634a and a second woofer 634b, respectively. In some examples, the speaker housing 624 may define a speaker volume 640. The speaker housing 624 may also include a divider 642 and one or more support ribs 643 positioned within the speaker volume 640, for example, to create or define an airflow passage 648 similar to an airflow passage of a speaker housing with a port. In some examples, and as shown, the electronic device 600 can include two speaker housings 624 that can have differently sized speaker volumes 640. For example, one or both of the speaker housings 624 can be sized and shaped to conform to the layout of other components within the electronic device 600. In some examples, the acoustic energy output by the speaker 620 can be adjusted, for example, by a processor associated with the speaker 620, to compensate for any size differences between the multiple speaker volumes 640 so that the acoustic output from each speaker assembly 618 is substantially similar.

[0083] Figure 8BShows Fig. 8A 640, which includes a waveguide component 644 positioned at a desired location in a speaker volume 640 defined by a speaker housing 624. In some examples, the waveguide component 644 may include plastic, rubber, foam, metal, or any other material that can block or at least impede the flow of air in the speaker volume 640, such as a closed-cell or open-cell foam. In some examples, the component may be positioned adjacent to an end portion of a rib 643, for example, to impede the airflow path at that location. By placing multiple components 644 at desired locations adjacent to the rib 643, the airflow path in the speaker volume 640 can be effectively extended, for example, to control or tune one or more qualities of the sound output by the speaker assembly 618 as desired. In some examples, by extending the effective airflow path in the speaker volume 640, the resonant frequency of the speaker volume 624 can be increased. In some examples, the density and / or porosity of the waveguide component may be selected to control the airflow in the speaker volume 640 and control the resonant frequency of the speaker housing 624.

[0084] Figure 8C Shown along Figure 8B A cross-sectional view of the speaker housing 624 taken along the line shown. As described herein, in some examples, the speaker housing 624 may include a five-sided box structure. In some examples, the speaker housing 624 may have a metal construction such as a piece of sheet metal (including a piece of stainless steel). In some examples, the sheet metal may have a thickness between about 0.05 mm to about 2 mm, between about 0.1 mm to about 1 mm, or between about 0.15 mm to about 0.5 mm, for example, about 0.2 mm. In some examples, various features of the speaker housing 624 may be defined by or formed in portions of the sheet metal. As shown, in some examples, ribs 643 may be defined by the speaker housing 624. In some examples, features such as ribs 643 may be formed in the sheet by a stamping process or any other desired manufacturing process. Reference is made below to Fig. 9 Describes the electronics and speaker assembly in more detail.

[0085] Fig. 9A cross-sectional front view of an electronic device 700 is shown. The electronic device 700 may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. The electronic device 700 may include a housing 704 that contains one or more speaker assemblies 718 in an internal volume at least partially defined by the housing 704. Each speaker assembly 718 may include a speaker housing 724 connected to a speaker module 720 by one or more channels 730a, 730b. The speaker assembly 718 may be substantially similar to the speaker assemblies described herein and may include some or all of the features of the speaker assemblies described herein. The speaker module 720 may include a first woofer 734a and a second woofer 734b, respectively. In some examples, the speaker housing 724 may define a speaker volume 740. The speaker housing 724 may also include a support rib 742 positioned within the speaker volume 740. In some examples, a flexible portion 746 of the speaker housing 724 may have mechanical properties such that the flexible portion may be used as a suspension spring or a passive radiator.

[0086] The positioning of the support ribs 742 can define a flexible portion 746 and a rigid portion 748 of one or more walls of the speaker housing 718. In some examples, the flexible portion 746 can oscillate or vibrate in a desired manner in response to sound waves emitted from the speaker module 720. The rigid portion 748 can be held fixed and reinforced by the ribs 742 and / or the material of the speaker housing 724 itself. In other words, the flexible portion 746 can be used as a passive radiator, which uses sound that is otherwise trapped in the speaker housing 724 to excite resonance on the flexible portion 746. In some examples, the material and / or thickness of one or more walls of the housing 724 provides rigidity and strength in the rigid portion 748 and flexibility and tolerance in the flexible portion 746. In other words, the support ribs 742 may not be necessary to create a passive radiator within the speaker housing 724. In some examples, the support ribs 742 define an elliptical flexible portion 746 that acts as a passive radiator. Other shapes and configurations of the flexible portion 746 are possible. In some examples, the entire wall of the speaker housing 724 can vibrate as a passive radiator. That is, the entire wall surface can vibrate or oscillate in response to sound waves emitted from the speaker module 720. In some examples, the flexible portion 746 can include additional materials or can be heavier than the material of the rigid portion 748. For example, a brass or tungsten plate can be added to the flexible portion 746 to increase mass and tune the resonant frequency of the flexible portion 746. Fig. 10A and Fig. 10B Provides more details of the speaker assembly.

[0087] Fig. 10AA front view of an electronic device 800 is shown, and Fig. 10B Shows from Fig. 10A 10B-10B is a cross-sectional side view of an electronic device 800 taken in cross section 10B-10B shown. The electronic device 800 may be substantially similar to the electronic device described herein, and may include some or all of the features of the electronic device described herein. The electronic device may include a speaker assembly 818 positioned on the housing 804. The speaker assembly 818 may include a speaker housing 824 connected to the speaker module 820 via a port 830. In some examples, the speaker housing 824 may be attached to the inner surface 852 of the housing 804. As discussed herein, the speaker housing 824 may include a variable amount of sides or areas. In other words, the speaker volume 840 may be defined not only by the speaker housing 824, but also by one or more walls or areas (e.g., inner surface 852) of the housing 804. In some examples, the speaker housing 824 may be a five-sided box with an open side defining an orifice. As used herein, the term "five-sided box" refers to any substantially three-dimensional housing, such as a housing in the shape of a cuboid, which partially defines a volume, but includes a single orifice so as not to completely surround the volume. That is, where the term "six-sided box" may be used to refer to a shell that completely defines and surrounds an interior volume, the term "five-sided box" is used to refer to a shell that defines a volume and a single orifice, where one or more additional components are required to close the orifice and completely surround the volume. Along the same lines, the term "four-sided box" may refer to a shell that partially defines a volume but also defines two orifices or holes that are disposed opposite each other. Thus, a four-sided box may also be considered a tube, and components are required to close the two orifices and completely close the volume partially defined by the four-sided box. Although referred to as boxes, six-sided box shells, five-sided box shells, and four-sided box shells may have any shape. The speaker housing 824 may then be positioned on the rear inner surface 852 of the housing 804 such that the inner surface covers or closes the open side of the speaker housing 824 to form a rear volume. In some examples, the speaker housing 824 may be a four-sided box, where the inner surface 852 closes one orifice or open side, and one or more additional components close the opposing orifice or open side. Reference is made below to Fig.11 Provides more details of the speaker assembly.

[0088] Fig.11 A cross-sectional side view of an electronic device 900 including a speaker assembly 918 is shown. The cross-sectional view may be substantially similar to Fig. 10A9B-9B shown in cross section. The electronic device 900 may be substantially similar to the electronic devices described herein, and may include some or all of the features of the electronic devices described herein. In some examples, the speaker volume 940 is defined by the inner surface 952 of the speaker housing 924 and the housing 904. The wall of the speaker housing 924 may include a flange 956 around the periphery of the speaker housing 924. The flange 956 may be fixed to the speaker module 920 by one or more fixing elements 960 such as a pressure sensitive adhesive (PSA). The speaker module 920 may be further coupled to the housing 904 by a fixing element 960. The flange 956 of the speaker housing 924 may allow additional volume to exist in the speaker volume 940. In some examples, the thickness of the speaker housing 924 may vary according to the placement of the internal components in the housing 904. For example, various electronic or structural components in the housing 904 may require the speaker housing 924 to be reduced in size and certain positions. Therefore, the speaker housing 924 may have a varying thickness to maximize the speaker volume 940, while still providing space for additional components of the device 900. An additional advantage of maximizing the thickness of the speaker volume is that the friction effect between the moving air and the inner wall of the speaker housing is reduced, thereby providing enhanced acoustic performance. Fig.12 More details are provided for an electronic device including a speaker assembly.

[0089] Fig.12 A cross-sectional top view of an electronic device 1000 is shown including a speaker assembly 1018 having a speaker housing 1024 and a speaker module (not shown). The cross-sectional view is from Fig. 10A12-12 shown in the figure. The electronic device 1000 may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. In some examples, the speaker volume 1040 may be defined by two walls or regions (e.g., the rear inner wall 1052 and the side wall 1054) of the housing 1004 and one or more walls of the speaker housing 1024. It should be understood that by removing one or more walls of the speaker housing 1024 and using the walls of the housing 1004 instead to define the speaker volume 1040, the speaker volume 1040 can increase the thickness of the wall removed from the speaker housing 1024. Then, the speaker housing 1024 can be fixed, attached, attached or otherwise fixed to the wall of the housing 1004. For example, the speaker assembly 1018 can be fixed with screws, glue, brackets or any other fastening means or a combination thereof. In some examples, an H-shaped seal or gasket can be used to seal the speaker volume from the surrounding environment. The H-shaped seal can be used in combination with foam for pressure-sensitive adhesives. In some examples, the speaker housing 1024 is secured in the housing by being pressed between the inner surface 1052 and other electronic components within the housing 1004, such as a display (e.g., press fit). Although the walls 1052, 1054 of the housing 1004 defining the speaker volume 1040 are shown as being substantially vertical, the walls 1052, 1054 can have any geometric arrangement and orientation. Fig.13 More details are provided for an electronic device including a speaker assembly.

[0090] Fig.13 A cross-sectional top view of electronic device 1100 is shown. The cross-sectional view may be substantially similar to Fig. 10ACross-section 12-12 shown. The electronic device 1100 may be substantially similar to the electronic devices described herein, and may include some or all of the features of the electronic devices described herein. In some examples, the device 1100 may include a speaker assembly, which includes a speaker module (not shown) and a speaker housing 1124. In some examples, the speaker housing 1124 may be a five-sided box with an open side or a large orifice. In some examples, the speaker housing 1124 is oval, has no defined edges, corners or sides, and includes an orifice near the housing 1104. A sealing film, layer or material 1156 such as a sheet of fabric or a similar woven structure, a rubber sheet (or a sheet of any other polymeric material), or a combination thereof may be configured to cover or close the open end of the five-sided box 1124. The speaker housing 1124 may be fixed to the inner surface 1152 of the housing 1104 so that the sealing film 1156 is positioned between the speaker housing 1124 and the housing 1104. By securing the sealing membrane 1156 to the speaker housing 1124, the manufacturing process of the electronic device 1100 can be improved by ensuring an appropriate sealing volume between the speaker housing 1124 and the sealing membrane 1156 before securing the speaker housing 1124 to the housing 1104. The sealing membrane 1156 can be much thinner than the wall of the speaker housing 1124, thereby increasing the available speaker volume 1140 relative to the traditional six-sided box construction. Fig.14A and Fig. 14B More details are provided for an electronic device including a speaker assembly.

[0091] Fig.14A 1 shows a cross-sectional side view of an electronic device 1200. The cross-sectional view may be substantially similar to Fig. 10A10B-10B shown in the cross section. The electronic device 1200 may be substantially similar to the electronic devices described herein, and may include some or all of the features of the electronic devices described herein. The electronic device 1200 may include a speaker assembly 1218, which includes a speaker housing 1224 and a speaker module 1220. In some examples, the housing 1204 of the electronic device 1200 may define a chamber, i.e., a recessed or concave area 1258, on the inner rear wall 1252 of the housing 1204. The recessed area 1258 can maximize the speaker volume 1240 while still maintaining the reduced size of the speaker housing 1224. In some examples, the speaker volume 1240 can be defined by a single thin wall 1224 and by five walls of the recessed portion 1258 (including the rear wall 1252 and four side walls of the housing 1204). For example, the speaker housing 1224 can be used as a cover to cover the open end or orifice of the recessed portion 1258. In some examples, the speaker housing 1224 can be sealed directly to the speaker module 1220 and the inner surface of the housing 1204. In some examples, the recessed portion 1258 can extend until it reaches the top wall of the housing 1204. In some examples, the recessed portion 1258 only partially extends upward along the rear wall of the housing 1204 and can terminate before reaching the top wall of the housing 1204. Fig. 14B Provides more details of the speaker assembly.

[0092] Fig. 14B A cross-sectional top view of electronic device 1300 is shown. The cross-sectional view may be substantially similar to Fig. 10A The electronic device 1300 may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. Fig.14A The electronic device 1100 of the embodiment of the present invention may include a speaker housing 1324 positioned above a recessed portion 1352 defined by the housing 1304 to define a speaker volume 1340. In some examples, the rear wall 1352 of the housing 1304 may function as a passive radiator, similar to the example of FIG. Fig. 9 In other words, the rear wall 1352 of the housing 1304 can be thinned to increase the speaker volume 1340 and create flexibility in the rear wall 1352 to act as a passive radiator. Fig.15A and Fig. 15B Provides more details of the speaker assembly.

[0093] Fig.15A A cross-sectional side view of an exemplary electronic device 1300 is shown. The cross-sectional view may be substantially similar to Fig. 10A10B-10B shown in the cross section. The electronic device 1300 may be substantially similar to the electronic devices described herein, and may include some or all of the features of the electronic devices described herein. The electronic device 1300 may include a speaker assembly 1318, which includes a speaker housing 1324 and a speaker module 1320. In some examples, the housing 1304 of the electronic device 1300 may define a chamber, i.e., a recessed area or a recessed area 1358, on the inner rear wall 1352 of the housing 1304. The recessed area 1358 can maximize the speaker volume 1340 while still maintaining the reduced size of the speaker housing 1324. In some examples, the speaker volume 1340 can be defined by the side walls and top wall of the housing 1324 and by five walls of the recessed portion 1358 (including the rear wall 1352 and four side walls of the housing 1304). For example, the speaker housing 1324 can be used as a five-sided box that covers the open end or orifice of the recessed portion 1358, thereby providing additional volume for the housing 1324. In some examples, the speaker housing 1324 can be sealed directly to the speaker module 1320 and the inner surface of the housing 1304. In some examples, the recessed portion 1358 can extend until it reaches the top wall of the housing 1304. In some examples, the recessed portion 1358 only partially extends upward along the rear wall of the housing 1304 and can terminate before reaching the top wall of the housing 1304. Fig. 15B Provides more details of the speaker assembly.

[0094] Fig. 15B 1400 is shown in a cross-sectional side view. The cross-sectional view may be substantially similar to Fig. 10A10B-10B shown in the cross section. The electronic device 1400 may be substantially similar to the electronic devices described herein, and may include some or all of the features of the electronic devices described herein. The electronic device 1400 may include a speaker assembly 1418, which includes a speaker housing 1424 and a speaker module 1420. In some examples, the housing 1404 of the electronic device 1400 may define a chamber, i.e., a recessed area or a recessed area 1458, on the inner rear wall 1452 of the housing 1404. The recessed area 1458 can maximize the speaker volume 1440 while still maintaining the reduced size of the speaker housing 1424. In some examples, the speaker volume 1440 can be defined by the side walls and top wall of the housing 1424 and by five walls of the recessed portion 1458 (including the rear wall 1452 and four side walls of the housing 1404). In addition, in some examples, the speaker housing 1424 can define one or more ribs 1443, which can guide the airflow within the housing 1424, as described herein. In some examples, ribs 1443 can extend into recessed area 1458. In some examples, one or more ribs 1443 can contact or seal rear wall 1452 to prevent or reduce airflow at those locations. In some examples, speaker housing 1424 can be directly sealed to speaker module 1420 and the inner surface of housing 1404.

[0095] Although the present disclosure generally describes a speaker assembly positioned in an electronic device, the components, features, and methods described herein may be used in any combination or order and with any desired component, portion, or electronic device. Furthermore, the components and features described herein are not limited to the specific examples shown, and may take on any geometric shape, pattern, size, or combination of shapes, patterns, and sizes, and may be included in any number in any position or combination of positions. Additionally, the components may be made of any desired material or combination of materials, and may be manufactured using any known or suitable manufacturing technique.

[0096] To the extent applicable to the present technology, the collection and use of data obtained from various sources can be used to improve the delivery of inspirational content or any other content that may be of interest to users. The present disclosure contemplates that in some instances, such collected data may include personal information data that uniquely identifies or can be used to contact or locate a specific person. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, ID, home address, data or records related to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

[0097] The present disclosure recognizes that the use of such personal information data in the present invention technology can be used to benefit users. For example, the personal information data can be used to deliver targeted content that users are more interested in. Therefore, the use of such personal information data enables users to have planned control over the content delivered. In addition, the present disclosure also anticipates other uses of personal information data that benefit users. For example, health and fitness data can be used to provide insights into the user's overall health status, or can be used as positive feedback for individuals who use technology to pursue health goals.

[0098] This disclosure envisions that entities responsible for collecting, analyzing, disclosing, transmitting, storing or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as the collection and / or use of data changes. Personal information from users should be collected for legitimate and reasonable purposes of the entity and not shared or sold outside of these legitimate uses. In addition, such collection / sharing should be performed after receiving informed consent from the user. In addition, such entities should consider taking any necessary steps to defend and secure access to such personal information data and ensure that others who have access to personal information data comply with their privacy policies and processes. In addition, such entities may subject themselves to third-party assessments to demonstrate their compliance with widely accepted privacy policies and practices. In addition, policies and practices should be adjusted to specific types of personal information data collected and / or accessed, and to applicable laws and standards including specific considerations of jurisdiction. For example, in the United States, the collection or access of certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA), while health data in other countries may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained in each country for different types of personal data.

[0099] Regardless of the foregoing, the present disclosure also contemplates an example in which a user selectively blocks the use or access of personal information data. That is, the present disclosure contemplates that hardware elements and / or software elements may be provided to prevent or block access to such personal information data. For example, with respect to an advertising delivery service, the technology of the present invention may be configured to allow a user to choose to "opt in" or "opt out" at any time during or after registration for the service to participate in the collection of personal information data. In another example, a user may choose not to provide emotion-related data for a target content delivery service. In another example, a user may choose to limit the length of time that emotion-related data is retained, or to completely prohibit the development of basic emotional conditions. In addition to providing "opt-in" and "opt-out" options, the present disclosure contemplates providing notifications related to access or use of personal information. For example, a user may be notified that their personal information data will be accessed when downloading an application, and then reminded again just before the personal information data is accessed by the application.

[0100] In addition, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use. Risks can be minimized by limiting data collection and deleting data once it is no longer needed. In addition, and when applicable, including in certain health-related applications, data de-identification can be used to protect the privacy of users. De-identification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than at the address level), controlling how data is stored (e.g., aggregating data on users), and / or other methods when appropriate.

[0101] Thus, while the present disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, the present disclosure also contemplates that various embodiments may also be implemented without access to such personal information data. That is, various embodiments of the present technology will not fail to function properly due to the lack of all or a portion of such personal information data. For example, content may be selected and delivered to a user by inferring preferences based on non-personal information data or an absolute minimum amount of personal information, such as content requested by a device associated with the user, other non-personal information available to a content delivery service, or publicly available information.

[0102] For the purpose of illustration, the foregoing description uses specific nomenclature to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that the embodiments can be practiced without specific details. Therefore, for the purpose of illustration and description, the foregoing description of the specific embodiments described herein is presented. They are not intended to be exhaustive or to limit the embodiments to the precise form disclosed. It will be apparent to those of ordinary skill in the art that, in view of the above teachings, many modifications and variations are feasible.

Claims

1. An electronic device, comprising: a housing defining an aperture; a display positioned in the aperture, the display and the housing defining an interior volume; a speaker housing positioned within the interior volume, the speaker housing and a wall of the housing opposite the display defining a speaker volume; a speaker module positioned within the interior volume and in fluid communication with the speaker volume; as well as Support ribs are positioned within the speaker volume, the support ribs being configured to structurally support a wall of the speaker housing. 2 . The electronic device of claim 1 , wherein the support rib is coupled to at least one of the housing or the wall of the speaker housing. 3 . The electronic device of claim 1 , wherein the support ribs are positioned to tune the sound output of the speaker module. 4 . The electronic device of claim 1 , further comprising a waveguide component configured to obstruct airflow within the speaker volume.

5. The electronic device according to claim 1, further comprising: a second speaker housing positioned within the interior volume and at least partially defining a second speaker volume; as well as A second speaker module is positioned within the interior volume in fluid communication with the second speaker volume.

6. The electronic device according to claim 1, wherein: The display at least partially defines a first exterior surface of the electronic device; The housing at least partially defines a second exterior surface of the electronic device positioned opposite the first exterior surface; and The distance from the first outer surface to the second outer surface is between 9 mm and 13 mm.

7. The electronic device of claim 1, wherein the support ribs at least partially define a flexible portion of the speaker housing and a rigid portion of the speaker housing.

8. The electronic device of claim 1, wherein the support rib is a first rib of a plurality of support ribs positioned within the speaker volume.

9. The electronic device according to claim 1, wherein: The speaker module comprises a first side and a second side opposite to the first side; The first side is in fluid communication with an ambient environment; and The second side is in fluid communication with the speaker volume.

10. The electronic device according to claim 1, wherein: The support ribs at least partially separate the speaker volume into a first volume and a second volume in fluid communication with the first volume; and The first volume is in fluid communication with the speaker module, and the second volume is in fluid communication with a port at least partially defined by the speaker housing.

11. The electronic device of claim 1, wherein the support rib extends into a recess formed in the housing.

12. An electronic device comprising: a housing at least partially defining an interior volume, the housing including walls defining a recessed area and at least partially defining an exterior surface of the electronic device; a speaker housing disposed within the interior volume, the speaker housing and the wall at least partially defining a speaker volume, the speaker housing defining a reinforcement rib extending into the recessed region; as well as A speaker module is disposed within the interior volume and is in fluid communication with the speaker volume.

13. The electronic device of claim 12, wherein the speaker volume is isolated from a surrounding environment.

14. The electronic device of claim 12, wherein the walls define five walls of the speaker volume.

15. The electronic device of claim 14, wherein the speaker housing comprises a single thin wall, the wall and the single thin wall defining the speaker volume.

16. The electronic device of claim 12, wherein the speaker module directs negative sound waves into the speaker volume, the negative sound waves producing a desired acoustic output.

17. A speaker system comprising: a housing defining an interior volume; a speaker module in fluid communication with the interior volume; as well as a rib positioned within the interior volume and configured to reinforce the housing, the rib configured to tune an acoustic output of the speaker module; in: The first wall of the housing includes a first port and a second port; the first port being in fluid communication with the interior volume; and The rib extends from the first wall between the first port and the second port.

18. The speaker system of claim 17, wherein the ribs are configured to direct airflow in the interior volume.

19. The speaker system of claim 17, wherein the ribs are stamped into the housing.

20. The speaker system of claim 17, wherein the second wall of the housing comprises: a flexible portion configured to be able to oscillate; as well as A rigid portion at least partially surrounds the flexible portion, the rib being in contact with the rigid portion.

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