Miniature integrated circuit with light emitting diode display laminated into glass

Abstract

Aspects of the present disclosure include laminating a micro integrated circuit (micro IC) with integrated micro light emitting diodes (micro LEDs) into a glass or laminated glass assembly (e.g., a glass panel of a vehicle). An exemplary vehicle includes a laminated glass panel having an outer glass layer, an inner glass layer, and an adhesive layer between the outer glass layer and the inner glass layer. The vehicle also includes a display unit embedded in the laminated glass panel. The display unit includes a micro IC having a driving circuit and a micro LED on a surface of the driving circuit. The vehicle includes a controller electrically coupled to the display unit. The controller is configured to direct the drive circuit to deliver a drive voltage to the micro LED.

Description

Technical Field

[0001] The subject disclosure relates to display technology, and in particular, to laminating micro-integrated circuits (micro-ICs) with integrated micro-light emitting diodes (micro-LEDs) into glass or laminated glass assemblies for smart glass and display applications. Background Art

[0002] Light emitting diodes (LEDs) have revolutionized the field of display technology with their efficient and versatile capabilities. LEDs are semiconductor devices that emit light when an electric current passes through them. LED displays can be monochrome or multicolor displays, and depending on the underlying architecture, typically utilize an active layer between two doped layers (e.g., an n-type semiconductor layer and a p-type semiconductor layer) and a voltage applied between the two doped layers to generate light. The voltage injects electrons into the active layer, where the electrons recombine to release photons. When compared to traditional incandescent bulbs, LEDs can be driven at relatively low voltages while emitting lower levels of heat, thereby providing relatively high energy efficiency. LEDs can be manufactured in a range of display and screen types, such as, for example, in head-up displays (HUDs), in-plane displays (e.g., in-plane communication devices laminated in or on vehicle windows to communicate with users inside or outside the vehicle), smart glass applications, and general device displays.

[0003] Early generation LED displays were somewhat simple devices constructed to display a limited variety of static images, logos, symbols and / or messages as needed, and were typically made by arranging LEDs to feed a light bar via a collimating optic (i.e., a collimator). The light from the light bar was mixed using a mixing region or homogenization region and ultimately displayed in a display region. However, LED technology has rapidly advanced, and displays can now utilize dense arrays of micro-LEDs to drive complex multi-pixel displays.

[0004] Micro-LEDs are tiny individual light-emitting diodes, typically less than 100 microns in size, that can be manufactured using advanced semiconductor manufacturing techniques. Micro-LED displays offer numerous advantages over previous generation LED display systems, such as higher brightness, improved color accuracy, higher energy efficiency, and other enhanced performance characteristics. These attributes make micro-LED displays ideal for automotive applications where visibility, clarity, and power efficiency are highly desired (e.g., in a vehicle's in-plane communication system).

[0005] The conventional way to drive micro-LEDs in display systems is to use a thin film transistor (TFT) backplane mounted on an underlying substrate. The TFT backplane acts as a switching element that controls the current flowing through each individual LED pixel in the display. Therefore, in order to integrate working micro-LEDs into a vehicle's glass laminate assembly (e.g., front windshield, passenger window, etc.), the TFT backplane must be laminated side by side with the micro-LEDs between the inner and outer glass layers of the glass laminate assembly. However, in this way, more manufacturing processes are required to produce the display because the laminated window will require more bonding layers and additional lamination steps. Summary of the invention

[0006] In an exemplary embodiment, a vehicle includes a laminated glass panel having an outer glass layer, an inner glass layer, and a bonding layer between the outer glass layer and the inner glass layer. The vehicle also includes a display unit embedded in the laminated glass panel. The display unit includes a micro IC having a drive circuit and a micro LED on a surface of the drive circuit. The vehicle includes a controller electrically coupled to the display unit. The controller is configured to direct the drive circuit to deliver a drive voltage to the micro LED.

[0007] In addition to one or more features described herein, in some embodiments, the bus lines are formed directly in at least one of the outer glass layer and the inner glass layer. In some embodiments, the display cells are formed on the bus lines.

[0008] In some embodiments, the display unit is embedded in the bonding layer of the laminated glass assembly.

[0009] In some embodiments, the laminated glass panel includes a color shifting layer between the bonding layer and the inner glass layer. In some embodiments, the color shifting layer is located within the patterned protective layer. In some embodiments, the display unit is embedded in the color shifting layer. In some embodiments, the color shifting layer includes a phosphor material selected to shift the natively emitted color of the micro-LED to another color.

[0010] In some embodiments, the sensor unit is embedded in the laminated glass panel. The sensor unit may include a micro IC having a drive circuit and a micro sensor on a surface of the drive circuit. In some embodiments, the display unit and the sensor unit are formed on the same surface of the laminated glass panel. In some embodiments, the display unit and the sensor unit are formed on opposite surfaces of the laminated glass panel.

[0011] In another exemplary embodiment, the laminated glass panel may include an outer glass layer, an inner glass layer, and a bonding layer between the outer glass layer and the inner glass layer. The display unit is embedded in the laminated glass panel. The display unit includes a micro IC having a driving circuit and a micro LED on a surface of the driving circuit.

[0012] In yet another exemplary embodiment, a method for integrating a micro integrated circuit with a micro light emitting diode in a laminated glass assembly may include forming one or more first glass layers, forming one or more bus lines on the one or more first glass layers, and forming a display unit on the one or more bus lines. The display unit may include a micro IC having a drive circuit and a micro LED on a surface of the drive circuit. The method includes forming a bonding layer over the display unit and the one or more first glass layers, forming one or more second glass layers over the bonding layer, and laminating the one or more first glass layers, the bonding layer, and the one or more second glass layers to define a laminated glass assembly.

[0013] The above features and advantages and other features and advantages of the present disclosure are apparent from the following detailed description when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Other features, advantages and details appear, by way of example only, in the following detailed description, which refers to the accompanying drawings, in which:

[0015] Figure 1 is a vehicle constructed according to one or more embodiments;

[0016] Figure 2 According to one or more embodiments Figure 1 A cross-sectional view of a laminated glass panel is shown;

[0017] Figure 3 According to one or more embodiments, Figure 2 Alternative constructions of laminated glass panels shown;

[0018] Figure 4 According to one or more embodiments, Figure 2 Yet another alternative configuration of the laminated glass panel shown;

[0019] Figure 5 According to one or more embodiments, Figure 2 Yet another alternative configuration of the laminated glass panel shown;

[0020] Fig. 6A A process for forming a laminated glass panel according to one or more embodiments is shown;

[0021] Figure 6B According to one or more embodiments, Fig. 6A Alternative layouts of bus lines in;

[0022] Figure 6C According to one or more embodiments, Fig. 6A Another alternative layout of bus lines in;

[0023] Figure 7 is a computer system according to one or more embodiments; and

[0024] Figure 8 is a flow chart according to one or more embodiments. DETAILED DESCRIPTION

[0025] The following description is merely exemplary in nature and is not intended to limit the present disclosure, its application or use. It should be understood that throughout the drawings, corresponding reference numerals represent identical or corresponding components and features. As used herein, the term module refers to a processing circuit, which may include an application specific integrated circuit (ASIC), an electronic circuit, a (shared, dedicated or group) processor and memory that executes one or more software or firmware programs, a combinational logic circuit, and / or other suitable components that provide the described functionality.

[0026] As previously discussed, the conventional way to drive micro-LEDs in micro-light emitting diode (micro-LED) display systems is to use a thin film transistor (TFT) backplane mounted on an underlying substrate. While the glass found in many windows itself is a suitable substrate, glass laminate assemblies with more desirable structural features have largely replaced glass panels in modern vehicles. Unfortunately, the presence of a TFT backplane complicates the panel manufacturing process because the TFT backplane integration requires additional bonding layers and / or lamination steps to complete the glass laminate assembly.

[0027] The present disclosure introduces a way to laminate a micro-integrated circuit (micro-IC) with integrated micro-LEDs into glass or laminated glass assemblies. Rather than relying on a TFT backplane to drive the micro-LEDs, a display constructed in accordance with one or more embodiments includes a co-integrated micro-IC mounted using complementary metal oxide semiconductor (CMOS) chiplet technology. The micro-IC described herein can be constructed as an embedded CMOS drive circuit to drive the micro-LEDs without a TFT backplane.

[0028] Micro LED displays constructed in accordance with one or more embodiments provide several technical advantages over existing LED-based displays. Notably, integrating the drive circuit (i.e., micro IC) with the micro LED allows the display system (e.g., micro LED) to be mounted on electrical bus lines printed directly on or in a laminated glass assembly (e.g., a vehicle window). In this type of construction, optical bonding can be achieved using only a single optical bonding layer because the display system is already mounted on a layer of the laminated glass assembly. The result is a significant simplification of the panel manufacturing process. Other advantages are possible.

[0029] In particular, the drive circuit can also be embedded in the microsensor, which can then be mounted within a laminated glass assembly using the same techniques described herein for micro ICs and micro LEDs to achieve a display with enhanced in-plane communication features. Depending on the desired sensing area, bidirectional communication is also possible, for example, by mounting the microsensor on the upper glass layer and / or lower glass layer of the laminated glass assembly. In some embodiments, one or more drive circuits may be designed to detect the junction temperature of the micro-LED. In some embodiments, a controller communicatively coupled to the drive circuit can limit the LED drive current of a single micro-LED based on its temperature. In some embodiments, a phosphor layer can be installed between patterned protective layers to convert the color of light emitted naturally from the micro-LED to a color specified by a phosphor (e.g., a red phosphor, a yellow phosphor, etc.).

[0030] According to an exemplary embodiment, a vehicle Figure 1 100 is generally indicated in the figure. The vehicle 100 is shown in the form of a car having a body 102. The body 102 includes a passenger compartment 104, in which a steering wheel, front seats and rear passenger seats (not shown separately) are arranged. The body 102 also includes a plurality of glass or glass laminate assemblies, such as a laminated glass panel 106. For ease of illustration and discussion only, emphasis is placed on a specific laminated glass panel 106 (here the rear passenger window). It should be understood that any aspect of the present disclosure may be applied to any glass and glass laminate assembly in the vehicle 100, including, for example, a front windshield, any driver door and passenger door (front door and rear door), a rear glass panel, a sunroof / top window, etc. In short, the position, size, arrangement, etc. of the laminated glass panel 106 are not meant to be particularly limited, and all such constructions are within the intended scope of the present disclosure.

[0031] As will be described in detail herein, the laminated glass panel 106 includes an embedded display 108. The embedded display 108 includes one or more micro-LEDs integrated with one or more micro-ICs. In some embodiments, the micro-LEDs and micro-ICs are embedded with thermal sensors between one or more layers of the laminated glass panel 106 (see FIG. Figure 2In some embodiments, the embedded display 108 includes one or more micro sensors embedded next to the micro IC and micro LED (see Figure 3 In some embodiments, one or more micro sensors are embedded on the surface opposite to the micro IC and micro LED (see Figure 4 In some embodiments, the embedded display 108 includes a color shifting layer (eg, a phosphor layer) in which the micro-LEDs are embedded (see Figure 5 ).

[0032] The display 108 is shown with a particular image (here, the text "TAXI"), for example and for ease of discussion only. It should be understood that the embedded components (micro ICs and micro LEDs) may be arranged, positioned and / or otherwise constructed anywhere within and / or on the laminated glass panel 106 as desired. Those components may be selectively activated using electrical signals (e.g., via a drive voltage) to achieve any desired image. In addition, while the image is shown as being projected in an outward configuration (the image is viewable and oriented for viewing from outside the vehicle 100), the components may also face the interior of the vehicle 100. In other words, the image may be projected into the passenger compartment 104 and / or outside the vehicle 100 as desired. All of these configurations are within the intended scope of the present disclosure.

[0033] Figure 2 shows a schematic diagram of a laminate after lamination according to one or more embodiments. Figure 1 A cross-sectional view of the display 108 is shown. Figure 2 As shown, the laminated glass panel 106 includes one or more display units 202 laminated between an outer glass layer 204 (also referred to as an outer glass layer) and an inner glass layer 206 (also referred to as an inner glass layer). In some embodiments, the laminated glass panel 106 includes one or more additional layers above and / or below the outer glass layer 204 and / or the inner glass layer 206. For example, the laminated glass panel 106 may include one or more layers (not separately shown) for anti-reflection, solar comfort, auto-tinting, and / or general appearance. In some embodiments, the laminated glass panel 106 includes a bonding layer 208 (also referred to as an optical bonding layer). In some embodiments, the display unit 202 is laminated between the outer glass layer 204 and the inner glass layer 206 within the bonding layer 208 (as shown).

[0034] The material composition of the outer glass layer 204, the inner glass layer 206, and the bonding layer 208 (collectively referred to as the laminating layer) is not meant to be particularly limited and will vary depending on the needs of the corresponding application (e.g., the desired structural, thermal and optical properties of the laminated glass panel 106, etc.). In some embodiments, for example, the bonding layer 208 can be made of a plastic interlayer material, such as a polyvinyl butyral (PVB) film. In some embodiments, the outer glass layer 204 and the inner glass layer 206 are made of glass, polycarbonate (PC) materials, acrylic materials (such as polymethyl methacrylate (PMMA)), thermoplastics (such as thermoplastic polyurethane (TPU)) and / or glass ceramic materials (such as soda-lime-silica glass ceramics, aluminosilicate glass ceramics, lithium aluminosilicate glass ceramics, spinel glass ceramics, and β-quartz glass ceramics).

[0035] The thickness of each laminate layer of the laminated glass panel 106 is not meant to be particularly limited and will vary depending on the needs of the respective application (e.g., desired structural, thermal and optical properties, etc.). In some embodiments, for example, the outer glass layer 204, the inner glass layer 206, and the bonding layer 208 are each formed to a thickness of 1 to 100 microns or more (e.g., the layers may be several inches thick if desired).

[0036] During the glass-PVB lamination process, the display unit 202 can be laminated between the lamination layers of the laminated glass panel 106. In some embodiments, the display unit 202, the outer glass layer 204, the inner glass layer 206, and the bonding layer 208 (e.g., PVB film) are heat sealed under pressure to laminate the final structure (i.e., the laminated glass panel 106). In some embodiments, the display unit 202 can be made of the same or less thickness than the bonding layer 208. In some embodiments, the display unit 202 is placed in a cutout in the bonding layer 208 before the glass / PVB / glass lamination process. In some embodiments, the display unit 202 is directly embedded in the bonding layer 208 before the glass / PVB / glass lamination process (as shown).

[0037] In some embodiments, lamination involves a pressure of 1000 Nm at kg-f / cm 2 The laminated glass panel 106 may be heated (e.g., at a temperature greater than 100 degrees Celsius) and quenched in an autoclave at a pressure of 100°C or more, but other lamination conditions (temperature, pressure, etc.) are within the contemplated scope of the present disclosure. In some embodiments, the laminated glass panel 106 may be formed to a total post-lamination thickness of 0.1 mm to 10 mm or more (e.g., 0.3 mm, 0.7 mm, 2 mm, one inch, several inches, etc.), depending on the application and design goals.

[0038] Turning now to display units 202, in some embodiments, display units 202 each include micro-LEDs 210 electrically coupled to dedicated drive circuits 212 (i.e., micro-ICs). In some embodiments, micro-LEDs 210 each include a single LED element. In some embodiments, micro-LEDs 210 each include multiple micro-LED elements (as shown). For example, in some embodiments, each of micro-LEDs 210 includes a red micro-LED element 214, a green micro-LED element 216, and a blue micro-LED element 218.

[0039] The display 108 is shown with a specific number of display units 202 (here, six) and a specific configuration of micro-LEDs 210 (here, each micro-LED has three elements, each element having a different color) for ease of discussion and illustration only. However, it should be understood that the number, size, configuration, orientation, centerline-to-centerline spacing, etc. of the display units 202 may vary as needed for a given display application. Similarly, the number, size, configuration, orientation, centerline-to-centerline spacing, etc. of the elements of the micro-LEDs 210 (e.g., red micro-LED elements 214, green micro-LED elements 216, and blue micro-LED elements 218) may vary as needed for a given display application. For example, the micro-LEDs 210 may include two or more elements of the same color (e.g., blue) and one element of another color (e.g., red, red and green, yellow, etc.). In addition, the micro-LEDs 210 do not necessarily each include the same number of elements. For example, some of micro-LEDs 210 may include a first number of elements (e.g., 1, 2, 3, 4, 10, etc.), while some of micro-LEDs 210 may include a second (or third, etc.) number of elements (e.g., 1, 2, 3, 4, 10, etc.) All of these configurations are within the contemplated scope of the present disclosure.

[0040] Depending on the desired emission color of the corresponding micro-LED, the micro-LED 210 can be formed from a range of known suitable materials, such as semiconductor materials (e.g., silicon, gallium nitride, indium gallium nitride, etc.) and sapphire. For example, gallium nitride (GaN) for blue LEDs, indium gallium nitride (InGaN) for green LEDs, and aluminum gallium indium phosphide (AlGaInP) for red LEDs. In some embodiments, the micro-LED 210 includes several stacked layers, such as indium gallium nitride / gallium nitride (InGaN / Gan) stacks formed on silicon or sapphire substrates to produce blue and green devices.

[0041] In some embodiments, one or more of the micro-LEDs 210 are formed on a surface of a dedicated driver circuit 212. In some embodiments, the driver circuit 212 may include internal electrical connections and components (not separately shown) configured to individually control a corresponding one of the micro-LEDs 210 using electrical signals. For example, the driver circuit 212 may control a corresponding one of the micro-LEDs 210 by selectively delivering a driving voltage to the micro-LEDs 210.

[0042] In some embodiments, one or more of the driver circuits 212 include an internally integrated thermal sensor (not separately shown). In some embodiments, the thermal sensor is configured to measure / monitor the LED junction temperature of the corresponding micro-LED 210. In some embodiments, the driver circuit 212 is configured to gate, limit and / or otherwise throttle the drive voltage to the micro-LED 210 in response to the LED junction temperature reaching a predetermined thermal limit (e.g., 80 degrees Celsius, 120 degrees Celsius, etc.).

[0043] In some embodiments, each driver circuit 212 is communicatively coupled to a controller 220. In some embodiments, the controller 220 is configured to individually direct the driver circuits 212 to selectively activate their respective micro-LEDs 210, thereby producing a desired image or pattern (see Figure 1 ). Although not meant to be particularly limiting, in some embodiments, controller 220 may include, for example, an electronic control unit (ECU) of vehicle 100. In some embodiments, controller 220 and / or driver circuit 212 may override the activation signal when, for example, the LED junction temperature exceeds a threshold, as previously described.

[0044] In some embodiments, the display unit 202 is mounted, formed, or otherwise coupled directly to a bus line 222 integrated into one or both of the outer glass layer 204 and the inner glass layer 206 (as shown, coupled to the surface of the inner glass layer 206). In some embodiments, the bus line 222 is an electrical / conductive line and / or printed wiring layer that is directionally embedded in one or both of the outer glass layer 204 and the inner glass layer 206. Fig. 6A , Figure 6B and Figure 6C Bus line 222 is discussed in more detail.

[0045] Figure 3 According to one or more embodiments, Figure 2 An alternative configuration of the laminated glass panel 106 is shown. Figure 3 The laminated glass panel 106 shown includes one or more sensor units 302 dispersed in the display unit 202. The laminated glass panel 106 can be used in conjunction with the display unit 202 to provide a sense of the present invention. Figure 2Made in a similar manner as discussed. Figure 3 An embodiment is depicted in which the sensor unit 302 and the display unit 202 are positioned along the same glass layer (as shown, on the surface of the inner glass layer 206).

[0046] In some embodiments, the sensor units 302 each include a microsensor 304 electrically coupled to a dedicated drive circuit 306 (i.e., a micro IC). In some embodiments, the drive circuit 306 may include internal electrical connections and components (not separately shown) configured to individually control and communicate with a corresponding one of the microsensors 304 using electrical signals. For example, the drive circuit 306 may receive in-plane communication data from the microsensor 304.

[0047] In-plane communication refers to the ability of the microsensor 304 to transmit data or signals through the glass surface (i.e., through the layers of the laminated glass panel 106) without blocking the view through the glass. By integrating the microsensor 304 within the laminated glass panel 106, the outer surface of one or both of the outer glass layer 204 and the inner glass layer 206 can act as an interactive display, a touch-sensitive interface, and / or even a transparent communication channel.

[0048] In some embodiments, one or more smart glass applications utilize the data collected by the microsensors 304 to dynamically adjust various properties of the laminated glass panel 106, such as transparency, tinting, and reflectivity, based on user preferences and / or sensed environmental conditions. Notably, integrating the microsensors 304 in this manner enables greater privacy control, energy efficiency, and enhanced user interaction. In particular, bidirectional communication is also achievable by mounting the microsensors 304 on a combination of the upper or lower glass surfaces, depending on the desired sensing area (see Figure 4 ).

[0049] The micro sensor 304 may include a range of sensing capabilities. Although not meant to be an exhaustive list, the micro sensor 304 may include a touch sensor, a proximity sensor, a light sensor, a temperature sensor, a humidity sensor, a motion sensor, and a microphone.

[0050] Micro touch sensors can be used to implement touch input on the glass surface. These sensors detect the touch of a finger or stylus and convert it into a corresponding input command. In some embodiments, the touch sensor is a capacitive touch sensor that measures the change in capacitance when a conductive object (such as a finger) contacts the glass surface.

[0051] Proximity sensors detect the presence or absence of objects in close proximity to glass surfaces. These sensors transmit and receive signals such as infrared light or electromagnetic fields to determine the distance between the sensor and the corresponding object. Proximity sensors can enable, for example, automatic activation or deactivation of one or more vehicle features based on the presence or absence of a user (driver, passenger, etc.), such as automatic dimming of windows or locking, unlocking, opening and closing of automatic doors.

[0052] A twilight sensor measures ambient light levels and enables, for example, automatic adjustment of display brightness or other environmental factors. A light sensor can enable improved visibility and power efficiency by dynamically adapting one or more external systems (cabin lights, HUD brightness, etc.) to ambient lighting conditions. A light sensor can enable, for example, automatic headlight control, adaptive displays, and glare reduction.

[0053] Tiny temperature sensors embedded in glass can provide precise temperature measurements. These sensors enable, for example, adaptive climate control systems, thermal monitoring, and temperature-sensitive glass surfaces, and can greatly improve driver and passenger comfort.

[0054] Micro humidity sensors measure the moisture content in the surrounding environment. These sensors can, for example, enable automatic adjustments to customer control systems to maintain desired conditions.

[0055] The micro motion sensors detect movement or change in position. These sensors can enable gesture recognition interfaces for smart and interactive displays. For example, the micro motion sensors can enable touchless, hands-free control and gesture-based interaction with a smart display (e.g., laminated glass panel 106).

[0056] Figure 4 According to one or more embodiments, Figure 2 Another alternative configuration of the laminated glass panel 106 is shown in FIG. Figure 4 The laminated glass panel 106 shown includes one or more sensor units 302 dispersed in the display unit 202. The laminated glass panel 106 can be used in conjunction with the display unit 202 to provide a sense of the present invention. Figure 2 Made in a similar manner as discussed. Figure 4 An embodiment is depicted where the sensor unit 302 and the display unit 202 are positioned along opposing glass surfaces.

[0057] As shown, the display unit 202 is on the surface of the inner glass layer 206, and the sensor unit 302 is on the surface of the outer glass layer 204. Alternatively, in some embodiments, the sensor unit 302 may be formed on the surface of the inner glass layer 206, and the display unit 202 may be formed on the surface of the outer glass layer 204 (not shown separately). Alternatively, in some embodiments, the sensor unit 302 and the display unit 202 may be formed on a combination of the surfaces of the inner glass layer 206 and the outer glass layer 204 (not shown separately). It is worth noting that bidirectional communication is achievable by mounting the micro sensor 304 on a combination of the upper glass surface or the lower glass surface, depending on the desired sensing area.

[0058] Figure 5 According to one or more embodiments, Figure 2 Another alternative configuration of the laminated glass panel 106 is shown. The laminated glass panel 106 can be configured in the same manner as described above. Figure 2 The same method as discussed above is used except that Figure 5 In the illustrated laminated glass panel 106 , the display unit 202 is formed in the color shifting layer 502 .

[0059] In some embodiments, color shifting layer 502 is made of a material selected to shift the natural emission color from micro LEDs 210 to a color specified by the material. For example, in some embodiments, color shifting layer 502 includes a phosphor (eg, a red phosphor, a yellow phosphor, etc.).

[0060] The red phosphor may be used to convert blue light or ultraviolet (UV) light emitted by the micro LED 210 into red light. The red phosphor may include, for example, compounds of rare earth elements such as europium-doped yttrium vanadate (YVO4:Eu), europium-doped yttrium oxide (Y2O3:Eu), yttrium aluminum garnet (YAG:Eu), yttrium aluminum borate (YAB:Eu), and yttrium orthovanadate (YVO4:Eu).

[0061] The green phosphor is used to convert blue light or UV light emitted by the micro LED 210 into green light. The green phosphor generally includes a rare earth element, such as terbium (Tb) or europium (Eu), combined with other compounds to achieve a desired emission wavelength.

[0062] The blue phosphor is used to convert the UV light emitted by the micro LED 210 into blue light. The blue phosphor may include a cerium (Ce) activated compound, such as cerium doped yttrium aluminum garnet (YAG:Ce). The blue phosphor absorbs UV light and emits blue light through a process called photoluminescence.

[0063] The yellow phosphor is used to convert blue light or UV light emitted by the micro LED 210 into yellow light. The yellow phosphor may include a rare earth element such as Ce, Tb, or Y in combination with other compounds.

[0064] The orange phosphor is used to convert blue light or UV light emitted by the micro LED 210 into orange light. The orange phosphor may include Eu and Tb and other co-activators (eg, Ce and strontium (Sr)).

[0065] The cyan phosphor is used to convert blue light or UV light emitted by the micro LED 210 into cyan light. The cyan phosphor may include Tb and Eu and other compounds (eg, gadolinium (Gd), aluminum (Al), silicon (Si), oxygen (O), etc.).

[0066] The white phosphor is used to convert the blue light or UV light emitted by the micro LED 210 into white light. The white phosphor may include a blend of red, green and blue (RGB) phosphors or a combination of blue and yellow phosphors. Alternatively or additionally, white light may be provided by using a combination of a blue LED and a yellow phosphor.

[0067] In some embodiments, the color shift layer 502 is mounted, embedded and / or otherwise formed in the patterned protective layer 504. Although not intended to be particularly limited, depending on the application, the patterned protective layer 504 may include optically transparent and / or opaque bonding materials, such as PC, PMMA, transparent polyethylene terephthalate (PET) film, and transparent conductive oxide (TCO). In some embodiments, the patterned protective layer 504 may also include an optically reflective material to improve lighting efficiency. Such materials may include, for example, epoxy resin, silicon and / or other optically reflective materials.

[0068] Fig. 6A A process 600 for forming a laminated glass panel 106 is shown according to one or more embodiments. The process 600 begins at step 601, where a first glass layer (e.g., one of the outer glass layer 204 and the inner glass layer 206) of the laminated glass panel 106 is formed and / or received from an upstream process. In some embodiments, the surface of the display area 602 of the glass is prepared for a bus wiring module. In some embodiments, preparing the glass surface may include cleaning and polishing the surface, marking wiring paths, sanding, and / or heating.

[0069] At step 604, one or more bus lines 222 are built directly into the first glass layer. In some embodiments, the bus lines 222 are electrical / conductive lines and / or printed wiring layers. In some embodiments, a combination of masking and etching techniques can be used to install the conductive traces and / or wires that make up the bus lines 222. Masking generally involves applying a protective material to the areas of the first glass layer where the bus lines will not be formed, while etching involves selectively removing material (glass or conductive traces / wires) after deposition to define the areas where the bus lines 222 will be embedded. In some embodiments, forming the bus lines 222 includes depositing or forming a conductive material onto a prepared glass surface within the patterned areas of the mask. The deposition process can include, for example, three-dimensional (3D) printing, screen printing, sputtering, electroplating, etc. In some embodiments, the conductive material can be a metal (e.g., silver, gold, or copper), a conductive polymer, or a combination thereof, depending on the desired electrical properties, but any conductive material is within the intended scope of the present disclosure. In some embodiments, after the bus lines 222 are built, the first glass layer is subjected to a curing and / or firing process to solidify and / or complete the bonding process.

[0070] At step 606, one or more display units 202 are mounted onto the bus lines 222 and the first glass layer. As previously discussed, the display units 202 may include micro IC integrated micro LEDs having electrical connections to dedicated drive circuits 212 (see FIG. Figures 2 to 5 ) of the micro-LED 210. In some embodiments, one or more sensor units 302 are mounted to the bus line 222 and the first glass layer. As previously discussed, the sensor unit 302 may include a micro-IC integrated micro-sensor having a micro-sensor 304 electrically coupled to a dedicated drive circuit 306 (see FIG. Figure 3 and Figure 4 ).

[0071] After step 606, the laminated glass panel 106 can be completed as previously described. For example, another glass layer (eg, the other of the outer glass layer 204 and the inner glass layer 206) and the bonding layer 208 can be laminated with the first glass layer to define the laminated glass panel 106.

[0072] The bus lines 222 are shown as having a particular arrangement (here, as a matrix of rows and columns), for example and only to facilitate discussion. It should be understood that the bus lines 222 may be arranged, positioned, and / or otherwise configured anywhere within and / or on the laminated glass panel 106 as desired. All such configurations are within the intended scope of the present disclosure. For example, Figure 6BAn alternative layout 650 of the bus line 222 is shown according to one or more embodiments. As shown, the bus line 222 may be arranged as a plurality of curved lines. Figure 6C Another alternative layout 660 of bus lines 222 according to one or more embodiments is shown. As shown, bus lines 222 can be arranged in a cross-hatched pattern. Although bus lines 222 are shown as being distributed in a single layer for ease of illustration and discussion, in some embodiments, one or more of bus lines 222 can be formed in layers above and / or below bus line 222. That is, bus lines 222 can be formed across multiple bus line layers. Forming bus lines 222 in multiple layers can prevent electrical interference.

[0073] Figure 7 Various aspects of an embodiment of a computer system 700 are shown that can perform various aspects of the embodiments described herein. In some embodiments, the computer system 700 can be incorporated into or combined with a micro-LED display (e.g., display 108), a driver circuit (e.g., driver circuit 212, driver circuit 306), and / or a controller (e.g., controller 220). The computer system 700 includes at least one processing device 702, which generally includes one or more processors for performing a variety of functions (e.g., controlling a drive voltage to one or more of the micro-LEDs 210 of the display 108). More specifically, the computer system 700 may include the logic necessary to direct the driver circuit 212 to activate or deactivate individual micro-LEDs 210 or any subset of micro-LEDs 210 of the display 108. In addition, the computer system 700 may include the logic necessary to perform the sensing functions of the sensor unit 302.

[0074] Components of computer system 700 include a processing device 702 (such as one or more processors or processing units), a system memory 704, and a bus 706 that couples various system components including system memory 704 to processing device 702. System memory 704 may include various computer system readable media. Such media may be any available media that can be accessed by processing device 702, and includes both volatile and non-volatile media, as well as removable and non-removable media.

[0075] For example, system memory 704 includes non-volatile memory 708, such as a hard drive, and may also include volatile memory 710, such as random access memory (RAM) and / or cache memory. Computer system 700 may also include other removable / non-removable, volatile / non-volatile computer system storage media.

[0076] The system memory 704 may include at least one program product having a set (e.g., at least one) of program modules configured to perform the functions of the embodiments described herein. For example, the system memory 704 stores various program modules that generally perform the functions and / or methods of the embodiments described herein. One or more modules 712, 714 may be included to perform functions related to the control of the display 108, such as determining a target image based on onboard, environmental, preprogrammed, or external data and directing the display 108 (via, for example, the driver circuit 212) to drive one or more of the micro-LEDs 210 to produce the target image. The computer system 700 is not limited thereto, as other modules may be included depending on the desired functionality of the corresponding display. As used herein, the term "module" refers to a processing circuit, which may include an application specific integrated circuit (ASIC), an electronic circuit, a (shared, dedicated, or group) processor and memory that executes one or more software or firmware programs, a combinational logic circuit, and / or other suitable components that provide the described functionality. For example, a module may be configured via software, hardware, and / or firmware to cause a display (display 108) to display an image, such as, for example, a vehicle status or driver and / or passenger communications.

[0077] The processing device 702 may also be configured to communicate with one or more external devices 716, such as a keyboard, pointing device, and / or any device that enables the processing device 702 to communicate with one or more other computing devices (e.g., a network card, a modem, a vehicle ECU, etc.). Communication with various devices may occur via input / output (I / O) interfaces 718 and 720.

[0078] The processing device 702 may also communicate with one or more networks 722 (such as a local area network (LAN), a general wide area network (WAN), a bus network, and / or a public network (e.g., the Internet)) via a network adapter 724. In some embodiments, the network adapter 724 is or includes an optical network adapter for communicating over an optical network. It should be understood that, although not shown, other hardware and / or software components may be used in conjunction with the computer system 700. Examples include, but are not limited to, microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, and data archival storage systems, among others. In some embodiments, the computer system 700 and / or the processing device 702 may receive information from one or more micro sensors (e.g., sensor unit 302), analyze the information, and send the information (raw, pre-processed, and / or post-processed) to one or more LEDs (e.g., micro LEDs 210) and / or any other component of the vehicle 100.

[0079] Reference now Figure 8, a flow chart 800 is generally shown for integrating micro-integrated circuits with micro-light emitting diodes in a laminated glass assembly according to one embodiment. Figures 1 to 7 Flowchart 800 is described and may include Figure 8 Although depicted in a particular order, Figure 8 The blocks depicted in the drawings may be rearranged, subdivided, and / or combined.

[0080] At block 802 , the method includes forming one or more first glass layers.

[0081] At block 804 , the method includes forming one or more bus lines on the one or more first glass layers.

[0082] At block 806, the method includes forming a display unit on one or more bus lines. The display unit includes a micro IC having a drive circuit and a micro LED on a surface of the drive circuit. In some embodiments, a plurality of micro LEDs are formed on the surface of the drive circuit.

[0083] At block 808, the method includes forming a bonding layer over the display unit and the one or more first glass layers. In some embodiments, the display unit is embedded in the bonding layer of the laminated glass assembly.

[0084] At block 810, the method includes forming one or more second glass layers over the bonding layer. In some embodiments, the method also includes forming a sensor unit embedded in the laminated glass panel. In some embodiments, the one or more first glass layers include one or more embedded micro sensor units. In some embodiments, the one or more second glass layers include one or more embedded micro sensor units. The sensor unit may include a micro IC having a drive circuit and a micro sensor on a surface of the drive circuit. Embedding the micro sensor in the second glass layer may enable bidirectional communication.

[0085] At block 812 , the method includes laminating one or more first glass layers, a bonding layer, and one or more second glass layers to define a laminated glass assembly.

[0086] In some embodiments, the method further comprises forming a color shift layer between the bonding layer and one of the first glass layer and the second glass layer. In some embodiments, the color shift layer is located within the patterned protective layer. In some embodiments, the display unit is embedded within the color shift layer.

[0087] The terms "a" and "an" do not indicate a limitation of quantity, but rather indicate the presence of at least one of the referenced item. Unless the context clearly indicates otherwise, the term "or" means "and / or". References to "aspects" throughout the specification mean that a particular element (e.g., a feature, structure, step, or characteristic) described in conjunction with that aspect is included in at least one aspect described herein, and may or may not be present in other aspects. In addition, it should be understood that the described elements may be combined in any suitable manner in the various aspects.

[0088] When an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present.

[0089] Unless stated to the contrary herein, all test standards are the most current standards in effect as of the filing date of this application or, if priority is claimed, the filing date of the earliest priority application in which the test standards appear.

[0090] Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs.

[0091] Although the above disclosure has been described with reference to exemplary embodiments, it will be appreciated by those skilled in the art that various changes may be made and equivalents may be substituted for its elements without departing from its scope. In addition, many modifications may be made to adapt specific circumstances or materials to the teachings of the disclosure without departing from the basic scope of the disclosure. Therefore, it is intended that the disclosure is not limited to the specific embodiments disclosed, but will include all embodiments falling within its scope.

Claims

1. A vehicle comprising: A laminated glass panel comprising an outer glass layer, an inner glass layer, and a bonding layer between the outer glass layer and the inner glass layer; A display unit is embedded in the laminated glass panel, and comprises: a micro-integrated circuit (IC) including a driver circuit; and a micro-light emitting diode (LED) on a surface of the drive circuit; and A controller is electrically coupled to the display unit, the controller being configured to direct the drive circuit to deliver a drive voltage to the micro LEDs. 2 . The vehicle of claim 1 , further comprising a bus line formed directly in at least one of the outer glass layer and the inner glass layer, wherein the display unit is formed on the bus line. 3 . The vehicle of claim 1 , wherein the display unit is embedded within a bonding layer of the laminated glass panel.

4. The vehicle of claim 1 further comprising a color shifting layer between the tie layer and the inner glass layer. The vehicle of claim 4 , wherein the color shifting layer is located within a patterned protective layer. The vehicle of claim 4 , wherein the display unit is embedded within the color shifting layer.

7. The vehicle of claim 4, wherein the color shifting layer comprises a phosphor material selected to shift a native emission color of the micro-LEDs to another color.

8. The vehicle of claim 1, further comprising a sensor unit embedded in the laminated glass panel, the sensor unit comprising: a micro IC including a driving circuit; as well as A micro sensor is located on the surface of the driving circuit. 9 . The vehicle according to claim 8 , wherein the display unit and the sensor unit are formed on the same surface of the laminated glass panel. 10 . The vehicle according to claim 8 , wherein the display unit and the sensor unit are formed on opposite surfaces of the laminated glass panel.

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