Resin molding device and method for manufacturing resin molded article

Abstract

The invention provides a resin molding device which can take out a molding object accommodated in a conveying member and perform resin molding. The resin molding apparatus of the present invention comprises: a take-out mechanism for taking out a molded object from a transport member in which the molded object is housed; a first molded object transport mechanism that transports the molded object taken out from the transport member to a molding die; a transport member accommodating part capable of accommodating the transport member from which the object to be molded has been taken out; a transport member transport mechanism that transports the transport member from which the object to be molded has been taken out to the transport member storage unit; a mold clamping mechanism for clamping the molding mold on which the object to be molded has been conveyed to perform resin molding; a second object-to-be-molded transport mechanism that transports the molded object from the molding die; and an object-to-be-molded accommodating mechanism that accommodates the object to be molded, which has been moved out of the molding die, to the transport member accommodated in the transport member accommodating unit.

Description

Technical Field

[0001] The present invention relates to a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] Generally, there is known a technique of collectively conveying a plurality of molding objects such as circuit boards by placing them in a conveying member. In addition, Patent Document 1 discloses a technique of performing a molding process while placing a plurality of circuit boards in a conveying member called a boat.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Korean Patent Publication No. 10-2016-0081289 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In the technology described in Patent Document 1, in the molding process, a conveying member containing a plurality of molding objects is supplied to a molding die to perform resin molding. Therefore, since the conveying member must be contained in the molding die, the molding die may be enlarged. Moreover, in the technology described in Patent Document 1, the molding object is indirectly aligned with respect to the molding die by aligning the conveying member with respect to the molding die. Therefore, the position accuracy of the molding object with respect to the molding die may be reduced. Therefore, a technology is being sought that can take out the molding object contained in the conveying member for resin molding and then contain the molding object again in the conveying member.

[0008] The present invention is completed in view of the above-mentioned situation, and the problem to be solved is to provide a resin molding device and a method for manufacturing a resin molded product, which can take out a molding object accommodated in a conveying member for resin molding, and then accommodate the molding object in the conveying member again.

[0009] Technical means of solving problems

[0010] The problem to be solved by the present invention is as described above. In order to solve the above problem, the resin molding device of the present invention includes: a removal mechanism for removing the molding object from a conveying member that accommodates the molding object; a first molding object conveying mechanism for conveying the molding object taken out from the conveying member to a molding mold; a conveying member accommodating portion that can accommodate the conveying member from which the molding object has been taken out; a conveying member conveying mechanism for conveying the conveying member from which the molding object has been taken out to the conveying member accommodating portion; a clamping mechanism for clamping the molding mold from which the molding object has been conveyed to perform resin molding; a second molding object conveying mechanism for conveying the molding object after molding from the molding mold; and a molding object accommodating mechanism for accommodating the molding object taken out from the molding mold into the conveying member accommodated in the conveying member accommodating portion.

[0011] Moreover, the manufacturing method of the resin molded product of the present invention uses the resin molding device, and the manufacturing method of the resin molded product includes: a removal process, taking out the molding object from the conveying member; a molding object conveying process, conveying the molding object taken out by the removal process to the molding mold; a conveying member conveying process, conveying the conveying member from which the molding object has been taken out; a resin molding process, resin molding the molding object conveyed to the molding mold by the molding object conveying process; and a molding object accommodation process, accommodating the molding object that has been resin molded by the resin molding process into the conveying member conveyed by the conveying member conveying process.

[0012] Effects of the Invention

[0013] According to the present invention, the molding object accommodated in the conveying member can be taken out, resin-molded, and then the molding object can be accommodated in the conveying member again. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] [ Figure 1 ] is a plan view showing the overall structure of a resin molding device according to one embodiment.

[0015] [ Figure 2 ](a) is a three-dimensional view showing a carrier and a substrate. (b) is a plan view showing a carrier and a substrate.

[0016] [ Figure 3 ](a) is a partial front cross-sectional view showing a state where a substrate is held by suction by a take-out mechanism. (b) is a partial front cross-sectional view showing a state where a substrate is held by a clamp of the take-out mechanism. (c) is a front view showing a state where a substrate is placed on a substrate arrangement stage.

[0017] [ Figure 4 ] is a side view showing the substrate arrangement carrier and the loader.

[0018] [ Figure 5 ] is a side view showing the carrier transport unit and the carrier transfer portion.

[0019] [ Figure 6 ] (a) is a side view showing a carrier storage portion. (b) is a side view showing a carrier being lifted. (c) is a side view showing a carrier being placed on a rotation support portion.

[0020] [ Figure 7 ] is a flow chart showing a method for manufacturing a resin molded product.

[0021] [ Figure 8 ] is a plan view showing the transportation of a substrate and a carrier until resin molding is performed.

[0022] [ Fig. 9 ] is a plan view showing the substrate after resin molding and the transportation of the carrier.

[0023] [ Fig.10 ] (a) is a plan view showing the state of the loader retreating to the retreat position. (b) is a plan view showing the arrangement order of the substrates on the substrate arrangement stage.

[0024] [ Fig.11 ] is a side view showing a modified example of the carrier storage portion. DETAILED DESCRIPTION

[0025] In the following, the directions indicated by arrows U, D, L, R, F, and B shown in the drawings are defined as upward, downward, left, right, forward, and backward directions, respectively.

[0026] <Overall Structure of Resin Molding Device 1>

[0027] First, use Figure 1 The structure of the resin molding device 1 of this embodiment is described. The resin molding device 1 is a device for resin-sealing electronic components such as semiconductor chips (hereinafter referred to as "chips") to manufacture resin molded products. In particular, in this embodiment, the resin molding device 1 that performs resin molding using the transfer molding method is exemplified.

[0028] The resin molding device 1 includes, as components, a supply module A, a resin molding module B, and a carry-out module C. Each component is detachable and replaceable with respect to other components.

[0029] <Supply module A>

[0030] The supply module A supplies the substrate 2 for fixing the chip and the cylindrical resin ingot T to the resin molding module B. In addition, the substrate 2 is an embodiment of the molding object of the present invention. As the substrate 2, various substrates (lead frame, epoxy glass substrate, ceramic substrate, resin substrate, metal substrate, etc.) can be used. The supply module A mainly includes a carrier loading unit 11, a substrate arrangement stage 12, a take-out mechanism 30, a carrier stage 13, a loader 40, a carrier transport unit 50, a carrier transfer unit 60, a first camera 14 and a control unit 15.

[0031] The carrier carrying-in part 11 is a part where the carrier 3 carried in from the outside to the supply module A is arranged. The carrier carrying-in part 11 can receive the carrier 3 containing the substrate 2 and place it on the upper surface.

[0032] Here, use Figure 2 The substrate 2 and the carrier 3 that can accommodate the substrate 2 are described. The carrier 3 is a member that can accommodate the substrate 2. In addition, the carrier 3 is an embodiment of the conveying member of the present invention. The carrier 3 is formed in a substantially rectangular plate shape. The carrier 3 is provided with a through hole 3a, a pin 3b and a code 3c.

[0033] The through hole 3a is formed in a manner of penetrating the carrier 3. The through hole 3a is formed in a manner of arranging three of them along the long side direction of the carrier 3. The pin 3b is used to position the substrate 2 accommodated in the carrier 3. The pin 3b is formed in a manner of protruding upward from the surface (upper surface) of the carrier 3. A plurality of pins 3b are provided in a manner of surrounding the through hole 3a. By accommodating the substrate 2 inside the pin 3b, the substrate 2 can be arranged at a position facing the through hole 3a. The carrier 3 of this embodiment can accommodate three substrates 2.

[0034] A code 3c is provided on the upper surface of the carrier 3. The code 3c is an identifier indicating information that can identify the carrier 3. As the code 3c, for example, a barcode or a two-dimensional code can be used.

[0035] A code 2a is provided on the upper surface of the substrate 2. The code 2a is an identifier indicating information that can identify the substrate 2. As the code 2a, a two-dimensional code or the like can be used similarly to the code 3c of the carrier 3.

[0036] Figure 1 The substrate arrangement stage 12 shown is a portion for placing the substrate 2 taken out from the carrier 3. The substrate arrangement stage 12 is an embodiment of the mounting portion of the present invention. The substrate arrangement stage 12 can arrange and place a plurality of substrates 2 on the upper surface. In this embodiment, on the substrate arrangement stage 12, three rows are arranged in the front-to-back direction and two rows are arranged in the left-to-right direction, so that a total of six substrates 2 are arranged (see Fig.10(b)). The arrangement of the substrates 2 in the substrate arrangement stage 12 corresponds to the arrangement of the substrates 2 in the molding die 16 described later. That is, the molding die 16 of this embodiment can perform resin molding on six substrates 2 at a time. The substrate arrangement stage 12 is arranged behind the carrier loading unit 11.

[0037] The take-out mechanism 30 takes out the substrate 2 from the carrier 3 of the carrier loading unit 11 and arranges it on the substrate arrangement stage 12. Figure 3 As shown, the taking-out mechanism 30 mainly includes a suction holding portion 31 , a clamper 32 and a pressing portion 33 .

[0038] The adsorption holding part 31 adsorbs and holds the substrate 2 placed on the carrier loading part 11. The adsorption holding part 31 can adsorb the substrate 2 from below through the through hole 3a of the carrier 3. The adsorption holding part 31 can move up and down by a lifting mechanism (not shown). Thus, the adsorption holding part 31 can lift the adsorbed substrate 2 from the carrier 3 upward.

[0039] The clamper 32 holds and transports the substrate 2. The clamper 32 includes a pair of left and right members and a pair of front and rear members that are L-shaped in side view. The clamper 32 can hold the substrate 2 in a manner of clamping it from four directions, namely, left and right and front and rear. Furthermore, the clamper 32 can be moved by a moving mechanism (not shown).

[0040] The pressing portion 33 presses the substrate 2 held by the clamper 32 from above. The pressing portion 33 is disposed inside the clamper 32. The pressing portion 33 is placed on the substrate 2, and thereby can press the substrate 2 by its own weight.

[0041] When the substrate 2 is taken out from the carrier 3 of the carrier loading unit 11 by the taking-out mechanism 30, first Figure 3 As shown in (a), the substrate 2 is held by the adsorption holding portion 31. Figure 3 As shown in (b), the adsorption holding part 31 holding the target substrate 2 rises to lift the substrate 2. Next, the adsorption by the adsorption holding part 31 is released, and the substrate 2 is held by the clamper 32. Furthermore, the substrate 2 is pressed from above by the pressing part 33. Thus, the substrate 2 can be stably held by the clamper 32.

[0042] Next, if Figure 3 As shown in (c), the clamper 32 moves to the substrate arrangement stage 12 and releases the substrate 2 at a predetermined location. Thus, the substrate 2 can be placed on the substrate arrangement stage 12. By repeating this operation of the clamper 32, the substrate 2 can be taken out from the carrier 3 of the carrier loading unit 11 and arranged on the substrate arrangement stage 12.

[0043] Figure 1The carrier stage 13 shown is a portion where the carrier 3 from which the substrate 2 has been taken out is placed in the carrier carrying-in portion 11. The carrier stage 13 can place the carrier 3 transferred from the carrier carrying-in portion 11 on the upper surface.

[0044] The loader 40 transports the substrate 2 arranged on the substrate arrangement carrier 12 to the resin molding module B. Furthermore, the loader 40 receives and holds the resin ingot T from a resin supply device not shown in the figure, and transports it to the resin molding module B together with the substrate 2. Here, the loader 40 may receive either the substrate 2 or the resin ingot T first, and may also receive the substrate 2 and the resin ingot T at the same time. That is, the timing when the loader 40 receives the substrate 2 and the resin ingot T is not particularly limited. In addition, the loader 40 is one embodiment of the first molding object conveying mechanism of the present invention. The loader 40 is arranged at the rear portion of the resin molding device 1. The loader 40 can move left and right along the track X extending across the left and right ends of the resin molding device 1. As shown in FIG. Figure 4 As shown, the loader 40 mainly includes a body 41 , a head 42 and a clamper 43 .

[0045] The main body 41 is a main structural part of the loader 40. The main body 41 is configured to be able to move along the track X (see Figure 1 ) moves left and right. The main body 41 of this embodiment is formed so that the upper front portion extends forward in order to stably support the head 42 described later. The portion of the main body 41 extending forward overlaps the rear portion of the substrate arrangement stage 12 in the front-to-back direction.

[0046] The head 42 is a portion where a clamper 43 described later is provided. The head 42 is supported relative to the main body 41 so as to be movable forward and backward.

[0047] The clamper 43 holds and conveys the substrate 2. The clamper 43 is provided in a number corresponding to the plurality of substrates 2 arranged on the substrate arrangement stage 12. In the present embodiment, six clampers 43 are provided corresponding to six substrates 2.

[0048] When the substrate 2 on the substrate array stage 12 is transported to the resin molding module B by the loader 40, first, the loader 40 moves along the track X (see Figure 1 ) moves and stops behind the substrate arrangement stage 12. Next, Figure 4 As shown, the head 42 moves forward relative to the main body 41 so that the substrate 2 on the substrate arrangement stage 12 and the clamper 43 face each other vertically. Next, each clamper 43 holds the corresponding substrate 2, and the head 42 moves backward relative to the main body 41.

[0049] The loader 40 moves along the track X (see Figure 1) moves to the right, thereby conveying the substrate 2 to the resin molding module B. Furthermore, the loader 40 releases the holding of the substrate 2 on the molding die 16 of the resin molding module B, thereby conveying the substrate 2 to the molding die 16.

[0050] Although detailed description is omitted in the present embodiment, the loader 40 also carries the resin ingot T used for resin molding into the molding die 16 simultaneously with the substrate 2 .

[0051] Figure 1 The carrier transport unit 50 shown transports the carrier 3 arranged on the carrier platform 13 to the unloading module C. In addition, the carrier transport unit 50 is an embodiment of the transport component transport mechanism of the present invention. The carrier transport unit 50 is arranged at the rear part of the resin molding device 1. The carrier transport unit 50 can move left and right along the track X. In the present embodiment, the carrier transport unit 50 is configured to move left and right integrally with the loader 40. That is, at least in the moving area along the track X, the loader 40 and the carrier transport unit 50 can move together. As a result, the moving mechanism (not shown) for moving the loader 40 and the carrier transport unit 50 left and right can be shared. As Figure 5 As shown, the carrier transport unit 50 mainly includes a main body 51 , a movable stage 52 and a carrier placement portion 53 .

[0052] The main body 51 is a main structure of the carrier transport unit 50. The main body 51 is configured to be able to move along the track X (see Figure 1 ) to move left or right.

[0053] The movable stage 52 is a portion where a carriage placement portion 53 described later is provided. The movable stage 52 is provided on the upper portion of the main body portion 51. The movable stage 52 is supported relative to the main body portion 51 so as to be movable forward and backward.

[0054] The carrier placement portion 53 is a portion on which the carrier 3 received from the carrier stage 13 is placed. The carrier placement portion 53 is provided on the upper portion of the movable stage 52. In the present embodiment, two carrier placement portions 53 are arranged in a front-rear arrangement.

[0055] The carrier transfer unit 60 transfers the carrier 3 from the carrier stage 13 to the carrier transport unit 50. Figure 5 As shown, the carrier transfer unit 60 mainly includes a head 61 and an adsorption holding unit 62 .

[0056] The head 61 is a portion where an adsorption holding unit 62 described later is provided. The head 61 is supported so as to be movable by a moving mechanism (not shown).

[0057] The suction holding section 62 suctions and holds the carrier 3. The suction holding section 62 is provided at the lower part of the head 61.

[0058] When the carrier 3 on the carrier stage 13 is transported to the unloading module C by the carrier transport unit 50, first, the carrier transport unit 50 moves along the track X (see Figure 1 ) moves and stops behind the carrier platform 13. Next, Figure 5 As shown, the carrier 3 of the carrier stage 13 is held by the suction holding portion 62 of the carrier transfer portion 60 and placed on the carrier placement portion 53 of the carrier transport unit 50. At this time, the movable stage 52 moves forward and backward appropriately to move the carrier placement portion 53 to a position where the carrier 3 can be placed.

[0059] The carrier transport unit 50 moves along the track X (see FIG. 1 ) with the carriers 3 placed on the two carrier placement sections 53 . Figure 1 ) moves to the right, thereby transporting the carrier 3 to the unloading module C. The carrier 3 transported to the unloading module C is accommodated in a carrier accommodating portion 80 described later.

[0060] The first camera 14 is used to read the code 2a of the substrate 2 and the code 3c of the carrier 3. In addition, the first camera 14 is an embodiment of the reading unit and the first reading unit of the present invention. The first camera 14 is arranged in the supply module A at a position where the carrier 3 containing the substrate 2 can be photographed. In this embodiment, the first camera 14 is arranged at a position where the carrier 3 arranged in the carrier loading unit 11 can be photographed.

[0061] The control unit 15 controls the operation of each module of the resin molding device 1. The operation of the supply module A, the resin molding module B, and the unloading module C is controlled by the control unit 15. Moreover, the operation of each module can be arbitrarily changed (adjusted) using the control unit 15. In addition, the control unit 15 can manage the information of the substrate 2 and the carrier 3 acquired by the first camera 14 and the second camera 20 described later.

[0062] In addition, in this embodiment, an example in which the control unit 15 is provided in the supply module A is shown, but the control unit 15 may be provided in other modules. In addition, a plurality of control units 15 may be provided. For example, a control unit 15 may be provided corresponding to each module or each device, and the operations of each module, etc. may be controlled separately while being linked to each other.

[0063] <Resin molding module B>

[0064] The resin molding module B performs resin sealing on the chip fixed to the substrate 2. In the present embodiment, two resin molding modules B are arranged. The two resin molding modules B perform resin sealing on the substrate 2 in parallel, thereby improving the manufacturing efficiency of the resin molded product. The resin molding module B mainly includes a molding die 16 and a mold clamping mechanism 17.

[0065] The molding die 16 uses a molten resin material to resin-seal the chip fixed to the substrate 2. The molding die 16 includes a pair of upper and lower molds, namely, a lower mold and an upper mold. The molding die 16 is provided with a heating unit (not shown) such as a heater.

[0066] The mold clamping mechanism 17 moves the lower mold of the molding die 16 up and down to close or open the molding die 16 .

[0067] <Move out module C>

[0068] The unloading module C receives and unloads the resin-sealed substrate 2 from the resin molding module B. The unloading module C mainly includes an unloader 70 , a molded substrate arranging stage 18 , a carrier storage unit 80 , a carrier unloading unit 19 , a molding object storage mechanism 90 , and a second camera 20 .

[0069] The unloader 70 holds the substrate 2 sealed with resin in the resin molding module B and transports it to the molded substrate arrangement stage 18 of the unloading module C. In addition, the unloader 70 is an embodiment of the second molding object transporting mechanism of the present invention. The unloader 70 is arranged at the rear of the resin molding device 1. The unloader 70 can move left and right along the track X.

[0070] The molded substrate arrangement stage 18 is a portion on which the molded substrate 2 conveyed from the resin molding module B is placed. The molded substrate arrangement stage 18 can arrange and place a plurality of substrates 2 on the upper surface.

[0071] When the resin-sealed substrate 2 is transported to the unloading module C by the unloader 70, first, the unloader 70 moves along the track X to the resin molding module B, and adsorbs and holds the substrate 2 that has been resin-molded by the molding die 16. Next, the unloader 70 moves along the track X to the unloading module C, and arranges the molded substrate 2 on the molded substrate arrangement stage 18.

[0072] The carrier storage unit 80 stores the carrier 3 from which the substrate 2 has been taken out of the supply module A. In addition, the carrier storage unit 80 is an embodiment of the conveying member storage unit of the present invention. Figure 6 As shown, the carrier receiving portion 80 mainly includes a main body portion 81 , a rotation support portion 82 , a rotation connection portion 83 and a lifting portion 84 .

[0073] The main body 81 is a part of the main structure of the carrier storage unit 80. The main body 81 includes a plurality of pillars 81a arranged in a front-rear manner. Figure 6 Although not shown in the figure, a plurality of support columns 81a are arranged in a row in the depth direction of the paper. The main body 81 is formed into a frame shape with the lower side open by connecting the upper parts of the support columns 81a.

[0074] The rotation support part 82 is a part that supports the carrier 3. The rotation support part 82 is provided in a manner that protrudes from the front and rear pillars 81a toward the inner side of the main body part 81. The rotation support part 82 is connected to the pillar 81a via a rotation connection part 83 described later. A plurality of rotation support parts 82 are provided in a manner that is arranged at equal intervals in the vertical direction. The rotation support parts 82 provided on the front and rear pillars 81a are arranged in a manner that is located at corresponding positions (same height) to each other.

[0075] The rotation connection part 83 is a part that connects the rotation support part 82 so that it can rotate up and down relative to the support column 81a. The rotation connection part 83 supports the rotation support part 82 so that the rotation support part 82 can rotate freely from a state facing a substantially horizontal direction to a state facing a substantially vertical direction. As a result, the rotation support part 82 rotates downward due to its own weight in a state where no external force is applied to it and faces a substantially horizontal direction. In addition, when an upward external force is applied to the rotation support part 82, the rotation support part 82 can rotate upward.

[0076] The lifting portion 84 is used to place the carrier 3 on the rotation support portion 82. The lifting portion 84 includes pillars 84a arranged in a front-rear manner and support portions 84b provided so as to protrude inward from the front and rear pillars 84a. A plurality of support portions 84b are provided so as to be arranged at equal intervals in the vertical direction. The vertical intervals of the support portions 84b are formed to be the same as the vertical intervals of the rotation support portions 82 provided on the main body 81.

[0077] The lifting portion 84 can be moved relative to the main body 81 in the front-rear direction and the up-down direction by a driving mechanism (not shown). Figure 6 As shown in FIG. (a), the lifting portion 84 repeatedly performs the following series of actions, that is, horizontally moves until the support portion 84b protrudes to the inner side of the main body 81, moves upward in this state, and horizontally moves toward the outer side of the main body 81 and descends. In addition, the lifting portion 84 and the main body 81 are arranged in a manner that does not interfere with each other.

[0078] Furthermore, the carrier accommodating portion 80 can be moved as a whole in the front-rear direction and the up-down direction by a driving mechanism (not shown). Thus, the carrier accommodating portion 80 can be moved to a position where it is easy to accommodate the carrier 3. Specifically, Figure 6 As shown, the carrier storage portion 80 can be moved to a position facing the carrier placement portion 53 on which the carrier 3 is placed from above.

[0079] Figure 1The carrier unloading section 19 shown is a portion where the carrier 3 unloaded from the unloading module C to the outside is arranged. The carrier unloading section 19 can load the carrier 3 received from the carrier receiving section 80 on the upper surface. The carrier 3 loaded on the carrier unloading section 19 receives the formed substrate 2 by the formed object receiving mechanism 90 described later. The carrier 3 containing the formed substrate 2 is unloaded from the carrier unloading section 19 to the outside.

[0080] The molding object storage mechanism 90 stores the substrate 2 placed on the molded substrate arrangement stage 18 in the carrier 3 arranged in the carrier unloading section 19. The molding object storage mechanism 90 can be used together with the removal mechanism 30 (see Figure 3 ) Similarly, a mechanism is used that can hold and transport the substrate 2. In addition, a detailed description of the structure of the molding object storage mechanism 90 will be omitted.

[0081] The second camera 20 is used to read the code 2a of the formed substrate 2 and the code 3c of the carrier 3. In addition, the second camera 20 is an embodiment of the reading unit and the second reading unit of the present invention. The second camera 20 is arranged in the unloading module C at a position where the formed substrate 2 and the carrier 3 containing the formed substrate 2 can be photographed. In this embodiment, the second camera 20 is arranged at a position where the carrier 3 arranged in the carrier unloading unit 19 can be photographed.

[0082] <Overview of Operation of Resin Molding Device 1>

[0083] Below, use Figures 7 to 9 The operation of the resin molding apparatus 1 configured as described above (the method for manufacturing a resin molded product using the resin molding apparatus 1) will be described in general. Figure 8 as well as Fig. 9 The black arrows shown indicate the movement of the carrier 3. The hollow arrows indicate the movement of the substrate 2.

[0084] like Figure 7 As shown, the manufacturing method of the resin molded product of this embodiment mainly includes a loading step S1, a first reading step S2, a taking-out step S3, a conveying step S4, a resin molding step S5, a molded substrate taking-out step S6, a molding object storage step S7, a second reading step S8, and a carrying-out step S9. In addition, for the convenience of explanation, Figure 7 Although each process is described in sequence one by one, in reality, different processes may be performed simultaneously, or a specific process may be performed repeatedly for multiple times.

[0085] First, the loading step S1 is performed. The loading step S1 is a step of loading the carrier 3 from the outside into the resin molding apparatus 1. In the loading step S1, the carrier 3 containing the substrate 2 is loaded into the carrier loading section 11 of the supply module A (see Figure 8 ).

[0086] Next, the first reading process S2 is performed. The first reading process S2 is a process of reading the code 3c of the carrier 3 and the code 2a of the substrate 2 accommodated in the carrier 3. In the first reading process S2, the first camera 14 photographs the carrier 3 and the substrate 2 carried into the carrier carrying-in part 11. The control unit 15 reads the code 3c of the carrier 3 and the code 2a of the substrate 2 from the image photographed by the first camera 14 to identify the carrier 3 and the substrate 2. The control unit 15 stores the correspondence between the carrier 3 and the substrate 2 accommodated in the carrier 3 in association. That is, the control unit 15 stores which substrate 2 is accommodated in the carrier 3.

[0087] Next, the unloading step S3 is performed. The unloading step S3 is a step of unloading the substrate 2 from the carrier 3. In the unloading step S3, the unloading mechanism 30 unloads the substrate 2 from the carrier 3 of the carrier loading unit 11 and arranges the substrate 2 on the substrate arrangement stage 12 (see Figure 8 In the present embodiment, six substrates 2 can be arranged on the substrate arrangement stage 12 , and therefore a total of six substrates 2 are taken out from the two carriers 3 to the substrate arrangement stage 12 .

[0088] Here, the arrangement order of the substrate 2 on the substrate arrangement stage 12 in the removal step S3 is described. Figure 4 As shown in FIG. 1 , the main body 41 of the loader 40 is formed in a manner extending forward. Therefore, when the loader 40 is located behind the substrate arrangement stage 12, the removal mechanism 30 and the loader 40 may interfere with each other, and the substrate 2 may not be arranged at a position (rear) close to the loader 40 of the substrate arrangement stage 12. For example, in this embodiment, Figure 4 As shown, the arrangement position of the substrate 2 in the rearmost row of the three front and rear rows overlaps with the main body 41 of the loader 40, so when the substrate 2 is arranged in the rearmost row ( Fig.10 (b) (1) and (2)), the take-out mechanism 30 and the loader 40 may interfere with each other.

[0089] In addition, the present embodiment exemplifies the case where the main body 41 of the loader 40 overlaps with the substrate 2 . However, even when the loader 40 and the substrate 2 do not overlap, interference between the removal mechanism 30 and the loader 40 is expected.

[0090] Therefore, in the taking-out step S3, when the substrate 2 is taken out from the first carrier 3, Fig.10As shown in (a), the loader 40 retreats to a retreat position deviated to the right from the back of the substrate arrangement stage 12. In this state, the take-out mechanism 30 does not interfere with the loader 40. In this state, the take-out mechanism 30 takes the substrate 2 to the substrate arrangement stage 12.

[0091] At this time, the take-out mechanism 30 sequentially arranges the substrates 2 starting from the side (rear side) close to the loader 40. For example, in this embodiment, Fig.10 As shown in (b), the arrangement order (1) to (6) is set in sequence from the rear side of the substrate arrangement stage 12. That is, the three substrates 2 taken out from the first carrier 3 are arranged at positions (1) to (3). Thus, the substrates 2 can be arranged at positions (1) and (2) where the take-out mechanism 30 and the loader 40 may interfere with each other.

[0092] When the loader 40 retreats to a position offset to the right from the substrate array stage 12 , it receives the resin ingot T from a resin supply device (not shown). Thus, the retreat time is used as the time for receiving the resin ingot T, thereby improving production efficiency.

[0093] When three substrates 2 from the first carrier 3 are taken out to the substrate arrangement stage 12, the loader 40 and the carrier transfer unit 50 move to the left as a whole. Thus, the loader 40 moves to a position (behind the substrate arrangement stage 12) where the substrates 2 of the substrate arrangement stage 12 can be received, and the carrier transfer unit 50 moves to a position (behind the carrier stage 13) where the carrier 3 of the carrier stage 13 can be received.

[0094] Then, the first carrier 3 from which the substrate 2 has been taken out is moved from the carrier carrying-in portion 11 to the carrier stage 13 by an appropriate moving mechanism.

[0095] After the first carrier 3 is moved from the carrier loading unit 11 to the carrier stage 13 , the loading step S1 , the first reading step S2 , and the unloading step S3 are performed again. Thus, the substrate 2 accommodated in the second carrier 3 is unloaded to the substrate arrangement stage 12 , and six substrates 2 are arranged on the substrate arrangement stage 12 .

[0096] In addition, at this time, the loader 40 is located behind the substrate arrangement stage 12, so the rearmost row ( Fig.10 (b) (1) and (2) positions) will overlap with the main body 41 of the loader 40, but the row is already arranged with the substrate 2 taken out from the first carrier 3. That is, the substrate 2 taken out from the second carrier 3 will not be arranged in the rearmost row of the substrate arrangement stage 12, so there is no concern that the take-out mechanism 30 and the loader 40 will interfere with each other.

[0097] Next, the conveying step S4 is performed. The conveying step S4 is a step of conveying the substrate 2 to the molding die 16 and conveying the carrier 3 to the carrier storage portion 80. The conveying step S4 is an embodiment of the molding object conveying step and the conveying member conveying step of the present invention. In the conveying step S4, the loader 40 holds the six substrates 2 arranged on the substrate arrangement stage 12 (see Figure 4 ). Then, the carrier 3 on the carrier stage 13 is transferred to the carrier placement portion 53 of the carrier transport unit 50 (see Figure 5 At this time, the two carriers 3 are placed on the two carrier placement portions 53, respectively.

[0098] Next, if Figure 8 As shown, the loader 40 and the carrier transport unit 50 move to the right as a whole. The loader 40 transfers the substrate 2 and the resin ingot T to the forming mold 16 in the resin forming module B. Subsequently, the loader 40 and the carrier transport unit 50 move further to the right. In the unloading module C, the carrier receiving portion 80 receives the carrier 3 from the carrier transport unit 50.

[0099] Here, use Figure 6 The following describes how the carrier accommodating portion 80 receives the carrier 3 in the conveying step S4. Figure 6 As shown in (a), the carrier storage portion 80 moves to above the carrier placement portion 53.

[0100] Next, if Figure 6 As shown in (b), the lifting portion 84 moves to the inner side of the main body 81 and then moves upward. As a result, the support portion 84b provided at the bottom lifts the carrier 3 of the carrier placement portion 53 from below. The lifted carrier 3 pushes the rotation support portion 82 upward from below, and the rotation support portion 82 rotates upward.

[0101] When the carrier 3 is lifted to the top of the rotation support 82, as shown in FIG. Figure 6 As shown in FIG. 5( c ), the rotation support portion 82 returns to a substantially horizontal position due to its own weight. In this state, the carrier 3 is placed on the rotation support portion 82, and the lifting portion 84 is retracted to the outside of the main body 81. In this way, the carrier 3 of the carrier placement portion 53 is supported by the rotation support portion 82 provided at the bottom of the carrier storage portion 80.

[0102] Moreover, at this time, the carrier 3 accommodated in the carrier accommodation part 80 will also be lifted to the upper stage (the upper rotation support part 82) by the other support part 84b of the lifting part 84. That is, the carrier 3 transported to the unloading module C is accommodated in the lowest stage of the carrier accommodation part 80, and is moved to the upper stage stage by stage whenever another carrier 3 is transported.

[0103] In this way, the plurality of carriers 3 transported to the unloading module C will be arranged and accommodated in sequence starting from the upper section of the carrier accommodation section 80 based on the order of transport. By providing the carrier accommodation section 80 in the resin molding device 1 in this way to ensure the accommodation space for the plurality of carriers 3, the substrate 2 (carrier 3) can be transported into the resin molding device 1 without stopping, thereby preventing the generation of standby time and achieving improved production efficiency of resin molded products. Moreover, the carriers 3 are arranged and accommodated from the top according to the order of transport, so the operator can easily and intuitively grasp the transport order of the carriers 3, thereby efficiently performing the confirmation operation of the carriers 3, etc.

[0104] Each step from the loading step S1 to the conveying step S4 is repeatedly performed according to the number of resin forming modules B. For example, in this embodiment, two resin forming modules B are provided, and thus the steps are repeatedly performed until the substrate 2 is conveyed to the forming dies 16 of the two resin forming modules B.

[0105] Next, the resin molding step S5 is performed. The resin molding step S5 is a step of performing resin molding on the substrate 2 conveyed to the molding die 16. In the resin molding step S5, the mold clamping mechanism 17 raises the lower mold to clamp the molding die 16. Then, the resin ingot T is heated and melted by a heating unit (not shown) of the molding die 16, and the generated molten resin is used to perform resin sealing on the substrate 2.

[0106] Next, the formed substrate removal step S6 is performed. The formed substrate removal step S6 is a step of removing the substrate 2 that has been resin-formed by the forming mold 16 from the forming mold 16. In the formed substrate removal step S6, the unloader 70 holds the substrate 2 that has been resin-formed by the forming mold 16, moves along the track X to the unloading module C, and arranges the formed substrate 2 on the formed substrate arrangement stage 18 (see Fig. 9 ).

[0107] In addition, when a plurality of resin forming modules B (forming molds 16) are provided as in the present embodiment, the unloader 70 sequentially carries out the formed substrates 2 starting from the forming mold 16 that first conveyed the substrate 2 in the conveying step S4. Thus, in the forming object storage step S7 described later, the corresponding relationship between the substrate 2 and the carrier 3 can be maintained.

[0108] Next, the molding object storage step S7 is performed. The molding object storage step S7 is a step of storing the molded substrate 2 in the carrier 3. In the molding object storage step S7, first, the carrier 3 stored in the carrier storage section 80 is taken out to the carrier unloading section 19 by an appropriate moving mechanism. At this time, the carrier 3 stored in the uppermost section among the carriers 3 stored in the carrier storage section 80 is taken out. Next, the molding object storage mechanism 90 stores the substrate 2 placed on the molded substrate arrangement stage 18 in the carrier 3 arranged in the carrier unloading section 19.

[0109] Next, the second reading process S8 is performed. The second reading process S8 is a process for reading the code 3c of the carrier 3 and the code 2a of the formed substrate 2 accommodated in the carrier 3. In the second reading process S8, the second camera 20 photographs the carrier 3 accommodating the formed substrate 2. The control unit 15 reads the code 3c of the carrier 3 and the code 2a of the formed substrate 2 from the image photographed by the second camera 20 to identify the carrier 3 and the substrate 2. Moreover, the control unit 15 determines whether the correspondence between the carrier 3 and the formed substrate 2 is consistent with the correspondence stored in the first reading process S2. If the correspondence between the carrier 3 and the substrate 2 is inconsistent, the control unit 15, for example, issues a warning to the operator, or stops the operation of the resin molding device 1.

[0110] Next, the unloading step S9 is performed. The unloading step S9 is a step of unloading the carrier 3 from the resin molding apparatus 1 to the outside. In the unloading step S9, the carrier 3 containing the molded substrate 2 is unloaded from the carrier unloading section 19 of the unloading module C to the outside (see Fig. 9 ).

[0111] As described above, in the resin molding apparatus 1 of the present embodiment, the substrate 2 accommodated in the carrier 3 can be taken out from the carrier 3 and resin molded. This can suppress the enlargement of the molding die 16. In addition, the substrate 2 can be directly positioned relative to the molding die 16, so that the position accuracy of the substrate 2 can be improved.

[0112] Furthermore, the resin molding apparatus 1 of this embodiment can store the substrate 2 after resin molding again in the carrier 3. At this time, the substrate 2 is stored in the same carrier 3 as the carrier 3 stored before resin molding. Thus, for example, the carrier 3 can be used to manage the substrate 2 (for example, batch management, etc.).

[0113] As mentioned above, although embodiment of this invention was described, this invention is not limited to this embodiment, It can change suitably within the range of the technical idea of ​​the invention described in a claim.

[0114] For example, the structure (shape or number, etc.) of each component illustrated in each embodiment is not particularly limited and can be changed arbitrarily. As an example, the method of holding the substrate 2 by the loader 40 or the unloader 70 is not particularly limited. Moreover, the method of holding the carrier 3 by the carrier transport unit 50 is not particularly limited. Moreover, the number of substrates 2 and carriers 3 transported at one time by each device, or the arrangement of the substrates 2 in the substrate arrangement stage 12 and the forming mold 16, etc. can be changed arbitrarily.

[0115] Furthermore, in the present embodiment, an example of assigning codes such as a two-dimensional code to the substrate 2 and the carrier 3 is shown, but the present invention is not limited thereto, and various other identifiers may be used. For example, a character string or a color may be used as an identifier, or an integrated circuit (IC) tag that can withstand the environment (heat, load, etc.) in the resin molding device 1 may be used as an identifier. In addition, when an IC tag is used, a communication device that can communicate with the IC tag may be used instead of the first camera 14 to read the information of the identifier.

[0116] Furthermore, the reading process (the first reading process S2 and the second reading process S8) shown in this embodiment is an example, and the code 2a of the substrate 2 and the code 3c of the carrier 3 can be read at any place and at any time. As an example, in this embodiment, an example of using the second camera 20 to read the code 3c of the carrier 3 taken out from the carrier storage unit 80 is shown (refer to the second reading process S8), but the code 3c of the carrier 3 stored in the carrier storage unit 80 in the conveying process S4 can also be read. In this way, the carrier 3 stored in the carrier storage unit 80 can be identified to understand whether the carrier 3 is stored in the appropriate position.

[0117] In addition, the second camera 20 may be used to read the code 2a of the formed substrate 2 (the substrate 2 placed on the formed substrate arrangement stage 18) before being accommodated in the carrier 3. Furthermore, the first camera 14 may be used to read the code 2a of the substrate 2 arranged on the substrate arrangement stage 12 or the code 3c of the carrier 3 arranged on the carrier stage 13.

[0118] Furthermore, the carrier storage portion 80 shown in this embodiment (see Figure 6 ) is an example, and the specific structure of the carrier storage portion 80 can be changed arbitrarily. Fig.11As in the modified example of the carrier storage part 80 shown in FIG. 1 , the carrier 3 is stored in the non-rotatable multi-stage support part 80a instead of the rotatable rotation support part 82. In this case, for example, the carrier storage part 80 can be appropriately raised or lowered according to the height of the carrier 3 transported, and the carrier 3 can be stored in each support part 80a from the side. In this case, it is also desirable to sequentially store the carriers 3 starting from the upper stage (or lower stage) of the carrier storage part 80 based on the order of the transported carriers 3.

[0119] Moreover, in the present embodiment, an example is shown in which three substrates 2 are accommodated in one carrier 3, and six substrates 2 (substrates 2 carried in by two carriers 3) are formed by one forming mold 16, but this is an example, and the number of substrates 2 that can be accommodated in the carrier 3 and the number of substrates 2 that can be formed simultaneously by one forming mold 16 can be changed arbitrarily. For example, three substrates 2 can be accommodated in one carrier 3, and the number of substrates 2 that can be formed by one forming mold 16 can be set to eight, ten, twelve, etc. Even if the relationship between the number of substrates 2 that can be accommodated in the carrier 3 and the number of substrates 2 that can be formed by the forming mold 16 is changed in this way, the corresponding relationship between the substrates 2 and the carrier 3 can be maintained before and after forming by the resin forming device 1 of the present embodiment. That is, in the resin forming device 1, the carrier 3 from which the substrates 2 have been taken out is sequentially accommodated in the carrier accommodating portion 80, and the formed substrates 2 are sequentially accommodated in the carrier 3, so that the corresponding relationship between the substrates 2 and the carrier 3 is maintained. Furthermore, in the resin molding apparatus 1 , the corresponding relationship between the substrate 2 and the carrier 3 can be confirmed by the first camera 14 and the second camera 20 , so the corresponding relationship between the substrate 2 and the carrier 3 can be maintained more reliably.

[0120] Furthermore, the operation of the resin molding device 1 illustrated in the present embodiment is an example, and the present invention is not limited thereto. That is, the operation order and operation form of each part of the resin molding device 1 can be changed arbitrarily.

[0121] <Notes>

[0122] A resin molding device 1 according to a first aspect of the present disclosure includes:

[0123] The taking-out mechanism 30 takes out the substrate 2 (molding object) from the carrier 3 (transportation member) accommodating the substrate 2;

[0124] The loader 40 (first molding object conveying mechanism) conveys the substrate 2 taken out from the carrier 3 to the molding die 16;

[0125] A carrier storage portion 80 (transport member storage portion) capable of storing the carrier 3 from which the substrate 2 has been taken out;

[0126] The carrier transport unit 50 (transport member transport mechanism) transports the carrier 3 from which the substrate 2 has been taken out to the carrier storage portion 80;

[0127] A mold clamping mechanism 17 is used to clamp the molding die 16 to which the substrate 2 has been conveyed to perform resin molding;

[0128] an unloader 70 (a second molding object conveying mechanism) for unloading the molded substrate 2 from the molding die 16; and

[0129] The molding object storage mechanism stores the substrate 2 carried out from the molding die 16 in the carrier 3 stored in the carrier storage portion 80 .

[0130] According to the resin molding device 1 of the first aspect of the present disclosure, the substrate 2 accommodated in the carrier 3 can be taken out for resin molding, and then the substrate 2 can be accommodated in the carrier 3 again. This can suppress the enlargement of the molding die 16. In addition, the substrate 2 can be directly positioned relative to the molding die 16, so that the position accuracy of the substrate 2 can be improved.

[0131] In the resin molding device 1 of the second aspect according to the first aspect,

[0132] The loader 40 and the carrier transfer unit 50 can move together in at least a portion of the moving area.

[0133] According to the resin molding apparatus 1 of the second aspect of the present disclosure, since the loader 40 and the carrier transport unit 50 share the moving area, it is possible to suppress an increase in size of the resin molding apparatus 1 .

[0134] The resin molding device 1 according to the third aspect of the first aspect or the second aspect includes a reading unit (a first camera 14 and a second camera 20),

[0135] The reading unit (the first camera 14 and the second camera 20 ) can read the identifier (the code 3 c and the code 2 a ) given to at least one of the carrier 3 and the substrate 2 .

[0136] According to the resin molding apparatus 1 of the third aspect of the present disclosure, it is possible to identify and manage at least one of the carrier 3 and the substrate 2. This makes it easy to confirm whether the conveyance or molding of the substrate 2 or the carrier 3 has been performed without any problem.

[0137] A resin molding device 1 according to a fourth aspect of the first aspect or the second aspect includes:

[0138] The first camera 14 (first reading unit) is capable of reading the identifier given to the substrate 2 before molding and the carrier 3 accommodating the substrate 2 before molding; and

[0139] The second camera 20 (second reading unit) can read the identifier given to the formed substrate 2 and the carrier 3 storing the formed substrate 2 .

[0140] According to the resin molding device 1 of the fourth aspect of the present disclosure, the corresponding relationship between the substrate 2 and the carrier 3 before and after molding can be confirmed. As a result, it is easy to maintain the corresponding relationship between the substrate 2 and the carrier 3 before and after molding, so that, for example, it is easy to manage the substrate 2 using the carrier 3 (such as batch management, etc.).

[0141] In the resin molding device 1 of the fifth aspect according to any one of the first to fourth aspects,

[0142] The carrier storage unit 80 can store the plurality of carriers 3 based on the order in which the carriers 3 are transported by the carrier transport unit 50 .

[0143] According to the resin molding apparatus 1 of the fifth aspect of the present disclosure, the carriers 3 can be stored in the order of conveyance, so that the order of the carriers 3 can be easily managed or understood.

[0144] The resin molding apparatus 1 of the sixth aspect according to any one of the first to fifth aspects includes a substrate arrangement stage 12 (mounting portion),

[0145] The substrate arranging stage 12 (mounting portion) mounts the substrate 2 taken out by the taking-out mechanism 30.

[0146] The taking-out mechanism 30 places the substrate 2 taken out from the carrier 3 on the substrate arrangement stage 12 in a manner that does not interfere with the loader 40 .

[0147] According to the resin molding apparatus 1 of the fifth aspect of the present disclosure, interference with the loader 40 when taking out the substrate 2 can be prevented.

[0148] In the resin molding device 1 of the seventh aspect according to the sixth aspect,

[0149] The take-out mechanism 30 places the substrate 2 at a predetermined position on the substrate array stage 12 when the loader 40 retreats to the retreat position.

[0150] According to the resin molding apparatus 1 of the seventh aspect of the present disclosure, interference with the loader 40 when taking out the substrate 2 can be prevented.

[0151] A method for manufacturing a resin molded product according to an eighth aspect of the present disclosure uses the resin molding apparatus according to any one of the first to seventh aspects, and the method for manufacturing a resin molded product includes:

[0152] A taking-out step S3, taking out the substrate 2 from the carrier 3;

[0153] A conveying step S4 (molding object conveying step) of conveying the substrate 2 taken out in the taking out step S3 to the molding die 16;

[0154] A conveying step S4 (conveying member conveying step) of conveying the carrier 3 from which the substrate 2 has been taken out;

[0155] a resin molding step S5 of performing resin molding on the substrate 2 conveyed to the molding die 16 in the conveying step S4; and

[0156] In the molding object storing step S7, the substrate 2 molded with resin in the resin molding step S5 is stored in the carrier 3 transported in the transport step S4.

[0157] According to the method for manufacturing a resin molded product of the eighth aspect of the present disclosure, the substrate 2 accommodated in the carrier 3 can be taken out and resin molded. This can suppress the enlargement of the molding die 16. In addition, the substrate 2 can be directly positioned relative to the molding die 16, so the positional accuracy of the substrate 2 can be improved.

[0158] Explanation of symbols

[0159] 1: Resin molding device

[0160] 2: Substrate

[0161] 3: Carrier

[0162] 12: Substrate arrangement stage

[0163] 14: First Camera

[0164] 16: Forming die

[0165] 17: Clamping mechanism

[0166] 20: Second Camera

[0167] 30: Take out the mechanism

[0168] 40: Loader

[0169] 50: Carrier transport unit

[0170] 70: Uninstaller

[0171] 80: Carrier storage unit

Claims

1. A resin molding device, comprising: A take-out mechanism for taking out the formed object from a conveying member containing the formed object; a first molding object conveying mechanism for conveying the molding object taken out from the conveying member to a molding die; a conveying member accommodating portion capable of accommodating the conveying member from which the formed object has been taken out; A conveying member conveying mechanism conveys the conveying member from which the formed object has been taken out to the conveying member accommodating portion; A mold clamping mechanism for clamping the molding die to which the molding object has been conveyed to perform resin molding; a second forming object conveying mechanism for conveying the formed forming object from the forming die; as well as The forming object storage mechanism stores the forming object carried out from the forming die in the conveying member stored in the conveying member storage portion. 2 . The resin molding apparatus according to claim 1 , wherein the first molding object conveying mechanism and the conveying member conveying mechanism are movable together in at least a part of a moving region. 3 . The resin molding apparatus according to claim 1 , further comprising a reading unit capable of reading an identifier given to at least one of the conveying member and the molding object.

4. The resin molding device according to claim 1 or 2, comprising: A first reading unit capable of reading an identifier given to the molding object before molding and the conveying member containing the molding object before molding; as well as The second reading unit can read the identifier given to the formed forming object and the conveying member containing the formed forming object. 5 . The resin molding apparatus according to claim 1 , wherein the conveying member storage section can store a plurality of the conveying members based on an order in which the conveying members are conveyed by the conveying member conveying mechanism.

6. The resin molding device according to any one of claims 1 to 5, comprising a placing portion on which the molding object taken out by the taking-out mechanism is placed, The taking-out mechanism places the formed object taken out from the conveying member on the placing portion so as not to interfere with the first formed object conveying mechanism.

7. The resin molding device according to claim 6, wherein The take-out mechanism places the object to be formed on a predetermined position of the placement section when the first object to be formed conveying mechanism is retracted to a retracted position.

8. A method for manufacturing a resin molded product, using the resin molding device according to any one of claims 1 to 7, the method for manufacturing a resin molded product comprising: A taking-out step of taking out the formed object from the conveying member; a forming object conveying step of conveying the forming object taken out in the taking out step to the forming die; a conveying member conveying step of conveying the conveying member from which the formed object has been taken out; a resin molding step of performing resin molding on the molding object conveyed to the molding die in the molding object conveying step; as well as The molding object accommodation step is to accommodate the molding object that has been resin-molded in the resin molding step in the conveying member conveyed in the conveying member conveying step.

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