A repair method for embossed soft film

Abstract

The present invention relates to a method for repairing an embossed soft film, comprising the following steps: S100: obtaining an embossed soft film to be repaired, wherein the material of the embossed soft film is material X; S200: obtaining a UPy compound, wherein the UPy compound comprises the following functional groups: a pyridine ring or a pyrimidine ring, and a urea bond; S300: mixing 0.008% to 0.02% by weight of the UPy compound into liquid material X to obtain a repair mixture, and stirring the mixture evenly; S400: supporting the embossed soft film to be repaired with its front side facing upward, uniformly spin-coating 0.015 to 0.03 g of the repair mixture per square centimeter of the embossed soft film, and then attaching the coated embossed soft film to a hard template, allowing the repair mixture to spread freely. The embossed soft film is then vacuumed, allowed to stand, and heated for curing, and then the mold is taken to obtain the repaired embossed soft film.

Description

Technical Field

[0001] The present invention relates to the field of nanoimprint technology, and in particular to a method for repairing an imprinted soft film. Background Art

[0002] Currently, in the process of preparing sapphire patterned substrates, after cleaning and coating the wafer, a soft AB adhesive film is squeezed and flowed with the imprint adhesive on the wafer surface. UV curing and imprinting are then performed to create a regularly arranged matrix of adhesive pillars. This step is called nanoimprinting. Nanoimprinting replaces the exposure and development steps in traditional photolithography, improving production efficiency, product consistency, and reducing process defects. Nanoimprinting involves curing approximately 75g of AB adhesive into a soft film. After reaching its service life, wear at the center point causes pattern abnormalities and renders it unusable. A single nanoimprinter consumes 40 to 150 sheets of soft film per day, consuming as much as 3,000 to 11,250g of AB adhesive and generating 3,000 to 11,250g of soft film waste. Discarding the soft film not only consumes a large amount of AB adhesive but also generates a large amount of soft film waste, wasting resources and polluting the environment. Furthermore, indentations are prone to form at the edge where the imprinted metal soft film contacts the wafer, causing pattern damage and reducing the effective surface area of ​​the product. Summary of the Invention

[0003] In view of the above analysis, an embodiment of the present invention aims to provide a method for repairing an embossed soft film, which can at least be used to solve one of the above problems.

[0004] The present invention provides a method for repairing an embossed soft film, comprising the following steps:

[0005] S100: Obtaining an embossed soft film to be repaired, wherein the material of the embossed soft film is material X;

[0006] S200: Obtaining a UPy compound, wherein the UPy compound includes the following functional groups:

[0007] a pyridine ring or a pyrimidine ring,

[0008] and urea bonds;

[0009] S300: mixing 0.008% to 0.02% by weight of UPy compound into the liquid material X to obtain a repair mixture, and stirring the mixture evenly;

[0010] S400: Support the embossed soft film to be repaired with the front side facing up, distribute 0.015-0.03g of repair mixture per square centimeter of the embossed soft film and evenly spin-coat it. Then stick the coated embossed soft film on the hard template. The repair mixture will spread freely. Then vacuum, let it stand, heat and cure, and take the mold to obtain the repaired embossed soft film.

[0011] Furthermore, the preparation method of the UPy compound comprises the following steps:

[0012] S201: Mixing an aminopyridine organic compound and a diisocyanate organic compound as raw materials at a molar ratio of 2.0 to 2.2:1, using chloroform as solvent at a mass ratio of solvent to raw materials of 4 to 8:1, and reacting at 40 to 70°C under nitrogen or argon protection for 6 to 9 hours;

[0013] S202: After the reaction is completed, n-hexane is added twice while hot, with the volume ratio of n-hexane to chloroform being 1 to 2:3, to obtain a uniform white suspension without precipitating into agglomerates;

[0014] S203: The white suspension is filtered with n-hexane to obtain a needle-shaped light filtered product, which is then vacuum-dried to obtain a UPy compound.

[0015] Furthermore, the aminopyridine organic compound includes the following functional groups:

[0016] amino,

[0017] a pyridine ring or a pyrimidine ring;

[0018] The diisocyanate organic compound includes two functional groups -N=C=O.

[0019] Furthermore, the aminopyridine organic compound is 2-amino-4-hydroxy-6-methylpyridine, and the diisocyanate organic compound is hexamethyl diisocyanate. In this case, the chemical formula of the UPy compound is C 18 H 26 N8O4, the structural formula is as follows:

[0020]

[0021] Furthermore, the chloroform is anhydrous chloroform.

[0022] Furthermore, in step S203, the filtration conditions are as follows: using filter paper with a mesh size of 200 to 500, a filtration pressure of -0.08 to -0.1 MPa, a filtration time of 10 to 30 minutes, adding 50 ml of n-hexane three times in the first 3 to 5 minutes of filtration, and then filtration for 5 to 25 minutes;

[0023] Vacuum drying conditions: vacuum degree is between -0.08 and -0.1Mpa, drying temperature is 50-100℃, drying time is 12-24h, and a vacuum oven is used.

[0024] Furthermore, the material X is one of AB glue, polyurethane, condensed polyester, and polyamide.

[0025] Furthermore, the AB glue refers to a mixture of A glue and B glue in a mass ratio of 1:1;

[0026] Glue A includes 83-97.5% PDMS matrix resin, 2-15% pure silicone oil and 0.5-2% cross-linking agent;

[0027] Glue B includes 99.985-99.999% of vinyl-terminated silicone resin and 0.001-0.015% of platinum catalyst.

[0028] Furthermore, in step S400, the conditions for vacuuming, standing, and heating and curing are: standing for 5 to 25 minutes at a vacuum degree of -0.08 to -0.1 MPa, and curing at 60 to 120°C for 10 to 35 minutes.

[0029] Furthermore, the repair method comprises the following steps:

[0030] S100: Obtaining an embossed soft film to be repaired, wherein the material of the embossed soft film is material X;

[0031] S200: Obtain a UPy compound, wherein a chemical formula of the UPy compound is C 18 H 26 N8O4, the structural formula is:

[0032]

[0033] S300: mixing 0.008% to 0.02% by weight of UPy compound into the liquid material X to obtain a repair mixture, and stirring the mixture evenly;

[0034] S400: The embossed soft film to be repaired is supported with the front side facing up, and 0.015-0.03 g of the repair mixture is evenly applied by spin coating per square centimeter of the embossed soft film. The coated embossed soft film is then attached to a hard template. The repair mixture will spread freely. The embossed soft film is then allowed to stand at a vacuum of -0.08 to -0.1 MPa for 5-25 minutes, and then cured at 60-120°C for 10-35 minutes. The repaired embossed soft film is then taken out of the mold.

[0035] The preparation method of the UPy compound comprises the following steps:

[0036] S201: 2-amino-4-hydroxy-6-methylpyridine and hexamethyl diisocyanate are mixed as raw materials at a molar ratio of 2.0-2.2:1, chloroform is used as solvent, and the mass ratio of solvent to raw materials is 4-8:1. The mixture is reacted at 40-70°C under nitrogen or argon protection for 8 hours;

[0037] S202: After the reaction is completed, n-hexane is added twice while hot, with the volume ratio of n-hexane to chloroform being 1 to 2:3, to obtain a uniform white suspension without precipitating into agglomerates;

[0038] S203: The white suspension is filtered with n-hexane to obtain a needle-shaped light filtered product, which is then vacuum-dried to obtain a UPy compound.

[0039] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0040] (1) The present invention can repair worn embossed soft films, avoiding the direct discard or low-cost disposal of soft films after use, and can effectively extend the service life of a single soft film in a conventional nanoimprinter;

[0041] (2) The repair method of the present invention can repair the scrapped initial soft film using only about 3g of the repair mixture. The repaired soft film can be re-printed and recycled 30 to 150 times. Without affecting the consistency of the product, the soft film can be repaired at least 9 to 20 times, that is, its life span is extended to 300 to 1500 times, and its utilization value is increased by 1000%;

[0042] (3) The repaired soft film of the present invention can provide the soft film with a flat edge without indentation, solving and exceeding the performance of the initial soft film and the utilization area of ​​the pattern transferred to the wafer surface;

[0043] (4) The present invention only requires 0.008% to 0.02% of UPy multi-hydrogen bond polymer to be mixed with the raw material of the imprint soft film (AB glue), which is spin-coated on the surface of the waste imprint soft film, and the glue surface is flattened on the silicon template, and heated and cured at 80 to 130°C for 200 to 500 seconds to prepare a method for repairing the waste imprint soft film and giving the new film layer self-repair to improve the imprint life and reduce material consumption. The new film layer and the waste soft film are not delaminated to ensure the accuracy of the pattern transfer. The new film layer uses a small amount of glue and can be repeatedly prepared for many times, which satisfies the normal curing of the imprint glue on the chip to form glue columns after the soft film imprint flow and ultraviolet light exposure, and obtains a product with the same quality as the initial soft film on the patterned sapphire substrate etching, realizing a simple, environmentally friendly, energy-saving and efficiency-enhancing high-value utilization of waste soft films.

[0044] In the present invention, the above-mentioned technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of the present invention will be described in the following description, and some advantages will become apparent from the description or be learned through practice of the present invention. The objectives and other advantages of the present invention can be realized and obtained through the contents particularly pointed out in the description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The accompanying drawings are only for the purpose of illustrating particular embodiments and are not to be considered limiting of the present invention. Like reference symbols denote like parts throughout the drawings.

[0046] Figure 1 This is an SEM image of a direct-coated embossed soft film of a control example in a specific embodiment;

[0047] Figure 2 This is an AOI inspection image of the center point wear of the direct-coated embossed soft film of the control example in the specific implementation manner;

[0048] Figure 3 This is a microscope image of the center point wear of the direct-coated embossed soft film of the control example in the specific embodiment;

[0049] Figure 4 This is a microscope image of the indentation damage of the direct-coated embossed soft film of the control example in the specific embodiment;

[0050] Figure 5 This is a SEM image of the embossed soft film after repair in an example of a specific embodiment;

[0051] Figure 6 This is an AIO detection diagram of the center point of the embossed soft film after repair in an example of a specific implementation manner;

[0052] Figure 7 A microscope image of the center point of the embossed soft film after repair in an example of a specific embodiment;

[0053] Figure 8 This is a microscope image of the indentation self-repairing of the embossed soft film after repair in an example of a specific embodiment;

[0054] Figure 9 This is a SEM image of the finished product after transfer and etching of the imprinted soft film pattern after repair in an example of a specific embodiment;

[0055] Figure 10 This is an AOI image of the finished product after transfer and etching of the imprinted soft film pattern after repair in an example of a specific implementation method. DETAILED DESCRIPTION

[0056] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, wherein the accompanying drawings constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not used to limit the scope of the present invention.

[0057] In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified or limited, the term "connected" should be understood in a broad sense. For example, it can mean a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection, an electrical connection, a direct connection, or an indirect connection through an intermediate medium. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0058] The terms "top," "bottom," "above," "below," and "on" used throughout the description refer to relative positions of components of a device, such as the relative positions of top and bottom substrates within a device. It will be understood that devices are multifunctional regardless of their orientation in space.

[0059] The working surface of the present invention can be a plane or a curved surface, can be inclined, or can be horizontal. For the convenience of description, the embodiment of the present invention is placed on a horizontal surface and used on the horizontal surface, and "high and low" and "up and down" are defined in this way.

[0060] A specific embodiment of the present invention discloses a method for repairing an embossed soft film, comprising the following steps:

[0061] S100: Obtaining an embossed soft film to be repaired, wherein the material of the embossed soft film is material X;

[0062] S200: Obtaining a UPy compound, wherein the UPy compound includes the following functional groups:

[0063] a pyridine ring or a pyrimidine ring,

[0064] and urea bonds;

[0065] S300: mixing 0.008% to 0.02% by weight of UPy compound into the liquid material X to obtain a repair mixture, and stirring the mixture evenly;

[0066] S400: Support the embossed soft film to be repaired with the front side facing up, distribute 0.015-0.03g of repair mixture per square centimeter of the embossed soft film and evenly spin-coat it. Then stick the coated embossed soft film on the hard template. The repair mixture will spread freely. Then vacuum, let it stand, heat and cure, and take the mold to obtain the repaired embossed soft film.

[0067] In step S100, the embossed soft film to be repaired is an embossed soft film with a damaged surface. It can be an embossed soft film that has reached the end of its service life or has been damaged due to other reasons. The service life of a typical embossed soft film is 20 to 100 times, and the service life of the embossed soft film refers to the number of times it can be embossed continuously.

[0068] Exemplarily, the initial embossed soft film is scrapped after being used M times (M is an integer, M∈[20,100]), and is collected as the embossed soft film to be repaired, and finally uniformly repaired using the repair method of the present invention.

[0069] The material of the embossed soft film is one of AB glue, polyurethane, condensation polyester, polyamide, etc., that is, the material X is one of AB glue, polyurethane, condensation polyester, polyamide, etc. The AB glue is a mixture of glue A and glue B in a mass ratio of 1:1. Glue A includes 83-97.5% PDMS matrix resin (vinyl-terminated polydimethylsiloxane), 2-15% pure silicone oil, and 0.5-2% cross-linking agent. Glue B includes 99.985-99.999% vinyl-terminated silicone resin and 0.001-0.015% platinum catalyst. The percentages of glue A and glue B are by weight.

[0070] The crosslinking agent is one of methyl hydrogen siloxane and phenyl substituted side hydrogen siloxane, wherein the structural formula of methyl hydrogen siloxane is as follows:

[0071]

[0072] The structural formula of phenyl-substituted side hydrogen-containing siloxane is as follows:

[0073]

[0074] The platinum catalyst is one of a thermal curing platinum catalyst, a Karstedt catalyst, and a photothermal curing catalyst bis(acetylacetonate)platinum (II).

[0075] For example, the platinum catalyst can be selected from one of the following four types, with the following names and structural formulas:

[0076] The structural formula of platinum (0)-2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane is as follows

[0077]

[0078] The structural formula of trimethyl(methylcyclopentadienyl)platinum(IV) catalyst is as follows:

[0079]

[0080] Dichloro(1,5-cyclooctadiene)platinum(II) structural formula:

[0081]

[0082] The structural formula of ethylene bis(triphenylphosphine) platinum:

[0083]

[0084] The method for preparing the initial embossed soft film comprises the following steps:

[0085] S101: Obtain a template that matches the shape of the embossed soft film;

[0086] S102: applying X material to the template, heating and curing, and demoulding to obtain an initial embossed soft film.

[0087] Exemplarily, when the material of the embossed soft film is AB glue, the method for preparing the initial embossed soft film includes the following steps:

[0088] S101: Obtain a template that matches the shape of the embossed soft film;

[0089] S102: applying AB glue to the template, heating and curing, and demoulding to obtain an initial embossed soft film.

[0090] In step S101, the template is a silicon plate.

[0091] In step S102, the dripping process means that the glue is freely flowed and spread into a layer after dripping, that is, a layer of AB glue is formed on the template. The temperature of heating and curing is 80-130° C. and the duration is 3-9 minutes.

[0092] The above-mentioned method for preparing the initial embossed soft film is not only applicable to soft films made of AB glue materials, but also to soft films made of polyurethane, condensed polyester, polyamide and other materials.

[0093] The initial embossing soft film is pressed into contact with a wafer coated with embossing adhesive. The embossing adhesive is cured under ultraviolet light, forming the desired pattern of adhesive pillars on the wafer surface. The embossing adhesive coated on the wafer can be one of acrylic condensation polyester embossing adhesive, epoxy resin embossing adhesive, polyurethane embossing adhesive, and polyamide embossing adhesive.

[0094] In step S200, the method for preparing the UPy compound includes the following steps:

[0095] S201: Mixing an aminopyridine organic compound and a diisocyanate organic compound as raw materials at a molar ratio of 2.0 to 2.2:1, using chloroform as a solvent at a mass ratio of the solvent to the raw materials of 4 to 8:1, and reacting at 40 to 70° C. under nitrogen or argon protection for 6 to 9 hours (preferably 8 hours);

[0096] S202: After the reaction is completed, n-hexane is added twice while hot, with the volume ratio of n-hexane to chloroform being 1 to 2:3, to obtain a uniform white suspension without precipitating into agglomerates;

[0097] S203: The white suspension is filtered with n-hexane to obtain a needle-shaped light filtered product, which is then vacuum-dried to obtain a UPy compound.

[0098] The aminopyridine organic compound includes the following functional groups:

[0099] amino group (-NH2),

[0100] a pyridine ring or a pyrimidine ring.

[0101] Illustratively, the aminopyridine organic compound is one of 2-amino-4-hydroxy-6-methylpyridine, 2-amino-4-methoxy-6-methylpyrimidine, and 2-amino-4-chloro-6-methylpyrimidine, wherein the structural formula of 2-amino-4-hydroxy-6-methylpyridine is as follows:

[0102]

[0103] The diisocyanate organic compound includes two functional groups -N=C=O.

[0104] The diisocyanate organic compound is one of hexamethyl diisocyanate, 2,6-toluene diisocyanate, 4,4′-methylenebis(phenyl isocyanate), toluene-2,4-diisocyanate, 4-diisocyanate butane, and diphenylmethane-4,4′-diisocyanate, wherein the structural formula of hexamethyl diisocyanate is as follows:

[0105]

[0106] In step S201, chloroform is the solvent. To ensure that the chloroform is free of water, any water present in the chloroform is preferably removed by molecular sieves. The molecular sieves may be 3A spherical molecular sieves, 4A spherical molecular sieves, or 5A spherical molecular sieves. After the reaction of the aminopyridine organic compound and the diisocyanate organic compound, the isocyanate group is capped, i.e., the functional group -N=C=O reacts with the amino group (-NH2) to form a urea bond. Exemplarily, the reaction vessel used in step S201 is a three-necked flask.

[0107] For example, when the chemical formula of the UPy compound is C 18 H 26 N8O4, the structural formula is: When the UPy compound is prepared, the method comprises the following steps:

[0108] S201: Mix 2-amino-4-hydroxy-6-methylpyridine and hexamethyl diisocyanate as raw materials in a molar ratio of 2.0-2.2:1 (or a mass ratio of 3-3.2:1), use chloroform as solvent, and the mass ratio of solvent to raw materials is 4-8:1, and react at 40-70°C under nitrogen or argon protection for 8 hours;

[0109] S202: After the reaction is completed, n-hexane is added twice while hot, with the volume ratio of n-hexane to chloroform being 1 to 2:3, to obtain a uniform white suspension without precipitating into agglomerates;

[0110] S203: The white suspension is filtered with n-hexane to obtain a needle-shaped light filtered product, which is then vacuum-dried to obtain a UPy compound.

[0111] 2-amino-4-hydroxy-6-methylpyridine is reacted with hexamethyl diisocyanate and the isocyanate group is capped. 2-amino-4-hydroxy-6-methylpyridine, hexamethyl diisocyanate, and chloroform are placed in a three-necked flask to react. The reaction equation of 2-amino-4-hydroxy-6-methylpyridine and hexamethyl diisocyanate is as follows:

[0112]

[0113] UPy compound C is obtained by reacting 2-amino-4-hydroxy-6-methyl-pyridine with hexamethylene diisocyanate (HDI). 18 H 26 N8O4, with a molecular weight of 418, has an unstable hydroxyl group on the double-bonded pyridine ring, which will automatically dehydroxylate to form a carbonyl group, forming multiple hydrogen bonds between molecules.

[0114] In step S202, after adding n-hexane while hot, a violent squeaking sound is produced (i.e., after adding n-hexane while hot to the flask, a violent squeaking sound is produced in the flask). If a uniform white suspension without clumps is obtained, the reaction is successful. Otherwise, it is unsuccessful. The reasons for failure include insufficient nitrogen protection or the introduction of water, which leads to clumps. The n-hexane is a saturated alkane and does not participate in the reaction itself. Here, it plays a role in similar compatibility, washing, and separation and purification to separate the by-products and the main product. However, n-hexane has a low polarity and a low boiling point. The washing process causes the product in the hot solution to elute and move violently, resulting in a squeaking sound.

[0115] While magnetically stirring the three-necked flask, add n-hexane from the side of the flask using a glass rod. Stir for 2 to 3 minutes before adding the second n-hexane. This will provide a more complete dispersion and washing effect.

[0116] In step S203, the filtration conditions are as follows: using 200-500 mesh filter paper, a filtration pressure of -0.08 to -0.1 MPa, a filtration time of 10 to 30 minutes, adding 50 ml of n-hexane three times in the early 3 to 5 minutes of filtration, and then filtration for 5 to 25 minutes. The vacuum drying conditions are as follows: a vacuum degree of -0.08 to -0.1 MPa, a drying temperature of 50 to 100° C. (preferably 60° C.), and a drying time of 12 to 24 hours, using a vacuum oven.

[0117] In the step S300, the material X and the UPy compound are mixed by mechanical stirring for 15 to 30 minutes (preferably 25 minutes). Preferably, the two are magnetically stirred at a stirring speed of 500 to 2000 r / min.

[0118] In step S400, the conditions for vacuuming, standing, and heating and curing are: standing at a vacuum of -0.08 to -0.1 MPa for 5 to 25 minutes, and curing at 60 to 120°C for 10 to 35 minutes. Preferably, the vacuuming process lasts for 6 to 15 minutes, followed by compressed air return for 5 to 10 minutes. This return air after vacuuming can increase the speed of bubble extraction and bubble breaking.

[0119] The repair method of the present invention forms a new film layer composed of a repair mixture composed of Material X and a UPy compound on the surface of the embossed soft film. There is no delamination between the new film layer and the original embossed soft film. The new film layer imparts self-repairing properties to the embossed soft film, thereby extending its service life. The self-repairing property refers to the new film layer's inherent multiple hydrogen bonds, which enable self-repair during the embossing process. This improves the life of the embossed soft film. Specifically, the UPy structure is rich in hydrogen bonds. During the embossing process, which includes UV exposure and heating, the enhanced hydrogen bond interactions increase intermolecular interactions, thermal motion, and strength, improving healing ability and service life. This method is fundamentally different from directly applying Material X to the surface of a waste soft film. This method results in delamination between the new and old film layers and lacks the UPy multiple hydrogen bond structure, resulting in a lack of robustness, indentation, or center-point self-repair. In addition, the hydrogen bond self-healing function of the new film layer can also solve the problem of indentation at the edge of the soft film contacting the chip, which causes pattern damage in the current imprint technology, thereby improving the effective utilization area and competitiveness of the product. This is because the new film layer contains a UPy polymer structure, and its multiple hydrogen bond interactions strengthen the intermolecular interactions and dynamically open and close covalent bonds. The original imprint process would cause indentation of the soft film, but after using this material in the new film layer, the indentation problem is effectively repaired and no indentation is produced.

[0120] [Example] A method for repairing an embossed soft film is provided, comprising the following steps:

[0121] S100: Obtaining an embossed soft film to be repaired, wherein the material of the embossed soft film is AB glue;

[0122] The AB glue refers to a mixture of A glue and B glue in a volume ratio of 1:1, A glue includes 83.5% PDMS matrix resin, 15% pure silicone oil and 1.5% cross-linking agent, and B glue includes 99.9985% vinyl-terminated silicone resin and 0.0015% platinum catalyst.

[0123] S200: Obtain a UPy compound, wherein a chemical formula of the UPy compound is C18 H 26 N8O4, the structural formula is as follows:

[0124]

[0125] The preparation method of the UPy compound comprises the following steps:

[0126] S201: 25 g of 2-amino-4-hydroxy-6-methylpyridine and 16.8 g of hexamethyl diisocyanate were mixed in a three-necked flask, and 250 mL of chloroform, which had been freed from water through molecular sieves, was used as the solvent. The mixture was heated to 60° C. and protected with dried nitrogen. The mixture was reacted for 8 hours to block the isocyanate groups.

[0127] S202: After the reaction is completed, n-hexane is added twice while hot, with the volume of n-hexane added twice being 80 mL, to obtain a uniform white suspension without clumps;

[0128] S203: The white suspension is filtered with n-hexane to obtain a needle-shaped light filtered product, which is then dried in a vacuum oven at 60° C. with a vacuum degree of −0.1 for 24 h to obtain a UPy compound.

[0129] S300: Mix equal amounts of glue A and glue B, then add 0.02% by weight of Upy compound and mechanically stir for 25 minutes until the mixture is uniform to obtain a repair mixture;

[0130] S400: Place the front side of the imprinted soft film to be repaired facing up and use a 16-inch wafer to hold it, and evenly spin-coat 3g of the repair mixture using a glue spreader (500-2000 rotations on the glue spreader, spin-coat 3g of the repair mixture in 5-30s). Then stick it on the hard template and let the repair mixture spread freely. Let it stand for 5 minutes under a vacuum of -0.08Mpa, heat and cure at 60℃ for 10 minutes, and take the mold to obtain the repaired imprinted soft film (called the repaired imprinted soft film).

[0131] [Control Example] Place the front side of the embossed soft film to be repaired facing up and hold it with a 16-inch wafer. Spin-coat 3g AB glue evenly with a glue spreader, then stick it on a hard template and let the repair mixture spread freely. Place it under a vacuum of -0.08Mpa for 5 minutes, heat and cure it at 60℃ for 10 minutes to obtain a direct-coated embossed soft film.

[0132] Figure 1 and Figure 5 By comparison, the direct-coated embossed soft film of the control example produces an obvious boundary layer, while the embossed soft film after repair in the example does not have any delamination, indicating that the repair method of the present invention can effectively solve the delamination problem and avoid the problem of graphic transfer accuracy caused by the loose adhesion of the new and old film layers.

[0133] The control example of direct coating soft film printing 15 to 75 times, there will be obvious center point defects (such as Figure 2 and Figure 3 As shown), there is an obvious indentation between the edge of the wafer and the soft film (as shown Figure 4 After the repair, the embossed soft film has been embossed for 30 to 150 times, and there is no abnormality in the center point defect (such as Figure 6 and Figure 7 There is no indentation between the edge of the wafer and the soft film (as shown in Figure 8 This shows that the soft film repaired by the present invention not only has no central point defects, but also has the property of no indentation on the flat edge of the soft film, thus solving and exceeding the performance of the original soft film and the utilization area of ​​the pattern transferred to the wafer surface.

[0134] from Figure 9 and Figure 10 It can be seen that the embossed soft film after repair can be normally used for pattern transfer and etching, and does not affect the normal use of the embossed soft film.

[0135] It should be noted that the SEM images in the accompanying drawings ( Figure 1 、 Figure 5 and Figure 9 ) The testing instrument used is a scanning electron microscope, the manufacturer is Hitachi, the model is SU5000. Figure 2 、 Figure 6 and Figure 10 ) The inspection instrument used is ADI Sapphire pattern substrate automatic optical defect inspection machine, the manufacturer is MIC Fanxuan System Technology, model MK-3650. The microscope image in the attached figure ( Figure 3 、 Figure 4 、 Figure 7 and Figure 8 ) The testing instrument used is a metallographic microscope, the manufacturer is OLYMPUS, model is BX53.

[0136] Theoretically, the repair method of this invention can repair the embossed soft film an unlimited number of times. However, due to the thickness limit imposed by the stamping machine hardware, the more repairs are performed, the thicker the film becomes. Currently, it can guarantee at least 20 repairs under normal operating conditions of the current stamping machine. Table 1 shows the data record of the initial embossed soft film (repair count = 0) and 20 repairs.

[0137] Table 1 - Data record of the initial embossed soft film and its 20 repairs

[0138]

[0139]

[0140] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed by the present invention should be covered by the scope of protection of the present invention.

Claims

1. A method for repairing an embossed soft film, characterized in that: The following steps are involved: S100: Obtaining an embossed soft film to be repaired, wherein the material of the embossed soft film is material X; S200: Obtaining a UPy compound, wherein the UPy compound includes the following functional groups: a pyridine ring or a pyrimidine ring, and urea bonds; S300: mixing 0.008% to 0.02% by weight of UPy compound into the liquid material X to obtain a repair mixture, and stirring the mixture evenly; S400: The embossed soft film to be repaired is supported with the front side facing up, and 0.015-0.03g of the repair mixture is evenly applied by spin coating per square centimeter of the embossed soft film. The coated embossed soft film is then attached to a hard template. The repair mixture will spread freely. Vacuuming, standing, and heating to cure are then performed, and the mold is taken to obtain the repaired embossed soft film. The material X is one of AB glue, polyurethane, condensation polyester, and polyamide; The AB glue is a mixture of glue A and glue B in a mass ratio of 1:1; Glue A includes 83-97.5% PDMS matrix resin, 2-15% pure silicone oil and 0.5-2% cross-linking agent; Glue B includes 99.985-99.999% of vinyl-terminated silicone resin and 0.001-0.015% of platinum catalyst.

2. The repair method according to claim 1, characterized in that: The preparation method of the UPy compound comprises the following steps: S201: Mixing an aminopyridine organic compound and a diisocyanate organic compound as raw materials at a molar ratio of 2.0 to 2.2:1, using chloroform as solvent at a mass ratio of solvent to raw materials of 4 to 8:1, and reacting at 40 to 70°C under nitrogen or argon protection for 6 to 9 hours; S202: After the reaction is completed, n-hexane is added twice while hot, with the volume ratio of n-hexane to chloroform being 1 to 2:3, to obtain a uniform white suspension without precipitating into agglomerates; S203: The white suspension is filtered with n-hexane to obtain a needle-shaped light filtered product, which is then vacuum-dried to obtain a UPy compound.

3. The repair method according to claim 2, characterized in that: The aminopyridine organic compound includes the following functional groups: amino, a pyridine ring or a pyrimidine ring; The diisocyanate organic compound includes two functional groups -N=C=O.

4. The repair method according to claim 3, characterized in that: The aminopyridine organic compound is 2-amino-4-hydroxy-6-methylpyridine, and the diisocyanate organic compound is hexamethyl diisocyanate. In this case, the chemical formula of the UPy compound is C 18 H 26 N8O4, the structural formula is as follows:

5. The repair method according to claim 2, characterized in that: The chloroform is anhydrous chloroform.

6. The repair method according to claim 2, characterized in that: In step S203, the filtration conditions are as follows: using filter paper with a mesh size of 200 to 500, a filtration pressure of -0.08 to -0.1 MPa, a filtration time of 10 to 30 minutes, adding 50 ml of n-hexane three times in the first 3 to 5 minutes of filtration, and then filtration for 5 to 25 minutes; Vacuum drying conditions: vacuum degree is between -0.08 and -0.1Mpa, drying temperature is 50-100℃, drying time is 12-24h, and a vacuum oven is used.

7. The repair method according to any one of claims 1 to 6, characterized in that: In step S400, the conditions for vacuuming, standing, and heating to cure are: standing for 5 to 25 minutes at a vacuum degree of -0.08 to -0.1 MPa, and curing at 60 to 120°C for 10 to 35 minutes.

8. The repair method according to claim 1, characterized in that: The following steps are involved: S100: Obtaining an embossed soft film to be repaired, wherein the material of the embossed soft film is material X; S200: Obtain a UPy compound, wherein a chemical formula of the UPy compound is C 18 H 26 N8O4, the structural formula is: S300: mixing 0.008% to 0.02% by weight of UPy compound into the liquid material X to obtain a repair mixture, and stirring the mixture evenly; S400: The embossed soft film to be repaired is supported with the front side facing up, and 0.015-0.03 g of the repair mixture is evenly applied by spin coating per square centimeter of the embossed soft film. The coated embossed soft film is then attached to a hard template. The repair mixture will spread freely. The embossed soft film is then allowed to stand at a vacuum of -0.08 to -0.1 MPa for 5-25 minutes, and then cured at 60-120°C for 10-35 minutes. The repaired embossed soft film is then taken out of the mold. The preparation method of the UPy compound comprises the following steps: S201: 2-amino-4-hydroxy-6-methylpyridine and hexamethyl diisocyanate are mixed as raw materials at a molar ratio of 2.0-2.2:1, chloroform is used as solvent, and the mass ratio of solvent to raw materials is 4-8:

1. The mixture is reacted at 40-70°C under nitrogen or argon protection for 8 hours; S202: After the reaction is completed, n-hexane is added twice while hot, with the volume ratio of n-hexane to chloroform being 1 to 2:3, to obtain a uniform white suspension without precipitating into agglomerates; S203: The white suspension is filtered with n-hexane to obtain a needle-shaped light filtered product, which is then vacuum-dried to obtain a UPy compound.

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