Manufacturing method of packaging structure, packaging structure and electronic equipment
By cutting and re -packaging the substrate structure, and after the packaging is completed, the packaging layer is based on the gap between the substrate structure, which solves the layered phenomenon caused by stress differences during the chip packaging process, and improves the stability and reliability of the packaging structure.
Patent Information
- Application Number
- CN202411247488.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2025-01-21
AI Technical Summary
During the chip packaging process, due to the stress difference between the glass substrate and other film layers, layering may lead to, which will affect the stability and reliability of the product.
By cutting the first substrate structure into a plurality of second substrate structures, and arranging these substrate structures at intervals on the carrier board, filling the plastic sealing material to form a plastic sealing layer, forming a rewiring layer on the side away from the carrier board, and finally based on the substrate structure gap The rewiring layer and plastic packaging layer are cut to obtain multiple packaging structures.
This method effectively reduces the stress difference between the substrate and other film layers, reduces the risk of delamination, ensures the stability and reliability of the packaging structure, and thereby improves the overall performance of the product.
Smart Images
Figure CN119340216A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a method for manufacturing a packaging structure, a packaging structure and an electronic device. Background Art
[0002] At present, in the chip packaging process, the redistribution layer and the accumulation layer are usually directly processed based on the glass substrate, and then cut into a single package structure. However, during the cutting process, due to the stress difference between the glass substrate and other film layers, delamination may occur, resulting in product failure. Summary of the invention
[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a method for manufacturing a packaging structure, a packaging structure and an electronic device.
[0004] In a first aspect, an embodiment of the present application provides a method for manufacturing a packaging structure, the method for manufacturing the packaging structure comprising:
[0005] Providing a first substrate structure, and cutting the first substrate structure to obtain a plurality of second substrate structures;
[0006] Disposing a plurality of the second substrate structures at intervals on a carrier, and filling a plastic encapsulation material between the plurality of the second substrate structures to form a plastic encapsulation layer;
[0007] A redistribution layer is formed on a side of the plastic encapsulation layer away from the carrier, and the orthographic projections of the plurality of second substrate structures on the carrier are located within the orthographic projections of the redistribution layer on the carrier;
[0008] The redistribution layer and the plastic packaging layer are cut based on the gaps between the plurality of second substrate structures to obtain a plurality of packaging structures.
[0009] In a possible implementation, before the step of providing a first substrate structure and cutting the first substrate structure to obtain a plurality of second substrate structures, the method further includes:
[0010] Providing a substrate to be processed, wherein a metal layer is disposed on the surface of the substrate to be processed;
[0011] forming a filling layer covering the metal layer on the surface of the substrate to be processed;
[0012] forming a plurality of conductive pillars on one side of the filling layer;
[0013] A protective layer is formed on a side of the conductive pillar away from the substrate to be processed to obtain a first substrate structure.
[0014] In a possible implementation, the step of forming a plurality of conductive pillars on one side of the filling layer includes:
[0015] Etching the filling layer to form a plurality of grooves exposing the metal layer; the plurality of grooves are located on the same side of the filling layer;
[0016] A plurality of conductive pillars are formed on one side of the filling layer, and the plurality of conductive pillars are electrically connected to the metal layer through the grooves respectively.
[0017] In a possible implementation, the step of forming a redistribution layer on a side of the plastic encapsulation layer away from the carrier board includes:
[0018] Grinding the plastic sealing layer and the protective layer to expose the conductive pillars;
[0019] A redistribution layer is formed on a side of the plastic packaging layer away from the carrier board, and the redistribution layer is electrically connected to the conductive pillar.
[0020] In a possible implementation manner, the material of the protection layer includes polyimide material.
[0021] In a possible implementation manner, after the step of forming a redistribution layer on a side of the plastic encapsulation layer away from the carrier board, the method further includes:
[0022] removing the carrier board;
[0023] A buildup layer is formed on a side of the second substrate structure away from the redistribution layer.
[0024] In a possible implementation, the step of forming a buildup layer on a side of the second substrate structure away from the redistribution layer includes:
[0025] An insulating material is coated on a side of the second substrate structure away from the redistribution layer to form a buildup layer.
[0026] In a possible implementation, the step of disposing a plurality of the second substrate structures at intervals on a carrier includes:
[0027] Applying bonding glue on one side of the carrier;
[0028] The plurality of second substrate structures are connected to the carrier board by using the bonding adhesive.
[0029] In a second aspect, an embodiment of the present application further provides a packaging structure, which is manufactured using the manufacturing method of the packaging structure described in the first aspect above.
[0030] In a third aspect, an embodiment of the present application further provides an electronic device, wherein the electronic device includes the packaging structure described in the second aspect.
[0031] Based on any one of the above aspects, the manufacturing method of the packaging structure, the packaging structure and the electronic device provided in the embodiments of the present application are achieved by cutting the first substrate structure to obtain the second substrate structure and then repackaging it. After the packaging is completed, cutting is performed based on the gaps between the multiple second substrate structures to obtain multiple packaging structures. This can effectively reduce the stress differences between the substrate and other film layers due to different material properties, thereby reducing the risk of delamination. At the same time, it can also ensure the stability and reliability of the packaging structure and improve the overall performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.
[0033] Figure 1 This is a schematic diagram of a process of manufacturing a packaging structure provided in this embodiment;
[0034] Figure 2 A schematic diagram of a first substrate structure and a second substrate structure provided in this embodiment;
[0035] Figure 3 One of the schematic diagrams of the packaging structure provided in this embodiment;
[0036] Figure 4 A second flow chart of the method for manufacturing the packaging structure provided in this embodiment;
[0037] Figure 5 A schematic diagram of the structure of a substrate to be processed provided in this embodiment;
[0038] Figure 6 One of the schematic diagrams of the first substrate structure provided in this embodiment;
[0039] Figure 7 A second schematic diagram of the first substrate structure provided in this embodiment;
[0040] Figure 8 A schematic diagram of sub-steps of step S230 provided in this embodiment;
[0041] Fig. 9 A schematic diagram of sub-steps of step S130 provided in this embodiment;
[0042] Fig.10 A second schematic diagram of the packaging structure provided in this embodiment;
[0043] Fig.11 A third flow chart of the method for manufacturing the packaging structure provided in this embodiment;
[0044] Fig.12 A third schematic diagram of the packaging structure provided in this embodiment;
[0045] Fig.13 A schematic diagram of sub-steps of step S120 provided for this embodiment.
[0046] Icon: 110 - substrate to be processed; 120 - metal layer; 130 - filling layer; 140 - conductive column; 150 - protective layer; 200 - carrier; 300 - plastic sealing layer; 400 - redistribution layer; 500 - accumulation layer. DETAILED DESCRIPTION
[0047] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0048] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0049] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0050] In the description of this application, it should be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0051] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0052] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0053] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.
[0054] The specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings.
[0055] Please refer to Figure 1 , Figure 1 This is a schematic flow chart of a method for manufacturing a packaging structure provided in this embodiment. The method may include the following steps.
[0056] Step S110: providing a first substrate structure, and cutting the first substrate structure to obtain a plurality of second substrate structures.
[0057] In this embodiment, please refer to Figure 2 The first substrate structure can be cut using a cutting machine or laser cutting to obtain a plurality of second substrate structures. The shapes and sizes of the plurality of second substrate structures can be the same, so that a plurality of completely identical packaging structures can be obtained based on the plurality of second substrate structures.
[0058] The first substrate structure may include a first surface and a second surface that are opposite to each other, and a plurality of conductive pillars 140 are disposed on the first surface.
[0059] Step S120 , disposing a plurality of the second substrate structures at intervals on the carrier 200 , and filling a molding material between the plurality of the second substrate structures to form a molding layer 300 .
[0060] In this embodiment, please refer to Figure 3The plurality of second substrate structures obtained in step S110 can be placed on the carrier 200, the plurality of second substrate structures are spaced apart, and a plastic encapsulation material is filled between the plurality of second substrate structures to form the plastic encapsulation layer 300 that completely covers the plurality of second substrate structures. The carrier 200 can be a glass carrier.
[0061] Specifically, when placing multiple second substrate structures on the carrier 200, the side of the second substrate structure where the conductive column 140 is not set can be in contact with the carrier 200, and the side of the second substrate structure where the conductive column 140 is set is not in contact with the carrier 200. In this way, it is convenient to set the redistribution layer 400 on the side of the second substrate structure away from the carrier 200.
[0062] The plastic sealing layer 300 may be formed by wafer-level or board-level plastic sealing, lamination of plastic sealing films, hot pressing plastic sealing or injection molding, etc., which are not specifically limited here.
[0063] The material of the plastic sealing layer 300 can be an insulating material, for example, it can include epoxy molding compound (Epoxy Molding Compound, EMC). Epoxy molding compound (Epoxy Molding Compound, EMC) is a powder molding compound made of epoxy resin as a base resin, high-performance phenolic resin as a curing agent, silicon micropowder as a filler, and a variety of additives. Epoxy molding compound (Epoxy Molding Compound, EMC) is easy to shape and has a hard texture. It can protect the second substrate structure, effectively prevent external water and oxygen from contacting the second substrate structure, and can improve the reliability of the packaging structure.
[0064] Step S130 , forming a redistribution layer 400 on a side of the plastic encapsulation layer 300 away from the carrier 200 , wherein the orthographic projections of the plurality of second substrate structures on the carrier 200 are located within the orthographic projections of the redistribution layer 400 on the carrier 200 .
[0065] In this embodiment, a plurality of conductive pillars 140 are respectively disposed on one side of the plurality of second substrate structures away from the carrier 200 , and each of the second substrate structures can be electrically connected to the redistribution layer 400 through the plurality of conductive pillars 140 .
[0066] Specifically, the redistribution layer 400 may be formed by photolithography, plating, sputtering, etc. The material of the redistribution layer 400 may be a metal material, and illustratively, the material of the redistribution layer 400 may be copper, aluminum, etc.
[0067] Step S140 , cutting the redistribution layer 400 and the plastic encapsulation layer 300 based on the gaps between the plurality of second substrate structures to obtain a plurality of packaging structures.
[0068] In this embodiment, since the multiple second substrate structures are spaced apart, the redistribution layer 400 and the plastic encapsulation layer 300 can be cut directly based on the gaps between the multiple second substrate structures without cutting the second substrate structure. In this way, the multiple second substrate structures can be divided to obtain multiple packaging structures, and the multiple packaging structures can be exactly the same.
[0069] Specifically, during cutting, the redistribution layer 400 and the plastic packaging layer 300 may be cut by laser cutting or mechanical cutting.
[0070] In the above design, the first substrate structure is cut to obtain multiple second substrate structures and then repackaged, and after packaging, the multiple packaging structures are obtained by cutting based on the gaps between the multiple second substrate structures. This can effectively reduce the stress difference between the substrate and other film layers due to different material properties, thereby reducing the risk of delamination. At the same time, it can also ensure the stability and reliability of the packaging structure and improve the overall performance of the product.
[0071] In one possible implementation, see Figure 4 Before step S110, the method for manufacturing the packaging structure may further include the following steps.
[0072] In step S210 , a substrate 110 to be processed is provided, and a metal layer 120 is disposed on the surface of the substrate 110 to be processed.
[0073] In this embodiment, please refer to Figure 5 , a plurality of through holes can be formed on the substrate to be processed 110 by laser drilling, and the metal layer 120 that at least partially covers the substrate to be processed 110 can be formed on the plurality of through holes and the surface of the substrate to be processed 110 .
[0074] The substrate to be processed 110 may be a glass substrate.
[0075] In step S220 , a filling layer 130 covering the metal layer 120 is formed on the surface of the substrate 110 to be processed.
[0076] In this embodiment, please refer to Figure 6 Insulating material may be filled in the through hole of the substrate to be processed 110 to form the filling layer 130 , and the filling layer 130 may completely cover all surfaces of the substrate to be processed 110 .
[0077] The material of the filling layer 130 may be an insulating material, for example, may include Ajinomoto Build-up Film (ABF).
[0078] In step S230 , a plurality of conductive pillars 140 are formed on one side of the filling layer 130 .
[0079] In this embodiment, please refer to Figure 7 A plurality of conductive pillars 140 electrically connected to the metal layer 120 on the surface of the substrate 110 to be processed may be formed on one side of the filling layer 130, and the plurality of conductive pillars 140 may be located on the same side of the substrate 110 to be processed, and the plurality of conductive pillars 140 may be arranged at intervals. The conductive pillars 140 may cover at least a portion of the surface of the filling layer 130.
[0080] Preferably, the conductive pillar 140 may be a copper pillar.
[0081] It should be noted that the number of the conductive pillars 140 can be determined according to actual needs and is not specifically limited here.
[0082] In step S240 , a protection layer 150 is formed on a side of the conductive pillar 140 away from the substrate to be processed 110 to obtain a first substrate structure.
[0083] In this embodiment, a protective layer 150 may be formed on a side of the conductive pillar 140 away from the substrate to be processed 110, and the protective layer 150 may fill the gaps between the plurality of conductive pillars 140 and completely cover the plurality of conductive pillars 140. The orthographic projection of the protective layer 150 on the substrate to be processed 110 completely covers the orthographic projection of the conductive pillar 140 on the substrate to be processed 110, and the orthographic projection of the protective layer 150 on the substrate to be processed 110 may coincide with the orthographic projection of the filling layer 130 on the substrate to be processed 110.
[0084] In one possible implementation, see Figure 8 , step S230 may include the following sub-steps.
[0085] Step S231 , etching the filling layer 130 to form a plurality of grooves exposing the metal layer 120 ; the plurality of grooves are located on the same side of the filling layer 130 .
[0086] In step S232 , a plurality of conductive pillars 140 are formed on one side of the filling layer 130 , and the plurality of conductive pillars 140 are electrically connected to the metal layer 120 through the grooves respectively.
[0087] In this embodiment, please refer to Figure 7, a plurality of grooves exposing the metal layer 120 on the surface of the substrate 110 to be processed can be formed in the filling layer 130 through an etching process, the plurality of grooves are arranged at intervals and are located on the same side of the substrate 110 to be processed, and the conductive pillar 140 can be formed by filling the groove with conductive material, one end of the conductive pillar 140 is in contact with the metal layer 120 on the surface of the substrate 110 to be processed, and the other end of the conductive pillar 140 at least partially covers the surface of the filling layer 130.
[0088] Exemplarily, the conductive material filled in the plurality of grooves may include conductive materials such as copper, aluminum, nickel, or alloys of at least two of the above, or a combination of the above, which is not specifically limited herein.
[0089] In one possible implementation, see Fig. 9 , step S130 may include the following sub-steps.
[0090] In step S131 , the plastic encapsulation layer 300 and the protection layer 150 are ground to expose the conductive pillars 140 .
[0091] In step S132 , a redistribution layer 400 is formed on a side of the plastic encapsulation layer 300 away from the carrier 200 , and the redistribution layer 400 is electrically connected to the conductive pillars 140 .
[0092] In this embodiment, please refer to Fig.10 Since the plastic encapsulation layer 300 and the protective layer 150 completely cover the conductive column 140, it is necessary to grind the plastic encapsulation layer 300 and the protective layer 150 so that the surface of the plastic encapsulation layer 300 and the protective layer 150 are flush with the surface of the conductive column 140 and expose the surface of the conductive column 140, so as to facilitate the electrical connection between the conductive column 140 and the redistribution layer 400.
[0093] In a possible implementation, the material of the protection layer 150 may include polyimide (PI) material. The protection layer 150 may be used to protect the substrate to be processed 110 and the conductive pillars 140 to improve the reliability of the first substrate structure.
[0094] In one possible implementation, see Fig.11 After step S130, the method for manufacturing the packaging structure may further include the following steps.
[0095] Step S310: removing the carrier board 200.
[0096] Step S320 , forming a buildup layer 500 on a side of the second substrate structure away from the redistribution layer 400 .
[0097] In this embodiment, please refer to Fig.12 After forming the redistribution layer 400, the carrier 200 may be removed, and the stacking layer 500 may be formed on the side of the second substrate structure away from the redistribution layer 400, and the stacking layer 500 may completely cover the plurality of second substrate structures. Specifically, after removing the carrier 200, a plurality of blind holes may be provided on the side of the second substrate structure away from the redistribution layer 400, and the blind holes may expose the metal layer 120 on the surface of the substrate 110 to be processed. Exemplarily, the plurality of blind holes may be formed by laser drilling.
[0098] After step S320, a plurality of chips electrically connected to the redistribution layer 400 may be arranged on a side of the redistribution layer 400 away from the second substrate structure. Exemplarily, the chips may include a system on chip (SoC) and a high bandwidth memory (HBM) chip.
[0099] After the chip is arranged on the side of the redistribution layer 400 away from the second substrate structure, a plurality of solder balls can be planted on the side of the stacking layer 500 away from the second substrate structure to form a plurality of solder balls, which can play a role of adhesion and diffusion when the package structure is connected to other electronic devices. The material of the solder ball can include one of lead, tin and silver or an alloy containing any of the above solder metals. The material of the solder ball is preferably tin.
[0100] In a possible implementation, when the stacking layer 500 is formed on the side of the second substrate structure away from the redistribution layer 400 , an insulating material may be coated on the side of the second substrate structure away from the redistribution layer 400 to form the stacking layer 500 .
[0101] In this embodiment, an insulating material may be coated on a side of the second substrate structure away from the redistribution layer 400 . For example, the insulating material may be Ajinomoto Build-up Film (ABF), so as to form the stacking layer 500 .
[0102] In one possible implementation, see Fig.13 , step S120 may include the following sub-steps.
[0103] Step S121 , coating bonding glue on one side of the carrier 200 .
[0104] Step S122 , connecting a plurality of the second substrate structures to the carrier 200 by using the bonding adhesive.
[0105] In this embodiment, the second substrate structure and the carrier 200 may be connected by the bonding adhesive. For example, the bonding adhesive may be a pyrolytic adhesive.
[0106] When the bonding adhesive is a pyrolytic adhesive, the pyrolytic adhesive can be softened by heating, thereby removing the carrier 200 .
[0107] It should be noted that the method of removing the carrier 200 is not limited to heating, and the carrier 200 can also be removed by laser debonding. The removal method can be selected according to the actual connection method, and is not specifically limited here.
[0108] After removing the carrier 200 , the second substrate structure may be cleaned to remove the bonding glue remaining on the surface of the second substrate structure.
[0109] An embodiment of the present application also provides a packaging structure, which can be manufactured using the manufacturing method of the packaging structure provided in the present application.
[0110] An embodiment of the present application also provides an electronic device, which may include the packaging structure provided in the present application.
[0111] In summary, the present embodiment provides a method for manufacturing a packaging structure, a packaging structure and an electronic device, by cutting the first substrate structure to obtain a second substrate structure and then repackaging it, and after the packaging is completed, cutting is performed based on the gaps between the multiple second substrate structures to obtain multiple packaging structures. This can effectively reduce the stress difference between the substrate and other film layers due to different material properties, thereby reducing the risk of delamination. At the same time, it can also ensure the stability and reliability of the packaging structure and improve the overall performance of the product.
[0112] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0113] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A method for manufacturing a packaging structure, characterized in that: The method comprises: Providing a first substrate structure, and cutting the first substrate structure to obtain a plurality of second substrate structures; Disposing a plurality of the second substrate structures at intervals on a carrier, and filling a plastic encapsulation material between the plurality of the second substrate structures to form a plastic encapsulation layer; A redistribution layer is formed on a side of the plastic encapsulation layer away from the carrier, and the orthographic projections of the plurality of second substrate structures on the carrier are located within the orthographic projections of the redistribution layer on the carrier; The redistribution layer and the plastic packaging layer are cut based on the gaps between the plurality of second substrate structures to obtain a plurality of packaging structures.
2. The method for manufacturing a packaging structure according to claim 1, characterized in that: Before the step of providing a first substrate structure and cutting the first substrate structure to obtain a plurality of second substrate structures, the method further includes: Providing a substrate to be processed, wherein a metal layer is disposed on the surface of the substrate to be processed; forming a filling layer covering the metal layer on the surface of the substrate to be processed; forming a plurality of conductive pillars on one side of the filling layer; A protective layer is formed on a side of the conductive pillar away from the substrate to be processed to obtain a first substrate structure.
3. The method for manufacturing a packaging structure according to claim 2, characterized in that: The step of forming a plurality of conductive pillars on one side of the filling layer comprises: Etching the filling layer to form a plurality of grooves exposing the metal layer; the plurality of grooves are located on the same side of the filling layer; A plurality of conductive pillars are formed on one side of the filling layer, and the plurality of conductive pillars are electrically connected to the metal layer through the grooves respectively.
4. The method for manufacturing a packaging structure according to claim 2, characterized in that: The step of forming a redistribution layer on a side of the plastic encapsulation layer away from the carrier board comprises: Grinding the plastic sealing layer and the protective layer to expose the conductive pillars; A redistribution layer is formed on a side of the plastic packaging layer away from the carrier board, and the redistribution layer is electrically connected to the conductive pillar.
5. The method for manufacturing a packaging structure according to claim 2, characterized in that: The material of the protection layer includes polyimide material.
6. The method for manufacturing a packaging structure according to claim 1, characterized in that: After the step of forming a redistribution layer on a side of the plastic encapsulation layer away from the carrier board, the method further comprises: removing the carrier board; A buildup layer is formed on a side of the second substrate structure away from the redistribution layer.
7. The method for manufacturing a packaging structure according to claim 6, characterized in that: The step of forming a buildup layer on a side of the second substrate structure away from the redistribution layer comprises: An insulating material is coated on a side of the second substrate structure away from the redistribution layer to form a buildup layer.
8. The method for manufacturing a packaging structure according to claim 1, characterized in that: The step of disposing a plurality of the second substrate structures at intervals on the carrier includes: Applying bonding glue on one side of the carrier; The plurality of second substrate structures are connected to the carrier board by using the bonding adhesive.
9. A packaging structure, characterized in that: The packaging structure is manufactured using the packaging structure manufacturing method described in any one of claims 1 to 8.
10. An electronic device, characterized in that: The electronic device comprises the packaging structure according to claim 9.