A device and method for monitoring junction temperature of an IGBT module in a cooling and refrigeration mechanism

Abstract

The present invention provides a junction temperature monitoring device and method for an IGBT module in a cooling and refrigerating mechanism. The device and method obtain the switch state of the IGBT module, determine the switch-off moment of the IGBT module based on the working rule of the switch state, provide the state information of the IGBT module for the junction temperature monitoring of the IGBT module, and at the switch-off moment of the IGBT module, control the optical fiber in the cooling and refrigerating mechanism to monitor the junction temperature of the IGBT module to obtain monitoring temperature data. The monitoring temperature data is transmitted based on the optical fiber amplifier in the cooling and refrigerating mechanism to a monitoring platform. Finally, the monitoring temperature data is optimized in combination with the induced voltage data of the IGBT module to obtain the target monitoring temperature, ensure the accuracy of the target monitoring temperature, realize accurate monitoring of the working junction temperature of the IGBT module, thereby ensuring the stability of the operation of the high-power converter and realizing the stable operation of the IGBT module in the cooling and refrigerating mechanism.

Description

Technical Field

[0001] The present invention relates to the technical field of IGBT module detection, and in particular to a junction temperature monitoring device and method for an IGBT module in a cooling and refrigeration mechanism. Background Art

[0002] At present, IGBT modules are widely used in new energy vehicles on the market. During the production process of IGBT modules, the modules need to be tested. However, in the high-power converter system of new energy vehicles, the working voltage and current of the module IGBT are relatively large, which makes its power consumption and chip junction temperature high. Once the temperature is too high, it will cause IGBT damage, and then cause the high-power converter system to fail. Therefore, how to provide an IGBT module working junction temperature detection method that can detect the working junction temperature of the IGBT module online and ensure the stability of the high-power converter operation is a major technical problem that needs to be solved by technicians in this field. Summary of the invention

[0003] The present invention provides a junction temperature monitoring device and method for an IGBT module in a cooling and refrigeration mechanism, which are used to solve the problems raised in the background technology.

[0004] A junction temperature monitoring device for an IGBT module in a cooling and refrigeration mechanism, comprising:

[0005] A state determination module is used to obtain the switch state of the IGBT module and determine the turn-off moment of the IGBT module based on the working law of the switch state;

[0006] A temperature monitoring module is used to control the optical fiber in the cooling mechanism to monitor the junction temperature of the IGBT module at the moment of shutting down the IGBT module, so as to obtain monitoring temperature data;

[0007] A data transmission module, used to transmit the monitored temperature data to a monitoring platform based on an optical fiber amplifier in a cooling and refrigeration mechanism;

[0008] The temperature optimization module is used to optimize the monitoring temperature data in combination with the induced voltage data of the IGBT module to obtain a target monitoring temperature.

[0009] Preferably, the state determination module includes:

[0010] A parameter acquisition unit, used to acquire basic parameters of the power topology in the IGBT module and collect power parameters of the power topology in the IGBT module;

[0011] A state determination unit, used to determine the switch state of the IGBT module based on the basic parameters and the power parameters;

[0012] A rule determination unit, used for periodically detecting the switch state to determine the working rule of the switch state;

[0013] The instant determination unit is used to determine the turn-off node of the IGBT module from the working law of the switch state, and obtain the target parameter of the turn-off node, and use the target parameter as the turn-off instant of the IGBT module.

[0014] Preferably, the temperature monitoring module comprises:

[0015] An instruction determination unit, used for determining a trigger junction temperature monitoring instruction based on the turn-off moment of the IGBT module;

[0016] The acquisition unit is used to control the optical fiber to collect the temperature of the IGBT module based on the triggering junction temperature monitoring instruction to obtain the monitoring temperature data.

[0017] Preferably, the instruction determination unit includes:

[0018] An analysis unit, configured to obtain a target parameter characteristic and a shutdown frequency characteristic of the IGBT module at the moment of shutdown, and determine a frequency sequence based on a parameter sequence of the target parameter characteristic and based on the shutdown frequency characteristic;

[0019] a condition determination unit, configured to determine a parameter range corresponding to each parameter type from the parameter sequence, and to set a value trigger condition based on the parameter range corresponding to each parameter type;

[0020] The condition determination unit is further used to determine the frequency range in which the shutdown occurs from the frequency sequence, and set the period trigger condition based on the frequency range;

[0021] A judging unit, configured to perform condition verification on the numerical trigger condition and the periodic trigger condition based on the shutdown moment, and judge whether the shutdown moment satisfies both the numerical trigger condition and the periodic trigger condition;

[0022] If so, determining the numerical trigger condition and the periodic trigger condition as the target trigger condition;

[0023] Otherwise, the numerical trigger condition and the periodic trigger condition are modified based on the long-term characteristics of the shutdown moment, and the target trigger condition is obtained according to the modification result;

[0024] An association determination unit, used to obtain a startup parameter when the optical fiber monitors the IGBT module, and use the startup parameter as a trigger result to establish association information between the target trigger condition and the trigger result;

[0025] A configuration unit is used to configure instruction parameters for the target trigger condition, trigger result and associated information, and establish a trigger junction temperature monitoring instruction based on the instruction parameters.

[0026] Preferably, the data transmission module includes:

[0027] A reminder determination unit, used for storing the monitored temperature data, and when the storage amount of the monitored temperature data reaches a preset storage amount or the value of the monitored temperature data is greater than a preset value, a transmission reminder is issued to the optical fiber amplifier in the cooling and refrigeration mechanism;

[0028] An instruction establishing unit, used for establishing a transmission instruction after the optical fiber amplifier receives a transmission reminder;

[0029] The transmission unit is used to transmit the monitored temperature data to the monitoring platform by using an optical fiber amplifier based on the transmission instruction.

[0030] Preferably, the instruction establishing unit comprises:

[0031] a channel determination unit, configured to obtain transmission channel usage information after the optical fiber amplifier receives the transmission reminder, and determine a target transmission channel based on the transmission channel usage information;

[0032] An instruction acquisition unit is used to establish a transmission instruction based on the monitored temperature data and a target transmission channel.

[0033] Preferably, the temperature optimization module comprises:

[0034] A curve determination unit, used to collect the induced voltage data of the IGBT module at the moment of shutdown, and obtain a data trend curve based on the induced voltage data;

[0035] A peak determination unit, used to obtain peak points in the data trend curve, and establish a peak sequence based on the time difference between the peak points and the peak value;

[0036] A relationship determination unit, used to obtain a numerical correspondence between historical induced voltage data and historical monitored temperature data of the IGBT module, and analyze the numerical correspondence based on a relationship learning model to obtain a functional relationship corresponding to the numerical correspondence;

[0037] A value determination unit, used to determine a theoretical monitoring temperature value determined under the peak sequence based on the functional relationship;

[0038] A temperature difference judgment unit, used for comparing the theoretical monitoring temperature value with the monitoring temperature data to obtain a temperature difference value, and judging whether the temperature difference value is within a preset difference range;

[0039] If so, determining that the monitored temperature data is the target monitored temperature;

[0040] Otherwise, based on the theoretical monitoring temperature value, the monitoring temperature data is optimized to obtain the target monitoring temperature.

[0041] Preferably, the temperature difference judgment unit comprises:

[0042] an optimization unit, configured to determine whether the temperature difference is greater than zero when the temperature difference is not within a preset difference range;

[0043] If so, the theoretical monitoring temperature value is used as the target monitoring temperature;

[0044] Otherwise, an optimization weight is determined based on the size of the temperature difference, and the monitoring temperature data is downward optimized based on the optimization weight to obtain a target monitoring temperature.

[0045] A monitoring method of a junction temperature monitoring device of an IGBT module in a cooling and refrigeration mechanism, comprising:

[0046] S1: Obtain the switch state of the IGBT module and determine the turn-off moment of the IGBT module based on the working rule of the switch state;

[0047] S2: At the moment of shutting down the IGBT module, controlling the optical fiber in the cooling mechanism to monitor the junction temperature of the IGBT module to obtain monitoring temperature data;

[0048] S3: transmitting the monitored temperature data to a monitoring platform based on an optical fiber amplifier in a cooling and refrigeration mechanism;

[0049] S4: Optimizing the monitoring temperature data in combination with the induced voltage data of the IGBT module to obtain a target monitoring temperature.

[0050] Preferably, in S1, obtaining the switch state of the IGBT module and determining the turn-off moment of the IGBT module based on the working rule of the switch state include:

[0051] Obtain the basic parameters of the power topology in the IGBT module, and collect the power parameters of the power topology in the IGBT module;

[0052] Determine the switching state of the IGBT module based on basic parameters and power parameters;

[0053] Performing periodic detection on the switch state to determine the working rule of the switch state;

[0054] The turn-off node of the IGBT module is determined from the working law of the switch state, and the target parameter of the turn-off node is obtained, and the target parameter is used as the turn-off moment of the IGBT module.

[0055] Compared with the prior art, the present invention has achieved the following beneficial effects:

[0056] By acquiring the switching state of the IGBT module, the shutdown moment of the IGBT module is determined based on the working law of the switching state, the state information of the IGBT module is provided for the junction temperature monitoring of the IGBT module, and a basis is provided for determining the junction temperature monitoring parameters of the IGBT module. At the shutdown moment of the IGBT module, the optical fiber in the cooling and refrigeration mechanism is controlled to monitor the junction temperature of the IGBT module to obtain monitoring temperature data. The monitoring temperature data is transmitted based on the optical fiber amplifier in the cooling and refrigeration mechanism to the monitoring platform. The optical fiber amplifier is used to enhance the signal strength of the optical fiber transmission and improve the accuracy and reliability of the monitoring. Finally, the monitoring temperature data is optimized in combination with the induced voltage data of the IGBT module to obtain the target monitoring temperature, ensure the accuracy of the target monitoring temperature, and realize accurate monitoring of the working junction temperature of the IGBT module, thereby ensuring the stability of the operation of the high-power converter and realizing the stable operation of the IGBT module in the cooling and refrigeration mechanism.

[0057] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures specifically pointed out in this application document.

[0058] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0060] Figure 1 It is a structural diagram of a junction temperature monitoring device of an IGBT module in a cooling and refrigeration mechanism in an embodiment of the present invention;

[0061] Figure 2 is a structural diagram of the temperature monitoring module described in an embodiment of the present invention;

[0062] Figure 3 The present invention is a flowchart of a method for monitoring the junction temperature of an IGBT module in a cooling and refrigeration mechanism according to an embodiment of the present invention. DETAILED DESCRIPTION

[0063] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0064] Example 1

[0065] The embodiment of the present invention provides a junction temperature monitoring device for an IGBT module in a cooling and refrigeration mechanism, such as Figure 1 As shown, including:

[0066] A state determination module is used to obtain the switch state of the IGBT module and determine the turn-off moment of the IGBT module based on the working law of the switch state;

[0067] A temperature monitoring module is used to control the optical fiber in the cooling mechanism to monitor the junction temperature of the IGBT module at the moment of shutting down the IGBT module, so as to obtain monitoring temperature data;

[0068] A data transmission module, used to transmit the monitored temperature data to a monitoring platform based on an optical fiber amplifier in a cooling and refrigeration mechanism;

[0069] The temperature optimization module is used to optimize the monitoring temperature data in combination with the induced voltage data of the IGBT module to obtain a target monitoring temperature.

[0070] In this embodiment, the optical fiber is used as a temperature sensor to monitor the temperature change of the IGBT module in real time.

[0071] In this embodiment, the optical fiber amplifier is used to enhance the signal strength of the optical fiber transmission and improve the accuracy and reliability of monitoring.

[0072] In this embodiment, there is a certain correlation between the induced voltage data of the IGBT module and the junction temperature monitoring data of the IGBT module, and the monitoring temperature data can be optimized based on this correlation.

[0073] The beneficial effects of the above design scheme are: by acquiring the switching state of the IGBT module, the shutdown moment of the IGBT module is determined based on the working law of the switching state, the state information of the IGBT module is provided for the junction temperature monitoring of the IGBT module, and a basis is provided for determining the junction temperature monitoring parameters of the IGBT module. At the shutdown moment of the IGBT module, the optical fiber in the cooling and refrigeration mechanism is controlled to monitor the junction temperature of the IGBT module to obtain monitoring temperature data, and the monitoring temperature data is transmitted based on the optical fiber amplifier in the cooling and refrigeration mechanism to the monitoring platform. The optical fiber amplifier is used to enhance the signal strength of the optical fiber transmission and improve the accuracy and reliability of the monitoring. Finally, the monitoring temperature data is optimized in combination with the induced voltage data of the IGBT module to obtain the target monitoring temperature, ensure the accuracy of the target monitoring temperature, and realize accurate monitoring of the working junction temperature of the IGBT module, thereby ensuring the stability of the operation of the high-power converter and realizing the stable operation of the IGBT module in the cooling and refrigeration mechanism.

[0074] Embodiment 2:

[0075] Based on the first embodiment, the present invention provides a junction temperature monitoring device for an IGBT module in a cooling mechanism, wherein the state determination module comprises:

[0076] A parameter acquisition unit, used to acquire basic parameters of the power topology in the IGBT module and collect power parameters of the power topology in the IGBT module;

[0077] A state determination unit, used to determine the switch state of the IGBT module based on the basic parameters and the power parameters;

[0078] A rule determination unit, used for periodically detecting the switch state to determine the working rule of the switch state;

[0079] The instant determination unit is used to determine the turn-off node of the IGBT module from the working law of the switch state, and obtain the target parameter of the turn-off node, and use the target parameter as the turn-off instant of the IGBT module.

[0080] In this embodiment, the basic parameters are the connection mode data between various components, and the power parameters are the power parameters of the IGBT module.

[0081] In this embodiment, the target parameters are electrical parameters such as current and voltage of the IGBT module.

[0082] The beneficial effects of the above design scheme are: by acquiring the basic parameters of the power topology in the IGBT module and collecting the power parameters of the power topology in the IGBT module, the switching state of the IGBT module is determined based on the basic parameters and the power parameters, the switching state is periodically detected, the working law of the switching state is determined, the shutdown node of the IGBT module is determined from the working law of the switching state, and the target parameters of the shutdown node are obtained, and the target parameters are used as the shutdown moment of the IGBT module to provide the state information of the IGBT module for the junction temperature monitoring of the IGBT module, and provide a basis for determining the junction temperature monitoring parameters of the IGBT module.

[0083] Embodiment 3:

[0084] Based on the first embodiment, the present invention provides a junction temperature monitoring device for an IGBT module in a cooling mechanism, such as Figure 2 As shown, the temperature monitoring module includes:

[0085] An instruction determination unit, used for determining a trigger junction temperature monitoring instruction based on the turn-off moment of the IGBT module;

[0086] The acquisition unit is used to control the optical fiber to collect the temperature of the IGBT module based on the triggering junction temperature monitoring instruction to obtain the monitoring temperature data.

[0087] The beneficial effect of the above design scheme is: by determining the trigger junction temperature monitoring instruction based on the shutdown moment of the IGBT module, based on the trigger junction temperature monitoring instruction, controlling the optical fiber to collect the temperature of the IGBT module, obtaining monitoring temperature data, and realizing real-time and accurate monitoring of the IGBT module.

[0088] Embodiment 4:

[0089] Based on the third embodiment, the embodiment of the present invention provides a junction temperature monitoring device for an IGBT module in a cooling mechanism, wherein the instruction determination unit comprises:

[0090] An analysis unit, configured to obtain a target parameter characteristic and a shutdown frequency characteristic of the IGBT module at the moment of shutdown, and determine a frequency sequence based on a parameter sequence of the target parameter characteristic and based on the shutdown frequency characteristic;

[0091] a condition determination unit, configured to determine a parameter range corresponding to each parameter type from the parameter sequence, and to set a value trigger condition based on the parameter range corresponding to each parameter type;

[0092] The condition determination unit is further used to determine the frequency range in which the shutdown occurs from the frequency sequence, and set the period trigger condition based on the frequency range;

[0093] A judging unit, configured to perform condition verification on the numerical trigger condition and the periodic trigger condition based on the shutdown moment, and judge whether the shutdown moment satisfies both the numerical trigger condition and the periodic trigger condition;

[0094] If so, determining the numerical trigger condition and the periodic trigger condition as the target trigger condition;

[0095] Otherwise, the numerical trigger condition and the periodic trigger condition are modified based on the long-term characteristics of the shutdown moment, and the target trigger condition is obtained according to the modification result;

[0096] An association determination unit, used to obtain a startup parameter when the optical fiber monitors the IGBT module, and use the startup parameter as a trigger result to establish association information between the target trigger condition and the trigger result;

[0097] A configuration unit is used to configure instruction parameters for the target trigger condition, trigger result and associated information, and establish a trigger junction temperature monitoring instruction based on the instruction parameters.

[0098] In this embodiment, the parameter sequence is the parameter value corresponding to each parameter type at each shutdown moment.

[0099] In this embodiment, the frequency sequence is the frequency at which the turn-off moment of the IGBT module occurs.

[0100] The beneficial effects of the above design scheme are: by obtaining the target parameter characteristics and the shutdown frequency characteristics of the IGBT module at the moment of shutdown, a parameter sequence based on the target parameter characteristics is determined, a frequency sequence is determined based on the shutdown frequency characteristics, a parameter range corresponding to each parameter type is determined from the parameter sequence, and a numerical trigger condition is set based on the parameter range corresponding to each parameter type, a frequency range in which shutdown occurs is determined from the frequency sequence, and a periodic trigger condition is set based on the frequency range, and the numerical trigger condition and the periodic trigger condition are conditionally verified based on the shutdown moment to determine whether the shutdown moment satisfies the numerical trigger condition. and periodic trigger conditions; if so, determining that the numerical trigger conditions and the periodic trigger conditions are the target trigger conditions; otherwise, correcting the numerical trigger conditions and the periodic trigger conditions based on the long-term characteristics of the shutdown moment, obtaining the target trigger conditions according to the correction results, obtaining the startup parameters when the optical fiber monitors the IGBT module, and using the startup parameters as the trigger results, establishing the association information between the target trigger conditions and the trigger results, configuring instruction parameters for the target trigger conditions, the trigger results and the association information, establishing a trigger junction temperature monitoring instruction based on the instruction parameters, achieving accurate establishment of the trigger junction temperature monitoring instruction, and providing a basis for junction temperature monitoring.

[0101] Embodiment 5:

[0102] Based on the first embodiment, the present invention provides a junction temperature monitoring device for an IGBT module in a cooling mechanism, wherein the data transmission module comprises:

[0103] A reminder determination unit, used for storing the monitored temperature data, and when the storage amount of the monitored temperature data reaches a preset storage amount or the value of the monitored temperature data is greater than a preset value, a transmission reminder is issued to the optical fiber amplifier in the cooling and refrigeration mechanism;

[0104] An instruction establishing unit, used for establishing a transmission instruction after the optical fiber amplifier receives a transmission reminder;

[0105] The transmission unit is used to transmit the monitored temperature data to the monitoring platform by using an optical fiber amplifier based on the transmission instruction.

[0106] The beneficial effect of the above design scheme is: by storing the monitored temperature data, when the storage amount of the monitored temperature data reaches a preset storage amount or the value of the monitored temperature data is greater than a preset value, a transmission reminder is issued to the optical fiber amplifier in the cooling and refrigeration mechanism; when the optical fiber amplifier receives the transmission reminder, a transmission instruction is established; based on the transmission instruction, the monitored temperature data is transmitted by the optical fiber amplifier to the monitoring platform; the optical fiber amplifier is used to enhance the signal strength of the optical fiber transmission and improve the accuracy and reliability of the monitoring transmission.

[0107] Embodiment 6:

[0108] Based on the fifth embodiment, the present invention provides a junction temperature monitoring device for an IGBT module in a cooling mechanism, wherein the instruction establishing unit comprises:

[0109] a channel determination unit, configured to obtain transmission channel usage information after the optical fiber amplifier receives the transmission reminder, and determine a target transmission channel based on the transmission channel usage information;

[0110] An instruction acquisition unit is used to establish a transmission instruction based on the monitored temperature data and a target transmission channel.

[0111] The beneficial effect of the above design scheme is: when the optical fiber amplifier receives the transmission reminder, the transmission channel usage information is obtained, based on the transmission channel usage information, the target transmission channel is determined, and the transmission instruction is established based on the monitored temperature data and the target transmission channel, so as to provide a suitable channel for transmission and ensure the feasibility of the transmission instruction.

[0112] Embodiment 7:

[0113] Based on the first embodiment, the present invention provides a junction temperature monitoring device for an IGBT module in a cooling mechanism, wherein the temperature optimization module comprises:

[0114] A curve determination unit, used to collect the induced voltage data of the IGBT module at the moment of shutdown, and obtain a data trend curve based on the induced voltage data;

[0115] A peak determination unit, used to obtain peak points in the data trend curve, and establish a peak sequence based on the time difference between the peak points and the peak value;

[0116] A relationship determination unit, used to obtain a numerical correspondence between historical induced voltage data and historical monitored temperature data of the IGBT module, and analyze the numerical correspondence based on a relationship learning model to obtain a functional relationship corresponding to the numerical correspondence;

[0117] A value determination unit, used to determine a theoretical monitoring temperature value determined under the peak sequence based on the functional relationship;

[0118] A temperature difference judgment unit, used for comparing the theoretical monitoring temperature value with the monitoring temperature data to obtain a temperature difference value, and judging whether the temperature difference value is within a preset difference range;

[0119] If so, determining that the monitored temperature data is the target monitored temperature;

[0120] Otherwise, based on the theoretical monitoring temperature value, the monitoring temperature data is optimized to obtain the target monitoring temperature.

[0121] In this embodiment, the relationship learning model is pre-set and used to learn the rules between numerical relationships.

[0122] The beneficial effects of the above design scheme are: a curve determination unit is used to collect the induced voltage data of the IGBT module at the moment of shutdown, a data trend curve is obtained based on the induced voltage data, a peak point in the data trend curve is obtained, a peak sequence is established based on the time difference between the peak points and the peak value, a numerical correspondence between the historical induced voltage data and the historical monitoring temperature data of the IGBT module is obtained, and the numerical correspondence is analyzed based on the relationship learning model to obtain a functional relationship corresponding to the numerical correspondence, based on the functional relationship, a theoretical monitoring temperature value determined under the peak sequence is determined, the theoretical monitoring temperature value is compared with the monitoring temperature data to obtain a temperature difference, and it is judged whether the temperature difference is within a preset difference range; if so, the monitoring temperature data is determined to be the target monitoring temperature; otherwise, based on the theoretical monitoring temperature value, the monitoring temperature data is optimized to obtain the target monitoring temperature, the accuracy of the target monitoring temperature is ensured, and the accurate monitoring of the working junction temperature of the IGBT module is achieved, thereby ensuring the stability of the operation of the high-power converter and achieving the stable operation of the IGBT module in the cooling and refrigeration mechanism.

[0123] Embodiment 8:

[0124] Based on Example 7, an embodiment of the present invention provides a junction temperature monitoring device for an IGBT module in a cooling mechanism, wherein the temperature difference judgment unit includes:

[0125] an optimization unit, configured to determine whether the temperature difference is greater than zero when the temperature difference is not within a preset difference range;

[0126] If so, the theoretical monitoring temperature value is used as the target monitoring temperature;

[0127] Otherwise, an optimization weight is determined based on the size of the temperature difference, and the monitoring temperature data is downward optimized based on the optimization weight to obtain a target monitoring temperature.

[0128] In this embodiment, the monitored temperature data is downwardly optimized to reduce the value of the monitored temperature data, and the greater the optimization weight, the greater the reduction.

[0129] The beneficial effect of the above design scheme is: when the temperature difference is not within the preset difference range, it is judged whether the temperature difference is greater than zero; if so, the theoretical monitoring temperature value is used as the target monitoring temperature; otherwise, the optimization weight is determined based on the size of the temperature difference, and the monitoring temperature data is downward optimized based on the optimization weight to obtain the target monitoring temperature, thereby ensuring the accuracy of the target monitoring temperature, realizing accurate monitoring of the working junction temperature of the IGBT module, and then ensuring the stability of the operation of the high-power converter, and realizing the stable operation of the IGBT module in the cooling and refrigeration mechanism.

[0130] Embodiment 9:

[0131] The embodiment of the present invention provides a method for monitoring the junction temperature of an IGBT module in a cooling and refrigeration mechanism, such as Figure 3 As shown, it is specifically used in the monitoring system as described in Example 1, including:

[0132] S1: Obtain the switch state of the IGBT module and determine the turn-off moment of the IGBT module based on the working rule of the switch state;

[0133] S2: At the moment of shutting down the IGBT module, controlling the optical fiber in the cooling mechanism to monitor the junction temperature of the IGBT module to obtain monitoring temperature data;

[0134] S3: transmitting the monitored temperature data to a monitoring platform based on an optical fiber amplifier in a cooling and refrigeration mechanism;

[0135] S4: Optimizing the monitoring temperature data in combination with the induced voltage data of the IGBT module to obtain a target monitoring temperature.

[0136] In this embodiment, the optical fiber is used as a temperature sensor to monitor the temperature change of the IGBT module in real time.

[0137] In this embodiment, the optical fiber amplifier is used to enhance the signal strength of the optical fiber transmission and improve the accuracy and reliability of monitoring.

[0138] In this embodiment, there is a certain correlation between the induced voltage data of the IGBT module and the junction temperature monitoring data of the IGBT module, and the monitoring temperature data can be optimized based on this correlation.

[0139] The beneficial effects of the above design scheme are: by acquiring the switching state of the IGBT module, the shutdown moment of the IGBT module is determined based on the working law of the switching state, the state information of the IGBT module is provided for the junction temperature monitoring of the IGBT module, and a basis is provided for determining the junction temperature monitoring parameters of the IGBT module. At the shutdown moment of the IGBT module, the optical fiber in the cooling and refrigeration mechanism is controlled to monitor the junction temperature of the IGBT module to obtain monitoring temperature data, and the monitoring temperature data is transmitted based on the optical fiber amplifier in the cooling and refrigeration mechanism to the monitoring platform. The optical fiber amplifier is used to enhance the signal strength of the optical fiber transmission and improve the accuracy and reliability of the monitoring. Finally, the monitoring temperature data is optimized in combination with the induced voltage data of the IGBT module to obtain the target monitoring temperature, ensure the accuracy of the target monitoring temperature, and realize accurate monitoring of the working junction temperature of the IGBT module, thereby ensuring the stability of the operation of the high-power converter and realizing the stable operation of the IGBT module in the cooling and refrigeration mechanism.

[0140] Embodiment 10:

[0141] Based on the first embodiment, the present invention provides a method for monitoring the junction temperature of an IGBT module in a cooling mechanism. In S1, the switch state of the IGBT module is obtained, and the shutdown moment of the IGBT module is determined based on the working rule of the switch state, including:

[0142] Obtain the basic parameters of the power topology in the IGBT module, and collect the power parameters of the power topology in the IGBT module;

[0143] Determine the switching state of the IGBT module based on basic parameters and power parameters;

[0144] Performing periodic detection on the switch state to determine the working rule of the switch state;

[0145] The turn-off node of the IGBT module is determined from the working law of the switch state, and the target parameter of the turn-off node is obtained, and the target parameter is used as the turn-off moment of the IGBT module.

[0146] In this embodiment, the basic parameters are the connection mode data between various components, and the power parameters are the power parameters of the IGBT module.

[0147] In this embodiment, the target parameters are electrical parameters such as current and voltage of the IGBT module.

[0148] The beneficial effects of the above design scheme are: by acquiring the basic parameters of the power topology in the IGBT module and collecting the power parameters of the power topology in the IGBT module, the switching state of the IGBT module is determined based on the basic parameters and the power parameters, the switching state is periodically detected, the working law of the switching state is determined, the shutdown node of the IGBT module is determined from the working law of the switching state, and the target parameters of the shutdown node are obtained, and the target parameters are used as the shutdown moment of the IGBT module to provide the state information of the IGBT module for the junction temperature monitoring of the IGBT module, and provide a basis for determining the junction temperature monitoring parameters of the IGBT module.

[0149] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention belong to the scope of this application document and its equivalent technology, the present invention is also intended to include these changes and variations.

Claims

1. A junction temperature monitoring device for an IGBT module in a cooling and refrigeration mechanism, characterized in that: include: A state determination module is used to obtain the switch state of the IGBT module and determine the turn-off moment of the IGBT module based on the working law of the switch state; A temperature monitoring module is used to control the optical fiber in the cooling mechanism to monitor the junction temperature of the IGBT module at the moment of shutting down the IGBT module, so as to obtain monitoring temperature data; A data transmission module, used to transmit the monitored temperature data to a monitoring platform based on an optical fiber amplifier in a cooling and refrigeration mechanism; A temperature optimization module, used to optimize the monitoring temperature data in combination with the induced voltage data of the IGBT module to obtain a target monitoring temperature; The temperature monitoring module comprises: An instruction determination unit, used for determining a trigger junction temperature monitoring instruction based on the turn-off moment of the IGBT module; The acquisition unit is used to control the optical fiber to collect the temperature of the IGBT module based on the triggering junction temperature monitoring instruction to obtain the monitoring temperature data; The instruction determination unit comprises: An analysis unit, configured to obtain a target parameter characteristic and a shutdown frequency characteristic of the IGBT module at the moment of shutdown, determine a parameter sequence based on the target parameter characteristic, and determine a frequency sequence based on the shutdown frequency characteristic; a condition determination unit, configured to determine a parameter range corresponding to each parameter type from the parameter sequence, and to set a value trigger condition based on the parameter range corresponding to each parameter type; The condition determination unit is further used to determine the frequency range in which the shutdown occurs from the frequency sequence, and set the period trigger condition based on the frequency range; A judging unit, configured to perform condition verification on the numerical trigger condition and the periodic trigger condition based on the shutdown moment, and judge whether the shutdown moment satisfies both the numerical trigger condition and the periodic trigger condition; If so, determining the numerical trigger condition and the periodic trigger condition as the target trigger condition; Otherwise, the numerical trigger condition and the periodic trigger condition are modified based on the long-term characteristics of the shutdown moment, and the target trigger condition is obtained according to the modification result; An association determination unit, used to obtain a startup parameter when the optical fiber monitors the IGBT module, and use the startup parameter as a trigger result to establish association information between the target trigger condition and the trigger result; A configuration unit is used to configure instruction parameters for the target trigger condition, trigger result and associated information, and establish a trigger junction temperature monitoring instruction based on the instruction parameters.

2. The junction temperature monitoring device of an IGBT module in a cooling and refrigeration mechanism according to claim 1, characterized in that: The state determination module comprises: A parameter acquisition unit, used to acquire basic parameters of the power topology in the IGBT module and collect power parameters of the power topology in the IGBT module; A state determination unit, used to determine the switch state of the IGBT module based on the basic parameters and the power parameters; A rule determination unit, used for periodically detecting the switch state to determine the working rule of the switch state; The instant determination unit is used to determine the turn-off node of the IGBT module from the working law of the switch state, and obtain the target parameter of the turn-off node, and use the target parameter as the turn-off instant of the IGBT module.

3. The junction temperature monitoring device of an IGBT module in a cooling and refrigeration mechanism according to claim 1, characterized in that: The data transmission module comprises: A reminder determination unit, used for storing the monitored temperature data, and when the storage amount of the monitored temperature data reaches a preset storage amount or the value of the monitored temperature data is greater than a preset value, a transmission reminder is issued to the optical fiber amplifier in the cooling and refrigeration mechanism; An instruction establishing unit, used for establishing a transmission instruction after the optical fiber amplifier receives a transmission reminder; The transmission unit is used to transmit the monitored temperature data to the monitoring platform by using an optical fiber amplifier based on the transmission instruction.

4. The junction temperature monitoring device of an IGBT module in a cooling and refrigeration mechanism according to claim 3, characterized in that: The instruction establishing unit comprises: a channel determination unit, configured to obtain transmission channel usage information after the optical fiber amplifier receives the transmission reminder, and determine a target transmission channel based on the transmission channel usage information; An instruction acquisition unit is used to establish a transmission instruction based on the monitored temperature data and a target transmission channel.

5. The junction temperature monitoring device of an IGBT module in a cooling and refrigeration mechanism according to claim 1, characterized in that: The temperature optimization module comprises: A curve determination unit, used to collect the induced voltage data of the IGBT module at the moment of shutdown, and obtain a data trend curve based on the induced voltage data; A peak determination unit, used to obtain peak points in the data trend curve, and establish a peak sequence based on the time difference between the peak points and the peak value; A relationship determination unit, used to obtain a numerical correspondence between historical induced voltage data and historical monitored temperature data of the IGBT module, and analyze the numerical correspondence based on a relationship learning model to obtain a functional relationship corresponding to the numerical correspondence; A value determination unit, used to determine a theoretical monitoring temperature value determined under the peak sequence based on the functional relationship; A temperature difference judgment unit, used for comparing the theoretical monitoring temperature value with the monitoring temperature data to obtain a temperature difference value, and judging whether the temperature difference value is within a preset difference range; If so, determining that the monitored temperature data is the target monitored temperature; Otherwise, based on the theoretical monitoring temperature value, the monitoring temperature data is optimized to obtain the target monitoring temperature.

6. The junction temperature monitoring device of an IGBT module in a cooling and refrigeration mechanism according to claim 5, characterized in that: The temperature difference judgment unit comprises: an optimization unit, configured to determine whether the temperature difference is greater than zero when the temperature difference is not within a preset difference range; If so, the theoretical monitoring temperature value is used as the target monitoring temperature; Otherwise, an optimization weight is determined based on the size of the temperature difference, and the monitoring temperature data is downward optimized based on the optimization weight to obtain a target monitoring temperature.

7. A method for monitoring the junction temperature of an IGBT module in a cooling and refrigeration mechanism, specifically used in the monitoring device as claimed in claim 1, characterized in that: include: S1: Obtain the switch state of the IGBT module and determine the turn-off moment of the IGBT module based on the working rule of the switch state; S2: At the moment of shutting down the IGBT module, controlling the optical fiber in the cooling mechanism to monitor the junction temperature of the IGBT module to obtain monitoring temperature data; S3: transmitting the monitored temperature data to a monitoring platform based on an optical fiber amplifier in a cooling and refrigeration mechanism; S4: Optimizing the monitoring temperature data in combination with the induced voltage data of the IGBT module to obtain a target monitoring temperature.

8. The method for monitoring junction temperature of an IGBT module in a cooling and refrigeration mechanism according to claim 7, characterized in that: In S1, the switching state of the IGBT module is obtained, and the shutdown moment of the IGBT module is determined based on the working rule of the switching state, including: Obtain the basic parameters of the power topology in the IGBT module, and collect the power parameters of the power topology in the IGBT module; Determine the switching state of the IGBT module based on basic parameters and power parameters; Performing periodic detection on the switch state to determine the working rule of the switch state; The turn-off node of the IGBT module is determined from the working law of the switch state, and the target parameter of the turn-off node is obtained, and the target parameter is used as the turn-off moment of the IGBT module.

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