A mini-RGBW-LED lamp bead structure with embedded IC and its preparation method

Abstract

The present invention discloses a mini-RGBW-LED lamp bead structure with an embedded IC and a method for preparing the same, relating to the technical field of LED lamp bead structures. The preparation method of the present invention arranges an IC chip and an RGBW chip in different layer structures, with the IC chip installed in an IC packaging layer and the RGBW chip installed in an RGBW packaging layer on top of the IC packaging layer. This allows the RGBW packaging layer to have sufficient space for four RGBW chips, which facilitates the layout of the RGBW chips and can reduce the overall size of the mini-RGBW-LED lamp bead structure. The mini-RGBW-LED lamp bead structure prepared by the present invention is used to prepare a display screen, which can significantly improve the uniformity and clarity of the display screen image, solving the problem that the current RGBW LED lamp bead with an embedded IC in a display screen results in low clarity of the resulting LED display screen.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lamp bead structures, and in particular to a mini-RGBW-LED lamp bead structure with an embedded IC and a preparation method thereof. Background Art

[0002] RGBW LEDs with built-in ICs are miniature LEDs that integrate red, green, blue, and white LED chips with a control IC. These LEDs are not only compact but also powerful. The control IC receives external signals and adjusts the brightness and color of the LED chips based on the signals, enabling rich color effects. Furthermore, the internal IC simplifies the control circuitry, making large-scale lighting control easier and facilitating integration with various embedded systems. These advantages have made RGBW LEDs with built-in ICs widely used in the display industry, such as microdisplays and LED displays.

[0003] Chinese patent application number 201520242416.4 discloses an LED bracket with built-in RGBW chips and its LED product. The following details are disclosed: The LED bracket structure includes four conductive pins and an insulating base, which are integrally inlaid with the insulating base. The top surface of the insulating base is concave to form a reflective cup. A partition wall divides the reflective cup into two parts: a first reflective area for accommodating white light LED chips and a second reflective area for accommodating red, green, and blue LED chips. When this LED bracket is used to manufacture LED products, the first reflective area holds the white light LED chips, while the second reflective area holds the red, green, and blue LED chips and a control IC. This allows the LED product to function as both a lighting fixture and a backlight source. Although the LED lamp beads with built-in RGBW chips can control the on / off of the LED chips and adjust the brightness and color of the LED chips through the IC chip, the white light LED chips, red light LED chips, green light LED chips, blue light LED chips and the control IC in the LED lamp beads with built-in RGBW chips are arranged in the same layer structure. Since the control IC occupies a large space, this will not only lead to a large overall space occupation of the manufactured LED lamp beads, but also, based on the fact that each pixel in the LED display is a lamp bead, the clarity of the display is proportional to the number of lamp beads. To obtain higher clarity, more The more lamp beads are placed, if the space occupied by the LED lamp beads is larger, the number of lamp beads that can be arranged on the LED display screen will be smaller, which will result in lower clarity of the LED display screen and make it difficult to meet people's high requirements for display clarity; moreover, due to the large size difference between the control IC and the RGBW chip, the size of the control IC is significantly larger than the size of the RGBW chip. As the size of the LED lamp beads becomes smaller, if the control IC and the RGBW chip are arranged on the same layer, there will be position limitations, making it difficult to center the RGBW chip, resulting in an irregular layout of the functional areas, which will further reduce the clarity of the display screen. Summary of the Invention

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC. By arranging the IC chip and the RGBW chip in different layer structures, the RGBW packaging layer has sufficient space to accommodate the four RGBW chips. This is conducive to the layout of the RGBW chips and can reduce the overall size of the mini-RGBW-LED lamp bead structure. The mini-RGBW-LED lamp bead structure prepared by the present invention is used to prepare a display screen, which can significantly improve the uniformity and clarity of the display screen image, solving the problem that the current RGBW LED lamp beads with built-in ICs will cause the clarity of the resulting LED display screen to be low when used in a display screen.

[0005] Another object of the present invention is to provide a mini-RGBW-LED lamp bead structure with an embedded IC, which is prepared by the above-mentioned preparation method.

[0006] In order to solve the above technical problems, the present invention provides a method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC, wherein the mini-RGBW-LED lamp bead structure with an embedded IC includes an insulating seat, a conductive pin assembly, an IC chip, an IC pad assembly, and a light-emitting assembly;

[0007] The insulating base includes, from bottom to top, a substrate, an IC packaging layer, and an RGBW packaging layer. The IC pad assembly and the light-emitting assembly are both embedded in the insulating base, and the IC pad assembly is arranged on the top of the substrate. The IC chip is soldered to the top of the IC pad assembly. The IC chip is embedded in the IC packaging layer. The light-emitting assembly is embedded in the RGBW packaging layer. The light-emitting assembly and the IC chip are electrically connected.

[0008] The conductive pin assembly is arranged outside the substrate, and the conductive pin assembly is electrically connected to the IC pad assembly;

[0009] The light-emitting component includes a die-bonding pad, an RGB light-emitting chip, a white light-emitting chip, and a positive light-emitting pad. The die-bonding pad and the positive light-emitting pad are both located at the bottom of the RGBW packaging layer. The RGB light-emitting chip and the white light-emitting chip are respectively installed on the die-bonding pad at intervals, and the RGB light-emitting chip and the white light-emitting chip are arranged in a "straight" shape in the middle of the insulating base.

[0010] The RGB light-emitting chip and the white light-emitting chip are respectively provided with corresponding positive light-emitting pads, the IC chip is electrically connected to the positive light-emitting pads, and the RGB light-emitting chip and the white light-emitting chip are respectively electrically connected to the corresponding positive light-emitting pads;

[0011] The conductive pin assembly includes a negative power pin, and the die-bonding pad is electrically connected to the negative power pin;

[0012] The method for preparing the mini-RGBW-LED lamp bead structure with embedded IC comprises the following steps:

[0013] (1) manufacturing an IC pad assembly on the top of the substrate, wherein the IC pad assembly and the conductive pin assembly are an integrally formed structure, and the conductive pin assembly is arranged outside the substrate;

[0014] (2) soldering an IC chip to the top of the IC pad assembly, so that the GND pad, VDD pad, DI pad, and DO pad of the IC chip are electrically connected to the corresponding pads in the IC pad assembly, and then packaging the IC chip to form an IC packaging layer;

[0015] (3) Making a die-bonding pad and a positive light-emitting electrode pad on the top of the IC packaging layer, and the die-bonding pad and the positive light-emitting electrode pad are respectively arranged on both sides of the top of the IC packaging layer; by making a circuit, the IC chip and the positive light-emitting electrode pad are electrically connected, and the die-bonding pad and the negative power supply pin are electrically connected;

[0016] (4) pressing the RGBW packaging layer having the first packaging hole and the second packaging hole on top of the IC packaging layer;

[0017] (5) Mounting the RGB light-emitting chip and the white light-emitting chip on top of the die-bonding pad, wherein the white light-emitting chip is located inside the first packaging hole and the RGB light-emitting chip is located inside the second packaging hole, so that the cathode of the RGB light-emitting chip and the cathode of the white light-emitting chip are both electrically connected to the die-bonding pad, and the anode of the RGB light-emitting chip and the anode of the white light-emitting chip are respectively electrically connected to the corresponding anode light-emitting pads through bonding wires;

[0018] (6) Fill the first packaging hole 131 with white light packaging glue, and fill the second packaging hole with RGB packaging glue to obtain a mini-RGBW-LED lamp bead structure with an embedded IC.

[0019] Preferably, the RGB light-emitting chip includes a red light chip, a blue light chip and a green light chip;

[0020] The mini-RGBW-LED lamp bead structure with embedded IC also includes four connecting pads, which are independent of each other. The W solder joint, B solder joint, G solder joint and R solder joint of the IC chip are respectively connected to one side of the four connecting pads, and the other sides of the four connecting pads are respectively used to connect the white light emitting chip, the blue light chip, the green light chip and the red light chip;

[0021] The light-emitting positive electrode pads include the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad, and the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad are respectively arranged above the corresponding connecting pads;

[0022] The mini-RGBW-LED lamp bead structure with embedded IC further includes a negative electrode connection pad, the negative electrode connection pad is located on the top of the substrate, and the negative electrode connection pad is located below the die bonding pad, and the negative electrode connection pad is electrically connected to the negative electrode pin of the power supply;

[0023] The method of making a circuit in step (3) to electrically connect the IC chip to the positive light-emitting pad and to electrically connect the die-bonding pad to the negative power supply pin includes the following steps:

[0024] a. Form first electroplated holes at the red light positive electrode pad, blue light positive electrode pad, green light positive electrode pad, and white light positive electrode pad, respectively, and extend the first electroplated holes to the corresponding connection pads; form second electroplated holes on the die-bonding pad, and extend the second electroplated holes to the negative electrode connection pad;

[0025] b. Electroplating is performed in the first electroplating hole and the second electroplating hole so that the electroplated metal completely fills the first electroplating hole and the second electroplating hole, and conductive columns are respectively formed in the first electroplating hole and the second electroplating hole. The red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad are respectively electrically connected to the corresponding connecting pads through the conductive columns, and the die-bonding pad and the negative electrode connecting pad are electrically connected.

[0026] Preferably, the components of the white light encapsulation adhesive include silicone glue and phosphor;

[0027] The components of the RGB packaging glue include epoxy resin glue and diffusion powder.

[0028] Preferably, in the white light encapsulation adhesive, the mass ratio of the silicone glue to the phosphor is (16-39):(3-10).

[0029] Preferably, in the RGB packaging glue, the mass ratio of the epoxy resin glue to the diffusion powder is (2.3-3.7): (0.7-1.0).

[0030] Correspondingly, the present invention also provides a mini-RGBW-LED lamp bead structure with an embedded IC, which is prepared by the above-mentioned method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC;

[0031] The mini-RGBW-LED lamp bead structure with embedded IC includes an insulating seat, a conductive pin assembly, an IC chip, an IC pad assembly and a light-emitting assembly;

[0032] The insulating base includes, from bottom to top, a substrate, an IC packaging layer, and an RGBW packaging layer. The IC pad assembly and the light-emitting assembly are both embedded in the insulating base, and the IC pad assembly is arranged on the top of the substrate. The IC chip is soldered to the top of the IC pad assembly. The IC chip is embedded in the IC packaging layer. The light-emitting assembly is embedded in the RGBW packaging layer. The light-emitting assembly and the IC chip are electrically connected.

[0033] The conductive pin assembly is arranged outside the substrate, and the conductive pin assembly is electrically connected to the IC pad assembly;

[0034] The light-emitting component includes a die-bonding pad, an RGB light-emitting chip, a white light-emitting chip, and a positive light-emitting pad. The die-bonding pad and the positive light-emitting pad are both located at the bottom of the RGBW packaging layer. The RGB light-emitting chip and the white light-emitting chip are respectively installed on the die-bonding pad at intervals, and the RGB light-emitting chip and the white light-emitting chip are arranged in a "straight" shape in the middle of the insulating base.

[0035] The RGB light-emitting chip and the white light-emitting chip are respectively provided with corresponding positive light-emitting pads, the IC chip is electrically connected to the positive light-emitting pads, and the RGB light-emitting chip and the white light-emitting chip are respectively electrically connected to the corresponding positive light-emitting pads;

[0036] The conductive pin assembly includes a negative power pin, and the die-bonding pad is electrically connected to the negative power pin.

[0037] Preferably, the mini-RGBW-LED lamp bead structure with embedded IC further includes a negative electrode connection pad and a plurality of conductive pillars, wherein the plurality of conductive pillars are embedded in the IC packaging layer, the negative electrode connection pad is located on the top of the substrate, and the negative electrode connection pad is located below the die bonding pad, and the negative electrode connection pad is electrically connected to the negative power supply pin through one of the conductive pillars;

[0038] The RGB light-emitting chip includes a red light chip, a blue light chip and a green light chip;

[0039] The mini-RGBW-LED lamp bead structure with embedded IC further includes a connection pad, which is provided on the top of the substrate. There are four connection pads, and the four connection pads are independent of each other.

[0040] The light-emitting positive electrode pads include the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad, and the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad are respectively arranged above the corresponding connecting pads;

[0041] The W solder point, B solder point, G solder point and R solder point of the IC chip are respectively connected to one side of the four connecting pads, and the other sides of the four connecting pads are respectively electrically connected to the white light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the red light positive electrode pad through conductive columns.

[0042] Preferably, the conductive pin assembly further includes a positive power pin, a data input pin, and a data output pin, and the negative power pin, the positive power pin, the data input pin, and the data output pin are respectively arranged at the four corners of the substrate;

[0043] The mini-RGBW-LED lamp bead structure with built-in IC also includes a plurality of conductive metal wires;

[0044] The IC pad assembly includes an IC positive pad, an IC negative pad, an IC data input pad, and an IC data output pad, wherein the IC positive pad is electrically connected to the positive power pin via a conductive metal wire, the IC negative pad is electrically connected to the negative power pin via a conductive metal wire, the IC data input pad is electrically connected to the data input pin via a conductive metal wire, and the IC data output pad is electrically connected to the data output pin via a conductive metal wire;

[0045] The GND solder joint of the IC chip is connected to the IC negative pad, the VDD solder joint of the IC chip is connected to the IC positive pad, the DI solder joint of the IC chip is connected to the IC data input pad, and the DO solder joint of the IC chip is connected to the IC data output pad.

[0046] Preferably, the ratio of the width of the conductive metal wire to the width of the insulating seat is (0.035-0.07):1.

[0047] Preferably, the ratio of the area of ​​the upper surface of the die-bonding pad to the area of ​​the cross section of the insulating seat is (0.3-0.6):1.

[0048] The implementation of the present invention has the following beneficial effects:

[0049] The insulating base of the mini-RGBW-LED lamp bead structure prepared by the preparation method of the present technical solution includes a substrate, an IC packaging layer, and an RGBW packaging layer arranged in sequence from bottom to top, wherein the IC pad assembly is arranged on the top of the substrate, the IC chip is soldered to the top of the IC pad assembly, and the IC chip is embedded in the IC packaging layer. The light-emitting component is embedded in the RGBW packaging layer, so that the IC packaging layer is used to layout the IC functional layer, and the RGBW packaging layer is used to layout the RGBW chip functional layer. The IC functional layer and the RGBW chip functional layer of the present technical solution are in different layer structures, so that the RGBW packaging layer has sufficient space to accommodate four RGBW chips, which is conducive to the layout of the RGBW chip, so that the RGBW chip can be placed in the center, making the lamp bead brighter and improving the uniformity and clarity of the display screen. In addition, thanks to the different layer structures of the IC functional layer and the RGBW chip functional layer, the space occupied by the mini-RGBW-LED lamp bead structure can be effectively reduced, so that more lamp beads can be arranged on the LED display screen, thereby further improving the brightness and clarity of the LED display screen. On the other hand, since the mini-RGBW-LED lamp bead structure of this technical solution adopts a two-layer functional structure setting, and the IC chip is located at the bottom of the insulating seat, the distance between the IC chip and the bottom surface of the substrate is closer, which is more conducive to the heat dissipation of the IC chip, making the overall heat dissipation performance of the mini-RGBW-LED lamp bead structure better, and can increase the life of the mini-RGBW-LED lamp bead structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 This is a schematic diagram of the preparation process of a mini-RGBW-LED lamp bead structure with an embedded IC in one embodiment of the present invention;

[0051] Figure 2 This is a schematic diagram of the structure of a mini-RGBW-LED lamp bead with an embedded IC in one embodiment of the present invention;

[0052] Figure 3 yes Figure 2 The front view of the mini-RGBW-LED lamp bead structure shown;

[0053] Figure 4 yes Figure 2 The longitudinal cross-sectional view of the mini-RGBW-LED lamp bead structure at the conductive column shown;

[0054] Figure 5 yes Figure 2 A cross-sectional view of the mini-RGBW-LED lamp bead structure at the IC pad assembly is shown;

[0055] Figure 6yes Figure 5 The schematic diagram of the mini-RGBW-LED lamp structure after installing the IC chip;

[0056] Figure 7 yes Figure 2 The cross-sectional view of the mini-RGBW-LED lamp bead structure at the die bonding pad is shown;

[0057] Figure 8 yes Figure 2 The back view of the mini-RGBW-LED lamp bead structure shown;

[0058] Figure 9 yes Figure 2 Schematic diagram of the IC chip structure in the mini-RGBW-LED lamp bead structure shown;

[0059] In the figure: insulating seat 1, conductive pin assembly 2, IC chip 3, IC pad assembly 4, connecting pad 6, conductive column 7, conductive metal wire 8, negative connecting pad 9, substrate 11, IC packaging layer 12, RGBW packaging layer 13, power negative pin 21, power positive pin 22, data input pin 23, data output pin 24, IC positive pad 41, IC negative pad 42, IC data input pad 43, IC data output pad 44, die bonding pad 51, RGB light emitting chip 52, white light emitting chip 53, light positive pad 54 , white light packaging glue 55, RGB packaging glue 56, red light connecting pad 61, green light connecting pad 62, blue light connecting pad 63, white light connecting pad 64, GND solder point 31, VDD solder point 32, DI solder point 33, DO solder point 34, R solder point 35, G solder point 36, B solder point 37, W solder point 38, first packaging hole 131, second packaging hole 132, red light chip 521, blue light chip 522, green light chip 523, red light positive electrode pad 541, blue light positive electrode pad 542, green light positive electrode pad 543, white light positive electrode pad 544. DETAILED DESCRIPTION

[0060] To make the objectives, technical solutions, and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present invention.

[0061] In the description of the present invention, it should be understood that the terms "up", "down", "left", "right", "top", "bottom", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0062] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted" and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0063] like Figures 1 to 9 As shown, a method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC is provided, wherein the mini-RGBW-LED lamp bead structure with an embedded IC includes an insulating seat 1, a conductive pin assembly 2, an IC chip 3, an IC pad assembly 4, and a light-emitting assembly;

[0064] The insulating base 1 includes, from bottom to top, a substrate 11, an IC packaging layer 12, and an RGBW packaging layer 13. The IC pad assembly 4 and the light-emitting assembly are both embedded in the insulating base 1, and the IC pad assembly 4 is arranged on the top of the substrate 11. The IC chip 3 is soldered to the top of the IC pad assembly 4. The IC chip 3 is embedded in the IC packaging layer 12. The light-emitting assembly is embedded in the RGBW packaging layer 13. The light-emitting assembly and the IC chip 3 are electrically connected.

[0065] The conductive pin assembly 2 is disposed outside the substrate 11 , and the conductive pin assembly 2 is electrically connected to the IC pad assembly 4 ;

[0066] The light-emitting component includes a die-bonding pad 51, an RGB light-emitting chip 52, a white light-emitting chip 53, and a positive light-emitting pad 54. The die-bonding pad 51 and the positive light-emitting pad 54 are both located at the bottom of the RGBW packaging layer 13. The RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively installed on the die-bonding pad 51 at intervals, and the RGB light-emitting chip 52 and the white light-emitting chip 53 are arranged in a "straight line" in the middle of the insulating base 1.

[0067] The RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively provided with corresponding positive light-emitting pads 54, the IC chip 3 is electrically connected to the positive light-emitting pads 54, and the RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively electrically connected to the corresponding positive light-emitting pads 54;

[0068] The conductive pin assembly 2 includes a negative power pin 21, and the die-bonding pad 51 is electrically connected to the negative power pin 21;

[0069] The method for preparing the mini-RGBW-LED lamp bead structure with embedded IC comprises the following steps:

[0070] (1) An IC pad assembly 4 is fabricated on top of a substrate 11. The IC pad assembly 4 and the conductive pin assembly 2 are integrally formed. The conductive pin assembly 2 is disposed outside the substrate 11.

[0071] (2) soldering the IC chip 3 to the top of the IC pad assembly 4, so that the GND pad 31, VDD pad 32, DI pad 33 and DO pad 34 of the IC chip 3 are electrically connected to the corresponding pads in the IC pad assembly 4, and then packaging the IC chip to form an IC packaging layer 12;

[0072] (3) A die-bonding pad 51 and a positive light-emitting pad 54 are fabricated on the top of the IC packaging layer 12. The die-bonding pad 51 and the positive light-emitting pad 54 are respectively disposed on both sides of the top of the IC packaging layer 12. A circuit is fabricated to electrically connect the IC chip 3 and the positive light-emitting pad 54, and to electrically connect the die-bonding pad 51 and the negative power supply pin 21.

[0073] (4) Pressing the RGBW packaging layer 13 with the first packaging hole 131 and the second packaging hole 132 onto the top of the IC packaging layer 12;

[0074] (5) Mounting the RGB light-emitting chip 52 and the white light-emitting chip 53 on top of the die-bonding pad 51, wherein the white light-emitting chip 53 is located inside the first packaging hole 131 and the RGB light-emitting chip 52 is located inside the second packaging hole 132, so that the cathode of the RGB light-emitting chip 52 and the cathode of the white light-emitting chip 53 are both electrically connected to the die-bonding pad 51, and the anode of the RGB light-emitting chip 52 and the anode of the white light-emitting chip 53 are respectively electrically connected to the corresponding anode light-emitting pad 54 through bonding wires;

[0075] (6) Fill the first packaging hole 131 with white light packaging glue 55, and fill the second packaging hole 132 with RGB packaging glue 56 to obtain a mini-RGBW-LED lamp bead structure with an embedded IC.

[0076] It is worth noting that the insulating seat 1 of the mini-RGBW-LED lamp bead structure prepared by the preparation method of the present technical solution includes a substrate 11, an IC packaging layer 12 and an RGBW packaging layer 13 arranged in sequence from bottom to top, wherein the IC pad assembly 4 is arranged on the top of the substrate 11, the IC chip 3 is soldered to the top of the IC pad assembly 4, and the IC chip 3 is embedded in the inside of the IC packaging layer 12, and the light-emitting component is embedded in the inside of the RGBW packaging layer 13, so that the IC packaging layer 12 serves as the IC functional layer, and the RGBW packaging layer 13 serves as the RGBW chip functional layer. The IC functional layer and the RGBW chip functional layer of the present technical solution are in different layer structures, so that the RGBW packaging layer 13 has enough space to place four RGBW chips, which is conducive to the layout of the RGBW chip, so that the RGBW chip can be set in the center, so that the lamp bead brightness is higher, and the uniformity and clarity of the display screen can be improved. Furthermore, thanks to the fact that the IC functional layer and the RGBW chip functional layer are in different layer structures, the space occupied by the mini-RGBW-LED lamp bead structure can be effectively reduced, allowing the LED display screen to accommodate more lamp beads, thereby further improving the brightness and clarity of the LED display screen. On the other hand, since the mini-RGBW-LED lamp bead structure of this technical solution adopts a two-layer functional structure, and the IC chip 3 is located at the bottom of the insulating base 1, the distance between the IC chip 3 and the bottom surface of the substrate 11 is closer, which is more conducive to the heat dissipation of the IC chip 3, making the overall heat dissipation performance of the mini-RGBW-LED lamp bead structure better, and can prolong the life of the mini-RGBW-LED lamp bead structure.

[0077] This technical solution redesigns the mini-RGBW-LED lamp bead structure, embedding an IC within the traditional RGBW-LED structure and integrating the control circuitry within the LED bead. This significantly reduces the number of external circuits and wiring, simplifying the circuit design and thus making the display screen easier to manufacture and install. Furthermore, by placing an IC chip within the mini-RGBW-LED lamp bead structure and integrating the control circuitry within the bead itself, this solution reduces display screen failures caused by poor external circuit connections or component failures, thereby improving overall reliability and stability. Furthermore, the embedded IC design allows each bead to be independently controlled, providing tremendous flexibility and convenience, and resulting in a richer display screen.

[0078] To further illustrate, the light-emitting assembly of this technical solution includes a die-bonding pad 51, an RGB light-emitting chip 52, a white light-emitting chip 53, and a positive light-emitting pad 54. Both the RGB light-emitting chip 52 and the white light-emitting chip 53 are mounted on the die-bonding pad 51 and controlled by the IC chip 3. This technical solution sets the white light-emitting chip 53 on the RGBW-LED lamp bead, allowing the RGBW-LED lamp bead of this technical solution to illuminate the individual white light-emitting chip 53, making the display brighter.

[0079] Specifically, the method of making the IC pad assembly 4 on the top of the substrate 11 in step (1) of the present technical solution is well known, and a commonly used method in the art can be used. For example, in one embodiment of the present technical solution, a substrate 11 of a desired shape can be prepared by a conventional method, and the material of the substrate 11 is BT resin; the IC pad assembly and the conductive pin assembly integrated structure of the desired specific structure can be obtained by stamping and stretching the metal substrate; and the IC pad assembly and the conductive pin assembly integrated structure can be fixed on the top of the substrate 11 by a commonly used method in the art. For example, the IC pad assembly and the conductive pin assembly integrated structure can be heated to a certain temperature so that the heated IC pad assembly and the conductive pin assembly integrated structure can melt the surface of the substrate 11. After cooling, the IC pad assembly and the conductive pin assembly integrated structure can be fixed on the top of the substrate 11.

[0080] Specifically, in step (2), BT resin is used to encapsulate the IC chip to form the IC encapsulation layer 12. In step (3), the method of making the die-bonding pad 51 and the positive light-emitting electrode pad 54 on top of the IC encapsulation layer 12 is well known. The method of making the IC pad assembly 4 on top of the substrate 11 in step (1) above can be used, but is not limited to this. In step (4), the material of the RGBW encapsulation layer 13 is ET resin.

[0081] To further illustrate, the RGB light emitting chip 52 includes a red light chip 521 , a blue light chip 522 and a green light chip 523 ;

[0082] The mini-RGBW-LED lamp bead structure with embedded IC also includes four connecting pads 6. The four connecting pads 6 are independent of each other. The W solder joint 38, B solder joint 37, G solder joint 36 and R solder joint 35 of the IC chip 3 are respectively connected to one side of the four connecting pads 6. The other sides of the four connecting pads 6 are respectively used to connect the white light emitting chip 53, the blue light chip 522, the green light chip 523 and the red light chip 521.

[0083] The light-emitting positive electrode pads 54 include the red light positive electrode pad 541, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the white light positive electrode pad 544. The red light positive electrode pad 541, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the white light positive electrode pad 544 are respectively arranged above the corresponding connecting pads 6;

[0084] The mini-RGBW-LED lamp bead structure with embedded IC further includes a negative electrode connecting pad 9, which is located on the top of the substrate 11 and below the die-bonding pad 51. The negative electrode connecting pad 9 is electrically connected to the negative power supply pin 21.

[0085] In step (3), the method of making a circuit to electrically connect the IC chip 3 and the positive light-emitting electrode pad 54 and to electrically connect the die-bonding pad 51 and the negative power supply pin 21 includes the following steps:

[0086] a. Form first electroplated holes on the red light positive electrode pad 541, the blue light positive electrode pad 542, the green light positive electrode pad 543, and the white light positive electrode pad 544, respectively, and extend to the corresponding connecting pads 6; form second electroplated holes on the die-bonding pad 51, and extend to the negative electrode connecting pad 9; specifically, the first electroplated holes and the second electroplated holes can be formed by mechanical drilling or etching;

[0087] b. Electroplating is performed in the first electroplating hole and the second electroplating hole so that the electroplated metal (such as copper) completely fills the first electroplating hole and the second electroplating hole, and conductive columns 7 are respectively formed in the first electroplating hole and the second electroplating hole. The red light positive electrode pad 541, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the white light positive electrode pad 544 are respectively electrically connected to the corresponding connecting pads 6 through the conductive columns 7, and the die-bonding pad 51 and the negative electrode connecting pad 9 are electrically connected.

[0088] Specifically, in step (5), the positive electrode of the red light chip 521 is connected to the red light positive electrode pad 541 through a bonding wire, the positive electrode of the blue light chip 522 is connected to the blue light positive electrode pad 542 through a bonding wire, the positive electrode of the green light chip 523 is connected to the green light positive electrode pad 543 through a bonding wire, and the positive electrode of the white light emitting chip 53 is connected to the white light positive electrode pad 544 through a bonding wire; and the negative electrode of the red light chip 521 is electrically connected to the die bonding pad 51, the negative electrode of the green light chip 523 is electrically connected to the die bonding pad 51 through a bonding wire, the negative electrode of the blue light chip 522 is electrically connected to the die bonding pad 51 through a bonding wire, and the negative electrode of the white light emitting chip 53 is electrically connected to the die bonding pad 51 through a bonding wire, thereby achieving electrical connection.

[0089] Preferably, the conductive pillar 7 is made of copper, which has better conductivity.

[0090] To further illustrate, the components of the white light encapsulation glue 55 include silicone glue and phosphor;

[0091] The components of the RGB packaging glue 56 include epoxy resin glue and diffusion powder.

[0092] Specifically, the first packaging hole 131 of the present technical solution is filled with white light encapsulation glue 55, which can make the white light-emitting chip 53 emit white light, further improving the brightness of the RGBW-LED lamp bead structure of the present technical solution, thereby making the display screen brighter. The material of the white light encapsulation glue 55 of the present technical solution is well known and can be purchased directly from the market, or the required materials can be purchased and simply mixed to obtain it. In a preferred embodiment of the present technical solution, the white light-emitting chip 53 is a blue light chip, and a mixture of silicone glue and phosphor can be used as the white light encapsulation glue, so that it will emit white light after emitting light, thereby increasing the brightness of the display screen.

[0093] Specifically, the second packaging hole 132 of the present technical solution is filled with RGB encapsulation glue 56. The material of RGB encapsulation glue 56 is well-known and can be purchased directly from the market, or the required materials can be purchased and simply mixed using existing processes. For example, the material of RGB encapsulation glue 56 is epoxy resin glue, or it can be a mixture of epoxy resin glue and diffusion powder. As a preferred embodiment of the present technical solution, the components of RGB encapsulation glue 56 include epoxy resin glue and diffusion powder. By adding diffusion powder, the RGB encapsulation glue 56 has a good refractive index and light transmittance, while also having good water vapor barrier and shock absorption and impact resistance.

[0094] As a further explanation, in the white light encapsulation adhesive 55 , the mass ratio of the silicone adhesive to the phosphor is (16-39):(3-10).

[0095] It is worth noting that the white light-emitting chip 53 of this technical solution is a blue light chip. By using a mixture of silicone glue and phosphor, the chip can emit white light. The principle is as follows: phosphor is a light-converting material that absorbs light of a specific wavelength (usually blue) and emits light of another wavelength (usually yellow or yellow-green). During the LED packaging process, the phosphor is coated on the blue light chip. When the blue light emitted by the blue light chip hits the phosphor particles, a portion of the blue light is absorbed by the phosphor and stimulated to emit yellow or yellow-green light. According to the principle of color addition, the mixing of blue light and yellow light (or yellow-green light) produces white light. In the LED package, the blue light not absorbed by the phosphor and the yellow light (or yellow-green light) stimulated by the phosphor mix together to form the white light perceived by the human eye. In this technical solution, the mass ratio of silicone glue to the phosphor is (16-39): (3-10). Within this mass ratio range, the light produced is slightly white, rather than blue, green, or yellow-green.

[0096] More preferably, the mass ratio of the silicone glue and the phosphor in the white light encapsulation glue 55 is 22:6.7. Within this mass ratio, a purer white light can be obtained, thereby achieving a better effect of increasing the brightness and clarity of the display screen.

[0097] Specifically, silicone glue typically includes component A and component B. In the white light encapsulant 55, the mass ratio of component A, component B, and phosphor is (1-4):(15-35):(3-10). Preferably, the mass ratio of component A:component B:phosphor in the white light encapsulant 55 is 2:20:6.7.

[0098] Specifically, the silicone glue and phosphor powder used in this technical solution can be purchased on the market.

[0099] To further illustrate, in the RGB packaging glue 56 , the mass ratio of the epoxy resin glue to the diffusion powder is (2.3-3.7): (0.7-1.0).

[0100] It is worth noting that the mass ratio of epoxy resin glue and diffusion powder in the RGB packaging glue 56 of the present technical solution is (2.3~3.7): (0.7~1.0). By mixing a specific proportion of diffusion powder into the RGB packaging glue 56, the propagation path and uniformity of light can be increased, which helps to reduce the reflection and refraction loss of light inside the packaging structure, improve the light extraction efficiency, and make the light emitted by the RGB light-emitting chip 52 present a more consistent color after mixing, which helps to reduce color deviation and color spot phenomenon, improve the uniformity and consistency of the display effect, and enable the RGB light-emitting chip 52 to present brighter and more vivid colors when displayed.

[0101] Specifically, epoxy resin glue generally includes component A and component B. In the RGB packaging glue 56 , the mass ratio of component A, component B, and diffusion powder is (1.5-2.5): (0.8-1.2): (0.7-1.0).

[0102] Preferably, in the RGB encapsulation glue 56 , the mass ratio of component A, component B and diffusion powder is 2:1:0.9, which can enable the RGB light-emitting chip 52 to present a better effect during display.

[0103] It is worth mentioning that the epoxy resin glue and diffusion powder used in this technical solution can be purchased on the market.

[0104] A mini-RGBW-LED lamp bead structure with an embedded IC is prepared by the above-mentioned method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC;

[0105] The mini-RGBW-LED lamp bead structure with embedded IC includes an insulating base 1, a conductive pin assembly 2, an IC chip 3, an IC pad assembly 4 and a light-emitting assembly;

[0106] The insulating base 1 includes, from bottom to top, a substrate 11, an IC packaging layer 12, and an RGBW packaging layer 13. The IC pad assembly 4 and the light-emitting assembly are both embedded in the insulating base 1, and the IC pad assembly 4 is arranged on the top of the substrate 11. The IC chip 3 is soldered to the top of the IC pad assembly 4. The IC chip 3 is embedded in the IC packaging layer 12. The light-emitting assembly is embedded in the RGBW packaging layer 13. The light-emitting assembly and the IC chip 3 are electrically connected.

[0107] The conductive pin assembly 2 is disposed outside the substrate 11 , and the conductive pin assembly 2 is electrically connected to the IC pad assembly 4 ;

[0108] The light-emitting component includes a die-bonding pad 51, an RGB light-emitting chip 52, a white light-emitting chip 53, and a positive light-emitting pad 54. The die-bonding pad 51 and the positive light-emitting pad 54 are both located at the bottom of the RGBW packaging layer 13. The RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively installed on the die-bonding pad 51 at intervals, and the RGB light-emitting chip 52 and the white light-emitting chip 53 are arranged in a "straight line" in the middle of the insulating base 1.

[0109] The RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively provided with corresponding positive light-emitting pads 54, the IC chip 3 is electrically connected to the positive light-emitting pads 54, and the RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively electrically connected to the corresponding positive light-emitting pads 54;

[0110] The conductive pin assembly 2 includes a negative power pin 21 , and the die-bonding pad 51 is electrically connected to the negative power pin 21 .

[0111] It is worth noting that this technical solution redesigns the lamp bead structure and process preparation method. The insulating base of the lamp bead structure includes a substrate 11 and an IC packaging layer 12 and an RGBW packaging layer 13 sequentially arranged on the substrate 11. The lamp bead has a two-layer functional structure: the IC functional layer is arranged in the IC packaging layer 12, and the RGBW chip functional layer is arranged in the RGBW packaging layer 13. The RGBW packaging layer 13 is provided with a first packaging hole 131 and a second packaging hole 132, so that the RGBW packaging layer 13 forms an RGB area and a white light area. The materials of the substrate 11, IC packaging layer 12, and RGBW packaging layer 13 are all BT resin. The RGBW chip functional layer and the IC functional layer are conductively connected via conductive pillars 7. The back pad of the substrate 11 is the pin for lighting the lamp beads; the IC chip uses a flip-chip process and is fixed by solder paste; the second layer of RGBW chips uses a face-up process, the red light chip 521 is fixed by a solid crystal silver glue, the blue light chip 522 and the green light chip 523 are fixed by a solid crystal insulating glue, and the chip and the wire area (i.e., the solid crystal pad 51 and the positive electrode pad 54) are connected by bonding wires, and then packaged by a dispensing process. The RGB light-emitting chip 52 is packaged with an RGB packaging glue 56 composed of epoxy resin glue and diffusion powder, and the white light area is packaged with a silicone glue and phosphor. White light encapsulation glue 55; finally, by cutting and splitting the material, a lamp bead with specific photoelectric characteristics is formed; as the size of the lamp bead becomes smaller, placing the IC and RGBW on the same layer has positional limitations, and the functional area layout is irregular, which can easily lead to unclear display screen images. Therefore, the IC chip is placed in the IC packaging layer 12 to facilitate IC heat dissipation, and to allow the RGBW packaging layer 13 to have enough space to place the four RGBW chips, and more metal parts can be retained, so that the heat dissipation performance is better. The first packaging hole 131 and the second packaging hole 132 of the RGBW packaging layer 13 are in a bowl-cup structure, and the airtightness is also improved compared to conventional RGB lamp beads. The mini-RGBW-LED lamp bead structure with embedded IC in this technical solution integrates the control circuit into the LED, making the circuit simpler, thereby making it easier to manufacture and install. This packaging technology not only increases the life of the lamp bead; the design of embedded IC allows each lamp bead to be independently controlled, providing great flexibility and convenience, making the display screen more colorful, and the RGBW lamp bead can light up a separate white light chip, making the display screen brighter.

[0112] Further explanation, the mini-RGBW-LED lamp bead structure with embedded IC also includes a negative electrode connection pad 9 and multiple conductive pillars 7. The multiple conductive pillars 7 are embedded in the IC packaging layer 12. The negative electrode connection pad 9 is located on the top of the substrate 11 and below the die bonding pad 51. The negative electrode connection pad 9 is electrically connected to the negative power supply pin 21 through one of the conductive pillars 7.

[0113] The RGB light emitting chip 52 includes a red light chip 521, a blue light chip 522 and a green light chip 523;

[0114] The mini-RGBW-LED lamp bead structure with embedded IC further includes a connecting pad 6, which is provided on the top of the substrate 11. There are four connecting pads 6, and the four connecting pads 6 are independent of each other.

[0115] The light-emitting positive electrode pads 54 include the red light positive electrode pad 541, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the white light positive electrode pad 544. The red light positive electrode pad 541, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the white light positive electrode pad 544 are respectively arranged above the corresponding connecting pads 6;

[0116] The W solder joint 38, B solder joint 37, G solder joint 36 and R solder joint 35 of the IC chip 3 are respectively connected to one side of the four connecting pads 6, and the other sides of the four connecting pads 6 are respectively electrically connected to the white light positive electrode pad 544, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the red light positive electrode pad 541 through the conductive column 7, so that the IC functional layer and the RGBW chip functional layer of this technical solution are conductively connected through the conductive column 7.

[0117] Further explanation, the conductive pin assembly 2 further includes a positive power pin 22, a data input pin 23 and a data output pin 24, and the negative power pin 21, the positive power pin 22, the data input pin 23 and the data output pin 24 are respectively arranged at the four corners of the substrate 11;

[0118] The mini-RGBW-LED lamp bead structure with built-in IC also includes a plurality of conductive metal wires 8;

[0119] The IC pad assembly 4 includes an IC positive pad 41, an IC negative pad 42, an IC data input pad 43, and an IC data output pad 44. The IC positive pad 41 is electrically connected to the positive power pin 22 via a conductive metal wire 8, the IC negative pad 42 is electrically connected to the negative power pin 21 via a conductive metal wire 8, the IC data input pad 43 is electrically connected to the data input pin 23 via a conductive metal wire 8, and the IC data output pad 44 is electrically connected to the data output pin 24 via a conductive metal wire 8.

[0120] The GND solder point 31 of the IC chip 3 is connected to the IC negative pad 42, the VDD solder point 32 of the IC chip 3 is connected to the IC positive pad 41, the DI solder point 33 of the IC chip 3 is connected to the IC data input pad 43, and the DO solder point 34 of the IC chip 3 is connected to the IC data output pad 44.

[0121] The present technical solution has four connecting pads 6, namely a red light connecting pad 61, a green light connecting pad 62, a blue light connecting pad 63 and a white light connecting pad 64, and the four connecting pads 6 are independent of each other;

[0122] The IC chip 3 is provided with eight solder joints, namely a GND solder joint 31, a VDD solder joint 32, a DI solder joint 33, a DO solder joint 34, an R solder joint 35, a G solder joint 36, a B solder joint 37 and a W solder joint 38. The GND solder joint 31 is connected to the IC negative electrode pad 42, the VDD solder joint 32 is connected to the IC positive electrode pad 41, the DI solder joint 33 is connected to the IC data input pad 43, the DO solder joint 34 is connected to the IC data output pad 44, the R solder joint 35 is connected to the red light connection pad 61, the G solder joint 36 is connected to the green light connection pad 62, the B solder joint 37 is connected to the blue light connection pad 63, and the W solder joint 38 is connected to the white light connection pad 64.

[0123] The present technical solution optimizes and improves the structure and layout of the conductive pin assembly 2, the IC pad assembly 4, and the connecting pad 6, making the layout of the IC functional layer and the conductive pins more compact, which is conducive to reducing the volume of the entire mini-RGBW-LED lamp bead structure; and can enable the IC chip 3 to be flipped, which not only shortens the signal transmission path, helps to reduce delay, and improves the signal transmission speed and stability, but also helps the IC chip 3 dissipate heat, which can further improve the stability and reliability of the lamp bead; at the same time, the flip-chip IC chip 3 can simplify the packaging process and reduce production costs to a certain extent. The negative power pin 21, the positive power pin 22, the data input pin 23, and the data output pin 24 of the present technical solution are respectively arranged at the four corners of the bottom of the substrate 11, which is not only conducive to wiring on the external PCB board, avoiding interference and conflict between pins, making the wiring clearer and more standardized, but also separates the pins with different functions, which can reduce electrical interference between them and improve the transmission quality of the signal.

[0124] Preferably, a first identification portion (not shown) is provided at the bottom of the substrate 11. Since the negative power pin 21, the positive power pin 22, the data input pin 23, and the data output pin 24 are respectively provided at the four corners of the bottom of the insulating seat 1, and the structures and shapes of these four pins are consistent, it is difficult to distinguish the negative power pin 21 from the positive power pin 22. Therefore, providing the first identification portion at the bottom of the insulating seat is conducive to identifying the negative power pin 21 and the positive power pin 22. Preferably, the first identification portion is provided at the bottom of the IC chip 3 to identify the solder joints of the IC chip 3.

[0125] To further illustrate, the top surface of the RGBW packaging layer 13 has two recessed areas to form a first packaging hole 131 and a second packaging hole 132. The depths of the first packaging hole 131 and the second packaging hole 132 extend to the die-bonding pad 51, respectively. The white light-emitting chip 53 is located in the first packaging hole 131, and the three RGB light-emitting chips, the red light chip 521, the blue light chip 522, and the green light chip 523, are located inside the second packaging hole 132.

[0126] The interior of the first packaging hole 131 is filled with white light packaging glue 55, and the interior of the second packaging hole 132 is filled with RGB packaging glue 56, so that the white light-emitting chip 53 and the RGB light-emitting chip 52 are tightly wrapped, which can improve the airtightness of the RGBW-LED lamp bead.

[0127] Preferably, the top surfaces of the white light encapsulation glue 55 and the RGB encapsulation glue 56 are flush with the top surface of the insulating seat 1, which can ensure the integrity of the packaging structure, improve the packaging reliability, optimize the optical performance and simplify the production process, and help improve the overall performance and quality of the mini-RGBW-LED lamp bead structure to meet the needs of various application scenarios.

[0128] To further illustrate, the ratio of the width of the conductive metal wire 8 to the width of the insulating seat 1 is (0.035-0.07):1.

[0129] It is worth noting that the soldering reel of the traditional mini-RGBW-LED lamp bead structure is usually directly connected to the conductive pin. Due to the large area of ​​the soldering reel, the deformation of the soldering reel due to thermal expansion and contraction under long-term operation of the mini-RGBW-LED lamp bead structure is also large, which can easily lead to small gaps or voids between the soldering reel and the insulating seat, reducing the airtightness of the mini-RGBW-LED lamp bead structure. In the present technical solution, the IC pad assembly 4 includes an IC positive pad 41, an IC negative pad 42, an IC data input pad 43, and an IC data output pad 44, wherein the IC positive pad 41, the IC negative pad 42, the IC data input pad 43, and the IC data output pad 44 are respectively connected by a conductive metal wire 8 and a corresponding conductive pin, so that the area of ​​the four pads of the IC positive pad 41, the IC negative pad 42, the IC data input pad 43, and the IC data output pad 44 of the present technical solution can be designed to be smaller, much smaller than the traditional IC bonding pad, and the width of the conductive metal wire 8 is also very small (such as Figure 5 As shown), it can effectively reduce the deformation amplitude of the IC pad assembly 4 and the conductive metal wire 8 during thermal expansion and contraction, thereby ensuring that the mini-RGBW-LED lamp bead structure of this technical solution can maintain good airtightness for a long time, thereby ensuring the reliability and durability of the mini-RGBW-LED lamp bead structure.

[0130] Further explanation, one side of the conductive metal wire 8 used to connect the IC negative electrode pad 42 and the negative power supply pin 21 is provided with a negative electrode connecting pad 9 connected to the conductive metal wire 8, and the solid crystal pad 51 is connected to the negative electrode connecting pad 9 through the conductive column 7, thereby electrically connecting the solid crystal pad 51 to the negative power supply pin 21.

[0131] Preferably, the negative power pin 21, positive power pin 22, data input pin 23, and data output pin 24 of this technical solution have the same structure, each comprising an embedded portion and an external portion. The embedded portion is embedded within the substrate 11 and connected to the conductive metal wire 8; the external portion is provided outside the insulating base 1 for connection to the client's PCB board. Preferably, the embedded portion is a curved sheet structure, with one side of the embedded portion contacting the insulating base 1 and the other side filled with resin (such as epoxy resin), giving the lamp bead an overall square shape, which is more conducive to integration.

[0132] To further illustrate, the ratio of the area of ​​the upper surface of the die-bonding pad 51 to the area of ​​the cross section of the insulating base 1 is (0.3-0.6):1.

[0133] It is worth noting that the height difference between the IC chip 3 and the RGBW chip in this technical solution creates a two-layer functional structure, consisting of an IC functional layer and an RGBW chip functional layer, from bottom to top. Placing the IC chip 3 in the bottom IC functional layer facilitates heat dissipation, while placing the RGBW chip in the top RGBW chip functional layer prevents the IC chip 3 from interfering with the RGBW chip layout. This leaves ample space in the top RGBW chip functional layer for the four RGBW chips, allowing them to be centrally positioned. For example, in a preferred embodiment of this technical solution, the four RGBW chips are arranged in a spaced-apart arrangement, forming a "straight" shape in the center of the lamp bead. This not only increases the brightness of the lamp bead and, consequently, the clarity of the display, but also, because the RGBW chip functional layer is separately provided, more metal components, such as the die-bonding pad 51 and the positive electrode pad 54, can be retained, resulting in better heat dissipation. This facilitates heat dissipation from the four RGBW chips and the IC chip 3, further enhancing the heat dissipation performance of the mini-RGBW-LED lamp bead structure.

[0134] As a preferred embodiment, the ratio of the area of ​​the upper surface of the die-bonding pad 51 to the area of ​​the cross section of the insulating seat 1 in this technical solution is (0.3-0.6): 1 (as Figure 7 , exemplarily 0.3:1, 0.35:1, 0.4:1, 0.45:1, 0.5:1, 0.55:1, and 0.6:1, but not limited thereto. The die-bonding pad 51 of this technical solution has a larger area and is made of metal, which is beneficial for heat dissipation and improving the overall performance of the mini-RGBW-LED lamp bead structure.

[0135] Preferably, the mini-RGBW-LED lamp bead structure with built-in IC described in the present technical solution has a length of 2.0 to 4.0 mm, a width of 2.0 to 4.0 mm, and a height of 1.2 to 3.5 mm.

[0136] Currently, IC-embedded lamp beads generally incorporate the IC chip and light-emitting chip within a single layer. Due to the large size of the IC chip, this results in larger IC-embedded lamp beads. Since the clarity of an LED display is directly proportional to the number of lamp beads, using larger lamp beads within a given display size reduces the number of lamp beads that can be arranged, resulting in reduced clarity. This technical solution sets the mini-RGBW-LED lamp bead structure with built-in IC as a two-layer functional structure (i.e., IC packaging layer 12 and RGBW packaging layer 13). The IC functional layer and the RGBW chip functional layer are located in different vertical layer structures, so that the overall size of the manufactured lamp bead is smaller. The mini-RGBW-LED lamp bead structure with built-in IC in this technical solution has a length of 2.0 to 4.0 mm, a width of 2.0 to 4.0 mm, and a height of 1.2 to 3.5 mm, which is close to the size of a conventional Mini RGB LED without embedded IC. Therefore, the mini-RGBW-LED lamp bead structure with built-in IC in this technical solution can provide higher resolution and more detailed display effects in a smaller space, ensuring that the LED display has better clarity.

[0137] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC, characterized in that: The mini-RGBW-LED lamp bead structure with embedded IC includes an insulating seat, a conductive pin assembly, an IC chip, an IC pad assembly and a light-emitting assembly; The insulating base includes, from bottom to top, a substrate, an IC packaging layer, and an RGBW packaging layer. The IC pad assembly and the light-emitting assembly are both embedded in the insulating base, and the IC pad assembly is arranged on the top of the substrate. The IC chip is soldered to the top of the IC pad assembly. The IC chip is embedded in the IC packaging layer. The light-emitting assembly is embedded in the RGBW packaging layer. The light-emitting assembly and the IC chip are electrically connected. The conductive pin assembly is arranged outside the substrate, and the conductive pin assembly is electrically connected to the IC pad assembly; The light-emitting component includes a die-bonding pad, an RGB light-emitting chip, a white light-emitting chip, and a positive light-emitting pad. The die-bonding pad and the positive light-emitting pad are both located at the bottom of the RGBW packaging layer. The RGB light-emitting chip and the white light-emitting chip are respectively installed on the die-bonding pad at intervals, and the RGB light-emitting chip and the white light-emitting chip are arranged in a "straight" shape in the middle of the insulating base. The RGB light-emitting chip and the white light-emitting chip are respectively provided with corresponding positive light-emitting pads, the IC chip is electrically connected to the positive light-emitting pads, and the RGB light-emitting chip and the white light-emitting chip are respectively electrically connected to the corresponding positive light-emitting pads; The conductive pin assembly includes a negative power pin, and the die-bonding pad is electrically connected to the negative power pin; The method for preparing the mini-RGBW-LED lamp bead structure with embedded IC comprises the following steps: (1) manufacturing an IC pad assembly on the top of the substrate, wherein the IC pad assembly and the conductive pin assembly are an integrally formed structure, and the conductive pin assembly is arranged outside the substrate; (2) soldering an IC chip to the top of the IC pad assembly, so that the GND pad, VDD pad, DI pad, and DO pad of the IC chip are electrically connected to the corresponding pads in the IC pad assembly, and then packaging the IC chip to form an IC packaging layer; (3) Making a die-bonding pad and a positive light-emitting electrode pad on the top of the IC packaging layer, and the die-bonding pad and the positive light-emitting electrode pad are respectively arranged on both sides of the top of the IC packaging layer; by making a circuit, the IC chip and the positive light-emitting electrode pad are electrically connected, and the die-bonding pad and the negative power supply pin are electrically connected; (4) pressing the RGBW packaging layer having the first packaging hole and the second packaging hole on top of the IC packaging layer; (5) Mounting the RGB light-emitting chip and the white light-emitting chip on top of the die-bonding pad, wherein the white light-emitting chip is located inside the first packaging hole and the RGB light-emitting chip is located inside the second packaging hole, so that the cathode of the RGB light-emitting chip and the cathode of the white light-emitting chip are both electrically connected to the die-bonding pad, and the anode of the RGB light-emitting chip and the anode of the white light-emitting chip are respectively electrically connected to the corresponding anode light-emitting pads through bonding wires; (6) Fill the first packaging hole (131) with white light packaging glue, and fill the second packaging hole with RGB packaging glue to obtain a mini-RGBW-LED lamp bead structure with an embedded IC.

2. The method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC according to claim 1, characterized in that: The RGB light-emitting chip includes a red light chip, a blue light chip and a green light chip; The mini-RGBW-LED lamp bead structure with embedded IC also includes four connecting pads, which are independent of each other. The W solder joint, B solder joint, G solder joint and R solder joint of the IC chip are respectively connected to one side of the four connecting pads, and the other sides of the four connecting pads are respectively used to connect the white light emitting chip, the blue light chip, the green light chip and the red light chip; The light-emitting positive electrode pads include a red light positive electrode pad, a blue light positive electrode pad, a green light positive electrode pad and a white light positive electrode pad, and the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad are respectively arranged above the corresponding connecting pads; The mini-RGBW-LED lamp bead structure with embedded IC further includes a negative electrode connection pad, the negative electrode connection pad is located on the top of the substrate, and the negative electrode connection pad is located below the die bonding pad, and the negative electrode connection pad is electrically connected to the negative electrode pin of the power supply; The method of making a circuit in step (3) to electrically connect the IC chip to the positive light-emitting pad and to electrically connect the die-bonding pad to the negative power supply pin includes the following steps: a. Form first electroplated holes at the red light positive electrode pad, blue light positive electrode pad, green light positive electrode pad, and white light positive electrode pad, respectively, and extend the first electroplated holes to the corresponding connection pads; form second electroplated holes on the die-bonding pad, and extend the second electroplated holes to the negative electrode connection pad; b. Electroplating is performed in the first electroplating hole and the second electroplating hole so that the electroplated metal completely fills the first electroplating hole and the second electroplating hole, and the conductive columns respectively formed in the first electroplating hole and the second electroplating hole electrically connect the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad to the corresponding connecting pads respectively through the conductive columns, and the die-bonding pad and the negative electrode connecting pad are electrically connected.

3. The method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC according to claim 1, wherein: The components of the white light encapsulation adhesive include silicone glue and phosphor; The components of the RGB packaging glue include epoxy resin glue and diffusion powder.

4. The method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC according to claim 3, wherein: In the white light encapsulation adhesive, the mass ratio of the silicone glue to the phosphor is (16-39):(3-10).

5. The method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC according to claim 3, wherein: In the RGB packaging glue, the mass ratio of the epoxy resin glue to the diffusion powder is (2.3-3.7): (0.7-1.0).

6. A mini-RGBW-LED lamp bead structure with an embedded IC, characterized in that: Prepared by the preparation method of the mini-RGBW-LED lamp bead structure with embedded IC according to any one of claims 1 to 5; The mini-RGBW-LED lamp bead structure with embedded IC includes an insulating seat, a conductive pin assembly, an IC chip, an IC pad assembly and a light-emitting assembly; The insulating base includes, from bottom to top, a substrate, an IC packaging layer, and an RGBW packaging layer. The IC pad assembly and the light-emitting assembly are both embedded in the insulating base, and the IC pad assembly is arranged on the top of the substrate. The IC chip is soldered to the top of the IC pad assembly. The IC chip is embedded in the IC packaging layer. The light-emitting assembly is embedded in the RGBW packaging layer. The light-emitting assembly and the IC chip are electrically connected. The conductive pin assembly is arranged outside the substrate, and the conductive pin assembly is electrically connected to the IC pad assembly; The light-emitting component includes a die-bonding pad, an RGB light-emitting chip, a white light-emitting chip, and a positive light-emitting pad. The die-bonding pad and the positive light-emitting pad are both located at the bottom of the RGBW packaging layer. The RGB light-emitting chip and the white light-emitting chip are respectively installed on the die-bonding pad at intervals, and the RGB light-emitting chip and the white light-emitting chip are arranged in a "straight" shape in the middle of the insulating base. The RGB light-emitting chip and the white light-emitting chip are respectively provided with corresponding positive light-emitting pads, the IC chip is electrically connected to the positive light-emitting pads, and the RGB light-emitting chip and the white light-emitting chip are respectively electrically connected to the corresponding positive light-emitting pads; The conductive pin assembly includes a negative power pin, and the die-bonding pad is electrically connected to the negative power pin.

7. The mini-RGBW-LED lamp bead structure with embedded IC according to claim 6, characterized in that: The mini-RGBW-LED lamp bead structure with embedded IC further includes a negative electrode connection pad and a plurality of conductive pillars, wherein the plurality of conductive pillars are embedded in the IC packaging layer, the negative electrode connection pad is located on the top of the substrate, and the negative electrode connection pad is located below the die bonding pad, and the negative electrode connection pad is electrically connected to the negative power supply pin through one of the conductive pillars; The RGB light-emitting chip includes a red light chip, a blue light chip and a green light chip; The mini-RGBW-LED lamp bead structure with embedded IC further includes a connection pad, which is provided on the top of the substrate. There are four connection pads, and the four connection pads are independent of each other. The light-emitting positive electrode pads include a red light positive electrode pad, a blue light positive electrode pad, a green light positive electrode pad and a white light positive electrode pad, and the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad are respectively arranged above the corresponding connecting pads; The W solder point, B solder point, G solder point and R solder point of the IC chip are respectively connected to one side of the four connecting pads, and the other sides of the four connecting pads are respectively electrically connected to the white light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the red light positive electrode pad through conductive columns.

8. The mini-RGBW-LED lamp bead structure with embedded IC according to claim 7, characterized in that: The conductive pin assembly further includes a positive power pin, a data input pin, and a data output pin, wherein the negative power pin, the positive power pin, the data input pin, and the data output pin are respectively arranged at four corners of the substrate; The mini-RGBW-LED lamp bead structure with embedded IC also includes a plurality of conductive metal wires; The IC pad assembly includes an IC positive pad, an IC negative pad, an IC data input pad, and an IC data output pad, wherein the IC positive pad is electrically connected to the positive power pin via a conductive metal wire, the IC negative pad is electrically connected to the negative power pin via a conductive metal wire, the IC data input pad is electrically connected to the data input pin via a conductive metal wire, and the IC data output pad is electrically connected to the data output pin via a conductive metal wire; The GND solder joint of the IC chip is connected to the IC negative pad, the VDD solder joint of the IC chip is connected to the IC positive pad, the DI solder joint of the IC chip is connected to the IC data input pad, and the DO solder joint of the IC chip is connected to the IC data output pad.

9. The mini-RGBW-LED lamp bead structure with embedded IC according to claim 8, characterized in that: The ratio of the width of the conductive metal wire to the width of the insulating seat is (0.035-0.07):

1.

10. The mini-RGBW-LED lamp bead structure with embedded IC according to claim 6, characterized in that: The ratio of the area of ​​the upper surface of the die-bonding pad to the area of ​​the cross section of the insulating seat is (0.3-0.6):1.

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