Substrate holder and plating apparatus

Abstract

The present invention realizes a substrate holder capable of coping with various types of substrates having different power supply positions. The substrate holder (210) includes a base plate, and a face plate (230) for sandwiching and holding the substrate together with the base plate. The panel (230) has a central opening (234a) and a frame member (234) surrounding the central opening (234a). The substrate holder (210) includes a contact member (240) having a first bus bar (242) attached to the frame member (234) so as to be movable with respect to the frame member (234), and a power supply contact (243) attached to the first bus bar (242).

Description

Technical Field

[0001] The present application relates to a substrate support and a plating device. Background Art

[0002] Patent Document 1 discloses an immersion plating device as an example of an electrolytic plating device. The plating device holds a substrate (e.g., a semiconductor wafer) with a side to be plated facing the side on a substrate holder and immerses the substrate in a plating solution, and applies a voltage between the substrate (cathode) and an anode, thereby depositing a conductive film on the surface of the substrate.

[0003] The substrate holder is usually configured to clamp and hold the substrate through a bottom plate and a panel, so that the plated surface of the substrate is exposed from a central opening formed in the panel. In addition, the substrate holder is configured to have a contact member provided on the panel, and power is supplied to the substrate by making the contact member contact the substrate.

[0004] Patent Document 1: Japanese Patent No. 6335763

[0005] The substrate holder of the plating device disclosed in Patent Document 1 does not take into account the need to cope with various types of substrates having different power supply positions.

[0006] That is, there are various types of substrates to be plated, and the specifications of the power supply position are different according to the substrate. In this case, it is necessary to make a dedicated substrate holder for each substrate with different power supply positions, and the number of substrate holders increases, so the structure of the plating device becomes complicated. Summary of the invention

[0007] Therefore, one object of the present application is to realize a substrate holder capable of handling various types of substrates having different power supply positions.

[0008] According to one embodiment, a substrate holder is disclosed, comprising: a base plate; a faceplate for clamping and holding the substrate together with the base plate, the faceplate having a central opening and a frame member surrounding the central opening; and a contact member having a first bus bar mounted on the frame member in a manner movable relative to the frame member, and a power supply contact mounted on the first bus bar. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a cross-sectional view showing the overall structure of a plating apparatus according to one embodiment.

[0010] Figure 2 FIG. 1 is a schematic perspective view of a substrate holder according to an embodiment.

[0011] Figure 3 FIG. 1 is a schematic cross-sectional view of a locking mechanism of a substrate holder according to an embodiment.

[0012] Figure 4 It is a schematic three-dimensional view of a contact component according to an embodiment.

[0013] Figure 5 is an enlarged perspective view of a contact member according to an embodiment.

[0014] Figure 6 is an enlarged perspective view of a contact member according to an embodiment.

[0015] Figure 7 is an enlarged perspective view of a contact member according to an embodiment.

[0016] Figure 8 is an enlarged perspective view of a contact member according to an embodiment.

[0017] Fig. 9 is an enlarged perspective view of a contact member according to an embodiment.

[0018] Fig.10 is an enlarged perspective view of a contact member according to an embodiment.

[0019] Fig.11 This is a schematic perspective view of a position adjustment mechanism according to one embodiment.

[0020] Fig.12 This is a schematic perspective view of a position adjustment mechanism according to one embodiment.

[0021] Fig.13 It is an enlarged stereoscopic view of a contact member and a position adjustment mechanism according to one embodiment.

[0022] Fig.14 It is an enlarged stereoscopic view of a contact member and a position adjustment mechanism according to one embodiment.

[0023] Fig.15 It is an enlarged stereoscopic view of a contact member and a position adjustment mechanism according to one embodiment.

[0024] Fig.16 It is an enlarged stereoscopic view of a contact member and a position adjustment mechanism according to one embodiment.

[0025] Fig.17 It is an enlarged stereoscopic view of a contact member and a position adjustment mechanism according to one embodiment.

[0026] Fig.18 It is an enlarged stereoscopic view of a contact member and a position adjustment mechanism according to one embodiment.

[0027] Fig.19 is an enlarged perspective view of a contact member according to an embodiment.

[0028] Fig. 20 It is a simplified three-dimensional view of a contact member and a position adjustment jig according to an embodiment.

[0029] Fig.21 It is a simplified three-dimensional view of a contact member and a position adjustment jig according to an embodiment.

[0030] Fig. 22 It is a simplified three-dimensional view of a contact member and a position adjustment jig according to an embodiment.

[0031] Fig.23 It is a simplified three-dimensional view of a contact member and a position adjustment jig according to an embodiment.

[0032] Fig.24 is a flow chart of a substrate mounting method according to an embodiment. DETAILED DESCRIPTION

[0033] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals and duplicate descriptions are omitted.

[0034] <Overall structure of plating equipment>

[0035] Figure 1 1 is a top view showing the overall structure of the plating device of the present embodiment. The plating device 1000 comprises: a loading port 100, a conveying robot 110, a loading workbench 120, an unloading workbench 130, a loader 140, a fixing module 200, a storage module 300, an exchange module 310, a support cleaning module 320, a pre-wetting module 400, a pre-preg module 500, a pre-preg cleaning module 510, a plating module 600, a plating cleaning module 700, a blowing module 710, a temporary module 720, a cleaning module 800, a conveying device 900 and a control module 950.

[0036] The loading port 100 is a module for carrying a substrate WF stored in a box such as a FOUP (not shown) into the plating device 1000, or carrying a substrate WF out of the plating device 1000 to a box. In this embodiment, four loading ports 100 are arranged in a horizontal direction, but the number and arrangement of the loading ports 100 are arbitrary. The conveying robot 110 is a robot for horizontally conveying the substrate WF, and is configured to transfer the substrate WF between the loading port 100 and the loading workbench 120.

[0037] The loading station 120 is a station for transferring the substrate WF before the plating process between the conveying robot 110 and the loader 140. The unloading station 130 is a station for transferring the substrate WF after the plating process between the conveying robot 110 and the loader 140. The loader 140 is a robot for horizontally transferring the substrate WF, and is configured to transfer the substrate WF between the loading station 120, the unloading station 130, the fixing module 200, and the cleaning module 800.

[0038] The fixing module 200 is a module for mounting the substrate WF on the substrate holder 210 or removing the substrate WF from the substrate holder 210. The storage module 300 is a module for vertically storing the substrate holder 210. The exchange module 310 is a module for temporarily storing the substrate holder 210 that needs to be replaced or maintained, and is a structure that allows the substrate holder 210 to enter and exit. The substrate holder 210 taken out of the exchange module 310 can be maintained in the plating device 1000, or discharged to the outside of the plating device 1000 for maintenance, and the maintained substrate holder 210 or a new substrate holder 210 is placed in the exchange module 310. The holder cleaning module 320 is a module for cleaning the substrate holder 210.

[0039] The pre-wetting module 400 is a module for replacing the air inside the pattern formed on the surface of the substrate with the processing liquid by wetting the plated surface of the substrate WF before the plating process with the processing liquid such as pure water or degassed water. The pre-wetting module 400 is configured to perform a pre-wetting process, which is a process for replacing the processing liquid inside the pattern with the plating liquid during plating so that the plating liquid is easily supplied to the inside of the pattern.

[0040] The pre-preg module 500 is configured to perform a pre-preg treatment, which is a treatment for cleaning or activating the surface of the plated base by etching away a high-resistance oxide film such as a seed layer surface formed on the plated surface of the substrate WF before the plating treatment using a treatment solution such as sulfuric acid or hydrochloric acid. The pre-preg cleaning module 510 is a module for cleaning the substrate WF that has been subjected to the pre-preg treatment.

[0041] The plating module 600 is a module for performing a plating process on the substrate WF. The plating cleaning module 700 is a module for cleaning the substrate WF in order to remove the plating liquid and the like remaining on the substrate WF after the plating process. In the present embodiment, three plating modules 600 and plating cleaning modules 700 are arranged horizontally, but the number and arrangement of the plating modules 600 and the plating cleaning modules 700 are arbitrary. The blowing module 710 is a module for drying the substrate WF after the cleaning process. The temporary module 720 is a module for temporarily placing the substrate holder 210 mounted with the substrate WF in order to transfer the substrate holder 210 mounted with the substrate WF between multiple conveying devices 900. In the present embodiment, the number of substrate holders 210 that can be stored in the temporary module 720 is 1, but the number is arbitrary.

[0042] The cleaning module 800 is a module for performing cleaning and drying processing on the substrate WF in order to remove the plating liquid and the like remaining on the substrate WF after the plating processing removed from the substrate holder 210. In the present embodiment, two cleaning modules 800 are arranged horizontally across the loading workbench 120 and the unloading workbench 130, but the number and arrangement of the cleaning modules 800 are arbitrary. The conveying device 900 is a device for vertically conveying the substrate holder 210 between the multiple modules in the plating device 1000. In the present embodiment, three conveying devices 900 are arranged in an arranged manner, but the number and arrangement of the conveying devices 900 are arbitrary.

[0043] The control module 950 is configured to control a plurality of modules of the plating apparatus 1000 , and can be configured by, for example, a general computer or a dedicated computer having an input / output interface with an operator.

[0044] An example of a series of plating processes performed by the plating device 1000 is described. First, the substrate WF stored in the box is moved into the loading port 100. Then, the conveying robot 110 takes out the substrate WF from the box of the loading port 100 and places the substrate WF on the loading workbench 120. The loader 140 receives the substrate WF from the loading workbench 120 and conveys it to the fixing module 200.

[0045] The fixing module 200 mounts the substrate WF on the substrate holder 210. The conveying device 900 conveys the substrate holder 210 on which the substrate WF is mounted to the pre-wetting module 400. The pre-wetting module 400 performs a pre-wetting process on the substrate WF. The conveying device 900 conveys the substrate holder 210 on which the substrate WF subjected to the pre-wetting process is mounted to the pre-preg module 500. The pre-preg module 500 performs a pre-preg process on the substrate WF. The conveying device 900 conveys the substrate holder 210 on which the substrate WF subjected to the pre-preg process is mounted to the pre-preg cleaning module 510. The pre-preg cleaning module 510 cleans the substrate WF. The conveying device 900 conveys the substrate holder 210 on which the substrate WF subjected to the cleaning process is mounted to the plating module 600. The plating module 600 performs a plating process on the substrate WF.

[0046] The conveying device 900 conveys the substrate holder 210 on which the substrate WF subjected to the plating process is mounted to the plating cleaning module 700. The plating cleaning module 700 performs a cleaning process on the substrate WF and the substrate holder 210. The conveying device 900 conveys the substrate holder 210 on which the substrate WF subjected to the cleaning process is mounted to the blowing module 710. The blowing module 710 performs a drying process on the substrate WF. The conveying device 900 conveys the substrate holder 210 on which the substrate WF subjected to the drying process is mounted to the temporary module 720, and other conveying devices 900 convey the substrate holder 210 from the temporary module 720 to the fixing module 200. The fixing module 200 removes the substrate WF from the substrate holder 210.

[0047] The loader 140 transports the plated substrate WF removed from the substrate holder 210 to the cleaning module 800. The cleaning module 800 performs cleaning and drying on the substrate WF. The loader 140 places the substrate WF that has been cleaned and dried on the unloading station 130. The transport robot 110 receives the substrate WF from the unloading station 130 and transports it to the box of the loading port 100. Finally, the box containing the substrate WF is unloaded from the loading port 100.

[0048] In the fixing module 200, the substrate holder 210 from which the substrate WF is removed is loaded with the next substrate WF or is returned to the storage module 300 by the conveying device 900. The substrate holder 210 not holding the substrate WF is cleaned by the holder cleaning module 320 as needed.

[0049] Figure 2 1 is a simplified three-dimensional diagram of a substrate support according to an embodiment. Figure 2As shown, the substrate holder 210 includes a base plate 220 and a panel 230 for clamping and holding the substrate together with the base plate 220. The panel 230 has a central opening 234a and a frame member 234 surrounding the central opening 234a. The central opening 234a is formed in a rectangular shape. In addition, in this embodiment, an example in which the central opening 234a is formed in a rectangular shape is shown, but it is not limited to this. The central opening 234a may also be circular, for example.

[0050] In addition, in this embodiment, an example in which a central opening is also formed in the bottom plate 220 is shown, but this is for plating both sides of the substrate. Therefore, in the case of plating only one side of the substrate, the central opening may not be formed in the bottom plate 220. In addition, in the following, for the sake of convenience, there is a case in which the panel 230 is arranged at the bottom and the bottom plate 220 is arranged at the top for description, but when the substrate holder 210 is processed in the fixed module 200, the bottom plate 220 is arranged at the bottom and the panel 230 is arranged at the top.

[0051] The substrate holder 210 includes: an inner sealing member 250, which is arranged on the frame member 234 in a manner of surrounding the central opening 234a; and an outer sealing member 260, which is arranged on the frame member 234 in a manner of surrounding the outer side of the inner sealing member 250 and spaced apart from the inner sealing member 250. In addition, the substrate holder 210 includes a contact member 240, which is provided in a pair in the frame member 234 across the rectangular central opening 234a. The contact member 240 is provided between the inner sealing member 250 and the outer sealing member 260. Thus, when the substrate holder 210 is immersed in the plating solution, the contact member 240 and the end of the substrate are sealed in a manner of being separated from the plating solution. In addition, in the present embodiment, an example in which a pair of contact members 240 are installed in the frame member 234 across the rectangular central opening 234a is shown, but it is not limited to this. The contact member 240 can also be installed on the four sides of the frame member 234 in a manner of surrounding the rectangular central opening 234a.

[0052] like Figure 2 As shown, the substrate support 210 has a plurality of locking mechanisms 270 for locking or releasing the bottom plate 220 and the panel 230. The plurality of locking mechanisms 270 are disposed along the periphery of the bottom plate 220 and the panel 230.

[0053] Figure 3 FIG. 2 is a schematic cross-sectional view of a locking mechanism 270 of a substrate support according to an embodiment. Figure 3As shown, the bottom plate 220 has a first locking opening 220a formed on the outside of the outer sealing member 260. On the other hand, the panel 230 has a second locking opening 230a formed on the outside of the outer sealing member 260 and corresponding to the first locking opening 220a. The locking mechanism 270 includes a bracket plate 222 provided at the first locking opening 220a, and a bracket hook 224 protruding toward the panel 230 side through the first locking opening 220a. On the other hand, the locking mechanism 270 includes a clamp plate 236 provided at the second locking opening 230a, and a clamp hook 238 protruding toward the bottom plate 220 through the second locking opening 230a.

[0054] The bracket hook 224 is configured to be rotatable around the shaft 224a. The locking mechanism 270 is configured such that when the bracket hook 224 is located at the position indicated by the solid line, the bracket hook 224 engages with the clamp hook 238, thereby locking the bottom plate 220 and the panel 230. On the other hand, the locking mechanism 270 is configured such that when the bracket hook 224 is rotated and located at the position indicated by the dotted line, the engagement between the bracket hook 224 and the clamp hook 238 is released, thereby releasing the lock between the bottom plate 220 and the panel 230. Figure 2 In FIG. 1 , a plurality of locking mechanisms 270 are provided along the periphery of the bottom plate 220 and the panel 230, but the present invention is not limited thereto. Figure 4 and Figure 4 In the following description, illustration of the locking mechanism 270 is omitted for convenience of description.

[0055] Figures 4 to 7 It is a schematic three-dimensional view of a contact component according to an embodiment. Figure 4 The entire contact component 240 is shown, Figure 5 to Figure 7 A part of the contact member 240 is shown in an enlarged manner. In addition, a pair of contact members 240 is provided in the frame member 234 across the central opening 234a, but both have the same structure, so only one will be described.

[0056] like Figures 4 to 7 As shown, the contact member 240 includes: a first bus bar 242 extending along the frame member 234 and mounted on the frame member 234 in a manner that can move relative to the frame member 234; and a power supply contact 243 mounted on the first bus bar 242. More specifically, the contact member 240 includes a second bus bar 244 extending along the frame member 234 and fixed to the frame member 234. The first bus bar 242 is stacked and mounted on the second bus bar 244 in a manner that can move relative to the second bus bar 244.

[0057] The base end of the power supply contact 243 is fixed to the first bus bar 242, and the front end of the power supply contact 243 protrudes in the direction of the central opening 234a. The second bus bar 244 is connected to a power source (not shown). Power is supplied from the power source to the power supply contact 243 via the second bus bar 244 and the first bus bar 242. The power supply contact 243 is configured to supply power to the substrate by contacting the front end of the power supply contact 243 with the substrate.

[0058] The first bus bar 242 is mounted on the second bus bar 244 so as to be movable in the first direction approaching and moving away from the central opening 234a. The second bus bar 244 has guide members 245 disposed at both ends of the extending direction of the first bus bar 242. The guide members 245 are members for limiting the movement direction of the first bus bar 242 in the first direction.

[0059] like Figure 5 As shown, the first bus bar 242 has holding holes 242a formed at both ends of the extending direction of the first bus bar 242. The holding holes 242a are cutouts for holding the first bus bar 242 when the first bus bar 242 is moved using a position adjustment mechanism and / or a jig described later.

[0060] like Figure 6 and Figure 7 As shown, the first bus bar 242 has a long hole 246 that is longer in the first direction than the extending direction of the first bus bar 242. A plurality of long holes 246 are provided along the extending direction of the first bus bar 242. On the other hand, the second bus bar 244 has a first limiting member 247 that is disposed at a position corresponding to the long hole 246. The first limiting member 247 is a member for limiting the movement of the first bus bar 242 in the first direction.

[0061] Specifically, the first limiting member 247 has a proximal end 247a, which contacts the edge of the long hole 246 after the first bus bar 242 moves in a direction away from the central opening 234a. In addition, the first limiting member 247 has a distal end 247b, which contacts the edge of the long hole 246 after the first bus bar 242 moves in a direction close to the central opening 234a. In the present embodiment, the first limiting member 247 is a bolt fixed to the surface of the second bus bar 244 facing the first bus bar 242, and the portion of the shaft of the bolt closest to the central opening 234a is the proximal end 247a, and the portion of the shaft of the bolt farthest from the central opening 234a is the distal end 247b.

[0062] The second bus bar 244 has a compression coil spring 248 for pressing the first bus bar 242 toward the second bus bar 244. The compression coil spring 248 is disposed between the head of the bolt as the first limiting member 247 and the first bus bar 242. Since the first limiting member 247 is fixed to the second bus bar 244, the compression coil spring 248 urges the first bus bar 242 toward the second bus bar 244.

[0063] like Figure 7 As shown, the first bus bar 242 has a protrusion 242b, which is formed on the opposite surface of the second bus bar 244 in a manner extending along the first direction. The first bus bar 242 is pressed toward the second bus bar 244 by the compression coil spring 248, so that the protrusion 242b contacts the second bus bar 244. Thus, the electrical conduction between the first bus bar 242 and the second bus bar 244 is ensured. In addition, since the first restriction member 247 and the compression coil spring 248 are conductive members, the electrical conduction between the first bus bar 242 and the second bus bar 244 is ensured via the first restriction member 247 and the compression coil spring 248. In addition, since the protrusion 242b extends along the first direction, the protrusion 242b does not hinder the movement of the first bus bar 242 along the first direction.

[0064] In the above description, an example is shown in which the first bus bar 242 is pressed toward the second bus bar 244 using the compression coil spring 248 to ensure electrical conduction between the first bus bar 242 and the second bus bar 244 , but the present invention is not limited thereto. Figure 8 to Figure 10 is an enlarged perspective view of a contact member according to an embodiment.

[0065] like Figure 8 to Figure 10 As shown, the second bus bar 244 may include a disc spring 249 instead of the compression coil spring 248, and the disc spring 249 is arranged between the first bus bar 242 and the second bus bar 244 in the area where the first limiting member 247 is arranged. The disc spring 249 applies force to the first bus bar 242 in a direction away from the second bus bar 244. Thus, the disc spring 249 presses the first bus bar 242 against the head of the bolt serving as the first limiting member 247.

[0066] The disc spring 249 is a conductive component, and the electrical conduction between the first bus bar 242 and the second bus bar 244 is ensured via the disc spring 249. In addition, the first limiting component 247 is also a conductive component, and the electrical conduction between the first bus bar 242 and the second bus bar 244 is ensured via the first limiting component 247. In addition, the contact surface of the disc spring 249 with the first bus bar 242 extends in the first direction, so the disc spring 249 does not hinder the movement of the first bus bar 242 along the first direction.

[0067] Fig.11 and Fig.12 1 is a simplified three-dimensional diagram of a position adjustment mechanism of one embodiment. The plating device 1000 includes a position adjustment mechanism 290, which is configured to adjust the position of the first bus bar 242 relative to the panel 230. The position adjustment mechanism 290 is configured on the fixed module 200. The position adjustment mechanism 290 includes: an arm 292, which is used to hold the first bus bar 242; a first driving component 298, which is used to move the arm 292 in a first direction; and a second driving component 296, which is used to move the arm 292 in a second direction (vertical direction) orthogonal to the extension direction of the first bus bar 242 and the first direction. The first driving component 298 and the second driving component 296 can be implemented by a well-known mechanism such as a motor or a cylinder. Fig.11 The arm 292 is not holding the first bus bar 242. Fig.12 The arm 292 is shown holding the first bus bar 242 .

[0068] Figure 13 to Figure 18 It is an enlarged stereoscopic view of a contact member and a position adjustment mechanism according to one embodiment. Fig.19 FIG. 1 is an enlarged perspective view of a contact component of an embodiment. Fig.13 As shown, the second bus bar 244 has a second limiting member 241. The second limiting member 241 is a member for limiting the movement of the first bus bar 242 in the first direction.

[0069] Specifically, the second limiting member 241 includes a proximal limiting member 241a which is in a state where the proximal end 247a of the first limiting member 247 is in contact with the edge of the long hole 246 ( Fig.17 ) to limit the movement of the first bus bar 242 in the direction close to the central opening 234a. In addition, the second limiting member 241 has a distal limiting member 241b, which is in a state where the distal end 247b of the first limiting member 247 contacts the edge of the long hole 246 ( Fig.15 ), the movement of the first bus bar 242 away from the central opening 234a is restricted.

[0070] The near-position limiting component 241a and the far-position limiting component 241b are formed of leaf springs. When no external force is applied, the near-position limiting component 241a and the far-position limiting component 241b are located in the moving path of the first bus bar 242 in the first direction, and contact the first bus bar 242 to limit the movement. On the other hand, the near-position limiting component 241a and the far-position limiting component 241b are configured so that when an external force is applied and they are pressed toward the direction of the second bus bar 244, they deviate from the moving path of the first bus bar 242 in the first direction, and the restriction on the movement of the first bus bar 242 is released.

[0071] The arm 292 includes a proximal pressing member 293 for pressing the proximal limiting member 241a to release the restriction on the movement of the first bus bar 242. The arm 292 also includes a distal pressing member 294 for pressing the distal limiting member 241b to release the restriction on the movement of the first bus bar 242. The arm 292 also includes a gripping portion 295 that is fitted into the gripping hole 242a of the first bus bar 242.

[0072] Fig.15 The state in which the first bus bar 242 moves to the position closest to the central opening 234a is shown. In this state, the edge of the long hole 246 of the first bus bar 242 contacts the distal end 247b of the first limiting member 247, thereby limiting the movement of the first bus bar 242 in the direction close to the central opening 234a. On the other hand, in this state, no external force is applied to the distal limiting member 241b of the second limiting member 241, and the distal limiting member 241b exists in the moving path of the first bus bar 242 in the first direction, thereby limiting the movement of the first bus bar 242 in the direction away from the central opening 234a. As a result, the first bus bar 242 is fixed at the position closest to the central opening 234a.

[0073] Fig.16 The arm 292 is shown holding the first bus bar 242. In this state, the remote pressing member 294 of the arm 292 presses the remote limiting member 241b, thereby releasing the restriction on the movement of the first bus bar 242 in the direction away from the central opening 234a. In addition, the holding portion 295 of the arm 292 is fitted into the holding hole 242a of the first bus bar 242. Thus, the first driving member 298 of the position adjustment mechanism 290 can move the first bus bar 242 in the direction away from the central opening 234a.

[0074] Fig.17The state in which the first bus bar 242 moves to the position farthest from the central opening 234a is shown. In this state, the edge of the long hole 246 of the first bus bar 242 contacts the proximal end 247a of the first limiting member 247, thereby limiting the movement of the first bus bar 242 in the direction away from the central opening 234a. On the other hand, in this state, no external force is applied to the proximal limiting member 241a of the second limiting member 241, and the proximal limiting member 241a exists in the moving path of the first bus bar 242 in the first direction, thereby limiting the movement of the first bus bar 242 in the direction close to the central opening 234a. As a result, the first bus bar 242 is fixed at the position farthest from the central opening 234a.

[0075] As described above, according to this embodiment, the first bus bar 242 and the power supply contact 243 can be moved and fixed to a plurality of positions relative to the second bus bar 244 (frame member 234 ), thereby realizing the substrate holder 210 that can handle various types of substrates having different power supply positions.

[0076] In the above description, an example in which the first bus bar 242 is moved using the position adjustment mechanism 290 is shown, but the present invention is not limited to this. Figure 20 to Figure 23 It is a simplified three-dimensional view of a contact member and a position adjustment jig according to an embodiment.

[0077] The position adjustment jig 280 includes: a jig body 281 extending along the first bus bar 242; a jig proximal pressing component 285 disposed at an end of the jig body 281 in the extending direction; and a jig distal pressing component 284 disposed at an end of the jig body 281 in the extending direction. The jig proximal pressing component 285 has the same function as the above-mentioned proximal pressing component 293. That is, the jig proximal pressing component 285 is a component for pressing the proximal limiting component 241a to release the restriction on the movement of the first bus bar 242. In addition, the jig distal pressing component 284 has the same function as the above-mentioned distal pressing component 294. That is, the jig distal pressing component 284 is a component for pressing the distal limiting component 241b to release the restriction on the movement of the first bus bar 242.

[0078] like Fig. 20 and Fig.21 As shown, the position adjustment jig 280 includes a first claw member 282, and the first claw member 282 is arranged on the opposite side of the central opening 234a of the jig body 281. Fig. 22 As shown, the position adjustment jig 280 includes a second claw member 283 , which is disposed on the central opening 234 a side of the jig body 281 .

[0079] Fig. 20A state before the first claw member 282 is fitted into the gap between the first bus bar 242 and the second bus bar 244 is shown. Fig.21 A state in which the first claw member 282 is fitted into the gap between the first bus bar 242 and the second bus bar 244 is shown. Fig. 22 The state where the second claw member 283 is fitted into the gap between the first bus bar 242 and the second bus bar 244 is shown.

[0080] like Fig.23 As shown, the first claw member 282 and the second claw member 283 are configured to slightly float the first bus bar 242 from the second bus bar 244 when they are inserted into the gap between the first bus bar 242 and the second bus bar 244. That is, the position adjustment jig 280 of this embodiment is assumed to apply force to the first bus bar 242 toward the second bus bar 244 through the compression coil spring 248 described above. Fig.23 As shown, the first bus bar 242 is slightly lifted from the second bus bar 244 by the first claw member 282 and the second claw member 283, thereby making it possible to smoothly move the first bus bar 242 relative to the second bus bar 244. In addition, the first claw member 282 and the second claw member 283 may not be provided. In particular, when the disc spring 249 is used instead of the compression coil spring 248, the first claw member 282 and the second claw member 283 may not be provided.

[0081] Next, the substrate mounting method will be described. Fig.24 1 is a flow chart of a substrate installation method according to an embodiment. The substrate installation method first stores the substrate holder 210 in the fixing module 200 (step S101). At this time, the substrate holder 210 is arranged in the fixing module 200 with the bottom plate 220 at the bottom and the panel 230 at the top.

[0082] Next, the substrate mounting method uses the locking mechanism 270 to unlock the substrate holder 210 (step S102). Next, the substrate mounting method lifts the panel 230 upward (step S103). Next, the substrate mounting method inserts the arm 292 of the position adjustment mechanism 290 between the bottom plate 220 and the panel 230 (step S104).

[0083] Next, the substrate installation method uses the arm 292 to hold the first bus bar 242 and move the first bus bar 242 (step S105). For example, step S105 moves the first bus bar 242 to a position closest to the central opening 234a or a position farthest from the central opening 234a according to the specification of the power supply position of the substrate WF. Next, the substrate installation method retracts the arm 292 from between the bottom plate 220 and the panel 230 (step S106).

[0084] Next, the substrate installation method places the substrate WF on the upper surface of the bottom plate 220 (step S107 ). Next, the substrate installation method lowers the face plate 230 and sandwiches the substrate WF with the bottom plate 220 and the face plate 230 (step S108 ).

[0085] Next, the substrate mounting method locks the substrate holder 210 using the locking mechanism 270 (step S109 ). Thus, the substrate WF is clamped by the substrate holder 210 . Next, the substrate mounting method carries the substrate holder 210 out of the fixing module 200 (step S110 ).

[0086] According to the substrate mounting method of this embodiment, the first bus bar 242 and the power supply contact 243 can be moved and fixed to a plurality of positions relative to the second bus bar 244 (frame member 234 ), and thus various types of substrates having different power supply positions can be supported.

[0087] Several embodiments of the present invention have been described above, but the embodiments of the invention described above are for the purpose of facilitating the understanding of the present invention and do not limit the present invention. Of course, the present invention can be changed and improved without departing from its main purpose, and the present invention includes its equivalents. In addition, within the scope of at least a part of the above-mentioned problems that can be solved or within the scope of at least a part of the effects that can be achieved, any combination or omission of the constituent elements described in the claims and the specification can be performed.

[0088] As an embodiment, the present application discloses a substrate holder, which includes: a base plate; a panel, which is used to clamp and hold the substrate together with the base plate, the panel having a central opening and a frame member surrounding the central opening; and a contact member, which has a first bus bar mounted on the frame member in a manner that can be moved relative to the frame member, and a power supply contact member mounted on the first bus bar.

[0089] In addition, the present application discloses, as an embodiment, a substrate holder, wherein the central opening is formed into a rectangle, and the contact member is installed in a pair on the frame member across the rectangular central opening, or is installed on four sides of the frame member in a manner surrounding the rectangular central opening.

[0090] In addition, the present application discloses, as an embodiment, a substrate holder, wherein the contact member further includes a second bus bar fixed to the frame member, and the first bus bar is mounted to the second bus bar in a manner movable relative to the second bus bar.

[0091] In addition, the present application discloses, as an embodiment, a substrate bracket, wherein the first bus bar is configured to be movable in a first direction approaching and moving away from the central opening, and the second bus bar has a guide component, which is arranged at both ends of the extension direction of the first bus bar and is used to limit the movement direction of the first bus bar in the first direction.

[0092] In addition, the present application discloses, as an embodiment, a substrate bracket, wherein the first bus bar has a long hole that is longer in the first direction than the extension direction of the first bus bar, and the second bus bar has a first limiting component, which is arranged at a position corresponding to the long hole and has: a proximal end, which contacts the edge of the long hole after the first bus bar moves in a direction away from the central opening; and a distal end, which contacts the edge of the long hole after the first bus bar moves in a direction close to the central opening.

[0093] In addition, the present application discloses, as an embodiment, a substrate bracket, wherein the second bus bar has a second limiting component, and the second limiting component has: a proximal limiting component, which limits the movement of the first bus bar toward the direction approaching the central opening when the proximal end of the first limiting component is in contact with the edge of the long hole; and a distal limiting component, which limits the movement of the first bus bar toward the direction away from the central opening when the distal end of the first limiting component is in contact with the edge of the long hole.

[0094] In addition, the present application discloses, as one embodiment, a plating device, which includes: a substrate holder as described in any one of the above items; and a position adjustment mechanism configured to adjust the position of the first bus bar relative to the panel.

[0095] In addition, the present application discloses, as an embodiment, a plating device, wherein the position adjustment mechanism includes: an arm for holding the first bus bar; a first driving component for moving the arm in a first direction approaching and moving away from the central opening; and a second driving component for moving the arm in a second direction orthogonal to the extension direction of the first bus bar and the first direction.

[0096] In addition, the present application discloses, as an embodiment, a plating device, wherein the arm includes: a proximal pressing component, which is used to press the proximal limiting component to release the restriction on the movement of the first bus bar; and a distal pressing component, which is used to press the distal limiting component to release the restriction on the movement of the first bus bar.

[0097] Description of Reference Numerals

[0098] 200…fixed module; 210…substrate support; 220…bottom plate; 230…panel; 234…frame member; 234a…central opening; 240…contact member; 241…second limiting member; 241a…near limiting member; 241b…far limiting member; 242…first bus bar; 242a…holding hole; 243…power supply contact; 244…second bus bar; 245…guide member; 246…long hole; 247…first limiting member; 247a…proximal end; 247b…distal end; 250…inner sealing member; 260…outer sealing member; 270…locking mechanism; 290…position adjustment mechanism; 292…arm; 293…proximal pressing member; 294…distal pressing member; 295…holding portion; 296…second driving member; 298…first driving member; 1000…plating device; WF…substrate.

Claims

1. A substrate support, characterized in that: include: Base plate; A panel, the panel being used for clamping and holding the substrate together with the bottom plate, the panel having a central opening and a frame member surrounding the central opening; as well as The contact member includes a first bus bar mounted to the frame member so as to be movable relative to the frame member, and a power supply contact mounted to the first bus bar.

2. The substrate support according to claim 1, characterized in that The central opening is formed into a rectangular shape, The contact members are mounted in pair on the frame member across the rectangular central opening, or are mounted on four sides of the frame member so as to surround the rectangular central opening.

3. The substrate support according to claim 2, characterized in that The contact member further includes a second bus bar fixed to the frame member, The first bus bar is mounted to the second bus bar so as to be movable relative to the second bus bar.

4. The substrate support according to claim 3, characterized in that The first bus bar is configured to be movable in a first direction approaching and moving away from the central opening. The second bus bar has guide components, which are arranged at both ends of the first bus bar in the extending direction and are used to limit the moving direction of the first bus bar in the first direction.

5. The substrate support according to claim 4, characterized in that The first bus bar has an elongated hole which is longer in the first direction than in the extending direction of the first bus bar. The second bus bar has a first limiting component, which is arranged at a position corresponding to the long hole and has: a proximal end, which contacts the edge of the long hole after the first bus bar moves in a direction away from the central opening; and a distal end, which contacts the edge of the long hole after the first bus bar moves in a direction close to the central opening.

6. The substrate support according to claim 5, characterized in that The second bus bar has a second limiting component, which includes: a proximal limiting component, which limits the movement of the first bus bar in a direction approaching the central opening when the proximal end of the first limiting component is in contact with the edge of the long hole; and a distal limiting component, which limits the movement of the first bus bar in a direction away from the central opening when the distal end of the first limiting component is in contact with the edge of the long hole.

7. A plating device, characterized in that: include: The substrate support according to any one of claims 1 to 6; and A position adjustment mechanism is configured to adjust a position of the first bus bar relative to the panel.

8. The plating device according to claim 7, characterized in that: The position adjustment mechanism includes: an arm, which is used to hold the first bus bar; a first driving component, which is used to move the arm in a first direction close to and away from the central opening; and a second driving component, which is used to move the arm in a second direction that is orthogonal to the extension direction of the first bus bar and the first direction.

9. A plating device, characterized in that: include: The substrate support according to claim 6; and a position adjustment mechanism configured to adjust a position of the first bus bar relative to the panel, The position adjustment mechanism includes: an arm for holding the first bus bar; a first driving component for moving the arm in a first direction close to and away from the central opening; and a second driving component for moving the arm in a second direction orthogonal to the extending direction of the first bus bar and the first direction. The arm includes a proximal pressing component for pressing the proximal limiting component to release the restriction on the movement of the first bus bar, and a distal pressing component for pressing the distal limiting component to release the restriction on the movement of the first bus bar.

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