Method for dynamically regulating dislocation configuration of refractory alloy by additive manufacturing and application thereof

Abstract

The application discloses a kind of additive manufacturing refractory alloy dynamic self-reinforcing dislocation configuration regulation method and application, using selective laser melting method to Ta-10W alloy powder is laser printing forming, obtain with solidification cell structure and high dislocation density of additive manufacturing refractory alloy;Under the condition of vacuum degree, to the additive manufacturing refractory alloy in 0.35~0.55T m Melting point under short-time medium-temperature stress relief annealing, obtain the solidification cell and the refractory alloy of dynamic self-reinforcing dislocation configuration of immobile dislocation coupling.The application is rearranged to the complex random dislocation configuration in additive manufacturing refractory alloy material by heat treatment, and is regulated into immobile dislocation distributed around solidification cell wall, and its room temperature and super high temperature strength is significantly improved, realizes dislocation cell structure dynamic self-reinforcing, improves refractory alloy room temperature and super high temperature strength, and realizes super high temperature strain hardening.In metallurgy and aerospace and other extreme service environment, it has wide application prospect.

Description

Technical Field

[0001] This invention belongs to the field of additive manufacturing refractory alloy preparation technology, specifically relating to a method and application for controlling the dynamic self-reinforcing dislocation configuration of additive manufacturing refractory alloys. Background Technology

[0002] Ultra-high temperature refractory alloys are a class of special metallic materials composed of metals such as tantalum, tungsten, molybdenum, and niobium, with melting points exceeding 2000℃, and other elements. They possess outstanding performance under extremely high-temperature environments, designed to maintain stability and strength even under conditions exceeding the heat resistance limits of conventional alloys and steels. Ultra-high temperature refractory alloys have important applications in aerospace, energy, and chemical industries. A typical application scenario is the manufacture of core components for hypersonic vehicles, where materials must remain stable for extended periods at temperatures ranging from 1800℃ to 3000℃. Such high service temperatures far exceed the limits of general structural materials, including existing high-temperature alloys. Furthermore, for the highest melting point refractory alloy system, this service temperature is more than 0.6 times its melting point, placing extremely stringent demands on the material's ability to withstand ultra-high temperatures and high loads. Therefore, there is an urgent need to find materials capable of withstanding ultra-high temperatures (>0.6T). m ,T m It is an ultra-high temperature high load-bearing refractory alloy with a melting point of (the melting point of ultra-high temperature refractory alloy), high tensile strength, high temperature strain hardening ability, and large room temperature tensile elongation.

[0003] For metallic materials, dislocations are the primary agents regulating the strength-plasticity balance, and different dislocation configurations have a significant impact on material properties. This is especially true for body-centered cubic (BCC) refractory alloys. Due to the inherent high dislocation energies of BCC metals, dislocation nucleation and movement are difficult. Furthermore, BCC metals have a large number of slip systems, and when a temperature or force field is present to activate dislocations, the dislocation reaction becomes exceptionally intense. The interaction between the activation of dislocations in two slip systems forms immobile dislocations, which further evolve into polygonal dislocation networks under high-temperature conditions. Both immobile dislocations and polygonal dislocation networks represent configurations with minimized dislocation energy, exhibiting relative stability at both room and high temperatures. By hindering the movement of movable dislocations, they promote improved mechanical properties. Therefore, dislocation control engineering is of great significance for ultra-high temperature refractory alloys. Many researchers and technicians have employed plastic processing methods such as isochannel extrusion and high-energy forging to introduce high-density dislocations into body-centered cubic refractory alloys like pure W and TiZrHfTa to enhance strength. However, the dislocation configurations obtained through these methods are predominantly high-density tangled dislocations, often accompanied by a sacrifice in material plasticity, and are also limited by issues such as sample size and processing conditions. Therefore, it is difficult to achieve a synergistic improvement in high-temperature ultra-high strength and room-temperature plasticity. Currently, dislocation control and performance enhancement of ultra-high-temperature refractory alloys remain a major challenge. Summary of the Invention

[0004] To address the aforementioned deficiencies in existing technologies, the present invention aims to provide a method for controlling the dynamic self-reinforcing dislocation configuration in additive manufacturing of refractory alloys. This method involves introducing a solidified cell structure into the refractory alloy during solidification, combined with high thermal stress cycling during forming, to simultaneously introduce high-density dislocations. Under the action of annealing, the dislocations rearrange to form immovable dislocations distributed around the solidified cell wall, thus constructing the initial dislocation cell configuration. This achieves dynamic self-reinforcing of the dislocation cell structure, improves the room temperature and ultra-high temperature strength of the refractory alloy, and realizes ultra-high temperature strain hardening.

[0005] The present invention is achieved through the following technical solution.

[0006] One aspect of the present invention provides a method for controlling the dynamic self-reinforcing dislocation configuration in additive manufacturing of refractory alloys, comprising:

[0007] Selective laser melting technology was used to laser print Ta-10W alloy powder to obtain an additive manufacturing refractory alloy with solidified cell structure and high dislocation density; in this case, there is no coupling relationship between the solidified cells and the high-density dislocations.

[0008] Under vacuum conditions, additive manufacturing of refractory alloys at 0.35–0.55T... m Short-time medium-temperature stress-relief annealing is performed at the melting point of the alloy. During the annealing process, dislocation reactions occur between the dislocations in the additive manufacturing refractory alloy, forming an immovable dislocation configuration that is uniformly distributed around the solidified cell wall, resulting in a refractory alloy with a dynamic self-reinforcing dislocation configuration in which the solidified cell and the immovable dislocation are coupled.

[0009] Preferably, the Ta-10W alloy powder uses raw materials with the following mass ratio:

[0010] Carbon: 0.01–0.05%, Nitrogen: 0.02–0.08%, Oxygen: 0.16–0.2%, Tungsten: 9.5–10.5%, balance tantalum.

[0011] Preferably, the laser printing scanning speed is 400-700 mm / s, and the energy density is 220-260 J / mm. 3 .

[0012] Preferably, the high dislocation density additive manufacturing refractory alloy obtained by laser printing is heated at a rate of 8–12 °C / min to 0.35–0.55T to the melting point of the Ta-10W alloy (3035 °C). m Then proceed with stress-relief annealing.

[0013] Preferably, the annealing temperature is 1200–1500℃ and the annealing time is 1–2 hours.

[0014] Preferably, the temperature fluctuation during annealing and heat preservation is less than 20°C.

[0015] Preferably, the vacuum level is below 5×10⁻⁶. -3 Stress-relief annealing was performed on the printed Ta-10W alloy in a vacuum furnace at Pa.

[0016] In another aspect, the present invention provides a refractory alloy with a dynamic self-reinforcing dislocation configuration obtained by the above method.

[0017] The present invention, by adopting the above technical solution, has the following beneficial effects:

[0018] 1. This invention uses metal additive manufacturing process to prepare ultra-high temperature refractory alloys. Compared with traditional deformation processes such as rolling, the rapid solidification process introduces solidification cell structure into the refractory alloy. Combined with the high thermal stress cycle in the forming process, high density dislocations are introduced simultaneously.

[0019] 2. This invention rationally controls the holding temperature and holding time of heat treatment, and regulates the distribution of immovable dislocations at the solidification cell wall. During plastic deformation, it can realize the dynamic self-reinforcement of the dislocation cell structure, and achieve the synergistic improvement of the strength and strain hardening ability of refractory alloys.

[0020] 3. This invention reshapes the dislocation configuration through heat treatment, rearranging the complex and random dislocation configuration in additively manufactured refractory alloys. These immobile dislocations distributed around the solidified cell wall can hinder the slip of movable dislocations during the plastic deformation stage, promoting dislocation reactions between movable dislocations. A large number of immobile dislocations are generated at the solidified cell wall of the additively manufactured ultra-high temperature refractory alloy, becoming effective pinning points and reaction sites for movable dislocations, thereby achieving dynamic self-reinforcement of the dislocation cell structure. Compared with ultra-high temperature refractory alloys prepared by currently commercially available conventional processes, the room temperature strength is increased by approximately 40%, and the ultra-high temperature strength (>0.6T) is... m Significant improvement, at 0.66T m The strength is increased by about 20% while still retaining strain hardening capacity.

[0021] 4. This invention employs a design concept of selective laser melting with high temperature gradient and high cyclic stress to introduce high-density dislocations, combined with stepwise control of dislocation structure. This provides a simple method for preparing high-strength, high-strain hardening body-centered cubic alloys, and can be extended to other body-centered cubic alloy materials. The refractory alloys with dynamically self-reinforcing dislocation configurations obtained by this method have wide applications in metallurgy and aerospace applications at room temperature or ultra-high temperature. Attached Figure Description

[0022] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, do not constitute an undue limitation of the invention. In the drawings:

[0023] Figure 1 To illustrate the relationship between solidified cells and dislocations in electron channel contrast imaging before annealing;

[0024] Figure 2 This is a schematic diagram showing the relationship between solidified cells and different dislocation configurations before annealing.

[0025] Figure 3 To illustrate the relationship between solidified cells and dislocations in electron channel contrast imaging after annealing;

[0026] Figure 4 This is a schematic diagram showing the relationship between solidified cells and different dislocation configurations after annealing.

[0027] Figure 5 Here is the annealing process flowchart;

[0028] Figure 6 This is a comparison chart of the room temperature tensile properties of Example 1 and the conventionally processed Ta-10W alloy;

[0029] Figure 7 The temperature of Ta-10W alloy produced in Example 1 and the conventional process is 2000℃ (~0.66T). m Comparison chart of ultra-high temperature tensile properties. Detailed Implementation

[0030] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention, but are not intended to limit the present invention.

[0031] The present invention provides a method for controlling the dynamic self-reinforcing dislocation configuration in additive manufacturing of refractory alloys, the steps of which are as follows:

[0032] Step 1: Select Ta-10W alloy spherical powder with a particle size of 15-63μm, and use selective laser melting method with a laser scanning speed of 400-700mm / s and a laser energy density of 220-260J / mm². 3 Ta-10W alloy powder was printed to introduce a solidified cell structure into the refractory alloy. Combined with the high thermal stress cycle during the printing process, high-density dislocations were introduced simultaneously, resulting in an additive refractory alloy with a solidified cell structure and high dislocation density.

[0033] Ta-10W alloy powder contains the following alloying elements in the following mass ratios: carbon: 0.01-0.05%, nitrogen: 0.02-0.08%, oxygen: 0.16-0.2%, tungsten: 9.5-10.5%, with the balance being tantalum.

[0034] Commercially available alloy spherical powder with the corresponding refractory components was used. Selective laser melting technology was employed for printing, and strip printing was selected as the printing strategy. Printing parameters with a high G / R ratio were chosen to obtain the solidified cell structure (G is the temperature gradient during solidification, and R is the cooling rate during solidification). The final product was an additive manufacturing refractory alloy with good density, virtually no fusion defects, and a high pre-formed dislocation density.

[0035] Step 2: The high dislocation density additive-manufactured refractory alloy obtained in Step 1 is subjected to a vacuum degree below 5 × 10⁻⁶. -3 The printed Ta-10W alloy was subjected to short-time stress-relieving annealing heat treatment in a vacuum furnace at a temperature of 0.35–0.55°C above the melting point of Ta-10W alloy (3035°C). m The temperature range (1060℃~1670℃) is used for stress-relief annealing for 1~2 hours to achieve configuration control of immovable dislocations. During the annealing heat treatment experiment, the heating rate is maintained within the range of 8~12℃ / min, and the temperature fluctuation during holding is less than 20℃.

[0036] In additive manufacturing of refractory alloys, two substructures exist: solidified cells and high-density tangled dislocations. Solidified cells are generated during solidification under high temperature gradients and high cooling rates, while high-density tangled dislocations are generated during selective laser melting (SLM) sample preparation due to large temperature gradients and high stress cycles. By utilizing solidified cells as dislocation pinning sites and combining this with the ability of a short-duration intermediate-temperature annealing step to regulate body-centered cubic dislocations, dislocation reactions occur at the solidified cell boundaries, generating immobile dislocation configurations. This constructs stable initial dislocation cell morphologies and lays the foundation for dynamic self-reinforcement of the dislocation cell structure during deformation, improving the room temperature and ultra-high temperature strength of the refractory alloy and achieving ultra-high temperature strain hardening.

[0037] In step 2, the stress-relief annealing parameters are selected as a temperature of 0.35–0.55T. mFirst, for refractory alloys with melting temperatures 0.35 to 0.55 times the annealing temperature, if the temperature is too low, it will be insufficient to eliminate the high internal stress in the additively manufactured refractory alloy, leading to sample cracking during service due to excessive internal stress. Furthermore, it will result in insufficient thermal activation energy, preventing dislocations from spontaneously forming immobile dislocations under the temperature field, thus failing to hinder movable dislocations during plastic deformation. If the temperature is too high, it will cause dynamic recrystallization of the refractory alloy, leading to grain growth; it will also cause a large number of dislocations to annihilate, significantly reducing dislocation density. Both of these factors will lead to a decrease in the mechanical properties of ultra-high temperature refractory alloys. The selection of annealing time is crucial. Insufficient annealing time leads to more residual internal stress in the material, while excessive annealing time can cause recrystallization and dislocation annihilation. Through stress-relief annealing, dislocations can spontaneously form low-energy immobile dislocation configurations. Furthermore, compared to a uniform matrix, the high cooling rate and high temperature gradient during additive manufacturing solidification create solidification cells within the grains. These substructures become the main sites for the distribution of immobile dislocations after annealing. The result is that, after stress-relief annealing, immobile dislocations in the printed annealed ultra-high temperature refractory alloy are relatively uniformly dispersed at the solidification cell walls. This dislocation configuration effectively hinders dislocation movement during plastic deformation, effectively improving the yield strength and strain hardening capacity of the ultra-high temperature refractory alloy.

[0038] Furthermore, an annealing temperature of 1200–1500°C and a holding time of 1–2 hours are used, which is a preferred embodiment of the present invention.

[0039] By rearranging dislocations at high temperatures, the complex and random dislocation configuration is controlled into immovable dislocations distributed around the solidified cell wall. This constructs the initial dislocation cell morphology and lays the foundation for the dynamic strengthening of the dislocation cell through dislocation reaction during the plastic deformation process, resulting in an additive manufacturing refractory alloy in which the solidified cell and immovable dislocation are coupled.

[0040] Due to the inherent high dislocation energies of body-centered cubic refractory metals, dislocation generation and activation are difficult to occur. However, due to the numerous dislocation slip systems in body-centered cubic metals, dislocation reactions can be exceptionally violent when a temperature or force field exists that can activate dislocations. The interaction of dislocation activation in two slip systems can form immobile dislocations, which are 1 / 2 of two different Burgers vectors. <111> The interaction between dislocations generates the Burgers vector. <100> Immovable dislocations (e.g.) This kind of <100> Immovable dislocations become obstacles to dislocation slip during subsequent deformation, prompting more dislocations to undergo dislocation reactions during plastic deformation to form new immovable dislocation pinning points, thereby improving the strength and strain hardening ability of refractory alloys.

[0041] Based on the characteristics of body-centered cubic metal dislocations, the present invention proposes the following approach to control dislocations in refractory alloys: First, commercially available refractory alloy powder with good sphericity is used as raw material. Selective laser melting is then applied to the refractory alloy powder. This additive manufacturing method, selective laser melting, yields a printed refractory alloy with solidified cells and high-density tangled dislocations. Then, the dislocations are processed at 0.35–0.55T... m (T m By subjecting the material to short-term (1-2 hours) stress-relief annealing within a temperature range of its melting point, the dislocation configuration is controlled. This reduces the high internal stress in the additive manufacturing of refractory alloys while simultaneously enabling high-temperature thermal activation, causing dislocations to tend towards low-energy, stable, immovable dislocation configurations. This transforms the complex, random dislocation configuration into an immovable dislocation configuration with solidified cell structures as pinning sites, constructing a stable initial dislocation cell morphology. During plastic deformation, dislocation reactions continuously occur, achieving self-reinforcement of the dislocation cell structure. In additive manufacturing, the solidified cell walls formed by high cooling rates and high temperature gradients become the optimal nucleation sites for immovable dislocations. As a result, the solidified cells of refractory materials manufactured by additive manufacturing after annealing achieve a high degree of coupling with immovable dislocations. During plastic deformation, the coupling effect of the two becomes an obstacle to the movement of movable dislocations, thereby increasing the yield strength of the refractory alloy. It also constructs a cellular coupling structure in which immovable dislocations are dispersed in the solidified cell walls. The existence of this cellular structure enables the additive manufacturing of ultra-high temperature refractory alloys to exhibit ultra-high strength and ultra-high strain hardening ability during plastic deformation at room temperature and ultra-high temperature. This process, while eliminating internal stress in additively manufactured ultra-high temperature refractory alloys, rearranges the complex and random dislocation configuration in the refractory alloy material, controlling it to become a cellular, immovable dislocation configuration with the solidified cell wall as pinning sites. This constructs a cellular structure where immovable dislocations are coupled with the solidified cell. This cellular structure can continuously react with movable dislocations during plastic deformation at room temperature and ultra-high temperatures, forming immovable dislocations and achieving self-reinforcement. This allows additively manufactured ultra-high temperature refractory alloys to withstand temperatures above 0.6T. m It exhibits excellent yield strength and strain hardening capability under extreme temperatures (>0.6T). On the other hand, the solidified cell wall, containing numerous immobile dislocations, also serves as a site for dislocation reactions, causing these reactions to continuously occur within the solidified cell wall. The dislocations in the solidified cell wall gradually self-reinforce, forming dislocation cells, which provides excellent strain hardening capability. Furthermore, this dislocation configuration exhibits excellent strain hardening capability under ultra-high temperature environments (>0.6T). m It will not completely decompose even at ultra-high temperatures (>0.6T), therefore it can withstand extremely high temperatures. m It provides higher strength and strain hardening capacity.

[0042] This additively manufactured refractory alloy exhibits the following performance characteristics compared to conventional commercial alloys: room temperature strength is increased by approximately 40% while maintaining essentially no reduction in room temperature plasticity, and ultra-high temperature strength (>0.6T) is also improved. mSignificant improvement, at 0.66T m The strength is increased by about 20%, and ultra-high temperature strain hardening can be achieved at the same time.

[0043] This method introduces a solidified cellular structure into refractory alloys through the rapid solidification process unique to additive manufacturing. Combined with the high thermal stress cycling during forming, high-density dislocations are simultaneously introduced. A short-duration, medium-temperature annealing step further modulates the dislocations in the body-centered cubic alloy. Under the influence of annealing, the dislocations rearrange to form immovable dislocations distributed around the solidified cell wall, constructing the initial dislocation cell configuration. This dislocation cell configuration can continuously react with movable dislocations during the plastic deformation stage to form immovable dislocations, thus achieving dynamic self-reinforcement of the dislocation cell structure. This structure improves the room temperature and ultra-high temperature strength of the refractory alloy and achieves ultra-high temperature strain hardening.

[0044] The following provides a more detailed description of the method of the present invention through different embodiments.

[0045] Example 1

[0046] Step 1: Selective laser melting (SLM) technology was used to print Ta-10W alloy powder (chemical composition: carbon: 0.03%, nitrogen: 0.08%, oxygen: 0.16%, tungsten: 9.5%, tantalum: balance) into shape. The laser scanning speed used for printing was 540 mm / s, and the energy density was 246.91 J / mm². 3 .

[0047] The positional relationship between solidified cells and dislocations in the printed sample was observed using electronic channel contrast imaging, such as... Figure 1 As shown, there is no coupling between the two; a large number of randomly arranged tangled dislocations exist inside the honeycomb-like solidified cells. A schematic diagram of the relationship between solidified cells and dislocations in the printed sample is shown below. Figure 2 As shown.

[0048] Step 2, with a vacuum level below 5×10 -3 Printed Ta-10W alloy was processed in a vacuum furnace at 0.35–0.55 T. m The melting point is subjected to stress-relief annealing at a temperature of 1500℃ for 1 hour, with the heating rate maintained within the range of 10℃ / min. The temperature fluctuation during annealing is less than 20℃.

[0049] The positional relationship between solidified cells and dislocations in the annealed sample was observed using electron channel contrast imaging, such as... Figure 3As shown, after annealing, a large number of dislocations form low-energy immobile dislocation configurations (the Burgers vectors of immobile dislocations are determined according to the extinction rule, as shown in Table 1). These immobile dislocations are distributed at the solidified cell wall location, and there is a coupling relationship between them and the solidified cell. A schematic diagram of the relationship between the solidified cell and dislocations in the annealed sample is shown below. Figure 4 As shown in the figure. The flowchart for controlling the dislocation configuration of the printed Ta-10W alloy under the stress-relief annealing process is as follows. Figure 5 As shown.

[0050] Example 2

[0051] Step 1: Selective laser melting (SLM) technology is used to print Ta-10W alloy powder (chemical composition: carbon: 0.01%, nitrogen: 0.02%, oxygen: 0.17%, tungsten: 10%, tantalum: balance) into shape. The laser scanning speed used for printing is 600 mm / s, and the energy density is 220 J / mm². 3 .

[0052] Step 2, with a vacuum level below 5×10 -3 Printed Ta-10W alloy was processed in a vacuum furnace at 0.35–0.55 T. m The melting point is subjected to stress-relief annealing at a temperature of 1200℃ for 1.5 hours, with the heating rate maintained within the range of 9℃ / min. The temperature fluctuation during annealing is less than 20℃.

[0053] Example 3

[0054] Step 1: Selective laser melting (SLM) technology is used to print Ta-10W alloy powder (chemical composition: carbon: 0.05%, nitrogen: 0.06%, oxygen: 0.2%, tungsten: 10.5%, tantalum: balance) into shape. The laser scanning speed used for printing is 400 mm / s, and the energy density is 230 J / mm². 3 .

[0055] Step 2, with a vacuum level below 5×10 -3 Printed Ta-10W alloy was processed in a vacuum furnace at 0.35–0.55 T. m The melting point is subjected to stress-relief annealing at a temperature of 1670℃ for 1 hour, with the heating rate maintained within the range of 12℃ / min. The temperature fluctuation during annealing is less than 20℃.

[0056] Example 4

[0057] Step 1: Selective laser melting (SLM) technology was used to print Ta-10W alloy powder (chemical composition: carbon: 0.02%, nitrogen: 0.04%, oxygen: 0.18%, tungsten: 9.5%, tantalum: balance) into shape. The laser scanning speed used for printing was 700 mm / s, and the energy density was 240 J / mm². 3 .

[0058] Step 2, with a vacuum level below 5×10 -3 Printed Ta-10W alloy was processed in a vacuum furnace at 0.35–0.55 T. m The melting point is subjected to stress-relief annealing at a temperature of 1060℃ for 2 hours, with the heating rate maintained within the range of 8℃ / min. The temperature fluctuation during annealing is less than 20℃.

[0059] The method of the present invention will be verified by improving mechanical properties.

[0060] Quasi-static tensile tests were conducted at room temperature on additively manufactured Ta-10W alloys containing a large number of regularly arranged immovable dislocations and conventionally manufactured Ta-10W alloys (test rate 10). -3 s -1 This was used to verify the effect of immobile dislocations on improving the mechanical properties of Ta-10W alloy. For example... Figure 6 As shown, the room temperature yield strength of the printed annealed Ta-10W alloy prepared in this embodiment of the invention can reach 693 MPa, which is about 200 MPa higher than that of commercially available Ta-10W alloys prepared by conventional processes, representing an increase of about 40%. Simultaneously, its strain hardening capability is also superior to that of Ta-10W alloys prepared by conventional processes. Figure 7 As shown, the printed annealed Ta-10W alloy prepared in this embodiment of the invention is subjected to a temperature of 2000℃ (~0.66T) m T m The ultra-high temperature yield strength (the melting point temperature of the material) exceeds 120 MPa, which is about 20 MPa higher than the yield strength of commercially available Ta-10W alloy produced by conventional processes, representing a 20% increase. It also exhibits strain hardening capability at ultra-high temperatures.

[0061] Table 1. Extinction Rules for Dislocations in Body-Centered Cubic Crystals

[0062]

[0063] Dislocation visibility means that the dislocation of the Burger vector is visible in the direction of the crystal plane; dislocation invisibility means that the dislocation of the Burger vector is not visible in the direction of the crystal plane.

[0064] The Burgers vector of a dislocation can be determined by observing the visible and invisible patterns of dislocations on different crystal planes.

[0065] From the above embodiments and appendices Figure 1-7As can be seen, this invention fully utilizes the dislocation characteristics of body-centered cubic refractory alloys and the control of alloy substructure by selective laser melting technology. Employing a medium-temperature, short-time stress-relief annealing strategy, it designs and constructs a dislocation configuration coupling solidified cells and immobile dislocations. This dislocation configuration achieves self-reinforcement during room temperature and ultra-high temperature plastic deformation, ultimately realizing the synergistic improvement of the room temperature and ultra-high temperature strength of refractory alloys. The method of this invention is simple, and the improvement in room temperature and ultra-high temperature mechanical properties is significant, showing broad application prospects in extreme service environments such as metallurgy and aerospace.

[0066] This invention is not limited to the above embodiments. Based on the technical solutions disclosed in this invention, those skilled in the art can make some substitutions and modifications to some of the technical features without creative effort, and all such substitutions and modifications are within the protection scope of this invention.

Claims

1. A method for controlling the dynamic self-reinforced dislocation configuration of additively manufactured refractory alloys, characterized in that, Comprise: Ta-10W alloy powder is laser printed by selective laser melting method, laser printing scanning speed is 400-700 mm / s, energy density is 220-260 J / mm 3 ; obtain additive manufacturing refractory alloy with solidification cell structure and high dislocation density; Ta-10W alloy powder is prepared by using the following raw materials in mass ratio: carbon: 0.01-0.05%, nitrogen: 0.02-0.08%, oxygen: 0.16-0.2%, tungsten: 9.5-10.5%, and the balance being tantalum; Under the condition of vacuum degree, the laser printing forming gets high dislocation density of additive manufacturing refractory alloy at 0.35~0.55T m The short-time medium-temperature stress relief annealing is carried out at the temperature of 1200~1500 DEG C for 1~2 hours at the heating rate of 8~12 DEG C / min and the temperature of 35~55% of the melting point of Ta-10W alloy (3035 DEG C), and the refractory alloy with dynamic self-enhanced dislocation configuration coupled by solidification cells and immobile dislocations is obtained after cooling.

2. The method of claim 1, wherein the method is a method of additive manufacturing of a refractory alloy dynamic self-reinforced dislocation configuration. The temperature fluctuation during annealing holding is less than 20℃.

3. The method of claim 1, wherein the method is a method of additive manufacturing of a refractory alloy dynamic self-reinforced dislocation configuration, the method comprising: When the vacuum level is lower The printed Ta-10W alloy was subjected to stress-relief annealing in a vacuum furnace.

4. A refractory alloy having a dynamic self-strengthening dislocation configuration obtained by the regulation method according to any one of claims 1-3.

5. Use of the refractory alloy having a dynamic self-strengthening dislocation configuration according to claim 4 in metallurgy and aerospace room temperature or ultra-high temperature environments.

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