Integrated packaging welding method and clamping tool

Abstract

The invention relates to the technical field of electronic assembly, and discloses an integrated packaging welding method and a clamping tool, and the welding method comprises the following steps: putting the composition structure of a radio frequency microwave communication assembly product into a workpiece box body; welding fluxes with the melting points located in the same preset temperature interval are arranged among different components of the composition structure, and pressing and fixing are conducted through a pressing mechanism; the maximum temperature value in the preset temperature interval is smaller than the minimum value of the temperature at which the material structure performance of the composition structure is damaged; the workpiece box body is detachably locked on the tool base; and putting the tool base into a vacuum sintering system, adjusting the internal temperature of the vacuum sintering system to a preset temperature interval, and integrally welding the composition structure to obtain a radio frequency microwave communication assembly product. According to the invention, it can be ensured that a radio frequency microwave communication assembly product obtained through welding has good overall performance and quality.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic assembly, and in particular to an integrated packaging welding method and a clamping tool. Background Art

[0002] In RF microwave communication component products, as the complexity of products increases, higher requirements are also put forward for the production packaging process, and the packaging process flow is more refined and precise. The packaging process of existing RF microwave communication component products is divided into multiple welding processes in sequence according to the components such as printed boards, components, insulators, carriers and chips. The welding temperatures of different welding processes are different, and the welding temperatures gradually decrease in sequence. It usually takes 3 to 5 welding processes to complete the entire packaging. There are many welding process flows, which are time-consuming and inefficient. In addition, the welding temperature that gradually decreases in a gradient is higher in the front sequence, which is easy to cause certain thermal damage to the components such as printed boards, chips and components, destroying their material structure properties, resulting in a decrease in the overall performance of the product. Summary of the invention

[0003] Therefore, the technical problem to be solved by the present invention is to overcome the defects in the prior art that the packaging and welding process of RF microwave communication component products is time-consuming and easily leads to a decrease in the overall performance of the product, thereby providing an integrated packaging and welding method and clamping tooling.

[0004] In a first aspect, the present invention provides an integrated packaging welding method, comprising the following steps:

[0005] The components of the radio frequency microwave communication component product are placed in the workpiece box respectively, and solder with a melting point in the same preset temperature range is arranged between different components of the components, and a clamping mechanism is used to press and fix them; the maximum temperature value in the preset temperature range is less than the minimum temperature value that causes the material structure performance of the components to be destroyed;

[0006] The workpiece box body is detachably locked to the tooling base;

[0007] The tooling base is placed in a vacuum sintering system, the internal temperature of the vacuum sintering system is adjusted to the preset temperature range, and the component structure is welded into one to obtain a radio frequency microwave communication component product.

[0008] An integrated packaging welding method according to the present invention has at least the following technical effects:

[0009] The component structure of the RF microwave communication component product is integrally clamped in a workpiece box, solder with a melting point in the same preset temperature range is arranged between different components of the component structure, and the tooling base with the integrally clamped component structure is placed in a vacuum sintering system. The interior of the vacuum sintering system is kept in a vacuum environment and gradually heated to a preset temperature range. The temperature atmosphere is controllable, so that the solder automatically melts in a vacuum environment to achieve welding of the integrally clamped component structure with a low void rate or even no void rate, and the welding process is time-saving and efficient. At the same time, because the maximum temperature value of the preset temperature range is lower than the minimum temperature that causes the destruction of the material structure performance of the component structure, the material structure performance of the component structure will not be affected during welding in a vacuum environment, thereby ensuring that the RF microwave communication component product obtained by welding has better overall performance and quality.

[0010] In an optional embodiment, the step of adjusting the internal temperature of the vacuum sintering system to the preset temperature range and welding the component structures into one body to obtain a radio frequency microwave communication component product comprises the following steps:

[0011] The vacuum sintering system is evacuated and filled with nitrogen;

[0012] Maintaining the interior of the vacuum sintering system at a set vacuum degree, raising the temperature to a first set temperature value, and maintaining the first set temperature value for a first set time;

[0013] Maintaining the interior of the vacuum sintering system at the set vacuum degree, raising the temperature to a second set temperature value, and maintaining the second set temperature value for a second set time;

[0014] The vacuum sintering system is kept at the set vacuum degree, the temperature is raised to the melting point of the solder, nitrogen is filled in and the system is kept for a third set time to perform welding;

[0015] The interior of the vacuum sintering system is kept in a nitrogen-filled state and cooled to room temperature.

[0016] In an optional embodiment, the component structure includes a printed circuit board, an insulator, components, a carrier and a chip; the insulator, the components and the carrier are respectively placed in corresponding mounting grooves of the end face of the printed circuit board facing away from the tooling base, and the chip is arranged on the end face of the carrier facing away from the tooling base; the solder is arranged between the printed circuit board and the insulator, between the printed circuit board and the components, between the printed circuit board and the carrier, and between the carrier and the chip.

[0017] In an optional embodiment, the solder located between the printed circuit board and the insulator and between the printed circuit board and the components is set to paste solder; the solder located between the printed circuit board and the carrier and between the carrier and the chip is set to sheet solder, and the thickness of the sheet solder is set to 0.02 mm to 0.05 mm.

[0018] In an optional embodiment, before placing the tooling base into the vacuum sintering system, the following steps are also included:

[0019] A first bolt is threadedly connected to a first threaded hole concentrically arranged on the tooling base with the insulator, and the first bolt is abutted against the insulator for locking.

[0020] In an optional implementation, the pressing and fixing using a pressing mechanism includes the following steps:

[0021] The first pressing block of the pressing mechanism is embedded in the end surface of the workpiece box body away from the tooling base, and the printed circuit board is pressed and fixed in the workpiece box body;

[0022] The second pressing block of the pressing mechanism is embedded in the first avoidance through hole of the first pressing block, and the chip and the carrier are pressed and fixed to the printed circuit board, and the first avoidance through hole is used to avoid the chip.

[0023] In an optional embodiment, before placing the tooling base into the vacuum sintering system, the following steps are also included:

[0024] An upper cover is arranged above the workpiece box body away from the tooling base, and the upper cover is detachably connected to the tooling base;

[0025] A first spring stud is threadedly connected in a second threaded hole on the upper cover that is coaxial with the first avoidance through-hole, and the first spring stud is pressed against the second pressing block to be fixed;

[0026] A second spring stud is threadedly connected in a third threaded hole on the upper cover that is coaxial with the second avoidance through-hole of the first pressure block, and the second spring stud is pressed against the component to be fixed, and the second avoidance through-hole is used to avoid the component;

[0027] A third spring stud is threadedly connected in the fourth threaded hole of the upper cover, and the third spring stud is pressed against the first pressing block to be fixed.

[0028] In a second aspect, the present invention further provides a clamping tool, which is applied to the integrated packaging welding method provided in the first aspect above, and is used to fix the printed circuit board, insulator, components, carrier and chip for welding, and the clamping tool comprises:

[0029] The workpiece box body is provided with a mounting hole for receiving the printed circuit board, and a first through hole is provided at a position of the side wall of the workpiece box body corresponding to the insulator;

[0030] A tool base is detachably connected to the lower end of the workpiece box body, the tool base is concentrically provided with a first threaded hole corresponding to the position of the first through hole, the first threaded hole is threadedly connected with a first bolt, and the first bolt abuts against the insulator and locks the insulator;

[0031] The clamping mechanism is arranged on the end surface of the workpiece box body away from the tooling base, and is used for pressing and fixing the printed circuit board, the carrier and the chip.

[0032] A clamping tool according to the present invention has at least the following beneficial effects:

[0033] By providing a mounting hole in the workpiece box body, and the mounting hole is suitable for embedding a clamping mechanism, in the process of clamping the component structure of the radio frequency microwave communication component product, the printed circuit board is first placed in the mounting hole, and then the insulator, components and carrier are respectively placed in the corresponding mounting grooves of the printed circuit board, and a chip is provided at the upper end of the carrier through solder; then the clamping mechanism is embedded in the mounting hole, and the printed circuit board, the carrier and the chip are pressed and fixed by the dead weight of the clamping mechanism, and at the same time, the first bolt is threadedly connected in the first threaded hole, and the first bolt abuts and locks the insulator concentrically arranged in the first through hole, ensuring that when the component structure is clamped as a whole and placed in a vacuum sintering system for welding, the carrier and the chip are not easy to shift or float, the printed circuit board is not easy to bounce and warp, and the insulator is not easy to deviate, and the concentricity is accurate; thereby ensuring that the radio frequency microwave communication component product obtained by welding has better overall performance and quality.

[0034] In an optional embodiment, the clamping mechanism includes a first pressure block and a second pressure block, the first pressure block is used to be embedded in the workpiece box body, and is used to press and fix the printed circuit board in the workpiece box body, and the projection of the first pressure block along the thickness direction of the first pressure block at least coincides with the printed circuit board; the first pressure block is respectively provided with a first avoidance perforation and a second avoidance perforation corresponding to the positions of the chip and the components, the second pressure block is used to be embedded in the second avoidance perforation, and two limit bars are spaced apart on the end face of the second pressure block facing the tooling base, the two limit bars are pressed against the end face of the carrier away from the printed circuit board, and abut against the two side walls of the chip; contact bosses are respectively provided on the side facing each other of the two limit bars, and the contact bosses are pressed against the four corners of the end face of the chip away from the carrier.

[0035] In an optional embodiment, it also includes an upper cover, which is arranged above the workpiece box body away from the tooling base and is detachably connected to the tooling base, and the upper cover is concentrically provided with a second threaded hole corresponding to the position of the first avoidance through-hole, and the second threaded hole is threadedly connected with a first spring stud, and the first spring stud is used to abut the second pressure block for pressure fixation; the upper cover is concentrically provided with a third threaded hole corresponding to the position of the second avoidance through-hole, and the third threaded hole is threadedly connected with a second spring stud, and the second spring stud is used to abut the component for pressure fixation; the upper cover is penetrated by a fourth threaded hole, and the fourth threaded hole is threadedly connected with a third spring stud, and the third spring stud is used to abut the first pressure block for pressure fixation;

[0036] And / or, an ear wall is provided on the end surface of the tooling base facing the workpiece box body along the outer contour of the tooling base, the first threaded hole is provided on the ear wall, and the gap between the ear wall and the workpiece box body is set to 15 mm to 20 mm.

[0037] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1This is a flow diagram of the principle of welding using a vacuum sintering system in an integrated packaging welding method of this embodiment;

[0040] Figure 2 This is a schematic diagram of the three-dimensional structure of the clamping tooling of this embodiment;

[0041] Figure 3 for Figure 2 Schematic diagram of the decomposition structure;

[0042] Figure 4 for Figure 2 A schematic diagram of the structure of the workpiece box and the assembly of the partial component structure;

[0043] Figure 5 for Figure 2 A schematic diagram of the structure of the tooling base;

[0044] Figure 6 for Figure 2 A schematic structural diagram of the first pressing block in FIG.

[0045] Figure 7 for Figure 2 A schematic structural diagram of the second pressing block in FIG.

[0046] Figure 8 for Figure 7 A structural diagram from another perspective;

[0047] Fig. 9 for Figure 2 Schematic diagram of the structure of the upper cover.

[0048] Description of reference numerals:

[0049] 100-workpiece box body, 110-first through hole, 120-third through hole;

[0050] 200-tooling base, 210-first threaded hole, 220-first bolt, 230-ear wall, 240-long through slot, 250-fifth threaded hole, 260-first fastening bolt, 270-sixth threaded hole;

[0051] 310-printed circuit board, 320-insulator, 330-components, 340-chip;

[0052] 400-upper cover, 410-second threaded hole, 420-first spring stud, 430-third threaded hole, 440-second spring stud, 450-fourth threaded hole, 460-third spring stud, 470-connecting ear, 471-fourth through hole, 480-second fastening bolt;

[0053] 510 - first pressing block, 511 - first avoiding through hole, 512 - second avoiding through hole, 513 - second through hole, 520 - second pressing block, 521 - limiting strip, 522 - contact boss. DETAILED DESCRIPTION

[0054] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0055] In the description of this embodiment, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this embodiment and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting this embodiment. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0056] In the description of this embodiment, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this embodiment can be understood according to specific circumstances.

[0057] Combine the following Figures 1 to 9 , describing an embodiment of the present invention.

[0058] According to a first aspect of an embodiment of the present invention, there is provided an integrated packaging welding method, comprising the following steps:

[0059] The components of the radio frequency microwave communication component product are respectively placed in the workpiece box 100, and solders with melting points in the same preset temperature range are arranged between different components of the components, and a pressing mechanism is used to press and fix them; the maximum temperature value in the preset temperature range is less than the minimum temperature value that causes the material structure performance of the components to be destroyed;

[0060] The workpiece box body 100 is detachably locked to the tooling base 200;

[0061] The tooling base 200 is placed in a vacuum sintering system, the internal temperature of the vacuum sintering system is adjusted to the preset temperature range under a vacuum environment, and the component structures are welded together to obtain a radio frequency microwave communication component product.

[0062] The welding method of this embodiment is to clamp the component structure of the RF microwave communication component product in an integral manner in a workpiece box body 100, and solder with a melting point in the same preset temperature range is arranged between different components of the component structure, and the tooling base 200 with the integrally clamped component structure is placed in a vacuum sintering system. The interior of the vacuum sintering system is kept in a vacuum environment and gradually heated to a preset temperature range. The temperature atmosphere is controllable, so that the solder automatically melts in a vacuum environment to achieve welding of the integrally clamped component structure, and has a low void rate or even no void rate, and the welding process is time-saving and efficient. At the same time, because the maximum temperature value of the preset temperature range is lower than the minimum temperature that causes the destruction of the material structure performance of the component structure, the material structure performance of the component structure will not be affected during welding in a vacuum environment, ensuring that the RF microwave communication component product obtained by welding has better overall performance and quality.

[0063] It should be noted that, because the temperature that damages the material properties of each component of the structure of the RF microwave communication component product in the related art is at least 300°C, the preset temperature range of this embodiment is set at 170°C to 240°C.

[0064] It should be noted that after the welded component structure is taken out from the vacuum sintering system, vapor phase cleaning is used to clean off the solder slag and flux remaining on the surface.

[0065] It should be noted that the void rate is an important quality indicator for measuring welding. The lower the void rate, the better the grounding and thermal conductivity. The overall performance of the RF microwave communication component products is better during operation and the reliability is more guaranteed.

[0066] It is understandable that the relevant technology usually uses a welding gun or a hot plate to complete the welding of the component structure in an external environment. Solders with different melting points need to be used step by step to complete the corresponding welding, and the welding process is complicated. If the welding is performed in an external environment (non-vacuum environment) at one time, the temperature is not easy to control, and voids and cold solder joints are prone to occur, which leads to poor overall performance of RF microwave communication component products.

[0067] In some embodiments, adjusting the internal temperature of the vacuum sintering system to the preset temperature range and welding the component structures into one to obtain a radio frequency microwave communication component product comprises the following steps:

[0068] The vacuum sintering system is evacuated and filled with nitrogen;

[0069] Maintaining the interior of the vacuum sintering system at a set vacuum degree, raising the temperature to a first set temperature value, and maintaining the first set temperature value for a first set time;

[0070] Maintaining the interior of the vacuum sintering system at the set vacuum degree, raising the temperature to a second set temperature value, and maintaining the second set temperature value for a second set time;

[0071] The vacuum sintering system is kept at the set vacuum degree, the temperature is raised to the melting point of the solder, nitrogen is filled in and the system is kept for a third set time to perform welding;

[0072] The interior of the vacuum sintering system is kept in a nitrogen-filled state and cooled to room temperature.

[0073] In the welding method of this embodiment, when placing the tooling base 200 with the integrally clamped component structure into the vacuum sintering system for welding, the vacuum sintering system is first evacuated to effectively remove dust attached to the various components of the component structure and the air between the various components, which plays a role in cleaning and exhausting bubbles before welding, and nitrogen is filled to neutralize and reduce the surface oxide layer, so that the welding surface of the various components of the component structure is more stable, more conducive to welding infiltration, and reduce the phenomenon of cold solder joints and poor solder wettability; then, the temperature is raised to a first set temperature value while maintaining the set vacuum degree (i.e., maintaining the vacuum state), and the temperature is maintained at the first set temperature value for a first set time, which can not only discharge the nitrogen that cleans the surface oxide layer to ensure that there is no oxidized dirt inside the vacuum sintering system, but also preheat the internal and external temperatures of the various components of the component structure and the solder to the first set temperature value; then, the vacuum degree is maintained (i.e., maintaining the vacuum state) Then the temperature is raised to a second set temperature value, and maintained at the second set temperature value for a second set time, so that the internal and external temperatures of the various components of the structure and the solder are then preheated to the second set temperature value. At this time, the temperature difference between the second set temperature value and the melting point temperature of the solder is small; finally, the temperature is maintained at the set vacuum degree and then raised to the melting point temperature of the solder, and nitrogen is filled at the melting point temperature and maintained for a third set time. Nitrogen can activate the welding performance during the welding process, making the welding more sufficient and shiny, thereby reducing the occurrence of cold solder joints and voids, improving the welding quality, and ensuring that the solder automatically melts in a vacuum environment to achieve the welding of the integrally clamped structure; after the welding is completed, it enters rapid cooling, and nitrogen is continuously filled during the cooling process to prevent oxidation of the welding surface; the temperature rise of the entire welding process adopts a gradient gradual increase method to ensure that it will not affect the material structure performance of the structure, and ensure that the RF microwave communication component products obtained by welding have better overall performance and quality.

[0074] It should be noted that the first set temperature value refers to the time required for each component of the structure in a normal temperature state to enter the temperature environment in a short time without affecting the material structure performance of each component. The first set time refers to the time required for each component of the structure and the solder to basically reach the first set temperature value inside and outside under the first set temperature environment. The second set temperature value refers to the time required for each component of the structure in the first set temperature state to enter the temperature environment in a short time without affecting the material structure performance of each component; and each component of the structure in the temperature value (second set temperature value) state to enter the solder melting point temperature environment in a short time without affecting the material structure performance of each component. The second set time refers to the time required for each component of the structure and the solder to basically reach the second set temperature value inside and outside under the second set temperature environment. The third set time refers to the time required for the solder to melt inside and outside to complete welding under the solder melting point temperature environment.

[0075] In some embodiments, the component structure includes a printed circuit board 310, an insulator 320, components 330, a carrier and a chip 340. The insulator 320, the components 330 and the carrier are respectively placed in corresponding mounting grooves of the end face of the printed circuit board 310 facing away from the tooling base 200, and the chip 340 is arranged on the end face of the carrier facing away from the tooling base 200; the solder is arranged between the printed circuit board 310 and the insulator 320, between the printed circuit board 310 and the components 330, between the printed circuit board 310 and the carrier, and between the carrier and the chip 340. In the process of integrally clamping the component structure of the RF microwave communication component product, the printed circuit board 310 is first placed in the workpiece box body 100, and then the insulator 320, the component 330 and the carrier are respectively placed in the corresponding installation grooves of the printed circuit board 310, and solder is provided between the printed circuit board 310 and the insulator 320, between the printed circuit board 310 and the component 330, between the printed circuit board 310 and the carrier, and between the carrier and the chip 340; then the clamping mechanism is embedded in the workpiece box body 100, and the printed circuit board 310, the carrier and the chip 340 are pressed and fixed by the dead weight of the clamping mechanism, so as to realize the integral clamping of the component structure of the RF microwave communication component product, and the whole operation process is simple.

[0076] Specifically, the solder between the printed circuit board 310 and the insulator 320 and between the printed circuit board 310 and the component 330 is set as paste solder; the solder between the printed circuit board 310 and the carrier and between the carrier and the chip 340 is set as sheet solder, and the thickness of the sheet solder is set to 0.02mm to 0.05mm. The paste solder has a viscosity, which can play a positioning role when small independent components are placed, and can better prevent displacement during clamping. The paste solder is more conducive to the tin creeping on the side of the device pad, and is more conducive to filling and full welding. At the same time, after multiple process verifications: sheet solder with a thickness of less than 0.02mm may have reliability quality problems such as incomplete welding, insufficient welding strength, and poor adhesion; sheet solder with a thickness of more than 0.05mm will cause too much welding to be too full, and too much overflow will cause short circuits, device adhesion, and excessive tin overflow on the surface of the component to contaminate and damage the component.

[0077] In some embodiments, before placing the tooling base 200 into the vacuum sintering system, the following steps are also included:

[0078] A first bolt 220 is internally threadedly connected to a first threaded hole 210 concentrically arranged on the tooling base 200 with the insulator 320 , and the first bolt 220 is abutted against the insulator 320 for locking.

[0079] The welding method of this embodiment connects the first bolt 220 through the thread in the first threaded hole 210, and the first bolt 220 abuts and locks the concentrically arranged insulator 320, ensuring that the insulator 320 is not easily displaced and has accurate concentricity when the structure is clamped as a whole and placed in a vacuum sintering system for welding, which is beneficial to improving the overall performance and quality of the RF microwave communication component products obtained by welding.

[0080] like Figure 3 As shown, specifically, the insulator 320 is horizontally disposed at the upper outer edge of the printed circuit board 310 , and one end of the insulator 320 passes through the first through hole 110 of the side wall of the workpiece box body 100 and extends to the outside of the workpiece box body 100 .

[0081] In some embodiments, the pressing and fixing using a pressing mechanism comprises the following steps:

[0082] The first pressing block 510 of the pressing mechanism is embedded in the end surface of the workpiece box body 100 away from the tooling base 200, and the printed circuit board 310 is pressed and fixed in the workpiece box body 100;

[0083] The second pressing block 520 of the pressing mechanism is embedded in the first avoiding through hole 511 of the first pressing block 510 , and the chip 340 and the carrier are pressed and fixed to the printed circuit board 310 . The first avoiding through hole 511 is used to avoid the chip 340 .

[0084] The welding method of this embodiment uses a first pressing block 510 whose cross-sectional area is at least equal to that of the printed circuit board 310 to apply pressure to the printed circuit board 310 so that the printed circuit board 310 is pressed and fixed in the workpiece box body 100. When the component structure is clamped as a whole and placed in a vacuum sintering system for welding, it is beneficial to prevent the printed circuit board 310 from bouncing or warping; and uses a second pressing block 520 to press and fix the chip 340 and the carrier in the corresponding installation groove of the printed circuit board 310 as a whole. When the component structure is clamped as a whole and placed in a vacuum sintering system for welding, it is beneficial to prevent the carrier and the chip 340 from shifting or floating, thereby ensuring that the RF microwave communication component product obtained by welding has better overall performance and quality.

[0085] Specifically, before placing the tooling base 200 into the vacuum sintering system, the following steps are also included:

[0086] An upper cover 400 is disposed above the workpiece box body 100 away from the tooling base 200, and the upper cover 400 is detachably connected to the tooling base 200;

[0087] A first spring stud 420 is internally threadedly connected to a second threaded hole 410 coaxially arranged on the upper cover 400 with the first avoidance through hole 511, and the first spring stud 420 is pressed against the second pressing block 520 to be fixed;

[0088] A second spring stud 440 is threadedly connected to a third threaded hole 430 on the upper cover 400 that is coaxial with the second avoidance through hole 512 of the first pressing block 510, and the second spring stud 440 is pressed against the component 330 to be fixed, and the second avoidance through hole 512 is used to avoid the component 330;

[0089] The third spring stud 460 is threadedly connected in the fourth threaded hole 450 of the upper cover 400 , and the third spring stud 460 is pressed against the first pressing block 510 to be fixed.

[0090] In the first aspect, the welding method of this embodiment is to thread the first spring stud 420 in the second threaded hole 410, and use the first spring stud 420 to apply downward pressure toward the printed board 310 to the second pressing block 520, the chip 340 and the carrier, which is more conducive to preventing the chip 340 and the carrier from shifting or floating during welding; in the second aspect, the second spring stud 440 is threadedly connected to the third threaded hole 430, and the second spring stud 440 is used to apply downward pressure toward the printed board 310 to the component 330, which is conducive to preventing the component 330 from shifting or floating during welding; in the third aspect, the third spring stud 460 is threadedly connected to the fourth threaded hole 450, and the third spring stud 460 is used to apply downward pressure toward the tooling base 200 to the first pressing block 510 and the printed board 310, which is conducive to preventing the printed board 310 from bouncing and warping during welding.

[0091] It should be noted that the fourth threaded hole 450 is disposed at a position where the upper cover 400 avoids the first avoidance through hole 511 and the second avoidance through hole 512 .

[0092] like Figures 2 to 9 As shown, according to the second aspect of the embodiment of the present invention, a clamping tool is also provided, which is applied to the integrated packaging welding method provided in the first aspect of the embodiment of the present invention, and is used to fix the printed circuit board 310, the insulator 320, the component 330, the carrier and the chip 340 for welding, and the clamping tool includes a workpiece box body 100, the workpiece box body 100 is provided with a mounting hole for receiving the printed circuit board 310, and the side wall of the workpiece box body 100 is provided with a first through hole 110 corresponding to the position of the insulator 320; the insulator 320 is horizontally arranged at the upper outer edge of the printed circuit board 310, and one end of the insulator 320 is penetrated A first through hole 110 through the side wall of the workpiece box body 100 extends to the outside of the workpiece box body 100; the lower end of the workpiece box body 100 is detachably connected to a tooling base 200, and the tooling base 200 is concentrically provided with a first threaded hole 210 corresponding to the position of the first through hole 110, and the first threaded hole 210 is threadedly connected with a first bolt 220, and the first bolt 220 abuts against the insulator 320 and locks the insulator 320; a clamping mechanism is provided on the end face of the workpiece box body 100 facing away from the tooling base 200, and the clamping mechanism is used to press and fix the printed circuit board 310, the carrier and the chip 340.

[0093] The clamping tool of this embodiment is provided with a mounting hole in the workpiece box body 100, and the mounting hole is suitable for embedding the clamping mechanism. In the process of clamping the component structure of the radio frequency microwave communication component product, the printed circuit board 310 is first placed in the mounting hole, and then the insulator 320, the component 330 and the carrier are respectively placed in the corresponding mounting groove of the printed circuit board 310, and the chip 340 is provided on the upper end of the carrier through solder; then the clamping mechanism is embedded in the mounting hole, and the printed circuit board 310, the carrier and the chip 340 are clamped by the dead weight of the clamping mechanism. The first threaded hole 210 is threadedly connected with the first bolt 220, and the first bolt 220 abuts and locks the insulator 320 concentrically arranged in the first through hole 110, ensuring that when the structure is clamped as a whole and placed in a vacuum sintering system for welding, the carrier and the chip 340 are not easy to shift or float, the printed circuit board 310 is not easy to bounce or warp, and the insulator 320 is not easy to deviate, and the concentricity is accurate; thereby ensuring that the RF microwave communication component product obtained by welding has better overall performance and quality.

[0094] like Figure 5 As shown, specifically, the tooling base 200 is made of aluminum or other metal materials with good thermal conductivity, light weight and non-stick tin, so as to facilitate heat conduction when the component structure is clamped as a whole and placed in a vacuum sintering system for welding; the tooling base 200 is penetrated by a plurality of long through grooves 240 to better gather heat and transfer heat, while also reducing the weight of the tooling base 200.

[0095] like Figure 2 , Figure 3 and Figure 5 As shown, specifically, the end surface of the tool base 200 facing the workpiece box body 100 is provided with an ear wall 230 along the outer contour of the tool base 200, the first threaded hole 210 is provided on the ear wall 230, and the gap between the ear wall 230 and the workpiece box body 100 is set to 15mm to 20mm, so that the top fixing condition can be observed when the insulator 320 is abutted and locked by the first bolt 220. More specifically, the top surface of the ear wall 230 is flush with the top surface of the workpiece box body 100.

[0096] Specifically, the first bolt 220 is made of polytetrafluoroethylene.

[0097] Here, the detachable connection structure of the workpiece box body 100 and the tooling base 200 is described in detail. Figures 2 to 5As shown, in some embodiments, the four corners of the end face of the tooling base 200 facing the workpiece box body 100 are respectively provided with fifth threaded holes 250, and the fifth threaded hole 250 is threadedly connected with a first fastening bolt 260, and the workpiece box body 100 is provided with a third through hole 120 at a position corresponding to the fifth threaded hole 250, and the third through hole 120 is used for the rod of the first fastening bolt 260 to pass through; during assembly, the rod of the first fastening bolt 260 is passed through the third through hole 120 and threadedly screwed to the fifth threaded hole 250. In another replaceable embodiment, the four corners of the end face of the tooling base 200 facing the workpiece box body 100 are respectively provided with first fastening nuts, the first fastening nut is threadedly connected with a first fastening bolt 260, and the workpiece box body 100 is provided with a third through hole 120 at a position corresponding to the first fastening nut, and the third through hole 120 is used for the rod of the first fastening bolt 260 to pass through; during assembly, the rod of the first fastening bolt 260 is passed through the third through hole 120 and threadedly screwed to the first fastening nut.

[0098] like Figure 2 , Figure 3 as well as Figures 6 to 8 As shown, in some embodiments, the clamping mechanism includes a first clamping block 510 and a second clamping block 520, the first clamping block 510 is used to be embedded in the workpiece box body 100, and is used to press and fix the printed board 310 in the workpiece box body 100, and the projection of the first clamping block 510 along the thickness direction of the first clamping block 510 at least overlaps with the printed board 310; the first clamping block 510 is respectively provided with a first avoidance through hole 511 and a second avoidance through hole 520 at positions corresponding to the chip 340 and the component 330. 12. The second pressing block 520 is used to be embedded in the second avoidance through-hole 512. Two limiting strips 521 are arranged at intervals on the end face of the second pressing block 520 facing the tooling base 200. The two limiting strips 521 are pressed against the end face of the carrier away from the printed circuit board 310 and abut against the two side walls of the chip 340. Two contact bosses 522 are respectively arranged on the side facing each other of the two limiting strips 521. The contact bosses 522 are pressed against the four corners of the end face of the chip 340 away from the carrier.

[0099] The clamping tool of this embodiment uses a first pressing block 510 with a cross-sectional area at least equal to that of the printed board 310 to press the printed board 310 so that the printed board 310 is pressed and fixed to the mounting hole of the workpiece box body 100. Because the positions of the printed board 310 except for the insulator 320, the components 330, the carrier and the chip 340 are all pressed by the first pressing block 510, it is beneficial to prevent the printed board 310 from bouncing and warping when the structure is clamped and placed in the vacuum sintering system for welding; two spaced-apart limiting strips 521 are also pressed against the carrier. The body faces the end face of the chip 340 and abuts against the two side walls of the chip 340 to ensure that the chip 340 is accurately positioned and installed on the carrier; at the same time, the four contact bosses 522 are respectively pressed on the four corners of the end face of the chip 340 away from the carrier, and other positions are kept empty, which can effectively reduce the risk of damaging the chip 340 by pressing on the chip 340 circuit. When the structure is clamped as a whole and placed in a vacuum sintering system for welding, it is also beneficial to prevent the carrier and the chip 340 from shifting or floating, thereby ensuring that the RF microwave communication component products obtained by welding have better overall performance and quality.

[0100] Specifically, the first pressing block 510 is made of aluminum or other metal materials with good thermal conductivity, light weight and non-stick tin, so that when the structure is clamped as a whole and placed in a vacuum sintering system for welding, the heat can be transferred to the printed circuit board 310; a plurality of second through holes 513 are provided through the non-circuit corresponding positions of the first pressing block 510, so as to accelerate the flow of hot air during welding, reduce the welding void rate of the printed circuit board 310, and improve the welding quality.

[0101] Specifically, the second pressing block 520 is made of graphite or aluminum; the width of the second pressing block 520 is consistent with the width of the chip 340 , and the length is 0.5 mm to 0.8 mm longer than the single side length of the chip 340 .

[0102] like Figure 2 , Figure 3 and Fig. 9As shown, in some embodiments, the clamping tool also includes an upper cover 400, which is arranged on the upper side of the workpiece box body 100 away from the tool base 200 and is detachably connected to the tool base 200, and the upper cover 400 is concentrically provided with a second threaded hole 410 corresponding to the position of the first avoidance through hole 511, and the second threaded hole 410 is threadedly connected with a first spring stud 420, and the first spring stud 420 is used to abut the second pressure block 520 for pressure fixation; the upper cover 400 is concentrically provided with a third threaded hole 430 corresponding to the position of the second avoidance through hole 512, and the third threaded hole 430 is threadedly connected with a second spring stud 440, and the second spring stud 440 is used to abut the component 330 for pressure fixation; the upper cover 400 is penetrated by a fourth threaded hole 450, and the fourth threaded hole 450 is threadedly connected with a third spring stud 460, and the third spring stud 460 is used to abut the first pressure block 510 for pressure fixation.

[0103] In the first aspect, the clamping tool of this embodiment is threadedly connected to the first spring stud 420 in the second threaded hole 410, and the first spring stud 420 is used to apply downward pressure toward the printed board 310 to the second pressure block 520, the chip 340 and the carrier, which is more conducive to preventing the chip 340 and the carrier from shifting or floating during welding; in the second aspect, the second spring stud 440 is threadedly connected to the third threaded hole 430, and the second spring stud 440 is used to apply downward pressure toward the printed board 310 to the component 330, which is conducive to preventing the component 330 from shifting or floating during welding; in the third aspect, the third spring stud 460 is threadedly connected to the fourth threaded hole 450, and the third spring stud 460 is used to apply downward pressure toward the tooling base 200 to the first pressure block 510 and the printed board 310, which is conducive to preventing the printed board 310 from bouncing and warping during welding.

[0104] Specifically, the upper cover 400 is made of graphite or aluminum.

[0105] Here, the detachable connection structure of the upper cover 400 and the tooling base 200 is described in detail. Figure 3 and Fig. 9 As shown, in some embodiments, both side walls of the upper cover 400 are folded downward to form connecting ears 470, and the connecting ears 470 are penetrated by a fourth through hole 471, and the fourth through hole 471 is used for the rod of the second fastening bolt 480 to pass through, and the side wall of the tooling base 200 is concentrically provided with a sixth threaded hole 270 corresponding to the position of the fourth through hole 471, and the sixth threaded hole 270 matches the rod of the second fastening bolt 480; during assembly, the rod of the second fastening bolt 480 is passed through the fourth through hole 471 and threadedly screwed to the sixth threaded hole 270.

[0106] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the present invention.

Claims

1. An integrated packaging welding method, characterized in that: The following steps are involved: The component structures of the radio frequency microwave communication component products are respectively placed in a workpiece box (100), solders with melting points in the same preset temperature range are arranged between different components of the component structures, and a pressing mechanism is used to press and fix them; the maximum temperature value in the preset temperature range is less than the minimum temperature value that causes damage to the material structure properties of the component structures; The workpiece box body (100) is detachably locked to the tooling base (200); The tooling base (200) is placed in a vacuum sintering system, the internal temperature of the vacuum sintering system is adjusted to the preset temperature range, and the component structures are welded together to obtain a radio frequency microwave communication component product.

2. The integrated packaging welding method according to claim 1, characterized in that: The step of adjusting the internal temperature of the vacuum sintering system to the preset temperature range and welding the component structures into one body to obtain a radio frequency microwave communication component product comprises the following steps: The vacuum sintering system is evacuated and filled with nitrogen; Maintaining the interior of the vacuum sintering system at a set vacuum degree, raising the temperature to a first set temperature value, and maintaining the first set temperature value for a first set time; Maintaining the interior of the vacuum sintering system at the set vacuum degree, raising the temperature to a second set temperature value, and maintaining the second set temperature value for a second set time; The vacuum sintering system is kept at the set vacuum degree, the temperature is raised to the melting point of the solder, nitrogen is filled in and the system is kept for a third set time to perform welding; The interior of the vacuum sintering system is kept in a nitrogen-filled state and cooled to room temperature.

3. An integrated packaging welding method according to claim 1 or 2, characterized in that: The component structure comprises a printed circuit board (310), an insulator (320), components (330), a carrier and a chip (340); the insulator (320), the components (330) and the carrier are respectively placed in corresponding mounting grooves of the end surface of the printed circuit board (310) away from the tooling base (200); the chip (340) is arranged on the end surface of the carrier away from the tooling base (200); the solder is arranged between the printed circuit board (310) and the insulator (320), between the printed circuit board (310) and the components (330), between the printed circuit board (310) and the carrier, and between the carrier and the chip (340).

4. The integrated packaging welding method according to claim 3, characterized in that: The solder located between the printed circuit board (310) and the insulator (320) and between the printed circuit board (310) and the component (330) is set as paste solder; the solder located between the printed circuit board (310) and the carrier and between the carrier and the chip (340) is set as sheet solder, and the thickness of the sheet solder is set to 0.02 mm to 0.05 mm.

5. The integrated packaging welding method according to claim 3, characterized in that: Before placing the tooling base (200) into the vacuum sintering system, the following steps are also included: A first bolt (220) is internally threadedly connected to a first threaded hole (210) arranged concentrically with the insulator (320) on the tooling base (200), and the first bolt (220) is abutted against the insulator (320) for locking.

6. The integrated packaging welding method according to claim 5, characterized in that: The method of using a pressing mechanism to press and fix comprises the following steps: The first pressing block (510) of the pressing mechanism is embedded in the end surface of the workpiece box body (100) away from the tooling base (200), and the printed circuit board (310) is pressed and fixed in the workpiece box body (100); The second pressing block (520) of the pressing mechanism is embedded in the first avoidance through hole (511) of the first pressing block (510), and the chip (340) and the carrier are pressed and fixed to the printed circuit board (310), and the first avoidance through hole (511) is used to avoid the chip (340).

7. The integrated packaging welding method according to claim 6, characterized in that: Before placing the tooling base (200) into the vacuum sintering system, the following steps are also included: An upper cover (400) is arranged above the workpiece box body (100) away from the tooling base (200), and the upper cover (400) is detachably connected to the tooling base (200); A first spring stud (420) is internally threadedly connected to a second threaded hole (410) arranged concentrically with the first avoidance through hole (511) on the upper cover (400), and the first spring stud (420) is pressed against the second pressing block (520) to be fixed; A second spring stud (440) is internally threadedly connected to a third threaded hole (430) on the upper cover (400) that is coaxial with the second avoidance through hole (512) of the first pressing block (510), and the second spring stud (440) is pressed against the component (330) to be fixed, and the second avoidance through hole (512) is used to avoid the component (330); The third spring stud (460) is threadedly connected to the fourth threaded hole (450) of the upper cover (400), and the third spring stud (460) is pressed against the first pressing block (510) to be fixed.

8. A clamping tool, applied to the integrated packaging welding method according to any one of claims 1 to 7, and used to fix a printed circuit board (310), an insulator (320), components (330), a carrier and a chip (340) for welding, characterized in that: The clamping tooling comprises: A workpiece box body (100) is provided with a mounting hole for receiving the printed circuit board (310), and a first through hole (110) is provided on a side wall of the workpiece box body (100) at a position corresponding to the insulator (320); A tool base (200) is detachably connected to the lower end of the workpiece box body (100); the tool base (200) is provided with a first threaded hole (210) concentrically corresponding to the position of the first through hole (110); the first threaded hole (210) is threadedly connected with a first bolt (220); the first bolt (220) abuts against the insulator (320) and locks the insulator (320); The pressing mechanism is arranged on the end surface of the workpiece box body (100) away from the tooling base (200), and is used to press and fix the printed circuit board (310), the carrier and the chip (340).

9. A clamping tool according to claim 8, characterized in that: The clamping mechanism comprises a first pressing block (510) and a second pressing block (520); the first pressing block (510) is used to be embedded in the workpiece box body (100) and to press and fix the printed board (310) in the workpiece box body (100); the projection of the first pressing block (510) along the thickness direction of the first pressing block (510) at least overlaps with the printed board (310); the first pressing block (510) is provided with a first avoidance through hole (511) and a second avoidance through hole (512) at positions corresponding to the chip (340) and the component (330), respectively. The second pressing block (520) is used to be embedded in the second avoidance through-hole (512); the end surface of the second pressing block (520) facing the tooling base (200) is provided with two limit bars (521) at intervals; the two limit bars (521) are pressed against the end surface of the carrier facing away from the printed circuit board (310) and abut against the two side walls of the chip (340); the two limit bars (521) are respectively provided with contact bosses (522) on the sides facing each other; the contact bosses (522) are pressed against the four corners of the end surface of the chip (340) facing away from the carrier.

10. A clamping tool according to claim 9, characterized in that: The invention also comprises an upper cover (400), wherein the upper cover (400) is arranged above the workpiece box body (100) away from the tooling base (200) and is detachably connected to the tooling base (200), and the upper cover (400) is provided with a second threaded hole (410) coaxially corresponding to the position of the first avoidance through hole (511), and the second threaded hole (410) is threadedly connected with a first spring stud (420), and the first spring stud (420) is used to abut against the second pressure block (520) for pressure fixing; the upper cover (400) A third threaded hole (430) is coaxially arranged at a position corresponding to the second avoidance through hole (512), and a second spring stud (440) is threadedly connected to the third threaded hole (430), and the second spring stud (440) is used to abut against the component (330) for pressure fixation; a fourth threaded hole (450) is penetrated by the upper cover (400), and a third spring stud (460) is threadedly connected to the fourth threaded hole (450), and the third spring stud (460) is used to abut against the first pressure block (510) for pressure fixation; And / or, an ear wall (230) is provided on the end surface of the tooling base (200) facing the workpiece box body (100) along the outer contour of the tooling base (200), the first threaded hole (210) is provided on the ear wall (230), and a gap between the ear wall (230) and the workpiece box body (100) is set to 15 mm to 20 mm.

Images