Chip coating uniformity control system and method

Abstract

The invention relates to the technical field of chip coating, in particular to a chip coating uniformity control system and method.The method comprises the steps that the characteristics of an adjustable magnet are adjusted on line, and a chip is coated under vacuum; verifying whether the film thickness uniformity is changed or not based on the chip coating film thickness uniformity; according to the method, the sputtering speed can be increased by adjusting the magnetic field intensity of the adjustable magnet and enhancing the magnetic field intensity within a certain range, the requirement that the film thickness uniformity difference is about 1% can be met, and the target material sputtering position quality is improved. The film thickness uniformity deviation of target sputter coating can be effectively reduced, the film thickness uniformity is improved, and the problems that according to an existing method for adjusting the film thickness uniformity of a chip by adding a baffle, the target consumed power is increased, and the cost is increased are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip coating, and in particular to a chip coating uniformity control system and method. Background Art

[0002] The development of vacuum magnetron sputtering coated chips in China has become increasingly mature. However, in the production process, the target material will produce corresponding etching as the use time increases. These etchings will cause changes in the uniformity of the film thickness, especially for planar targets. According to past experience, as the use time of the target material increases, the deviation in the uniformity of the film thickness will become larger.

[0003] In daily production, most magnetron sputtering coating lines have problems with uneven film thickness due to larger deviations in target film thickness uniformity, resulting in obvious color differences at the edges of the coated chips, with the two ends showing purple color and the middle showing green color.

[0004] In order to reduce the problem of uneven film thickness on chips, the existing method is to solve the problem of film thickness uniformity by adding a baffle, that is, to add a baffle in the middle of one of the four i-ZnO cylindrical targets to block the sputtering in the middle. The film layer is attached to the baffle, and the film thickness at both ends is sputtered onto the substrate normally. In this way, only the film thickness at both ends can be compensated. However, after adding the baffle, under the same film thickness conditions, the sputtering rate is reduced, the power consumption of the target material in a single production cycle is increased, and the cost is increased. Summary of the invention

[0005] The purpose of the present invention is to provide a chip coating uniformity control system and method, aiming to solve the existing method of adding baffles to adjust the uniformity of chip film thickness, which has the problem of increased target material power consumption and increased cost.

[0006] To achieve the above objectives, in a first aspect, the present invention provides a method for controlling uniformity of chip coating, comprising the following steps:

[0007] Adjust the properties of the adjustable magnets online and coat the chips under vacuum;

[0008] Verify whether the film thickness uniformity has changed based on the chip coating thickness uniformity;

[0009] Detect whether the adjustable magnet auxiliary anode is discharged, obtain a detection result, and improve the quality of the target sputtering position based on the verification result.

[0010] The online adjustment can adjust the characteristics of the magnet, and the specific method of coating the chip under vacuum is:

[0011] Install the adjustable magnet to the dielectric layer of the coating system and align it with the sputtering target;

[0012] The air in the chamber is extracted to simulate a vacuum environment, and the chip is subjected to magnetron sputtering coating.

[0013] The specific method of verifying whether the film thickness uniformity has changed based on the chip coating thickness uniformity is as follows:

[0014] Taking out the coated chip in the cavity as a sample, detecting the uniformity of the coating thickness of the sample, and obtaining a sample value;

[0015] The sample value is compared with the standard value to verify whether the uniformity of the film thickness has changed. If it has changed, the adjustable magnet is checked and the magnetic size of the adjustable magnet is adjusted.

[0016] The specific method of detecting whether the adjustable magnet auxiliary anode is discharged, obtaining a verification result, and improving the quality of the target sputtering position based on the verification result is as follows:

[0017] Detecting the voltage stability of the coating system's tempered double silver and laminated glass during the coating process to determine whether the regulating magnet auxiliary anode is discharged, and obtaining a detection result;

[0018] If discharge occurs, the discharge trend of tempered double silver and laminated glass will be improved. If no discharge occurs, the quality of the target sputtering position will be improved.

[0019] In a second aspect, the present invention further provides a chip coating uniformity control system, comprising a coating module, a measuring module, a detection module and a control module, wherein the coating module and the detection module are respectively connected to the control module, and the measuring module is connected to the coating module;

[0020] The coating module is used to simulate a vacuum environment to perform magnetron sputtering coating on the chip;

[0021] The measuring module is used to measure the coating thickness of the sputtering coated chip;

[0022] The detection module is used to detect the voltage stability of the coating module;

[0023] The control module is used to control the actions of the coating module and the detection module.

[0024] Wherein, the coating module includes a vacuum unit, a placement unit and a sputtering unit;

[0025] The vacuum unit is used to evacuate the air in the cavity and introduce rare gas to simulate a vacuum environment;

[0026] The placement unit is used to place the chip to be coated;

[0027] The sputtering unit is used for magnetron target sputtering coating the chip on the placement unit.

[0028] Wherein, the detection module includes a detection unit and a display unit, and the detection unit is connected to the display unit;

[0029] The detection unit is used to detect the voltage stability of the coating module in real time to obtain detection data;

[0030] The display unit is used to display the detection data.

[0031] The present invention discloses a chip coating uniformity control system, which adjusts the characteristics of an adjustable magnet online and coats the chip under vacuum; verifies whether the film thickness uniformity has changed based on the chip coating thickness uniformity; detects whether the adjustable magnet auxiliary anode is discharged to obtain a detection result, and improves the target sputtering position quality based on the verification result. The method can improve the sputtering rate by adjusting the magnetic field strength of the adjustable magnet to enhance within a certain range, and can meet the film thickness uniformity difference of about 1%. It can effectively reduce the film thickness uniformity deviation of the target sputtering coating, improve the film thickness uniformity, and solve the existing method of adding a baffle to adjust the chip film thickness uniformity, which has the problem of increased target power consumption and increased cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 The present invention provides a flow chart of a chip coating uniformity control method.

[0034] Figure 2 It is a flow chart of a specific method for adjusting the characteristics of an adjustable magnet online and coating a chip under vacuum.

[0035] Figure 3 It is a flow chart of a specific method for verifying whether the film thickness uniformity has changed based on the chip coating thickness uniformity.

[0036] Figure 4 It is a schematic diagram of a chip coating uniformity control system provided by the present invention.

[0037] In the figure: 1- coating module, 2- measuring module, 3- detection module, 4- control module, 5- vacuum unit, 6- placement unit, 7- sputtering unit, 8- detection unit, 9- display unit. DETAILED DESCRIPTION

[0038] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0039] See also Figures 1 to 3 In a first aspect, the present invention provides a method for controlling uniformity of chip coating, comprising the following steps:

[0040] S1 adjusts the characteristics of the adjustable magnet online and coats the chip under vacuum;

[0041] Specific method:

[0042] S11 installs the adjustable magnet to the dielectric layer of the coating system and aligns it with the sputtering target;

[0043] S12 extracts air from the chamber to simulate a vacuum environment and performs magnetron sputtering coating on the chip.

[0044] S2 verifies whether the film thickness uniformity has changed based on the chip coating thickness uniformity;

[0045] Specific method:

[0046] S21: taking out the coated chip in the cavity as a sample, detecting the uniformity of the coating thickness of the sample, and obtaining a sample value;

[0047] S22 compares the sample value with the standard value to verify whether the uniformity of the film thickness has changed. If it has changed, check the adjustable magnet and adjust the magnetic size of the adjustable magnet.

[0048] S3 detects whether the adjustable magnet auxiliary anode is discharged, obtains the detection result, and improves the quality of the target sputtering position based on the verification result.

[0049] Specific method:

[0050] S31 detects the voltage stability of the coating system's tempered double silver and laminated glass during the coating process to determine whether the regulating magnet auxiliary anode is discharged, and obtains a detection result;

[0051] If S32 discharges, the discharge trend of tempered double silver and laminated glass will be improved. If it does not discharge, the quality of the target sputtering position will be improved.

[0052] This method can increase the sputtering rate within a certain range by adjusting the magnetic field strength of the adjustable magnet, which can meet the film thickness uniformity difference of about 1%. It can effectively reduce the film thickness uniformity deviation of the target material sputtering coating, improve the uniformity of the film thickness, and solve the problem of increased target material power consumption and rising costs in the existing method of adding a baffle to adjust the chip film thickness uniformity.

[0053] See also Figure 4 In a second aspect, the present invention further provides a chip coating uniformity control system, comprising a coating module 1, a measuring module 2, a detection module 3 and a control module 4, wherein the coating module 1 and the detection module 3 are respectively connected to the control module 4, and the measuring module 2 is connected to the coating module 1;

[0054] The coating module 1 is used to simulate a vacuum environment to perform magnetron sputtering coating on the chip;

[0055] The measuring module 2 is used to measure the coating thickness of the sputtered chip;

[0056] The detection module 3 is used to detect the voltage stability of the coating module 1;

[0057] The control module 4 is used to control the actions of the coating module 1 and the detection module 3 .

[0058] In this embodiment, the coating module 1 is used to adjust the characteristics of the adjustable magnet online, and the chip is coated under vacuum. The measuring module 2 detects the uniformity of the coating thickness of the sample to obtain the sample value. The detection module 3 detects the voltage stability of the coating module 1 to determine whether the adjustable magnet auxiliary anode is discharged. The control module 4 is used to control the actions of the coating module 1 and the detection module 3.

[0059] Furthermore, the coating module 1 includes a vacuum unit 5, a placement unit 6 and a sputtering unit 7;

[0060] The vacuum unit 5 is used to evacuate the air in the cavity and introduce rare gas to simulate a vacuum environment;

[0061] The placement unit 6 is used to place the chip to be coated;

[0062] The sputtering unit 7 is used for magnetron target sputtering coating the chip on the placement unit 6 .

[0063] In this embodiment, the air in the cavity is evacuated through the vacuum unit 5, and a rare gas is introduced to simulate a vacuum environment. The placement unit 6 places the chip to be coated, and the sputtering unit 7 is used for magnetron target sputtering coating the chip on the placement unit 6.

[0064] Further, the detection module 3 includes a detection unit 8 and a display unit 9, and the detection unit 8 and the display unit 9 are connected;

[0065] The detection unit 8 is used to detect the voltage stability of the coating module 1 in real time to obtain detection data;

[0066] The display unit 9 is used to display the detection data.

[0067] In this embodiment, the detection unit 8 detects the voltage stability of the coating module 1 in real time to obtain detection data, and transmits the detection data to the display unit 9 for display.

[0068] The above disclosure is only a preferred embodiment of a chip coating uniformity control system and method of the present invention. Of course, this cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiments and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. A chip coating uniformity control method, characterized in that: The following steps are involved: Adjust the properties of the adjustable magnets online and coat the chips under vacuum; Verify whether the film thickness uniformity has changed based on the chip coating thickness uniformity; Detect whether the adjustable magnet auxiliary anode is discharged, obtain a detection result, and improve the quality of the target sputtering position based on the verification result.

2. A chip coating uniformity control method as claimed in claim 1, characterized in that: The online adjustment can adjust the characteristics of the magnet and coat the chip in a vacuum: Install the adjustable magnet to the dielectric layer of the coating system and align it with the sputtering target; The air in the chamber is extracted to simulate a vacuum environment, and the chip is subjected to magnetron sputtering coating.

3. A chip coating uniformity control method as claimed in claim 1, characterized in that: The specific method of verifying whether the film thickness uniformity has changed based on the chip coating thickness uniformity is: Taking out the coated chip in the cavity as a sample, detecting the uniformity of the coating thickness of the sample, and obtaining a sample value; The sample value is compared with the standard value to verify whether the uniformity of the film thickness has changed. If it has changed, the adjustable magnet is checked and the magnetic size of the adjustable magnet is adjusted.

4. A chip coating uniformity control method as claimed in claim 1, characterized in that: The specific method of detecting whether the adjustable magnet auxiliary anode is discharged, obtaining a verification result, and improving the quality of the target sputtering position based on the verification result is: Detecting the voltage stability of the coating system's tempered double silver and laminated glass during the coating process to determine whether the regulating magnet auxiliary anode is discharged, and obtaining a detection result; If discharge occurs, the discharge trend of tempered double silver and laminated glass will be improved. If no discharge occurs, the quality of the target sputtering position will be improved.

5. A chip coating uniformity control system, applied to a chip coating uniformity control method as claimed in any one of claims 1 to 4, characterized in that: It includes a coating module, a measuring module, a detection module and a control module, wherein the coating module and the detection module are respectively connected to the control module, and the measuring module is connected to the coating module; The coating module is used to simulate a vacuum environment to perform magnetron sputtering coating on the chip; The measuring module is used to measure the coating thickness of the sputtering coated chip; The detection module is used to detect the voltage stability of the coating module; The control module is used to control the actions of the coating module and the detection module.

6. A chip coating uniformity control system as claimed in claim 5, characterized in that: The coating module includes a vacuum unit, a placement unit and a sputtering unit; The vacuum unit is used to evacuate the air in the cavity and introduce rare gas to simulate a vacuum environment; The placement unit is used to place the chip to be coated; The sputtering unit is used for magnetron target sputtering coating the chip on the placement unit.

7. A chip coating uniformity control system as claimed in claim 5, characterized in that: The detection module includes a detection unit and a display unit, and the detection unit is connected to the display unit; The detection unit is used to detect the voltage stability of the coating module in real time to obtain detection data; The display unit is used to display the detection data.

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