Condensation structure, exhaust device and semiconductor process equipment

Abstract

The invention discloses a condensation structure, an exhaust device and semiconductor process equipment. The condensation structure comprises a condensation chamber; the partition plate is arranged in the condensation cavity and divides the inner space of the condensation cavity into a first space and a second space, and the first space and the second space are provided with a communicating channel; the condensation chamber is provided with an air inlet communicated with the first space and an air outlet communicated with the second space, and the air inlet and the air outlet are arranged far away from the communication channel; the first space and the second space are each internally provided with a plurality of damping plates which are parallel to one another and arranged at intervals, a gap between every two adjacent damping plates forms a cooling channel, and the cooling channels communicate with the communicating channel. Gas can flow through the cooling channel in the first space and the second space to be cooled, the cooling path is prolonged, and therefore the cooling efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor manufacturing equipment, and in particular to a condensation structure, an exhaust device and semiconductor process equipment. Background Art

[0002] Semiconductor processing often involves introducing oxygen into the semiconductor process chamber under high temperature conditions. 2 In this step, the relevant substances on the wafer will be 2 A chemical reaction occurs, producing volatile substances such as butyrolactone. The volatile substances will be discharged to the factory system along with the gas in the semiconductor process chamber after being processed by the exhaust device. The exhaust device is used to condense the volatile substances into liquid viscous substances and collect them.

[0003] A schematic diagram of the structure of an existing exhaust device is shown in FIG. Figure 1 As shown, the exhaust device 200a includes an exhaust pipe assembly 10a, a condensation structure 20a and an exhaust pipe 40a which are connected in sequence. The collecting box 30a is connected to the condensation structure 20a for collecting liquid viscous substances. The exhaust pipe assembly 10a is connected to the process chamber 100a. After the gas enters the condensation structure 20a, the volatile substances therein condense and gradually flow into the collecting box 30a, and the remaining gas is discharged to the plant system 300a through the exhaust pipe 40a.

[0004] The existing condensation structure 20a is prone to the problem that volatiles condense during the exhaust process and block the exhaust passage. Summary of the invention

[0005] In response to the above technical problems, the present application provides a condensation structure, an exhaust device and a semiconductor process equipment for condensing and collecting volatiles in the gas discharged from the semiconductor process chamber to improve the problem of condensation of volatiles during the exhaust process and blocking the exhaust channel.

[0006] In order to solve the above technical problems, in a first aspect, an embodiment of the present application provides a condensation structure, comprising:

[0007] Condensation chamber;

[0008] a partition plate, arranged in the condensation chamber, dividing the internal space of the condensation chamber into a first space and a second space, wherein the first space and the second space are provided with a communication passage;

[0009] The condensation chamber is provided with an air inlet communicating with the first space, and an air outlet communicating with the second space, and the air inlet and the air outlet are arranged away from the communication channel;

[0010] A plurality of damping plates which are parallel to each other and arranged at intervals are respectively arranged in the first space and the second space, and a gap between two adjacent damping plates constitutes a cooling channel, and the cooling channel is communicated with the communication channel.

[0011] Optionally, the condensation chamber comprises:

[0012] A cover plate, wherein the air inlet and the air outlet are arranged on the cover plate;

[0013] A bottom plate, arranged opposite to the cover plate;

[0014] A side panel, connecting the cover panel and the bottom panel to enclose the internal space;

[0015] The partition extends from the cover plate to the bottom plate, and forms the communication channel at least on one side close to the bottom plate;

[0016] The condensation structure further comprises:

[0017] A connecting rod is used to connect the partition plate and all the damping plates, and the damping plate is spaced apart from the cover plate.

[0018] Optionally, the condensation structure further includes a first scraping mechanism for scraping off viscous matter retained on the damping plate.

[0019] Optionally, the side panel includes a first side panel and a second side panel which are perpendicular to and opposite to the partition panel, and a third side panel and a fourth side panel which are connected to the first side panel and the second side panel on both sides;

[0020] The first scraping mechanism comprises:

[0021] A plurality of scraper strips are arranged in the inner space, the number of the scraper strips is at least equal to the number of the cooling channels, each cooling channel corresponds to one scraper strip, the scraper strip has a shape adapted to the cross section of the cooling channel, and the thickness of the scraper strip is less than the width of the cooling channel;

[0022] At least one group of guide rods penetrating the first side plate, each group of guide rods being connected to the plurality of scraper strips in a one-to-one correspondence, and the guide rods being slidable relative to the first side plate;

[0023] The first driving source is connected to the guide rod and is used to drive the scraper bar to move toward the second side plate to scrape off the viscous material.

[0024] Optionally, the condensation structure further includes a second scraping mechanism for scraping off the viscous matter retained on a side of the scraping strip facing the second side plate when the scraping strip moves to an extreme position in the direction of the second side plate.

[0025] Optionally, the second scraping mechanism includes:

[0026] A fan is arranged in the inner space near the second side plate, and when the scraper moves to the extreme position, the fan and a side of the scraper facing the second side plate maintain a preset distance; the partition is arranged to avoid the fan;

[0027] a rotating shaft, penetrating through the second side plate and connected to the fan, and the rotating shaft is rotatable relative to the second side plate;

[0028] The second driving source is connected to the rotating shaft and is used to drive the fan to rotate so as to scrape off the viscous material on the side of the scraper facing the second side plate.

[0029] Optionally, the condensation structure further includes a cooling component, which is arranged along the outer wall of the side panel and avoids the rotating shaft and the guide rod.

[0030] Optionally, the cooling assembly includes:

[0031] A covering plate, covering the second side plate, the third side plate and the fourth side plate; the rotating shaft passes through the covering plate;

[0032] The cooling pipe is sandwiched between the cladding plate and the second side plate, the third side plate, and the fourth side plate.

[0033] In a second aspect, an embodiment of the present application provides an exhaust device of a semiconductor process equipment, which is used to process the gas exhausted by the semiconductor process equipment, and the exhaust device includes an exhaust pipe assembly and a condensation structure as described in the above embodiments;

[0034] One end of the exhaust pipe assembly is connected to the air inlet, and the other end is used to connect to the process chamber. The exhaust port of the condensation structure is used to connect to an external factory service system.

[0035] Optionally, the bottom plate of the condensation chamber is funnel-shaped, and a drain port is provided on the bottom plate;

[0036] The exhaust device further comprises a collecting box, which is connected to the liquid discharge port and is used for collecting liquid viscous substances.

[0037] Optionally, the exhaust pipe assembly includes:

[0038] A heating section, comprising a transition pipe having one end connected to the process chamber, and a heating belt wrapped around the outside of the transition pipe, wherein the transition pipe is integrally formed;

[0039] The pre-condensation section has one end connected to the other end of the transition pipe and the other end connected to the air inlet.

[0040] Optionally, inner walls at both ends of the transition pipe are provided with a corrugated structure.

[0041] In a third aspect, an embodiment of the present application provides a semiconductor process equipment, including a process chamber and an exhaust device connected to the process chamber, wherein the exhaust device is the exhaust device mentioned above.

[0042] As described above, in the condensation structure of the present application, the gas enters the first space from the air inlet, then flows through the cooling channel of the first space, and enters the second space through the connecting channel, continues to flow along the cooling channel in the second space, and finally flows out from the exhaust port. In this embodiment, multiple damping plates are arranged in the first space and the second space to form multiple cooling channels, and the air inlet and the exhaust port are arranged away from the connecting channel, so that the gas can be cooled through the above cooling channels in the first space and the second space respectively, which greatly extends the cooling path, thereby improving the cooling efficiency, condensing the volatiles before entering the exhaust channel, and preventing the volatiles from entering the exhaust channel and condensing and blocking the exhaust channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor.

[0044] Figure 1 It is a structural schematic diagram of an existing exhaust device;

[0045] Figure 2 is a schematic cross-sectional structural diagram of a condensation structure provided in an embodiment of the present application;

[0046] Figure 3 is a schematic cross-sectional view of another condensation structure provided in an embodiment of the present application;

[0047] Figure 4 It is a schematic diagram of an exploded structure of a condensation structure provided in an embodiment of the present application;

[0048] Figure 5 yes Figure 4 A schematic diagram of the partially enlarged structure of part A;

[0049] Figure 6 It is a first visual stereoscopic structural schematic diagram of a condensation structure provided in an embodiment of the present application;

[0050] Figure 7This is a schematic diagram of the structure of a condensation structure provided in an embodiment of the present application with the cover plate removed;

[0051] Figure 8 yes Figure 4 A schematic diagram of the local enlarged structure of part B;

[0052] Fig. 9 yes Figure 4 A schematic diagram of the partially enlarged structure of part C in the middle;

[0053] Fig.10 yes Figure 4 A schematic diagram of the local enlarged structure of part D in the middle;

[0054] Fig.11 yes Figure 4 A schematic diagram of the local enlarged structure of part E in the middle;

[0055] Fig.12 This is a schematic diagram of the working principle of a condensation structure provided in an embodiment of the present application;

[0056] Fig.13 It is a schematic diagram of a second visual three-dimensional structure of a condensation structure provided in an embodiment of the present application;

[0057] Fig.14 is a schematic diagram of the internal structure after the cover plate, side panels and cladding panels of the condensation chamber are removed;

[0058] Fig.15 This is an application scenario diagram of an exhaust device provided in an embodiment of the present application;

[0059] Fig.16 It is a structural schematic diagram of a heating section provided in an embodiment of the present application.

[0060] The realization of the purpose, functional features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. The above-mentioned drawings have shown clear embodiments of this application, which will be described in more detail later. These drawings and textual descriptions are not intended to limit the scope of the concept of this application in any way, but to illustrate the concept of this application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0061] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0062] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0063] It should be further understood that the terms "comprising" and "including" indicate the presence of the described features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or", "and / or", "including at least one of the following", etc. used in this application may be interpreted as inclusive, or mean any one or any combination. For example, "including at least one of the following: A, B, C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C", and for another example, "A, B or C" or "A, B and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.

[0064] It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this document, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, as used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless otherwise indicated in the context.

[0065] It should be understood that the orientations or positional relationships indicated by terms such as "top", "bottom", "up", "down", "vertical", and "horizontal" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0066] For ease of description, in the following embodiments, the orthogonal space formed by the horizontal plane and the vertical direction is used as an example for explanation, and this premise should not be understood as a limitation to the present application.

[0067] As mentioned above, the existing condensation structure 20a is prone to the problem that volatiles condense during the exhaust process and block the exhaust channel. After research and analysis, the applicant found that the main reason for the above problem is that the existing condensation structure 20a has a short internal cooling path and a low cooling efficiency for the gas. Based on this, the present application provides a condensation structure, an exhaust device and a semiconductor process equipment.

[0068] See also Figure 2 Figure 2 is a schematic cross-sectional view of a condensation structure provided in an embodiment of the present application. Figure 3 It is a schematic cross-sectional structural diagram of another condensation structure provided in an embodiment of the present application. The condensation structure may include: a condensation chamber 10, a partition 20 and a plurality of damping plates 30.

[0069] The partition 20 is arranged in the condensation chamber 10, and the internal space of the condensation chamber 10 is divided into a first space S1 and a second space S2. The first space S1 and the second space S2 are provided with a connecting channel G1; the condensation chamber 10 is provided with an air inlet 111 connected to the first space S1, and an exhaust port 112 connected to the second space S2. The air inlet 111 and the exhaust port 112 are arranged away from the connecting channel G1. For example, the air inlet 111 and the exhaust port 112 are arranged at the top of the condensation chamber 10, and the connecting channel G1 is arranged at the bottom of the condensation chamber 10, or vice versa, so as to increase the air flow path. The air inlet 111 and the exhaust port 112 can be connected to external equipment by setting an interface flange, and the interface flange can be made of 304 stainless steel. A plurality of damping plates 30 are respectively arranged in parallel and spaced apart in the first space S1 and the second space S2. The gap between two adjacent damping plates 30 constitutes a cooling channel G2, and the cooling channel G2 is connected to the connecting channel G1. For example, a gap may be provided between the end of the damping plate 30 close to the connecting passage G1 and the condensing chamber 10, so that the cooling passage G2 is connected to the connecting passage G1. The condensing chamber 10, the partition plate 20 and the damping plate 30 may all be made of 304 stainless steel.

[0070] As some examples, the communication channel G1 may be a through hole opened on the partition 20, such as Figure 3 The communicating channel G1 may also be formed by a gap provided between the partition 20 and the inner wall of the condensation chamber 10, as shown in FIG. Figure 2 The air inlet 111 and the air outlet 112 may be disposed on the cover plate 11 of the condensation chamber 10, as shown in FIG. Figure 2 As shown, it can also be arranged on the side plate of the condensation chamber 10, such as Figure 3 shown.

[0071] The working principle of the condensation structure of this embodiment is as follows: the gas enters the first space S1 from the air inlet 111, then flows through the cooling channel G2 on the right side as shown by the arrow in the figure, and enters the second space S2 through the connecting channel G1, flows upward along the cooling channel G2 in the second space S2, and finally flows out from the exhaust port 112. In this embodiment, a plurality of damping plates 30 are arranged in the first space S1 and the second space S2 to form a plurality of cooling channels G2, and the air inlet 111 and the exhaust port 112 are arranged away from the connecting channel G1, so that the gas can be cooled through the cooling channel G2 in the first space S1 and the second space S2, respectively, which greatly extends the cooling path, thereby improving the cooling efficiency, condensing the volatiles before entering the exhaust channel, and preventing the volatiles from condensing and blocking the exhaust channel when entering the exhaust channel.

[0072] It is understood that the damping plate 30 may be Figure 3 Preferably, when the damping plate 30 is wavy, as Figure 2 As shown, the cooling channel G2 formed between adjacent damping plates 30 is also wavy, so as to increase the cooling path of the gas and further improve the cooling efficiency. It should be noted that the wavy shape can be as follows: Figure 2 The broken line shape may be a smooth arc shape or an irregular curve shape, which is not particularly limited in the embodiments of the present application.

[0073] As an example, see Figure 4 and Figure 5 , Figure 4 is a schematic diagram of an exploded structure of a condensation structure provided in an embodiment of the present application, Figure 5 yes Figure 4 The partially enlarged structural diagram of the A part in the figure shows that the condensation chamber 10 may include a cover plate 11, a bottom plate 12 and a side panel 13. The air inlet 111 and the air outlet 112 are arranged on the cover plate 11; the bottom plate 12 is arranged opposite to the cover plate 11; the side panel 13 connects the cover plate 11 and the bottom plate 12 to enclose an internal space. For example, the cover plate 11 can be fixed to the side panel 13 by screws 113 (8 screws can be provided). The partition 20 extends from the cover plate 11 to the bottom plate 12, and forms a connecting channel G1 at least on one side close to the bottom plate 12. For example, the partition 20 can be welded to the bottom surface of the cover plate 11. In the illustrated direction, the partition 20 divides the internal space of the condensation chamber 10 into a first space S1 located on the right and a second space S2 located on the left. The bottom end of the partition 20 can be spaced apart from the bottom plate 12 to form a connecting channel G1. It should be noted that the partition 20 divides the internal space of the condensation chamber 10 into the first space S1 and the second space S2, which does not necessarily mean that the first space S1 and the second space S2 are completely isolated except for the connecting passage G1. Figure 4 There may be a gap between the partition 20 and the first side plate 131 and / or the second side plate 132 of the side panel 13 of the condensing chamber 10, or there may be no gap. When there is a gap, a small amount of gas does not flow through the complete cooling path along the cooling channel G2, but it does not affect the overall effect of the present application. The condensation structure may also include a connecting rod 40, which connects the partition 20 and all the damping plates 30. For example, the connecting rod 40 may pass through the partition 20 and all the damping plates 30 (see Fig.14 ), to fix the damping plate 30, the damping plate 30 and the cover plate 11 are spaced apart so that all cooling channels G2 formed between adjacent damping plates 30 can be connected to the air inlet 111 and the air outlet 112 to form a complete cooling path. The connecting rod 40 can be made of 304 stainless steel.

[0074] Two connecting rods 40 can be provided, respectively connected from the upper and lower ends of the damping plate 30 to improve the stability of the overall structure. Of course, more connecting rods 40 can be provided, and the embodiment of the present application is not particularly limited.

[0075] Since the volatiles in the gas condense into viscous substances in the condensation structure and are retained on the damping plate 30, as the viscous substances increase, the cooling channel G2 will be blocked. In order to solve this problem, in one embodiment, the condensation structure may also include a first scraping mechanism 60 for scraping off the viscous substances retained on the damping plate 30. For example, the first scraping mechanism 60 may scrape from top to bottom, and for the wavy damping plate 30, a flexible scraping material may be used. Preferably, the first scraping mechanism 60 scrapes in the horizontal direction, and can be applicable to both the planar damping plate 30 and the wavy damping plate 30. For example, a scraper or a scraping strip may be used to scrape off the viscous substances.

[0076] As an example of a first scraping mechanism 60, see Figure 4 , Figure 6 and Figure 7 , Figure 6 is a first visual stereoscopic structural diagram of a condensation structure provided in an embodiment of the present application, Figure 7 It is a schematic diagram of the structure of a condensation structure provided in an embodiment of the present application without the cover plate. The side panel 13 includes a first side panel 131 and a second side panel 132 which are perpendicular to and opposite to the partition 20, and a third side panel and a fourth side panel 134 which connect the first side panel 131 and the second side panel 132 on both sides. The first scraping mechanism 60 may include a plurality of scraping strips 61, at least one group of guide rods 62 and a first driving source 63. The guide rods 62 may be made of 304 stainless steel, and the scraping strips 61 may be a composite structure with an outer layer of foam rubber and an inner layer of 304 stainless steel, and the inner and outer layers may be connected by bonding.

[0077] The scraper strips 61 are arranged in the above-mentioned internal space, and the number of the scraper strips 61 is at least equal to the number of the cooling channels G2, and each cooling channel G2 corresponds to a scraper strip 61. The scraper strip 61 has a shape adapted to the cross-section of the cooling channel G2, and the thickness of the scraper strip 61 is less than the width of the cooling channel G2. For example, when the damping plate 30 is wavy, the scraper strip 61 is also correspondingly wavy to adapt to the wavy cooling channel G2. When the scraper strip 61 is fitted into the cooling channel G2, the smaller the gap between the scraper strip 61 and the damping plates 30 on both sides, the cleaner the scraping. For example, the above-mentioned gap can be 0.5 mm. It can be understood that the number of scraper strips 61 can be more than the number of cooling channels G2, for example, Figure 4 When the number of the middle damping plates 30 is set to 5, 4 cooling channels G2 can be formed, and 4 or 6 scraping strips 61 can be set accordingly. The extra 2 scraping strips 61 can scrape the outer side surfaces of the two outermost scraping strips 61.

[0078] The guide rods 62 may be provided in one group, or in two or more groups, to improve the stability of the connection. The guide rods 62 penetrate the first side plate 131. In each group of guide rods 62, the guide rods 62 are connected to the scraper strips 61 in a one-to-one correspondence, for example, by threaded connection. The guide rods 62 are slidable relative to the first side plate 131. For example, a through hole 1311 may be provided on the first side plate 131 (see Figure 4 ), and install the bushing 1312 in the through hole 1311, see Figure 8 , Figure 8 yes Figure 4 The partial enlarged structural diagram of the B part, the guide rod 62 passes through the bushing 1312 to slide smoothly, and the bushing can be made of 45 steel. The first drive source 63 is connected to the guide rod 62. For example, please refer to Figure 6 A connecting bracket 64 may be provided, and all guide rods 62 and the first driving source 63 may be connected to the connecting bracket 64 through the connecting bracket 64, so as to be indirectly connected to all guide rods 62. As an example, see Figure 4 , Figure 6 and Fig. 9 , Fig. 9 yes Figure 4 The schematic diagram of the partial enlarged structure of the C part, the connecting bracket 64 may include a U-shaped bite portion 641, one end of the guide rod 62 is fixed to the U-shaped bite portion 641, and a rubber pad 621 may be provided between the guide rod 62 and the U-shaped bite portion 641 to increase the connection tightness between the two. For example, the first driving source 63 may be a linear stroke cylinder, see Fig.10 The cylinder can be threadedly connected to the connecting bracket 64 via bolts 631.

[0079] The first driving source 63 can drive the scraper bar 61 to move toward the second side plate 132 by driving the guide rod 62, so as to scrape the viscous matter in the horizontal direction. It is understandable that the first driving source 63 can drive the scraper bar 61 to move from the initial position toward the second side plate 132 to the extreme position (maximum stroke) to scrape the viscous matter, and can also drive the scraper bar 61 to return from the extreme position to the initial position.

[0080] After the scraper 61 scrapes off the viscous material on the damping plate 30, some viscous material will remain on the end surface of the scraper 61. Based on this problem, in one embodiment, the condensation structure may also include a second scraping mechanism 70. When the scraper 61 moves to the extreme position in the direction of the second side plate 132, the second scraping mechanism 70 can scrape off the viscous material on the side of the scraper 61 facing the second side plate 132. Since all the sides of the scrapers 61 facing the second side plate 132 are located on the same plane, the second scraper mechanism 70 can scrape off the viscous material on the scraper 61 as long as a reasonable gap (such as 0.5 mm) is maintained with the above-mentioned plane and the movement direction is parallel to the plane. Therefore, the specific shape and movement mode of the second scraper mechanism 70 are not particularly limited in this embodiment. For example, the second scraper mechanism 70 may include a scraper, and the movement direction during scraping may be from left to right, from top to bottom or other directions.

[0081] As an example of a second scraping mechanism 70, see Figure 4 , Figure 7 and Fig.11 , Fig.11 yes Figure 4 The second scraping mechanism 70 may include: a fan 71, a rotating shaft 72, and a second driving source 73. The fan 71 is arranged in the above-mentioned internal space near the second side plate 132, and when the scraper 61 moves to the above-mentioned extreme position, the fan 71 and the side of the scraper 61 facing the second side plate 132 maintain a preset distance, for example, the preset distance may be 0.3mm, 0.6mm, 1.0mm, 1.5mm, etc.; the partition 20 is arranged to avoid the fan 71, please combine Figure 4 The end of the partition 20 close to the second side plate 132 may be provided with an avoidance notch (see Fig.14). The rotating shaft 72 passes through the second side plate 132 and is connected to the fan 71, and the rotating shaft 72 is rotatable relative to the second side plate 132. For example, a bearing mounting hole can be set on the second side plate 132, and then a bearing 721 can be installed in the bearing mounting hole, and the bearing 721 can be interference fit with the bearing mounting hole, and the rotating shaft 72 is sleeved in the bearing 721, and the two are interference fit. At the same time, the rotating shaft 72 and the center hole of the fan 71 are fixedly connected by a key, so that the rotating shaft 72 can drive the fan 71 to rotate. The second driving source 73 is connected to the rotating shaft 72, and is used to drive the fan 71 to rotate, so as to scrape off the viscous material on the side of the scraper 61 facing the second side plate 132.

[0082] The working principle of the condensation structure of this embodiment is as follows Fig.12 As shown, after condensation reaches the preset target time, the first driving source 63 is controlled to drive the scraper 61 to move in a straight line, and the scraper 61 moves from the initial position to the extreme position, and at the same time, the liquid viscous material retained on the damping plate 30 is scraped off. At this time, a large amount of liquid viscous material will accumulate on the end surface of the scraper 61 facing the fan 71; when the scraper 61 moves to the extreme position, the second driving source 73 is controlled to drive the fan 71 to rotate, and the liquid viscous material on the scraper 61 is scraped off. The liquid viscous material finally falls onto the bottom plate 12 of the condensation chamber and can be discharged through the drain port on the bottom plate 12.

[0083] The condensing device of this embodiment can periodically clean the liquid viscous material inside the condensing chamber 10 without removing the condensing chamber 10 and surrounding connecting components, and the cleaning frequency can be set according to needs. This solution can greatly extend the main process times of the machine equipment, reduce the maintenance times, and improve the competitiveness of the equipment.

[0084] To further increase the cooling capacity of the condensing structure, see Figure 4 and Figure 7 The condensation structure may further include a cooling assembly 80, which is disposed along the outer wall of the side panel 13 of the condensation chamber 10 and avoids the rotating shaft 72 and the guide rod 62. It is understood that the cooling assembly 80 may cover the four sides of the condensation chamber 10 from the outside to cool the condensation chamber 10.

[0085] As an example, see Figure 4 , Figure 7 , Fig.13 and Fig.14 , Fig.13 is a schematic diagram of a second visual stereoscopic structure of a condensation structure provided in an embodiment of the present application, Fig.14It is a schematic diagram of the internal structure after removing the cover plate, side panel and covering plate of the condensation chamber. The cooling assembly 80 may include: a covering plate 81 and a cooling pipe 82. The covering plate 81 covers the second side plate 132, the third side plate 133 and the fourth side plate 134, and the covering plate 81 can be fixed to the side panel 13 of the condensation chamber 10 by screws 811. The rotating shaft 72 passes through the covering plate 81. Since the first side plate 131 is provided with the first scraping mechanism 60, a cooling structure may not be provided on its outer side to simplify the structural design. The cooling pipe 82 is sandwiched between the covering plate 81 and the second side plate 132, the third side plate 133, and the fourth side plate 134. For example, the cooling pipe 82 can be welded to the inner side of the covering plate 81 in advance. As an example, the covering plate 81 and the cooling pipe 82 can be made of 304 stainless steel.

[0086] The assembly method of the condensation structure of this embodiment may include (from inside to outside): ① Install the scraper strip 61; first install the bushing 1312 in the corresponding hole of the side panel 13 of the condensation chamber 10 ( Figure 4 16 in total), then put the scraper strip 61 (8 in total, each with 2 fixing points on the top and bottom) in from the top or bottom of the side panel 13, and dock with the threaded hole of the external guide rod 62 when putting it in, and fasten it with screws; ② Install the fan 71; first install the bearing 721 on the bearing mounting hole of the side panel 13, then install the shaft 72 on the bearing 721, and then put the fan 71 in from the top or bottom of the side panel 13, and when putting it in, its internal center hole and the shaft 72 are installed with interference fit; ③ Install the damping plate 30, you can pre-install the cover plate 11, the damping plate 30, and the connecting The support rods 40 are welded together, and then the welded body is placed from the top of the side panel 13, and finally it is fastened to the side panel 13 with screws 113 (for example, 8 pieces); ④ Install the bottom plate 12; the bottom plate 12 can be fastened to the bottom surface of the side panel 13 with screws; ⑤ Install the cooling assembly 80; the cooling pipe 82 can be welded to the inner side surface of the covering plate 81 in advance, and then it can be fixed to the side panel 13 with screws 811 (which can be 6 pieces); ⑥ Install the first drive source 63 (linear cylinder) and the connecting bracket 64; ⑦ Install the second drive source 73 (fan motor).

[0087] The present application also provides an exhaust device for semiconductor process equipment, which is used to treat the gas discharged by the semiconductor process equipment. Fig.15 , Fig.15This is an application scenario diagram of an exhaust device provided in an embodiment of the present application. The exhaust device may include an exhaust pipe assembly 100, and a condensation structure 200 as described in the above embodiments. One end of the exhaust pipe assembly 100 is connected to the air inlet 111 of the condensation structure 200, and the other end is used to connect to the process chamber 400. The exhaust port 112 of the condensation structure 200 is used to connect to the factory service system 500. For example, the exhaust pipe assembly 100 can be connected to the process chamber 400 by a sealing flange, and can be sealed and connected to the air inlet 111 of the condensation structure 200 by a KF flange. Similarly, the factory service system 500 can also be sealed and connected to the exhaust port 112 of the condensation structure 200 by a KF flange.

[0088] The exhaust device of this embodiment can effectively remove volatiles in the gas, thereby preventing the pipelines connected to the factory system from being blocked.

[0089] In one embodiment, see Figure 4 , Fig.14 and Fig.15 The bottom plate 12 of the condensation chamber 10 of the condensation structure 200 is funnel-shaped, and a drain port (not shown in the figure) is provided on the bottom plate 12. The exhaust device also includes a collecting box 300, which is connected to the drain port 121 for collecting liquid viscous substances. For example, the drain pipe 121 can be connected to the drain port through a ferrule, and connected to the collecting box 300 through a through-plate ferrule. The drain pipe 121 can guide the liquid viscous substance into the collecting box 300. The funnel-shaped bottom plate 12 can facilitate the gathering and discharge of liquid viscous substances. For example, the drain pipe 121 can be a 1-inch PFA tube.

[0090] See also Figure 1 The existing exhaust pipe assembly 10a includes a heating pipe 11a (with a heating belt 12a wrapped outside), an exhaust transition pipe 13a, a ferrule adapter elbow 14a and a pre-condensing pipe 15a connected in sequence. Not only are there many joints that are prone to leakage, but also a long section of the pipe is not heated, which is prone to blockage. This application has made improvements on this. In one embodiment, please continue to refer to Fig.15 and Fig.16 , Fig.16 1 is a schematic diagram of the structure of a heating section provided in an embodiment of the present application. The exhaust pipe assembly 100 may include a heating section 101 and a pre-condensing section 102. The heating section 101 includes a transition pipe 1011 having one end for connecting to the process chamber 400, and a heating belt 1012 wrapped around the outside of the transition pipe 1011. The transition pipe 1011 is integrally formed. As an example, the transition pipe 1011 may be made of 316L material and may have a pipe diameter of 2 inches. One end of the pre-condensing section 102 is connected to the other end of the transition pipe 1011, and the other end is connected to the air inlet 111 for cooling the gas.

[0091] In the exhaust pipe assembly 100 of the present embodiment, the heating section 101 is integrally formed to avoid the problem of multiple joints prone to leakage. In addition, except for the pre-condensation section 102, the entire transition pipe 1011 is wrapped with a heating belt 1012 to prevent volatiles from condensing and clogging the pipe.

[0092] Please continue reading Fig.16 In one embodiment, the inner walls of both ends of the transition pipe 1011 are provided with a corrugated structure 1012. By providing the corrugated structure 1012, when the two ends of the transition pipe 1011 are connected to external devices respectively, a margin is left, thereby reducing the difficulty of assembly.

[0093] The present application also provides a semiconductor process equipment. Fig.15 The semiconductor process equipment includes a process chamber 400 and an exhaust device as described in the above embodiments, the exhaust device includes an exhaust pipe assembly 100 and a condensation structure 200, one end of the exhaust pipe assembly 100 is connected to an air inlet 111 of the condensation structure 200, and the other end is connected to the process chamber 400, and the exhaust port 112 of the condensation structure 200 is used to connect to an external factory service system 500.

[0094] For other working principles and processes of the exhaust device and semiconductor process equipment of this embodiment, please refer to the description of the condensation structure in the aforementioned embodiment of the present application, which will not be repeated here.

[0095] The above is a detailed introduction to a condensation structure, exhaust device and semiconductor process equipment provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. It should be noted that in the present application, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0096] The various technical features of the technical solution of the present application can be arbitrarily combined. In order to make the description concise, not all possible combinations of the various technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present application.

Claims

1. A condensation structure, characterized in that: include: Condensation chamber; a partition plate, arranged in the condensation chamber, dividing the internal space of the condensation chamber into a first space and a second space, wherein the first space and the second space are provided with a communication passage; The condensation chamber is provided with an air inlet communicating with the first space, and an air outlet communicating with the second space, and the air inlet and the air outlet are arranged away from the communication channel; A plurality of damping plates which are parallel to each other and arranged at intervals are respectively arranged in the first space and the second space, and a gap between two adjacent damping plates constitutes a cooling channel, and the cooling channel is communicated with the communication channel.

2. The condensation structure according to claim 1, characterized in that: The condensation chamber comprises: A cover plate, wherein the air inlet and the air outlet are arranged on the cover plate; A bottom plate, arranged opposite to the cover plate; A side panel, connecting the cover panel and the bottom panel to enclose the internal space; The partition extends from the cover plate to the bottom plate, and forms the communication channel at least on one side close to the bottom plate; The condensation structure further comprises: A connecting rod is used to connect the partition plate and all the damping plates, and the damping plate is spaced apart from the cover plate.

3. The condensation structure according to claim 2, characterized in that: The condensation structure further includes a first scraping mechanism for scraping off viscous matter retained on the damping plate.

4. The condensation structure according to claim 3, characterized in that: The side panel comprises a first side panel and a second side panel which are perpendicular to and opposite to the partition panel, and a third side panel and a fourth side panel which are connected to the first side panel and the second side panel on both sides; The first scraping mechanism comprises: A plurality of scraper strips are arranged in the inner space, the number of the scraper strips is at least equal to the number of the cooling channels, each cooling channel corresponds to one scraper strip, the scraper strip has a shape adapted to the cross section of the cooling channel, and the thickness of the scraper strip is less than the width of the cooling channel; At least one group of guide rods penetrating the first side plate, each group of guide rods being connected to the plurality of scraper strips in a one-to-one correspondence, and the guide rods being slidable relative to the first side plate; The first driving source is connected to the guide rod and is used to drive the scraper bar to move toward the second side plate to scrape off the viscous material.

5. The condensation structure according to claim 4, characterized in that: It also includes a second scraping mechanism, which is used to scrape off the viscous matter retained on the side of the scraping strip facing the second side plate when the scraping strip moves to the extreme position in the direction of the second side plate.

6. The condensation structure according to claim 5, characterized in that: The second scraping mechanism comprises: A fan is arranged in the inner space near the second side plate, and when the scraper moves to the extreme position, the fan and a side of the scraper facing the second side plate maintain a preset distance; the partition is arranged to avoid the fan; a rotating shaft, penetrating through the second side plate and connected to the fan, and the rotating shaft is rotatable relative to the second side plate; The second driving source is connected to the rotating shaft and is used to drive the fan to rotate so as to scrape off the viscous material on the side of the scraper facing the second side plate.

7. The condensation structure according to claim 6, characterized in that: It also includes a cooling component, which is arranged along the outer wall of the side panel and avoids the rotating shaft and the guide rod.

8. The condensation structure according to claim 7, characterized in that: The cooling assembly comprises: A covering plate, covering the second side plate, the third side plate and the fourth side plate; the rotating shaft passes through the covering plate; The cooling pipe is sandwiched between the cladding plate and the second side plate, the third side plate, and the fourth side plate.

9. An exhaust device for semiconductor process equipment, used for treating the gas exhausted by the semiconductor process equipment, characterized in that: The exhaust device comprises an exhaust pipe assembly and a condensation structure according to any one of claims 1 to 8; One end of the exhaust pipe assembly is connected to the air inlet, and the other end is used to connect to the process chamber. The exhaust port of the condensation structure is used to connect to an external factory service system.

10. The exhaust device according to claim 9, characterized in that: The bottom plate of the condensation chamber is funnel-shaped, and a drain port is provided on the bottom plate; The exhaust device further comprises a collecting box, which is connected to the liquid discharge port and is used for collecting liquid viscous substances.

11. The exhaust device according to claim 9, characterized in that: The exhaust pipe assembly comprises: A heating section, comprising a transition pipe having one end connected to the process chamber, and a heating belt wrapped around the outside of the transition pipe, wherein the transition pipe is integrally formed; The pre-condensation section has one end connected to the other end of the transition pipe and the other end connected to the air inlet.

12. A semiconductor process equipment, characterized in that: It comprises a process chamber and an exhaust device connected to the process chamber, and the exhaust device is the exhaust device as described in any one of claims 9-11.

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