Expansion board for test fixture and chip test host

Abstract

The invention discloses an expansion board for a test fixture and a chip test host, the expansion board comprises a printed circuit board, and the printed circuit board comprises a first area located at the upper part and a second area located at the lower part; the second area is used for arranging a test sampling interface of a to-be-tested chip, the second area is flush with the first area on the first side edge, and the second area shrinks inwards by a preset distance relative to the first area on the second side edge opposite to the first side edge. The expansion board for the test fixture can be integrated to a mainboard of an existing chip test host to expand the test capability of the chip test host, and can enable the host to realize more test functions on the premise of not increasing the area scale of the host; and the electrical data of the to-be-tested chip can be automatically measured instead of manpower, so that the test quality and the test efficiency can be improved. Moreover, when the expansion board is independently used, the expansion board at least can realize the capability similar to a universal meter, and the application scene of the expansion board is expanded.

Description

Technical Field

[0001] The present invention relates to the field of display driver chip testing, and in particular to an expansion board for a test fixture and a chip testing host. Background Art

[0002] During the production process of display chips, the chips need to be tested to ensure the quality of the chips before they leave the factory. There are often various display screens in the industry, and different display screens need to match different chips. Therefore, there are various chips on the market to meet the needs of matching different display screen drivers, which requires testing various chips separately; in addition, even the same chip needs to be tested in different ways, such as different voltage tests and different current tests on the tested chip.

[0003] The large-scale and high-quality mass production of chips must consider the needs of reducing costs, improving test quality, and improving test efficiency. The existing host test performance for completing these chip tests is single, and the protocol interface provided is also relatively single, which is difficult to adapt to the many test requirements of chips of different types and quantities; and the functions and interfaces of these existing chip test hosts are not scientifically designed, which is not conducive to building a simple, convenient, and efficient test platform on a limited experimental table. In particular, the existing test fixture hosts are often unable to complete a large number of chip tests with different voltages, currents, etc. at a low cost, and often require manual testing. For example, in order to complete the detection of various voltages, currents, frequencies, etc. on the chip, testers usually need to manually measure them on the spot with a multimeter, which is very unfavorable for cost reduction, and it is extremely difficult to improve test quality and test efficiency, and cannot meet the needs of mass production testing. Summary of the invention

[0004] The purpose of the present invention is to provide an expansion board for a test fixture and a chip test host. The expansion board for the test fixture of the present invention can be integrated into the mainboard of an existing chip test host to expand the test capability of the chip test host, and can allow the host to realize more test functions without increasing the area scale of the host, and can replace manpower to realize automatic measurement of the electrical data of the chip to be tested, which can improve the test quality and test efficiency. Moreover, in addition to being selectively integrated into an existing mainboard, the expansion board provided by the present invention can also be used independently. When used independently, it can achieve capabilities similar to those of a multimeter on the market, which further expands the application scenarios of the expansion board.

[0005] To achieve the above object, the present invention provides an expansion board for a test fixture, comprising:

[0006] A printed circuit board, comprising a first area located at an upper portion of the printed circuit board, and a second area located at a lower portion of the printed circuit board;

[0007] The second area is used to arrange test sampling interfaces of several chips to be tested, and the second area is flush with the first area at their first side edges, and at a second side edge opposite to the first side edge, the second area is retracted by a preset distance relative to the first area.

[0008] Preferably, the expansion board comprises a first electrical test area, the first electrical test area is located in the second area, and the first electrical test area is used to arrange various test sampling interfaces that are related to each other.

[0009] Preferably, the expansion board includes a second electrical test area, the second electrical test area is located in the middle area of ​​the printed circuit board and in the first area and / or the second area, and the second electrical test area is used to arrange test sampling interfaces that are not related to each other.

[0010] Preferably, the first electrical property test area includes a plurality of external voltage sampling interfaces, current sampling interfaces, diodes and resistance sampling interfaces of the chip to be tested.

[0011] Preferably, the second electrical property test area includes an external voltage sampling interface, an external current sampling interface, and a waveform frequency or duty cycle sampling interface.

[0012] Preferably, the expansion board includes a display module area, and the display module area is located in the first area and is used for interactively displaying test information.

[0013] Preferably, the second electrical testing area of ​​the expansion board is arranged between the display module area and the first electrical testing area.

[0014] Preferably, the expansion board further comprises an expansion interface disposed on the lower surface of the printed circuit board, and the expansion interface comprises:

[0015] A first socket, used to match and couple with a first pin module of a test fixture mainboard to obtain a transmission path for a sampled test signal;

[0016] The third socket is used to match and couple with the third pin module of the test fixture mainboard so that the expansion board obtains power from the test fixture mainboard, or establishes communication between the expansion board and the test fixture mainboard.

[0017] Preferably, the expansion interface also includes a second socket, and the second socket is used to match and couple with a second pin module of the test fixture mainboard, so that the mainboard can receive the frequency detection signal transmitted by the expansion board to implement a frequency detection function.

[0018] Preferably, the expansion board also includes a mechanical connection sub-module arranged on the lower surface of the printed circuit board, and the mechanical connection sub-module also includes a support column integrally formed with the printed circuit board and located on the lower surface of the display module area, and the support column is used to support the expansion board and provide the possibility of coupling binding holes of the test fixture mainboard.

[0019] Preferably, the mechanical connection submodule comprises at least two binding holes, wherein the binding holes, the support columns, the first socket and the third socket are evenly distributed around the periphery of the printed circuit board.

[0020] On the other hand, the present invention further provides a chip testing host, including the expansion board as described in any of the previous embodiments, or including a structure formed by coupling the expansion board as described in any of the previous embodiments to a test fixture mainboard.

[0021] In summary, compared with the prior art, the test fixture expansion board provided by the present invention has the following beneficial effects:

[0022] The test fixture expansion board of the present invention can be integrated into an existing test fixture mainboard, and more test functions can be integrated into the test fixture mainboard without increasing the test fixture mainboard. The test fixture expansion board of the present invention can automatically measure the electrical data of the tested chip, which can improve the test quality and test efficiency. In addition, the expansion board provided by the present invention can be selectively integrated into an existing mainboard or used independently. When used independently, it can achieve capabilities similar to those of a multimeter on the market, which further expands the application scenarios of the expansion board. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the front layout of the expansion board for the test fixture of the present invention.

[0024] Figure 2 It is a schematic diagram of the back layout of the expansion board for the test fixture of the present invention.

[0025] Figure 3 It is a schematic diagram of a control circuit of an expansion board for a test fixture of the present invention.

[0026] Description of reference numerals:

[0027] Expansion board 10

[0028] Printed circuit board 100

[0029] The first electrical testing area 110

[0030] The second electrical testing area 120

[0031] External input voltage output interface 121

[0032] Frequency detection interface 122

[0033] Frequency output interface 123

[0034] Display module area 130

[0035] Display 131

[0036] Control buttons 132

[0037] Binding hole 140

[0038] First socket 210

[0039] Second socket 220

[0040] The third socket 230 DETAILED DESCRIPTION

[0041] The following will be combined with the attached embodiment of the present invention Figure 1 ~Attached Figure 3 , the technical solutions, structural features, objectives achieved and effects in the embodiments of the present invention are described in detail.

[0042] It should be noted that the drawings are in a very simplified form and use non-precise proportions. They are only used to conveniently and clearly assist in explaining the embodiments of the present invention, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0043] It should be noted that, in the present invention, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only the elements explicitly listed, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0044] Attached Figure 1An expansion board 10 for a test fixture provided by the present invention is given as an example. The expansion board 10 is used for the extended connection of the test fixture mainboard to realize the cooperation between the expansion board 10 and the test fixture mainboard to automatically test the chip under test. The combination of the expansion board 10 and the test fixture mainboard can be used to constitute a test chip host. For the test chip host, more test functions can be extended to the test chip host by externally connecting the expansion board 10 for the test fixture of the present invention without increasing the size and area of ​​the test chip host, and the automation of the test method can be realized, and the test quality and efficiency can be improved. In addition, the expansion board 10 provided by the present invention provides more optionality, because the expansion board 10 for the test fixture of the present invention can also be used alone. When used alone, it can also complete partial testing of the chip under test, and can achieve capabilities similar to those of multimeters on the market, which further expands the application scenarios of the expansion board proposed by the present invention.

[0045] The test fixture expansion board 10 includes a printed circuit board 100, and the printed circuit board 100 is in the shape of an inverted "7". The printed circuit board 100 includes a first area A1 located at the upper part of the printed circuit board 100, and a second area A2 located at the lower part of the printed circuit board 100. The second area A2 is used to arrange the test sampling interfaces of the chips to be tested, and the second area A2 is flush with the first area A1 at the first side position, and at the second side opposite to the first side, that is, Figure 1 On the right side shown, the second area A2 is retracted by a preset distance relative to the first area A1. The first area A1 and the second area A2 form an overall inverted "7" shape. Specifically, the printed circuit board 100 includes a first electrical test area 110, a second electrical test area 120, a display module area 130, and an expansion interface and other structures arranged on the second surface (lower surface) of the printed circuit board 100. Among them, the first electrical test area 110 is used to arrange various test sampling interfaces that are related to each other, the second electrical test area 120 is used to arrange various test sampling interfaces that are not related to each other, and the display module area 130 is used to interactively display test information.

[0046] The display module area 130 is roughly located in the first area A1, and the first electrical test area 110 and the second electrical test area 120 (if the second electrical test area 120 is included) are roughly located in the second area A2. Preferably, the first electrical test area is located in the second area A2, the second electrical test area is located in the middle area of ​​the printed circuit board and is located in the first area A1 and / or the second area A2, and the second electrical test area 120 is arranged between the display module area 130 and the first electrical test area 110. Specifically, on the first side of the entire printed circuit board 100, the first electrical test area 110, the second electrical test area 120, and the display module area 130 are located at the first side of the printed circuit board 100 (attached Figure 1 The left side of the printed circuit board 100 is flush with the second side of the printed circuit board 100 (the Figure 1 The first electrical test area 110 and the second electrical test area 120 are retracted by a preset distance relative to the display module area 130, and the preset distance is used to avoid the setting of the output interface of the matching test fixture mainboard. The setting of the avoidance area is conducive to the expansion board 10 coupling with the test fixture mainboard with the smallest area scale. At the same time, by ensuring the position of the output interface of the host jointly constituted by the expansion board 10 and the test fixture mainboard, it is conducive to the subsequent construction of a test platform that is easy to operate to establish a signal connection or electrical connection between the host and the chip to be tested. Optionally, the output interface of the test fixture mainboard can be a DuPont line interface or an HDMI interface that supports the MIPI protocol.

[0047] The following is an exemplary introduction to some structures included in the expansion board 10:

[0048] In order to facilitate the expansion coupling between the expansion board 10 and the test fixture mainboard, the expansion interface is arranged on the back of the expansion board 10 for matching and coupling with the expansion interface (such as the first pin module, the second pin module, the third pin module, etc.) arranged on the front of the test fixture mainboard, so that the expansion board 10 can obtain power from the test fixture mainboard or perform signal interaction between the two. Figure 2 The expansion interface shown may include, for example, a first socket 210, a second socket 220 and a third socket 230, wherein the second socket may be set or not set according to actual needs. Exemplarily, the first socket 210, the second socket 220 and the third socket 230 on the expansion board 10 may be used to connect to the corresponding matching first pin module, the second pin module and the third pin module on the test fixture mainboard, so as to realize the electrical connection or signal interconnection between the test fixture expansion board 10 and the test fixture mainboard. In addition, the expansion board 10 may also be separately connected to other modules that provide corresponding power or signals through the first socket 210, the second socket 220 and the third socket 230 or other structures, so that the expansion board 10 does not have to be used in combination with the test fixture mainboard, and it can also be used alone to complete part of the test application of the chip. For example, the expansion board 10 does not need to be coupled to the third pin module of the test fixture mainboard through the third socket to obtain power. An additional direct power supply module can be provided on the expansion board 10 to ensure the power required for independent operation of the expansion board 10. At this time, most of the functions of the expansion board 10 can be similar to a common multimeter, and the tester can use it to manually complete part of the test of the chip or other device to be tested.

[0049] Exemplarily, the first socket 210 is used for the plug-in connection of the first pin module, and the voltage and current measurement modules of the expansion board 10 can obtain the measured signal from the test fixture mainboard by means of the channel built by coupling the first socket 210 and the first pin module. The first socket 210 includes a jack that matches the pin of the first pin module 110, that is, it includes two rows of parallel jacks. Optionally, in addition to providing the measured signal to the voltage measurement module and the current measurement module on the expansion board 10, the first pin module arranged on the test fixture mainboard also provides power to the power pins on the chip test fixture mainboard.

[0050] Exemplarily, the second socket 220 is coupled to the second pin module of the test fixture mainboard. The frequency detection module may not be provided on the expansion board 10, and the expansion board 10 may transmit the frequency detection signal received by the frequency output interface 121 to the FPGA (Field-Programmable Gate Array) module on the test fixture mainboard for processing by means of the channel constructed by the second socket 220 and the second pin module. Thus, the expansion board 10 may use the FPGA of the test fixture mainboard to jointly realize the function of frequency detection of any signal of any device including the chip to be tested. Optionally, the second socket may be considered to be set or omitted depending on whether the frequency detection is needed or not.

[0051] Exemplarily, the third socket 230 is coupled to the third pin module, and the expansion board can obtain all the required power supply from the test fixture mainboard by means of the channel built by coupling the third socket 230 and the third pin module, so that when the expansion board 10 is coupled to the test fixture mainboard to form a chip test host, the setting and arrangement of power can be saved on the expansion board 10. Preferably, in order to simplify the circuit, the channel built by coupling the third socket 230 and the third pin module is also used for communication between the chip test fixture mainboard and the expansion board. For example, SPI communication between the chip test fixture mainboard and the expansion board 10 can be completed through the channel built by coupling the third socket 230 and the third pin module, and SPI communication can realize full-duplex communication, and has the advantages of high speed and high flexibility.

[0052] Optionally, the first socket 210 matched with the first pin module includes a plurality of groups of first jacks corresponding to the first pins included therein, and the third socket 230 matched with the third pin module includes a plurality of groups of third jacks corresponding to the third pins included therein, and the plurality of groups of first jacks are arranged along the first direction, and the plurality of groups of third jacks are arranged along the second direction. In this embodiment, the first direction and the second direction are arranged perpendicularly. In other embodiments, the first direction may also be arranged at an angle to the second direction without being perpendicular. The first socket 210 and the third socket 230 are arranged perpendicularly or at an angle to each other to improve the stability of the connection between the chip test fixture mainboard 10 and the extended test circuit board.

[0053] In addition, if a second socket is provided, then the second socket 220 is closer to the middle area of ​​one side edge of the printed circuit board 100 than the first socket 210 and the third socket 230, so that the first socket 210, the second socket 220, and the third socket 230 can be more reasonably distributed on the printed circuit board. With such a configuration, when the distance between the first socket 210 and the third socket 230 is large, the second socket 220 can further provide stable coupling support between the expansion board 10 and the test fixture mainboard in the middle area, thereby improving the stability of the connection and ensuring the transmission quality of the signal or power supply.

[0054] Preferably, the first electrical test area 110 of the expansion board may include several test interfaces such as voltage test interfaces, resistance test interfaces, diode test interfaces, etc., which are used to receive corresponding test signals provided by the test chip; and the orientation of these test interfaces is perpendicular to the first surface of the expansion board 10, so as to facilitate connection with the corresponding test signal transmission line to provide the corresponding test signal to the chip under test. Exemplarily, the first electrical test area 110 may be provided with 20 external voltage measurement interfaces, 5 power supply voltage measurement and 1 backlight voltage measurement interface, 5 power supply current measurement and 1 backlight current measurement interface, and 16 diode and resistance detection interfaces. The number of voltage channels of the external voltage measurement interface and the number of diode and resistance detection interfaces can be set according to actual needs, and are not limited to the aforementioned 20 voltage channels, or 16 diode sampling channels.

[0055] The first electrical test area 110 can occupy most of the area of ​​the second area A2, and each test interface in the first electrical test area 110 is preferably arranged close to the bottom edge of the second area A2. Through the aforementioned arrangement of these interfaces, when the expansion board 10 is coupled to the test fixture mainboard 10 to cooperate with the chip test host, multiple surfaces of the host can form an interface that is convenient for plugging and unplugging, thereby facilitating the construction and adjustment of the test platform, and improving the test quality and test efficiency. Preferably, the expansion board 10 also includes a second electrical test area 120, which is used to arrange some circuits required for sporadic testing. When the expansion board 10 is coupled to the test fixture mainboard, exemplarily, the second electrical test area 120 can be used to electrically connect to the test fixture mainboard and cooperate to measure the frequency-related performance of the tested chip (for example, receiving a frequency signal through a frequency output interface 121). Optionally, the second electrical test area 120 may include a frequency output interface 123, a frequency detection interface 122, and an external voltage output interface 121, etc. Among them, the frequency output interface 123 is used for outputting the waveform frequency, and the waveform and frequency can be set to be transmitted to the chip under test to realize the corresponding detection of the chip. In fact, the frequency output interface 123 and the external voltage output interface 121 can be used to provide specific working conditions for the chip under test, and the external voltage output interface 121 can also be used to perform voltage and current sampling on the external voltage. The frequency detection interface 122 can be used for duty cycle detection, and can detect the duty cycle and other frequency data of any waveform of the chip under test. Preferably, the frequency output interface 123, the frequency detection interface 122 and the external voltage output interface 121 are dispersedly arranged in the second electrical test area 120, and avoid squeezing the layout space of the first electrical test area 110. Appendix Figure 1 It is shown that the second electrical test area 120 is roughly located in the second area A2, but preferably, a large part of the second electrical test area 120 can also be dispersed in the first area A1, so that the area of ​​the second area A2 can be guaranteed, so as to ensure that a large number of voltage test interfaces, resistance test interfaces, and diode test interfaces can have sufficient distribution space while ensuring that the corresponding test signal generating circuits can be reasonably arranged to avoid mutual interference between different test signal generating circuits. Exemplarily, the second electrical test area 120 can be provided with 1 external voltage measurement + 1 external current measurement interface, 2 clock output interfaces, and 2 waveform frequency or duty cycle detection interfaces, which are formed into a frequency output interface 123, a frequency detection interface 122, and an external voltage output interface 121.

[0056] The first area A1 of the expansion board 10 is used to set the display module area 130, and the display module area 130 is used to display test information. Specifically, the display module area 130 includes a display screen 131. The display screen 131 is used to display test information, such as displaying the current screen point protocol, real-time voltage, current conditions, register readback results, and electrical test data. The display module area 130 is also provided with a plurality of control buttons 132, and the control buttons 132 may include, for example: a button for displaying the current screen point protocol, a button for displaying the voltage and current conditions in real time, a button for reading back the register results, a button for electrical test data, etc. The plurality of control buttons 132 are used to control the display of corresponding test information.

[0057] In order to enable the expansion board to be coupled with the test fixture mainboard with high precision, the expansion board 10 is also provided with a mechanical connection submodule, which includes at least two binding holes 140. When the test fixture needs to be connected to the test fixture mainboard with the expansion board 10, the binding hole 140 on the expansion board 10 and the corresponding binding hole on the test fixture mainboard can be screwed through the binding hole to achieve a reliable connection between the two. Preferably, two binding holes are provided, one binding hole 140 is provided in the display module area 130, specifically located at the upper left corner side of the display module area 130; the other binding hole 140 is provided in the first electrical test area 110, specifically provided at the lower right corner position of the first electrical test area 110. In addition, the mechanical connection submodule also includes a support column with a screw hole provided below the upper corner area of ​​the display module area 130, and the support column is integrally formed with the printed circuit board 100. When the expansion board 10 is coupled with the test fixture mainboard, a stable support and coupling can be provided in the upper right corner area of ​​the printed circuit board 100. The display screen 131 is fragile, and its display driving circuit has high requirements for connection arrangement. By not providing binding holes for screw coupling in the upper right corner area, but providing an integrally formed support column with screw holes from the second surface of the printed circuit board 100, it is possible to prevent the screws from scratching the display screen 131 and its driving circuit board in this area, causing abnormal display of the display screen 131. In addition, since the support column is integrally formed with the printed circuit board 100, a stable spacing support can be provided, and the spacing between the expansion board 10 and the test fixture mainboard can be maintained at an appropriate distance, thereby preventing the respective circuit components on the mutually facing surfaces of the two from scratching each other, causing damage to the entire test circuit.

[0058] With the help of the first socket 210, the third socket 230 and even the second socket 220 of the expansion board 10, as well as the aforementioned binding hole 140 and the setting of the support column, the expansion board 10 and the test fixture mainboard can be combined. On the one hand, a stable complete device can be formed. On the other hand, the respective circuit combinations can cooperate to realize the automated testing requirements of a large number of tests, improve the test quality, test efficiency, and reduce the test cost.

[0059] The circuit module 10' included in the test fixture expansion board 10 of the present invention is described in detail below. Figure 3 As shown, the circuit module includes an MCU (Microcontroller Unit) control module 470. The MCU control module 470 can communicate with the main control MCU control module on the test fixture mainboard, for example, through an interface J9 such as SPI (Serial Peripheral Interface); the MCU control module 470 is mainly used for the combined control of each module structure on the expansion board 10. The MCU control module 470 is connected to each sub-module on the test fixture expansion board 10 through an IIC1 bus 530, an IIC2 bus 520 and an SPI bus 530. For example, it can be used to cooperate with the control button 132 to control the display of the display screen 131. The MCU control module 470 can be used to control various sampling modules. Each sampling module can sample various test indicators of the chip to be tested, such as the 20-channel external voltage sampling module, 5-channel power supply voltage sampling modules and 1-channel backlight voltage sampling module, 5-channel power supply current sampling modules and 1-channel backlight current sampling module mentioned above, and 16-channel diode and resistor sampling modules; and 1-channel external injection voltage sampling module, 1-channel external injection current sampling module, 2-channel waveform frequency or duty cycle sampling modules, etc. Therefore, the corresponding first electrical test area 110 can have the following interfaces: a multi-channel external voltage measurement interface J1, a 5-channel power supply voltage measurement and a 1-channel backlight voltage measurement interface J2, a 5-channel power supply current measurement and a 1-channel backlight current measurement interface J3, and a large-scale (for example, 16*16) diode and resistor detection interface J4. The second electrical test area 120 may be provided with 1 external voltage measurement + 1 external current measurement interface J5, 2 clock output interfaces J6, and 2 waveform frequency or duty cycle detection interfaces J7. Interfaces J5, J6, and J7 may be as follows: Figure 1 The interfaces 121 to 123 shown, interfaces J1, J2, J3, and J4 are preferably Figure 1 The first electrical test area 110 is regularly arranged. For example, a large-scale diode and resistance detection interface J4 can occupy one side and be arranged in a column along the longitudinal direction, and a large-scale voltage detection interface (for example, interface J1) occupies the other side and is arranged in several rows along the longitudinal direction, so that the interface J1 and the interface J4 are regularly arranged in the first electrical test area 110. As for the interface J2 and the interface J3, they are implemented through the first socket 210, and the expansion board 10 obtains the voltage and current measurement of 5 power supplies and 1 backlight through the first socket 210.

[0060] In this embodiment, the MCU control module 470 is directly electrically connected to the display screen 131 and controls the display content of the display screen 131. The display screen 131 can, for example, be a GC9307 model display screen with a resolution of 240*320 (but the specific embodiment is not limited to this). Under the premise of ensuring that the content can be displayed clearly, the power consumption is reduced, the output information requirements of the MCU control module 470 for the display screen 131 are reduced, and the computing load of the MCU control module 470 is reduced.

[0061] The expansion board 10 is provided with an independent power supply adjustment module 460, which can be used to convert the power supply voltage input from the test fixture mainboard or other external modules input from the interface J8 for use by each module on the expansion board 10. Preferably, the power supply adjustment module 460 of the expansion board 10 developed by the present invention can convert the input 12V voltage into 5V, 5V, 3.3V, 2.5V, ±5V, 0.5V, -12V and other potentials for use by each module in the expansion board 10. Figure 3 As shown, for example, the aforementioned 5V output can be used for the power supply of the MCU control module 470, the 3.3V output can be used for the power supply required by devices such as the EEPROM (Electrically Erasable Programmable Read-Only Memory) 420, ADC, DAC modules, etc. of the expansion board 10, and the other 5V and 2.5V, 0.5V, etc. can be the reference voltages required by different ADCs (such as ADC1, ADC2, ADC3, DAC modules, etc.).

[0062] The expansion board 10 of the present invention can be integrated into the mainboard of an existing chip test host to expand the test capability of the chip test host. It can enable the host to realize more test functions without increasing the area of ​​the host, and can replace manpower to automatically measure the electrical data of the chip to be tested, thereby improving the test quality and test efficiency. The expansion board 10 can also work without being powered by the test fixture mainboard but by other means. In this case, part of the test functions of the expansion board 10 can be completed by the expansion board 10 itself. Figure 3As shown, for example, multiple channels (20 channels are used as an example in the embodiment of the accompanying drawings, and can be selected as needed in practice, the more the better) of external voltage measurement, 1 channel of external power supply voltage measurement, current measurement, 2 channels of clock output, diode, resistance detection, etc. can be completed independently by the ADC included in the expansion board 10. The expansion board 10 is provided with a corresponding first ADC unit 310ADC1 for voltage sampling, and a corresponding second ADC unit 320ADC2 for current sampling.) For example, multiple channels (for example, 20 channels) of external voltage and multiple channels (for example, 6 channels) of power supply voltage can be measured by the first ADC unit 310 (for example, Figure 3 5 power supplies and 1 backlight current can be based on the second ADC unit 320 (such as Figure 3 ADC2 connected to the SPI bus 510 as shown in FIG. 5 ), the diode / resistance detection (eg, 16 channels) can be completed by the third ADC unit 330 (eg, Figure 3 The expansion board 10 can also complete 2-way frequency output, and the frequency output needs to involve the phase-locked loop module 450. Another part of the expansion board 10 assists in completing chip testing by combining with the test fixture mainboard, such as 2-way waveform frequency, etc. It also involves a backlight 430 module, which is a backlight driving circuit for the display screen 131 matched by the expansion board 10 itself. For example, through the channel established by coupling the first pin module of the test fixture mainboard with the first socket 210, the expansion board 10 can obtain the measured signal required by the voltage and current measurement module from the test fixture mainboard, and the corresponding signal is sampled and quantized by ADC1 and ADC2.

[0063] In order to realize the control of these sampling categories, they can be connected through control signal lines. For example, the first ADC unit 310, the second ADC unit 320, and the third ADC unit 330 can be controlled and processed through the SPI bus 510, and other types of control can be controlled through the IIC buses 520, 530. Multiple IIC buses can be set. For example, setting the diode sampling channel selection 410 and the button 132 can be controlled by setting an independent IIC2 bus 520 separately, and the detection of frequency output, backlight voltage and current, etc. can be controlled through the IIC1 bus 530.

[0064] By coupling the expansion board 10 to the test fixture mainboard to collaboratively complete the test operation, some functional modules or circuit routings of the expansion board 10 can be arranged on the test fixture mainboard. The test fixture mainboard is coupled to the expansion board 10 by means of pins and sockets, and the expansion board 10 can form a spacing with the coupled test fixture mainboard, so that a large number of functional modules or circuits can be supported to be arranged on the opposite surfaces of the test fixture mainboard and the expansion board 10, so that the many test functions of the expansion board 10 can be automated with the help of the synergistic effect of the MCU and FPGA set on the test fixture mainboard. For example, the expansion board can provide a large number of voltage, resistance, and diode tests, which can be automated through the control of the MCU on the test fixture mainboard, replacing complex manual labor, improving test efficiency, and reducing test costs. Without increasing the area size of the chip test host, the host's functions can be diversified and automated, meeting the low-cost, high-quality, and high-efficiency requirements of chip mass production testing.

[0065] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. An expansion board for a test fixture, characterized in that: The expansion board includes: A printed circuit board, comprising a first area located at an upper portion of the printed circuit board, and a second area located at a lower portion of the printed circuit board; The second area is used to arrange test sampling interfaces of several chips to be tested, and the second area is flush with the first area at their first side edges, and at a second side edge opposite to the first side edge, the second area is retracted by a preset distance relative to the first area.

2. The test fixture expansion board according to claim 1, wherein: The expansion board includes a first electrical test area, which is located in the second area and is used to arrange various test sampling interfaces that are related to each other.

3. The test fixture expansion board according to claim 1 or 2, characterized in that: The expansion board includes a second electrical test area, which is located in the middle area of ​​the printed circuit board and in the first area and / or the second area, and is used to arrange test sampling interfaces that are not related to each other.

4. The test fixture expansion board according to claim 2, wherein: The first electrical property test area includes a plurality of external voltage sampling interfaces, a current sampling interface, a diode and a resistance sampling interface of the chip to be tested.

5. The test fixture expansion board as claimed in claim 3, characterized in that: The second electrical property test area includes an external voltage sampling interface, an external current sampling interface, and a waveform frequency or duty cycle sampling interface.

6. The test fixture expansion board according to any one of claims 1 to 3, characterized in that: The expansion board includes a display module area, which is located in the first area and is used for interactively displaying test information.

7. The test fixture expansion board according to claim 6, wherein: The second electrical test area of ​​the expansion board is arranged between the display module area and the first electrical test area.

8. The test fixture expansion board according to any one of claims 1 to 4, characterized in that: The expansion board also includes an expansion interface disposed on the lower surface of the printed circuit board, and the expansion interface includes: A first socket, used to match and couple with a first pin module of a test fixture mainboard to obtain a transmission path for a sampled test signal; The third socket is used to match and couple with the third pin module of the test fixture mainboard so that the expansion board obtains power from the test fixture mainboard, or establishes communication between the expansion board and the test fixture mainboard.

9. The test fixture expansion board according to claim 8, wherein: The expansion interface also includes a second socket, which is used to match and couple with a second pin module of the test fixture mainboard, so that the mainboard can receive the frequency detection signal transmitted by the expansion board to implement a frequency detection function.

10. The test fixture expansion board according to any one of claims 1 to 4, characterized in that: The expansion board also includes a mechanical connection sub-module arranged on the lower surface of the printed circuit board, and the mechanical connection sub-module also includes a support column integrally formed with the printed circuit board and located on the lower surface of the display module area, and the support column is used to support the expansion board and provide the possibility of coupling binding holes of the test fixture mainboard.

11. The test fixture expansion board according to claim 10, wherein: The mechanical connection submodule comprises at least two binding holes, wherein the binding holes, the support columns, the first socket and the third socket are evenly distributed around the periphery of the printed circuit board.

12. A chip testing host, comprising the expansion board as claimed in any one of claims 1 to 11, or comprising a structure formed by coupling the expansion board as claimed in any one of claims 1 to 11 to a test fixture mainboard.

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