Three-temperature test sorting machine

Abstract

The invention relates to the technical field of automation equipment, and discloses a three-temperature test sorting machine, which is characterized in that a heat preservation cover is arranged on a workbench, and a test space is formed by the heat preservation cover and the workbench, so that the consistency of temperature in the test space can be ensured, a chip is uniformly heated in the test space, and automation of three-temperature test of the chip is realized. The temperature of the chip is adjusted in advance by additionally arranging the pre-heating device, so that the whole chip is heated more uniformly, and meanwhile, the waiting time is fully utilized to adjust the temperature in advance, so that the test time is saved, the accuracy of a chip test result and the stability of a test yield can be ensured, and the test efficiency is improved. Moreover, the test efficiency is improved, and large-scale popularization and application are facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of automated equipment, and particularly to a three-temperature test and sorting machine. Background Art

[0002] Currently, in the field of chip testing, most of the testing work can be efficiently completed by advanced automated testing equipment. However, there is still a small portion of chips that cannot be directly adapted to existing automated testing equipment due to their special testing requirements, namely, they need to undergo a three-temperature testing process - including performance testing under high temperature, low temperature, and normal temperature environments.

[0003] For the testing of this part of chips, the current method mainly uses a surface-contact heating source to locally heat the chips. Subsequently, the testers need to manually perform point-by-point testing on the chips. However, this method has obvious limitations. Since it is exposed to the environment, it can only make the side of the chip that is in direct contact with the heating source reach the required testing temperature, and it is difficult to ensure that the entire chip uniformly reaches the temperature conditions required for testing. In addition, due to possible human differences in each manual testing operation process, this inconsistency will also have an adverse impact on the testing results of the chips.

[0004] In summary, the current testing method not only makes it difficult to guarantee the accuracy and stability of chip testing results, resulting in large fluctuations in the testing yield, but also has relatively cumbersome operation steps and low testing efficiency.

[0005] Therefore, in order to improve the accuracy and efficiency of chip testing and ensure the stability of the testing yield, it is particularly important to improve and optimize the existing testing technology.

[0006] The above information is given as background information only to assist in understanding the present disclosure, and does not determine or admit whether any of the above content can be used as prior art relative to the present disclosure. Summary of the Invention

[0007] The present invention provides a three-temperature test and sorting machine to solve the problems existing in the prior art.

[0008] To achieve the above object, the present invention provides the following technical solutions:

[0009] A three-temperature test and sorting machine includes a workbench, a heat insulation cover, a feeding device, a discharging device, a chip handling device, a preheating device, a chip shuttle device, a testing device, and a ventilation pipe; wherein,

[0010] The heat insulation cover is arranged on the workbench and is used to form a testing space with the workbench;

[0011] The loading device, unloading device, chip handling device, preheating device, chip shuttle device, testing device, and ventilation pipe are respectively arranged on the workbench and located within the testing space;

[0012] The ventilation pipe is used to convey refrigerant so that the refrigerant circulates within the testing space;

[0013] The loading device is used to load the tray loaded with chips to be tested;

[0014] The chip handling device is used to transfer the chips in the loaded tray to the preheating device; and transfer the preheated chips from the preheating device to the chip shuttle device; and transfer the tested chips from the chip shuttle device to the unloading device;

[0015] The preheating device is used to pre-adjust the temperature of the chips located on the preheating device before testing;

[0016] The chip shuttle device is used to convey the chips into the testing device for testing; and convey the tested chips out of the testing device;

[0017] The testing device is used to further adjust the temperature of the chips and test the chips;

[0018] The unloading device is used to unload the tray loaded with tested chips.

[0019] Further, in the three-temperature test sorter, the loading device includes a loading module and a grasping and waiting module;

[0020] The loading module is used to store a plurality of trays loaded with chips to be tested, and the plurality of trays are stacked; and used to provide the trays to the grasping and waiting module;

[0021] The grasping and waiting module is used to store the trays provided by the loading module to wait for the chip handling device to transfer the chips in the trays to the preheating device.

[0022] Further, in the three-temperature test sorter, the loading module includes a first conveying mechanism, a lifting mechanism, a storage tank, and a clamping mechanism;

[0023] The storage tank is used to store a plurality of stacked trays;

[0024] The lifting mechanism is located at the bottom of the storage tank and is used to move up and down through the storage tank to lift or lower the trays in the storage tank;

[0025] The clamping mechanism is located on both sides of the storage slot and is used to extend when the lifting mechanism lifts the tray in the storage slot, so as to clamp the trays except the bottommost tray.

[0026] The lifting mechanism is also used to lower the bottommost tray when the clamping mechanism clamps the trays except the bottommost tray, so as to place it on the first conveying mechanism.

[0027] The first conveying mechanism is used to convey the tray placed thereon to the grasping and waiting module.

[0028] Further, in the three-temperature test and sorting machine, the grasping and waiting module includes a second conveying mechanism, a blocking mechanism, a side-pushing mechanism and a positioning jaw mechanism.

[0029] The second conveying mechanism is connected to the first conveying mechanism and is used to continue conveying the tray coming from the first conveying mechanism.

[0030] The blocking mechanism is arranged at the end of the second conveying mechanism and is used to block the second conveying mechanism from continuing to convey the tray.

[0031] The side-pushing mechanism is arranged on one side of the second conveying mechanism and is used to push the tray laterally from the side of the tray, so as to position the tray in the lateral direction and wait for the chip handling device to transfer the chips in the tray to the preheating device.

[0032] The positioning jaw mechanism is arranged on both sides of the second conveying mechanism and is used to press the tray positioned in the lateral direction.

[0033] Further, the three-temperature test and sorting machine further includes a tray handling device.

[0034] The blanking device includes an OK blanking module and an NG blanking module.

[0035] The tray handling device is arranged on the workbench and is located in the test space. It can move within the grasping and waiting module, the OK blanking module and the NG blanking module, and is used to transfer the empty tray after the chips are transferred from the grasping and waiting module to the OK blanking module and the NG blanking module, and store them respectively by the OK blanking module and the NG blanking module.

[0036] The OK blanking module is used to blank the tray loaded with chips with OK test results.

[0037] The NG blanking module is used to blank the tray loaded with chips with NG test results.

[0038] Furthermore, the three-temperature test and sorting machine further includes a code scanning device;

[0039] The chip handling device is further configured to transfer the chip to the code scanning device during the process of transferring the pre-heated chip from the pre-heating device to the chip shuttle device;

[0040] The code scanning device is arranged on the workbench and within the test space, and is used to scan the code on the chip.

[0041] Furthermore, the three-temperature test and sorting machine further includes a camera device;

[0042] The pre-heating device includes a pre-heating table, and a plurality of pre-heating grooves for placing chips are arranged on the pre-heating table;

[0043] The camera device is arranged on the chip handling device and is used to assist the chip handling device to place the chip into the pre-heating groove through visual recognition technology.

[0044] Furthermore, in the three-temperature test and sorting machine, the chip shuttle device includes a third conveying mechanism and a carrier;

[0045] The carrier is arranged on the third conveying mechanism and is provided with a placement groove for placing chips;

[0046] The third conveying mechanism is used to convey the carrier and the chip thereon into the test device for testing; and convey the carrier and the chip thereon out of the test device after the test.

[0047] Furthermore, the three-temperature test and sorting machine further includes an induction device;

[0048] The induction device is arranged on the workbench and within the test space;

[0049] The third conveying mechanism is further used to convey the carrier and the chip thereon to the induction device after the test;

[0050] The induction device is used to emit an induction signal when there is no chip or the chip is placed obliquely in the placement groove.

[0051] Furthermore, in the three-temperature test and sorting machine, the test device includes a lifting mechanism, a pneumatically driven floating module, and a pressing head;

[0052] The pressing head is arranged on the pneumatically driven floating module and is used to contact the chip in the placement groove and perform temperature counteraction on the chip so as to facilitate the testing of the chip;

[0053] The gas-driven floating module is arranged on the lifting mechanism and can move along the lifting direction under the drive of the lifting mechanism, and is used to adjust the slot entry angle of the indenter so that the indenter can accurately contact the chip in the placement slot.

[0054] Compared with the prior art, the present invention has the following beneficial effects:

[0055] A three-temperature test and sorting machine provided by the present invention forms a test space by arranging a heat preservation cover on the workbench, and the heat preservation cover and the workbench form a test space, and uses refrigerant as a medium to circulate in the test space, which can ensure the temperature consistency in the test space, make the chips uniformly heated in the test space, realize the automation of the three-temperature test of the chips, and also pre-adjust the temperature of the chips by adding a preheating device, so that the overall heating of the chips is more uniform, and at the same time, the waiting time is fully utilized for pre-temperature adjustment, thus saving the time required for testing. Therefore, it can not only ensure the accuracy of the chip test results and the stability of the test yield, but also improve the test efficiency, which is conducive to large-scale popularization and application.

[0056] The present invention has other characteristics and advantages, which will be obvious from the accompanying drawings incorporated herein and the subsequent detailed description, or will be described in detail in the accompanying drawings incorporated herein and the subsequent detailed description. These accompanying drawings and detailed description are used together to explain the specific principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0058] Figure 1 is one of the (three-dimensional) structural schematic diagrams of a three-temperature test and sorting machine provided by an embodiment of the present invention;

[0059] Figure 2 is the (top view) structural schematic diagram of a three-temperature test and sorting machine provided by an embodiment of the present invention;

[0060] Figure 3 is the second (three-dimensional) structural schematic diagram of a three-temperature test and sorting machine provided by an embodiment of the present invention;

[0061] Figure 4 is the third (three-dimensional) structural schematic diagram of a three-temperature test and sorting machine provided by an embodiment of the present invention;

[0062] Figure 5It is a (three-dimensional) structural schematic diagram of the feeding device provided by an embodiment of the present invention;

[0063] Figure 6 It is a (three-dimensional) structural schematic diagram of the feeding module provided by an embodiment of the present invention;

[0064] Figure 7 It is a (three-dimensional) structural schematic diagram of the grasping and waiting module provided by an embodiment of the present invention;

[0065] Figure 8 It is a (three-dimensional) structural schematic diagram of the feeding device and the discharging device provided by an embodiment of the present invention;

[0066] Figure 9 It is a (three-dimensional) structural schematic diagram of the feeding device, the discharging device, the tray handling device and the code scanning device provided by an embodiment of the present invention;

[0067] Figure 10 It is a (three-dimensional) structural schematic diagram of the feeding device, the discharging device, the tray handling device and the code scanning device provided by an embodiment of the present invention;

[0068] Figure 11 It is a (three-dimensional) structural schematic diagram of the chip handling device, the camera device and the chip shuttle device provided by an embodiment of the present invention;

[0069] Figure 12 It is a (three-dimensional) structural schematic diagram of the testing device and the sensing device provided by an embodiment of the present invention;

[0070] Figure 13 It is a (three-dimensional) structural schematic diagram of the testing device provided by an embodiment of the present invention.

[0071] Reference numerals:

[0072] Workbench 1, heat preservation cover 2, feeding device 3, discharging device 4, chip handling device 5, preheating device 6, chip shuttle device 7, testing device 8, ventilation duct 9, tray handling device 10, code scanning device 11, camera device 12, sensing device 13;

[0073] Feeding module 301, grasping and waiting module 302;

[0074] First conveying mechanism 3011, lifting mechanism 3012, storage tank 3013, clamping mechanism 3014;

[0075] Second conveying mechanism 3021, blocking mechanism 3022, side pushing mechanism 3023, positioning claw mechanism 3024;

[0076] OK discharging module 401, NG discharging module 402;

[0077] Preheating table 601, preheating tank 602;

[0078] The third transfer mechanism 701, the vehicle 702, and the placement groove 703;

[0079] The lifting mechanism 801, the pneumatically driven floating module 802, and the pressing head 803. Detailed implementation manners

[0080] To illustrate in detail the possible application scenarios, technical principles, specific implementable solutions, achievable objectives and effects, etc. of the present application, the following is described in detail with reference to the specific examples listed and in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of the present application, and therefore are only examples and cannot be used to limit the protection scope of the present application.

[0081] Referring to "embodiments" herein means that the specific features, structures or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The term "embodiment" appearing in various positions in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or relevance to other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0082] Unless otherwise defined, the meanings of the technical terms used herein are the same as those generally understood by those skilled in the technical field to which the present application belongs; the use of the relevant terms herein is only for describing specific embodiments and is not intended to limit the present application.

[0083] In the description of the present application, the phrase "and / or" is an expression used to describe the logical relationship between objects, indicating that there can be three relationships, for example, A and / or B, which means: the existence of A, the existence of B, and the simultaneous existence of A and B. In addition, the character " / " herein generally represents an "or" logical relationship between the associated objects before and after.

[0084] In the present application, terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual quantity, primary or secondary, or order relationship between these entities or operations.

[0085] Without further limitations, in this application, the terms "including", "comprising", "having" or other similar expressions used in a statement are intended to cover non-exclusive inclusion. These expressions do not exclude the possibility that there may be additional elements in a process, method or product that includes the said elements. Thus, a process, method or product that includes a series of elements may include not only those defined elements, but also other elements not explicitly listed, or elements inherent to such a process, method or product.

[0086] In this application, expressions such as "greater than", "less than", "exceeding" are understood not to include the present number; expressions such as "above", "below", "within" are understood to include the present number. In addition, in the description of the embodiments of this application, the meaning of "a plurality of" is two or more (including two). Similar expressions related to "many", such as "multiple groups", "multiple times", etc., are understood in the same way, unless otherwise specifically defined.

[0087] In the description of the embodiments of this application, the spatially related expressions used, such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "perpendicular", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiment or the drawings. This is only for the convenience of describing the specific embodiments of this application or for the reader's understanding, rather than indicating or implying that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, it should not be construed as a limitation on the embodiments of this application.

[0088] Unless otherwise clearly specified or limited, in the description of the embodiments of this application, the terms "installed", "connected", "joined", "fixed", "set", etc. should be understood in a broad sense. For example, the said "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art to which this application pertains, the specific meanings of the above terms in the embodiments of this application can be understood according to specific circumstances.

[0089] In view of the defects existing in the above-mentioned prior art, based on the rich practical experience and professional knowledge in the design and manufacture of this field for many years, and in cooperation with the application of theory, the applicant has actively carried out research and innovation in the hope of creating a technology that can solve the defects in the prior art. After continuous research, design, and repeated trial production of samples and improvements, the present invention with practical value has finally been created.

[0090] Please refer to Figures 1-4 , embodiments of the present invention elaborate in detail the structural design and functional characteristics of a three-temperature test sorter. The main components of the three-temperature test sorter include a workbench 1, a heat preservation cover 2, a feeding device 3, a discharging device 4, a chip handling device 5, a preheating device 6, a chip shuttle device 7, a testing device 8, and an air vent pipe 9. The following will elaborate in detail on each component of the sorter and its functions:

[0091] First, the heat preservation cover 2 is carefully installed on the workbench 1, and its main function is to jointly enclose a closed test space with the workbench 1. This design aims to ensure the stability of the test environment and provide a temperature-controlled closed environment for subsequent chip testing.

[0092] Secondly, key components such as the feeding device 3, the discharging device 4, the chip handling device 5, the preheating device 6, the chip shuttle device 7, the testing device 8, and the air vent pipe 9 are all cleverly arranged on the workbench 1 and are all located inside the above-mentioned test space. Such a layout design not only optimizes the space utilization rate of the equipment but also ensures the efficient and smooth cooperation among various components.

[0093] The air vent pipe 9 serves as a conveying channel for the refrigerant, and its function is to make the refrigerant circulate in the test space. Through this design, the temperature in the test space can be effectively adjusted and controlled, providing a uniform and stable temperature environment for chip testing.

[0094] The feeding device 3 is responsible for feeding the tray loaded with chips to be tested into the test process. It ensures that the chips can accurately and quickly enter the test system and prepares for subsequent testing work.

[0095] The chip handling device 5 undertakes the task of transferring the chips in the tray after feeding to the preheating device 6. At the same time, it also transfers the preheated chips from the preheating device 6 to the chip shuttle device 7, and transfers the tested chips from the chip shuttle device 7 to the discharging device 4. The design of this device greatly improves the handling efficiency of chips in the test process.

[0096] The function of the preheating device 6 is to pre-adjust the temperature of the chips before the formal test. Through this step, it can ensure that the chips are in the best temperature state during the test, thereby improving the accuracy and reliability of the test.

[0097] The chip shuttle device 7 is responsible for transporting the preheated chips into the testing device 8 for testing. At the same time, it also transports the tested chips out of the testing device 8 to prepare for subsequent chip processing procedures.

[0098] The test device 8 is the core component for chip testing. It not only further adjusts the temperature of the chip to ensure the stability of the test environment, but also conducts comprehensive tests on the chip to evaluate its performance and quality.

[0099] Finally, the unloading device 4 is responsible for removing the tray loaded with the tested chips from the test system. It ensures that the tested chips can leave the test system accurately and quickly, preparing for subsequent chip processing or packaging work.

[0100] In summary, in this embodiment, by setting the heat preservation cover 2 on the workbench 1 and jointly forming a closed test space with the workbench 1, and at the same time using the refrigerant as a medium to circulate in the test space, the consistency and stability of the temperature in the test space are ensured. This design not only realizes the automated process of three-temperature testing of chips, but also pre-adjusts the temperature of the chips by adding a preheating device 6, making the overall heating of the chips more uniform. In addition, by making full use of the waiting time for pre-temperature adjustment, the total time required for testing is saved. Therefore, the three-temperature testing and sorting machine of the embodiment of the present invention can not only ensure the accuracy of the chip test results and the stability of the test yield rate, but also significantly improve the test efficiency, having broad application prospects and promotion value.

[0101] Please refer to Figures 5-7 , in a specific implementation manner presented in this embodiment, the loading device 3 designed in this embodiment has a delicate structure and complete functions, mainly consisting of two core components: the loading module 301 and the grasping and waiting module 302. These two parts cooperate with each other to jointly ensure the smoothness and efficiency of the loading process.

[0102] Specifically, the loading module 301 plays a crucial role in this embodiment. It is not only responsible for storing and managing a certain number of trays, each of which is loaded with chips to be tested, and arranging them in an orderly manner in a stacked manner, which not only effectively saves storage space, but also facilitates the access and management of the trays. More importantly, the loading module 301 also undertakes the key task of providing trays to the grasping and waiting module 302. When needed, it can quickly and accurately transfer the trays to the grasping and waiting module 302, making full preparations for subsequent chip handling and testing work.

[0103] The grasping and waiting module 302 is another essential part of the loading device 3. Its main function is to receive the trays transferred by the loading module 301 and store them securely. During this process, the chips in the trays will remain stationary, waiting for the arrival of the chip handling device 5. Once the chip handling device 5 is ready, it will quickly and accurately transfer the chips in the trays to the preheating device 6 according to the preset program and path. In this way, the grasping and waiting module 302 not only ensures the safety and stability of the chips during the transfer process but also improves the efficiency and accuracy of the entire testing process.

[0104] In summary, the loading device 3 in this embodiment, through the ingenious design of the loading module 301 and the grasping and waiting module 302, realizes the efficient storage, accurate transfer, and secure waiting of the trays, providing strong support for the handling and testing of chips.

[0105] Please refer to again Figures 5-7 , in an implementation manner of this embodiment, the design concept of the loading module 301 is ingenious and its functions are comprehensive. It mainly consists of key components such as the first conveying mechanism 3011, the lifting mechanism 3012, the storage slot 3013, and the clamping mechanism 3014. These components cooperate with each other to jointly realize the efficient and orderly loading process of the trays.

[0106] The storage slot 3013, as the core storage component of the loading module 301, is designed to accommodate and stack several trays. These trays are all loaded with chips to be tested. By stacking them, not only is the storage space effectively saved, but also the management and access efficiency of the trays are improved.

[0107] The lifting mechanism 3012 is located at the bottom of the storage slot 3013, and its unique design enables it to move up and down through the storage slot 3013. When it is necessary to take out a tray, the lifting mechanism 3012 will move upward to lift the tray in the storage slot 3013. This action provides the necessary preparation for the subsequent clamping and conveying of the tray.

[0108] The clamping mechanism 3014 is cleverly arranged on both sides of the storage slot 3013. When the lifting mechanism 3012 lifts the tray in the storage slot 3013, the clamping mechanism 3014 will quickly extend to clamp the trays except the bottommost tray. This design ensures that only the bottommost tray can be taken out smoothly, while the other trays remain stable and will not be displaced or toppled due to the lifting action.

[0109] While the clamping mechanism 3014 clamps the trays except the bottommost tray, the lifting mechanism 3012 continues its descending action to smoothly place the bottommost tray onto the first conveyor mechanism 3011. During this process, the coordinated operation of the lifting mechanism 3012 and the clamping mechanism 3014 ensures the accurate and safe transfer of the trays.

[0110] Finally, as the output component of the loading module 301, the first conveyor mechanism 3011 is designed to transfer the trays placed thereon to the grasping and waiting module 302. Through the precise transfer of the first conveyor mechanism 3011, the trays can reach the grasping and waiting module 302 smoothly, making full preparations for the subsequent chip handling and testing operations.

[0111] In summary, through the ingenious design of the first conveyor mechanism 3011, the lifting mechanism 3012, the storage slot 3013, and the clamping mechanism 3014 in this embodiment, the loading module 301 realizes the efficient storage, accurate clamping, smooth transfer, and orderly loading of the trays, providing a strong guarantee for the efficient operation of the entire testing process.

[0112] Please refer to Figures 5-7 again. In an implementation manner of this embodiment, the design of the grasping and waiting module 302 fully embodies the concept of precise control and stable support. Its main components include the second conveyor mechanism 3021, the blocking mechanism 3022, the side-pushing mechanism 3023, and the positioning jaw mechanism 3024. These components cooperate with each other to jointly ensure the accurate positioning and stable holding of the trays during the grasping and waiting process.

[0113] As the input channel of the grasping and waiting module 302, the second conveyor mechanism 3021 is seamlessly connected to the first conveyor mechanism 3011. Its design purpose is to continue to transfer the trays transferred from the first conveyor mechanism 3011 to ensure that the trays can smoothly enter the grasping and waiting module 302, laying the foundation for the subsequent positioning and handling operations.

[0114] The blocking mechanism 3022 is cleverly arranged at the end of the second conveyor mechanism 3021, and its function is to block the second conveyor mechanism 3021 from continuing to transfer the trays at an appropriate time. This design ensures that the trays can stop accurately at the predetermined position, providing the necessary conditions for the actions of the side-pushing mechanism and the positioning jaw mechanism.

[0115] The side-pushing mechanism 3023 is located on one side of the second conveyor mechanism 3021, and its unique function is to apply a thrust from the side of the tray to move the tray in the lateral direction until it reaches the predetermined positioning position. This action not only realizes the lateral positioning of the tray but also facilitates the chip handling device 5 to accurately grasp the chips in the tray.

[0116] The positioning and pressing jaw mechanism 3024 is arranged on both sides of the second conveying mechanism 3021, and its function is to press the tray that has completed horizontal positioning to ensure that the tray remains stable during the waiting process for the chip handling device 5 and will not be displaced or toppled due to external factors (such as vibration, wind, etc.).

[0117] In summary, through the elaborate design of the second conveying mechanism 3021, the blocking mechanism 3022, the side pushing mechanism 3023, and the positioning and pressing jaw mechanism 3024 in this embodiment, the grasping and waiting module 302 realizes the efficient conveying, accurate blocking, horizontal positioning, and stable pressing of the tray. This series of actions not only improves the automation level of the entire feeding process but also ensures the accuracy and reliability of the chip handling process, laying a solid foundation for the subsequent chip testing work.

[0118] Please refer to Figures 8-10 , in an implementation manner of this embodiment, the design of the three-temperature test and sorting machine is further improved and optimized. In particular, a key component, the tray handling device 10, is introduced to improve the automation level and test efficiency of the entire device.

[0119] In this embodiment, the discharging device 4 is elaborately designed to include two independent modules, namely the OK discharging module 401 and the NG discharging module 402. These two modules each undertake different discharging tasks, ensuring the orderly classification and storage of the tested chips.

[0120] The tray handling device 10 is cleverly arranged on the workbench 1 and is located within the test space. It has the ability to move freely among the grasping and waiting module 302, the OK discharging module 401, and the NG discharging module 402. This design enables the tray handling device 10 to accurately grasp the trays that have become empty after the chips have been transferred away by the chip handling device 5 from the grasping and waiting module 302 and transfer them to the OK discharging module 401 or the NG discharging module 402 respectively.

[0121] Specifically, the OK discharging module 401 is specifically responsible for receiving and storing the trays loaded with chips that have passed the tests with OK (i.e., qualified) results. The chips in these trays have passed all the test processes and have been confirmed to meet the quality standards, so they can be safely stored in the OK discharging module 401 waiting for subsequent processing or packaging.

[0122] The NG discharging module 402 is used to receive and store the trays loaded with chips that have failed the tests with NG (i.e., unqualified) results. The chips in these trays have problems or defects during the test process, so they need to be stored separately for subsequent analysis, repair, or scrapping.

[0123] Through the close cooperation of the tray handling device 10 with the OK blanking module 401 and the NG blanking module 402, the three-temperature test sorter in this embodiment realizes the efficient, accurate handling and classified blanking of trays. This design not only improves the automation level of the test process but also ensures the accuracy and reliability of the test results, providing strong support for the production and quality control of chips.

[0124] Please refer to again Figures 8-10 , the function of the three-temperature test sorter has been further expanded and improved. In particular, a scanning device 11, an important component, is added to achieve precise tracking and management of chips.

[0125] In this embodiment, the chip handling device 5 not only undertakes the task of transferring the preheated chips from the preheating device 6 to the chip shuttle device 7 but also, during the transfer process, cleverly transfers the chips to the scanning device 11 temporarily. This design enables the chips to go through the scanning process before entering the formal test process, ensuring that the identity information of each chip is accurately recorded.

[0126] The scanning device 11 is carefully set on the workbench 1 and is located within the test space. The selection of its position fully considers the coordination and connection with the chip handling device 5, the preheating device 6, and the chip shuttle device 7. When the chip handling device 5 transfers the chips to the scanning device 11, the scanning device 11 quickly and accurately scans the codes on the chips. These codes usually contain key information such as the unique identifier, production date, and batch number of the chips, which are important bases for chip traceability and management.

[0127] Through the addition of the scanning device 11, the three-temperature test sorter in this embodiment realizes the full-chain tracking and management of chips. Information on each link from chip production, preheating, testing to final blanking can be accurately recorded, providing strong data support for chip quality control, problem traceability, and production optimization. At the same time, this design also improves the automation level of the test process, reduces manual intervention, and ensures the accuracy and reliability of the test results.

[0128] Please refer to Figure 11 , in an implementation manner of this embodiment, the technical configuration of the three-temperature test sorter has been further upgraded and optimized. In particular, a camera device 12 is introduced to enhance the intelligence and automation level of the device.

[0129] In this embodiment, the preheating device 6, as a key link in the test process, is particularly finely designed. The preheating device 6 includes a preheating table 601, and a number of preheating slots 602 are carefully set on the preheating table 601. These preheating slots 602 are specifically used to place the chips to be tested, ensuring that the chips can reach the required temperature state before testing.

[0130] The camera device 12 is ingeniously installed on the chip handling device 5. This design enables the camera device 12 to move together with the chip handling device 5 and visually identify the preheating tank 602 and the chip at the appropriate time. Through advanced visual recognition technology, the camera device 12 can accurately capture the position information of the preheating tank 602 and the specific form of the chip, thereby providing precise placement guidance for the chip handling device 5.

[0131] During the chip handling process, the camera device 12 transmits image data to the control system in real time. The control system analyzes the optimal placement position based on this data and commands the chip handling device 5 to accurately place the chip into the preheating tank 602. This process not only improves the accuracy and efficiency of chip placement but also reduces the errors and risks caused by manual operation.

[0132] In summary, in this embodiment, the three-temperature test and sorting machine realizes the intelligence and automation of chip placement by introducing the camera device 12 and closely cooperating with the preheating device 6 and the chip handling device 5. This design not only improves the smoothness and efficiency of the test process but also provides strong technical support for chip quality control and production management.

[0133] Please refer to again Figure 11 , in a specific implementation mode described in detail in this embodiment, the design of the chip shuttle device 7 fully demonstrates the concept of efficient and precise material transmission, and it makes an important contribution to the improvement of the overall performance of the three-temperature test and sorting machine.

[0134] The chip shuttle device 7 mainly consists of a third transfer mechanism 701 and a carrier 702. The close cooperation between the two realizes the efficient and stable transmission of the chip in the test process.

[0135] The carrier 702 is carefully arranged on the third transfer mechanism 701, and its design fully considers the placement requirements of the chip. The carrier 702 is provided with placement slots 703, which are specifically used for placing the chips, ensuring the stability and safety of the chips during transmission. The design of the placement slots 703 not only conforms to the size and shape of the chips but also takes into account the easy access and placement of the chips, facilitating subsequent test operations.

[0136] The third transfer mechanism 701 undertakes the important task of transporting the carrier 702 and the chips thereon into the test device 8 for testing. During the test, the third transfer mechanism 701 can accurately control the position and speed of the carrier 702 to ensure that the chips can accurately enter the test area of the test device 8. At the same time, after the test is completed, the third transfer mechanism 701 will also transport the carrier 702 and the chips thereon out of the test device 8 to prepare for subsequent chip processing or blanking.

[0137] Through the design of the chip shuttle device 7, the three-temperature test sorter in this embodiment realizes the efficient and precise transmission of chips in the test process. This design not only improves the test efficiency but also ensures the accuracy of test results, providing strong guarantee for chip production and quality control. At the same time, the flexibility and scalability of the chip shuttle device 7 also leave sufficient room for future upgrades and transformations of the equipment.

[0138] Please refer to Figure 12 , in a specific implementation manner elaborated in detail in this embodiment, the functional system of the three-temperature test sorter is further improved, and in particular, an induction device 13 is added to enhance the intelligent monitoring ability of the equipment in the chip test process.

[0139] The induction device 13 is carefully arranged on the workbench 1 and located within the test space. The selection of its position fully considers the coordination and connection with the third transfer mechanism 701 and the carrier 702. After the test process is completed, the third transfer mechanism 701 will transport the carrier 702 and the chips thereon to the induction device 13 for subsequent monitoring operations.

[0140] The main function of the induction device 13 is to monitor the state of the chips in the placement groove 703. Specifically, when there is no chip or the chip is placed obliquely in the placement groove 703, the induction device 13 can quickly and accurately send out induction signals. This design ensures the accurate placement and transmission of chips after the test process, avoiding abnormal blanking caused by chip loss or improper placement.

[0141] By adding the induction device 13, the three-temperature test sorter in this embodiment realizes the real-time monitoring and feedback of the chip state. Once the induction device 13 sends out an induction signal, the control system will immediately receive this information and take corresponding measures, such as stopping the operation of the equipment, sending out an alarm or prompting the operator to check, etc. This design not only improves the operation safety and reliability of the equipment but also reduces the errors and risks brought by manual operation.

[0142] In summary, the three-temperature test sorter in this embodiment realizes the intelligent monitoring and management of the chip state by introducing the induction device 13 and closely cooperating with the third transfer mechanism 701 and the carrier 702. This design not only improves the smoothness and efficiency of the test process but also provides strong technical support for chip quality control and production management.

[0143] Please refer to Figure 13 , in an implementation manner of this embodiment, the design of the test device 8 fully integrates the technical concepts of precision machinery and intelligent control, providing the three-temperature test sorter with efficient and accurate test capabilities.

[0144] The test device 8 mainly consists of three major parts: a lifting mechanism 801, a pneumatically-driven floating module 802, and a pressing head 803. The coordinated work among these three parts realizes the precise testing of the chip.

[0145] As one of the core components of the test device 8, the pressing head 803 is carefully arranged on the pneumatically-driven floating module 802. The design of the pressing head 803 is closely related to the structure and testing requirements of the chip. Its surface shape and material have been carefully selected and processed to ensure that when contacting the chip, it can evenly and stably transfer temperature, achieve temperature counteraction, thereby creating favorable conditions for the testing of the chip. After the pressing head 803 is in close contact with the chip, the test device 8 can accurately conduct various electrical performance tests on the chip, such as voltage, current, resistance, etc.

[0146] The pneumatically-driven floating module 802 undertakes the important task of supporting and adjusting the position of the pressing head 803. The pneumatically-driven floating module 802 is arranged on the lifting mechanism 801 and can move along the lifting direction under the drive of the lifting mechanism 801. This design enables the pneumatically-driven floating module 802 to flexibly adjust the insertion angle of the pressing head 803 according to the specific position of the chip, ensuring that the pressing head 803 can accurately contact the chip in the placement groove 703 and apply appropriate pressure, thereby improving the accuracy and stability of the test.

[0147] As the power source of the test device 8, the performance of the lifting mechanism 801 directly affects the smoothness and efficiency of the entire test process. The lifting mechanism 801 can accurately control the lifting speed and position of the pneumatically-driven floating module 802 and the pressing head 803 through precise transmission mechanisms and control systems, ensuring the precision and controllability of the test process.

[0148] Through the design of the test device 8, the three-temperature test and sorting machine in this embodiment realizes the precise testing and adjustment of the chip. The close contact between the pressing head 803 and the chip, the flexible adjustment of the pneumatically-driven floating module 802, and the precise control of the lifting mechanism 801 jointly ensure the accuracy and stability of the test process. This design not only improves the test efficiency but also ensures the reliability of the test results.

[0149] Although terms such as workbench and heat preservation cover are used more frequently in this application, the possibility of using other terms is not excluded. The use of these terms is only to more conveniently describe and explain the essence of the present invention; interpreting them as any additional limitation is contrary to the spirit of the present invention.

[0150] A three-temperature test and sorting machine provided by an embodiment of the present invention forms a test space by setting a heat preservation cover on a workbench. The heat preservation cover and the workbench can ensure the temperature consistency in the test space, enabling the chips to be evenly heated in the test space, realizing the automation of the three-temperature test of the chips. Moreover, a preheating device is added to pre-adjust the temperature of the chips, making the overall heating of the chips more uniform. At the same time, the waiting time is fully utilized for pre-temperature adjustment, saving the time required for testing. Therefore, not only can the accuracy of the chip test results and the stability of the test yield be guaranteed, but also the test efficiency is improved, which is conducive to large-scale popularization and application.

[0151] Finally, it should be noted that although the above embodiments have been described in the text of the specification and the drawings of the present application, the patent protection scope of the present application cannot be limited thereby. Any technical solutions obtained by equivalent structure or equivalent process substitution or modification based on the essential concept of the present application and using the content recorded in the text of the specification and the drawings of the present application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are all included in the patent protection scope of the present application.

Claims

1. A three-temperature test sorting machine, characterized in that: It comprises a workbench (1), a heat preservation cover (2), a loading device (3), a unloading device (4), a chip transport device (5), a preheating device (6), a chip shuttle device (7), a testing device (8) and a ventilation duct (9); wherein: The heat-insulating cover (2) is arranged on the workbench (1) and is used to form a test space with the workbench (1); The loading device (3), unloading device (4), chip transport device (5), preheating device (6), chip shuttle device (7), testing device (8) and ventilation duct (9) are respectively arranged on the workbench (1) and are located in the testing space; The ventilation pipe (9) is used to transport the refrigerant so that the refrigerant circulates in the test space; The loading device (3) is used to load a tray loaded with chips to be tested; The chip transport device (5) is used to transfer the chips in the loading tray to the preheating device (6); and to transfer the preheated chips from the preheating device (6) to the chip shuttle device (7); and to transfer the tested chips from the chip shuttle device (7) to the unloading device (4); The pre-temperature device (6) is used to pre-adjust the temperature of the chip located on the pre-temperature device (6) before testing; The chip shuttle device (7) is used to transport the chip to the testing device (8) for testing; and to transport the tested chip out of the testing device (8); The testing device (8) is used to further adjust the temperature of the chip and test the chip; The unloading device (4) is used to unload the tray loaded with tested chips.

2. The three-temperature test sorting machine according to claim 1, characterized in that: The feeding device (3) comprises a feeding module (301) and a grabbing and waiting module (302); The loading module (301) is used to store a plurality of trays loaded with chips to be tested, wherein the plurality of trays are stacked; and is used to provide the trays to the grabbing and waiting module (302); The grabbing and waiting module (302) is used to store the material tray provided by the loading module (301) to wait for the chip transport device (5) to transfer the chips in the material tray to the pre-temperature device (6).

3. The three-temperature test sorting machine according to claim 2, characterized in that: The loading module (301) comprises a first conveying mechanism (3011), a lifting mechanism (3012), a storage tank (3013) and a clamping mechanism (3014); The storage slot (3013) is used to store a plurality of stacked material trays; The lifting mechanism (3012) is located at the bottom of the storage tank (3013) and is used to pass through the storage tank (3013) to perform lifting and lowering movements so as to lift or lower the material tray in the storage tank (3013); The clamping mechanism (3014) is located on both sides of the storage groove (3013), and is used to extend when the lifting mechanism (3012) lifts the material tray in the storage groove (3013), so as to clamp the remaining material trays except the material tray at the bottom; The lifting mechanism (3012) is also used to lower the material tray at the bottom when the clamping mechanism (3014) clamps the remaining material trays except the material tray at the bottom, so as to place it on the first conveying mechanism (3011); The first conveying mechanism (3011) is used to convey the material tray placed thereon to the grabbing waiting module (302).

4. The three-temperature test sorting machine according to claim 1, characterized in that: The grabbing and waiting module (302) comprises a second conveying mechanism (3021), a blocking mechanism (3022), a side pushing mechanism (3023) and a positioning claw mechanism (3024); The second conveying mechanism (3021) is in communication with the first conveying mechanism (3011) and is used to continue conveying the material tray coming from the first conveying mechanism (3011); The blocking mechanism (3022) is arranged at the end of the second conveying mechanism (3021), and is used to block the second conveying mechanism (3021) from continuing to convey the material tray; The side push mechanism (3023) is arranged on one side of the second conveying mechanism (3021) and is used to push the material tray to move laterally from the side of the material tray so as to position the material tray in the lateral direction and wait for the chip transport device (5) to transfer the chips in the material tray to the pre-temperature device (6); The positioning claw mechanism (3024) is arranged on both sides of the second conveying mechanism (3021) and is used to press and hold the material tray positioned in the transverse direction.

5. The three-temperature test sorting machine according to claim 2, characterized in that: It also includes a tray handling device (10); The blanking device (4) comprises an OK blanking module (401) and an NG blanking module (402); The tray transport device (10) is arranged on the workbench (1) and is located in the test space. It can move in the grabbing and waiting module (302), the OK unloading module (401) and the NG unloading module (402), and is used to transfer the empty tray after the transferred chips from the grabbing and waiting module (302) to the OK unloading module (401) and the NG unloading module (402), and store them in the OK unloading module (401) and the NG unloading module (402) respectively; The OK unloading module (401) is used to unload the tray loaded with chips with OK test results; The NG unloading module (402) is used to unload the tray loaded with chips with NG test results.

6. The three-temperature test sorting machine according to claim 1, characterized in that: It also includes a code scanning device (11); The chip transport device (5) is also used to transfer the preheated chip to the code scanning device (11) during the process of transferring the preheated chip from the preheating device (6) to the chip shuttle device (7); The code scanning device (11) is arranged on the workbench (1) and is located in the test space, and is used for scanning the code on the chip.

7. The three-temperature test sorting machine according to claim 1, characterized in that: Also included is a camera device (12); The pre-heating device (6) comprises a pre-heating platform (601), and a plurality of pre-heating slots (602) for chips to be placed on the pre-heating platform (601); The camera device (12) is arranged on the chip transport device (5) and is used to assist the chip transport device (5) in placing the chip into the pre-temperature tank (602) through visual recognition technology.

8. The three-temperature test sorting machine according to claim 1, characterized in that: The chip shuttle device (7) comprises a third conveying mechanism (701) and a carrier (702); The carrier (702) is arranged on the third conveying mechanism (701) and is provided with a placement slot (703) for placing chips; The third conveying mechanism (701) is used to convey the carrier (702) and the chip thereon to the testing device (8) for testing; and to convey the carrier (702) and the chip thereon out of the testing device (8) after the test.

9. The three-temperature test sorting machine according to claim 8, characterized in that: Also included is a sensing device (13); The sensing device (13) is arranged on the workbench (1) and is located in the test space; The third conveying mechanism (701) is also used to convey the carrier (702) and the chip thereon to the sensing device (13) after testing; The sensing device (13) is used to send out a sensing signal when there is no chip in the placement groove (703) or the chip is placed crookedly.

10. The three-temperature test sorting machine according to claim 8, characterized in that: The testing device (8) comprises a lifting mechanism (801), an air-driven floating module (802) and a pressure head (803); The pressure head (803) is arranged on the air-driven floating module (802) and is used to contact the chip in the placement groove (703) and perform temperature compensation on the chip to facilitate testing of the chip; The air-driven floating module (802) is arranged on the lifting mechanism (801) and can move along the lifting direction under the drive of the lifting mechanism (801) to adjust the slot entry angle of the pressure head (803) so that the pressure head (803) can accurately contact the chip in the placement slot (703).

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