LCoS display panel, preparation method thereof and display device

Abstract

The invention provides an LCoS display panel, a preparation method thereof and a display device, and relates to the field of integrated circuits and the technical field of micro-display, and the method comprises the steps: forming a first gap particle array in a frame glue region reserved on a first substrate, forming a second gap particle array in a non-display region, and enabling the non-display region to be located between the frame glue region and a display region; frame glue is coated on the second substrate corresponding to the frame glue area, so that the second substrate and the first substrate are aligned and attached, and the frame glue covers the first gap particle array of the frame glue area; and curing the frame glue. According to the first gap particle array, the contact area of the frame glue and the first substrate is increased, the bonding strength and sealing performance of the frame glue and the first substrate are improved, and the problems of bonding strength reduction, even liquid leakage and the like caused by water vapor permeation are avoided; the second gap particle array can provide auxiliary support, the box thickness uniformity of the LCoS display panel is improved, the problem that the box thickness is not uniform due to center collapse of the LCoS display panel is solved, and the overall performance quality of the LCoS display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of integrated circuits and microdisplay technology, and in particular to an LCoS display panel and a preparation method thereof, and a display device. Background Art

[0002] Liquid crystal on silicon (LCoS) microdisplay technology is a reflective display technology with the characteristics of high integration, high resolution, and high device aperture ratio. It is widely used in display fields such as holographic display, AR / VR, projection, quantum computing, head-up display (HUD), and laser printing.

[0003] At present, the LCoS display panel box packaging process technology in the industry usually adopts the following method to manufacture LCoS display panel products: by applying frame glue (silicon balls of a certain size are dispersed in the frame glue) around the chip substrate to connect the wafer and the ITO substrate to seal it into a box. This structure has average strength and support capacity. The thickness uniformity of the LCoS display panel box is poor. In high temperature and high humidity environments, especially in 85℃ / 85%RH environments, water vapor infiltration is prone to occur, which leads to a decrease in bonding strength. After a long time, leakage and other problems will occur, affecting product performance and quality. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide an LCoS display panel and a method for manufacturing the same, and a display device, which can improve the bonding strength and cell thickness uniformity.

[0005] In one aspect of an embodiment of the present application, a method for preparing an LCoS display panel is provided, comprising forming a first gap particle array in a frame glue area reserved on a first substrate, and forming a second gap particle array in a non-display area, wherein the non-display area is located between the frame glue area and the display area;

[0006] Applying sealant on the second substrate corresponding to the sealant area, so that the second substrate is aligned and attached to the first substrate, and the sealant covers the first gap particle array in the sealant area;

[0007] The frame glue is cured.

[0008] Optionally, the first gap particle array is formed in the frame glue area reserved on the first substrate, and the second gap particle array is formed in the non-display area, and the non-display area is located between the frame glue area and the display area, including:

[0009] The diameter of the first gap particles is 10um to 100um, the spacing between adjacent first gap particles in the array is 30um to 150um, and the height of the first gap particles is 0.5um to 1.0um smaller than the distance between the first substrate and the second substrate;

[0010] The diameter of the second gap particles is 8um to 30um, the spacing distance between adjacent second gap particles in the array is 30um to 150um, and the height of the second gap particles is substantially equal to the distance between the first substrate and the second substrate.

[0011] Optionally, the first gap particle array is formed in the frame glue area reserved on the first substrate, and the second gap particle array is formed in the non-display area, and the non-display area is located between the frame glue area and the display area, including:

[0012] The sealant area is disposed around the edge of the first substrate to form a closed area;

[0013] Alternatively, the sealant area is disposed around the edge of the first substrate and is reserved with an opening to form a semi-enclosed area with the opening.

[0014] Optionally, the step of applying sealant on the second substrate corresponding to the sealant area so that the second substrate is aligned and attached to the first substrate, and the sealant covers the first gap particle array in the sealant area, comprises:

[0015] Mix the silicon balls and resin frame glue and load them into the glue coating machine;

[0016] Applying sealant to the sealant area corresponding to the second substrate by the sealant coating machine;

[0017] The second substrate is aligned and bonded to the first substrate, the frame glue covers the first gap particle array, and the second gap particle array is located in the non-display area.

[0018] Optionally, the mixing of the silicon balls and the resin frame glue and loading the mixture into a glue coating machine comprises:

[0019] The diameter of the silicon ball is 0.5um to 10um.

[0020] In another aspect of an embodiment of the present application, an LCoS display panel is provided, which is prepared according to the above-mentioned method for preparing the LCoS display panel, and includes: a first substrate and a second substrate, a frame glue area, a display area and a non-display area between the frame glue area and the display area are formed between the first substrate and the second substrate, a first gap particle array is formed in the frame glue area, and a second gap particle array is formed in the non-display area.

[0021] Optionally, the first gap particles and the second gap particles form an inverted cone along the direction from the first substrate to the second substrate, the large end diameter of the first gap particles on the first substrate is 10um to 100um, and the large end diameter of the second gap particles on the first substrate is 8um to 30um.

[0022] Optionally, the first interstitial particles and the second interstitial particles are both made of transparent photosensitive resin.

[0023] Optionally, regularly arranged liquid crystals are formed in the display area, and the liquid crystals include negative liquid crystals or positive liquid crystals.

[0024] An embodiment of the present application further provides a display device, comprising the above-mentioned LCoS display panel.

[0025] The preparation method and display device of the LCOS display panel provided in the embodiments of the present application can increase the contact area of ​​the frame glue in the frame glue area with the first substrate through the first gap particle array, thereby improving the bonding strength and sealing between the frame glue and the first substrate, and avoiding problems such as reduced bonding strength or even leakage caused by water vapor infiltration; the second gap particle array can provide auxiliary support, thereby improving the uniformity of the cell thickness of the LCoS display panel, solving the problem of uneven cell thickness caused by the center collapse of the LCoS display panel, and improving the overall performance quality of the LCoS display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 This is a top view of the LCoS display panel after traditional bonding;

[0028] Figure 2 This is a cross-sectional structural diagram of the LCoS display panel after conventional bonding;

[0029] Figure 3 is a top view of the LCoS display panel provided by an embodiment of the present application after drip filling and packaging;

[0030] Figure 4 is a top view of the LCoS display panel after die-casting and packaging provided by an embodiment of the present application;

[0031] Figure 5 is a cross-sectional structural diagram of the LCoS display panel after packaging provided by an embodiment of the present application;

[0032] Figure 6 is a top view of the first substrate of the LCoS display panel after photolithography provided by an embodiment of the present application;

[0033] Figure 7 It is a cross-sectional structural diagram of the first substrate of the LCoS display panel after photolithography provided in an embodiment of the present application.

[0034] Icon: 01-first substrate; 011-first gap particle array; 012-second gap particle array; 012A-non-display area; 02-liquid crystal; 021-frame glue; 021A-frame glue area; 022-silicon ball; 03-second substrate; 04-display area. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0036] In the description of this application, it should be noted that the terms "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0037] It should also be noted that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0038] The traditional LCoS display panel packaging box making process includes the following steps:

[0039] Step 1: Fully mix the silicon balls 022 of the required particle size and the resin frame glue 021 and load them into the glue coating machine;

[0040] Step 2: Figure 1 The second substrate 03 is coated with a sealant 021, and then aligned and bonded to the ITO first substrate 01;

[0041] Step 3: According to the type of sealant 021, you can choose high temperature curing process or UV curing process for curing;

[0042] The traditional solution is to seal the second substrate 03 and the ITO first substrate 01 by mixing the sealant 021 and the silicon balls 022 of different particle sizes. Figure 2 This is a cross-sectional structural diagram of the LCOS display panel after the traditional structure is bonded. The display area 04 can generally be provided with liquid crystal 02 to realize liquid crystal 02 display. The support capacity and bonding strength provided by this structure are average. The thickness uniformity of the prepared LCoS chip box is poor. It cannot effectively prevent water vapor from penetrating in a high temperature environment or a high temperature and high humidity environment, which is easy to cause bonding degradation and thus lead to major defects such as liquid crystal 02 leakage.

[0043] In view of this, to solve the above problems, please refer to Figure 3 As shown, an embodiment of the present application provides an LCOS display panel, including: a first substrate 01 and a second substrate 03, a frame glue area 021A, a display area 04, and a non-display area 012A between the frame glue area 021A and the display area 04 are formed between the first substrate 01 and the second substrate 03, the frame glue area 021A is located outside the display area 04, a first gap particle array 011 is formed in the frame glue area 021A, and a second gap particle array 012 is formed in the non-display area 012A between the frame glue area 021A and the display area 04.

[0044] The first substrate 01 and the second substrate 03 are arranged opposite to each other. For example, the first substrate 01 is an ITO (indium tin oxide) substrate, and the second substrate 03 is a wafer substrate; the frame glue area 021A, the display area 04 and the non-display area 012A are all located between the first substrate 01 and the second substrate 03, the display area 04 is located in the middle area of ​​the first substrate 01, the frame glue area 021A is arranged along the four edges of the first substrate 01 and surrounds the display area 04, and the non-display area 012A is located between the frame glue area 021A and the display area 04.

[0045] A first gap particle array 011 composed of a plurality of first gap particles is formed in the frame glue area 021A, and a second gap particle array 012 composed of a plurality of second gap particles is formed in the non-display area 012A. Both the first gap particles and the second gap particles are arranged on the first substrate 01. The first gap particle array 011 can increase the contact area between the frame glue 021 in the frame glue area 021A and the first substrate 01, thereby improving the bonding strength and sealing between the frame glue 021 and the first substrate 01, and avoiding problems such as reduced bonding strength or even leakage caused by water vapor infiltration; the second gap particle array 012 can provide auxiliary support, thereby improving the uniformity of the cell thickness of the LCoS display panel, solving the problem of uneven cell thickness caused by the center collapse of the LCoS display panel, and improving the overall performance quality of the LCoS display panel.

[0046] Specifically, in some embodiments, Figure 3As shown, the frame glue area 021A is arranged around the edge of the first substrate 01 to form a closed four-frame area, and the display area 04 is wrapped therein.

[0047] In other embodiments, Figure 4 As shown, the sealant area 021A is disposed around the edge of the first substrate 01 and has an opening reserved therein to form a semi-enclosed area with an opening, and the display area 04 is enclosed therein.

[0048] It should be noted that the opening area is not provided with the first interstitial particles and the second interstitial particles.

[0049] Furthermore, if Figure 5 As shown, the first gap particles (first gap particle array 011) and the second gap particles (second gap particle array 012) form an inverted frustum along the direction from the first substrate 01 to the second substrate 03, and the large end diameter of the first gap particles on the first substrate 01 is 10um~100um, and the large end diameter of the second gap particles on the first substrate 01 is 8um~30um.

[0050] Both interstitial particles are of truncated cone structure. Their positions on the first substrate 01 are the large ends of the truncated cones, and the small ends of the truncated cones extend toward the second substrate 03 . The second interstitial particles (second interstitial particle array 012 ) are close to the second substrate 03 .

[0051] The materials of the first gap particles and the second gap particles are both transparent photosensitive resin, which is a high-precision photosensitive material, so that the adhesion between the first substrate 01 and the frame glue 021 is stronger after curing.

[0052] In addition, the display area 04 is formed with regularly arranged liquid crystals 02. Figure 5 The horizontal and vertical arrays shown are used to form a liquid crystal 02 display in the display area 04 .

[0053] Among them, the liquid crystal 02 can be a negative liquid crystal or a positive liquid crystal, and can be applicable to a negative VA display mode, or a positive TN display mode, ECB mode, or OCB mode.

[0054] Based on this, an embodiment of the present application further provides a display device, including the above-mentioned LCOS display panel. For example, the display device can be a television, a mobile phone, a tablet computer, etc.

[0055] On the other hand, an embodiment of the present application provides a method for preparing an LCOS display panel, which is used to prepare the above-mentioned LCOS display panel, and the method includes:

[0056] Step 100 : forming a first gap particle array 011 in the glue area 021A reserved on the first substrate 01 , and forming a second gap particle array 012 in the non-display area 012A between the glue area 021A and the display area 04 .

[0057] A first gap particle array 011 and a second gap particle array 012 are formed on the first substrate 01 , wherein the first gap particle array 011 is located in the frame glue area 021A, and the second gap particle array 012 is located in the non-display area 012A between the frame glue area 021A and the display area 04 .

[0058] During preparation, the first gap particle array 011 and the second gap particle array 012 can be formed on the first substrate 01 by a half tone mask (HTM) photolithography process to obtain an array.

[0059] Generally, the opening shape of the mask used for photolithography can be circular, elliptical, prismatic, square, etc., and the gap particle array produced can be formed into a circular, elliptical, long strip, etc. shape when viewed from above according to the mask opening, mainly to increase the contact area with the frame glue 021 and provide support for the LCoS display panel.

[0060] Furthermore, the sizes of the first gap particles and the second gap particles are different, and gap particles of different sizes and shapes are produced by optimizing mask opening design, wet film thickness, exposure process parameters, etc.

[0061] In the present application, the diameter of the first interstitial particle ( Figure 5 The diameter of the large end of the middle cone is 10um to 100um, the spacing distance between adjacent first gap particles in the array is 30um to 150um, and the height of the first gap particles ( Figure 5 The dimension in the vertical direction) is 0.5um to 1.0um smaller than the distance between the first substrate 01 and the second substrate 03.

[0062] The diameter of the second gap particles is 8 um to 30 um, the spacing distance between adjacent second gap particles in the array is 30 um to 150 um, and the height of the second gap particles is substantially equal to the distance between the first substrate 01 and the second substrate 03 .

[0063] The height of the first gap particles and the second gap particles is specifically manufactured according to the box thickness, and is generally 1 um to 12 um.

[0064] In particular, in some embodiments, the diameter of the first gap particles is 10um~20um, and the spacing distance between adjacent first gap particles in the array is 30um~50um; and the diameter of the second gap particles is 8um~15um, and the spacing distance between adjacent second gap particles in the array is 30um~50um, which needs to be considered according to factors such as box thickness.

[0065] The second gap particles serve as auxiliary supports between the first substrate 01 and the second substrate 03. Since the height of the second gap particles is equivalent to the distance between the first substrate 01 and the second substrate 03, the second gap particles can be well supported between the first substrate 01 and the second substrate 03, thereby preventing the center of the LCoS display panel from collapsing and causing uneven cell thickness.

[0066] The first gap particle array 011 can increase the contact area between the sealant 021 and the first substrate 01 and improve the adhesion between the two; the second gap particle array 012 in the non-display area 012A outside the display area 04 can provide auxiliary support and improve the uniformity of the cell thickness of the LCoS display panel.

[0067] Step 110: Apply sealant 021 on the second substrate 03 corresponding to the sealant area 021A, so that the second substrate 03 and the first substrate 01 are aligned and bonded, and the sealant 021 covers the first gap particle array 011 in the sealant area 021A.

[0068] The silicon balls 022 of the required particle size and the resin frame glue 021 are fully mixed and loaded into the glue coating machine; for example, the diameter of the silicon balls 022 is 0.5um to 10um, which is selected according to the box thickness. The frame glue 021 is then applied to the position corresponding to the frame glue area 021A on the second substrate 03 by the glue coating machine; then the second substrate 03 is aligned and bonded with the first substrate 01, and the frame glue 021 covers the first gap particle array 011, increasing the contact area between the frame glue 021 and the first substrate 01 and improving the bonding strength; the second gap particle array 012 is located in the non-display area 012A, and the frame glue 021 does not cover the second gap particles. The second gap particles play the role of auxiliary support to maintain the uniformity of the box thickness.

[0069] Step 120: Curing the sealant 021. Specifically, a thermal curing process or a UV curing process is selected according to the type of the sealant 021 to cure the sealant 021.

[0070] The LCoS display panel prepared as above can be in VA mode, TN mode, ECB mode or OCB mode.

[0071] In addition, when forming a liquid crystal 02 display, its packaging process can be a drop filling (One drop fill, ODF), specifically, after coating the frame glue 021 on the second substrate 03, the liquid crystal 02 is dripped; it can also be a pouring process, after the frame glue 021 is cured, the liquid crystal 02 is poured into the display area 04. There are differences in the manufacturing structure. It is only necessary to consider that the reserved opening area in the pouring packaging process does not produce gap particles. Figure 4 shown.

[0072] The following is explained by two embodiments:

[0073] In the first embodiment, referring to Figure 3 and Figure 5 As shown, it is suitable for a one drop fill (ODF) process LCoS display panel. The LCoS display panel comprises a first substrate 01, a first gap particle array 011, a second gap particle array 012, a second substrate 03, a liquid crystal 02 between the first substrate 01 and the second substrate 03, a sealant 021 and a silicon ball 022, wherein the first substrate 01 is an ITO substrate conforming to a conventional reflective VA display mode, and the first gap particle array 011 and the second gap particle array 012 are arranged on the first substrate 01, as shown in FIG. Figure 7 As shown. The second substrate 03 is an ITO substrate that complies with the conventional reflective VA display mode, and the liquid crystal 02 is a negative liquid crystal. Among them, the LCoS display panel is suitable for the VA display mode, and the liquid crystal 02 is arranged vertically. The preparation method thereof includes the following steps:

[0074] Step 1: Form a first gap particle array 011 in the frame glue area 021A of the first substrate 01 and a second gap particle array 012 in the non-display area 012A outside the display area 04 by HTM photolithography process. Figure 6 and Figure 7 As shown, the diameter of the first gap particles in the frame glue area 021A is generally 10um~100um, the interval is 30um~150um, and the height is less than the box thickness of the LCoS display panel 0.5um~1.0um; the diameter of the second gap particle array 012 in the non-display area 012A is 8um~30um, the interval is 30um~150um, and the height is equivalent to the box thickness of the LCoS display panel.

[0075] Step 2: Fully mix the silicon balls 022 of the required particle size and the resin frame glue 021 and load them into the glue coating machine.

[0076] Step 3: After applying sealant 021 on the second substrate 03, drip liquid crystal 02, and then align and bond it with the first substrate 01. The sealant 021 covers the first gap particle array 011 to increase the contact area between the sealant 021 and the first substrate 01 and improve the bonding strength; the uncovered second gap particle array 012 serves as auxiliary support to maintain the uniformity of the box thickness.

[0077] Step 4: Select thermal curing process or UV curing process for curing according to the type of frame glue 021.

[0078] In Example 2, referring to Figure 4 and Figure 5 As shown, it is suitable for the die casting packaging process. The LCoS display panel comprises a first substrate 01, a first gap particle array 011, a second gap particle array 012012, a second substrate 03, a liquid crystal 02 between the first substrate 01 and the second substrate 03, a sealant 021 and a silicon ball 022; wherein the first substrate 01 is an ITO substrate conforming to a conventional reflective VA display mode, and the first gap particle array 011 and the second gap particle array 012 are arranged on the first substrate 01.

[0079] Different from the first embodiment, the second embodiment is different in that an opening area is reserved and no gap particles are made in the opening area; the second substrate 03 is an ITO substrate that conforms to the conventional reflective VA display mode, and the 02 liquid crystal 02 is a negative liquid crystal 02, wherein the LCOS display panel is suitable for the VA display mode, and the liquid crystal 02 is arranged vertically. The manufacturing method comprises the following steps:

[0080] Step 1: Form a first gap particle array 011 in the frame glue area 021A of the first substrate 01 and a second gap particle array 012 in the non-display area 012A outside the display area 04 by HTM photolithography process. Figure 6 and Figure 7 As shown, the diameter of the first gap particle array 011 in the frame glue area 021A is generally 10um~100um, the interval is 30um~150um, and the height is less than the LCoS display panel box thickness of 0.5um~1.0um; the diameter of the second gap particle array 012 in the non-display area 012A is 8um~30um, the interval is 30um~150um, and the height is equivalent to the LCoS display panel box thickness.

[0081] Step 2: Fully mix the silicon balls 022 of the required particle size and the resin frame glue and load them into the glue coating machine.

[0082] Step 3: Apply sealant 021 on the second substrate 03, and then align and fit it with the first substrate 01. The sealant 021 covers the first gap particle array 011, increasing the contact area between the sealant 021 and the first substrate 01 and improving the bonding strength between the two. The uncovered second gap particle array 012 plays an auxiliary supporting role, which can effectively maintain the uniformity of the box thickness.

[0083] Step 4: Select a thermal curing process or a UV curing process according to the type of the frame glue 021 to cure it, and then inject the liquid crystal 02 into the display area 04 through the capillary effect.

[0084] In summary, the method for preparing the LCoS display panel provided in the embodiment of the present application uses the HTM photolithography process to produce a first gap particle array 011 in the frame glue area 021A of the first substrate 01 and a second gap particle array 012 in the non-display area 012A outside the display area 04. The first gap particle array 011 enhances the contact area of ​​the frame glue 021 with the first substrate 01 and improves the bonding strength between the frame glue 021 and the first substrate 01; the second gap particle array 012 provides auxiliary support capability and improves the uniformity of the box thickness of the LCoS display panel.

[0085] The method for preparing the LCoS display panel includes the same structure and beneficial effects as the method for preparing the LCoS display panel in the aforementioned embodiment. The structure and beneficial effects of the method for preparing the LCoS display panel have been described in detail in the aforementioned embodiment and will not be repeated here.

[0086] The above description is only an embodiment of the present application and is not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for preparing an LCoS display panel, characterized in that: The method comprises: A first gap particle array is formed in a frame glue area reserved on the first substrate, and a second gap particle array is formed in a non-display area, wherein the non-display area is located between the frame glue area and the display area; Applying sealant on the second substrate corresponding to the sealant area, so that the second substrate is aligned and attached to the first substrate, and the sealant covers the first gap particle array in the sealant area; The frame glue is cured.

2. The method for preparing an LCoS display panel according to claim 1, characterized in that: The first gap particle array is formed in the frame glue area reserved on the first substrate, and the second gap particle array is formed in the non-display area, and the non-display area is located between the frame glue area and the display area, comprising: The diameter of the first gap particles is 10um to 100um, the spacing between adjacent first gap particles in the array is 30um to 150um, and the height of the first gap particles is 0.5um to 1.0um smaller than the distance between the first substrate and the second substrate; The diameter of the second gap particles is 8um to 30um, the spacing distance between adjacent second gap particles in the array is 30um to 150um, and the height of the second gap particles is substantially equal to the distance between the first substrate and the second substrate.

3. The method for preparing an LCoS display panel according to claim 1 or 2, characterized in that: The first gap particle array is formed in the frame glue area reserved on the first substrate, and the second gap particle array is formed in the non-display area, and the non-display area is located between the frame glue area and the display area, comprising: The sealant area is disposed around the edge of the first substrate to form a closed area; Alternatively, the sealant area is disposed around the edge of the first substrate and is reserved with an opening to form a semi-enclosed area with the opening.

4. The method for preparing an LCoS display panel according to claim 3, characterized in that: The step of applying sealant on the second substrate corresponding to the sealant area so that the second substrate is aligned and bonded to the first substrate, and the sealant covers the first gap particle array in the sealant area, comprises: Mix the silicon balls and resin frame glue and load them into the glue coating machine; Applying sealant to the sealant area corresponding to the second substrate by the sealant coating machine; The second substrate is aligned and bonded to the first substrate, the frame glue covers the first gap particle array, and the second gap particle array is located in the non-display area.

5. The method for preparing an LCoS display panel according to claim 4, characterized in that: The mixing of the silicon balls and the resin frame glue and loading them into the glue coating machine comprises: The diameter of the silicon ball is 0.5um to 10um.

6. An LCoS display panel, prepared according to the method for preparing an LCoS display panel according to any one of claims 1 to 5, characterized in that: It comprises a first substrate and a second substrate, wherein a frame glue area, a display area and a non-display area between the frame glue area and the display area are formed between the first substrate and the second substrate, a first gap particle array is formed in the frame glue area, and a second gap particle array is formed in the non-display area.

7. The LCoS display panel according to claim 6, characterized in that: The first interstitial particles and the second interstitial particles form an inverted frustum along the first substrate toward the second substrate. The large end diameter of the first interstitial particles on the first substrate is 10um-100um, and the large end diameter of the second interstitial particles on the first substrate is 8um-30um.

8. The LCoS display panel according to claim 6, characterized in that: The materials of the first interstitial particles and the second interstitial particles are both transparent photosensitive resin.

9. The LCoS display panel according to claim 6, characterized in that: Regularly arranged liquid crystals are formed in the display area, and the liquid crystals include positive liquid crystals or negative liquid crystals.

10. A display device, characterized in that: An LCoS display panel comprising any one of claims 1 to 8.

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