Chip assembly, assembly and process cartridge assembly

Abstract

The invention provides a chip assembly, an assembly and a process cartridge assembly, the chip assembly can be detachably mounted to a carrier provided with a magnetic conductor, the chip assembly comprises a chip for storing parameter information, the chip comprises a substrate and at least one electric contact part, and the electric contact part is arranged on the substrate; the electric contact part is used for forming electric contact / electric connection with electrodes except for the chip assembly, so that parameter information stored in the chip is acquired, and the chip assembly is mounted in the bearing part through the magnetic force effect between the chip assembly and the magnetic conductor in the bearing part; a first accessory of which at least one part is arranged to be a magnetic part or can be magnetized by the magnetic part is also arranged in the chip assembly; or in a combination comprising the second accessory and the chip assembly, the second accessory is arranged to be a magnetic conductor, so that the chip assembly is more rapid and convenient to mount and dismount, and does not interfere with other parts of the imaging equipment.

Description

Technical Field

[0001] The present invention relates to the field of electronic photographic imaging, and in particular to a chip assembly detachably mounted in an electronic photographic imaging device, a combination having the chip assembly, a processing box assembly having the chip assembly, and a processing box assembly having the combination. Background Art

[0002] The processing box can be installed to the imaging device in a detachable manner, and the processing box includes at least the developing box among the developing box and the drum box, and the developing box includes a developing roller rotatably arranged therein; the drum box includes a photosensitive drum rotatably arranged therein; the developing roller is used to supply the developer in the developing box to the photosensitive drum.

[0003] A chip assembly is also provided in the developing box, and the chip assembly at least includes a chip for storing parameter information of the developing box, and the developing box establishes a communication connection with the imaging device through the chip.

[0004] The first and second imaging devices are both provided with an electrode accommodating cavity for accommodating an electrode, and the electrode accommodating cavity is formed in a groove shape. When the chip assembly is fixed relative to the box body of the developer box, the contact between the chip and the electrode will become unstable, and the imaging device will report an error. At the same time, the electrical contact part of the chip may be squeezed and damaged by the inner wall of the imaging device. For this reason, there is a solution to independently set the chip assembly, and the chip assembly is installed to the imaging device by means of clipping and bonding.

[0005] In the first imaging device, a side wall is also provided for directly or indirectly guiding the installation of the processing box / developing box; along the installation direction of the processing box / developing box, the processing box / developing box first passes through the side wall and then reaches the position where the electrode is located.

[0006] In the second imaging device, in order to ensure the imaging quality, the surface of the photosensitive drum needs to be cleaned when the imaging device is not imaging. The specific form of this is to force at least one of the developing box and the drum box to move, or in other words, to force the developing box and the drum box to separate from each other, so that the developing roller and the photosensitive drum change from a state of being close to each other to a state of being separated from each other.

[0007] However, the existing chip assembly installation method has the following defects:

[0008] First, this installation method has high requirements on the size of the operable space. For imaging devices, since the operable space therein is small, it is not easy to install the chip to the predetermined position of the imaging device.

[0009] Secondly, after the chip is installed, as the processing box is used for a longer time, the chip is prone to fall off and become loosely combined with the imaging device;

[0010] Thirdly, when the chip assembly is installed by gluing, when the process box is replaced, residues such as adhesives will exist in the imaging device, and these residues are not easy to remove and will affect the installation of the new chip assembly.

[0011] Fourthly, when the chip assembly is installed by snap-fitting, since the chip needs to be installed inside the imaging device, during the disassembly of the chip assembly, the user cannot observe the snap-fitting position, so it is not easy to release the snap-fitting of the chip. Summary of the invention

[0012] The chip assembly, assembly and processing box assembly provided by the present invention can at least solve one of the above technical problems.

[0013] A chip assembly is detachably mounted on a carrier provided with a magnetic conductor. The chip assembly includes a chip for storing parameter information. The chip includes a substrate and at least one electrical contact portion, and the electrical contact portion is arranged on the substrate. The electrical contact portion is used to form an electrical contact / electrical connection with an electrode outside the chip assembly, so that the parameter information stored in the chip can be obtained. The chip assembly is installed in the carrier through the magnetic force between the chip assembly and the magnetic conductor in the carrier.

[0014] The chip assembly also includes a first accessory at least part of which is configured as a magnetic conductor. The chip is mounted on the carrier through the magnetic force between the first accessory and the magnetic conductor in the carrier.

[0015] The substrate of the chip is magnetic, and the chip is directly mounted on the carrier through the magnetic force between the substrate and the magnetic conductor in the carrier; along the thickness direction of the substrate, the outer contour of the first accessory does not exceed the projection of the substrate.

[0016] The first accessory includes a first accessory body and a protrusion located on the first accessory body, wherein the protrusion direction is parallel to the direction of the electrical contact portion, the protrusion is configured as a magnetic part, and the chip assembly is mounted to the carrier through the magnetic force between the protrusion and the magnetic conductor in the carrier.

[0017] The combination includes a second accessory and the chip assembly described in any one of claims 1 to 5, at least a portion of the second accessory is configured as a magnetic conductor, and the chip assembly is mounted to the carrier through the magnetic force between the second accessory and the magnetic conductor in the carrier; the second accessory includes at least a magnetic fixing portion, and the fixing portion is used to directly or indirectly fix the chip to the second accessory.

[0018] The assembly also includes an anti-error portion arranged in at least one of the substrate, the first accessory and the second accessory, the anti-error portion is used to match the corresponding position in the carrier to prevent the chip from being in the wrong installation position in the carrier or the chip from being inverted.

[0019] A processing box assembly includes a processing box and a chip assembly, the processing box includes at least one of a developing box and a drum box, and the processing box is detachably mounted to a carrier; the developing box includes a developing box shell for accommodating a developer and a developing roller rotatably arranged in the developing box shell; the drum box includes a drum shell and a photosensitive drum rotatably arranged in the drum shell, and the developing roller is used to supply the developer to the photosensitive drum; the chip assembly is used to store parameter information of the processing box, and through the chip assembly, the processing box can establish a communication connection with the carrier.

[0020] A processing box assembly includes a processing box and a combination, the processing box includes at least one of a developing box and a drum box, and the processing box is detachably mounted on a carrier; the developing box includes a developing box shell for accommodating a developer and a developing roller rotatably arranged in the developing box shell; the drum box includes a drum shell and a photosensitive drum rotatably arranged in the drum shell, and the developing roller is used to supply the developer to the photosensitive drum; the combination is detachably mounted on the carrier, and the chip assembly is used to store parameter information of the processing box, and through the chip assembly, the processing box can establish a communication connection with the carrier.

[0021] In the chip assembly, assembly and box assembly provided by the present invention, the chip assembly is directly or indirectly installed in the imaging device through the action of magnetic force. Specifically, the chip assembly is also provided with a first accessory at least a portion of which is configured as a magnetic part or can be magnetized by a magnetic part; or, in the assembly including the second accessory and the chip assembly, the second accessory is configured as a magnetic conductor. This makes the installation and removal of the chip assembly faster and more convenient, and at the same time will not interfere with other components of the imaging device, and will not leave residues in the imaging device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a perspective view of a process cartridge according to the present invention.

[0023] Figure 2 It is a stereoscopic view of a process box involved in the present invention combined with an electrode mounting portion in an imaging device.

[0024] Figure 3A It is a three-dimensional diagram of the chip assembly involved in the first embodiment of the present invention.

[0025] Figure 3B This is an exploded view of the chip assembly involved in the first embodiment of the present invention after the first accessory and the chip are separated from each other.

[0026] Figure 4 It is a three-dimensional view of an electrode assembly suitable for the chip assembly according to the present invention.

[0027] Figure 5A It is a perspective view of a first imaging device according to the present invention.

[0028] Figure 5B It is a perspective view of a second imaging device according to the present invention.

[0029] Figure 6 , Figure 7 and Figure 8 It is a three-dimensional diagram of another first accessory combined with a chip in the chip assembly involved in the first embodiment of the present invention.

[0030] Fig.9A and 9B It is a three-dimensional diagram of the second accessory in the chip assembly involved in the second embodiment of the present invention.

[0031] Fig.10 It is an exploded view showing some components of the chip assembly involved in the second embodiment of the present invention and the electrode mounting portion separated from each other.

[0032] Fig.11 This is a state diagram after the chip assembly and the processing box involved in the second embodiment of the present invention are installed in the imaging device.

[0033] Fig. 12A and 12B It is a stereoscopic diagram of a first deformation mode of the second accessory involved in the second embodiment of the present invention.

[0034] Fig.13 It is a stereoscopic diagram of a second deformation mode of the second accessory involved in the second embodiment of the present invention. DETAILED DESCRIPTION

[0035] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0036] like Figure 1 and Figure 2 As shown, the processing box 100 includes at least one of a developer box 10 and a drum box 20, the developer box 10 includes a developer box housing 11 and a developer roller 12 rotatably arranged in the developer box housing 11, and the developer roller 12 rotates around a rotation axis M; the drum box 20 includes a drum housing 21 and a photosensitive drum rotatably arranged in the drum housing 21, and the photosensitive drum rotates around a rotation axis parallel to the rotation axis M; the surface of the photosensitive drum is used to form an electrostatic latent image, and the developer roller 11 is used to supply a developer to the photosensitive drum so that the electrostatic latent image on the surface of the photosensitive drum is developed.

[0037] The present invention also provides a chip assembly 200 independent of the process box 100. The chip assembly 200 and the process box 100 can be separately and detachably installed in the imaging device. The whole formed by the combination of the process box 100 and the chip assembly 200 can be called a process box assembly. The imaging device and the process box 100 establish a communication connection through the chip assembly 200. Figure 3A and Figure 3BAs shown, the chip assembly 200 at least includes a chip 270 for storing parameter information. Optionally, the chip 270 stores parameter information of the processing box 100. The chip 270 includes a substrate 220 and at least one electrical contact portion 221. Optionally, the electrical contact portion 221 is arranged on the substrate 220, and the electrical contact portion 221 is used to form an electrical contact / electrical connection with an electrode 91 outside the chip assembly 200, so that the parameter information stored in the chip 270 is obtained, for example: the electrical contact portion 221 can be used to form an electrical contact with an electrode 91 set in the imaging device.

[0038] For the convenience of the following description, the direction parallel to the direction extending from the rotation axis M is defined as the first direction / left-right direction, the direction intersecting the first direction is defined as the second direction / front-back direction, along the second direction, the developing roller 12 is located in front of the developing housing 11, the direction intersecting both the first direction and the second direction is defined as the third direction, and the electrical contact portion 221 is facing the third direction; preferably, the first direction, the second direction and the third direction are perpendicular to each other.

[0039] like Figure 4 As shown, the imaging device has an electrode assembly for forming an electrical contact with the chip assembly 200, the electrode assembly includes an electrode 91 and an electrode mounting portion 90, the electrode 91 is arranged in the electrode mounting portion 90, and the electrode 91 is used to form an electrical contact / electrical connection with the electrical contact portion 221; the electrode mounting portion 90 is provided with a mounting groove 92 and a second side wall 94 adjacent to the mounting groove 92, optionally, the electrode mounting portion 90 is also provided with an electrode accommodating cavity 95 for accommodating the electrode 91, the electrode accommodating cavity 95 is arranged to be recessed relative to the second side wall 94 to form a groove, preferably, the electrode 91 is completely accommodated in the electrode accommodating cavity 95; the imaging device is also provided with a magnetic conductor (for example: iron) around the electrode 91.

[0040] In some embodiments, the electrode mounting portion 90 is further provided with another side wall adjacent to the mounting groove 92 , namely, a first side wall 93 , and the electrode accommodating cavity 95 may also be provided as a groove located on the first side wall 93 .

[0041] The chip assembly 200 of the present invention is at least applicable to the first imaging device 410 and the second imaging device 420 described in the background art. Figure 5A As shown, in the first imaging device 410, the processing box 100 is installed along the second direction, the second side wall 94 is located above the installation direction, and the electrode accommodating cavity 95 is recessed relative to the second side wall 94 to form a groove. Optionally, at least one inclined surface 941 is provided on the second side wall 94. In this case, the surface of the second side wall 94 is not smooth. In other embodiments, the second side wall 94 may not be provided with an inclined surface. In this case, the surface of the second side wall 94 is smooth.

[0042] Furthermore, the first imaging device 410 is also provided with an abutment member 96 for squeezing the chip assembly 200. During the installation process of the processing box 100, the abutment member 96 abuts against the chip assembly 200, so that the chip assembly 200 has a tendency to move upward in the installation direction; after the processing box 100 is installed to the predetermined position, the abutment member 96 still abuts against the chip assembly 200, so that the electrical contact portion 221 always maintains electrical contact with the electrode 91; optionally, the abutment member 96 is arranged to be irregular, that is, at least one inclined surface is also arranged on the abutment member 96.

[0043] like Figure 5B As shown, in the second imaging device 420 , the processing box 100 is installed along the second direction, the second side wall 94 is located above the installation direction, the electrode accommodating cavity 95 is recessed relative to the second side wall 94 to form a groove, and the electrode 91 is completely accommodated in the electrode accommodating cavity 95 .

[0044] To solve at least one of the problems in the background art, the chip assembly 200 provided by the present invention is directly or indirectly mounted to the imaging device under the action of magnetic force to ensure that the electrical contact portion 221 and the electrode 91 form a stable electrical contact.

[0045] In the present invention, the chip assembly 200 can also be fixed in a package provided with a magnetic conductor by means of magnetic force. Under the action of the magnetic force, the chip assembly 200 can be stably fixed in the package for easy transportation; accordingly, the imaging device and the package can be collectively referred to as a carrier for carrying the chip assembly 200, that is, the chip assembly 200 can be detachably installed to the carrier by means of magnetic force.

[0046] The following description will be made by taking the carrier as an imaging device as an example.

[0047] [Example 1]

[0048] In this embodiment, the chip assembly 200 further includes a first accessory 240 that can be connected to the substrate 220. The chip assembly 200 can be installed on the imaging device through the first accessory 240. At least a portion of the first accessory 240 is configured as a magnetic conductor. Figure 3A and Figure 3BAs shown, the first accessory 240 has a first surface 242 and a second surface 243, and the first surface 242 and the second surface 243 are arranged opposite to each other. The first surface 242 is connected to the substrate 220 and faces the substrate 220. The first surface 242 can be called the front side of the first accessory, and the second surface 243 faces away from the substrate 220 and can be called the back side of the first accessory. The first accessory 240 also includes a first accessory side / third surface 241 located between the first surface 242 and the second surface 243. Optionally, the first surface 242, the second surface 243 and the third surface 241 can all be set to be planes.

[0049] Preferably, the first accessory 240 is configured as a magnetic member as a whole, and is used to fix the chip 270 on the electrode mounting portion 90 , so that the electrical contact portion 221 forms electrical contact with the electrode 91 .

[0050] The first accessory 240 and the base plate 220 may be connected to each other by means of magnetism, or by means of bonding, clamping, etc.

[0051] Continue as Figure 3A and Figure 3B As shown, the electrical contact portion 221 is located on a surface of the substrate 220, which surface can be referred to as the substrate front side / fourth surface 222. The substrate 220 also includes a substrate back side / fifth surface 223 opposite to the substrate front side 222. The substrate 220 also includes a substrate side surface / sixth surface 224 located between the fourth surface 222 and the fifth surface 223. The first accessory 240 is connected to the substrate back side 223, that is, after the chip assembly 200 is connected to the first accessory 240, the first surface 242 is opposite to the fifth surface 223, or in other words, the electrical contact portion 221 and the first accessory 240 are respectively located on opposite sides of the substrate 220.

[0052] When the chip assembly 200 with the first accessory 240 is being installed toward an imaging device, as long as there is a magnetic conductor around the electrode 91 (for example, there is a magnetic conductor in the electrode accommodating cavity 95 or the second side wall 94 or the mounting groove 92), the first accessory 240 will be adsorbed onto the electrode mounting portion 90 under the action of the magnetic force between the first accessory 240 and the magnetic conductor, and the chip assembly 200 can be fixed in the imaging device / electrode mounting portion 90 through the first accessory 240. At this time, the electrical contact portion 221 forms electrical contact with the electrode 91.

[0053] In some embodiments, a portion of the chip 270 itself is magnetic or can be magnetized, such as the substrate 220. In this way, the chip 270 can be directly fixed in the imaging device and the first accessory 240 can be omitted. At this time, the chip 270 forms a chip assembly 200, but the substrate 220 of the chip is magnetic.

[0054] In some embodiments, Figure 6 As shown, the size of the first accessory 240 is reduced. Specifically, along the thickness direction of the substrate 220 , the outer contour of the first accessory 240 does not exceed the projection of the substrate 220 , so that the overall size of the chip assembly 200 can be reduced.

[0055] In some embodiments, Figure 7 As shown, the first accessory 240 includes a first accessory body 244 and a protrusion 260 located on the first accessory body 244. The first accessory body 244 has the above-mentioned first surface 242, second surface 243 and third surface 241. The protrusion 260 extends from the first surface 242 in a direction away from the first surface 242. The protrusion direction of the protrusion 260 is parallel to the direction of the electrical contact portion 221, or in other words, the protrusion direction is the same as the direction of the electrical contact portion 221. The chip assembly 200 is installed to the imaging device / electrode installation portion 90 through the magnetic force between the protrusion 260 and the magnetic conductor in the imaging device, so that the electrical contact portion 221 can form electrical contact with the electrode 91.

[0056] Preferably, in the first accessory 240, only the protrusion 260 is set as a magnetic part. Firstly, it can save the amount of magnetic material. Secondly, it can reduce the influence of the magnetic force of the magnetic part on the chip circuit. Thirdly, it can also change the position of attraction between the chip component 200 and the imaging device according to the structure of the imaging device.

[0057] In some embodiments, Figure 8 As shown, the protrusion 260 extends from the second surface 243 in a direction away from the second surface 243 , and the protrusion direction of the protrusion 260 is opposite to the direction of the electrical contact portion 221 . The protrusion 260 is arranged on the second surface 243 of the first accessory 240 , that is, the protrusion 260 faces away from the electrical contact portion 221 .

[0058] In some embodiments, the protruding direction of the protrusion 260 may also intersect with the direction of the electrical contact portion 221. Figure 3A and Figure 3B As shown, the protrusion 260 is disposed on the substrate side 224 ; alternatively, the protrusion 260 is disposed on the first accessory side 241 .

[0059] [Example 2]

[0060] This embodiment is described only with respect to the differences from the first embodiment.

[0061] like Fig.9A , Fig. 9B , Fig.10 and Fig.11As shown, when the magnetic force between the magnetic conductor around the electrode 91 and the chip assembly 200 / the first accessory 240 is weak, the second accessory 250 at least a portion of which is set as a magnetic conductor can be installed to the imaging device, and the combination formed by the chip assembly 200 and the second accessory 250 can also be suitable for the imaging device, so that the electrical contact portion 221 is in electrical contact with the electrode 91.

[0062] In some embodiments, the second accessory 250 can be installed on the imaging device first, and then the chip assembly 200 can be installed on the second accessory 250. The second accessory 250 can also be retained in the imaging device. When the user needs to install the chip 270 again, there is no need to install the second accessory 250. At this time, the second accessory 250 can be regarded as a part of the imaging device.

[0063] In some implementations, the chip assembly 200 may be first mounted on the second accessory 250 and then the second accessory 250 may be mounted on the imaging device.

[0064] Preferably, the chip assembly 200 is mounted to the second accessory 250 by magnetic force. For example, the chip 270 can be directly mounted on the second accessory 250 by magnetic force, or the first accessory 240 with the chip 270 mounted thereon is mounted on the second accessory 250 by magnetic force.

[0065] In some embodiments, the second accessory 250 can be mounted to the imaging device by magnetism, or by methods other than magnetism. For example, the second accessory 250 is mounted to the imaging device by bonding, snapping, etc.

[0066] In some embodiments, the chip 270 can be fixed in the imaging device through the combined action of the magnetic force of the magnetic conductor around the first accessory 240 and the electrode 91 and the magnetic force between the second accessory 250 and other components of the imaging device; or, the chip 270 can be fixed in the imaging device only through the magnetic force between the second accessory 250 and other components, so that the electrical contact portion 221 can form electrical contact with the electrode 91.

[0067] like Fig.9A and Fig. 9B As shown, the second accessory 250 includes a fixing portion 251, an acting portion 252 and a connecting portion 253 connecting the fixing portion 251 and the acting portion 252. The fixing portion 251 and the acting portion 252 are respectively located at two ends of the connecting portion 253. Among the fixing portion 251, the acting portion 252 and the connecting portion 253, at least the fixing portion 251 has magnetism. The fixing portion 251 is used to fix the chip 270 on the second accessory 250, and the acting portion 252 is used to directly or indirectly fix the second accessory 250 on the imaging device.

[0068] In some embodiments, the action portion 252 may also allow the user to install and remove the second accessory 250 .

[0069] In some embodiments, the fixing portion 251 is further provided with a mating portion 254 capable of mating with other components, and the mating portion 254 enables the first accessory 240 or the chip 270 to be more stably fixed in the second accessory 250. Furthermore, the mating portion 254 can also enable the second accessory 250 to be more stably fixed in the imaging device.

[0070] In some embodiments, the fixing portion 251 and the acting portion 252 are both configured to have magnetism, which can increase the magnetic force of the second accessory 250; preferably, the entire second accessory 250 is configured to be a magnetic part.

[0071] In some embodiments, Fig. 12A and Fig. 12B As shown, only the fixing portion 251 is retained in the second accessory 250. In this embodiment, the chip 270 is mounted to the second accessory 250 through the magnetic force between the second accessory 250 and the first accessory 240, and the second accessory 250 is mounted to the imaging device / electrode mounting portion 90 through the magnetic force between the fixing portion 251 and the magnetic conductor in the imaging device, so that the electrical contact portion 221 can form electrical contact with the electrode 91.

[0072] In some embodiments, Fig.13 As shown, the second accessory 250 is not provided with a matching portion 254, and the area of ​​the fixing portion 251 is reduced, which is beneficial to reducing the cost of the second accessory 250. Specifically, the fixing portion 251 only retains a portion connected to the connecting portion 253. Preferably, the second accessory 250 is entirely configured as a magnetic part to increase the magnetic force of the second accessory 250.

[0073] In some embodiments, one of the first accessory 240 and the second accessory 250 may also be configured as a component that can be magnetized by a magnetic member, that is, one of the first accessory 240 and the second accessory 250 is provided with a magnetic conductor, and the other of the first accessory 240 and the second accessory 250 is configured as a magnetic member.

[0074] In some embodiments, the first accessory 240 may also be configured to be in a shape similar to the second accessory 250 . In this case, the chip 270 is mounted to the imaging device through the second accessory 250 .

[0075] In some embodiments, the non-magnetic chip 270 can also be directly installed on the second accessory 250. In this case, the non-magnetic chip 270 will be installed on the imaging device through the second accessory 250, wherein the non-magnetic chip 270 and the second accessory 250 can be connected by magnetic connection, snap connection, bonding, etc., and the second accessory 250 and the imaging device can also be connected by magnetic connection, snap connection, bonding, etc.

[0076] [Other Notes]

[0077] According to the inventive concept of the present invention, an anti-error portion 230 may also be provided in the chip assembly 200 / combination, and the anti-error portion 230 is used to ensure that the chip 270 is correctly installed in the imaging device. Specifically, the anti-error portion 230 may be provided on at least one of the substrate 220, the first accessory 240 and the second accessory 250; the shape and position of the anti-error portion 230 may be changed according to actual needs, for example, the anti-error portion 230 is provided to be circular, triangular, T-shaped, etc.; the anti-error portion 230 may be provided on at least one of the front side 222 of the substrate, the back side 223 of the substrate, the side side 224 of the substrate, the front side 242 of the first accessory, the back side 243 of the first accessory and the side side 241 of the first accessory.

[0078] When the anti-error portion 230 is disposed on the substrate 220, the anti-error portion 230 can match the corresponding portion in the imaging device to prevent the chip 270 from being in an incorrect installation position in the imaging device, or the chip 270 from being inverted; in addition, the anti-error portion 230 can also prevent the chip 270 from being in an incorrect installation position in the first accessory 240, or the chip 270 from being inverted.

[0079] When the anti-error portion 230 is disposed on the first accessory 240, the anti-error portion 230 can match the corresponding portion in the imaging device to prevent the first accessory 240 from being in an incorrect installation position in the imaging device; at the same time, the anti-error portion 230 can also prevent the chip 270 from being in an incorrect installation position in the first accessory 240, or the chip 270 from being inverted.

[0080] In addition, when the anti-error portion 230 is disposed on the first accessory 240 , the anti-error portion 230 may also cooperate with the matching portion 254 in the second accessory 250 to prevent the first accessory 240 from being in an incorrect installation position in the second accessory 250 .

[0081] When the anti-mistake portion 230 is disposed on the second accessory 250 , the anti-mistake portion 230 can match with a corresponding portion in the imaging device to prevent the second accessory 250 from being in a wrong installation position in the imaging device.

[0082] Likewise, the error-proofing portion 230 can also be used to match with a corresponding portion in the carrier to ensure that the chip 270 is correctly installed in the carrier.

[0083] [Beneficial Effects]

[0084] The chip assembly can be mounted to the imaging device by means of clipping, pressing and bonding. Such mounting methods have the disadvantages listed in the following table:

[0085]

[0086]

[0087] Compared with the prior art, the chip assembly 200, the assembly and the box assembly provided by the present invention have the following beneficial effects:

[0088] On the one hand, the chip assembly 200 is directly or indirectly installed in the imaging device through the action of magnetism. Specifically, the chip assembly 200 is also provided with a first accessory 240 at least a portion of which is configured as a magnetic part or can be magnetized by a magnetic part; or, in a combination including a second accessory 250 and the chip assembly 200, the second accessory is configured as a magnetic conductor. This makes the installation and removal of the chip assembly 200 faster and more convenient, and at the same time will not interfere with other components of the imaging device, and will not leave residue in the imaging device.

[0089] Secondly, when the chip assembly 200 is disassembled, the principle of "opposites attract each other and likes repel each other" of the magnetic parts can be utilized to remove the chip assembly 200 externally, thereby preventing at least one of the first accessory 240 and the second accessory 250 from interfering with other components of the imaging device.

Claims

1. A chip assembly, detachably mounted to a carrier provided with a magnetic conductor, the chip assembly comprising a chip for storing parameter information, the chip comprising a substrate and at least one electrical contact portion, the electrical contact portion being arranged on the substrate; the electrical contact portion being used to form an electrical contact / electrical connection with an electrode outside the chip assembly, so that the parameter information stored in the chip is obtained, characterized in that: The chip assembly is mounted in the carrier by the magnetic force between the chip assembly and the magnetic conductor in the carrier.

2. The chip assembly according to claim 1, characterized in that: The chip assembly also includes a first accessory at least part of which is configured as a magnetic conductor. The chip is mounted on the carrier through the magnetic force between the first accessory and the magnetic conductor in the carrier.

3. The chip assembly according to claim 1, characterized in that: The substrate of the chip is magnetic, and the chip is directly mounted on the carrier through the magnetic force between the substrate and the magnetic conductor in the carrier.

4. The chip assembly according to claim 2, characterized in that: Along the thickness direction of the substrate, the outer contour of the first accessory does not exceed the projection of the substrate.

5. The chip assembly according to claim 2, characterized in that: The first accessory includes a first accessory body and a protrusion located on the first accessory body, wherein the protrusion direction is parallel to the direction of the electrical contact portion, the protrusion is configured as a magnetic part, and the chip assembly is mounted to the carrier through the magnetic force between the protrusion and the magnetic conductor in the carrier.

6. A combination, characterized in that: The combination comprises a second accessory and the chip assembly according to any one of claims 1 to 5, at least a portion of the second accessory is configured as a magnetic conductor, and the chip assembly is mounted to the carrier through the magnetic force between the second accessory and the magnetic conductor in the carrier.

7. The combination according to claim 6, characterized in that: The second accessory at least includes a fixing portion having magnetism, and the fixing portion is used to fix the chip to the second accessory directly or indirectly.

8. The combination according to claim 6, characterized in that: The assembly also includes an anti-error portion arranged in at least one of the substrate, the first accessory and the second accessory, the anti-error portion is used to match the corresponding position in the carrier to prevent the chip from being in the wrong installation position in the carrier or the chip from being inverted.

9. A process cartridge assembly, comprising a process cartridge and a chip assembly according to any one of claims 1 to 5, characterized in that: The process cartridge includes at least one of a developer cartridge and a drum cartridge, and the process cartridge is detachably mounted to the carrier; The developing cartridge includes a developing cartridge housing for accommodating a developer and a developing roller rotatably disposed in the developing cartridge housing; The drum cartridge includes a drum casing and a photosensitive drum rotatably disposed in the drum casing, and a developing roller is used to supply a developer to the photosensitive drum; The chip assembly is used to store parameter information of the processing box, and the processing box can establish a communication connection with the carrier through the chip assembly.

10. A process cartridge assembly, comprising a process cartridge and a combination according to any one of claims 6 to 8, characterized in that: The process cartridge includes at least one of a developer cartridge and a drum cartridge, and the process cartridge is detachably mounted to the carrier; The developing cartridge includes a developing cartridge housing for accommodating a developer and a developing roller rotatably disposed in the developing cartridge housing; The drum cartridge includes a drum casing and a photosensitive drum rotatably disposed in the drum casing, and a developing roller is used to supply a developer to the photosensitive drum; The assembly is detachably mounted to the carrier, and the chip assembly is used to store parameter information of the processing box. Through the chip assembly, the processing box can establish a communication connection with the carrier.

Images