Turnout simulation load device

Abstract

The invention relates to a turnout simulation load device, which comprises a driving output interface, a power supply acquisition module, a micro-control unit, a positioning simulation module, an anti-position simulation module, a positioning driving module and an anti-position driving module, and is characterized in that the micro-control unit is respectively connected with the positioning driving module and the anti-position driving module through a real-time acquisition unit; the micro-control unit is connected with the positioning driving module, the anti-position driving module, the positioning simulation module and the anti-position simulation module through the protection switch. According to the turnout simulation load device, simulation of the initial position of a turnout is realized through the positioning simulation module and the anti-position simulation module, and driving monitoring of the turnout is realized through driving voltage and driving current acquired by the real-time acquisition unit. If monitoring is abnormal, the micro-control unit can be adopted to control the circuit between the micro-control unit and the positioning driving module, the anti-position driving module, the positioning simulation module and the anti-position simulation module to be disconnected through the protection switch, and the power supply module and the micro-control unit are protected from being damaged.

Description

Technical Field

[0001] The present application belongs to the technical field of turnouts, and in particular relates to a turnout simulation load device. Background Art

[0002] A turnout is a line connection device that allows locomotives and vehicles to transfer from one track to another. It is also one of the weak links in the track and is usually laid in large quantities at stations and marshalling yards.

[0003] Turnouts are an important equipment in the field of rail transit. They have many models, among which single-phase control and drive-separated turnouts are used on-site as important controlled equipment in the turnout interlocking system. However, traditional turnout equipment is large and heavy, not easy to carry and install; and during the driving process, traditional turnouts cannot monitor the driving voltage and current in real time, cannot communicate and interact with their controllers in real time, and have no intelligent feedback function. When the driving current and driving voltage are abnormal, the corresponding protection actions cannot be taken in time, which may eventually damage the power module or the turnout control unit. Summary of the invention

[0004] An embodiment of the present application provides a turnout simulation load device to solve the problem that the existing turnout drive has no abnormality monitoring and no protective measures, which may easily lead to damage to the turnout controller.

[0005] In a first aspect, an embodiment of the present application provides a turnout simulation load device, comprising:

[0006] Drive output interface, used to connect with the turnout controller;

[0007] A power acquisition module, used for acquiring the voltage output by the turnout, the power acquisition module being connected to the drive output interface;

[0008] A micro control unit is connected to the power collection module, and the micro control unit is also in communication connection with the controller of the turnout;

[0009] A positioning simulation module, used to simulate the initial position state of the turnout in a positioning manner and collect simulated positioning signals, wherein the positioning simulation module is connected to the positioning collection ports of the micro control unit and the controller respectively;

[0010] A reverse position simulation module, used for simulating the initial position state of the turnout in a reverse position manner and collecting simulated reverse position signals, wherein the reverse position simulation module is connected to the reverse position collection ports of the micro control unit and the controller respectively;

[0011] A positioning driving module, used for driving the positioning simulation module to operate, wherein the positioning driving module is respectively connected to the driving output interface, the micro control unit and the positioning simulation module;

[0012] An inversion driving module, used for driving the inversion simulation module to operate, wherein the inversion driving module is respectively connected to the driving output interface, the micro control unit and the inversion simulation module;

[0013] Among them, the micro control unit is connected to the positioning drive module and the anti-position drive module respectively through a real-time acquisition unit, and the real-time acquisition unit is used to collect the driving current and driving voltage of the positioning drive module or the anti-position drive module in real time. The micro control unit is connected to the positioning drive module, the anti-position drive module, the positioning simulation module and the anti-position simulation module respectively through a protection switch, and the protection switch is used to disconnect or connect the micro control unit with the positioning drive module, the anti-position drive module, the positioning simulation module and the anti-position simulation module.

[0014] Optionally, the positioning simulation module includes a fifth switching element and a first relay, the first end of the fifth switching element is respectively connected to a DC power supply and the forty-third connection end of the first relay, the second end of the fifth switching element is respectively connected to the output end of the positioning drive module and the first end of the coil of the first relay, the second end of the coil of the first relay is grounded, the third end of the fifth switching element is connected to the protection switch, the fifty-third connection end and the sixty-third connection end of the first relay are connected to the positioning indication power supply, and the twenty-second connection end and the thirty-second connection end of the first relay are connected to the positioning acquisition port.

[0015] Optionally, the anti-position simulation module includes a sixth switch element and a second relay, the first end of the sixth switch element is respectively connected to the DC power supply and the forty-third connection end of the second relay, the second end of the sixth switch element is respectively connected to the output end of the anti-position driving module, the eleventh connection end of the first relay and the first end of the coil of the second relay, the second end of the coil of the second relay is grounded, the third end of the sixth switch element is connected to the protection switch, the fifty-third connection end and the sixty-third connection end of the second relay are connected to the anti-position representation power supply, and the twenty-second connection end and the thirty-second connection end of the second relay are connected to the anti-position acquisition port; the forty-fourth connection end of the first relay is connected to the eleventh connection end of the second relay, the fifty-fourth connection end of the first relay is connected to the twenty-first connection end of the second relay, the sixty-fourth connection end of the first relay is connected to the thirty-first connection end of the second relay, the twelfth connection end of the first relay is connected to the forty-fourth connection end of the second relay, the twenty-first connection end of the first relay is connected to the fifty-fourth connection end of the second relay, the thirty-first connection end of the first relay is connected to the sixty-fourth connection end of the second relay, and the twelfth connection end of the second relay is connected to the second end of the fifth switch element.

[0016] Optionally, the positioning drive module includes a third switch element, a fourth switch element, a positioning rectifier and filter sub-module, a positioning sampling sub-module and a positioning drive element, the first end of the third switch element and the first end of the fourth switch element are both connected to the drive output interface, the positioning rectifier and filter sub-module and the positioning sampling sub-module are connected between the second end of the third switch element, the second end of the fourth switch element and the positioning drive element, the third end of the third switch element and the third end of the fourth switch element are both connected to the protection switch, the positioning sampling sub-module is also connected to the real-time acquisition unit, and the output end of the positioning drive element is connected to the positioning simulation module.

[0017] Optionally, the positioning rectification and filtering submodule includes a third semiconductor element, a second filtering element and a fourth semiconductor element; the positioning sampling submodule includes a fourth sampling element, a fifth sampling element and a sixth sampling element, the anode of the third semiconductor element is connected to the second end of the third switching element, the cathode of the third semiconductor element is respectively connected to the first end of the second filtering element and the first end of the fourth sampling element, the second end of the fourth sampling element is respectively connected to the first end of the fifth sampling element and the first input end of the positioning driving element, the third end of the fourth sampling element is connected to the real-time acquisition unit, the cathode of the fourth semiconductor element is connected to the second end of the fourth switching element, the anode of the fourth semiconductor element is respectively connected to the second end of the second filtering element and the first end of the sixth sampling element, and the second end of the sixth sampling element is respectively connected to the second end of the fifth sampling element and the second input end of the positioning driving element.

[0018] Optionally, the third semiconductor element and the fourth semiconductor element are both rectifier diodes, and the second filter element is a filter capacitor; and / or the fourth sampling element is an adjustable resistor, and the fifth sampling element and the sixth sampling element are both resistors.

[0019] Optionally, the anti-position driving module includes a first switching element, a second switching element, an anti-position rectifying and filtering sub-module, an anti-position sampling sub-module and an anti-position driving element, the first end of the first switching element and the first end of the first switching element are both connected to the driving output interface, the anti-position rectifying and filtering sub-module and the anti-position sampling sub-module are connected between the second end of the first switching element, the second end of the second switching element and the anti-position driving element, the third end of the first switching element and the third end of the second switching element are both connected to the protection switch, the anti-position sampling sub-module is also connected to the real-time acquisition unit, and the output end of the anti-position driving element is connected to the anti-position simulation module.

[0020] Optionally, the inverted rectifying and filtering submodule includes a first semiconductor element, a first filtering element, and a second semiconductor element; the inverted sampling submodule includes a first sampling element, a second sampling element, and a third sampling element, the cathode of the first semiconductor element is connected to the second end of the first switching element, the anode of the first semiconductor element is respectively connected to the first end of the first filtering element and the first end of the first sampling element, the second end of the first sampling element is respectively connected to the first end of the second sampling element and the first input end of the inverted driving element, the third end of the first sampling element is connected to the real-time acquisition unit, the anode of the second semiconductor element is connected to the second end of the second switching element, the cathode of the second semiconductor element is respectively connected to the second end of the first filtering element and the first end of the third sampling element, and the second end of the third sampling element is respectively connected to the second end of the second sampling element and the second input end of the inverted driving element.

[0021] Optionally, the first semiconductor element and the second semiconductor element are both rectifier diodes, and the first filter element is a filter capacitor; and / or the first sampling element is an adjustable resistor, and the second sampling element and the third sampling element are both resistors.

[0022] Optionally, the switching elements of the positioning simulation module, the anti-position simulation module, the positioning drive module and the anti-position drive module are all electronic relays; and / or, the positioning drive element of the positioning drive module and the anti-position drive element of the anti-position drive module are all photoelectric coupling elements.

[0023] An embodiment of the present application provides a turnout simulation load device, including a drive output interface, a power acquisition module, a microcontroller unit, a positioning simulation module, an anti-position simulation module, a positioning drive module and an anti-position drive module. The microcontroller unit is respectively connected to the positioning drive module and the anti-position drive module through a real-time acquisition unit, and the microcontroller unit is respectively connected to the positioning drive module, the anti-position drive module, the positioning simulation module and the anti-position simulation module through a protection switch. The turnout simulation load device simulates the initial position of the turnout through the positioning simulation module and the anti-position simulation module, and monitors the drive of the turnout through the driving voltage and driving current collected by the real-time acquisition unit. If the monitoring is abnormal, the microcontroller unit can be used to control the circuit disconnection between the microcontroller unit and the positioning drive module, the anti-position drive module, the positioning simulation module and the anti-position simulation module through the protection switch to protect the power module and the microcontroller unit from being damaged, thereby solving the problem that the existing turnout drive has no abnormal monitoring and no protection measures that easily lead to damage to the turnout controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solution in an embodiment of the present application, the following briefly introduces the drawings required for use in the description of the embodiment. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can also obtain other drawings based on these drawings without creative work.

[0025] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings. In the following description, the same reference numerals represent the same parts.

[0026] Figure 1 A schematic diagram of the framework of a turnout simulation load device provided in one embodiment of the present application.

[0027] Figure 2 A circuit diagram of a turnout simulation load device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0028] The technical scheme in one embodiment of the present application will be clearly and completely described below in conjunction with the drawings in one embodiment of the present application. Obviously, the described embodiment is only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0029] An embodiment of the present application provides a turnout simulation load device to solve the problem that the existing turnout drive has no abnormality monitoring and no protective measures, which may easily lead to damage to the turnout controller.

[0030] Embodiment 1:

[0031] An embodiment of the present application provides a turnout simulation load device, for example, see Figure 1 , Figure 1 A schematic diagram of the framework of a turnout simulation load device provided in one embodiment of the present application.

[0032] like Figure 1 As shown, the invention of this application provides a turnout simulation load device, including a drive output interface, a power acquisition module 10, a micro control unit MCU, a positioning simulation module 20, an anti-position simulation module 30, a positioning drive module 40 and an anti-position drive module 50.

[0033] In the embodiment of the present invention, the drive output interface is used to connect to the controller of the turnout. The power acquisition module 10 collects the voltage output by the turnout, and the power acquisition module 10 is connected to the drive output interface. The microcontroller unit MCU is connected to the power acquisition module 10, and the microcontroller unit MCU is also connected to the controller of the turnout for communication.

[0034] It is further explained that the drive output interface includes a live line drive output interface Drive_L and a neutral line drive output interface Drive_N.

[0035] In the embodiment of the present invention, the positioning simulation module 20 is used to simulate the initial position state of the turnout in a positioning manner and collect the simulated positioning signal, and the positioning simulation module 20 is connected to the positioning acquisition port of the microcontroller unit MCU and the controller respectively. The reverse position simulation module 30 is used to simulate the initial position state of the turnout in a reverse position manner and collect the simulated reverse position signal, and the reverse position simulation module 30 is connected to the reverse position acquisition port of the microcontroller unit MCU and the controller respectively.

[0036] It is further explained that the turnout simulation load device realizes the simulation of the initial position state of the turnout through the positioning simulation module 20 and the reverse position simulation module 30.

[0037] In the embodiment of the present invention, the positioning drive module 40 is used to drive the positioning simulation module 20 to run, and the positioning drive module 40 is respectively connected to the drive output interface, the micro control unit MCU and the positioning simulation module 20. The anti-position drive module 50 is used to drive the anti-position simulation module 30 to run, and the anti-position drive module 50 is respectively connected to the drive output interface, the micro control unit MCU and the anti-position simulation module 30. The micro control unit MCU is respectively connected to the positioning drive module 40 and the anti-position drive module 50 through the real-time acquisition unit 60, and the real-time acquisition unit 60 is used to collect the driving current and driving voltage of the positioning drive module 40 or the anti-position drive module 50 in real time. The micro control unit MCU is respectively connected to the positioning drive module 20, the anti-position drive module 30, the positioning simulation module 40 and the anti-position simulation module 50 through the protection switch 70, and the protection switch 0 is used to disconnect or conduct the micro control unit MCU and the positioning drive module 20, the anti-position drive module 30, the positioning simulation module 40 and the anti-position simulation module 50.

[0038] It is further explained that the turnout simulation load device realizes switching between the operation of the positioning simulation module 20 and the reverse position simulation module 30 through the positioning drive module 40 and the reverse position drive module 50. The micro control unit MCU can communicate with the controller of the turnout for data comparison based on the driving current and driving voltage collected by the real-time acquisition unit 60. When the driving voltage and driving current are abnormal, the circuit connected between the micro control unit MCU and the positioning drive module 20, the reverse position drive module 30, the positioning simulation module 40 and the reverse position simulation module 50 can be effectively cut off through the protection switch 70, thereby protecting the micro control unit MCU and the turnout. In this embodiment, the micro control unit MCU is also used to process the collected driving voltage, driving current, positioning signal and reverse position signal.

[0039] In the embodiment of the present invention, the power acquisition module 10, the microcontroller unit MCU, the positioning simulation module 20, the reverse position simulation module 30, the positioning drive module 40 and the reverse position drive module 50 cooperate with each other to realize the full electronic integrated circuit board design of the turnout simulation load device, which is small in size and easy to install. Since the full electronic integrated circuit is cheap, the economic value of the turnout simulation load device is high.

[0040] A turnout simulation load device provided by an embodiment of the present application includes a drive output interface, a power acquisition module, a microcontroller unit, a positioning simulation module, an anti-position simulation module, a positioning drive module and an anti-position drive module. The microcontroller unit is respectively connected to the positioning drive module and the anti-position drive module through a real-time acquisition unit, and the microcontroller unit is respectively connected to the positioning drive module, the anti-position drive module, the positioning simulation module and the anti-position simulation module through a protection switch. The turnout simulation load device simulates the initial position of the turnout through the positioning simulation module and the anti-position simulation module, and monitors the drive of the turnout through the driving voltage and driving current collected by the real-time acquisition unit. If an abnormality occurs in the monitoring, the microcontroller unit can be used to control the circuit disconnection between the microcontroller unit and the positioning drive module, the anti-position drive module, the positioning simulation module and the anti-position simulation module through the protection switch to protect the power acquisition module and the microcontroller unit from being damaged, thereby solving the problem that the existing turnout drive has no abnormal monitoring and no protective measures that easily lead to damage to the turnout controller.

[0041] Figure 2 A circuit diagram of a turnout simulation load device provided in one embodiment of the present application.

[0042] like Figure 2 As shown, in one embodiment of the invention of the present application, the positioning simulation module 20 includes a fifth switching element SSR5 and a first relay K1, the first end of the fifth switching element SSR5 is respectively connected to the DC power supply and the forty-third connection end of the first relay K1, the second end of the fifth switching element SSR5 is respectively connected to the output end of the positioning drive module 40 and the first end A1 of the coil of the first relay K1, the second end A2 of the coil of the first relay K1 is grounded, the third end of the fifth switching element SSR5 is connected to the protection switch, the fifty-third connection end 53 and the sixty-third connection end 63 of the first relay K1 are connected to the positioning indication power supply, and the twenty-second connection end 22 and the thirty-second connection end 32 of the first relay K1 are connected to the positioning acquisition port.

[0043] It is further explained that the DC power supply can provide DC power for the positioning simulation module 20, the reverse position simulation module 30, the positioning drive module 40 and the reverse position drive module 50. Figure 2 The DC Relay Power shown in the figure indicates that the connection terminals of the power supply are respectively as follows: Figure 2 The connection terminals NP_IN+ and NP_IN- shown in FIG. 1 and 1 are respectively recorded as follows: Figure 2 Shown are connection terminal NP_ACQ+ and connection terminal NP_ACQ-.

[0044] like Figure 2 As shown, in one embodiment of the invention of the present application, the reverse position simulation module 30 includes a sixth switch element SSR6 and a second relay K2, the first end of the sixth switch element SSR6 is respectively connected to the DC power supply and the forty-third connection terminal 43 of the second relay K2, the second end of the sixth switch element SSR is respectively connected to the output end of the reverse position drive module 50, the eleventh connection terminal 11 of the first relay K1 and the first end A1 of the coil of the second relay K2, the second end A2 of the coil of the second relay K2 is grounded, the third end of the sixth switch element SSR6 is connected to the protection switch, the fifty-third connection terminal 53 and the sixty-third connection terminal 63 of the second relay K2 are connected to the reverse position indicating power supply, the twenty-second connection terminal 22 and the thirty-second connection terminal 32 of the second relay K2 are connected to the reverse position acquisition port Connection: the forty-fourth connection terminal 44 of the first relay K1 is connected to the eleventh connection terminal 11 of the second relay K2, the fifty-fourth connection terminal 54 of the first relay K1 is connected to the twenty-first connection terminal 21 of the second relay K2, the sixty-fourth connection terminal 64 of the first relay K1 is connected to the thirty-first connection terminal 31 of the second relay K2, the twelfth connection terminal 12 of the first relay K1 is connected to the forty-fourth connection terminal 44 of the second relay K2, the twenty-first connection terminal 21 of the first relay K1 is connected to the fifty-fourth connection terminal 54 of the second relay K2, the thirty-first connection terminal 31 of the first relay K1 is connected to the sixty-fourth connection terminal 64 of the second relay K2, and the twelfth connection terminal 12 of the second relay K2 is connected to the second end of the fifth switching element SSR5.

[0045] It is further explained that the reverse position indicates that the connection terminals of the power supply are recorded as follows Figure 2 The connection terminals RP_IN+ and RP_IN- shown in FIG. 1 and 1 are respectively recorded as follows: Figure 2 The connection terminal RP_ACQ+ and the connection terminal RP_ACQ- are shown. In this embodiment, the first relay K1 and the second relay K2 are used to control the acquisition of the microcontroller positioning and reverse position.

[0046] like Figure 2As shown, in one embodiment of the invention of the present application, the positioning drive module 40 includes a third switch element SSR3, a fourth switch element SSR4, a positioning rectifier filter submodule, a positioning sampling submodule and a positioning drive element U2, the first end of the third switch element SSR3 and the first end of the fourth switch element SSR4 are both connected to the drive output interface, the second end of the third switch element SSR3, the second end of the fourth switch element SSR and the positioning drive element U2 are connected with a positioning rectifier filter submodule and a positioning sampling submodule, the third end of the third switch element SSR3 and the third end of the fourth switch element SSR4 are both connected to the protection switch, the positioning sampling submodule is also connected to the real-time acquisition unit 60, and the output end of the positioning drive element U2 is connected to the positioning simulation module 20. The positioning rectification and filtering submodule includes a third semiconductor element D3, a second filtering element C2 and a fourth semiconductor element D4; the positioning sampling submodule includes a fourth sampling element R4, a fifth sampling element R5 and a sixth sampling element R, the anode of the third semiconductor element D3 is connected to the second end of the third switch element SSR3, the cathode of the third semiconductor element D3 is respectively connected to the first end of the second filtering element C2 and the first end of the fourth sampling element R4, the second end of the fourth sampling element R4 is respectively connected to the first end of the fifth sampling element R5 and the first input end of the positioning drive element U2, the third end of the fourth sampling element R4 is connected to the real-time acquisition unit 60, the cathode of the fourth semiconductor element D4 is connected to the second end of the fourth switch element SSR4, the anode of the fourth semiconductor element D4 is respectively connected to the second end of the second filtering element C2 and the first end of the sixth sampling element R6, and the second end of the sixth sampling element R6 is respectively connected to the second end of the fifth sampling element R5 and the second input end of the positioning drive element U2.

[0047] It is further explained that the third semiconductor element D3 and the fourth semiconductor element D4 are both rectifier diodes, the second filter element C2 is a filter capacitor; and / or the fourth sampling element R4 is an adjustable resistor, and the fifth sampling element R5 and the sixth sampling element R6 are both resistors.

[0048] like Figure 2As shown, in one embodiment of the invention of the present application, the anti-position driving module 50 includes a first switching element SSR1, a second switching element SSR2, an anti-position rectifying and filtering submodule, an anti-position sampling submodule and an anti-position driving element U1, the first end of the first switching element SSR1 and the first end of the first switching element SSR1 are both connected to the driving output interface, the anti-position rectifying and filtering submodule and the anti-position sampling submodule are connected between the second end of the first switching element SSR1, the second end of the second switching element SSR2 and the anti-position driving element U1, the third end of the first switching element SSR1 and the third end of the second switching element SSR2 are both connected to the protection switch, the anti-position sampling submodule is also connected to the real-time acquisition unit 60, and the output end of the anti-position driving element U1 is connected to the anti-position simulation module 30. The inverted rectifying and filtering submodule includes a first semiconductor element D1, a first filtering element C1, and a second semiconductor element D2; the inverted sampling submodule includes a first sampling element R1, a second sampling element R2, and a third sampling element R3, wherein the cathode of the first semiconductor element D1 is connected to the second end of the first switch element SSR1, the anode of the first semiconductor element D1 is respectively connected to the first end of the first filtering element C2 and the first end of the first sampling element R1, the second end of the first sampling element R1 is respectively connected to the first end of the second sampling element R2 and the first input end of the inverted driving element U1, the third end of the first sampling element R1 is connected to the real-time acquisition unit 60, the anode of the second semiconductor element D2 is connected to the second end of the second switch element SSR2, the cathode of the second semiconductor element D2 is respectively connected to the second end of the first filtering element C1 and the first end of the third sampling element R3, and the second end of the third sampling element R3 is respectively connected to the second end of the second sampling element R2 and the second input end of the inverted driving element U1.

[0049] It is further explained that the first semiconductor element D1 and the second semiconductor element D2 are both rectifier diodes, and the first filter element C1 is a filter capacitor; and / or, the first sampling element R1 is an adjustable resistor, and the second sampling element R2 and the third sampling element R3 are both resistors. The switching elements of the positioning simulation module 20, the anti-position simulation module 30, the positioning drive module 40 and the anti-position drive module 50 are all electronic relays; and / or, the positioning drive element U2 of the positioning drive module 40 and the anti-position drive element U1 of the anti-position drive module 50 are both optocoupler elements. In this embodiment, the first sampling element R1, the second sampling element R2, the third sampling element R3, the fourth sampling element R4, the fifth sampling element R5 and the sixth sampling element R6 are all power resistors adapted to a 220VAC drive voltage. Figure 2As shown, after the electronic relay SSR1, electronic relay SSR2, diode D1, diode D2 are connected in series with resistor R1, resistor R2, and resistor R3, the primary of the photoelectric coupling element U1 is connected in parallel at both ends of the resistor R2, and the secondary of the photoelectric coupling element U1 is respectively connected to the DC power supply and the first end A1 of the coil of the second relay K2; the electronic relay SSR3, electronic relay SSR4, diode D3, diode D4 are connected in series with resistor R4, resistor R5, and resistor R6, and the primary of the photoelectric coupling element U2 is connected in parallel at both ends of the resistor R5, and the secondary of the photoelectric coupling element U2 is respectively connected to the DC power supply and the first end A1 of the coil of the first relay K1. Among them, the positioning drive element U2 and the reverse position drive element U1 are used to drive the corresponding first relay K1 and the second relay K2 to realize the switching between positioning and reverse position. The rectifier diode D1 and the rectifier diode D2, as well as the rectifier diode D3 and the rectifier diode D4 are all used for full-wave rectification, and the filter capacitor C1 and the filter capacitor C2 perform filtering processing to realize the positive and negative phase output of the turnout output power supply and control the photoelectric coupling element of the subsequent stage.

[0050] like Figure 2 As shown, in the embodiment of the invention of the present application, the turnout simulation load device can control the output current of the positive drive element U1 or the reverse drive element U2 by adjusting the sampling resistance of the first sampling element or the fourth sampling element, and can be used to simulate the situation where the output current of the turnout controller is too small or overcurrent, and at the same time, the upper and lower limits of the output current of the positioning drive module 40 and the reverse drive module 50 can be verified, and the rationality of the turnout design can be verified.

[0051] In the present invention, the working principle of the simulation switching between the positioning simulation module 20 and the reverse position simulation module 30 of the turnout simulation load device is as follows: the output port of the turnout controller is connected at the interface of the drive output interface Drive_L and the drive output interface Drive_N. The positioning acquisition port of the controller in the turnout is connected at the interface of the positioning acquisition port NP_ACQ+ / -, and the reverse position acquisition port of the control module in the turnout is connected at the interface of the reverse position acquisition port RP_ACQ+ / -. First, after the turnout simulation load is powered on, the fifth switch element SSR5 or the sixth switch element SSR6 is driven to simulate the initial position of the turnout, wherein the fifth switch element SSR5 drives the positioning input first relay K1, and the sixth switch element SSR6 drives the reverse position input second relay K2. When the fifth switch element SSR5 is driven at the beginning, the first relay K1 is energized, and the controller of the turnout collects the positioning position. The first relay K1 is self-locked through the normally open node and interlocked with the normally closed node of the second relay K2. The first relay K1 maintains the energized state, and then the fifth switch element SSR5 is closed; when it is necessary to switch to the reverse position simulation module 30, the first switch element SSR1 and the second switch element SSR2 need to be opened, and a 220VAC driving voltage is output. After rectification and filtering by the first semiconductor element D1, the second semiconductor element D2 and the first filter element C1, the driving current is kept flowing from the third sampling element R3 to the first sampling element R1, and the rear end reverse position driving element U1 is opened to drive the reverse position second relay K2. At this time, the normally closed node eleventh connection terminal 11 and the twelfth connection terminal 12 of the second relay K2 are disconnected, the coil of the first relay K1 is de-energized, and the second relay K2 is self-locked through the normally open node and interlocked with the normally closed node of the first relay K1. The controller of the turnout collects the reverse position signal of the reverse position state, and then the first switch element SSR1 and the second switch element SSR2 are closed.On the contrary, when the sixth switch element SSR6 is driven at the beginning, the second relay K2 is energized, the controller of the turnout collects the reverse position, the second relay K2 is self-locked through the normally open node and interlocked with the normally closed node of the first relay K1, the second relay K2 remains energized, and then the sixth switch element SSR6 is closed; when it is necessary to switch to the positioning position, the third switch element SSR3 and the fourth switch element SSR4 are opened, and the turnout outputs a 220VAC driving voltage, which is rectified and filtered by the third semiconductor element D3, the fourth semiconductor element D4 and the second filter element C2. The wave is maintained, and the driving current flows from the fourth sampling element R4 to the sixth sampling element R6, and the rear end positive driving element U2 is turned on to drive the first relay K1 for positioning. At this time, the normally closed node eleventh connection terminal 11 and the twelfth connection terminal 12 of the first relay K1 are disconnected, and the second relay K2 coil is de-energized. The first relay K1 is self-locked through the normally open node and interlocked with the normally closed node of the second relay K2. The first relay K1 remains in the excitation state, and the controller of the turnout collects the positioning signal of the positioning position and closes the third switch element SSR3 and the fourth switch element SSR4.

[0052] It is further explained that in the process of turnout driving, the real-time acquisition unit 60 can be used to collect and monitor the driving voltage and driving current of the positive drive module 40 or the reverse drive module 50 in real time, and the microcontroller unit MCU Ethernet communicates with the controller of the turnout to verify the accuracy of the driving voltage and driving current. When the driving voltage and driving current are abnormal, the driving switch element SSR can be cut off in time by the protection switch to achieve the protection of the controller and the microcontroller unit. In the case of the controller output current of the simulated turnout being too small or overcurrent, it can be achieved by changing the specifications of the power resistor of the first sampling element or the fourth sampling element, so as to achieve a wide range of output current changes. The upper and lower limits of the output current of the controller of the turnout can be verified by the turnout simulation load device, and the rationality of its design can be verified. At the same time, the limit that the controller in the turnout can withstand can also be verified.

[0053] In the embodiment of the invention of the present application, the turnout simulation load device is connected to the controller of the turnout to simulate the fixed drive, reverse drive, fixed mining and reverse mining functions of the turnout. The turnout simulation load device can realize real-time monitoring of the driving voltage and driving current, and communicate with the controller of the turnout through Ethernet, compare the voltage and current collection data, and when an abnormality occurs, the driving switch element SSR can be cut off to protect the controller of the turnout and the turnout simulation load device.

[0054] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0055] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features.

[0056] The above is a detailed introduction to the turnout simulation load device provided by an embodiment of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A turnout simulation load device, characterized in that: include: Drive output interface, used to connect with the turnout controller; A power acquisition module, used for acquiring the voltage output by the turnout, the power acquisition module being connected to the drive output interface; A micro control unit is connected to the power collection module, and the micro control unit is also in communication connection with the controller of the turnout; A positioning simulation module, used to simulate the initial position state of the turnout in a positioning manner and collect simulated positioning signals, wherein the positioning simulation module is connected to the positioning collection ports of the micro control unit and the controller respectively; A reverse position simulation module, used for simulating the initial position state of the turnout in a reverse position manner and collecting simulated reverse position signals, wherein the reverse position simulation module is connected to the reverse position collection ports of the micro control unit and the controller respectively; A positioning driving module, used for driving the positioning simulation module to operate, wherein the positioning driving module is respectively connected to the driving output interface, the micro control unit and the positioning simulation module; An inversion driving module, used for driving the inversion simulation module to operate, wherein the inversion driving module is respectively connected to the driving output interface, the micro control unit and the inversion simulation module; Among them, the micro control unit is connected to the positioning drive module and the anti-position drive module respectively through a real-time acquisition unit, and the real-time acquisition unit is used to collect the driving current and driving voltage of the positioning drive module or the anti-position drive module in real time. The micro control unit is connected to the positioning drive module, the anti-position drive module, the positioning simulation module and the anti-position simulation module respectively through a protection switch, and the protection switch is used to disconnect or connect the micro control unit with the positioning drive module, the anti-position drive module, the positioning simulation module and the anti-position simulation module.

2. The turnout simulation load device according to claim 1, characterized in that: The positioning simulation module includes a fifth switch element and a first relay, the first end of the fifth switch element is respectively connected to a DC power supply and a forty-third connection end of the first relay, the second end of the fifth switch element is respectively connected to an output end of the positioning drive module and a first end of a coil of the first relay, the second end of the coil of the first relay is grounded, the third end of the fifth switch element is connected to the protection switch, the fifty-third connection end and the sixty-third connection end of the first relay are connected to a positioning indication power supply, and the twenty-second connection end and the thirty-second connection end of the first relay are connected to the positioning acquisition port.

3. The turnout simulation load device according to claim 2, characterized in that: The reverse position simulation module includes a sixth switch element and a second relay, wherein the first end of the sixth switch element is respectively connected to the DC power supply and the forty-third connection end of the second relay, the second end of the sixth switch element is respectively connected to the output end of the reverse position driving module, the eleventh connection end of the first relay and the first end of the coil of the second relay, the second end of the coil of the second relay is grounded, the third end of the sixth switch element is connected to the protection switch, the fifty-third connection end and the sixty-third connection end of the second relay are connected to the reverse position indicating power supply, the twenty-second connection end and the thirty-second connection end of the second relay are connected to the reverse position acquisition port; the forty-fourth connection end of the first relay is connected to the eleventh connection end of the second relay, the fifty-fourth connection end of the first relay is connected to the twenty-first connection end of the second relay, the sixty-fourth connection end of the first relay is connected to the thirty-first connection end of the second relay, the twelfth connection end of the first relay is connected to the forty-fourth connection end of the second relay, the twenty-first connection end of the first relay is connected to the fifty-fourth connection end of the second relay, the thirty-first connection end of the first relay is connected to the sixty-fourth connection end of the second relay, and the twelfth connection end of the second relay is connected to the second end of the fifth switch element.

4. The turnout simulation load device according to claim 1, characterized in that: The positioning drive module includes a third switch element, a fourth switch element, a positioning rectifier and filter submodule, a positioning sampling submodule and a positioning drive element. The first end of the third switch element and the first end of the fourth switch element are both connected to the drive output interface. The positioning rectifier and filter submodule and the positioning sampling submodule are connected between the second end of the third switch element, the second end of the fourth switch element and the positioning drive element. The third end of the third switch element and the third end of the fourth switch element are both connected to the protection switch. The positioning sampling submodule is also connected to the real-time acquisition unit. The output end of the positioning drive element is connected to the positioning simulation module.

5. The turnout simulation load device according to claim 4, characterized in that: The positioning rectification and filtering submodule includes a third semiconductor element, a second filtering element and a fourth semiconductor element; the positioning sampling submodule includes a fourth sampling element, a fifth sampling element and a sixth sampling element, the anode of the third semiconductor element is connected to the second end of the third switch element, the cathode of the third semiconductor element is respectively connected to the first end of the second filtering element and the first end of the fourth sampling element, the second end of the fourth sampling element is respectively connected to the first end of the fifth sampling element and the first input end of the positioning drive element, the third end of the fourth sampling element is connected to the real-time acquisition unit, the cathode of the fourth semiconductor element is connected to the second end of the fourth switch element, the anode of the fourth semiconductor element is respectively connected to the second end of the second filtering element and the first end of the sixth sampling element, and the second end of the sixth sampling element is respectively connected to the second end of the fifth sampling element and the second input end of the positioning drive element.

6. The turnout simulation load device according to claim 5, characterized in that: The third semiconductor element and the fourth semiconductor element are both rectifier diodes, and the second filter element is a filter capacitor; and / or the fourth sampling element is an adjustable resistor, and the fifth sampling element and the sixth sampling element are both resistors.

7. The turnout simulation load device according to claim 1, characterized in that: The inverted driving module includes a first switch element, a second switch element, an inverted rectification and filtering submodule, an inverted sampling submodule and an inverted driving element. The first end of the first switch element and the first end of the first switch element are both connected to the driving output interface. The inverted rectification and filtering submodule and the inverted sampling submodule are connected between the second end of the first switch element, the second end of the second switch element and the inverted driving element. The third end of the first switch element and the third end of the second switch element are both connected to the protection switch. The inverted sampling submodule is also connected to the real-time acquisition unit. The output end of the inverted driving element is connected to the inverted simulation module.

8. The turnout simulation load device according to claim 7, characterized in that: The inverted rectifying and filtering submodule includes a first semiconductor element, a first filtering element, and a second semiconductor element; the inverted sampling submodule includes a first sampling element, a second sampling element, and a third sampling element, wherein the cathode of the first semiconductor element is connected to the second end of the first switching element, the anode of the first semiconductor element is respectively connected to the first end of the first filtering element and the first end of the first sampling element, the second end of the first sampling element is respectively connected to the first end of the second sampling element and the first input end of the inverted driving element, the third end of the first sampling element is connected to the real-time acquisition unit, the anode of the second semiconductor element is connected to the second end of the second switching element, the cathode of the second semiconductor element is respectively connected to the second end of the first filtering element and the first end of the third sampling element, and the second end of the third sampling element is respectively connected to the second end of the second sampling element and the second input end of the inverted driving element.

9. The turnout simulation load device according to claim 8, characterized in that: The first semiconductor element and the second semiconductor element are both rectifier diodes, and the first filter element is a filter capacitor; and / or the first sampling element is an adjustable resistor, and the second sampling element and the third sampling element are both resistors.

10. The turnout simulation load device according to any one of claims 1 to 9, characterized in that: The switch elements of the positioning simulation module, the anti-position simulation module, the positioning drive module and the anti-position drive module are all electronic relays; and / or, the positioning drive element of the positioning drive module and the anti-position drive element of the anti-position drive module are all photoelectric coupling elements.

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