Base assembly and lens driving device

Abstract

The present invention belongs to the technical field of optical imaging devices, and particularly relates to a base assembly and a lens driving device. The base assembly includes a base, a reset mechanism, and a substrate. The substrate is movably mounted in the inner cavity of the base through the reset mechanism. The reset mechanism uses a reed, and the reed has a reed outer ring, one or several reed middle rings, and a reed inner ring. The reed outer ring is connected to the inner cavity of the base, the reed middle ring is suspended in the inner cavity of the base, and the reed inner ring is connected to the inner substrate. A coil group is arranged on the substrate. When the coil group is energized, it cooperates with a magnet group to drive the substrate to move at least on a plane perpendicular to the optical axis. The present invention can achieve a larger range of movement, achieve better zooming and / or anti-shake effects, and thus obtain better imaging quality. The present invention also uses a reed with a three-layer structure as the reset mechanism, so that the reset operation of the substrate in the optical axis direction, the first direction, and the second direction has a good reset effect.

Description

Technical Field

[0001] The present invention belongs to the technical field of optical imaging devices, and particularly relates to a base assembly and a lens driving device. Background Art

[0002] With the development of technology, many current electronic devices (such as smart phones or digital cameras) have the function of taking photos or videos. The use of these electronic devices is becoming more and more common, and they are developing towards a convenient, thin and light design direction to provide users with more choices. However, sometimes the photos taken during the current mobile phone shooting are blurry, that is, the captured images are not clear enough, and even double images or blurs occur. These reasons, in addition to occasional out-of-focus (that is, the camera fails to focus normally), are largely due to the slight jitter during the exposure of the photographed scene.

[0003] Generally speaking, this kind of slight jitter phenomenon often occurs under handheld conditions, which will cause the deviation of the lens of the imaging device, resulting in the deterioration of the image quality captured by the image sensor. Therefore, in recent years, the demand for the development of anti-shake technology functions is relatively large.

[0004] However, most of the existing technologies achieve optical zoom and optical anti-shake functions through the movement of the same component (carrier). The movement range of the carrier is limited by weight, volume, etc., and it is impossible to effectively solve the problem of blurry photos caused by hand jitter during the shooting process. Summary of the Invention

[0005] Aiming at the above technical problems, the present invention aims to provide a base assembly and a lens driving device.

[0006] A base assembly, the base assembly includes a base, a reset mechanism and a substrate. The base has a base inner cavity with an open top. The substrate is movably installed in the base inner cavity through the reset mechanism. The reset mechanism adopts a multi-layer structure of reed pieces. The reed pieces have a reed outer ring, one or several reed middle rings and a reed inner ring connected in sequence from outside to inside. The reed outer ring is connected to the base inner cavity. The reed middle rings are suspended in the base inner cavity. The reed inner ring is connected to the inner substrate.

[0007] A coil group for cooperating with a magnet group is arranged on the substrate. When the coil group is energized, it cooperates with the magnet group to drive the substrate to move at least on a plane perpendicular to the optical axis.

[0008] Optionally, a substrate movement avoidance opening communicating with the inside and outside is arranged in the middle of the base inner cavity, and the substrate movement avoidance opening is located below the substrate.

[0009] Optionally, support portions are respectively provided on two opposite sides along a first direction inside the base cavity, and the first direction is perpendicular to the optical axis direction;

[0010] The bottom ends of two opposite sides of the outer ring of the reed along the first direction are respectively connected to the two support portions.

[0011] Optionally, a substrate receiving groove is dug on the outer side of the top end of the substrate, and the inner ring of the reed is installed in the substrate receiving groove.

[0012] Optionally, the connection positions of one layer of the reed with the outer layer and the inner layer are staggered, so that the layers in the reed are connected in an interleaved manner.

[0013] Optionally, reed through holes are provided on the side edges of the outer ring of the reed having connection positions, and one or several middle rings of the reed are also provided with reed through holes. The reed through holes on the middle ring of the reed are provided on the side edges away from the side where the reed through holes on its outer layer are located, so that the reed through holes on each layer of the reed are also connected in an interleaved manner.

[0014] Optionally, the side edge of the outer ring of the reed away from the connection position is connected to the inner cavity of the base.

[0015] Optionally, each layer of the reed is a rectangular frame structure, and the reed has an outer ring of the reed, a middle ring of the reed, and an inner ring of the reed that are connected in sequence from outside to inside;

[0016] The outer sides of two opposite sides of the inner ring of the reed along the first direction are connected to the inner sides of two opposite sides of the middle ring of the reed along the first direction, and the outer sides of two opposite sides of the middle ring of the reed along the second direction are connected to the inner sides of two opposite sides of the outer ring of the reed along the second direction;

[0017] The bottom of two opposite sides of the outer ring of the reed along the first direction is connected to the inner cavity of the base, and the inner ring of the reed is connected to the outer side of the top end of the substrate;

[0018] Wherein, the first direction is perpendicular to the optical axis direction, and the second direction is perpendicular to the first direction and the optical axis direction respectively.

[0019] Optionally, the base assembly further includes a circuit board, the circuit board is arranged on the base, and the circuit board supplies power to the coil group on the substrate.

[0020] Optionally, the circuit board is an FPC board.

[0021] Optionally, the circuit board includes a circuit connection portion, a circuit board outer ring, and a circuit board inner ring that are connected in sequence. The circuit connection portion is connected to the base outside the inner cavity of the base, the circuit board outer ring is suspended and surrounds the outside of the reed, and the circuit board inner ring is connected to the top end of the inner ring of the reed.

[0022] The bottom end of the outer ring of the circuit board is connected to the inner ring of the circuit board. The connection part between the circuit connection part and the bottom end of the outer ring of the circuit board passes through the base avoidance opening on the base, and the base avoidance opening communicates the inside and outside of the base cavity.

[0023] Optionally, the base assembly further includes a movable seat, the movable seat is installed at the upper end of the substrate, the coil group is installed at the top end of the movable seat, and a light avoidance opening is provided in the middle of the movable seat.

[0024] Optionally, the coil group has four coils, and the four coils are arranged around the light avoidance opening.

[0025] Optionally, the movable seat is located inside the base cavity.

[0026] Optionally, a sensor installation opening is provided in the middle of the substrate, and the base assembly further includes an image sensor, and the image sensor is installed in the sensor installation opening.

[0027] A lens driving device, the lens driving device includes the base assembly provided above in the present invention.

[0028] Advantageous effects: The present invention has at least one or more of the following advantages:

[0029] 1. The moving parts for realizing the zooming and / or anti-shake functions in the present invention are located on the substrate, that is, the chip part. By moving the chip part, the lens zooming and / or anti-shake effects are achieved. It is relatively independent of the lens part, can achieve a larger range of movement, achieve better zooming and / or anti-shake effects, and thus obtain better imaging quality.

[0030] The present invention also uses a reed with a three-layer structure as a reset mechanism, so that the reset operation of the substrate in the optical axis direction, the first direction and the second direction has a good reset effect.

[0031] 2. Since the three-layer structure of the reed in the present invention is designed inside and outside, compared with the design of the upper reed and the lower reed with a height increasing effect in the up and down relationship, the height of the reed is reduced, and the position of the substrate becomes correspondingly lower. Therefore, a substrate movement avoidance opening is provided at the center position of the base to leave a moving space for the substrate.

[0032] 3. The circuit board of the present invention has an outer ring and an inner ring of the circuit board. It can not only supply power to the image sensor and the coil group, but also, with this reasonable design, the circuit board has a certain elastic potential energy, which can play an auxiliary role in the reset of the substrate and the movable seat.

[0033] In addition, since the height of the substrate becomes lower, the outer ring of the circuit board forms the inner ring of the circuit board from one bottom end to the center position, that is, the bottom end of the outer ring of the circuit board is connected to the inner ring of the circuit board. Description of the Drawings

[0034] Figure 1 is a schematic structural diagram of the present invention;

[0035] Figure 2 is Figure 1 the top view of;

[0036] Figure 3 is Figure 2 the A-A cross-sectional view of;

[0037] Figure 4 is Figure 1 the exploded view of;

[0038] Figure 5 is Figure 4 the further exploded view of;

[0039] Figure 6 is Figure 4 the partial structural schematic diagram of;

[0040] Figure 7 is the exploded view of the positional relationship between the substrate, the reset mechanism and the image sensor of the present invention;

[0041] Figure 8 is the exploded view of a structure of the lens driving device of the present invention. Detailed Description of the Preferred Embodiment

[0042] The following will describe in detail the preferred embodiments of the present invention with reference to the drawings so as to more clearly understand the purpose, features and advantages of the present invention. It should be understood that the embodiments shown in the drawings are not limitations on the scope of the present invention, but only to illustrate the essential spirit of the technical solution of the present invention.

[0043] In the following description, certain specific details are set forth in order to provide a thorough understanding of various disclosed embodiments. However, one or more of these specific details may be practiced without one or more of these specific details. In other instances, well-known devices, structures and techniques associated with the present application may not be shown or described in detail so as not to unnecessarily obscure the description of the embodiments.

[0044] References throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Additionally, the particular features, structures, or characteristics may be combined in any manner in one or more embodiments.

[0045] In the following description, for the purpose of clearly showing the structure and working mode of the present invention, many directional terms will be used for description. However, terms such as "front", "rear", "left", "right", "outer", "inner", "outward", "inward", "up", "down", etc. should be understood as convenient terms and should not be construed as limiting terms.

[0046] In the following description, for the sake of convenience of description, the concept of "optical axis" is introduced to represent the propagation direction of light rays within an optical element. It is an abstract concept and does not refer to the existence of a physically meaningful axis.

[0047] Referring to Figures 1 to 7 , an embodiment of the present invention provides a base assembly 1, which is applied in a lens driving device and can be used as a part of the lens driving device to achieve the zooming and / or anti-shake functions of the lens.

[0048] The base assembly 1 includes a base 10, a reset mechanism, and a substrate 20. Among them, the reset mechanism adopts a multi-layer structure of reed pieces, and the reed pieces have a reed piece outer ring 30, one or several reed piece middle rings 40, and a reed piece inner ring 50 that are connected in sequence from the outside to the inside.

[0049] The base 10 has a base inner cavity with an open top. The reset mechanism is located inside the base inner cavity, and the substrate 20 is movably installed in the base inner cavity through the reset mechanism. Specifically, the reed piece outer ring 30 is connected to the base inner cavity, the reed piece middle rings 40 are suspended in the base inner cavity, and the reed piece inner ring 50 is connected to the inner substrate 20.

[0050] The substrate 20 is provided with a coil group for cooperating with a magnet group. When the coil group is energized, it cooperates with the magnet group to drive the substrate 20 to move along the optical axis direction and / or on a plane perpendicular to the optical axis.

[0051] The coil group has several coils 60, and the magnet group has several magnets that are arranged opposite to the coils 60 in the same number. When a part of the coils 60 is energized, it cooperates with the corresponding part of the magnets to drive the substrate 20 to move along the optical axis direction. This part of the coils 60 can be defined as zoom coils. When another part of the coils 60 is energized, it cooperates with the corresponding part of the magnets to drive the substrate 20 to move on a plane perpendicular to the optical axis. This part of the coils 60 can be defined as anti-shake coils.

[0052] Among them, the movement directions perpendicular to the optical axis include two directions, namely the first direction perpendicular to the optical axis and the second direction perpendicular to the first direction. If the first direction is defined as the X-axis direction, the second direction is the Y-axis direction, and the optical axis direction is the Z-axis direction.

[0053] The magnet corresponding to the zoom coil and the magnet corresponding to the anti-shake coil can be the same or different. That is to say, the zoom coil and the anti-shake coil can share a set of magnet groups.

[0054] Of course, when the coil group is energized in the present invention, it can cooperate with the magnet group to drive the substrate 20 to move only along the optical axis direction or only on the plane perpendicular to the optical axis.

[0055] After the above design of the present invention, the movement of the substrate 20 can be independent of the lens part, and a larger range of movement can be achieved, realizing better zooming and / or anti-shake effects, thereby obtaining better imaging quality. The present invention also designs a reset mechanism, so that after the substrate 20 moves, a better reset effect can be achieved under the action of the reset mechanism.

[0056] In one embodiment, the inner cavity of the base 10 is a quasi-rectangular cavity. Specifically, a rectangular frame can be set on the base 10, and the inner cavity of the base is formed inside the rectangular frame.

[0057] In one embodiment, referring to Figure 3 , a substrate movement avoidance opening 11 communicating the inside and outside of the inner cavity of the base is provided in the middle of the inner cavity of the base, and the substrate movement avoidance opening 11 is located below the substrate 20.

[0058] Since the three-layer structure of the reed in the present invention is designed inside and outside, compared with the design of the upper reed and the lower reed with a height-lifting effect in the up-and-down relationship, the height of the reed is reduced, and the position of the substrate 20 becomes correspondingly lower. Therefore, a substrate movement avoidance opening 11 is provided at the center position of the base 10 to leave an activity space for the substrate 20.

[0059] Of course, a convex device for raising the reed can also be provided in the inner cavity of the base so that the substrate 20 is lifted to a position where even if the substrate 20 moves, it will not abut against the bottom end of the inner cavity of the base. At this time, the substrate movement avoidance opening 11 may not be provided.

[0060] In one embodiment, referring to Figure 5 , two support portions 12 are respectively provided on two opposite sides of the inner cavity of the base along the first direction.

[0061] The bottom ends of two pairs of opposite sides of the reed outer ring 30 in the first direction are respectively connected to the two support portions 12.

[0062] In one embodiment, referring to Figure 3 and Figure 7, a substrate receiving groove 21 is dug on the outer side of the top end of the substrate 20, and the inner ring 50 of the reed is installed in the substrate receiving groove 21.

[0063] In one embodiment, the connection positions of one layer of the reed with the outer layer and the inner layer are staggered, resulting in the staggered connection of each layer in the reed.

[0064] For example, when each layer in the reed is a rectangular frame structure, when the connection position of one layer with the outer layer is in the first direction, the connection position of this layer with the inner layer is in the second direction. Preferably, when the connection positions of one layer with the outer layer are on the two opposite sides in the first direction, the connection positions with the inner layer are on the two opposite sides in the second direction. More preferably, when the connection positions of one layer with the outer layer are in the middle of the two opposite sides in the first direction, the connection positions of this layer with the inner layer are in the middle of the two opposite sides in the second direction. Of course, the above position relationships can also be reversed.

[0065] Refer to Figure 7 , taking the middle ring 40 of the reed as an example, the connection positions 40a of the middle ring 40 of the reed with the outer ring 30 of the reed on the outside are in the middle of the two opposite sides in the second direction, and the connection positions 40b of the middle ring 40 of the reed with the inner ring 50 of the reed on the inside are in the middle of the two opposite sides in the first direction.

[0066] In one embodiment, refer to Figure 7 , there are reed through holes on the side edges of the reed outer ring 30 with connection positions. The reed through holes on the reed outer ring 30 are defined as outer ring reed through holes 31. One or several middle rings 40 of the reed are provided with reed through holes. The reed through holes on the middle rings 40 of the reed are defined as middle ring reed through holes 41. The middle ring reed through holes 41 are arranged on the side edges far from the reed through holes on their outer layers, resulting in the staggered connection of the reed through holes on each layer in the reed.

[0067] If there are two or more middle rings 40 in the reed, as Figure 7 shown, one or more middle rings of the reed are also provided inside the inner side of the middle ring 40 of the reed. At this time, because Figure 7 the middle ring reed through holes 41 of the middle ring 40 of the reed in

[0068] are arranged on the two opposite sides in the first direction, the reed through holes on another middle ring 40 adjacent to the inner side of this middle ring 40 of the reed are arranged on the two opposite sides in the second direction, and so on. The reed through holes on adjacent two layers are respectively located in the first direction and the second direction.

[0069] In this embodiment, no reed through holes are provided on the inner ring 50 of the reed, so that the bottom end of the inner ring 50 of the reed is fixedly connected to the substrate 20, and the connection between the two is stable.

[0070] In one embodiment, the side of the outer ring 30 of the reed away from the connection position is connected to the inner cavity of the base.

[0071] In one embodiment, referring to Figure 6 and Figure 7 , each layer of the reed is a rectangular frame structure. The reed has an outer ring 30 of the reed, a middle ring 40 of the reed, and an inner ring 50 of the reed that are connected in sequence from the outside to the inside. The outer sides of the two pairs of sides of the inner ring 50 of the reed in the first direction are connected to the inner sides of the two pairs of sides of the middle ring 40 of the reed in the first direction. The outer sides of the two pairs of sides of the middle ring 40 of the reed in the second direction are connected to the inner sides of the two pairs of sides of the outer ring 30 of the reed in the second direction. The bottoms of the two pairs of sides of the outer ring 30 of the reed in the first direction are connected to the inner cavity of the base. The inner ring 50 of the reed is connected to the outer side of the top of the substrate 20.

[0072] Preferably, the middle parts of the outer sides of the two pairs of sides of the inner ring 50 of the reed in the first direction are connected to the middle parts of the inner sides of the two pairs of sides of the middle ring 40 of the reed in the first direction. The middle parts of the outer sides of the two pairs of sides of the middle ring 40 of the reed in the second direction are connected to the middle parts of the inner sides of the two pairs of sides of the outer ring 30 of the reed in the second direction.

[0073] Preferably, two pairs of sides of the outer ring 30 of the reed in the second direction are provided with outer ring reed through holes 31, and two pairs of sides of the middle ring 40 of the reed in the first direction are provided with middle ring reed through holes 41.

[0074] Preferably, the length direction of the outer ring reed through hole 31 is the first direction. The length direction of the middle ring reed through hole 41 is the second direction.

[0075] Preferably, there are two outer ring reed through holes 31, and the two outer ring reed through holes 31 are arranged side by side in the first direction. There are two middle ring reed through holes 41, and the two middle ring reed through holes 41 are arranged side by side in the second direction.

[0076] In one embodiment, referring to Figures 1 to 5 , the base assembly 1 further includes a circuit board 70. The circuit board 70 is arranged on the base 10 and is mainly used for circuit transmission. The circuit board 70 supplies power to the coil group on the substrate 20.

[0077] Of course, when an image sensor 90 is installed on the substrate 20, the circuit board 70 also supplies power to the image sensor 90 at the same time.

[0078] In one embodiment, the circuit board 70 is an FPC board.

[0079] In one embodiment, referring to Figures 1 to 5, the circuit board 70 includes a circuit connection portion 71, a circuit board outer ring 72, and a circuit board inner ring 73 that are connected in sequence. The circuit connection portion 71 is connected to the base 10 outside the inner cavity of the base. The circuit board outer ring 72 is suspended and surrounds the outside and above of the reed. The circuit board inner ring 73 is connected to the top of the reed inner ring 50 at the top of the substrate 20.

[0080] The bottom end of the circuit board outer ring 72 is connected to the circuit board inner ring 73. The connection portion between the circuit connection portion 71 and the bottom end of the circuit board outer ring 72 passes through the base avoidance opening 13 on the base 10, and the base avoidance opening 13 communicates the inside and outside of the inner cavity of the base.

[0081] The circuit board 70 designed above extends from the part of the circuit connection portion 71 outside the inner cavity of the base through the base avoidance opening 13 and then enters the inner cavity of the base and is connected to the circuit board outer ring 72. The circuit board outer ring 72 is suspended and surrounds the outside of the reed in a circle and extends at the bottom end on one side and then is connected to the circuit board inner ring 73 at the central position. In addition to realizing the power supply function, the circuit board 70 has a certain elastic potential energy due to the cooperative design of the circuit board outer ring 72 and the circuit board inner ring 73, which can play an auxiliary role in the reset of the substrate 20.

[0082] Since there is no obstruction between the circuit board outer ring 72 and the circuit board inner ring 73 and there is no need to pass through other components, other components do not need to be provided with avoidance openings for avoidance.

[0083] In addition, since the height of the substrate becomes lower, the circuit board outer ring 72 forms the circuit board inner ring 73 from the bottom end on one side to the central position, that is, the bottom end of the circuit board outer ring 72 is connected to the circuit board inner ring 73.

[0084] In specific implementation, preferably, the middle part of the inner side of the circuit connection portion 71 is connected to the middle part of the bottom end on one side of the circuit board outer ring 72, and the middle part of the bottom end on the opposite side of the circuit board outer ring 72 is connected to the middle part of the outer side on one side of the circuit board inner ring 73.

[0085] In specific implementation, when a circle of substrate receiving grooves 21 is provided on the outer side of the top end of the substrate 20, the reed inner ring 50 and the circuit board inner ring 73 are both installed in the substrate receiving grooves 21.

[0086] In one embodiment, both the circuit board outer ring 72 and the circuit board inner ring 73 adopt a rectangular frame structure.

[0087] In one embodiment, referring to Figures 1 to 5 , the base assembly 1 further includes a movable seat 80. The movable seat 80 is installed on the upper end of the substrate 20. The coil group is installed on the top end of the movable seat 80. A light avoidance opening 81 is provided in the middle of the movable seat 80 so that light can pass through the light avoidance opening 81 and irradiate the image sensor 90 in the substrate 20 below it.

[0088] In the design of this embodiment, when the coil group is energized, the magnet group cooperating with it drives the substrate 20 and the movable seat 80 to move together.

[0089] In one embodiment, the movable seat 80 is a movable seat 80 having a hollow rectangular cross-sectional structure.

[0090] In one embodiment, referring to Figure 1 , Figure 2 , Figure 4 and Figure 5 , the coil group has four coils 60, and the four coils 60 are arranged around the light avoidance opening 81.

[0091] In one embodiment, referring to Figure 3 , the movable seat 80 is located inside the inner cavity of the base.

[0092] Preferably, the movable seat 80 is located inside the inner ring 72 of the circuit board.

[0093] In one embodiment, referring to Figures 1 to 7 , a sensor mounting opening is provided in the middle of the substrate 20, and the base assembly 1 further includes an image sensor 90, and the image sensor 90 is mounted in the sensor mounting opening.

[0094] In the design of this embodiment, when the coil group is energized, the magnet group cooperating with it drives the substrate 20 and the image sensor 90 to move together.

[0095] In one embodiment, the substrate 20 is a substrate having a hollow rectangular cross-sectional structure.

[0096] The embodiment of the present invention further provides a lens driving device, and the lens driving device includes the base assembly 1 provided in each of the above embodiments of the present invention.

[0097] Embodiment 1:

[0098] Referring to Figure 8 , the lens driving device of this embodiment includes a base assembly 1, a housing 2, a carrier reed 3, a magnet group having a plurality of magnets 4, a carrier 5, and a zoom coil 6.

[0099] A receiving cavity is formed between the base assembly 1 and the housing 2, and each component inside the base assembly 1, the carrier reed 3, the magnet 4, the carrier 5, and the zoom coil 6 are all arranged in the receiving cavity.

[0100] When the base assembly 1 has a circuit board, a part of the circuit board extends out of the receiving cavity for connection with an external device. Specifically, when the circuit board has a circuit connection portion, the circuit connection portion extends out of the receiving cavity.

[0101] The carrier spring piece 3 is connected between the housing 2 and the carrier 5. The magnet 4 is disposed inside the housing 2. The carrier 5 is located inside the housing 2 on the inner side of the magnet 4. Usually, the carrier 5 is provided with an optical element mounting hole for mounting an optical element. A zoom coil 6 is disposed on the outer wall of the carrier 5. The zoom coil 6 is disposed opposite to the inner side of the magnet 4. When the zoom coil 6 is energized, it cooperates with the magnet 4 to drive the carrier 5 to move along the optical axis direction, realizing the zoom function.

[0102] The coil group of the base assembly 1 serves as an anti-shake coil and is disposed opposite to the bottom end of the magnet 4. When the anti-shake coil is energized, it cooperates with the magnet 4 to drive the substrate 20 to move in a first direction and a second direction perpendicular to the optical axis, realizing the anti-shake function.

[0103] The base of the base assembly 1 and the housing 2 can be connected to each other, can also not be connected to each other, or can be fixed respectively through other external components. When the two are not connected, it is preferably adsorbed to each other through an adsorption assembly. Of course, the adsorption assembly can also not be provided, which is determined according to the requirements in actual applications.

[0104] Of course, when the image sensor 90 is mounted in the middle of the substrate 20 and the carrier 5 is mounted with an optical element, the image sensor 90 is aligned with the optical element to receive the light transmitted through the optical element.

[0105] Embodiment 2:

[0106] Compared with Embodiment 1, the lens driving device of this embodiment includes a base assembly 1, a housing, a magnet, and a carrier, and does not include a carrier spring piece and a zoom coil. At this time, different from Embodiment 1, the carrier is fixed inside the housing. Part of the coil group of the base assembly 1 serves as a zoom coil, and the other part serves as an anti-shake coil. The zoom coil and the anti-shake coil are respectively disposed opposite to the magnet 4 to realize the zoom and anti-shake functions of the substrate 20.

[0107] The lens driving device of the present invention can also adopt other deformations. For example, the carrier is relatively stationary, and an existing other zoom structure is adopted to realize the zoom function, and the base assembly 1 is adopted to realize the anti-shake function. As long as an existing device that can cooperate with the base assembly 1 of the present invention to realize the zoom and / or anti-shake function can be combined to form a lens driving device, which is not limited to Embodiment 1 and Embodiment 2 of the present invention.

[0108] The preferred embodiments of the present invention have been described in detail above. However, it should be understood that after reading the above teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention. These equivalent forms also fall within the scope defined by the appended claims of this application.

Claims

1. A base assembly, characterized in that, The base assembly includes a base, a reset mechanism, and a substrate. The base has a base inner cavity with an open top. The substrate is movably mounted in the base inner cavity through the reset mechanism. The reset mechanism uses a multi-layer structure reed. The reed has a reed outer ring, one or several reed middle rings, and a reed inner ring connected in sequence from outside to inside. The reed outer ring is connected to the base inner cavity. The reed middle rings are suspended in the base inner cavity. The reed inner ring is connected to the inner substrate. A coil group for cooperating with a magnet group is arranged on the substrate. When the coil group is energized, it cooperates with the magnet group to drive the substrate to move at least in a plane perpendicular to the optical axis. The base assembly further includes a circuit board. The circuit board is arranged on the base and supplies power to the coil group on the substrate. The circuit board is an FPC board. The circuit board includes a circuit connection part, a circuit board outer ring, and a circuit board inner ring connected in sequence. The circuit connection part is connected to the base outside the base inner cavity. The circuit board outer ring is suspended and surrounds the outside of the reed. The circuit board inner ring is connected to the top end of the reed inner ring.

2. The base assembly according to claim 1, wherein, A substrate movement avoidance opening communicating inside and outside is arranged in the middle of the base inner cavity. The substrate movement avoidance opening is located below the substrate.

3. The base assembly according to claim 1, wherein Support parts are respectively arranged on two opposite sides in the first direction in the base inner cavity. The first direction is perpendicular to the optical axis direction. The bottom ends of two opposite sides in the first direction on the reed outer ring are respectively connected to the two support parts. And / or, a substrate accommodation groove is dug on the outer side of the top end of the substrate. The reed inner ring is installed in the substrate accommodation groove. And / or, the connection positions of one layer of the reed with the outer layer and the inner layer are staggered, so that the layers of the reed are cross-connected.

4. The base assembly according to claim 3, wherein Reed through holes are arranged on the side edges with connection positions on the reed outer ring. One or several reed through holes are also arranged on the reed middle rings. The reed through holes on the reed middle rings are arranged on the side edges far from the side where the reed through holes on the outer layer are located, so that the reed through holes on each layer of the reed are also cross-connected. The side edge of the reed outer ring far from the connection position is connected to the base inner cavity.

5. The base assembly according to claim 1, wherein Each layer of the reed is a rectangular frame structure. The reed has one reed outer ring, one reed middle ring, and one reed inner ring connected in sequence from outside to inside. The outer sides of two opposite sides in the first direction on the reed inner ring are connected to the inner sides of two opposite sides in the first direction on the reed middle ring. The outer sides of two opposite sides in the second direction on the reed middle ring are connected to the inner sides of two opposite sides in the second direction on the reed outer ring. The bottoms of two opposite sides in the first direction on the reed outer ring are connected to the base inner cavity. The reed inner ring is connected to the outer side of the top end of the substrate. Wherein, the first direction is perpendicular to the optical axis direction, and the second direction is respectively perpendicular to the first direction and the optical axis direction.

6. The base assembly according to claim 1, characterized in that A sensor installation opening is arranged in the middle of the substrate. The base assembly further includes an image sensor. The image sensor is installed in the sensor installation opening.

7. The base assembly according to any one of claims 1 to 6, characterized in that The base assembly further includes a movable seat, the movable seat is installed at the upper end of the substrate, the coil group is installed at the top of the movable seat, and a light avoidance opening is provided in the middle of the movable seat.

8. The base assembly according to claim 1, wherein The bottom end of the outer ring of the circuit board is connected to the inner ring of the circuit board, and the connection part between the circuit connection part and the bottom end of the outer ring of the circuit board passes through the base avoidance opening on the base, and the base avoidance opening communicates the inside and outside of the base cavity.

9. The base assembly according to claim 7, wherein, The coil group has four coils, and the four coils are arranged around the light avoidance opening; And / or, the movable seat is located inside the base cavity.

10. A lens driving device, characterized in that, The lens driving device includes the base assembly according to any one of claims 1 to 9.

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