Terminal device

Abstract

Terminal equipment comprises a shell and a heat dissipation assembly located in the shell, the inner space of the shell comprises a hot area and a cold area, the heat dissipation assembly comprises at least two heat exchangers, a pump and a connecting pipe, one heat exchanger is located in the hot area, the other heat exchangers are located in the cold area, and the connecting pipe is connected between the two heat exchangers to form a heat exchange circulation pipeline. The pump is arranged on the heat exchange circulation pipeline so as to achieve heat exchange between the hot area and the heat exchange circulation pipeline. According to the terminal equipment provided by the invention, active liquid cooling heat dissipation in the terminal equipment can be realized, and the temperature uniformity of the terminal equipment is improved.

Description

Technical Field

[0001] The present application relates to the technical field related to heat dissipation, and in particular to a terminal device. Background Art

[0002] As the functions of terminal devices (such as mobile phones, tablets, and notebooks) become more and more abundant, the performance is getting stronger and stronger, and the heat generation is getting higher and higher. The main heat dissipation methods currently used in terminal devices are: VC temperature spreader, graphite, and graphene and other passive heat dissipation methods, whose main purpose is to enhance the internal heat conduction of the mobile phone and optimize the temperature uniformity of the mobile phone. Due to the limitations of their respective mechanisms, these passive heat conduction methods are difficult to significantly improve the heat dissipation capacity of the mobile phone. For example, the insufficient capillary force of the VC temperature spreader will lead to slow liquid return and reduced heat uniformity performance; graphite Z has poor thermal conductivity, and the density limit determines the boundary of thermal conductivity. Summary of the invention

[0003] The present application provides a terminal device, wherein the internal space of the terminal device is provided with a heat dissipation component, which can realize active liquid cooling and improve the temperature uniformity of the terminal device.

[0004] In a first aspect, an embodiment of the present application provides a terminal device, comprising a shell and a heat dissipation component located inside the shell, the internal space of the shell comprising a hot zone and a cold zone, the heat dissipation component comprising at least two heat exchangers, a pump and a connecting pipe, one of the heat exchangers being located in the hot zone, and the other of the heat exchangers being located in the cold zone, the connecting pipe being connected between the at least two heat exchangers to form a heat exchange circulation pipeline, and the pump being arranged in the heat exchange circulation pipeline to realize heat exchange between the hot zone and the cold zone.

[0005] The embodiment of the present application drives the refrigerant to circulate in the heat exchange circulation pipeline by a pump, and transmits the refrigerant between at least two heat exchangers to achieve heat dissipation. For example, one of the heat exchangers is a cooler, and the other heat exchangers are radiators. The cooler is connected to the heating device in the hot zone of the terminal device, and the radiator is located in the cold zone. The embodiment of the present application utilizes the driving force of the pump to bring the refrigerant with a higher temperature in the cooler to the radiator, and dissipates heat at the position of the radiator to make the refrigerant cool, thereby realizing an active liquid cooling heat dissipation system. Compared with the passive liquid cooling heat dissipation method, the embodiment of the present application uses a pump as a power source, and the heat dissipation component can transmit the refrigerant farther, and the distance between the cooler and the radiator can be designed to be longer as needed. Therefore, the heat dissipation component can bring the heat from the hot zone to the cold zone, which can improve the heat dissipation efficiency and make the terminal device have a better temperature uniformity effect.

[0006] In one possible implementation, the terminal device includes a mainboard, a heating device and a battery located inside the shell, the heating device is arranged on the mainboard, the terminal device includes a top end and a bottom end arranged opposite to each other, the battery includes a first end and a second end arranged opposite to each other, the first end is located at an edge of the battery facing the top end, and the second end is located at an edge of the battery facing the bottom end, the mainboard is located between the first end and the top end, and the heat exchanger and the heating device located in the hot zone are thermally connected.

[0007] This embodiment restricts the positional relationship between the mainboard and the battery inside the housing to an application scenario where the terminal device is a mobile phone. The heat exchanger located in the hot zone is thermally connected to the heating device on the mainboard to dissipate heat from the heating device. For mobile phones, due to their limited internal space and severe heat dissipation requirements, the heat dissipation component is set inside the mobile phone, so that an active liquid cooling system can be formed inside the mobile phone, which can improve the heat dissipation effect and temperature uniformity of the mobile phone.

[0008] In one possible implementation, at least part of the heat exchanger located in the cold zone is located between the second end and the bottom end. In the application scenario where the aforementioned terminal device is a mobile phone, the heat exchanger defining the cold zone is located between the second end of the battery and the bottom end of the terminal device. The heat dissipation assembly provided by this solution can transfer the heat between the first end of the battery and the top end of the terminal device to between the second end of the battery and the bottom end of the terminal device, with a long transfer distance, and such a transfer distance cannot be achieved by a temperature equalizing plate.

[0009] In one possible implementation, at least part of the heat exchanger and part of the battery located in the cold zone overlap and are adjacent to the second end. In the application scenario where the aforementioned terminal device is a mobile phone, the heat exchanger that defines the cold zone is located within the projection area of ​​the battery and adjacent to the second end of the battery. The heat dissipation assembly provided by this solution can transfer the heat between the first end of the battery and the top of the terminal device to the area where the battery is located and adjacent to the second end. The transfer distance is long, and such a transfer distance is also impossible to achieve with a temperature equalizing plate.

[0010] In a possible implementation, the terminal device includes a display screen, the housing includes a middle frame and a back shell, the display screen and the back shell are distributed on opposite sides of the middle frame, and the heat dissipation component is distributed between the middle frame and the display screen. This solution sets at least two heat exchangers, a pump, and a connecting pipe on the same side of the middle frame, which provides convenience for the assembly process of the terminal device. The connecting pipe does not need to pass through the middle frame, and the heat dissipation component can be assembled into a complete structure and then installed between the middle frame and the display screen. Therefore, this solution has the advantage of easy assembly.

[0011] In one possible implementation, the terminal device includes a display screen, the shell includes a middle frame and a back shell, the display screen and the back shell are distributed on opposite sides of the middle frame, and at least one of the at least two heat exchangers is located between the middle frame and the back shell. This solution provides a specific location arrangement scheme for the heat dissipation component, in which at least one of the at least two heat exchangers is arranged between the middle frame and the back shell. It can be understood that the remaining heat exchangers can be arranged between the middle frame and the display screen. In this way, the heat dissipation components are dispersed on both sides of the middle frame, and the space on both sides of the middle frame can be flexibly used. For example, if there is idle space in the area between the middle frame and the back shell near the small board, a heat exchanger and a pump can be set up. Using the idle space to set up part of the heat dissipation components is conducive to the design of the overall thin size of the terminal device.

[0012] In a possible implementation, the terminal device includes a first body and a second body, the first body and the second body can be folded or unfolded relative to each other, and the heat dissipation component is located inside the first body. In this embodiment, the heat dissipation component is arranged inside the first body, and the connecting pipe does not need to pass through the shaft assembly. Moreover, the main heat source of the hot zone in the first body is concentrated. This embodiment can take into account the solution of heat dissipation and temperature uniformity, and can ensure that the arrangement of the heat dissipation component in the terminal device is simple and easy.

[0013] In a possible implementation, the terminal device includes a first body and a second body, the first body and the second body can be folded or unfolded relative to each other, one of the at least two heat exchangers is located inside the first body, and at least one of the at least two heat exchangers is located inside the second body. This embodiment can conduct heat in the first body to the second body, and dissipate heat through the heat exchanger provided in the second body, which can ensure better temperature uniformity between the first body and the second body.

[0014] In a possible implementation, the terminal device includes a shaft assembly connected between a first body and a second body. In one implementation, the connecting tube is located between the shaft assembly and the flexible screen, and the connecting tube crosses the shaft assembly from the space between the shaft assembly and the flexible screen. In this implementation, the connecting tube crosses the shaft assembly from the interval between the middle door panel and the display screen at the position of the shaft assembly, which can ensure that the connecting tube is bent at a larger angle, which can not only ensure that the internal transmission space of the bent tube remains unobstructed, but also help to ensure the service life and structural safety and stability of the connecting tube.

[0015] In a possible implementation, the connecting tube is located inside the shaft assembly, that is, the connecting tube passes through the inside of the shaft assembly. In this embodiment, the connecting tube passes through the inside of the shaft assembly, and the diameter of the connecting tube can be set larger, because the space inside the shaft assembly is larger than the spacing between the shaft assembly and the display screen. The connecting tube with a larger diameter is conducive to improving the transmission efficiency and ensuring the strength and stability of the structure.

[0016] In a possible implementation, one of the at least two heat exchangers is a cooler, and the other heat exchangers are radiators, the radiators include a first radiator and a second radiator, the pumps include a first pump and a second pump, the connecting pipes include a first connecting pipe and a second connecting pipe, the first pump is connected to the heat exchange circulation pipeline between the first radiator and the cooler through the first connecting pipe, and the second pump is connected to the heat exchange circulation pipeline between the second radiator and the cooler through the second connecting pipe. This solution forms two parallel heat exchange circulation pipelines through a cooler, two radiators, and two pumps, which is conducive to improving heat dissipation efficiency and can also flexibly arrange radiators and pumps.

[0017] In one possible implementation, the heat exchanger includes a plurality of fluid channels, channel inlets and channel outlets, the channel inlets and the channel outlets are used to connect the connecting pipes, and the equivalent diameter of the fluid channel is in the range of 0.05 mm to 0.3 mm (this range includes the endpoints), which can be understood as the equivalent diameter of the fluid channel being greater than or equal to 0.05 mm and less than or equal to 0.3 mm. On the one hand, this solution is conducive to increasing the heat exchange efficiency per unit volume of the heat exchanger, and on the other hand, it is conducive to controlling the overall size of the heat exchanger to be thinner. When the heat exchanger is used inside a terminal device, the thickness of the terminal device can be controlled within a reasonable range. This heat exchanger can be a cooler arranged in a hot zone, or it can be a radiator arranged in a cold zone.

[0018] In a possible implementation, inside the heat exchanger, multiple flows are formed from the channel inlet through the multiple fluid channels to the channel outlet, and the fluid flow paths of the multiple flows are of equal size. This solution is conducive to ensuring the uniformity of the flow distribution of the fluid in each channel of the cooler.

[0019] In a possible implementation, the multiple fluid channels extend along the second direction and are sequentially arranged in a row along the first direction. In the second direction, the channel inlet and the fluid channel at the head of the row are arranged opposite to each other, and the channel outlet and the fluid channel at the tail of the row are arranged opposite to each other, and the second direction is perpendicular to the first direction. In this solution, the channel inlet and the channel outlet are arranged opposite to the liquid channel at the head of the row and the liquid channel at the tail of the row, respectively, so that the flow from the channel inlet to the channel outlet can be close to or equal, which is conducive to ensuring the uniformity of heating of the fluid inside the heat exchanger.

[0020] In a possible implementation, a flow guiding structure extending along the first direction is provided between the channel inlet and the multiple fluid channels, the flow guiding structure divides the space in the cooler into a first space and a second space, the multiple fluid channels are located in the second space, the channel inlet is connected to the first space, and along the first direction, the flow guiding structure is provided with multiple through holes connecting the first space and the second space. In this solution, the multiple through holes of the flow guiding structure make the flow distribution of the heat exchanger passing through each fluid channel more uniform.

[0021] In one possible implementation, along the first direction, the density of the through holes at the two ends of the flow-guiding structure is less than the density of the through holes in the middle area of ​​the flow-guiding structure. This solution can improve the flow balancing effect by designing the distribution density of the through holes on the flow-guiding structure. For the edge area close to the channel entrance, since the channel entrance and the fluid channel are arranged along the first direction, the fluid can easily pass through the through hole due to the entrance effect. As for the other edge area far away from the channel entrance, the shell of the first plate can be used to force the fluid to change the flow direction, forming a fluid disturbance, which is beneficial for the fluid to pass through the through hole. However, for the middle area, there is no fluid disturbance factor in this area, and the fluid is not easy to change the flow direction, resulting in a small amount of fluid passing through the through hole. Therefore, a higher density of through holes is set in the middle area, and a lower density of through holes is set in the edge area, which is beneficial to the overall flow balancing effect of the flow-guiding structure.

[0022] In a possible implementation, the guide structure includes a plurality of diverter plates and a plurality of spoiler structures, the plurality of diverter plates are arranged at intervals along the first direction, and the through holes are formed between adjacent diverter plates, the spoiler structure is protrudingly arranged at one end of the corresponding diverter plate, and the spoiler structure protrudes toward the first space or the second space. By setting a spoiler structure, the embodiment of the present application can solve the flow equalization effect in the case of a large flow velocity in the heat exchanger. In the case of a large flow velocity, it is difficult to achieve the purpose of changing the flow direction of the refrigerant medium only by the pressure fluctuations formed by the through holes on the guide structure. Therefore, it is necessary to set a spoiler structure at the edge of the through hole to increase the disturbance, strengthen the pressure fluctuation at the through hole, and force the refrigerant medium to change the flow direction.

[0023] In a possible implementation, the heat exchanger includes a plurality of baffles extending along the second direction and arranged at intervals from each other, the fluid channel is formed between adjacent baffles, part of the fluid channel is a first channel, the baffles forming the first channel are a first baffle and a second baffle, one end of the first channel facing the flow guide structure is the entrance of the first channel, the entrance of the first channel and the middle area of ​​the flow guide structure are arranged relatively, and at the entrance position of the first channel, the distance between the first baffle and the flow guide structure in the second direction is smaller than the distance between the first baffle and the flow guide structure in the second direction. This scheme is advantageous in providing smoothness of fluid flow in the heat exchanger. For example, the heat exchanger is made of metal, and since the metal surface is hydrophilic and has a large surface energy, it is easy to form a liquid film in a small channel and a small flow rate. The flow guide structure provided by this scheme can realize that when the equivalent diameter of the channel is small, the fluid channel in the middle area of ​​the heat exchanger is arranged in a step-by-step manner near the inlet side. The stepped flow channel structure can effectively reduce the influence of channel blockage caused by water film adhesion on the surface of the microchannel by forming a turbulent flow.

[0024] In a possible implementation, the first direction is the width direction of the fluid channel, the second direction is the length direction of the fluid channel, and the third direction is the height direction of the fluid channel. The first direction, the second direction and the third direction are perpendicular to each other, and the size ratio of the height direction to the width direction of each fluid channel is 0.3-2. This solution constrains the size ratio of the height and width of the fluid channel, so that the cooler can be used in a space-constrained environment such as a mobile phone, which is conducive to improving the heat dissipation performance of small-sized terminal devices. Small-sized terminal devices have large heat dissipation requirements and can better highlight the heat dissipation effect of the heat dissipation component.

[0025] In a possible implementation, the thermal conductivity of the connecting pipe is K1, and the thermal conductivity of the metal is K2, wherein K1<K2 / 5.

[0026] In a possible implementation, the connecting pipe is made of non-metallic material.

[0027] In a possible implementation, the connecting pipe includes a metal pipe body and a heat insulation layer, and the heat insulation layer is coated on the periphery of the metal pipe body.

[0028] The connecting tube provided in the present application has low thermal conductivity, which can ensure that less heat is conducted to the terminal device in the area where the connecting tube extends, and can ensure that more heat is conducted to the radiator. Such a design can improve the temperature equalization effect of the terminal device.

[0029] In a possible implementation, the cross section of the connecting tube includes a height direction and a width direction, the size of the connecting tube in the width direction is greater than the size of the connecting tube in the height direction, and in the cross section of the connecting tube, the connecting tube includes a first tube body and a second tube body arranged opposite to each other, the first tube body semi-encloses to form a first channel, the second tube body semi-encloses to form a second channel, the first tube body and the second tube body are fixed by brazing, and the first channel and the second channel are connected to form an internal channel of the connecting tube. This solution provides a specific manufacturing solution for the connecting tube.

[0030] In a possible implementation, the height of the connecting tube does not exceed 0.25 mm. This solution is conducive to ensuring a thin design of the space inside the terminal device by limiting the size of the connecting tube height.

[0031] In a possible implementation, the at least two heat exchangers and the connecting pipe are integrally formed in a heat sink structure, the heat sink structure includes a first interface and a second interface, the first interface and the second interface are connected to the connecting pipe, and the pump is connected between the first interface and the second interface. This solution saves assembly by manufacturing all heat exchangers and connecting pipes in an integrated heat sink structure, so that the heat sink component has integrity, is not prone to leakage, and is easy to assemble.

[0032] In a possible implementation, the heat sink structure includes a first plate and a second plate, the flow channels in the at least two heat exchangers and the flow channels in the connecting pipe are integrally formed on the surface of the first plate, and the first plate and the second plate are relatively connected as a whole, so that the flow channels in the at least two heat exchangers and the flow channels in the connecting pipe are formed between the first plate and the second plate. In this solution, the flow channels in the heat exchanger and the flow channels in the connecting pipe are made on the first plate, and the second plate is a smooth flat plate, which is easy to control the production cost and production difficulty.

[0033] In a possible implementation, the first interface and the second interface are located at the connection between the first plate and the second plate. Such a design can ensure that the pump occupies as little space as possible in the thickness direction of the heat sink structure at the first interface and the second interface, which is conducive to the thin design of the terminal device.

[0034] In a possible implementation, the heat sink structure is surrounded to form a receiving space, and the receiving space is used to accommodate the pump. The heat dissipation assembly provided in this solution sets the pump in the receiving space surrounded by the heat sink structure, and the pump does not occupy the space outside the heat sink structure, which is conducive to saving space inside the terminal device.

[0035] In a possible implementation, the heat sink structure includes a top edge and a bottom edge that are arranged opposite to each other, and a first side edge and a second side edge that are connected between the top edge and the bottom edge and are arranged opposite to each other, one of the at least two heat exchangers is a cooler, and the cooler is formed in a region of the heat sink structure adjacent to the top edge, at least one of the at least two heat exchangers is a radiator, and the radiator is formed in a region of the heat sink structure adjacent to the bottom edge, part of the connecting tubes are first tubes, the first tubes are adjacent to the first side edge and connected between the cooler and the radiator, and part of the connecting tubes are second tubes, the second tubes are adjacent to the second side edge and connected between the cooler and the radiator. This solution provides a specific structure of a heat sink structure, which specifically limits the positions of the cooler, the radiator, and the connecting tubes therein, which is conducive to miniaturizing the size of the heat sink structure and making it easy to match the internal environment of terminal devices such as mobile phones.

[0036] In a possible implementation, the heat sink structure is provided with an isolation zone, part of which is located on the side of the first tube away from the first side edge and adjacent to the first tube, and part of which is located on the side of the second tube away from the second side edge and adjacent to the second tube. The present application provides an isolation zone on the heat sink structure so that the connecting tube for transmitting a low-temperature cold medium and the connecting tube for transmitting a high-temperature cold medium in the heat sink assembly are separated by the isolation zone, thereby reducing direct heat conduction between the two. This makes the heat exchange between the cooler and the radiator more sufficient.

[0037] In a possible implementation, the pump is arranged in part of the isolation zone. The pump is arranged in the isolation zone. On the one hand, the isolation zone is used to install the pump, which is conducive to saving space, and on the other hand, it can also ensure the thermal isolation of the hot and cold water pipes.

[0038] In a possible implementation, part of the heat sink structure forms a temperature averaging plate, the heat exchange circulation pipeline composed of the at least two heat exchangers and the connecting pipe is arranged around the periphery of the temperature averaging plate, one of the at least two heat exchangers is a cooler, and the other heat exchangers are radiators, the evaporation zone of the temperature averaging plate is adjacent to the cooler, and the condensation zone of the temperature averaging plate is located between the cooler and the radiator. In this embodiment, the evaporation zone of the temperature averaging plate and the cooler are arranged adjacent to each other, and the heat at the cooler position can be conducted to the evaporation zone of the temperature averaging plate through the main material of the heat sink structure, and the heat conduction efficiency is high. The temperature averaging plate can be used to supplement the heat dissipation, which is conducive to improving the heat dissipation efficiency. In this solution, by arranging the temperature averaging plate and the heat exchange circulation pipeline on a heat sink structure, the heat sink structure can have two heat dissipation systems, namely, the active liquid cooling heat dissipation system of the heat exchange circulation pipeline and the heat dissipation system of the temperature averaging plate. The two heat dissipation systems can work together, or when the terminal device has low power consumption, the active liquid cooling heat dissipation system is not started, and only the heat dissipation system of the temperature averaging plate is used. Therefore, this solution has better application flexibility and can achieve better heat dissipation performance.

[0039] In the second aspect, the present application provides a temperature equalizing plate, including a shell, which surrounds a sealed space, in which a cold medium is arranged, and the sealed space includes an evaporation zone, in which a plurality of spaced-apart nucleation structures are arranged, each of the nucleation structures has a hydrophilic structure on the periphery, and the nucleation structures are used to promote nucleation boiling of the cold medium.

[0040] The embodiment of the present application is to set a structure in which nucleation structures and hydrophilic structures are alternately distributed in the evaporation zone of the temperature equalizing plate, that is, multiple nucleation structures are distributed at intervals, and the periphery of each nucleation structure is a hydrophilic structure. The surface of the nucleation structure has a hydrophobic function, that is, the contact angle between the surface of the nucleation structure and the liquid is large, so that the contact area between the liquid and the nucleation structure is smaller, and it is easier to nucleate and boil under the influence of the heat source. The contact angle between the hydrophilic structure and the liquid is small, the fluid can expand and infiltrate on the surface of the hydrophilic structure, and the hydrophilic structure can continuously transport the liquid to the nucleation structure. The temperature equalizing plate provided by the present application can realize the easy nucleation boiling of the liquid in the evaporation zone, thereby improving the temperature equalization effect of the temperature equalizing plate.

[0041] For example, the shell includes a first cover plate and a second cover plate, the first cover plate is thermally connected to the heat source, and the nucleation structure is arranged on the inner surface of the first cover plate, which can be closer to the heat source, so that the liquid in the evaporation zone is more easily nucleated and boiled under the influence of the nucleation structure. Therefore, the temperature averaging plate provided in the present application can achieve nucleation boiling of the liquid in the evaporation zone at a lower temperature, thereby improving the temperature averaging effect of the temperature averaging plate.

[0042] In one possible implementation, the nucleation structure includes a groove structure formed on the inner side of the shell, or a hydrophobic surface formed on the inner side of the shell, or a metal oxide coating formed on the inner side of the shell. This solution provides three specific forms of nucleation structures. Specifically, the first way is to form a hydrophobic surface by surface treatment, and the hydrophobic surface constitutes the nucleation structure; the second way is to make the surface of the nucleation structure have a hydrophobic function by setting a groove structure; the third way is to make the surface of the nucleation structure have a hydrophobic function by setting a metal oxide coating. All three solutions are easy to implement and low-cost manufacturing processes.

[0043] In a possible implementation, in the evaporation zone, a plurality of microcolumns are arranged on the inner wall of the shell, the plurality of microcolumns are spaced apart, the microcolumns include an end face and a side face connected between the end face and the inner wall of the shell, the end face forms the groove structure, or the hydrophobic surface, or the metal oxide coating, and the side face of the microcolumn and the surface of the inner wall between the plurality of microcolumns are both provided with the hydrophilic structure. In this embodiment, by arranging microcolumns on the inner surface of the shell, the end face of the microcolumn forms a hydrophobic surface, and the side face of the microcolumn and the surface of the inner wall between the plurality of microcolumns can be a hydrophilic structure, so that the contact angle between the liquid and the end face is large, making it easier for the liquid to nucleate and boil. The method of arranging microcolumns on the inner surface of the first cover plate is easy to manufacture, for example, the microcolumns can be integrally formed directly on the shell by stamping, etc., and the manufacturing cost is low.

[0044] In a possible implementation, a support column is provided in the sealed space, and one end of at least part of the support columns arranged in the evaporation zone is connected to the shell, and the other end contacts the end face of at least one of the micro-columns. In this solution, the support columns and the micro-columns abut against each other, so that the support columns and the micro-columns can jointly construct a support structure in the evaporation zone, thereby ensuring that the internal space of the evaporation zone does not collapse and ensuring space for liquid vaporization. Moreover, the support column can be integrally formed with the shell, and the support column abuts against the micro-column, so that the size of the support column does not need to be too long, and it can be directly formed on the inner surface of the shell by a stamping process, and the manufacturing process is simple, the manufacturing cost is low, and the yield is also high.

[0045] In a possible implementation, in the sealed space, the evaporation zone is provided with a plurality of support columns, the plurality of support columns are distributed between adjacent micro-columns, and the plurality of support columns support the inner wall of the shell in the thickness direction of the temperature homogenizing plate. In this solution, by arranging support columns in the evaporation zone to abut against the inner surface of the shell, the distribution of the micro-columns needs to avoid the positions of the support columns. During the manufacturing process, there is no need to consider the positional relationship and alignment between the micro-columns and the support columns, so that the manufacturing process is simpler and the manufacturing cost is lower.

[0046] In a possible implementation, the shell includes a first cover plate and a second cover plate that are arranged opposite to each other, a plurality of capillary walls are arranged in the sealed space, the plurality of capillary walls are spaced apart in the sealed space, the plurality of capillary walls are supported between the first cover plate and the second cover plate, and in the evaporation zone, the capillary walls are located between the plurality of micro-pillars. In this solution, the capillary walls are used as a structure supporting the first cover plate and the second cover plate in the evaporation zone, and the capillary walls have the function of transmitting liquid. This solution improves the liquid circulation performance in the temperature equalizing plate.

[0047] In a possible implementation, the sealed space includes a condensation area and a first channel and a second channel connected between the condensation area and the evaporation area, and the evaporation area, the first channel, the condensation area, and the second channel are sequentially connected to form an annular circulation channel. This solution provides a loop architecture within the temperature equalization plate, which can ensure the smoothness of the cold medium transportation within the temperature equalization plate and promote the temperature equalization effect.

[0048] In a possible implementation, the temperature averaging plate is provided with a strip hole penetrating the shell in the thickness direction of the temperature averaging plate, along the plane extending from the temperature averaging plate, one end of the strip hole is located at or adjacent to the edge of the evaporation zone, the other end of the strip hole is located at or adjacent to the edge of the condensation zone, and the inner wall of the strip hole constitutes a partition wall between the first channel and the second channel. This solution realizes the spacing between the first channel and the second channel by setting the strip hole, and constructs a loop architecture.

[0049] In a possible implementation, the first channel is a gas channel, the second channel is a liquid channel, the first channel includes an inlet end and an outlet end, the inlet end is connected to the evaporation zone, the outlet end is connected to the condensation zone, the gas channel includes an expansion zone, the cross section of the expansion zone is larger than the cross section of the inlet end, and the expansion zone is located between the inlet end and the outlet end. Since the expansion zone is wider than the inlet end, the steam pressure at the expansion zone is smaller, the phase change temperature is lower, the gas can be expanded, the condensation temperature is reduced, and favorable conditions are provided for the steam to flow along the gas channel to the condensation zone.

[0050] In a possible implementation, the shell includes a first cover plate and a second cover plate that are arranged opposite to each other, the first channel is a gas channel, the second channel is a liquid channel, a first capillary layer and a second capillary layer are arranged in the second channel, the first capillary layer covers the inner surface of the first cover plate, the second capillary layer covers the inner surface of the second cover plate, a support column is arranged in the liquid channel, one end of the support column is fixedly connected to the inner surface of the second cover plate, and the other end abuts the first capillary layer, and at least part of the side surface of the support column has a hydrophobic property. This solution arranges the side surface of the support column with a hydrophobic property in the liquid channel so that the liquid can more easily break away from the side surface of the support column and more easily enter the first capillary layer and the second capillary layer, so as to smoothly complete the liquid return, thereby improving the smoothness of the cold medium transportation of the temperature equalizing plate and promoting the temperature equalization effect.

[0051] In a possible implementation, the total thickness of the first capillary layer and the second capillary layer accounts for more than 80% of the height of the second channel. Since the liquid channel is filled with liquid refrigerant, the liquid refrigerant will be transmitted in the first capillary layer and the second capillary layer. Therefore, this solution constrains the total thickness of the first capillary layer and the second capillary layer to be more than 80% of the height of the liquid channel, which is conducive to the design of a thin size of the temperature equalization board.

[0052] In a possible implementation, the first channel is a gas channel, the second channel is a liquid channel, the second channel includes a tail end and a wide area, the tail end is located at a position where the liquid channel and the evaporation zone are connected, the wide area and the tail end are adjacent, and the cross-sectional area of ​​the tail end is smaller than the cross-sectional area of ​​the wide area. In this solution, by setting the size of the tail end smaller than the size of the wide area, it is possible to prevent the gas in the evaporation zone from flowing back to the liquid channel.

[0053] In a possible implementation, the condensation zone includes a plurality of bionic convex structures, the plurality of bionic convex structures are arranged at intervals, the bionic convex structure includes a bottom and a top, the bottom is connected to the inner surface of the shell, the projection of the top on the bottom is located at the asymmetric center of the bottom, and the top is the highest position of the bionic convex structure protruding relative to the surface of the shell. Since the projection of the top on the bottom is located at the asymmetric center of the bottom, the surface connecting the top and the bottom forms an inclined plane, and the inclined planes on both sides of the top have different inclination angles. By forming inclined planes with different inclination angles, the gas condenses into water droplets on the bionic convex structure and can flow quickly and enter the capillary structure. Therefore, the present solution can increase the condensation rate through the bionic convex structure, so that the steam in the condensation zone condenses into liquid more quickly and enters the capillary layer.

[0054] In a possible implementation, the shell includes a first cover plate and a second cover plate that are arranged opposite to each other, the condensation area includes a plurality of support columns, the plurality of support columns are spaced apart on the inner surface of the second cover plate, a capillary structure is provided on the inner surface of the first cover plate, the plurality of support columns abut the capillary structure, the plurality of bionic convex structures are distributed one-to-one between adjacent support columns, and the top of the plurality of bionic convex structures and the capillary structure on the surface of the first cover plate are spaced apart. This solution realizes the support between the first cover plate and the second cover plate by providing support columns, and the top of the bionic convex structure and the inner surface of the first cover plate are spaced apart, so that the contact surface between the top surface of the bionic convex structure and the cold medium is larger, highlighting the effect of the bionic convex structure in increasing the condensation rate.

[0055] In a possible implementation, the shell includes a first cover plate and a second cover plate that are arranged opposite to each other, the multiple bionic convex structures are spaced apart on the inner surface of the second cover plate, the inner surface of the first cover plate is provided with a capillary structure, and the tops of the multiple bionic convex structures abut against the capillary structure on the surface of the first cover plate. This solution uses the bionic convex structure as a supporting structure between the first cover plate and the second cover plate, so that the bionic convex structure has both a supporting function and a function of increasing the condensation rate. It can be understood that this solution designs the supporting structure in the condensation area as a bionic convex structure, which can greatly increase the condensation rate.

[0056] In a possible implementation, the bionic convex structure includes a first inclined plane and a second inclined plane connected between the top and the bottom, the direction of the vertical line between the first cover plate and the second cover plate is a first direction, and on a first cross section of the bionic convex structure, the angle between the extension direction of the second inclined plane and the first direction is a first angle, the angle between the extension direction of the second inclined plane and the first direction is a second angle, the first angle is greater than the second angle, and the first cross section is parallel to the first direction and passes through the top. This solution achieves the effect of increasing the condensation rate of the bionic convex structure by constraining the angle relationship between the first inclined plane and the second inclined plane formed between the top and the bottom, that is, the first angle is greater than the second angle. It is easy to manufacture and has a low manufacturing cost.

[0057] In a possible implementation, the first angle is in the range of 60°-80°, and the second angle is in the range of 10°-30°. This solution provides a specific angle range for the first angle and the second angle, which is conducive to ensuring the effect of increasing the condensation rate of the bionic protrusion structure.

[0058] In a third aspect, an embodiment of the present application provides a temperature equalizing plate, comprising a first cover plate and a second cover plate arranged opposite to each other, the two being sealed and connected to form a sealed space, the sealed space comprising an evaporation zone, a condensation zone, a gas channel connected between the condensation zone and the evaporation zone, and a liquid channel connected between the condensation zone and the evaporation zone, the condensation zone comprising a plurality of bionic protrusion structures, the plurality of bionic protrusion structures being distributed at intervals on the surface of the second cover plate, each of the bionic protrusion structures comprising a bottom, a top, and a first inclined plane and a second inclined plane connected between the top and the bottom, the direction of a vertical line between the first cover plate and the second cover plate being a first direction, the angle between the second inclined plane and the first direction being a first angle, the angle between the second inclined plane and the first direction being a second angle, and the first angle being greater than the second angle.

[0059] This solution can increase the condensation rate through the bionic convex structure, so that the steam in the condensation zone condenses into liquid more quickly and enters the capillary layer.

[0060] In a possible implementation, the first angle ranges from 60° to 80°; the second angle ranges from 10° to 30°.

[0061] In one possible implementation, the top of each of the bionic protrusion structures faces the capillary structure of the first cover plate and is spaced apart from the capillary structure on the surface of the first cover plate. The condensation zone also includes a plurality of support columns, which are spaced apart on the surface of the second cover plate and rest against the capillary structure on the surface of the first cover plate. The plurality of bionic protrusion structures are distributed in the area between adjacent support columns.

[0062] In a possible implementation manner, the top of each of the bionic protrusion structures abuts against the capillary structure of the first cover plate.

[0063] In a fourth aspect, an embodiment of the present application provides a cooler, comprising a shell, wherein the shell surrounds a plurality of fluid channels, the cooler comprising a channel inlet and a channel outlet connecting the fluid channels with the outside, the channel inlet and the channel outlet being respectively located on both sides of the fluid channel, the shell being used to be connected to a heat source via a thermal interface material, a plurality of intervally distributed hydrophobic surfaces being arranged in the liquid channel, each of the hydrophobic surfaces being provided with a hydrophilic surface on the periphery, the hydrophobic surfaces being used to promote nucleate boiling of the liquid, and the hydrophilic surface being used to supply the liquid to the hydrophobic surfaces.

[0064] The embodiment of the present application is set as a structure in which a hydrophobic surface and a hydrophilic surface are alternately distributed in the cooler, that is, multiple hydrophobic surfaces are distributed at intervals, and the periphery of each of the hydrophobic surfaces is a hydrophilic surface. Since the contact angle between the hydrophobic surface and the liquid is large, the contact area between the liquid and the hydrophobic surface is smaller, and it is easier to nucleate boiling under the influence of the heat source. The hydrophilic surface can continuously transport liquid to the hydrophobic surface. Therefore, the temperature averaging plate provided in the present application can achieve nucleate boiling of the liquid in the cooler at a lower temperature, thereby improving the heat dissipation performance of the cooler.

[0065] In a possible implementation, the present application arranges the hydrophobic surface on the inner surface of the shell close to the heat source, so that the hydrophobic surface is closer to the heat source, making it easier for the liquid in the cooler to nucleate boiling under the influence of the hydrophobic surface.

[0066] In a fifth aspect, an embodiment of the present application provides a heat sink structure, part of which forms a temperature averaging plate as described in any one of the embodiments of the second aspect and the third aspect, and the heat sink structure includes a first plate and a second plate, the second plate forms a cooler flow channel, a radiator flow channel and a connecting pipe flow channel, the second plate and the first plate are arranged relative to each other and connected as a whole, so that the cooler flow channel, the radiator flow channel and the connecting pipe flow channel form a sealed space between the first plate and the second plate; the heat exchange circulation pipeline formed by the cooler flow channel, the radiator flow channel and the connecting pipe flow channel is arranged around the periphery of the temperature averaging plate; the evaporation zone is adjacent to the cooler flow channel. In this solution, by arranging the temperature averaging plate and the heat exchange circulation pipeline on a heat sink structure, the heat sink structure can have two heat dissipation systems, namely, an active liquid cooling heat dissipation system of the heat exchange circulation pipeline and a heat dissipation system of the temperature averaging plate, and the two heat dissipation systems can work together, or when the terminal device has low power consumption, the active liquid cooling heat dissipation system can be not started, and only the heat dissipation system of the temperature averaging plate can be used. Therefore, this solution has better application flexibility and can achieve better heat dissipation performance.

[0067] In a sixth aspect, an embodiment of the present application provides a terminal device, comprising a pump and a heat sink structure as described in the fourth aspect, wherein the heat sink structure comprises a first interface and a second interface, wherein the first interface and the second interface are connected to the connecting pipe, and the pump is connected between the first interface and the second interface.

[0068] In a possible implementation, the heat sink structure is enclosed to form a receiving space, the receiving space is used to accommodate the pump, the receiving space is located between the temperature averaging plate and part of the connecting pipe flow channel, and the receiving space is used to isolate the temperature averaging plate and part of the connecting pipe flow channel.

[0069] In one possible implementation, the heat sink structure includes a top end and a bottom end that are relatively arranged, and a first side and a second side that are connected between the top end and the bottom end and are relatively arranged, the cooler flow channel is formed in a first area adjacent to the top end, and the radiator flow channel is formed in a second area adjacent to the bottom end, part of the connecting tubes are first tubes, the first tubes are adjacent to the first side edge and connected between the cooler flow channel and the radiator flow channel, part of the connecting tubes are second tubes, the second tubes are adjacent to the second side edge and connected between the cooler flow channel and the radiator flow channel, the temperature equalizing plate is located between the first tube and the second tube, and an isolation zone is provided on the heat sink structure, part of the isolation zone is located between the first tube and the temperature equalizing plate, and part of the isolation zone is located between the second tube and the temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0071] Figure 1 A schematic diagram of a heat dissipation component provided in a terminal device according to an embodiment of the present application;

[0072] Figure 2 A schematic diagram of a heat dissipation component provided in a terminal device according to an embodiment of the present application;

[0073] Figure 3 A schematic diagram of a heat dissipation component provided in a terminal device according to an embodiment of the present application;

[0074] Figure 4 A schematic diagram of a side exploded view of a terminal device provided in one embodiment of the present application;

[0075] Figure 5 A schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0076] Figure 6 for Figure 5 A side view of the internal structure layout of the terminal device shown;

[0077] Figure 7 A schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0078] Figure 8 for Figure 7 A side view of the internal structure layout of the terminal device shown;

[0079] Fig. 9 A schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0080] Fig.10 A schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0081] Fig.11 A schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0082] Fig.12 A schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0083] Fig.13 A schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0084] Fig.14 A schematic diagram of a configuration scheme of a connecting pipe at a rotating shaft assembly in a terminal device provided in one embodiment of the present application;

[0085] Fig.15 A schematic diagram of a configuration scheme of a connecting pipe at a rotating shaft assembly in a terminal device provided in one embodiment of the present application;

[0086] Fig.16 , Fig.17 and Fig.18 A partial schematic diagram of a connecting pipe provided for a specific embodiment of the present application;

[0087] Fig.19 A three-dimensional schematic diagram and a partially enlarged schematic diagram of a cooler in a heat dissipation assembly provided in one embodiment of the present application;

[0088] Fig. 20 for Fig.19 A three-dimensional exploded schematic diagram of a heat exchanger shown;

[0089] Fig.21 A three-dimensional schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application;

[0090] Fig. 22 for Fig.21 A schematic plan view of a first plate in the heat exchanger shown;

[0091] Fig.23 A three-dimensional schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application;

[0092] Fig.24 for Fig.23 A schematic plan view of a first plate in the heat exchanger shown;

[0093] Fig.25A partial stereoscopic schematic diagram and a partially enlarged schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application;

[0094] Fig.26 A partial stereoscopic schematic diagram and a partially enlarged schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application;

[0095] Fig. 27 A partial stereoscopic schematic diagram and a partially enlarged schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application;

[0096] Fig.28 A partial stereoscopic schematic diagram and a partially enlarged schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application;

[0097] Fig.29 , Fig.30 and Fig.31 They are respectively plan schematic diagrams of a first plate in a heat exchanger provided in one embodiment of the present application;

[0098] Fig.32 A schematic plan view of a first plate in a heat exchanger provided in one embodiment of the present application;

[0099] Fig.33 A schematic plan view of a first plate in a heat exchanger provided in one embodiment of the present application;

[0100] Fig.34 An enlarged schematic diagram of a liquid channel in a heat exchanger provided in one embodiment of the present application;

[0101] Fig.35 A schematic diagram of a pump provided in accordance with one embodiment of the present application;

[0102] Fig.36 A three-dimensional exploded schematic diagram of a heat dissipation assembly provided in one embodiment of the present application;

[0103] Fig.37 for Fig.36 A schematic plan view of a first plate member of a heat dissipation plate structure in a heat dissipation assembly shown;

[0104] Fig.38 for Fig.36 A schematic plan view of a second plate member of a heat dissipation plate structure in a heat dissipation assembly shown;

[0105] Fig.39 A planar exploded schematic diagram of a heat sink structure provided in one embodiment of the present application;

[0106] Fig.40 for Fig.39 A schematic diagram of the heat sink structure shown is applied in a terminal device;

[0107] Fig.41 A planar exploded schematic diagram of a heat sink structure provided in one embodiment of the present application;

[0108] Fig.42 A planar exploded schematic diagram of a heat sink structure provided in one embodiment of the present application;

[0109] Fig.43 A schematic diagram of a planar decomposition of a temperature homogenizing plate provided in one embodiment of the present application;

[0110] Fig.44 A schematic cross-sectional view of a temperature homogenizing plate provided in one embodiment of the present application, wherein the supporting structure inside the temperature homogenizing plate is omitted;

[0111] Fig.45 A specific structural design scheme of the evaporation zone in the temperature homogenizing plate provided in one embodiment of the present application;

[0112] Fig.46 for Fig.45 A schematic cross-sectional view of a portion of a micropillar in the structure shown;

[0113] Fig.47 A schematic cross-sectional view of some micro-columns in a temperature homogenizing plate provided in one embodiment;

[0114] Fig.48 A specific structural design scheme of the evaporation zone in the temperature homogenizing plate provided in one embodiment of the present application;

[0115] Fig.49 for Fig.48 A schematic cross-sectional view of a portion of a micropillar in the structure shown;

[0116] Fig.50 A schematic cross-sectional view of an evaporation zone of a temperature homogenizing plate provided in one embodiment of the present application;

[0117] Fig.51 A schematic cross-sectional view of an evaporation zone of a temperature homogenizing plate provided in one embodiment of the present application;

[0118] Fig.52 A schematic cross-sectional view of an evaporation zone of a temperature homogenizing plate provided in one embodiment of the present application;

[0119] Fig.53 A schematic diagram of a temperature homogenizing plate provided in one embodiment of the present application;

[0120] Fig.54 for Fig.53 A schematic diagram of the cross section at the AA position in the middle;

[0121] Fig.55 A schematic diagram of an internal channel of a temperature homogenizing plate provided in one embodiment of the present application;

[0122] Fig.56 A schematic cross-sectional view of a liquid channel of a temperature homogenizing plate provided in one embodiment of the present application;

[0123] Fig.57 A three-dimensional view, a top view, a front view and a left view of one of the bionic protrusion structures in the condensation area of ​​a temperature homogenizing plate provided in one embodiment of the present application;

[0124] Fig.58 A schematic diagram of the distribution of bionic protrusion structures in the condensation zone of a temperature homogenizing plate provided in one embodiment of the present application;

[0125] Fig.59 for Fig.58 A partially enlarged cross-sectional schematic diagram of the bionic protrusion structure distribution scheme shown;

[0126] Fig.60 A schematic diagram of the distribution of bionic protrusion structures in the condensation zone of a temperature homogenizing plate provided in one embodiment of the present application;

[0127] Fig.61 for Fig.60 A partially enlarged cross-sectional schematic diagram of the bionic protrusion structure distribution scheme shown;

[0128] Fig.62 A schematic diagram comparing the condensation phenomenon (the part on the left side of the dotted line) generated by the bionic protrusion structure 921 provided in an embodiment and the condensation phenomenon (the part on the right side of the dotted line) generated by an ordinary surface. DETAILED DESCRIPTION

[0129] In the following description of the embodiments of the present application, unless otherwise specified, "and / or" is used to describe the association relationship of objects, indicating that three relationships can exist between objects. For example, A and / or B is used to indicate: A exists alone, A and B exist at the same time, and B exists alone.

[0130] In the following description of the embodiments of the present application, “plurality” means two or more than two.

[0131] In the following description of the embodiments of the present application, the terms "first", "second", etc. are only used to distinguish technical features for clear description and should not be understood as implying relative importance or implicitly indicating the number of indicated technical features.

[0132] The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", "top", "bottom", etc., are only reference directions of the drawings. Therefore, the directional terms are for better and clearer explanation and understanding of the embodiments of the present application, rather than explicitly or implicitly indicating that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application.

[0133] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set on..." should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection, and can be a direct connection or an indirect connection through an intermediate medium.

[0134] Terminal devices may include mobile phones, tablets, smart watches, laptops, wearable devices, etc. As terminal devices have more and more functions and stronger performance, their heat generation also increases dramatically. For example, more powerful computing chips, 5G technology with higher power consumption compared to 4G, and faster charging technology with higher current will all lead to a significant increase in heat generation, which puts higher demands on the heat dissipation performance of the equipment. Without an effective heat dissipation design, the accumulation of heat or cold will cause the temperature of the mobile terminal device to be too high or too low, resulting in the following adverse effects: decreased and limited device performance, poor user thermal experience, reduced device reliability, battery safety issues, etc.

[0135] Therefore, the heat dissipation design of terminal equipment has not only become one of the important bottlenecks for improving the performance and reliability of terminal equipment, but also one of the indicators that consumers pay the most attention to. In view of this, the embodiment of the present application provides an active liquid cooling solution, which can overcome the defect that conventional heat dissipation solutions cannot fully dissipate heat, resulting in poor temperature uniformity of the entire machine.

[0136] The terminal device provided in the present application includes a shell and a heat dissipation component located inside the shell. For example, the terminal device can be a mobile phone, and the shell can include a middle frame and a back shell, and the display screen and the back shell of the terminal device are respectively arranged on opposite sides of the middle frame. The heat dissipation component includes at least two heat exchangers, a pump and a connecting pipe, and the internal space of the shell includes a hot zone and a cold zone. It can be understood that the hot zone is the area where the terminal device generates heat when in working state, for example, the area where the heating device (power device) is located; the cold zone is the area where the terminal device does not generate heat when in working state, or the heat generation is very low. The cold zone and the hot zone are usually arranged at intervals in the internal space of the shell, that is, other devices or devices are arranged in the interval area between the cold zone and the hot zone. For example, the terminal device is a mobile phone, and the hot zone and the cold zone are respectively located at opposite ends of the battery. The area between the battery and the top of the mobile phone can be defined as a hot zone because the motherboard is set, and the partial area of ​​the battery near the bottom of the mobile phone and at least the partial area between the battery and the bottom of the mobile phone can be defined as a cold zone because there is no main heating device.

[0137] One of the at least two heat exchangers of the heat dissipation assembly is located in the hot zone in the terminal device, and the other heat exchangers are located in the cold zone in the terminal device. The connecting pipe is connected between the at least two heat exchangers to form a heat exchange circulation pipeline, and the pump is arranged in the heat exchange circulation pipeline to realize heat exchange between the hot zone and the cold zone. The embodiment of the present application arranges an active liquid cooling circulation system, i.e., a heat dissipation assembly, in the internal space of the terminal device, so that the heat in the hot zone can be brought to the cold zone for heat dissipation, thereby improving the temperature uniformity of the terminal device.

[0138] Figure 1 A schematic diagram of a heat dissipation component provided in a terminal device according to an embodiment of the present application. Figure 1 The terminal device 100 shown is a mobile phone, and the internal space of the terminal device 100 includes a hot zone H and a cold zone C. For example, the terminal device 100 includes a top 1001 and a bottom 1002 that are relatively arranged. Specifically, the top 1001 is the end where the front camera of the terminal device is located, and the bottom 1002 is the end where the charging interface of the terminal device is located. The hot zone H is close to the top 1001 of the terminal device 100, and the cold zone C is close to the bottom 1002 of the terminal device 100. The hot zone H may have a main heating device, such as a motherboard (or SOC). The cold zone C may have a non-heating device (or a device with a lower heat generation), such as some areas on a small board, or a portion of the battery close to the small board. If there is no small board in the terminal device 100, the cold zone C includes at least a portion of the area between the battery and the bottom 1002 of the terminal device 100, and the area where part of the battery is located close to the bottom 1002 of the terminal device 100.

[0139] See also Figure 1, the heat dissipation component 20 is arranged in the internal space of the terminal device 100, and the internal space is also used to accommodate circuit boards and electronic devices. The heat dissipation component 20 includes a heat exchanger 20A, a pump 23 and a connecting pipe 24. The number of heat exchangers 20A is at least two, and the heat exchanger 20A includes a cooler 21 and a radiator 22, that is, one of the heat exchangers 20A is a cooler 21, and the remaining heat exchangers 20A are radiators. The cooler 21 is located in the hot zone H, and the radiator 22 is located in the cold zone C. The cooler 21 and the radiator 22 are connected by the connecting pipe 24 to form a heat exchange circulation pipeline. The heat exchanger 20A and the connecting pipe 24 contain a refrigerant, and the refrigerant can be water. The pump 23 is arranged in the heat exchange circulation pipeline, and is used to drive the refrigerant to flow in the heat exchange circulation pipeline to achieve heat exchange between the hot zone H and the cold zone C.

[0140] In one embodiment, the pump 23 is a liquid micro pump. The heat dissipation component 20 may include a pump component, the pump component includes a pump 23 and a control unit, and the control unit is used to control the working state of the pump 23 and collect relevant data. In other embodiments, the control unit may be a circuit unit set in the terminal device, and the control unit may be integrated into other circuits of the terminal device, such as integrated into the SOC.

[0141] For mobile phones, their internal space is limited and the heat dissipation requirements are severe. Compared with the use of a temperature equalizing plate for uniform temperature heat dissipation, the embodiment of the present application applies the heat dissipation component 20 to the internal space of the terminal device 100. Since the pump 23 can realize a liquid cooling cycle between the cooler 21 and the radiator 22, the heat dissipation component 20 constitutes an active liquid cooling cycle architecture, which can improve the temperature uniformity of the terminal device 100. In one embodiment, the present application can use the power of the pump to bring the heat from the hot zone near the top of the mobile phone to the cold zone near the bottom of the mobile phone for heat dissipation. Compared with the heat dissipation cycle path of the temperature equalizing plate, the heat dissipation cycle path of the heat dissipation component provided in the embodiment of the present application is longer, and the heat dissipation effect and temperature equalization effect are more significant.

[0142] Figure 2 A schematic diagram of a heat dissipation component provided in a terminal device according to an embodiment of the present application. Figure 2The terminal device 100 shown is a laptop computer. The embodiment of the present application schematically indicates the hot zone H and the cold zone C on the terminal device 100. For example, the display screen area of ​​the laptop computer can be the cold zone C, the area where the handwriting board under the keyboard of the laptop computer is located can be the hot zone H, and the motherboard of the laptop computer can be set in the hot zone H. In one embodiment, the heat dissipation component 20 includes a heat exchanger 20A, a pump 23 and a connecting pipe 24. The number of heat exchangers 20A is at least two. The heat exchanger 20A includes a cooler 21 and a radiator 22, that is, one of the heat exchangers 20A is a cooler 21, and the remaining heat exchangers 20A are radiators. The cooler 21 is set in the hot zone H and is located in the area of ​​the lower right corner of the laptop computer; the radiator 22 is located in the cold zone C and is located in the area of ​​the lower left corner of the display screen. The pump 23 is set in the hot zone H and is close to the cooler 21. Part of the connecting tube 24 extends below the keyboard, part of the connecting tube 24 passes through the keyboard area and the hinge area, part of the connecting tube extends to the right edge area of ​​the keyboard, and part of the connecting tube 24 extends to the area where the display screen is located.

[0143] Figure 2 The heat dissipation assembly 20 is arranged in the terminal device 100 as shown in FIG. Figure 1 The embodiments shown are similar, and both constitute an active liquid cooling circulation architecture in the internal space of the terminal device 100 to achieve heat exchange between the hot zone H and the cold zone C, which can improve the heat dissipation capacity of the laptop. For example, the embodiment of the present application can bring the heat generated on the motherboard of the laptop to the display area. When the display is in use, there is no obstruction around the display, and the display does not generate heat. The heat on the motherboard is transferred to the display area, which can improve the heat dissipation and temperature equalization effect of the laptop, and avoid the heat being concentrated in the motherboard area and affecting the performance and user experience.

[0144] Figure 3 A schematic diagram of a heat dissipation component provided in a terminal device according to an embodiment of the present application. Figure 3 The terminal device 100 shown is a tablet computer. The internal space of the tablet computer also has a heat outlet area H and a cold area C. Figure 3 The positions of the hot zone H and the cold zone C are schematically indicated in the tablet computer. In a specific terminal device 100, the position, shape, size, etc. of the hot zone H and the cold zone C can be adjusted according to requirements. Figure 3 The heat dissipation assembly 20 is arranged in the terminal device 100 as shown in FIG. Figure 1The embodiments shown are similar, both of which constitute an active liquid cooling circulation architecture in the internal space of the terminal device 100 to achieve heat exchange between the hot zone H and the cold zone C, which can improve the heat dissipation capacity of the tablet computer. In one embodiment, the heat dissipation component 20 includes a heat exchanger 20A, a pump 23 and a connecting pipe 24. The number of heat exchangers 20A is at least two, and the heat exchanger 20A includes a cooler 21 and a radiator 22, that is, one of the heat exchangers 20A is a cooler 21, and the remaining heat exchangers 20A are radiators. The cooler 21 is set in the hot zone H and is located in the area of ​​the lower right corner of the tablet computer; the radiator 22 is located in the cold zone C and is located in the area of ​​the upper left corner of the tablet computer. The pump 23 is set near a side of the tablet computer. The connecting pipe 24 extends in the internal space of the tablet computer.

[0145] Figure 4 A schematic diagram of a side exploded view of a terminal device provided in one embodiment of the present application. Figure 4 The terminal device 100 shown may be a mobile phone. The terminal device 100 includes a display screen 10, a middle frame 30, a back shell 50, a heat dissipation component 20, a mainboard 40, a battery 60 and a small board 70. The middle frame 30 and the back shell 50 are connected to form a housing 100A of the terminal device. The display screen 10 and the housing 100A are connected and jointly enclosed to form an internal space of the terminal device 100, and the heat dissipation component 20, the mainboard 40, the battery 60 and the small board 70 are located in this internal space. In one embodiment, there may be no small board in the terminal device 100.

[0146] Figure 5 A schematic diagram of the internal structural layout of a terminal device provided for one embodiment of the present application. Figure 5 In one embodiment shown, the terminal device 100 is a mobile phone, and the terminal device 100 is provided with a main board 40, a battery 60, and a small board 70. In this embodiment, the terminal device 100 includes a top end 1001 and a bottom end 1002 that are relatively arranged. Specifically, the top end 1001 is the end where the front camera of the terminal device is located, and the bottom end 1002 is the end where the charging interface of the terminal device is located. The battery 60 includes a first end 601 and a second end 602 that are relatively arranged. The first end 601 is located at the edge of the battery 60 facing the top end 1001, and the second end 602 is located at the edge of the battery 60 facing the bottom end 1002. The main board 40 and the small board 70 are distributed on opposite sides of the battery 60, and the main board 40 is located between the first end 601 and the top end 1001. The small board 70 is located between the second end 602 and the bottom end 1002. The hot zone H includes the area where the main board 40 is located, and the cold zone C includes the area where at least part of the small board 70 is located and the area where part of the battery 60 near the small board 70 is located. As shown in FIG. Figure 5As shown, in the area between the battery 60 and the bottom 1002 of the terminal device 100, the portion within the dotted line frame belongs to the cold zone C, and the portion outside the dotted line frame does not belong to the cold zone C. For example, the speaker is a heat-generating device, so the speaker is not within the cold zone C.

[0147] See also Figure 5 In some embodiments, a heating device 41 is provided on the mainboard 40, for example: SOC (System-on-a-Chip). The heat dissipation component 20 includes a heat exchanger 20A, a pump 23 and a connecting pipe 24. The number of heat exchangers 20A is at least two, and the heat exchanger 20A includes a cooler 21 and a radiator 22, that is, one of the heat exchangers 20A is a cooler 21, and the remaining heat exchangers 20A are radiators. The cooler 21 is provided on the heating device 41. The area of ​​the cooler 21 is larger than the area of ​​the heating device 41, so that the cooler 21 can fully cover the heating device 41. The cooler 21 and the heating device 41 are connected by a cold medium to improve the heat conduction efficiency of the heat of the heating device 41 to the cooler 21. In this embodiment, the heat exchanger 20A located in the cold zone H overlaps with part of the battery 60 and is adjacent to the second end 602. In other words, the radiator 22 and the battery 60 are overlapped in a partial area close to the small plate 70. The pump 23 is disposed in the area where the small plate 70 is located. In other embodiments, the heat exchanger 20A located in the cold zone H may also be disposed in the area between the second end 602 of the battery 60 and the bottom end 1002 of the terminal device 100 .

[0148] Figure 5 In the illustrated embodiment, the pump 23 is disposed in the cold zone C between the second end 602 of the battery 60 and the bottom end 1002 of the terminal device 100, that is, the area where the small plate 70 is located. In other embodiments, the pump 23 may also be disposed in the hot zone H, or a position between the hot zone H and the cold zone C. In one embodiment, the portion of the connecting pipe 24 connected between the pump 23 and the cooler 21 and the portion of the connecting pipe 24 connected between the pump 23 and the radiator 22 are used to convey a cold medium with a lower temperature, and the portion of the connecting pipe 24 connected between the radiator 22 and the cooler 21 is used to convey a cold medium with a higher temperature. In one embodiment, the portion of the connecting pipe 24 connected between the pump 23 and the cooler 21 and the portion of the connecting pipe 24 connected between the pump 23 and the radiator 22 are used to convey a cold medium with a higher temperature, and the portion of the connecting pipe 24 connected between the radiator 22 and the cooler 21 is used to convey a cold medium with a lower temperature.

[0149] Figure 6 for Figure 5A side view of the internal structural layout of the terminal device shown. The display screen 10 and the back shell 50 are distributed on opposite sides of the middle frame 30, that is, along the thickness direction of the terminal device 100, the display screen 10, the middle frame 30 and the back shell 50 are stacked. In the embodiment of the present application, the heat dissipation assembly 20 can be distributed between the middle frame 30 and the display screen 10, that is, the cooler 21, the radiator 22, the pump 23 and the connecting pipe 24 are all arranged between the middle frame 30 and the display screen 10. This solution arranges the cooler 21, the radiator 22, the pump and the connecting pipe 24 on the same side of the middle frame 30, which provides convenience for the assembly process of the terminal device 100. The connecting pipe 24 does not need to pass through the middle frame. In one embodiment, the heat dissipation assembly 20 can be assembled into a complete structure, and then the complete structure can be installed at a position between the middle frame 30 and the display screen 10.

[0150] Figure 7 A schematic diagram of the internal structural layout of a terminal device provided for one embodiment of the present application. Figure 8 for Figure 7 The side view of the terminal equipment internal structure layout is shown in Figure 1. Figure 7 and Figure 8 The cooler 21 and the heating element 41 are connected by a refrigerant medium. Figure 5 The embodiments shown are the same and will not be described again. In this embodiment, the cooler 21 is located between the middle frame 30 and the display screen 10, and the radiator 22 is located between the middle frame 30 and the back shell 50. The pump 23 is located between the middle frame 30 and the back shell 50. In the thickness direction of the terminal device 100, the connecting pipe 24 needs to pass through the middle frame 30, and part of the connecting pipe 24 ( Figure 7 The part of the connecting pipe 24 indicated by the solid line in the figure is located between the middle frame 30 and the display screen 10. The part of the connecting pipe 24 ( Figure 7 The portion of the connecting pipe 24 indicated by the dotted line in the figure is located between the middle frame 30 and the back shell 50. In this solution, the heat dissipation components 20 are dispersed on both sides of the middle frame 30, and the space on both sides of the middle frame 30 can be flexibly used. For example, if there is idle space in the area near the small board 70 between the middle frame 30 and the back shell 50, the radiator 22 and the pump 23 can be set in this idle space, and part of the heat dissipation components 20 are set in the idle space, which is conducive to the design of the overall thin size of the terminal device 100.

[0151] Fig. 9 This is a schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application. Fig. 9As shown, in the present embodiment, the cooler 21 is located in the hot zone H, and is thermally connected to the heating device 41 through a cold medium. The radiator 22 is located in the cold zone C, and is located in the area where the small plate 70 is located. The pump 23 is located in the hot zone H, and the pump 23 is arranged adjacent to the cooler 21. In the present solution, the pump 23 is arranged in the area where the mainboard 40 is located, which is convenient for setting a control unit, and the control unit is used to control the working state of the pump 23 and collect relevant data. For example, the control unit can be arranged on the mainboard 40, or the control unit can be integrated in other circuit units on the mainboard 40. In the embodiment of the present application, the control unit for controlling the pump 23 can also be a separate chip, which can be arranged on a separate circuit board independent of the mainboard 40.

[0152] In one embodiment, the number of coolers in the heat dissipation assembly is one, the number of radiators is two or more, the number of pumps is one, or two, or more than two, and the cooler, radiator, pump and connecting pipe constitute two or more parallel liquid cooling circulation systems, so that the heat dissipation assembly can be flexibly arranged in the terminal device to improve the temperature uniformity and heat dissipation performance.

[0153] Fig.10 This is a schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application. Fig.10 As shown, in this embodiment, the number of heat exchangers 20A is three, among which the number of coolers 21 is one, and the number of radiators 22 is two. The number of pumps 23 is one. The cooler 21 is located in the hot zone H, and is connected to the heating device 41 through a refrigerant medium. The pump 23 is located in the hot zone H, and the pump 23 is arranged adjacent to the cooler 21. One of the radiators 22 (the first radiator) is located in the cold zone C, and is located in the area where the small plate 70 is located. The other radiator 22 (the second radiator) is arranged to overlap with a partial area of ​​the battery 60 near the small plate 70. It can be understood that the two radiators 22 are distributed on two parallel liquid cooling pipelines. In this embodiment, by arranging two radiators 22 in parallel in the cold zone C, the sizes of the two radiators 22 can be different or the same, and their positions can be flexibly arranged in the cold zone C. This solution can set the size of each radiator 22 according to the specific environmental size in the terminal device 100. The two radiators 22 are independent of each other and jointly achieve heat dissipation, which is beneficial to rationally utilize the space in the terminal device 100 on the basis of ensuring heat dissipation efficiency. It can avoid that the overall size of the terminal device 100 is affected by the larger radiator occupying a larger space and cannot achieve a lightweight design.

[0154] In other implementations, Fig.10On the basis of the embodiment shown, the number of the radiators 22 is set to three or more, which can be set according to the requirements of the internal space of the specific terminal device 100. For example, when the terminal device is a laptop computer, the power of the heating device on the motherboard is relatively large, and a stronger heat dissipation capacity is required. Since the cold zone of the laptop computer is relatively large, more radiators can be set, and three or more radiators can be set in parallel to improve the heat dissipation efficiency.

[0155] Fig.11 This is a schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application. Fig.11 As shown, in this embodiment, the terminal device 100 is a folding machine, that is, a mobile phone with a folding function. The terminal device 100 includes a first body 101 and a second body 102, and the first body 101 and the second body 102 are connected by a hinge assembly 103, and the first body 101 and the second body 102 can be folded or unfolded relative to each other. The first body 101 is provided with a main frame side circuit board and a main frame side battery, and the main frame side circuit board is equivalent to the main board of the terminal device. The main frame side circuit board is provided with a heating device 41, for example, the heating device 41 can be a SOC. The second body 102 is provided with a sub-frame side circuit board and a sub-frame side battery, and a speaker and other electronic devices are provided on the side of the sub-frame side battery away from the sub-frame side circuit board. The first body 101 is provided with a rear camera, and the second body 102 is provided with a front camera. The first body 101 and the second body 102 are connected by an FPC to transmit electrical signals and data signals, and the FPC passes through the hinge assembly 103.

[0156] Fig.11In the illustrated embodiment, the first body 101 includes a top 1011 and a bottom 1012, the main frame side circuit board is close to the top 1011 of the first body 101, and the main frame side battery is located between the main frame side circuit board and the bottom 1012 of the first body 101. The cooler 21 of the heat dissipation assembly is arranged in the hot zone H in the first body 101. Specifically, the cooler 21 is located in the area where the main frame side circuit board is located, and is thermally connected to the heating device 41. The radiator 22 of the heat dissipation assembly 20 is arranged in the cold zone C in the first body 101. In one embodiment, the radiator 22 overlaps with part of the main frame side battery, and the radiator 22 is close to the edge of the main frame side battery away from the main frame side circuit board. The pump 23 of the heat dissipation assembly is located on the side of the main frame side battery away from the main frame side circuit board, that is, located near the bottom 1012 of the first body 101. The connecting pipe 24 connects the cooler 21, the pump 23, and the radiator 22 to form a heat exchange circulation pipeline. In this embodiment, the heat dissipation component 20 is arranged in the first main body 101, and the connecting pipe 24 does not need to pass through the shaft assembly 103. Moreover, the hot zone H in the first main body 101 is the area where the main heat source is concentrated. This embodiment can take into account the solution of heat dissipation and temperature uniformity, and can ensure that the arrangement of the heat dissipation component in the terminal device is simple and easy.

[0157] Fig.12 A schematic diagram of the internal structural layout of a terminal device provided for one embodiment of the present application. Fig.12 The embodiment shown is similar to Fig.11 The difference between the embodiments shown is that the pump 23 and the radiator 22 in the heat dissipation assembly 20 are arranged differently in the internal space of the terminal device 100. Fig.12 As shown, in this embodiment, the cooler 21 of the heat dissipation assembly 20 is arranged in the hot zone H in the first body 101. Specifically, the cooler 21 is located in the area where the main frame side circuit board is located, and is thermally connected to the heating device 41. The pump 23 and the radiator 22 in the heat dissipation assembly 20 are located in the second body 102. The radiator 22 is located in the cold zone C, and the pump 23 is located in the area where the sub-frame circuit board is located. The connecting pipe 24 extends from the first body 101 through the shaft assembly 103 to the inside of the second body 102. Fig.12 The illustrated embodiment conducts the heat in the first body 101 to the second body 102 and dissipates the heat through the heat sink 22 disposed in the second body 102 , thereby ensuring better temperature uniformity between the first body 101 and the second body 102 .

[0158] Fig.13 A schematic diagram of the internal structural layout of a terminal device provided for one embodiment of the present application. Fig.13 The embodiment shown combines Fig.11 The embodiments shown and Fig.12In the illustrated embodiment, the cooler 21 of the heat dissipation assembly 20 is disposed in the heat zone H in the first body 101 . Specifically, the cooler 21 is located in the area where the circuit board on the main frame side is located, and is thermally connected to the heating device 41 . Fig.13 In the embodiment shown, two independent liquid cooling circulation pipelines are connected by a cooler 21, and the cooler 21 includes four interfaces, which are used to connect with the connecting pipe 24, two of which are liquid inlets, and the other two interfaces are liquid outlets. The number of radiators 22 of the heat dissipation assembly 20 is two (respectively, the first radiator and the second radiator). One of the radiators 22 (the first radiator) is located in the cold zone C in the first body 101. Specifically, this radiator 22 is close to the bottom edge of the main frame side battery, and the bottom edge of the main frame side battery is located at the edge of the main frame side battery away from the main frame side circuit board. Another radiator 22 (the second radiator) is located in the cold zone C in the second body 102. In this embodiment, the number of pumps 23 is two (respectively the first pump and the second pump), one of which is located in the first body 101, and is located on the side of the main frame side battery away from the main frame side circuit board, that is, located near the bottom edge of the first body 101; the other pump 23 (the second pump) is located in the second body 102, and is located in the area where the sub-frame circuit board is located. This solution is beneficial to improving the heat dissipation efficiency of terminal equipment and can also flexibly arrange radiators and pumps.

[0159] Fig.14 This is a schematic diagram of a setting scheme of a connection pipe in a terminal device provided in an embodiment of the present application at the position of a shaft assembly. The relationship between the connection pipe 24 and the shaft assembly 103 provided in this embodiment is a cross-axis connection relationship. Fig.14The first body 101 and the second body 102 are connected by a rotating shaft assembly 103. The first body 101 includes a main frame door panel 1015 and a first middle frame 1016, and the second body 102 includes a sub-frame door panel 1025 and a second middle frame 1026. The rotating shaft assembly 103 includes an intermediate door panel 1031, a rotating shaft seat 1036 and a rotating shaft cover 1035, and the rotating shaft seat 1036 is located between the intermediate door panel 1031 and the rotating shaft cover 1035. The first middle frame 1016 and the main frame door panel 1015 are arranged opposite to each other, and the second middle frame 1026 and the sub-frame door panel 1025 are arranged opposite to each other. When the first body 101 and the second body 102 are relatively unfolded, the main frame door plate 1015 and the sub-frame door plate 1025 are distributed on both sides of the shaft seat 1036, the middle door plate 1031 is located between the shaft seat 1036 and the display screen 10, and the first middle frame 1016 and the second middle frame 1026 are distributed on both sides of the shaft cover 1035. The main frame door plate 1015, the sub-frame door plate 1025 and the middle door plate 1031 can form a flattened support structure, and the flattened support structure is used to support the display screen 10. In the flattened state, there are gaps between the main frame door plate 1015 and the display screen 10, between the middle door plate 1031 and the display screen, and between the sub-frame door plate 1025 and the display screen 10. The connecting pipe 24 crosses the shaft assembly 103 from the interval between the middle door plate 1031 and the display screen 10. Since the deformation of the display screen 10 during the bending process is smaller than the deformation of the hinge assembly 103 during the bending process, in this embodiment, the connecting tube 24 is crossed from the gap between the middle door panel 1031 and the display screen 10 to the hinge assembly 103, which can ensure that the connecting tube is bent at a larger angle, which not only ensures that the internal transmission space of the bending tube remains unobstructed, but also helps to ensure the service life of the connecting tube and the safety and stability of the structure.

[0160] Fig.15 This is a schematic diagram of a configuration scheme of a connection pipe in a terminal device at the position of a shaft assembly provided in an embodiment of the present application. The relationship between the connection pipe 24 and the shaft assembly 103 provided in this embodiment is a through-shaft connection relationship. Fig.15 The specific structure of the terminal device shown can be Fig.14 The specific structure of the terminal device shown is the same and will not be described again. In this embodiment, at the position of the shaft assembly 103, the connecting tube 24 is located on the side of the middle door plate 1031 away from the display screen 10, that is, the connecting tube 24 passes through the shaft assembly 103 from the interval area between the shaft seat 1036 and the shaft cover 1035. In this embodiment, the connecting tube 24 passes through the inside of the shaft assembly 103, because the space inside the shaft assembly 103 is larger than the interval space between the shaft assembly 103 and the display screen 10, the diameter of the connecting tube 24 can be set larger, and the larger size of the connecting tube 24 is conducive to improving the heat transfer efficiency and ensuring the structural strength and stability of the connecting tube.

[0161] Fig.16 , Fig.17 and Fig.18 A partial schematic diagram of a connecting pipe provided for a specific embodiment of the present application. Fig.16 , Fig.17 and Fig.18 In one embodiment, the connecting tube 24 has low thermal conductivity, and the thermal conductivity of the connecting tube 24 is much lower than that of the metal, so that it is difficult for the liquid inside the heat dissipation component to dissipate heat inside the connecting tube 24, so that the liquid inside the heat dissipation component can be concentrated in the radiator to dissipate heat. In one embodiment, the thermal conductivity of the connecting tube is K1, and the thermal conductivity of the metal is K2, where K1 < K2 / 5. The connecting tube provided in the present application has low thermal conductivity, which can ensure that less heat will be conducted to the terminal device in the area where the connecting tube extends, and can ensure that more heat is conducted to the radiator. Such a design can improve the temperature uniformity effect of the terminal device.

[0162] In one embodiment, the connecting pipe is made of a non-metallic material, and the thermal conductivity of the non-metallic material is much smaller than the thermal conductivity of metal.

[0163] See also Fig.17 and Fig.18 In one embodiment, the connecting tube 24 includes a metal tube body 241 and a heat insulating layer 242, and the heat insulating layer 242 is coated on the outer periphery of the metal tube body 241. In this solution, the connecting tube 24 is formed by combining the heat insulating layer 242 and the metal tube body 241, which can ensure that the connecting tube 24 can still have good structural strength and stability when the size is small enough. The cross section of the connecting tube 24 includes a height direction and a width direction. The size of the connecting tube 24 in the width direction is larger than the size of the connecting tube 24 in the height direction, that is, the connecting tube 24 is in the shape of a flat tube (such as Fig.17 As shown). In the cross section of the connecting tube 24, the metal tube body 241 includes a first half tube body 243 and a second half tube body 244 arranged opposite to each other, the first half tube body 243 half-encloses to form a first half channel 245, the second half tube body 244 half-encloses to form a second half channel 246, the first half tube body 243 and the second half tube body 244 are fixed by brazing, the first half channel 245 and the second half channel 246 are connected to form the internal channel of the connecting tube 24. This solution provides a specific manufacturing solution for the connecting tube.

[0164] In one embodiment, the height 24H of the connecting tube 24 does not exceed 0.25 mm. The thickness of the heat insulating layer 242 is not less than 0.05 mm. The heat insulating layer 242 may be a PI film. This solution helps to ensure a thin design of the space inside the terminal device by limiting the size of the connecting tube height.

[0165] In one embodiment, the metal tube body 241 in the connecting tube 24 may be a copper tube. The copper tube has the property of being easy to bend. When the connecting tube 24 is relatively wide, a support column structure may be relatively arranged in the first half tube body 243 and the second half tube body 244 to prevent the connecting tube 24 from collapsing due to the large width. The connecting tube 24 may be welded to the cooler 21, the radiator 22 and the pump 23 by laser welding or ultrasonic welding.

[0166] Fig.19 A three-dimensional schematic diagram and a partially enlarged schematic diagram of a heat exchanger in a heat dissipation assembly provided in one embodiment of the present application, Fig. 20 for Fig.19 Schematic diagram of the heat exchanger shown in Figure 1. Fig.19 In this embodiment, the heat exchanger is described in detail by taking the cooler 21 as an example. In other embodiments, the cooler 21 with the same structure can also become the radiator of the heat exchanger. The cooler 21 is a flat plate structure. The cooler 21 includes a first plate 211 and a second plate 212 stacked. The first plate 211 and the second plate 212 are connected to form a shell 210 of the cooler 21. The shell 210 surrounds a plurality of fluid channels. The shell 210 is provided with a channel inlet 213 and a channel outlet communicating with the fluid channels. Fig.19 As shown in the partial enlarged view, in one embodiment, the second plate 212 and the first plate 211 are relatively buckled, and the groove position of the first plate 211 is the channel entrance 213.

[0167] In one embodiment, the first plate 211 is a combination of one or more of copper, aluminum, stainless steel, and a high thermal conductivity polymer material. The second plate 212 may also be a combination of one or more of copper, aluminum, stainless steel, and a high thermal conductivity polymer material.

[0168] See also Fig. 20 In one embodiment, a channel inlet 213, a channel outlet 215, and a fluid channel 214 connected between the channel inlet 213 and the channel outlet 215 are formed on the surface of the first plate 211. Specifically, the channel inlet 213, the channel outlet 215, and the fluid channel 214 connected between the channel inlet 213 and the channel outlet 215 can be formed on the surface of the first plate 211 by etching or casting. The second plate 212 is a flat plate structure, that is, no channel structure is provided on the second plate. The first plate 211 and the second plate 212 can be sealed by welding.

[0169] In one embodiment, the channel inlet 213 and the channel outlet 215 are located on opposite sides of the fluid channel 214, such as Fig. 20As shown, the cooler 21 as a whole can be rectangular, and the channel inlet 213 and the channel outlet 215 are respectively located at a pair of oppositely arranged diagonal positions of the rectangle. There are multiple fluid channels 214, which are arranged between the channel inlet 213 and the channel outlet 215. The journey from the channel inlet 213 through each fluid channel 214 to the channel outlet 215 is called the flow of the cold medium in the cooler 21. The cold medium passes through the multiple fluid channels 214 in the cooler 21, generating multiple flows, and the number of flows is the same as the number of fluid channels 214 and corresponds one to one. In one embodiment, the sizes of the flows of the multiple fluid channels 214 are equal, which is conducive to ensuring the uniformity of the flow distribution of the cold medium body in the multiple fluid channels 214 of the cooler 21.

[0170] like Fig. 20 As shown, in one embodiment, the equivalent diameter D of the fluid channel 214 is within the range of 0.05 to 0.3 mm (this range includes the end points), which can be understood as the equivalent diameter D of the fluid channel 214 being greater than or equal to 0.05 mm and less than or equal to 0.3 mm. This solution limits the equivalent diameter D of the fluid channel 214 to within the range of 0.05 to 0.3 mm, which is beneficial to increasing the heat exchange efficiency per unit volume of the cooler 21 on the one hand, and is beneficial to controlling the overall size of the cooler 21 to be thinner on the other hand. When the cooler 21 is used inside a terminal device, the thickness of the terminal device can be controlled within a reasonable range.

[0171] Fig.21 A three-dimensional schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application. Fig. 22 for Fig.21 A schematic plan view of the first plate in the heat exchanger is shown.

[0172] See also Fig.21 and Fig. 22, the periphery of the first plate 211 forms an edge wall 2110, and the channel inlet 213 and the channel outlet 215 are notch structures formed on the edge wall 2110. A flow guide structure 217 and a barrier strip 216 for forming a fluid channel 214 are arranged in the space enclosed by the edge wall 2110. The barrier strips 216 are arranged at intervals along the first direction A1. In a specific embodiment, each barrier strip 216 is in a straight line shape, and the extending direction of each barrier strip 216 is the second direction A2. There is a spacing space between the two ends of each barrier strip 216 and the edge wall 2110, and this spacing space is used to connect each fluid channel 214 to the channel inlet 213 and the channel outlet 215. A plurality of fluid channels 214 are sequentially arranged in a row along the first direction A1, and in the second direction A2, the channel inlet 213 and the fluid channel 214 at the head of the row are arranged opposite to each other, and the channel outlet 215 and the fluid channel 214 at the end of the row are arranged opposite to each other. This solution can achieve that multiple processes from the channel inlet 213 to the channel outlet 215 are close or equal, which is conducive to ensuring the uniformity of the heat received by the refrigerant medium inside the cooler. The second direction A2 is perpendicular to the first direction A1. In a specific embodiment, the first plate 211 is a rectangle, the first direction A1 is the long side direction of the rectangle, and the second direction A2 is the short side direction of the rectangle.

[0173] Fig.21 and Fig. 22 In one embodiment shown, the flow guide structure 217 includes a plurality of diverter plates 2171, and through holes 2172 are formed between adjacent diverter plates 2171. The plurality of diverter plates 2171 are arranged in a row along the first direction A1. The diverter plates 2171 can be integrally formed in the first plate 211 by etching or casting. The plurality of diverter plates 2171 divide the space in the first plate 211 (the space formed by the edge wall 2110) into a first space R1 and a second space R2. The plurality of fluid channels 214 formed by the plurality of barrier strips 216 are located in the second space R2, and the channel inlet 213 is connected to the first space R1. The plurality of through holes 2172 are connected to the first space R1 and the second space R2. This solution makes the flow distribution in the cooler more uniform by designing a flow guide structure.

[0174] Fig.21 and Fig. 22 In one embodiment shown, the dimensions of the diverter plates 2171 extending along the first direction A1 are the same, and the through holes 2172 in the flow guiding structure 217 are evenly distributed along the first direction A1.

[0175] Fig.23 A three-dimensional schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application. Fig.24 for Fig.23 A schematic plan view of the first plate in the heat exchanger is shown. Fig.23 , Fig.24 The embodiment shown and Fig.21 , Fig. 22 The difference between the embodiments shown is that the design of the flow guide structure 217 is different. Fig.23 and Fig.24 In one embodiment, along the first direction A1, the density of the through holes 2172 at both ends of the flow guiding structure 217 is less than the density of the through holes 2172 in the middle area of ​​the flow guiding structure 217. The flow guiding structure 217 includes an edge area 2175 and a middle area 2174, and the edge area 2175 is located on both sides of the middle area 2174. The size of each of the multiple diverter plates 2171 in the edge area 2175 is greater than the size of each of the multiple diverter plates 2171 in the middle area 2174, and the distribution density of the through holes 2172 in the edge area 2175 is less than the distribution density of the through holes 2172 in the middle area.

[0176] This solution can improve the flow balancing effect by designing the distribution density of the through holes 2172 on the flow guide structure 217. For the edge area 2175 close to the channel inlet 213, since the channel inlet 213 and the fluid channel 214 are arranged along the first direction A1, the cold medium can easily pass through the through hole 2172 due to the inlet effect. The inlet effect can be understood as: when the cold medium enters the channel inlet 213, because the inner diameter of the connecting pipe is different from the size of the channel inlet 213, the potential energy of the fluid accumulates at the position of the channel inlet 213, making the flow speed of the cold medium faster. As for the other edge area 2175 far away from the channel inlet 213, the corresponding part of the first plate 211 and the corresponding part of the second plate can be used to force the cold medium to change the flow direction, forming a fluid disturbance, which is conducive to the cold medium passing through the through hole 2172. However, for the middle area 2174, there is no fluid disturbance factor in this area, and the refrigerant medium is not easy to change the flow direction, resulting in a small amount of refrigerant medium passing through the through holes 2172. Therefore, a higher density of through holes 2172 is set in the middle area 2174, and a lower density of through holes 2172 is set in the edge area 2175, which is beneficial to the overall flow uniformity effect of the guide structure 217.

[0177] Fig.25 A partial three-dimensional schematic diagram and a partially enlarged schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application. Fig.25In one embodiment, the flow-guiding structure 217 includes a plurality of spoiler structures 2177, and the plurality of spoiler structures 2177 are protrudingly arranged at one end of the corresponding diverter plate 2171, and the spoiler structure 2177 protrudes toward the first space R1 or the second space R2. The spoiler structure 2177 is located at the outer edge of the through hole 2172. In this embodiment, each diverter plate 2171 has a spoiler structure 2177 at both ends, and each through hole 2172 has a spoiler structure 2177 at the outer edge on both sides. The spoiler structure 2177 extends from the surface of the diverter plate 2171 in the direction of the second space R2. In this embodiment, the spoiler structure 2177 is a flat plate or a straight strip structure, and the spoiler structure 2177 is perpendicular to the diverter plate 2171.

[0178] The embodiment of the present application can solve the problem of flow balancing in the case of a large flow velocity in the cooler 21 by providing a flow disturbance structure 2177. In the case of a large flow velocity, it is difficult to achieve the purpose of changing the flow direction of the refrigerant medium only by providing the pressure fluctuation formed by the through hole 2172. Therefore, it is necessary to provide a flow disturbance structure 2177 in the case of providing the through hole 2172, increase the disturbance, strengthen the pressure fluctuation at the through hole 2172, and force the refrigerant medium to change the flow direction.

[0179] Fig.26 A partial stereoscopic schematic diagram and a partially enlarged schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application. Fig.26 The embodiments shown and Fig.25 The difference between the embodiments shown is that the spoiler structure 2177 is arranged in a different position. Fig.26 In this embodiment, the spoiler structure 2177 extends from the surface of the diverter plate 2171 toward the first space R1. Fig.25 and Fig.26 The spoiler structure 2177 is arranged in different directions, and the selection of the two is mainly determined by the flow velocity and the flow velocity resistance loss. Fig.26 The arrangement of the spoiler structure 2177 shown in the figure is characterized in that: at a high flow rate, the flow diversion effect is more obvious, but the flow resistance loss is also greater. The specific structure and quantity distribution of the spoiler structure 2177 provided in this embodiment are similar to Fig.25 The embodiments shown are the same and will not be described again.

[0180] Fig. 27 A partial stereoscopic schematic diagram and a partially enlarged schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application. Fig. 27 The embodiments shown and Fig.26 The embodiment shown differs in that the number of spoiler structures 2177 is different. Fig. 27A spoiler structure 2177 is provided at one end of each diverter plate 2171 , that is, a spoiler structure 2177 is provided at the outer edge of one side of each through hole 2172 . Fig. 27 The embodiments shown and Fig.26 The differences in the implementations shown are: Fig. 27 The embodiment shown in the figure has a spoiler structure 2177 on each diverter plate 2171, and the uniform diverter effect is slightly inferior to Fig.26 The embodiment shown, however Fig. 27 In the embodiment shown, the resistance loss of the refrigerant in the cooler is greatly reduced. The specific structure of the spoiler structure 2177 provided in this embodiment and its positional relationship relative to the diverter plate 2171 are similar to Fig.26 The embodiments shown are the same and will not be described again.

[0181] Fig.28 A partial stereoscopic schematic diagram and a partially enlarged schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application. Fig.28 The embodiments shown and Fig. 27 The difference between the illustrated embodiments is that the structural form of the spoiler structure 2177 is different. Fig. 27 The spoiler structure 2177 in the provided embodiment is a flat plate structure. Fig.28 The spoiler structure 2177 in the embodiment provided is in the shape of an arc plate, and is used to achieve a reduction in resistance loss. Specifically, in the embodiment, the spoiler structure 2177 includes a connection end 21771 and a free end 21772, the connection end 21771 is connected to the diverter plate 2171, and the tip 21772 is located at the end of the spoiler structure 2177 away from the diverter plate 2171. From the connection end 21771 to the free end 21772, the spoiler structure 2177 extends in an arc shape, the connection end 21771 is connected to the edge position of the diverter plate 2171, the tip 21772 extends to the position corresponding to the inside of the through hole 2172 in the first direction, and the tip 21772 is projected inside the through hole 2172 in the second direction. The concave arc surface of the arc plate-shaped spoiler structure 2177 faces the through hole 2172, and the convex arc surface of the arc plate-shaped spoiler structure 2177 faces the edge fence 2110. The quantity distribution and relative position relationship of the spoiler structures 2177 provided in this embodiment to the diverter plate 2171 are similar to Fig. 27 The embodiments shown are the same and will not be described again.

[0182] Fig.29 , Fig.30 and Fig.31 Each of them is a schematic plan view of a first plate in a heat exchanger provided in one embodiment of the present application. Fig.29 In the embodiment shown, part of the spoiler structure 2177 is Fig.25The spoiler structure 2177 provided in the embodiment provided, part of the spoiler structure 2177 is Fig.26 The provided embodiment provides a spoiler structure 2177. Fig.30 In the embodiment shown, part of the spoiler structure 2177 is Fig. 27 The spoiler structure 2177 provided in the embodiment provided, part of the spoiler structure 2177 is Fig.28 The provided embodiment provides a spoiler structure 2177. Fig.31 In the embodiment shown, the first plate is formed Fig.25 , Fig.26 , Fig. 27 , Fig.28 The embodiment shown provides four different designs of spoiler structures 2177. In summary, the spoiler structure 2177 in the flow guide structure of the cooler provided in the embodiment of the present application can be: Figures 25 to 31 The spoiler structure 2177 provided in any one of the embodiments may also be combined and varied in different ways based on these embodiments.

[0183] Fig.32 A schematic plan view of a first plate in a heat exchanger provided in one embodiment of the present application. Fig.32 In one embodiment, the flow guide structure 217 includes a double-layer diverter plate 2171 structure, and the flow guide structure 217 has a double-layer through hole 2172. The multi-layer diverter plate 2171 structure provided in this solution is used in the case where the flow velocity in the cooler 21 is relatively low, and a strong pressure disturbance is formed through the two layers of through holes 2172, so that the refrigerant medium changes its flow direction. The secondary diversion formed by the double-layer diverter plate 2171 structure is more obvious than the primary diversion effect and is easier to control. Multiple diverter plates 2171 are arranged in two rows along the second direction A2, and each row of diverter plates 2171 is arranged along the first direction A1. The flow guide structure 217 divides the internal space of the first plate into a first space R1 and a second space R2, and the spacing area between the two rows of diverter plates 2171 forms a third space R3. In one embodiment. The two rows of diverter plates 2171 are staggered in the first direction A1, and the through holes 2172 formed in one row of diverter plates 2171 are arranged opposite to the other row of diverter plates 2171 in the second direction A2. The through holes 2172 in one row of diverter plates 2171 and the through holes 2172 in the other row of diverter plates 2171 are staggered.

[0184] Fig.33 A schematic plan view of a first plate in a heat exchanger provided in one embodiment of the present application. Fig.33 In one embodiment, the portion of the fluid channel 214 is a first channel 2140, Fig.33The fluid channels in the middle dotted frame are all first channels 2140. The barrier strips 216 forming the first channels 2140 are first barrier strips 2161 and second barrier strips 2162. The flow guiding structure 217 includes a middle area 2174 and an edge area 2175. The entrance of the first channel 2140 and the middle area 2174 of the flow guiding structure 217 are arranged opposite to each other. At the entrance of the first channel 2140, the first barrier strips 2161 and the second barrier strips 2162 are arranged in a stepped structure, and the distance between the first barrier strips 2161 and the flow guiding structure 217 in the second direction A2 is smaller than the distance between the second barrier strips 2162 and the flow guiding structure 217 in the second direction A2.

[0185] In one embodiment, the length of the first baffle 2161 is greater than the length of the second baffle 2162, and on the side adjacent to the guide structure 217, the vertical distance between the first baffle 2161 and the guide structure 217 is less than the vertical distance between the second baffle 2162 and the guide structure 217. The cooler is made of metal and can be made in one piece. Since the metal surface is hydrophilic and has a large surface energy, it is easy to form a liquid film in a small-sized channel and a low flow rate. The guide structure provided in this solution can achieve a step-by-step arrangement of the channel length of the fluid channel in the middle area of ​​the cooler on the side close to the inlet when the equivalent diameter of the channel is small. The stepped flow channel structure can effectively reduce the effect of channel blockage caused by the adhesion of water film on the surface of the microchannel by forming a turbulent flow.

[0186] Fig.34 This is an enlarged schematic diagram of a liquid channel in a heat exchanger provided in one embodiment of the present application. Fig.34 For the fluid channel 214 in the cooler, the first direction A1 is the width direction of the fluid channel 214, the second direction A2 is the length direction of the fluid channel 214, and the third direction A3 is the height direction of the fluid channel 214. The first direction A1, the second direction A2 and the third direction A3 are perpendicular to each other. The dimension ratio of the height direction to the width direction of each fluid channel 214 is 0.3-2, that is, H / W=0.3-2. By constraining the dimension ratio of the height and width of the fluid channel, this solution allows the cooler to be used in space-constrained environments such as mobile phones, which is beneficial to improving the heat dissipation performance of small-sized terminal devices. Small-sized terminal devices have large heat dissipation requirements and can better highlight the heat dissipation effect of the heat dissipation component.

[0187] The specific structure of the radiator provided in the present application can be the same as that of the cooler, and the specific structure of the radiator will not be described in detail. The size of the radiator can be different from that of the cooler, and radiators of different sizes can be set according to different use environments and requirements.

[0188] Fig.35 A schematic diagram of a pump provided in accordance with an embodiment of the present application. Fig.35 In one embodiment, the pump 23 provided in the present application is a piezoelectric micropump, and the pump 23 includes an inlet 231, an outlet 232, a pump chamber 233, a piezoelectric vibrator 234, an inlet valve 235 and an outlet valve 236. The piezoelectric vibrator 234 is arranged in the pump chamber 233, the inlet valve 235 is arranged between the inlet 231 and the pump chamber 233, and the outlet valve 236 is arranged between the outlet 232 and the pump chamber 233. The pump 23 also includes a terminal 237, which is electrically connected to the piezoelectric vibrator 234 and is used to connect an external drive circuit or a drive component. The drive of the pump 23 can be a control unit, and this control unit can be a circuit board architecture independently arranged in the terminal device, or it can be a partial control circuit integrated on other circuit boards of the terminal device.

[0189] Fig.36 This is a three-dimensional exploded schematic diagram of a heat dissipation assembly provided in one embodiment of the present application. Fig.36 In one embodiment, the heat dissipation assembly 20 includes a heat dissipation plate structure 201 and a pump 23. The heat dissipation plate structure 201 is enclosed to form a receiving space 2011, and the receiving space 2011 is used to accommodate the pump 23. In one embodiment, the heat dissipation plate structure 201 includes a first interface P1 and a second interface P2, and the first interface P1 and the second interface P2 are located on the inner wall of the receiving space 2011. The pump 23 is connected between the first interface P1 and the second interface P2 so that the pump 23 and the heat dissipation channel inside the heat dissipation plate structure 201 are connected. The heat dissipation plate structure 201 is provided with an isolation belt 2014, and the isolation belt 2014 passes through the heat dissipation plate structure 201 in the thickness direction of the heat dissipation plate structure 201. The receiving space 2011 can also be called an isolation belt, and therefore, the pump 23 provided in the embodiment of the present application can be located in part of the isolation belt.

[0190] See also Fig.36 The heat sink structure 201 includes a first plate 2012 and a second plate 2013, which are stacked relative to each other and interconnected as a whole. The first interface P1 and the second interface P2 can be arranged at the connection between the first plate 2012 and the second plate 2013. Such a design can ensure that the pump occupies as little space as possible in the thickness direction of the heat sink structure at the first interface P1 and the second interface P2, which is conducive to the thin design of the terminal device.

[0191] Fig.37 for Fig.36 The schematic plan view of the first plate member of the heat dissipation plate structure in the heat dissipation assembly is shown. Fig.38 for Fig.36The schematic plan view of the second plate of the heat dissipation plate structure in the heat dissipation assembly is shown. The at least two heat exchangers and connecting pipes provided in the embodiment of the present application are integrally formed in a heat dissipation plate structure, eliminating the need for assembly, making the heat dissipation assembly integral, not prone to leakage, and easy to assemble.

[0192] See also Fig.37 and Fig.38 , the first plate 2012 has a cooler channel 21P, a radiator channel 22P and a connecting pipe channel 24P which are integrally formed. In this solution, the cooler channel 21P, the radiator channel 22P and the connecting pipe channel 24P are made on the first plate 2012, and the second plate 2013 is a smooth flat plate, which is easy to control the production cost and production difficulty. It can be understood that the cooler channel 21P and the corresponding first plate 2012 and the second plate 2013 together form a cooler, the radiator channel 22P and the corresponding first plate 2012 and the second plate 2013 together form a radiator, and the connecting pipe channel 24P and the corresponding first plate 2012 and the second plate 2013 together form a connecting pipe.

[0193] Fig.37 The portion in the dotted box is the cooler flow channel 21P and the radiator flow channel 22P. In one embodiment, the first plate 2012 includes a top E1, a bottom E2, and a first side E3 and a second side E4 connected between the top E1 and the bottom E2 and arranged opposite to each other. The cooler flow channel 21P is adjacent to the top E1, and the radiator flow channel 22P is adjacent to the bottom E2. A portion of the connecting pipe flow channel 24P is a first section 24P1, and the first section 24P1 is adjacent to the first side E3 and connected between the cooler flow channel 21P and the radiator flow channel 22P. A portion of the connecting pipe flow channel 24P is a second section 24P2, and the second section 24P2 is adjacent to the second side E4 and connected between the cooler flow channel 21P and the radiator flow channel 22P. The first plate 2012 is provided with a first sub-isolation zone 20141, part of the first sub-isolation zone 20141 is located on the side of the first section 24P1 away from the first side edge E3 and adjacent to the first section 24P1, and part of the first sub-isolation zone 20141 is located on the side of the second section 24P2 away from the second side edge E4 and adjacent to the second section 24P2. The first plate 2012 surrounds and forms a first sub-accommodation space 20111, the first sub-accommodation space 20111 is used to accommodate the pump 23, and the first sub-accommodation space 20111 is connected to the second section 24P2 of the connecting pipe flow channel 24P.

[0194] See also Fig.37 and Fig.38The second plate 2013 has the same shape as the first plate 2012. The second plate 2013 is provided with a second sub-isolation zone 20142 and a second sub-accommodation space 20112. After the first plate 2012 and the second plate 2013 are interconnected as one, the second sub-isolation zone 20142 and the first sub-isolation zone 20141 are connected to form an isolation zone of a heat dissipation plate structure, and the second sub-accommodation space 20112 and the first sub-accommodation space 20111 are connected to form an accommodation space of a heat dissipation plate structure.

[0195] A portion of the isolation zone on the heat dissipation plate structure is located on a side of the first tube away from the first side and adjacent to the first tube, and a portion of the isolation zone on the heat dissipation plate structure is located on a side of the second tube away from the second side and adjacent to the second tube. The heat dissipation plate structure includes a top end and a bottom end that are oppositely arranged, and a first side and a second side that are connected between the top end and the bottom end and are oppositely arranged. One of the at least two heat exchangers is a cooler, and the remaining heat exchangers are radiators. The cooler is formed in an area adjacent to the top end, and the radiator is formed in an area adjacent to the bottom end. A portion of the connecting tubes is a first tube that is adjacent to the first side and connected between the cooler and the radiator, and a portion of the connecting tubes is a second tube that is adjacent to the second side and connected between the cooler and the radiator.

[0196] In one embodiment, the heat exchanger formed in the heat dissipation plate structure can be Figures 21 to 34 The specific structure of the cooler provided in any embodiment. The connecting pipe formed in the heat sink structure can be Figures 16 to 18 The specific structural dimension parameters of the connecting pipe provided in any one of the embodiments.

[0197] In one embodiment of the present application, part of the heat sink structure forms a temperature equalizing plate, and a heat exchange circulation pipeline consisting of at least two heat exchangers and connecting pipes is arranged around the periphery of the temperature equalizing plate. At least one of the two heat exchangers is a cooler, and the other heat exchangers are radiators. The evaporation zone of the temperature equalizing plate is adjacent to the cooler, and the condensation zone of the temperature equalizing plate is located between the cooler and the radiator. In this embodiment, the evaporation zone and the cooler of the temperature equalizing plate are arranged adjacent to each other, and the heat at the cooler position can be conducted to the evaporation zone of the temperature equalizing plate through the heat sink structure. The thermal conductivity is high, and the temperature equalizing plate can be used to supplement the heat dissipation, which is beneficial to provide a heat dissipation effect. For specific embodiments, please refer to Fig.39 The embodiment shown.

[0198] Fig.39 This is a schematic diagram of a planar decomposition of a heat sink structure provided in one embodiment of the present application. Fig.39The first plate 2012 of the heat dissipation plate structure 201 is integrally formed with a cooler channel 21P, a radiator channel 22P, a connecting pipe channel 24P and a temperature equalizing plate inner cavity 25C. The cooler channel 21P, the radiator channel 22P and the connecting pipe channel 24P constitute a heat exchange circulation pipeline, and this heat exchange circulation pipeline is arranged around the periphery of the temperature equalizing plate inner cavity 25C. The temperature equalizing plate inner cavity 25C includes an evaporation area 251 and a condensation area 252, the evaporation area 251 is adjacent to the cooler channel 21P, and the condensation area 252 is located between the cooler channel 21P and the radiator channel 22P. The first sub-isolation zone 20141 on the first plate 2012 is distributed on both sides of the temperature equalizing plate inner cavity 25C, and is located between the temperature equalizing plate inner cavity 25C and the connecting pipe channel 24P. A temperature averaging plate isolation zone 253 is provided inside the temperature averaging plate inner cavity 25C, and the two sides of the temperature averaging plate isolation zone 253 are respectively provided with a gas channel 254 and a liquid return channel 255, and the gas channel 254 and the liquid return channel 255 are both connected between the evaporation area 251 and the condensation area 252. The evaporation area 251, the gas channel 254, the condensation area 252, and the liquid return channel 255 are sequentially connected to form an annular circulation channel.

[0199] like Fig.39 As shown, the first plate 2012 has a length direction and a width direction, and the evaporation area 251 of the temperature-averaging plate inner cavity 25C and the cooler flow channel 21P are arranged side by side in the width direction. The cooler flow channel 21P and the radiator flow channel 22P are arranged opposite to each other in the length direction and are respectively located at the top and bottom ends of the first plate 2012. The condensation area 252 of the temperature-averaging plate inner cavity 25C is located in the middle area of ​​the first plate 2012 in the length direction.

[0200] See also Fig.39 The surface of the second plate 2013 of the heat dissipation plate structure 201 is provided with a capillary structure 256. In order to clearly illustrate the structure of each part of the heat dissipation plate structure 201, Fig.39 In the figure, the capillary structure 256 is separated from the second plate 2013. It is understood that the capillary structure 256 can be integrally formed on the surface of the second plate 2013, for example, the capillary structure 256 is formed on the surface of the second plate 2013 by sintering a copper mesh. The second plate 2013 and the first plate 2012 are relatively combined and fixed by sealing welding. The capillary structure 256 and the gas channel 254, the condensation zone 252, and the liquid return channel 255 in the inner cavity 25C of the temperature equalizing plate are arranged correspondingly. It can be understood that the area of ​​the capillary structure 256 on the second plate 2013 is opposite to the area of ​​the gas channel 254, the condensation zone 252, and the liquid return channel 255 on the first plate 2012. In this embodiment, the area of ​​the evaporation zone 251 is small, and the capillary action of the inner surface of the first plate and the second plate corresponding to the evaporation zone 251 can be used to realize the transfer of liquid. Therefore, the capillary structure 256 may not be arranged in the evaporation zone 251.

[0201] The second plate 2013 is provided with a long strip through hole 257, and the long strip channel 257 and the temperature averaging plate isolation belt 253 have the same structure and size, and the temperature averaging plate isolation belt 253 is a strip through hole structure provided on the first plate 2013. The first plate and the second plate are relatively buckled, and the long strip channel 257 and the temperature averaging plate isolation belt 253 are connected to form an integrated strip through hole structure.

[0202] In this embodiment, the evaporation area 251 of the temperature equalizing plate in the heat dissipation plate structure 201 is adjacent to the area where the cooler is located, and the area where the cooler is located is thermally connected to the heating device in the terminal device. For example, the area where the cooler is located can be attached to the heating device through a refrigerant medium. For example, the heating device can be a SOC on a motherboard.

[0203] See also Fig.40 , Fig.40 for Fig.39 Schematic diagram of the heat sink structure shown in the terminal device. In one embodiment, the terminal device is a mobile phone, and the heat sink structure 201 can be arranged between the display screen and the middle frame in the thickness direction of the terminal device. In the length direction of the terminal device, part of the heat sink structure 201 corresponds to the mainboard 40 in the terminal device, part of the heat sink structure 201 corresponds to the battery 60, and part of the heat sink structure 201 corresponds to the small board 70. The cooler 21 of the heat sink structure 201 is located in the hot zone H and is thermally connected to the heating device 41 on the mainboard 40 in the terminal device. The heat sink 22 of the heat sink structure 201 is located in the cold zone C, for example, at least part of the heat sink 22 can overlap with the battery 60, or at least part of the heat sink 22 overlaps with a part of the small board 70. The evaporation zone 251 of the temperature averaging plate 25 is located in the hot zone H and is adjacent to the cooler 21. The condensation zone 252 of the temperature averaging plate 25 is located in the middle area of ​​the battery 60 and between the cold zone C and the hot zone H.

[0204] Fig.40 The pump is not shown in the figure, but it can be understood that the pump can be located in the receiving space 2011 surrounded by the heat dissipation plate structure 201.

[0205] like Fig.40 As shown, the heat exchange circulation pipeline formed between the cooler 21 and the radiator 22 in the heat dissipation plate structure 201 is an active heat dissipation system. The pump is used as a power source to drive the circulation of the refrigerant. The refrigerant in the cooler 21 located at the top of the terminal device can be transported to the radiator 22 located at the bottom of the terminal device for heat dissipation. The refrigerant transmission process is much greater than the refrigerant transmission process of the temperature equalizing plate, which is conducive to the flexible arrangement of the radiator 22 and can improve the heat dissipation efficiency and temperature equalization effect.

[0206] This embodiment integrates the heat exchange circulation pipeline and the temperature equalizer 25, and the two can work together. When the power consumption of the heating device is large, the control system can start the pump to start the liquid cooling circulation architecture. At the same time, the evaporation area of ​​the temperature equalizer will also be affected by the heat of the heating device, so that the liquid inside it becomes steam and is transmitted to the condensation area along the gas channel. The gas in the condensation area is liquefied, and under the driving force of the capillary structure, it is transmitted to the evaporation area through the liquid return channel. When the power consumption of the heating device is small, the pump is not started, and the heat is transferred to the evaporation area of ​​the temperature equalizer by heat conduction, so that the liquid in the evaporation area of ​​the temperature equalizer changes phase, thereby completing the transfer of heat to the condensation area.

[0207] The embodiments of the present application can also be applied when the heat generation of the heating device is relatively low. At this time, in order to save energy, there is no need to start the pump, but heat dissipation can be performed through the temperature equalizing plate.

[0208] Fig.41 This is a schematic diagram of a planar decomposition of a heat dissipation plate structure 201 provided in one embodiment of the present application. Fig.41 A cooler flow channel 21P, a radiator flow channel 22P and a connecting pipe flow channel 24P are integrally formed in the first plate 2012 of the heat dissipation plate structure 201 . Fig.41 The embodiments shown and Fig.39 The embodiment shown differs in that Fig.41 In the illustrated embodiment, the heat sink structure 201 has only one liquid cooling circulation structure, and no temperature equalizing plate structure is provided. The heat sink structure 201 only integrates the liquid cooling circulation structure consisting of the cooler flow channel 21P, the radiator flow channel 22P and the connecting pipe flow channel 24P. Specifically, in the present embodiment, the heat sink structure 201 includes a first plate 2012 and a second plate 2013. The cooler flow channel 21P, the radiator flow channel 22P and the connecting pipe flow channel 24P are integrally formed in the first plate 2012. The second plate 2013 is a smooth flat plate structure, that is, no relevant flow channel structure is provided on the second plate 2013. The first plate 2012 and the second plate 2013 are relatively connected, for example, they can be sealed and connected by welding, so that a liquid cooling circulation structure can be formed inside the heat sink structure 201.

[0209] Fig.41 In the embodiment shown, the centers of the first plate 2012 and the second plate 2013 are both hollowed out, that is, the first plate 2012 and the second plate 2013 are both annular structures, so that the heat sink structure 201 constitutes an annular structure with a hollow center. This embodiment can make the heat sink structure 201 lighter on the one hand, and on the other hand, it can also ensure that the extension path of the connecting pipe flow channel 24P is more flexible, and the heat sink structure 201 can be adapted to a variety of different application environments by changing the shape of the connecting pipe flow channel 24P.

[0210] Fig.41 In the illustrated embodiment, the hollow space 2015 surrounded by the heat sink structure 201 is an integral space, and a pump may be disposed in the hollow space 2015. Components of electronic equipment, such as batteries, etc. may also be disposed in the hollow space 2015. Of course, a temperature equalizing plate may also be disposed in the hollow space 2015.

[0211] Fig.42 A schematic plan view of a heat sink structure provided in accordance with an embodiment of the present application. Fig.42 The embodiments shown and Fig.41 The embodiment shown differs in that Fig.42 In the illustrated embodiment, the hollow space formed by the heat dissipation plate structure 201 includes a relatively large main space 20151 and a relatively small subspace 20152. The subspace 20152 is separated from the main space 20151 by a spacer 20153. The subspace 20152 is used to accommodate a pump, and the main space 20151 can be used to arrange electronic equipment components, such as batteries, etc. Of course, a temperature equalization plate can also be arranged in the main space 20151.

[0212] Fig.43 A schematic plan view of a temperature homogenizing plate provided in one embodiment of the present application. Fig.44 A schematic cross-sectional view of a temperature homogenizing plate provided in one embodiment of the present application, wherein the supporting structure inside the temperature homogenizing plate is omitted.

[0213] See also Fig.43 and Fig.44 In one embodiment, the temperature plate 90 includes a housing 900, the housing includes a sealed space, and the sealed space is filled with a refrigerant. Specifically, in one embodiment, the housing 900 includes a first cover plate 901 and a second cover plate 902. The first cover plate 901 and the second cover plate 902 are sealed and connected to form a sealed space 903, and the first cover plate 901 and the second cover plate 902 can be sealed and connected by welding. A capillary layer 904 is provided on the inner surface of the second cover plate 902.

[0214] An evaporation zone 91, a condensation zone 92, a first channel 93 and a second channel 94 connected between the condensation zone 92 and the evaporation zone 91 are formed in the sealed space 903. The evaporation zone 91, the first channel 93, the condensation zone 92 and the second channel 94 are connected in sequence to form an annular circulation channel. Fig.43 The positions of the evaporation area 91 , the first channel 93 , the condensation area 92 , and the second channel 94 are schematically indicated on the surface of the first cover plate 901 . Fig.44In the cross-sectional view shown, the left end of the sealed space 903 is the evaporation zone 91, the right end of the sealed space 903 is the condensation zone 92, and the middle part can be the first channel or the second channel. Specifically, in one embodiment, the first channel 93 is a gas channel, and the second channel 94 is a liquid channel.

[0215] The first cover plate 901 corresponding to the evaporation zone 91 in the sealed space 903 is used to connect with the heat source in the electronic device (such as the SOC on the motherboard) through a thermal interface material (such as thermally conductive glue or other cold medium) so that the liquid in the evaporation zone 91 changes phase when heated to form steam. The steam enters the first channel 93 and diffuses toward the condensation zone 92. In the condensation zone 92, due to the lower temperature, the steam is forced to liquefy to form liquid, which passes through the capillary layer 904, so that the liquid is transferred to the evaporation zone 91 in the second channel 94.

[0216] See also Fig.43 and Fig.44 In the embodiment of the present application, a plurality of spaced nucleation structures 910 are provided in the first cover plate 901 corresponding to the evaporation zone 91, and the periphery of each nucleation structure 910 is a hydrophilic structure 920. The nucleation structure 910 is used to promote the nucleation boiling of the refrigerant, and the hydrophilic structure 920 is used to supply the refrigerant to the nucleation structure 910. Specifically, since the surface of the nucleation structure 910 is a surface with a hydrophobic function, the contact angle between the refrigerant and the surface of the nucleation structure 910 is large, making it easier for the refrigerant to nucleate and boil. At the same time, the embodiment of the present application can also continuously transport the refrigerant to the nucleation structure 910 with the help of the hydrophilic structure 920, so that the refrigerant in the evaporation zone 91 is easier to boil.

[0217] Fig.45 A specific structural design scheme of the evaporation zone in the temperature homogenizing plate provided in one embodiment of the present application includes the overall structure of the first cover plate 901 in the evaporation zone 91 and a partial enlarged schematic diagram. Fig.46 for Fig.45 Schematic diagram of a cross section of a portion of the micropillars in the structure shown. Fig.45 and Fig.46In one embodiment, the nucleation structure 910 includes a hydrophobic surface formed in the shell, and the hydrophilic structure 920 includes a hydrophilic surface located outside the hydrophobic surface. A plurality of spaced microcolumns 912 are provided in the evaporation zone 91, and the microcolumns 912 are connected to the first cover plate 901. The microcolumns 912 include an end face 9121 and a side face 9122 connected between the end face 9121 and the first cover plate 901. The end face 9121 forms a hydrophobic surface, and the side faces 9122 of the adjacent microcolumns 912 are surrounded to form a groove 913, and the side faces 9122 and the bottom of the groove 913 are both the hydrophilic surfaces. In this embodiment, by arranging the microcolumns 912 on the inner surface of the first cover plate 901, the end face 9121 of the microcolumns 912 forms a hydrophobic surface, and the side faces 9122 of the microcolumns 912 and the bottom of the groove 913 can both be hydrophilic surfaces, so that the cold medium has a greater contact with the end face 9121 on the end face 9121. For example, the contact angle is greater than 100 degrees, or greater than 150 degrees. In this case, the coolant forms a water drop shape on the end surface 9121, and the coolant is more likely to nucleate and boil when heated. The method of arranging the micro-pillars 912 on the inner surface of the first cover plate 901 is easy to manufacture. For example, the micro-pillars can be integrally formed directly on the surface of the first cover plate 901 by stamping, etc., and the manufacturing cost is low.

[0218] Fig.45 In the embodiment shown, the bottom of the groove 913 is the inner surface of the first cover plate 901, the side surface 9122 of the micro-pillar 912 is directly connected to the inner surface of the first cover plate 901, and the inner surface of the first cover plate 901 is a hydrophilic structure. Specifically, the first cover plate 901 is made of metal. Since the evaporation area of ​​the temperature-averaging plate is small, it only needs to be attached to the heating device. The inner surface of the first cover plate 901 is a hydrophilic structure. This solution uses the surface hydrophilicity of the first cover plate 901 to transport the liquid to the end surface 9121, without the need for an additional capillary structure, which is conducive to the small size and thin design of the temperature-averaging plate.

[0219] In one embodiment, the end surface 9121 is treated with a hydrophobic process to form a nucleation structure 910 having a hydrophobic function. For example, the nucleation structure 910 may be formed by a hydrophobic process such as oxidation, electroplating, or fine etching.

[0220] See also Fig.45 and Fig.46For each microcolumn 912, the end face 9121 of the microcolumn 912 includes a first width W1 and a second width W2, the first width is the side length of the end face 9121 in the first direction, and the second width is the side of the end face 9121 in the second direction, and the first direction and the second direction may be perpendicular to each other. In one embodiment, the first width W1 and the second width W2 may be equal, for example, the range of the first width W1 may be: 30-50um. The height H of the microcolumn 912 is the dimension of the microcolumn 912 protruding from the inner surface of the first cover plate 901, which can also be understood as the dimension in the thickness direction of the temperature equalizing plate, and the thickness direction of the temperature equalizing plate may be the stacking direction between the first cover plate and the second cover plate. In one embodiment, the size range of the height H of the microcolumn 912 may be: 40-80um, and all microcolumns 912 may be designed with the same height. The distance L between adjacent micropillars 912 can be between 50-100um. Specifically, the distance L between adjacent micropillars 912 arranged in the first direction and the distance L between adjacent micropillars 912 arranged in the second direction can be the same; in fact, in an embodiment, the distance between adjacent micropillars 912 arranged in the first direction and the distance between adjacent micropillars 912 arranged in the second direction can also be different.

[0221] Fig.47 A schematic cross-sectional view of some micro-pillars in a temperature homogenizing plate provided in one embodiment. Fig.47 , the end face 9121 of the microcolumn 912 includes a metal oxide coating 91211. In a specific embodiment, the metal oxide coating 91211 can be covered on the end face 9121 of the microcolumn 912 by a pulling method or a spraying, oxidation or other process. In this solution, the nucleation structure 910 includes a metal oxide coating 91211, and the metal oxide coating 91211 can be a micron-sized pit structure, and the metal oxide coating 91211 is a structure with a hydrophobic function. The cold medium will form a form with a large contact angle on the surface of the metal oxide coating 91211 with micron-sized pits, and the cold medium is easy to gather into a water drop shape, which is conducive to nucleation boiling.

[0222] Fig.48 A specific structural design scheme of the evaporation zone in the temperature homogenizing plate provided in one embodiment of the present application includes the overall structure of the first cover plate 901 in the evaporation zone 91 and a partial enlarged schematic diagram. Fig.49 for Fig.48 Schematic diagram of a cross section of a portion of the micropillars in the structure shown. Fig.48 and Fig.49In one embodiment, a part of the end surface 9121 of the microcolumn 912 is provided with one or more groove structures 9124 which are concave. In this embodiment, the nucleation structure 910 includes the groove structure 9124. The groove structure 9124 can be a pit structure visible to the naked eye. The groove structure 9124 can be a structure with a hydrophobic function. The cold medium will form a form with a large contact angle on the surface with the groove structure 9124. The cold medium is easy to gather into a water drop shape, which is conducive to nucleation boiling. The area occupied by the groove structure 9124 accounts for 30% to 80% of the area of ​​the entire end surface 9121, that is, the opening rate of the groove structure 9124 on the entire end surface 9121 is 30% to 80%. In this scheme, a groove structure 9124 is provided on the end face 9121 to make the end face 9121 a hydrophobic surface. It can be understood that the provision of the groove structure 9124 makes the end face 9121 no longer a smooth surface (such as a smooth plane or a smooth curved surface), that is, the surface roughness of the end face 9121 is changed, so that when the liquid is on the end face 9121, a larger contact angle can be formed between the liquid and the end face 9121, thereby forming a hydrophobic effect, which is conducive to nucleation boiling.

[0223] In a specific embodiment, a groove structure 9124 is provided on one end face 9121, and the groove structure 9124 is located in the central area of ​​the end face 9121. The groove structure 9124 can be a columnar blind hole structure, and the cross-section of the groove structure 9124 can be circular, square, triangular, polygonal, irregular, etc. The depth of the groove structure 9124 is the dimension in the thickness direction of the temperature homogenizing plate; or, when the end face 9121 is a plane, the depth of the groove structure 9124 can be the dimension in the direction perpendicular to the end face 9121. In one embodiment, the depth of the groove structure 9124 accounts for 10% to 90% of the height of the microcolumn 912.

[0224] Fig.47 , Fig.48 and Fig.49 The shape, size and other parameters of the micro-pillars 912 in the embodiment shown in the figure and the arrangement and position relationship of the plurality of micro-pillars 912 can be referred to in Fig.45 and Fig.46 The illustrated implementation manner will not be described in detail.

[0225] The present application provides three specific forms of hydrophobic surfaces, namely, surface treatment, groove structure, and metal oxide coating. These three solutions are easy to implement and have low production costs.

[0226] Fig.50 A schematic cross-sectional view of the evaporation zone of a temperature homogenizing plate provided in one embodiment of the present application. Fig.50A support column 905 is provided in the sealed space 903 between the first cover plate 901 and the second cover plate 902. The support column 905 is fixedly connected to the second cover plate 902. The surface of the support column 905 facing the first cover plate 901 contacts the end face 9121 of at least one of the micro-columns 912. In this solution, the support column 905 and the micro-columns 912 abut against each other, so that the support column 905 and the micro-columns 912 can jointly construct a support structure in the evaporation zone, thereby ensuring that the internal space of the evaporation zone does not collapse and ensuring space for liquid vaporization. Moreover, the support column 905 can be integrally formed with the second cover plate, and the support column 905 abuts against the micro-columns 912, so that the size of the support column 905 does not need to be too long, and can be directly formed on the inner surface of the second cover plate by a stamping process, and the manufacturing process is simple, the manufacturing cost is low, and the yield is also high.

[0227] Fig.51 A schematic cross-sectional view of the evaporation zone of a temperature homogenizing plate provided in one embodiment of the present application. Fig.51 A support column 905 is provided in the sealed space 903 between the first cover plate 901 and the second cover plate 902. In the evaporation zone, the support column 905 is abutted between the first cover plate 901 and the second cover plate 902, and a plurality of micro columns 912 are distributed in the area outside the support column 905. In this solution, by setting the support column 905 in the evaporation zone to abut between the first cover plate 901 and the second cover plate 902, the distribution of the micro columns 912 needs to avoid the position of the support column 905. During the manufacturing process, it is not necessary to consider the positional relationship and alignment between the micro columns 912 and the support column 905, so that the manufacturing process is simpler and the manufacturing cost is lower.

[0228] Fig.50 and Fig.51 In the illustrated embodiment, the support column 905 can be integrally formed with the second cover plate 902 , for example, the support column 905 can be formed on the second cover plate 902 by a stamping process. A plurality of micro columns 912 can be integrally formed with the first cover plate 901 . Fig.50 and Fig.51 The positional relationship between the support column 905 and the micro column 912, the support column 905 and the first cover plate 901, and the second cover plate 902 are only schematically expressed, and do not represent their actual structural form.

[0229] Fig.52 A schematic cross-sectional view of the evaporation zone of a temperature homogenizing plate provided in one embodiment of the present application. Fig.52A plurality of capillary walls 906 are provided in the sealed space 903 between the first cover plate 901 and the second cover plate 902. The plurality of capillary walls 906 are distributed at intervals in the sealed space 903. The plurality of capillary walls 906 are supported between the first cover plate 901 and the second cover plate 902. In the evaporation zone, the plurality of micropillars 912 are distributed in the peripheral area of ​​the capillary walls 906. The capillary wall 906 can be a copper mesh structure. The capillary wall 906 has a capillary force. The capillary wall 906 is used to transport the refrigerant. In this solution, the capillary wall 906 is used as a structure supporting the first cover plate 901 and the second cover plate 902 in the evaporation zone. The capillary wall 906 also has the function of transmitting the refrigerant. This solution makes the refrigerant circulation performance in the temperature equalizing plate better.

[0230] Fig.53 A schematic diagram of a temperature homogenizing plate provided in one embodiment of the present application, see Fig.53 , Fig.53 The middle numbers 91, 92, 93, and 94 represent the evaporation zone 91, the first channel 93, the condensation zone 92, and the second channel 94 inside the temperature equalizing plate, respectively. The evaporation zone 91, the first channel 93 (which can be a gas channel), the condensation zone 92, and the second channel 94 (which can be a liquid channel) in the sealed space between the first cover plate 901 and the second cover plate 902 are sequentially connected to form an annular circulation channel. This solution provides a loop architecture inside the temperature equalizing plate, which can ensure the smoothness of the working medium transportation inside the temperature equalizing plate and promote the temperature equalization effect.

[0231] The temperature averaging plate 90 is provided with a strip hole 95, and in the thickness direction of the temperature averaging plate 90, the strip hole 95 passes through the first cover plate 901 and the second cover plate 902. Along the plane extending from the temperature averaging plate, one end of the strip hole 95 is located at the edge of the evaporation area 91, and the other end of the strip hole 95 is located at the edge of the condensation area 92. In this solution, the spacing between the first channel and the second channel is realized by setting the strip hole 95, and a loop structure is constructed.

[0232] Fig.54 for Fig.53 See the enlarged schematic diagram of the cross section at the AA position in Fig.53 and Fig.54 The inner walls 951 and 952 of the strip-shaped hole 95 constitute a partition wall between the first channel 93 and the second channel 94 .

[0233] Fig.55 A schematic diagram of the internal channel of a temperature homogenizing plate provided in one embodiment of the present application. Fig.55The temperature averaging plate 90 includes a length direction and a width direction. The evaporation zone 91 and the condensation zone 92 are respectively distributed at the top and bottom ends of the temperature averaging plate 90 in the length direction of the temperature averaging plate. The first channel 93 and the second channel 94 are arranged in the width direction. The first channel 93 includes an inlet end 931 and an outlet end 932. The inlet end 931 is connected to the evaporation zone 91, and the outlet end 932 is connected to the condensation zone 92. The first channel 93 includes an expansion zone 933, for example, Fig.55 The portion of the first channel 93 within the range of the middle dotted ellipse may be an expansion zone 933. The cross section of the expansion zone 933 is larger than the cross section of the inlet end 931, and the expansion zone 933 is located between the inlet end 931 and the outlet end 932. The caliber of the outlet end 932 is larger than the caliber of the inlet end 931. The first channel 93 at the location of the expansion zone 933 is wider, and the size of the expansion zone 933 in the width direction is larger than the size of the inlet end 931 in the width direction. Since the expansion zone 933 is wider than the inlet end 931, the steam pressure at the location of the expansion zone 933 is smaller, and the phase change temperature is lower, which can cause the gas to expand and the condensation temperature to decrease, providing favorable conditions for the steam to flow along the first channel 93 to the condensation zone 92.

[0234] In a possible implementation, in a direction extending from the inlet end 931 to the outlet end 932 , the expansion zone 933 has a gradually expanding trend in which a cross section gradually expands.

[0235] See also Fig.55 In one embodiment, the second channel 94 includes a tail end 941 and a wide area 942, the tail end 941 is located at a position where the second channel 94 and the evaporation zone 91 are connected, the wide area 942 and the tail end 941 are adjacent, and the cross-sectional area of ​​the tail end 941 is smaller than the cross-sectional area of ​​the wide area 942, so that a liquid seal is formed at the position where the tail end 941 is located to prevent the gas in the evaporation zone 91 from flowing back to the second channel 94.

[0236] Fig.56 A cross-sectional schematic diagram of a liquid channel of a temperature homogenizing plate provided in one embodiment of the present application. Fig.56, a first capillary layer 945 and a second capillary layer 946 are provided in the second channel 94, the first capillary layer 945 covers the inner surface of the first cover plate 901, the second capillary layer 946 covers the inner surface of the second cover plate 902, a support column 947 is provided in the second channel 94, one end of the support column 947 is fixedly connected to the inner surface of the second cover plate 902, and the other end abuts the first capillary layer 945, and at least part of the side surface 9471 of the support column 947 has a hydrophobic property. By providing the side surface 9471 of the support column 947 with a hydrophobic property in the second channel 94, the liquid is more easily separated from the side surface 9471 of the support column 947, and more easily enters the first capillary layer 945 and the second capillary layer 946, so as to smoothly complete the liquid return, so that the smoothness of the working medium transportation of the temperature equalizing plate is improved, and the temperature equalizing effect can be promoted.

[0237] In one embodiment, the total thickness of the first capillary layer 945 and the second capillary layer 946 accounts for more than 80% of the thickness of the second channel 94. Since the liquid channel is full of liquid working medium, the liquid working medium will be transmitted in the first capillary layer and the second capillary layer. Therefore, this solution constrains the total thickness of the first capillary layer and the second capillary layer to be more than 80% of the thickness of the liquid channel, which is conducive to the design of a thin size of the temperature equalization plate.

[0238] In one embodiment, a bionic convex structure is provided in the condensation zone of the temperature homogenizing plate, and the bionic convex structure can increase the condensation rate, so that the steam in the condensation zone condenses into liquid more quickly and enters the capillary layer.

[0239] The present application provides a design concept of a bionic protrusion structure, and the source of the bionic design concept is the protrusion structure on the surface of beetles in the desert and the needles of cacti. Specifically, the protrusion structure on the surface of beetles in the desert can promote condensation, and the needles of cacti can guide the flow of droplets. Based on this, the embodiment of the present application designs a bionic protrusion structure, which is arranged in the condensation area of ​​the heat spreader, which is conducive to the condensation and shedding of steam and can enhance the performance of the heat spreader.

[0240] Fig.57 A three-dimensional view, a top view, a front view and a left view of one of the bionic protrusion structures in the condensation area of ​​a temperature homogenizing plate provided in one embodiment of the present application. Fig.57The bionic protrusion structure 921 includes a bottom 9211, a top 9212, and a first inclined surface 9213 and a second inclined surface 9214 connected between the top 9212 and the bottom 9211. The bottom 9211 is connected to the inner surface of the shell of the temperature homogenizing plate, the projection of the top 9212 on the bottom 9211 is located at the asymmetric center of the bottom 9211, and the top 9212 is the highest position of the bionic protrusion structure 921 protruding relative to the inner surface of the shell. In this solution, the projection of the top 9212 on the bottom 9211 is located at the asymmetric center of the bottom 9211. The surface connecting the top 9212 and the bottom 9211 constitutes a slope, and the slopes on both sides of the top 9212 have different inclination angles. By forming slopes with different inclination angles, the gas can condense into water droplets on the bionic protrusion structure 921 and then flow quickly and enter the capillary structure. Therefore, this solution can increase the condensation rate through the bionic protrusion structure 921, so that the steam in the condensation zone condenses into liquid more quickly and enters the capillary layer.

[0241] The first inclined surface 9213 and the second inclined surface 9214 are both inclined relative to the thickness direction of the temperature equalizing plate, and the thickness direction of the temperature equalizing plate is the first direction. On the first cross section of the bionic protrusion structure 921, the angle between the extension direction of the first inclined surface 9213 and the first direction is the first angle B1, and the angle between the extension direction of the second inclined surface 9214 and the first direction is the second angle B2, the first angle B1 is greater than the second angle B2, and the first cross section is parallel to the first direction and passes through the top 9212. It can be understood that: the angle (first angle B1) at which the first inclined surface 9213 is inclined relative to the first direction is greater than the angle (first angle B2) at which the second inclined surface is inclined relative to the first direction. In one embodiment, the range of the first angle B1 is: 60°-80°, and the range of the second angle is: 10°-30°.

[0242] Fig.58 A schematic diagram of the distribution of bionic protrusion structures in the condensation zone of a temperature homogenizing plate provided in one embodiment of the present application. Fig.59 for Fig.58 The schematic diagram of the partial enlarged cross section of the bionic protrusion structure distribution scheme shown in FIG. Fig.58 and Fig.59The condensation area 92 includes a plurality of support columns 922 and a plurality of bionic protrusion structures 921, wherein the plurality of support columns 922 are spaced apart on the surface of the second cover plate 902, and the plurality of support columns 922 are abutted against the capillary structure 923 on the surface of the first cover plate 901, and the plurality of bionic protrusion structures 921 are distributed in the area between adjacent support columns 922 and are spaced apart from the capillary structure 923 on the surface of the first cover plate 901, a bottom 9211 of each bionic protrusion structure 921 is connected to the second cover plate 902, a top 9212 of each bionic protrusion structure 921 faces the capillary structure 923 on the first cover plate 901, and the direction of the vertical line between the first cover plate 901 and the second cover plate 902 is the first direction.

[0243] The first inclined surface 9213 and the second inclined surface 9214 are both inclined relative to the thickness direction of the temperature averaging plate, and the thickness direction of the temperature averaging plate is the first direction. On the first cross section of the bionic protrusion structure 921, the angle between the extension direction of the first inclined surface 9213 and the first direction is the first angle B1, and the angle between the extension direction of the second inclined surface 9214 and the first direction is the second angle B2, the first angle B1 is greater than the second angle B2, and the first cross section is parallel to the first direction and passes through the top 9212.

[0244] Fig.60 A schematic diagram of the distribution of bionic protrusion structures in the condensation zone of a temperature homogenizing plate provided in one embodiment of the present application. Fig.61 for Fig.60 The schematic diagram of the partial enlarged cross section of the bionic protrusion structure distribution scheme shown in FIG. Fig.60 and Fig.61 The condensation area 92 includes a plurality of bionic protrusion structures 921, which are spaced apart on the surface of the second cover plate 902, and abut against the capillary structure 923 on the inner surface of the first cover plate 901. Each of the bionic protrusion structures 921 and the bottom 9211 are connected to the second cover plate 902, and the top 9212 abuts against the capillary structure 923 on the inner surface of the first cover plate 901.

[0245] The working principle of the bionic protrusion structure 921 to increase the condensation rate is described as follows.

[0246] The surface of the bionic protrusion structure 921 (through the arrangement of the first inclined surface 9213 and the second inclined surface 9214) increases the contact area between the condensation wall and the steam, which is beneficial to the formation of condensed water. Fig.57On the first cross section of the bionic protrusion structure 921, the angle between the extension direction of the second inclined surface 9214 and the first direction is the second angle B2, and the second angle B2 is small, so that the second inclined surface 9214 is a steeper inclined surface. When the droplets are on the second inclined surface 9214, under the action of gravity, small and medium-sized droplets are easy to fall off directly. The second inclined surface 9214 can be an arc-shaped surface. The arc-shaped setting of the second inclined surface 9214 is conducive to increasing the surface area of ​​the bionic protrusion structure 921, and obtaining a larger surface area in contact with steam.

[0247] like Fig.57 As shown, on the first cross section of the bionic protrusion structure 921, the angle between the extension direction of the first slope 9213 and the first direction is the first angle B1, the first angle B1 is greater than the second angle B2, the first slope 9213 can be a gentler slope surface (the second slope 9214 is a steeper slope), the liquid can form liquid droplets with a smaller rolling angle on the first slope 9213, and the first slope 9213 is easy for large liquids to fall off.

[0248] At the intersection of the first inclined surface 9213 and the second inclined surface 9214, small droplets are easily formed at the top 9212 under the action of surface force, and the small droplets continue to merge with other droplets along the first inclined surface 9213. Since the droplet rolling angle on the first inclined surface 9213 is small, the merged droplets are easy to fall off, taking away many small droplets originally formed on the first inclined surface 9213, thereby accelerating the condensation of water. At the same time, due to the shedding of droplets, the top of the first inclined surface 9213 forms a surface force pulling force on the droplets on the second inclined surface 9214, thereby continuously causing the droplets to form and fall off.

[0249] In a specific implementation, the top surface of the bionic protrusion structure 921 is a hydrophobic surface, which can further enhance the water condensation rate.

[0250] Fig.62 The schematic diagram is a comparison of the condensation phenomenon (the part on the left of the dotted line) produced by the bionic protrusion structure 921 provided in an embodiment and the condensation phenomenon (the part on the right of the dotted line) produced by the ordinary surface. It can be clearly seen that the surface with the bionic protrusion structure 921 has a better condensation effect. The experimental results show that when the liquid is coated with a hydrophobic layer, Fig.57 The condensation speed of the bionic protrusion structure 921 is more than 10 times that of the liquid on the surface of the ordinary support column. Fig.57 The condensation speed of the surface of the bionic protrusion structure 921 is 3-5 times that of the surface of the liquid on the ordinary support column.

[0251] Embodiments of the present application Figures 43 to 61 The provided temperature chamber design can be applied in Fig.39 and Fig.40 In the heat sink structure shown. This solution sets the temperature averaging plate and the liquid cooling circulation channel on a heat sink structure, so that the heat sink structure can have two heat dissipation systems, namely the active liquid cooling heat dissipation system of the liquid cooling circulation channel and the heat dissipation system of the temperature averaging plate. The two heat dissipation systems can work together, or when the terminal device is low power, the active liquid cooling heat dissipation system is not started, and only the heat dissipation system of the temperature averaging plate is used. Therefore, this solution has better application flexibility and can achieve better heat dissipation performance.

[0252] The working principle of the heat dissipation module that sets the temperature averaging plate and liquid cooling circulation channel on a heat dissipation plate structure is: under low power consumption, the heat in the hot zone is mainly transferred by the evaporation and condensation of the liquid phase of the temperature averaging plate; under high power consumption, the pump is started under the control of the control chip, and the pump drives the liquid circulation in the active liquid cooling architecture to transfer liquid between the cooler pipe and the radiator pipe to achieve heat exchange. The efficient heat exchange capacity of the microchannel is used to move the heat in the hot zone to the cold zone farther away from the heat source for heat dissipation. The liquid cooling circulation system driven by the pump can transfer liquid to a farther cold zone, which can ensure the high efficiency of the system heat dissipation.

[0253] In other application scenarios, the embodiments of the present application Figures 43 to 61 The provided temperature evaporating plate can also be used alone in the terminal device, and the evaporation area of ​​the temperature evaporating plate can be directly attached to the heat source in the terminal device. Due to the hydrophobic surface design of the evaporation area of ​​the temperature evaporating plate, nucleation boiling can be easily achieved even when the heat source has a low heat output, which can ensure that the terminal device has better temperature uniformity.

[0254] In one embodiment of the present application, the condensation rate is increased by only setting a plurality of bionic protrusion structures in the condensation zone of the temperature equalizing plate, so that the steam in the condensation zone condenses into liquid more quickly and enters the capillary layer, without limiting whether the evaporation zone has a structure in which the hydrophobic surface and the hydrophilic surface are alternately distributed. In other words, in one embodiment of the present application, a structure in which a plurality of bionic protrusion structures are set in the condensation zone can adopt any design structure. The specific design method can be referred to Figure 57-Figure 61 The illustrated implementation manner will not be described in detail.

[0255] In one embodiment of the present application, a cooler is provided, the cooler includes a shell, the shell surrounds a plurality of fluid channels, the cooler includes a channel inlet and a channel outlet connected to the fluid channels, the channel inlet and the channel outlet can be respectively located on both sides of the fluid channel, the shell is used to be connected to a heat source via a thermal interface material, a plurality of spaced nucleation structures are provided in the fluid channel, the periphery of each nucleation structure is a hydrophilic structure, the nucleation structure is used to promote nucleation boiling of a cold medium, and the hydrophilic structure is used to transport the cold medium to the position of the nucleation structure.

[0256] The embodiment of the present application is to set up a structure in which a nucleation structure and a hydrophilic structure are alternately distributed in the cooler. The nucleation structure has a hydrophobic function, and the contact angle between the surface of the nucleation structure and the liquid is large, so that the contact area between the liquid and the hydrophobic surface is smaller, and it is easier to nucleate and boil under the influence of the heat source. The hydrophilic structure can continuously transport liquid to the nucleation structure. Therefore, the cooler provided by the present application can achieve nucleation boiling of the liquid in the cooler at a lower temperature, thereby improving the heat dissipation performance of the cooler.

[0257] In a possible implementation, the present application arranges the nucleation structure on the inner surface of the shell close to the heat source, so that the nucleation structure is closer to the heat source, making it easier for the liquid in the cooler to nucleate and boil under the influence of the nucleation structure.

[0258] It can be understood that in this embodiment, the structure in which the nucleation structure and the hydrophilic structure are alternately distributed in the evaporation zone of the temperature homogenizing plate provided in the above embodiment is applied in a cooler, and this cooler can be Figure 20-Figure 34 A cooler provided in any one of the embodiments.

[0259] The above are only some embodiments and implementation methods of the present application, and the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by any person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A terminal device, characterized in that: The invention comprises a shell and a heat dissipation component located inside the shell, wherein the internal space of the shell comprises a hot zone and a cold zone, the heat dissipation component comprises at least two heat exchangers, a pump and a connecting pipe, one of the at least two heat exchangers is located in the hot zone, and the other of the at least two heat exchangers is located in the cold zone, the connecting pipe is connected between the at least two heat exchangers to form a heat exchange circulation pipeline, and the pump is arranged in the heat exchange circulation pipeline to realize heat exchange between the hot zone and the cold zone.

2. The terminal device according to claim 1, characterized in that: The terminal device includes a mainboard, a heating device and a battery located inside the shell, the heating device is arranged on the mainboard, the terminal device includes a top end and a bottom end arranged oppositely, the battery includes a first end and a second end arranged oppositely, the first end is located at the edge of the battery facing the top end, and the second end is located at the edge of the battery facing the bottom end, the mainboard is located between the first end and the top end, and the heat exchanger located in the hot zone is thermally connected to the heating device.

3. The terminal device according to claim 2, characterized in that: At least part of the heat exchanger located in the cold zone is located between the second end and the bottom end; or, at least part of the heat exchanger located in the cold zone overlaps with part of the battery and is adjacent to the second end.

4. The terminal device according to claim 2 or 3, characterized in that: The terminal device includes a display screen, the housing includes a middle frame and a back shell, and the display screen and the back shell are distributed on opposite sides of the middle frame; The heat dissipation component is distributed between the middle frame and the display screen; or at least one of the at least two heat exchangers is located between the middle frame and the back shell.

5. The terminal device according to claim 1, characterized in that: The terminal device comprises a first body and a second body, and the first body and the second body can be folded or unfolded relative to each other; The heat dissipation component is located inside the first body; or, one of the at least two heat exchangers is located inside the first body, and at least one of the at least two heat exchangers is located inside the second body.

6. The terminal device according to any one of claims 1 to 5, characterized in that: One of the at least two heat exchangers is a cooler, and the other heat exchangers are radiators. The radiators include a first radiator and a second radiator. The pumps include a first pump and a second pump. The connecting pipes include a first connecting pipe and a second connecting pipe. The first pump is connected to the heat exchange circulation pipeline between the first radiator and the cooler through the first connecting pipe, and the second pump is connected to the heat exchange circulation pipeline between the second radiator and the cooler through the second connecting pipe.

7. The terminal device according to any one of claims 1 to 6, characterized in that: The heat exchanger comprises a plurality of fluid channels, channel inlets and channel outlets. The channel inlets and the channel outlets are used to connect the connecting pipes. The equivalent diameter of the fluid channels is in the range of 0.05 mm to 0.3 mm.

8. The terminal device according to claim 7, characterized in that: The multiple fluid channels extend along a second direction and are arranged in a row in sequence along the first direction. In the second direction, the channel inlet and the fluid channel at the head of the row are arranged opposite to each other, and the channel outlet and the fluid channel at the end of the row are arranged opposite to each other. The second direction is perpendicular to the first direction.

9. The terminal device according to claim 7 or 8, characterized in that: A guide structure extending along the first direction is provided between the channel inlet and the multiple fluid channels, the guide structure divides the space in the cooler into a first space and a second space, the multiple fluid channels are located in the second space, the channel inlet is connected to the first space, and along the first direction, the guide structure is provided with multiple through holes connecting the first space and the second space.

10. The terminal device according to claim 9, characterized in that: Along the first direction, the density of the through holes located at both ends of the flow guiding structure is less than the density of the through holes located in the middle area of ​​the flow guiding structure.

11. The terminal device according to claim 9 or 10, characterized in that: The guide structure includes a plurality of diverter plates and a plurality of spoiler structures, the plurality of diverter plates are arranged at intervals along the first direction, and the through holes are formed between adjacent diverter plates, the spoiler structure is protrudingly arranged at one end of the corresponding diverter plate, and the spoiler structure protrudes toward the first space or the second space.

12. The terminal device according to claim 9 or 10, characterized in that: The heat exchanger includes a plurality of barrier strips which are spaced apart from each other and extend along the second direction, wherein the fluid channel is formed between adjacent barrier strips, a portion of the fluid channel is a first channel, the barrier strips forming the first channel are a first barrier strip and a second barrier strip, one end of the first channel facing the flow guide structure is an inlet of the first channel, the inlet of the first channel and a middle area of ​​the flow guide structure are arranged relative to each other, and at the inlet position of the first channel, a distance between the first barrier strip and the flow guide structure in the second direction is smaller than a distance between the first barrier strip and the flow guide structure in the second direction.

13. The terminal device according to any one of claims 7 to 12, characterized in that: The first direction is the width direction of the fluid channel, the second direction is the length direction of the fluid channel, and the third direction is the height direction of the fluid channel. The first direction, the second direction and the third direction are perpendicular to each other, and the ratio of the height direction dimension to the width direction dimension of each fluid channel is 0.3-2.

14. The terminal device according to any one of claims 1 to 13, characterized in that: The connecting pipe is made of non-metallic material; or, the connecting pipe includes a metal pipe body and a heat insulation layer, and the heat insulation layer is coated on the periphery of the metal pipe body.

15. The terminal device according to any one of claims 1 to 14, characterized in that: The at least two heat exchangers and the connecting pipe are integrally formed in a heat sink structure, the heat sink structure includes a first interface and a second interface, the first interface and the second interface are connected to the connecting pipe, and the pump is connected between the first interface and the second interface.

16. The terminal device according to claim 15, characterized in that: The heat dissipation plate structure includes a first plate and a second plate. The flow channels in the at least two heat exchangers and the flow channels in the connecting pipe are integrally formed on the surface of the first plate. The first plate and the second plate are relatively connected as a whole, so that the flow channels in the at least two heat exchangers and the flow channels in the connecting pipe are formed between the first plate and the second plate.

17. The terminal device according to claim 15 or 16, characterized in that: The heat dissipation plate structure is surrounded to form a receiving space, and the receiving space is used to accommodate the pump.

18. The terminal device according to any one of claims 15 to 17, characterized in that: The heat dissipation plate structure includes a top edge and a bottom edge that are arranged opposite to each other, and a first side edge and a second side edge that are connected between the top edge and the bottom edge and are arranged opposite to each other. One of the at least two heat exchangers is a cooler, and the cooler is formed in a region of the heat dissipation plate structure adjacent to the top edge. At least one of the at least two heat exchangers is a radiator, and the radiator is formed in a region of the heat dissipation plate structure adjacent to the bottom edge. Some of the connecting pipes are first pipes, and the first pipes are adjacent to the first side edge and connected between the cooler and the radiator. Some of the connecting pipes are second pipes, and the second pipes are adjacent to the second side edge and connected between the cooler and the radiator.

19. The terminal device according to claim 18, characterized in that: The heat sink structure is provided with an isolation zone, part of which is located on a side of the first tube away from the first side edge, and part of which is located on a side of the second tube away from the second side edge.

20. The terminal device according to any one of claims 15 to 19, characterized in that: Part of the heat dissipation plate structure forms a temperature equalizing plate, and the heat exchange circulation pipeline composed of the at least two heat exchangers and the connecting pipes is arranged around the periphery of the temperature equalizing plate, one of the at least two heat exchangers is a cooler, and the other heat exchangers are radiators, the evaporation zone of the temperature equalizing plate is adjacent to the cooler, and the condensation zone of the temperature equalizing plate is located between the cooler and the radiator.

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