Display panel and display device

Abstract

The invention discloses a display panel, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display panel comprises a plurality of sub-pixels (10), each sub-pixel (10) comprises at least one first light-emitting device (11), the first substrate (100) comprises a first area (110), and the sub-pixels (10) are located in the first area (110); a device layer comprising a plurality of first light emitting devices (11); the light emitting device comprises a first light emitting device (11), a first driving unit (21) and a second driving unit (22), the first driving unit (21) is used for outputting driving current, and the second driving unit (22) is used for responding to the driving current output by the first driving unit (21), generating oscillation current, outputting the oscillation current to the first light emitting device (11) and controlling the first light emitting device (11) to be turned on or turned off repeatedly. The first light-emitting device (11) emits a light signal while displaying. The display panel can serve as a signal source to emit light signals while displaying.

Description

Display panel and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Visible light communication (VLC), also known as Li-Fi, offers higher bandwidth and efficiency than Wi-Fi. The spectrum bandwidth of visible light is 10,000 times greater than that of current electromagnetic waves. This allows Li-Fi to achieve very high bandwidth on a single data channel and accommodate multiple channels for parallel transmission, ensuring wireless transmission speeds are maintained even when multiple devices are connected simultaneously. However, VLC is currently not widely used.

[0003] The above information disclosed in this Background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art.

[0004] Summary of the Invention

[0005] The purpose of the present disclosure is to provide a display panel and a manufacturing method thereof, and a display device that integrates display and emission of light signals.

[0006] To achieve the above-mentioned purpose, the present invention adopts the following technical solutions:

[0007] According to a first aspect of the present disclosure, a display panel is provided, comprising a plurality of sub-pixels, each of the sub-pixels comprising at least one first light-emitting device; the display panel further comprising:

[0008] A first base substrate includes a first area, and the plurality of sub-pixels are located in the first area;

[0009] a device layer, provided on one side of the first base substrate, comprising a plurality of the first light-emitting devices;

[0010] A first driving unit and a second driving unit, wherein the second driving unit is connected to the first driving unit and the first light-emitting device, the first driving unit is used to output a driving current, and the second driving unit is used to generate an oscillating current in response to the driving current output by the first driving unit and output it to the first light-emitting device, thereby controlling the first light-emitting device to be repeatedly turned on or off, so that the first light-emitting device emits a light signal while displaying.

[0011] In an exemplary embodiment of the present disclosure, the frequency of the oscillating current generated by the second driving unit is not less than 10 5 Hz.

[0012] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0013] a first driving layer, provided on one side of the first base substrate, the first driving layer including the second driving unit, and the second driving unit being located in the first area;

[0014] The first light emitting device is located on a side of the first driving layer away from the first base substrate, and the first light emitting device is located in the first area;

[0015] There are multiple second driving units, and in a direction perpendicular to the first substrate, the first light-emitting devices and the second driving units are arranged in a one-to-one correspondence.

[0016] In an exemplary embodiment of the present disclosure, the first driving layer further includes a first driving unit, and the first driving unit is located in the first area;

[0017] There are multiple first driving units, and in a direction perpendicular to the first substrate, the first light-emitting devices and the first driving units are arranged in a one-to-one correspondence.

[0018] In an exemplary embodiment of the present disclosure, the display panel further includes a first driving chip, and the first driving unit is integrated into the first driving chip;

[0019] The first driving layer further includes a plurality of leads, and the first driving chip is connected to each of the first light-emitting devices and each of the second driving units through the leads.

[0020] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0021] A first driving layer is provided on one side of the first base substrate, and the first driving layer includes a plurality of leads;

[0022] a first driver chip and a second driver chip, wherein the first driver unit is integrated into the first driver chip, the second driver unit is integrated into the second driver chip, and the first driver chip and the second driver chip are connected to the first light-emitting devices through the leads;

[0023] The first light-emitting device is located on a side of the first driving layer away from the first base substrate, and the first light-emitting device is located in the first area.

[0024] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0025] A first driving layer is provided on one side of the first base substrate, and the first driving layer includes a plurality of leads;

[0026] a third driver chip, wherein the first driver unit and the second driver unit are integrated into the third driver chip, and the third driver chip is connected to each of the first light-emitting devices through the leads;

[0027] The first light-emitting device is located on a side of the first driving layer away from the first base substrate, and the first light-emitting device is located in the first area.

[0028] In an exemplary embodiment of the present disclosure, a single sub-pixel further includes a second light-emitting device, and the device layer further includes the second light-emitting device;

[0029] The display panel further includes:

[0030] a third driving unit connected to the second light emitting device, the third driving unit being configured to output a driving current to the second light emitting device;

[0031] A control unit is connected to the first driving unit and the third driving unit, and is used to control the first light-emitting device to emit a light signal within one frame time displayed by the second light-emitting device.

[0032] In an exemplary embodiment of the present disclosure, within one frame time displayed by the second light emitting device, the number of switching times of the first light emitting device is not less than 10. 6 .

[0033] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0034] a first driving layer, provided on one side of the first base substrate, the first driving layer including the third driving unit, and the third driving unit being located in the first area;

[0035] The second light emitting device is located on a side of the first driving layer away from the first base substrate, and the second light emitting device is located in the first area;

[0036] There are multiple third driving units, and in a direction perpendicular to the first substrate, the second light emitting devices and the third driving units are arranged in a one-to-one correspondence.

[0037] In an exemplary embodiment of the present disclosure, the display panel further includes a plurality of photoelectric converters for receiving optical signals transmitted from the outside and converting the optical signals into electrical signals for output.

[0038] In an exemplary embodiment of the present disclosure, the display panel further includes a signal shielding layer, the signal shielding layer having a plurality of openings, and the plurality of photoelectric converters are disposed in each of the openings in a one-to-one correspondence;

[0039] Wherein, the thickness of the signal shielding layer is not less than the height of the photoelectric converter.

[0040] In an exemplary embodiment of the present disclosure, the display panel further includes a covering layer, wherein the covering layer is provided on one side of the light receiving surface of the photoelectric converter;

[0041] The cover layer includes a first cover layer and a second cover layer stacked in sequence in a direction away from the photoelectric converter, wherein the refractive index of the first cover layer is smaller than the refractive index of the second cover layer;

[0042] A surface of the cover layer away from the photoelectric converter has a plurality of arc-shaped grooves, and the arc-shaped grooves are arranged in a one-to-one correspondence with the photoelectric converters.

[0043] In an exemplary embodiment of the present disclosure, the display panel further includes a plurality of photoelectric converters, and the photoelectric converters are located in the first area;

[0044] wherein the plurality of photoelectric converters are dispersed in the plurality of sub-pixels; or

[0045] The first region includes a first sub-region and a second sub-region located outside the first sub-region, the plurality of sub-pixels are located in the first sub-region, and the photoelectric converter is located in the second sub-region.

[0046] In an exemplary embodiment of the present disclosure, when the first region includes a first sub-region and a second sub-region located outside the first sub-region, and the photoelectric converter is located in the second sub-region, the display panel further includes:

[0047] The barrier dam is provided on one side of the first base substrate and surrounds the periphery of the first sub-region. The barrier dam is located between the first sub-region and the second sub-region.

[0048] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0049] A cover plate is provided on a side of the first light emitting device and the photoelectric conversion device away from the first base substrate.

[0050] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0051] an encapsulation layer, provided on a side of the first light-emitting device and the photoelectric conversion device away from the first substrate, wherein the orthographic projections of the first light-emitting device and the photoelectric conversion device on the first substrate are located within the orthographic projection of the encapsulation layer on the first substrate;

[0052] The encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer stacked in sequence in a direction away from the first substrate.

[0053] In an exemplary embodiment of the present disclosure, when the first region includes a first sub-region and a second sub-region located outside the first sub-region, and the photoelectric converter is located in the second sub-region, the display panel further includes:

[0054] a second driving backplane, provided on one side of the first substrate and located in the second sub-area, the second driving backplane comprising a second substrate and a fourth driving unit provided on one side of the second substrate, the fourth driving unit being configured to provide a driving signal to the photoelectric converter, the photoelectric converter being provided on a side of the fourth driving unit away from the second substrate;

[0055] Wherein, the first base substrate is a glass substrate, and the second base substrate is a single crystal silicon substrate.

[0056] According to a second aspect of the present disclosure, a method for manufacturing a display panel is provided, comprising:

[0057] Providing a first substrate, comprising a first region and a second region located outside the first region;

[0058] forming a first drive unit and a second drive unit;

[0059] forming a device layer, the device layer being provided on one side of the first base substrate and comprising a plurality of first light-emitting devices, the first light-emitting devices being located in the first area;

[0060] Among them, the second driving unit is connected to the first driving unit and the first light-emitting device, the first driving unit is used to output a driving current, and the second driving unit is used to generate an oscillating current in response to the driving current output by the first driving unit and output it to the first light-emitting device, controlling the first light-emitting device to be repeatedly turned on or off, so that the first light-emitting device emits a light signal while displaying.

[0061] In an exemplary embodiment of the present disclosure, the method for manufacturing a display panel further includes:

[0062] A photoelectric converter is formed, wherein the photoelectric converter is located in the first region.

[0063] According to a third aspect of the present disclosure, a display device is provided, comprising the display panel as described in the first aspect.

[0064] The display panel disclosed herein comprises a single sub-pixel comprising at least one first light-emitting device. A second driving unit is connected to the first driving unit and the first light-emitting device. The first driving unit is configured to output a driving current, and the second driving unit is configured to generate an oscillating current in response to the driving current output by the first driving unit and output the current to the first light-emitting device, thereby controlling the first light-emitting device to repeatedly turn on and off, thereby causing the first light-emitting device to emit a light signal while displaying. This display panel integrates display and signal transmission, allowing it to not only display images but also function as a signal source to emit light signals and communicate using light signals. Its diverse functionality can meet diverse application needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] The above and other features and advantages of the present disclosure will become more apparent by describing in detail example embodiments thereof with reference to the accompanying drawings.

[0066] FIG1 is a schematic diagram of the optical communication principle in the related art;

[0067] FIG2 is a schematic plan view of a first substrate in an exemplary embodiment of the present disclosure;

[0068] FIG3 is a schematic diagram of a planar distribution of sub-pixels and driving units of a display panel in an exemplary embodiment of the present disclosure;

[0069] FIG4 is a schematic diagram of a planar distribution of sub-pixels and driving units of a display panel in another exemplary embodiment of the present disclosure;

[0070] FIG5 is a schematic diagram of a planar distribution of sub-pixels and driving units of a display panel in another exemplary embodiment of the present disclosure;

[0071] FIG6 is a schematic diagram of a planar distribution of sub-pixels and driving units of a display panel in another exemplary embodiment of the present disclosure;

[0072] FIG7 is a schematic diagram of a planar distribution of sub-pixels and driving units of a display panel in another exemplary embodiment of the present disclosure;

[0073] FIG8 is a schematic diagram of a planar distribution of sub-pixels and photoelectric converters in another exemplary embodiment of the present disclosure;

[0074] FIG9 is a schematic diagram showing the cross-sectional distribution of sub-pixels and photoelectric converters in a display panel according to an exemplary embodiment of the present disclosure;

[0075] FIG10 is a schematic diagram of a display panel cover package in an exemplary embodiment of the present disclosure;

[0076] FIG11 is a schematic diagram of a display panel thin film package in an exemplary embodiment of the present disclosure;

[0077] FIG12 is a schematic diagram of a cross-sectional distribution of sub-pixels in a display panel in an exemplary embodiment of the present disclosure;

[0078] FIG13 is a schematic diagram showing a cross-sectional distribution of photoelectric converters in a display panel according to an exemplary embodiment of the present disclosure;

[0079] FIG14 is a schematic cross-sectional view of a display panel in another exemplary embodiment of the present disclosure;

[0080] FIG15 is a schematic diagram of the structure around the photoelectric converter in an exemplary embodiment of the present disclosure;

[0081] FIG16 is a schematic diagram of the structure of the first light emitting device connected to the first driving backplane in an exemplary embodiment of the present disclosure;

[0082] FIG17 is a schematic diagram of the structure of the photoelectric converter connected to the first driving backplane in an exemplary embodiment of the present disclosure;

[0083] FIG18 is a schematic structural diagram of a first light emitting device connected to a first driving backplane in another exemplary embodiment of the present disclosure;

[0084] FIG. 19 is a schematic diagram of a structure in which a photoelectric converter is connected to a second driving backplane in an exemplary embodiment of the present disclosure.

[0085] The main elements in the figure are denoted as follows: 100 - first substrate; 110 - first region; 111 - first sub-region; 112 - second sub-region; 120 - Second region; 200-first driving layer; 201-first lead; 202-second lead; 203-third lead; 204-fourth lead; 205-active layer; 206-first gate insulating layer; 207-first gate metal layer; 208-second gate insulating layer; 209-second gate metal layer; 210-interlayer dielectric layer; 211-source / drain metal layer; 212-first planarization layer; 213-transfer layer; 214-second planarization layer; 300-cover plate; 301-blocking dam; 302-first blocking dam; 303-second blocking dam; 304-support structure; 400-encapsulation layer; 500-second substrate; 501-n-well; 502-p-well; 503-first doped region; 504-second doped region Miscellaneous region; 505-gate insulating layer; 506-gate layer; 507-first planarization layer; 508-source / drain layer; 509-second planarization layer; 510-transfer layer; 511-third planarization layer; 10-sub-pixel; 11-first light-emitting device; 12-second light-emitting device; 21-first driving unit; 22-second driving unit; 23-third driving unit; 24-fourth driving unit; 30-first driving chip; 31-second driving chip; 32-third driving chip; 33-fourth driving chip; 34-first peripheral control chip; 35-second peripheral control chip; 40-photoelectric converter; 41-signal shielding layer; 42-covering layer; 43-first covering layer; 44-second covering layer; 45-arc-shaped groove. DETAILED DESCRIPTION

[0086] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of the embodiments of the present disclosure.

[0087] In the drawings, the thickness of regions and layers may be exaggerated for clarity. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

[0088] The described features, structures or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure can be practiced without one or more of the specific details, or other methods, components, materials, etc. can be adopted. In other cases, well-known structures, materials or operations are not shown or described in detail to avoid obscuring the main technical ideas of the present disclosure.

[0089] When a structure is “on” another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is “directly” disposed on the other structure, or that the structure is “indirectly” disposed on the other structure via another structure.

[0090] The terms "a," "an," and "the" are used to indicate the presence of one or more elements / components; the terms "including" and "having" are used to indicate an open-ended inclusiveness and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc. The terms "first," "second," etc. are used merely as labels and do not limit the quantity of the items to which they refer.

[0091] Visible light wireless communication is a technology that uses light sources to transmit data wirelessly. This technology uses a light-emitting device to flash millions of times per second, with on representing a 1 and off representing a 0. Because the flashing frequency is too high for the human eye to detect, only a photoelectric converter can detect these changes. This creates a communication mechanism where a light-emitting device sends signals and a photosensitive sensor receives them. Figure 1 shows the schematic diagram of visible light wireless communication. The data signal from the transmitter passes through a modulator and is transmitted to a light-emitting device, such as an LED. The light-emitting device converts the received data signal (electrical signal) into an optical signal and then transmits it. An optical receiver, such as an APD (avalanche diode), receives the optical signal and converts it into an electrical signal, which is then transmitted to the receiver via a modulator and other devices.

[0092] In the related art, a light-emitting device can be used as a transmitter of wireless communication to emit light data, and a photoelectric converter can be used as a receiver to receive the data. However, the transmitter has a single function.

[0093] As shown in Figures 2 and 3, the present disclosure provides a display panel comprising a plurality of sub-pixels 10, wherein each sub-pixel 10 comprises at least one first light-emitting device 11. The display panel further comprises a first base substrate 100, a device layer, a first driving unit 21, and a second driving unit 22, wherein the first base substrate 100 comprises a first region 110 and a second region 120 located outside the first region 110, and the plurality of sub-pixels 10 are located in the first region 110; the device layer is disposed on one side of the first base substrate 100 and comprises a plurality of first light-emitting devices 11. The second driving unit 22 connects the first driving unit 21 and the first light-emitting device 11, wherein the first driving unit 21 is configured to output a driving current, and the second driving unit 22 is configured to generate an oscillating current in response to the driving current output by the first driving unit 21 and output the oscillating current to the first light-emitting device 11, thereby controlling the first light-emitting device 11 to repeatedly turn on or off, so that the first light-emitting device 11 emits a light signal while displaying.

[0094] The display panel provided by the present disclosure includes a single sub-pixel 10 comprising at least one first light-emitting device 11. A second driving unit 22 is connected to the first driving unit 21 and the first light-emitting device 11. The first driving unit 21 is configured to output a driving current, and the second driving unit 22 is configured to generate an oscillating current in response to the driving current output by the first driving unit 21 and output the current to the first light-emitting device 11, thereby controlling the first light-emitting device 11 to repeatedly turn on and off, so that the first light-emitting device 11 emits a light signal while displaying. This display panel integrates display and signal transmission, and can be used not only to display images but also to emit light signals as a signal source, using light signals for communication. It has diverse functions and can meet diverse application needs.

[0095] The components of the display panel provided by the present disclosure will be described in detail below with reference to the accompanying drawings and specific embodiments:

[0096] As shown in Figures 2 and 3, the display panel provided by the present disclosure includes multiple sub-pixels 10, a first drive unit 21, and a second drive unit 22. Multiple sub-pixels 10 can be arranged in an array. Each sub-pixel 10 includes at least one first light-emitting device 11. The first light-emitting device 11 can be an OLED, micro LED, mini LED, etc. Preferably, the first light-emitting device 11 is a micro LED.

[0097] The second driving unit 22 is connected to the first driving unit 21 and the first light-emitting device 11, and the first driving unit 21 is used to output a driving current. The second driving unit 22 is used to generate an oscillating current in response to the driving current output by the first driving unit 21 and output it to the first light-emitting device 11, controlling the first light-emitting device 11 to repeatedly turn on or off, so that the first light-emitting device 11 emits a light signal while displaying. Specifically, the driving current output by the first driving unit 21 is used to control the lighting and grayscale of the first light-emitting device 11 so that the first light-emitting device 11 completes the display. When the first driving unit 21 delivers a driving current to light up the first light-emitting device 11, the second driving unit 22 is activated and generates an oscillating current under the driving current. The frequency of the oscillating current is very high, which can enable the first light-emitting device 11 to turn on (light up) and turn off quickly, but it is not noticeable to the human eye, and it is still a normal display screen visually. Under the normal display screen, the first light-emitting device 11 emits a visible light signal that flickers under the action of the oscillating current. This visible light signal that flickers can transmit data information and realize visible light communication.

[0098] The second driving unit 22 may be an oscillating circuit, which generates an oscillating current with a frequency not less than 10 5 Hz. The second driving unit 22 can be used to control the switching frequency of the first light emitting device 11. The switching frequency of the first light emitting device 11 controlled by the second driving unit 22 can be no less than 10 5 Hz. In some embodiments of the present disclosure, the second driving unit 22 includes components such as a coil, a resistor, and a capacitor, and may also include a transistor. The transistor may be a thin film transistor (TFT) or a metal oxide semiconductor field effect transistor (MOS). Generally, different types of transistors may be used to enable the first light emitting device 11 to achieve different switching frequencies. For example, using a thin film transistor, the switching frequency of the first light emitting device 11 may reach 10 6 ~10 8 Hz, which is a high frequency and helps to achieve a higher signal transmission rate.

[0099] As shown in Figures 3 to 8, the first drive unit 21 and the second drive unit 22 can be arranged at different positions of the display panel in different ways. The following will describe in detail the arrangement of the first drive unit 21 and the second drive unit 22 in conjunction with the film structure of the display panel.

[0100] In the present disclosure, the first driving unit 21 and the second driving unit 22 may be distributed in the first area 110 , or may be connected to the display panel by being integrated into a chip, or may be distributed in the second area 120 .

[0101] As shown in Figures 3, 4, 16, and 18, in some embodiments of the present disclosure, the second driving unit 22 is located in the first area 110. Specifically, the display panel also includes a first driving layer 200, which is provided on one side of the first base substrate 100. The first driving layer 200 and the first base substrate 100 can be combined to form a first driving backplane. The first driving layer 200 includes a second driving unit 22, and the second driving unit 22 is located in the first area 110. The first light-emitting device 11 is located on the side of the first driving layer 200 away from the first base substrate 100; the number of the second driving units 22 is multiple, and in a direction perpendicular to the first base substrate 100, the first light-emitting device 11 and the second driving unit 22 are arranged in a one-to-one correspondence. That is, each first light-emitting device 11 is connected to a corresponding second driving unit 22, and the second driving unit 22 provides an oscillating current to the first light-emitting device 11 in a one-to-one correspondence.

[0102] The first driving unit 21 is used to control the lighting and grayscale of the first light emitting device 11. In this type of embodiment, the first light emitting device 11 can be driven by passive, active or semi-active means for display.

[0103] Specifically, in one embodiment, as shown in FIG4 , the first light-emitting device 11 can be driven actively or semi-actively. In this embodiment, the first driving layer 200 further includes a first driving unit 21 located in the first region 110 . There are multiple first driving units 21 , and the first light-emitting devices 11 and the first driving units 21 are arranged in a one-to-one correspondence in a direction perpendicular to the first base substrate 100 .

[0104] The first driving unit 21 includes elements such as transistors and capacitors. Optionally, the transistors may be thin film transistors (TFTs) or metal oxide semiconductor field effect transistors (MOSs).

[0105] Taking the transistors included in the first drive unit 21 and the second drive unit 22 as thin film transistors as an example, in terms of the film layer structure, the thin film transistor can be a top-gate thin film transistor or a bottom-gate thin film transistor, and the present disclosure does not limit this. In terms of the thin film transistor material, the thin film transistor can be an amorphous silicon thin film transistor, a low-temperature polycrystalline silicon thin film transistor or an oxide thin film transistor, and the present disclosure does not limit this. In terms of the conduction condition of the thin film transistor, the thin film transistor can be an N-type thin film transistor or a P-type thin film transistor, and the present disclosure does not limit this. In the first drive layer 200, each thin film transistor and storage capacitor can be formed by film layers such as an active layer, a gate insulating layer, a gate metal layer, an interlayer dielectric layer, and a source-drain metal layer. Among them, the thin film transistor may include a semiconductor layer located in the active layer, a gate insulating layer, a gate located in the gate metal layer, an interlayer dielectric layer, and a source-drain electrode layer located in the source-drain metal layer, and the source-drain electrode layer is composed of the source and drain of the thin film transistor. The semiconductor layer includes a channel region and a source contact region and a drain contact region on both sides of the channel region. The source electrode passes through the interlayer dielectric layer to connect to the source contact region, the drain electrode passes through the interlayer dielectric layer to connect to the drain contact region, and the gate and the channel region are isolated by a gate insulating layer. Among them, the positional relationship of each film layer can be determined according to the film layer structure of the thin film transistor. For example, the first drive layer 200 may include an active layer, a gate insulating layer, a gate metal layer, an interlayer dielectric layer and a source-drain metal layer stacked in sequence, and the thin film transistor formed in this way is a top-gate thin film transistor. For another example, the first drive layer 200 may include a gate metal layer, a gate insulating layer, an active layer, an interlayer dielectric layer and a source-drain metal layer stacked in sequence, and the thin film transistor formed in this way is a bottom-gate thin film transistor.

[0106] As shown in FIG18 , the first drive layer 200 may also employ a dual-gate structure, i.e., the gate metal layer may include a first gate metal layer 207 and a second gate metal layer 209, and the gate insulation layer may include a first gate insulation layer 206 for isolating the active layer 205 from the first gate metal layer 207, and a second gate insulation layer 208 for isolating the first gate metal layer 207 from the second gate metal layer 209. For example, the first drive layer 200 may include an active layer 205, a first gate insulation layer 206, a first gate metal layer 207, a second gate insulation layer 208, a second gate metal layer 209, an interlayer dielectric layer 210, and a source / drain metal layer 211, stacked sequentially on one side of the first base substrate 100. Furthermore, the first drive layer 200 may also include a first planarization layer 212, a transfer layer 213, and a second planarization layer 214, stacked sequentially away from the first base substrate 100. The first light-emitting device 11 may be connected to the source / drain metal layer 211 via the transfer layer 213.

[0107] As shown in Figure 3 , in another embodiment, the first light-emitting device 11 can be passively driven. In this embodiment, the display panel also includes a first driver chip 30, with the first driver unit 21 integrated into the first driver chip 30. As shown in Figure 16 , in this embodiment, the first driver layer 200 includes, in addition to the second driver unit 22, a plurality of leads, through which the first driver chip 30 is connected to each first light-emitting device 11 and each second driver unit 22. For example, the first driver layer 200 also includes a lead layer, which can be located on the side of the second driver unit 22 away from the first base substrate 100. The lead layer may include a first lead 201 and a second lead 202. The first lead 201 may be connected to the first electrode of the first light-emitting device 11, and the second lead 202 may be connected to the second electrode of the first light-emitting device 11. Furthermore, the second drive unit 22 may be connected to the first light-emitting device 11 via the first lead 201 or the second lead 202. The first driver chip 30 may be connected to the first light-emitting device 11 via the first lead 201 or the second lead 202, or connected to the second drive unit 22 via the first lead 201 or the second lead 202. The specific connection method can be set according to actual needs and is not specifically limited here. In addition, the first drive layer 200 may also include multiple lead layers, with adjacent lead layers separated by an insulating layer. Multiple leads may be distributed on different lead layers. For example, if the first drive layer 200 also includes a first lead layer, an insulating layer, and a second lead layer stacked in sequence in a direction away from the first base substrate, the first lead layer may be located on the side of the second drive unit 22 away from the first base substrate 100. The first lead layer includes a plurality of first leads 201, and the second lead layer includes a plurality of second leads 202. Similarly, the first lead 201 can be connected to the first electrode of the first light-emitting device 11, and the second lead 202 can be connected to the second electrode of the first light-emitting device 11. The second driving unit 22 can be connected to the first light-emitting device 11 via the first lead 201 or the second lead 202. The first driving chip 30 can be connected to the first light-emitting device 11 via the first lead 201 or the second lead 202, or connected to the second driving unit 22 via the first lead 201 or the second lead 202. The specific connection method can be set according to actual needs and is not specifically limited here.

[0108] The first driver chip 30 may be located outside the first base substrate 100 and connected to the first base substrate 100 via a connection structure. The first driver chip 30 is also disposed on the first base substrate 100 , such as the first driver chip 30 is located in the second region 120 .

[0109] As shown in Figures 5 to 8, in some other embodiments of the present disclosure, the second driving unit 22 is not located in the first area 110. In such embodiments, the first driving unit 21 may also not be located in the first area 110, that is, the first light emitting device 11 is passively driven.

[0110] As shown in Figures 5 and 16, in one embodiment, a display panel includes a first driver layer 200, a first driver chip 30, and a second driver chip 31. The first driver layer 200 is disposed on one side of the first base substrate 100 and includes a plurality of leads. The first driver unit 21 is integrated into the first driver chip 30, and the second driver unit 22 is integrated into the second driver chip 31. The first driver chip 30 and the second driver chip 31 are connected to each first light-emitting device 11 via leads. For example, in this embodiment, the first driver layer 200 includes a lead layer, which may include a first lead 201 and a second lead 202. The first lead 201 may be connected to the first electrode of the first light-emitting device 11, and the second lead 202 may be connected to the second electrode of the first light-emitting device 11. Furthermore, the second driver chip 31 may be connected to the first light-emitting device 11 via the first lead 201 or the second lead 202, and the first driver chip 30 may be connected to the first light-emitting device 11 via the first lead 201 or the second lead 202. Of course, the first driving layer 200 may also include multiple lead layers, with an insulating layer provided between two adjacent lead layers. Connection vias may be provided in the insulating layer to interconnect some leads in different lead layers.

[0111] As shown in Figures 6 and 16, in another embodiment, the display panel includes a first driver layer 200 and a third driver chip 32. The first driver layer 200 is disposed on one side of the first base substrate 100 and includes multiple leads. The first driver unit 21 and the second driver unit 22 are integrated into the third driver chip 32, which is connected to each first light-emitting device 11 via leads. For example, in this embodiment, the first driver layer 200 includes a lead layer, which may include a first lead 201 and a second lead 202. The first lead 201 may be connected to the first electrode of the first light-emitting device 11, and the second lead 202 may be connected to the second electrode of the first light-emitting device 11. Furthermore, the driver chip may be connected to the first light-emitting device 11 via the first lead 201 or the second lead 202. Of course, the first driver layer 200 may also include multiple lead layers, with an insulating layer disposed between adjacent lead layers. Connecting vias may be provided in the insulating layer to interconnect some leads in different lead layers.

[0112] As shown in Figures 2 and 7, in some other embodiments of the present disclosure, a single sub-pixel 10 may include a second light-emitting device 12 in addition to the first light-emitting device 11. The device layer includes the second light-emitting device 12. The second light-emitting device 12 can be an OLED, a micro LED, a mini LED, etc. In this type of embodiment, the display panel also includes a third driving unit 22 and a control unit 20. The third driving unit 22 is connected to the second light-emitting device 12, and the third driving unit 22 is used to output a driving current to the second light-emitting device 12. The control unit 20 is connected to the first driving unit 21 and the third driving unit 22, and is used to control the first light-emitting device 11 to emit a light signal within one frame time displayed by the second light-emitting device 12.

[0113] The driving current output by the third driving unit 22 is used to control the lighting and grayscale of the second light-emitting device 12, thereby enabling the second light-emitting device 12 to display. In this type of embodiment, the second light-emitting device 12 can be driven either actively or passively. Preferably, the second light-emitting device 12 is driven actively to ensure the stability of the display panel. Taking the example of the second light-emitting device 12 being driven actively, the first driving layer 200 also includes a third driving unit 22, which is located in the first region 110. There are multiple third driving units 22, and each of the second light-emitting devices 12 and the third driving unit 22 is arranged in a one-to-one correspondence perpendicular to the first substrate 100. The third driving unit 22 includes components such as transistors and capacitors. Optionally, the transistor can be a thin-film transistor (TFT) or a metal oxide semiconductor field-effect transistor (MOS). For example, the third driving unit 22 can be a TFT compensation circuit, such as an 8T2C pixel circuit. In 8T2C, T represents a thin-film transistor, C represents a capacitor, and 8 and 2 represent the number of thin-film transistors and capacitors, respectively.

[0114] In this embodiment, the control unit 20 is connected to the first driving unit 21 and the third driving unit 22, and is used to control the first light emitting device 11 to emit a light signal within a frame time displayed by the second light emitting device 12. Specifically, the first light emitting device 11 can be controlled to repeatedly switch on and off to emit a light signal within a frame time displayed by the second light emitting device 12. For example, within a frame time displayed by the second light emitting device 12, the number of times the first light emitting device 11 switches on and off is not less than 10. 6 Under normal circumstances, the frequency of the display signal of the second light emitting device 12 can be 60-120HZ, and the first light emitting device 11 can flash 10 8 Furthermore, in the same sub-pixel, when the first light emitting device 11 emits a light signal, its brightness is the same as that of the second light emitting device 12. Preferably, the control unit 20 can also control the first light emitting device 11 and the second light emitting device 12 to display synchronously.

[0115] The combination of the first light-emitting device 11 and the second light-emitting device 12 helps ensure stable display on the display panel while emitting optical signals for communication. Taking the example of a passively driven first light-emitting device 11 and an actively driven second light-emitting device 12, in this embodiment, the third drive unit 22 is located in the first area 110, and the first and second drive units 21 and 22 are integrated into a third drive chip 32. Furthermore, the display panel also includes a first peripheral control chip 34 and a second peripheral control chip 35. The first peripheral control chip 34 is connected to the third drive unit 22 and is used to transmit display signals to the second light-emitting device 12. The control unit 20 is integrated into the second peripheral control chip 35. The second peripheral control chip 35 is connected to the first peripheral control chip 34 and the third drive chip 32 to control the first light-emitting device 11 to emit optical signals within a frame displayed by the second light-emitting device 12 via the first peripheral control chip 34 and the third drive chip 32.

[0116] It should be noted that both the first light-emitting device 11 and the second light-emitting device 12 can be driven either actively or passively. For example, both can be driven either actively or passively, or one can be driven actively while the other can be driven passively. The control unit 20, the first drive unit 21, and the third drive unit 22, as well as their positional distribution, can vary depending on the driving method of the first light-emitting device 11 and the second light-emitting device 12, as long as the control unit 20 can control the first light-emitting device 11 to emit a light signal within one frame displayed by the second light-emitting device 12.

[0117] In the present disclosure, the display panel not only integrates display and emission of light signals, but also has other functions.

[0118] As shown in Figures 1, 8, and 9 to 14, in some embodiments of the present disclosure, the display panel further includes a plurality of photoelectric converters 40 for receiving optical signals transmitted from the outside and converting the optical signals into electrical signals for output. In such embodiments, the display panel can serve not only as a transmitting end in optical communication for transmitting optical signals, but also as a receiving end in optical communication for receiving optical signals. The photoelectric converter 40 may include a first electrode, a first semiconductor layer, a photoelectric conversion layer, a second semiconductor layer, and a second electrode.

[0119] The photoelectric converter 40 may be a PIN diode. The first electrode may be a P-electrode, and the second electrode may be an N-electrode accordingly. The first semiconductor layer may be a P-type semiconductor layer, and the second semiconductor layer may be an N-type semiconductor layer accordingly. The photoelectric conversion layer may be an I (Intrinsic) semiconductor layer. When the I semiconductor layer (photoelectric conversion layer) of the PIN diode receives light of a corresponding wavelength, it generates a photocurrent. The PIN diode has a high responsiveness and a fast response speed, a wide frequency band, a low operating voltage, a simple bias circuit, and can withstand a high reverse voltage under reverse bias, so the linear output range is wide. However, its disadvantage is that the I semiconductor layer (photoelectric conversion layer) has a large resistance, and the output current of the diode is small, generally ranging from a few tenths of a microampere to several microamperes. Therefore, in the present disclosure, the PIN photodiode can be connected to a transimpedance amplifier. After the PIN diode converts the optical signal into a current signal, the transimpedance amplifier converts the current signal into a voltage signal and amplifies it to the required amplitude, which helps to improve the signal-to-noise ratio and reduce the bit error rate.

[0120] The photoelectric converter 40 can also be an APD diode, that is, an avalanche diode. Compared with a PIN diode, an APD diode has an additional avalanche layer. The avalanche layer is arranged between the photoelectric conversion layer and the second semiconductor layer. Under the action of the electric field, the avalanche layer undergoes avalanche breakdown, the carrier energy increases, and it constantly collides with the crystal atoms, causing the electrons in the covalent bonds to be excited to form free electron-hole pairs. The newly generated carriers generate free electron-hole pairs through collisions. This is the multiplication effect. Under the action of the multiplication effect, the carriers 1 generate 2, 2 generate 4, and increase like an avalanche. The APD diode utilizes the avalanche multiplication effect of carriers to amplify the photoelectric signal to improve the detection sensitivity. Compared with the PIN diode, the APD diode has an additional avalanche layer, and the photogenerated current will be amplified by this area. Therefore, the ADP photodiode has the advantages of high power and high efficiency.

[0121] As shown in FIG14 , the display panel further includes a signal shielding layer 41 having multiple openings, with multiple photoelectric converters 40 disposed in corresponding positions within each opening. The thickness of the signal shielding layer 41 is no less than the height of the photoelectric converters 40. The signal shielding layer 41 is used to prevent ambient stray light from entering the photoelectric converters 40 and interfering with their reception of optical signals. The signal shielding layer 41 can be made of black resin or a reflective material.

[0122] The display panel also includes a cover layer 42, which is disposed on one side of the light-receiving surface of the photoelectric converter 40. The cover layer 42 includes a first cover layer 43 and a second cover layer 44, which are stacked in sequence in a direction away from the photoelectric converter 40. The refractive index of the first cover layer 43 is less than the refractive index of the second cover layer 44. The surface of the cover layer 42 away from the photoelectric converter 40 has a plurality of arc-shaped grooves 45, which are arranged in a one-to-one correspondence with the photoelectric converter 40. The cover layer 42 helps prevent side light from entering the photoelectric converter 40 and interfering with the photoelectric converter 40, while the arc-shaped grooves 45 on the top help better receive external light signals and evenly diffuse them across the entire light-receiving surface of the photoelectric converter 40.

[0123] As shown in Figures 2 and 8, in some embodiments of the present disclosure, the display panel further includes a fourth driving unit 24 for providing a driving signal to the photoelectric converter 40. The fourth driving unit 24 can be positioned in various locations within the display panel, and can be located in the first region 110 of the first base substrate 100, or can be disposed on the periphery of the first base substrate 100, or in the second region 120 of the first base substrate 100.

[0124] In some embodiments of the present disclosure, the fourth driving unit 24 is located at the periphery or in the second region 120 of the first base substrate 100. In such embodiments, the display panel further includes a fourth driving chip 33, and the fourth driving unit 24 is integrated into the fourth driving chip 33. In such embodiments, the fourth driving chip 33 can be connected to the photoelectric converter 40 via leads in the first driving layer 200. As shown in FIG17 , the lead layer in the first driving layer 200 further includes a third lead 203 and a fourth lead 204, wherein the third lead 203 connects the fourth driving chip 33 to the first electrode of the photoelectric converter 40, and the fourth lead 204 connects the fourth driving chip 33 to the second electrode of the photoelectric converter 40.

[0125] In other embodiments of the present disclosure, the fourth drive unit 24 is located in the first region 110 of the first base substrate 100. In such embodiments, the fourth drive unit 24 can be formed in the first drive layer 200. That is, when the first drive layer 200 is formed on one side of the first base substrate 100, the fourth drive unit 24 and other structures in the first drive layer 200, such as the first drive unit 21, can be formed simultaneously. In this embodiment, the first base substrate 100 can be a glass substrate or a single crystal silicon substrate.

[0126] In addition, the fourth driving unit 24 can also be formed separately, that is, not formed in the first driving layer 200. As shown in Figures 10, 11, 14, 18, and 19, for example, the display panel also includes a second driving backplane, which is provided on one side of the first base substrate 100 and located in the second sub-area 112. The second driving backplane includes a second base substrate 500 and the fourth driving unit 24 provided on one side of the second base substrate 500. The photoelectric converter 40 is provided on the side of the fourth driving unit 24 away from the second base substrate 500. In this embodiment, the first base substrate 100 can be a glass substrate, and the second base substrate 500 can be a single crystal silicon substrate.

[0127] In this embodiment, the second substrate 500 has a p-well 502 and an n-well 501, which can be used to form an N-type transistor and a P-type transistor, respectively. A first doped region 503 can be formed in the p-well 502, comprising a source doped region and a drain doped region. A second doped region 504 can be formed in the n-well 501, comprising a source doped region and a drain doped region. The second driving backplane also includes a gate insulating layer 505, a gate layer 506, a first planarization layer 507, and a source-drain layer 508, stacked in a direction away from the second substrate 500. Vias are provided in the first planarization layer 507, and the source-drain layer 508 can be connected to the first doped region 503 and the second doped region 504 through the vias. Furthermore, the second driving backplane also includes a second planarization layer 509, a transfer layer 510 and a third planarization layer 511 arranged on the side of the source and drain layer 508 away from the second complete substrate. Vias can also be set in the third planarization layer 511 and the second planarization layer 509, and the photoelectric converter 40 is connected to the source and drain layer 508 through the transfer layer 510.

[0128] In the present disclosure, the photoelectric converter 40 is located in the first region 110 , and the photoelectric converter 40 and the plurality of sub-pixels 10 may be distributed in various locations.

[0129] As shown in FIG8 , in some embodiments, a plurality of photoelectric converters 40 are dispersed in a plurality of sub-pixels 10. For example, the photoelectric converters 40 and the sub-pixels 10 are arranged alternately, or every two, three, or five sub-pixels 10 form a pixel unit, and the pixel units and the photoelectric converters 40 are arranged alternately.

[0130] As shown in Figures 2, 10, 11, and 14, in some other embodiments, the first region 110 includes a first sub-region 111 and a second sub-region 112 located outside the first sub-region 111. The plurality of sub-pixels 10 are located in the first sub-region 111, and the photoelectric converter 40 is located in the second sub-region 112. That is, the central region of the display panel is substantially the display and signal transmission region, and the edge region is substantially the signal receiving region.

[0131] As shown in Figures 10 and 14, in some embodiments, the display panel further includes a barrier dam 301. The barrier dam 301 is disposed on one side of the first base substrate 100 and surrounds the first sub-region 111. The barrier dam 301 is located between the first sub-region 111 and the second sub-region 112, preventing moisture from entering and causing corrosion. The barrier dam 301 can be formed of an adhesive material that has a water and oxygen barrier function. While providing a barrier, it also serves as a connection. Furthermore, the barrier dam 301 can include a first barrier dam 302 and a second barrier dam 303. The second barrier dam 303 surrounds the side of the first barrier dam 302 away from the first sub-region 111. The width of the first barrier dam 302 and the second barrier dam 303, parallel to the first base substrate 100, can range from 10 μm to 300 μm, and can be adjusted accordingly based on the size of the display panel.

[0132] In some embodiments of the present disclosure, the display panel may be packaged using a cover plate package or a thin film package. As shown in Figures 10 and 14, in one embodiment, the display panel further includes a cover plate 300, which is provided on the side of the first light-emitting device 11 and the photoelectric converter 40 away from the first base substrate 100. In this embodiment, the barrier dam 301 may be connected between the cover plate 300 and the first base substrate 100. Furthermore, the display panel may further include a support structure 304, which is located between the first base substrate 100 and the cover plate 300. The height of the support structure 304 may be roughly set according to the size of the first light-emitting device 11, the second light-emitting device 12 and the photoelectric converter 40. For example, the size of the first light-emitting device 11 and the second light-emitting device 12 may be 10μm-30μm, with a resolution of 4k to 32k; the height of the photoelectric converter 40 may be 3μm-10μm, and the height of the support structure 304 may be 3μm-15μm.

[0133] As shown in FIG11 , in another embodiment, the display panel further includes an encapsulation layer 400 disposed on a side of the first light-emitting device 11 and the photoelectric converter 40 away from the first base substrate 100. The orthographic projections of the first light-emitting device 11 and the photoelectric converter 40 on the first base substrate 100 are located within the orthographic projection of the encapsulation layer 400 on the first base substrate 100. The encapsulation layer 400 includes a first inorganic layer, an organic layer, and a second inorganic layer stacked sequentially in a direction away from the first base substrate 100. The first inorganic layer may be a silicon dioxide layer, a silicon nitride layer, or a silicon oxynitride layer, and may have a thickness of 800 nm to 1200 nm, such as 1000 nm. The organic layer may be an epoxy resin layer, and may have a thickness of 5 μm to 10 μm. The second inorganic layer may be a silicon dioxide layer, a silicon nitride layer, or a silicon oxynitride layer, and may have a thickness of 200 nm to 500 nm, such as 300 nm.

[0134] As shown in FIG. 2 , FIG. 3 , and FIG. 9 to FIG. 14 , the present disclosure further provides a method for manufacturing a display panel, comprising:

[0135] Step S100 , providing a first substrate 100 , including a first region 110 and a second region 120 located outside the first region 110 ;

[0136] Step S200, forming a first driving unit 21 and a second driving unit 22;

[0137] Step S300 , forming a device layer, the device layer is provided on one side of the first base substrate 100 , and includes a plurality of first light-emitting devices 11 , and the first light-emitting devices 11 are located in the first area 110 ;

[0138] Among them, the second driving unit 22 is connected to the first driving unit 21 and the first light-emitting device 11, the first driving unit 21 is used to output a driving current, and the second driving unit 22 is used to generate an oscillating current in response to the driving current output by the first driving unit 21 and output it to the first light-emitting device 11, controlling the first light-emitting device 11 to repeatedly turn on or off, so that the first light-emitting device 11 emits a light signal while displaying.

[0139] In some embodiments of the present disclosure, the method for manufacturing a display panel further includes:

[0140] In step S400 , a photoelectric converter 40 is formed. The photoelectric converter 40 is located in the first region 110 .

[0141] In the present disclosure, the first driving unit 21 and the second driving unit 22 can be distributed in various positions in the display panel. For details, please refer to any of the above embodiments of the display panel. They will not be described in detail here. Different production steps can be used for different position distributions.

[0142] For example, a display panel includes a first drive layer 200, which includes a first drive unit 21 and / or a second drive unit 22. The first drive layer 200 is formed on one side of a first base substrate 100. The first drive layer 200 includes the first drive unit 21 and / or the second drive unit 22. The first base substrate 100 and the first drive layer 200 combine to form a first drive backplane. As shown in Figures 9, 10, and 11, the first light-emitting devices 11 can be fabricated separately on another substrate and then transferred to the first drive backplane via transfer. The first light-emitting devices 11 can be micro LEDs. The photoelectric converter 40 can be fabricated separately on another substrate and then transferred to the first drive backplane via transfer. Of course, the photoelectric converter 40 can also be fabricated directly on the first drive backplane without transfer.

[0143] As shown in FIG. 19 , taking the case where the photoelectric converter 40 is fabricated separately on another substrate as an example, a fourth driving unit 24 for providing a driving signal to the photoelectric converter 40 may be formed when the photoelectric converter 40 is formed. This step includes:

[0144] Step S410, providing a second base substrate 500;

[0145] Step S420 , forming a second driving layer on one side of the second base substrate 500 , the second driving layer including a fourth driving unit 24 ;

[0146] In step S430 , a photoelectric converter 40 is formed on a side of the second driving layer away from the second base substrate 500 .

[0147] The second substrate 500 may be a single crystal silicon substrate. The fourth drive unit 24 may include a transistor device, which may be a metal oxide semiconductor field effect transistor (MOS). Furthermore, the second drive layer may also include other data processing units, such as a filter circuit, to filter the electrical signal converted by the photoelectric converter 40. The second substrate 500 has a p-well 502 and an n-well 501, which can be used to form an N-type transistor and a P-type transistor, respectively. A first doped region 503 may be formed in the p-well 502, and the first doped region 503 includes a source doped region and a drain doped region. A second doped region 504 may be formed in the n-well 501, and the second doped region 504 includes a source doped region and a drain doped region. The second drive layer also includes a gate insulating layer 505, a gate layer 506, a first planarization layer 507, and a source and drain layer 508 stacked in a direction away from the second substrate 500. Vias are provided in the first planarization layer 507, through which the source / drain layer 508 can be connected to the first doped region 503 and the second doped region 504. Furthermore, the second driving layer includes a second planarization layer 509, a transfer layer 510, and a third planarization layer 511, which are located on the side of the source / drain layer 508 away from the second substrate. Vias can also be provided in the third planarization layer 511 and the second planarization layer 509, and the photoelectric converter 40 is connected to the source / drain layer 508 via the transfer layer 510.

[0148] In this embodiment, the second base substrate 500, the second driving layer and the photoelectric converter 40 are collectively transferred onto the first driving backplane, specifically onto the second region 120. The first base substrate 100 may be a glass substrate.

[0149] It should be noted here that when the first drive unit 21 and the second drive unit 22 are not located in the first area 110, that is, when the first drive layer 200 does not include the first drive unit 21 and the second drive unit 22 and only includes leads, the first light-emitting device 11 can also be made separately on another substrate and then transferred to the first drive backplane by transfer. The photoelectric converter 40 can also be made separately on another substrate and then transferred to the first drive backplane by transfer, or it can be made directly on the first drive backplane without transfer. In the present disclosure, the first light-emitting device 11 and the photoelectric converter 40 can be connected to the corresponding drive backplane by means of face-up or flip-up.

[0150] 13 and 14 , in addition to being transferred to the first driving backplane, the photoelectric converter 40 can also be transferred to the cover plate 300 , and then the cover plate 300 and the first driving backplane are assembled to form a display panel.

[0151] The present disclosure also provides a display device including a display panel. The display panel may be any of the above-described embodiments. The specific structure and beneficial effects thereof may be referenced above with respect to the display panel embodiments, and are not further described here. The display device of the present disclosure may be an electronic device such as a mobile phone, a tablet computer, or a television, and these are not listed here.

[0152] It should be noted that although the steps of the method of the present disclosure are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in this specific order, or that all steps must be performed to achieve the desired results. Additional or alternative steps, such as omitting certain steps, combining multiple steps into one step, and / or decomposing a step into multiple steps, should all be considered part of this disclosure.

[0153] It should be understood that the present disclosure is not limited in its application to the detailed structure and arrangement of the components set forth in this specification. The present disclosure is capable of other embodiments and can be implemented and executed in a variety of ways. The aforementioned variations and modifications fall within the scope of the present disclosure. It should be understood that the present disclosure disclosed and defined in this specification extends to all alternative combinations of two or more individual features mentioned or evident in the text and / or the drawings. All of these different combinations constitute multiple alternative aspects of the present disclosure. The embodiments of this specification illustrate the best mode known for implementing the present disclosure and will enable those skilled in the art to utilize the present disclosure.

Claims

1. A display panel, in, The display panel includes a plurality of sub-pixels, each of which includes at least one first light-emitting device. The display panel also includes: A first substrate, comprising a first area, wherein the plurality of sub-pixels are located in the first area; A device layer, provided on one side of the first substrate, comprising a plurality of the first light-emitting devices; A first driving unit and a second driving unit, wherein the second driving unit is connected to the first driving unit and the first light-emitting device, the first driving unit is used to output a driving current, and the second driving unit is used to generate an oscillating current in response to the driving current output by the first driving unit and output it to the first light-emitting device, so as to control the first light-emitting device to be repeatedly turned on or off, so that the first light-emitting device emits a light signal while displaying.

2. The display panel according to claim 1, in, The frequency of the oscillating current generated by the second driving unit is not less than 10 5 Hz.

3. The display panel according to claim 1, in, The display panel further includes: A first driving layer, disposed on one side of the first substrate, the first driving layer comprising the second driving unit, and the second driving unit is located in the first area; Wherein, the first light emitting device is located on a side of the first driving layer away from the first substrate, and the first light emitting device is located in the first area; There are multiple second driving units, and in a direction perpendicular to the first substrate, the first light emitting devices and the second driving units are arranged in a one-to-one correspondence.

4. The display panel according to claim 3, in, The first driving layer further includes a first driving unit, and the first driving unit is located in the first area; There are multiple first driving units, and in a direction perpendicular to the first substrate, the first light emitting devices and the first driving units are arranged in a one-to-one correspondence.

5. The display panel according to claim 3, in, The display panel further includes a first driving chip, and the first driving unit is integrated in the first driving chip; The first driving layer further includes a plurality of leads, and the first driving chip is connected to each of the first light emitting devices and each of the second driving units through the leads.

6. The display panel according to claim 1, in, The display panel further includes: A first driving layer is provided on one side of the first substrate. The first driving layer includes Multiple leads; a first driving chip and a second driving chip, wherein the first driving unit is integrated into the first driving chip, the second driving unit is integrated into the second driving chip, and the first driving chip and the second driving chip are connected to each of the first light-emitting devices through the lead wires; The first light emitting device is located on a side of the first driving layer away from the first substrate, and the first light emitting device is located in the first area.

7. The display panel according to claim 1, in, The display panel further includes: A first driving layer, disposed on one side of the first substrate, the first driving layer comprising a plurality of leads; a third driving chip, wherein the first driving unit and the second driving unit are integrated into the third driving chip, and the third driving chip is connected to each of the first light-emitting devices through the lead wires; The first light emitting device is located on a side of the first driving layer away from the first substrate, and the first light emitting device is located in the first area.

8. The display panel according to claim 1, in, The single sub-pixel further includes a second light-emitting device, and the device layer further includes the second light-emitting device; The display panel further includes: a third driving unit, connected to the second light emitting device, and configured to output a driving current to the second light emitting device; A control unit is connected to the first driving unit and the third driving unit, and is used to control the first light emitting device to emit a light signal within one frame time displayed by the second light emitting device.

9. The display panel according to claim 8, in, During one frame of the second light emitting device, the number of switching times of the first light emitting device is not less than 10 6 .

10. The display panel according to claim 8, in, The display panel further includes: A first driving layer, disposed on one side of the first substrate, the first driving layer comprising the third driving unit, and the third driving unit is located in the first area; Wherein, the second light emitting device is located on a side of the first driving layer away from the first substrate, and the second light emitting device is located in the first area; The number of the third driving units is multiple, and the third driving units are arranged in a direction perpendicular to the first substrate. The second light emitting device and the third driving unit are arranged in a one-to-one correspondence.

11. The display panel according to claim 1, in, The display panel also includes a plurality of photoelectric converters for receiving optical signals transmitted from the outside and converting the optical signals into electrical signals for output.

12. The display panel according to claim 11, in, The display panel further comprises a signal shielding layer, the signal shielding layer having a plurality of openings, and the plurality of photoelectric converters are disposed in each of the openings in a one-to-one correspondence; Wherein, the thickness of the signal shielding layer is not less than the height of the photoelectric converter.

13. The display panel according to claim 11, in, The display panel further comprises a covering layer, wherein the covering layer is disposed on one side of the light receiving surface of the photoelectric converter; The cover layer comprises a first cover layer and a second cover layer which are sequentially stacked in a direction away from the photoelectric converter, and the refractive index of the first cover layer is smaller than the refractive index of the second cover layer; A surface of the cover layer away from the photoelectric converter has a plurality of arc-shaped grooves, and the arc-shaped grooves are arranged in a one-to-one correspondence with the photoelectric converters.

14. The display panel according to claim 1, in, The display panel further includes a plurality of photoelectric converters, wherein the photoelectric converters are located in the first area; wherein the plurality of photoelectric converters are dispersedly located in the plurality of sub-pixels; or The first region includes a first sub-region and a second sub-region located outside the first sub-region, the plurality of sub-pixels are located in the first sub-region, and the photoelectric converter is located in the second sub-region.

15. The display panel according to claim 14, in, When the first region includes a first sub-region and a second sub-region located outside the first sub-region, and the photoelectric converter is located in the second sub-region, the display panel further includes: The barrier dam is disposed on one side of the first substrate and surrounds the first sub-region. The barrier dam is located between the first sub-region and the second sub-region.

16. The display panel according to claim 14, in, The display panel further includes: A cover plate is arranged on a side of the first light emitting device and the photoelectric conversion device away from the first substrate.

17. The display panel according to claim 14, in, The display panel further includes: The encapsulation layer is provided on the first light emitting device and the photoelectric conversion device away from the first On one side of the base substrate, the orthographic projections of the first light emitting device and the photoelectric conversion device on the first base substrate are located within the orthographic projection of the encapsulation layer on the first base substrate; The encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer which are sequentially stacked in a direction away from the first substrate.

18. The display panel according to claim 14, in, When the first area includes a first sub-area and a second sub-area located outside the first sub-area, and the photoelectric converter is located in the second sub-area, the display panel further includes: a second driving backplane, disposed on one side of the first substrate and located in the second sub-area, the second driving backplane comprising a second substrate and a fourth driving unit disposed on one side of the second substrate, the fourth driving unit being used to provide a driving signal to the photoelectric converter, the photoelectric converter being disposed on a side of the fourth driving unit away from the second substrate; Wherein, the first substrate is a glass substrate, and the second substrate is a single crystal silicon substrate.

19. A method for manufacturing a display panel, in, include: Providing a first substrate, comprising a first region and a second region located outside the first region; forming a first drive unit and a second drive unit; forming a device layer, wherein the device layer is disposed on one side of the first substrate and comprises a plurality of first light-emitting devices, wherein the first light-emitting devices are located in the first area; Among them, the second driving unit is connected to the first driving unit and the first light-emitting device, the first driving unit is used to output a driving current, and the second driving unit is used to generate an oscillating current in response to the driving current output by the first driving unit and output it to the first light-emitting device, so as to control the first light-emitting device to be repeatedly turned on or off, so that the first light-emitting device emits a light signal while displaying.

20. The method for manufacturing a display panel according to claim 19, in, The method for manufacturing the display panel also includes: A photoelectric converter is formed, wherein the photoelectric converter is located in the first region.

21. A display device, in, Comprising a display panel as described in any one of claims 1-18.

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