Laser drilling control methods, systems and devices, equipment and storage media

Abstract

This invention discloses a control method, system, device, equipment, and storage medium for laser drilling. The control method includes: during the feeding process of the worktable towards the laser processing area, acquiring the current moving position of the worktable, which reflects the current position of the workpiece to be processed; when the current moving position is in the entrance area of ​​the laser processing area, sending a deflection command to the scanning galvanometer to instruct it to deflect in the direction of the laser processing area; acquiring the current deflection angle of the scanning galvanometer; when the current deflection angle is within a preset angle threshold, sending an activation command to the laser generator to instruct it to generate a laser beam for laser drilling of the workpiece to be processed during the feeding process of the worktable. Through this method, laser drilling of the workpiece to be processed can be performed during the feeding process of the worktable, achieving uninterrupted drilling processing without requiring the worktable to stop and wait, greatly improving processing efficiency.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and in particular to a control method, system, device, equipment, and storage medium for laser drilling. Background Technology

[0002] In recent years, with the continuous expansion of HDI (High Density Interconnector) circuit board and carrier board applications, PCB manufacturing processes have rapidly become more precise and dense, resulting in a significant increase in the number of holes in the workpiece. To improve processing efficiency, a flying drilling solution using CO2 pulsed laser drilling, which differs from traditional processing methods, has emerged. This processing solution can significantly improve drilling efficiency.

[0003] The principle of laser drilling is as follows: a laser generator produces a processing light source, which is transmitted to a scanning galvanometer (hereinafter referred to as an electron microscope, Galvano) via a reflector. Then, a scanning lens (hereinafter referred to as an Fθ scanning mirror) forms a beam perpendicular to the worktable, ultimately forming a hole on the workpiece. Due to the limited processing area of ​​the electron microscope (Galvano), see Figure 1(a). Figure 1(a) is a schematic diagram of the maximum processing area of ​​a scanning galvanometer. Taking Figure 1(a) as an example, the maximum processing area of ​​the scanning galvanometer shown in Figure 1(a) is 90mm. However, the size of the workpiece to be processed by the end customer is often much larger than this maximum processing area. Therefore, it is necessary to divide the coordinate file of the workpiece to be processed into regions to complete the overall processing. The workpiece is then moved to different positions via a platform to achieve the purpose of regional processing (see Figure 1(b), which is a schematic diagram of regional processing of the workpiece). Finally, drilling is completed on the entire surface of the workpiece.

[0004] The traditional area processing method is as follows: Based on the above-mentioned laser drilling working principle, the traditional table movement method is as follows: First, the segmented area is moved to the working range of the Fθ scanning mirror. After moving to the designated position, the table will stop moving and wait for the laser to act on the workpiece (see reference). Figure 2 , Figure 2 (This is a schematic diagram of a traditional area processing method in an embodiment of the present invention.) After processing one area, the process moves to the next area, and this cycle is repeated to complete the processing of the entire board. Because the worktable needs to stop and wait for the processing to complete, the current processing efficiency of laser processing is low. Summary of the Invention

[0005] The main objective of this invention is to provide a control method, system, device, equipment, and storage medium for laser drilling, which can solve the problem of low processing efficiency caused by the need for the worktable to stop and wait for processing to complete in the prior art.

[0006] To achieve the above objectives, the first aspect of the present invention provides a control method for laser drilling, the control method being applied to a laser drilling control system, the control system including a laser generator, a scanning galvanometer, and a worktable, the worktable being used to load a workpiece to be processed, the laser beam emitted by the laser generator being directed towards a laser processing area via the scanning galvanometer, the laser processing area being used to perform laser drilling on the workpiece to be processed, the control method including:

[0007] During the feeding process of the worktable toward the laser processing area, the current moving position of the worktable is obtained, and the current moving position is used to reflect the current position of the workpiece to be processed;

[0008] When the current moving position is in the entrance area of ​​the laser processing area, a deflection command is sent to the scanning galvanometer, which is used to instruct the scanning galvanometer to deflect in the direction of the laser processing area;

[0009] Obtain the current deflection angle of the scanning galvanometer;

[0010] When the current deflection angle is at a preset angle threshold, an activation command is sent to the laser generator. The activation command is used to instruct the laser generator to generate a laser beam to perform laser drilling on the workpiece during the feeding process of the worktable.

[0011] In one feasible implementation, the laser processing area is at least divided into a left processing area, a middle processing area, and a right processing area, and sending a deflection command to the scanning galvanometer includes:

[0012] If the entrance area is the entrance to the left processing area, a left deflection command is sent to the scanning galvanometer. The deflection command includes at least the left deflection command, which is used to instruct the scanning galvanometer to deflect to the left processing area.

[0013] If the entrance area is the entrance to the intermediate processing area, then an intermediate deflection command is sent to the scanning galvanometer. The deflection command includes at least the intermediate deflection command, which is used to instruct the scanning galvanometer to deflect to the intermediate processing area.

[0014] If the entrance area is the entrance to the right processing area, a right deflection command is sent to the scanning galvanometer. The deflection command includes at least the right deflection command, which is used to instruct the scanning galvanometer to deflect to the right processing area.

[0015] In one feasible implementation, before acquiring the current moving position of the worktable during the feeding process of the worktable towards the laser processing area, the method further includes:

[0016] Upon receiving a processing instruction for the workpiece to be processed, a feed instruction is sent to the worktable. The feed instruction is used to instruct the worktable to feed towards the laser processing area so that the workpiece to be processed moves to the laser processing area.

[0017] In one feasible implementation, the method further includes:

[0018] Obtain the dimensions of the workpiece to be processed;

[0019] The workpiece to be processed is divided into sections based on the dimensions and the maximum processing area of ​​the scanning galvanometer, and the sectioning result is determined, wherein the sectioning result includes at least the number of sections.

[0020] In one feasible implementation, the step of sending the deflection command to the scanning galvanometer further includes:

[0021] Obtain the recorded number of entrances to the laser processing area traversed by the worktable;

[0022] If the number of entry points is greater than the number of regions, then return to the step of obtaining the current moving position of the worktable until the current moving position is at the feed endpoint, then send a stop feed command to the worktable.

[0023] To achieve the above objectives, a second aspect of the present invention provides a control system for laser drilling, the control system comprising a central control unit, a laser generator, a scanning galvanometer, and a worktable, wherein the central control unit is communicatively connected to the laser generator, the scanning galvanometer, and the worktable, the worktable is used to load a workpiece to be processed, a laser beam emitted by the laser generator is directed to a laser processing area via the scanning galvanometer, the laser processing area is used to perform laser drilling on the workpiece to be processed, and the central control unit is used to execute the steps as shown in the first aspect and any feasible implementation thereof.

[0024] In one feasible implementation, the control system further includes a scanning lens through which the laser beam passing through the scanning galvanometer is directed perpendicularly toward the laser processing area.

[0025] To achieve the above objectives, a third aspect of the present invention provides a control device for laser drilling, the control device being applied to a laser drilling control system, the control system including a laser generator, a scanning galvanometer, and a worktable, the worktable being used to load a workpiece to be processed, the laser beam emitted by the laser generator being directed towards a laser processing area via the scanning galvanometer, the laser processing area being used to perform laser drilling on the workpiece to be processed, the control device comprising:

[0026] Position acquisition module: used to acquire the current moving position of the worktable during the feeding process of the worktable towards the laser processing area, the current moving position being used to reflect the current position of the workpiece to be processed;

[0027] Deflection control module: When the current moving position is in the entrance area of ​​the laser processing area, it sends a deflection command to the scanning galvanometer, the deflection command instructing the scanning galvanometer to deflect in the direction of the laser processing area;

[0028] Angle acquisition module: used to acquire the current deflection angle of the scanning galvanometer;

[0029] Laser processing module: When the current deflection angle is at a preset angle threshold, it sends an activation command to the laser generator. The activation command is used to instruct the laser generator to generate a laser beam to perform laser drilling on the workpiece during the feeding process of the worktable.

[0030] To achieve the above objectives, a fourth aspect of the present invention provides a computer-readable storage medium storing a computer program, which, when executed by a processor, causes the processor to perform the steps shown in the first aspect and any feasible implementation.

[0031] To achieve the above objectives, a fourth aspect of the present invention provides a computer device including a memory and a processor, the memory storing a computer program, which, when executed by the processor, causes the processor to perform the steps shown in the first aspect and any feasible implementation.

[0032] The embodiments of the present invention have the following beneficial effects:

[0033] This invention provides a control method for laser drilling. The control method is applied to a laser drilling control system, which includes a laser generator, a scanning galvanometer, and a worktable. The worktable is used to load the workpiece to be processed. The laser beam emitted by the laser generator is directed towards the laser processing area via the scanning galvanometer. The laser processing area is used to perform laser drilling on the workpiece. The control method includes: during the worktable's feed towards the laser processing area, acquiring the current moving position of the worktable, which reflects the current position of the workpiece; when the current moving position is in the entrance area of ​​the laser processing area, sending a deflection command to the scanning galvanometer, which instructs the scanning galvanometer to deflect in the direction of the laser processing area; acquiring the current deflection angle of the scanning galvanometer; when the current deflection angle is within a preset angle threshold, sending an activation command to the laser generator, which instructs the laser generator to generate a laser beam to perform laser drilling on the workpiece during the worktable's feed. Through this method, laser drilling can be performed on the workpiece during the worktable's feed, achieving uninterrupted drilling processing without requiring the worktable to stop and wait, greatly improving processing efficiency. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] in:

[0036] Figure 1(a) is a schematic diagram of the maximum processing area of ​​a scanning galvanometer;

[0037] Figure 1(b) is a schematic diagram of a partitioned processing of a workpiece;

[0038] Figure 2 This is a schematic diagram of a conventional area processing method in an embodiment of the present invention;

[0039] Figure 3 This is a structural block diagram of a laser drilling control system according to an embodiment of the present invention;

[0040] Figure 4 This is a flowchart of a laser drilling control method according to an embodiment of the present invention;

[0041] Figure 5 This is a schematic diagram of the area processing of a laser drilling control method according to an embodiment of the present invention;

[0042] Figure 6 This is a structural block diagram of a laser drilling control device according to an embodiment of the present invention;

[0043] Figure 7 This is a structural block diagram of a computer device in an embodiment of the present invention. Detailed Implementation

[0044] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] Please see Figure 3 , Figure 3 This is a structural block diagram of a laser drilling control system according to an embodiment of the present invention, as shown below. Figure 3 The laser drilling control system 00 shown includes a central control unit 10, a laser generator 20, a scanning galvanometer 30, and a worktable 40. This laser drilling can be a flying drilling solution applied to CO2 pulsed laser drilling. The scanning galvanometer can be an electron microscope (Galvano), and the laser generator can be a multi-channel laser. The central control unit 10 has communication connections with the laser generator 20, the scanning galvanometer 30, and the worktable 40. The worktable 40 is used to load the workpiece to be processed, which can be fixedly mounted on the worktable. The workpiece can be a PCB, core board, photovoltaic panel, or other board product, and is carried by the worktable to the laser... The laser processing area performs laser drilling; the laser beam emitted by the laser generator 20 is directed to the laser processing area via the scanning galvanometer 30. The laser processing area is used to perform laser drilling on the workpiece to be processed. The central control unit 10 is used to execute the laser drilling control method shown in this application. As the central control unit, it interacts with the laser generator, the scanning galvanometer, and the worktable to monitor the status of the laser generator, the scanning galvanometer, and the worktable in real time. The laser generator, the scanning galvanometer, and the worktable can report their own status data to the central control unit. The reporting method can be active reporting or reporting only when requested by the central controller. No limitation is made here.

[0046] Exemplarily, the above control system may further include a terminal providing a human-machine interaction medium, such as a PC segment. Furthermore, a feasible interaction process may be that after receiving a human-machine interaction signal at the PC end, the central control unit simultaneously sends control signals to the following three components (laser generator, electron microscope, and workbench). This method can ensure the timeliness and unity of electrical signals, and can receive the real-time motion states fed back by the three components, achieving the effect of closed-loop control and realizing the precise linkage control of the three components. Among them, closed-loop control includes, but is not limited to, Galvano monitoring and feeding back its own swing angle, whether it is within the controllable deviation range of the theoretical angle; the workbench is the same, monitoring and feeding back its own moving coordinates, whether it is within the controllable deviation range of the theoretical coordinates.

[0047] The main control principle is as follows: First, the PC end sends a processing instruction to the central control unit. Then, the central control unit will send a moving command to the workbench to move it to the target position (which can be the position where the laser processing area is located). When the workbench enters within 2-3um of the coordinates of the target position (the moving coordinates of the workbench are fed back in real time here), the central control unit immediately sends commands to Galvano and the laser. The action of the laser relative to Galvano will be delayed by 100us (equivalent to turning on the laser after the electron microscope deflects to the corresponding direction) to ensure that the laser accurately hits the target position on the platform.

[0048] Furthermore, the above control system 00 may further include a scanning lens. Among them, the scanning lens may be an Fθ scanning mirror. The laser beam passing through the scanning galvanometer 30 is perpendicularly incident on the laser processing area through the scanning lens. The following introduces a control method for laser drilling in an embodiment of the present invention.

[0049] Please refer to Figure 4 , Figure 4 which is a flowchart of a control method for laser drilling in an embodiment of the present invention. As Figure 4 shown, the control method is applied to the laser drilling control system shown in Figure 1. The control method includes the following steps:

[0050] 401. During the feeding process of the workbench towards the laser processing area, obtain the current moving position of the workbench, and the current moving position is used to reflect the current position of the workpiece to be processed;

[0051] Understandably, to perform laser drilling on a workpiece, the workpiece needs to be fixed on a worktable, which then feeds the workpiece towards the laser processing area. To achieve laser drilling without stopping, the current position of the worktable needs to be obtained during its feed. Since the workpiece is fixed on the worktable, this current position reflects the current location of the workpiece. By using this current position, it can be determined whether the workpiece has entered the laser processing area, allowing for timely laser drilling during the feed process.

[0052] In one feasible implementation, the central control unit can also have a communication connection with a preset terminal, which can be a desktop terminal or a mobile terminal. The mobile terminal can be at least one of a mobile phone, tablet computer, or laptop computer. The terminal can interact with the central control unit. The user sends instructions or data to the central control unit through some processing interaction operations on the terminal. For example, the user issues processing instructions for the workpiece to be processed to the central control unit on the terminal, or inputs the feed data of the worktable, such as feed speed and feed direction, workpiece information such as size and specifications, and design information of the pattern to be processed, such as hole type and hole diameter, etc., on the terminal. Then the central control unit can request the above data information from the terminal to better synchronize and control the various devices in the control system during the worktable feeding process.

[0053] For example, before step 401, the method further includes: upon receiving a processing instruction for the workpiece to be processed, sending a feed instruction to the worktable, the feed instruction being used to instruct the worktable to feed towards the laser processing area, so that the workpiece to be processed moves to the laser processing area.

[0054] The processing instructions can be issued by the user through the aforementioned terminal. These instructions may include the feed direction, feed speed, dimensions of the workpiece to be processed, design information of the pattern to be processed, etc., which are not limited here.

[0055] 402. When the current moving position is in the entrance area of ​​the laser processing area, a deflection command is sent to the scanning galvanometer, the deflection command being used to instruct the scanning galvanometer to deflect in the direction of the laser processing area;

[0056] It should be noted that the current movement position of the worktable can be used to determine whether the workpiece to be processed has entered the laser processing area. Specifically, it is determined whether the current movement position is within the entrance area of ​​the laser processing area. For example, it is determined whether the current movement position is within the coordinate range corresponding to the entrance area of ​​the laser processing area. If the current movement position is within this coordinate range, it is considered that the current movement position is within the entrance area of ​​the laser processing area; otherwise, it is considered that it is not within the entrance area of ​​the laser processing area. The coordinate range can be a position coordinate corresponding to the boundary position of the entrance area, or it can be a coordinate area including a preset distance threshold before the boundary position. For example, if the preset distance threshold can be 2-3 μm, then the coordinate range corresponding to the entrance area can be a coordinate area within the range of 2-3 μm before the boundary position.

[0057] Then, when the current moving position is in the entrance area of ​​the laser processing zone, a deflection command is sent to the scanning galvanometer, instructing the scanning galvanometer to deflect in the direction of the laser processing zone, so as to project the laser beam onto the laser processing zone and deflect the laser beam onto the workpiece to be processed that has entered the laser processing zone, thereby realizing the drilling process.

[0058] Furthermore, the scanning galvanometer can deflect left and right, so the laser processing area is at least divided into sub-processing areas such as the left processing area, the middle processing area, and the right processing area. Each sub-processing area has an entrance area, so the laser processing area has at least three entrance areas. Entering different entrance areas at the current position will cause the scanning galvanometer to deflect differently. Specifically, sending a deflection command to the scanning galvanometer includes the following steps A01 to A03:

[0059] A01. If the entrance area is the entrance to the left processing area, a left deflection command is sent to the scanning galvanometer. The deflection command includes at least the left deflection command, which is used to instruct the scanning galvanometer to deflect to the left processing area.

[0060] A02. If the entrance area is the entrance to the intermediate processing area, then send an intermediate deflection command to the scanning galvanometer. The deflection command includes at least the intermediate deflection command, which is used to instruct the scanning galvanometer to deflect to the intermediate processing area.

[0061] A03. If the entrance area is the entrance to the right processing area, a right deflection command is sent to the scanning galvanometer. The deflection command includes at least the right deflection command, which is used to instruct the scanning galvanometer to deflect to the right processing area.

[0062] Steps A01 to A03 allow the workpiece to be identified when it enters different sub-processing zones of the laser processing area, thereby controlling the scanning galvanometer to deflect in the direction of the sub-processing zone, thus enabling drilling at different locations of the workpiece during the feeding process.

[0063] It should be noted that, due to the limited processing range of the scanning galvanometer, if the workpiece to be processed is larger than the maximum processing range of the scanning galvanometer, the workpiece must be divided into sections, and each section of the workpiece is processed sequentially to complete the overall processing. The scanning galvanometer has the ability to deflect in the left and right directions, which can divide the laser processing area into at least three sub-processing areas: a left processing area, a middle processing area, and a right processing area. When the scanning galvanometer deflects to the left, the laser beam falls on the left processing area; when it deflects to the middle, the laser beam falls on the middle processing area; and when it deflects to the right, the laser beam falls on the right processing area. During the deflection process, the worktable continues to feed, thus enabling the sequential processing of each section of the workpiece to complete the overall processing.

[0064] To better understand the changes in the improved processing procedure, the following will be used as an example. Figure 2 and Figure 5 For a comparative explanation, please continue reading. Figure 2 , Figure 2 This is a schematic diagram of a traditional area processing method in an embodiment of the present invention. Figure 2 In the laser processing area, the workpiece is positioned to await processing. Therefore, during laser processing, firstly, the Galvano microscope is rotated to illuminate the left side of the FθLens (left processing area), thus processing the left side of the workpiece; then, the Galvano microscope is rotated to illuminate the middle area of ​​the FθLens (middle processing area), thus processing the middle area of ​​the workpiece; finally, the Galvano microscope is rotated to illuminate the right side of the FθLens (right processing area), thus processing the right side of the workpiece.

[0065] For further details, please refer to Figure 5 , Figure 5 This is a schematic diagram of the area processing of a laser drilling control method according to an embodiment of the present invention. Figure 5 The diagram shows the boundary points C1 to C3 of the three sub-processing zones and the reference point X1 of the current position of the workpiece. C1 is the boundary point of the entrance area of ​​the left processing zone of the laser processing zone, C2 is the boundary point of the entrance area of ​​the middle processing zone of the laser processing zone, and C3 is the boundary point of the entrance area of ​​the right processing zone of the laser processing zone. Figure 5It can be seen that the workpiece enters the laser processing area from left to right. As the workpiece is fed, laser processing is performed without stopping during the feeding process: First, the right side region X1 of the workpiece enters the left side C1 of the laser processing area. At this time, the scanning galvanometer rotates to illuminate the left side of the scanning lens FθLens (i.e., the left processing area), and then the right side region of the workpiece is processed. Next, the workpiece X1 enters the middle C2 of the laser processing area. At this time, the scanning galvanometer rotates to illuminate the middle region of the scanning lens FθLens (i.e., the middle processing area), and then the middle region of the workpiece is processed. Finally, the workpiece X1 enters the right side C3 of the laser processing area. At this time, the scanning galvanometer of the electron microscope is controlled to rotate to illuminate the right side of the scanning lens FθLens (i.e., the right processing area), and then the left side of the workpiece is processed. The speed of the linear moving stage can be 10-50 m / min.

[0066] In simple terms, the processing method shown in this application is as follows: during the continuous and uninterrupted movement of the worktable, the laser synchronously acts on the workpiece, greatly reducing the platform's stopping and waiting time. In the single-area processing method, the left half of the FθLens first processes the right half of the divided area, and then as the worktable moves, the right half of the FθLens processes the left half of the divided area.

[0067] It should be noted that the maximum moving speed of the worktable is 60 m / min (1 μm / µs), while the speed of laser propagation in air is 3 × 10⁸ m / s. The laser speed is much greater than the maximum moving speed of the worktable, approaching a state of relative stillness. The maximum time the laser acts on the workpiece is 15 µs, equivalent to the workpiece moving a maximum of 15 µm during this time. To ensure the roundness of the machined holes, tests have shown that when the workpiece moves less than 30 µm during the laser's action, the roundness can be guaranteed to be above 90% acceptable. In other words, when the platform moving speed is less than 120 m / min, this method has minimal impact on processing quality. Therefore, drilling in various areas can be effectively completed during the feed process. By replacing the traditional inching movement with the linear moving worktable described above, the entire workpiece is processed during linear feed, effectively improving processing efficiency.

[0068] In one feasible implementation, the method further includes partitioning the workpiece to be processed. Specifically, the partitioning process may be performed before obtaining the current moving position of the worktable: obtaining the size of the workpiece to be processed; partitioning the workpiece to be processed according to the size and the maximum processing area of ​​the scanning galvanometer, and determining the partitioning result, wherein the partitioning result includes at least the number of regions.

[0069] In order to determine how many areas of the workpiece to be processed exist, the size of the workpiece to be processed can be obtained; the workpiece to be processed is divided into regions according to the size and the maximum processing area of ​​the scanning galvanometer, and the partitioning result is determined. The partitioning result includes at least the number of regions, which is the total number of regions to be processed in the workpiece.

[0070] In one feasible implementation, the number of regions can be used to determine whether the workpiece processing is complete. If processing is complete, then the scanning galvanometer does not need to be deflected. That is, before sending the deflection command to the scanning galvanometer, it can be determined whether the workpiece processing is complete. Specifically, this includes steps B01 and B02:

[0071] B01. Obtain the recorded number of entrances to the laser processing area that the workbench passes through;

[0072] It should be noted that the number of entry points a workpiece passes through each sub-processing zone of the laser processing area is recorded each time it passes through the entry point, so as to determine whether the scanning galvanometer needs to be deflected.

[0073] B02. When the number of entrances is greater than the number of regions, return to the step of obtaining the current moving position of the worktable until the current moving position is at the feed endpoint position, then send a stop feed command to the worktable.

[0074] When the number of entry points is obtained, the number of entry points and the number of areas of the workpiece to be processed can be used to determine whether the scanning galvanometer needs to continue to deflect with the workpiece. The sign that the overall processing of the workpiece is completed should be that the number of entry points and the number of areas are equal. Therefore, if the number of entry points is greater than the number of areas, it means that the overall processing of the workpiece has been completed. Although the workpiece is about to enter a new sub-processing area, it is not necessary to drill holes in the workpiece at this time. Therefore, it is not necessary to send a deflection command to the scanning galvanometer. Instead, the process returns to the step of obtaining the current moving position of the worktable until the current moving position is at the feed endpoint, at which point a stop feed command is sent to the worktable.

[0075] 403. Obtain the current deflection angle of the scanning galvanometer;

[0076] 404. When the current deflection angle is at a preset angle threshold, an activation command is sent to the laser generator. The activation command is used to instruct the laser generator to generate a laser beam to perform laser drilling on the workpiece to be processed during the feeding process of the worktable.

[0077] Furthermore, the scanning galvanometer also reports its deflection angle to the central control unit. The central control unit can then obtain the current deflection angle of the scanning galvanometer and determine whether it has deflected to the corresponding sub-processing area by monitoring the deflection angle. This controls the timing of the laser generator emitting the laser beam, reducing processing errors. Specifically, when the current deflection angle is within a preset angle threshold, an activation command is sent to the laser generator. This activation command instructs the laser generator to generate a laser beam to perform laser drilling on the workpiece during the table's feed. The preset angle threshold varies depending on the sub-processing area. For example, if the deflection command is to the left, the preset angle threshold is the ideal deflection angle for the scanning galvanometer corresponding to the left processing area; if the deflection command is to the center, the preset angle threshold is the ideal deflection angle for the scanning galvanometer corresponding to the middle processing area; and if the deflection command is to the right, the preset angle threshold is the ideal deflection angle for the scanning galvanometer corresponding to the right processing area. The activation timing of the laser generator is then controlled by comparing the current deflection angle with the preset angle threshold. An angle threshold list can be preset, which includes the correspondence between deflection commands in different directions and the ideal deflection angle of the scanning galvanometer. When deflection is required, the corresponding preset angle threshold can be obtained through the correspondence in the list.

[0078] Furthermore, workpiece partitioning can be achieved by importing the CNC file program corresponding to the graphic style of the workpiece to be processed, partitioning the workpiece, locating the target hole position, and then visually recognizing the target hole position of the workpiece during laser drilling to locate the specific processing position of the workpiece for drilling processing. This will not be elaborated on here.

[0079] It should be noted that, in order to further improve efficiency, the Galvano electron microscope has pioneered the use of a continuous micro-rotation motion method. The laser signal is provided by Galvano. During the process of Galvano transmitting the signal to the laser, due to the delay effect of the electrical signal, in a traditional laser machine, the two motors on Galvano would pause briefly after reaching the target position, at which point their speed would be 0. When moving to the next target, they would need to accelerate again, which wastes efficiency.

[0080] The principle of the uninterrupted micro-rotation motion is that after the Galvano motor reaches the target position, it performs repeated oscillations with a very small arc, so that the Galvano always maintains a non-zero initial velocity during its movement between the target positions. It has been verified that this arc, when converted to a horizontal distance unit, is approximately 2µm, which is within the allowable error range.

[0081] This invention provides a control method for laser drilling. The control method is applied to a laser drilling control system, which includes a laser generator, a scanning galvanometer, and a worktable. The worktable is used to load the workpiece to be processed. The laser beam emitted by the laser generator is directed towards the laser processing area via the scanning galvanometer. The laser processing area is used to perform laser drilling on the workpiece. The control method includes: during the worktable's feed towards the laser processing area, acquiring the current moving position of the worktable, which reflects the current position of the workpiece; when the current moving position is in the entrance area of ​​the laser processing area, sending a deflection command to the scanning galvanometer, which instructs the scanning galvanometer to deflect in the direction of the laser processing area; acquiring the current deflection angle of the scanning galvanometer; when the current deflection angle is within a preset angle threshold, sending an activation command to the laser generator, which instructs the laser generator to generate a laser beam to perform laser drilling on the workpiece during the worktable's feed. Through this method, laser drilling can be performed on the workpiece during the worktable's feed, achieving uninterrupted drilling processing without requiring the worktable to stop and wait, greatly improving processing efficiency.

[0082] Please see Figure 6 , Figure 6 This is a structural block diagram of a laser drilling control device according to an embodiment of the present invention, as shown below. Figure 6 The control device shown is applied to a laser drilling control system. The control system includes a laser generator, a scanning galvanometer, and a worktable. The worktable is used to load the workpiece to be processed. The laser beam emitted by the laser generator is directed towards the laser processing area via the scanning galvanometer. The laser processing area is used to perform laser drilling on the workpiece. The control device includes:

[0083] Position acquisition module 601: used to acquire the current moving position of the worktable during the feeding process of the worktable towards the laser processing area, the current moving position being used to reflect the current position of the workpiece to be processed;

[0084] Deflection control module 602: When the current moving position is in the entrance area of ​​the laser processing area, it sends a deflection command to the scanning galvanometer, the deflection command instructing the scanning galvanometer to deflect in the direction of the laser processing area;

[0085] Angle acquisition module 603: used to acquire the current deflection angle of the scanning galvanometer;

[0086] Laser processing module 604: When the current deflection angle is at a preset angle threshold, it sends an activation command to the laser generator. The activation command is used to instruct the laser generator to generate a laser beam to perform laser drilling on the workpiece to be processed during the feeding process of the worktable.

[0087] It should be noted that, Figure 6 The contents of each module in the device shown are... Figure 4 The steps in the method shown are similar, and will not be repeated here to avoid repetition. For details, please refer to [reference needed]. Figure 4 The content of each step in the method shown.

[0088] This invention provides a control device for laser drilling. The control device is applied to a laser drilling control system, which includes a laser generator, a scanning galvanometer, and a worktable. The worktable is used to load the workpiece to be processed. The laser beam emitted by the laser generator is directed towards the laser processing area via the scanning galvanometer. The laser processing area is used to perform laser drilling on the workpiece. The control device includes: a position acquisition module for acquiring the current moving position of the worktable during its feed towards the laser processing area; the current moving position reflects the current position of the workpiece; a deflection control module for sending a deflection command to the scanning galvanometer when the current moving position is in the entrance area of ​​the laser processing area; an angle acquisition module for acquiring the current deflection angle of the scanning galvanometer; and a laser processing module for sending an activation command to the laser generator when the current deflection angle is within a preset angle threshold; the activation command instructs the laser generator to generate a laser beam to perform laser drilling on the workpiece during the feed of the worktable. With the above-mentioned device, laser drilling can be performed on the workpiece during the table feed process, realizing uninterrupted drilling processing without the need for the table to stop and wait, which greatly improves processing efficiency.

[0089] Figure 7 An internal structural diagram of a computer device in one embodiment is shown. This computer device can specifically be a terminal or a server. Figure 7 As shown, the computer device includes a processor, memory, and a network interface connected via a system bus. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system and may also store a computer program, which, when executed by the processor, causes the processor to perform the aforementioned methods. The internal memory may also store a computer program, which, when executed by the processor, causes the processor to perform the aforementioned methods. Those skilled in the art will understand that… Figure 7 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0090] In one embodiment, a computer device is provided, including a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform actions such as... Figure 4 The steps of the method shown.

[0091] In one embodiment, a computer-readable storage medium is provided storing a computer program that, when executed by a processor, causes the processor to perform the following actions: Figure 4 The steps of the method shown.

[0092] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM), etc.

[0093] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for controlling laser drilling, characterized in that, The control method is applied to a laser drilling control system, which includes a laser generator, a scanning galvanometer, and a worktable. The worktable is used to load the workpiece to be processed. The laser beam emitted by the laser generator is directed towards the laser processing area via the scanning galvanometer. The laser processing area is used to perform laser drilling on the workpiece. The control method includes: During the feeding process of the worktable toward the laser processing area, the current moving position of the worktable is obtained, and the current moving position is used to reflect the current position of the workpiece to be processed; When the current moving position is in the entrance area of ​​the laser processing area, a deflection command is sent to the scanning galvanometer, which is used to instruct the scanning galvanometer to deflect in the direction of the laser processing area; Obtain the current deflection angle of the scanning galvanometer; When the current deflection angle is at a preset angle threshold, an activation command is sent to the laser generator. The activation command is used to instruct the laser generator to generate a laser beam to perform laser drilling on the workpiece during the feeding process of the worktable.

2. The method according to claim 1, characterized in that, The laser processing area is divided into at least a left processing area, a middle processing area, and a right processing area. Sending a deflection command to the scanning galvanometer includes: If the entrance area is the entrance to the left processing area, a left deflection command is sent to the scanning galvanometer. The deflection command includes at least the left deflection command, which is used to instruct the scanning galvanometer to deflect to the left processing area. If the entrance area is the entrance to the intermediate processing area, then an intermediate deflection command is sent to the scanning galvanometer. The deflection command includes at least the intermediate deflection command, which is used to instruct the scanning galvanometer to deflect to the intermediate processing area. If the entrance area is the entrance to the right processing area, a right deflection command is sent to the scanning galvanometer. The deflection command includes at least the right deflection command, which is used to instruct the scanning galvanometer to deflect to the right processing area.

3. The method according to claim 1 or 2, characterized in that, Before acquiring the current moving position of the worktable during the feeding process of the worktable towards the laser processing area, the method further includes: Upon receiving a processing instruction for the workpiece to be processed, a feed instruction is sent to the worktable. The feed instruction is used to instruct the worktable to feed towards the laser processing area so that the workpiece to be processed moves to the laser processing area.

4. The method according to claim 1, characterized in that, Prior to obtaining the current moving position of the workbench, the process also includes: Obtain the dimensions of the workpiece to be processed; The workpiece to be processed is divided into sections based on the dimensions and the maximum processing area of ​​the scanning galvanometer, and the sectioning result is determined, wherein the sectioning result includes at least the number of sections.

5. The method according to claim 4, characterized in that, The step of sending the deflection command to the scanning galvanometer also includes: Obtain the recorded number of entrances to the laser processing area traversed by the worktable; If the number of entry points is greater than the number of regions, then return to the step of obtaining the current moving position of the worktable until the current moving position is at the feed endpoint, then send a stop feed command to the worktable.

6. A control system for laser drilling, characterized in that, The control system includes a central control unit, a laser generator, a scanning galvanometer, and a worktable. The central control unit is connected to the laser generator, the scanning galvanometer, and the worktable. The worktable is used to load the workpiece to be processed. The laser beam emitted by the laser generator is directed to the laser processing area via the scanning galvanometer. The laser processing area is used to perform laser drilling on the workpiece to be processed. The central control unit is used to execute the steps of the method as described in any one of claims 1-5.

7. The control system according to claim 6, characterized in that, The control system also includes a scanning lens, through which the laser beam passing through the scanning galvanometer is directed perpendicularly toward the laser processing area.

8. A control device for laser drilling, characterized in that, The control device is applied to a laser drilling control system. The control system includes a laser generator, a scanning galvanometer, and a worktable. The worktable is used to load the workpiece to be processed. The laser beam emitted by the laser generator is directed towards the laser processing area via the scanning galvanometer. The laser processing area is used to perform laser drilling on the workpiece. The control device includes: Position acquisition module: used to acquire the current moving position of the worktable during the feeding process of the worktable towards the laser processing area, the current moving position being used to reflect the current position of the workpiece to be processed; Deflection control module: When the current moving position is in the entrance area of ​​the laser processing area, it sends a deflection command to the scanning galvanometer, the deflection command instructing the scanning galvanometer to deflect in the direction of the laser processing area; Angle acquisition module: used to acquire the current deflection angle of the scanning galvanometer; Laser processing module: When the current deflection angle is at a preset angle threshold, it sends an activation command to the laser generator. The activation command is used to instruct the laser generator to generate a laser beam to perform laser drilling on the workpiece during the feeding process of the worktable.

9. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, the processor performs the steps of the method as described in any one of claims 1 to 5.

10. A computer device, comprising a memory and a processor, characterized in that, The memory stores a computer program that, when executed by the processor, causes the processor to perform the steps of the method as described in any one of claims 1 to 5.

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