Laminating jig, laminating device and laminating method
By designing a fitting fixture including a press head, sensor, airbag and controller, the problem of insulating tape rising during the attaching process is solved, and a better fit between the tape and the component to be fitted is achieved.
Patent Information
- Application Number
- CN202411523812.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-29
- Publication Date
- 2025-02-07
AI Technical Summary
During the production process of display devices, there are often problems with lifting when attaching insulating tape, which affects the fitting effect.
A fitting fixture including a press head, a first sensor, a first airbag, and a first controller is designed. The pressure surface of the pressure head is provided with a groove, the first sensor measures the distance of the fitting surface of the assembly to be bonded in the groove, the first airbag controls the fluid volume according to the sensor data to adjust the pressure, and the first controller adjusts the airbag The amount of fluid is to ensure smooth adhesion of the tape.
Through this fitting fixture, the tape can be effectively avoided, the fitting effect between the tape and the component to be fitted can be improved, and the flatness and stability of the fitting process can be ensured.
Smart Images
Figure CN119388781A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of display panels, and in particular to a laminating jig, a laminating device and a laminating method. Background Art
[0002] With the development of display technology, display devices are applied to more and more electronic devices. In the production process of display devices, there is a process of attaching insulating tape, but in these processes, there is usually a problem of the insulating tape being lifted up during attachment. Summary of the invention
[0003] In view of this, the main technical problem to be solved by the present application is the problem of tape curling up when the tape is bonded to the bonding surface of the component to be bonded, thereby providing a bonding jig, a bonding device and a bonding method, which are helpful to improve the bonding effect between the tape and the component to be bonded.
[0004] In order to solve the above technical problems, a technical solution adopted in the present application is to provide a bonding jig, which includes a pressure head, a first sensor, a first airbag and a first controller, wherein the pressure head includes a pressure surface, a groove is provided on the pressure surface, and the groove includes a bottom wall and a side wall; the first sensor is arranged in the groove and on the bottom wall, and is used to measure the distance from the bonding surface of the component to be bonded to the bottom wall of the groove during the bonding process; the first airbag is arranged in the groove and on the bottom wall; the first controller is used to control the amount of fluid filled in the first airbag according to the data measured by the first sensor.
[0005] The present application also includes a second technical solution, which provides a bonding device including any of the bonding jigs described above.
[0006] The present application also includes a third technical solution, which provides a bonding method, the method comprising:
[0007] Place the tape on the bonding surface of the component to be bonded;
[0008] The laminating jig is placed on the side of the tape away from the component to be laminated, and the pressing surface of the pressing head is facing the tape and the groove is arranged corresponding to the component area of the component to be laminated;
[0009] The pressure head is controlled to move toward the tape to press the tape onto the component to be bonded, wherein during the pressing process of the pressure head, the first controller controls the amount of fluid filled into the first airbag according to data measured by the first sensor.
[0010] The beneficial effect is as follows: Different from the prior art, the present application provides a bonding jig, which includes a pressure head, a first sensor, a first airbag and a first controller. The pressure head includes a pressure surface, a groove is provided on the pressure surface, and the groove includes a bottom wall and a side wall; the first sensor is arranged in the groove and on the bottom wall, and is used to measure the distance from the bonding surface of the component to be bonded to the bottom wall of the groove during the bonding process; the first airbag is arranged in the groove and on the bottom wall; the first controller is used to control the amount of fluid filled in the first airbag according to the data measured by the first sensor. Among them, the first controller can control the appropriate amount of fluid to be filled in the first airbag according to the data measured by the first sensor, so that the pressure head can indirectly apply pressure to the tape through the first airbag, so that the tape is attached more smoothly, and the bonding effect between the component to be bonded and the tape is effectively guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:
[0012] Figure 1 It is a schematic diagram of the structure of a bonding jig and components to be bonded in one embodiment of the present application;
[0013] Figure 2 yes Figure 1 A bottom view of the lamination fixture;
[0014] Figure 3 yes Figure 1 Schematic diagram of the structure of the middle lamination fixture during the pressing process;
[0015] Figure 4 is a schematic structural diagram of a bonding jig and components to be bonded in another embodiment of the present application;
[0016] Figure 5 It is a schematic diagram of a process of an implementation method of the present application. DETAILED DESCRIPTION
[0017] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0018] It should be noted that the terms "first" and "second" in this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.
[0019] In one embodiment of the present application, Figure 1 and Figure 2 The laminating jig 10 includes a pressing head 100, a first sensor 200, a first airbag 300 and a first controller (not shown in the figure).
[0020] The pressing head 100 includes a pressing surface 110. During the bonding process, the pressing head 100 applies bonding pressure to the tape through the pressing surface 110, so that the tape is bonded to the component to be bonded 900. The material of the pressing head 100 includes at least one of metal and plastic, and the present application does not limit the material of the pressing head 100. The component to be bonded 900 may be a circuit board, which includes a substrate and a plurality of components 112 soldered on the substrate.
[0021] A groove 111 is provided on the pressing surface 110, and the groove 111 includes a bottom wall 1111 and a side wall 1112. The assembly 900 to be bonded is provided with a component area and a non-component area, and the component area is provided with components 112. During the bonding process, the groove 111 and the component area on the assembly 900 to be bonded are provided correspondingly, so as to prevent the pressing head 100 from interfering with the component 112 during the pressing process, and to prevent the pressing head 100 from damaging the component 112 during the pressing process.
[0022] The first sensor 200 is disposed in the groove 111 and on the bottom wall 1111, and is used to measure the distance between the bonding surface 910 of the component to be bonded 900 and the bottom wall 1111 during the bonding process. The bonding surface 910 of the component to be bonded 900 refers to the surface of the component to be bonded 900 facing the pressure head 100.
[0023] The first airbag 300 is disposed in the groove 111 and on the bottom wall 1111. The first airbag 300 can be inflated or deflated by a pneumatic component. During the process of the pressure head 100 applying pressure, by inflating the first airbag 300, the pressure head 100 can indirectly apply pressure to the adhesive tape through the first airbag 300, ensuring that the adhesive tape can be more evenly attached to the bonding surface 910 of the component to be bonded 900, and the first airbag 300 can also provide a buffer to prevent the pressure head 100 from damaging the component to be bonded 900 during the downward pressing process.
[0024] The first controller is used to control the amount of fluid filled into the first airbag 300 according to the data measured by the first sensor 200. Specifically, the first sensor 200 measures the distance between the bonding surface 910 of the assembly 900 to be bonded and the bottom wall 1111. The first controller can control the amount of fluid filled into the first airbag 300 according to the distance measured by the first sensor 200, so that the pressure head 100 can better apply pressure to the adhesive tape through the first airbag 300. For example, when the first sensor 200 measures that the distance between the bonding surface 910 of the assembly 900 to be bonded and the bottom wall 1111 is large, the first controller controls the amount of fluid filled into the first airbag 300 to be large, and when the first sensor 200 measures that the distance between the bonding surface 910 of the assembly 900 to be bonded and the bottom wall 1111 is small, the first controller controls the amount of fluid filled into the first airbag 300 to be small, so that the pressure head 100 can better apply pressure to the adhesive tape during the pressure application process.
[0025] In one embodiment, the first sensor 200 includes an optical fiber sensor. The optical fiber sensor can measure the distance using optical principles, and has high measurement accuracy and fast response speed. Of course, in other embodiments, other sensors may be used, such as a laser distance sensor, an infrared distance sensor, or an ultrasonic distance sensor. There are no excessive restrictions in this application, as long as the first sensor 200 can be used to measure the distance between the bonding surface 910 of the assembly 900 to be bonded and the bottom wall 1111.
[0026] In one embodiment, see Figure 2 , there are multiple first airbags 300, there are multiple first sensors 200, the first sensor 200 corresponds to at least one first airbag 300, and the first controller controls the amount of fluid filled into the first airbag 300 corresponding to the first sensor 200 according to the data measured by the first sensor 200. Specifically, one first sensor 200 may correspond to one first airbag 300, or may correspond to multiple first airbags 300, for example, the first sensor 200 may correspond to two, three or more first airbags 300 to reduce the cost.
[0027] In one embodiment, one first sensor 200 corresponds to one first airbag 300, and each first airbag 300 has a first sensor 200 corresponding to its measurement data. The first controller controls the amount of fluid filled into the first airbag 300 corresponding to the first sensor 200 according to the data measured by the first sensor 200. Specifically, considering that the assembly 900 to be bonded may include components 112 of different heights, the bonding surface 910 of the assembly 900 to be bonded may have ups and downs, so that the distance between each position on the bonding surface 910 of the assembly 900 to be bonded and the bottom wall 1111 may also change. Therefore, in order for the pressure head 100 to allow the tape to bond with each component 112 in the assembly 900 to be bonded at the same time during the pressure application process, the first sensor 200 and the first airbag 300 are set one by one, so that the amount of fluid filled into each first airbag 300 better meets the bonding requirements.
[0028] For a better understanding, see Figure 1 and Figure 3 , which is explained here with examples:
[0029] Assume that the assembly 900 to be bonded includes a plurality of components 112, the plurality of components 112 include a first component 112A and a second component 112B, and the height of the first component 112A is smaller than the height of the second component 112B. Then, the distance between the bonding surface 910 at the first component 112A and the bottom wall 1111 is greater than the distance between the bonding surface 910 at the second component 112B and the bottom wall 1111. Then, during the process of the pressing head 100 pressing down, the gas filled into the first airbag 300 corresponding to the first component 112A is greater than the gas filled into the first airbag 300 corresponding to the second component 112B.
[0030] In one embodiment, the structures of the plurality of first airbags 300 and the structures of the plurality of first sensors 200 are the same to reduce costs. In other embodiments, the structures of the plurality of first airbags 300 and the structures of the plurality of first sensors 200 may be different, and this application does not limit this.
[0031] In one embodiment, in combination Figure 1 and Figure 2 , multiple first airbags 300 are arranged in an array on the bottom wall 1111 of the groove 111. Specifically, the first airbags 300 are closely arranged in a regular array to ensure the best layout efficiency, so that more first airbags 300 can be covered on the bottom wall 1111 of the groove 111, so that a larger range of the component 900 to be bonded can contact the first airbags 300, and the pressure head 100 can indirectly press the component 900 to be bonded through the first airbags 300 to a greater extent, so that the component 900 to be bonded can be bonded more smoothly.
[0032] In one embodiment, a plurality of first airbags 300 are evenly arranged on the bottom wall 1111 of the groove 111 , and each first airbag 300 maintains a uniform interval between each other.
[0033] In one embodiment of the present application, Figure 4 The laminating jig 10 further includes a second airbag 500, a second sensor 600 and a second controller (not shown in the figure).
[0034] The second airbag 500 is arranged in the groove 111 and on the side wall 1112. During the bonding process, the second airbag 500 can make the side of the component 900 to be bonded fit more closely with the tape, avoiding the phenomenon of the tape warping.
[0035] The second sensor 600 is arranged in the groove 111 and on the side wall 1112, and is used to measure the distance from the side wall of the component 900 to be bonded to the side wall 1112 of the groove 111 during the bonding process. The second controller is used to control the amount of fluid filled in the second airbag 500 according to the data measured by the second sensor 600.
[0036] Specifically, during the bonding process, when the edge of the tape is less than 4 mm from the component 112, the edge of the tape is too close to the component 112, so the tape is prone to lift up during the bonding process. However, in this embodiment, a second airbag 500 is provided on the side wall 1112 of the groove 111, and a second controller is provided to control the amount of fluid filled in the second airbag 500 according to the data measured by the second sensor 600. The adaptive effect of the second airbag 500 ensures that the tape is attached to the component 112.
[0037] In one embodiment, the first sensor 200 and the second sensor 600 are of the same type, which may be an optical fiber sensor, a laser ranging sensor, an infrared ranging sensor, or an ultrasonic ranging sensor, etc. In other embodiments, the first sensor 200 and the second sensor 600 may be of different types, which may be specifically configured according to actual needs.
[0038] In one embodiment, the first controller is reused as the second controller, that is, the first controller is the second controller, so that the amount of fluid filled into the first airbag 300 and the second airbag 500 is controlled by the first controller. This solution directly uses the first controller as the second controller, which can reduce the number of components of the bonding fixture 10 and reduce production costs. In other embodiments, the first controller and the second controller can also be two different controllers.
[0039] In one embodiment, the material of the first airbag 300 is the same as the material of the second airbag 500. In other embodiments, the material of the first airbag 300 and the material of the second airbag 500 may also be different.
[0040] In one embodiment of the present application, the pressure head 100 is provided with a first through hole (not shown in the figure), the first through hole is connected to the first airbag 300, and the fluid is filled into the first airbag 300 through the first through hole, and the volume of the first airbag 300 changes after the fluid is filled. In other embodiments, the pressure head 100 may also include a second through hole (not shown in the figure), the second through hole is connected to the second airbag 500, and the fluid is filled into the second airbag 500 through the second through hole, and the volume of the second airbag 500 changes after the fluid is filled.
[0041] In one embodiment of the present application, the fluid filled into the first airbag 300 includes at least one of gas and liquid, the gas includes at least one of nitrogen, carbon dioxide, and oxygen, and the liquid includes at least one of water, ethanol, and sodium chloride. In other words, the fluid filled into the first airbag 300 may be gas, liquid, or a mixture of gas and liquid.
[0042] In one embodiment of the present application, the material of the first airbag 300 includes silicone. Silicone has high elasticity. When fluid is filled in the first airbag 300, the volume of the first airbag 300 will expand due to its elasticity. Secondly, silicone has high softness. When the first airbag 300 contacts the component 900 to be bonded, the pressure head 100 indirectly applies pressure to the component 900 to be bonded through the first airbag 300. The first airbag 300 can play a buffering role, thereby ensuring that the components 112 of the component 900 to be bonded will not be damaged.
[0043] The present application also protects a bonding device, including any of the bonding jigs 10 described above. For details, please refer to the above-mentioned related contents, which will not be repeated here.
[0044] This application also protects a bonding method, combined with Figures 1 to 5 The method is applied to any of the above-mentioned laminating jigs 10, and the method comprises:
[0045] S100: placing an adhesive tape on the bonding surface 910 of the component 900 to be bonded.
[0046] Specifically, the tape can be an insulating tape, including a polyimide tape, and the component 900 to be bonded can be a flexible circuit board. Attaching the insulating tape to the flexible circuit board can improve the reliability and stability of the entire circuit and reduce the occurrence of problems such as circuit short circuits and poor contact.
[0047] S200 : placing the laminating jig 10 on the side of the tape away from the component 900 to be laminated, with the pressing surface 110 of the pressing head 100 facing the tape and the groove 111 arranged corresponding to the component area of the component 900 to be laminated.
[0048] It can be understood that the pressing surface 110 is the side of the pressing head 100 facing the tape, and the groove 111 is provided on the pressing surface 110 . The shape of the groove 111 is consistent with the shape of the component area of the assembly 900 to be bonded.
[0049] S300 : Control the pressure head 100 to move toward the tape to press the tape onto the component to be bonded 900 , wherein during the pressing process of the pressure head 100 , the first controller controls the amount of fluid filled into the first airbag 300 according to data measured by the first sensor 200 .
[0050] Specifically, the pressure head 100 can apply pressure to the tape so that the tape can be attached to the component to be bonded 900. The first control component can control the amount of fluid filled into the first airbag 300 through the data measured by the first sensor 200, thereby controlling the volume of the first airbag 300 and allowing the first airbag 300 to contact the tape. In this way, the pressure head 100 can indirectly apply pressure to the tape through the first airbag 300 to ensure perfect bonding between the tape and the component to be bonded 900.
[0051] The above description is only an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A laminating jig, characterized in that: The laminating jig comprises: A pressure head, the pressure head comprising a pressure surface, a groove is formed on the pressure surface, and the groove comprises a bottom wall and a side wall; A first sensor is arranged in the groove and on the bottom wall, and is used to measure the distance between the bonding surface of the component to be bonded and the bottom wall of the groove during the bonding process; a first air bag, disposed in the groove and on the bottom wall; The first controller is used to control the amount of fluid filled into the first airbag according to the data measured by the first sensor.
2. The laminating jig according to claim 1, characterized in that: The first sensor comprises a fiber optic sensor.
3. The laminating jig according to claim 1, characterized in that: There are a plurality of first airbags, a plurality of first sensors, and the first sensor corresponds to at least one of the first airbags. The first controller controls the amount of fluid filled into the first airbag corresponding to the first sensor according to data measured by the first sensor. Preferably, the structures of the plurality of first airbags are the same, and / or the structures of the plurality of first sensors are the same.
4. The laminating jig according to claim 3, characterized in that: The first sensor corresponds to one of the first airbags.
5. The laminating jig according to claim 3, characterized in that: A plurality of the first air bags are arranged in an array on the bottom wall of the groove; Preferably, a plurality of the first airbags are evenly arranged on the bottom wall of the groove.
6. The laminating jig according to claim 1, characterized in that: The laminating jig further comprises: a second air bag disposed in the groove and on the side wall; A second sensor is arranged in the groove and on the side wall, and is used to measure the distance from the side wall of the component to be bonded to the side wall of the groove during the bonding process; a second controller, configured to control the amount of fluid filled into the second airbag according to data measured by the second sensor; Preferably, the first sensor is of the same type as the second sensor; Preferably, the first controller is multiplexed as the second controller; Preferably, the material of the first airbag is the same as that of the second airbag.
7. The laminating jig according to claim 1, characterized in that: The pressure head is provided with a first through hole, the first through hole is communicated with the first air bag, and the fluid is filled into the first air bag through the first through hole; Preferably, the fluid filled into the first airbag includes at least one of gas and liquid, the gas includes at least one of nitrogen, carbon dioxide and oxygen, and the liquid includes at least one of water, ethanol and sodium chloride.
8. The laminating jig according to claim 1, characterized in that: The material of the first airbag includes silica gel.
9. A laminating device, characterized in that: It comprises the laminating jig as described in any one of claims 1 to 8.
10. A bonding method, characterized in that: The method is applied to the bonding jig according to any one of claims 1 to 8, and the method comprises: Place the tape on the bonding surface of the component to be bonded; The laminating jig is placed on the side of the tape away from the component to be laminated, and the pressing surface of the pressing head is facing the tape and the groove is arranged corresponding to the component area of the component to be laminated; The pressure head is controlled to move toward the tape to press the tape onto the component to be bonded, wherein during the pressing process of the pressure head, the first controller controls the amount of fluid filled into the first airbag according to data measured by the first sensor.