Display module and display device

Abstract

The embodiment of the invention provides a display module and a display device, relates to the technical field of display, and is used for reducing the risk that a driving chip is damaged due to deformation of the driving chip caused by stress of a display panel. The display module comprises a display panel, a display panel and a driving chip. The display panel comprises a main body part, a binding part and a bending part located between the main body part and the binding part. The main body part is provided with a display side and a non-display side which are oppositely arranged, and the bending part is bent towards the non-display side of the main body part, so that the binding part is bent to the non-display side of the main body part. At least one supporting layer is located between the main body part and the binding part and connected with the main body part and the binding part, and at least one supporting layer is provided with a first blocking hole. The driving chip is located on the binding part and located on the side, away from the main body part, of the binding part. And the orthographic projection of the driving chip on the reference surface is at least partially overlapped with the orthographic projection of the first blocking hole on the reference surface. The display module is used for displaying images.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the rapid development of display technology, display technologies such as liquid crystal display (LCD), organic light emitting display (OLED), quantum dot light emitting display (QLED) and mini / micro light emitting display (MLED) have been widely used in people's daily lives. For example, smart phones, wearable watches, televisions, laptops and car displays have gradually spread in people's lives. Summary of the invention

[0003] The purpose of the embodiments of the present disclosure is to provide a display module and a display device, which are used to reduce the risk of deformation of a driver chip caused by force on a display panel, thereby causing damage to the driver chip.

[0004] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0005] On the one hand, a display module is provided. The display module includes a display panel, a display panel and a driver chip. The display panel includes a main body, a binding part and a bending part located between the main body and the binding part. The main body has a display side and a non-display side arranged opposite to each other, and the bending part is bent toward the non-display side of the main body so that the binding part is bent to the non-display side of the main body. The at least one supporting layer is located between the main body and the binding part, and is connected to the main body and the binding part, and at least one supporting layer is provided with a first blocking hole. The driver chip is located on the binding part, and is located on the side of the binding part away from the main body. The orthographic projection of the driver chip on the reference surface at least partially overlaps with the orthographic projection of the first blocking hole on the reference surface. Wherein, the reference surface is the plane where the display surface of the main body of the display panel is located.

[0006] In the above display module, there is at least one supporting layer provided with a first blocking hole, and the orthographic projection of the driver chip on the reference surface at least partially overlaps with the orthographic projection of the first blocking hole on the reference surface. In this way, the first blocking hole can prevent the deformation of the main body from being transmitted to the driver chip, thereby reducing the risk of deformation of the driver chip and the risk of damage to the driver chip.

[0007] In some embodiments, the display module includes multiple supporting layers. The display module also includes at least one adhesive layer, and there is an adhesive layer between two adjacent supporting layers in the multiple supporting layers. Among the at least one adhesive layer, at least one adhesive layer is provided with a second blocking hole, and the orthographic projection of the driving chip on the reference surface at least partially overlaps with the orthographic projection of the second blocking hole on the reference surface.

[0008] In some embodiments, along a direction perpendicular to the main body and pointing from the main body to the binding part, the multi-layer support layer includes a first support layer and a second support layer, the density of the first support layer is greater than the density of the second support layer, the second support layer is provided with the first barrier hole, and the first barrier hole penetrates the second support layer.

[0009] The at least one adhesive layer includes a first adhesive layer, the first adhesive layer is located between the first supporting layer and the second supporting layer, the first adhesive layer is provided with a second blocking hole, and the second blocking hole passes through the first adhesive layer.

[0010] In some embodiments, an orthographic projection of the first blocking hole on the reference plane substantially coincides with an orthographic projection of the second blocking hole on the reference plane.

[0011] In some embodiments, the orthographic projection of the driver chip on the reference surface is located within the range of the orthographic projection of the blocking hole on the reference surface, and the distance between the boundary of the orthographic projection of the driver chip on the reference surface and the boundary of the orthographic projection of the blocking hole on the reference surface is greater than or equal to 0.5 mm.

[0012] In some embodiments, the display module further includes a heat sink, the heat sink is located in the blocking hole, and the orthographic projection of the heat sink on the reference plane at least partially overlaps with the orthographic projection of the driving chip on the reference plane.

[0013] In some embodiments, the display module further includes an electromagnetic shielding component, the electromagnetic shielding component is located in the blocking hole, and an orthographic projection of the electromagnetic shielding component on the reference plane at least partially overlaps with an orthographic projection of the driving chip on the reference plane.

[0014] In some embodiments, the display module further includes a buffer component, the buffer component is located in the blocking hole, and an orthographic projection of the buffer component on the reference surface at least partially overlaps with an orthographic projection of the driving chip on the reference surface.

[0015] In some embodiments, the display module further includes a second adhesive layer, and the second adhesive layer includes a first adhesive pattern and a second adhesive pattern. The first adhesive pattern is located between the at least one supporting layer and the binding portion. The second adhesive pattern is located between the at least one supporting layer and the binding portion, and between the first adhesive pattern and the bending portion. The thickness of the second adhesive pattern is greater than that of the first adhesive pattern, and there is a gap between the second adhesive pattern and the first adhesive pattern. The driving chip is arranged on a side of the first adhesive pattern away from the main body.

[0016] In some embodiments, the display module further includes a flexible glass and a first protective layer. The flexible glass is located on the display side of the main body, the orthographic projection of the flexible glass on the reference surface covers the orthographic projection of the display panel on the reference surface, and the boundary of the orthographic projection of the flexible glass on the reference surface is spaced from the boundary of the orthographic projection of the display panel on the reference surface. The first protective layer is located on a side of the flexible glass close to the display panel, the first protective layer is at least partially located on the edge of the flexible glass that exceeds the display panel, and the first protective layer surrounds the display panel.

[0017] In some embodiments, an outer boundary of an orthographic projection of the first protection layer on the reference surface is located outside a boundary of an orthographic projection of the flexible glass on the reference surface.

[0018] In some embodiments, the elastic modulus of the material of the first protective layer is smaller than the elastic modulus of the flexible glass.

[0019] In some embodiments, the display module also includes a second protective layer, which is located on a side of the flexible glass away from the display panel and is arranged along an edge of the flexible glass, and an outer boundary of the orthographic projection of the second protective layer on the reference plane is located outside the boundary of the orthographic projection of the flexible glass on the reference plane.

[0020] In some embodiments, the distance between the outer boundary of the orthographic projection of the first protective layer on the reference surface and the boundary of the orthographic projection of the flexible glass on the reference surface is greater than or equal to 0.1 mm. And / or, the distance between the outer boundary of the orthographic projection of the second protective layer on the reference surface and the boundary of the orthographic projection of the flexible glass on the reference surface is greater than or equal to 0.1 mm.

[0021] In some embodiments, an outer boundary of the first protective layer is at least partially substantially flush with an outer boundary of the second protective layer.

[0022] In some embodiments, the material of the first protective layer includes polyimide or polyethylene terephthalate; in the case where the second protective layer is included, the material of the second protective layer includes polyimide or polyethylene terephthalate.

[0023] In some embodiments, the display module further includes a covering layer and a third adhesive layer. The covering layer is located on a side of the flexible glass away from the display panel, and the orthographic projection of the covering layer on the reference surface covers the orthographic projection of the flexible glass on the reference surface. The third adhesive layer is located between the covering layer and the flexible glass, the orthographic projection of the third adhesive layer on the reference surface is located within the orthographic projection of the flexible glass on the reference surface, and the boundary of the orthographic projection of the third adhesive layer on the reference surface is spaced from the boundary of the orthographic projection of the flexible glass on the reference surface. In the case where the display module includes a second protective layer, the second protective layer is at least partially located on the edge portion of the flexible glass that exceeds the third adhesive layer, and surrounds the third adhesive layer.

[0024] In some embodiments, the display module further includes: a buffer layer located between the flexible glass and the display panel, and / or a light shielding layer located between the flexible glass and the display panel, wherein the light shielding layer is configured to shield ultraviolet light.

[0025] In another aspect, a display device is provided, comprising: a display panel as described in any of the above embodiments and a housing, wherein the display module is located in the housing.

[0026] The above-mentioned display device has the same structure and beneficial technical effects as the display panels provided in some of the above-mentioned embodiments, which will not be described in detail here.

[0027] In some embodiments, the housing includes a bottom plate, a frame, and a top frame. The bottom plate is located on the non-display side of the display module, the frame surrounds the bottom plate and is arranged around the periphery of the display module, the top frame is located on the display side of the display module, the top frame is arranged in a ring shape along the edge of the flexible glass of the display module, and the first protective layer is at least partially in contact with the top frame.

[0028] In some embodiments, the inner boundary of the orthographic projection of the top frame on the reference plane is located within the range of the orthographic projection of the flexible glass on the reference plane, and the distance between the inner boundary of the orthographic projection of the top frame on the reference plane and the boundary of the orthographic projection of the flexible glass on the reference plane is greater than or equal to 2 mm.

[0029] In some embodiments, the main body of the display panel in the display module has a display area and a peripheral area surrounding the display area, and the inner boundary of the orthographic projection of the top frame on the reference plane is located within the orthographic projection of the peripheral area on the reference plane. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0031] Figure 1 is a structural diagram of a display device according to some embodiments;

[0032] Figure 2 is another structural diagram of a display device according to some embodiments;

[0033] Figure 3 is another structural diagram of a display device according to some embodiments;

[0034] Figure 4 is another structural diagram of a display device according to some embodiments;

[0035] Figure 5A is a structural diagram of a foldable display device according to some embodiments;

[0036] Figure 5B is a structural diagram of a foldable display device according to some embodiments;

[0037] Figure 6 for Figure 1 A cross-sectional view along section line CC;

[0038] Figure 7 is a structural diagram of a flattened state of a display module according to some embodiments;

[0039] Figure 8 for Figure 5A A cross-sectional view along section line DD;

[0040] Fig. 9 for Figure 5A Another cross-sectional view along section line DD;

[0041] Fig.10 for Figure 5AAnother cross-sectional view along section line DD;

[0042] Fig.11 for Figure 5A Another cross-sectional view along section line DD;

[0043] Fig.12 for Figure 5A Another cross-sectional view along section line DD;

[0044] Fig.13 for Figure 5A Another cross-sectional view along section line DD;

[0045] Fig.14 for Figure 5A Another cross-sectional view along section line DD;

[0046] Fig.15 for Figure 5A Another cross-sectional view along section line DD;

[0047] Fig.16 for Figure 5A Another cross-sectional view along section line DD;

[0048] Fig.17 is a flow chart of a method for preparing a first protective layer according to some embodiments;

[0049] Fig.18 is a flow chart of a method for preparing a second protective layer according to some embodiments;

[0050] Fig.19 for Figure 5A Another cross-sectional view along section line DD;

[0051] Fig. 20 for Figure 5A Another cross-sectional view along section line DD;

[0052] Fig.21 for Figure 5A Another cross-sectional view along section line DD;

[0053] Fig. 22 is a structural diagram of a display module in a folded state according to some embodiments;

[0054] Fig.23 for Figure 5A Another cross-sectional view along section line DD;

[0055] Fig.24 for Figure 5A Another cross-sectional view along section line DD;

[0056] Fig.25for Figure 5A Another cross-sectional view along section line DD;

[0057] Fig.26 for Figure 5A Another cross-sectional view along section line DD. DETAILED DESCRIPTION

[0058] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0059] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0060] Terms such as "first" and "second" are used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one component from other components. For example, an element referred to as a first element in one embodiment can be referred to as a second element in another embodiment without departing from the scope of the appended claims. Unless otherwise mentioned, terms in the singular may include plural forms.

[0061] When describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0062] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0063] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0064] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0065] As used herein, "about" or "approximately" includes the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0066] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0067] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0068] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0069] In this specification, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as those commonly understood by ordinary technicians in the field to which this application belongs. It will be further understood that, unless explicitly defined herein, terms (such as terms defined in a general dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and should not be interpreted as an ideal or overly formal meaning.

[0070] In the present disclosure, terms such as "lower", "below", "above" and "upper" and the like are used to explain the relationship association of components shown in the drawings. The terms may be relative concepts and described based on the directions shown in the drawings, but are not limited thereto.

[0071] The term "overlap" or "overlapping" means that a first object may be above or below a second object or to the side of the second object, and vice versa. Additionally, the term "overlap" may include stacking, stacking, facing or facing, extending over, covering or partially covering, or any other suitable term that will be appreciated and understood by a person of ordinary skill in the art.

[0072] like Figure 1 As shown, some embodiments of the present disclosure provide a display device 1000 , which may be any device that displays anything, whether in motion (eg, video) or fixed (eg, still image), and whether in text or image.

[0073] For example, Figure 1 As shown, the display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a vehicle display, a flight display, a wearable device, a virtual reality (VR) device, etc.

[0074] For example, Figure 2 and Figure 3 As shown, the display device 1000 may be a wearable device, and the wearable device may be as follows Figure 2 Round watches as shown or Figure 3 For another example, the display device 1000 may be a mobile phone, and the mobile phone may be as shown in FIG. Figure 4 The candy bar phone shown in the figure can also be Figure 5A and Figure 5B The foldable phone shown in.

[0075] The display device 1000 may be any one of a flat display device, a curved display device, a foldable display device or a rollable display device.

[0076] The following takes the above-mentioned display device 1000 as a foldable display device as an example to schematically illustrate some embodiments of the present disclosure, but the implementation of the present disclosure is not limited to this, and any other display device 1000 can also be considered as long as the same technical concept is applied.

[0077] The foldable display device 1000 includes an inner folding display device and an outer folding display device.

[0078] In some embodiments, Figure 1 As shown, the display device 1000 includes a display module 100. The display module 100 includes a display panel 10.

[0079] The display panel 10 may be: an organic light emitting diode display panel, a quantum dot light emitting diode display panel, a micro light emitting diode display panel, a liquid crystal display panel, a plasma display panel, a field emission display panel, an electrowetting display panel or an electrophoretic display panel, etc., and the embodiments of the present disclosure are not specifically limited here.

[0080] The following takes the above-mentioned display panel 10 as an organic light emitting diode display panel as an example to schematically illustrate some embodiments of the present disclosure, but the implementation of the present disclosure is not limited to this, and any other display panel can also be considered as long as the same technical concept is applied.

[0081] like Figure 1 and Figure 6 As shown, the display panel 10 includes a substrate 11 , and a plurality of sub-pixels P and an encapsulation layer 12 disposed on the substrate 11 .

[0082] The substrate 11 is a flexible substrate, which may be a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate (PEN) substrate, or a polyimide (PI) substrate.

[0083] In some embodiments, Figure 1 As shown, the plurality of sub-pixels P may be arranged in a plurality of rows and columns, for example, a row of sub-pixels P includes a plurality of sub-pixels P arranged along a first direction X, and a column of sub-pixels P includes a plurality of sub-pixels P arranged along a second direction Y. The first direction X is substantially perpendicular to the second direction Y.

[0084] The plurality of sub-pixels P may include a first sub-pixel emitting a first color, a second sub-pixel emitting a second color, and a third sub-pixel emitting a third color. The first color, the second color, and the third color are three primary colors. For example, the first color is red, the second color is blue, and the third color is green, which is not specifically limited in the embodiments of the present disclosure.

[0085] like Figure 6 As shown, each sub-pixel P includes a pixel circuit 14 and a light-emitting device 15 disposed on a substrate 11 .

[0086] The pixel circuit 14 includes a plurality of thin film transistors 141 and a storage capacitor 142 .

[0087] In some embodiments, the thin film transistor 141 is, for example, an oxide thin film transistor. The oxide thin film transistor has a high carrier mobility, which can improve the response speed of the thin film transistor 141 .

[0088] The thin film transistor 141 includes an active layer 1411, a source electrode 1412, a drain electrode 1413 and a gate electrode 1414. The source electrode 1412 and the drain electrode 1413 are respectively in contact with the active layer 1411. The storage capacitor 142 includes a first electrode plate 1421 and a second electrode plate 1422 which are arranged opposite to each other.

[0089] It should be noted that the source 1412 and the drain 1413 can be interchanged. Figure 6 1412 represents a drain, and 1413 represents a source.

[0090] like Figure 6As shown, the light emitting device 15 includes a first electrode 151, a light emitting functional layer 152 and a second electrode 153. The first electrode 151 can be electrically connected to a source 1412 or a drain 1413 of a thin film transistor 141 serving as a driving transistor among the plurality of thin film transistors 141. Figure 6 In the figure, the first electrode 151 is electrically connected to the drain electrode 1413 of the thin film transistor 141. The material of the first electrode 151 includes indium tin oxide (ITO) or silver (Ag). The material of the second electrode includes aluminum (Al), Ag or magnesium (Mg).

[0091] It should be noted that the first electrode 151 is the anode of the light-emitting device 15, and the second electrode 153 is the cathode of the light-emitting device 15; or, the first electrode 151 is the cathode of the light-emitting device 15, and the second electrode 153 is the anode of the light-emitting device 15. The following takes the first electrode 151 as the anode of the light-emitting device 15 and the second electrode 153 as the cathode of the light-emitting device 15 as an example to exemplarily illustrate the embodiments of the present disclosure. Figure 6 As shown, the second electrode 321 (cathode) is a whole-layer structure, that is, the voltage values ​​on the second electrodes 321 of different light-emitting devices 15 are equal.

[0092] Among them, the above-mentioned light-emitting functional layer 152 may include only a light-emitting layer, or, in addition to the light-emitting layer, may also include at least one of an electron transport layer (Election Transporting Layer, abbreviated as: ETL), an electron injection layer (Election Injection Layer, abbreviated as: EIL), a hole transport layer (Hole Transporting Layer, abbreviated as: HTL) and a hole injection layer (Hole Injection Layer, abbreviated as: HIL).

[0093] The encapsulation layer 12 is located on the side of the second electrode 152 away from the first electrode 151. The encapsulation layer 12 may be an encapsulation film. In some embodiments, the encapsulation layer 12 may include a layer of encapsulation film, or may include two or more layers of encapsulation films stacked in a stacked manner. For example, the encapsulation layer includes three layers of encapsulation films stacked in sequence.

[0094] When the encapsulation layer 12 includes three layers of encapsulation films stacked in sequence, the material of the encapsulation film in the middle layer is an organic material, and the materials of the encapsulation films on both sides are inorganic materials. The organic material may be, for example, polymethyl methacrylate (PMMA) or PI.

[0095] like Figure 1 to Figure 5BAs shown, the display panel 10 includes a display area A and a peripheral area B disposed on at least one side of the display area A. Figure 1 to Figure 5B In the figure, the peripheral area B is arranged around the display area A for illustration.

[0096] like Figure 1 As shown, the display area A is the area for displaying images and is configured to set a plurality of pixel units 13, and the peripheral area B is the area for not displaying images and is configured to set a display driving circuit, for example, a gate driving circuit and a source driving circuit.

[0097] On the basis of the above embodiment, the display panel 10 includes at least one bending area 101 and at least two non-bending areas 102 .

[0098] In some examples, such as Figure 5A and Figure 5B As shown, the display panel 10 may include a bending area 101 and two non-bending areas 102 .

[0099] For example, Figure 5A As shown, the bending area 101 extends along the first direction X, and the two non-bending areas 102 are respectively arranged on both sides of the bending area 101 along the second direction Y. Two adjacent non-bending areas 102 are connected through the bending area 101. That is, at least two non-bending areas 102 are arranged at intervals along the second direction Y, and any two adjacent non-bending areas 102 are connected through a bending area 101.

[0100] Or, for example, Figure 5B As shown, the bending area 101 extends along the second direction Y, and the two non-bending areas 102 are respectively arranged on both sides of the bending area 101 along the first direction X. Two adjacent non-bending areas 102 are connected through the bending area 101. That is, at least two non-bending areas 102 are arranged at intervals along the first direction X, and any two adjacent non-bending areas 102 are connected through a bending area 101.

[0101] like Figure 5A and Figure 5B As shown, some embodiments of the present disclosure are schematically described below by taking the above-mentioned display panel 10 including one bending area 101 and two non-bending areas 102 as an example, but the implementation mode of the present disclosure is not limited to this, and a display panel 10 with multiple bending areas 101 and multiple non-bending areas 102 can also be considered, as long as the same technical concept is applied.

[0102] For example, Figure 5A and Figure 5B As shown, the two non-bending regions 102 may be symmetrically arranged with respect to the bending region 101 , so that after the display panel 10 is bent, the ends of the two non-bending regions 102 away from the bending region 101 are flush.

[0103] In addition, when the display device 1000 is an inward folding display device 1000, after the display panel 10 is folded, the two non-bending regions 102 of the display panel 10 are stacked face to face. When the display device 1000 is an outward folding display device 1000, the two non-bending regions 102 of the display panel 10 are stacked back to back.

[0104] It is understandable that when the display panel 10 is bent (curled or folded), the bending area 101 is bent, and the non-bending area 102 remains flat. It is understandable that the bending area 101 and the non-bending area 102 are divided based on whether deformation occurs during the bending process of the display device, and the structures of the two areas may be the same.

[0105] Exemplarily, in the process of manufacturing the display panel 10, a plurality of sub-pixels P are formed on the same substrate 11, for example, a substrate using polyimide. Then, a first region and second regions disposed on both sides of the first region are divided on the display panel 10. The substrate 11 and the sub-pixels P included in the first region constitute a bending region 101, and the substrate 11 and the sub-pixels P included in the second region constitute a non-bending region 102.

[0106] As can be seen from the above, the bending area 101 and the non-bending area 102 may be identical in structure. However, the two are in different states when the display panel 10 is bent. For example, during the bending process of the display panel 10, the bending area 101 will bend accordingly, while the non-bending area 102 remains in its original state (in a flat state).

[0107] In some embodiments, Figure 7 As shown, the display module 100 further includes a circuit board 20 , and the circuit board 20 can be bound to the display panel 10 at an end of the display panel 10 .

[0108] In some embodiments, Figure 7 As shown, the display panel 10 includes a main body 110, a bending portion 120 and a binding portion 130 which are connected in sequence. The bending portion 120 is located on one side of the main body 110, and the binding portion 130 is located on the side of the bending portion 120 away from the main body 110, that is, the bending portion 120 is located between the main body 110 and the binding portion 130.

[0109] like Figure 7 As shown, the main body 110 may be a portion of the display panel 10 for displaying images. Figure 2 to Figure 5B ) is located in the main body 110, that is, the main body 110 has a display area A (as shown Figure 2 to Figure 5B shown).

[0110] like Figure 7As shown, the main body 110 has a display side 110A and a non-display side 110B that are arranged opposite to each other. It should be noted that the display side 110A refers to the side of the main body 110 that displays an image ( Figure 7 The non-display side 110B refers to the other side opposite to the display side 110A ( Figure 7 The lower side of the middle main body portion 110).

[0111] Among them, Figure 2 to Figure 5B As shown, the main body 110 may also include a partial area of ​​the peripheral area B. For example, Figure 2 to Figure 5B As shown, the orthographic projection of the main body 110 on the reference plane is generally any one of a circle, an ellipse, a rectangle, etc., which is not specifically limited in the embodiment of the present disclosure.

[0112] It should be noted that the reference plane is the plane where the display surface of the main body 110 of the display panel 10 is located. The display surface refers to a side surface of the main body 110 for displaying image information.

[0113] In this article, "substantially circular or elliptical" means that the shape is circular or elliptical as a whole, but is not limited to a standard circular or elliptical shape. That is, the "circular or elliptical" here includes not only a substantially circular or elliptical shape, but also a shape similar to a circular or elliptical shape.

[0114] In this article, "substantially rectangular" means that the shape is rectangular as a whole, but is not limited to a standard rectangle. That is, the "rectangle" here includes not only a basic rectangular shape, but also a shape similar to a rectangle. For example, the long side and the short side of the rectangle are curved at each intersection (i.e., at the corner), that is, the corner is smooth and the shape is a rounded rectangle. Figure 5A and Figure 5B The main body 110 shown in FIG. 1 is roughly projected as a rounded rectangle on the reference plane as an example for description.

[0115] like Figure 7 As shown, the binding portion 130 may be a portion of the display panel 10 used to bind and connect with the circuit board 20. Figure 8 As shown, through the bending process, the bending portion 120 can be bent along the bending axis extending in the first direction X toward the non-display side 110B of the main body 110 of the display panel 10, so that the binding portion 130 is bent to the non-display side 110B of the main body 110, thereby reducing the display device 1000 (such as Figure 5A and Figure 5B The bending axis is not an actual structure in the display panel 10, but is only a concept proposed to illustrate the bending process of the display panel 10.

[0116] like Figure 8As shown, after the binding portion 130 is bent, the circuit board 20 can be bent along with the display panel 10 to the non-display side 110B of the main body 110 to achieve the purpose of reducing the frame of the display device 1000. Figure 8 As shown, part of the circuit board 20 is located on a side of the main body 110 close to the binding part 130 and bonded to the main body 110 , and part of the circuit board 20 is located on a side of the binding part 130 away from the main body 110 and bound to the binding part 130 .

[0117] It should be noted that the bending radius of the bending portion 120 may be 0.1 mm to 0.5 mm; for example, the bending radius of the bending portion 120 may be any one of 0.1 mm, 0.2 mm, 0.3 mm, 0.35 mm, 0.4 mm and 0.5 mm.

[0118] It should be understood that the smaller the bending radius of the bending portion 120 is, the smaller the frame of the display device 1000 corresponding to the bending portion 120 (eg Figure 5A and Figure 5B The lower frame in the display device 1000 can be designed to be narrower, which is more conducive to the narrow frame design of the display device 1000. Exemplarily, the bending radius of the bending portion 120 can be 0.1mm to 0.2mm. For example, the bending radius of the bending portion 120 can be any one of 0.12mm, 0.15mm and 0.18mm, so that the frame of the display device 1000 corresponding to the bending portion 120 (such as Figure 5A and Figure 5B The bottom border in the image can be made narrower.

[0119] Based on the above embodiments, Figure 8 As shown, the display module 100 further includes at least one supporting layer 30 and a driving chip 40 .

[0120] like Figure 8 As shown, at least one supporting layer 30 is located between the main body 110 and the binding part 130, and at least one supporting layer 30 is connected to the main body 110 and the binding part 130. The supporting layer 30 is configured to support the display panel. The material of the supporting layer 30 may include at least one of stainless steel, aluminum or copper.

[0121] like Figure 8 As shown, the at least one support layer 30 is bonded to the main body through the fourth adhesive layer 4. The material of the fourth adhesive layer 4 may include optical adhesive (English: Optically Clear Adhesive, referred to as: OCA) or pressure sensitive adhesive (English: Pressure Sensitive Adhesive, referred to as: PSA). Exemplarily, the at least one support layer 30 is bonded to the main body 110 through the pressure sensitive adhesive.

[0122] like Figure 8As shown, the at least one supporting layer 30 is bonded to the binding portion 130 via the second adhesive layer 2 , and the material of the second adhesive layer 2 includes foam adhesive or mesh adhesive. Exemplarily, the at least one supporting layer 30 is bonded to the binding portion 130 via the mesh adhesive.

[0123] Here, the grid glue includes a plurality of intersecting vertical and horizontal lines. The arrangement of the horizontal and vertical lines in the grid glue allows the air between the grid glue and the support layer 30 or the binding part 130 to be better discharged when the grid glue is pasted, thereby reducing the probability of bubble generation, so that the grid glue can be more flat when it is attached to the support layer 30 or the binding part 130, and the tightness of the bonding between the support layer 30 and the binding part 130 can be improved.

[0124] For example, Fig. 9 As shown, the second adhesive layer 2 includes a first adhesive pattern 201 and a second adhesive pattern 202. The first adhesive pattern 201 is located between at least one supporting layer 30 and the binding portion 130, and is bonded to at least one supporting layer 30 and the binding portion 130. The second adhesive pattern 202 is located between at least one supporting layer 30 and the binding portion 130, and is bonded to at least one supporting layer 30 and the binding portion 130. The second adhesive pattern 202 is also located between the first adhesive pattern 201 and the bending portion 120. The thickness of the second adhesive pattern 202 is greater than that of the first adhesive pattern 201, and there is a gap between the second adhesive pattern 202 and the first adhesive pattern 201.

[0125] In this way, the portion of the binding portion 130 that is bonded to the first adhesive pattern 201 has a larger space away from the main body 110, that is, Fig. 9 As shown, the space below the portion of the binding portion 130 bonded to the first adhesive pattern 201 is relatively large, thereby providing installation space for other components such as the driver chip 40 and the circuit board 20 .

[0126] like Figure 8 As shown, the driving chip 40 is configured to provide the display panel 10 with data signals required for displaying images.

[0127] like Figure 8 and Fig. 9 As shown, the driving chip 40 can be disposed on the binding portion 130 , so that the driving chip 40 can provide the data signal required for displaying the picture to the main body 110 through the binding portion 130 and the bending portion 120 to control the display panel 10 to display the image.

[0128] Here, the driving chip 40 includes at least one of microchips such as a source driving chip, a touch chip, a timing controller, and a gamma circuit, which is not specifically limited in the embodiments of the present disclosure.

[0129] like Fig. 9As shown, on the basis of the above embodiment, and in the case where the second adhesive layer 2 includes a first adhesive pattern 201 and a second adhesive pattern 202, the driving chip 40 is arranged on the side of the first adhesive pattern 201 away from the main body 110, that is, the orthographic projection of the driving chip 40 on the reference surface is located within the orthographic projection of the first adhesive pattern 201 on the reference surface.

[0130] By configuring in this way, the thickness of the display module 100 can be reduced, which is beneficial for making the display device 1000 thinner and lighter.

[0131] Exemplarily, the difference between the thickness of the second adhesive pattern 202 and the thickness of the first adhesive pattern 201 is greater than or equal to the thickness of the driving chip 40 .

[0132] That is, after the driver chip 40 is installed, the surface of the driver chip 40 is away from the main body 110, and is closer to the main body 110 than the surface of the portion of the binding portion 130 bonded to the second adhesive pattern 202. Alternatively, the surface of the driver chip 40 is away from the main body 110, and is substantially flush with the surface of the portion of the binding portion 130 bonded to the second adhesive pattern 202.

[0133] In this case, the thickness of the display module 100 can be further reduced.

[0134] In the related art, when a force is applied to the main body, the force will cause the main body to deform, and the deformation can be transmitted to the driver chip through the main body, at least one supporting layer and the binding part, thereby causing the driver chip to deform and thus damage the driver chip.

[0135] In order to solve the above problems, Fig. 9 As shown, in the embodiment of the present disclosure, there is at least one support layer 30 provided with a first blocking hole 301, and the orthographic projection of the driving chip 40 on the reference surface at least partially overlaps with the orthographic projection of the first blocking hole 301 on the reference surface. The first blocking hole 301 may be a blind hole or a through hole.

[0136] In this way, the first blocking hole 301 can prevent the deformation of the main body 110 from being transmitted to the driver chip 40 , thereby reducing the risk of deformation of the driver chip 40 and reducing the risk of damage to the driver chip 40 .

[0137] In some embodiments, Fig.10As shown, the display module 100 includes a support layer 30, that is, the display module 100 includes a first support layer 31, the first support layer 31 is located between the main body 110 and the binding part 130, and the orthographic projection of the first support layer 31 on the reference surface at least covers the orthographic projection of the display area A on the reference surface. The first support layer 31 and the main body 110 are bonded by the fourth adhesive layer 4, and the first support layer 31 and the binding part 130 are bonded by the second adhesive layer 2. The first support layer 31 is provided with a first blocking hole 301.

[0138] For example, Fig.10 As shown, the first blocking hole 301 is a blind hole, and the opening direction of the blind hole is toward the binding part 130 , that is, the surface of the first supporting layer 31 close to the binding part 130 has an opening, and the surface of the first supporting layer 31 away from the binding part 130 has no opening.

[0139] In this case, each area within the outer boundary of the first supporting layer 31 has the first supporting layer 31. When the main body 110 is subjected to a force, each part of the main body 110 located in the display area A can be supported by the first supporting layer 31, so that the surface of the main body 110 located in the display area A close to the first supporting layer 31 can be relatively flat, that is, there is no height difference between the surface of the main body 110 in the display area A and the first supporting layer 31, thereby reducing the risk of film printing on the display panel 10.

[0140] Or, for example, Fig.11 As shown, the first blocking hole 301 is a through hole. Thus, the first blocking hole 301 has a larger size along a direction perpendicular to the main body 110, which can further block the deformation generated by the main body 110 from being transmitted to the driving chip 40, thereby reducing the risk of deformation of the driving chip 40 and reducing the risk of damage to the driving chip 40.

[0141] In other embodiments, Fig.12 As shown, the display module 100 includes a plurality of support layers 30 and at least one adhesive layer.

[0142] The multi-layer supporting layer 30 is located between the main body 110 and the binding part 130, and the multi-layer supporting layer 30 is connected to the main body 110 and the binding part 130. There is an adhesive layer between two adjacent layers of the multi-layer supporting layer 30, and the two adjacent layers of the supporting layer 30 are bonded by the adhesive layer. At least one of the adhesive layers (all the adhesive layers between the multi-layer supporting layers 30) has a second blocking hole 302, and the orthographic projection of the driving chip 40 on the reference surface at least partially overlaps with the orthographic projection of the second blocking hole 302 on the reference surface.

[0143] In this way, the second blocking hole 302 can prevent the deformation of the main body 110 from being transmitted to the driver chip 40 , thereby reducing the risk of deformation of the driver chip 40 and the risk of damage to the driver chip 40 .

[0144] In some examples, such as Fig.12 As shown, along a direction perpendicular to the main body 110 and pointing from the main body 110 to the binding portion 130, the multilayer support layer 30 includes a first support layer 31 and a second support layer 32, and the density of the first support layer 31 is greater than the density of the second support layer 32. For example, the material of the first support layer 31 includes stainless steel, and the material of the second support layer 32 includes titanium or aluminum.

[0145] In this case, the weight of the multi-layer support layer 30 can be reduced, thereby reducing the weight of the display module 100, which is conducive to the thinness of the display device 1000. The first support layer 31 and the main body 110 are bonded by the fourth adhesive layer 4, and the second support layer 32 and the binding part 130 are bonded by the second adhesive layer 2.

[0146] On this basis, in order to reduce the weight of the multi-layer support layer 30 and ensure the support strength of the multi-layer support layer 30, the thickness of the first support layer 31 is 30 μm to 100 μm, and the thickness of the second support layer 32 is 150 μm to 200 μm.

[0147] For example, the thickness of the first support layer 31 is 30 μm, 36 μm, 40 μm, 60 μm, 65 μm, 75 μm, 83 μm,

[0148] The thickness of the second support layer 32 is 150 μm, 155 μm, 161 μm, 168 μm,

[0149] Any one of 172μm, 180μm, 185μm, 194μm and 200μm.

[0150] For example, Fig.12 As shown, only the second supporting layer 32 is provided with the first blocking hole 301 , and the first blocking hole 301 penetrates the second supporting layer 32 .

[0151] In this way, on the one hand, each area within the outer boundary of the first supporting layer 31 has the first supporting layer 31, and when the main body 110 is subjected to a force, each part of the main body 110 located in the display area A can be supported by the first supporting layer 31, so that the surface of the main body 110 located in the display area A close to the first supporting layer 31 can be relatively flat, thereby reducing the risk of film printing in the display area A.

[0152] On the other hand, since the thickness of the second supporting layer 32 is greater than that of the first supporting layer 31, the second supporting layer 32 is provided with a first blocking hole 301, and the first blocking hole 301 penetrates the second supporting layer, so that the size of the first blocking hole 301 in a direction perpendicular to the main body 110 can be larger, which can further block the deformation generated by the main body 110 from being transmitted to the driving chip 40, thereby reducing the risk of deformation of the driving chip 40 and reducing the risk of damage to the driving chip 40.

[0153] Or, for example, Fig.13 As shown, only the first support layer 31 is provided with the first blocking hole 301.

[0154] In this way, since the density of the first supporting layer 31 is relatively high, arranging the first blocking hole 301 on the first supporting layer 31 can greatly reduce the weight of the multi-layer supporting layer 30, thereby reducing the weight of the display module 100, which is conducive to the thinness of the display device 1000.

[0155] Or, for example, Fig.14 As shown, the first support layer 31 is provided with a first blocking hole 301 , and the second support layer 32 is provided with a first blocking hole 301 .

[0156] Arranged in this way, the first blocking hole 301 has a larger size along the direction perpendicular to the main body 110, which can further block the deformation of the main body 110 from being transmitted to the driver chip 40, thereby reducing the risk of deformation of the driver chip 40 and reducing the risk of damage to the driver chip 40.

[0157] In addition, if Figure 12 to Figure 14 As shown, at least one adhesive layer includes an adhesive layer, that is, the display module 100 includes a first adhesive layer 1, and the first adhesive layer 1 is located between the first support layer 31 and the second support layer 32, and is bonded to the first support layer 31 and the second support layer 32. The first adhesive layer 1 is provided with a second blocking hole 302, and the second blocking hole 302 penetrates the first adhesive layer 1. The material of the first adhesive layer 1 includes a fluorinated ethylene propylene copolymer layer (English: Fluorinated Ethylene Propylene, referred to as: FEP).

[0158] Based on the above embodiments, Figure 12 to Figure 14 As shown, the orthographic projection of the first blocking hole 301 on the reference plane substantially coincides with the orthographic projection of the second blocking hole 302 on the reference plane.

[0159] In this way, the first barrier hole 301 and the second barrier hole 302 can be formed in a one-step etching process, which can reduce the process steps of the display module 100 and reduce the manufacturing cost of the display module 100 .

[0160] In some embodiments, Figure 12 to Figure 14 As shown, the orthographic projection of the driver chip 40 on the reference surface is within the range of the orthographic projection of the blocking hole on the reference surface, and the distance between the boundary of the orthographic projection of the driver chip 40 on the reference surface and the boundary of the orthographic projection of the blocking hole on the reference surface is greater than or equal to 0.5 mm.

[0161] It should be noted that the blocking hole includes the first blocking hole 301 and / or the second blocking hole 302. In addition, the blocking holes mentioned below all include the first blocking hole 301 and / or the second blocking hole 302, which will not be described in detail in the embodiment of the present disclosure.

[0162] For example, the distance between the boundary of the orthographic projection of the driving chip 40 on the reference surface and the boundary of the orthographic projection of the blocking hole on the reference surface is one of 0.5 mm, 0.55 mm, 0.61 mm, 0.7 mm and 0.85 mm.

[0163] In this way, the blocking hole can block the deformation of the main body 110 from being transmitted to the driver chip 40 to the greatest extent, thereby reducing the risk of deformation of the driver chip 40 and reducing the risk of damage to the driver chip 40.

[0164] Exemplarily, the orthographic projection of the driver chip 40 on the reference surface is located within the range of the orthographic projection of the first blocking hole 301 on the reference surface, and the distance between the boundary of the orthographic projection of the driver chip 40 on the reference surface and the boundary of the orthographic projection of the first blocking hole 301 on the reference surface is greater than or equal to 0.5 mm.

[0165] For example, the distance between the boundary of the orthographic projection of the driving chip 40 on the reference surface and the boundary of the orthographic projection of the first blocking hole 301 on the reference surface is one of 0.5 mm, 0.55 mm, 0.61 mm, 0.7 mm and 0.85 mm.

[0166] Or, exemplarily, the orthographic projection of the driver chip 40 on the reference surface is located within the range of the orthographic projection of the second blocking hole 302 on the reference surface, and the distance between the boundary of the orthographic projection of the driver chip 40 on the reference surface and the boundary of the orthographic projection of the second blocking hole 302 on the reference surface is greater than or equal to 0.5 mm.

[0167] For example, the distance between the boundary of the orthographic projection of the driving chip 40 on the reference surface and the boundary of the orthographic projection of the second blocking hole 302 on the reference surface is one of 0.5 mm, 0.55 mm, 0.61 mm, 0.7 mm and 0.85 mm.

[0168] Alternatively, exemplarily, the orthographic projection of the driver chip on the reference surface is located within the range of the orthographic projection of the first blocking hole 301 on the reference surface, and the distance between the boundary of the orthographic projection of the driver chip 40 on the reference surface and the boundary of the orthographic projection of the first blocking hole 301 on the reference surface is greater than or equal to 0.5 mm.

[0169] For example, the distance between the boundary of the orthographic projection of the driving chip 40 on the reference surface and the boundary of the orthographic projection of the first blocking hole 301 on the reference surface is one of 0.5 mm, 0.55 mm, 0.61 mm, 0.7 mm and 0.85 mm.

[0170] Moreover, the orthographic projection of the driving chip 40 on the reference surface is located within the range of the orthographic projection of the second blocking hole 302 on the reference surface, and the distance between the boundary of the orthographic projection of the driving chip 40 on the reference surface and the boundary of the orthographic projection of the second blocking hole 302 on the reference surface is greater than or equal to 0.5 mm.

[0171] For example, the distance between the boundary of the orthographic projection of the driving chip 40 on the reference surface and the boundary of the orthographic projection of the second blocking hole 302 on the reference surface is one of 0.5 mm, 0.55 mm, 0.61 mm, 0.7 mm and 0.85 mm.

[0172] In some embodiments, Fig.15 As shown, the display module 100 further includes a heat sink 50 , which is located in the blocking hole. The orthographic projection of the heat sink 50 on the reference plane at least partially overlaps with the orthographic projection of the driving chip 40 on the reference plane.

[0173] In this case, the heat generated by the driving chip 40 can be transferred to the heat sink 50 , and the heat sink 50 transfers the heat to the atmosphere, which can improve the heat dissipation efficiency of the driving chip 40 and increase the service life of the driving chip 40 .

[0174] The material used for the heat sink 50 includes at least one of copper, silver, gold, graphite and boron nitride. For example, the material used for the heat sink 50 includes graphite. Graphite has a high heat dissipation coefficient, which is beneficial to improving the heat dissipation efficiency of the driver chip 40.

[0175] In some examples, such as Fig.15 As shown, along the direction perpendicular to the main body 110, the size of the heat sink 50 is smaller than or equal to the size of the blocking hole. In other words, the end of the heat sink 50 close to the binding portion is farther away from the binding portion 130 than the end of the blocking hole close to the binding portion 130; or, the end of the heat sink 50 close to the binding portion 130 is roughly flush with the end of the blocking hole close to the binding portion 130.

[0176] In this case, the problem of the heat sink 50 protruding out of the blocking hole causing the binding portion 130 to deform can be improved, the risk of the binding portion 130 deforming and causing the driver chip 40 to deform can be reduced, and the risk of damage to the driver chip 40 can be reduced.

[0177] In other embodiments, Fig.15 As shown, the display module 100 further includes an electromagnetic shielding member 60 , which is located in the blocking hole. The orthographic projection of the electromagnetic shielding member 60 on the reference plane at least partially overlaps with the orthographic projection of the driving chip 40 on the reference plane.

[0178] In this case, the electromagnetic shielding member 60 can reduce the influence of electromagnetic waves outside the driving chip 40 on the driving chip 40. The electromagnetic shielding member 60 is made of a wave absorbing material, for example, the electromagnetic shielding member 60 includes at least one of copper, aluminum and nickel.

[0179] In some examples, as shown in the figure, the size of the electromagnetic shielding member 60 is smaller than or equal to the size of the blocking hole in a direction perpendicular to the main body 110. That is, the end of the electromagnetic shielding member 60 close to the binding portion 130 is farther away from the binding portion 130 than the end of the blocking hole close to the binding portion 130; or, the end of the electromagnetic shielding member 60 close to the binding portion 130 is substantially flush with the end of the blocking hole close to the binding portion 130.

[0180] In this case, the problem of the electromagnetic shielding component 60 protruding out of the blocking hole causing the binding portion 130 to deform can be improved, the risk of the binding portion 130 deforming and causing the driver chip 40 to deform can be reduced, and the risk of damage to the driver chip 40 can be reduced.

[0181] In some other embodiments, Fig.15 As shown, the display module 100 further includes a buffer member 70 , which is located in the blocking hole. The orthographic projection of the buffer member 70 on the reference surface at least partially overlaps with the orthographic projection of the driving chip 40 on the reference surface.

[0182] In this case, the buffer 70 can generate a certain deformation after being subjected to stress (tensile stress or compressive stress), and the stress generated inside the buffer 70 is released by the deformation of the buffer 70 itself, which can prevent the deformation generated by the main body 110 from being transmitted to the driver chip 40, thereby reducing the risk of deformation of the driver chip 40 and the risk of damage to the driver chip 40. The material used for the buffer 70 includes foam or rubber.

[0183] In some examples, such as Fig.15As shown, along the direction perpendicular to the main body 110, the size of the buffer 70 is smaller than or equal to the size of the blocking hole. In other words, the end of the buffer 70 close to the binding portion 130 is farther away from the binding portion 130 than the end of the blocking hole close to the binding portion 130; or, the end of the buffer 70 close to the binding portion 130 is roughly flush with the end of the blocking hole close to the binding portion 130.

[0184] In this case, the problem of deformation of the binding portion 130 caused by the protrusion of the buffer member 70 from the blocking hole can be improved, the risk of deformation of the binding portion 130 causing deformation of the driving chip 40 can be reduced, and the risk of damage to the driving chip 40 can be reduced.

[0185] In some embodiments, Figure 7 As shown, the display module 100 further includes a back film 80 , and the back film 80 is located on the non-display side of the display panel 10 .

[0186] In some examples, such as Figure 8 to Figure 15 As shown, the back film 80 may include, for example, a first sub-back film 801 and a second sub-back film 802 , and the first sub-back film 801 and the second sub-back film 802 are disconnected at the bending portion 120 .

[0187] The first sub-back film 801 at least partially overlaps the main body 110 in a direction perpendicular to the main body 110. The second sub-back film 802 at least partially overlaps the binding part 130, and the second sub-back film 802 can be bent along the binding part 130 to the non-display side 110B of the main body 110 of the display panel 10.

[0188] In this case, the back film 80 exposes the bending portion 120 of the display panel 10, which can reduce the bending resistance of the bending portion 120 of the display panel 10 and change the position of the force-neutral layer of the bending portion 120 of the display panel 10 during the bending process, thereby reducing the risk of damage to the display panel 10.

[0189] In some examples, such as Figure 8 to Figure 15 As shown, the orthographic projection of the boundary of the main body 110 on the reference surface is located within the range of the orthographic projection of the boundary of the first sub-back film 801 on the reference surface, that is, the first sub-back film 801 covers the main body 110, and the side of the first sub-back film 801 close to the second sub-back film 802 extends to the bending portion 120. The orthographic projection of the boundary of the binding portion 130 on the reference surface is located within the range of the orthographic projection of the boundary of the second sub-back film 802 on the reference surface, that is, the second sub-back film 802 covers the binding portion 130, and the side of the second sub-back film 802 close to the first sub-back film 801 extends to the bending portion 120.

[0190] In this case, during the bending process of the display panel 10, stress concentration at the junction of the main body 110, the bending portion 120 and the binding portion 130 can be avoided, thereby reducing the risk of cracks or breakage of the display panel 10 at the junction of the main body 110, the bending portion 120 and the binding portion 130.

[0191] In some embodiments, Figure 6 As shown, the display panel 10 further includes a black matrix 17 , which is disposed on a side of the light emitting device 15 away from the substrate 11 .

[0192] It should be noted that the black matrix 17 is configured to separate the light emitted from different sub-pixels P, and has the function of reducing the reflected light generated after the external ambient light enters the interior of the display panel 10 .

[0193] In addition, if Figure 6 As shown, the display panel 10 further includes a color filter 18, which is disposed on a side of the light emitting device 15 away from the substrate 11. When the display panel 10 includes a black matrix 17, the color filter 18 is disposed on a side of the black matrix 17 away from the substrate 11.

[0194] It should be noted that the color filter 18 can filter out light of most wavelength bands in the external ambient light, thereby reducing the reflection intensity of the external ambient light on the display panel 10 .

[0195] Among them, Figure 6 As shown, the color filter 18 includes a plurality of filter patterns 181 , and the orthographic projection of a pixel opening 16 on the substrate 11 is located within the range of the orthographic projection of a filter pattern 181 on the substrate 11 .

[0196] Here, if Figure 6 As shown, the shape of the filter pattern 181 can be substantially the same as the shape of the pixel opening 16 , or can be different from the shape of the pixel opening 16 . Figure 6 In the figure, the shape of the filter pattern 181 is substantially the same as the shape of the pixel opening 16 .

[0197] It should be noted that the material of the above-mentioned filter pattern 181 includes organic material. For example, the material of the filter pattern 181 includes at least one of polymethyl methacrylate, a general polymer of polystyrene, a polymer derivative with a phenol group, an acryl polymer, an imide polymer, an aromatic ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer and a vinyl alcohol polymer.

[0198] In some other embodiments, the display panel 10 may further include a polarizer. The polarizer may be disposed on a side of the light emitting device 15 away from the substrate 11 . The polarizer may be a flexible member.

[0199] In this way, by selecting light with a certain polarization direction to pass through the polarizer, the reflection intensity of the external ambient light on the display panel 10 can be reduced.

[0200] In some embodiments, Fig.16 As shown, the display module 100 further includes flexible glass 90 (ultra-thin glass). The flexible glass 90 refers to glass having a thickness less than or equal to a first threshold, for example, the first threshold is 0.1 mm.

[0201] like Fig.16 As shown, the flexible glass 90 is located on the display side of the main body 110, and the orthographic projection of the flexible glass 90 on the reference surface covers the orthographic projection of the display panel 10 on the reference surface, and the boundary of the orthographic projection of the flexible glass 90 on the reference surface is spaced from the boundary of the orthographic projection of the display panel on the reference surface, that is, the boundary of the flexible glass 90 exceeds the boundary of the display panel 10. The orthographic projection of the flexible glass 90 on the reference surface covers the orthographic projection of the display panel 10 on the reference surface, which means that the orthographic projection of the flexible glass 90 on the reference surface coincides with the orthographic projection of the display panel 10 on the reference surface. Alternatively, the orthographic projection on the reference surface and the orthographic projection of the display panel 10 on the reference surface are located within the range of the orthographic projection of the flexible glass 90 on the reference surface.

[0202] In this case, on the one hand, when an object collides with the display module 100 or the display module 100 collides with the ground, the object will first collide with the flexible glass 90 instead of touching the display panel 10. In this way, the flexible glass 90 can reduce the risk of objects outside the display module 100 directly colliding with the display panel 10 and causing damage to the display panel 10.

[0203] On the other hand, when an object moves in a direction parallel to the main body 110, the object will first hit the edge of the flexible glass 90 and will not hit the edge of the display panel 10. In this way, the flexible glass 90 can also reduce the risk of objects outside the display module 100 directly colliding with the edge of the display panel 10 and causing damage to the display panel 10.

[0204] In addition, in order to bond the flexible glass 90 and the display panel 10 , the display module 100 further includes a top optically clear adhesive layer 9 (English: Top Optically Clear Adhesive; abbreviated as TOCA). The top optical adhesive layer 9 is located between the flexible glass 90 and the display panel 10 , and the top optical adhesive layer 9 is configured to bond the flexible glass 90 and the display panel 10 .

[0205] like Fig.16As shown, the display module 100 further includes a first protective layer 210 . The first protective layer 210 is located on a side of the flexible glass 90 close to the display panel 10 . The first protective layer 210 is at least partially located on an edge portion of the flexible glass 90 that exceeds the display panel 10 . The first protective layer 210 surrounds the display panel 10 .

[0206] That is to say, at least part of the area of ​​the edge portion of the flexible glass 90 that extends beyond the display panel 10 is supported, that is, at least part of the area of ​​the edge portion of the flexible glass 90 that extends beyond the display panel 10 will not be in a suspended state. When the flexible glass 90 is subjected to a force, the force will be transmitted to the first protective layer 210 through the edge portion of the flexible glass 90 that extends beyond the display panel 10, and then the force will be dispersed to the first protective layer 210. In this way, the risk of stress concentration in the edge portion of the flexible glass 90 that extends beyond the display panel 10 and causing the flexible glass 90 to break can be reduced.

[0207] In some embodiments, Fig.16 As shown, the outer boundary of the orthographic projection of the first protection layer 210 on the reference surface is located outside the boundary of the orthographic projection of the flexible glass 90 on the reference surface.

[0208] In this way, when an object moves in a direction parallel to the main body 110, the object will first hit the edge of the first protective layer 210 and will not hit the edge of the flexible glass 90. The first protective layer 210 can reduce the risk of objects outside the display module 100 directly colliding with the edge of the flexible glass 90 and causing damage to the display panel 10.

[0209] Exemplarily, a distance between an outer boundary of an orthographic projection of the first protection layer 210 on the reference surface and a boundary of an orthographic projection of the flexible glass 90 on the reference surface is greater than or equal to 0.1 mm.

[0210] For example, the distance between the outer boundary of the orthographic projection of the first protection layer 210 on the reference surface and the boundary of the orthographic projection of the flexible glass 90 on the reference surface is one of 0.1 mm, 0.15 mm, 0.22 mm, 0.30 mm, 0.42 mm, 0.48 mm and 0.5 mm.

[0211] In some embodiments, the elastic modulus of the first protective layer 210 is less than the elastic modulus of the flexible glass 90 .

[0212] In this case, the first protective layer 210 may be formed by laser cutting.

[0213] In some examples, the elastic modulus of the first protective layer 210 is greater than or equal to 3 GPa.

[0214] For example, the elastic modulus of the first protective layer 210 is one of 3 GPa, 3.6 GPa, 4 GPa, 5.3 GPa, 5.8 GPa and 6 GPa.

[0215] The elastic modulus of the flexible glass 90 is greater than or equal to 7 GPa.

[0216] For example, the elastic modulus of the flexible glass 90 is one of 7 GPa, 7.5 GPa, 8.1 GPa, 8.9 GPa, 9.5 GPa, and 10 GPa.

[0217] Exemplarily, the outer boundary of the orthographic projection of the first protection layer 210 on the reference surface coincides with the boundary of the orthographic projection of the flexible glass 90 on the reference surface.

[0218] The first protective layer 210 can be formed by the following preparation method: Fig.17 As shown, the manufacturing method of the display device 1000 includes S100 to S200.

[0219] S100 , attaching a first initial protective layer 211 to a side of the flexible glass 90 close to the display panel 10 .

[0220] The first initial protective layer 211 is at least partially located on the edge portion of the flexible glass 90 that extends beyond the display panel 10, the inner boundary of the orthographic projection of the first initial protective layer 211 on the reference plane is located within the boundary of the orthographic projection of the flexible glass 90 on the reference plane, the outer boundary of the orthographic projection of the first initial protective layer 211 on the reference plane is located within the boundary of the orthographic projection of the flexible glass 90 on the reference plane, and the first initial protective layer 211 surrounds the display panel 10.

[0221] S200 , using a laser to cut the first initial protection layer 211 along a first cutting line to form a first protection layer 210 .

[0222] The second cutting line is the boundary of the flexible glass 90 .

[0223] In some embodiments, the material of the first protection layer 210 includes polyimide or polyethylene terephthalate. The thickness of the first protection layer 210 is 20 μm to 300 μm.

[0224] For example, the thickness of the first protection layer 210 is one of 20 μm, 30 μm, 34 μm, 38 μm, 42 μm, 45 μm, 51 μm, 55 μm, 60 μm, 100 μm, 150 μm, 210 μm, 260 μm, and 300 μm.

[0225] On the basis of the above embodiment, in order to bond the first protective layer 210 and the flexible glass 90, the display module 100 further includes a sixth adhesive layer 6. The sixth adhesive layer 6 is located between the first protective layer 210 and the flexible glass 90, and is configured to bond the ultra-thin glass and the first protective layer 210. Exemplarily, the material of the sixth adhesive layer 6 is a pressure-sensitive adhesive. The elastic modulus of the sixth adhesive layer 6 is 10KPa to 50KPa.

[0226] For example, the elastic modulus of the sixth adhesive layer 6 is one of 10 KPa, 11 KPa, 15 KPa, 19 KPa, 20 KPa, 25 KPa, 33 KPa, 39 KPa, 40 KPa, 45 KPa and 50 KPa.

[0227] In some embodiments, Fig.16 As shown, the display module 100 further includes a second protective layer 220. The second protective layer 220 is located on a side of the flexible glass 90 away from the display panel 10 and is arranged along the edge of the flexible glass 90, and the outer boundary of the orthographic projection of the second protective layer 220 on the reference plane is located outside the boundary of the orthographic projection of the flexible glass 90 on the reference plane.

[0228] In this case, when an object moves in a direction parallel to the main body 110, the object will first hit the edge of the second protective layer 220 and will not hit the edge of the flexible glass 90. In this way, the second protective layer 220 can also reduce the risk of objects outside the display module 100 directly colliding with the edge of the flexible glass 90 and causing damage to the flexible glass 90.

[0229] Exemplarily, the outer boundary of the orthographic projection of the second protection layer 220 on the reference surface and the boundary of the orthographic projection of the flexible glass 90 on the reference surface are greater than or equal to 0.1 mm.

[0230] For example, the distance between the outer boundary of the orthographic projection of the second protection layer 220 on the reference surface and the boundary of the orthographic projection of the flexible glass 90 on the reference surface is one of 0.1 mm, 0.15 mm, 0.22 mm, 0.30 mm, 0.42 mm, 0.48 mm and 0.5 mm.

[0231] In some embodiments, the elastic modulus of the second protective layer 220 is less than the elastic modulus of the flexible glass 90 .

[0232] In this case, the second protective layer 220 may be formed by laser cutting.

[0233] In some examples, the elastic modulus of the second protective layer 220 is greater than or equal to 3 GPa.

[0234] For example, the elastic modulus of the second protective layer 220 is one of 3 GPa, 3.6 GPa, 4 GPa, 5.3 GPa, 5.8 GPa, and 6 GPa.

[0235] The elastic modulus of the flexible glass 90 is greater than or equal to 7GP.

[0236] For example, the elastic modulus of the flexible glass 90 is one of 7 GPa, 7.5 GPa, 8.1 GPa, 8.9 GPa, 9.5 GPa, and 10 GPa.

[0237] Exemplarily, the outer boundary of the orthographic projection of the second protective layer 220 on the reference surface is located outside the boundary of the orthographic projection of the flexible glass 90 on the reference surface. The second protective layer 220 can be formed by the following preparation method, such as Fig.18 As shown, the manufacturing method of the display device 1000 includes S210 to S220.

[0238] S210 , attaching a second initial protective layer 221 to a side of the flexible glass 90 away from the display panel 10 .

[0239] The second initial protective layer 221 is at least partially located on the edge portion of the flexible glass 90 that extends beyond the display panel 10, the inner boundary of the orthographic projection of the second initial protective layer 221 on the reference plane is located within the boundary of the orthographic projection of the flexible glass 90 on the reference plane, the outer boundary of the orthographic projection of the second initial protective layer 221 on the reference plane is located within the boundary of the orthographic projection of the flexible glass 90 on the reference plane, and the second initial protective layer 221 surrounds the display panel 10.

[0240] S220 , using a laser to cut the second initial protection layer 221 along a second cutting line to form a second protection layer 220 .

[0241] The boundary of the second cutting line is the boundary of the second protective layer 220 , and the outer boundary of the orthographic projection of the boundary of the second protective layer 220 on the reference plane is located outside the boundary of the orthographic projection of the flexible glass 90 on the reference plane.

[0242] It should be noted that the above S220 and S200 can be performed in the same process step. In this way, the process steps of the display device 1000 can be reduced, and the manufacturing cost of the display device 1000 can be reduced.

[0243] For example, Fig.16 As shown, the outer boundary of the first protective layer 210 is at least partially substantially flush with the outer boundary of the second protective layer 220. In the process of forming the protective layer by laser cutting materials, the first protective layer 210 and the second protective layer 220 can be formed simultaneously.

[0244] On the basis of the above embodiment, in order to bond the second protective layer 220 and the flexible glass 90, the display module 100 further includes a seventh adhesive layer 7. The seventh adhesive layer 7 is located between the second protective layer 220 and the flexible glass 90, and is configured to bond the flexible glass 90 and the second protective layer 220. Exemplarily, the material of the seventh adhesive layer 7 is a pressure-sensitive adhesive. The elastic modulus of the seventh adhesive layer 7 is 10KPa to 50KPa.

[0245] For example, the elastic modulus of the seventh adhesive layer 7 is one of 10 KPa, 11 KPa, 15 KPa, 19 KPa, 20 KPa, 25 KPa, 33 KPa, 39 KPa, 40 KPa, 45 KPa and 50 KPa.

[0246] In some embodiments, the material of the second protective layer 220 can be the same as that of the first protective layer 210. For example, the material of the first protective layer 210 and the material of the second protective layer 220 are both polyimide; for another example, the material of the first protective layer 210 and the material of the second protective layer 220 are both polyethylene terephthalate.

[0247] Alternatively, the material of the second protective layer 220 may be different from the material of the first protective layer 210. For example, the material of the first protective layer 210 is polyimide, and the material of the second protective layer 220 is polyethylene terephthalate; for another example, the material of the first protective layer 210 includes polyethylene terephthalate, and the material of the second protective layer 220 is polyimide.

[0248] In some embodiments, Fig.19 As shown, the display module 100 further includes a covering layer 230 and a third adhesive layer 3. The covering layer is located on a side of the flexible glass 90 away from the display panel 10, and the orthographic projection of the covering layer 230 on the reference surface covers the orthographic projection of the flexible glass 90 on the reference surface.

[0249] In this case, when an object collides with the display module 100 or the display module 100 collides with the ground, the object or the ground will first hit the covering layer 230 and will not hit the flexible glass 90. In this way, the covering layer 230 can reduce the risk of objects outside the display module 100 directly colliding with the flexible glass 90 and causing damage to the flexible glass 90.

[0250] The material of the cover layer 230 includes a transparent polyimide film (English: Colorless Polyimide, abbreviated as: CPI) or polyethylene terephthalate.

[0251] like Fig.19 As shown, the third adhesive layer 3 is located between the cover layer 230 and the flexible glass 90, and is configured to bond the cover layer 230 and the flexible glass 90. The material of the third adhesive layer 3 may be optical adhesive.

[0252] Exemplarily, the orthographic projection of the third adhesive layer 3 on the reference surface coincides with the orthographic projection of the flexible glass 90 on the reference surface, that is, the size of the third adhesive layer 3 is the same as that of the flexible glass 90 .

[0253] By configuring in this manner, the bonding area of ​​the flexible glass 90 can be made larger, so that the flexible glass 90 and the cover layer 230 are bonded more firmly.

[0254] Or, for example, Fig.19 As shown, the orthographic projection of the third adhesive layer 3 on the reference surface is within the range of the orthographic projection of the flexible glass 90 on the reference surface, and the boundary of the orthographic projection of the third adhesive layer 3 on the reference surface is spaced from the boundary of the orthographic projection of the flexible glass 90 on the reference surface. For example, the distance between the boundary of the orthographic projection of the third adhesive layer 3 on the reference surface and the boundary of the orthographic projection of the flexible glass 90 on the reference surface is greater than 0.3 mm.

[0255] For example, the distance between the boundary of the orthographic projection of the third adhesive layer 3 on the reference surface and the boundary of the orthographic projection of the flexible glass 90 on the reference surface is one of 0.3 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.58 mm, 0.62 mm, 0.66 mm, 0.71 mm, 0.79 mm, 0.8 mm, 0.94 mm and 1 mm.

[0256] In this case, the edge portion of the flexible glass 90 that extends beyond the third adhesive layer 3 provides an accommodation space for the second protective layer 220, that is, when the display module 100 includes the second protective layer 220, the second protective layer 220 is at least partially located on the edge portion of the flexible glass 90 that extends beyond the third adhesive layer 3 and surrounds the third adhesive layer 3.

[0257] In some embodiments, Fig. 20 As shown, the display module 100 further includes a buffer layer 240 and an eighth adhesive layer 8 .

[0258] The buffer layer 240 is located between the flexible glass 90 and the display panel 10. The buffer layer 240 mainly plays a role of buffering and shock resistance to improve the impact resistance of the display module 100. The material of the buffer layer 240 may include thermoplastic polyurethane elastomer rubber (English: Thermoplastic polyurethanes, referred to as: TPU).

[0259] like Fig. 20 As shown, the orthographic projection of the buffer layer 240 on the reference plane may be located within the range of the orthographic projection of the display panel 10 on the reference plane, for example.

[0260] like Fig. 20As shown, the eighth adhesive layer 8 is located between the buffer layer 240 and the flexible glass 90, and is configured to bond the buffer layer 240 and the flexible glass 90. The material of the eighth adhesive layer 8 can be the same as that of the third adhesive layer 3, for example, the materials of the third adhesive layer 3 and the eighth adhesive layer 8 are both optical adhesive.

[0261] On the basis of the above-mentioned embodiment, the top optical adhesive layer 9 is located between the buffer layer 240 and the display panel 10 , and is configured to bond the buffer layer 240 and the display panel 10 .

[0262] In other embodiments, Fig.21 and Fig. 22 As shown, the display module 100 further includes a light shielding layer 250 and a fifth adhesive layer 5 .

[0263] The light shielding layer 250 is located between the flexible glass 90 and the display panel 10, and is configured to shield ultraviolet light, that is, the light shielding layer 250 mainly serves to reduce the risk of aging of organic materials in the display panel 10. The material of the light shielding layer 250 may include ultraviolet optical glue or polyethylene terephthalate.

[0264] like Fig.21 As shown, the orthographic projection of the light shielding layer 250 on the reference plane may be located within the range of the orthographic projection of the display panel 10 on the reference plane, for example.

[0265] like Fig.21 As shown, the fifth adhesive layer 5 is located between the light shielding layer 250 and the flexible glass 90, and is configured to bond the light shielding layer 250 and the flexible glass 90. The material of the fifth adhesive layer 5 can be the same as that of the third adhesive layer 3, for example, the materials of the third adhesive layer 3 and the fifth adhesive layer 5 are both optical adhesive.

[0266] On the basis of the above embodiment, the top optical adhesive layer 9 is located between the light shielding layer 250 and the display panel 10 , and is configured as the light shielding layer 250 and the display panel 10 .

[0267] In some other embodiments, Fig.23 As shown, the display module 100 further includes a buffer layer 240 , an eighth adhesive layer 8 , a light shielding layer 250 and a fifth adhesive layer 5 .

[0268] The buffer layer 240 is located between the flexible glass 90 and the display panel 10. The eighth adhesive layer 8 is located between the buffer layer 240 and the flexible glass 90, and is configured to bond the buffer layer 240 and the flexible glass 90. The light shielding layer 250 is located between the buffer layer 240 and the display panel 10. The fifth adhesive layer 5 is located between the buffer layer 240 and the light shielding layer 250, and is configured to bond the buffer layer 240 and the light shielding layer 250.

[0269] On the basis of the above embodiment, the top optical adhesive layer 9 is located between the light shielding layer 250 and the display panel 10 , and is configured as the light shielding layer 250 and the display panel 10 .

[0270] In some other embodiments, Fig.24 As shown, the display module 100 further includes a light shielding layer 250 , a fifth adhesive layer 5 , a buffer layer 240 and an eighth adhesive layer 8 .

[0271] The light shielding layer 250 is located between the flexible glass 90 and the display panel 10. The fifth adhesive layer 5 is located between the light shielding layer 250 and the flexible glass 90, and is configured to bond the light shielding layer 250 and the flexible glass 90. The buffer layer 240 is located between the light shielding layer 250 and the display panel 10. The eighth adhesive layer 8 is located between the buffer layer 240 and the light shielding layer 250, and is configured to bond the buffer layer 240 and the light shielding layer 250.

[0272] On the basis of the above-mentioned embodiment, the top optical adhesive layer 9 is located between the buffer layer 240 and the display panel 10 , and is configured to bond the buffer layer 240 and the display panel 10 .

[0273] In some embodiments, Fig.25 As shown, the display device 1000 further includes a housing 300 , and the display module 100 can be disposed in the housing 300 .

[0274] The housing 300 includes a bottom plate 310, a frame 320 and a top frame 330. The bottom plate 310 is located on the non-display side of the display module 100, the frame 320 surrounds the bottom plate 310 and is arranged around the periphery of the display module 100, and the top frame 330 is located on the display side of the display module 100, and is arranged in a ring shape along the edge of the flexible glass 90 of the display module 100.

[0275] It is important to understand that Fig.25 As shown, the display module 100 has a display side and a non-display side that are arranged opposite to each other. It should be noted that the display side 110A refers to the side of the display module 100 that displays an image ( Fig.25 The non-display side refers to the other side opposite to the display side ( Fig.25 (shown in the figure below)

[0276] In some examples, such as Fig.25 As shown, the outer boundary of the orthographic projection of the top frame 330 on the reference plane roughly coincides with the inner boundary of the orthographic projection of the frame 320 on the reference plane, and the top frame 330 is connected to the inner side surface of the frame 320 .

[0277] Arranged in this manner, the frame 320 can protect the edge of the frame 320 , which is at risk of being broken by accidental collisions.

[0278] In other examples, such as Fig.26 As shown, the orthographic projection of the frame 320 on the reference plane is within the range of the orthographic projection of the top frame 330 on the reference plane, and the top frame 330 is connected to the end face of the frame 320 away from the bottom plate 310. In this way, the frame 320 can provide support for the top frame 330.

[0279] In addition, the first protective layer 210 is at least partially in contact with the top frame 330. In this case, when the user applies a force to the top frame 330, the force can be transferred to the flexible glass 90, and then to the first protective layer 210, which can reduce the risk of the force on the top frame 330 being transferred to the flexible glass 90 and causing damage to the flexible glass 90.

[0280] It should be noted that the term "abutment" should be understood in a broad sense, and can be a fixed connection, a detachable connection, or abutment or fit. Moreover, "abutment" can be direct abutment, that is, there is no other component (or region, layer, part) between the two components (or regions, layers, parts), or indirect abutment through an intermediate medium, that is, there is another component (or region, layer, part) between the two components (or regions, layers, parts).

[0281] In some embodiments, Fig.25 and Fig.26 As shown, the inner boundary of the orthographic projection of the top frame 330 on the reference plane is located within the range of the orthographic projection of the flexible glass 90 on the reference plane, and the distance between the inner boundary of the orthographic projection of the top frame 330 on the reference plane and the boundary of the orthographic projection of the flexible glass 90 on the reference plane is greater than or equal to 2 mm.

[0282] For example, the distance between the inner boundary of the orthographic projection of the top frame 330 on the reference surface and the boundary of the orthographic projection of the flexible glass 90 on the reference surface is one of 2 mm, 2.5 mm, 3.1 mm, 4.5 mm and 5 mm.

[0283] In this case, the bonding area between the flexible glass 90 and the top frame 330 is larger, which can improve the supporting strength of the top frame 330 for the flexible glass 90 .

[0284] In some embodiments, Fig.25 As shown, the inner boundary of the orthographic projection of the top frame 330 on the reference plane is located within the orthographic projection of the peripheral area B on the reference plane.

[0285] By setting it in this way, the distance between the orthographic projection boundary of the peripheral area B on the reference plane and the outer boundary of the orthographic projection of the top frame 330 on the reference plane can be shortened, that is, the size of the border of the display device 1000 can be shortened, so that the screen-to-body ratio of the display device 1000 can be improved.

[0286] Exemplarily, the inner boundary of the orthographic projection of the top frame 330 on the reference surface coincides with the orthographic projection boundary of the peripheral area B on the reference surface. In this case, the size of the frame of the display device 1000 can be shortened to the greatest extent.

[0287] When the bending radius of the display device 1000 is 3mm, the performance indicators of the above-mentioned display device 1000 can meet the following requirements: when the temperature is -20°C, the display device 1000 can be bent for more than or equal to 20,000 times. When the temperature is 25°C, the display device 1000 can be bent for more than or equal to 300,000 times. When the temperature is 85°C, the display device 1000 can be bent for more than or equal to 20,000 times. The surface hardness of the display device 1000 is greater than or equal to 3H. During the ball drop test, the mass of the falling ball is 32.65g, and the height of the falling ball is greater than or equal to 15mm.

[0288] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0289] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display module, characterized in that: include: The display panel comprises a main body, a binding portion and a bending portion between the main body and the binding portion; The main body has a display side and a non-display side that are opposite to each other, and the bending portion is bent toward the non-display side of the main body so that the binding portion is bent to the non-display side of the main body; At least one supporting layer is located between the main body and the binding part and connected to the main body and the binding part; at least one supporting layer is provided with a first blocking hole; A driving chip is located on the binding portion and on a side of the binding portion away from the main body; the orthographic projection of the driving chip on the reference surface at least partially overlaps with the orthographic projection of the first blocking hole on the reference surface; wherein the reference surface is the plane where the display surface of the main body of the display panel is located.

2. The display module according to claim 1, characterized in that: The display module includes a plurality of supporting layers, and the display module also includes: At least one adhesive layer, wherein an adhesive layer exists between two adjacent supporting layers in the multiple supporting layers; among the at least one adhesive layer, at least one adhesive layer is provided with a second blocking hole; the orthographic projection of the driving chip on the reference surface at least partially overlaps with the orthographic projection of the second blocking hole on the reference surface.

3. The display module according to claim 2, characterized in that: Along a direction perpendicular to the main body and pointing from the main body to the binding part, the multi-layer support layer includes a first support layer and a second support layer, the density of the first support layer is greater than the density of the second support layer; the second support layer is provided with the first barrier hole, and the first barrier hole penetrates the second support layer; The at least one adhesive layer includes a first adhesive layer, and the first adhesive layer is located between the first supporting layer and the second supporting layer; the first adhesive layer is provided with a second barrier hole, and the second barrier hole penetrates the first adhesive layer.

4. The display module according to claim 3, characterized in that: The orthographic projection of the first blocking hole on the reference surface substantially coincides with the orthographic projection of the second blocking hole on the reference surface.

5. The display module according to claim 3, characterized in that: The orthographic projection of the driving chip on the reference surface is located within the range of the orthographic projection of the blocking hole on the reference surface; Furthermore, a distance between a boundary of an orthographic projection of the driving chip on the reference surface and a boundary of an orthographic projection of the blocking hole on the reference surface is greater than or equal to 0.5 mm.

6. The display module according to claim 3, characterized in that: Also includes A heat sink is located in the blocking hole; an orthographic projection of the heat sink on the reference surface at least partially overlaps with an orthographic projection of the driver chip on the reference surface.

7. The display module according to claim 3, characterized in that: Also includes: The electromagnetic shielding component is located in the blocking hole; the orthographic projection of the electromagnetic shielding component on the reference plane at least partially overlaps with the orthographic projection of the driving chip on the reference plane.

8. The display module according to claim 3, characterized in that: Also includes: A buffer is located in the blocking hole; an orthographic projection of the buffer on the reference surface at least partially overlaps with an orthographic projection of the driver chip on the reference surface.

9. The display module according to claim 1, characterized in that: Also includes: A second adhesive layer, comprising a first adhesive pattern and a second adhesive pattern; the first adhesive pattern is located between the at least one supporting layer and the binding portion; The second adhesive pattern is located between the at least one supporting layer and the binding portion, and between the first adhesive pattern and the bending portion. The thickness of the second adhesive pattern is greater than that of the first adhesive pattern, and there is a gap between the second adhesive pattern and the first adhesive pattern. Wherein, the driving chip is arranged on a side of the first adhesive pattern away from the main body.

10. The display module according to any one of claims 1 to 9, characterized in that: Also includes: A flexible glass is located on the display side of the main body; the orthographic projection of the flexible glass on the reference surface covers the orthographic projection of the display panel on the reference surface, and the boundary of the orthographic projection of the flexible glass on the reference surface is spaced from the boundary of the orthographic projection of the display panel on the reference surface; The first protective layer is located on a side of the flexible glass close to the display panel; the first protective layer is at least partially located on an edge portion of the flexible glass that exceeds the display panel, and the first protective layer surrounds the display panel.

11. The display module according to claim 10, characterized in that: An outer boundary of the orthographic projection of the first protection layer on the reference surface is located outside a boundary of the orthographic projection of the flexible glass on the reference surface.

12. The display module according to claim 10, characterized in that: The elastic modulus of the material of the first protective layer is smaller than the elastic modulus of the flexible glass.

13. The display module according to claim 10, characterized in that: Also includes: The second protective layer is located on a side of the flexible glass away from the display panel and is arranged along the edge of the flexible glass. The outer boundary of the orthographic projection of the second protective layer on the reference plane is located outside the boundary of the orthographic projection of the flexible glass on the reference plane.

14. The display module according to claim 13, characterized in that: The distance between the outer boundary of the orthographic projection of the first protective layer on the reference surface and the boundary of the orthographic projection of the flexible glass on the reference surface is greater than or equal to 0.1 mm; and / or, The outer boundary of the orthographic projection of the second protective layer on the reference surface and the boundary of the orthographic projection of the flexible glass on the reference surface are greater than or equal to 0.1 mm.

15. The display module according to claim 13, characterized in that: The outer edge of the first protective layer is at least partially flush with the outer edge of the second protective layer.

16. The display module according to claim 10, characterized in that: The material of the first protective layer includes polyimide or polyethylene terephthalate; in the case where the second protective layer is included, the material of the second protective layer includes polyimide or polyethylene terephthalate.

17. The display module according to claim 10, characterized in that: Also includes: A covering layer is located on a side of the flexible glass away from the display panel; and the orthographic projection of the covering layer on the reference surface covers the orthographic projection of the flexible glass on the reference surface; a third adhesive layer, located between the cover layer and the flexible glass; The orthographic projection of the third adhesive layer on the reference surface is located within the orthographic projection of the flexible glass on the reference surface, and a boundary of the orthographic projection of the third adhesive layer on the reference surface is spaced from a boundary of the orthographic projection of the flexible glass on the reference surface; In the case where the display module includes a second protective layer, the second protective layer is at least partially located on an edge portion of the flexible glass that exceeds the third adhesive layer and surrounds the third adhesive layer.

18. The display module according to claim 10, characterized in that: Also includes: A buffer layer, located between the flexible glass and the display panel; and / or, A light shielding layer is located between the flexible glass and the display panel, and the light shielding layer is configured to shield ultraviolet light.

19. A display device, characterized in that: include: The display module according to any one of claims 1 to 18; A housing, wherein the display module is located inside the housing.

20. The display device according to claim 19, characterized in that The shell includes a bottom plate, a frame and a top frame. The bottom plate is located on the non-display side of the display module. The frame surrounds the bottom plate and is arranged around the peripheral side of the display module. The top frame is located on the display side of the display module. The top frame is arranged in a ring shape along the edge of the flexible glass of the display module. The first protective layer is at least partially in contact with the top frame.

21. The display device according to claim 20, characterized in that: The inner boundary of the orthographic projection of the top frame on the reference plane is located within the range of the orthographic projection of the flexible glass on the reference plane, and the distance between the inner boundary of the orthographic projection of the top frame on the reference plane and the boundary of the orthographic projection of the flexible glass on the reference plane is greater than or equal to 2 mm.

22. The display device according to claim 20 or 21, characterized in that: The main body of the display panel in the display module has a display area and a peripheral area surrounding the display area, and the inner boundary of the orthographic projection of the top frame on the reference surface is located within the orthographic projection of the peripheral area on the reference surface.

Images