A kind of intelligent PCB circuit board detection and repair method

Abstract

The present invention relates to the technical field of PCB circuit boards, and specifically to an intelligent PCB circuit board detection and repair method, comprising the following steps: S1, initialization module configuration: automatically identifying PCB type and structural information; S2, dynamic detection stage: collecting electrical parameters of PCB and generating fault location information; S3, circuit dynamic characteristic compensation: analyzing nonlinear distortion characteristics of circuit, calculating and performing dynamic compensation; S4, automatic repair stage: generating a repair plan, including performing solder joint repair, line reconstruction or signal compensation; S5, intelligent review stage: performing a comprehensive retest on the repaired PCB, verifying the performance of the repaired area, and generating a repair evaluation report. The present invention improves the repair accuracy and efficiency, the entire repair process is intelligent and automated, reduces the risk of manual intervention, and improves the overall repair efficiency and the long-term reliability of the PCB circuit.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB circuit boards, and in particular to an intelligent PCB circuit board detection and repair method. Background Art

[0002] With the widespread application of electronic devices, PCB is an important basic component of electronic products, and its quality and reliability are crucial to the normal operation of electronic devices. However, during the production, transportation and use of PCB circuit boards, they often encounter electrical faults caused by factors such as temperature fluctuations, physical damage, and production processes. These faults may manifest as circuit open circuits, short circuits, impedance mismatches, signal attenuation, and other problems, seriously affecting the performance and stability of the product. Traditional PCB fault detection methods rely on manual visual inspection, simple electrical measurement methods, or static electrical parameter analysis. These methods can often only make judgments on relatively simple faults and cannot cope with multiple faults in complex circuits. In addition, there is a lot of manual intervention in the repair process, which is low in efficiency and poor in accuracy.

[0003] Existing PCB inspection and repair technologies have many limitations. Traditional inspection methods are mostly manual or simple electrical measurements, which cannot fully capture the dynamic changes of various electrical parameters in the circuit, and often cannot accurately locate the fault area. Even if automated inspection equipment is used, it still faces the problem of insufficient recognition accuracy, especially on high-density wiring or multi-layer PCBs, it is difficult to achieve accurate fault location. In addition, existing repair technologies are often unable to intelligently generate repair plans based on actual fault conditions. The repair process lacks specificity and is prone to over-repair or under-repair. More importantly, the electrical performance after repair often requires manual review, and automated and efficient repair evaluation cannot be achieved, increasing the risk of manual intervention and human error.

[0004] In view of the deficiencies in the prior art, the present invention aims to provide an intelligent PCB circuit board detection and repair method, which can greatly improve the accuracy and efficiency of PCB repair, reduce human errors, and enhance the long-term stability and reliability of the repaired circuit. Summary of the invention

[0005] The invention provides an intelligent PCB circuit board detection and repair method.

[0006] An intelligent PCB circuit board detection and repair method comprises the following steps:

[0007] S1, initialization module configuration: connect the target PCB through the integrated device and automatically identify the PCB type and structure information;

[0008] S2, dynamic detection stage: use multi-point scanning to collect the electrical parameters of the PCB, including voltage, impedance, and signal waveform, locate the fault area through intelligent analysis algorithms, and generate fault location information;

[0009] S3, circuit dynamic characteristics compensation: Based on the generated fault location information, analyze the nonlinear distortion characteristics of the circuit, calculate and perform dynamic compensation, and optimize electrical performance, including:

[0010] S31, nonlinear distortion characteristic analysis: based on the generated fault location information, identify the nonlinear distortion behavior of the fault area and form distortion characteristic parameters, including distortion amplitude and frequency response changes;

[0011] S32, dynamic compensation value calculation: based on the distortion characteristic parameters formed, the compensation value of the signal in the circuit is calculated by a dynamic compensation algorithm, including a voltage adjustment value, an impedance correction value, and a waveform compensation parameter. At the same time, the circuit operation effect is simulated to verify the validity of the compensation value;

[0012] S33, compensation execution: applying the verified compensation value, executing real-time compensation operation, compensating the electrical parameters of the fault area, and restoring the electrical performance;

[0013] S4, automatic repair stage: based on the compensated electrical parameters, a repair plan is generated, including solder joint repair, line reconstruction or signal compensation;

[0014] S5, intelligent review stage: conduct a comprehensive retest of the repaired PCB, verify the performance of the repaired area, and generate a repair evaluation report.

[0015] Optionally, the initialization module configuration in S1 includes:

[0016] S11, establishing a physical connection: establishing a physical connection with the target PCB through a multifunctional interface of the integrated device, the interface including a standard electrical signal interface and a special identification interface;

[0017] S12, PCB type identification: Utilize the built-in PCB type database of the device and analyze the electrical characteristics matching algorithm of the characteristic signal to quickly identify the type of PCB;

[0018] S13, structural information extraction: Extract PCB structural information based on physical layer scanning and logical layer analysis technology, including the number of layers, node distribution and circuit connectivity.

[0019] Optionally, the dynamic detection stage in S2 includes:

[0020] S21, electrical parameter acquisition: comprehensive inspection of the target PCB is performed through multi-point scanning, and electrical parameters including voltage, impedance, and signal waveform are collected in real time at nodes and paths;

[0021] S22, fault location: Use intelligent analysis algorithms to compare and analyze the collected electrical parameters, identify abnormal points or abnormal distribution areas, locate the fault area, and generate fault location information, including the coordinates of the fault node and the affected range.

[0022] Optionally, the electrical parameter collection in S21 includes:

[0023] S211, setting scanning points: selecting multiple nodes and electrical paths on the target PCB as scanning points, and planning the scanning paths, the scanning points including power supply nodes, signal transmission paths and ground loops;

[0024] S212, real-time electrical parameter acquisition: real-time acquisition of electrical parameters at each scanning point through multiple sensors, including voltage, impedance and signal waveform;

[0025] S213, synchronous sampling: synchronous sampling technology is used to collect data at multiple scanning points simultaneously.

[0026] Optionally, the fault location in S22 includes:

[0027] S221, comparative analysis: By comparing the collected electrical parameters with the standard values, the deviation value of each node or path is calculated. ;

[0028] S222, outlier identification: When the deviation value of a node or path Exceeding the set abnormal threshold When , it indicates that the node or path is an outlier;

[0029] S223, abnormal distribution area analysis: use K-means algorithm to cluster multiple abnormal points and identify the spatial distribution of fault areas;

[0030] S224, fault area location: Generate coordinate information of the fault area according to the clustering result, and calculate the impact range by the distance between the farthest abnormal point in the cluster and the cluster center.

[0031] Optionally, the nonlinear distortion characteristic analysis in S31 includes:

[0032] S311, distortion amplitude calculation: by comparing the deviation between the actually measured electrical parameters and the ideal electrical parameters, the distortion amplitude is calculated;

[0033] S312, frequency response change calculation: based on the comparison of the gain and phase response between the actual circuit and the ideal circuit, the gain change and phase change in the fault area are calculated, thereby forming a frequency response change.

[0034] Optionally, the dynamic compensation value calculation in S32 includes:

[0035] S321, calculating the voltage adjustment value: dynamically calculating the voltage adjustment value according to the distortion amplitude, and adjusting the voltage signal to restore it to an ideal state;

[0036] S322, calculating impedance correction value: calculating impedance correction value of the distorted area in the circuit by analyzing the distortion amplitude and frequency response change, adjusting the impedance of the circuit, and restoring the signal transmission to an ideal state;

[0037] S323, calculating waveform compensation parameters: using the distortion amplitude and frequency response changes to perform waveform compensation and optimize the waveform distortion in the circuit;

[0038] S324, simulating circuit operation effect: using the compensation value to perform circuit simulation, verifying the circuit operation effect after compensation, and verifying through simulation whether the adjusted voltage, impedance and waveform can effectively restore the circuit performance;

[0039] S325, verifying the effectiveness of compensation: verifying the effectiveness of the compensation value by comparing the changes in electrical parameters before and after compensation.

[0040] Optionally, the compensation execution in S33 includes:

[0041] S331, obtaining compensation value: obtaining the compensation value after verification of validity to perform electrical parameter compensation;

[0042] S332, perform real-time compensation operation: apply compensation value in the fault area, dynamically adjust voltage, impedance, and waveform of the fault area by real-time monitoring of electrical parameters of the target PCB, and restore electrical performance.

[0043] Optionally, the automatic repair stage in S4 includes:

[0044] S41, Solder joint repair: In the solder joint repair stage, the electrical parameters after compensation are compared with the standard values, the abnormalities of the electrical parameters are analyzed, the damaged or missing solder joint locations are determined, and the electrical connection is restored by welding using automated equipment;

[0045] S42, line reconstruction: During the line reconstruction phase, the faulty line is identified using the compensated electrical parameters, and a new circuit path is planned and generated using an intelligent planning algorithm;

[0046] S43, signal compensation: In the signal compensation stage, the impedance and signal waveform of the signal path are adjusted according to the compensated electrical parameters.

[0047] Optionally, the intelligent review stage in S5 includes:

[0048] S51, comprehensive retest: After repair, the electrical parameters of the repaired area are fully tested through multi-point scanning, including voltage, impedance and waveform;

[0049] S52, performance verification: Compare and analyze the retest results with the electrical parameters before repair to verify whether the electrical performance of the repaired area has returned to normal levels;

[0050] S53, generate a repair evaluation report: according to the retest and verification results, automatically generate a repair evaluation report, including electrical parameters of the repair area, repair effect and effectiveness of the repair.

[0051] Beneficial effects of the present invention:

[0052] The present invention greatly improves the automation level of PCB fault detection and repair through the combination of integrated equipment and intelligent algorithms. Through the accurate identification of the initialization module and the multi-point scanning detection technology, the system can comprehensively collect the electrical parameters of the PCB, including voltage, impedance, and signal waveform, quickly locate the fault area, and ensure the efficiency and accuracy of the detection result. Through the dynamic compensation technology, it solves the complex problem that traditional detection methods cannot cope with circuit nonlinear distortion, optimizes the electrical performance of the fault area in time, and restores the stable operation of the circuit. The method makes full use of electrical parameter comparison and analysis, dynamic compensation and automatic repair in the processing process, effectively solves the errors and missed repairs that may be caused by manual operation, and improves the reliability of the repair process.

[0053] The present invention generates an intelligent repair scheme based on the compensated electrical parameters, automatically completes solder joint repair, line reconstruction and signal compensation, can quickly identify and repair faulty lines, minimize signal attenuation and electrical performance loss, and ensure that the repaired circuit can resume normal working conditions. In the signal compensation stage, by real-time monitoring of the dynamic changes of electrical parameters, the impedance and waveform of the signal path can be accurately adjusted, the signal transmission quality can be effectively improved, over-repair or under-compensation can be avoided, and the repair accuracy and efficiency are greatly improved. The entire repair process is intelligent and automated, which reduces the risk of manual intervention and improves the overall repair efficiency and the long-term reliability of the PCB circuit.

[0054] The present invention, through the intelligent review stage, the repaired PCB will undergo comprehensive retesting and performance verification to ensure the effectiveness of the repair effect and the recovery of electrical performance. By comparing and analyzing the data before repair, the system can identify whether there are incomplete repairs or new faults, and adjust the repair strategy in time. The automatically generated repair evaluation report provides users with a detailed evaluation of the repair effect, enhances the transparency of the repair process, and ensures the reliability of the repair quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0056] Figure 1 A schematic diagram of a detection and repair method flow chart of an embodiment of the present invention;

[0057] Figure 2 Schematic diagram of circuit dynamic characteristic compensation according to an embodiment of the present invention. DETAILED DESCRIPTION

[0058] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. At the same time, it is explained here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art may also adopt other alternatives to implement some known technologies; and the accompanying drawings are only for more specific description of the embodiments, and are not intended to specifically limit the present invention.

[0059] It should be noted that the references to "one embodiment", "embodiment", "exemplary embodiments", "some embodiments" and the like in the specification indicate that the embodiments described may include specific features, structures or characteristics, but not every embodiment may include the specific features, structures or characteristics. In addition, when a specific feature, structure or characteristic is described in conjunction with an embodiment, it should be within the knowledge of a person skilled in the art to implement such feature, structure or characteristic in conjunction with other embodiments (whether or not explicitly described).

[0060] In general, a term can be understood, at least in part, from its use in context. For example, depending, at least in part, on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey an exclusive set of factors, but can instead, depending, at least in part, on the context, allow for the presence of other factors that are not necessarily explicitly described.

[0061] like Figure 1-Figure 2 As shown, an intelligent PCB circuit board detection and repair method includes the following steps:

[0062] S1, initialization module configuration: connect the target PCB through the integrated device and automatically identify the PCB type and structure information;

[0063] S2, dynamic detection stage: use multi-point scanning to collect the electrical parameters of the PCB, including voltage, impedance, and signal waveform, locate the fault area through intelligent analysis algorithms, and generate fault location information;

[0064] S3, circuit dynamic characteristics compensation: Based on the generated fault location information, analyze the nonlinear distortion characteristics of the circuit, calculate and perform dynamic compensation, and optimize electrical performance, including:

[0065] S31, nonlinear distortion characteristic analysis: based on the generated fault location information, identify the nonlinear distortion behavior of the fault area and form distortion characteristic parameters, including distortion amplitude and frequency response changes;

[0066] S32, dynamic compensation value calculation: based on the distortion characteristic parameters formed, the compensation value of the signal in the circuit is calculated by a dynamic compensation algorithm, including a voltage adjustment value, an impedance correction value, and a waveform compensation parameter. At the same time, the circuit operation effect is simulated to verify the validity of the compensation value;

[0067] S33, compensation execution: applying the verified compensation value, executing real-time compensation operation, compensating the electrical parameters of the fault area, and restoring the electrical performance;

[0068] S4, automatic repair stage: based on the compensated electrical parameters, a repair plan is generated, including solder joint repair, line reconstruction or signal compensation;

[0069] S5, intelligent review stage: conduct a comprehensive retest on the repaired PCB, verify the performance of the repaired area, and generate a repair evaluation report;

[0070] Through the above content, accurate positioning, efficient repair and performance optimization of PCB circuit board faults are achieved. Multi-point scanning and intelligent algorithms are used to effectively cope with the multi-fault characteristics of complex PCBs. Dynamic compensation technology is used to solve nonlinear distortion problems, and optimized circuit models are generated to ensure the scientific nature of the repair strategy. In addition, the accuracy and efficiency of detection and repair are greatly improved. At the same time, the quality of repair is verified through a review mechanism to ensure long-term reliability.

[0071] The initialization module configuration in S1 includes:

[0072] S11, establishing a physical connection: establishing a physical connection with the target PCB through a multifunctional interface of the integrated device, the interface including a standard electrical signal interface and a special identification interface;

[0073] S12, PCB type identification: Utilize the built-in PCB type database of the device and analyze the electrical characteristic matching algorithm of the characteristic signal to quickly identify the type of PCB, which is expressed as: ;

[0074] in, is the target signal, at time The signal characteristics formed by the linear combination of multiple pin signals at all times are used to describe the overall electrical characteristics or characteristic signals of the PCB. is the number of pins, is the weight coefficient, It is Pin signal, indicating time Time from the The voltage signal or characteristic signal collected by each pin;

[0075] ;

[0076] in, To match the PCB type, is the observed characteristic signal, For the database Reference characteristic signals of PCB types, is the number of signal samples;

[0077] S13, structural information extraction: Extract PCB structural information based on physical layer scanning and logical layer analysis technology, including the number of layers, node distribution and circuit connectivity, expressed as:

[0078] ;

[0079] ;

[0080] ;

[0081] in, This is the topological structure diagram of the PCB. is a node set, is a set of edges, each edge Representation Node and connection relationship;

[0082] ;

[0083] ;

[0084] in, and is the total distribution of resistance and capacitance, and are the resistance and capacitance between nodes respectively;

[0085] Through the above content, the PCB type and structural information are automatically identified, providing accurate basic data and adaptation parameters for subsequent detection and repair, realizing seamless connection between equipment and PCB, simplifying the operation process, avoiding errors caused by manual intervention, and ensuring the efficiency and accuracy of subsequent steps.

[0086] The dynamic detection stage in S2 includes:

[0087] S21, electrical parameter acquisition: comprehensive inspection of the target PCB is performed through multi-point scanning, and electrical parameters including voltage, impedance, and signal waveform are collected in real time at nodes and paths;

[0088] S22, fault location: Use intelligent analysis algorithms to compare and analyze the collected electrical parameters, identify abnormal points or abnormal distribution areas, locate the fault area, and generate fault location information, including the coordinates of the fault node and the impact range; through the above content, it is possible to quickly identify abnormal points or abnormal areas and generate accurate fault location information, which is suitable for circuit fault diagnosis of complex multi-layer PCBs or high-density wiring, and effectively improves the automation level and accuracy of detection.

[0089] The electrical parameter collection in S21 includes:

[0090] S211, setting scanning points: selecting multiple nodes and electrical paths on the target PCB as scanning points, and planning the scanning paths to ensure that all important electrical areas of the PCB are covered. The scanning points include power supply nodes, signal transmission paths, and ground loops.

[0091] S212, real-time electrical parameter acquisition: real-time acquisition of electrical parameters at each scanning point through multiple sensors, including voltage, impedance and signal waveform;

[0092] S213, synchronous sampling: synchronous sampling technology is used to collect data at multiple scanning points at the same time to ensure that the collected electrical parameters have time consistency and avoid errors caused by delay differences;

[0093] Through the above content, multiple key nodes and electrical paths of the PCB can be fully covered, ensuring accurate detection of the entire circuit status and avoiding missing potential fault points. The synchronous sampling technology is used to ensure the time consistency of the data, so that the data at different scanning points can accurately reflect the overall operating status of the circuit, greatly improving the accuracy of fault diagnosis.

[0094] Fault location in S22 includes:

[0095] S221, comparative analysis: By comparing the collected electrical parameters with the standard values, the deviation value of each node or path is calculated. , expressed as:

[0096] ;

[0097] in, For the The node's deviation value, is the actual measured value, is the standard value;

[0098] S222, outlier identification: When the deviation value of a node or path Exceeding the set abnormal threshold When , it indicates that the node or path is an outlier;

[0099] Abnormal Threshold The threshold is set according to the electrical specifications and historical data of the target PCB, taking into account the normal fluctuation range of voltage and current, and is set to 1.5 or 2 times of its maximum fluctuation range as the threshold, expressed as:

[0100] ;

[0101] in, is the abnormal threshold, is an empirical coefficient, set to 1.5 or 2, used to adjust the tolerance. is the maximum deviation range of electrical parameters;

[0102] S223, abnormal distribution area analysis: Use K-means algorithm to cluster multiple abnormal points and identify the spatial distribution of the fault area, which is expressed as: ;

[0103] in, Indicates The outliers contained in the clusters are For abnormal points and cluster centers The distance between is the distance threshold;

[0104] Distance Threshold It is set according to the size of the circuit board and the spacing between nodes, expressed as:

[0105] ;

[0106] in, is the distance threshold, is an empirical coefficient, set to 1.2 to 2, used to adjust the sensitivity of clustering. is the minimum distance between nodes;

[0107] S224, fault area location: Generate the coordinate information of the fault area according to the clustering result, and calculate the impact range by the distance between the farthest abnormal point in the cluster and the cluster center, expressed as:

[0108] ;

[0109] in, is the influence radius of the fault area, which represents the distance between the farthest abnormal point in the cluster and the cluster center. For the clusters;

[0110] Through the above content, the fault area on the PCB can be identified efficiently and accurately. Through comparative analysis and deviation calculation, the nodes with large electrical parameter deviations can be quickly located, providing a clear basis for fault location. Cluster analysis further classifies multiple abnormal points, identifies the spatial distribution of the fault area and its impact range, ensures the accuracy of positioning, and can not only find single abnormal points, but also identify the overall impact area of ​​the fault, thereby improving the comprehensiveness and efficiency of fault diagnosis.

[0111] The nonlinear distortion characteristics analysis in S31 includes:

[0112] S311, distortion amplitude calculation: By comparing the deviation between the actually measured electrical parameters and the ideal electrical parameters, the distortion amplitude is calculated and expressed as:

[0113] ;

[0114] in, is the distortion amplitude, To actually measure the voltage, is the ideal voltage value;

[0115] S312, frequency response change calculation: Based on the comparison of the gain and phase response of the actual circuit and the ideal circuit, the gain change and phase change in the fault area are calculated, and then the frequency response change is formed, which is expressed as: ;

[0116] ;

[0117] ;

[0118] in, For the frequency The gain change at represents the gain difference between the signal in the target circuit and the ideal circuit. For the frequency At the actual measured frequency response (gain), For the frequency At, the frequency response of the ideal circuit, For the frequency The phase change at represents the phase difference between the signal in the target circuit and the ideal circuit. For the frequency At this point, the actual measured phase response is For the frequency At , the phase response of the ideal circuit is, is the frequency response change;

[0119] Through the above content, the distortion behavior in the circuit can be accurately identified, and key signal characteristics such as distortion amplitude and frequency response changes can be effectively quantified. By combining the frequency response analysis of gain change and phase change, the change of circuit performance can be comprehensively evaluated, thereby optimizing the electrical performance of the circuit and ensuring the stability and reliability of the circuit after repair. It not only improves the accuracy of detection, but also significantly improves the pertinence and effectiveness of the repair process.

[0120] The dynamic compensation value calculation in S32 includes:

[0121] S321, calculating the voltage adjustment value: dynamically calculating the voltage adjustment value according to the distortion amplitude, and adjusting the voltage signal to restore it to an ideal state, which is expressed as:

[0122] ;

[0123] in, is the voltage after compensation, To actually measure the voltage, is the distortion amplitude, is the compensation coefficient;

[0124] S322, calculating impedance correction value: by analyzing the distortion amplitude and frequency response change, calculating the impedance correction value of the distorted area in the circuit, adjusting the impedance of the circuit, and restoring the signal transmission to an ideal state, which is expressed as:

[0125] ;

[0126] in, is the impedance after compensation, To actually measure impedance, is the gain change (frequency response change), is the impedance compensation coefficient;

[0127] S323, calculate waveform compensation parameters: use the distortion amplitude and frequency response change to perform waveform compensation and optimize the waveform distortion in the circuit, expressed as:

[0128] ;

[0129] in, is the waveform after compensation, For the actual measured waveform, is the phase change (frequency response change), is the waveform compensation coefficient;

[0130] S324, simulating circuit operation effect: using the compensation value to perform circuit simulation, verifying the circuit operation effect after compensation, and verifying through simulation whether the adjusted voltage, impedance and waveform can effectively restore the circuit performance and ensure the stability and accuracy of signal transmission;

[0131] S325, verify the effectiveness of compensation: verify the effectiveness of the compensation value by comparing the changes in electrical parameters before and after compensation to ensure that the circuit is restored to the best working state, including:

[0132] Voltage verification: By comparing the voltage changes before and after compensation, verify whether the compensation is effective, expressed as:

[0133] ;

[0134] in, is the voltage verification error, is the voltage after compensation, is the ideal or expected voltage value;

[0135] Impedance verification: Ensure that impedance compensation is effective by comparing the impedance changes before and after compensation, expressed as:

[0136] ;

[0137] in, is the impedance verification error, is the impedance after compensation, is the ideal or expected impedance value;

[0138] Waveform verification: The effectiveness of waveform compensation is measured by the mean square error (MSE) of the signal to verify the compensation effect of the waveform, which is expressed as:

[0139] ;

[0140] in, is the mean square error, which is used to measure the difference in waveforms. is the waveform signal measured before compensation, is the waveform signal after compensation, is the discretized frequency point, is the total number of discrete frequency points used to calculate the mean square error;

[0141] Comprehensive verification: The verification errors of voltage, impedance, and waveform are weighted and summarized to obtain comprehensive verification indicators. And compare it with the preset compensation threshold. If it is less than the compensation threshold, it means that the compensation is effective, which is expressed as: ;

[0142] in, , , is the weighting coefficient;

[0143] The compensation threshold is set according to the actual repair effect of different electrical parameters (voltage, impedance, waveform) by selecting the appropriate tolerance, which is expressed as:

[0144] ;

[0145] in, is the compensation threshold, is the voltage verification threshold, set to , is the impedance verification threshold, set to , is the waveform verification threshold, set to , is the weighting coefficient, set to ;

[0146] Through the above content, the circuit performance can be effectively optimized. By calculating the compensation value based on the distortion characteristic parameters and simulating the circuit operation effect, the efficiency and accuracy of the repair process are ensured. Not only the compensation accuracy is improved, but also the compensation effect can be verified in time, thereby avoiding the risk of over-repair or insufficient compensation. At the same time, through a precise verification mechanism, the stability and reliability of the circuit after repair are ensured, and finally automated and intelligent PCB repair is realized.

[0147] The compensation execution in S33 includes:

[0148] S331, obtaining compensation value: obtaining the compensation value after verification of validity to perform electrical parameter compensation;

[0149] S332, performing real-time compensation operation: applying compensation value in the fault area, dynamically adjusting voltage, impedance, and waveform of the fault area by real-time monitoring electrical parameters of the target PCB, and restoring electrical performance;

[0150] Through the above content, the electrical parameters of the fault area can be accurately and dynamically compensated to ensure the rapid recovery of circuit performance. The mechanism of real-time monitoring and dynamic adjustment of compensation values ​​can respond to changes in circuit status in a timely manner, avoid over- or under-compensation, and improve the stability and reliability of the repair effect. In addition, it can minimize human intervention, improve the automation and intelligence level of the repair process, reduce manual errors and improve the overall repair efficiency, thus providing guarantee for the reliability and long-term performance of PCB circuit boards.

[0151] The automatic repair phase in S4 includes:

[0152] S41, Solder joint repair: In the solder joint repair stage, the electrical parameters after compensation are compared with the standard values, the abnormalities of the electrical parameters are analyzed, the damaged or missing solder joint locations are determined, and the automated equipment is used for welding to restore the electrical connection and ensure that the solder joints return to normal working condition;

[0153] S42, line reconstruction: During the line reconstruction phase, the faulty line is identified using the compensated electrical parameters, and a new circuit path is planned and generated through an intelligent planning algorithm to ensure that the reconstructed line can restore electrical functions and avoid signal attenuation, thereby ensuring normal operation of the circuit. Specifically, it includes:

[0154] Fault line identification: Identify line faults through compensated electrical parameters, expressed as:

[0155] ;

[0156] in, is the compensated electrical parameter (such as impedance), is the standard electrical parameter of the line (such as standard impedance), is the tolerance error threshold, if , it is considered that the line has a fault;

[0157] Circuit path planning: Solved by Dijkstra algorithm in graph theory, assuming that each node represents a contact on the circuit board, each edge represents a circuit path, and the weight of each edge is an electrical parameter (such as resistance, impedance, etc.), expressed as:

[0158] ;

[0159] in, It is a slave node To Node The shortest path of It is a slave node To Node The shortest known path, It is a slave node To Node Electrical parameters;

[0160] Circuit optimization: Circuit optimization is performed through the optimization algorithm, which is expressed as:

[0161] ;

[0162] in, is the reconstructed circuit path, It is The signal attenuation of the line, It is Signal delay of the line, is the number of lines in the path;

[0163] Tolerance error threshold The settings include:

[0164] Determine the standard error of electrical parameters: Obtain the standard deviation or error range of electrical parameters (such as impedance, voltage, etc.) based on circuit design documents or actual measurements, expressed as:

[0165] ;

[0166] in, is the standard error of the electrical parameter, is the standard deviation of the electrical parameter;

[0167] Consider the design accuracy requirements: According to the design accuracy requirements of the circuit, set the tolerance error range, expressed as:

[0168] ;

[0169] in, is the final set tolerance error, is the adjustment factor required by the design, set to 1 to 2;

[0170] S43, signal compensation: In the signal compensation stage, the impedance and signal waveform of the signal path are adjusted according to the compensated electrical parameters to ensure the signal transmission quality;

[0171] Through the above content, the fault area can be identified quickly and accurately, and solder joint repair, line reconstruction or signal compensation can be performed through automated equipment, effectively avoiding errors and delays caused by manual operation. The automatic repair solution can dynamically adjust the repair strategy according to the changes in electrical parameters to ensure the stability and efficiency of the circuit after restoration. It can automatically plan the optimal path to minimize signal attenuation and electrical performance loss, thereby improving PCB repair efficiency and overall circuit performance.

[0172] The smart review phases in S5 include:

[0173] S51, comprehensive retest: After repair, the electrical parameters of the repaired area are fully tested through multi-point scanning, including voltage, impedance and waveform;

[0174] S52, performance verification: Compare and analyze the retest results with the electrical parameters before repair to verify whether the electrical performance of the repaired area has returned to normal levels;

[0175] S53, generate a repair evaluation report: according to the retest and verification results, automatically generate a repair evaluation report, including electrical parameters of the repair area, repair effect and effectiveness of the repair;

[0176] Through the above content, the quality of repair and the restoration of electrical performance are ensured. The electrical parameters of the repair area can be accurately checked to ensure that all repair work has achieved the expected results and avoid potential omissions or incomplete repairs. Performance verification and comparative analysis of data before repair help identify whether there are incomplete repairs or new faults, and problems are discovered and corresponding measures are taken in a timely manner, thereby improving the reliability and accuracy of the repair. The automatically generated repair evaluation report provides users with a detailed evaluation of the repair effect and enhances the transparency of the process.

[0177] The present invention covers any substitution, modification, equivalent method and scheme made on the essence and scope of the present invention. In order to make the public have a thorough understanding of the present invention, specific details are described in detail in the following preferred embodiments of the present invention, but those skilled in the art can fully understand the present invention without the description of these details. In addition, in order to avoid unnecessary confusion about the essence of the present invention, well-known methods, processes, procedures, components and circuits are not described in detail.

[0178] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An intelligent PCB circuit board detection and repair method, characterized in that: The following steps are involved: S1, initialization module configuration: connect the target PCB through the integrated device and automatically identify the PCB type and structure information; S2, dynamic detection stage: use multi-point scanning to collect the electrical parameters of the PCB, including voltage, impedance, and signal waveform, locate the fault area through intelligent analysis algorithm, and generate fault location information. The dynamic detection stage includes: S21, electrical parameter acquisition: comprehensive inspection of the target PCB is performed through multi-point scanning, and electrical parameters including voltage, impedance, and signal waveform are collected in real time at nodes and paths; S22, fault location: Use intelligent analysis algorithms to compare and analyze the collected electrical parameters, identify abnormal points or abnormal distribution areas, locate the fault area, and generate fault location information, including the coordinates of the fault node and the impact range; The fault location in S22 includes: S221, comparative analysis: By comparing the collected electrical parameters with the standard values, the deviation value of each node or path is calculated. ; S222, outlier identification: When the deviation value of a node or path Exceeding the set abnormal threshold When , it indicates that the node or path is an outlier; S223, abnormal distribution area analysis: use K-means algorithm to cluster multiple abnormal points and identify the spatial distribution of fault areas; S224, fault area location: Generate coordinate information of the fault area according to the clustering result, and calculate the impact range by the distance between the farthest abnormal point in the cluster and the cluster center; S3, circuit dynamic characteristics compensation: Based on the generated fault location information, analyze the nonlinear distortion characteristics of the circuit, calculate and perform dynamic compensation, and optimize electrical performance, including: S31, nonlinear distortion characteristic analysis: based on the generated fault location information, identify the nonlinear distortion behavior of the fault area and form distortion characteristic parameters, including distortion amplitude and frequency response changes; S32, dynamic compensation value calculation: based on the distortion characteristic parameters formed, the compensation value of the signal in the circuit is calculated by a dynamic compensation algorithm, including a voltage adjustment value, an impedance correction value, and a waveform compensation parameter. At the same time, the circuit operation effect is simulated to verify the validity of the compensation value; S33, compensation execution: applying the verified compensation value, executing real-time compensation operation, compensating the electrical parameters of the fault area, and restoring the electrical performance; S4, automatic repair stage: based on the compensated electrical parameters, a repair plan is generated, including solder joint repair, line reconstruction or signal compensation; S5, intelligent review stage: conduct a comprehensive retest of the repaired PCB, verify the performance of the repaired area, and generate a repair evaluation report.

2. The intelligent PCB circuit board detection and repair method according to claim 1 is characterized in that: The initialization module configuration in S1 includes: S11, establishing a physical connection: establishing a physical connection with the target PCB through a multifunctional interface of the integrated device, the interface including a standard electrical signal interface and a special identification interface; S12, PCB type identification: Utilize the built-in PCB type database of the device and analyze the electrical characteristics matching algorithm of the characteristic signal to quickly identify the type of PCB; S13, structural information extraction: Extract PCB structural information based on physical layer scanning and logical layer analysis technology, including the number of layers, node distribution and circuit connectivity.

3. The intelligent PCB circuit board detection and repair method according to claim 1 is characterized in that: The electrical parameter collection in S21 includes: S211, setting scanning points: selecting multiple nodes and electrical paths on the target PCB as scanning points, and planning the scanning paths, the scanning points including power supply nodes, signal transmission paths and ground loops; S212, real-time electrical parameter acquisition: real-time acquisition of electrical parameters at each scanning point through multiple sensors, including voltage, impedance and signal waveform; S213, synchronous sampling: synchronous sampling technology is used to collect data at multiple scanning points simultaneously.

4. The intelligent PCB circuit board detection and repair method according to claim 1 is characterized in that: The nonlinear distortion characteristic analysis in S31 includes: S311, distortion amplitude calculation: by comparing the deviation between the actually measured electrical parameters and the ideal electrical parameters, the distortion amplitude is calculated; S312, frequency response change calculation: based on the comparison of the gain and phase response between the actual circuit and the ideal circuit, the gain change and phase change in the fault area are calculated, thereby forming a frequency response change.

5. The intelligent PCB circuit board detection and repair method according to claim 4 is characterized in that: The dynamic compensation value calculation in S32 includes: S321, calculating the voltage adjustment value: dynamically calculating the voltage adjustment value according to the distortion amplitude, and adjusting the voltage signal to restore it to an ideal state; S322, calculating impedance correction value: calculating impedance correction value of the distorted area in the circuit by analyzing the distortion amplitude and frequency response change, adjusting the impedance of the circuit, and restoring the signal transmission to an ideal state; S323, calculating waveform compensation parameters: using the distortion amplitude and frequency response changes to perform waveform compensation and optimize the waveform distortion in the circuit; S324, simulating circuit operation effect: using the compensation value to perform circuit simulation, verifying the circuit operation effect after compensation, and verifying through simulation whether the adjusted voltage, impedance and waveform can effectively restore the circuit performance; S325, verifying the effectiveness of compensation: verifying the effectiveness of the compensation value by comparing the changes in electrical parameters before and after compensation.

6. The intelligent PCB circuit board detection and repair method according to claim 5 is characterized in that: The compensation execution in S33 includes: S331, obtaining compensation value: obtaining the compensation value after verification of validity to perform electrical parameter compensation; S332, perform real-time compensation operation: apply compensation value in the fault area, dynamically adjust voltage, impedance, and waveform of the fault area by real-time monitoring of electrical parameters of the target PCB, and restore electrical performance.

7. The intelligent PCB circuit board detection and repair method according to claim 1 is characterized in that: The automatic repair phase in S4 includes: S41, Solder joint repair: In the solder joint repair stage, the electrical parameters after compensation are compared with the standard values, the abnormalities of the electrical parameters are analyzed, the damaged or missing solder joint locations are determined, and the electrical connection is restored by welding using automated equipment; S42, line reconstruction: During the line reconstruction phase, the faulty line is identified using the compensated electrical parameters, and a new circuit path is planned and generated using an intelligent planning algorithm; S43, signal compensation: In the signal compensation stage, the impedance and signal waveform of the signal path are adjusted according to the compensated electrical parameters.

8. The intelligent PCB circuit board detection and repair method according to claim 1 is characterized in that: The intelligent review stage in S5 includes: S51, comprehensive retest: After repair, the electrical parameters of the repaired area are fully tested through multi-point scanning, including voltage, impedance and waveform; S52, performance verification: Compare and analyze the retest results with the electrical parameters before repair to verify whether the electrical performance of the repaired area has returned to normal levels; S53, generate a repair evaluation report: according to the retest and verification results, automatically generate a repair evaluation report, including electrical parameters of the repair area, repair effect and effectiveness of the repair.

Images