Display device

Abstract

A display device is disclosed. The display device includes: a base layer including an active area and a peripheral area outside the active area; a circuit element layer including a pixel circuit in the active area and a driving voltage wiring in the peripheral area to supply a driving voltage to the pixel circuit; a light emitting element layer including a plurality of light emitting elements on the circuit element layer; a thin film sealing layer for covering the light emitting element layer; and an input sensing layer on the thin film sealing layer and including a sensing electrode and a sensing signal wiring portion connected to the sensing electrode. The circuit element layer includes a connection wiring portion that overlaps the driving voltage wiring in the peripheral region and is in contact with the sensing signal wiring portion. The connection wiring portion is a different layer from the driving voltage wiring.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0078941, filed on Jul. 1, 2019, which is hereby incorporated by reference in its entirety. Technical Field

[0003] Herein, the present disclosure relates to a display device, and more particularly, to a display device having relatively high sensitivity (eg, improved sensing sensitivity). Background Art

[0004] The electronic device is enabled in response to an electrical signal. The electronic device may include multiple devices composed of various electronic components, such as a display unit for displaying an image, or an input detection unit for detecting an external input. The electronic components may be electrically interconnected by signal lines of various arrangements.

[0005] Depending on the number of electronic components or the processing environment, there may be various numbers of signal lines. The signal lines may be designed to be arranged with appropriate spacing therebetween to prevent or reduce electrical signal interference within a set or predetermined panel area. The signal lines may receive electrical signals applied from the outside via pads (e.g., electrical pads). As the processing speed of the electronic device or the amount of data processed increases, a larger number of signal lines and pads may be required. Therefore, mutual interference between electronic components or signal lines may be increased. Summary of the invention

[0006] The present disclosure is to provide a display device in which an electronic module has relatively high sensitivity (eg, improved sensing sensitivity).

[0007] An embodiment of the present disclosure provides a display device, which includes: a base layer, including an effective area and a peripheral area located outside the effective area; a circuit element layer, including a pixel circuit located on the base layer in the effective area and a driving voltage wiring located on the base layer in the peripheral area to provide a driving voltage to the pixel circuit; a light-emitting element layer, including a plurality of light-emitting elements located on the circuit element layer; a thin film sealing layer configured to cover the light-emitting element layer; and an input sensing layer, located on the thin film sealing layer and including a sensing electrode and a sensing signal wiring portion connected to the sensing electrode.

[0008] The circuit element layer includes a connection wiring portion that overlaps the driving voltage wiring in the peripheral region on a plane and is configured to contact the sensing signal wiring portion.

[0009] The connection wiring portion is located on a different layer from the driving voltage wiring.

[0010] In some embodiments, the sensing electrode includes: a first sensing electrode; and a second sensing electrode electrically insulated from the first sensing electrode to form a capacitor. In some embodiments, the sensing signal wiring portion includes: a receiving wiring portion connected to the first sensing electrode; and a transmitting wiring portion connected to the second sensing electrode. In some embodiments, the connecting wiring portion contacts the transmitting wiring portion.

[0011] In some embodiments, the transmission wiring portion includes: a first transmission wiring portion connected to one end of the second sensing electrode; and a second transmission wiring portion connected to the other end of the second sensing electrode. In some embodiments, the connection wiring portion contacts the second transmission wiring portion.

[0012] In some embodiments, the second transmission wiring portion includes: a plurality of other-side transmission wirings connected to the other end of the second sensing electrode; a first sensing contact portion located at one end of the plurality of other-side transmission wirings; and a second sensing contact portion located at the other end of the plurality of other-side transmission wirings. In some embodiments, the connection wiring portion includes: a plurality of sensing connection wirings extending along the plurality of other-side transmission wirings; a first contact portion connected to one end of the plurality of sensing connection wirings to face the first sensing contact portion; and a second contact portion connected to the other end of the plurality of sensing connection wirings to face the second sensing contact portion.

[0013] In some embodiments, a plurality of sensing connection wirings overlap with the driving voltage wirings. In some embodiments, the first sensing contact portion directly contacts the first contact portion, and the second sensing contact portion directly contacts the second contact portion. In some embodiments, each of the plurality of other side sending wirings includes: a first wiring layer, located on the thin film sealing layer; and a second wiring layer, positioned adjacent to the first wiring layer and with a touch insulation layer interposed between the first wiring layer and the second wiring layer. In some embodiments, the first wiring layer and the second wiring layer are electrically connected to each other. In some embodiments, in the intersection area where the plurality of sensing connection wirings intersect, each of the plurality of other side sending wirings includes one of the first wiring layer and the second wiring layer.

[0014] In some embodiments, the pixel circuit includes: a pixel transistor including a control electrode, an output electrode, and an input electrode; and a connecting electrode located on the output electrode. In some embodiments, the light-emitting element is electrically connected to the connecting electrode. In some embodiments, the driving voltage wiring is located at the same layer as the connecting electrode. In some embodiments, the connecting wiring portion is located at the same layer as the input electrode and the output electrode. In some embodiments, the effective area includes a non-display area having at least one hole and a display area surrounding the non-display area. In some embodiments, the pixel circuit and the light-emitting element are located in the display area.

[0015] In an embodiment of the present disclosure, a display device includes: a base layer, including an effective area and a peripheral area located outside the effective area; a circuit element layer, including a pixel circuit located in the effective area of ​​the base layer and a driving voltage wiring located in the peripheral area of ​​the base layer to provide a driving voltage to the pixel circuit; a light-emitting element layer, including a plurality of light-emitting elements located on the circuit element layer; a thin film sealing layer configured to cover the light-emitting element layer; and an input sensing layer, located on the thin film sealing layer and including a sensing electrode and a sensing signal wiring portion connected to the sensing electrode.

[0016] The circuit element layer includes a connection wiring portion which is located on the same layer as the driving voltage wiring in the peripheral region and is in contact with the sensing signal wiring portion.

[0017] In some embodiments, the sensing electrode includes: a first sensing electrode; and a second sensing electrode electrically insulated from the first sensing electrode to form a capacitor. In some embodiments, the sensing signal wiring portion includes: a receiving wiring portion connected to the first sensing electrode; and a transmitting wiring portion connected to the second sensing electrode, wherein the connecting wiring portion contacts the transmitting wiring portion.

[0018] In some embodiments, the transmission wiring portion includes: a first transmission wiring portion connected to one end of the second sensing electrode; and a second transmission wiring portion connected to the other end of the second sensing electrode. In some embodiments, the connection wiring portion contacts the second transmission wiring portion. In some embodiments, the second transmission wiring portion includes: a plurality of other-side transmission wirings connected to the other end of the second sensing electrode; a first sensing contact portion located at one end of the second sensing electrode; and a second sensing contact portion located at the other end of the plurality of other-side transmission wirings opposite to the end connected to the second sensing electrode.

[0019] In some embodiments, the connection wiring portion includes: a plurality of sensing connection wirings extending along a plurality of other side sending wirings; a first contact portion connected to one end of the plurality of sensing connection wirings to face the first sensing contact portion; and a second contact portion connected to the other end of the plurality of sensing connection wirings to face the second sensing contact portion. In some embodiments, the pixel circuit includes a pixel transistor including a control electrode, an output electrode, and an input electrode. In some embodiments, the light emitting element is electrically connected to the output electrode. In some embodiments, the drive voltage wiring and the connection wiring portion are located at the same layer as the input electrode and the output electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate embodiments of the present disclosure and together with the description are used to explain the principles of the present disclosure. In the accompanying drawings:

[0021] Figure 1A is a perspective view of a display device according to an embodiment of the present disclosure;

[0022] Figure 1B is an exploded perspective view of a display device according to an embodiment of the present disclosure;

[0023] Figure 2 is a block diagram showing a display device according to an embodiment of the present disclosure;

[0024] Figure 3A is a plan view of a display panel according to an embodiment of the present disclosure;

[0025] Figure 3B is an equivalent circuit diagram of a pixel according to an embodiment of the present disclosure;

[0026] Figure 4 is a cross-sectional view of the display panel shown in FIG. 3 ;

[0027] Figure 5 is a plan view of an input sensing unit according to an embodiment of the present disclosure;

[0028] Figure 6 yes Figure 5 An enlarged plan view of the area A1 shown in FIG.

[0029] Figure 7 is along Figure 6 A cross-sectional view taken along line II' shown in FIG.

[0030] Figure 8 is along Figure 6 A cross-sectional view taken along line II-II' shown in FIG.

[0031] Fig. 9 is along Figure 6 A cross-sectional view taken along line III-III' shown in FIG.

[0032] Fig.10 is a plan view of a display panel according to an embodiment of the present disclosure;

[0033] Fig.11 is a plan view of an input sensing unit according to an embodiment of the present disclosure;

[0034] Fig.12 yes Fig.11 An enlarged plan view of area A2 shown in FIG. 1 ; and

[0035] Fig.13 is along Fig.12 A cross-sectional view taken along line IV-IV' shown in FIG. DETAILED DESCRIPTION

[0036] In this specification, when a component (or region, layer, part, etc.) is referred to as being "on", "connected to" or "coupled to" another component, this means that the component may be directly on, connected to or coupled to the other component, or a third component may be present therebetween.

[0037] The same reference numerals denote the same elements. In addition, in the drawings, the thickness, proportion, and size of components are exaggerated for efficient description.

[0038] “And / or” includes all of one or more combinations defined by the relevant components.

[0039] It will be understood that the terms "first" and "second" are used herein to describe various components, but these components should not be limited by these terms. The above terms are only used to distinguish one component from another component. For example, a first component may be referred to as a second component, and vice versa, without departing from the scope of the present disclosure. Unless the context clearly indicates otherwise, singular expressions include plural meanings.

[0040] In addition, terms such as "below", "lower side", "upper", and "upper side" are used to describe the relationship of the configurations shown in the drawings. These terms are described as relative concepts based on the directions shown in the drawings.

[0041] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this article have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. Generally, terms defined in dictionaries should be considered to have the same meaning as the contextual meaning of the relevant technology, and, unless explicitly defined herein, should not be abnormally understood or understood as having an overly formal meaning.

[0042] In various embodiments of the present disclosure, the terms "comprises," "includes," "including," or "comprising" list attributes, regions, fixed numbers, steps, processes, elements, and / or components, but do not exclude other attributes, regions, fixed numbers, steps, processes, elements, and / or components.

[0043] Hereinafter, another embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0044] Figure 1A is a perspective view of a display device according to an embodiment of the present disclosure. Figure 1B is an exploded perspective view of a display device according to an embodiment of the present disclosure. Figure 2is a block diagram showing a display device according to an embodiment of the present disclosure. Figures 1A to 2 The present disclosure is described.

[0045] Reference Figures 1A to 2 According to an embodiment of the present disclosure, the display device EA may be a device enabled according to an electrical signal. The display device EA may include various embodiments. For example, the display device EA may include a tablet computer, a notebook computer, a computer, a television, etc. In this embodiment, the display device EA is shown as, for example, a smart phone.

[0046] The display device EA may display an image IM toward a third direction DR3 on a display surface FS parallel to the first direction DR1 and the second direction DR2. For example, the image IM is displayed on a plane extending along the first direction DR1 and the second direction DR2. The display surface FS on which the image IM is displayed may correspond to the front surface of the display device EA, and may correspond to the front surface FS of the window 100. Hereinafter, the same reference numeral FS will be used for the display surface and the front surface of the display device EA and the front surface of the window 100. The image IM may include still images as well as dynamic images (e.g., motion images such as videos). Figure 1A , a viewing window and an application icon are shown as examples of the image IM.

[0047] In this embodiment, the front surface (or upper surface) and the rear surface (or lower surface) of each component are defined with reference to the direction shown in the image IM. For example, the front surface and the rear surface of each component of the display device EA are defined with respect to the third direction DR3. For example, the front surface and the rear surface are opposite to each other in the third direction DR3, and the normal direction of each of the front surface and the rear surface may be parallel to the third direction DR3. In addition, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 may be converted into other directions as relative concepts.

[0048] Reference Figure 1B , the display device EA may include a window 100, a display module 200, a driving circuit unit 300, a housing 400, and an electronic module 500. In this embodiment, the window 100 and the housing 400 may be combined to form the appearance of the display device EA. Figure 1A As shown in FIG. 1 , the window 100 and the housing 400 are components (or members) of the display apparatus EA that surround other components of the display apparatus EA.

[0049] The window 100 may include an optically transparent insulating material. For example, the window 100 may include glass or plastic. The window 100 may have a multilayer structure or a single-layer structure. For example, the window 100 may include a plurality of plastic films bonded together using an adhesive, or may include a glass substrate and a plastic film bonded together using an adhesive.

[0050] The window 100 may be divided into a transmissive area TA and a frame area BZA on a plane (eg, a plan view). In this specification, the meaning of "on a plane" or "in a plan view" refers to viewing in a third direction DR3. In addition, the "thickness direction" may refer to the third direction DR3.

[0051] The transmission area TA may be an optically transparent area. The frame area BZA may be a region having a lower light transmittance than the transmission area TA. The frame area BZA may define the shape of the transmission area TA. The frame area BZA is adjacent to the transmission area TA and may surround the transmission area TA.

[0052] The border area BZA may have a set or predetermined color. The border area BZA covers the peripheral area NAA of the display module 200 so as to prevent or reduce the peripheral area NAA from being visually recognized from the outside. For example, the border area BZA reduces the possibility that the peripheral area NAA is visible to the user. On the other hand, this is shown by way of example, and in the window 100 according to an embodiment of the present disclosure, the border area BZA may be omitted.

[0053] In an embodiment of the present disclosure, the sensor areas SA1 and SA2 may be areas overlapping with the electronic module 500 to be described later. The display device EA may receive an external signal for the electronic module 500 through the sensor areas SA1 and SA2, or may provide a signal output from the electronic module 500 to the outside. According to an embodiment of the present disclosure, the sensor areas SA1 and SA2 may overlap with the transmissive area TA. Therefore, a separate area for the sensor areas SA1 and SA2 may be omitted. Therefore, the area of ​​the frame area BZA may be relatively reduced.

[0054] exist Figure 1B , two sensor areas SA1 and SA2 are shown, but the present disclosure is not limited thereto. For example, the sensor areas SA1 and SA2 may be defined as three or more, or one of them may be omitted and they may be defined as a single number. Figure 1B , the sensor areas SA1 and SA2 are defined at the upper left end of the transmission area TA by way of example, but the sensor areas SA1 and SA2 may be located in various areas, such as the upper right end of the transmission area TA, the center of the transmission area TA, the lower left end of the transmission area TA, or the lower right end of the transmission area TA. In addition, one sensor area SA1 may be defined at the upper left end of the transmission area TA, and the other sensor area SA2 may be defined at the upper right end of the transmission area TA.

[0055] The display module 200 may be located below the window 100. In the present specification, "below" may refer to a direction opposite to a direction in which the display module 200 displays an image IM. For example, in one embodiment, "below" may refer to a direction opposite to a third direction DR3. The display module 200 may display an image IM and detect an external input TC. The display module 200 includes a front surface IS, and the front surface IS includes an active area AA and a peripheral area NAA. The active area AA may be an area enabled according to an electrical signal. For example, the active area AA may be enabled in response to receiving an electrical signal.

[0056] In this embodiment, the active area AA is an area for displaying the image IM and is also an area for detecting the external input TC. The transmissive area TA may overlap at least with the active area AA. For example, the transmissive area TA overlaps with the entire front surface of the active area AA or at least a portion of the active area AA. Therefore, the user can view the image IM and / or provide the external input TC through the transmissive area TA.

[0057] The peripheral area NAA may be an area covered by the border area BZA. The peripheral area NAA is adjacent to the active area AA. The peripheral area NAA may surround the active area AA. A driving circuit or driving wiring for driving the active area AA may be located in the peripheral area NAA.

[0058] In this embodiment, the display module 200 is assembled in a flat state in which the active area AA and the peripheral area NAA face the window 100. However, this is shown illustratively, and a portion of the peripheral area NAA may be bent. In some embodiments, a portion of the peripheral area NAA faces the rear surface of the display device EA, so that the area of ​​the border area BZA on the front surface FS of the display device EA can be relatively reduced. Alternatively, the display module 200 may be assembled in a state in which a portion of the active area AA is also bent. Alternatively, in the display module 200 according to an embodiment of the present disclosure, the peripheral area NAA may be omitted.

[0059] The display module 200 may include a display panel 210 and an input sensing unit 220 .

[0060] The display panel 210 may generate an image IM. The image IM generated by the display panel 210 is displayed on the front surface IS and is visually recognized by a user through the transmissive area TA.

[0061] The input sensing unit 220 detects an external input TC applied from the outside. For example, the input sensing unit 220 may detect an external input TC provided to the window 100. The external input TC may be a user input. The user input includes various types of external inputs, such as touch (e.g., by a part of the user's body), light, heat, a pen, or pressure. In this embodiment, the external input TC is shown as a user's hand applied to (or touching) the front surface FS. However, this is described by way of example, and as described above, the external input TC may be provided in various forms, and, depending on the structure of the display device EA, an external input TC applied to the side surface or rear surface of the display device EA may be detected, and the present disclosure is not limited to any one embodiment.

[0062] The driving circuit unit 300 may be electrically connected to the display module 200. The driving circuit unit 300 may include a main circuit board MB and a flexible film CF.

[0063] The flexible film CF is electrically connected to the display module 200. The flexible film CF may connect the display module 200 and the main circuit board MB. For example, the flexible film CF may serve as an electrical interconnection between the display module 200 and the main circuit board MB. The flexible film CF may be connected to a pad (e.g., a display pad) of the display module 200 located in the peripheral area NAA. The flexible film CF provides the display module 200 with an electrical signal for driving the display module 200. For example, the display module 200 receives a driving electrical signal via the flexible film CF. The driving electrical signal may be generated by the flexible film CF or by the main circuit board MB.

[0064] The flexible film CF may be electrically connected to the display panel 210 and the input sensing unit 220. Therefore, the flexible film CF provides the display module 200 with an electrical signal for driving the display panel 210 and an electrical signal for driving the input sensing unit 220. The electrical signal may be generated by the flexible film CF or by the main circuit board MB.

[0065] The main circuit board MB may include various driving circuits for driving the display module 200, a connector for power supply, etc. The flexible film CF may be connected to the main circuit board MB. According to the present disclosure, one main circuit board MB and one flexible film CF are connected to the display module 200. However, this is described in an exemplary manner, and in the display module 200 according to an embodiment of the present disclosure, the display panel 210 and the input sensing unit 220 may be connected to different main circuit boards and different flexible films.

[0066] In one embodiment of the present disclosure, one area of ​​the display module 200 corresponding to the sensor areas SA1 and SA2 may have a relatively higher transmittance than the active area AA not overlapping the sensor areas SA1 and SA2. For example, at least some of the components of the display panel 210 and the components of the input sensing unit 220 may be removed. Therefore, the electronic module 500 positioned to overlap the sensor areas SA1 and SA2 may transmit and / or receive signals through the sensor areas SA1 and SA2.

[0067] Figure 1B It is shown that set or predetermined holes MH1 and MH2 (e.g., hereinafter referred to as module holes) are defined in one area of ​​the display module 200 corresponding to the sensor areas SA1 and SA2. The module holes MH1 and MH2 may be defined in the active area AA and penetrate the display module 200. The display panel 210 and the input sensing unit 220 may be penetrated by the module holes MH1 and MH2. That is, the module holes MH1 and MH2 may be defined by removing all of the configuration of the display panel 210 overlapping the sensor areas SA1 and SA2 and the configuration of the input sensing unit 220 overlapping the sensor areas SA1 and SA2. The module holes MH1 and MH2 are defined in the active area AA so that the sensor areas SA1 and SA2 may be located in the transmission area TA.

[0068] The electronic module 500 may include a first electronic module 501 and a second electronic module 502. On a plane (e.g., in a plan view unfolded along the first direction DR1 and the second direction DR2), the first electronic module 501 and the second electronic module 502 may overlap the module holes MH1 and MH2 and the sensor areas SA1 and SA2. The first electronic module 501 and the second electronic module 502 may be located below the display module 200, and at least a portion of the first electronic module 501 and the second electronic module 502 may be received in the module holes MH1 and MH2. The first electronic module 501 and the second electronic module 502 may receive an external input TC transmitted through the sensor areas SA1 and SA2 or may provide an output through the sensor areas SA1 and SA2.

[0069] The housing 400 is coupled with the window 100. The housing 400 is coupled with the window 100 to provide a set or predetermined space (eg, an inner space) to accommodate the display module 200 and the electronic module 500 inside the display device EA. The display module 200 and the electronic module 500 may be accommodated in the inner space.

[0070] The housing 400 may include a material having relatively high hardness or rigidity. For example, the housing 400 may include a plurality of frames and / or plates including glass, plastic, or metal or a combination thereof. The housing 400 may provide protection (e.g., stably protect) components of the display device EA housed in the internal space from external impact.

[0071] like Figure 2 As shown in FIG. 1 , the display device EA may include a display module 200, a power module PM, a first electronic module EM1, and a second electronic module EM2. The display module 200, the power module PM, the first electronic module EM1, and the second electronic module EM2 may be electrically connected to each other.

[0072] The power module PM provides necessary power for the overall operation of the display apparatus EA. The power module PM may include a battery module.

[0073] The first electronic module EM1 and the second electronic module EM2 may include various functional modules for operating the display device EA.

[0074] The first electronic module EM1 may be located on (eg, directly mounted on) a main circuit board MB electrically connected to the display module 200 , or may be located on (eg, mounted on) a separate board and electrically connected to the main circuit board MB through a connector or the like.

[0075] The first electronic module EM1 may include a control module CM, a wireless communication module TM, an image input module IIM, an audio input module AIM, a memory MM and an external interface IF. In some embodiments, these configurations may not be mounted on the main circuit board MB, but may be electrically connected to the main circuit board MB through a flexible circuit board.

[0076] The control module CM controls the overall operation of the display device EA. The control module CM may be a microprocessor. For example, the control module CM enables or disables the display module 200. The control module CM may control other modules such as the image input module IIM or the audio input module AIM based on a touch signal received from the display module 200.

[0077] The wireless communication module TM can use Bluetooth or Wi-Fi connection to send / receive wireless signals to / from another device (e.g., external device) terminal. The wireless communication module TM can use a universal communication line to send and / or receive voice signals. The wireless communication module TM may include a transmission unit TM1 for modulating and sending a signal to be sent and a receiving unit TM2 for demodulating a received signal.

[0078] The image input module IIM processes the image signal and converts it into image data that can be displayed on the display module 200. The audio input module AIM receives an external audio signal through a microphone in a recording mode, a voice recognition mode, etc. and converts it into electronic voice data.

[0079] The external interface IF may serve as an interface to an external charger, a wired and / or wireless data port, and a card socket (eg, a memory card, a subscriber identification module (SIM) or a user identity module (UIM) card, etc.).

[0080] The second electronic module EM2 may include an audio output module AOM, a light emitting module LM, a light receiving module LRM, and a camera module CMM. These configurations may be located on the main circuit board MB (e.g., directly mounted thereon), or located on a separate substrate (e.g., mounted thereon) and electrically connected to the display module 200 through a connector, or electrically connected to the first electronic module EM1.

[0081] The audio output module AOM converts audio data received from the wireless communication module TM or audio data stored in the memory MM and outputs the converted audio data.

[0082] The light emitting module LM generates and outputs light. The light emitting module LM may output infrared light. The light emitting module LM may include a light emitting diode (LED) element. The light receiving module LRM may sense infrared light. The light receiving module LRM may be enabled when a set or predetermined level or higher level of infrared light is sensed. For example, the light receiving module LRM may be enabled in response to a set or predetermined level of infrared light being applied to (or incident on) the light receiving module LRM. The light receiving module LRM may include a complementary metal oxide semiconductor (CMOS) sensor. After the infrared light generated by the light emitting module LM is output, the infrared light is reflected by an external object (e.g., a user's finger or face), and the reflected infrared light may be incident on the light receiving module LRM. The camera module CMM may capture external images.

[0083] Each of the first electronic module 501 and the second electronic module 502 according to an embodiment of the present disclosure may include at least one of the first electronic module EM1 and the second electronic module EM2. For example, each of the first electronic module 501 and the second electronic module 502 may include at least one of an audio output module AOM, a light emitting module LM, a light receiving module LRM, a camera module CMM, and a thermal sensing module. The first electronic module 501 and the second electronic module 502 may sense an external input (e.g., a signal) received through the sensor areas SA1 and SA2, and / or provide a sound signal such as voice or light such as infrared light to the outside through the sensor areas SA1 and SA2.

[0084] Figure 3A is a plan view of a display panel according to an embodiment of the present disclosure, and Figure 3B is an equivalent circuit diagram of one pixel according to an embodiment of the present disclosure. Figure 4 yes Figure 3A A cross-sectional view of a display panel shown in FIG.

[0085] Reference Figure 3A , the display panel 210 may include a base layer BS, a plurality of pixels PX, a plurality of signal wirings SNL1 , SNL2 , EVDL and EVSL, and a plurality of display pads PD1 to PD3 .

[0086] The active area AA of the display panel 210 is an area where an image is displayed, and the peripheral area NAA may be an area where a driving circuit and corresponding wiring are located. Figure 3A , an active area AA and a peripheral area NAA of the display panel 210 are shown. A plurality of pixels PX may be located in the active area AA.

[0087] The base layer BS may be a silicon substrate, a plastic substrate, a glass substrate, an insulating film, or a laminate structure including a plurality of insulating layers.

[0088] The base layer BS may include a first area AR1, a second area AR2, and a third area AR3. The first area AR1 and the second area AR2 may be defined to be spaced apart from each other. When viewed on a plane, the third area AR3 may surround the first area AR1 and the second area AR2. The third area AR3 may be surrounded by the peripheral area NAA. That is, the first area AR1 to the third area AR3 may be included in the active area AA. The pixel PX may be located in the third area AR3.

[0089] The first area AR1 and the second area AR2 may be areas overlapping the sensor areas SA1 and SA2, respectively, on a plane. The first module hole MH1 and the second module hole MH2 may be located in the first area AR1 and the second area AR2, respectively. Each of the first module hole MH1 and the second module hole MH2 may be a hole penetrating the front and rear surfaces of the base layer BS.

[0090] The first area AR1 is formed to have a larger size than the first module hole MH1, and the second area AR2 is formed to have a larger size than the second module hole MH2. For example, the sizes of the first module hole MH1 and the second module hole MH2 are relatively smaller than the first area AR1 and the second area AR2, respectively. The pixel PX for providing an image may not be located in the first area AR1 and the second area AR2. Therefore, in the display panel 210, the first area AR1 and the second area AR2 of the base layer BS may be defined as a non-display area. The pixel PX may be located in the third area AR3 of the base layer BS. Therefore, the area of ​​the base layer BS including the third area AR3 may be defined as a display area. That is, the display area of ​​the display panel 210 corresponds to the third area AR3 of the base layer BS, and the non-display area of ​​the display panel 210 corresponds to the first area AR1 and the second area AR2 of the base layer BS. Although in Figure 3A 2 shows a structure in which the first area AR1 and the second area AR2 are formed to have the same size, but in another embodiment of the present disclosure, the first area AR1 and the second area AR2 may have different sizes.

[0091] According to an embodiment of the present disclosure, the non-display area surrounded by the display area may be located on a plane. The non-display area may be located adjacent to the first electronic module 501 and the second electronic module 502 (see FIG. Figure 1B ) overlap area.

[0092] A plurality of signal wirings SNL1, SNL2, EVDL, and EVSL are connected to the pixel PX to send an electrical signal to the pixel PX. For example, among the signal wirings included in the display panel 210, a first signal wiring SNL1, a second signal wiring SNL2, a first drive voltage wiring EVDL, and a second drive voltage wiring EVSL are shown. The first signal wiring SNL1 may be referred to as a data wiring. There may be a plurality of first signal wirings SNL1, and the first signal wiring SNL1 may be arranged along a first direction DR1. The second signal wiring SNL2 may include a scan wiring GL and a light emitting control wiring ECL. The scan wiring GL and the light emitting control wiring ECL may be arranged along a second direction DR2. However, this arrangement is shown only as an example, and the signal wirings SNL1, SNL2, EVDL, and EVSL may also include an initialization voltage wiring, and are not limited to any one embodiment.

[0093] exist Figure 3B , an equivalent circuit diagram of one pixel PX from among a plurality of pixels PX is enlarged and shown. Figure 3B A pixel PX connected to an i-th scanning wiring GLi and an i-th emission control wiring ECLi is shown.

[0094] The pixel PX may include a light emitting element ED and a pixel circuit CC. The pixel circuit CC may include a plurality of transistors T1 to T7 and a capacitor CP. The pixel circuit CC controls the amount of current flowing through the light emitting element ED in response to a data signal (eg, SNL1).

[0095] Each of the plurality of transistors T1 to T7 may include an input electrode (or source electrode), an output electrode (or drain electrode), and a control electrode (or gate electrode). In the present disclosure, for convenience, either the input electrode or the output electrode may be referred to as a first electrode, and the other may be referred to as a second electrode.

[0096] The first electrode of the first transistor T1 is connected to the first driving voltage wiring EVDL through the fifth transistor T5, and the second electrode of the first transistor T1 is connected to the anode electrode of the light emitting element ED through the sixth transistor T6. In the present disclosure, the first transistor T1 may be referred to as a driving transistor. The first driving voltage wiring EVDL may receive the first driving voltage ELVDD.

[0097] The first transistor T1 controls the amount of current flowing through the light emitting element ED in response to a voltage applied to a control electrode of the first transistor T1 .

[0098] The second transistor T2 is connected between the first signal wiring SNL1 and the first electrode of the first transistor T1. The control electrode of the second transistor T2 is connected to the i-th scanning wiring GLi. When the i-th scanning signal is applied to the i-th scanning wiring GLi, the second transistor T2 is turned on, thereby electrically connecting the first signal wiring SNL1 and the first electrode of the first transistor T1.

[0099] The third transistor T3 is connected between the second electrode of the first transistor T1 and the control electrode of the first transistor T1. The control electrode of the third transistor T3 is connected to the i-th scanning wiring GLi. When the i-th scanning signal is applied to the i-th scanning wiring GLi, the third transistor T3 is turned on, thereby electrically connecting the second electrode of the first transistor T1 and the control electrode of the first transistor T1. Therefore, when the third transistor T3 is turned on, the first transistor T1 is connected in the form of a diode (for example, the first transistor T1 is connected in the form of a diode).

[0100] The fourth transistor T4 is connected between the node ND and the initial power generation unit (not shown). The control electrode of the fourth transistor T4 is connected to the (i-1)th scan wiring GLi-1. When the (i-1)th scan signal is applied to the (i-1)th scan wiring GLi-1, the fourth transistor T4 is turned on to provide the initialization voltage Vint to the node ND.

[0101] The fifth transistor T5 is connected between the first driving voltage wiring EVDL and the first electrode of the first transistor T1. A control electrode of the fifth transistor T5 is connected to the i-th emission control wiring ECLi.

[0102] The sixth transistor T6 is connected between the second electrode of the first transistor T1 and the anode electrode of the light emitting element ED. A control electrode of the sixth transistor T6 is connected to the i-th light emitting control wiring ECLi.

[0103] The seventh transistor T7 is connected between the initial power generation unit (not shown) and the anode electrode of the light emitting element ED. The control electrode of the seventh transistor T7 is connected to the (i+1)th scanning wiring GLi+1. When the (i+1)th scanning signal is applied to the (i+1)th scanning wiring GLi+1, the seventh transistor T7 is turned on, thereby providing the initialization voltage Vint to the anode electrode of the light emitting element ED.

[0104] The seventh transistor T7 can improve the black display capability of the pixel PX. For example, when the seventh transistor T7 is turned on, the parasitic capacitance (not shown) of the light emitting element ED is discharged. Then, when black brightness is achieved, the light emitting element ED does not emit light due to the leakage current from the first transistor T1, and thus the black display capability can be improved.

[0105] In addition, despite the Figure 3B , the control electrode of the seventh transistor T7 is shown as being connected to the (i+1)th scan wiring GLi+1, but the embodiments of the present disclosure are not limited thereto. In another embodiment of the present disclosure, the control electrode of the seventh transistor T7 may be connected to the i-th scan wiring GLi or the (i-1)-th scan wiring GLi-1.

[0106] The cathode electrode of the light emitting element ED is connected to the second driving voltage wiring EVSL. The second driving voltage wiring EVSL receives the second driving voltage ELVSS. Here, the second driving voltage ELVSS has a lower voltage level than the first driving voltage ELVDD.

[0107] exist Figure 3B , a p-channel metal oxide semiconductor (PMOS) transistor is shown as an example, however, the present disclosure is not limited thereto. In another embodiment of the present disclosure, the pixel circuit CC may be composed of one or more n-channel MOS (NMOS) transistors. In another embodiment of the present disclosure, the pixel circuit CC may include a combination of one or more NMOS transistors and one or more PMOS transistors.

[0108] The capacitor CP is located between the first driving voltage wiring EVDL and the node ND. The capacitor CP stores the difference voltage between the first driving voltage ELVDD and the voltage of the node ND. The voltage of the node ND is proportional to the data signal. When the fifth transistor T5 and the sixth transistor T6 are turned on according to the voltage stored in the capacitor CP, the amount of current flowing through the first transistor T1 can be determined. The equivalent circuit of the pixel PX in the present disclosure is not limited to Figure 3B In another embodiment of the present disclosure, the pixel PX may be implemented in various forms to enable the light emitting element ED to emit light.

[0109] Reference Figure 4 , the display panel 210 includes a base layer BS, a circuit element layer DP-CL, a light emitting element layer DP-EDL, and a thin film sealing layer TFE. In an embodiment, the base layer BS, the circuit element layer DP-CL, the light emitting element layer DP-EDL, and the thin film sealing layer TFE may be sequentially stacked in the third direction DR3.

[0110] The base layer BS may be a member providing a base surface on which the circuit element layers DP-CL are located. The base layer BS may be a glass substrate, a metal substrate, a plastic substrate, etc. However, the embodiment is not limited thereto, and the base layer BS may be an inorganic layer, an organic layer, or a composite layer.

[0111] The circuit element layer DP-CL is located on the base layer BS. The circuit element layer DP-CL may include a pixel circuit CC (see, for example, Figure 3B That is, the circuit element layer DP-CL may include transistors T1 to T7 (see, for example, Figure 3B ) and capacitor CP (see, for example, Figure 3B ).exist Figure 4 In the figure, for the convenience of description, only one transistor PX-TR (hereinafter referred to as a pixel transistor) is shown. Here, the pixel transistor PX-TR may be a reference Figure 3B A first transistor T1 is described.

[0112] The circuit element layer DP-CL further includes a first insulating layer 10, a second insulating layer 20, a third insulating layer 30, a fourth insulating layer 40, a fifth insulating layer 50, and a sixth insulating layer 60 sequentially stacked on the base layer BS in the third direction DR3. The first insulating layer 10 is located on the base layer BS. The first insulating layer 10 may include a barrier layer 11 and a buffer layer 12.

[0113] The barrier layer 11 may include an inorganic material. The barrier layer 11 may prevent or substantially prevent oxygen or moisture flowing through the base layer BS from penetrating into the pixel PX (see Figure 3A). For example, the barrier layer 11 may provide protection to the pixel PX from external oxygen or moisture flowing through the base layer BS. The buffer layer 12 may include an inorganic material. The buffer layer 12 may provide the pixel PX with a lower surface energy than the base layer BS, so that the pixel PX is stably formed on the base layer BS. For example, the buffer layer 12 may provide structural stability to the pixel PX. Figure 4 , the barrier layer 11 and the buffer layer 12 are each shown as a single layer. However, the barrier layer 11 and the buffer layer 12 according to the embodiment of the present disclosure may be provided in plural and may be alternately stacked with each other. In another embodiment, at least one of the barrier layer 11 and the buffer layer 12 may be provided in plural or may be omitted.

[0114] The pixel transistor PX-TR may be located on the first insulating layer 10. The pixel transistor PX-TR includes a semiconductor pattern SP, a control electrode CE, an input electrode IE, and an output electrode OE. The semiconductor pattern SP is located on the first insulating layer 10. The semiconductor pattern SP may include a semiconductor material. The control electrode CE is spaced apart from the semiconductor pattern SP, and a second insulating layer 20 is disposed between the control electrode CE and the semiconductor pattern SP. For example, the second insulating layer 20 provides separation between the control electrode CE and the semiconductor pattern SP. The control electrode CE may be connected to one electrode of the capacitor CP.

[0115] The input electrode IE and the output electrode OE are spaced apart from the control electrode CE, and the third insulating layer 30 and the fourth insulating layer 40 are disposed between the input electrode IE and the output electrode OE and the control electrode CE. For example, the third insulating layer 30 and the fourth insulating layer 40 provide separation between the input electrode IE and the output electrode OE and the control electrode CE. The input electrode IE and the output electrode OE penetrate the second insulating layer 20, the third insulating layer 30, and the fourth insulating layer 40, and are connected to one side and the other side of the semiconductor pattern SP, respectively.

[0116] The upper electrode UE may be located between the third insulating layer 30 and the fourth insulating layer 40. The upper electrode UE may be connected to the other electrode of the capacitor CP.

[0117] The fifth insulating layer 50 is positioned on the fourth insulating layer 40 to cover the input electrode IE and the output electrode OE. The fifth insulating layer 50 may include an organic material and / or an inorganic material, and may have a single layer or a stacked structure.

[0118] The connection electrode CNE may be located on the fifth insulating layer 50. The connection electrode CNE may be connected to the output electrode OE. The sixth insulating layer 60 may be located on the connection electrode CNE.

[0119] The pixel transistor PX-TR according to the embodiment of the present disclosure may be formed in various structures and is not limited to Figure 4 The embodiment shown in .

[0120] The light emitting element layer DP-EDL is located on the circuit element layer DP-CL. The light emitting element layer DP-EDL may include a plurality of light emitting elements ED.

[0121] The light emitting element ED is located on the sixth insulating layer 60. The light emitting element ED may include a first electrode E1, a light emitting layer EL, and a second electrode E2. The first electrode E1 may penetrate the sixth insulating layer 60 to be electrically connected to the pixel transistor PX-TR through the connection electrode CNE.

[0122] The seventh insulating layer 70 may be located on the sixth insulating layer 60. The seventh insulating layer 70 may have an opening portion OP defined therein, and the opening portion OP may expose at least a portion of the first electrode E1. The seventh insulating layer 70 may be a pixel defining layer.

[0123] The light emitting layer EL may be located on the first electrode E1 exposed by the opening portion OP defined in the seventh insulating layer 70. The light emitting layer EL may include a light emitting material. For example, the light emitting layer EL may be composed of at least one of a material emitting red light, green light, or blue light. The light emitting layer EL may include a fluorescent material or a phosphorescent material. The light emitting layer EL may include an organic light emitting material or an inorganic light emitting material. The light emitting layer EL may emit light in response to a potential difference between the first electrode E1 and the second electrode E2.

[0124] The second electrode E2 may be located on the light emitting layer EL. The second electrode E2 may be commonly used for a plurality of pixels PX. In other words, the second electrode E2 may be a common electrode shared by a plurality of pixels. The second electrode E2 may have a Figure 3A ) corresponding to the shape. The second electrode E2 can be electrically connected to the peripheral area NAA (see Figure 3A ) in the second drive voltage wiring EVSL (see Figure 3A The second driving voltage wiring EVSL may provide the second driving voltage ELVSS to the second electrode E2 (see Figure 3B ). Therefore, each light emitting element ED located in each of the pixels PX may receive the common second driving voltage ELVSS through the second electrode E2.

[0125] The second electrode E2 may include a transmissive conductive material or a translucent conductive material. Accordingly, light generated in the light-emitting layer EL (or emitted therefrom) may be emitted toward the third direction DR3 through the second electrode E2. However, this is explained by way of example. Depending on the design, the light-emitting element ED according to an embodiment of the present disclosure may be driven in a rear surface light-emitting system in which the first electrode E1 includes a transparent or translucent material, or may be driven in a double-sided light-emitting system in which light is emitted toward both the front surface and the rear surface (for example, a dual-emission display in which light is emitted toward the third direction DR3 and in a direction opposite to the third direction DR3), but is not limited to any one embodiment.

[0126] The thin film sealing layer TFE may be located on the light emitting element layer DP-EDL to seal the light emitting element ED. The thin film sealing layer TFE may cover the entire active area AA. The thin film sealing layer TFE may cover some areas of the peripheral area NAA.

[0127] The thin film sealing layer TFE may include a first inorganic layer 81, an organic layer 82, and a second inorganic layer 83 sequentially stacked along the third direction DR3. In this embodiment, each of the first inorganic layer 81, the organic layer 82, and the second inorganic layer 83 is shown as a single layer. However, this is shown illustratively, and at least one of the first inorganic layer 81, the organic layer 82, and the second inorganic layer 83 may be provided in plural or may be omitted, but is not limited to any one embodiment.

[0128] The first inorganic layer 81 may cover the second electrode E2. The first inorganic layer 81 may prevent or reduce external moisture or oxygen from penetrating into the light emitting element ED. For example, the first inorganic layer 81 may include silicon nitride, silicon oxide, or a combination thereof. The first inorganic layer 81 may be formed by a deposition process.

[0129] The organic layer 82 may be located on and in contact with the first inorganic layer 81. The organic layer 82 may provide a flat surface on the first inorganic layer 81. For example, the organic layer 82 may provide a flat surface to the active area AA.

[0130] The bent portion formed on the upper surface of the first inorganic layer 81 and the particles existing on the first inorganic layer 81 are covered by the organic layer 82, so that the surface state of the upper surface of the first inorganic layer 81 can be prevented or reduced from affecting the structure formed on the organic layer 82. In addition, the organic layer 82 can relieve stress between contact layers. The organic layer 82 may include an organic material and may be formed by a solution process such as a spin coating process, a slit coating process, or an inkjet process.

[0131] The second inorganic layer 83 is located on the organic layer 82 to cover the organic layer 82. Compared with being located on the first inorganic layer 81, the second inorganic layer 83 can be stably formed on a relatively flat surface. The second inorganic layer 83 can seal moisture, etc. emitted from the organic layer 82 to prevent or reduce it from being introduced to the outside. For example, the second inorganic layer 83 protects the organic layer 82 from external interference by sealing the organic layer 82. The second inorganic layer 83 may include silicon nitride, silicon oxide, or a combination thereof. The second inorganic layer 83 may be formed by a deposition process.

[0132] Refer again Figure 3A , the display panel 210 includes a connection wiring portion. The connection wiring portion includes a plurality of sensing connection wirings TCL1 to TCln. The plurality of sensing connection wirings TCL1 to TCln are located in the peripheral area NAA. On a plane (e.g., a plane extending along the first direction DR1 and the second direction DR2), the plurality of sensing connection wirings TCL1 to TCln may overlap with the second driving voltage wiring EVSL. The plurality of sensing connection wirings TCL1 to TCln may extend in the second direction DR2 and may be arranged along the first direction DR1.

[0133] The connection wiring portion may further include a first contact portion CTP1 and a second contact portion CTP2. The first contact portion CTP1 is connected to one end of the plurality of sensing connection wirings TCL1 to TCln, and the second contact portion CTP2 is connected to the other end of the plurality of sensing connection wirings TCL1 to TCln. The first contact portion CTP1 includes a plurality of first contact electrodes CTE1 to CTEn located at one end of the plurality of sensing connection wirings TCL1 to TCln (e.g., extending from them). The second contact portion CTP2 includes a plurality of second contact electrodes CTO1 to CTOn located at the other end (e.g., the opposite end) of the plurality of sensing connection wirings TCL1 to TCln.

[0134] The connection wiring portion may be electrically connected to the input sensing unit 220. For example, the plurality of sensing connection wirings TCL1 to TCln may directly electrically contact the sensing signal wiring portion of the input sensing unit 220 through the first and second contact portions CTP1 and CTP2.

[0135] The display panel 210 may include a first pad PD1, a second pad PD2, and a third pad PD3 located in the peripheral area NAA. The first pad PD1 may be provided in plurality and connected to the first signal wiring SNL1. The second pad PD2 may be electrically connected to the first drive voltage wiring EVDL, and the third pad PD3 may be electrically connected to the second drive voltage wiring EVSL. The display panel 210 may provide an electrical signal from the outside (e.g., an external source) to the pixel PX through the first pad PD1 to the third pad PD3. In some embodiments, in addition to the first pad PD1 to the third pad PD3, the display panel 210 may further include a pad for receiving an electrical signal, without being limited to the embodiments shown in the current figure.

[0136] Figure 5 is a plan view of an input sensing unit according to an embodiment of the present disclosure, and Figure 6 yes Figure 5 An enlarged plan view of the area A1 shown in FIG. Figure 7 is along Figure 6 A sectional view taken along line II`. Figure 8 is along Figure 6 A sectional view taken along line II-II`. Fig. 9 is along Figure 6 A sectional view taken along line III-III`.

[0137] Reference Figure 5 and Figure 6 The input sensing unit 220 may be located on the display panel 210 (eg Figure 3A After forming the display panel 210, the input sensing unit 220 is formed through a continuous process. Therefore, the input sensing unit 220 may be referred to as an input sensing layer.

[0138] The input sensing unit 220 includes a first sensing electrode TE1, a second sensing electrode TE2, sensing signal wiring portions RSL, TSL1, and TSL2, and sensing pad portions RPD, TPD1, ​​and TPD2.

[0139] The first sensing electrode TE1 and the second sensing electrode TE2 are located in the active area AA. The input sensing unit 220 can obtain information about the external input TC (see FIG. 1 ) through the capacitance change between the first sensing electrode TE1 and the second sensing electrode TE2. Figure 1A ) of (e.g., related to) the

[0140] The first sensing electrode TE1 may include a plurality of first sensing patterns SP1 and a plurality of first connection patterns BP1. At least one first connection pattern BP1 may be connected to two first sensing patterns SP1 adjacent to each other. For example, the first sensing patterns SP1 are arranged along the first direction DR1 and the second direction DR2, and the first connection pattern BP1 connects at least two first sensing patterns SP1 adjacent to each other in the first direction DR1.

[0141] The second sensing electrode TE2 may include a plurality of second sensing patterns SP2 and a plurality of second connection patterns BP2. At least one second connection pattern BP2 may be connected to two second sensing patterns SP2 adjacent to each other. For example, the second sensing patterns SP2 are arranged along the first direction DR1 and the second direction DR2, and the second connection pattern BP2 connects at least two second sensing patterns SP2 adjacent to each other in the second direction DR2.

[0142] The sensing signal wiring portions RSL, TSL1, and TSL2 are located in the peripheral area NAA. The sensing signal wiring portions RSL, TSL1, and TSL2 may include a reception wiring portion RSL, a first transmission wiring portion TSL1, and a second transmission wiring portion TSL2.

[0143] The receiving wiring portion RSL is connected to the first sensing electrode TE1. The first transmitting wiring portion TSL1 and the second transmitting wiring portion TSL2 are connected to the second sensing electrode TE2. For example, the first transmitting wiring portion TSL1 is connected to one end of the second sensing electrode TE2, and the second transmitting wiring portion TSL2 is connected to the other end (e.g., the opposite end) of the second sensing electrode TE2. The other end of the second sensing electrode TE2 may be a portion opposite to one end of the second sensing electrode TE2.

[0144] According to an embodiment of the present disclosure, the second sensing electrode TE2 has a relatively long length in the second direction DR2 compared to the first sensing electrode TE1. That is, the first sensing electrode TE1 includes a group of m first sensing patterns SP1 arranged along the second direction DR2, and in each group of the first sensing patterns SP1, the n first sensing patterns SP1 are connected to each other and located in the first direction DR1. In some embodiments, the second sensing electrode TE2 includes a group of n second sensing patterns SP2 arranged along the first direction DR1, and in each group of the second sensing patterns SP2, the m second sensing patterns SP2 are connected to each other and located in the second direction DR2. In the case where the input sensing unit 220 has a longitudinal shape in which the side along the second direction DR2 is longer than the side along the first direction DR1, n and m may be integers greater than 1, and m may be a number greater than n. In this case, the length of each group of the second sensing patterns SP2 may be longer than the length of the group of the first sensing patterns SP1. Therefore, by connecting both ends of the second sensing electrode TE2 to the first and second transmission wiring portions TSL1 and TSL2 , the sensitivity according to the position of the second sensing electrode TE2 may be uniformly maintained.

[0145] According to some embodiments of the present disclosure, the first transmission wiring portion TSL1 includes a plurality of one-side (e.g., first-side) transmission wirings TSL1-1 to TSL1-n respectively connected to one end of a group of n second sensing patterns SP2. The second transmission wiring portion TSL2 includes a plurality of other-side (e.g., second-side) transmission wirings TSL2-1 to TSL2-n connected to the other end of the group of n second sensing patterns SP2. Figure 5 As shown in , the first side may be the lower side and the second side may be the right side.

[0146] The second transmission wiring portion TSL2 also includes a first sensing contact portion TCP1 and a second sensing contact portion TCP2 extending from a plurality of other side (e.g., second side) transmission wirings TSL2-1 to TSL2-n. As an example of the present disclosure, the first sensing contact portion TCP1 is positioned adjacent to the one end of the second sensing electrode TE2, and the second sensing contact portion TCP2 is positioned adjacent to the other end of the second sensing electrode TE2. The first transmission wiring portion TSL1 and the second transmission wiring portion TSL2 are located in the peripheral area NAA, and for example, the first transmission wiring portion TSL1 and the second transmission wiring portion TSL2 may be formed on the thin film sealing layer TFE (e.g., Figure 4 The first sensing contact portion TCP1 and the second sensing contact portion TCP2 may be located in the peripheral area NAA, and, for example, may be located outside the thin film sealing area TFEA.

[0147] The first sensing contact portion TCP1 includes a plurality of first sensing contact electrodes TCE1 to TCEn at one end of a plurality of other-side transmission wirings TSL2-1 to TSL2-n. The second sensing contact portion TCP2 includes a plurality of second sensing contact electrodes TCO1 to TCOn at the other side (eg, the opposite side) of the plurality of other-side transmission wirings TSL2-1 to TSL2-n.

[0148] The first sensing contact portion TCP1 and the second sensing contact portion TCP2 may be located adjacent to the first contact portion CTP1 and the second contact portion CTP2 of the display panel 210 (eg, see Figure 3A ). The first sensing contact portion TCP1 and the second sensing contact portion TCP2 may directly contact the first contact portion CTP1 and the second contact portion CTP2, respectively. For example, the plurality of first sensing contact electrodes TCE1 to TCEn are in contact with the plurality of first contact electrodes CTE1 to CTEn, respectively, and the plurality of second sensing contact electrodes TCO1 to TCOn are in contact with the plurality of second contact electrodes CTO1 to CTOn, respectively.

[0149] The sensing pad portions RPD, TPD1, ​​and TPD2 are located in the peripheral area NAA. In some embodiments, the sensing pad portions RPD, TPD1, ​​and TPD2 may include a plurality of receiving pads RPD, a plurality of first sending pads TPD1, ​​and a plurality of second sending pads TPD2. The plurality of receiving pads RPD are connected to the receiving wiring portion RSL and are electrically connected to the first sensing electrode TE1. The plurality of first sending pads TPD1 are connected to the first sending wiring portion TSL1, and the plurality of second sending pads TPD2 are connected to the second sending wiring portion TSL2. Therefore, the first sending pads TPD1 and the second sending pads TPD2 may be electrically connected to the second sensing electrode TE2.

[0150] In some embodiments, some of the components of the input sensing unit 220 may be removed or omitted from the areas corresponding to the sensor areas SA1 and SA2. For example, at least some of the portions of the first sensing electrode TE1 and the second sensing electrode TE2 may not be located in the sensor areas SA1 and SA2. In one embodiment, the first sensing electrode TE1 may overlap the sensor areas SA1 and SA2 and may include a first sensing pattern SP1 having a portion removed, and the second sensing electrode TE2 may include a second sensing pattern SP2 having a portion removed. For example, the sensor areas SA1 and SA2 may have the first sensing pattern SP1 and the second sensing pattern SP2 at least partially removed.

[0151] According to an embodiment of the present disclosure, by removing portions of the sensing electrodes TE1 and TE2 at the regions overlapping the sensor areas SA1 and SA2, the electronic module 500 (see Figure 1B ) is covered by (eg, hidden behind) the first sensing electrode TE1 or the second sensing electrode TE2. Therefore, the sensitivity (eg, sensing sensitivity) of the electronic module 500 can be improved.

[0152] Reference Figure 6 and Figure 7 The stacked structure of the circuit element layer DP-CL, the light emitting element layer DP-EDL and the thin film sealing layer TFE in the active area AA has the same structure as that of the reference Figure 4 The described configuration is the same configuration, and therefore, a detailed description thereof will be omitted.

[0153] The circuit element layer DP-CL may include a drive circuit GDC for driving the pixel circuit. The drive circuit GDC is located in the peripheral area NAA. The drive circuit GDC includes at least one transistor GDC-TR, which is formed by the same process as the pixel transistor PX-TR in the active area AA. The drive circuit GDC may include a control signal line GDC-SL located on the same layer as the input electrode IE of the pixel transistor PX-TR. Although not shown separately, the drive circuit GDC may also include a control signal line located on the same layer as the control electrode CE of the pixel transistor PX-TR.

[0154] The second driving voltage wiring EVSL may be in the peripheral area NAA and located outside the driving circuit GDC. The second driving voltage wiring EVSL may be located on the same layer as the connection electrode CNE of the pixel transistor PX-TR. The second driving voltage wiring EVSL may receive a second driving voltage ELVSS from the outside.

[0155] A plurality of sensing connection wirings TCL1 to TCL4 are located in the peripheral area NAA. A plurality of sensing connection wirings TCL1 to TCL4 may be located on the same layer as the input electrode IE of the pixel transistor PX-TR. A plurality of sensing connection wirings TCL1 to TCL4 may be located below the second drive voltage wiring EVSL and may be electrically separated from the second drive voltage wiring EVSL. For example, a plurality of sensing connection wirings TCL1 to TCL4 may be electrically isolated from the second drive voltage wiring EVSL. On a plane (for example, in a plan view unfolded along the first direction DR1 and the second direction DR2), a plurality of sensing connection wirings TCL1 to TCL4 may overlap with the second drive voltage wiring EVSL.

[0156] Reference Figure 6 and Figure 7, the input sensing unit 220 may include a first conductive layer, a second conductive layer, a first wiring layer, a second wiring layer, a first touch insulating layer 91, and a second touch insulating layer 92. The first conductive layer is located on the display panel 210. For example, the first conductive layer may be formed on the thin film sealing layer TFE. The first conductive layer may include at least one of the first sensing pattern SP1 and the second sensing pattern SP2 and the first connection pattern BP1 and the second connection pattern BP2. As an example of the present disclosure, the first conductive layer may include the second connection pattern BP2. The first conductive layer is covered by the first touch insulating layer 91.

[0157] The second conductive layer is located on the first touch insulating layer 91. The second conductive layer may include at least one of the first sensing pattern SP1 and the second sensing pattern SP2 and the first connection pattern BP1 and the second connection pattern BP2. The second conductive layer may include the first connection pattern BP1 and the first sensing pattern SP1 and the second sensing pattern SP2. A contact hole for connecting the second connection pattern BP2 and the second sensing pattern SP2 may be located in the first touch insulating layer 91.

[0158] The second conductive layer is covered by the second touch insulating layer 92. The first touch insulating layer 91 and the second touch insulating layer 92 may have insulating properties and may be optically transparent. The first touch insulating layer 91 and the second touch insulating layer 92 may include at least one inorganic layer and / or an organic layer. For example, when the first touch insulating layer 91 and the second touch insulating layer 92 include an organic layer, the ductility of the input sensing unit 220 may be improved. When the first touch insulating layer 91 and the second touch insulating layer 92 include an inorganic layer, a thin input sensing unit 220 may be provided, and the internal impact strength may be improved. The first touch insulating layer 91 and the second touch insulating layer 92 according to an embodiment of the present disclosure may include various materials and are not limited to any one embodiment.

[0159] Sensing signal wiring parts RSL, TSL1 and TSL2 (see Figure 5 Each of the wirings of ) may have a double wiring structure. Figure 7 As shown in FIG. 1 , each of the plurality of other-side transmission wirings TSL2 - 1 to TSL2 - 4 of the second transmission wiring portion TSL2 may include a first wiring layer MTL1 and a second wiring layer MTL2 . Figure 7 , as an example of the present disclosure, only the second transmission wiring portion TSL2 is illustrated, but the wiring of the sensing signal wiring portion RSL and the TSL1 may also include the first wiring layer MTL1 and the second wiring layer MTL2.

[0160] The first wiring layer MTL1 is located on the same layer as the first conductive layer. That is, the first conductive layer and the first wiring layer MTL1 are formed on the thin film sealing layer TFE by the same process, and the second conductive layer and the second wiring layer MTL2 are formed on the first touch insulating layer 91 by the same process.

[0161] The first wiring layer MTL1 may contact the corresponding second wiring layer MTL2 through the second contact hole in the first touch insulating layer 91. There may be a plurality of second contact holes in the first touch insulating layer 91, and the plurality of second contact holes may be arranged at set or predetermined intervals along the extension direction of the corresponding wiring.

[0162] On a plane, the other side transmission wiring TSL2-1 to TSL2-4 of the second transmission wiring portion TSL2 may overlap with a plurality of sensing connection wirings TCL1 to TCL4 and the second driving voltage wiring EVSL. Each of the other side transmission wirings TSL2-1 to TSL2-4 may be electrically connected to a corresponding sensing connection wiring in a plurality of sensing connection wirings TCL1 to TCL4. Specifically, the second transmission wiring portion TSL2 may be electrically connected to (e.g., contacted with) the connection wiring portion by the first contact portion CTP1 and the second contact portion CTP2 contacting the first sensing contact portion TCP1 and the second sensing contact portion TCP2.

[0163] like Figure 6 As shown in FIG. 1 , the plurality of second contact electrodes CTO1 to CTO4 located on the second contact portion CTP2 are in direct contact with the plurality of second sensing contact electrodes TCO1 to TCO4 located on the second sensing contact portion TCP2 , respectively.

[0164] Reference Figure 8 , the fourth other side sending wiring TSL2-4 among the other side sending wirings TSL2-1 to TSL2-4 may include a first wiring layer MTL1 and a second wiring layer MTL2. The area where the fourth other side sending wiring TSL2-4 crosses with the other side sending wirings TSL2-1 to TSL2-3 may be defined as a cross area CA, and the area where the fourth other side sending wiring TSL2-4 does not cross with the other side sending wirings TSL2-1 to TSL2-3 may be defined as a non-cross area NCA.

[0165] In the non-intersection area NCA, the fourth other side sending wiring TSL2-4 has a double-layer structure in which the first wiring layer MTL1 and the second wiring layer MTL2 are arranged side by side (for example, or arranged on top of each other in a stacked structure, for example, the second wiring layer MTL2 may be stacked on the first wiring layer MTL1). In the intersection area CA, the fourth other side sending wiring TSL2-4 may have a single-layer structure including only one wiring layer (for example, MTL1) of the first wiring layer MTL1 and the second wiring layer MTL2. For example, in the intersection area CA, the fourth other side sending wiring TSL2-4 may include only the first wiring layer MTL1. In the intersection area CA, the second wiring layer MTL2 of the fourth other side sending wiring TSL2-4 may be removed or omitted.

[0166] The first other side sending wiring TSL2-1 to the third other side sending wiring TSL2-3 among the other side sending wiring TSL2-1 to TSL2-4 may have a single-layer structure including only one wiring layer of the first wiring layer MTL1 and the second wiring layer MTL2. Since the fourth other side sending wiring TSL2-4 is composed of the first wiring layer MTL1 in the intersection (e.g., intersection) area CA, the first other side sending wiring TSL2-1 to the third other side sending wiring TSL2-3 may be composed of the second wiring layer MTL2 to avoid electrical contact with the fourth other side sending wiring TSL2-4.

[0167] In the intersection (eg, crossing) area CA, the arrangement structure between the other-side sending wirings TSL2-1 to TSL2-4 is not limited to Figure 6 and Figure 8 That is, the arrangement structure of the other-side sending wirings TSL2-1 to TSL2-4 can be variously modified within a range in which they do not electrically contact each other.

[0168] exist Figure 6 , for convenience, it is shown that the other side transmission wirings TSL2-1 to TSL2-4 do not overlap with the corresponding sensing connection wirings TCL1 to TCL4 in the thin film sealing area TFEA, but they may substantially overlap on a plane.

[0169] Reference Figure 6 and Fig. 9 , each of the plurality of second sensing contact electrodes TCO1 to TCO4 is respectively located at one end of the other side transmission wirings TSL2-1 to TSL2-4. The plurality of second sensing contact electrodes TCO1 to TCO4 overlap with the plurality of second contact electrodes CTO1 to CTO4 respectively. The plurality of second sensing contact electrodes TCO1 to TCO4 are respectively in contact with the plurality of second contact electrodes CTO1 to CTO4 through contact holes.

[0170] like Fig. 9 As shown in , the second contact electrode CTO4 directly contacts the second sensing contact electrode TCO4. The second contact electrode CTO4 may include a first electrode layer CTL1 and a second electrode layer CTL2. The first electrode layer CTL1 is located on the same layer as the sensing connection wirings TCL1 to TCL4 and is located at one end of the corresponding sensing connection wirings TCL1 to TCL4. The second electrode layer CTL2 is located on the same layer as the second driving voltage wiring EVSL and is located at the upper portion of the first electrode layer CTL1.

[0171] The second electrode layer CTL2 may be exposed through the contact holes in the sixth insulating layer 60, the first and second inorganic layers 81 and 83, and the first touch insulating layer 91. Therefore, the second sensing contact electrode TCO4 in the second contact portion CTP2 may directly contact the second electrode layer CTL2 through the contact hole. The second sensing contact electrode TCO4 may be located on the same layer as the second wiring layer MTL2. Therefore, through the second contact electrode CTO4 and the second sensing contact electrode TCO4, the fourth other-side sending wiring TSL2-4 may be electrically connected to the corresponding sensing connection wiring TCL4.

[0172] Refer again Figure 7 The display panel 210 may further include a first dam portion DMP1 and a second dam portion DMP2 located in the peripheral area NAA. Figure 7 As shown in , the first dam portion DMP1 and the second dam portion DMP2 may have a multi-layer structure. The second dam portion DMP2 may be positioned more outward than the first dam portion DMP1. The first dam portion DMP1 includes a first lower dam DM1-L, a first middle dam DM1-M, and a first upper dam DM1-U. The second dam portion DMP2 includes a second lower dam DM2-L, a second middle dam DM2-M, and a second upper dam DM2-U.

[0173] The first lower bank DM1-L and the second lower bank DM2-L may be formed simultaneously with the sixth insulating layer 60. The first middle bank DM1-M and the second middle bank DM2-M are respectively located on the first lower bank DM1-L and the second lower bank DM2-L. The first middle bank DM1-M and the second middle bank DM2-M may be formed simultaneously with the seventh insulating layer 70. The first upper bank DM1-U and the second upper bank DM2-U are respectively located on the first middle bank DM1-M and the second middle bank DM2-M. A dummy insulating layer 75 may be located on the seventh insulating layer 70 in the active area AA, wherein the dummy insulating layer 75 is formed simultaneously with the first upper bank DM1-U and the second upper bank DM2-U.

[0174] The first dam portion DMP1 and the second dam portion DMP2 may be arranged in a closed ring in the peripheral area NAA to surround the active area AA. Therefore, the first dam portion DMP1 and the second dam portion DMP2 may prevent or substantially prevent the liquid organic material in the active area AA from spreading outward during the process of forming the organic layer 82 of the thin film sealing layer TFE. For example, during the formation of the organic layer 82, the first dam portion DMP1 and the second dam portion DMP2 may prevent the liquid organic material from overflowing. The organic layer 82 is formed by coating the liquid organic material on the first inorganic layer 81 via an inkjet method, and the first dam portion DMP1 and the second dam portion DMP2 may set the boundary of the area where the liquid organic material is located. The second dam portion DMP2 may be positioned further outward from the active area AA than the first dam portion DMP1.

[0175] The structures of the first bank portion DMP1 and the second bank portion DMP2 are not limited to Figure 7 For example, the display panel 210 may include only one of the first and second dam portions DMP1 and DMP2. Also, although it is shown that each of the first and second dam portions DMP1 and DMP2 has a three-layer film structure, each of the first and second dam portions DMP1 and DMP2 may have a double-layer film structure.

[0176] The first inorganic layer 81 and the second inorganic layer 83 may contact each other at upper portions (e.g., upper surfaces) of the first dam portion DMP1 and the second dam portion DMP2. Since the organic layer 82 is located within the region defined by the first dam portion DMP1 and the second dam portion DMP2, the first inorganic layer 81 and the second inorganic layer 83 may contact each other on the first dam portion DMP1 and the second dam portion DMP2 to seal the organic layer 82.

[0177] The first and second contact portions CTP1 and CTP2 are located outside the first and second dam portions DMP1 and DMP2, thereby forming a contact structure for contacting the other side transmission wirings TSL2-1 to TSL2-n of the second transmission wiring portion TSL2 and a plurality of sensing connection wirings TCL1 to TCln.

[0178] In some embodiments, the wiring resistance generated in the second transmission wiring portion TSL2 can be reduced by connecting the second transmission wiring portion TSL2 to the plurality of sensing connection wirings TCL1 to TCL4 in the display panel 210. The second transmission wiring portion TSL2 has a length longer than that of the first transmission wiring portion TSL1, thereby increasing the wiring resistance. When the line width of the second transmission wiring portion TSL2 is increased to overcome the wiring resistance difference, the width of the peripheral area NAA may increase, thereby increasing the border width of the display device EA.

[0179] However, when the second transmission wiring portion TSL2 is electrically connected to the plurality of sensing connection wirings TCL1 to TCL4 in the display panel 210, the wiring resistance can be reduced without increasing the line width of the second transmission wiring portion TSL2. In addition, since the plurality of sensing connection wirings TCL1 to TCL4 are arranged in a structure overlapping the second drive voltage wiring EVSL and the second transmission wiring portion TSL2 on a plane, the frame width is not increased by the plurality of sensing connection wirings TCL1 to TCL4. Therefore, the wiring resistance of the second transmission wiring portion TSL2 can be reduced without increasing the frame width.

[0180] Fig.10 is a plan view of a display panel according to an embodiment of the present disclosure, and Fig.11 is a plan view of an input sensing unit according to an embodiment of the present disclosure. Fig.12 yes Fig.11 an enlarged plan view of the area A2 shown in FIG. 1 , and Fig.13 is along Fig.12 A cross-sectional view taken along line IV-IV` shown in FIG.

[0181] Reference Fig.10 In the display panel 215 according to the embodiment of the present disclosure, Figure 3A The base layer BS shown in FIG. 1 is different from the base layer BS2 in that the base layer BS2 is not divided into the first to third areas AR1 to AR3. That is, the first module hole MH1 and the second module hole MH2 ( Figure 3A ) may not be in the base layer BS2.

[0182] The display panel 215 may include a connection wiring portion located in the peripheral area NAA. The connection wiring portion includes a plurality of sensing connection wirings TCL1 to TCln. The plurality of sensing connection wirings TCL1 to TCln may extend in the second direction DR2 and may be arranged along the first direction DR1. The plurality of sensing connection wirings TCL1 to TCln may be positioned further outward than the second driving voltage wiring EVSL.

[0183] The connection wiring portion includes a first contact portion CTP1 connected to one end of the plurality of sensing connection wirings TCL1 to TCln and a second contact portion CTP2 connected to the other end of the plurality of sensing connection wirings TCL1 to TCln. The first contact portion CTP1 includes a plurality of first contact electrodes CTE1 to CTEn at one end of the plurality of sensing connection wirings TCL1 to TCln. The second contact portion CTP2 includes a plurality of second contact electrodes CT01 to CTOn at the other end of the plurality of sensing connection wirings TCL1 to TCln.

[0184] The connection wiring portion may be electrically connected to the input sensing unit 225. Specifically, the plurality of sensing connection wirings TCL1 to TCln may directly electrically contact the sensing signal wiring portions RSL, TSL1, and TSL2 of the input sensing unit 225 through the first and second contact portions CTP1 and CTP2.

[0185] Reference Fig.11 In the embodiment of the present disclosure, the first transmission wiring portion TSL1 includes a plurality of one-side transmission wirings TSL1-1 to TSL1-n respectively connected to one ends of the group of n second sensing patterns SP2. The second transmission wiring portion TSL2 includes a plurality of other-side (e.g., Fig.11 The upper side of the transmission wiring TSL2-1 to TSL2-n. The second transmission wiring portion TSL2 also includes a first sensing contact portion TCP1 and a second sensing contact portion TCP2. The first sensing contact portion TCP1 includes a plurality of first sensing contact electrodes TCE1 to TCEn extending from a plurality of second transmission pads TPD2. The second sensing contact portion TCP2 includes a plurality of second sensing contact electrodes TCO1 to TCOn located at the other end of the plurality of other-side transmission wirings TSL2-1 to TSL2-n opposite to the end thereof connected to the second sensing electrode TE2.

[0186] As an example of the present disclosure, the first sensing contact portion TCP1 is positioned adjacent to one end of the second sensing electrode TE2, and the second sensing contact portion TCP2 is positioned adjacent to the other end of the second sensing electrode TE2. The first transmission wiring portion TSL1 and the second transmission wiring portion TSL2 are located in the peripheral area NAA, and specifically, the first transmission wiring portion TSL1 and the second transmission wiring portion TSL2 may be located in the area where the thin film sealing layer TFE ( Figure 4 The first sensing contact portion TCP1 and the second sensing contact portion TCP2 may be located in the peripheral area NAA, and, for example, may be located outside the thin film sealing area TFEA.

[0187] The first sensing contact portion TCP1 and the second sensing contact portion TCP2 may be located adjacent to the first sensing contact portion TCP1 and the second sensing contact portion TCP2 of the display panel 215 (see Fig.10 ). The first sensing contact portion TCP1 and the second sensing contact portion TCP2 may directly contact the first contact portion CTP1 and the second contact portion CTP2, respectively. For example, the plurality of first sensing contact electrodes TCE1 to TCEn are in contact with the plurality of first contact electrodes CTE1 to CTEn, respectively, and the plurality of second sensing contact electrodes TCO1 to TCOn are in contact with the plurality of second contact electrodes CTO1 to CTOn, respectively.

[0188] like Fig.12 As shown in , on a plane, a plurality of sensing connection wirings TCL1 to TCL4 may be located outside the second driving voltage wiring EVSL. Each of the other side transmission wirings TSL2-1 to TSL2-4 may be electrically connected to a corresponding sensing connection wiring in the plurality of sensing connection wirings TCL1 to TCL4. Specifically, the second transmission wiring portion TSL2 may be electrically connected to the connection wiring portion through the first contact portion CTP1 and the second contact portion CTP2 in contact with the first sensing contact portion TCP1 and the second sensing contact portion TCP2.

[0189] The plurality of second contact electrodes CTO1 to CTO4 formed on the second contact portion CTP2 are in direct contact with the plurality of second sensing contact electrodes TCO1 to TCO4 formed on the second sensing contact portion TCP2 , respectively.

[0190] Reference Fig.13 , on the thin film sealing layer TFE in the peripheral area NAA, some wirings (eg, Figure 7 2-1 to TSL2-4 shown in FIG. 2 ). Therefore, the connection interference between the sensing signal wiring portions RSL, TSL1 and TSL2 of the input sensing unit 225 and the elements (or wirings) of the display panel 215 can be reduced, and thus, the sensitivity reduction of the input sensing unit 225 due to the electrical signal interference can be prevented or reduced.

[0191] The display device according to the embodiment of the present disclosure electrically connects the sensing signal wiring portion in the input sensing unit to the connection wiring portion in the display panel, thereby reducing the wiring resistance of the sensing signal wiring portion. In addition, since the connection wiring portion is located in a structure overlapping with the sensing signal wiring portion on a plane, the increase in the frame width caused by the connection wiring portion can be prevented or reduced.

[0192] In addition, since some wirings of the sensing signal wiring portion are located on the display panel, it is possible to prevent or reduce a decrease in sensitivity due to electrical signal interference between the display panel and the input sensing unit.

[0193] Although the implementation methods of the present disclosure have been described, it should be understood that the present disclosure should not be limited to these implementation methods, but a person skilled in the art may make various changes and modifications within the spirit and scope of the present disclosure as claimed herein.

Claims

1. A display device, comprising: A base layer having an active area and a peripheral area outside the active area; a circuit element layer including a pixel circuit located in the effective area of ​​the base layer and a driving voltage wiring located in the peripheral area of ​​the base layer to supply a driving voltage to the pixel circuit; a light emitting element layer, comprising a plurality of light emitting elements on the circuit element layer; as well as an input sensing layer, on the light emitting element layer, the input sensing layer including a sensing electrode and a sensing signal wiring portion connected to the sensing electrode, The circuit element layer includes a connection wiring portion, which is located on the same layer as the driving voltage wiring in the peripheral area and is in contact with the sensing signal wiring portion.

2. The display device according to claim 1, wherein: The sensing electrode comprises: a first sensing electrode; and The second sensing electrode is electrically insulated from the first sensing electrode to form a capacitor.

3. The display device according to claim 2, wherein: The sensing signal wiring portion includes: a receiving wiring portion connected to the first sensing electrode; and a transmission wiring portion connected to the second sensing electrode, The connection wiring portion contacts the reception wiring portion or the transmission wiring portion.

4. The display device according to claim 3, wherein: The transmission wiring part includes: a first transmission wiring portion connected to one end of the second sensing electrode; and a second transmission wiring portion connected to the other end of the second sensing electrode, wherein the connection wiring portion contacts the second transmission wiring portion.

5. The display device according to claim 4, wherein: The second transmission wiring portion comprises: a plurality of other-side sending wirings connected to the other end of the second sensing electrode; a first sensing contact portion located at one end of the plurality of other-side transmission wirings; and The second sensing contact portion is located at the other end of the plurality of other-side transmission wirings.

6. The display device according to claim 5, wherein: The connection wiring part includes: A plurality of sensing connection wirings extending along the plurality of other-side sending wirings; a first contact portion connected to one ends of the plurality of sensing connection wirings to face the first sensing contact portion; and A second contact portion connected to the other ends of the plurality of sensing connection wirings to face the second sensing contact portion.

7. The display device according to claim 6, wherein: The first sensing contact portion directly contacts the first contact portion, and the second sensing contact portion directly contacts the second contact portion.

8. The display device according to claim 6, wherein: Each of the plurality of other-side transmission wirings comprises: a first wiring layer on the light emitting element layer; and a second wiring layer positioned adjacent to the first wiring layer, with the touch insulating layer of the input sensing layer interposed between the first wiring layer and the first wiring layer, The first wiring layer and the second wiring layer are electrically connected to each other.

9. The display device according to claim 8, wherein: In an intersection region where the plurality of other-side sending wirings intersect, each of the plurality of other-side sending wirings includes one of the first wiring layer and the second wiring layer.

10. The display device according to claim 1, wherein: The pixel circuit comprises: a pixel transistor including a control electrode, an output electrode, and an input electrode; and Connecting electrodes, on the output electrodes, Wherein, the light emitting element layer is electrically connected to the connecting electrode.

11. The display device according to claim 10, wherein: The driving voltage wiring and the connection wiring portion are located on the same layer as the connection electrode.

12. The display device according to claim 1, further comprising: a thin film sealing layer configured to cover the light emitting element layer, wherein the connection wiring portion and the driving voltage wiring are disposed below the thin film sealing layer in the peripheral region.

13. A display device, comprising: A base layer having an active area and a peripheral area outside the active area; a circuit element layer including a pixel circuit located in the effective area of ​​the base layer and a driving voltage wiring located in the peripheral area of ​​the base layer to supply a driving voltage to the pixel circuit; a light emitting element layer, comprising a plurality of light emitting elements on the circuit element layer; as well as an input sensing layer, on the light emitting element layer, the input sensing layer comprising sensing electrodes and sensing signal wirings connected to the sensing electrodes, wherein the circuit element layer includes a connection wiring located on the same layer as the drive voltage wiring in the peripheral region, and The connection wiring is in contact with the sensing signal wiring via a contact portion in the peripheral region.

14. The display device according to claim 13, wherein: The sensing electrode comprises: a first sensing electrode; and The second sensing electrode is electrically insulated from the first sensing electrode to form a capacitor.

15. The display device according to claim 14, wherein: The sensing signal wiring comprises: a receiving wiring connected to the first sensing electrode; and a transmission wiring connected to the second sensing electrode, The connection wiring is in contact with the reception wiring or the transmission wiring.

16. The display device according to claim 15, wherein: The transmission wiring comprises: a first transmission wiring connected to one end of the second sensing electrode; and a sensing contact portion extending from one end of the first transmitting wiring, The connection wiring contacts the first transmission wiring via the sensing contact portion.

17. The display device according to claim 16, wherein: The transmission wiring also includes: The second transmission wiring is connected to the other end of the second sensing electrode.

18. The display device according to claim 16, wherein: The contact portion electrically connects one end of the connection wiring to the sensing contact portion.

19. The display device according to claim 16, wherein: The first transmission wiring comprises: a first wiring layer on the light emitting element layer; and a second wiring layer positioned adjacent to the first wiring layer, with the touch insulating layer of the input sensing layer interposed between the first wiring layer and the first wiring layer, The first wiring layer and the second wiring layer are electrically connected to each other.

20. The display device according to claim 19, wherein: The first transmission wiring includes one of the first wiring layer and the second wiring layer in an intersection region where the first transmission wiring crosses.

21. The display device according to claim 13, wherein: The pixel circuit comprises: a pixel transistor including a control electrode, an output electrode, and an input electrode; and Connecting electrodes, on the output electrodes, Wherein, the light emitting element layer is electrically connected to the connecting electrode.

22. The display device according to claim 21, wherein: The driving voltage wiring and the connection wiring are located on the same layer as the connection electrode.

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