Display panel, display equipment and manufacturing method of display panel

Abstract

The invention provides a display panel, a display device and a manufacturing method of the display panel, the display panel comprises a substrate, a pixel defining layer, an isolation structure and a pixel unit, the pixel defining layer is arranged on the substrate, and the pixel defining layer is provided with a pixel opening; the isolation structure is arranged on the side, away from the substrate, of the pixel defining layer, an isolation opening is defined by the isolation structure, the orthographic projection of the pixel opening on the substrate falls into the orthographic projection range of the isolation opening on the substrate, and the isolation structure comprises a first structure layer, a second structure layer and a third structure layer which are sequentially stacked in the direction away from the substrate; the orthographic projection of the second structural layer on the substrate falls into the orthographic projection range of the first structural layer on the substrate, and the etching resistance of the first structural layer is higher than that of the second structural layer; each pixel unit comprises a first electrode, the first electrodes are at least arranged in the pixel openings and the isolation openings, and the first electrodes are at least in lap joint with the first structure layer.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of display technology, and in particular, to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Display (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, power saving, thin body, and wide range of applications, becoming the mainstream display device.

[0003] However, in current OLED display products, there are cases where dark spots appear and the lighting effect is poor due to insufficient process performance. Summary of the Invention

[0004] In order to solve the above problems, embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, so as to at least partially solve the above problems.

[0005] In the first aspect, the present application provides a display panel comprising a substrate, a pixel defining layer, an isolation structure and a pixel unit, wherein the pixel defining layer is arranged on the substrate, and the pixel defining layer is provided with a pixel opening; the isolation structure is arranged on the side of the pixel defining layer away from the substrate, the isolation structure encloses to form an isolation opening, the orthographic projection of the pixel opening on the substrate falls within the orthographic projection range of the isolation opening on the substrate, wherein the isolation structure comprises a first structure layer, a second structure layer and a third structure layer stacked in sequence along a direction away from the substrate, the orthographic projection of the second structure layer on the substrate falls within the orthographic projection range of the first structure layer on the substrate, and the etching resistance of the first structure layer is stronger than that of the second structure layer; the pixel unit comprises a first electrode, the first electrode is arranged at least in the pixel opening and the isolation opening, and the first electrode at least overlaps with the first structure layer.

[0006] In one embodiment, the first structural layer is conductive, a surface of the first structural layer facing away from the substrate includes a first central region and a first edge region adjacent to each other, an orthographic projection of the second structural layer on the substrate coincides with an orthographic projection of the first central region on the substrate, and the first electrode is overlapped on the first edge region;

[0007] Preferably, the first electrode and the second structural layer are overlapped;

[0008] Preferably, the second structural layer is conductive.

[0009] In one embodiment, the material of the first structural layer is metal or metal oxide; preferably, the material of the first structural layer includes crystallized indium tin oxide.

[0010] In one embodiment, the orthographic projection of the surface of the second structural layer on the side away from the substrate on the substrate falls within the orthographic projection range of the third structural layer on the substrate, and the orthographic projection area of ​​the surface of the second structural layer on the side away from the substrate on the substrate is smaller than the orthographic projection area of ​​the third structural layer on the substrate.

[0011] In one embodiment, the orthographic projection of the first structure layer on the substrate falls within the orthographic projection range of the third structure layer on the substrate, and the orthographic projection area of ​​the first structure layer on the substrate is smaller than the orthographic projection area of ​​the third structure layer on the substrate.

[0012] In one embodiment, the isolation structure further includes a fourth structural layer, wherein the fourth structural layer is located between the first structural layer and the second structural layer;

[0013] Preferably, the etching resistance of the first structural layer is stronger than that of the fourth structural layer;

[0014] Preferably, the fourth structural layer is conductive;

[0015] Preferably, the first electrode and the fourth structural layer are overlapped.

[0016] In one embodiment, the orthographic projection of the fourth structure layer on the substrate falls within the orthographic projection range of the first structure layer on the substrate, and the orthographic projection area of ​​the fourth structure layer on the substrate is smaller than the orthographic projection area of ​​the first structure layer on the substrate.

[0017] In one embodiment, the cross-section of the second structure layer in a direction perpendicular to the plane of the pixel definition layer is trapezoidal, and the angle between the sidewall of the second structure layer and the side of the plane of the substrate away from the pixel opening is less than 90 degrees.

[0018] In one embodiment, the pixel unit further includes a second electrode and a light-emitting structure, the second electrode is arranged on the side of the pixel defining layer facing the substrate, and the orthographic projection of the pixel opening on the substrate falls within the orthographic projection range of the second electrode on the substrate; the light-emitting structure is arranged in the pixel opening and the isolation opening, and is located on the side of the second electrode away from the substrate, and the first electrode is arranged on the side of the light-emitting structure away from the substrate.

[0019] In one embodiment, the display panel further includes an encapsulation structure layer, wherein the encapsulation structure layer is at least disposed in the isolation opening, covers at least the first electrode, and contacts a sidewall of the isolation structure;

[0020] Preferably, the encapsulation structure layer includes a first encapsulation layer, and the first encapsulation layer at least covers the first electrode;

[0021] Preferably, the encapsulation structure layer further includes a second encapsulation layer, and the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate;

[0022] Preferably, the encapsulation structure layer further includes a third encapsulation layer, and the third encapsulation layer is located on a side of the second encapsulation layer away from the substrate.

[0023] In the second aspect, the present application provides a display panel comprising a substrate, an isolation structure and a pixel unit, wherein the isolation structure is arranged on one side of the substrate, and the isolation structure encloses an isolation opening, wherein the isolation structure comprises a first structure layer, a second structure layer and a third structure layer stacked in sequence in a direction away from the substrate, the orthographic projection of the second structure layer on the substrate falls within the orthographic projection range of the first structure layer on the substrate, and the etching resistance of the first structure layer is stronger than that of the second structure layer; the pixel unit comprises a first electrode, the first electrode is at least arranged in the isolation opening, and the first electrode at least overlaps with the first structure layer.

[0024] In one embodiment, the material of the first structural layer includes metal or metal oxide; preferably, the material of the first structural layer includes crystallized indium tin oxide.

[0025] In one embodiment, the display panel includes a pixel defining layer, the pixel defining layer is provided on the substrate, the isolation structure is located on a side of the pixel defining layer facing away from the substrate, the pixel defining layer is provided with a pixel opening, and the orthographic projection of the pixel opening on the substrate falls within the orthographic projection range of the isolation opening on the substrate; the pixel unit further includes a second electrode and a light-emitting structure, the second electrode is provided on a side of the pixel defining layer facing the substrate, and the orthographic projection of the pixel opening on the substrate falls within the orthographic projection range of the second electrode on the substrate; the light-emitting structure is provided in the pixel opening and the isolation opening and is located on a side of the second electrode facing away from the substrate, and the first electrode is provided on a side of the light-emitting structure facing away from the substrate;

[0026] Preferably, the first structural layer is conductive, a surface of the first structural layer on a side facing away from the substrate includes a first central region and a first edge region adjacent to each other, an orthographic projection of the second structural layer on the substrate coincides with an orthographic projection of the first central region on the substrate, and the first electrode is overlapped on the first edge region;

[0027] Preferably, the first electrode and the second structural layer are overlapped;

[0028] Preferably, the second structural layer is conductive.

[0029] In one embodiment, the isolation structure further includes a fourth structural layer, wherein the fourth structural layer is located between the first structural layer and the second structural layer;

[0030] Preferably, the etching resistance of the first structural layer is stronger than that of the fourth structural layer;

[0031] Preferably, the fourth structural layer is conductive;

[0032] Preferably, the first electrode and the fourth structural layer are overlapped.

[0033] In a third aspect, the present application provides a method for manufacturing a display panel, the method comprising:

[0034] Providing a backplane for an isolation structure to be manufactured, the backplane comprising a substrate and a pixel defining layer, the pixel defining layer being disposed on the substrate and having pixel openings;

[0035] forming a first structural material layer on the backplane;

[0036] patterning the first structural material layer to obtain a first structural layer;

[0037] at least partially crystallize the first structural layer by heat treating the first structural layer;

[0038] forming a second structural material layer and a third structural material layer on the at least partially crystallized first structural layer and the pixel defining layer;

[0039] The second structural material layer and the third structural material layer are patterned to obtain a second structural layer and a third structural layer, the second structural layer is stacked on the side of the first structural layer facing away from the substrate, and the third structural layer is stacked on the side of the second structural layer facing away from the substrate. The isolation structure includes the first structural layer, the second structural layer and the third structural layer.

[0040] In one embodiment, after heat-treating the first structural layer and before forming the second structural material layer and the third structural material layer, the manufacturing method further includes: forming a fourth structural material layer on the first structural layer and the pixel defining layer;

[0041] The patterning of the second structural material layer and the third structural material layer further includes: patterning the second structural material layer, the third structural material layer and the fourth structural material layer to obtain a second structural layer, a third structural layer and a fourth structural layer, wherein the fourth structural layer is stacked on a side of the first structural layer away from the substrate.

[0042] In one embodiment, patterning the second structural material layer, the third structural material layer and the fourth structural material layer includes: patterning the third structural material layer and the second structural material layer by dry etching to obtain a third structural layer and a second initial structure; and patterning the second initial structure and the fourth structural material layer by wet etching to obtain a second structural layer and a fourth structural layer.

[0043] In one embodiment, the manufacturing method further includes: forming a second electrode material layer on the substrate, patterning the second electrode material layer to obtain a second electrode of the pixel unit, and forming a pixel defining layer on the second electrode and the substrate.

[0044] In one embodiment, the manufacturing method further comprises:

[0045] A light-emitting functional film layer and a first electrode material layer are sequentially formed on the back plate and the isolation structure,

[0046] The first electrode material layer and the light-emitting functional film layer are patterned to obtain a first electrode and a light-emitting structure at least located in the pixel opening.

[0047] In a fourth aspect, the present application further provides a display device, which includes the above-mentioned display panel, or includes a display panel manufactured by the above-mentioned display panel manufacturing method. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The following drawings are only intended to illustrate and explain the present application and do not limit the scope of the present application.

[0049] Figure 1 This is a schematic structural diagram of a display panel in a state during the manufacturing process in the related art;

[0050] Figure 2 This is a structural diagram of a display panel provided by the present application, showing a state during the manufacturing process;

[0051] Figure 3 This is a structural diagram of a display panel provided by the present application, showing a state during the manufacturing process;

[0052] Figure 4 This is a structural diagram of a display panel provided by the present application, showing a state during the manufacturing process;

[0053] Figure 5 This is a structural diagram of a display panel provided by the present application, showing a state during the manufacturing process;

[0054] Figure 6 This is a flow chart of a method for manufacturing a display panel provided by the present application;

[0055] Figure 7a is based on Figure 6 A manufacturing method, a structural diagram showing a state of the panel during the manufacturing process;

[0056] Figure 7b is based on Figure 6 A manufacturing method, a structural diagram showing a state of the panel during the manufacturing process;

[0057] Figure 7c is based on Figure 6 A manufacturing method, a structural diagram showing a state of the panel during the manufacturing process;

[0058] Figure 7d is based on Figure 6 A manufacturing method is provided, and a structural diagram of a display panel in a state during the manufacturing process is provided.

[0059] Description of reference numerals:

[0060] 11-substrate, 12-pixel defining layer, 13-isolation structure, 131-first conductive structure, 132-second conductive structure,

[0061] 14-pixel unit, 141-second electrode, 142-light-emitting structure layer, 143-first electrode;

[0062] 21 - substrate, 22 - pixel defining layer, 30 - isolation structure, 31 - first structure layer, 311 - first edge region, 312 - first center region, 32 - second structure layer, 33 - third structure layer, 34 - fourth structure layer;

[0063] 40 - pixel unit, 41 - second electrode, 42 - light-emitting structure, 43 - first electrode;

[0064] 50-encapsulation structure layer, 51-first encapsulation layer, 52-second encapsulation layer, 53-third encapsulation layer;

[0065] 3a - first structural material layer, 3b - second structural material layer, 3c - third structural material layer. DETAILED DESCRIPTION

[0066] In order to have a clearer understanding of the technical features, purposes and effects of the embodiments of the present application, the specific implementation methods of the embodiments of the present application are now described with reference to the accompanying drawings.

[0067] In this document, “illustrative” means “serving as an example, instance or illustration”, and any diagram or implementation described in this document as “illustrative” should not be interpreted as a more preferred or more advantageous technical solution.

[0068] To simplify the drawings, only the parts related to the present application are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, to simplify the drawings and facilitate understanding, in some figures, only one or more components with the same structure or function are schematically shown, or only one or more are labeled.

[0069] The corresponding structural parts mentioned below, such as the isolation structure, are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072 , CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A are further described for reference.

[0070] In the related art, reference Figure 1The display panel includes a substrate 11, a pixel defining layer 12, an isolation structure 13 and a pixel unit 14. The pixel unit is arranged in a specific form in the pixel opening of the pixel defining layer 12 and is surrounded by the isolation structure 13. The pixel unit 14 includes a second electrode 141, a light-emitting structure 142 and a first electrode 143. Different pixel units can emit red, blue or green light. Among them, the isolation structure 13 includes a first conductive structure 131 and a second conductive structure 132. The first conductive structure 131 is located between the pixel defining layer 12 and the second conductive structure 132. The first electrode 143 of the pixel unit 14 can be electrically connected by contacting the first conductive structure 131 and the second conductive structure 132. During the manufacturing process, the first conductive film and the second conductive film are usually formed on the pixel defining layer 12 by deposition, and then the excess part of the first conductive film and the excess part of the second conductive film can be removed by wet etching at the same time, thereby obtaining the first conductive structure 131 and the second conductive structure 132. Because the first and second conductive films are made of different materials, their etching rates are different. For example, in related art, the first conductive film is made of molybdenum (Mo), which has a faster etching rate, while the second conductive film is made of aluminum (Al), which has a slower etching rate. This causes the sidewalls of the isolation structure 13 to be recessed at the first conductive structure 131. This results in poor overlap between the first electrode 143 in the pixel unit 14 and the corresponding sidewall areas of the first conductive structure 131, resulting in poor lighting performance.

[0071] To solve this problem, Figure 2 As shown, the present application provides a display panel, which includes a substrate 21, a pixel defining layer 22, an isolation structure 30 and a pixel unit 40, wherein the pixel defining layer 22 is arranged on the substrate 21, and the pixel defining layer 22 has a pixel opening; the isolation structure 30 is arranged on the side of the pixel defining layer 22 away from the substrate 21, and the isolation structure 30 encloses to form an isolation opening, and the orthographic projection of the pixel opening on the substrate 21 falls within the orthographic projection range of the isolation opening on the substrate 21, wherein the isolation structure 30 includes a first structure layer 31, a second structure layer 32 and a third structure layer 33 stacked in sequence along a direction away from the substrate, the orthographic projection of the second structure layer 32 toward the substrate 21 falls within the orthographic projection range of the first structure layer 31 toward the substrate 21, and the etching resistance of the first structure layer 31 is stronger than that of the second structure layer 32; the pixel unit 40 includes a first electrode 43, the first electrode 43 is at least arranged in the pixel opening and the isolation opening, and the first electrode 43 at least overlaps with the first structure layer 31.

[0072] Through the above technical solution, in the process of making the isolation structure 30, the first structure layer 31 can be first formed on the pixel definition layer 22, and then the second structure layer 32 and the third structure layer 33 can be formed through steps such as deposition and etching. Since the etching resistance of the first structure layer 31 is stronger than that of the second structure layer 32, that is, the etching rate of the first structure layer 31 is lower than the etching rate of the second structure layer 32, then in the process of etching the second structure layer 32, the first structure layer 31 can resist etching to maintain structural integrity and avoid the phenomenon of the first structure layer 31 shrinking relative to the second structure layer 32. Then, after forming the first electrode 43 of the pixel unit 40, it can be ensured that the overlap area of ​​the first electrode 43 and the first structure layer 31 meets the preset requirements, ensuring that the side wall areas corresponding to the first electrode 43 and the first structure layer 31 overlap well, and the display panel has a good lighting effect. In addition, the first structure layer 31 covers the pixel definition layer 22, and can also protect the pixel definition layer 22 and prevent the pixel definition layer 22 from being excessively etched.

[0073] In one possible embodiment, reference Figure 2 The first structure layer 31 is conductive. The surface of the first structure layer 31 facing away from the substrate 21 includes a first central region 312 and a first edge region 311. The orthographic projection of the second structure layer 32 on the substrate 21 coincides with the orthographic projection of the first central region 312 on the substrate 21. The first electrode 43 overlaps the first edge region 311. This ensures reliable conductive contact between the first electrode 43 and the first structure layer 31 and increases the conductive contact area between the first electrode 43 and the first structure layer 31, thereby reducing impedance and thus power consumption.

[0074] Preferably, the first electrode 43 overlaps the second structure layer 32 , which can increase the overlapping area between the first electrode 43 and the isolation structure 30 , and is beneficial to the overlapping stability between the first electrode 43 and the isolation structure 30 .

[0075] Preferably, the second structure layer 32 is conductive, so that the conductive contact area between the first electrode 43 and the isolation structure 30 can be increased, thereby reducing impedance and thus reducing power consumption.

[0076] The material of the first structural layer 31 is a metal or metal oxide. Preferably, the material of the first structural layer 31 includes crystallized indium tin oxide. That is, the first structural layer 31 can be formed using indium tin oxide and then crystallized, thereby obtaining a first structural layer 31 with strong etching resistance.

[0077] The material of the second structural layer 32 may include, but is not limited to, conductive metals such as aluminum (Al), magnesium (Mg), copper (Cu), silver (Ag), indium tin oxide (ITO), indium gallium zinc oxide (IGZO), or other metal oxides or their combinations, as long as they meet the use conditions of the implementation scheme, and are not specifically limited here.

[0078] The third structural layer 33 may have insulating properties or conductive properties. The material of the third structural layer 33 may include, but is not limited to, titanium (Ti), silicon monoxide (SiO), silicon dioxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiNO), and the like.

[0079] In one possible embodiment, reference Figure 2 The orthographic projection of the surface of the second structure layer 32 on the side away from the substrate on the substrate 21 falls within the orthographic projection of the third structure layer 33 on the substrate 21, and the orthographic projection area of ​​the surface of the second structure layer 32 on the side away from the substrate on the substrate 21 is smaller than the orthographic projection area of ​​the third structure layer 33 on the substrate 21. In this way, the third structure layer 33 can extend beyond the second structure layer 32 to form an eaves-like structure. Then, when the first electrode 43 of the pixel unit 40 is evaporated, the first electrode 43 will not be continuous near the eaves-like structure, but will be discontinuous. In this way, the isolation structure 30 can reliably separate adjacent first electrodes 43. The first electrode 43 overlaps and conducts with the first structure layer 31 of the isolation structure 30, thereby achieving mutual electrical connection between the first electrodes 43 of the pixel units 40. In this way, through the isolation structure 30 arranged around the pixel opening, the first electrodes 43 of each pixel unit 40 are connected in a mesh-like manner, which is conducive to the uniformity of the first electrode 43.

[0080] Further, in a possible embodiment, referring to Figure 2 The orthographic projection of the first structure layer 31 on the substrate 21 falls within the orthographic projection of the third structure layer 33 on the substrate 21, and the orthographic projection area of ​​the first structure layer 31 on the substrate 21 is smaller than the orthographic projection area of ​​the third structure layer 33 on the substrate 21. This allows the third structure layer 33 to extend beyond the first structure layer 31. This helps ensure that the first electrode 43 near the eaves-like structure is not continuous but discontinuous when the first electrode 43 of the pixel unit 40 is evaporated. Furthermore, this helps control the overlap area between the first electrode 43 and the second structure layer 32, preventing the overlap area between the first electrode 43 and the second structure layer 32 from being too large.

[0081] In one example, reference Figure 3 The isolation structure 30 further includes a fourth structure layer 34 , which is located between the first structure layer 31 and the second structure layer 32 .

[0082] Preferably, the first structure layer 31 has stronger etching resistance than the fourth structure layer 34. Thus, the etching rate of the first structure layer 31 is lower than that of the fourth structure layer 34. During the etching of the fourth structure layer 34, the first structure layer 31 can resist etching to maintain structural integrity, thus preventing the first structure layer 31 from shrinking relative to the fourth structure layer 34. Consequently, after forming the first electrode 43 of the pixel unit 40, the overlap area between the first electrode 43 and the first structure layer 31 can be ensured to meet preset requirements.

[0083] Preferably, the fourth structure layer 34 is conductive and can function as a conductive connection.

[0084] Preferably, the first electrode and the fourth structure layer overlap. When the first electrode 43 in one pixel opening is more connected to the first structure layer 31, while the first electrode 43 in another pixel opening is more connected to the second structure layer 32, the fourth structure layer 34 can serve as a conductive connection. By providing a fourth structure layer 34 that is conductive and different from the first structure layer 31, the conductive performance of the isolation structure 30 can be improved.

[0085] For further reference, Figure 3 The orthographic projection of the fourth structure layer 34 on the substrate 21 falls within the orthographic projection of the first structure layer 31 on the substrate 21, and the orthographic projection area of ​​the fourth structure layer 34 on the substrate 21 is smaller than the orthographic projection area of ​​the first structure layer 31 on the substrate 21. In this way, effective overlap between the first electrode 43 and the first structure layer 31 can still be ensured, and the conductive impedance between the first electrode 43 and the isolation structure 30 can be controlled within an appropriate range.

[0086] The fourth structure layer 34 may be made of a different material from the second structure layer 32. For example, the second structure layer 32 may be made of aluminum, and the fourth structure layer 34 may be made of molybdenum or titanium.

[0087] In one possible implementation, refer to Figure 3 The cross-section of the second structure layer 32 in a direction perpendicular to the plane of the pixel definition layer 22 is trapezoidal, and the angle between the sidewall of the second structure layer 32 and the side of the substrate 21 plane away from the pixel opening is less than 90 degrees. It can also be understood that the angle between the sidewall of the second structure layer 32 and the surface of the first structure layer 31 facing the substrate 21 is less than 90 degrees. In this way, the adverse effects on the light extraction efficiency of the pixel unit 40 can be reduced. It can also facilitate the overlap of the first electrode 43 and the sidewall of the second structure layer 32, increase the conductive contact area, and reduce the conductive impedance.

[0088] The pixel unit 40 further includes a second electrode 41 and a light-emitting structure 42. The second electrode 41 is disposed on the side of the pixel defining layer 22 facing the substrate 21, and the orthographic projection of the pixel opening on the substrate 21 falls within the orthographic projection of the second electrode 41 on the substrate 21. The light-emitting structure is disposed within the pixel opening and the isolation opening, and is located on the side of the second electrode 41 facing away from the substrate 21. The first electrode 43 is disposed on the side of the light-emitting structure facing away from the substrate 21. In this manner, adjacent pixel units 40 can be conductively connected via the isolation structure 30. The isolation structure 30 surrounding the pixel opening allows for a mesh-like connection between the first electrodes 43 of each pixel unit 40, which helps reduce voltage drop across the display panel and improves the uniformity of the first electrodes 43, thereby enhancing display uniformity of the display panel.

[0089] One of the first electrode 43 and the second electrode 41 may be an anode, and the other may be a cathode.

[0090] The light-emitting structure may include one or more of: a HIL (Hole Injection Layer), a HTL (Hole Transfer Layer), an EML (Emitting Layer), and an ETL (Electron Transfer Layer). Organic light-emitting materials in the light-emitting structure are generally classified as polymers, small molecule organic compounds, and complex light-emitting materials. Polymers are typically conductive conjugated polymers or semiconducting conjugated polymers, which can be formed into films using spin coating, making them simple to manufacture and low-cost. However, their purity is difficult to improve, and they lack durability, brightness, and color compared to small molecule organic compounds. Organic small molecule light-emitting materials are primarily organic dyes, which offer advantages such as strong chemical modifiability, a wide range of options, ease of purification, high quantum efficiency, and the ability to produce emission peaks in various colors, including red, green, blue, and yellow. However, most suffer from concentration quenching in the solid state. Complex light-emitting materials lie between organic and inorganic materials, combining the high fluorescence quantum efficiency of organic materials with the high stability of inorganic materials, and are considered a promising class of light-emitting materials. Pixel units 40 capable of emitting different colors may be provided in different pixel openings. Thus, by providing a variety of pixel units 40, the display panel may be able to present a variety of display colors and effects.

[0091] In one example, reference Figure 4 The display panel provided in the present application further includes an encapsulation structure layer 50, which is disposed at least in the isolation opening, covers at least the first electrode 43, and contacts the sidewalls of the isolation structure 30. Thus, the encapsulation structure layer 50 can isolate water and oxygen, thereby protecting the pixel unit 40.

[0092] Preferably, the encapsulation structure layer includes a first encapsulation layer 51 , and the first encapsulation layer 51 at least covers the first electrode 43 .

[0093] Preferably, the encapsulation structure layer further includes a second encapsulation layer 52 , which is located on a side of the first encapsulation layer 51 away from the substrate 21 . In this way, the first encapsulation layer 51 and the second encapsulation layer 52 can protect the pixel unit 40 together.

[0094] Preferably, the second encapsulation layer 52 is located on a side of the isolation structure 30 away from the substrate 21 . The second encapsulation layer 52 can protect the isolation structure 30 .

[0095] Preferably, the material of the second encapsulation layer 52 is different from the material of the first encapsulation layer 51. The material of the second encapsulation layer 52 may include an organic material, and the material of the first encapsulation layer 51 may include an inorganic material.

[0096] Preferably, the encapsulation structure layer further includes a third encapsulation layer 53 , which is located on a side of the second encapsulation layer 52 away from the substrate 21 . In this way, the third encapsulation layer 53 can protect the second encapsulation layer 52 .

[0097] Preferably, the material of the third encapsulation layer 53 is different from the material of the second encapsulation layer 52. The third encapsulation layer 53 may include an inorganic material.

[0098] Preferably, the material of the third encapsulation layer 53 is different from the material of the first encapsulation layer 51 .

[0099] In addition, a driving circuit may be provided on the substrate 21 , and the driving circuit is used to drive the pixel unit 40 to emit light.

[0100] It can be understood that the substrate 21 plays the role of supporting the entire panel in the display panel. The substrate 21 is generally divided into two types: a hard substrate 21 and a soft substrate 21. The hard substrate 21 is usually made of rigid materials such as glass or plastic, has good stability and durability, and is suitable for large-size display screens and professional displays; while the soft substrate 21 is usually made of soft plastic or metal foil and other materials, and is suitable for flexible displays and wearable devices.

[0101] This application also provides a display panel, referring to Figure 5The display panel includes a substrate 21, an isolation structure 30 and a pixel unit 40. The isolation structure 30 is arranged on one side of the substrate 21. The isolation structure 30 encloses an isolation opening, wherein the isolation structure 30 includes a first structure layer 31, a second structure layer 32 and a third structure layer 33 stacked in sequence along a direction away from the substrate. The orthographic projection of the second structure layer 32 toward the substrate 21 falls within the orthographic projection range of the first structure layer 31 toward the substrate 21. The etching resistance of the first structure layer 31 is stronger than that of the second structure layer 32. The pixel unit 40 includes a first electrode 43. The first electrode 43 is at least arranged in the isolation opening, and the first electrode 43 at least overlaps with the first structure layer 31.

[0102] Through the above technical solution, in the process of manufacturing the isolation structure 30, the first structure layer 31 can be formed first, and then the second structure layer 32 and the third structure layer 33 can be formed through steps such as deposition and etching. Since the etching resistance of the first structure layer 31 is stronger than that of the second structure layer 32, that is, the etching rate of the first structure layer 31 is lower than the etching rate of the second structure layer 32, then in the process of etching the second structure layer 32, the first structure layer 31 can resist etching to maintain structural integrity, and avoid the phenomenon of the first structure layer 31 shrinking relative to the second structure layer 32. Then, after forming the first electrode 43 of the pixel unit 40, it can be ensured that the overlapping area of ​​the first electrode 43 and the first structure layer 31 meets the preset requirements, ensuring that the side wall areas corresponding to the first electrode 43 and the first structure layer 31 overlap well, and the display panel has a good lighting effect.

[0103] In one embodiment, the material of the first structural layer 31 includes a metal or a metal oxide. Preferably, the material of the first structural layer includes crystallized indium tin oxide. That is, the first structural layer 31 can be formed using indium tin oxide and then crystallized, thereby obtaining a first structural layer 31 with strong etching resistance.

[0104] In one embodiment, reference Figure 2The display panel includes a pixel defining layer 22 disposed on a substrate 21. An isolation structure 30 is located on a side of the pixel defining layer 22 facing away from the substrate. The pixel defining layer 22 is provided with a pixel opening, the orthographic projection of the pixel opening on the substrate 21 falling within the orthographic projection of the isolation opening on the substrate 21. A pixel unit 40 also includes a second electrode 41 and a light-emitting structure. The second electrode 41 is disposed on a side of the pixel defining layer facing the substrate, the orthographic projection of the pixel opening on the substrate 21 falling within the orthographic projection of the second electrode 41 on the substrate 21. The light-emitting structure is disposed within the pixel opening and the isolation opening and is located on a side of the second electrode 41 facing away from the substrate 21. A first electrode 43 is disposed on a side of the light-emitting structure facing away from the substrate 21. Thus, adjacent pixel units 40 can be conductively connected via the isolation structure 30. The isolation structure 30 surrounding the pixel opening can achieve a mesh-like connection between the first electrodes 43 of each pixel unit 40, which helps reduce voltage drop across the display panel and improves the uniformity of the first electrodes 43, thereby facilitating display uniformity of the display panel.

[0105] Preferably, the first structure layer 31 is conductive. The surface of the first structure layer 31 on the side facing away from the substrate 21 includes a first central region 312 and a first edge region 311 adjacent to each other. The orthographic projection of the second structure layer 32 on the substrate 21 coincides with the orthographic projection of the first central region 312 on the substrate 21, and the first electrode 43 overlaps the first edge region 311. This ensures reliable conductive overlap between the first electrode 43 and the first structure layer 31, and increases the conductive contact area between the first electrode 43 and the first structure layer 31, thereby reducing impedance and thus power consumption.

[0106] Preferably, the first electrode 43 overlaps the second structure layer 32 , which can increase the overlapping area between the first electrode 43 and the isolation structure 30 , and is beneficial to the overlapping stability between the first electrode 43 and the isolation structure 30 .

[0107] Preferably, the second structure layer 32 is conductive, so that the conductive contact area between the first electrode 43 and the isolation structure 30 can be increased, thereby reducing impedance and thus reducing power consumption.

[0108] In one possible embodiment, reference Figure 3 The isolation structure 30 further includes a fourth structure layer 34 , which is located between the first structure layer 31 and the second structure layer 32 .

[0109] Preferably, the first structure layer has stronger etching resistance than the fourth structure layer. Thus, the etching rate of the first structure layer 31 is lower than that of the fourth structure layer 34. During the etching of the fourth structure layer 34, the first structure layer 31 can resist etching to maintain structural integrity, preventing the first structure layer 31 from shrinking relative to the fourth structure layer 34. Consequently, after forming the first electrode 43 of the pixel unit 40, the overlap area between the first electrode 43 and the first structure layer 31 can be ensured to meet preset requirements.

[0110] Preferably, the fourth structure layer 34 is conductive and can function as a conductive connection.

[0111] Preferably, the first electrode 43 and the fourth structure layer overlap. When the first electrode 43 in one pixel opening is more connected to the first structure layer 31, while the first electrode 43 in another pixel opening is more connected to the second structure layer 32, the fourth structure layer 34 can serve as a conductive connection. By providing a fourth structure layer 34 that is conductive and different from the first structure layer 31, the conductive performance of the isolation structure 30 can be improved.

[0112] refer to Figure 6 , and references Figures 7a to 7d The present application also provides a method for manufacturing a display panel, the method comprising:

[0113] In step S61 , a backplane for manufacturing the isolation structure 30 is provided. The backplane includes a substrate 21 and a pixel defining layer 22 . The pixel defining layer 22 is disposed on the substrate 21 and has pixel openings.

[0114] Step S62: forming a first structural material layer 3a on the back plate. Preferably, the first structural material layer can be an indium tin oxide film layer.

[0115] In step S63 , the first structural material layer 3 a is patterned to obtain a first structural layer 31 .

[0116] In step S64, the first structure layer 31 is heat-treated to at least partially crystallize. In the crystalline first structure layer 31, the grains are arranged in an orderly manner. The increased grain size makes the arrangement of the grains denser, thereby providing better etching resistance. Specifically, the first structure layer 31 can be treated by high-temperature baking and annealing. After heat treatment, the first structure layer 31 can be crystallized indium tin oxide.

[0117] In step S65, a second structural material layer 3b and a third structural material layer 3c are formed on the at least partially crystallized first structural layer 31 and the pixel defining layer 22. The etching resistance of the second structural material layer 3b and the etching resistance of the third structural material layer 3c are both lower than that of the first structural material layer 3a. Furthermore, the first structural material layer 3a and the second structural material layer 3b may both be conductive. The third structural material layer 3c may also be conductive.

[0118] Step S66, patterning the second structural material layer 3b and the third structural material layer 3c to obtain a second structural layer 32 and a third structural layer 33, the second structural layer 32 is stacked on the side of the first structural layer 31 facing away from the substrate 21, and the third structural layer 33 is stacked on the side of the second structural layer 32 facing away from the substrate 21, and the isolation structure 30 includes the first structural layer 31, the second structural layer 32 and the third structural layer 33.

[0119] Based on the above-described fabrication method, the first structural layer 31 has strong etching resistance. Therefore, when the second and third structural material layers are patterned and etched to obtain the second and third structural layers 32 and 33, the first structural layer 31 can resist the erosion of the etching solution, maintaining the structural dimensions unchanged. This ensures that when the first electrode 43 of the pixel unit 40 is subsequently formed, an effective overlap area is ensured between the first electrode 43 and the first structural layer 31. The above-described fabrication method can be used to obtain the display panel provided herein.

[0120] In a specific embodiment, after heat treating the first structural layer and before forming the second structural material layer 3b and the third structural material layer 3c, the manufacturing method further includes: forming a fourth structural material layer on the first structural layer 31 and the pixel defining layer 22. Accordingly, patterning the second structural material layer 3b and the third structural material layer 3c further includes: patterning the second structural material layer 3b, the third structural material layer 3c, and the fourth structural material layer to obtain a second structural layer 32, a third structural layer 33, and a fourth structural layer 34, wherein the fourth structural layer 34 is stacked on a side of the first structural layer 31 facing away from the substrate 21.

[0121] The fourth structural layer 34 may be conductive. The fourth structural layer 34 is patterned from the fourth structural material layer. Figure 3 It should be understood that the first structure layer 31 is patterned from the first structure material layer 3a, the second structure layer 32 is patterned from the second structure material layer 3b, and the third structure layer 33 is patterned from the third structure material layer 3c.

[0122] In one example, patterning the second structural material layer 3b, the third structural material layer 3c, and the fourth structural material layer includes: patterning the third structural material layer and the second structural material layer by dry etching to obtain the third structural layer and the second initial structure; and patterning the second initial structure and the fourth structural material layer by wet etching to obtain the second structural layer 32 and the fourth structural layer 34. That is, the fourth structural layer 34 is patterned from the fourth structural material layer.

[0123] The manufacturing method provided in this application further includes: forming a second electrode material layer on the substrate 21, patterning the first metal layer to obtain the second electrode 41 of the pixel unit 40, and forming a pixel defining layer 22 on the second electrode 41 and the substrate 21. Figure 7a The second electrode 41 is shown in FIG.

[0124] Furthermore, the manufacturing method provided in this application may also include:

[0125] A light-emitting functional film layer and a first electrode material layer are sequentially formed on the back plate and the isolation structure 30.

[0126] The first electrode material layer and the light-emitting functional film layer are patterned to obtain a first electrode and a light-emitting structure at least located in the pixel opening.

[0127] Among them, the second electrode material layer, the light-emitting film layer and the first electrode material layer can be obtained by whole-surface evaporation; the first structural material layer, the second structural material layer, the third structural material layer and the fourth structural material layer can all be obtained by physical deposition.

[0128] The present application also provides a display device, which includes the display panel described above, or includes a display panel manufactured by the above manufacturing method. As can be seen from the above, the display device provided by the present application has a good lighting effect.

[0129] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0130] It should be understood that although the specific embodiments of the present application are described in detail in conjunction with the accompanying drawings, it should not be understood as limiting the scope of protection of the present application. Within the scope described in the claims, various modifications and variations that can be made by those skilled in the art without creative work still fall within the scope of protection of the present application. Although this specification is described in accordance with various embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that those skilled in the art can understand.

[0131] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: include: substrate, A pixel defining layer is disposed on the substrate, and the pixel defining layer is provided with a pixel opening; an isolation structure, arranged on a side of the pixel defining layer away from the substrate, the isolation structure encloses an isolation opening, the orthographic projection of the pixel opening on the substrate falls within the orthographic projection range of the isolation opening on the substrate, wherein the isolation structure comprises a first structure layer, a second structure layer and a third structure layer stacked in sequence in a direction away from the substrate, the orthographic projection of the second structure layer on the substrate falls within the orthographic projection range of the first structure layer on the substrate, and the first structure layer has stronger etching resistance than the second structure layer; The pixel unit comprises a first electrode, wherein the first electrode is at least arranged in the pixel opening and the isolation opening, and the first electrode at least overlaps with the first structural layer.

2. The display panel according to claim 1, characterized in that: The first structural layer is conductive, a surface of the first structural layer on a side away from the substrate includes a first central area and a first edge area adjacent to each other, an orthographic projection of the second structural layer on the substrate coincides with an orthographic projection of the first central area on the substrate, and the first electrode is overlapped on the first edge area; Preferably, the first electrode and the second structural layer are overlapped; Preferably, the second structural layer is conductive.

3. The display panel according to claim 1, characterized in that: The material of the first structural layer includes metal or metal oxide; Preferably, the material of the first structural layer includes crystallized indium tin oxide.

4. The display panel according to claim 1, characterized in that: The orthographic projection of the surface of the second structural layer on the side away from the substrate on the substrate falls within the orthographic projection range of the third structural layer on the substrate, and the orthographic projection area of ​​the surface of the second structural layer on the side away from the substrate on the substrate is smaller than the orthographic projection area of ​​the third structural layer on the substrate.

5. The display panel according to claim 1, characterized in that: The orthographic projection of the first structure layer on the substrate falls within the orthographic projection range of the third structure layer on the substrate, and the orthographic projection area of ​​the first structure layer on the substrate is smaller than the orthographic projection area of ​​the third structure layer on the substrate.

6. The display panel according to any one of claims 1 to 5, characterized in that: The isolation structure further includes a fourth structure layer, wherein the fourth structure layer is located between the first structure layer and the second structure layer; Preferably, the etching resistance of the first structural layer is stronger than that of the fourth structural layer; Preferably, the fourth structural layer is conductive; Preferably, the first electrode and the fourth structure layer are overlapped.

7. The display panel according to claim 6, characterized in that: The orthographic projection of the fourth structure layer on the substrate falls within the orthographic projection range of the first structure layer on the substrate, and the orthographic projection area of ​​the fourth structure layer on the substrate is smaller than the orthographic projection area of ​​the first structure layer on the substrate.

8. The display panel according to claim 1, characterized in that: The cross section of the second structure layer in a direction perpendicular to the plane of the pixel definition layer is trapezoidal, and the angle between the side wall of the second structure layer and the side of the plane of the substrate away from the pixel opening is less than 90 degrees.

9. The display panel according to claim 1, characterized in that: The pixel unit further includes a second electrode and a light emitting structure, wherein the second electrode is arranged on a side of the pixel defining layer facing the substrate, and the orthographic projection of the pixel opening on the substrate falls within the orthographic projection range of the second electrode on the substrate; The light emitting structure is disposed in the pixel opening and the isolation opening and is located on a side of the second electrode away from the substrate, and the first electrode is disposed on a side of the light emitting structure away from the substrate.

10. The display panel according to claim 1, characterized in that: The display panel further includes a packaging structure layer, which is disposed at least in the isolation opening, covers at least the first electrode, and contacts with a side wall of the isolation structure; Preferably, the encapsulation structure layer comprises a first encapsulation layer, and the first encapsulation layer at least covers the first electrode; Preferably, the encapsulation structure layer further comprises a second encapsulation layer, and the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate; Preferably, the encapsulation structure layer further includes a third encapsulation layer, and the third encapsulation layer is located on a side of the second encapsulation layer away from the substrate.

11. A display panel, characterized in that: include: substrate, an isolation structure, arranged on one side of the substrate, the isolation structure enclosing an isolation opening, wherein the isolation structure comprises a first structure layer, a second structure layer and a third structure layer stacked in sequence in a direction away from the substrate, an orthographic projection of the second structure layer on the substrate falls within a range of an orthographic projection of the first structure layer on the substrate, and the first structure layer has stronger etching resistance than the second structure layer; The pixel unit comprises a first electrode, wherein the first electrode is at least arranged in the isolation opening, and the first electrode at least overlaps with the first structural layer.

12. The display panel according to claim 11, characterized in that: The material of the first structural layer includes metal or metal oxide; Preferably, the material of the first structural layer includes crystallized indium tin oxide.

13. The display panel according to claim 11, characterized in that: The display panel comprises a pixel defining layer, the pixel defining layer is arranged on the substrate, the isolation structure is located on a side of the pixel defining layer away from the substrate, the pixel defining layer is provided with a pixel opening, and the orthographic projection of the pixel opening on the substrate falls within the orthographic projection range of the isolation opening on the substrate; The pixel unit further includes a second electrode and a light emitting structure, wherein the second electrode is arranged on a side of the pixel defining layer facing the substrate, and the orthographic projection of the pixel opening on the substrate falls within the orthographic projection range of the second electrode on the substrate; The light emitting structure is arranged in the pixel opening and the isolation opening and is located on a side of the second electrode away from the substrate, and the first electrode is arranged on a side of the light emitting structure away from the substrate; Preferably, the first structural layer is conductive, a surface of the first structural layer on a side away from the substrate includes a first central area and a first edge area adjacent to each other, an orthographic projection of the second structural layer on the substrate coincides with an orthographic projection of the first central area on the substrate, and the first electrode is overlapped on the first edge area; Preferably, the first electrode and the second structural layer are overlapped; Preferably, the second structural layer is conductive.

14. The display panel according to claim 11, characterized in that: The isolation structure further includes a fourth structure layer, wherein the fourth structure layer is located between the first structure layer and the second structure layer; Preferably, the etching resistance of the first structural layer is stronger than that of the fourth structural layer; Preferably, the fourth structural layer is conductive; Preferably, the first electrode and the fourth structure layer are overlapped.

15. A method for manufacturing a display panel, characterized in that: The production method comprises: Providing a backplane of an isolation structure to be manufactured, the backplane comprising a substrate and a pixel defining layer, the pixel defining layer being arranged on the substrate, and the pixel defining layer being provided with a pixel opening; forming a first structural material layer on the backplane; patterning the first structural material layer to obtain a first structural layer; By heat treating the first structural layer, the first structural layer is at least partially crystallized; forming a second structural material layer and a third structural material layer on the at least partially crystallized first structural layer and the pixel defining layer; The second structural material layer and the third structural material layer are patterned to obtain a second structural layer and a third structural layer, wherein the second structural layer is stacked on a side of the first structural layer facing away from the substrate, and the third structural layer is stacked on a side of the second structural layer facing away from the substrate, and the isolation structure includes the first structural layer, the second structural layer and the third structural layer.

16. The method for manufacturing a display panel according to claim 15, characterized in that: After heat treating the first structural layer and before forming the second structural material layer and the third structural material layer, the manufacturing method further includes: forming a fourth structural material layer on the first structural layer and the pixel defining layer; The patterning of the second structural material layer and the third structural material layer also includes: patterning the second structural material layer, the third structural material layer and the fourth structural material layer to obtain a second structural layer, a third structural layer and a fourth structural layer, wherein the fourth structural layer is stacked on a side of the first structural layer away from the substrate.

17. The method for manufacturing a display panel according to claim 16, characterized in that: The patterning of the second structural material layer, the third structural material layer and the fourth structural material layer comprises: Patterning the third structure material layer and the second structure material layer by dry etching to obtain a third structure layer and a second initial structure; The second initial structure and the fourth structure material layer are patterned by wet etching to obtain a second structure layer and a fourth structure layer.

18. The method for manufacturing a display panel according to claim 15, characterized in that: The manufacturing method further includes: forming a second electrode material layer on the substrate, patterning the second electrode material layer to obtain a second electrode of the pixel unit, and forming a pixel defining layer on the second electrode and the substrate.

19. The method for manufacturing a display panel according to claim 18, characterized in that: The production method further comprises: A light-emitting functional film layer and a first electrode material layer are sequentially formed on the back plate and the isolation structure, The first electrode material layer and the light-emitting functional film layer are patterned to obtain a first electrode and a light-emitting structure at least located in a pixel opening.

20. A display device, characterized in that: The display device includes the display panel described in any one of claims 1 to 14, or includes a display panel manufactured by the method for manufacturing a display panel described in any one of claims 15 to 19.

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