Substrate pressing device for a bonding process

Abstract

The application relates to the technical field of display panels, in particular to a substrate pressing device suitable for a laminating process. The device comprises a rack, a mounting frame, a driving module, a guide module, a vacuum chuck, a curing module and a separation module. The mounting frame is arranged on the rack, the driving module is arranged on the top of the rack, the driving module is connected with the mounting frame, the guide modules are arranged on the two sides of the mounting frame and fixedly connected with the rack, the vacuum chuck is fixedly arranged at the bottom of the mounting frame, the curing module is arranged on the mounting frame above the vacuum chuck, and the separation modules are symmetrically arranged on the mounting frame above the curing module. The application has the advantages of improving working precision, continuously completing curing work, reducing errors, being good in universality and being suitable for liquid environments, solves the problems of low working precision, discontinuous curing work, increased errors, poor universality and difficulty in working in liquid environments of the existing substrate assembly equipment, and meets the needs of substrate transfer and processing.

Description

Technical Field

[0001] This application relates to the field of display panel technology, and more specifically to a substrate pressing device suitable for the bonding process. Background Technology

[0002] With the development of science and technology, more and more products are equipped with electronic screens to display visual information to users and enhance product usability. After removing the outer protective glass and touch screen, the main body of the electronic screen is a display panel with display function. It is usually a multi-layer structure, which requires the separate production and assembly of functional substrates for each layer. Therefore, during the manufacturing process, the substrates need to be assembled and moved so that the substrates of each layer can be pressed and bonded in specific areas at the workstation.

[0003] Existing substrate pressing devices typically only provide basic substrate movement functionality. When the substrate needs to undergo common curing processes, other equipment at the workstation must be used for subsequent processing. During the process of exiting the pressing device and switching to other equipment, vibration can easily cause additional movement deviations in the substrate, reducing process accuracy.

[0004] Furthermore, existing substrate pressing and bonding operations are typically carried out at room temperature. However, some new processes have very high temperature requirements and need to operate in a liquid environment filled with a dielectric liquid. The existing equipment structure is difficult to handle, especially when the substrate is transferred back to the assembly device after the transfer work is completed. The substrate in the liquid is easily adsorbed onto the assembly device under the action of air pressure and is difficult to detach normally. This causes the substrate product to shift and be damaged under the action of tension. Therefore, a new substrate pressing device is needed to solve the above-mentioned shortcomings. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a substrate pressing device suitable for the bonding process, which aims to solve the technical problems of low working accuracy, discontinuous curing process, increased error, poor versatility and difficulty in working in liquid environment of existing substrate pressing devices.

[0006] To achieve the above objectives, this application provides a substrate pressing device suitable for bonding processes, including a frame, a mounting frame, a drive module, a guide module, a vacuum chuck, a curing module, and a release module. The mounting frame is mounted on the frame, and the drive module is mounted on the top of the frame, extending to the bottom of the frame and connected to the mounting frame. The drive module is used to drive the mounting frame to move up and down. Guide modules are mounted on both sides of the mounting frame and are fixedly connected to the frame to allow the mounting frame to slide up and down. A vacuum chuck is fixedly mounted on the bottom of the mounting frame, and a curing module is mounted on the mounting frame above the vacuum chuck. Release modules are symmetrically mounted on the mounting frame above the curing module.

[0007] In some embodiments, the mounting bracket includes a first frame, a second frame, a fine-tuning cylinder, and a mounting base. The first and second frame are rectangular frames. The second frame is slidably mounted on the first frame. A fine-tuning cylinder is installed between the second and first frame. The cylinder barrel of the fine-tuning cylinder is connected to the second frame, and the piston rod of the fine-tuning cylinder is connected to the first frame. The fine-tuning cylinder is used to drive the first frame to move up and down. A mounting base is fixedly installed at the bottom of the first frame.

[0008] In some embodiments, the drive module includes a motor bracket, a drive motor, a reducer, a lead screw, and a drive nut. The drive motor is mounted on the motor bracket and connected to the reducer. The reducer is used to reduce the speed and increase the torque of the drive motor. A lead screw is located below the motor bracket. The end of the lead screw is fixedly connected to the output shaft of the reducer via a coupling. A drive nut is threaded onto the lead screw. The lead screw is used to convert the rotation of the drive motor into the axial movement of the drive nut.

[0009] In some embodiments, the guiding module includes a guide plate, a slider, and a guide rail, with sliders symmetrically mounted on the guide plate and guide rails slidably mounted on the sliders.

[0010] In some embodiments, the vacuum suction cup has multiple air pipe connectors arranged in pairs on its side, the air pipe connectors being used to connect to a vacuum pump, and the bottom of the vacuum suction cup having multiple air holes for generating negative pressure to adsorb the substrate. The vacuum suction cup also has an air channel inside for connecting the air holes to the air pipe connectors.

[0011] In some embodiments, the curing module includes a fixed frame, a lifting cylinder, a movable frame, clamping blocks, and an ultraviolet lamp. The movable frame is mounted on the fixed frame, and a lifting cylinder is installed between the movable frame and the fixed frame. The cylinder barrel of the lifting cylinder is connected to the fixed frame, and the piston rod of the lifting cylinder is connected to the movable frame. The lifting cylinder is used to drive the movable frame to move up and down. Clamping blocks are symmetrically mounted on the movable frame by wing screws, and ultraviolet lamps are engaged on the clamping blocks.

[0012] In some embodiments, the movable frame is provided with symmetrical adjustment slots, and multiple positioning holes are provided in the adjustment slots.

[0013] In some embodiments, the detachment module includes a mounting plate, an adjustment bracket, an adjustment bolt, and a miniature cylinder. The adjustment bracket is fixedly mounted on the mounting plate at intervals, and the adjustment bracket is equipped with an adjustment bolt. A miniature cylinder is fixedly mounted on the bottom of the adjustment bolt. The adjustment bolt is used to adjust the height of the miniature cylinder, and the miniature cylinder is used to push the substrate open at the end of assembly.

[0014] In some embodiments, the mounting plate is provided with clearance grooves to avoid interference with the curing module.

[0015] In some embodiments, the mounting bracket is also equipped with a distance sensor for measuring the height of the mounting bracket.

[0016] The beneficial effects of the technical solution provided in this application include:

[0017] This application provides a substrate pressing device suitable for very hot liquid environments. It has the advantages of improving working accuracy, continuously completing the curing process, reducing errors, good versatility, and adapting to liquid environments. It solves the problems of low working accuracy, discontinuous curing process, increased errors, poor versatility, and difficulty in working in liquid environments of existing substrate assembly equipment, and meets the needs of substrate transfer and processing.

[0018] This application uses a drive module to drive the mounting bracket to move up and down, and then uses a fine-tuning cylinder to further adjust the height of the first frame, improving the accuracy of the height position and enabling the loaded substrate to move accurately to the predetermined position. This application also includes a curing module mounted on the mounting bracket above the vacuum suction cup. Once the substrate is in place, a lifting cylinder moves the movable frame downwards, allowing the ultraviolet lamp to approach and irradiate the substrate for curing, without needing to switch to other tools or equipment, thus achieving continuous assembly movement and photocuring.

[0019] By setting a distance sensor on the mounting bracket and using a grating ruler sensor to provide feedback on the distance moved, the working error can be effectively reduced. In addition, this application has symmetrically mounted release modules on the mounting bracket. After the assembly and curing work is completed, the substrate is pushed down by a micro cylinder to prevent the substrate from continuing to adhere to the vacuum suction cup, thus enabling normal operation in a liquid environment. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of this application;

[0021] Figure 2 This application is Figure 1 A magnified view of a portion of point A in the middle;

[0022] Figure 3 This is a three-dimensional structural diagram of the mounting bracket of this application;

[0023] Figure 4 This is a three-dimensional structural diagram of the driver module of this application;

[0024] Figure 5 This is a three-dimensional structural diagram of the guidance module of this application;

[0025] Figure 6 This is a three-dimensional structural diagram of the vacuum suction cup of this application;

[0026] Figure 7 This is a three-dimensional structural diagram of the solidification module of this application;

[0027] Figure 8 This is a three-dimensional structural diagram of the movable frame of this application;

[0028] Figure 9 This is a three-dimensional structural diagram of the detached module of this application;

[0029] Figure 10 This is a three-dimensional structural schematic diagram of the adjusting bolt of this application.

[0030] In the picture:

[0031] 1. Rack,

[0032] 2. Mounting bracket; 21. First frame body; 22. Second frame body; 23. Fine-tuning cylinder; 24. Assembly base; 25. Distance sensor; 26. Slide rail; 27. First clearance hole.

[0033] 3. Drive module; 31. Motor bracket; 32. Drive motor; 33. Reducer; 34. Lead screw; 35. Drive nut; 36. Coupling.

[0034] 4. Guide module; 41. Guide plate; 42. Displacement sensor; 43. Slider; 44. Guide rail.

[0035] 5. Vacuum suction cup; 51. Air pipe connector; 52. Air vent; 53. Second clearance hole.

[0036] 6. Curing module; 61. Fixing bracket; 62. Lifting cylinder; 63. Movable frame; 64. Clamping block; 65. Ultraviolet lamp; 66. Adjustment slot; 67. Positioning hole; 68. Wing screw.

[0037] 7. Detachable module; 71. Mounting plate; 72. Adjustment bracket; 73. Adjustment bolt; 74. Miniature cylinder; 75. Clearance groove; 76. Adjustment screw; 77. Adjustment nut. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0039] This application provides a substrate pressing device suitable for bonding processes. It uses a vacuum suction cup 5 to adsorb the substrate to be assembled, and then drives the mounting bracket 2 and the substrate to move up and down under the action of the driving module 3. The curing module 6 continuously performs the curing work, and after the work is completed, the substrate is pushed down by the release module 7. This solves the problems of low working accuracy, discontinuous curing work, increased error, poor versatility and difficulty in working in liquid environment in the prior art.

[0040] like Figure 1 As shown, a substrate pressing device suitable for bonding processes includes a frame 1, a mounting frame 2, a drive module 3, a guide module 4, a vacuum suction cup 5, a curing module 6, and a release module 7. The frame 1 is a gantry frame used to provide support and a mounting base. The mounting frame 2 is mounted on the frame 1. Specifically, as shown... Figure 3 As shown, the mounting bracket 2 includes a first frame body 21, a second frame body 22, a fine-tuning cylinder 23, and an assembly base 24. The first frame body 21 and the second frame body 22 are rectangular frames. The second frame body 22 is slidably mounted on the first frame body 21. The assembly base 24 is fixedly mounted on the bottom of the first frame body 21. The assembly base 24 is a combination of a variable-diameter cylindrical body and a stepped rectangular body, used to provide an assembly base.

[0041] As a preferred embodiment of this application, such as Figure 3 As shown, a fine-tuning cylinder 23 is installed between the second frame 22 and the first frame 21. The cylinder of the fine-tuning cylinder 23 is connected to the second frame 22, and the piston rod of the fine-tuning cylinder 23 is connected to the first frame 21. The fine-tuning cylinder 23 is used to drive the first frame 21 to move up and down relative to the second frame 22, so that when the second frame 22 is adjusted to a predetermined position, the height of the first frame 21 can be further finely adjusted. Furthermore, a slide rail 26 is installed between the second frame 22 and the first frame 21 to allow the first frame 21 to move smoothly along the second frame 22.

[0042] like Figure 2 As shown, the mounting frame 2 is also equipped with a distance sensor 25. Optionally, the distance sensor 25 uses laser distance measurement to calculate the height of the mounting frame 2 in order to determine whether the mounting frame 2 has reached the predetermined position.

[0043] A drive module 3 is mounted on the top of the frame 1. The drive module 3 extends to the bottom of the frame 1 and connects to the mounting frame 2. The drive module 3 is used to drive the mounting frame 2 to move up and down as a whole. Specifically, as shown in the figure... Figure 4As shown, the drive module 3 includes a motor bracket 31, a drive motor 32, a reducer 33, a transmission screw 34, and a transmission nut 35. The motor bracket 31 is fixedly installed on the frame 1, and the drive motor 32 is mounted on the motor bracket 31. The drive motor 32 is connected to the reducer 33, and the reducer 33 is used to reduce the speed and increase the torque of the drive motor 32.

[0044] A transmission screw 34 is provided below the motor bracket 31. The end of the transmission screw 34 is fixedly connected to the output shaft of the reducer 33 through a coupling 36, so that the drive motor 32 drives the transmission screw 34 to rotate. A transmission nut 35 is threaded on the transmission screw 34. The transmission screw 34 is used to convert the rotation of the drive motor 32 into the axial movement of the transmission nut 35. The transmission nut 35 is fixedly connected to the second frame 22. The advantage of this arrangement is that the drive motor 32 drives the transmission nut 35 and the mounting bracket 2 to move.

[0045] The mounting bracket 2 is equipped with guide modules 4 on both sides. The guide modules 4 are fixedly connected to the frame 1 so that the mounting bracket 2 can slide up and down. Specifically, for example... Figure 5 As shown, the guiding module 4 includes a guide plate 41, a slider 43, and a guide rail 44. The end face of the guide plate 41 is fixedly connected to the second frame 22. Slider 43 is symmetrically mounted on the guide plate 41, and the guide rail 44 is slidably mounted on the slider 43. The guide rail 44 is fixedly connected to the frame 1. Further, the guide rail 44 is an air-bearing guide rail, used to reduce the frictional resistance when the slider 43 slides on the guide rail 44. Optionally, as a feasible embodiment of this application, a displacement sensor 42 is fixedly mounted on one side of the guide plate 41. The displacement sensor 42 is used to measure the displacement data of the guide plate 41 relative to the frame 1. The displacement sensor 42 includes a grating ruler sensor and a magnetic grating ruler sensor. When a grating ruler sensor is used, the reading head of the sensor is connected to the guide plate 41, and the main scale of the sensor is fixedly mounted on the frame 1. The movement accuracy of the mounting frame 2 is improved through closed-loop control.

[0046] A vacuum suction cup 5 is fixedly mounted on the bottom of the mounting bracket 2. The vacuum suction cup 5 is fixedly connected to the mounting base 24 so that it can move synchronously with the mounting bracket 2. Specifically, as shown in the figure... Figure 6 As shown, the vacuum suction cup 5 has multiple air pipe connectors 51 arranged in pairs on its side. The air pipe connectors 51 are used to connect to a vacuum pump. The bottom of the vacuum suction cup 5 has multiple air holes 52. The air holes 52 are used to generate negative pressure to adsorb the substrate. The vacuum suction cup 5 also has an air channel inside, which is used to connect the air holes 52 with the air pipe connectors 51.

[0047] The mounting bracket 2 above the vacuum suction cup 5 is equipped with a curing module 6, specifically, as follows: Figure 7As shown, the curing module 6 includes a fixed frame 61, a lifting cylinder 62, a movable frame 63, a clamping block 64, and an ultraviolet lamp 65. The fixed frame 61 is mounted on the assembly base 24, and the movable frame 63 is mounted on the fixed frame 61. The lifting cylinder 62 is installed between the movable frame 63 and the fixed frame 61. The cylinder barrel of the lifting cylinder 62 is connected to the fixed frame 61, and the piston rod of the lifting cylinder 62 is connected to the movable frame 63. The lifting cylinder 62 is used to drive the movable frame 63 to move up and down. The clamping block 64 is symmetrically installed on the movable frame 63 by wing screws 68. The advantage of setting the wing screws 68 is that it is convenient to operate by hand so as to quickly install the clamping block 64. The ultraviolet lamp 65 is engaged and installed on the clamping block 64. The ultraviolet lamp 65 is used to emit ultraviolet light to irradiate the adhesive between the substrates to complete the curing.

[0048] As a preferred embodiment of this application, such as Figure 8 As shown, the movable frame 63 is symmetrically provided with adjustment slots 66, and multiple positioning holes 67 are provided in the adjustment slots 66. The positioning holes 67 are used to install wing screws 68. The advantage of this design is that it can adapt to substrates of different sizes, so as to adjust the position of the ultraviolet lamp 65 and cure the corresponding points on the substrate. By rotating the wing screws 68 to remove the clamping block 64, and then sliding it on the adjustment slots 66, the positions of the clamping block 64 and the ultraviolet lamp 65 can be quickly adjusted. Then, the wing screws 68 are screwed back into the corresponding positioning holes 67 to achieve fixation, which improves the versatility of substrates of different sizes.

[0049] The mounting bracket 2 above the curing module 6 is symmetrically equipped with release modules 7, specifically, as shown in... Figure 9 As shown, the detachment module 7 includes a mounting plate 71, an adjustment bracket 72, an adjustment bolt 73, and a miniature cylinder 74. The mounting plate 71 is fixedly connected to the mounting base 24. The mounting plate 71 is provided with a clearance groove 75 to avoid interference with the curing module 6. The adjustment bracket 72 is fixedly mounted on the mounting plate 71 at intervals, and the adjustment bracket 72 is equipped with the adjustment bolt 73. Further, as... Figure 10 As shown, the adjusting bolt 73 includes an adjusting screw 76 and a threaded adjusting nut 77. The extension length can be controlled by rotating the adjusting screw 76. The adjusting nut 77 is also provided with a groove that cooperates with the adjusting bracket 72 for limiting and fixing the adjusting bolt 73.

[0050] In a preferred embodiment of this application, a miniature cylinder 74 is fixedly mounted on the bottom of the adjusting bolt 73. The adjusting bolt 73 is used to adjust the height of the miniature cylinder 74, and the miniature cylinder 74 is used to push the substrate away at the end of assembly. The advantage of this arrangement is that when the substrate is in a liquid environment, even if the vacuum suction cup 5 is closed after the movement and assembly work is completed, the substrate is easily adhered to the bottom of the vacuum suction cup 5 under the action of air pressure. This can easily cause the substrate to be pulled when the mounting bracket 2 is retracted, damaging the processed substrate. This application uses the pushing of the miniature cylinder 74 to make the substrate correctly detach from the vacuum suction cup 5, avoiding damage and failure.

[0051] Furthermore, corresponding to the positions of the miniature cylinder 74 and the ultraviolet lamp 65, the mounting base 24 of this application is also provided with a first clearance hole 27, and the vacuum suction cup 5 is provided with a second clearance hole 53. The second clearance hole 53 and the first clearance hole 27 are used to prevent the components from interfering with the miniature cylinder 74 and the ultraviolet lamp 65.

[0052] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0053] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0054] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A substrate pressing device suitable for bonding processes, comprising a frame (1), a mounting frame (2), a drive module (3), a guide module (4), a vacuum suction cup (5), a curing module (6), and a release module (7), characterized in that: A mounting bracket (2) is mounted on the frame (1). A drive module (3) is mounted on the top of the frame (1). The drive module (3) extends to the bottom of the frame (1) and connects to the mounting bracket (2). The drive module (3) is used to drive the mounting bracket (2) to move up and down. Guide modules (4) are mounted on both sides of the mounting bracket (2). The guide modules (4) are fixedly connected to the frame (1) so that the mounting bracket (2) can slide up and down. A vacuum suction cup (5) is fixedly mounted on the bottom of the mounting bracket (2). A curing module (6) is mounted on the mounting bracket (2) above the vacuum suction cup (5). A detachment module (7) is symmetrically mounted on the mounting bracket (2) above the curing module (6). The curing module (6) includes an ultraviolet lamp. The mounting bracket (2) includes a first frame body (21), a second frame body (22), a fine-tuning cylinder (23), and a mounting base (24). The first frame body (21) and the second frame body (22) are rectangular frames. The second frame body (22) is slidably mounted on the first frame body (21). A fine-tuning cylinder (23) is installed between the second frame body (22) and the first frame body (21). The cylinder of the fine-tuning cylinder (23) is connected to the second frame body (22), and the piston rod of the fine-tuning cylinder (23) is connected to the first frame body (21). The fine-tuning cylinder (23) is used to drive the first frame body (21) to move up and down. The mounting base (24) is fixedly installed at the bottom of the first frame body (21). The detachment module (7) includes a mounting plate (71), an adjustment bracket (72), an adjustment bolt (73), and a miniature cylinder (74). The adjustment bracket (72) is fixedly mounted on the mounting plate (71) at intervals. The adjustment bracket (72) is equipped with an adjustment bolt (73). The miniature cylinder (74) is fixedly mounted on the bottom of the adjustment bolt (73). The adjustment bolt (73) is used to adjust the height of the miniature cylinder (74). The miniature cylinder (74) is used to push open the substrate at the end of the assembly.

2. The substrate pressing device for bonding process according to claim 1, characterized in that: The drive module (3) includes a motor bracket (31), a drive motor (32), a reducer (33), a transmission screw (34), and a transmission nut (35). The drive motor (32) is mounted on the motor bracket (31). The drive motor (32) is connected to the reducer (33). The reducer (33) is used to reduce the speed and increase the torque of the drive motor (32). The transmission screw (34) is provided below the motor bracket (31). The end of the transmission screw (34) is fixedly connected to the output shaft of the reducer (33) through a coupling (36). The transmission nut (35) is threaded on the transmission screw (34). The transmission screw (34) is used to convert the rotation of the drive motor (32) into the axial movement of the transmission nut (35).

3. The substrate pressing device according to claim 1, characterized in that: The guide module (4) includes a guide plate (41), a slider (43) and a guide rail (44). The slider (43) is symmetrically mounted on the guide plate (41) and the slider (43) is slidably mounted on the guide rail (44).

4. A substrate pressing device suitable for bonding processes according to claim 1, characterized in that: The vacuum suction cup (5) has multiple pairs of air pipe connectors (51) on its side. The air pipe connectors (51) are used to connect to a vacuum pump. The bottom of the vacuum suction cup (5) has multiple air holes (52). The air holes (52) are used to generate negative pressure to adsorb the substrate. The vacuum suction cup (5) also has an air channel inside to connect the air holes (52) with the air pipe connectors (51).

5. A substrate pressing device suitable for bonding processes according to claim 1, characterized in that: The curing module (6) includes a fixed frame (61), a lifting cylinder (62), a movable frame (63), a clamping block (64), and an ultraviolet lamp (65). The movable frame (63) is mounted on the fixed frame (61). The lifting cylinder (62) is installed between the movable frame (63) and the fixed frame (61). The cylinder of the lifting cylinder (62) is connected to the fixed frame (61), and the piston rod of the lifting cylinder (62) is connected to the movable frame (63). The lifting cylinder (62) is used to drive the movable frame (63) to move up and down. The clamping block (64) is symmetrically mounted on the movable frame (63) by a wing screw (68). The ultraviolet lamp (65) is engaged and installed on the clamping block (64).

6. A substrate pressing device suitable for bonding processes according to claim 5, characterized in that: The movable frame (63) is symmetrically provided with adjustment grooves (66), and multiple positioning holes (67) are provided in the adjustment grooves (66).

7. A substrate pressing device suitable for bonding processes according to claim 1, characterized in that: The mounting plate (71) is provided with a clearance groove (75) to avoid interference with the curing module (6).

8. A substrate pressing device suitable for bonding processes according to claim 1, characterized in that: The mounting bracket (2) is also equipped with a distance sensor (25), which is used to measure the height of the mounting bracket (2).

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