Pressure detection devices and electronic equipment

Abstract

This application discloses a pressure detection device and an electronic device, belonging to the field of electronic equipment technology. The pressure detection device includes: a flexible circuit board, which includes a trace layer and a touch layer, wherein the touch layer is disposed on the trace layer and electrically connected to the trace layer; an electromagnetic interference (EMI) film layer, disposed on the flexible circuit board and electrically connected to the trace layer; an elastic filler layer, disposed on the flexible circuit board; and a ground layer, disposed on the elastic filler layer, with the elastic filler layer located between the ground layer and the EMI film layer.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a pressure detection device and an electronic device. Background Technology

[0002] A capacitive pressure sensor contains a pair of conductive plates or electrodes. When pressure is applied to an object, the distance between the conductive plates changes, causing a change in capacitance. This change in capacitance can be measured and converted into an electrical signal, which can then be analyzed and identified by a processor or circuit.

[0003] In related technologies, touch detection and pressure detection of capacitive pressure sensors need to be performed on different layers of FPC (Flexible Printed Circuit), requiring the design of multiple FPCs for detection or multiple FPCs for detection, resulting in high hardware and design costs. Summary of the Invention

[0004] This application aims to provide a pressure detection device and electronic device that can solve the problem of high hardware and design costs caused by the need to design multiple layers of FPC for detection or to divide the detection into multiple FPCs.

[0005] In a first aspect, embodiments of this application propose a pressure detection device, comprising: a flexible circuit board, the flexible circuit board including a trace layer and a touch layer, wherein the touch layer is disposed on the trace layer and electrically connected to the trace layer; an electromagnetic interference film layer disposed on the flexible circuit board and electrically connected to the trace layer; an elastic filler layer disposed on the flexible circuit board; and a ground layer disposed on the elastic filler layer, wherein the elastic filler layer is located between the ground layer and the electromagnetic interference film layer.

[0006] Secondly, embodiments of this application provide an electronic device, including: a housing; and a pressure detection device disposed in the housing, wherein the pressure detection device is the same as the pressure detection device in the first aspect.

[0007] In this embodiment, by setting an electromagnetic interference thin film layer on the flexible circuit board for capacitive touch detection, the touch layer can generate a touch detection signal when the pressure detection device is touched, and the capacitance value of the plate capacitor formed between the electromagnetic interference thin film layer and the ground layer changes when the pressure detection device is pressed, thereby generating a pressure detection signal. Thus, the pressure detection device can perform touch detection and pressure detection with a smaller number of flexible circuit boards, reducing the hardware cost and design cost of the pressure detection device.

[0008] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0009] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0010] Figure 1 This illustration shows one of the structural schematic diagrams of the pressure detection device provided in some embodiments of this application;

[0011] Figure 2 This is shown as a second schematic diagram of the structure of the pressure detection device provided in some embodiments of this application;

[0012] Figure 3 The following are schematic diagrams of the wiring layer structure provided in some embodiments of this application;

[0013] Figure 4 One of the schematic diagrams of the sub-film arrangement provided in some embodiments of this application is shown;

[0014] Figure 5 This is a second schematic diagram of the sub-film arrangement provided in some embodiments of this application;

[0015] Figure 6 This is shown as the third schematic diagram of the sub-film arrangement provided in some embodiments of this application;

[0016] Figure 7 The diagram shows a schematic representation of the touch layer provided in some embodiments of this application;

[0017] Figure 8 This illustration shows one of the structural schematic diagrams of the electronic device provided in some embodiments of this application;

[0018] Figure 9 This is a second schematic diagram of the structure of an electronic device provided in some embodiments of this application.

[0019] Figure label:

[0020] 100 Pressure detection device, 110 Flexible circuit board, 112 Wiring layer, 1121 First wiring, 1122 Connection window, 1123 Second connection terminal, 1124 Second wiring, 114 Touch layer, 1141 Capacitance detection unit, 1142 First connection terminal, 120 Electromagnetic interference thin film layer, 122 Sub-thin film, 130 Elastic filling layer, 140 Grounding layer, 150 Capacitance detection chip, 200 Electronic device, 201 Housing. Detailed Implementation

[0021] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0022] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0023] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0024] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] The following combination Figures 1 to 9 This application describes a pressure detection device and an electronic device according to embodiments thereof.

[0026] In some embodiments of this application, a pressure detection device is provided. Figure 1 This illustration shows one of the structural schematic diagrams of the pressure detection device provided in some embodiments of this application. Figure 2 The following is a schematic diagram of the structure of the pressure detection device provided in some embodiments of this application, such as... Figure 1 and Figure 2 As shown, the pressure detection device 100 includes: a flexible circuit board 110, which includes a wiring layer 112 and a touch layer 114, wherein the touch layer 114 is disposed on the wiring layer 112 and is electrically connected to the wiring layer 112; an electromagnetic interference film layer 120, which is disposed on the flexible circuit board 110 and is electrically connected to the wiring layer 112; an elastic filler layer 130, which is disposed on the flexible circuit board 110; and a ground layer 140, which is disposed on the elastic filler layer 130 and is located between the ground layer 140 and the electromagnetic interference film layer 120.

[0027] In this embodiment, the pressure detection device 100 includes a flexible circuit board 110, which comprises two circuit board layers: a wiring layer 112 and a touch layer 114. The touch layer 114 is used to detect the pressure exerted by the user on the touch layer 114 to generate a touch detection signal. The wiring layer 112 is used to transmit the touch detection signal generated by the touch layer 114 outward. In other words, the touch layer 114 is used for signal detection, and the wiring layer 112 is used for signal transmission. The pressure detection device 100 also includes an electromagnetic interference (EMI) film layer 120 disposed on the flexible circuit board 110. The EMI film layer 120, the elastic filler layer 130, and the ground layer 140 are capable of generating a pressure detection signal in response to the applied pressure. An elastic filler layer 130 is disposed between the EMI film layer 120 and the ground layer 140. When the user presses the ground layer, the elastic filler layer 130 deforms, thereby changing the distance between the EMI film layer 120 and the ground layer 140. A parallel plate capacitor is formed between the electromagnetic interference thin film layer 120 and the ground layer 140. When the distance between the electromagnetic interference thin film layer 120 and the ground layer 140 changes, the capacitance value of the parallel plate capacitor changes, thereby outputting a pressure detection signal to realize the detection of pressing action.

[0028] For example, the elastic filler layer 130 is an interlayer filled with an elastic insulating material, such as foam adhesive.

[0029] For example, the electromagnetic interference thin film layer 120 is selected as an EMI (Electromagnetic Interference) film. The EMI film includes an insulating layer, a metal deposition layer and a conductive adhesive layer. The conductive adhesive layer is attached to the wiring layer 112 of the flexible circuit board 110, and the EMI film is electrically connected to the wiring layer 112 through the conductive adhesive layer.

[0030] Specifically, the top layer of the double-layer flexible circuit board 110 serves as a touch layer 114, which contains multiple capacitance detection units 1141. The top layer of the double-layer flexible board also serves as a wiring layer 112. An electromagnetic interference (EMI) film layer 120 is attached to the wiring layer 112 and electrically connected to it. The EMI film layer 120 is tightly attached to the ground layer 140 via an elastic filler layer 130. The ground layer 140 is attached to the device casing. The elastic filler layer 130 can deform and rebound in response to user pressure. When a user pinches the device casing and applies pressure, the distance between the EMI film layer 120 and the ground layer 140 is compressed, thereby increasing the capacitance of the parallel plate capacitor formed by the EMI film layer 120 and the ground layer 140. By detecting this capacitance change, the pressure action can be detected.

[0031] For example, the grounding layer 140 can be implemented by means of steel pipe grounding, conductive cloth grounding, etc.

[0032] like Figure 1 As shown, exemplarily, the pressure detection device 100 can be laid flat on the device.

[0033] like Figure 2 As shown, exemplarily, the pressure detection device 100 may be annular and arranged around the device.

[0034] In this embodiment, by providing an electromagnetic interference thin film layer 120 on the flexible circuit board 110 for capacitive touch detection, the touch layer can generate a touch detection signal when the pressure detection device 100 is touched. When the pressure detection device 100 is pressed, the capacitance value of the plate capacitor formed between the electromagnetic interference thin film layer 120 and the ground layer 140 changes, generating a pressure detection signal. Thus, the pressure detection device 100 can perform touch detection and pressure detection with a smaller number of flexible circuit boards 110, reducing the hardware and design costs of the pressure detection device 100.

[0035] In some embodiments of this application, the electromagnetic interference thin film layer 120 includes N sub-films 122, where N is a positive integer. In one embodiment, N can be 1, 2, 3, etc. When N is 2, two sub-films 122 are arranged side-by-side with a gap. When N is 3, three sub-films are arranged side-by-side with a gap. The wiring layer 112 is located between the touch layer 114 and the electromagnetic interference thin film layer 120. The wiring layer 112 has M connection windows 1122, which are connected to the N sub-films 122, where M is a positive integer. In one embodiment, M can be 1, 2, 3, etc. Each of the N sub-films 122 is connected to P connection windows 1122, where P is a positive integer, and M = P × N. In other words, each sub-film can have one or more connection windows.

[0036] In this embodiment, the electromagnetic interference thin film layer 120 includes N sub-films 122, each of which serves as a pressure detection unit. By setting multiple sub-films 122 in the electromagnetic interference thin film layer 120, the pressure detection device 100 includes multiple pressure detection units, which are distributed at different positions in the pressure detection device 100, thereby detecting the pressure at different positions.

[0037] In this embodiment, the wiring layer 112 is disposed between the touch layer 114 and the electromagnetic interference film layer 120, that is, the electromagnetic interference film layer 120 is attached to the wiring layer 112. A connection window 1122 is formed on the wiring layer 112 so that the electromagnetic interference film layer 120 is electrically connected to the wiring layer 112 through conductive adhesive and the connection window 1122.

[0038] Specifically, the connection window 1122 is an opening formed on the trace layer 112, through which copper is exposed. The electromagnetic interference thin film layer 120 includes sub-films 122, each of which is an EMI film. The EMI film includes a conductive adhesive layer, and the conductive adhesive layer of the EMI film is attached to the connection window 1122 of the trace layer 112, so that the EMI film is electrically connected to the trace layer 112 through the connection window 1122 and the conductive adhesive.

[0039] In this embodiment, M≥N, that is, the number M of connection windows 1122 is greater than or equal to the number N of sub-films 122, and each sub-film 122 corresponds to at least one connection window 1122, thereby improving the connection stability between the electromagnetic interference film layer 120 and the wiring layer 112.

[0040] For example, there are 10 sub-films 122, and 10 connection windows 1122 are opened on the wiring layer 112, i.e., P=1. The opening position of the 10 connection windows 1122 matches the distribution position of the 10 sub-films 122, and the sub-films 122 correspond one-to-one with the connection windows 1122.

[0041] For example, there are 6 sub-films 122, and 12 connection windows 1122 are opened on the wiring layer 112, that is, P=2. One sub-film 122 corresponds to two connection windows 1122, and the opening position of the two connection windows 1122 corresponding to the sub-film 122 matches the distribution position of the corresponding sub-film 122.

[0042] In this embodiment, a plurality of sub-films 122 are provided in the electromagnetic interference thin film layer 120, and corresponding connection windows 1122 are opened on the wiring layer 112. The plurality of sub-films 122 are electrically connected to the wiring layer 112 through the corresponding connection windows 1122, so that each sub-film 122 can be used as a pressure detection unit to detect the pressing pressure. Furthermore, by setting the number of connection windows 1122 corresponding to each sub-film 122 to at least one, the stability of the electrical connection between each sub-film 122 and the wiring layer 112 can be improved.

[0043] Figure 3 The following are schematic diagrams illustrating the structure of the wiring layer provided in some embodiments of this application, such as... Figure 3 As shown, in some embodiments of this application, the wiring layer 112 includes: M first wirings 1121, the first ends of the M first wirings 1121 are respectively connected to M connection windows 1122, and the second ends of the M first wirings 1121 are used to output pressure detection signals.

[0044] In this embodiment of the application, the wiring layer 112 includes a first wiring 1121, which is used to transmit the pressure detection signal output by the electromagnetic interference thin film layer 120 to the outside, that is, to transmit the pressure detection signal output by the electromagnetic interference thin film layer 120 to the capacitance detection chip 150.

[0045] Specifically, the N sub-films 122 in the electromagnetic interference thin film layer 120 transmit the collected pressure detection signal to the wiring layer 112. The wiring layer 112 then transmits the pressure detection signal to the capacitance detection chip 150 via the first wiring 1121, thereby determining the pressing pressure. There are M first wirings 1121, with each first wiring 1121 having its first end connected to the connection window 1122 and its second end connected to the capacitance detection chip 150, thus transmitting the pressure detection signal to the capacitance detection chip 150 via the first wiring 1121.

[0046] In this embodiment, multiple first traces 1121 are provided in the wiring layer 112, and the multiple first traces 1121 correspond one-to-one with multiple connection windows 1122. The collected pressure detection signal can be transmitted to the capacitance detection chip 150 through the first traces 1121, thereby improving the stability and accuracy of the pressure detection device 100 in detecting the user's pressing operation.

[0047] In some embodiments of this application, N sub-films 122 are arranged along a first direction.

[0048] In this embodiment, N sub-films 122 are arranged in an N×1 array, and the arrangement direction of the N sub-films 122 is the first direction.

[0049] For example, when the pressure detection device 100 has a quadrilateral structure, the first direction can be the width direction of the wiring layer 112, the length direction of the wiring layer 112, or the diagonal direction of the wiring layer 112, etc.

[0050] Figure 4 This illustration shows one of the sub-film arrangement schematic diagrams provided in some embodiments of this application, such as... Figure 4 As shown, arrow A indicates the first direction, which is the length direction of the wiring layer 112. N sub-films 122 are arranged along the length direction of the wiring layer 112. The width of each sub-film 122 is the same as the width of the wiring layer 112, and the length of each sub-film 122 is less than or equal to 1 / N of the length of the flexible circuit board 110.

[0051] Figure 5 This is shown as a second schematic diagram of the sub-film arrangement provided in some embodiments of this application, such as... Figure 5 As shown, arrow B indicates the first direction, which is the width direction of the wiring layer 112. N sub-films 122 are arranged along the width direction of the wiring layer 112. The length of each sub-film 122 is the same as the length of the wiring layer 112, and the width of each sub-film 122 is less than or equal to 1 / N of the width of the flexible circuit board 110.

[0052] For example, when the pressure detection device 100 is a ring structure, the first direction can be the axial direction of the wiring layer 112, or the circumferential direction of the wiring layer 112.

[0053] In this embodiment, the sub-films 122 are arranged along a first direction so that the sub-films 122 can be distributed on the wiring layer 112 along the first direction, thereby improving the stability of the connection between each sub-film 122 and the wiring layer 112.

[0054] In some embodiments of this application, N sub-films 122 are arranged according to a target array, wherein the number of rows of the target array is X and the number of columns of the target array is Y, where X and Y are both integers greater than 1, and N = X × Y.

[0055] In this embodiment, N sub-films 122 are arranged in a rectangular array of X×Y, and the product of X and Y is N.

[0056] Figure 6 The third illustration shows a schematic diagram of the sub-film arrangement provided in some embodiments of this application, such as... Figure 6 As shown, N sub-films 122 are arranged along the width direction of the wiring layer 112. The length of each sub-film 122 is less than or equal to 1 / X of the length of the flexible circuit board 110, and the width of each sub-film 122 is less than or equal to 1 / Y of the width of the flexible circuit board 110.

[0057] For example, the number of sub-films 122 is 8, the number of rows of the target array is 2, and the number of columns of the target array is 4, or the number of rows of the target array is 4 and the number of columns of the target array is 2.

[0058] For example, there are 9 sub-films 122, and the target array has 3 rows and 3 columns.

[0059] In this embodiment, when there are multiple sub-films 122, the sub-films 122 can be arranged in an X×Y target array on the flexible circuit board 110 to further improve the detection sensitivity of the pressure detection device 100.

[0060] Figure 7 The following are schematic diagrams illustrating the structure of the touch layer provided in some embodiments of this application, such as... Figure 3 and Figure 7 As shown, in some embodiments of this application, the touch layer 114 includes: Q capacitance detection units 1141, arranged in an array, and each of the Q capacitance detection units 1141 is provided with a first connection terminal 1142, where Q is a positive integer; the wiring layer 112 is provided with Q second connection terminals 1123, and each capacitance detection unit 1141 is connected to the wiring layer 112 through the first connection terminal 1142 and the second connection terminal 1123.

[0061] In this embodiment, the touch layer 114 includes multiple capacitance detection units 1141, which are arrayed on the flexible circuit board 110. The multiple capacitance detection units 1141 perform capacitance detection on the touch detection signal. Each capacitance detection unit 1141 is provided with a first connection terminal 1142, and the wiring layer 112 is provided with the same number of second connection terminals 1123 as the capacitance detection units 1141. The first connection terminals 1142 and the second connection terminals 1123 can be connected by connecting lines, thereby electrically connecting the wiring layer 112 and the touch layer 114.

[0062] Specifically, Q capacitor detection units 1141 are arranged in an array, and the array of Q capacitor detection units 1141 is a J×K array, and the number of rows and columns of the array of Q capacitor detection units 1141 are both positive integers.

[0063] For example, both the first connection terminal 1142 and the second connection terminal 1123 are blind hole structures, and the plane of the touch layer 114 on which the first connection terminal 1142 is disposed is opposite to the plane of the wiring layer 112 on which the second connection terminal 1123 is disposed.

[0064] In this embodiment, multiple capacitance detection units 1141 are provided on the touch layer 114, enabling the touch layer 114 to identify and detect touch operations with different touch trajectories performed by the user. Each capacitance detection unit 1141 is provided with a corresponding first connection terminal 1142 and connected to the wiring layer 112 through a second connection terminal 1123, which can improve the stability of the touch detection signal transmitted from the touch layer 114 to the wiring layer 112.

[0065] like Figure 3 As shown, in some embodiments of this application, the wiring layer 112 includes: Q second wirings 1124, the first ends of the Q second wirings 1124 are respectively connected to Q second connection terminals 1123, and the second ends of the Q second wirings 1124 are used to output touch detection signals.

[0066] In this embodiment of the application, a second trace 1124 is provided in the trace layer 112. The second trace 1124 is used to transmit the touch detection signal output by the touch layer 114 to the outside, that is, to transmit the touch detection signal output by the touch layer 114 to the capacitance detection chip 150.

[0067] Specifically, the number of second traces 1124 matches the number of capacitive detection units 1141 in the touch layer 114, ensuring that the touch detection signal output by each capacitive detection unit 1141 can be transmitted to the capacitive detection chip 150 through the trace layer 112. The first end of each second trace 1124 is connected to a corresponding second connection terminal 1123, and the second end of each second trace 1124 is connected to the capacitive detection chip 150, thereby transmitting the touch detection signal output by each capacitive detection unit 1141 to the capacitive detection chip 150.

[0068] In this embodiment, multiple second traces 1124 are provided in the trace layer 112, and the multiple second traces 1124 correspond one-to-one with multiple second connection terminals 1123. The touch detection signal collected by the touch layer 114 can be transmitted to the capacitance detection chip 150 through the second traces 1124, thereby improving the stability and accuracy of the pressure detection device 100 in detecting the user's touch operation.

[0069] like Figure 3 As shown, in some embodiments of this application, the pressure detection device 100 further includes a capacitance detection chip 150, which is electrically connected to the wiring layer 112.

[0070] In this embodiment, the pressure detection device 100 is further provided with a capacitance detection chip 150. The touch detection signal output by the touch layer 114 and the pressure detection signal output by the electromagnetic interference film layer 120 can be transmitted to the capacitance detection chip 150 through the wiring layer 112, so that the capacitance detection chip 150 can monitor the capacitance values ​​of the touch layer 114 and the electromagnetic interference film layer 120.

[0071] like Figure 2 As shown, in some embodiments of this application, the pressure detection device 100 is annular, wherein the touch layer 114 is located on the outer ring of the pressure detection device 100, and the grounding layer 140 is located on the inner ring of the pressure detection device 100.

[0072] In this embodiment, the pressure detection device 100 can be disposed on a cylindrical device, that is, the pressure detection device 100 can be disposed in a ring shape, and the touch layer 114 is located on the outer ring of the pressure detection device 100, which can ensure the accuracy and sensitivity of the pressure detection device 100 in sampling the touch detection signal.

[0073] For example, the annular pressure detection device 100 consists of a grounding layer 140, an elastic filling layer 130, an electromagnetic interference thin film layer 120, a wiring layer 112, and a touch layer 114 from the inside out.

[0074] In some embodiments of this application, an electronic device is provided. Figure 8 This illustration shows one of the structural schematic diagrams of the electronic device provided in some embodiments of this application. Figure 9 The second schematic diagram of the structure of the electronic device provided in some embodiments of this application is shown, such as... Figure 8 and Figure 9 As shown, the electronic device 200 includes a housing 201 and a pressure detection device 100. The pressure detection device 100 is the pressure detection device 100 in any of the above embodiments, and therefore has all the beneficial technical effects of the pressure detection device 100 in any of the above embodiments, which will not be elaborated further here.

[0075] like Figure 8 As shown, exemplarily, the electronic device 200 is a wireless headset, and the pressure detection device 100 is disposed on the headset stem of the wireless headset.

[0076] like Figure 9 As shown, exemplarily, the electronic device 200 is a stylus, and the stylus housing 201 is cylindrical. The pressure detection device 100 is annular, and the annular pressure detection device 100 is disposed inside the stylus housing 201.

[0077] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0078] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A pressure detection device, characterized in that, include: A flexible circuit board, the flexible circuit board including a wiring layer and a touch layer, wherein the touch layer is disposed on the wiring layer and the touch layer is electrically connected to the wiring layer; An electromagnetic interference thin film layer is disposed on a flexible circuit board, and the electromagnetic interference thin film layer is electrically connected to the trace layer; An elastic filler layer is disposed on the flexible circuit board; A grounding layer is disposed on the elastic filler layer, and the elastic filler layer is located between the grounding layer and the electromagnetic interference thin film layer.

2. The pressure detection device according to claim 1, characterized in that, The electromagnetic interference thin film layer comprises: N sub-thin films, where N is a positive integer; The wiring layer is located between the touch layer and the electromagnetic interference film layer. M connection windows are provided on the wiring layer, and the M connection windows are connected to N sub-films, where M is a positive integer. Each of the N sub-films is connected to P connection windows, where P is a positive integer and M = P × N.

3. The pressure detection device according to claim 2, characterized in that, The routing layer includes: M first traces, the first ends of which are respectively connected to the M connecting windows, and the second ends of the M first traces are used to output pressure detection signals.

4. The pressure detection device according to claim 2, characterized in that, The N sub-films are arranged along a first direction.

5. The pressure detection device according to claim 2, characterized in that, The N sub-films are arranged in a target array, wherein the number of rows of the target array is X and the number of columns of the target array is Y, where X and Y are both integers greater than 1, and N = X × Y.

6. The pressure detection device according to any one of claims 1 to 5, characterized in that, The touch layer includes: Q capacitance detection units are arranged in an array, and each of the Q capacitance detection units is provided with a first connection terminal, where Q is a positive integer; The wiring layer is provided with Q second connection terminals, and each of the capacitance detection units is connected to the wiring layer through the first connection terminal and the second connection terminal.

7. The pressure detection device according to claim 6, characterized in that, The routing layer includes: Q second traces, the first ends of which are respectively connected to Q second connection terminals, and the second ends of the Q second traces are used to output touch detection signals.

8. The pressure detection device according to any one of claims 1 to 5, characterized in that, Also includes: A capacitance detection chip is electrically connected to the wiring layer.

9. The pressure detection device according to any one of claims 1 to 5, characterized in that, The pressure detection device is ring-shaped, wherein the touch layer is located on the outer ring of the pressure detection device, and the grounding layer is located on the inner ring of the pressure detection device.

10. An electronic device, characterized in that, include: shell; The pressure detection device according to any one of claims 1 to 9 is disposed in the housing.

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