Chip position prediction and adjustment method, device, equipment and storage medium during reverse hand switching

Abstract

The present invention relates to a chip position prediction and adjustment method, device, equipment and storage medium during reverse hand-over. The specific method is: using a reverse device with an adaptive clamping and adjustment function to pick up a chip, and collecting image information of the chip and a substrate for feature extraction to determine the relative position relationship between the chip and the substrate; matching the coordinates of each chip bump with the substrate solder point one by one; calculating the theoretical alignment position of the chip and the substrate after the chip is flipped and planning a moving route according to the rotation center and length of a mechanical arm of the reverse device and the relative position relationship between the chip and the substrate; moving the chip according to the moving route, monitoring the chip status through the multi-sensor of the mechanical arm, and predicting the actual position of the chip based on the monitoring result; and adjusting the final position and final moving route of the chip by comparing the actual position of the chip with the theoretical alignment position, so as to effectively solve the chip deformation problem and improve the accuracy and reliability of chip position prediction during reverse hand-over.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a chip position prediction and adjustment method, device, equipment and storage medium during reverse hand switching. Background Art

[0002] In the semiconductor manufacturing and packaging process, there are multiple challenges in the process of accurately moving the chip from the pick-up position to the predetermined position on the substrate, among which the chip deformation problem is particularly prominent. The chip may be deformed due to physical stress. These stresses may come from the clamping force of the robot arm, the acceleration or deceleration during the movement, and the interaction between the chip and the surrounding environment. Deformation not only affects the electrical performance of the chip, but also may cause poor connection between the chip and the substrate, which in turn affects the reliability and stability of the entire electronic device.

[0003] During the reverse hand-over process, the chip will be affected by various physical forces such as the clamping force of the robot arm and the centrifugal force during flipping. This is more obvious for thin chips or large-size chips. The deformation of the chip will not only affect the electrical performance of the chip, but may also cause poor connection between the chip and the substrate, thereby affecting the reliability and stability of the entire electronic device. At the same time, temperature change is also an important factor causing chip deformation. During the packaging process, the chip may experience rapid temperature changes, such as heating from room temperature to welding temperature and then cooling to room temperature. These temperature changes will cause thermal expansion and contraction of the chip material, resulting in deformation. The difference in thermal expansion coefficients between the different materials of the chip and the substrate will also affect the alignment accuracy of the chip and the substrate, increasing the difficulty of position prediction and adjustment. Summary of the invention

[0004] The main purpose of the present invention is to provide a chip position prediction and adjustment method, device, equipment and storage medium during reverse hand switching, so as to effectively solve the chip deformation problem and improve the accuracy and reliability of chip position prediction during reverse hand switching.

[0005] To achieve the above object, the present invention provides a chip position prediction and adjustment method during reverse hand switching, comprising the following steps:

[0006] The chip is picked up by a reversing device with adaptive clamping and adjustment function, and the image information of the chip and the substrate are collected respectively;

[0007] Extract features based on the collected image information and determine the relative position relationship between the chip and the substrate;

[0008] Based on the extracted features and relative positional relationships, the coordinates of each bump on the chip are matched one-to-one with the coordinates of each solder point on the substrate;

[0009] According to the rotation center and length of the mechanical arm of the reversing device and the relative position relationship between the chip and the substrate, the theoretical alignment position of the chip bumps and the substrate solder joints after the chip is flipped is calculated and the chip movement route is planned;

[0010] The chip is moved according to the chip moving route, the chip status is monitored by multiple sensors on the robot arm, and the actual position of the chip is predicted based on the monitoring results;

[0011] By comparing the actual position with the theoretical alignment position, the final position and final moving route of the chip are adjusted.

[0012] Furthermore, the step of picking up the chip using the inverting device with adaptive clamping and adjusting function and collecting image information of the chip and the substrate respectively comprises:

[0013] Determine the reference position through the built-in sensor of the reversing device, adjust each joint angle of the reversing device and determine the maximum and minimum motion range of the robot arm of the reversing device;

[0014] Determine the initial clamping force of the clamp on the robot arm according to the preset chip size, shape and material;

[0015] picking up the chip by a gripper using a flexible gripping material based on the initial gripping force;

[0016] Based on the real-time monitoring feedback of the pressure sensors on each clamping unit, the clamping force of each position of the chip is dynamically adjusted by using multiple clamping units. The interior of the reversing device is equipped with multiple independently controllable clamping units. When clamping the chip, each clamping unit on the clamp monitors the clamping force applied to the chip in real time through the pressure sensor and provides data feedback.

[0017] After the gripper successfully picks up the chip, image information of the chip and substrate is captured by image sensors respectively, and the image information includes but is not limited to the geometric shape and size of the chip and substrate, the number and layout of chip bumps and substrate solder joints.

[0018] Furthermore, the step of extracting features based on the collected image information and determining the relative position relationship between the chip and the substrate includes:

[0019] Preprocessing the collected image information, wherein the preprocessing includes at least denoising, grayscale conversion and edge detection operations;

[0020] Establishing an image coordinate system based on the collected image information of the chip and the substrate;

[0021] Identify the preprocessed image information and extract key features of chip bumps and substrate solder joints, wherein the key features include the number, size, shape and layout of chip bumps and substrate solder joints;

[0022] Based on the established image coordinate system, coordinates of each element in the key feature are determined, wherein the coordinates of each element include the coordinates of the center of the chip and the coordinates of each chip bump, the coordinates of the center of the substrate and the coordinates of each substrate solder point;

[0023] Based on the coordinates of each element, the relative position relationship and relative coordinates of the chip and the substrate are determined by calculating the coordinate difference.

[0024] Furthermore, the step of matching each bump coordinate on the chip with each substrate solder joint coordinate one-to-one based on the extracted features and relative position relationship includes:

[0025] According to the layout of the chip bumps and the substrate solder joints in the key features, respectively identifying the layout features of the chip bumps and the substrate solder joints;

[0026] Based on the relative position relationship between the chip and the substrate, the one-to-one correspondence and coordinates between each chip bump and each substrate solder point are determined by analyzing the correlation between the chip bump and the substrate solder point layout features.

[0027] Furthermore, the step of calculating the theoretical alignment position of the chip bumps and the substrate solder joints after the chip is flipped and planning the chip movement route according to the rotation center and length of the mechanical arm of the reversing device and the relative position relationship between the chip and the substrate includes:

[0028] Based on the rotation center and arm length of the mechanical arm of the reversing device, and the relative position relationship between the chip and the substrate, the rotation and displacement of the chip in space are simulated by using the principles of geometry and kinematics to predict the theoretical alignment position of the chip and the substrate after flipping;

[0029] Planning a chip movement route from a current position of the chip to the theoretical alignment position according to the theoretical alignment position and the motion limit of the robot arm, wherein the motion limit includes a joint angle limit and a motion range limit of the robot arm;

[0030] According to the planned chip moving route, a control instruction is generated, and the control instruction includes the flip direction, flip angle, moving distance and moving speed of the robot arm.

[0031] Furthermore, the step of moving the chip according to the chip moving route, monitoring the chip status by using the multi-sensor on the robot arm, and predicting the actual position of the chip based on the monitoring result includes:

[0032] According to the planned chip moving route, the chip moving operation is performed by the robot arm, and the chip is moved from the current position to the theoretical alignment position according to the predetermined trajectory and moving speed;

[0033] During the movement of the chip, various state information of the chip is collected in real time using multiple sensors provided on the mechanical arm, wherein the various state information at least includes data information of the real-time position, speed, force condition and temperature of the chip;

[0034] Based on the fusion processing of the data collected by multiple sensors and the data information of the angles and speeds of each joint of the robotic arm, the actual position of the chip after completing the chip movement route is predicted through a pre-trained position prediction model.

[0035] Furthermore, the step of adjusting the final position and final moving route of the chip by comparing the actual position with the theoretical alignment position includes:

[0036] Comparing the predicted actual position with the theoretical alignment position to determine whether there is a deviation and the size and direction of the deviation;

[0037] If there is a deviation between the actual position and the theoretical alignment position, the final position of the chip is predicted according to the size and direction of the deviation and the correspondence between each substrate solder joint and each chip bump;

[0038] Using the inverse kinematics algorithm of the robotic arm, the angle sequence of rotation of each joint of the robotic arm is calculated according to the predicted final position of the chip and the actual posture and position of the current robotic arm, and the final movement route of the chip from the current position to the final position of the chip is planned.

[0039] The present invention also provides a chip position prediction and adjustment device during reverse hand switching, comprising:

[0040] An adaptive clamping module, used to pick up the chip using a reversing device with an adaptive clamping adjustment function, and to collect image information of the chip and the substrate respectively;

[0041] A data processing module is used to extract features based on the collected image information and determine the relative position relationship between the chip and the substrate;

[0042] A coordinate matching module is used to match the coordinates of each bump on the chip with the coordinates of each solder point on the substrate one by one according to the extracted features and relative position relationship;

[0043] An information planning module, for calculating the theoretical alignment position of the chip bumps and the substrate solder joints after the chip is flipped and planning the chip movement route according to the rotation center and length of the mechanical arm of the reversing device and the relative position relationship between the chip and the substrate;

[0044] An information execution module, used to move the chip according to the chip movement route, monitor the chip status through the multi-sensor on the mechanical arm, and predict the actual position of the chip based on the monitoring result;

[0045] The feedback and adjustment module is used to adjust the final position and final moving route of the chip by comparing the actual position with the theoretical alignment position.

[0046] The present invention also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the steps of the chip position prediction and adjustment method during the reverse hand transition are implemented.

[0047] The present invention also provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the chip position prediction and adjustment method during the above-mentioned reverse hand switching are implemented.

[0048] The chip position prediction and adjustment method, device, equipment and storage medium provided by the present invention during reverse hand switching have the following beneficial effects:

[0049] (1) The present invention adopts an inversion device with adaptive clamping and adjustment function to dynamically adjust the clamping force according to the size, shape and material of the chip, thereby reducing the physical stress on the chip and reducing the risk of deformation. At the same time, multiple sensors are used to monitor the status of the chip in real time, including position, speed, force and temperature, so as to timely discover and adjust the factors that may cause deformation;

[0050] (2) The present invention plans the optimal moving route by accurately matching the coordinates of the chip bumps and the substrate solder joints, ensuring that the chip can be smoothly and accurately moved to the predetermined position on the substrate during the reverse hand-over process, thereby reducing the risk of chip deformation during movement and improving the connection quality and reliability between the chip and the substrate.

[0051] (3) The present invention also considers the compatibility of the chip and the substrate. By extracting the image information of the chip and the substrate and determining their relative position relationship and key features, the present invention can ensure the matching and compatibility between the chip and the substrate, and adjust the motion parameters and clamping strategy of the robot arm according to actual needs to adapt to the needs of different chips and substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 1 is a flow chart of a chip position prediction and adjustment method when reverse hand switching in one embodiment of the present invention;

[0053] Figure 2 It is a structural block diagram of a chip position prediction and adjustment device during reverse hand switching in one embodiment of the present invention;

[0054] Figure 3 It is a schematic block diagram of the structure of a computer device according to an embodiment of the present invention.

[0055] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0057] Reference Figure 1 , is a flow chart of a chip position prediction and adjustment method during reverse hand switching proposed by the present invention, comprising the following steps:

[0058] S1, using a reversing device with adaptive clamping and adjustment function to pick up the chip and collect image information of the chip and substrate respectively;

[0059] S2, extracting features based on the collected image information and determining the relative position relationship between the chip and the substrate;

[0060] S3, based on the extracted features and relative position relationship, matching each bump coordinate on the chip with each substrate solder joint coordinate one by one;

[0061] S4, calculating the theoretical alignment position of the chip bumps and the substrate solder joints after the chip is flipped and planning the chip movement route according to the rotation center and length of the mechanical arm of the reversing device and the relative position relationship between the chip and the substrate;

[0062] S5, moving the chip according to the chip moving route, monitoring the chip status through the multi-sensor on the robot arm, and predicting the actual position of the chip based on the monitoring result;

[0063] S6, adjusting the final position and final moving route of the chip by comparing the actual position with the theoretical alignment position.

[0064] As described in step S1 above, an inversion device with an adaptive clamping and adjustment function is used to pick up the chip, and the image information of the chip and the substrate is collected respectively. Among them, the inversion device for picking up the chip has an adaptive clamping and adjustment function, which can automatically adjust the clamping force according to the size, shape and material of the chip to ensure that no excessive physical stress is caused to the chip during the picking process, thereby reducing the risk of chip deformation. The working principle of the inversion is that the device is equipped with multiple independently controllable clamping units, each clamping unit is equipped with a pressure sensor, which can monitor the clamping force applied to the chip in real time and provide data feedback. After the clamp successfully picks up the chip, the device will capture the image information of the chip and the substrate respectively through the built-in image sensor. The collected image information will be used for subsequent steps such as feature extraction and coordinate matching, which is the basis for ensuring that the chip can be accurately moved to the predetermined position of the substrate.

[0065] As described in step S2 above, feature extraction is performed based on the collected image information, and the relative position relationship between the chip and the substrate is determined. From the collected chip and substrate image information, key features of the chip bumps and substrate solder joints, such as quantity, size, shape, and layout, are extracted through image processing technology (such as edge detection, contour extraction, etc.). Based on the extracted features, the coordinates of each element in the chip and substrate image (such as chip center, bump, substrate center, solder joint, etc.) are calculated to determine the relative position relationship between them, so that the chip bumps and substrate solder joints can be accurately matched later.

[0066] As described in step S3 above, based on the extracted features and relative positional relationship, each bump coordinate on the chip is matched with each substrate solder joint coordinate one-to-one. According to the layout features of the chip bumps and the substrate solder joints, and the relative positional relationship between them, each bump coordinate on the chip is matched with each solder joint coordinate on the substrate one-to-one through an algorithm to ensure that the chip can be accurately aligned to the substrate after flipping.

[0067] As described in step S4 above, according to the rotation center and length of the mechanical arm of the inversion device and the relative position relationship between the chip and the substrate, the theoretical alignment position of the chip bump and the substrate solder joint after the chip is flipped is calculated and the chip movement route is planned. Based on the rotation center and length of the mechanical arm of the inversion device and the relative position relationship between the chip and the substrate, the theoretical position where the bump should be aligned with the substrate solder joint after the chip is flipped is calculated through the principles of geometry and kinematics. At the same time, according to the calculated theoretical alignment position and the movement restrictions of the mechanical arm (such as joint angle restrictions, movement range restrictions, etc.), the movement route of the chip from the current position to the theoretical alignment position is planned.

[0068] As described in step S5 above, the chip is moved according to the chip moving route, the chip status is monitored by the multi-sensors on the robotic arm, and the actual position of the chip is predicted based on the monitoring results. According to the chip moving route planned in step S4, the chip moving operation is performed by the robotic arm to move the chip from the current position to the theoretical alignment position. During the chip movement process, the multi-sensors set on the robotic arm are used to collect various status information of the chip (such as position, speed, force condition, temperature, etc.) in real time, and the actual position of the chip after completing the moving route is predicted by the pre-trained position prediction model, so as to timely discover and adjust the deviation that may be caused during the chip movement process.

[0069] As described in step S6 above, by comparing the actual position with the theoretical alignment position, the final position and final movement route of the chip are adjusted. The predicted actual position is compared with the theoretical alignment position to determine whether there is a deviation and the size and direction of the deviation. If there is a deviation, the final position of the chip is predicted based on the size and direction of the deviation and the correspondence between each substrate solder joint and each chip bump, and then the inverse kinematics algorithm of the robot arm is used to plan the final movement route from the current position to the final position to ensure that the chip can be accurately aligned to the predetermined position on the substrate.

[0070] In one embodiment, the step S1 of picking up the chip using the inverting device with adaptive clamping and adjusting function and collecting image information of the chip and the substrate respectively includes:

[0071] S11, determining a reference position through a built-in sensor of the inversion device, adjusting each joint angle of the inversion device and determining a maximum and minimum motion range of a mechanical arm of the inversion device;

[0072] S12, determining an initial clamping force of the clamp on the robot arm according to a preset chip size, shape and material;

[0073] S13, picking up the chip by using a clamper of a flexible clamping material based on the initial clamping force;

[0074] S14, based on the real-time monitoring feedback of the pressure sensors on each clamping unit, the clamping force of each position of the chip is dynamically adjusted by using multiple clamping units, the interior of the inversion device is equipped with multiple independently controllable clamping units, when clamping the chip, each clamping unit on the clamp monitors the clamping force applied to the chip in real time through the pressure sensor, and provides data feedback;

[0075] S15, after the gripper successfully picks up the chip, the image information of the chip and the substrate is captured by the image sensor respectively, and the image information includes but is not limited to the geometric shape and size of the chip and the substrate, the number and layout of the chip bumps and the substrate solder joints.

[0076] As described in the above steps S11-S12, a reference position is determined by the built-in sensor of the reversing device, and each joint angle of the reversing device is adjusted according to the reference position to ensure that the robot arm can move accurately and stably. At the same time, the maximum and minimum range of motion of the robot arm is determined to ensure that it will not exceed its physical limitations in subsequent operations. According to the pre-set chip size, shape and material, the initial clamping force of the clamp on the robot arm is determined. At the same time, the setting of the initial clamping force needs to comprehensively consider the fragility of the chip, the material of the clamp and the robustness of the clamping method to ensure that the chip will not be subjected to excessive physical stress when picking up the chip. As described in the above steps S13-S15, based on the set initial clamping force, a clamp equipped with a flexible clamping material is used to pick up the chip. The flexible clamping material can better adapt to the shape and size of the chip and reduce the damage to the chip during the clamping process. In the process of clamping the chip, the pressure sensors on the multiple independently controllable clamping units equipped inside the reversing device will monitor the clamping force applied to the chip in real time and provide data feedback. According to these feedback data, the clamping force of each position of the chip is dynamically adjusted using a multi-clamping unit to ensure the uniformity and stability of the clamping force. This step is the core of the adaptive clamping adjustment function. After the clamp successfully picks up the chip, the image information of the chip and substrate is captured by the image sensor respectively. This image information includes but is not limited to the geometric shape and size of the chip and substrate, the number and layout of the chip bumps and substrate solder joints, etc. This information is used for subsequent feature extraction, relative position relationship determination, and coordinate matching operations. In summary, steps S11-S15 ensure the stability and safety of the chip during the picking process through a series of precise operations and advanced sensor technology, and at the same time collect the necessary image information for subsequent processing. The successful implementation of this step lays a solid foundation for subsequent operations such as chip and substrate alignment and welding.

[0077] In one embodiment, the step S2 of extracting features based on the collected image information and determining the relative position relationship between the chip and the substrate includes:

[0078] S21, preprocessing the collected image information, wherein the preprocessing at least includes operations of denoising, grayscale conversion, and edge detection;

[0079] S22, establishing an image coordinate system based on the collected image information of the chip and the substrate;

[0080] S23, identifying the preprocessed image information, and extracting key features of chip bumps and substrate solder joints, wherein the key features include the number, size, shape, and layout of chip bumps and substrate solder joints;

[0081] S24, based on the established image coordinate system, determining the coordinates of each element in the key feature, wherein the coordinates of each element include the coordinates of the center of the chip and the coordinates of each chip bump, the coordinates of the center of the substrate and the coordinates of each substrate solder point;

[0082] S25, determining the relative position relationship and relative coordinates between the chip and the substrate by calculating the coordinate difference based on the coordinates of each element.

[0083] As described in the above steps S21-S23, the collected image information of the chip and the substrate is preprocessed to improve the image quality and provide more favorable conditions for subsequent feature extraction and recognition. The preprocessing operation includes at least denoising (removing noise points in the image and improving image clarity), grayscale transformation (converting color images into grayscale images to simplify the processing process) and edge detection (recognizing edge information in the image, such as the outlines of chip bumps and substrate solder joints). Based on the preprocessed image information, a unified image coordinate system is established for subsequent element coordinate determination and position relationship calculation, and each pixel has a corresponding coordinate value. The preprocessed image information is identified to extract the key features of the chip bumps and substrate solder joints. These key features include the number, size, shape and layout of the chip bumps and substrate solder joints. The key features are used for subsequent position relationship determination and coordinate matching. As described in the above steps S24-S25, based on the established image coordinate system, the coordinate values ​​of each element in the key features are determined. These coordinate values ​​include the coordinates of the center of the chip and the coordinates of each chip bump, the coordinates of the center of the substrate and the coordinates of each substrate solder joint, which are used for subsequent position relationship calculation and coordinate matching. Based on the coordinates of each element, the relative position relationship between the chip and the substrate (such as the rotation angle of the chip relative to the substrate, the translation distance, etc.) and the relative coordinates (the coordinate value relative to the center of the substrate, used to describe the relative position between the chip bump and the substrate solder joint) are determined by calculating the coordinate difference or using other geometric relationships. In summary, steps S21-S25 successfully extract the key features of the chip bump and the substrate solder joint through a series of precise image processing operations and feature extraction techniques, and determine the relative position relationship and relative coordinates between them, providing accurate data support for subsequent chip and substrate alignment, welding and other operations.

[0084] In one embodiment, the step S3 of matching each bump coordinate on the chip with each solder joint coordinate on the substrate one by one based on the extracted features and relative position relationship includes:

[0085] S31, identifying layout features of the chip bumps and the substrate solder joints respectively according to the layouts of the chip bumps and the substrate solder joints in the key features;

[0086] S32, based on the relative position relationship between the chip and the substrate, by analyzing the correlation between the chip bumps and the substrate solder joints layout features, determine the one-to-one correspondence and coordinates between each chip bump and each substrate solder joint.

[0087] As described in the above step S31, according to the layout of the chip bumps and substrate solder joints in the key features, their layout features are respectively identified, such as the number of bumps, solder joints, arrangement (such as linear arrangement, matrix arrangement, etc.), relative position relationship (such as adjacent relationship, symmetrical relationship, etc.), and geometric information such as the distance and angle between bumps and bumps, solder joints and solder joints. By identifying the layout features, the spatial relationship between the chip bumps and the substrate solder joints can be better understood, providing a basis for subsequent one-to-one matching. As described in the above step S32, based on the relative position relationship between the chip and the substrate, the one-to-one correspondence and coordinates between each chip bump and each substrate solder joint are determined by analyzing the correlation between the layout features of the chip bumps and the substrate solder joints. The correlation analysis includes comparing whether the number of bumps and solder joints is consistent, whether the arrangement is similar, whether the relative position relationship is consistent, etc. At the same time, the information such as the rotation angle and the translation distance in the relative position relationship can be used to accurately transform and match the chip bumps and substrate solder joints. Through the correlation analysis, it can be determined which substrate solder joint each chip bump corresponds to, forming a one-to-one correspondence. After determining the one-to-one correspondence, the precise coordinate values ​​are determined for each chip bump and the corresponding substrate solder joint based on the image coordinate system. In summary, steps S31-S32 successfully determine the one-to-one correspondence and coordinates between each chip bump and each substrate solder joint by identifying the layout features of the chip bump and the substrate solder joint, and performing correlation analysis based on the relative position relationship between the chip and the substrate. The successful implementation of this step provides accurate data support for subsequent chip and substrate alignment, welding and other operations, ensuring that the chip can be accurately placed at the predetermined position on the substrate.

[0088] In one embodiment, the step S4 of calculating the theoretical alignment position of the chip bumps and the substrate solder joints after the chip is flipped and planning the chip movement route according to the rotation center and length of the mechanical arm of the inversion device and the relative position relationship between the chip and the substrate includes:

[0089] S41, based on the rotation center and arm length of the mechanical arm of the inversion device and the relative position relationship between the chip and the substrate, simulate the rotation and displacement of the chip in space through the principles of geometry and kinematics to predict the theoretical alignment position of the chip and the substrate after flipping;

[0090] S42, planning a chip movement route from the current position of the chip to the theoretical alignment position according to the theoretical alignment position and the motion limit of the robot arm, wherein the motion limit includes a joint angle limit and a motion range limit of the robot arm;

[0091] S43, generating a control instruction according to the planned chip moving route, wherein the control instruction includes a flip direction, a flip angle, a moving distance and a moving speed of the robot arm.

[0092] As described in step S41 above, the rotation center and arm length of the robot arm of the inversion device and the relative position relationship between the chip and the substrate determined in the previous step S3 are used. The rotation and displacement process of the chip in space is simulated by geometric principles (such as rotation matrix, translation vector, etc.) and kinematic principles (such as the motion equation of the robot arm). This simulation process takes into account the motion characteristics of the robot arm and the relative position of the chip and the substrate, so as to predict the theoretical alignment position of the chip with the substrate after flipping. The theoretical alignment position refers to the ideal matching position of the chip bump and the substrate solder joint in three-dimensional space, that is, when the chip is correctly flipped and placed on the substrate, each bump should be accurately aligned with the corresponding solder joint.

[0093] As described in the above steps S42-S43, when planning the chip movement route, it is necessary to consider both the theoretical alignment position and the motion limitations of the robot arm. These motion limitations include the joint angle limitations of the robot arm (i.e., the maximum and minimum angles that each joint can rotate) and the range of motion limitations (i.e., the farthest and closest positions that the robot arm can reach). Based on these factors, an optimal movement route from the current position of the chip to the theoretical alignment position is planned. According to the planned chip movement route, a series of control instructions are generated to guide the movement of the robot arm. These control instructions include the flip direction of the robot arm (i.e., about which axis the chip should rotate), the flip angle (i.e., how many degrees the chip should rotate), the moving distance (i.e., how far the robot arm should move), and the moving speed (i.e., how fast the robot arm should move). These control instructions will be sent to the control system of the robot arm to drive the robot arm to move the chip along the planned route. In summary, steps S41-S43 determine the theoretical alignment position of the chip with the substrate after flipping through simulation and prediction of geometry and kinematics principles, and plan an optimal moving route from the current position to the theoretical alignment position, and then generate a series of control instructions based on this route to guide the movement of the robot arm. The successful implementation of this step provides accurate data support and control instructions for subsequent chip flipping and placement operations.

[0094] In one embodiment, the step S5 of moving the chip according to the chip moving route, monitoring the chip status by using the multi-sensor on the robot arm, and predicting the actual position of the chip based on the monitoring result includes:

[0095] S51, according to the planned chip moving route, the robot arm performs the chip moving operation, and moves the chip from the current position to the theoretical alignment position according to the predetermined trajectory and moving speed;

[0096] S52, during the chip movement process, using the multiple sensors provided on the robot arm to collect various status information of the chip in real time, wherein the various status information at least includes data information of the real-time position, speed, force condition and temperature of the chip;

[0097] S53, based on the fusion processing of the data collected by the multiple sensors and the data information of the angles and speeds of each joint of the robotic arm, the actual position of the chip after completing the chip movement route is predicted through a pre-trained position prediction model.

[0098] As described in the above steps S51-S52, the basis is: according to the chip movement route planned in step S4, the robot arm starts to perform the chip movement operation. The robot arm moves the chip from the current position to the theoretical alignment position according to the predetermined trajectory and movement speed. During this process, the movement of the robot arm is precisely controlled to ensure that the chip can move smoothly along the planned route. During the chip movement process, the multiple sensors set on the robot arm begin to collect various status information of the chip in real time. This status information includes at least the real-time position, speed, force and temperature data information of the chip, which is used to understand the dynamic changes of the chip during the movement process. The sensor collection is to provide real-time and continuous chip status information, and the movement of the chip is monitored and adjusted in real time through the system.

[0099] As described in step S53 above, the data collected by multiple sensors are fused and processed, and the data from different sensors are integrated together to form a more comprehensive and accurate description of the chip state. The pre-trained position prediction model is used to combine the data information of the angles and speeds of each joint of the robotic arm to predict the actual position of the chip after completing the moving route. This position prediction model is trained based on a large amount of historical data and machine learning algorithms, and can accurately predict the final position of the chip under given conditions. The estimated value of the actual position of the chip provided by the prediction result is used to compare with the theoretical alignment position to evaluate the accuracy and precision of the moving operation. If there is a deviation between the predicted position and the theoretical alignment position, the motion parameters of the robotic arm will be adjusted accordingly to ensure that the chip can be accurately placed on the substrate. In summary, step S5 performs the chip moving operation through the robotic arm and uses multiple sensors to collect the chip status information in real time. Then, the system predicts the actual position of the chip after completing the moving route by fusing and modeling this information, providing accurate data support and feedback adjustment mechanism for subsequent chip placement and alignment operations.

[0100] In one embodiment, the step S6 of adjusting the final position and the final moving route of the chip by comparing the actual position with the theoretical alignment position includes:

[0101] S61, performing coordinate comparison between the predicted actual position and the theoretical alignment position to determine whether there is a deviation and the size and direction of the deviation;

[0102] S62, if there is a deviation between the actual position and the theoretical alignment position, predicting the final position of the chip according to the size and direction of the deviation and the correspondence between each substrate solder joint and each chip bump;

[0103] S63, using the inverse kinematics algorithm of the robotic arm, according to the predicted final position of the chip and the actual posture and position of the current robotic arm, calculate the angle sequence of the rotation of each joint of the robotic arm, and plan the final movement route of the chip from the current position to the final position of the chip.

[0104] As described in the above steps S61-S63, the predicted actual position of the chip (i.e., the position obtained by the position prediction model in step S5) is compared with the theoretical alignment position (i.e., the position where the chip should be aligned with the substrate solder joint after flipping calculated in step S4) to determine whether there is a deviation and the size and direction of the deviation. The deviation may include translation deviation (i.e., the displacement deviation of the chip in the X, Y, and Z axis directions) and rotation deviation (i.e., the rotation angle deviation of the chip around a certain axis). If there is a deviation between the actual position and the theoretical alignment position, adjustment is required. According to the size and direction of the deviation, as well as the correspondence between each substrate solder joint and each chip bump determined in the previous step, it is also necessary to consider the motion restrictions of the robot arm, the physical properties of the chip (such as size, weight, etc.), and the structure of the substrate, etc., to predict the final position of the chip. This final position is the position of the chip after adjustment, aiming to ensure that each chip bump can be accurately aligned with the corresponding substrate solder joint. Using the inverse kinematics algorithm of the robot arm, the angle sequence of each joint rotation of the robot arm is calculated according to the predicted final position of the chip and the actual posture and position of the current robot arm. Based on this angle sequence, the final movement route of the chip from the current position to the final position is planned. This route should be as smooth and continuous as possible, and avoid collision with any obstacles. In summary, steps S61-S63 determine the deviation by comparing the actual position with the theoretical alignment position, and predict the final position of the chip based on the deviation. Then, the final movement route from the current position to the final position is planned using the inverse kinematics algorithm of the robotic arm. The successful implementation of this step ensures that the chip can be accurately placed at the predetermined position on the substrate, thereby improving the accuracy and reliability of chip packaging.

[0105] Reference Figure 2 , is a structural block diagram of a chip position prediction and adjustment device during reverse hand switching in one embodiment of the present invention, comprising:

[0106] An adaptive clamping module, used to pick up the chip using a reversing device with an adaptive clamping adjustment function, and to collect image information of the chip and the substrate respectively;

[0107] A data processing module is used to extract features based on the collected image information and determine the relative position relationship between the chip and the substrate;

[0108] A coordinate matching module is used to match the coordinates of each bump on the chip with the coordinates of each solder point on the substrate one by one according to the extracted features and relative position relationship;

[0109] An information planning module, for calculating the theoretical alignment position of the chip bumps and the substrate solder joints after the chip is flipped and planning the chip movement route according to the rotation center and length of the mechanical arm of the reversing device and the relative position relationship between the chip and the substrate;

[0110] An information execution module, used to move the chip according to the chip movement route, monitor the chip status through the multi-sensor on the mechanical arm, and predict the actual position of the chip based on the monitoring result;

[0111] The feedback and adjustment module is used to adjust the final position and final moving route of the chip by comparing the actual position with the theoretical alignment position.

[0112] For the specific implementation of each module in the above device example, please refer to the above method embodiment, which will not be repeated here.

[0113] Reference Figure 3 In an embodiment of the present invention, a computer device is also provided. The computer device may be a server, and its internal structure may be as follows: Figure 3 As shown. The computer device includes a processor, a memory, a display screen, an input device, a network interface and a database connected through a system bus. Among them, the processor designed by the computer is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store the corresponding data in this embodiment. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, the above method is implemented.

[0114] Those skilled in the art will understand that Figure 3 The structure shown in the figure is merely a block diagram of a portion of the structure related to the solution of the present invention, and does not constitute a limitation on the computer device to which the solution of the present invention is applied.

[0115] An embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored, and when the computer program is executed by a processor, the above method is implemented. It can be understood that the computer-readable storage medium in this embodiment can be a volatile readable storage medium or a non-volatile readable storage medium.

[0116] In summary, the steps of the chip position prediction and adjustment method during reverse hand switching include: picking up the chip using a reversing device with an adaptive clamping and adjustment function, and collecting image information of the chip and the substrate respectively; performing feature extraction based on the collected image information, and determining the relative position relationship between the chip and the substrate;

[0117] Based on the extracted features and relative position relationship, the coordinates of each bump on the chip are matched one by one with the coordinates of each substrate solder point; according to the rotation center and length of the mechanical arm of the inversion device and the relative position relationship between the chip and the substrate, the theoretical alignment position of the chip bump and the substrate solder point after the chip is flipped is calculated and the chip movement route is planned; the chip is moved according to the chip movement route, the chip status is monitored by the multiple sensors on the mechanical arm, and the actual position of the chip is predicted based on the monitoring results; by comparing the actual position with the theoretical alignment position, the final position and final movement route of the chip are adjusted to effectively solve the chip deformation problem and improve the accuracy and reliability of chip position prediction when the hand is reversed.

[0118] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media provided by the present invention and used in the embodiments may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double-speed data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM.

[0119] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0120] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A chip position prediction and adjustment method for reverse hand switching, characterized in that: The following steps are involved: The chip is picked up by a reversing device with adaptive clamping and adjustment function, and the image information of the chip and the substrate are collected respectively; Extract features based on the collected image information and determine the relative position relationship between the chip and the substrate; Based on the extracted features and relative positional relationships, the coordinates of each bump on the chip are matched one-to-one with the coordinates of each solder point on the substrate; According to the rotation center and length of the mechanical arm of the reversing device and the relative position relationship between the chip and the substrate, the theoretical alignment position of the chip bumps and the substrate solder joints after the chip is flipped is calculated and the chip movement route is planned; The chip is moved according to the chip moving route, the chip status is monitored by multiple sensors on the robot arm, and the actual position of the chip is predicted based on the monitoring results; By comparing the actual position with the theoretical alignment position, the final position and final moving route of the chip are adjusted.

2. The chip position prediction and adjustment method for reverse hand switching according to claim 1, characterized in that: The step of picking up the chip using the inverting device with adaptive clamping and adjusting function and collecting image information of the chip and the substrate respectively comprises: Determine the reference position through the built-in sensor of the reversing device, adjust each joint angle of the reversing device and determine the maximum and minimum motion range of the robot arm of the reversing device; Determine the initial clamping force of the clamp on the robot arm according to the preset chip size, shape and material; picking up the chip by a gripper using a flexible gripping material based on the initial gripping force; Based on the real-time monitoring feedback of the pressure sensors on each clamping unit, the clamping force of each position of the chip is dynamically adjusted by using multiple clamping units. The interior of the reversing device is equipped with multiple independently controllable clamping units. When clamping the chip, each clamping unit on the clamp monitors the clamping force applied to the chip in real time through the pressure sensor and provides data feedback. After the gripper successfully picks up the chip, image information of the chip and substrate is captured by image sensors respectively, and the image information includes the geometric shape and size of the chip and substrate, the number and layout of chip bumps and substrate solder joints.

3. The chip position prediction and adjustment method for reverse hand switching according to claim 1, characterized in that: The step of extracting features based on the collected image information and determining the relative position relationship between the chip and the substrate includes: Preprocessing the collected image information, wherein the preprocessing includes at least denoising, grayscale conversion and edge detection operations; Establishing an image coordinate system based on the collected image information of the chip and the substrate; Identify the preprocessed image information and extract key features of chip bumps and substrate solder joints, wherein the key features include the number, size, shape and layout of chip bumps and substrate solder joints; Based on the established image coordinate system, coordinates of each element in the key feature are determined, wherein the coordinates of each element include the coordinates of the center of the chip and the coordinates of each chip bump, the coordinates of the center of the substrate and the coordinates of each substrate solder point; Based on the coordinates of each element, the relative position relationship and relative coordinates of the chip and the substrate are determined by calculating the coordinate difference.

4. The chip position prediction and adjustment method for reverse hand switching according to claim 1, characterized in that: The step of matching each bump coordinate on the chip with each substrate solder joint coordinate one-to-one based on the extracted features and relative position relationship comprises: According to the layout of the chip bumps and the substrate solder joints in the key features, respectively identifying the layout features of the chip bumps and the substrate solder joints; Based on the relative position relationship between the chip and the substrate, the one-to-one correspondence and coordinates between each chip bump and each substrate solder point are determined by analyzing the correlation between the chip bump and the substrate solder point layout features.

5. The chip position prediction and adjustment method for reverse hand switching according to claim 1, characterized in that: The step of calculating the theoretical alignment position of the chip bumps and the substrate solder joints after the chip is flipped and planning the chip movement route according to the rotation center and length of the mechanical arm of the reversing device and the relative position relationship between the chip and the substrate comprises: Based on the rotation center and arm length of the mechanical arm of the reversing device, and the relative position relationship between the chip and the substrate, the rotation and displacement of the chip in space are simulated by using the principles of geometry and kinematics to predict the theoretical alignment position of the chip and the substrate after flipping; Planning a chip movement route from a current position of the chip to the theoretical alignment position according to the theoretical alignment position and the motion limit of the robot arm, wherein the motion limit includes a joint angle limit and a motion range limit of the robot arm; According to the planned chip moving route, a control instruction is generated, and the control instruction includes the flip direction, flip angle, moving distance and moving speed of the robot arm.

6. The chip position prediction and adjustment method for reverse hand switching according to claim 1, characterized in that: The step of moving the chip according to the chip moving route, monitoring the chip status by using the multi-sensor on the robot arm, and predicting the actual position of the chip based on the monitoring result comprises: According to the planned chip moving route, the chip moving operation is performed by the robot arm, and the chip is moved from the current position to the theoretical alignment position according to the predetermined trajectory and moving speed; During the movement of the chip, various state information of the chip is collected in real time using multiple sensors provided on the mechanical arm, wherein the various state information includes at least data information of the real-time position, speed, force condition and temperature of the chip; Based on the fusion processing of the data collected by multiple sensors and the data information of the angles and speeds of each joint of the robotic arm, the actual position of the chip after completing the chip movement route is predicted through a pre-trained position prediction model.

7. The chip position prediction and adjustment method for reverse hand switching according to claim 1, characterized in that: The step of adjusting the final position and the final moving route of the chip by comparing the actual position with the theoretical alignment position comprises: Comparing the predicted actual position with the theoretical alignment position to determine whether there is a deviation and the size and direction of the deviation; If there is a deviation between the actual position and the theoretical alignment position, the final position of the chip is predicted according to the size and direction of the deviation and the correspondence between each substrate solder joint and each chip bump; Using the inverse kinematics algorithm of the robotic arm, the angle sequence of rotation of each joint of the robotic arm is calculated according to the predicted final position of the chip and the actual posture and position of the current robotic arm, and the final movement route of the chip from the current position to the final position of the chip is planned.

8. A chip position prediction and adjustment device for reverse hand switching, characterized in that: include: An adaptive clamping module, used to pick up the chip using a reversing device with an adaptive clamping adjustment function, and to collect image information of the chip and the substrate respectively; A data processing module is used to extract features based on the collected image information and determine the relative position relationship between the chip and the substrate; A coordinate matching module is used to match the coordinates of each bump on the chip with the coordinates of each solder point on the substrate one by one according to the extracted features and relative position relationship; An information planning module, for calculating the theoretical alignment position of the chip bumps and the substrate solder joints after the chip is flipped and planning the chip movement route according to the rotation center and length of the mechanical arm of the reversing device and the relative position relationship between the chip and the substrate; An information execution module, used to move the chip according to the chip movement route, monitor the chip status through the multi-sensor on the mechanical arm, and predict the actual position of the chip based on the monitoring result; The feedback and adjustment module is used to adjust the final position and final moving route of the chip by comparing the actual position with the theoretical alignment position.

9. A computer device comprising a memory and a processor, wherein a computer program is stored in the memory, wherein: When the processor executes the computer program, the steps of the chip position prediction and adjustment method during reverse hand switching described in any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the chip position prediction and adjustment method during reverse hand switching according to any one of claims 1 to 7 are implemented.

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