Laser engraving machine and focusing height detection method

Abstract

The invention relates to the technical field of laser engraving, and provides a laser engraving machine and a focusing height detection method. A laser engraving machine includes: a housing; the Z-axis driving assembly is connected to the shell; the laser module is connected to the Z-axis driving assembly, and the Z-axis driving assembly is used for driving the laser module to move along the Z axis; the detection sliding block is connected to the laser module, and the detection sliding block can move on the Z axis relative to the laser module; the contact switch is installed on the laser module and located on the moving path of the detection sliding block; and the control part is installed on the shell, the contact switch and the Z-axis driving assembly are both electrically connected with the control part, the control part is used for receiving electric signals generated by the contact switch, and the control part is configured to determine the working height of the laser module based on the electric signals generated by the contact switch. According to the focusing height detection method provided by the embodiment of the invention, intelligent detection and determination of the working height of the laser module are realized, and the focusing height can be accurately and quickly determined.

Description

Technical Field

[0001] The present application relates to the technical field of laser engraving, and in particular to a laser engraving machine and a focus height detection method. Background Art

[0002] With the advancement of science and technology and the continuous development of society, various DIY small desktop devices are becoming more and more popular, especially laser engraving machines, which are widely used in the fields of material cutting and engraving due to their simple structure, strong versatility and low cost.

[0003] In the related art, it is rather troublesome to determine the focus height of a laser engraving machine. Summary of the invention

[0004] The present application aims to solve at least one of the technical problems existing in the related art. To this end, the present application proposes a laser engraving machine that can accurately and quickly determine the focus height.

[0005] The laser engraving machine according to the first embodiment of the present application includes:

[0006] case;

[0007] A Z-axis drive assembly connected to the housing;

[0008] A laser module is connected to the Z-axis driving assembly, and the Z-axis driving assembly is used to drive the laser module to move along the Z-axis;

[0009] A detection slider connected to the laser module, wherein the detection slider can move relative to the laser module on the Z axis;

[0010] A contact switch, mounted on the laser module, wherein the contact switch is located on the moving path of the detection slider;

[0011] A control component is installed on the shell, the contact switch and the Z-axis drive assembly are electrically connected to the control component, the control component is used to receive the electrical signal generated by the contact switch, and the control component is configured to determine the working height of the laser module based on the electrical signal generated by the contact switch.

[0012] According to the laser engraving machine of the embodiment of the present application, when the workpiece is located below the laser engraving machine, the control component controls the Z-axis drive assembly to drive the laser module to move along the Z-axis, so that the laser module and the detection slider installed on the laser module move toward the workpiece. When the detection slider touches the workpiece, under the reaction force of the workpiece, the detection slider will move relative to the laser module and trigger the contact switch. After the contact switch is triggered, an electrical signal will be generated, and the contact switch will send the generated electrical signal to the control component, so that the control component can determine the working height of the laser module according to the electrical signal generated by the contact switch, thereby realizing intelligent detection and determination of the working height of the laser module, and can accurately and quickly determine the focus height.

[0013] According to one embodiment of the present application, the laser module includes a main body and a guide column, the guide column is connected to a connection surface of the main body facing away from the shell, the detection slider is sleeved on the guide column, the detection slider can slide relative to the guide column, the contact switch is installed on the connection surface, and the contact switch is located between the detection slider and the connection surface.

[0014] According to an embodiment of the present application, the laser engraving machine includes at least two contact switches, and the at least two contact switches include a first contact switch and a second contact switch, and the first contact switch and the second contact switch are symmetrically arranged about the guide column.

[0015] According to an embodiment of the present application, a buffer block is connected to an end surface of the detection sliding block that is away from the detection surface.

[0016] According to one embodiment of the present application, the laser engraving machine further includes a motion component, the motion component is mounted on the housing, the Z-axis drive component is connected to the motion component, and the motion component is used to drive the Z-axis drive component to move along the X-axis and / or Y-axis.

[0017] According to one embodiment of the present application, the motion assembly includes an X-axis drive assembly, the Z-axis drive assembly is connected to the X-axis drive assembly, and the X-axis drive assembly is used to drive the Z-axis drive assembly to move along the X-axis direction.

[0018] According to one embodiment of the present application, the motion assembly includes a Y-axis drive assembly, the Y-axis drive assembly is installed on the shell, the X-axis drive assembly is connected to the Y-axis drive assembly, and the Y-axis drive assembly is used to drive the X-axis drive assembly to move.

[0019] According to an embodiment of the present application, the shell is formed with a accommodating cavity, and the moving component is arranged in the accommodating cavity.

[0020] According to an embodiment of the present application, the laser engraving machine further includes a plurality of pillars, wherein the pillars are connected to the shell, and the plurality of pillars are evenly arranged along the circumference of the shell.

[0021] A focus height detection method according to an embodiment of the second aspect of the present application includes:

[0022] Obtaining a feedback signal of the contact switch;

[0023] Based on the feedback signal of the contact switch and the motion data of the Z-axis drive assembly, the focusing height of the laser module is determined.

[0024] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 This is one of the structural schematic diagrams of the laser engraving machine provided in the embodiment of the present application;

[0027] Figure 2 This is the second structural schematic diagram of the laser engraving machine provided in the embodiment of the present application;

[0028] Figure 3 The embodiment of this application provides Figure 2 A schematic diagram of the structure enlargement at the center A;

[0029] Figure 4 This is one of the partial structural schematic diagrams of the laser engraving machine provided in the embodiment of the present application;

[0030] Figure 5 This is the second partial structural schematic diagram of the laser engraving machine provided in the embodiment of the present application;

[0031] Figure 6 It is a flow chart of the focus height detection method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The following is a further detailed description of the implementation of the present application in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

[0033] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0034] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0035] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0037] Combine the following Figures 1 to 6 The laser engraving machine and the focus height detection method of the present application are described.

[0038] According to the embodiment of the first aspect of the present application, Figure 1 and Figure 2 As shown, the laser engraving machine includes:

[0039] Housing 10;

[0040] A Z-axis driving assembly 20 connected to the housing 10;

[0041] The laser module 30 is connected to the Z-axis driving assembly 20, and the Z-axis driving assembly 20 is used to drive the laser module 30 to move along the Z-axis;

[0042] A detection slider 40 connected to the laser module 30, wherein the detection slider 40 can move relative to the laser module 30 on the Z axis;

[0043] A contact switch 50 is installed on the laser module 30 , and the contact switch 50 is located on the moving path of the detection slider 40 ;

[0044] The control component 60 is installed on the housing 10. The contact switch 50 and the Z-axis drive assembly 20 are both electrically connected to the control component 60. The control component 60 is used to receive the electrical signal generated by the contact switch 50. The control component 60 is configured to determine the working height of the laser module 30 based on the electrical signal generated by the contact switch 50.

[0045] According to the laser engraving machine of the embodiment of the present application, when the workpiece is located below the laser engraving machine, the control component 60 controls the Z-axis driving assembly 20 to drive the laser module 30 to move along the Z-axis, so that the laser module 30 and the detection slider 40 installed on the laser module 30 move toward the workpiece. When the detection slider 40 touches the workpiece, under the reaction force of the workpiece, the detection slider 40 will move relative to the laser module 30 and trigger the contact switch 50. After the contact switch 50 is triggered, an electrical signal will be generated, and the contact switch 50 will send the generated electrical signal to the control component 60, so that the control component 60 can determine the working height of the laser module 30 according to the electrical signal generated by the contact switch 50, thereby realizing intelligent detection and determination of the working height of the laser module 30, and can accurately and quickly determine the focus height.

[0046] It is understandable that when using a laser engraving machine, the focus height is a very important parameter that directly affects the quality and effect of engraving or cutting. The focus height refers to the distance between the laser head and the surface of the material being processed. The correct focus height ensures that the focus of the laser beam is on the surface of the material, thereby obtaining the best engraving or cutting effect.

[0047] Exemplarily, the control component 60 can determine the working duration of the Z-axis drive assembly 20 according to the time when the electrical signal generated by the contact switch 50 is received, that is, it can determine the time duration that the Z-axis drive assembly 20 drives the laser module 30 to move toward the workpiece along the Z axis. The moving speed of the laser module 30 can be determined according to the working parameters of the Z-axis drive assembly 20, and then the control component 60 can determine the moving distance of the laser module 30, that is, the working height of the laser module 30, and then the focusing height of the laser engraving machine can be determined.

[0048] In some embodiments, Figure 2 and Figure 3 As shown, the laser module 30 includes a main body 301 and a guide column, the guide column is connected to a connection surface 302 of the main body 301 facing away from the shell 10, the detection slider 40 is sleeved on the guide column, the detection slider 40 can slide relative to the guide column, the contact switch 50 is installed on the connection surface 302, and the contact switch 50 is located between the detection slider 40 and the connection surface 302.

[0049] It is understandable that the guide column can guide the movement of the detection slider 40. The contact switch 50 is disposed between the detection slider 40 and the connection surface 302. When the detection slider 40 contacts the workpiece and moves toward the connection surface 302, the contact switch 50 is triggered.

[0050] In some embodiments, the laser engraving machine also includes a locking assembly, which is connected to the detection slider 40. The locking structure includes a locking state and an unlocking state. In the locking state, the locking structure fixedly connects the detection slider 40 and the laser module 30. In the unlocking state, the detection slider 40 can move relative to the laser module 30.

[0051] It is understandable that when the working height needs to be determined, the locking assembly is in an unlocked state, so that the detection slider 40 can move relative to the laser module 30, so that the detection slider 40 can trigger the contact switch 50 after contacting the workpiece.

[0052] After the working height is determined, if the detection slider 40 is still in a movable state, it may affect the laser engraving. Therefore, after the working height is determined, that is, when the detection slider 40 triggers the contact switch 50, the locking assembly is locked, and the locking structure fixedly connects the detection slider 40 and the laser module 30, so that the detection slider 40 can no longer move relative to the laser module 30, avoiding affecting the laser engraving.

[0053] Specifically, the locking assembly includes a clamping member and a driving member, wherein the driving member is connected to the detection slider 40, and the driving member is connected to the clamping member, and the driving member is used to drive the clamping member to open and close so that the clamping member switches between a clamped state and a loosened state. In the clamped state, the clamping member is fixedly connected to the guide column, and in the loosened state, the clamping member and the guide column are spaced apart. It can be understood that when the detection slider 40 needs to be movable, the driving member is controlled to drive the clamping member to open, so that the clamping member is in a loosened state. When the detection slider 40 does not need to be movable, the driving member is controlled to drive the clamping member to clamp, so that the clamping member is in a clamped state, so that the clamping member is fixedly connected to the guide column and the detection slider 40.

[0054] Furthermore, the driving member is connected to the control member 60, and the control member 60 is configured to: determine that the detection slider 40 is in contact with the workpiece; control the Z-axis driving assembly 20 so that the detection slider 40 is in contact with the workpiece; determine that the contact switch 50 is triggered; control the driving member to drive the clamping member to clamp; and control the Z-axis driving assembly 20 to drive the laser module 30 to move. In other words, after the detection slider 40 is in contact with the workpiece, the detection slider 40 is not moved first. When it is determined that the contact switch 50 is triggered to generate an electrical signal, the clamping member is first controlled to fix the connection between the detection slider 40 and the guide column, and then the Z-axis driving assembly 20 is controlled to drive the laser module 30 and the detection slider 40 away from the workpiece, so that when the detection slider 40 is fixed, it will not protrude from the laser of the laser module 30.

[0055] In some embodiments, the laser engraving machine includes at least two contact switches 50, and the at least two contact switches 50 include a first contact switch 50 and a second contact switch 50, and the first contact switch 50 and the second contact switch 50 are symmetrically arranged about the guide column.

[0056] It can be understood that, by providing at least two contact switches 50, when one of the contact switches 50 fails, the other contact switch 50 can still work normally, thereby improving the working stability of the laser engraving machine.

[0057] In some embodiments, a buffer block is connected to an end surface of the detection slider 40 that is away from the detection surface.

[0058] It can be understood that, by providing the buffer block, the detection slider 40 will not directly contact the workpiece, thereby preventing the workpiece from being damaged.

[0059] In some embodiments, Figure 2 and Figure 3As shown, the laser engraving machine further includes a motion component 70, which is mounted on the housing 10, and the Z-axis driving component 20 is connected to the motion component 70, and the motion component 70 is used to drive the Z-axis driving component 20 to move along the X-axis and / or the Y-axis.

[0060] It is understandable that the Z-axis driving assembly 20 is driven to move along the X-axis and / or the Y-axis by the motion assembly 70, and the laser module 30 is connected to the Z-axis driving assembly 20, and then the laser module 30 also moves along the X-axis and / or the Y-axis. In other words, through the cooperation of the motion assembly 70 and the Z-axis driving assembly 20, the laser module 30 can move in three directions of the X-axis, the Y-axis and the Z-axis, so that the laser module 30 can perform fine engraving on the workpiece.

[0061] In some embodiments, Figure 2 As shown, the motion assembly 70 includes an X-axis driving assembly 701, the Z-axis driving assembly 20 is connected to the X-axis driving assembly 701, and the X-axis driving assembly 701 is used to drive the Z-axis driving assembly 20 to move along the X-axis direction.

[0062] It is understandable that the laser module 30 will also move along the X-axis direction by driving the Z-axis driving assembly 20 along the X-axis direction through the X-axis driving assembly 701. In other words, through the cooperation of the X-axis driving assembly 701 and the Z-axis driving assembly 20, the laser module 30 can move along the Z-axis and X-axis directions.

[0063] In some embodiments, Figure 2 As shown, the motion assembly 70 includes a Y-axis driving assembly 702, the Y-axis driving assembly 702 is installed on the housing 10, the X-axis driving assembly 701 is connected to the Y-axis driving assembly 702, and the Y-axis driving assembly 702 is used to drive the X-axis driving assembly 701 to move.

[0064] It is understandable that the laser module 30 will also move along the Y-axis direction by driving the Z-axis driving assembly 20 along the Y-axis direction through the Y-axis driving assembly 702. In other words, through the cooperation of the Y-axis driving assembly 702 and the Z-axis driving assembly 20, the laser module 30 can move along the Z-axis and Y-axis directions.

[0065] In some examples, the X-axis driving assembly 701 , the Y-axis driving assembly 702 , and the Z-axis driving assembly 20 are, for example, driving motors or driving cylinders.

[0066] In some embodiments, Figure 2 and Figure 3 As shown, the housing 10 is formed with a receiving cavity 101 , and the moving component 70 is disposed in the receiving cavity 101 .

[0067] It can be understood that arranging the motion assembly 70 in the accommodating cavity 101 fully utilizes the space of the laser engraving machine, making the structure of the laser engraving machine compact and reducing the size of the laser engraving machine.

[0068] In some embodiments, Figure 1 and Figure 2 As shown, the laser engraving machine further includes a plurality of pillars 80 , which are connected to the housing 10 , and the plurality of pillars 80 are evenly arranged along the circumference of the housing 10 .

[0069] It is understandable that, by providing a plurality of pillars 80, the pillars 80 can support the housing 10. The plurality of pillars 80 are evenly arranged, so that the plurality of pillars 80 can play a stable supporting role.

[0070] In order to improve the engraving accuracy of the laser engraving machine, it is also necessary to calibrate the laser engraving machine horizontally. Figure 4 and Figure 5 ,

[0071] The laser engraving machine also includes a workbench, which is used to carry a workpiece.

[0072] The laser engraving machine also includes:

[0073] A calibration assembly connected to the laser module 30, the calibration assembly comprising a calibration mounting plate 1, a first Y-axis detection block 2, a second Y-axis detection block 3 and a Z-axis detection block 4, the first Y-axis detection block 2 and the second Y-axis detection block 3 are stacked relative to the Z-axis detection block 4, the upper surfaces of the first Y-axis detection block 2, the second Y-axis detection block 3 and the Z-axis detection block 4 are all in the same plane, the first Y-axis detection block 2 and the second Y-axis detection block 3 are mounted on the first end of the calibration mounting plate 1, and the Z-axis detection block 4 is mounted on the calibration mounting plate 1, wherein the Z-axis detection block 4 is farther from the first end of the calibration mounting plate 1 than the first Y-axis detection block 2 and the second Y-axis detection block 3;

[0074] A detection assembly is arranged on a workbench, the detection assembly comprises a detection mounting plate 5, a first Y-axis pressure detection portion 6, a second Y-axis pressure detection portion 7 and a Z-axis pressure detection portion 8, the first Y-axis pressure detection portion 6 and the second Y-axis pressure detection portion 7 are symmetrically arranged relative to the Z-axis pressure detection portion 8, the lower surfaces of the first Y-axis pressure detection portion 6, the second Y-axis pressure detection portion 7 and the Z-axis pressure detection portion 8 are all in the same plane, the first Y-axis pressure detection portion 6 and the second Y-axis pressure detection portion 7 are installed on the first end of the detection mounting plate 5, and the Z-axis pressure detection portion 8 is installed on the detection mounting plate 5, wherein the Z-axis pressure detection portion 8 is farther from the first end of the detection mounting plate 5 than the first Y-axis pressure detection portion 6 and the second Y-axis pressure detection portion 7;

[0075] A signal source is provided at the Z-axis detection block 4 , and a signal detection component is provided at the Z-axis pressure detection portion 8 . The signal detection component is suitable for detecting the signal strength of the signal source, and the signal detection component is electrically connected to the control component 60 .

[0076] It can be understood that when performing the calibration operation, the motion component 70 and the Z-axis drive component 20 drive the calibration mounting plate 1 to move to the preset calibration position, and then continue to drive the calibration mounting plate 1 to move. At this time, the signal source can be detected by the signal detection component. The closer the signal source is to the signal detection component, the greater the signal strength detected by the signal detection component. Then, according to the detection result of the signal detection component, the calibration mounting plate 1 can be controlled to move in the direction of signal enhancement, thereby realizing the movement guidance of the calibration mounting plate 1, so as to quickly make the Z-axis detection block 4 and the Z-axis pressure detection part 8 abut. At this time, even if the first Y-axis detection block 2 does not abut against the first Y-axis pressure detection part 6, it is close to the first Y-axis pressure detection part 6, and even if the second Y-axis detection block 3 does not abut against the second Y-axis pressure detection part 7, it is close to the second Y-axis pressure detection part 7. Only slight adjustment is needed to make the first Y-axis detection block 2 abut against the first Y-axis pressure detection part 6, and the second Y-axis detection block 3 abut against the second Y-axis pressure detection part 7, so that the horizontal calibration is simpler and faster. When the Z-axis detection block 4 and the Z-axis pressure detection unit 8 are in contact, the Z-axis pressure detection unit 8 will detect pressure. When the first Y-axis detection block 2 and the first Y-axis pressure detection unit 6 are in contact, the first Y-axis pressure detection unit 6 will detect pressure. When the second Y-axis detection block 3 detects and abuts against the second Y-axis pressure detection unit 7, the second Y-axis pressure detection unit 7 will detect pressure. Then, according to the detection data of the first Y-axis pressure detection unit 6, the second Y-axis pressure detection unit 7 and the Z-axis pressure detection unit 8, the positions of the first Y-axis detection block 2, the second Y-axis detection block 3 and the Z-axis detection block 4 can be determined. When it is determined that the first Y-axis detection block 2 and the first Y-axis pressure detection unit 6 are in contact, the second Y-axis detection block 3 and the second Y-axis pressure detection unit 7 are in contact, and the Z-axis detection block 4 and the Z-axis pressure detection unit 8 are in contact, the Z-axis coordinate of the Z-axis detection block 4 at this time is obtained. The Z-axis coordinate at this time is the Z value in the calibration point coordinate parameters. Based on the coordinates of the first Y-axis detection block 2 and the second Y-axis detection block 3 at this time, the Y value and U value in the calibration point coordinate parameters can be determined. There is no need to manually judge whether the detection block is in contact with the pressure detection part, which improves the intelligence level of the horizontal calibration and can effectively avoid deviations in the obtained calibration point coordinate parameters.

[0077] It can be understood that the Y value and U value in the calibration point coordinate parameters are determined based on the coordinates of the first Y-axis detection block 2 and the second Y-axis detection block 3 at this time. The Y value and U value in the calibration point coordinate parameters can be determined by the coordinates of the midpoint of the line connecting the first Y-axis detection block 2 and the second Y-axis detection block 3, or the Y value and U value in the calibration point coordinate parameters can be determined by combining the coordinate parameters of the first Y-axis detection block 2 and the second Y-axis detection block 3.

[0078] It should be noted that the end of the detection mounting plate 5 close to the calibration mounting plate 1 is an arc-shaped structure, and the detection mounting plate 5 can also be a circular structure.

[0079] In one embodiment of the present application, the laser engraving machine also includes a calibration component, which is used to calibrate the movement of the calibration mounting plate 1, and the calibration component includes a first Y-axis calibration component, a second Y-axis calibration component and a Z-axis calibration component. The first Y-axis calibration component is arranged between the first Y-axis pressure detection part 6 and the end of the first end of the detection mounting plate 5, the second Y-axis calibration component is arranged between the second Y-axis pressure detection part 7 and the end of the first end of the detection mounting plate 5, and the Z-axis calibration component is arranged between the Z-axis pressure detection part 8 and the first Y-axis pressure detection part 6. The connecting line between the first Y-axis calibration component and the first Y-axis pressure detection part 6, the connecting line between the second Y-axis calibration component and the second Y-axis pressure detection part 7, and the connecting line between the Z-axis calibration component and the Z-axis pressure detection part 8 are all parallel to each other.

[0080] It can be understood that the movement of the calibration mounting plate 1 can be preliminarily calibrated through the calibration assembly, so that the first Y-axis detection block 2 moves in the direction of the first Y-axis pressure detection part 6, the second Y-axis detection block 3 moves in the direction of the second Y-axis pressure detection part 7, and the Z-axis detection block 4 moves in the direction of the Z-axis pressure detection part 8.

[0081] Specifically, the first Y-axis calibration piece is located in front of the first Y-axis pressure detection part 6, that is, the first Y-axis detection block 2 needs to pass through the first Y-axis calibration piece before it can move to the first Y-axis pressure detection part 6, and the first Y-axis calibration piece allows the first Y-axis detection block 2 to pass through, and the second Y-axis detection block 3 or the Z-axis detection block 4 cannot pass through the first Y-axis calibration piece, thereby ensuring that the first Y-axis detection block 2 passes through the first Y-axis calibration piece and moves to the first Y-axis pressure detection part 6, ensuring the accuracy of the horizontal calibration. The principles of the second Y-axis calibration piece and the Z-axis calibration piece are the same as those of the first Y-axis calibration piece, and will not be repeated here.

[0082] According to an embodiment of the second aspect of the present application, an embodiment of a focus height detection method is provided. It should be noted that, although a logical order is shown in the flow chart, under certain data, the steps shown or described may be completed in an order different from that shown here.

[0083] Before introducing the focus height detection method of the embodiment of the present application, the application scenario of the focus height detection method is first explained. The focus height detection method of the present application can be applied to smart terminals such as smart phones, tablets and computers connected to the laser engraving machine, and can also be applied to the server connected to the laser engraving machine. The present application is not specifically limited here, as long as it can carry and implement the focus height detection method of the present application.

[0084] The server end is, for example, a processor end or a similar control element on a laser engraving machine. The server end may also be a server independent of the laser engraving machine. Here, the server end is merely illustrated without any specific limitation.

[0085] like Figure 6 As shown, the focus height detection method includes:

[0086] S100, obtaining a feedback signal of the contact switch 50;

[0087] S200 , determining a focus height of the laser module 30 based on a feedback signal of the contact switch 50 and movement data of the Z-axis driving assembly 20 .

[0088] According to the focus height detection method of the embodiment of the present application, when the workpiece is located below the laser engraving machine, the control component 60 controls the Z-axis drive assembly 20 to drive the laser module 30 to move along the Z-axis, so that the laser module 30 and the detection slider 40 installed on the laser module 30 move toward the workpiece. When the detection slider 40 touches the workpiece, under the reaction force of the workpiece, the detection slider 40 will move relative to the laser module 30 and trigger the contact switch 50. After the contact switch 50 is triggered, an electrical signal will be generated, and the contact switch 50 will send the generated electrical signal to the control component 60, and then the feedback signal of the contact switch 50 can be obtained. Then, the control component 60 can determine the working time of the Z-axis drive assembly 20 according to the time when the feedback signal is received, that is, the time length that the Z-axis drive assembly 20 drives the laser module 30 to move toward the workpiece along the Z-axis, and the moving speed of the laser module 30 can be determined according to the working data of the Z-axis drive assembly 20, and then the control component 60 can determine the moving distance of the laser module 30, that is, the working height of the laser module 30, and then the focus height of the laser engraving machine can be determined.

[0089] It is understandable that the exercise data includes exercise speed and exercise duration.

[0090] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, i.e., they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Those of ordinary skill in the art may understand and implement it without creative effort.

[0091] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, or of course by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods of each embodiment or some parts of the embodiment. .

[0092] Finally, it should be noted that the above implementation modes are only used to illustrate the present application, rather than to limit the present application. Although the present application is described in detail with reference to the embodiments, a person skilled in the art should understand that various combinations, modifications or equivalent substitutions of the technical solutions of the present application do not depart from the spirit and scope of the technical solutions of the present application, and should be included in the scope of the claims of the present application.

Claims

1. A laser engraving machine, characterized in that: include: case; A Z-axis drive assembly connected to the housing; A laser module is connected to the Z-axis driving assembly, and the Z-axis driving assembly is used to drive the laser module to move along the Z-axis; A detection slider connected to the laser module, wherein the detection slider can move relative to the laser module on the Z axis; A contact switch, mounted on the laser module, wherein the contact switch is located on the moving path of the detection slider; A control component is installed on the shell, the contact switch and the Z-axis drive assembly are electrically connected to the control component, the control component is used to receive the electrical signal generated by the contact switch, and the control component is configured to determine the working height of the laser module based on the electrical signal generated by the contact switch.

2. The laser engraving machine according to claim 1, characterized in that: The laser module includes a body and a guide column, wherein the guide column is connected to a connection surface of the body facing away from the shell, the detection slider is sleeved on the guide column, the detection slider can slide relative to the guide column, and the contact switch is installed on the connection surface, and the contact switch is located between the detection slider and the connection surface.

3. The laser engraving machine according to claim 1, characterized in that: The laser engraving machine comprises at least two contact switches, wherein the at least two contact switches comprise a first contact switch and a second contact switch, and the first contact switch and the second contact switch are symmetrically arranged about the guide column.

4. The laser engraving machine according to claim 1, characterized in that: A buffer block is connected to an end surface of the detection sliding block which is away from the detection surface.

5. The laser engraving machine according to any one of claims 1 to 4, characterized in that: The laser engraving machine further comprises a motion component, wherein the motion component is mounted on the housing, the Z-axis driving component is connected to the motion component, and the motion component is used to drive the Z-axis driving component to move along the X-axis and / or the Y-axis.

6. The laser engraving machine according to claim 5, characterized in that: The motion assembly includes an X-axis driving assembly, the Z-axis driving assembly is connected to the X-axis driving assembly, and the X-axis driving assembly is used to drive the Z-axis driving assembly to move along the X-axis direction.

7. The laser engraving machine according to claim 5, characterized in that: The motion assembly includes a Y-axis driving assembly, the Y-axis driving assembly is installed on the housing, the X-axis driving assembly is connected to the Y-axis driving assembly, and the Y-axis driving assembly is used to drive the X-axis driving assembly to move.

8. The laser engraving machine according to claim 5, characterized in that: The shell is formed with a containing cavity, and the moving component is arranged in the containing cavity.

9. The laser engraving machine according to any one of claims 1 to 4, characterized in that: The laser engraving machine further comprises a plurality of pillars, which are connected to the shell and are evenly arranged along the circumference of the shell.

10. A focus height detection method for a laser engraving machine according to any one of claims 1 to 9, characterized in that: include: Obtaining a feedback signal of the contact switch; Based on the feedback signal of the contact switch and the motion data of the Z-axis drive assembly, the focusing height of the laser module is determined.

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