Grinding equipment

Abstract

The invention provides grinding equipment, and belongs to the technical field of semiconductors. Comprising a body which is of a cylindrical structure with an opening in the top, a containing space is formed in the body, and a mounting hole is formed in the side wall of the body; the grinding pad is arranged in the accommodating space, and the grinding pad is used for grinding the edge of the silicon wafer; the mounting bracket comprises a first connecting piece and a second connecting piece, the first connecting piece is arranged outside the body, the first connecting piece is fixedly connected with the second connecting piece, and the second connecting piece is arranged in the mounting hole in a penetrating manner and is connected with the grinding pad; the balancing weight is arranged outside the body and is fixedly connected with the first connecting piece; and the cover body is arranged at the top opening of the body, and the cover body is used for sealing the accommodating space. According to the technical scheme, the problem that in the prior art, the grinding effect of a silicon wafer grinding tool is poor is solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a grinding device. Background Art

[0002] like Figure 1 and Figure 2 As shown, in the prior art, Drum 01 is usually used to grind silicon wafer 02.

[0003] Drum01 is a cylindrical grinding tool. Since a counterweight 03 is required inside the tool, Drum01 is an open structure as a whole. During the processing, Drum01 runs at a fixed speed, and Slurry04 (i.e., the slurry used for grinding) flows into Drum01 from the top opening of Drum01 to participate in the edge grinding of silicon wafer 02. Under the action of centrifugal force, part of Slurry04 splashes everywhere, resulting in low utilization rate of Slurry04, poor grinding effect, and a certain waste of resources. In addition, it will further cause crystallization inside and on the surface of Drum01. After the crystallization is adsorbed on the surface of the device, it is difficult to clean it, and it may even cause damage to the device and poor internal particles. Summary of the invention

[0004] The present invention provides a grinding device, which can solve the problem of poor grinding effect of silicon wafer grinding tools in the prior art.

[0005] In order to achieve the above object, the technical solution adopted in the embodiment of the present invention is:

[0006] A grinding device, comprising:

[0007] The body is a cylindrical structure with an opening at the top, a containing space is provided inside the body, and a mounting hole is provided on the side wall of the body;

[0008] A polishing pad is disposed in the accommodating space, and is used to polish the edge of the silicon wafer;

[0009] The mounting bracket comprises: a first connecting member and a second connecting member, wherein the first connecting member is arranged outside the body, the first connecting member is fixedly connected to the second connecting member, and the second connecting member is passed through the mounting hole and connected to the polishing pad;

[0010] A counterweight block, arranged outside the body and fixedly connected to the first connecting member;

[0011] A cover body is arranged at the top opening of the main body, and the cover body is used to close the accommodating space.

[0012] In some embodiments, the first connecting member includes: an oblique rod and a horizontal rod;

[0013] The first end of the second connecting member extends through the mounting hole into the accommodating space and is connected to the grinding pad, the second end of the second connecting member is connected to the first end of the inclined rod, and the second end of the inclined rod is fixedly connected to the counterweight block;

[0014] The cross bar is arranged between the oblique bar and the outer wall of the body.

[0015] In some embodiments, a first groove in a vertical direction is formed on the outer surface of the body, a sliding block is disposed in the first groove, and the vertical direction is perpendicular to the horizontal plane;

[0016] A limiting portion is provided on the oblique rod along the length direction of the oblique rod;

[0017] The first end of the cross bar is connected to the slider, and the second end of the cross bar is slidably connected to the limiting portion;

[0018] Wherein, the grinding equipment also includes:

[0019] The first driving mechanism is connected to the slider, and the first driving mechanism is used to drive the slider to slide in the first groove.

[0020] In some embodiments, the limiting portion is a second groove opened on the oblique rod, and a clamping portion matching the groove is provided on the second end of the cross rod, and the second end of the cross rod is slidably connected to the second groove through the clamping portion.

[0021] In some embodiments, the grinding device further comprises:

[0022] A controller is connected to the first driving mechanism, and the controller is used to:

[0023] Acquiring process parameters related to the silicon wafer;

[0024] Determining a target distance and a target moving direction of the slider according to the process parameters;

[0025] The first driving mechanism is controlled to drive the slider in the first groove to move the target distance along the target moving direction.

[0026] In some embodiments, the process parameters include at least one of the following:

[0027] The rotation speed of the body;

[0028] The diameter of the silicon wafer;

[0029] The target processing time of the silicon wafer.

[0030] In some embodiments, the grinding device further comprises:

[0031] A filler is used to inject slurry into the accommodating space, and the slurry is used to grind the silicon wafer.

[0032] In some embodiments, the grinding device further comprises:

[0033] The second driving mechanism is used to drive the body to rotate, so as to drive the grinding pad to grind the edge of the silicon wafer.

[0034] The beneficial effects of the present invention are:

[0035] In this embodiment, the counterweight block is arranged on the outside of the main body. In this way, the accommodating space can be closed with a cover when grinding the silicon wafer. In this way, the grinding equipment adopts a closed structural design, which can avoid the problem of poor grinding effect caused by Slurry splashing around during the grinding process, and can also improve the problem of crystallization inside and on the surface of the grinding equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram showing the structure of a Drum in the prior art;

[0037] Figure 2 A top view of a Drum in the prior art is shown;

[0038] Figure 3 A schematic diagram showing the structure of a grinding device according to an embodiment of the present invention;

[0039] Figure 4 A top view showing a grinding apparatus according to an embodiment of the present invention;

[0040] Figure 5 A schematic diagram showing the structure and principle of the grinding device of an embodiment of the present invention when in operation;

[0041] Figure 6 A partial structural schematic diagram of a grinding device according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0043] In order to solve the above technical problems, an embodiment of the present invention provides a grinding device, which can solve the problem of poor grinding effect of silicon wafer grinding tools in the prior art.

[0044] like Figure 3 As shown, an embodiment of the present invention provides a grinding device, comprising:

[0045] Main body 1, polishing pad 2, mounting bracket 4, counterweight 5 and cover.

[0046] The main body 1 is a cylindrical structure with an open top, an accommodating space is provided inside the main body 1, and a mounting hole is opened on the side wall of the main body 1.

[0047] The polishing pad 2 is arranged in the accommodating space, and the polishing pad 2 is used to grind the edge of the silicon wafer 3.

[0048] like Figure 3 As shown, the polishing pad 2 is arranged in the accommodating space near the inner wall of the body 1, so that the edge of the silicon wafer 3 can be polished, and multiple polishing pads 2 can be evenly spaced in the accommodating space to achieve a better polishing effect.

[0049] The mounting bracket 4 includes: a first connecting member and a second connecting member 401, wherein the first connecting member is arranged outside the main body 1, the first connecting member is fixedly connected to the second connecting member 401, and the second connecting member 401 is passed through the mounting hole and connected to the polishing pad 2.

[0050] like Figure 3-Figure 4 As shown, the counterweight 5 is arranged outside the body 1 and fixedly connected to the first connecting member. In this way, the connection between the counterweight 5 and the grinding pad 2 in the accommodating space can be achieved through the mounting bracket 4.

[0051] It should be noted that in some specific examples, such as Figure 3 As shown, a plurality of mounting holes are provided on the side wall of the body 1 , which are respectively used to install a plurality of mounting brackets 4 , and a counterweight 5 is installed on each mounting bracket 4 .

[0052] A cover body (not shown in the drawings) is arranged at the top opening of the body 1, and the cover body is used to close the accommodating space.

[0053] It should be noted that after the counterweight 5 is set outside the main body 1, the accommodating space can be closed with a cover to achieve a closed structure of the main body 1. In this way, the slurry splashing around during the grinding process can be reduced, thereby avoiding crystallization on the surface of the grinding equipment and improving the slurry crystallization problem on the grinding equipment.

[0054] In this embodiment, the counterweight 5 is arranged outside the main body 1. In this way, the accommodating space can be closed by a cover when the silicon wafer is ground. In this way, the grinding equipment adopts a closed structural design, which can avoid the problem of poor grinding effect caused by Slurry splashing around during the grinding process, and can also improve the problem of crystallization inside and on the surface of the grinding equipment.

[0055] In some embodiments, the first connecting member includes: an inclined rod 402 and a cross rod 403; wherein, the first end of the second connecting member 401 extends into the accommodating space through the mounting hole and is connected to the grinding pad 2, the second end of the second connecting member 401 is connected to the first end of the inclined rod 402, and the second end of the inclined rod 402 is fixedly connected to the counterweight block 5; the cross rod 403 is arranged between the inclined rod 402 and the outer wall of the main body 1.

[0056] like Figure 3 As shown, a triangular stable structure is formed between the oblique rod 402 , the cross rod 403 and the outer wall of the main body 1 , and the counterweight 5 is assembled on the outer side of the main body 1 through the triangular stable structure.

[0057] In some embodiments, the grinding device further includes: a second driving mechanism, configured to drive the body 1 to rotate, so as to drive the grinding pad 2 to grind the edge of the silicon wafer 3 .

[0058] In this embodiment, the second driving mechanism drives the body 1 to rotate. Figure 5 As shown, when the main body 1 rotates, it will drive the grinding pad 2 and the counterweight 5 to rotate. The counterweight 5 generates centrifugal force under the high-speed rotation of the main body 1. Under the action of the centrifugal force, the counterweight 5 is in a state of being away from the main body 1. The counterweight 5 pries the grinding pad 2 located on the inner side of the main body 1 through the mounting bracket 4, and transmits centripetal force to the grinding pad 2, so that the grinding pad 2 is more closely attached to the edge of the silicon wafer 3, thereby increasing the grinding force of the grinding pad 2 on the silicon wafer 3, thereby achieving an edge grinding effect and improving the edge roughness of the silicon wafer 3.

[0059] In some embodiments, Figure 6 As shown, the outer surface of the body 1 is provided with a first groove 101 in a vertical direction, and a slider 102 is arranged in the first groove 101, and the vertical direction is perpendicular to the horizontal plane; a limit portion is arranged on the inclined rod 402 along the length direction of the inclined rod 402; the first end of the cross bar 403 is connected to the slider 102, and the second end of the cross bar 403 is slidably connected to the limit portion. The grinding device further includes: a first driving mechanism 6, connected to the slider 102, and the first driving mechanism 6 is used to drive the slider 102 to slide in the first groove 101.

[0060] In this embodiment, the first end of the cross bar 403 can be movably connected to the main body 1 through the slider 102 and the first groove 101, and the second end of the cross bar 403 is movably connected to the limiting portion on the inclined rod 402. When the slider 102 is driven by the first driving mechanism 6 to slide in the first groove 101 on the outer surface of the main body 1, the second end of the cross bar 403 is driven to move on the inclined rod 402, thereby realizing the position adjustment of the cross bar 403.

[0061] It is understandable that if Figure 5 As shown, when the cross bar 403 moves upward or downward, the angle formed by the inclined bar 402 and the outer wall of the main body 1 in the vertical direction changes accordingly. According to the lever principle, the position of the cross bar 403 can affect the magnitude of the centrifugal force generated by the counterweight block 5 during the grinding process of the silicon wafer 3, thereby affecting the roughness of the edge of the silicon wafer 3. Therefore, the position of the cross bar 403 can be adjusted to achieve regulation of the roughness of the edge of the silicon wafer 3.

[0062] In some embodiments, the limiting portion is a second groove opened on the oblique rod 402, and a clamping portion matching the groove is provided on the second end of the cross rod 403, and the second end of the cross rod 403 is slidably connected to the second groove through the clamping portion.

[0063] It should be noted that when the first driving mechanism 6 drives the slider 102 to slide to a certain position in the first groove 101 on the outer surface of the main body 1, the driving slider 102 stops. At this time, the second end of the cross bar 403 is connected with the second groove on the oblique rod 402 that matches the clamping portion through the clamping portion, and the clamping portion is limited in the second groove, forming a triangular stable structure between the oblique rod 402, the cross bar 403 and the outer wall of the main body 1.

[0064] In some embodiments, the grinding equipment also includes: a controller connected to the first driving mechanism 6, and the controller is used to: obtain process parameters related to the silicon wafer 3; determine the target distance and the target moving direction of the slider 102 according to the process parameters; control the first driving mechanism 6 to drive the slider 102 in the first groove 101 to move the target distance along the target moving direction.

[0065] That is, the controller can determine the required centrifugal force according to the process parameters related to the silicon wafer 3, and then drive the slider 102 to move through the first driving mechanism 6 to adjust the position of the crossbar 403 to achieve the effect of adjusting the centrifugal force.

[0066] In some embodiments, the process parameters include at least one of the following: the rotation speed of the body 1; the diameter of the silicon wafer 3; and the target processing time of the silicon wafer 3. In some examples, the process parameters may also include the weight of a counterweight.

[0067] That is to say, by using the lever principle, the controller can dynamically adjust the position of the cross bar 403 according to process parameter requirements such as the rotation speed of the main body 1, the diameter of the silicon wafer 3 and the processing time requirement (such as the preset target processing time), thereby adjusting the centrifugal force generated by the counterweight block 5 during the silicon wafer edge grinding process, thereby achieving the purpose of regulating the edge roughness of the silicon wafer 3.

[0068] In some embodiments, the grinding device further includes: a filler 7 for injecting slurry into the accommodating space, and the slurry is used for grinding the silicon wafer 3 .

[0069] It should be noted that the filler 7 is generally installed above the body 1. Before processing the silicon wafer 3, the slurry (Slurry) stored in the filler 7 is poured into the accommodation space in the body 1 from the top opening of the body 1, and then the cover body is installed to the top opening of the body 1 to close the accommodation space. During the silicon wafer processing, the body 1 rotates, and the Slurry flowing into the accommodation space from the top of the body 1 is concentrated at the edge of the silicon wafer 3 under the action of centrifugal force to participate in grinding. Due to the limitation of the cover body, the grinding equipment has a closed structure, and the Slurry will not splash to the outside of the body 1, avoiding the crystallization problem inside and on the surface of the equipment caused by the splashing of the Slurry, thereby effectively improving the utilization rate of the Slurry, and the edge grinding efficiency of the silicon wafer 3 by the Slurry is further improved, and the cleanliness of the grinding equipment is also improved.

[0070] In this embodiment, the counterweight block is arranged on the outside of the main body. In this way, the accommodating space can be closed with a cover when grinding the silicon wafer. In this way, the grinding equipment adopts a closed structural design, which can avoid the problem of poor grinding effect caused by Slurry splashing around during the grinding process, and can also improve the problem of crystallization inside and on the surface of the grinding equipment.

[0071] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiments.

[0072] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0073] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0074] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0075] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A grinding device, characterized in that: include: The body (1) is a cylindrical structure with an open top, a receiving space is provided inside the body (1), and a mounting hole is provided on the side wall of the body (1); A grinding pad (2) is arranged in the accommodating space, and the grinding pad (2) is used to grind the edge of the silicon wafer (3); The mounting bracket (4) comprises: a first connecting member and a second connecting member (401), wherein the first connecting member is arranged outside the body (1), the first connecting member is fixedly connected to the second connecting member (401), and the second connecting member (401) is inserted into the mounting hole and connected to the polishing pad (2); A counterweight (5) is arranged outside the body (1) and fixedly connected to the first connecting member; A cover body is arranged at the top opening of the body (1), and is used to close the accommodating space.

2. The grinding device according to claim 1, characterized in that The first connecting member comprises: an oblique rod (402) and a horizontal rod (403); Wherein, the first end of the second connecting member (401) passes through the mounting hole and extends into the accommodating space and is connected to the polishing pad (2); the second end of the second connecting member (401) is connected to the first end of the inclined rod (402); and the second end of the inclined rod (402) is fixedly connected to the counterweight (5); The cross bar (403) is arranged between the oblique bar (402) and the outer wall of the body (1).

3. The grinding device according to claim 2, characterized in that: The outer surface of the body (1) is provided with a first groove (101) in a vertical direction, a sliding block (102) is arranged in the first groove (101), and the vertical direction is perpendicular to a horizontal plane; A limiting portion is provided on the oblique rod (402) along the length direction of the oblique rod (402); The first end of the cross bar (403) is connected to the slider (102), and the second end of the cross bar (403) is slidably connected to the limiting portion; Wherein, the grinding equipment also includes: A first driving mechanism (6) is connected to the slider (102), and the first driving mechanism (6) is used to drive the slider (102) to slide in the first groove (101).

4. The grinding device according to claim 3, characterized in that The limiting portion is a second groove formed on the oblique rod (402), and a clamping portion matching the groove is provided on the second end of the cross rod (403), and the second end of the cross rod (403) is slidably connected to the second groove via the clamping portion.

5. The grinding device according to claim 3, characterized in that: The grinding device also includes: A controller connected to the first driving mechanism (6), the controller being used for: Acquiring process parameters related to the silicon wafer (3); Determining a target distance and a target moving direction of the slider (102) according to the process parameters; The first driving mechanism (6) is controlled to drive the sliding block (102) in the first groove (101) to move the target distance along the target moving direction.

6. The grinding device according to claim 5, characterized in that The process parameters include at least one of the following: The rotation speed of the body (1); The diameter of the silicon wafer (3); The target processing time of the silicon wafer (3) is 7. The grinding device according to claim 1, characterized in that: The grinding device also includes: A filler (7) is used to inject slurry into the accommodating space, wherein the slurry is used to grind the silicon wafer (3).

8. The grinding device according to claim 1, characterized in that The grinding device also includes: The second driving mechanism is used to drive the main body (1) to rotate, so as to drive the grinding pad (2) to grind the edge of the silicon wafer (3).

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