Cover window, display device, and method of manufacturing cover window

Abstract

The invention relates to a cover window, a display device and a method of manufacturing the cover window. The cover window includes: a resin member including a light-transmissive region and a non-light-transmissive region surrounding at least a portion of the light-transmissive region; and a particle layer inside the resin member, the particle layer overlapping the non-light-transmissive region, and the particle layer including a plurality of particles.

Description

Technical Field

[0001] Aspects of some embodiments relate to a cover window, a display device including the cover window, and a method of manufacturing the cover window. Background Art

[0002] A display device is a device that displays an image to provide visual information to a user. Among the display devices, an organic light emitting diode display device has recently attracted attention.

[0003] The display device may include a display panel. In addition, the display device may include a cover window attached to the display panel. The cover window may protect the display panel. The cover window may include a light-transmitting area and a non-light-transmitting area surrounding the light-transmitting area. The black matrix may be positioned in the non-light-transmitting area.

[0004] The above information disclosed in this Background section is only for enhancement of background understanding and therefore the information discussed in this Background section does not necessarily constitute prior art. Summary of the invention

[0005] Aspects of some embodiments include a cover window having relatively improved reliability.

[0006] Aspects of some embodiments include a display device including a cover window.

[0007] Aspects of some embodiments include methods of making a cover window.

[0008] According to some embodiments, the cover window includes a resin part, the resin part includes a light-transmitting area and a non-light-transmitting area surrounding at least a portion of the light-transmitting area; and a particle layer, inside the resin part, the particle layer overlaps with the non-light-transmitting area, and the particle layer includes a plurality of particles.

[0009] According to some embodiments, the resin member may include a first surface and a second surface facing the first surface.

[0010] According to some embodiments, the particle layer may be adjacent to the first surface.

[0011] According to some embodiments, the particle layer may be spaced apart from the second surface.

[0012] According to some embodiments, each of the plurality of particles may include a magnetic particle.

[0013] According to some embodiments, each of the plurality of particles may include at least one of iron, nickel, cobalt, and iron oxide.

[0014] According to some embodiments, a density of each of the plurality of particles and a density of the resin part may be different from each other.

[0015] According to some embodiments, the density of each of the plurality of particles may be greater than the density of the resin part.

[0016] According to some embodiments, the color of each of the plurality of particles may be black.

[0017] According to some embodiments, each of the plurality of particles includes a magnetic particle and a coating surrounding at least a portion of the magnetic particle.

[0018] According to some embodiments, the coating may have a black color.

[0019] According to some embodiments, a portion of the resin member overlapping the non-light-transmitting region may include a first portion where the particle layer is located and a second portion adjacent to the first portion in a thickness direction of the resin member.

[0020] According to some embodiments, the display device includes a display panel and a cover window, wherein the cover window is on the display panel and includes a light-transmitting area and a non-light-transmitting area surrounding at least a portion of the light-transmitting area, the cover window also includes a resin part and a particle layer, wherein the particle layer is inside the resin part and overlaps with the non-light-transmitting area, and the particle layer includes a plurality of particles.

[0021] According to some embodiments, the resin member may include a first surface and a second surface facing the first surface.

[0022] According to some embodiments, the particle layer may be adjacent to the first surface.

[0023] According to some embodiments, the particle layer may be spaced apart from the second surface.

[0024] According to some embodiments, each of the plurality of particles may include a magnetic particle.

[0025] According to some embodiments, each of the plurality of particles may include at least one of iron, nickel, cobalt, and iron oxide.

[0026] According to some embodiments, a method for manufacturing a cover window includes: forming a first resin part overlapping a light-transmitting area on a platform; forming a second resin part on the platform, the second resin part overlapping a non-light-transmitting area surrounding at least a portion of the light-transmitting area; placing a magnet to move the plurality of particles toward the magnet; and curing the first resin part and the second resin part.

[0027] According to some embodiments, the second resin component may include a plurality of particles.

[0028] According to some embodiments, the first resin component and the second resin component may include the same material.

[0029] According to some embodiments, each of the plurality of particles may include at least one of iron, nickel, cobalt, and iron oxide.

[0030] According to some embodiments, moving the plurality of particles toward the magnet may include moving the plurality of particles toward the platform by placing the magnet below the platform.

[0031] According to some embodiments, the forming of the second resin component is performed after the forming of the first resin component.

[0032] According to some embodiments, the cover window according to some embodiments may include a light-transmitting area and a non-light-transmitting area. According to some embodiments, the light-transmitting area may overlap with the display area of ​​the display panel. According to some embodiments, the non-light-transmitting area may overlap with the non-display area of ​​the display panel. According to some embodiments, the cover window may include a resin part and a particle layer including a plurality of particles. According to some embodiments, the particle layer may overlap with the non-light-transmitting area.

[0033] Thus, the particle layer may cover the driver positioned in the non-display area. That is, the particle layer may prevent or reduce the visibility of the driver to a user of the display device.

[0034] In addition, the particle layer can be positioned inside the resin component. Therefore, no interface is formed between the particle layer and the resin component. Therefore, moisture and pollutants, etc., can not penetrate into the interface between the particle layer and the resin component. Therefore, the cover window and the particle layer, etc. can not fade. In addition, the interface between the particle layer and the resin component can not be separated.

[0035] According to some embodiments, a method for manufacturing a cover window includes: forming a first resin component overlapping a light-transmitting area on a platform; forming a second resin component overlapping a non-light-transmitting area surrounding at least a portion of the light-transmitting area on the platform; placing a magnet to move multiple particles toward the magnet; and curing the first resin component and the second resin component.

[0036] That is to say, the particle layer can be formed when a plurality of particles move toward the magnet. After the particle layer is formed, the first resin component and the second resin component can be cured simultaneously. Therefore, the cover window including the particle layer can be manufactured by a single curing process, thereby relatively simplifying the manufacturing process of the cover window. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The illustrative, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0038] Figure 1 is a plan view showing a cover window according to some embodiments.

[0039] Figure 2 It is along Figure 1 A cross-sectional view of an example of a cover window taken along line II'.

[0040] Figure 3 It is along Figure 1 A cross-sectional view of another example of the cover window taken along line II'.

[0041] Figure 4 is a plan view showing a display panel.

[0042] Figure 5 It is shown that the Figure 4 A cross-sectional view of a pixel in a display panel.

[0043] Figure 6 is a cross-sectional view showing a display device according to some embodiments.

[0044] Figures 7 to 11 is a diagram showing the manufacture of some embodiments Figure 6 A cross-sectional view of a display device and a method of covering a window.

[0045] Figures 12 to 16 is a cross-sectional view illustrating a method of manufacturing a cover window according to some embodiments. DETAILED DESCRIPTION

[0046] Aspects of a display device according to some embodiments will be described in more detail below with reference to the accompanying drawings. In the accompanying drawings, the same reference numerals are used for the same components, and some redundant descriptions of the same components may be omitted.

[0047] Figure 1 is a plan view showing a cover window according to some embodiments. Figure 2 It is along Figure 1 A cross-sectional view of an example of a cover window taken along line II'.

[0048] Reference Figure 1 According to some embodiments, the cover window CW may include a light-transmitting area TA and a non-light-transmitting area BA. The non-light-transmitting area BA may surround at least a portion of the light-transmitting area TA.

[0049] For example, the light-transmitting area TA may be aligned with the display panel (eg, Figure 4 The display area of ​​the display panel PNL) (for example, Figure 4 That is, the light-transmitting area TA may be an area through which light provided from the display panel is transmitted.

[0050] In addition, the non-light-transmitting area BA may be aligned with a non-display area (eg, Figure 4 That is, the non-light-transmitting area BA may be an area through which light is not transmitted.

[0051] A first direction DR1 and a second direction DR2 crossing the first direction DR1 may be defined. Also, a third direction DR3 perpendicular or orthogonal to a plane formed by the first direction DR1 and the second direction DR2 may be defined.

[0052] refer to Figure 1 and Figure 2 , the cover window CW may include a resin member RS ​​and a particle layer PCL.

[0053] As described above, the cover window CW may include the light-transmitting area TA and the non-light-transmitting area BA. Since the cover window CW includes the light-transmitting area TA and the non-light-transmitting area BA, the resin part RS may also include the light-transmitting area TA and the non-light-transmitting area BA.

[0054] The resin part RS may overlap the light-transmitting area TA and the non-light-transmitting area BA. That is, the resin part RS may be arranged to completely extend over the light-transmitting area TA and the non-light-transmitting area BA.

[0055] The resin part RS may include a first surface RS1 and a second surface RS2. The second surface RS2 may face the first surface RS1. That is, the second surface RS2 may be spaced apart from the first surface RS1 in the third direction DR3.

[0056] For example, the resin part RS may include epoxy resin, acrylic resin, polyurethane resin, polyethylene resin, etc. These may be used alone or in combination with each other. However, the embodiments according to the present disclosure are not limited thereto, and the resin part RS may include other types of resin materials.

[0057] According to some embodiments, the particle layer PCL may be positioned inside the resin part RS. The particle layer PCL may overlap with the non-light-transmitting area BA. The particle layer PCL may include a plurality of particles PC. That is, the particle layer PCL may refer to a portion where a plurality of particles PC in the resin part RS are positioned. The number of the plurality of particles PC forming the particle layer PCL may be set differently.

[0058] The portion of the resin part RS overlapping with the non-light-transmitting area BA may include a first portion P1 and a second portion P2. The first portion P1 may be a portion where the particle layer PCL is positioned. The second portion P2 may be a portion where the particle layer PCL is not positioned. That is, in the portion of the resin part RS overlapping with the non-light-transmitting area BA, the first portion P1 may refer to a portion where the second portion P2 is not positioned. The second portion P2 may be adjacent to the first portion P1 in the thickness direction of the resin part RS. For example, the second portion P2 may be adjacent to the first portion P1 in the third direction DR3.

[0059] According to some embodiments, the particle layer PCL may be positioned adjacent to the first surface RS1. In addition, the particle layer PCL may be arranged to be spaced apart from the second surface RS2. For example, the particle layer PCL may be spaced apart from the second surface RS2 in a direction opposite to the third direction DR3. For example, a display panel (e.g., Figure 4 The display panel PNL) may be adjacent to the first surface RS1.

[0060] According to some embodiments, each of the plurality of particles PC may include magnetic particles. For example, each of the plurality of particles PC may include iron, nickel, cobalt, or iron oxide, etc. These may be used alone or in combination with each other.

[0061] According to some embodiments, the color of each of the plurality of particles PC may be black. That is, each of the plurality of particles PC may include a material having a black color. For example, each of the plurality of particles PC may include a pigment or dye having a black color.

[0062] According to some embodiments, each of the plurality of particles PC may include a magnetic particle and a coating surrounding at least a portion of the magnetic particle. The coating may include a black-based material. For example, the coating may include a black-based pigment or dye.

[0063] According to some embodiments, each of the plurality of particles PC may include only magnetic particles. In this case, the color of the magnetic particles may be black.

[0064] According to some embodiments, the color of each of the plurality of particles PC may include a color of a series different from black. For example, each of the plurality of particles PC may include a pigment or dye having a color different from black.

[0065] As will be referenced later Fig.10 As described, since each of the plurality of particles PC includes magnetic particles, the particle layer PCL may be positioned adjacent to the first surface RS1.

[0066] The density of each of the plurality of particles PC may be different from the density of the resin part RS. According to some embodiments, the density of each of the plurality of particles PC may be greater than the density of the resin part RS. Therefore, the particle layer PCL including the plurality of particles PC may be positioned adjacent to the first surface RS1.

[0067] That is, due to the difference in density between each of the plurality of particles PC and the resin member RS, the particle layer PCL may move to the surface of the resin member RS. In this case, each of the plurality of particles PC may not include a magnetic material.

[0068] Figure 3 It is along Figure 1 A cross-sectional view of another example of the cover window taken along line II'.

[0069] In addition to the configuration of the granular layer PCL, the first portion P1 and the second portion P2, refer to Figure 3 The cover window CW described can be compared with the reference Figure 2 The cover windows CW described are substantially the same or similar. Therefore, some repeated descriptions of the same or similar components may be omitted or simplified.

[0070] refer to Figure 3 According to some embodiments, the particle layer PCL may be adjacent to the second surface RS2. In addition, the particle layer PCL may be spaced apart from the first surface RS1. In this case, the first portion P1 where the particle layer PCL is positioned may be adjacent to the second portion P2 where the particle layer is not positioned in the third direction DR3.

[0071] Figure 4 is a plan view showing a display panel.

[0072] refer to Figure 4 , the display panel PNL may include a display area DA and a non-display area NDA. The display area DA may be defined as an area for generating light and displaying an image. The non-display area NDA may be an area where an image is not displayed. In addition, the non-display area NDA may surround at least a portion of the display area DA.

[0073] The display area DA may be aligned with the cover window (eg, Figure 1 The light-transmitting area of ​​the cover window CW) (for example, Figure 1 In addition, the non-display area NDA may overlap with the non-light-transmitting area (eg, Figure 1 The non-light-transmitting area BA) overlaps.

[0074] A plurality of pixels may be positioned in the display area DA. For example, a pixel PX may be positioned in the display area DA. Each of the plurality of pixels may emit light. For example, the pixel PX may emit light. The plurality of pixels may be repeatedly arranged in the first direction DR1 and the second direction DR2.

[0075] The non-display area NDA may include a driver. For example, the driver may include a driving controller, a gate driver, a data driver, and the like.

[0076] Figure 5 It is shown that the Figure 4 A cross-sectional view of a pixel in a display panel.

[0077] refer to Figure 5 The pixel PX may include a substrate SUB, a buffer layer BUF, a gate insulating layer GI, an interlayer insulating layer ILD, a via insulating layer VIA, an active layer ACT, a source electrode SE, a gate electrode GE, a drain electrode DE, a pixel electrode PE, a pixel defining layer PDL, a light emitting layer EML, a common electrode CE and an encapsulation layer TFE.

[0078] The transistor TR may include an active layer ACT, a source electrode SE, a gate electrode GE, and a drain electrode DE.

[0079] The substrate SUB may include a transparent material or an opaque material. The substrate SUB may be formed of a transparent resin substrate. Examples of the transparent resin substrate may include a polyimide substrate. In this case, the polyimide substrate may include a first organic layer, a first barrier layer, and a second organic layer, etc.

[0080] Alternatively, the substrate SUB may include a quartz substrate (eg, a synthetic quartz substrate, a fluorine-doped quartz substrate), a calcium fluoride substrate, a soda lime substrate, or an alkali-free glass substrate, etc. These materials may be used alone or in combination with each other.

[0081] The buffer layer BUF may be positioned on the substrate SUB. The buffer layer BUF may prevent metal atoms or impurities from diffusing from the substrate SUB to the transistor TR. In addition, when the surface of the substrate SUB is uneven, the buffer layer BUF may improve the flatness of the surface of the substrate SUB.

[0082] For example, the buffer layer BUF may include an inorganic material such as silicon oxide, silicon nitride, or silicon oxynitride, etc. These materials may be used alone or in combination with each other.

[0083] The active layer ACT may be positioned on the buffer layer BUF. The active layer ACT may include an inorganic semiconductor (e.g., amorphous silicon, polycrystalline silicon, metal oxide semiconductor) and an organic semiconductor, etc. These materials may be used alone or in combination with each other. The active layer ACT may include a source region, a drain region, and a channel region positioned between the source region and the drain region.

[0084] Metal oxide semiconductors can include binary compounds (“AB x ”), ternary compounds (“AB x C y ”) and quaternary compounds (“AB x C y D z ”), etc., binary compounds (“AB x ”), ternary compounds (“AB x C y ”) and quaternary compounds (“AB x C y D z ”) include indium (“In”), zinc (“Zn”), gallium (“Ga”), tin (“Sn”), titanium (“Ti”), aluminum (“Al”), hafnium (“Hf”), zirconium (“Zr”) or magnesium (“Mg”) etc.

[0085] For example, the metal oxide semiconductor may include zinc oxide (“ZnO x ”), gallium oxide (“GaO x ”), tin oxide (“SnO x ”), indium oxide (“InO x ”), indium gallium oxide (“IGO”), indium zinc oxide (“IZO”), indium tin oxide (“ITO”), indium zinc tin oxide (“IZTO”), and indium gallium zinc oxide (“IGZO”). These materials may be used alone or in combination with each other.

[0086] The gate insulating layer GI may be positioned on the buffer layer BUF. The gate insulating layer GI may fully cover the active layer ACT and may have a substantially flat upper surface without generating steps around the active layer ACT. Alternatively, the gate insulating layer GI may cover the active layer ACT and may be arranged along the contour of the active layer ACT.

[0087] For example, the gate insulating layer GI may include an inorganic material such as silicon oxide ("SiO x ”), silicon nitride (“SiN x ”), Silicon Carbide (“SiC x ”), silicon oxynitride (“SiO x N y ”) and silicon oxycarbide (“SiOx C y ”) etc. These materials may be used alone or in combination with each other.

[0088] The gate electrode GE may be positioned on the gate insulating layer GI. The gate electrode GE may overlap with the channel region of the active layer ACT.

[0089] The gate electrode GE may include a metal, an alloy metal nitride, a conductive metal oxide, or a transparent conductive material, etc. Examples of the metal may include silver ("Ag"), molybdenum ("Mo"), aluminum ("Al"), tungsten ("W"), copper ("Cu"), nickel ("Ni"), chromium ("Cr"), titanium ("Ti"), tantalum ("Ta"), platinum ("Pt"), or scandium ("Sc"), etc. These materials may be used alone or in combination with each other.

[0090] Examples of conductive metal oxides may include indium tin oxide or indium zinc oxide, etc. In addition, examples of metal nitrides may include aluminum nitride (“AlN x ”), tungsten nitride (“WN x ”) or chromium nitride (“CrN x ”) etc. These materials may be used alone or in combination with each other.

[0091] The interlayer insulating layer ILD may be positioned on the gate insulating layer GI. The interlayer insulating layer ILD may fully cover the gate electrode GE and have a substantially flat upper surface without generating steps around the gate electrode GE. Alternatively, the interlayer insulating layer ILD may cover the gate electrode GE and may be arranged along the outline of the gate electrode GE.

[0092] For example, the interlayer insulating layer ILD may include an inorganic material such as silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, or silicon oxycarbide, etc. These materials may be used alone or in combination with each other.

[0093] The source electrode SE may be positioned on the interlayer insulating layer ILD. The source electrode SE may be connected to the source region of the active layer ACT through a contact hole penetrating the gate insulating layer GI and the interlayer insulating layer ILD.

[0094] The drain electrode DE may be positioned on the interlayer insulating layer ILD. The drain electrode DE may be connected to the drain region of the active layer ACT through a contact hole penetrating the gate insulating layer GI and the interlayer insulating layer ILD.

[0095] For example, the source electrode SE may include metal, alloy, metal nitride, conductive metal oxide, and transparent conductive material, etc. These materials may be used alone or in combination with each other. The drain electrode DE may be formed by the same process as the source electrode SE, and the drain electrode DE may include the same material as the source electrode SE.

[0096] The via insulating layer VIA may be positioned on the interlayer insulating layer ILD. The via insulating layer VIA may fully cover the source electrode SE and the drain electrode DE. The via insulating layer VIA may include an organic material. For example, the via insulating layer VIA may include an organic material such as phenolic resin, acrylic resin, polyimide resin, polyamide resin, siloxane resin, or epoxy resin. These materials may be used alone or in combination with each other.

[0097] The pixel electrode PE may be positioned on the via insulating layer VIA. The pixel electrode PE may be connected to the drain electrode DE through a contact hole penetrating the via insulating layer VIA.

[0098] The pixel electrode PE may include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material, etc. These materials may be used alone or in combination with each other. According to some embodiments, the pixel electrode PE may have a stacked structure including ITO / Ag / ITO. For example, the pixel electrode PE may be used as an anode.

[0099] The pixel defining layer PDL may be positioned on the via insulating layer VIA. The pixel defining layer PDL may cover a side portion of the pixel electrode PE. In addition, an opening exposing a portion of an upper surface of the pixel electrode PE may be defined in the pixel defining layer PDL.

[0100] For example, the pixel defining layer PDL may include an inorganic material or an organic material. According to some embodiments, the pixel defining layer PDL may include an organic material such as an epoxy resin or a silicone resin. These materials may be used alone or in combination with each other. According to some embodiments, the pixel defining layer PDL may also include a light blocking material including a black pigment and a black dye.

[0101] The light emitting layer EML may be positioned on the pixel electrode PE. The light emitting layer EML may include an organic material that emits light having a color (e.g., a set or predetermined color). For example, the light emitting layer EML may include an organic material that emits red light. However, the embodiments according to the present disclosure are not limited thereto, and the light emitting layer EML may emit light having a color different from the color of red light.

[0102] The common electrode CE may be positioned on the light emitting layer EML and the pixel defining layer PDL. The common electrode CE may include metal, alloy, metal nitride, conductive metal oxide or transparent conductive material, etc. These materials may be used alone or in combination with each other. The common electrode CE may be used as a cathode.

[0103] The encapsulation layer TFE may be positioned on the common electrode CE. The encapsulation layer TFE may prevent impurities and moisture from penetrating into the pixel electrode PE, the light emitting layer EML, and the common electrode CE from the outside. The encapsulation layer TFE may include at least one inorganic layer and at least one organic layer.

[0104] For example, the inorganic layer may include silicon oxide, silicon nitride, silicon oxynitride, etc. These materials may be used alone or in combination with each other. The organic layer may include a polymer cured product such as polyacrylate.

[0105] Although referenced Figure 5 Aspects of the pixel PX according to some embodiments are described, but the pixel PX is not limited to Figure 5 That is, the pixel PX may include all structures that receive an electrical signal and emit light having a brightness corresponding to the intensity of the electrical signal.

[0106] Figure 6 is a cross-sectional view showing a display device according to some embodiments.

[0107] refer to Figure 4 and Figure 6 According to some embodiments, the display device DD may include a display panel PNL and a cover window CW. The cover window CW may be positioned on the display panel PNL. That is, the display device DD may include Figure 4 The display panel PNL and the display panel PNL positioned on the display panel PNL Figure 2 Cover window CW.

[0108] As described above, the particle layer PCL may overlap with the non-light-transmitting area BA. In addition, the non-light-transmitting area BA may overlap with the non-display area NDA. Therefore, the particle layer PCL may cover the drivers (such as the drive controller, the gate driver, and the data driver) positioned in the non-display area NDA. That is, the particle layer PCL may prevent or reduce the situation where the driver is visually recognized by the user of the display device DD. In addition, the particle layer PCL may prevent or reduce the situation where the gate lines and the data lines, etc., are visually recognized by the user of the display device DD. That is, the particle layer PCL may be used as a black matrix.

[0109] In addition, the particle layer can be positioned inside the resin component. Therefore, no interface may be formed between the particle layer and the resin component. Therefore, moisture, etc. may not penetrate into the interface between the particle layer and the resin component. Therefore, the cover window and the particle layer, etc. may not fade. In addition, the interface between the particle layer and the resin component may not separate.

[0110] Figures 7 to 11 is a diagram showing the manufacture of some embodiments Figure 6 A cross-sectional view of a display device and a method of covering a window.

[0111] refer to Figure 7 , a platform ST may be provided. A groove H may be defined in the platform ST. The groove H may be a portion obtained by removing a portion of the platform ST from an upper surface of the platform ST.

[0112] The display panel PNL may be provided on the platform ST. For example, the display panel PNL may be located in the groove H. The display panel PNL may overlap the light-transmitting area TA. In addition, the display panel PNL may partially overlap the non-light-transmitting area BA. The non-light-transmitting area BA may surround at least a portion of the light-transmitting area TA.

[0113] refer to Figure 8 , a first resin part RSA may be formed on the platform ST. The first resin part RSA may overlap the light-transmitting area TA. For example, the first resin part RSA may include epoxy resin, acrylic resin, polyurethane resin, polyethylene resin, etc. These may be used alone or in combination with each other.

[0114] refer to Fig. 9 , a second resin part RSB including a plurality of particles PC may be formed on the platform ST. The second resin part RSB may overlap with the non-light-transmitting area BA. For example, the second resin part RSB may include epoxy resin, acrylic resin, polyurethane resin, polyethylene resin, etc. These may be used alone or in combination with each other.

[0115] According to some embodiments, the second resin part RSB and the first resin part RSA may include the same material. According to some embodiments, the second resin part RSB and the first resin part RSA may include different materials.

[0116] According to some embodiments, each of the plurality of particles PC may include magnetic particles. For example, each of the plurality of particles PC may include iron, nickel, cobalt, or iron oxide, etc. These may be used alone or in combination with each other.

[0117] refer to Figure 8 and Fig. 9According to some embodiments, after forming the first resin part RSA on the platform ST, the second resin part RSB may be formed on the platform ST. According to some embodiments, after forming the second resin part RSB on the platform ST, the first resin part RSA may be formed on the platform ST.

[0118] refer to Fig.10 According to some embodiments, the magnet MG may be positioned below the platform ST. The magnet MG may overlap with the non-light-transmitting area BA. Therefore, the plurality of particles PC including magnetic particles may move toward the magnet MG. That is, the plurality of particles PC may move toward the platform ST.

[0119] Therefore, the plurality of particles PC may form a particle layer PCL. That is, the second resin part RSB may include a first portion P1 and a second portion P2. The first portion P1 may be a portion where the particle layer PCL is located. The second portion P2 may be a portion where the particle layer PCL is not located. The second portion P2 may be adjacent to the first portion P1 in the third direction DR3.

[0120] According to some embodiments, the magnet MG may be positioned on the second resin part RSB. That is, the magnet MG may be spaced apart from the second resin part RSB in the third direction DR3. In this case, the plurality of particles PC may move in a direction away from the platform ST. That is, the plurality of particles PC may move in the third direction DR3.

[0121] After the particle layer PCL is formed, the first resin component RSA and the second resin component RSB can be cured. For example, the first resin component RSA and the second resin component RSB can be cured by heat or ultraviolet light. According to some embodiments, the first resin component RSA and the second resin component RSB can be cured simultaneously. That is, by manufacturing the cover window CW including the particle layer PCL through a single curing process, the manufacturing process of the cover window CW can be simplified.

[0122] refer to Fig.11 , the platform ST can be removed.

[0123] Figures 12 to 16 is a cross-sectional view illustrating a method of manufacturing a cover window according to some embodiments.

[0124] refer to Fig.12 , a mold MD may be provided. The mold MD may include a seat part HA. In a plan view, the seat part HA may have a rectangular shape.

[0125] refer to Fig.13, a second resin part RSB including a plurality of particles PC may be formed on the mold MD. For example, the second resin part RSB may be formed inside the seat part HA. The second resin part RSB may overlap with the non-light-transmitting area BA.

[0126] For example, the second resin part RSB may include epoxy resin, acrylic resin, polyurethane resin, polyethylene resin, etc. These may be used alone or in combination with each other.

[0127] For example, each of the plurality of particles PC may include magnetic particles. For example, each of the plurality of particles PC may include iron, nickel, cobalt, or iron oxide, etc. These may be used alone or in combination with each other.

[0128] refer to Fig.14 , a first resin part RSA may be formed on the mold MD. For example, the first resin part RSA may be formed inside the seat part HA. The first resin part RSA may overlap the light-transmitting area TA.

[0129] For example, the first resin member RSA may include epoxy resin, acrylic resin, polyurethane resin, polyethylene resin, etc. These may be used alone or in combination with each other.

[0130] According to some embodiments, the second resin part RSB and the first resin part RSA may include the same material. According to some embodiments, the second resin part RSB and the first resin part RSA may include different materials.

[0131] refer to Fig.13 and 14 According to some embodiments, after forming the second resin part RSB on the mold MD, the first resin part RSA may be formed on the mold MD. According to some embodiments, after forming the first resin part RSA on the mold MD, the second resin part RSB may be formed on the mold MD.

[0132] refer to Fig.15 According to some embodiments, the magnet MG may be positioned on the second resin part RSB. The magnet MG may overlap with the non-light-transmitting area BA.

[0133] Therefore, the plurality of particles PC can move toward the magnet MG. For example, the plurality of particles PC can move in the third direction DR3.

[0134] Therefore, the plurality of particles PC may form a particle layer PCL. That is, the second resin part RSB may include a first portion P1 and a second portion P2. The first portion P1 may be a portion where the particle layer PCL is positioned. The second portion P2 may be a portion where the particle layer PCL is not positioned. The second portion P2 may be adjacent to the first portion P1 in a direction opposite to the third direction DR3.

[0135] According to some embodiments, the magnet MG may be positioned below the mold MD. In this case, the plurality of particles PC may move in a direction opposite to the third direction DR3.

[0136] After the particle layer PCL is formed, the first resin component RSA and the second resin component RSB may be cured. For example, the first resin component RSA and the second resin component RSB may be cured by heat or ultraviolet rays. According to some embodiments, the first resin component RSA and the second resin component RSB may be cured simultaneously.

[0137] refer to Fig.16 , the mold MD can be removed.

[0138] The present disclosure may be applicable to various display devices. For example, the present disclosure may be applicable to various display devices, such as display devices for vehicles, ships and aircraft, portable communication devices, display devices for display or information transmission, and medical display devices.

[0139] The foregoing is an explanation of the embodiments and should not be construed as limiting the embodiments. Although aspects of some embodiments have been described, it will be readily understood by those skilled in the art that many modifications may be made in the embodiments without substantially departing from the novel teachings and characteristics of the embodiments disclosed herein. Therefore, all of these modifications are intended to be included in the spirit and scope of the embodiments disclosed herein as defined by the appended claims and their equivalents. Therefore, it will be understood that the foregoing is an explanation of various embodiments and should not be construed as being limited to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included in the scope of the appended claims and their equivalents.

Claims

1. A cover window, wherein: The cover window comprises: a resin member including a light-transmitting region and a non-light-transmitting region surrounding at least a portion of the light-transmitting region; and A particle layer is provided inside the resin member, the particle layer overlaps the non-light-transmitting region, and the particle layer includes a plurality of particles.

2. The cover window according to claim 1, wherein: The resin member includes a first surface and a second surface facing the first surface, and The particle layer is adjacent to the first surface.

3. The cover window according to claim 2, wherein: The particle layer is spaced apart from the second surface.

4. The cover window according to claim 1, wherein: Each of the plurality of particles includes a magnetic particle.

5. The cover window according to claim 4, wherein: Each of the plurality of particles includes at least one of iron, nickel, cobalt, and iron oxide.

6. The cover window according to claim 1, wherein: A density of each of the plurality of particles and a density of the resin member are different from each other.

7. The cover window according to claim 6, wherein: The density of each of the plurality of particles is greater than the density of the resin member.

8. The cover window according to claim 1, wherein: The color of each of the plurality of particles is black.

9. The cover window according to claim 8, wherein: Each of the plurality of particles comprises a magnetic particle and a coating surrounding at least a portion of the magnetic particle, and The coating has a black color.

10. The cover window according to claim 1, wherein: The portion of the resin component overlapping the non-light-transmitting area includes: A first portion where the particle layer is located; and A second portion is adjacent to the first portion in a thickness direction of the resin member.

11. A display device, wherein: The display device comprises: display panel; and A cover window is on the display panel, and the cover window includes a light-transmitting area and a non-light-transmitting area surrounding at least a portion of the light-transmitting area, the cover window also includes a resin part and a particle layer, wherein the particle layer is inside the resin part, the particle layer overlaps with the non-light-transmitting area, and the particle layer includes a plurality of particles.

12. The display device according to claim 11, wherein: The resin member includes a first surface and a second surface facing the first surface, and The particle layer is adjacent to the first surface.

13. The display device according to claim 12, wherein: The particle layer is spaced apart from the second surface.

14. The display device according to claim 11, wherein: Each of the plurality of particles includes a magnetic particle.

15. The display device according to claim 14, wherein: Each of the plurality of particles includes at least one of iron, nickel, cobalt, and iron oxide.

16. A method of manufacturing a cover window, wherein: The method comprises: forming a first resin member on the platform to overlap the light-transmitting region; forming a second resin component on the platform, the second resin component overlapping a non-light-transmitting area surrounding at least a portion of the light-transmitting area, wherein the second resin component includes a plurality of particles; positioning a magnet to move the plurality of particles toward the magnet; and The first resin member and the second resin member are cured.

17. The method according to claim 16, wherein: The first resin member and the second resin member include the same material.

18. The method according to claim 16, wherein: Each of the plurality of particles includes at least one of iron, nickel, cobalt, and iron oxide.

19. The method according to claim 16, wherein: Moving the plurality of particles toward the magnet includes moving the plurality of particles toward the platform by placing the magnet below the platform.

20. The method according to claim 16, wherein: The forming of the second resin member is performed after the forming of the first resin member.

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