Grinding assembly, grinding machine and grinding method thereof

Abstract

The invention relates to the field of grinding equipment, particularly provides a grinding assembly, a grinding machine and a grinding method thereof, and aims to solve the problem that a grinding machine in the prior art cannot be compatible with whole bar grinding and half bar grinding. In order to achieve the purpose, the grinding assembly comprises a clamping assembly and a grinding assembly, the clamping assembly comprises detachable clamping ends, a part to be ground is clamped between the two clamping ends, the grinding assembly comprises a grinding disc, and the grinding disc is located on one side of the part to be ground. The clamping assembly and / or the grinding assembly can move so that relative movement can be generated between the grinding disc and the to-be-ground piece. According to the technical scheme, the grinding assembly can be used for grinding the half rod material and the whole rod material of the silicon rod, and the wide applicability of equipment is improved.

Description

Technical Field

[0001] The invention relates to the field of grinding equipment, and specifically provides a grinding assembly, a grinding machine and a grinding method thereof. Background Art

[0001] A grinder is a device for grinding hard and brittle materials. For example, a grinder usually includes a loading and unloading device, a transfer component, and a grinding assembly. Taking the hard and brittle material as a silicon rod as an example, first fix the entire silicon rod to the loading device, make some preliminary adjustments to its position and posture, and then deliver the silicon rod to the two chucks of the grinding assembly. For example, both chucks can be movable chucks, or one of the two chucks is a movable chuck and the other is a fixed chuck. Through the axial movement of the silicon rod, the silicon rod is delivered to the grinding device to perform grinding processing including rough grinding and fine grinding on the first group of surfaces to be ground. Afterwards, by rotating the silicon rod, it is rotated to the second group of surfaces to be ground, and on this basis, the second group of surfaces to be ground is subjected to grinding processing including rough grinding and fine grinding. Repeat this process until all the surfaces to be ground of the silicon rod are ground according to the set grinding standards. For example, a silicon rod generally includes four groups of surfaces to be inspected / grinded (0° surface, 90° surface, 45° chamfer / round, 135° chamfer / round).

[0002] Still taking the silicon rod as an example of a hard and brittle material, the silicon rod is initially a rough rod with a square cross section and an unprocessed surface. After removing the edges and peeling, a long silicon material, i.e. a whole rod, is obtained. Generally, the whole rod is clamped on a grinding assembly and ground by a grinding wheel. However, after the whole rod is cut in the middle, a half rod with a rectangular cross section is obtained. However, the half rod cannot be ground after being clamped by the existing grinding assembly. The position interference of the chuck on the end face causes the half rod to be unable to be continuously ground on the surface. Therefore, it is difficult for the existing grinding assembly to take into account the grinding of both the half rod and the whole rod.

[0003] Accordingly, the art needs a new grinding assembly to solve the above problems. Summary of the invention

[0004] The present invention aims to solve the above technical problem, that is, to solve the problem that the grinding machine in the prior art is not compatible with full bar grinding and half bar grinding. To this end, the present invention provides a grinding assembly, which includes:

[0005] A clamping assembly, the clamping assembly comprising a detachable clamping end, and two clamping ends are used to clamp the workpiece to be ground;

[0006] A grinding assembly, the grinding assembly comprising a grinding disc, the grinding disc being located on one side of the workpiece to be ground;

[0007] The clamping assembly and / or the grinding assembly can be moved to generate relative movement between the grinding disc and the workpiece to be ground.

[0008] Through the above technical scheme, a grinding assembly is proposed, which utilizes the relative movement of the grinding component and the clamping component to realize the grinding process of the surface of the workpiece to be ground by the grinding disc. At the same time, in order to take into account the processing and grinding of the whole bar and the half bar, the clamping end of the clamping assembly is detachable and matched with the whole bar and the half bar to avoid grinding interference and meet the grinding requirements.

[0009] In the above-mentioned specific embodiment with a grinding assembly, the clamping end includes a first chuck and a second chuck, the first chuck is a floating chuck, the second chuck is a buffer chuck, the first chuck is provided with a first give way section, the second chuck is provided with a second give way section, the length of the first give way section is greater than the length of the second give way section and is not less than the diameter of the grinding disc, the first chuck and the second chuck are a group, the first chuck and the second chuck have multiple groups, the end area of ​​the first chuck and the second chuck is smaller than the end face of the workpiece to be ground, and the end areas of the multiple groups of the first chuck and the second chuck are different.

[0010] Through the above technical solution, the clamping end is a first chuck and a second chuck arranged on both sides of the silicon rod, and the first chuck and the second chuck are both provided with a clearance section, that is, when the grinding disc grinds the surface of the silicon rod, the grinding disc can start grinding from one end of the silicon rod, and the first clearance section can provide a space for the grinding disc to feed the tool. When grinding to the other end of the silicon rod, the grinding range of the grinding disc must cover the other end of the silicon rod. The length of the first clearance section must not be less than the diameter of the grinding disc, and the length of the first clearance section is greater than the length of the second clearance section, so that the clamping space is arranged reasonably.

[0011] Through the above technical solution, the first chuck and the second chuck can be designed in multiple groups of different specifications, and their end areas are different in size to adapt to whole rods and half rods of different specifications. At the same time, the end areas of the first chuck and the second chuck are smaller than the end faces of the workpiece to be ground, so the grinding disc will not interfere with the chuck when grinding the workpiece to be ground.

[0012] Through the above technical solution, one end is a floating chuck and the other end is a buffer chuck. On the one hand, the floating chuck can compensate for the surface defects caused by the cutting of the end face of the silicon rod. Even if the end face is uneven, it can still maintain the overall clamping level of the silicon rod and keep the grinding surface of the silicon rod accurately positioned, thereby improving the grinding accuracy.

[0013] In the above-mentioned specific embodiment with a grinding assembly, the first chuck includes a fixed body and a floating body, the floating body is movably connected to the fixed body, the fixed body is the first yielding section, the floating body includes a chuck unit, a coupling diaphragm, a wear-resistant copper pad and a supporting steel ball, one side of the coupling diaphragm is connected to the chuck unit, and the other side is connected to the fixed body, the supporting steel ball is arranged between the chuck unit and the fixed body, there are two wear-resistant copper pads and they are respectively arranged on the fixed body and the chuck unit, the wear-resistant copper pad is abutted against the supporting steel ball, the chuck unit includes a chuck body and a height-fixing clamping head arranged on the end face of the chuck body, and the height-fixing clamping head is multiple and arranged in an array on the end face of the chuck body.

[0014] Through the above technical solution, the first chuck adopts a structural form of a combination of a fixed body and a floating body. The fixed body is movably connected to the floating body. The fixed body plays a role of fixed installation and also serves as the first yielding end to provide sufficient processing space for the grinding disc. The floating body movably connected to the fixed body can adapt to the surface shape of the end of the silicon rod, achieve stable clamping, and improve the position accuracy of the central axis of the silicon rod clamping.

[0015] Through the above technical scheme, a supporting steel ball is installed between the chuck unit and the fixed body through an active connection between the coupling diaphragm chuck unit and the fixed body, and a wear-resistant copper pad matching the supporting steel ball is installed on the fixed body and the chuck unit. The chuck unit abuts against the end of the silicon rod. The end of the silicon rod may have an uneven end surface due to processing. The chuck unit can swing around the supporting steel ball to adapt to the clamping of the silicon rod, thereby improving the positioning size accuracy of the silicon rod.

[0016] Through the above technical solution, the chuck unit is specifically a chuck body and a fixed-height clamping head installed on the end face of the chuck body. An array of multiple fixed-height clamping heads is installed on the end face of the clamping body. The multiple fixed-height clamping heads abut against the end face of the silicon rod to reduce the force contact area and balance the force state.

[0017] In the above-mentioned specific embodiment with a grinding assembly, the buffer chuck includes a clamping disk and a buffer clamping head floatingly arranged on the clamping disk, the buffer clamping heads are multiple and arranged in an array on the end surface of the clamping disk, the clamping disk is a second yielding section, a buffer blind hole is arranged on the clamping disk, the buffer clamping head is slidably arranged in the buffer blind hole, the buffer chuck also includes a retaining ring and a buffer spring, the middle diameter of the buffer clamping head is larger than the diameter at both ends, the buffer spring is sleeved on one end of the buffer clamping head and is located in the buffer blind hole, one end of the buffer spring abuts against the bottom of the buffer blind hole, and the other end abuts against the buffer clamping head, the retaining ring is sleeved on the other end of the buffer clamping head and is threadedly connected to the inner wall of the buffer blind hole, the buffer chuck also includes a wear-resistant sleeve, the wear-resistant sleeve is arranged in the buffer blind hole, and the buffer clamping head passes through the wear-resistant sleeve.

[0018] Through the above technical solution, the structure of the buffer chuck is that the clamping disk serves as the fixed end, and a buffer clamping head is arranged at the end of the clamping disk. Multiple buffer clamping heads are arrayed at the end of the clamping disk to reduce the contact area and balance the force distribution of the silicon rod. When contacting the end face of the silicon rod, the buffer clamping head can float and buffer, adapt to the length of the silicon rod, play a role of buffering clamping, and avoid hard and direct contact clamping.

[0019] Through the above technical solution, a buffer blind hole is opened on the clamping disk, and the buffer clamping head is slidably set in the buffer blind hole. The buffer clamping head and the buffer spring are fixed in the clamping disk at the end of the buffer blind hole through a retaining ring. When the buffer clamping head abuts against the silicon rod, the buffer clamping head will retract into the buffer blind hole. At the same time, the buffer clamping head can also maintain a certain clamping force, thereby playing a certain clamping effect on the silicon rod.

[0020] Through the above technical solution, by setting a wear-resistant sleeve, the wear of the clamping disk can be protected, and the centering degree of the buffer clamping head moving in the buffer blind hole can be improved, thereby avoiding the situation where the buffer clamping head has difficulty in extension and contraction or jamming due to wear of the inner wall of the buffer blind hole.

[0021] In the above-mentioned specific embodiment with a grinding assembly, the clamping assembly also includes a clamping frame main body and a mounting frame arranged on the clamping frame main body, the mounting frames are two and at least one is movably arranged on the clamping frame main body, the clamping end is arranged on the mounting frame, the mounting frame includes a head frame and a tail frame, the first chuck is rotatably arranged on the head frame, the second chuck is rotatably arranged on the tail frame, the tail frame is movably arranged on the clamping frame main body, and the head frame is fixedly arranged at one end of the clamping frame main body.

[0022] Through the above technical solution, the clamping action is achieved by driving the clamping end through the mounting frame on the clamping frame body. Only one of the two mounting frames installed on the clamping frame body can be moved. When one mounting frame moves closer to the other mounting frame, clamping can be achieved, and when it moves away from the other mounting frame, loosening can be achieved.

[0023] Through the above technical solution, the mounting frame is divided into a head frame and a tail frame, wherein the head frame is fixedly mounted on one side, and the tail frame is movably mounted. As the clamping end, the first chuck is rotatably mounted on the head frame, and the second chuck is rotatably mounted on the tail frame. After clamping the silicon rod, the angle and position of the silicon rod to be ground can be adjusted by rotation.

[0024] In the above-mentioned specific embodiment with a grinding assembly, the clamping assembly also includes a feed motor, a feed screw, a linear guide and a feed slide, the linear guide is arranged on the clamping frame body, the feed slide is slidably arranged on the linear guide, the tail stock is arranged on the feed slide, the feed screw is threadedly connected to the feed slide, the feed motor drives the feed screw to drive the feed slide to move, and the clamping assembly also includes a head motor and a tail motor, the head motor is arranged on the head stock, the tail motor is arranged on the tail stock, the head motor drives the first chuck to rotate, and the tail motor drives the second chuck to rotate.

[0025] Through the above technical solution, the feed motor drives the feed screw to rotate, and the feed screw drives the feed slide to move on the linear guide rail. The above structure can smoothly and accurately control the distance between the tail frame and the head frame, and match the size of the silicon rod to clamp it with appropriate force.

[0026] Through the above technical solution, the rotation of the first chuck and the second chuck can be controlled, and the grinding angle and position of the silicon rod can be accurately controlled.

[0027] In the above-mentioned specific embodiment with a grinding assembly, the grinding disc is arranged at an angle and the angle between the grinding disc and the surface to be ground of the workpiece to be ground opens toward the first yielding section, the grinding assembly also includes a grinding frame body and a grinding motor and a grinding shaft arranged on the grinding frame body, the grinding motor is connected to the grinding shaft by a belt transmission, the grinding shaft drives the grinding disc to rotate, the grinding disc includes a central grinding disc and an outer ring grinding disc, the central grinding disc is telescopically arranged in the outer ring grinding disc, the central grinding disc is a coarse grinding disc and the outer ring grinding disc is a fine grinding disc, or the central grinding disc is a fine grinding disc and the outer ring grinding disc is a coarse grinding disc.

[0028] Through the above technical solution, the grinding disc is tilted to form an angle with the surface to be ground, and the opening of the angle faces the first clearance section, so that the grinding disc can enter from the end face of the silicon rod when cutting, and when grinding to the other end, the contact point between the tilted grinding disc and the silicon rod can be completely ground from the silicon rod under the clearance space of the second clearance section, so that the grinding of the silicon rod by the grinding disc is more complete.

[0029] Through the above technical solution, the grinding motor drives the grinding shaft to rotate and then drives the grinding disc to rotate, and the grinding disc rotates to grind the surface to be ground of the silicon rod.

[0030] Through the above technical solution, the grinding discs are in a combined form, the central grinding disc is arranged on the inner side of the outer ring grinding disc and can be telescopically moved, and the central grinding disc and the outer ring grinding disc can adopt different grinding grades. According to needs, the inside and outside can adopt the form of a combination of fine grinding discs and coarse grinding discs. When one of the grinding grades is needed, the central grinding disc can be selected to extend or retract so that the grinding disc of the required grinding grade contacts the surface to be ground of the silicon rod.

[0031] In the above-mentioned specific embodiment with a grinding assembly, the grinding shaft includes an inner shaft and an outer shaft, the inner shaft key is connected to the inside of the outer shaft, the outer shaft is rotatably arranged on the grinding frame body and is connected to the grinding motor belt transmission, the outer shaft is connected to the outer ring grinding disc, the inner shaft is connected to the center grinding disc, and the inner shaft is telescopically arranged in the outer shaft. The grinding assembly also includes a reset spring, a positioning end cover, an ejection cam and an ejection motor, the reset spring is sleeved on the inner shaft, the positioning end cover is arranged at the end of the inner shaft away from the center grinding disc, one end of the reset spring acts on the inner wall of the outer shaft, and the other end acts on the positioning end cover, the ejection motor is arranged on the grinding frame body, and the ejection cam is arranged on the output end of the ejection motor and abuts against the positioning end cover.

[0032] Through the above technical scheme, the grinding motor can drive the outer shaft to rotate and drive the inner shaft to rotate synchronously, the center grinding disc and the outer ring grinding disc can also achieve synchronous rotation, and the structural form of the outer shaft and the inner shaft sleeve can enable the inner shaft to achieve synchronous rotation while being able to move axially, thereby realizing the diversification of the grinding method of the grinding disc, and a variety of grinding schemes can be combined according to the grinding requirements.

[0033] Through the above technical solution, the ejection motor drives the ejection cam to rotate, and the ejection cam abuts against the positioning end cover of the inner shaft and applies a force, so that the inner shaft can move axially. Through the reset spring between the outer shaft and the inner shaft, when the ejection cam rotates to the side of the short diameter and abuts against the positioning end cover, the reset spring resets the inner shaft axially, and the center grinding disc retracts into the inner part of the outer ring grinding disc, thereby realizing the alternating contact between the center grinding disc or the outer ring grinding disc and the surface to be ground of the silicon rod to achieve grinding.

[0034] In the above specific embodiment with the grinding assembly, at least one of the clamping frame body and the grinding frame body has a degree of freedom of linear movement.

[0035] Through the above technical solution, one of the clamping frame body or the grinding frame body can move along a straight line, so that a straight line relative displacement can be generated between the grinding disc and the surface to be ground of the silicon rod, thereby achieving grinding.

[0036] In the above-mentioned specific embodiment with a grinding assembly, the clamping assembly also includes a reference plate arranged on the headstock or the tailstock, and the grinding assembly also includes a support plate and a detection probe movably arranged on the grinding frame body, and the detection probes are multiple and evenly spaced on the support plate, and one end of the detection probe is directed toward the workpiece to be ground.

[0037] Through the above technical scheme, a reference plate is installed on the headstock or the tailstock, and the support plate arranged on the grinding frame body is moved to drive the detection probe to detect the surface to be ground of the silicon rod with the substrate as the standard to obtain the required grinding amount. The use of multiple detection probes can comprehensively detect the surface of the silicon rod, improve the accuracy of the detection, and thus improve the surface grinding quality of the silicon rod.

[0038] A grinding machine, comprising a bed and a grinding assembly described in any one of the above schemes arranged on the bed, the grinding assembly comprising the clamping assembly and the grinding assembly, the grinding machine also comprising a loading assembly, a transfer assembly and a unloading assembly, the loading assembly and the unloading assembly being arranged on the sides of the grinding assembly, the transfer assembly being arranged on the bed for transferring the workpiece to be ground from the loading assembly to the unloading assembly via the grinding assembly.

[0039] The present invention also proposes a grinder. Through the above technical scheme, the grinding of silicon rods can be automated. The silicon rods are preliminarily positioned and detected by a loading assembly, and the silicon rods are transferred from the loading assembly to the grinding assembly by a transfer assembly. The silicon rods are ground by a clamping assembly and a grinding assembly. After the processing is completed, the transfer assembly is used to move the ground silicon rods from the grinding assembly to the unloading assembly, thereby realizing the automated processing of silicon rod grinding from loading to unloading, thereby improving production efficiency and grinding quality.

[0040] In the above-mentioned specific embodiment with a grinding machine, the transfer assembly includes a column frame, a transfer screw, a transfer seat and a transfer motor arranged on the bed, the transfer screw is arranged on the column frame, the transfer seat is threadedly connected to the transfer screw and the bottom of the transfer seat is connected to the clamping assembly, the transfer motor drives the transfer seat to move along the axial direction of the transfer screw, and the loading assembly and the unloading assembly are movably arranged on the bed and alternately moved to the bottom of the column frame.

[0041] Through the above technical scheme, the transfer component takes the form of moving the clamping component, using the column frame as a support, and the transfer screw is driven by the transfer motor. The transfer screw rotates to drive the transfer seat to move on the column frame, and at the same time drives the clamping component to move. The moving range covers the position of the grinding component and the loading and unloading component on the bed. At the same time, the clamping component moves relative to the grinding component to realize the grinding of the silicon rod.

[0042] In the above-mentioned specific embodiment of the grinding machine, the transfer component includes a gantry frame arranged on the bed and a transfer robot movably arranged on the gantry frame, the two claws of the transfer robots are a group and move toward each other, and the claws of the transfer robots are provided with right-angle notches.

[0043] Through the above technical solution, the gantry frame on the bed covers the range of the loading assembly, the unloading assembly, and the grinding assembly. The transfer robot moving on the gantry frame can transfer the silicon rods between the above-mentioned workstations. The transfer robot has two clamping claws to clamp the silicon rods.

[0044] Through the above technical solution, a right-angle notch is opened on the clamping claw, and after the two clamping claws are combined, the right-angle notch forms a clamping space that adapts to the shape of the silicon rod, and the clamping is more stable.

[0045] A grinding method for a grinding machine, the grinding machine comprising a feeding assembly, a transfer assembly, a grinding assembly, and a feeding assembly, the grinding assembly comprising a clamping assembly and a grinding assembly, the clamping assembly comprising a detachable clamping end, and the grinding assembly comprising a grinding disc;

[0046] The grinding method comprises:

[0047] The clamping end adapted to the workpiece to be ground is replaced according to its specifications, the two clamping ends clamp the workpiece to be ground and adjust its grinding position, the grinding assembly moves or the clamping assembly moves to make the grinding disc and the workpiece to be ground move relative to each other, and selectively perform slant grinding or forward grinding.

[0048] The present invention also proposes a grinding method for a grinder. Through the above technical scheme, the whole rod grinding and half rod grinding of the silicon rod can be carried out on the same grinder. The clamping end is selected and matched according to the specifications of the workpiece to be ground, i.e., the silicon rod, and the clamping end matching the silicon rod is replaced to adapt to the clamping of the whole rod and the half rod. The grinding position of the silicon rod is adjusted to generate relative movement between the grinding disk and the surface to be ground of the silicon rod, thereby performing grinding. Depending on whether the grinding is for material reduction or surface quality control, slitting grinding or down-cut grinding is selectively used.

[0049] In the above-mentioned specific implementation of the grinding method with a grinding machine, in the step of "the two clamping ends clamp the workpiece to be ground and adjust its grinding position", "the two clamping ends adjust their grinding positions" includes:

[0050] By rotating the first chuck and the second chuck, the grinding surface of the workpiece is adjusted to a vertical state and calibrated as the 0° surface. Based on this surface, the first chuck and the second chuck are selectively rotated 45° or 90° according to the processing conditions of the grinding surface.

[0051] Through the above technical solution, after the first chuck and the second chuck clamp the silicon rod, they are rotated, with one of the planes of the silicon rod as the starting 0° plane, and then rotated 90° to grind the other plane according to the grinding requirements, and rotated 45° to grind the edge of the silicon rod, thereby performing grinding on the surface and chamfer of the silicon rod.

[0052] In the above-mentioned specific implementation of the grinding method with a grinding machine, the step of "the grinding assembly moves or the clamping assembly moves so that the grinding disc and the workpiece to be ground move relative to each other, and selectively performs slant grinding or down-cut grinding" includes:

[0053] By adjusting the angle formed between the grinding disc and the workpiece to be ground, the grinding assembly moves or the clamping assembly moves to make the grinding disc and the workpiece to be ground move relative to each other, the 0° surface and other surfaces to be ground parallel or perpendicular to the 0° surface are roughly ground by grit grinding according to grinding requirements, and then the edges of the workpiece to be ground where the surfaces to be ground intersect are chamfered and roughly ground by grit grinding, and then fine ground by down-cut grinding, and finally the 0° surface and other surfaces to be ground parallel or perpendicular to the 0° surface are fine ground by down-cut grinding according to grinding requirements.

[0054] When the above technical solution is adopted, the surface and edges of the silicon rod are ground, with the 0° surface as the starting surface for grinding. The grinding method is that the plane is first roughly ground in the form of a burr, with a large cutting amount and high grinding efficiency. Then the silicon rod is controlled to rotate 90° in sequence to roughly grind the remaining planes, and then the silicon rod is rotated 45° to grind the edges to form chamfers. When grinding the edges, burr grinding is first performed to reduce material to form chamfers, and then down-grinding is performed to improve the surface quality of the chamfers. Then, the remaining edges are rotated 90° in sequence to form chamfered surfaces with higher surface quality. Then, the rough-ground plane surfaces are down-grinded to obtain higher surface quality, thereby completing the grinding process of the entire silicon rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings, in which:

[0056] Figure 1 is a schematic structural diagram of a silicon rod in the present invention, wherein the structures of a half rod and a whole rod are shown;

[0057] Figure 2 It is a structural schematic diagram of one embodiment of the grinding assembly in the present invention;

[0058] Figure 3 is a schematic structural diagram of one embodiment of the grinding machine of the present invention, wherein the structure of another embodiment of the grinding assembly is shown;

[0059] Figure 4 It is a structural schematic diagram of one embodiment of the clamping assembly in the present invention;

[0060] Figure 5 is a structural schematic diagram of another embodiment of the clamping assembly in the present invention;

[0061] Figure 6 It is a schematic structural diagram of the first chuck in the present invention;

[0062] Figure 7 yes Figure 6 A partial enlarged view of the center A, showing the structure of the floating body;

[0063] Figure 8 is a schematic structural diagram of the second chuck in the present invention;

[0064] Fig. 9 yes Figure 8 A partial enlarged view of the position B in the middle shows the structure of the buffer chuck;

[0065] Fig.10 is a schematic diagram of the grinding process of the grinding disc grinding the silicon rod in the present invention, wherein the positional relationship between the grinding disc and the silicon rod is shown;

[0066] Fig.11 It is a schematic structural diagram of the grinding assembly in the present invention;

[0067] Fig.12 yes Fig.11 A partial enlarged view of the C in the middle shows the structure of the ejector cam part;

[0068] Fig.13 is a schematic structural diagram of the detection probe in the present invention, which shows the positional relationship between the detection probe and the silicon rod;

[0069] Fig.14 is a schematic structural diagram of another embodiment of the grinding machine of the present invention, wherein the structure of one embodiment of the transfer assembly is shown;

[0070] Fig.15 It is a structural schematic diagram of another embodiment of the transfer component in the present invention;

[0071] Fig.16 It is a schematic diagram of the steps of the grinding method in the present invention.

[0072] In the figure: 1, half rod, 2, whole rod, 3, clamping assembly, 4, grinding assembly, 5, grinding disk, 6, first chuck, 7, second chuck, 8, first give way section, 9, second give way section, 10, fixed body, 11, floating body, 12, chuck unit, 13, coupling diaphragm, 14, wear-resistant copper pad, 15, supporting steel ball, 16, chuck body, 17, fixed height clamping head, 18, clamping disk, 19, buffer clamping head, 20, buffer blind hole, 21, retaining ring, 22, buffer spring, 23, wear-resistant sleeve, 24, clamping frame body, 25, mounting frame, 26, head frame, 27, tail frame, 28, feed motor, 29, feed screw, 30, linear guide Rail, 31, feed slide, 32, head motor, 33, tail motor, 34, grinding frame body, 35, grinding motor, 36, grinding shaft, 37, center grinding disc, 38, outer ring grinding disc, 39, inner shaft, 40, outer shaft, 41, return spring, 42, positioning end cover, 43, ejector cam, 44, ejector motor, 45, reference plate, 46, support plate, 47, detection probe, 48, bed, 49, loading assembly, 50, transfer assembly, 51, unloading assembly, 52, column frame, 53, transfer screw, 54, transfer seat, 55, transfer motor, 56, gantry frame, 57, transfer robot, 58, claw, 59, right-angle notch. DETAILED DESCRIPTION

[0073] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not used to limit the scope of protection of the present invention. Those skilled in the art can make adjustments to them as needed to adapt to specific application scenarios.

[0074] It should be noted that in the description of the present invention, the terms "upper", "lower", "left", "right", "inner", "outer", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the relevant devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, ordinal numbers such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0075] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0076] See also Figure 2 and Figure 3 The present invention proposes a grinding assembly, which is composed of two parts, namely a clamping assembly 3 for fixing the silicon rod and a grinding assembly 4 for processing the silicon rod. Figure 1 As shown, Figure 1 The left side is a half-bar and the right side is a whole-bar. The half-bar is obtained by cutting the whole-bar. The end surface area of ​​the half-bar and the whole-bar are different, so they cannot be ground on one grinding device. The grinding assembly proposed in the present invention can adapt to the clamping and grinding of half-bars and whole-bars of silicon rods. The clamping end of the clamping component 3 is a detachable structure. The clamping component 3 and the grinding component 4 form a relative movement so that the grinding disc 5 of the grinding component 4 can grind the half-bar or the whole-bar. Based on the above design ideas, the present invention is described by taking the silicon rod as an example and combining two embodiments.

[0077] See also Figure 2The clamping assembly 3 is located on the inner side of the two grinding assemblies 4. The clamping end on the clamping assembly 3 is detachable and can be removed and replaced according to the type of silicon rod to be clamped. For example, when a whole rod needs to be clamped, a clamping end that adapts to the stress state of the end of the whole rod is installed. When a half rod needs to be clamped, the end area of ​​the half rod is smaller than that of the whole rod. The clamping end that adapts to the stress area of ​​the end of the half rod is replaced. The grinding disk 5 of the grinding assembly 4 is on both sides of the silicon rod. In this embodiment, the movement of the clamping assembly 3 drives the silicon rod and the grinding disk 5 to move relative to each other to achieve grinding.

[0078] See also Figure 3 The clamping assembly 3 is located at one side of the grinding assembly 4. The clamping assembly 3 is suspended and installed. The clamping assembly 3 is detachable like the clamping end in the above embodiment and can be replaced according to the specifications of the silicon rod. The clamping assembly 3 drives the silicon rod to move and moves relative to the grinding disk 5 of the grinding assembly 4 located at one side thereof to realize grinding processing.

[0079] See also Figure 4 and Figure 5 The clamping end is divided into a first chuck 6 and a second chuck 7, wherein the first chuck 6 is provided with a first giving section 8, and the second chuck 7 is provided with a second giving section 9, the length of the first giving section 8 is greater than the length of the second giving section 9 and the length of the first giving section 8 is not less than the diameter of the grinding disc 5. During processing, the grinding disc 5 can be cut from the first chuck 6 on one side of the first giving section 8, and the end face of the silicon rod is ground. With the relative movement between the silicon rod and the grinding disc 5, the grinding disc 5 enters the second giving section 9 from the other end of the silicon rod. When the grinding disc 5 enters the second giving section 9, the surface grinding of the silicon rod has been completed.

[0080] Continue reading Figure 4 and Figure 5 The clamping end is divided into a first clamp 6 and a second clamp 7. The two clamps clamping the silicon rod of the same specification are a group. The end surface areas of the first clamp 6 and the second clamp 7 are smaller than the end area of ​​the silicon rod. When it is a whole rod material, the end area is larger, while the end area of ​​a half rod material is relatively reduced by half. The end areas of the first clamp 6 and the second clamp 7 matched with them are also different. When the grinding disk 5 is used for subtractive grinding of the silicon rod, the feed space at the end is reserved.

[0081] Based on the above embodiments, the first chuck 6 can be set as a floating chuck, and the second chuck 7 can be set as a buffer chuck. When the clamping assembly 3 clamps the silicon rod, the floating chuck can form a better contact with the end face of the silicon rod. The end face of the silicon rod may be uneven due to processing factors. The contact between the floating chuck and the end face of the silicon rod can adapt to the changes in its end face, so that the silicon rod can maintain the accuracy of the clamping position as much as possible when clamping. The buffer chuck at the other end, when in contact with the end face of the silicon rod, can reduce the effect of the clamping force on the silicon rod during clamping, thereby avoiding wear or even damage to the silicon rod due to clamping.

[0082] For further information, see Figure 6 and Figure 7 The first chuck 6 is composed of a fixed body 10 and a floating body 11. The floating body 11 is movably connected to the fixed body 10. The fixed body 10 has a certain length, namely the first clearance section 8, which provides an operating space for the processing of the grinding disc 5 and also plays a role in connection and fixing. The floating body 11 at the end of the fixed body 10 contacts the end of the silicon rod and can be adaptively adjusted according to the end face of the silicon rod so that the silicon rod can be clamped horizontally, thereby improving the position accuracy of the silicon rod clamped before grinding. Fig.10 and Fig.11 When the end face of the silicon rod is tilted due to cutting, the floating body 11 contacts the end face of the silicon rod and slightly swings around the fixed body 10, so that even if the end face of the silicon rod is not flat but tilted, horizontal clamping can be achieved.

[0083] Based on the above embodiments, see Figure 7 Specifically, the structure of the floating body 11 is as follows: the chuck unit 12 is connected to the fixed body 10 through a coupling diaphragm 13, so that there is a movable space between the chuck unit 12 and the fixed body 10, and a supporting steel ball 15 is installed between the chuck unit 12 and the fixed body 10, so that the chuck unit 12 swings around the supporting steel ball 15, and a wear-resistant copper pad 14 is installed on the fixed body 10 and the chuck unit 12. Through the contact between the wear-resistant copper pad 14 and the supporting steel ball 15, the service life of the floating body 11 can be extended, the clamping accuracy can be improved, and the reduction of clamping accuracy due to wear can be avoided.

[0084] Based on the above embodiments, continue to refer to Figure 7 Specifically, the clamping unit is a plurality of fixed-height clamping heads 17 installed on the clamping head body 16. The fixed-height clamping heads 17 are arranged in an array on the end face of the clamping head body 16. When contacting the end face of the silicon rod, a large area of ​​contact with the end face of the silicon rod is avoided to avoid unnecessary wear. The fixed-height clamping heads 17 arranged in an array can balance the force distribution between the clamping unit and the silicon rod while reducing the contact area, thereby reducing wear and achieving clamping.

[0085] See also Figure 8and Fig. 9 The buffer chuck includes a clamping disc 18 and a buffer clamping head 19. A plurality of buffer clamping heads 19 are arranged in an array on the clamping disc 18. The clamping disc 18 plays a fixing role and also provides a clearance space for the second clearance section 9 so that the grinding disc 5 can completely grind the silicon rod.

[0086] Continue reading Figure 8 and Fig. 9 The specific structure of the buffer clamping head 19 on the clamping disk 18 is that a plurality of buffer blind holes 20 are opened on the clamping disk 18, and the buffer blind holes 20 are also distributed in an array. The buffer clamping head 19 can slide in the buffer blind hole 20, and the buffer clamping head 19 is restricted in the buffer blind hole 20 by a retaining ring 21. The retaining ring 21 is connected to the buffer blind hole 20 by a threaded connection. The shape of the buffer clamping head 19 adopts a structure that is thick in the middle and thin at both ends, one end of which can extend through the retaining ring 21 and contact the end face of the silicon rod. The part located in the buffer blind hole 20 is sleeved with a buffer spring 22. When the buffer clamping head 19 contacts the silicon rod, it can buffer the impact of the clamping force on the silicon rod. The elastic force of the buffer spring 22 can provide a certain clamping force, so that the buffer clamping head 19 can clamp the silicon rod and maintain the stability of the silicon rod clamping.

[0087] It can be imagined that the buffer clamping head 19 sliding back and forth in the buffer blind hole 20 will cause certain wear. When the inner diameter of the buffer blind hole 20 becomes larger due to wear, the movement of the buffer clamping head 19 in the buffer blind hole 20 may be stuck or even stuck due to the skew. A wear-resistant sleeve 23 is installed in the buffer blind hole 20, and the buffer clamping head 19 passes through the wear-resistant sleeve 23 installed in the buffer blind hole 20 to reduce the large wear caused by the reciprocating movement of the buffer clamping head 19 and avoid jamming due to skew.

[0088] See also Figure 4 and Figure 5The first chuck 6 and the second chuck 7 are arranged on the mounting frame 25, and the mounting frame 25 is on the clamping frame body 24, wherein the mounting frame 25 has a head frame 26 and a tail frame 27. The first chuck 6 is mounted on the head frame 26 and is driven to rotate by the head motor 32, and the second chuck 7 is mounted on the tail frame 27 and is driven to rotate by the tail motor 33. The head frame 26 is fixedly arranged on the clamping frame body 24, and the tail frame 27 can be moved, so that the distance between the first chuck 6 and the second chuck 7 can be changed to achieve clamping and loosening. Specifically, the tailstock 27 drives the feed screw 29 to rotate through the feed motor 28, and the feed screw 29 cooperates with the feed slide 31 to drive the feed slide 31 to move along the linear guide rail 30. The tailstock 27 is installed on the feed slide 31, so as to achieve the approach and distance between the tailstock 27 and the headstock 26. The feed screw 29 can be set with a corresponding pitch as needed, so as to facilitate the fine control of the clamping force when clamping the silicon rod, and the movement of the feed slide 31 on the linear guide rail 30 improves the stability of the movable tailstock 27 and improves the stability of the clamping.

[0089] Based on the above embodiments, see Fig.10 The grinding assembly 4 grinds the surface of the silicon rod. The grinding disc 5 of the grinding assembly 4 contacts the silicon rod. The grinding disc 5 and the surface to be ground of the silicon rod form an angle. The specific setting of the angle can be adjusted accordingly according to the processing needs. One side of the grinding disc 5 forming the angle will contact the surface to be ground of the silicon rod to form grinding. The grinding disc 5 drives the grinding shaft 36 to rotate through the grinding motor 35 set on the grinding frame body 34, so that the grinding disc 5 rotates to grind the silicon rod. The transmission between the grinding motor 35 and the grinding shaft 36 is preferably a belt drive, which has a stable transmission and small vibration, improves the stability of the grinding disc 5, and thus improves the grinding quality.

[0090] See also Fig.11 The surface quality requirement of the silicon rod is relatively high. Therefore, based on the above-mentioned grinding implementation method, the grinding disc 5 adopts a combined structural form. Specifically, the grinding disc 5 is divided into an outer ring grinding disc 38 and a center grinding disc 37. The center grinding disc 37 can be retracted in the outer ring grinding disc 38. The center grinding disc 37 and the outer ring grinding disc 38 have different grinding grades, which are divided into rough grinding and fine grinding. The rough grinding and fine grinding can be freely combined inside and outside. When the silicon rod needs to be roughly ground, whether it is the center grinding disc 37 or the outer ring grinding disc 38, the relatively coarser grinding disc can be in contact with the silicon rod.

[0091] Based on the above embodiments, continue to refer to Fig.11The grinding disc 5 has a split structure, and the grinding shaft 36 also adopts a split structure to cooperate with the grinding disc 5. The grinding shaft 36 is divided into an inner shaft 39 and an outer shaft 40. The end of the inner shaft 39 is connected to the center grinding disc 37, and the end of the outer shaft 40 is connected to the outer ring grinding disc 38. The outer shaft 40 and the grinding motor 35 are driven by a belt. The inner shaft 39 and the outer shaft 40 are key-connected along the axial direction to realize the transmission of rotational torque, that is, the outer shaft 40 can drive the inner shaft 39 to rotate. In addition, the inner shaft 39 can also move along the axial direction in the outer shaft 40, thereby driving the center grinding disc 37 to extend out of the outer ring grinding disc 38.

[0092] Based on the above embodiment, an external force needs to be applied to enable the inner shaft 39 to move along the axial direction. Fig.12 At one end of the outer shaft 40 away from the outer ring grinding disc 38, the inner diameter of the outer shaft 40 is larger than the outer diameter of the inner shaft 39, and an annular groove capable of accommodating the inner shaft 39 is formed between the outer shaft 40 and the inner shaft 39. A return spring 41 is sleeved on the inner shaft 39 and the return spring 41 is compressed in the annular groove by installing a positioning end cover 42 at the end of the inner shaft 39, that is, one end of the return spring 41 acts on the outer shaft 40, and the other end acts on the positioning end cover 42, and on one side of the positioning end cover 42, the ejection motor 44 drives the ejection cam 43 to rotate, and the ejection cam 43 abuts against the positioning end cover 42, so that the inner shaft 39 moves in the axial extension direction. When the inner shaft 39 moves, the return spring 41 is compressed and the ejection cam 43 continues to rotate. When the short diameter side abuts against the positioning end cover 42, under the action of the return spring 41, the inner shaft 39 retracts into the outer shaft 40.

[0093] Based on the above embodiments, see Fig.13 and Fig.15 A reference plate 45 is installed on the head frame 26 or the tail frame 27 of the clamping assembly 3, and a detection probe 47 is installed on the grinding frame body 34. The detection probe 47 can move toward the reference plate 45 driven by the support plate 46. The support plate 46 is movably arranged on the grinding frame body 34. Before grinding, the detection probe 47 is used to abut against the surface of the reference plate 45, and then the detection probe 47 is used to abut against the surface to be ground of the silicon rod, so as to obtain the grinding amount of the silicon rod.

[0094] The present invention also proposes a grinding machine, which uses the grinding assembly in the above embodiment as a main component, and is assisted by a loading component 49, a unloading component 51 and a transfer component 50. The loading component 49 and the unloading component 51 are located on the side of the grinding assembly, and the transfer component 50 can transport the silicon rods between the three workstations of the loading component 49, the grinding assembly and the unloading component 51, thereby realizing the position movement of the silicon rods.

[0095] Specifically, before grinding, the grinding assembly is first adaptively debugged according to the type and specifications of the silicon rod, and then the silicon rod is loaded and placed on the loading assembly 49. The loading assembly 49 can make preliminary adjustments to the initial positioning and posture of the silicon rod, and can also detect whether the size of the silicon rod is a specification that is compatible with the grinding assembly to avoid processing errors. After the preliminary adjustment is completed, the silicon rod needs to be transferred to the grinding assembly for grinding. The transfer assembly 50 is described below in combination with two embodiments.

[0096] See also Fig.14 In one embodiment, a gantry frame 56 is installed on the bed 48 of the grinder, and a transfer robot 57 is movably arranged on the crossbeam of the gantry frame 56. The transfer robot 57 moves to cover the loading component 49, the grinding assembly and the unloading component 51. The robot transports the silicon rod through two claws 58 that can be brought together or opened. A right-angle notch 59 is opened on the claw 58. The right-angle notches 59 on the two claws 58 are combined to form a vertically placed rhombus, which improves the stability of clamping the silicon rod. The silicon rod is transferred by the transfer robot 57.

[0097] See also Figure 3 and Fig.15 Another embodiment of the transfer component 50 is that a column frame 52 is installed on the bed 48 of the grinder, and the transfer seat 54 moves on the column frame 52. The transfer screw 53 is driven to rotate by the transfer motor 55. The transfer screw 53 is threadedly connected to the transfer seat 54, and the transfer screw 53 drives the transfer seat 54 to move. The transfer seat 54 can move on the column frame 52 with the help of a guide rail. The movement range of the transfer seat 54 can cover the grinding range of the grinding component 4. The clamping component 3 is installed on the transfer seat 54, and the loading component 49 and the unloading component 51 move on the bed 48. When loading is required, the loading component 49 moves to the bottom of the column frame 52, and the transfer seat 54 moves the clamping component 3 to the top of the loading component 49, clamps the silicon rod and moves it to the side of the grinding component 4 for grinding. When the grinding process is completed, the unloading component 51 moves to the bottom of the column frame 52, and the transfer seat 54 transfers the ground silicon rod to the top of the unloading component 51, thereby completing the unloading.

[0098] The present invention also provides a grinding method of a grinding machine, referring to Fig.16 , including the following steps:

[0099] S100: Install the clamping end of the matching model according to the specifications of the silicon rod;

[0100] S200: Preliminary position correction of the silicon rods is performed through the loading assembly 49 to detect whether the specifications of the silicon rods meet the processing requirements;

[0101] S210: If the processing requirements are not met, the equipment will alarm;

[0102] S220: If the processing requirements are met, the transfer assembly 50 transfers the silicon rod to the clamping assembly 3 and clamps the silicon rod;

[0103] S300: the clamping assembly 3 adjusts the silicon rod to the 0° surface, the detection probe 47 is calibrated, and then the detection probe 47 detects the 0° surface to determine the grinding amount of the plane, and the grinding assembly 4 uses the rough grinding disc to perform rough grinding on the 0° surface in the form of a burr;

[0104] S400: The clamping assembly 3 clamps the silicon rod and rotates it 90°. The detection probe 47 detects the surface to be ground to determine the surface grinding amount. The grinding assembly 4 uses the rough grinding disc to perform rough grinding on the surface to be ground in the form of a shaving knife. The clamping assembly 3 rotates the silicon rod 90° in sequence and performs rough grinding on the remaining surfaces.

[0105] S500: the clamping assembly 3 clamps the silicon rod and rotates it 45°, the detection probe 47 detects the edge and determines the chamfer grinding amount, the grinding assembly 4 uses the rough grinding disc to perform rough grinding on the edge in a chamfering manner, and then uses the fine grinding disc to perform fine grinding in a forward manner, the clamping assembly 3 rotates the silicon rod 90° in sequence, and grinds the remaining edges;

[0106] S600: the clamping assembly 3 clamps the silicon rod and rotates it 45°, the grinding assembly 4 uses the fine grinding disc to finely grind the 0° surface in a forward direction, the clamping assembly 3 rotates the silicon rod 90° in sequence, and finely grinds the remaining surfaces;

[0107] S700: The transfer assembly 50 transfers the ground silicon rod to the unloading assembly 51 to complete the grinding process of the silicon rod.

[0108] Through the above embodiments, both half-rod and whole-rod silicon rods can be ground, and the grinding disc composite processing is adopted, which is more efficient. The combined grinding method of grinding the plane and chamfer separately achieves a smaller processing margin difference between the grinding surfaces and a higher level of roughness of the grinding surface.

[0109] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. A grinding assembly, characterized in that: The grinding assembly comprises: A clamping assembly, the clamping assembly comprising a detachable clamping end, and two clamping ends are used to clamp the workpiece to be ground; A grinding assembly, the grinding assembly comprising a grinding disc, the grinding disc being located on one side of the workpiece to be ground; The clamping assembly and / or the grinding assembly can be moved to generate relative movement between the grinding disc and the workpiece to be ground.

2. The grinding assembly according to claim 1, characterized in that: The clamping end includes a first chuck and a second chuck, the first chuck is a floating chuck, the second chuck is a buffer chuck, a first give-way section is provided on the first chuck, a second give-way section is provided on the second chuck, the length of the first give-way section is greater than the length of the second give-way section and is not less than the diameter of the grinding disc, the first chuck and the second chuck are a group, the first chuck and the second chuck have multiple groups, the end areas of the first chuck and the second chuck are smaller than the end face of the workpiece to be ground, and the end areas of the multiple groups of the first chuck and the second chuck are different.

3. The grinding assembly according to claim 2, characterized in that: The first chuck includes a fixed body and a floating body, the floating body is movably connected to the fixed body, the fixed body is the first yield section, the floating body includes a chuck unit, a coupling diaphragm, a wear-resistant copper pad and a supporting steel ball, one side of the coupling diaphragm is connected to the chuck unit, and the other side is connected to the fixed body, the supporting steel ball is arranged between the chuck unit and the fixed body, there are two wear-resistant copper pads and they are respectively arranged on the fixed body and the chuck unit, the wear-resistant copper pad abuts against the supporting steel ball, the chuck unit includes a chuck body and a height-fixing clamping head arranged on the end face of the chuck body, and there are multiple height-fixing clamping heads and they are arranged in an array on the end face of the chuck body.

4. The grinding assembly according to claim 3, characterized in that: The buffer chuck includes a clamping disk and a buffer clamping head floatingly arranged on the clamping disk, the buffer clamping heads are multiple and arranged in an array on the end surface of the clamping disk, the clamping disk is a second yielding section, a buffer blind hole is arranged on the clamping disk, the buffer clamping head is slidably arranged in the buffer blind hole, the buffer chuck also includes a retaining ring and a buffer spring, the middle diameter of the buffer clamping head is larger than the diameter at both ends, the buffer spring is sleeved on one end of the buffer clamping head and is located in the buffer blind hole, one end of the buffer spring abuts against the bottom of the buffer blind hole, and the other end abuts against the buffer clamping head, the retaining ring is sleeved on the other end of the buffer clamping head and is threadedly connected to the inner wall of the buffer blind hole, the buffer chuck also includes a wear-resistant sleeve, the wear-resistant sleeve is arranged in the buffer blind hole, and the buffer clamping head passes through the wear-resistant sleeve.

5. The grinding assembly according to claim 4, characterized in that: The clamping assembly also includes a clamping frame main body and a mounting frame arranged on the clamping frame main body, there are two mounting frames and at least one of them is movably arranged on the clamping frame main body, the clamping end is arranged on the mounting frame, the mounting frame includes a head frame and a tail frame, the first chuck is rotatably arranged on the head frame, the second chuck is rotatably arranged on the tail frame, the tail frame is movably arranged on the clamping frame main body, and the head frame is fixedly arranged at one end of the clamping frame main body.

6. The grinding assembly according to claim 5, characterized in that: The clamping assembly also includes a feed motor, a feed screw, a linear guide and a feed slide, the linear guide is arranged on the clamping frame body, the feed slide is slidably arranged on the linear guide, the tail stock is arranged on the feed slide, the feed screw is threadedly connected to the feed slide, the feed motor drives the feed screw to drive the feed slide to move, and the clamping assembly also includes a head motor and a tail motor, the head motor is arranged on the head stock, the tail motor is arranged on the tail stock, the head motor drives the first chuck to rotate, and the tail motor drives the second chuck to rotate.

7. The grinding assembly according to claim 6, characterized in that: The grinding disc is arranged obliquely, and the angle between the grinding disc and the surface to be ground of the workpiece to be ground opens toward the first yielding section. The grinding assembly also includes a grinding frame main body, a grinding motor and a grinding shaft arranged on the grinding frame main body. The grinding motor is connected to the grinding shaft with a belt transmission, and the grinding shaft drives the grinding disc to rotate. The grinding disc includes a central grinding disc and an outer ring grinding disc. The central grinding disc can be telescopically arranged in the outer ring grinding disc. The central grinding disc is a coarse grinding disc and the outer ring grinding disc is a fine grinding disc, or the central grinding disc is a fine grinding disc and the outer ring grinding disc is a coarse grinding disc.

8. The grinding assembly according to claim 7, characterized in that: The grinding shaft comprises an inner shaft and an outer shaft, the inner shaft key is connected to the inside of the outer shaft, the outer shaft is rotatably arranged on the grinding frame body and is connected to the grinding motor belt transmission, the outer shaft is connected to the outer ring grinding disc, the inner shaft is connected to the center grinding disc, the inner shaft is telescopically arranged in the outer shaft, the grinding assembly also comprises a reset spring, a positioning end cover, an ejection cam and an ejection motor, the reset spring is sleeved on the inner shaft, the positioning end cover is arranged at the end of the inner shaft away from the center grinding disc, one end of the reset spring acts on the inner wall of the outer shaft, and the other end acts on the positioning end cover, the ejection motor is arranged on the grinding frame body, and the ejection cam is arranged on the output end of the ejection motor and abuts against the positioning end cover.

9. The grinding assembly according to claim 8, characterized in that: The clamping assembly also includes a reference plate arranged on the headstock or the tailstock, and the grinding assembly also includes a support plate and a detection probe movably arranged on the grinding frame body. The detection probes are multiple and evenly spaced on the support plate, and one end of the detection probe is directed toward the workpiece to be ground.

10. A grinding machine, characterized in that: The grinding machine includes a bed and a grinding assembly according to any one of claims 1 to 9 arranged on the bed, the grinding assembly includes the clamping assembly and the grinding assembly, the grinding machine also includes a loading assembly, a transfer assembly and a unloading assembly, the loading assembly and the unloading assembly are arranged on the sides of the grinding assembly, and the transfer assembly is arranged on the bed for transferring the workpiece to be ground from the loading assembly to the unloading assembly via the grinding assembly.

11. The grinding machine according to claim 10, characterized in that The transfer assembly includes a column frame, a transfer screw, a transfer seat and a transfer motor arranged on the bed. The transfer screw is arranged on the column frame, the transfer seat is threadedly connected to the transfer screw and the bottom of the transfer seat is connected to the clamping assembly, the transfer motor drives the transfer seat to move along the axial direction of the transfer screw, and the loading assembly and the unloading assembly are movably arranged on the bed and alternately moved to the bottom of the column frame.

12. The grinding machine according to claim 11, characterized in that The transfer assembly includes a gantry frame arranged on the bed and a transfer robot movably arranged on the gantry frame. The claws of the two transfer robots are a group and move toward each other. The claws of the transfer robots are provided with right-angle notches.

13. A grinding method for a grinding machine, characterized in that: The grinding machine comprises a feeding assembly, a transfer assembly, a grinding assembly, and a feeding assembly, wherein the grinding assembly comprises a clamping assembly and a grinding assembly, wherein the clamping assembly comprises a detachable clamping end, and the grinding assembly comprises a grinding disc; The grinding method comprises: The clamping end adapted to the workpiece to be ground is replaced according to its specifications, the two clamping ends clamp the workpiece to be ground and adjust its grinding position, the grinding assembly moves or the clamping assembly moves to make the grinding disc and the workpiece to be ground move relative to each other, and selectively perform slant grinding or forward grinding.

14. The grinding method of a grinding machine according to claim 13, characterized in that: In the step of "the two clamping ends clamp the workpiece to be ground and adjust its grinding position", "the two clamping ends adjust their grinding positions" includes: By rotating the first chuck and the second chuck, the grinding surface of the workpiece is adjusted to a vertical state and calibrated as the 0° surface. Based on this surface, the first chuck and the second chuck are selectively rotated 45° or 90° according to the processing conditions of the grinding surface.

15. The grinding method of a grinding machine according to claim 14, characterized in that: The step of "the grinding assembly moves or the clamping assembly moves so that the grinding disc and the workpiece to be ground move relative to each other, and selectively performs sideways grinding or sideways grinding" includes: By adjusting the angle formed between the grinding disc and the workpiece to be ground, the grinding assembly moves or the clamping assembly moves to make the grinding disc and the workpiece to be ground move relative to each other, the 0° surface and other surfaces to be ground parallel or perpendicular to the 0° surface are roughly ground by grit grinding according to grinding requirements, and then the edges of the workpiece to be ground where the surfaces to be ground intersect are chamfered and roughly ground by grit grinding, and then fine ground by down-cut grinding, and finally the 0° surface and other surfaces to be ground parallel or perpendicular to the 0° surface are fine ground by down-cut grinding according to grinding requirements.

Images