Abnormal positioning method and device for wire net cutting machine, storage medium, equipment and product

Abstract

The invention relates to the technical field of wire net cutting, and particularly provides a wire net cutting machine abnormity positioning method and device, a storage medium, equipment and a product, and the method can comprise the steps that in the silicon rod cutting process of a wire net cutting machine, relevant parameters automatically modified by the cutting technology are obtained, the associated parameters comprise the specification of a cut silicon rod, the serial number of a machine, modification parameters, the number of times of modification and modification time; carrying out statistics on the related parameters modified by the cutting process to obtain a statistical result; and on the basis of the statistical result, abnormity of the wire net cutting machine is positioned according to the machine number, and the abnormity is caused by the cutting process, cutting auxiliary materials or the wire net cutting machine. According to some embodiments of the invention, the abnormity of the wire net cutting machine can be quickly positioned through the number of process modification times, and the efficiency is high.

Description

Technical Field

[0001] The present application relates to the field of wire mesh cutting technology, and in particular to a method, device, storage medium, equipment and product for abnormal positioning of a wire mesh cutting machine. Background Art

[0002] The wire mesh cutter is a machine commonly used for cutting silicon rods, and diamond wire is often used as a cutting tool. The wire mesh cutter may have abnormalities during operation due to various reasons. At present, the cutting process can usually be automatically adjusted according to abnormal conditions that occur during the operation of the wire mesh cutter to ensure the continuous progress of the cutting work. However, if the wire mesh cutter frequently modifies the cutting process, it may be that there is an abnormality in the wire mesh cutter itself. However, the current technology can only determine whether the wire mesh cutter has an abnormality by stopping the machine for maintenance, which will undoubtedly reduce the working efficiency of the wire mesh cutter.

[0003] Therefore, how to provide a technical solution for an efficient method for locating abnormalities of a wire mesh cutting machine has become a technical problem that needs to be solved urgently. Summary of the invention

[0004] Some embodiments of the present application aim to provide a method, device, storage medium, equipment and product for abnormal positioning of a wire mesh cutting machine. Through the technical solution of the embodiments of the present application, the abnormal positioning of the wire mesh cutting machine can be achieved by automatically modifying relevant parameters of the cutting process, which is both efficient and accurate.

[0005] In a first aspect, some embodiments of the present application provide a method for locating abnormalities of a wire mesh cutting machine, comprising: in the process of the wire mesh cutting machine cutting silicon rods, obtaining associated parameters of the cutting process automatically modified, wherein the associated parameters include: cutting silicon rod specifications, machine number, modification parameters, number of modifications and modification time, and the modification parameters include: parameter type and parameter data; statistics are performed on the associated parameters of the cutting process modification to obtain statistical results; based on the statistical results, locating the abnormality of the wire mesh cutting machine according to the machine number, wherein the abnormality is caused by the cutting process, cutting auxiliary materials or the wire mesh cutting machine itself.

[0006] Some embodiments of the present application can locate the abnormality of the wire mesh cutting machine by obtaining the related parameters automatically modified by the cutting process during the cutting process, and then statistically analyzing the related parameters. The embodiments of the present application can locate the abnormality of the wire mesh cutting machine by the related parameters automatically modified by the cutting process, which is both efficient and accurate.

[0007] In some embodiments, the triggering condition for automatically modifying the cutting process includes: the wire net of the wire net cutting machine has at least one of a wire bow abnormality, a wire parallel abnormality, a wire jump abnormality, and a wire break abnormality.

[0008] Some embodiments of the present application achieve automatic modification of the process by triggering automatic modification operations of the cutting process under various abnormal conditions.

[0009] In some embodiments, the associated parameters of the cutting process modification are counted to obtain statistical results, including: fixing the dimensions of the wire mesh cutting machine and the silicon rod, taking the auxiliary material type of any auxiliary material as a variable, and keeping the other auxiliary material types unchanged, to obtain the associated parameters under different auxiliary material types; or, keeping the auxiliary material type of any auxiliary material unchanged, taking the auxiliary material parameters of any auxiliary material as variables, to obtain the associated parameters; counting the associated parameters to obtain the statistical results, wherein the statistical results are represented by statistical charts or statistical tables; the statistical results include process modification results.

[0010] Some embodiments of the present application use a control variable method to perform statistics on process modification results to obtain statistical results, which can achieve accurate positioning of abnormalities in the wire mesh cutting machine.

[0011] In some embodiments, the auxiliary materials include cutting wires, groove wheels, coolants, guide wheels, material seats, material plates, stick glue, plate glue, resin plates and rubber pulleys; the auxiliary material types include: model, factory batch and manufacturer.

[0012] In some embodiments, based on the statistical results, locating the abnormality of the wire mesh cutting machine corresponding to the machine number includes: comparing the process modification results in the statistical results with a preset threshold value to confirm whether any of the auxiliary materials has an abnormality, so as to locate the abnormality of the wire mesh cutting machine.

[0013] Some embodiments of the present application compare the process modification results with preset thresholds to confirm the abnormalities existing in the wire mesh cutting machine, thereby achieving rapid and accurate positioning of the abnormalities.

[0014] In some embodiments, the method further comprises: optimizing the modification parameters of the automatic modification of the cutting process based on the statistical results.

[0015] Some embodiments of the present application optimize the modification parameters of the cutting process automatically modified through statistical results, reduce the occurrence of abnormal situations caused by inaccurate automatic modification parameters, and allow the wire mesh cutting machine to work normally.

[0016] In a second aspect, some embodiments of the present application provide a device for locating abnormalities of a wire mesh cutting machine, comprising: an acquisition module, used to acquire associated parameters of automatic modification of the cutting process during the process of the wire mesh cutting machine cutting silicon rods, wherein the associated parameters include: cutting silicon rod specifications, machine number, modification parameters, number of modifications and modification time, and the modification parameters include: parameter type and parameter data; a statistical module, used to count the associated parameters of the cutting process modification to obtain statistical results; a positioning module, used to locate the abnormality of the wire mesh cutting machine corresponding to the machine number based on the statistical results, wherein the abnormality is caused by the cutting process, cutting auxiliary materials or the wire mesh cutting machine itself.

[0017] In a third aspect, some embodiments of the present application provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, can implement the method described in any embodiment of the first aspect.

[0018] In a fourth aspect, some embodiments of the present application provide an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor can implement a method as described in any embodiment of the first aspect when executing the program.

[0019] In a fifth aspect, some embodiments of the present application provide a computer program product, wherein the computer program product comprises a computer program, wherein the computer program, when executed by a processor, can implement the method described in any embodiment of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of some embodiments of the present application, the drawings required for use in some embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 System diagram for abnormal positioning of a wire mesh cutting machine provided for some embodiments of the present application;

[0022] Figure 2 One of the flow charts of the method for locating abnormality of a wire mesh cutting machine provided in some embodiments of the present application;

[0023] Figure 3 A bar chart of process modification results of steel wire categories provided for some embodiments of the present application;

[0024] Figure 4A bar chart showing the statistical results of machine modification rates provided in some embodiments of the present application;

[0025] Figure 5 A second flow chart of a method for locating abnormality of a wire mesh cutting machine provided in some embodiments of the present application;

[0026] Figure 6 A block diagram of the composition of an apparatus for abnormal positioning of a wire mesh cutting machine provided in some embodiments of the present application;

[0027] Figure 7 A schematic diagram of an electronic device is provided for some embodiments of the present application. DETAILED DESCRIPTION

[0028] The technical solutions in some embodiments of the present application will be described below in conjunction with the drawings in some embodiments of the present application.

[0029] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0030] In the related art, the working parameters of the diamond wire cutting device can be automatically adjusted through the detection mechanism and the control system during the operation of the wire mesh cutting machine. Specifically, the detection mechanism is used to detect the state parameters of the wire diamond cutting device; the control system is respectively connected to the detection mechanism and the wire cutting mechanism for communication, and the control system can adjust the working parameters of the wire cutting mechanism according to the state parameters. Through the cooperation of the detection mechanism and the control system, the working parameters of the diamond wire cutting device can be automatically adjusted according to the current state parameters of the diamond wire cutting device to avoid the influence of the difference in the quality of the silicon rod and the quality of the electroplated diamond wire on the cutting quality. However, if the working parameters are frequently adjusted during the cutting process, it may be that some auxiliary materials in the wire mesh cutting machine are abnormal. However, the prior art cannot confirm whether the wire mesh cutting machine has an abnormality by automatically adjusting the parameters.

[0031] In view of this, some embodiments of the present application provide a method for locating abnormalities of a wire mesh cutter, in which the associated parameters of the automatic modification of the cutting process during the process of the wire mesh cutter cutting silicon rods can be counted and analyzed to locate whether the abnormality of the wire mesh cutter is caused by the cutting process or the cutting auxiliary materials. Some embodiments of the present application can detect and locate abnormalities of the wire mesh cutter through automatic process modification, with a wide detection range, which improves the comprehensiveness and timeliness of the detection and ensures the working efficiency of the wire mesh cutter.

[0032] The following is combined with Figure 1The overall composition structure of the system for abnormal positioning of a wire mesh cutting machine provided by some embodiments of the present application is exemplified.

[0033] like Figure 1 As shown, some embodiments of the present application provide a system for locating abnormalities of a wire mesh cutting machine, and the system for locating abnormalities of a wire mesh cutting machine may include: a terminal 100 and a first cutting machine 110, a second cutting machine 120...the Nth cutting machine. The terminal 100 may establish a communication connection with the first cutting machine 110, the second cutting machine 120...the Nth cutting machine, so as to obtain the associated parameters of the automatic modification of the cutting process of the first cutting machine 110, the second cutting machine 120...the Nth cutting machine during the cutting process. Afterwards, the terminal 100 may perform statistics and analysis on the associated parameters of the automatic modification of the cutting process, and locate the abnormalities of the wire mesh cutting machine.

[0034] In some embodiments of the present application, the number of wire mesh cutting machines can be set according to actual needs, and the present application does not make specific restrictions here. The terminal 100 can be a mobile terminal or a non-portable computer terminal, or the terminal 100 can be a monitoring module, unit or controller connected to each wire mesh cutting machine; as long as the terminal 100 can achieve the above functions, the embodiments of the present application do not make specific restrictions on the type of the terminal 100.

[0035] The following is combined with Figure 2 The implementation process of abnormal positioning of a wire mesh cutting machine performed by the terminal 100 provided in some embodiments of the present application is exemplarily described.

[0036] Please see attached Figure 2 , Figure 2 A flow chart of a method for locating abnormality of a wire mesh cutting machine provided in some embodiments of the present application, the method for locating abnormality of a wire mesh cutting machine may include:

[0037] S210, in the process of cutting silicon rods by the wire mesh cutting machine, obtaining the associated parameters of the cutting process automatically modified, wherein the associated parameters include: cutting silicon rod specifications, machine number, modification parameters, modification times and modification time, and the modification parameters include: parameter type and parameter data.

[0038] For example, in some embodiments of the present application, during the process of cutting silicon rods, the wire mesh cutter obtains the associated parameters of the wire mesh cutter that are monitored by the wire mesh monitoring system and automatically modifies the cutting process. Among them, when automatically modifying the cutting process, the feed speed of the silicon rod cutting, the amount of wire mesh retraction and release (as a specific example of the parameter type and parameter data in the modification parameters), etc. can be adjusted. The associated parameters may include: the machine number of the specific wire mesh cutter, the number of modification processes (as a specific example of the number of modification times), the modification process time (as a specific example of the modification time), etc. The associated parameters can be expanded according to the actual application scenario, and the embodiments of the present application are not limited to this.

[0039] In some embodiments of the present application, the triggering condition for automatic modification of the cutting process includes: the wire mesh of the wire mesh cutting machine has at least one of a wire bow abnormality, a wire paralleling abnormality, a wire jump abnormality and a wire break abnormality.

[0040] For example, in some embodiments of the present application, during the silicon rod cutting process, by setting relevant rules, the equipment can autonomously determine if an abnormality has occurred, and find relevant parameters to automatically modify the cutting process. For example, the wire network monitoring system can monitor the wire network in real time to confirm whether there is an abnormality in the wire network. For example, by real-time monitoring of the cutting wire bow value of the wire network, when the cutting wire bow value exceeds the preset threshold (that is, the judgment rule for the wire bow abnormality), the cutting process is automatically modified to reduce the risk of wire breakage. Alternatively, by real-time monitoring of the wire network for abnormalities such as wire breakage, wire jumper or wire paralleling, the cutting process can also be automatically modified to ensure that the wire network cutting machine can continue to work normally.

[0041] S220, performing statistics on the associated parameters of the cutting process modification to obtain statistical results.

[0042] For example, in some embodiments of the present application, statistics are collected on the associated parameters in the above-mentioned automatic modification of the cutting process to obtain statistical results. For example, statistics are collected on the machine number, modification parameters, modification times, modification time, etc. of each automatic modification of the cutting process to determine the statistical results.

[0043] In some embodiments of the present application, S220 may include: fixing the size of the wire mesh cutting machine and the silicon rod, taking the auxiliary material type of any auxiliary material as a variable, and keeping the other auxiliary material types unchanged, to obtain the associated parameters under different auxiliary material types; or, keeping the auxiliary material type of any auxiliary material unchanged, taking the auxiliary material parameter of any auxiliary material as a variable, to obtain the associated parameters; performing statistics on the associated parameters to obtain the statistical results, wherein the statistical results are represented by statistical charts or statistical tables; the statistical results include process modification results. Among them, the auxiliary materials include: cutting wire, groove wheel, coolant, guide wheel, material seat, material plate, stick glue, plate glue, resin plate and rubber pulley; the auxiliary material types include: model, factory batch and manufacturer.

[0044] For example, in some embodiments of the present application, in actual production, the wire mesh cutting machine itself and the different auxiliary materials that make up the wire mesh cutting machine may come from different manufacturers, different models and different production batches. These factors may have a certain impact on the working process of the wire mesh cutting machine. Therefore, in this embodiment, the control variable method is used to statistically analyze the associated parameters of the automatic modification of the cutting work of multiple wire mesh cutting machines during the cutting process to obtain statistical results. For example, the machine of the wire mesh cutting machine (that is, all machine models, production batches and manufacturers are consistent) and the size of the cut silicon rod are fixed, and the steel wire category (as a specific example of the auxiliary material type) of the steel wire (that is, the cutting wire, as a specific example of any auxiliary material) is used as a variable. When other auxiliary material types and parameters are the same (for example, the wire mesh cutting machine belongs to the same batch of a manufacturer, the groove wheel belongs to the same batch of a manufacturer, etc.), the associated parameters are obtained for statistics, and the statistics are obtained within a preset time period as follows: Figure 3 The bar chart of the steel wire category process modification results shown in FIG. 1 is a specific example of the statistical results. Specifically, multiple cutting machines use steel wires of different steel wire types for cutting, and statistics are given for the different types of steel wires (i.e. Figure 3 The process modification results (i.e. Figure 3 For another example, taking the machine model of the wire mesh cutting machine as a variable, and the other auxiliary material types and auxiliary material parameters being the same, the associated parameters of the automatic modification of the cutting process within a preset time period are statistically obtained as follows: Figure 4 The machine modification rate statistics are shown. Figure 4 It can be clearly seen that the machine models with the highest modification rate. In other scenarios, you can also fix any auxiliary material type, change the auxiliary material parameters of any auxiliary material type, and calculate the impact of auxiliary material parameters on the cutting process, so as to set appropriate auxiliary material parameters later.

[0045] S230, based on the statistical result, locate the abnormality of the wire mesh cutting machine corresponding to the machine number, wherein the abnormality is caused by the cutting process, cutting auxiliary materials or the wire mesh cutting machine itself.

[0046] For example, in some embodiments of the present application, by analyzing the data in the statistical chart or statistical table obtained above, it is possible to locate which component of the wire mesh cutting machine has an abnormality (i.e., an abnormality caused by cutting auxiliary materials), or an abnormality in the built-in modification process (i.e., an abnormality caused by the cutting process), or an abnormality in the wire mesh cutting machine itself, etc. It should be understood that there may be many factors causing cutting abnormalities, and the embodiments of the present application are not limited thereto.

[0047] In some embodiments of the present application, S230 may include: comparing the process modification result in the statistical result with a preset threshold value to confirm whether any of the auxiliary materials is abnormal, so as to locate the abnormality of the wire mesh cutting machine.

[0048] For example, in some embodiments of the present application, a preset threshold can be set. When the process modification rate (as a specific example of the process modification result) exceeds the preset threshold, the auxiliary material or machine is considered abnormal. The process modification rate represents the proportion of modifications that occurred within the preset period to the entire time period. For example, statistics are made on whether the cutting process is automatically modified within each preset period. There are a total of 10 time periods, and modifications were made in 8 periods, so the process modification rate is 80%.

[0049] Alternatively, in another embodiment, when controlling the same variable, the number of modifications is generally 6 times, and the number of process modifications generated by the auxiliary materials, auxiliary material parameters or machine as variables (as another specific example of process modification results) exceeds a preset threshold (for example, the preset threshold is 18 times), then it is considered that a parameter of the auxiliary material is abnormal.

[0050] It should be noted that the method for characterizing the process modification results can be flexibly selected and expanded, and the embodiments of the present application are not limited thereto.

[0051] by Figure 3 Taking the statistical results shown in the figure as an example, for example, the preset threshold is 60%, and it can be seen that the process modification rate is 80% when the steel wire model is Yuanshi 30. At this time, it can be confirmed that the cutting effect of this steel wire is poor and there is an abnormality. In the later stage, the steel wire can be used as little as possible or not used for cutting. For another example, Figure 4As shown, with the machine model as a variable, the process modification rate can be used to count which type (i.e. model) of wire mesh cutting machine has an abnormality, so that the wire mesh cutting machine of this machine model can be used as little as possible or not at all for cutting in the future. If the process modification rate meets the preset threshold, it is considered that there is a problem with the parameter setting of the automatic modification of the cutting process, and the cutting parameters during the automatic modification of the cutting process need to be optimized.

[0052] In some embodiments of the present application, the method for locating abnormalities of a wire mesh cutting machine may further include: optimizing the modification parameters of the automatic modification of the cutting process based on the statistical results.

[0053] For example, in some embodiments of the present application, the cutting process modification parameters in the wire mesh cutting machine can be optimized through the located abnormal results to reduce abnormal situations caused by inaccurate setting of the modification process parameters.

[0054] The following is combined with Figure 5 The specific process of abnormal positioning of the wire mesh cutting machine provided by some embodiments of the present application is exemplified.

[0055] Please see attached Figure 5 , Figure 5 A flow chart of a method for abnormal positioning of a wire mesh cutting machine is provided for some embodiments of the present application.

[0056] The above process is explained below as an example.

[0057] S510, during the process of the wire mesh cutting machine cutting the silicon rod, the cutting process parameters are automatically modified when the triggering conditions are met.

[0058] S520, obtaining associated parameters for automatically modifying cutting process parameters.

[0059] S530, performing statistics on the associated parameters according to a preset time period to generate statistical results.

[0060] S540, comparing the process modification rate in the statistical result with a preset threshold value to locate the abnormality of the wire mesh cutting machine.

[0061] It can be understood that the specific implementation process of S510 to S540 can refer to the method embodiment provided above, and in order to avoid repetition, the detailed description is appropriately omitted here.

[0062] Through some of the above-mentioned embodiments of the present application, it can be seen that the method of locating abnormalities based on automatic modification of process times statistics provided by the present application can realize the rapid and accurate positioning of abnormal auxiliary materials or processes in the wire mesh cutting machine, with high efficiency and a wide and comprehensive abnormality detection range.

[0063] Please refer to Figure 6 , Figure 6The block diagram of the composition of the device for abnormal positioning of a wire mesh cutting machine provided by some embodiments of the present application is shown. It should be understood that the device for abnormal positioning of a wire mesh cutting machine corresponds to the above method embodiment and can execute each step involved in the above method embodiment. The specific functions of the device for abnormal positioning of a wire mesh cutting machine can be found in the description above. To avoid repetition, the detailed description is appropriately omitted here.

[0064] Figure 6 The device for locating abnormality of a wire mesh cutting machine includes at least one software function module that can be stored in a memory in the form of software or firmware or solidified in the device for locating abnormality of a wire mesh cutting machine, and the device for locating abnormality of a wire mesh cutting machine includes: an acquisition module 610, which is used to obtain associated parameters of automatic modification of the cutting process during the process of cutting silicon rods by the wire mesh cutting machine, wherein the associated parameters include: cutting silicon rod specifications, machine number, modification parameters, number of modifications and modification time, and the modification parameters include: parameter type and parameter data; a statistical module 620, which is used to count the associated parameters of the cutting process modification to obtain statistical results; a positioning module 630, which is used to locate the abnormality of the wire mesh cutting machine corresponding to the machine number based on the statistical results, wherein the abnormality is caused by the cutting process, cutting auxiliary materials or the wire mesh cutting machine itself.

[0065] In some embodiments of the present application, the triggering condition for automatic modification of the cutting process includes: the wire mesh of the wire mesh cutting machine has at least one of a wire bow abnormality, a wire paralleling abnormality, a wire jump abnormality and a wire break abnormality.

[0066] In some embodiments of the present application, the statistical module 620 is used to fix the size of the wire mesh cutting machine and the silicon rod, take the auxiliary material type of any auxiliary material as a variable, and keep the other auxiliary material types unchanged, to obtain the associated parameters under different auxiliary material types; or, when the auxiliary material type of any auxiliary material remains unchanged and the auxiliary material parameter of any auxiliary material is used as a variable, the associated parameters are obtained; the associated parameters are counted to obtain the statistical results, wherein the statistical results are represented by statistical charts or statistical tables; the statistical results include process modification results.

[0067] In some embodiments of the present application, the positioning module 630 is used to compare the process modification results in the statistical results with a preset threshold value to confirm whether any of the auxiliary materials is abnormal, so as to locate the abnormality of the wire mesh cutting machine.

[0068] In some embodiments of the present application, the device for abnormal positioning of the wire mesh cutting machine also includes: an optimization module (not shown in the figure), which is used to optimize the modification parameters of the automatic modification of the cutting process based on the statistical results.

[0069] In some embodiments of the present application, the auxiliary materials include: the wire mesh cutting machine and the components constituting the wire mesh cutting machine; the components include cutting wire, groove wheels, coolant, resin plate and glue; the auxiliary material types include: the models, factory batches and manufacturers of the wire mesh cutting machine and the components.

[0070] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the device described above can refer to the corresponding process in the aforementioned method, and will not be described in detail here.

[0071] Some embodiments of the present application further provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, can implement the operations of the method corresponding to any of the above methods provided in the above embodiments.

[0072] Some embodiments of the present application further provide a computer program product, which includes a computer program, wherein when the computer program is executed by a processor, it can implement the operations corresponding to any of the above methods provided in the above embodiments.

[0073] like Figure 7 As shown, some embodiments of the present application provide an electronic device 700, which includes: a memory 710, a processor 720, and a computer program stored in the memory 710 and executable on the processor 720, wherein the processor 720 can implement a method as described in any of the above embodiments when reading the program from the memory 710 through a bus 730 and executing the program.

[0074] Processor 720 can process digital signals and can include various computing structures, such as complex instruction set computer structure, reduced instruction set computer structure, or a structure that implements a combination of multiple instruction sets. In some examples, processor 720 can be a microprocessor.

[0075] The memory 710 may be used to store instructions executed by the processor 720 or data related to the execution of instructions. These instructions and / or data may include codes for implementing some or all functions of one or more modules described in the embodiments of the present application. The processor 720 of the disclosed embodiment may be used to execute instructions in the memory 710 to implement the method shown above. The memory 710 includes a dynamic random access memory, a static random access memory, a flash memory, an optical memory, or other memory known to those skilled in the art.

[0076] The above description is only an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0077] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0078] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

Claims

1. A method for abnormal positioning of a wire mesh cutting machine, characterized in that: include: In the process of cutting silicon rods by the wire mesh cutting machine, the associated parameters of the cutting process automatically modified are obtained, wherein the associated parameters include: cutting silicon rod specifications, machine number, modification parameters, modification times and modification time, and the modification parameters include: parameter type and parameter data; Performing statistics on the associated parameters of the cutting process modification to obtain statistical results; Based on the statistical results, an abnormality existing in the wire mesh cutting machine corresponding to the machine number is located, wherein the abnormality is caused by the cutting process, cutting auxiliary materials or the wire mesh cutting machine itself.

2. The method according to claim 1, characterized in that The triggering condition for automatically modifying the cutting process includes: the wire net of the wire net cutting machine has at least one of a wire bow abnormality, a wire parallel abnormality, a wire jump abnormality and a wire break abnormality.

3. The method according to claim 1 or 2, characterized in that The statistical analysis of the associated parameters of the cutting process modification to obtain statistical results includes: The sizes of the wire mesh cutting machine and the silicon rod are fixed, and the auxiliary material type of any auxiliary material is used as a variable, and the other auxiliary material types remain unchanged, and the associated parameters under different auxiliary material types are obtained; or, the auxiliary material type of any auxiliary material remains unchanged, and the auxiliary material parameter of any auxiliary material is used as a variable, and the associated parameters are obtained; The associated parameters are counted to obtain the statistical results, wherein the statistical results are represented by statistical charts or statistical tables; and the statistical results include process modification results.

4. The method according to claim 3, characterized in that The auxiliary materials include cutting wires, groove wheels, coolants, guide wheels, material seats, material plates, stick glue, plate glue, resin plates and rubber pulleys; the auxiliary material types include: model, factory batch and manufacturer.

5. The method according to claim 3, characterized in that Based on the statistical result, locating the abnormality of the wire mesh cutting machine corresponding to the machine number includes: The process modification results in the statistical results are compared with a preset threshold value to confirm whether any of the auxiliary materials is abnormal, so as to locate the abnormality of the wire mesh cutting machine.

6. The method according to any one of claims 1-2, 4-5, characterized in that: The method further comprises: Based on the statistical results, the modification parameters of the automatic modification of the cutting process are optimized.

7. A device for abnormal positioning of a wire mesh cutting machine, characterized in that: include: An acquisition module is used to acquire the associated parameters of the automatic modification of the cutting process during the process of the online mesh cutting machine cutting the silicon rod, wherein the associated parameters include: the specifications of the cutting silicon rod, the machine number, the modified parameters, the number of modifications and the modification time, and the modified parameters include: the parameter type and the parameter data; A statistical module, used for collecting statistics on the associated parameters of the cutting process modification to obtain statistical results; A positioning module is used to locate the abnormality of the wire mesh cutting machine corresponding to the machine number based on the statistical results, wherein the abnormality is caused by the cutting process, cutting auxiliary materials or the wire mesh cutting machine itself.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program executes the method according to any one of claims 1 to 6 when executed by a processor.

9. An electronic device, characterized in that: The method comprises a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the computer program executes the method according to any one of claims 1 to 6 when being run by the processor.

10. A computer program product, characterized in that The computer program product comprises a computer program, wherein the computer program executes the method according to any one of claims 1 to 6 when executed by a processor.

Images