Integrally packaged hemispherical resonator gyroscope inertial navigation structure and assembly method

Abstract

The invention provides an integrated packaging hemispherical resonator gyroscope inertial navigation structure and an assembling method.The integrated packaging hemispherical resonator gyroscope inertial navigation structure comprises a structure table body, three hemispherical resonator gyroscopes, a film getter and three accelerometers, and the structure table body is provided with three gyroscope mounting cavities and three accelerometer mounting cavities; the three gyroscope mounting cavities are distributed orthogonally, one hemispherical resonator gyroscope is mounted in any gyroscope mounting cavity in a sealing manner, and the sensitive directions of the three hemispherical resonator gyroscopes are perpendicular to one another; the inner walls of the three gyroscope mounting cavities are plated with film getters; the three accelerometer installation cavities are distributed in a mutually orthogonal mode, one accelerometer is installed in any accelerometer installation cavity in a sealed mode, and the sensitive directions of the three accelerometers are perpendicular to one another. By applying the technical scheme provided by the invention, the model error existing between the gyroscope and the accelerometer which are installed for multiple times can be effectively avoided, and the method has the characteristics of low cost, miniaturization, light weight and the like.

Description

Technical Field

[0001] The present invention relates to the field of inertial technology, and in particular to an integrated packaged hemispherical resonant gyro inertial navigation structure and an assembly method. Background Art

[0002] The hemispherical resonant gyroscope is a classic high-precision Coriolis vibration gyroscope that relies on the standing wave precession phenomenon caused by the Coriolis effect to measure the rotation vector. The hemispherical resonant gyroscope is mainly composed of a meter, a control circuit and a control algorithm. At present, the hemispherical resonant gyroscope meter is mostly a single meter independent packaging structure, which includes a hemispherical resonator, a flat electrode, a TO base, a packaging shell, a getter shell, an air nozzle, etc. At present, the hemispherical resonant gyroscope inertial navigation system is composed of a hemispherical resonant gyroscope, an accelerometer, a gyroscope control and information processing circuit, a power module and structural parts. The hemispherical resonant gyroscope and accelerometer used in the inertial navigation system are mainly presented in two structural forms: First, the hemispherical resonant gyroscope and accelerometer are all single-head independent packaging structures. Three hemispherical resonant gyroscopes and three accelerometers are orthogonally installed on the structural table, where each gyro head includes a set of getter housing, air nozzle and packaging housing, and is fastened to the structural table through the TO base flange. This structural form not only occupies a relatively large space, but also has error model differences each time the hemispherical resonant gyroscope and accelerometer flange are installed, and the reinstalled gyroscopes and accelerometers need to be reinstalled. Calibration is carried out; secondly, a combined structure of three independently packaged accelerometers and a three-axis integrated packaged hemispherical resonant gyroscope is adopted. The structural platform includes three gyroscope mounting cavities, one getter base mounting cavity, and one air nozzle mounting cavity, and the five mounting cavities are connected. This structural form effectively avoids the model error problem caused by multiple installations of the hemispherical resonant gyroscope system composed of three single heads, but cannot avoid the error caused by reinstalling the accelerometer, and its getter base and air nozzle still need to occupy a large installation space, resulting in a larger structural space for the inertial navigation system platform. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0004] According to one aspect of the present invention, an integrated packaged hemispherical resonant gyro inertial navigation structure is provided, the integrated packaged hemispherical resonant gyro inertial navigation structure comprising: a structural platform, three hemispherical resonant gyros, a thin film getter and three accelerometers, the structural platform having three gyro mounting cavities and three accelerometer mounting cavities, the three gyro mounting cavities being orthogonally distributed to each other, one hemispherical resonant gyro being sealed and mounted in any gyro mounting cavity, and the sensitive directions of the three hemispherical resonant gyros being perpendicular to each other; the inner walls of the three gyro mounting cavities are all coated with a thin film getter; the three accelerometer mounting cavities are orthogonally distributed to each other, one accelerometer being sealed and mounted in any accelerometer mounting cavity, and the sensitive directions of the three accelerometers being perpendicular to each other.

[0005] Furthermore, any hemispherical resonator gyroscope includes a hemispherical resonator, a flat electrode, a TO base and a preamplifier circuit, the flat electrode is respectively connected to the hemispherical resonator and the TO base, the TO base is connected to the preamplifier circuit, the TO base includes a main body part and a welding flange part, and the inner side surface of the welding flange of the TO base is sealed and welded to the gyroscope mounting cavity.

[0006] Furthermore, the TO base has a pin inside, and the pin runs through both inner and outer sides of the TO base. The inner side of the TO base is connected to the flat electrode through the pin, and the outer side of the TO base is connected to the preamplifier circuit through the pin.

[0007] Furthermore, a conformal step structure design is adopted inside any gyroscope mounting cavity, including a first step, a second step, a third step and a fourth step arranged in sequence: the first step is distributed in a bowl shape, and a hemispherical resonator is assembled inside the first step; the second step is distributed in a cylindrical cavity, and a flat electrode is assembled inside the second step; the third step is distributed in a cylindrical cavity, and the main body of the TO base is assembled inside the third step; the fourth step is distributed in a cylindrical cavity, and the welding flange part of the TO base is assembled inside the fourth step.

[0008] Furthermore, the inner wall of the gyroscope mounting cavity is plated with a nickel film, a gold film and a getter film in sequence.

[0009] Furthermore, the interior of any accelerometer installation cavity adopts a conformal structure design, and the interior is distributed as a cylindrical cavity, and the accelerometer is sealed and assembled in the internal position.

[0010] According to another aspect of the present invention, a method for assembling an integrated hemispherical resonant gyro inertial navigation structure is provided. The method is used to assemble the integrated hemispherical resonant gyro inertial navigation structure as described above. Specifically, the method comprises the following steps:

[0011] (1) coating the inner wall of the three gyro mounting cavities of the structural platform with a thin film getter;

[0012] (2) Assembling a hemispherical resonant gyroscope;

[0013] (3) activating the getter on the inner wall of the gyro mounting cavity;

[0014] (4) Installing the hemispherical resonant gyroscope: installing the hemispherical resonant gyroscope in the gyroscope installation cavity, and sealing the gap between the hemispherical resonant gyroscope and the gyroscope installation cavity under a vacuum state;

[0015] (5) Installing the accelerometer: In a helium-nitrogen atmosphere, install the accelerometer in the accelerometer mounting cavity, seal the gap between the accelerometer and the accelerometer mounting cavity, and complete the assembly of the integrated hemispherical resonant gyro inertial navigation structure.

[0016] Furthermore, in step (1), the structural platform is fixed in a tooling inside a coating device, and a nickel film and a gold film are first plated on the inner wall of the gyroscope mounting cavity, and then a getter film is plated.

[0017] Furthermore, in step (3), the structural table is placed in a high-temperature chamber of the eutectic furnace, the structural table is fixed with a special tooling, the eutectic furnace is evacuated, and the inner cavity of the structural table and the equipment box are degassed until the vacuum degree reaches a preset vacuum degree; the temperature of the eutectic furnace is set, and the temperature inside the box is raised to a preset activation temperature, and the getter is heated and activated to passivate and remove the getter surface. After the activation of the getter is completed, the temperature inside the box is lowered to room temperature.

[0018] Furthermore, in step (4), sealing the gap between the hemispherical resonator gyroscope and the gyroscope mounting cavity under a vacuum state specifically includes: evacuating the eutectic furnace, setting the temperature of the eutectic furnace while ensuring the vacuum degree in the eutectic furnace and the gyroscope mounting cavity of the structural platform, raising the temperature in the furnace to a preset temperature to liquefy the solder between the hemispherical resonator gyroscope and the gyroscope mounting cavity of the structural platform, and then lowering the temperature in the furnace to re-solidify the solder.

[0019] By applying the technical solution of the present invention, an integrated packaged hemispherical resonant gyro inertial navigation structure and an assembly method are provided. The hemispherical resonant gyro inertial navigation structure comprises: a structural platform, three hemispherical resonant gyros, a thin film getter and three accelerometers. The hemispherical resonant gyro and the accelerometer are directly packaged in the structural platform, which can effectively avoid the model error between multiple installations of the gyro and the accelerometer. At the same time, the thin film getter is plated on the inner wall of the gyro installation cavity to meet the vacuum use environment of the hemispherical resonant gyro, while further reducing the size of the inertial navigation structure, and has the characteristics of low cost, miniaturization and light weight. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The included drawings are used to provide a further understanding of the embodiments of the present invention, which constitute a part of the specification, are used to illustrate the embodiments of the present invention, and together with the text description, explain the principles of the present invention. Obviously, the drawings in the following description are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 The figure shows an assembly diagram of an integrated hemispherical resonant gyro inertial navigation structure provided according to a specific embodiment of the present invention.

[0022] The above drawings include the following reference numerals:

[0023] 1. Structural platform, 2. Gyro mounting cavity, 3. Accelerometer mounting cavity, 4. Thin film getter, 5. Hemispherical resonator, 6. Flat electrode, 7. TO base, 8. Preamplifier circuit, 9. Gyro mounting cavity cover, 10. Accelerometer. DETAILED DESCRIPTION

[0024] It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0026] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values.

[0027] like Figure 1As shown, according to a specific embodiment of the present invention, an integrated packaged hemispherical resonant gyro inertial navigation structure is provided, and the hemispherical resonant gyro inertial navigation structure includes: a structural platform 1, three hemispherical resonant gyros, a thin film getter 4 and three accelerometers 10, the structural platform 1 has three gyro mounting cavities 2 and three accelerometer mounting cavities 3, the three gyro mounting cavities 2 are orthogonally distributed to each other, one hemispherical resonant gyro is sealed and installed in any gyro mounting cavity 2, and the sensitive directions of the three hemispherical resonant gyros are perpendicular to each other; the inner walls of the three gyro mounting cavities 2 are all coated with the thin film getter 4; the three accelerometer mounting cavities 3 are orthogonally distributed to each other, one accelerometer 10 is sealed and installed in any accelerometer mounting cavity 3, and the sensitive directions of the three accelerometers 10 are perpendicular to each other.

[0028] By applying this configuration, an integrated packaged hemispherical resonant gyro inertial navigation structure is provided, which includes: a structural platform 1, three hemispherical resonant gyros, a thin film getter 4 and three accelerometers 10. The hemispherical resonant gyro and the accelerometer 10 are directly packaged in the structural platform 1, which can effectively avoid the model error between multiple installations of the gyro and the accelerometer 10. At the same time, the thin film getter 4 is plated on the inner wall of the gyro installation cavity 2 to meet the vacuum use environment of the hemispherical resonant gyro, while further reducing the size of the inertial navigation structure, which has the characteristics of low cost, miniaturization and light weight.

[0029] Furthermore, in the present invention, any hemispherical resonator gyroscope includes a hemispherical resonator 5, a flat electrode 6, a TO base 7 and a preamplifier circuit 8, the flat electrode 6 is respectively connected to the hemispherical resonator 5 and the TO base 7, the TO base 7 is connected to the preamplifier circuit 8, the TO base 7 includes a main body part and a welding flange part, and the inner side surface of the welding flange of the TO base 7 is sealed and welded to the gyroscope mounting cavity 2.

[0030] The welding flange of the TO base 7 is sealed and welded to the gyro mounting cavity 2, thereby meeting the vacuum packaging requirements of the hemispherical resonant gyroscope.

[0031] As a specific embodiment of the present invention, the hemispherical resonator 5 is connected to the plate electrode 6 by gluing or welding, the plate electrode 6 is connected to the TO base 7 by gluing or welding, and the TO base 7 is connected to the preamplifier circuit 8 by welding. The gap between the gyroscope mounting cavity 2 and the hemispherical resonator gyroscope can be sealed by filling an annular solder between the inner side of the welding flange of the TO base 7 and the gyroscope mounting cavity 2.

[0032] In addition, the TO base 7 may be provided with pins inside, the pins passing through both sides of the TO base 7, the inside of the TO base 7 is connected to the flat electrode 6 through the pins, and the outside of the TO base 7 is connected to the preamplifier circuit 8 through the pins.

[0033] Furthermore, in the present invention, in order to cooperate with the installation of the hemispherical resonant gyroscope, a conformal step structure design can be configured inside any gyroscope installation cavity 2, including a first step, a second step, a third step and a fourth step arranged in sequence: the first step is distributed in a bowl shape, and the hemispherical resonator 5 is assembled in its internal position; the second step is distributed in a cylindrical cavity, and the flat electrode 6 is assembled in its internal position; the third step is distributed in a cylindrical cavity, and the main body of the TO base 7 is assembled in its internal position; the fourth step is distributed in a cylindrical cavity, and the welding flange part of the TO base 7 is assembled in its internal seal.

[0034] As a specific embodiment of the present invention, the assembly clearance between the hemispherical resonator 5 and the first step of the gyroscope mounting cavity is about 1 mm; the assembly clearance between the flat electrode 6 and the second step of the gyroscope mounting cavity is about 2 mm; the assembly clearance between the main body of the TO base 7 and the third step of the gyroscope mounting cavity is less than ±0.02 mm; the cylindrical cavity of the fourth step has a diameter 2 mm wider than the TO base 7 and a height of only 1 mm, and solder and the welding flange of the TO base are assembled inside it, and the assembly clearance between the welding flange of the TO base and the fourth step of the gyroscope mounting cavity is less than ±0.02 mm.

[0035] Furthermore, in the present invention, due to the requirement of using the hemispherical resonant gyroscope in a vacuum environment, the inner walls of the three gyroscope mounting cavities 2 need to be plated with a getter film. Considering the long-term adhesion of the thin film getter 4, the inner walls of the gyroscope mounting cavity 2 can be first plated with a nickel film and a gold film, and then the getter film.

[0036] As a specific embodiment of the present invention, the inner wall of the first, second and third steps of the gyroscope installation cavity can be plated with a nickel film of about 1 μm, then plated with a gold film of about 0.5 μm, and then plated with a getter film of about 20 μm. To meet the requirements of gap sealing welding, the inner wall of the fourth step of the gyroscope installation cavity can be plated with a nickel film of about 1 μm, and then plated with a gold film of about 0.5 μm.

[0037] Furthermore, in the present invention, in order to facilitate the installation of the accelerometer 10, any accelerometer installation cavity 3 may be configured to have a conformal structure design, with the interior being a cylindrical cavity, and the accelerometer 10 is sealed and assembled in its internal position.

[0038] As a specific embodiment of the present invention, any accelerometer 10 may be configured to have an accelerometer welding flange, and the accelerometer welding flange is sealed and welded to the accelerometer installation cavity 3 .

[0039] In this embodiment, the assembly clearance between the accelerometer welding flange and the accelerometer mounting cavity 3 can be configured to be less than ±0.02 mm.

[0040] As another specific embodiment of the present invention, considering the accuracy requirement of the inertial navigation system on the accelerometer 10, any accelerometer 10 may be configured as a high-precision quartz flexible accelerometer.

[0041] The integrated packaged hemispherical resonant gyro inertial navigation structure of the present invention is not only simple in structure, but also can effectively avoid the model error caused by multiple installations of the gyro and the accelerometer. It has the characteristics of low cost, miniaturization, and light weight, and effectively reduces the cost and has a wider application space.

[0042] According to another aspect of the present invention, a method for assembling an integrated hemispherical resonant gyro inertial navigation structure is provided. The method is used to assemble the integrated hemispherical resonant gyro inertial navigation structure as described above. Specifically, the assembly method comprises the following steps:

[0043] (1) coating the inner wall of the three gyro mounting cavities 2 of the structural platform 1 with a thin film getter 4;

[0044] (2) Assembling a hemispherical resonant gyroscope;

[0045] (3) activating the getter on the inner wall of the gyro mounting cavity 2;

[0046] (4) Installing the hemispherical resonant gyroscope: installing the hemispherical resonant gyroscope in the gyroscope installation cavity 2, and sealing the gap between the hemispherical resonant gyroscope and the gyroscope installation cavity 2 under a vacuum state;

[0047] (5) Installing the accelerometer: In a helium-nitrogen atmosphere, install the accelerometer 10 in the accelerometer installation cavity 3, seal the gap between the accelerometer 10 and the accelerometer installation cavity 3, and complete the assembly of the integrated hemispherical resonant gyro inertial navigation structure.

[0048] Furthermore, in the present invention, in step (1), the structural platform 1 is fixed in a tooling inside a coating device, and a nickel film and a gold film are first plated on the inner wall of the gyroscope mounting cavity 2, and then a getter film is plated.

[0049] As a specific embodiment of the present invention, the inner wall of the gyroscope mounting cavity 2 may be plated with a nickel film of about 1 μm, then plated with a gold film of about 0.5 μm, and finally plated with a getter film of about 20 μm. Specifically, the inner wall of the first, second, and third steps of the gyroscope mounting cavity is plated with a nickel film of about 1 μm, then plated with a gold film of about 0.5 μm, and then plated with a getter film of about 20 μm. The inner wall of the fourth step of the gyroscope mounting cavity is plated with a nickel film of about 1 μm, and then plated with a gold film of about 0.5 μm.

[0050] In step (2), the steps of assembling the hemispherical resonator gyroscope specifically include: firstly installing the support column of the hemispherical resonator 5 to the center hole of the flat electrode 6, and connecting and fixing it by gluing or welding; after complete curing, aligning the pins of the TO base 7 and installing them into the pin holes of the flat electrode 6, and connecting and fixing them by gluing or welding.

[0051] In step (2), the annular solder is placed on the inner side of the welding flange of the TO base 7, the assembled hemispherical resonant gyroscope is placed in the assembly compartment of the eutectic furnace, and the hemispherical resonant gyroscope is fixed on the assembly table using a special fixing tool.

[0052] In step (3), the structural platform 1 is placed in the high temperature chamber of the eutectic furnace, the platform is fixed with a special tool, the eutectic furnace is evacuated, and the inner cavity of the platform structure and the equipment box are degassed until the vacuum degree reaches a preset vacuum degree, for example, 10 -4 Pa; set the temperature of the eutectic furnace, raise the temperature inside the box to a preset activation temperature, such as 300°C, heat and activate the getter to remove the passivation on the getter surface, and after the getter activation is completed, lower the temperature inside the box to room temperature.

[0053] In step (4), the three hemispherical resonant gyroscopes are respectively installed in the corresponding gyroscope mounting cavities 2 through the assembly table, so that the two sides of the solder are in contact with the welding flanges of the gyroscope mounting cavity 2 and the TO base 7 respectively, and the hemispherical resonant gyroscope is pressed into the gyroscope mounting cavity 2 using a special tool.

[0054] In step (4), sealing the gap between the hemispherical resonant gyroscope and the gyroscope mounting cavity 2 under vacuum specifically includes: evacuating the eutectic furnace, and ensuring that the vacuum degree in the eutectic furnace and the gyroscope mounting cavity 2 is 10 -4 Pa), set the temperature of the eutectic furnace, raise the temperature in the furnace to a preset temperature, for example, 200°C, so that the solder between the hemispherical resonator gyroscope and the platform gyroscope mounting cavity 2 is liquefied, and then lower the temperature in the furnace, for example, to 30°C, so that the solder is re-solidified.

[0055] In step (4), after sealing the gap between the hemispherical resonant gyroscope and the platform gyroscope mounting cavity 2, the pins on the outside of the TO base 7 are installed in the corresponding pin holes of the preamplifier circuit 8, and connected and fixed by soldering; the gyroscope mounting cavity cover plate 9 is installed to the outside of the gyroscope mounting cavity 2, at a position corresponding to the 1mm assembly gap of the preamplifier circuit 8, and fixed by bonding or welding.

[0056] In step (5), the structural platform 1 is placed in a glove box, which is filled with a helium-nitrogen mixed gas. The structural platform 1 is fixed with a special tooling, and the three accelerometers 10 are installed in the corresponding accelerometer mounting cavities 3 in sequence. The gap between the accelerometer 10 and the accelerometer mounting cavity 3 is sealed by welding.

[0057] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An integrated packaged hemispherical resonant gyro inertial navigation structure, characterized in that: The integrated packaged hemispherical resonant gyro inertial navigation structure comprises: a structural platform (1), three hemispherical resonant gyros, a thin film getter (4) and three accelerometers (10); the structural platform (1) has three gyro mounting cavities (2) and three accelerometer mounting cavities (3); the three gyro mounting cavities (2) are orthogonally distributed, one hemispherical resonant gyro is sealed and mounted in any one of the gyro mounting cavities (2), and the sensitive directions of the three hemispherical resonant gyros are perpendicular to each other; the inner walls of the three gyro mounting cavities (2) are all plated with the thin film getter (4); the three accelerometer mounting cavities (3) are orthogonally distributed, one accelerometer (10) is sealed and mounted in any one of the accelerometer mounting cavities (3), and the sensitive directions of the three accelerometers (10) are perpendicular to each other.

2. The integrated packaged hemispherical resonant gyro inertial navigation structure according to claim 1, characterized in that: Any hemispherical resonator gyroscope comprises a hemispherical resonator (5), a flat plate electrode (6), a TO base (7) and a preamplifier circuit (8); the flat plate electrode (6) is connected to the hemispherical resonator (5) and the TO base (7) respectively; the TO base (7) is connected to the preamplifier circuit (8); the TO base (7) comprises a body part and a welding flange part; the inner side surface of the welding flange of the TO base (7) is sealed and welded to the gyroscope mounting cavity (2).

3. The integrated packaged hemispherical resonant gyro inertial navigation structure according to claim 2, characterized in that: The TO base (7) has a plug pin inside, and the plug pin passes through both the inner and outer sides of the TO base (7). The inner side of the TO base (7) is connected to the flat electrode (6) through the plug pin, and the outer side of the TO base (7) is connected to the preamplifier circuit (8) through the plug pin.

4. The integrated packaged hemispherical resonant gyro inertial navigation structure according to claim 2, characterized in that: The interior of any gyro installation cavity (2) adopts a conformal step structure design, including a first step, a second step, a third step and a fourth step arranged in sequence: the first step is distributed in a bowl shape, and the hemispherical resonator (5) is assembled in its internal position; the second step is distributed in a cylindrical cavity, and the flat electrode (6) is assembled in its internal position; the third step is distributed in a cylindrical cavity, and the main body of the TO base (7) is assembled in its internal position; the fourth step is distributed in a cylindrical cavity, and the welding flange part of the TO base (7) is assembled in its internal position in a sealed manner.

5. The integrated packaged hemispherical resonant gyro inertial navigation structure according to claim 1, characterized in that: The inner wall of the gyroscope installation cavity (2) is plated with a nickel film, a gold film and a getter film in sequence.

6. The integrated packaged hemispherical resonant gyro inertial navigation structure according to claim 1, characterized in that: The interior of any accelerometer installation cavity (3) adopts a conformal structure design and is distributed as a cylindrical cavity, and the accelerometer (10) is sealed and assembled in its internal position.

7. An assembly method of an integrated hemispherical resonant gyro inertial navigation structure, characterized in that: The assembly method is used to assemble the integrated hemispherical resonant gyro inertial navigation structure according to claims 1 to 6. Specifically, the assembly method comprises the following steps: (1) coating the inner walls of three gyro mounting cavities (2) of the structural platform (1) with a thin film getter (4); (2) Assembling a hemispherical resonant gyroscope; (3) activating the getter on the inner wall of the gyro mounting cavity (2); (4) Installing the hemispherical resonant gyroscope: installing the hemispherical resonant gyroscope in the gyroscope installation cavity (2), and sealing the gap between the hemispherical resonant gyroscope and the gyroscope installation cavity (2) under a vacuum state; (5) Installing the accelerometer: In a helium-nitrogen atmosphere, installing the accelerometer (10) in the accelerometer installation cavity (3), sealing the gap between the accelerometer (10) and the accelerometer installation cavity (3), and completing the assembly of the integrated hemispherical resonant gyro inertial navigation structure.

8. The assembly method of the integrated packaged hemispherical resonant gyro inertial navigation structure according to claim 7, characterized in that: In step (1), the structural platform (1) is fixed in a tooling inside a coating device, and a nickel film and a gold film are first plated on the inner wall of the gyroscope mounting cavity (2), and then a getter film is plated.

9. The method for assembling the integrated packaged hemispherical resonant gyro inertial navigation structure according to claim 7, characterized in that: In step (3), the structural platform (1) is placed in a high-temperature chamber of a eutectic furnace, the structural platform (1) is fixed by using a special tool, the eutectic furnace is evacuated, and the inner cavity of the structural platform (1) and the equipment box are degassed until the vacuum degree reaches a preset vacuum degree; Set the temperature of the eutectic furnace, raise the temperature inside the box to the preset activation temperature, heat and activate the getter, and remove the passivation on the getter surface. After the getter activation is completed, lower the temperature inside the box to room temperature.

10. The assembly method of the integrated packaged hemispherical resonant gyro inertial navigation structure according to claim 7, characterized in that: In step (4), sealing the gap between the hemispherical resonator gyroscope and the gyroscope mounting cavity (2) under a vacuum state specifically comprises: evacuating the eutectic furnace, setting the temperature of the eutectic furnace while ensuring the vacuum degree in the eutectic furnace and the structural platform gyroscope mounting cavity (2), raising the temperature in the furnace to a preset temperature, liquefying the solder between the hemispherical resonator gyroscope and the structural platform gyroscope mounting cavity (2), and then lowering the temperature in the furnace to re-solidify the solder.

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