Actuator for optical image stabilization and camera module including the same
By designing an actuator in the camera module, using the combination of image sensor and heat dissipation member to realize vertical movement of the image sensor for optical image stabilization, the problem of increasing the weight of the lens module is solved, and the driving force control is difficult to be controlled, and the optical is improved Image stability accuracy and thermal performance of the camera module.
Patent Information
- Application Number
- CN202411082581.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-08-10
- Filing Date
- 2024-08-08
- Publication Date
- 2025-02-18
AI Technical Summary
As the performance of the camera module improves, the weight of the lens module increases, making it difficult to accurately control the driving force when moving the lens module for optical image stabilization.
An actuator is designed to realize vertical movement of the image sensor to perform optical image stabilization by providing an image sensor on a sensor substrate and a heat dissipation member overlapping with the image sensor in the optical axis direction. The actuator includes a fixed frame, a moving frame and a first driver that drives movement of the moving frame and the image sensor by electromagnetic force.
By moving the image sensor instead of the lens module, the driving force can be controlled more accurately, the accuracy of optical image stability can be improved, and the temperature of the image sensor can be effectively reduced through the through-silicon heat dissipation member, and the heat dissipation performance of the camera module can be improved.
Smart Images

Figure CN119485020A_ABST
Abstract
Description
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0104547 filed in the Korean Intellectual Property Office on August 10, 2023, the disclosure of which is incorporated herein in its entirety for all purposes by reference. Technical Field
[0003] The following description relates to an actuator for optical image stabilization and a camera module including the actuator. Background Art
[0004] Camera modules are used in mobile communication terminals such as tablet personal computers (PCs), laptops, and smart phones.
[0005] In addition, the camera module used in the portable electronic device is equipped with an auto focus function (AF) and an image stabilization function (OIS) to generate a high-resolution image. For example, the camera module performs focusing by moving the lens module in the optical axis (Z axis) direction, and performs optical image stabilization by moving the lens module in a direction perpendicular to the optical axis (Z axis) direction.
[0006] However, recent improvements in the performance of camera modules have resulted in an increase in the weight of the lens module, thereby creating a problem in that it is difficult to accurately control the driving force when moving the lens module for optical image stabilization.
[0007] The above information is presented as background information only to assist with understanding the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with respect to the present disclosure. Summary of the invention
[0008] The purpose of providing this summary is to introduce a selection of concepts in a concise form, and these concepts will be further described in the following detailed description. This summary is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to be used to help determine the scope of the claimed subject matter.
[0009] In a general aspect, an actuator for optical image stabilization includes: a fixed frame; a moving frame accommodated in the fixed frame and configured to move relative to the fixed frame on a plane perpendicular to an optical axis; and a sensor substrate on which an image sensor is disposed, the sensor substrate including a fixed portion coupled to the fixed frame, a moving portion including the image sensor and coupled to the moving frame, and a connecting portion disposed between the moving portion and the fixed portion to support movement of the moving portion. The moving portion includes a heat dissipation member that dissipates heat generated from the image sensor, and the heat dissipation member includes a substrate having a through hole and a conductive electrode filling the through hole.
[0010] The heat dissipation member may overlap with the image sensor in the optical axis direction.
[0011] The moving part may further include: a first layer arranged side by side with the fixed part and the connecting part in a direction perpendicular to the optical axis; a second layer having a surface provided on an upper side of the first layer and an opening penetrating the surface in the direction of the optical axis; and a third layer provided between the first layer and the second layer. The heat dissipation member may be provided in the opening of the second layer.
[0012] Each of the first layer and the third layer may have a surface including an opening, the opening of each of the first layer and the third layer penetrating the surface of each of the first layer and the third layer in the optical axis direction and overlapping with the opening of the second layer.
[0013] The heat dissipation member may further include a first extending portion extending toward the openings of the first layer and the third layer in the optical axis direction.
[0014] The moving part may further include: a first layer arranged side by side with the fixing part and the connecting part in a direction perpendicular to the optical axis; and a second layer arranged on an upper side of the first layer. The image sensor may be arranged on one side of the second layer, and the heat dissipation member may be arranged on the other side of the second layer to overlap with the image sensor.
[0015] A portion of the heat dissipation member may be disposed between the first layer and the second layer. The first layer and the second layer may be electrically connected by the heat dissipation member disposed between the first layer and the second layer.
[0016] The surface of the first layer may have an opening penetrating the surface of the first layer, the opening of the first layer being at a position overlapping with the image sensor in the optical axis direction.
[0017] The heat dissipation member may further include a first extending portion extending in the optical axis direction toward the opening of the first layer.
[0018] The actuator may further include a base disposed below the sensor substrate. A gap may be formed between the moving portion and the base in the optical axis direction.
[0019] The actuator may further include a first driver including a plurality of magnets disposed on the moving frame and a plurality of coils disposed on the fixed frame to face the plurality of magnets.
[0020] In another general aspect, a camera module includes: a lens module including a lens arranged in an optical axis direction; and an actuator for optical image stabilization configured to move an image sensor on a plane perpendicular to the optical axis. The actuator includes: a sensor substrate on which an image sensor is disposed; and a heat dissipation member disposed to overlap the image sensor in the optical axis direction. The heat dissipation member includes a substrate having a through hole and a conductive electrode filling the through hole in a thickness direction.
[0021] The sensor substrate may include a fixed portion, a moving portion configured to move relative to the fixed portion on a plane perpendicular to the optical axis, and a connecting portion disposed between the fixed portion and the moving portion to support movement of the moving portion. The moving portion may include an image sensor and a heat dissipation member.
[0022] The camera module may further include a base disposed below the sensor substrate. The heat dissipation member may further include an extension portion extending toward the base in the optical axis direction. A gap may be formed between the base and the extension portion.
[0023] The actuator may further include: a fixed frame coupled to the fixed part; a moving frame coupled to the moving part; and a first driver separately disposed in the fixed frame and the moving frame and configured to generate a driving force to move the image sensor on a plane perpendicular to the optical axis.
[0024] The camera module may further include a focus actuator configured to move the lens module in an optical axis direction.
[0025] Other features and aspects will be apparent from the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 is a perspective view of a camera module according to an embodiment of the present disclosure.
[0027] Figure 2 yes Figure 1 Schematic exploded perspective view of a camera module.
[0028] Figure 3 is an exploded perspective view of an actuator for optical image stabilization according to an embodiment of the present disclosure.
[0029] Figure 4 yes Figure 3An exploded perspective view of the driving portion of an actuator for optical image stabilization.
[0030] Figure 5 yes Figure 3 A perspective view of an actuator for optical image stabilization.
[0031] Fig. 6A It is along Figure 5 A cross-sectional view taken along line II'.
[0032] Figure 6B yes Fig. 6A Magnified view of part A.
[0033] Fig. 7A It is along Figure 5 A cross-sectional view taken along line II-II'.
[0034] Figure 7B yes Fig. 7A Magnified view of part B.
[0035] Figure 8 It is shown Figure 3 Diagram of a moving frame of an actuator for optical image stabilization.
[0036] Fig. 9 It is shown Figure 3 Diagram of the moving frame and sensor substrate of an actuator for optical image stabilization.
[0037] Fig.10 It is shown Fig. 9 Diagram of the connection state of the moving frame and the sensor substrate.
[0038] Fig.11 is an exploded perspective view of a sensor substrate according to an embodiment of the present disclosure.
[0039] Fig.12 yes Fig.11 Cross-sectional view of the sensor substrate.
[0040] Figures 13 to 15 is a cross-sectional view of a sensor substrate according to other embodiments of the present disclosure.
[0041] Fig.16 is an exploded perspective view of a focus actuator according to an embodiment of the present disclosure.
[0042] Fig.17 yes Fig.16 A stereoscopic view of the focus actuator in FIG.
[0043] Fig.18 yes Fig.16 Side view of the carrier portion of the focus actuator.
[0044] Fig.19 yes Fig.16 A perspective view of the housing of the focus actuator.
[0045] Throughout the drawings and detailed description, unless otherwise described, the same reference numerals refer to the same elements. For purposes of clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative sizes, proportions, and depictions of elements in the drawings may be exaggerated. DETAILED DESCRIPTION
[0046] Hereinafter, although examples of the present disclosure will be described in detail with reference to the accompanying drawings, it should be noted that the examples are not limited thereto.
[0047] The following specific embodiments are provided to help the reader gain a comprehensive understanding of the methods, devices and / or systems described herein. However, various changes, modifications and equivalents of the methods, devices and / or systems described herein will be apparent after understanding the present disclosure. For example, the order of operations described herein is merely an example, and except for operations that must occur in a particular order, it is not limited to the order set forth herein, but can be changed, which will be apparent after understanding the present disclosure. In addition, for greater clarity and brevity, descriptions of features known in the art may be omitted.
[0048] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways to implement the methods, devices, and / or systems described herein that will be apparent after understanding the present disclosure.
[0049] Throughout the specification, when an element such as a layer, a region, or a substrate is described as being “on,” “connected to,” or “coupled to” another element, the element may be directly “on,” “connected to,” or “coupled to” the other element, or one or more other elements may be present between the element and the other element. Conversely, when an element is described as being “directly on,” “directly connected to,” or “directly coupled to” another element, no other elements may be present between the element and the other element.
[0050] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more items; similarly, "at least one" includes any one of the associated listed items and any combination of any two or more items.
[0051] Although terms such as "first", "second" and "third" may be used herein to describe various members, components, regions, layers or portions, these members, components, regions, layers or portions are not limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer or portion from another member, component, region, layer or portion. Therefore, without departing from the teachings of the examples described herein, the first member, first component, first region, first layer or first portion mentioned in these examples may also be referred to as the second member, second component, second region, second layer or second portion.
[0052] Spatially relative terms such as "above", "above", "below", "below", etc. may be used herein for descriptive convenience to describe the relationship of one element relative to another element as shown in the accompanying drawings. In addition to covering the orientations depicted in the accompanying drawings, these spatially relative terms are intended to also cover different orientations of the device in use or operation. For example, if the device in the accompanying drawings is flipped, an element described as being "above" or "above" another element relative to the other element will be "below" or "below" the other element relative to the other element. Therefore, depending on the spatial orientation of the device, the term "above" covers both orientations of "above" and "below". The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative terms used herein should be interpreted accordingly.
[0053] The terms used herein are only used to describe various examples and are not used to limit the present disclosure. Unless the context clearly indicates otherwise, the terms "a", "an" and "the" are intended to include plural forms as well. The terms "include", "comprise" and "have" indicate the presence of the features, numbers, operations, components, elements and / or combinations thereof, but do not exclude the presence or addition of one or more other features, numbers, operations, components, elements and / or combinations thereof.
[0054] Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include variations in shapes that occur during manufacturing.
[0055] It should be noted that herein, use of the word “may” with respect to an example, such as regarding what an example may include or implement, means that there is at least one example in which such feature is included or implemented, and all examples are not limited thereto.
[0056] The features of the examples described herein may be combined in various ways that will be apparent after understanding the present disclosure. In addition, although the examples described herein have various configurations, other configurations that will be apparent after understanding the present disclosure are also possible.
[0057] Figure 1 is a perspective view of a camera module according to an embodiment of the present disclosure, and Figure 2 yes Figure 1 Schematic exploded perspective view of a camera module.
[0058] according to Figure 1 The camera module 1 of the embodiment of the present disclosure shown in FIG. 1 may be mounted on a portable electronic device. The portable electronic device may be a smart phone, a tablet PC, or the like.
[0059] Reference Figure 2 , the camera module 1 may include a lens module 700, an image sensor S, a first actuator 10, and a second actuator 20. The first actuator 10 may be an optical image stabilization actuator (OIS actuator), and the second actuator 20 may be a focus actuator (AF actuator).
[0060] The lens module 700 may include one or more lenses and a lens barrel 710 in which the lenses are installed. When the lens module 700 includes a plurality of lenses, the plurality of lenses may be installed in the lens barrel 710 in the optical axis direction (Z-axis direction). In addition, the lens module 700 may include a carrier 730 coupled to the lens barrel 710.
[0061] According to an embodiment of the present disclosure, the lens module 700 may be a moving member configured to move in the optical axis direction (Z axis direction) during focusing. The lens module 700 may be moved in the optical axis (Z axis) direction for focusing by the second actuator 20. At the same time, the lens module 700 may be a fixed member that does not move during optical image stabilization.
[0062] According to an embodiment of the present disclosure, the image sensor S may be a moving member that moves in a direction perpendicular to the optical axis (Z axis) during optical image stabilization. The image sensor S may be moved in a direction perpendicular to the optical axis (Z axis) by the first actuator 10 for optical image stabilization. That is, the camera module 1 may perform optical image stabilization by moving the image sensor S instead of the lens module 700. Since the image sensor S is relatively light compared to the lens module 700, the image sensor S may be moved with a smaller driving force, and optical image stabilization may be performed more accurately. In detail, the image sensor S may be moved in a direction perpendicular to the optical axis (Z axis) by the first actuator 10, or rotated around the optical axis (Z axis) as a rotation axis.
[0063] Figure 3 is an exploded perspective view of an actuator for optical image stabilization according to an embodiment of the present disclosure; Figure 4 yes Figure 3 An exploded perspective view of a driving portion of an actuator for optical image stabilization; Figure 5 yes Figure 3 A perspective view of an actuator for optical image stabilization; and Figure 8 yes Figure 3 Diagram of a moving frame of an actuator for optical image stabilization.
[0064] Reference Figure 3 , the first actuator 10 may include a fixed frame 100 , a moving frame 200 , a first driver 300 , a sensor substrate 400 , and a base 500 .
[0065] The fixed frame 100 may have a quadrilateral (e.g., rectangular) box shape and have an opening penetrating in the optical axis (Z-axis) direction. The fixed frame 100 may be a fixed member that does not move during focusing and optical image stabilization. The fixed frame 100 may accommodate the moving frame 200, etc. In addition, the fixed frame 100 may be coupled to the second actuator 20.
[0066] The moving frame 200 may have a quadrilateral (eg, rectangular) plate shape and have an opening penetrating in the optical axis (Z axis) direction. The infrared cut filter IRCF may be disposed on the upper side of the moving frame 200, and the sensor substrate 400 may be disposed on the lower side of the moving frame 200.
[0067] The mobile frame 200 may be accommodated in a space provided below the fixed frame 100. The mobile frame 200 may be a mobile member that moves during optical image stabilization. In an embodiment, the mobile frame 200 may move in the direction of a first axis (X axis) perpendicular to the optical axis (Z axis) and a second axis (Y axis) perpendicular to both the optical axis (Z axis) and the first axis (X axis), or may rotate around the optical axis (Z axis) as a rotation axis. That is, the mobile frame 200 may move relative to the fixed frame 100 on a plane perpendicular to the optical axis (Z axis) while being accommodated in the fixed frame 100.
[0068] Reference Figure 8 , the mobile frame 200 may include a reinforcing plate 250 for reinforcing the structural rigidity of the mobile frame 200. The reinforcing plate 250 may be integrally formed with the mobile frame 200 by insert injection molding. For example, the reinforcing plate 250 may be made of stainless steel or replaced with another material.
[0069] Refer again Figure 3, the image sensor S may be mounted on the sensor substrate 400. The sensor substrate 400 may include a portion coupled to the fixed frame 100 (hereinafter referred to as a fixed portion 430) and a portion coupled to the moving frame 200 (hereinafter referred to as a moving portion 410), and the image sensor S may be mounted on the moving portion 410. Therefore, the image sensor S and the moving portion 410 may move on a plane perpendicular to the optical axis (Z axis) together with the moving frame 200.
[0070] Reference Figure 4 , the first actuator 10 may include a first driver 300. The first driver 300 may generate a driving force to move the moving frame 200 in a first axis direction (X axis direction) and a second axis direction (Y axis direction), or rotate the moving frame 200 around an optical axis (Z axis) as a rotation axis.
[0071] The first driver 300 includes a first sub-driver 310 generating a driving force in a first axis direction (X axis direction) and a second sub-driver 330 generating a driving force in a second axis direction (Y axis direction).
[0072] The first sub-driver 310 includes a first magnet 311 and a first coil 313 arranged to face each other in the optical axis direction (Z-axis direction), and the second sub-driver 330 includes a second magnet 331 and a second coil 333 arranged to face each other in the optical axis direction (Z-axis direction). The first sub-driver 310 and the second sub-driver 330 may include a number of coils corresponding to the number of magnets included in the first magnet 311 and the second magnet 331. In an embodiment, the first magnet 311 and the second magnet 331 may each include two magnets, and the first coil 313 and the second coil 333 may each include two coils. The first magnet 311 may have a shape that magnetizes the N pole and the S pole in the first axis direction (X-axis direction), and a neutral zone may be set between the N pole and the S pole. The second magnet 331 may have a shape that magnetizes the N pole and the S pole in the second axis direction (Y-axis direction), and a neutral zone may be set between the N pole and the S pole.
[0073] The first magnet 311 and the second magnet 331 may be arranged perpendicularly to each other on a surface of the moving frame 200 facing the fixed frame 100 in the optical axis direction (Z-axis direction). The first coil 313 and the second coil 333 may be provided on the fixed frame 100 through the first substrate 350. The first coil 313 and the second coil 333 may be provided in the through hole 120 formed in the fixed frame 100, and may directly face the first magnet 311 and the second magnet 331 through the through hole 120.
[0074] When power is supplied to the first coil 313, the mobile frame 200 can move in the first axis direction (X axis direction) by the electromagnetic force between the first magnet 311 and the first coil 313. Similarly, when power is supplied to the second coil 333, the mobile frame 200 can move in the second axis direction (Y axis direction) by the electromagnetic force between the second magnet 331 and the second coil 333. Since the first magnet 311 and the second magnet 331 are provided on the mobile frame 200, the first magnet 311 and the second magnet 331 are mobile components that move together with the mobile frame 200 on a plane perpendicular to the optical axis (Z axis), and since the first coil 313 and the second coil 333 are provided on the fixed frame 100, the first coil 313 and the second coil 333 can be fixed components that do not move.
[0075] At the same time, the first sub-driver 310 and the second sub-driver 330 may cooperate to generate a driving force for rotating the moving frame 200 around the optical axis (Z axis). The rotational driving force may be formed by a combined force or a bias of the driving forces generated by the first sub-driver 310 and the second sub-driver 330.
[0076] Reference Figure 4 , the first actuator 10 (or the first driver 300) may include a position sensor that detects the position of the moving frame 200. For example, the position sensor may be a Hall sensor. The first actuator 10 includes a first position sensor 315 arranged to face the first magnet 311 in the optical axis direction (Z-axis direction) and a second position sensor 335 arranged to face the second magnet 331 in the optical axis direction (Z-axis direction). The first position sensor 315 and the second position sensor 335 together with the first coil 313 and the second coil 333 may be disposed on the fixed frame 100 via the first substrate 350. In an embodiment, the second position sensor 335 may include two position sensors arranged to face each of the two magnets included in the second magnet 331 to detect the rotation of the moving frame 200.
[0077] The first ball member B1 may be provided between the moving frame 200 and the fixed frame 100. The first ball member B1 may be arranged to contact the moving frame 200 and the fixed frame 100, respectively. When the moving frame 200 moves relative to the fixed frame 100, the first ball member B1 may support the movement of the moving frame 200 while rolling in a direction in which a driving force is generated.
[0078] The first ball member B1 may include a plurality of balls, and the surfaces of the mobile frame 200 and the fixed frame 100 facing each other in the optical axis direction (Z-axis direction) have guide grooves each accommodating a plurality of balls. For example, the lower surface of the fixed frame 100 may include a first guide groove 110, and the upper surface of the mobile frame 200 may include a second guide groove 210. The first ball member B1 may be in contact with the first guide groove 110 and the second guide groove 210, respectively. The first guide groove 110 and the second guide groove 210 are formed to be larger than the diameter of the first ball member B1, so that the direction of the rolling motion of the first ball member B1 on a plane perpendicular to the optical axis (Z-axis) may not be restricted.
[0079] Reference Figure 3 , the first actuator 10 may include a yoke to maintain contact between the first ball member B1 and the fixed frame 100 and the moving frame 200. For example, the yoke may be made of a magnetic material. The first actuator 10 includes a first yoke 317 and a second yoke 337, the first yoke 317 is arranged to face the first magnet 311 in the optical axis direction (Z-axis direction), and the second yoke 337 is arranged to face the second magnet 331 in the optical axis direction (Z-axis direction). The first yoke 317 and the second yoke 337 may be connected to the fixed frame 100 through the first substrate 350. The first yoke 317 and the second yoke 337 may be arranged on opposite sides of the first substrate 350 on which the first coil 313 and the second coil 333 are arranged.
[0080] The attractive force can act between the first yoke 317 and the second yoke 337 and the first magnet 311 and the second magnet 331 in the direction in which the first yoke 317 and the second yoke 337 and the first magnet 311 and the second magnet 331 face each other, that is, in the optical axis direction (Z-axis direction). Therefore, an attractive force is formed between the fixed frame 100 on which the first yoke 317 and the second yoke 337 are provided and the moving frame 200 on which the first magnet 311 and the second magnet 331 are provided, so that the first ball member B1 provided between the moving frame 200 and the fixed frame 100 can maintain contact with the moving frame 200 and the fixed frame 100.
[0081] Fig. 6A It is along Figure 5 A cross-sectional view taken along line II'; Figure 6B yes Fig. 6A An enlarged view of part A; Fig. 7A It is along Figure 5 A cross-sectional view taken along line II-II'; and Figure 7B yes Fig. 7A Magnified view of part B.
[0082] like Fig. 6A and Fig. 7AAs shown in , when a driving force is generated in the first axis (X axis) direction, the mobile frame 200 can move in the first axis (X axis) direction, and when a driving force is generated in the second axis (Y axis) direction, the mobile frame 200 can move in the second axis (Y axis) direction. In addition, when there is a difference between the magnitude of the driving force generated in the first axis (X axis) direction and the magnitude of the driving force generated in the second axis (Y axis) direction, the mobile frame 200 can rotate around the optical axis (Z axis) as the rotation axis. As described above, the moving portion 410 of the sensor substrate 400 on which the image sensor S is mounted is connected to the mobile frame 200 so that the image sensor S can move together with the mobile frame 200.
[0083] At the same time, refer to Figure 6B and Figure 7B , the moving frame 200 includes a protrusion 240 protruding toward the sensor substrate 400, and the moving portion 410 may be coupled to the protrusion 240. Therefore, in a portion other than the protrusion 240 and the moving portion 410, a gap may be formed between the moving frame 200 and the sensor substrate 400 in the optical axis direction (Z-axis direction), and the fixed portion 430 of the sensor substrate 400 may not be interfered with by the movement of the moving frame 200.
[0084] Fig.11 is an exploded perspective view of a sensor substrate according to an embodiment of the present disclosure. Fig.12 yes Fig.11 A cross-sectional view of the sensor substrate, and Figures 13 to 15 is a cross-sectional view of a sensor substrate according to other embodiments of the present disclosure.
[0085] Reference Fig.11 , the sensor substrate 400 may include a moving portion 410 , a fixing portion 430 , and a connecting portion 450 .
[0086] The moving part 410 may be a moving member that is coupled to the lower part of the moving frame 200 and moves with the moving frame 200 during optical image stabilization. The image sensor S may be mounted on the moving part 410. The fixed part 430 may be a fixed member that is coupled to the lower part of the fixed frame 100 and does not move during optical image stabilization. The fixed part 430 may be disposed to surround the moving part 410. The connecting part 450 may be disposed between the moving part 410 and the fixed part 430. For example, the connecting part 450 may be disposed between the moving part 410 and the fixed part 430 in a direction perpendicular to the optical axis (Z axis). The connecting part 450 may be disposed between the moving part 410 and the fixed part 430 to connect the moving part 410 and the fixed part 430, and may support the movement of the moving part 410. In an embodiment, the sensor substrate 400 may be a rigid flexible printed circuit board (rigid flexible PCB), the moving part 410 and the fixed part 430 may be rigid printed circuit boards (rigid PCB), and the connecting part 450 may include a flexible printed circuit board (flexible PCB). Therefore, when the moving portion 410 moves, the connecting portion 450 may support the movement of the moving portion 410 while being bent.
[0087] The connecting portion 450 may include a plurality of bridging elements 455 disposed between the moving portion 410 and the fixed portion 430. The plurality of bridging elements 455 may be portions corresponding to a flexible printed circuit board (flexible PCB) that may be bent when the moving portion 410 moves. The plurality of bridging elements 455 may extend along the periphery of the moving portion 410, and each bridging element may be spaced apart by a slit penetrating in the optical axis direction (Z-axis direction).
[0088] In addition, the connecting portion 450 may include a pair of first supporting portions 451 and a pair of second supporting portions 453 facing each other in a direction perpendicular to the optical axis (Z axis). The pair of first supporting portions 451 face each other in the first axis direction (X axis direction), and may be connected to the fixed portion 430 and spaced apart from the moving portion 410. The pair of second supporting portions 453 face each other in the second axis direction (Y axis direction), and may be connected to the moving portion 410 and spaced apart from the fixed portion 430. With this structure, the moving portion 410 may be structurally connected to the fixed portion 430 and have fluidity.
[0089] In an embodiment, when the moving part 410 moves in the first axis direction (X axis direction), the plurality of bridging elements 455 connected to the first supporting part 451 may be bent. When the moving part 410 moves in the second axis (Y axis direction), the plurality of bridging elements 455 connected to the second supporting part 453 may be bent. When the moving part 410 rotates around the optical axis (Z axis), the plurality of bridging elements 455 connected to the first supporting part 451 and the second supporting part 453 may be bent together.
[0090] Reference Fig.11 and Fig.12 , the moving part 410 according to an embodiment of the present disclosure includes a plurality of layers (hereinafter referred to as a first layer 411 , a second layer 413 , and a third layer 415 ), an image sensor S, and a heat dissipation member 470 .
[0091] The plurality of layers include a first layer 411 disposed side by side with the fixed portion 430 and the connecting portion 450 in a direction perpendicular to the optical axis (Z axis) and a second layer 413 disposed on the upper side of the first layer 411 and spaced apart from the first layer 411. In addition, the plurality of layers may include a third layer 415 disposed between the first layer 411 and the second layer 413. The third layer 415 may be used to electrically connect the first layer 411 and the second layer 413. In addition, the third layer 415 may be used to separate the moving portion 410 and the fixed portion 430. In detail, the second layer 413 may be spaced apart from the fixed portion 430 in the optical axis direction (Z axis direction) by the third layer 415, and therefore, when the moving portion 410 moves on a plane perpendicular to the optical axis (Z axis), the second layer 413 and the fixed portion 430 may not interfere with each other. The third layer 415 may be optionally provided, and another configuration (e.g., a heat dissipation member 470) may replace the third layer 415. Fig.14 and Fig.15 An embodiment in which the third layer 415 is omitted is shown, which will be described later.
[0092] In an embodiment of the present disclosure, the first layer 411, the second layer 413, and the third layer 415 may each include a first opening 411a, a second opening 413a, and a third opening 415a penetrating in the optical axis direction (Z-axis direction). The first layer 411, the second layer 413, and the third layer 415 may be arranged so that the first opening 411a, the second opening 413a, and the third opening 415a overlap in the optical axis direction (Z-axis direction), and the image sensor S may be arranged to overlap with the first opening 411a, the second opening 413a, and the third opening 415a in the optical axis direction (Z-axis direction).
[0093] The heat dissipation member 470 may be disposed in the second opening 413a. That is, the heat dissipation member 470 may be arranged side by side with the second layer 413 in a direction perpendicular to the optical axis (Z axis). In addition, the heat dissipation member 470 may be arranged to overlap with the image sensor S in the optical axis direction (Z axis direction). Fig.12 , the image sensor S can be directly attached to one surface of the heat dissipation member 470 by the adhesive AD. In this way, when the image sensor S is directly attached to the heat dissipation member 470, the heat dissipation member 470 can directly take away the heat generated by the image sensor S, thereby improving the heat dissipation performance of the camera module 1.
[0094] In consideration of heat dissipation performance, the heat dissipation member 470 is formed so that the surface in contact with the image sensor S has an area capable of covering the entire imaging surface (a plane perpendicular to the optical axis (Z axis)) of the image sensor S. That is, one side of the heat dissipation member 470 parallel to the imaging surface of the image sensor S may be formed to have an area equal to or larger than the imaging surface, and as the area and volume of the heat dissipation member 470 increase, the heat dissipation effect may be improved.
[0095] According to an embodiment of the present disclosure, the heat dissipation member 470 may have a TSV (Through Silicon Via) structure. The TSV structure refers to a structure in which a plurality of through holes are drilled in a silicon (Si) substrate 471 and the inside of the through holes is filled with a conductive electrode 473. For example, the conductive electrode 473 may be made of copper (Cu). Since the heat transfer coefficient of silicon (Si) is 148W / m·C and the heat transfer coefficient of copper (Cu) is 401W / m·C, the heat transfer performance of the heat dissipation member 470 can be very good. For example, when considering that the heat transfer coefficient of a PCB board on which a conventional image sensor S is disposed is 10W / m·C to 20W / m·C, the heat dissipation performance can be greatly improved.
[0096] According to other embodiments of the present disclosure, the heat dissipation performance of the camera module 1 may be improved by increasing the volume of the heat dissipation member 470. In an embodiment, the volume of the heat dissipation member 470 may be increased by changing the length and / or height of the heat dissipation member 470.
[0097] According to another embodiment, Fig.13As shown in , the volume of the heat dissipation member 470 can be increased by increasing the thickness of the heat dissipation member 470 (i.e., the length in the optical axis direction (Z-axis direction)). At this time, in order to prevent the movement of the moving part 410 from being interfered with by the fixed member, the thickness of the heat dissipation member 470 can be increased within a range that does not contact the base 500, which will be described later. In this embodiment, the heat dissipation member 470 may include an extension portion 470a extending in the optical axis direction (Z-axis direction), and the extension portion 470a may be disposed on the third opening 415a and / or the first opening 411a. Even if the thickness of the heat dissipation member 470 increases, the thickness of the camera module 1 does not increase because the heat dissipation member 470 is disposed in the openings 411a, 413a, and 415a of the multiple layers.
[0098] In another embodiment, although not specifically shown in the drawings, the length of the heat dissipation member 470 in the first axis direction (X axis direction) and / or the second axis direction (Y axis direction) may be increased. For example, this may be a case where the side of the heat dissipation member 470 parallel to the imaging surface of the image sensor S has a larger area than the imaging surface, and the area of the second opening 413a may also be changed according to the area of the heat dissipation member 470. In addition, in this case, the length of the heat dissipation member 470 may be increased to the extent that the movement of the moving part 410 is not interfered with by the fixed member.
[0099] At the same time, if Fig.14 and Fig.15 As shown in , in an embodiment where the volume of the heat dissipation member 470 is increased, the third layer 415 may be omitted, and the heat dissipation member 470 may replace the third layer 415 .
[0100] Reference Fig.14 and Fig.15 , the moving part 410 includes a first layer 411 arranged in the optical axis direction (Z axis direction), a heat dissipation member 470, a second layer 413, and an image sensor S. The first layer 411 may be arranged side by side with the fixed part 430 and the connecting part 450 in a direction perpendicular to the optical axis (Z axis), and the second layer 413 may be arranged to be spaced apart from the first layer 411 on an upper side of the first layer 411.
[0101] The heat dissipation member 470 may be disposed between the first layer 411 and the second layer 413. The first layer 411 and the second layer 413 may be electrically connected to each other through the heat dissipation member 470 disposed therebetween. For example, the first layer 411 and the second layer 413 may be electrically connected through the conductive electrode 473 of the heat dissipation member 470. In addition, the second layer 413 may be spaced apart from the fixing portion 430 by the heat dissipation member 470.
[0102] In other embodiments, the first layer 411 may include a first opening 411a penetrating the first layer 411 in the optical axis (Z-axis) direction. However, unlike the above-described embodiments, the second layer 413 may not include the second opening 413a.
[0103] The image sensor S may be disposed on one side of the second layer 413, and the heat dissipation member 470 may be disposed on the other side of the second layer 413. That is, the image sensor S may overlap with the heat dissipation member 470 in the optical axis direction (Z-axis direction) with the second layer 413 located between the image sensor S and the heat dissipation member 470, and heat generated from the image sensor S may be transferred to the heat dissipation member 470 through the second layer 413.
[0104] Also in this embodiment, the heat dissipation performance can be improved by increasing the thickness of the heat dissipation member 470. The heat dissipation member 470 may include an extension portion 470a extending in the optical axis direction (Z-axis direction). The extension portion 470a may be disposed in the first opening 411a, and its thickness may be increased within a range that does not contact the base 500, which will be described later.
[0105] However, since the heat dissipation member 470 is a part of the moving portion 410 that moves on a plane perpendicular to the optical axis (Z axis), according to Figures 13 to 15 , the increase in the volume of the heat dissipation member 470 affects the optical image stabilization performance. Therefore, when the volume of the heat dissipation member 470 is increased, some through holes are filled with silicon (Si) instead of copper (Cu) (copper (Cu) is a material with a relatively high density), or filled with other materials with a density lower than that of copper (Cu).
[0106] Meanwhile, the base 500 may be disposed under the sensor substrate 400. The base 500 may be disposed at the bottom of the sensor substrate 400 to completely cover the sensor substrate 400, and may prevent foreign matter and the like from entering the gap between the moving part 410 and the fixed part 430.
[0107] Fig. 9 It is shown Figure 3 A diagram of the optical image stabilization moving frame and sensor substrate, and Fig.10 It is shown Fig. 9 Diagram of the connection state of the moving frame and the sensor substrate.
[0108] At the same time, refer to Fig. 9 and Fig.10, the moving frame 200 includes a first escape hole 260 and a second escape hole 270 penetrating the moving frame 200 in the optical axis direction (Z-axis direction). In a case where the moving frame 200 is coupled to the sensor substrate 400, a portion of the fixed portion 430 and the connecting portion 450 (for example, the second supporting portion 453) of the sensor substrate 400 may be exposed through the first escape hole 260 and the second escape hole 270. Due to this structure, the moving portion 410 of the sensor substrate 400 may have fluidity after being coupled to the moving frame 200. In detail, the sensor substrate 400 is coupled to the moving frame 200 in a state where the moving portion 410 has no fluidity, and then may have fluidity by exposing a portion of the second supporting portion 453 by cutting the first escape hole 260 and the second escape hole 270.
[0109] Fig.16 is an exploded perspective view of a focus actuator according to an embodiment of the present disclosure; Fig.17 yes Fig.16 A perspective view of a focus actuator in FIG. Fig.18 yes Fig.16 a side view of a carrier portion of a focus actuator; and Fig.19 yes Fig.16 A perspective view of the housing of the focus actuator.
[0110] Reference Fig.16 The second actuator 20 may include a housing 600 , a casing 630 , a bearing portion 730 , and a second driver 800 .
[0111] The housing 600 has an internal space and may be formed in a quadrilateral (e.g., rectangular) box shape having an opening penetrating in the optical axis direction (Z-axis direction). The bearing portion 730 may be disposed in the internal space of the housing 600. As described above, the lens barrel 710 may be coupled to the bearing portion 730, and the lens barrel 710 and the bearing portion 730 may move in the optical axis direction (Z-axis direction). In addition, the housing 600 may be coupled to the fixed frame 100, and similar to the fixed frame 100, may be a fixed member that does not move during focusing and optical image stabilization.
[0112] The housing 630 may be coupled to the housing 600 to cover the inner space of the housing 600. The housing 630 may include a protrusion protruding toward the inner space on a lower surface thereof. The protrusion may function as a buffer member while adjusting a range of motion of a second ball member B2 to be described later.
[0113] The second driver 800 may generate a driving force to move the carrier 730 in the optical axis direction (Z-axis direction).
[0114] The second driver 800 may include a third magnet 810 and a third coil 830 arranged to face each other in a direction perpendicular to the optical axis (Z axis). The third magnet 810 may be disposed on one side of the bearing portion 730, and a back yoke may be disposed between the bearing portion 730 and the third magnet 810 to prevent magnetic flux leakage. The third coil 830 may be disposed on one side of the housing 600 through the second substrate 890. The third coil 830 may be disposed in a through hole formed in the housing 600, and may directly face the third magnet 810 through the through hole.
[0115] The third magnet 810 may have a shape in which an N pole and an S pole are magnetized in the optical axis direction (Z-axis direction), and a neutral region may be provided between the N pole and the S pole.
[0116] When power is supplied to the third coil 830, the carrier 730 may move in the optical axis direction (Z-axis direction) by the electromagnetic force between the third magnet 810 and the third coil 830. The third magnet 810 is disposed on the carrier 730, so the third magnet 810 may be a moving member that moves in the optical axis direction (Z-axis direction) together with the carrier 730, and the third coil 830 is disposed on the housing 600, so the third coil 830 may be a fixed member that does not move.
[0117] Reference Fig.16 , the second actuator 20 (or the second driver 800) may include a third position sensor 850 that detects the position of the bearing portion 730. For example, the third position sensor 850 may be a Hall sensor. The third position sensor 850 may be disposed in the housing 600 via the second substrate 890 to face the third magnet 810 in a direction perpendicular to the optical axis (Z axis).
[0118] The second ball member B2 may be disposed between the bearing portion 730 and the housing 600. The second ball member B2 may be arranged to contact the bearing portion 730 and the housing 600, respectively. When the bearing portion 730 moves relative to the housing 600 in the optical axis direction (Z-axis direction), the second ball member B2 may support the movement of the bearing portion 730 while rolling in the optical axis direction (Z-axis direction).
[0119] The second ball member B2 may include a plurality of balls arranged in the optical axis direction (Z-axis direction), and the surfaces of the bearing portion 730 and the housing 600 facing each other in the direction perpendicular to the optical axis (Z-axis) may include guide grooves for accommodating the plurality of balls. For example, one side of the bearing portion 730 may include a third guide groove 731, and one side of the housing 600 facing the one side of the bearing portion 730 may include a fourth guide groove 610. The third guide groove 731 and the fourth guide groove 610 may have a form extending in the optical axis direction (Z-axis direction), and the second ball member B2 may be provided between the third guide groove 731 and the fourth guide groove 610.
[0120] The second ball member B2 may include a first ball group BG1 and a second ball group BG2 spaced apart in a direction perpendicular to the optical axis (Z axis). The first ball group BG1 and the second ball group BG2 may include different numbers of balls, for example, two balls and three balls, respectively.
[0121] The third guide groove 731 includes a first groove g1 and a second groove g2, and the fourth guide groove 610 includes a third groove g3 facing the first groove g1 and a fourth groove g4 facing the second groove g2. The first ball group BG1 may be disposed between the first groove g1 and the third groove g3, and the second ball group BG2 may be disposed between the second groove g2 and the fourth groove g4.
[0122] In an embodiment, the first ball group BG1 may contact the first groove g1 and the third groove g3 at 1 point (2 points) and 2 points (1 point), respectively, and may be used as an auxiliary guide. The second ball group BG2 may contact the second groove g2 and the fourth groove g4 at two points, respectively, and may be used as a main guide.
[0123] According to an embodiment of the present disclosure, optical image stabilization is performed to precisely control the driving force by moving the image sensor S. In addition, by disposing the heat dissipation member 470 of a through silicon via (TSV) structure under the image sensor S, the temperature of the image sensor S can be effectively reduced.
[0124] An actuator and a camera module for optical image stabilization may have improved optical image stabilization performance and heat dissipation performance.
[0125] Although specific examples have been shown and described above, it will be apparent after understanding the present disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are understood in a descriptive sense only and not for limiting purposes. The description of the features or aspects in each example should be considered to be applicable to similar features or aspects in other examples. If the described techniques are performed in a different order, and / or if the components in the described system, architecture, device or circuit are replaced or supplemented in a different manner and / or by other components or their equivalents, appropriate results can still be achieved. Therefore, the scope of the present disclosure is not limited by specific embodiments, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents should be understood to be included in the present disclosure.
Claims
1. An actuator for optical image stabilization, comprising: A fixed frame having an opening penetrating in the direction of the optical axis; a moving frame received in the fixed frame and configured to move relative to the fixed frame in a plane perpendicular to the optical axis; as well as a sensor substrate on which an image sensor is disposed, the sensor substrate comprising: a fixed portion coupled to the fixed frame; a moving portion including the image sensor and coupled to the moving frame; and a connecting portion disposed between the moving portion and the fixed portion to support movement of the moving portion, wherein the moving portion includes a heat dissipation member that dissipates heat generated from the image sensor, and Wherein, the heat dissipation component includes a substrate having a through hole and a conductive electrode filling the through hole.
2. The actuator according to claim 1, wherein: The heat dissipation member overlaps the image sensor in the optical axis direction.
3. The actuator according to claim 2, wherein: The mobile part also includes: a first layer, arranged side by side with the fixing portion and the connecting portion in a direction perpendicular to the optical axis; a second layer having a surface provided on an upper side of the first layer and an opening penetrating the surface in the optical axis direction; and a third layer, disposed between the first layer and the second layer, Wherein, the heat dissipation component is arranged in the opening of the second layer.
4. The actuator according to claim 3, wherein: Each of the first layer and the third layer has a surface including an opening, and the opening of each of the first layer and the third layer penetrates the surface of each of the first layer and the third layer in the optical axis direction and overlaps with the opening of the second layer.
5. The actuator according to claim 4, wherein: The heat dissipation member further includes a first extending portion extending in the optical axis direction toward the openings of the first layer and the third layer.
6. The actuator according to claim 2, wherein: The mobile part also includes: a first layer arranged side by side with the fixing portion and the connecting portion in a direction perpendicular to the optical axis; and a second layer, disposed on an upper side of the first layer, The image sensor is disposed on one side of the second layer, and the heat dissipation member is disposed on the other side of the second layer to overlap with the image sensor.
7. The actuator according to claim 6, wherein: A portion of the heat dissipation member is disposed between the first layer and the second layer, and The first layer and the second layer are electrically connected via the heat dissipation member disposed between the first layer and the second layer.
8. The actuator according to claim 6, wherein: A surface of the first layer has an opening penetrating the surface of the first layer, the opening of the first layer being at a position overlapping with the image sensor in the optical axis direction.
9. The actuator according to claim 8, wherein: The heat dissipation member further includes a first extending portion extending in the optical axis direction toward the opening of the first layer.
10. The actuator according to claim 1, further comprising a base disposed below the sensor substrate, in, A gap is formed between the moving portion and the base in the optical axis direction. 11 . The actuator according to claim 1 , further comprising a first driver including a plurality of magnets provided on the moving frame and a plurality of coils provided on the fixed frame to face the plurality of magnets.
12. Camera module, including: A lens module, comprising lenses arranged in the direction of the optical axis; as well as An actuator according to any one of claims 1 to 11.
13. Camera module, including: A lens module, comprising a lens arranged in an optical axis direction and a lens barrel in which the lens is installed; as well as An actuator for optical image stabilization, configured to move an image sensor in a plane perpendicular to an optical axis, The actuator includes: a sensor substrate on which the image sensor is disposed; and a heat dissipation member disposed so as to overlap with the image sensor in the optical axis direction, and The heat dissipation component includes a substrate having a through hole and a conductive electrode filling the through hole in a thickness direction.
14. The camera module according to claim 13, wherein: The sensor substrate comprises: Fixed part; a moving portion configured to move relative to the fixed portion on the plane perpendicular to the optical axis; and a connecting portion, disposed between the fixed portion and the moving portion to support the movement of the moving portion, Wherein, the moving part includes the image sensor and the heat dissipation component.
15. The camera module according to claim 14, further comprising a base disposed below the sensor substrate, in, The heat dissipation member further includes an extending portion extending toward the base in the optical axis direction, and Wherein a gap is formed between the base and the extension portion.
16. The camera module according to claim 14, wherein: The actuator further comprises: a fixed frame coupled to the fixed portion; a moving frame coupled to the moving portion; and A first driver is separately provided in the fixed frame and the moving frame and is configured to generate a driving force to move the image sensor on the plane perpendicular to the optical axis. 17 . The camera module of claim 13 , further comprising a focus actuator configured to move the lens module in the optical axis direction.
Citation Information
Patent Citations
Apparatus for management of microgrid
KR1020230104547A