High-luminous-efficiency LED light source

Abstract

The invention relates to the technical field of LED light sources, and discloses a high-luminous-efficiency LED light source which comprises a substrate, the substrate is provided with a light-emitting area, a glue layer is arranged on the light-emitting area, and fluorescent powder is mixed in the glue layer. The adhesive layer is provided with a middle part and a peripheral part; a light-emitting chip is arranged on the adhesive layer, and the light-emitting chip is provided with a bottom light-emitting surface, a peripheral light-emitting surface and a top light-emitting surface; the bottom light-emitting surface fixedly abuts against the middle part, and the middle part reflects light emitted by the bottom light-emitting surface. An annular interval is formed between the outer peripheral part and the peripheral side light-emitting surface, the outer peripheral part is provided with an inner side light-reflecting surface, and the inner side light-reflecting surface reflects light rays emitted by the peripheral side light-emitting surface; fluorescent powder is mixed in the glue layer, the heat conductivity is greatly improved, the inner side light reflecting face can reflect light rays emitted by the peripheral side light emitting faces, the high lighting effect of the LED light source is achieved, the peripheral portion surrounds the peripheries of the peripheral side light emitting faces, and direct correlation between the adjacent peripheral side light emitting faces is avoided.

Description

Technical Field

[0001] The invention patent relates to the technical field of LED light sources, specifically, to high-efficiency LED light sources. Background Art

[0002] LED light sources have the advantages of small size, long life and high efficiency. They can be used continuously for up to 100,000 hours. LED light sources have become mainstream in the lighting field and are widely used.

[0003] LED light sources are widely used in life, which include a substrate with a light-emitting area on it. The light-emitting area is provided with a plurality of light-emitting chips, the light-emitting chips are fixed on the substrate, and the light-emitting area is covered with a fluorescent adhesive layer. The light emitted by the light-emitting chip passes through the fluorescent adhesive layer and irradiates outward to form the required light.

[0004] In the prior art, the bottom of the light-emitting chip has a bottom light-emitting surface, the periphery of the light-emitting chip has a peripheral light-emitting surface, and the bottom of the light-emitting chip has a bottom light-emitting surface. The bottom light-emitting surface and the peripheral light-emitting surface cannot irradiate outward, resulting in low luminous efficiency of the LED light source. Summary of the invention

[0005] The purpose of the present invention is to provide a high-light-efficiency LED light source, aiming to solve the problem of low light-efficiency of LED light sources in the prior art.

[0006] The present invention is implemented as follows: a high light-efficiency LED light source comprises a substrate, the top of the substrate has a recessed area, the bottom of the recessed area forms a light-emitting area, a plurality of adhesive layers arranged in an array are provided on the light-emitting area, and phosphors are mixed in the adhesive layers; the middle of the adhesive layer has a middle part, and the periphery of the middle part expands outward to form a peripheral part arranged around;

[0007] A light-emitting chip is fixedly arranged on the adhesive layer, the bottom of the light-emitting chip has a bottom light-emitting surface, the periphery of the light-emitting chip has a peripheral light-emitting surface, and the top of the light-emitting chip has a top light-emitting surface; the bottom light-emitting surface is fixedly pressed against the middle part, and the middle part reflects the light emitted by the bottom light-emitting surface;

[0008] The outer peripheral portion surrounds the outer periphery of the peripheral luminous surface and has an annular interval between the outer peripheral portion and the peripheral luminous surface. The inner side of the outer peripheral portion has an inner reflective surface arranged toward the annular interval, and the inner reflective surface reflects the light emitted by the peripheral luminous surface.

[0009] Furthermore, there is a chip gap between the peripheral light-emitting surfaces of adjacent light-emitting chips, the peripheral portion is located in the chip gap, and there is a glue layer gap between adjacent peripheral portions.

[0010] Furthermore, a plurality of hollow areas are provided in the middle portion, the top of the hollow area passes through the top of the middle portion to form a top opening, and the bottom of the hollow area passes through the bottom of the middle portion to form a bottom opening; the top opening is connected to the bottom light-emitting surface, and the bottom opening is connected to the light-emitting area.

[0011] Furthermore, a heat-conducting column is protruding from the light-emitting area, the heat-conducting column is inserted into the hollow area, the inner side wall of the heat-conducting column abuts against the inner side wall of the hollow area, and the top of the heat-conducting column extends along the top opening and docks on the bottom light-emitting surface.

[0012] Furthermore, the periphery of the top of the heat-conducting column extends outward to form a peripheral ring sheet, and the peripheral ring sheet is inverted and abutted against the middle part and is arranged flush with the top of the middle part.

[0013] Furthermore, the lower part of the outer periphery has a lower segment, and the upper part of the outer periphery has an upper segment, and the upper segment and the lower segment are respectively arranged around the circumference of the peripheral light-emitting surface; the lower segment abuts against the peripheral light-emitting surface, and the annular gap is formed between the upper segment and the peripheral light-emitting surface, and the inner side of the upper segment forms the inner reflective surface.

[0014] Furthermore, along the direction away from the light-emitting area and outward, the inner reflective surface is arranged obliquely away from the peripheral light-emitting surface.

[0015] Furthermore, a reflective dam is provided in the gap of the adhesive layer, and the reflective dam has a reflective side wall facing the periphery. Along the reflective dam from bottom to top, the reflective side wall is arranged obliquely away from the periphery, and the light passing through the periphery is reflected by the reflective side wall and irradiated outward away from the light-emitting area.

[0016] Furthermore, the peripheral portion has a peripheral side wall facing the reflective dam, the peripheral side wall is arranged in an arc shape, and a light-transmitting interval is provided between the peripheral side wall and the reflective side wall; the light-emitting area is covered with a fluorescent glue layer, the fluorescent glue layer fills the annular interval and the light-transmitting interval downwards, and covers the top light-emitting surface;

[0017] The top of the fluorescent glue layer is convex in an arc shape to form a top arc surface. Along the direction from the middle to the periphery of the top arc surface, the curvature of the top arc surface gradually decreases so that the periphery of the top arc surface converges into an arc convexity toward the middle.

[0018] Furthermore, the periphery of the fluorescent glue layer is butted against the periphery of the recessed area, a dam is provided on the substrate, the dam is arranged around the periphery of the recessed area, and the dam is inclined toward the lower part of the fluorescent glue layer and butts against the lower part of the top arc surface.

[0019] Compared with the prior art, the high-efficiency LED light source provided by the present invention arranges a glue layer at the bottom of the light-emitting chip, and the glue layer is mixed with fluorescent powder. In this way, the thermal conductivity of the glue layer is greatly improved, and the heat of the light-emitting chip can be transferred to the substrate faster and more, so as to achieve an efficient heat dissipation effect; secondly, the middle part can reflect the light emitted by the bottom light-emitting surface, and the inner reflective surface of the peripheral part can reflect the light emitted by the peripheral light-emitting surface, so as to achieve a high-efficiency LED light source effect; in addition, the peripheral part surrounds the periphery of the peripheral light-emitting surface to avoid direct reflection between adjacent peripheral light-emitting surfaces, thereby improving the efficiency of the LED light source and reducing the heat generation of the LED light source. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic cross-sectional view of a high light efficiency LED light source provided by the present invention;

[0021] Figure 2 is a three-dimensional schematic diagram of the light-emitting chip provided by the present invention;

[0022] Figure 3 It is a front view schematic diagram of the cooperation between the light emitting chip and the adhesive layer provided by the present invention. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0024] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0025] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0026] Reference Figure 1-3 The figure shows a preferred embodiment of the present invention.

[0027] A high-light-efficiency LED light source includes a substrate 100, the top of the substrate 100 has a recessed area, the bottom of the recessed area forms a light-emitting area 101, a plurality of adhesive layers 400 arranged in an array are provided on the light-emitting area 101, and phosphors are mixed in the adhesive layers 400; the middle of the adhesive layer 400 has a middle portion 403, and the periphery of the middle portion 403 expands outward to form a surrounding peripheral portion.

[0028] The phosphors can be evenly mixed in the adhesive layer 400. During the process of making the adhesive layer 400, the phosphors are directly mixed in the adhesive layer 400 and stirred to make the phosphors more uniform in the adhesive layer 400. Preferably, blue light phosphors or other types of phosphors can be selected.

[0029] A light-emitting chip 600 is fixed on the adhesive layer 400 , the bottom of the light-emitting chip 600 has a bottom light-emitting surface 603 , the periphery of the light-emitting chip 600 has a peripheral light-emitting surface 602 , and the top of the light-emitting chip 600 has a top light-emitting surface 601 ; the bottom light-emitting surface 603 is fixedly pressed against the middle part 403 , and the middle part 403 reflects the light emitted by the bottom light-emitting surface 603 .

[0030] Typically, the light emitting chip 600 is in a cubic shape, and its peripheral light emitting surface 602 is composed of four surfaces.

[0031] The outer peripheral portion surrounds the outer periphery of the peripheral light-emitting surface 602 and has an annular gap 404 between the peripheral portion and the peripheral light-emitting surface 602 . The inner side of the outer peripheral portion has an inner reflective surface 405 arranged toward the annular gap 404 . The inner reflective surface 405 reflects the light emitted by the peripheral light-emitting surface 602 .

[0032] The high-efficiency LED light source provided above arranges a glue layer 400 at the bottom of the light-emitting chip 600, and the glue layer 400 is mixed with fluorescent powder. In this way, the thermal conductivity of the glue layer 400 is greatly improved, and the heat of the light-emitting chip 600 can be transferred to the substrate 100 faster and more, so as to achieve an efficient heat dissipation effect; secondly, the middle part 403 can reflect the light emitted by the bottom light-emitting surface 603, and the inner reflective surface 405 of the peripheral part can reflect the light emitted by the peripheral light-emitting surface 602, so as to achieve a high-efficiency LED light source effect; in addition, the peripheral part surrounds the periphery of the peripheral light-emitting surface 602, so as to avoid direct reflection between adjacent peripheral light-emitting surfaces 602, thereby improving the efficiency of the LED light source and reducing the heat generation of the LED light source.

[0033] In actual manufacturing, the glue layer 400 can be arranged by dispensing glue in the light-emitting area 101. When the light-emitting chip 600 is set, the bottom light-emitting surface 603 of the light-emitting chip 600 is directly abutted against the glue layer 400, and the glue layer 400 is pressed from top to bottom to extend toward the periphery until the middle part 403 and the peripheral part are formed.

[0034] Of course, other manufacturing methods may also be used to achieve the arrangement between the adhesive layer 400 and the light-emitting chip 600 , such as molding the middle portion 403 and the periphery separately, so that more connection methods can be achieved.

[0035] In this embodiment, there is a chip gap between the peripheral light-emitting surfaces 602 of adjacent light-emitting chips 600, the peripheral part is located in the chip gap, and there is a glue layer 400 gap between adjacent peripheral parts, so that the peripheral part can better reflect the light emitted by the peripheral light-emitting surface 602.

[0036] In this embodiment, a plurality of hollow areas are provided in the middle portion 403, the top of the hollow area passes through the top of the middle portion 403 to form a top opening, and the bottom of the hollow area passes through the bottom of the middle portion 403 to form a bottom opening; the top opening is connected to the bottom light-emitting surface 603, and the bottom opening is connected to the light-emitting area 101.

[0037] In this way, the hollow area can be used as a conduction space for heat conduction of the light-emitting chip 600. During the heat conduction between the light-emitting chip 600 and the substrate 100, the hollow area and the adhesive layer 400 conduct heat in multiple ways simultaneously, and the conduction effect is better.

[0038] In this embodiment, a thermal conductive column 406 is protruding from the light-emitting area 101, and the thermal conductive column 406 is inserted into the hollow area. The inner wall of the thermal conductive column 406 abuts against the inner wall of the hollow area, and the top of the thermal conductive column 406 extends along the top opening and docks on the bottom light-emitting surface 603.

[0039] In this way, the heat-conducting column 406 can be used as a positioning means for the adhesive layer 400 to ensure a stable connection between the adhesive layer 400 and the substrate 100 , and the heat-conducting column 406 is connected to the bottom light-emitting surface 603 to achieve more efficient heat conduction.

[0040] In this embodiment, the outer periphery of the top of the heat-conducting column 406 extends outward to form an outer peripheral ring piece 407, and the outer peripheral ring piece 407 is reversed and abutted against the middle part 403, and is arranged flush with the top of the middle part 403. In this way, through the outer peripheral ring piece 407, the adhesive layer 400 can be reversed, so that the adhesive layer 400 and the substrate 100 are more firmly connected, and the contact area between the heat-conducting column 406 and the bottom light-emitting surface 603 is increased, greatly improving the heat conduction efficiency.

[0041] In this embodiment, the lower part of the outer periphery has a lower segment 402, and the upper part of the outer periphery has an upper segment 401. The upper segment 401 and the lower segment 402 are respectively arranged around the circumference of the peripheral light-emitting surface 602, and the lower segment 402 is abutted against the peripheral light-emitting surface 602. The lower segment 402 can be used to reflect the peripheral light-emitting surface 602 and achieve a direct contact thermal conduction effect to facilitate heat conduction of the light-emitting chip 600.

[0042] An annular gap 404 is formed between the upper section 401 and the peripheral light-emitting surface 602. The inner side of the upper section 401 forms the inner reflective surface 405 mentioned above. The upper section 401 is arranged away from the peripheral light-emitting surface 602. The inner reflective surface 405 can be used to more efficiently reflect the light emitted by the peripheral light-emitting surface 602, so as to achieve the effect of high light efficiency of the LED light source.

[0043] In this embodiment, the inner reflective surface 405 is arranged to be tilted away from the peripheral light-emitting surface 602 in the direction away from the light-emitting area 101. Of course, the tilt angle can be determined according to the desired light focusing requirements. Secondly, a plurality of step surfaces can be formed on the inner reflective surface 405, and the plurality of step surfaces are arranged in sequence along the height direction of the inner reflective surface 405, so that multi-angle reflection can be achieved for the direction emitted by the peripheral light-emitting surface 602.

[0044] In this embodiment, a reflective dam 500 is provided in the interval of the adhesive layer 400, and the reflective dam 500 has a reflective side wall 501 facing the periphery. Along the reflective dam 500 from bottom to top, the reflective side wall 501 is arranged obliquely away from the periphery, and the light passing through the periphery is reflected by the reflective side wall 501 and irradiated outward away from the light-emitting area 101.

[0045] By providing the reflective dam 500, the light passing through the outer periphery can be reflected twice, directly avoiding the reflection between adjacent peripheral light-emitting surfaces 602. In addition, the reflective side wall 501 can be used to reflect the light twice, greatly improving the light efficiency of the LED light source.

[0046] In this embodiment, the outer peripheral portion has an outer peripheral side wall facing the reflective dam 500, the outer peripheral side wall is arranged in an arc shape, and a light-transmitting space 408 is provided between the outer peripheral side wall and the reflective side wall 501; the light-emitting area 101 is covered with a fluorescent glue layer 200, and the fluorescent glue layer 200 fills the annular space 404 and the light-transmitting space 408 downwards and covers the top light-emitting surface 601;

[0047] The top of the fluorescent glue layer 200 is convex in an arc shape, forming a top arc surface 201. The curvature of the top arc surface 201 gradually decreases along the direction from the middle to the periphery of the top arc surface 201, so that the periphery of the top arc surface 201 converges and convexly arcs toward the middle. In this way, the light emitted by the light-emitting chip 600 is projected to the outside through the fluorescent glue layer 200 directly or after reflection to achieve the desired bright light effect, and the periphery of the top arc surface 201 converges and convexly arcs toward the middle, which can achieve a high focusing effect.

[0048] In this embodiment, the periphery of the fluorescent glue layer 200 is butted against the periphery of the recessed area, and a dam 300 is provided on the substrate 100. The dam 300 is arranged around the periphery of the recessed area, and the dam 300 is inclined toward the lower part of the fluorescent glue layer 200 and abuts against the lower part of the top arc surface 201.

[0049] By setting the dam 300 , the lower part of the top curved surface 201 can be shielded and reflected, so as to achieve a high light-focusing effect, and the light-focusing range can be adjusted according to the covering height of the dam 300 .

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. High light efficiency LED light source, characterized in that: The substrate comprises a substrate, the top of the substrate has a concave area, the bottom of the concave area forms a light-emitting area, a plurality of adhesive layers arranged in an array are provided on the light-emitting area, and phosphors are mixed in the adhesive layers; the middle of the adhesive layer has a middle part, and the periphery of the middle part expands outward to form a peripheral part arranged around; A light-emitting chip is fixedly arranged on the adhesive layer, the bottom of the light-emitting chip has a bottom light-emitting surface, the periphery of the light-emitting chip has a peripheral light-emitting surface, and the top of the light-emitting chip has a top light-emitting surface; the bottom light-emitting surface is fixedly pressed against the middle part, and the middle part reflects the light emitted by the bottom light-emitting surface; The outer peripheral portion surrounds the outer periphery of the peripheral luminous surface and has an annular interval between the outer peripheral portion and the peripheral luminous surface. The inner side of the outer peripheral portion has an inner reflective surface arranged toward the annular interval, and the inner reflective surface reflects the light emitted by the peripheral luminous surface.

2. The high light efficiency LED light source according to claim 1, characterized in that: There is a chip gap between the peripheral light-emitting surfaces of adjacent light-emitting chips, the peripheral portion is located in the chip gap, and there is a glue layer gap between adjacent peripheral portions.

3. The high light efficiency LED light source according to claim 1 or 2, characterized in that: A plurality of hollow areas are provided in the middle portion, the top of the hollow area passes through the top of the middle portion to form a top opening, and the bottom of the hollow area passes through the bottom of the middle portion to form a bottom opening; the top opening is butted against the bottom light-emitting surface, and the bottom opening is butted against the light-emitting area.

4. The high light efficiency LED light source according to claim 3, characterized in that: A heat-conducting column is protruding from the light-emitting area and inserted into the hollow area. The inner side wall of the heat-conducting column abuts against the inner side wall of the hollow area. The top of the heat-conducting column extends along the top opening and docks on the bottom light-emitting surface.

5. The high light efficiency LED light source according to claim 4, characterized in that: The outer periphery of the top of the heat-conducting column extends outward to form an outer peripheral ring sheet, and the outer peripheral ring sheet is inverted and abutted against the middle part and is arranged flush with the top of the middle part.

6. The high light efficiency LED light source according to claim 1 or 2, characterized in that: The lower part of the outer periphery has a lower segment, and the upper part of the outer periphery has an upper segment, and the upper segment and the lower segment are respectively arranged around the circumference of the peripheral light-emitting surface; the lower segment abuts against the peripheral light-emitting surface, and the annular gap is formed between the upper segment and the peripheral light-emitting surface, and the inner side of the upper segment forms the inner reflective surface.

7. The high light efficiency LED light source according to claim 6, characterized in that: Along the direction away from the light-emitting area and outward, the inner light-reflecting surface is arranged obliquely away from the peripheral light-emitting surface.

8. The high light efficiency LED light source according to claim 1 or 2, characterized in that: A reflective dam is provided in the gap of the adhesive layer, and the reflective dam has a reflective side wall facing the periphery. Along the reflective dam from bottom to top, the reflective side wall is arranged obliquely away from the periphery, and the light passing through the periphery is reflected by the reflective side wall and irradiated outward away from the light-emitting area.

9. The high light efficiency LED light source according to claim 8, characterized in that: The peripheral portion has a peripheral side wall facing the reflective dam, the peripheral side wall is arranged in an arc shape, and a light-transmitting space is provided between the peripheral side wall and the reflective side wall; the light-emitting area is covered with a fluorescent glue layer, the fluorescent glue layer fills the annular space and the light-transmitting space downwards, and covers the top light-emitting surface; The top of the fluorescent glue layer is convex in an arc shape to form a top arc surface. Along the direction from the middle to the periphery of the top arc surface, the curvature of the top arc surface gradually decreases so that the periphery of the top arc surface converges into an arc convexity toward the middle.

10. The high light efficiency LED light source according to claim 9, characterized in that: The periphery of the fluorescent glue layer is butted against the periphery of the recessed area. A dam is provided on the substrate. The dam is arranged around the periphery of the recessed area and is inclined toward the bottom of the fluorescent glue layer and butted against the bottom of the top arc surface.

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