A patch LED lamp bead support structure

Abstract

The utility model relates to the technical field of LED packaging, specifically relates to a kind of patch LED lamp pearl support structure, including support body, bowl cup, positive electrode conducting terminal, negative electrode conducting terminal, through-hole etc.The utility model overcomes the deficiency of prior art, by setting up metal filling through-hole on conducting terminal, establishes the efficient vertical heat dissipation path from chip to PCB board, effectively reduces the junction temperature of LED chip, improves luminous efficiency and life, the slope structure of bowl cup is combined with the high reflectivity coating in it, can more effectively reflect light and export, reduces internal absorption, improves brightness, metal through-hole enhances the embedding strength and combined tightness of metal terminal and plastic body, reduces the stress generated due to thermal expansion and contraction, improves the air tightness and anti-mechanical impact ability of product.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, specifically to a surface-mount LED lamp bead support structure. Background Technology

[0002] Surface mount LEDs have become the mainstream packaging form in the LED lighting and display fields due to their advantages such as small size, light weight, high brightness, and ease of automated production. One of their core components is the support frame, which is mainly used to support the LED chip, provide electrical connections, and reflect light through a cup structure to improve light extraction efficiency.

[0003] Existing surface-mount LED brackets are typically made of plastics such as PPA (polyphthalamide) and bonded to a metal lead frame via injection molding. However, the metal portion of traditional brackets is relatively thin and poorly connected to external heat dissipation paths, resulting in the inability to dissipate heat generated by the chip in a timely manner, affecting the luminous efficacy and lifespan of the LED. Furthermore, the bonding strength between the metal terminals and the plastic body is insufficient, and gaps may appear due to differences in thermal expansion coefficients when temperatures change, affecting airtightness and reliability.

[0004] To address the problems mentioned above, a surface-mount LED chip support structure is proposed. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the present invention provides a surface-mount LED bead bracket structure, which overcomes the shortcomings of the prior art and solves the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a surface mount LED chip support structure, comprising a support body made of insulating material, wherein the support body is provided with at least one cup for placing LED chips, the bottom of the cup is provided with mutually isolated positive and negative conductive terminals, the outer side of the bottom of the support body is provided with a positive pad electrically connected to the positive conductive terminal and a negative pad electrically connected to the negative conductive terminal for surface mounting, the positive and negative conductive terminals are respectively provided with flat soldering areas for soldering gold wires, and the sidewall of the cup is designed as a slope to facilitate light reflection.

[0007] As a preferred technical solution of this utility model, the inner surface of the bowl is coated with a high reflectivity coating, such as an electroplated silver layer or a high reflectivity material such as titanium dioxide, to significantly improve light reflectivity and increase LED light output efficiency.

[0008] As a preferred embodiment of this utility model, at least one through hole is provided on the positive conductive terminal and the negative conductive terminal. The through hole is filled with a metal material (such as copper) to form an electroplated through hole. This not only enhances the mechanical connection strength of the upper and lower metal layers, but also provides an additional vertical heat dissipation channel, thereby improving the overall heat dissipation performance.

[0009] As a preferred technical solution of this utility model, the bottom of the bracket body is also provided with positioning marks, such as recesses or printed marks, to facilitate visual positioning and mounting in subsequent automated production.

[0010] As a preferred embodiment of this invention, the surfaces of the positive and negative electrode pads are coated with a solderable plating, such as tin or silver plating, to ensure good solderability.

[0011] In a preferred embodiment of this invention, the insulating material is a high-temperature thermoplastic or thermosetting plastic, and the conductive terminal is a circuit pattern formed by etching copper foil.

[0012] As a preferred embodiment of this utility model, both the positive electrode pad and the negative electrode pad are provided with heat dissipation holes to increase the contact area with air and improve the heat dissipation effect.

[0013] Compared with the prior art, the beneficial effects of this utility model are: 1. By setting metal-filled through-holes on the conductive terminals, an efficient vertical heat dissipation path is established from the chip to the PCB board, which effectively reduces the junction temperature of the LED chip and improves luminous efficacy and lifespan.

[0014] 2. The sloping structure of the bowl-shaped cup, combined with the high-reflectivity coating inside, can more effectively reflect and export light, reduce internal absorption, and improve brightness.

[0015] 3. The metal through-hole enhances the interlocking strength and tightness between the metal terminal and the plastic body, reduces the stress caused by thermal expansion and contraction, and improves the product's airtightness and resistance to mechanical impact.

[0016] 4. The flat welding area facilitates gold wire bonding operations, and the positioning marks on the bottom facilitate automated mounting. The overall structural design optimizes the production process and improves production efficiency and yield. Attached Figure Description

[0017] Figure 1 This is a three-dimensional illustration of the present invention. Figure 1 ; Figure 2 This is a three-dimensional illustration of the present invention. Figure 2 ; Figure 3 This is a side view of the present invention; Figure 4 For the present utility model Figure 3 Schematic diagram of the cross section at point AA; Figure 5 For the present utility model Figure 4 Enlarged view of a portion of point A in the middle; Figure 6 For the present utility model Figure 2 A magnified view of a portion of point B in the middle.

[0018] In the diagram: 1. Support body; 2. Bowl; 3. Positive conductive terminal; 4. Negative conductive terminal; 5. Positive pad; 6. Negative pad; 7. Welding area; 8. High reflectivity coating; 9. Through hole; 10. Metal material; 11. Heat dissipation hole; 12. Positioning mark. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-6 A surface-mount LED lamp bead bracket structure, wherein the bracket body 1 is made of PPA material by injection molding, and a cup 2 is provided on the bracket body 1. The bottom of the cup 2 is provided with a positive conductive terminal 3 and a negative conductive terminal 4 formed by etching process and insulated from each other. The two are usually made of copper.

[0021] The bottom outer side of the bracket body 1 is provided with positive electrode pad 5 and negative electrode pad 6, which are electrically connected to positive electrode conductive terminal 3 and negative electrode conductive terminal 4 through internal circuits, respectively. The upper surface of positive electrode conductive terminal 3 and negative electrode conductive terminal 4 is provided with flat welding area 7 for welding the gold wire of LED chip. The side wall of cup 2 is a smooth sloping surface.

[0022] As a preferred embodiment, the inner surface of the bowl 2 is coated with a high-reflectivity coating 8 formed by electroplating silver. A through hole 9 is provided on each of the positive conductive terminal 3 and the negative conductive terminal 4. The through hole 9 is filled with metal material 10 by electroplating to form a good electrical and thermal connection between the upper and lower surfaces. A recess is provided at one corner of the bottom of the bracket body 1 as a positioning mark 12. The surfaces of the positive solder pad 5 and the negative solder pad 6 are plated with a tin layer. Heat dissipation holes 11 are provided through the ends of the positive solder pad 5 and the negative solder pad 6 to improve heat dissipation.

[0023] Working principle: In use, the LED chip is die-bonded to the bottom of the cup 2, and then the electrode of the chip is connected to the soldering area 7 on another conductive terminal by gold wire. Finally, the cup 2 is filled with encapsulating glue and cured to form a complete surface mount LED bead. During SMT assembly, the machine vision system identifies the positioning mark 12 and accurately mounts the bracket to the corresponding position on the circuit board. The positive pad 5 and the negative pad 6 are bonded to the pads on the PCB board by reflow soldering.

[0024] Finally, it should be noted that in the description of this utility model, the terms "vertical," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0025] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A surface-mount LED bead support structure, comprising a support body (1), wherein the support body (1) is made of insulating material, characterized in that: The support body (1) is provided with at least one bowl (2) for placing LED chips. The bottom of the bowl (2) is provided with a positive conductive terminal (3) and a negative conductive terminal (4) that are isolated from each other. The bottom outer side of the bracket body (1) is provided with a positive electrode pad (5) electrically connected to the positive electrode conductive terminal (3) and a negative electrode pad (6) electrically connected to the negative electrode conductive terminal (4). The positive conductive terminal (3) and the negative conductive terminal (4) are respectively provided with welding areas (7) for welding gold wires; The sidewalls of the bowl (2) are sloping.

2. The surface mount LED bead support structure according to claim 1, characterized in that: The inner surface of the bowl (2) is coated with a high reflectivity coating (8).

3. The surface mount LED bead support structure according to claim 1, characterized in that: At least one through hole (9) is provided on the positive conductive terminal (3) and the negative conductive terminal (4), and the through hole (9) is filled with metal material (10) so that the upper and lower surfaces of the conductive terminal are electrically connected.

4. The surface mount LED bead support structure according to claim 1, characterized in that: The bottom of the support body (1) is also provided with a positioning mark (12).

5. The surface mount LED bead support structure according to claim 1, characterized in that: The surfaces of the positive electrode pad (5) and the negative electrode pad (6) are solderable coatings.

6. The surface mount LED bead support structure according to claim 1, characterized in that: The insulating material is a high-temperature thermoplastic or thermosetting plastic, and the positive conductive terminal (3) and the negative conductive terminal (4) are formed by copper foil etching.

7. The surface mount LED bead support structure according to claim 1, characterized in that: Both the positive electrode pad (5) and the negative electrode pad (6) have heat dissipation holes (11) through them.

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