Lens module and electronic device

Abstract

The application discloses a lens module and an electronic device. The lens module comprises a holder structure, an opening is arranged on the holder structure, an installation cavity is arranged in the holder structure, and the installation cavity is communicated with the opening; a motor assembly is arranged in the installation cavity, the motor assembly can move relative to the holder structure, and the motor assembly is arranged opposite to the opening; a photosensitive chip is arranged in the installation cavity, and the photosensitive chip is connected to the side of the motor assembly which is away from the opening; and a heat dissipation structure, at least a part of the heat dissipation structure is arranged in the installation cavity, the part of the heat dissipation structure in the installation cavity is arranged on the circumferential side of the photosensitive chip; the part of the heat dissipation structure in the installation cavity is provided with a flow channel, a flowable heat dissipation medium is arranged in the flow channel, and the heat dissipation medium is used for conducting heat to the photosensitive chip. The application reasonably sets the structure of the lens module, can effectively reduce the temperature rise at the photosensitive chip, so that the probability of the imaging quality decline caused by the junction temperature rise of the photosensitive chip can be reduced.

Description

Technical Field

[0001] This application belongs to the field of lens module technology, specifically relating to a lens module and an electronic device. Background Technology

[0002] The lens module includes a gimbal structure and an image sensor, with the image sensor located within the gimbal structure. There is no heat dissipation mechanism for the image sensor within the lens module. During prolonged operation, the image sensor generates significant heat, which accumulates at the sensor's junction. The low heat dissipation efficiency of the image sensor leads to increased junction temperature. This increased junction temperature results in decreased image quality and significantly reduces the product's performance. Utility Model Content

[0003] This application aims to provide a lens module and electronic device that solves the problem in the related art where the low heat dissipation efficiency of the photosensitive chip and the rise in the junction temperature of the photosensitive chip during long-term operation of the lens module lead to a decrease in image quality.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of this application propose a lens module, comprising: a gimbal structure having an opening and a mounting cavity connected to the opening; a motor assembly disposed within the mounting cavity, the motor assembly being movable relative to the gimbal structure and disposed opposite to the opening; a photosensitive chip disposed within the mounting cavity, the photosensitive chip being connected to the side of the motor assembly away from the opening; and a heat dissipation structure, at least a portion of which is disposed within the mounting cavity, the portion of the heat dissipation structure located within the mounting cavity being disposed around the photosensitive chip; the portion of the heat dissipation structure located within the mounting cavity having a flow channel, the flow channel having a flowable heat dissipation medium for conducting heat to the photosensitive chip.

[0006] Secondly, embodiments of this application provide an electronic device including: the lens module of the first aspect.

[0007] In embodiments of this application, the lens module includes a gimbal structure, a motor assembly, a photosensitive chip, and a heat dissipation structure.

[0008] The gimbal structure has an opening, and the gimbal structure has a mounting cavity inside, which is connected to the opening.

[0009] At least a portion of the heat dissipation structure, the motor assembly, and the photosensitive chip are all located within the mounting cavity. That is, the gimbal structure serves as the mounting carrier for the motor assembly, photosensitive chip, and heat dissipation structure, ensuring the proper dimensional fit of these components.

[0010] Because a heat dissipation structure is incorporated, with its portion located within the mounting cavity around the image sensor chip, the distance between the heat dissipation structure and the image sensor chip is shortened. This heat dissipation structure dissipates heat generated during the operation of the image sensor chip, thereby reducing the junction temperature of the image sensor chip and lowering the temperature rise at the image sensor chip. This reduces the probability of image quality degradation due to increased junction temperature of the image sensor chip, providing structural support for the stable and reliable operation of the lens module.

[0011] Specifically, the portion of the heat dissipation structure located within the mounting cavity has a flow channel containing a heat dissipation medium that can flow within the channel. As the heat dissipation medium flows within the channel, it can conduct heat to the photosensitive chip, that is, exchange heat with the photosensitive chip and carry away the heat, thereby reducing the junction temperature of the photosensitive chip and accelerating its heat dissipation.

[0012] It is understandable that the heat dissipation structure and the photosensitive chip are two independent structures. That is, the existing structure of the photosensitive chip will not be changed, and the heat dissipation requirements of the photosensitive chip can still be met.

[0013] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0014] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0015] Figure 1 This is an exploded view of the first part of the structure of a lens module according to an embodiment of this application;

[0016] Figure 2 This is a schematic diagram of the first part of the lens module structure according to an embodiment of this application;

[0017] Figure 3 for Figure 2 The lens module shown is a cross-sectional view along the AA direction;

[0018] Figure 4 This is an exploded view of the second part of the structure of a lens module according to an embodiment of this application;

[0019] Figure 5 This is a schematic diagram of a heat dissipation structure according to an embodiment of this application;

[0020] Figure 6 This is a schematic diagram of the first part of a heat dissipation structure according to an embodiment of this application;

[0021] Figure 7 for Figure 6The heat dissipation structure shown is a cross-sectional view along the BB direction;

[0022] Figure 8 for Figure 6 The heat dissipation structure shown is a cross-sectional view along the CC direction;

[0023] Figure 9 This is a schematic diagram of the second part of the heat dissipation structure according to an embodiment of this application;

[0024] Figure 10 for Figure 9 The heat dissipation structure shown is a cross-sectional view along the DD direction.

[0025] Figure label:

[0026] Figures 1 to 10 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0027] 10 Lens module, 100 Gimbal structure, 110 Opening, 120 Mounting cavity, 200 Motor assembly, 310 Photosensitive chip, 320 Connector, 330 Flexible circuit board, 400 Heat dissipation structure, 410 Pump body, 411 Inlet, 412 Outlet, 413 First check valve, 414 Second check valve, 415 Piezoelectric element, 420 Flow channel, 422 First part of flow channel, 424 Second part of flow channel, 430 Heat dissipation medium, 500 Lens, 600 Bracket. Detailed Implementation

[0028] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0029] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0030] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0032] The following is combined Figures 1 to 10 This application describes a lens module 10 and an electronic device according to embodiments of the present application.

[0033] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, a lens module 10 according to some embodiments of this application includes: a gimbal structure 100, an opening 110 on the gimbal structure 100, a mounting cavity 120 inside the gimbal structure 100, and the mounting cavity 120 communicating with the opening 110; a motor assembly 200 disposed in the mounting cavity 120, the motor assembly 200 being movable relative to the gimbal structure 100, and the motor assembly 200 being disposed opposite to the opening 110; a photosensitive chip 310 disposed in the mounting cavity 120, the photosensitive chip 310 being connected to the side of the motor assembly 200 away from the opening 110; a heat dissipation structure 400, at least a portion of the heat dissipation structure 400 being disposed in the mounting cavity 120, the portion of the heat dissipation structure 400 located in the mounting cavity 120 being located around the photosensitive chip 310; the portion of the heat dissipation structure 400 located in the mounting cavity 120 being provided with a flow channel 420, the flow channel 420 being provided with a flowable heat dissipation medium 430, the heat dissipation medium 430 being used for heat conduction on the photosensitive chip 310.

[0034] According to an embodiment of this application, the lens module 10 includes a gimbal structure 100, a motor assembly 200, a photosensitive chip 310, and a heat dissipation structure 400.

[0035] The gimbal structure 100 has an opening 110 and a mounting cavity 120 inside, which is connected to the opening 110.

[0036] At least a portion of the heat dissipation structure 400, the motor assembly 200, and the photosensitive chip 310 are all located within the mounting cavity 120. That is, the gimbal structure 100 serves as a mounting carrier for the motor assembly 200, the photosensitive chip 310, and the heat dissipation structure 400, and has the function of mounting and fixing the motor assembly 200, the photosensitive chip 310, and the heat dissipation structure 400, ensuring the mating dimensions of the motor assembly 200, the photosensitive chip 310, and the heat dissipation structure 400.

[0037] Because a heat dissipation structure 400 is provided, and the portion of the heat dissipation structure 400 located within the mounting cavity 120 is situated around the photosensitive chip 310, the distance between the heat dissipation structure 400 and the photosensitive chip 310 is shortened. The heat dissipation structure 400 is used to dissipate heat from the photosensitive chip 310, thereby removing the heat generated during operation and reducing the junction temperature of the photosensitive chip 310. This reduces the probability of image quality degradation due to increased junction temperature of the photosensitive chip 310, providing structural support for the stable and reliable operation of the lens module 10.

[0038] Specifically, the portion of the heat dissipation structure 400 located within the mounting cavity 120 is provided with a flow channel 420, and a heat dissipation medium 430 is provided within the flow channel 420. The heat dissipation medium 430 can flow within the flow channel 420. When the heat dissipation medium 430 flows within the flow channel 420, it can conduct heat to the photosensitive chip 310 and carry away the heat, thereby reducing the junction temperature of the photosensitive chip 310 and accelerating the heat dissipation of the photosensitive chip 310.

[0039] It is understandable that the heat dissipation structure 400 and the photosensitive chip 310 are two independent structures. That is, the existing structure of the photosensitive chip 310 will not be changed, and the heat dissipation requirements of the photosensitive chip 310 can still be met.

[0040] Understandably, the motor assembly 200 is located within the mounting cavity 120 and is capable of moving relative to the gimbal structure 100. The motor assembly 200 is used to mount the lens 500. Since the image sensor 310 is connected to the side of the motor assembly 200 opposite to the port 110, when the image stabilization function of the lens module 10 is used, the image sensor 310 also moves relative to the gimbal structure 100 along with the motor assembly 200 when the motor assembly 200 drives the lens 500 to move relative to the gimbal structure 100.

[0041] For example, such as Figure 3 As shown, the lens module 10 also includes a bracket 600, which is located in the mounting cavity 120. The motor assembly 200 is mounted on the bracket 600. The bracket 600 is movably connected to the gimbal structure 100. When the image stabilization function of the lens module 10 is used, the motor assembly 200 moves relative to the gimbal structure 100 through the bracket 600.

[0042] It is understood that the portion of the heat dissipation structure 400 located within the mounting cavity 120 is situated around the photosensitive chip 310. In other words, the portion of the heat dissipation structure 400 located within the mounting cavity 120 is situated around the photosensitive chip 310 to ensure the heat dissipation efficiency of the photosensitive chip 310. Furthermore, the heat dissipation structure 400 does not obstruct the light transmitted to the photosensitive chip 310.

[0043] Understandably, light enters the image sensor 310 through the lens 500. The image sensor 310 is electrically connected to the motor assembly 200. The image sensor 310 is used to convert light signals into electrical signals, thereby completing image capture and processing.

[0044] For example, when a portion of the heat dissipation structure 400 is located within the mounting cavity 120, the entire flow channel 420 is located within the mounting cavity 120.

[0045] For example, when a portion of the heat dissipation structure 400 is located within the mounting cavity 120, a portion of the flow channel 420 is located within the mounting cavity 120, and another portion of the flow channel 420 is located outside the gimbal structure 100.

[0046] In some embodiments, the portion of the heat dissipation structure 400 located within the mounting cavity 120 is fitted to the side of the photosensitive chip 310 facing away from the motor assembly 200.

[0047] In this embodiment, the portion of the heat dissipation structure 400 located within the mounting cavity 120 is situated on the side of the photosensitive chip 310 facing away from the motor assembly 200, and the portion of the heat dissipation structure 400 located within the mounting cavity 120 is fitted to the photosensitive chip 310.

[0048] By rationally setting the cooperation structure between the heat dissipation structure 400 and the photosensitive chip 310, the distance between the heat dissipation medium 430 of the heat dissipation structure 400 and the photosensitive chip 310 is reduced, and the contact area between the heat dissipation medium 430 and the photosensitive chip 310 is increased. This allows the heat generated by the photosensitive chip 310 during operation to be transferred to the heat dissipation structure 400 in a timely manner, thereby accelerating heat dissipation and providing structural support for improving the heat dissipation efficiency of the photosensitive chip 310.

[0049] In addition, the portion of the heat dissipation structure 400 located within the mounting cavity 120 is situated on the side of the photosensitive chip 310 away from the motor assembly 200. Therefore, the heat dissipation structure 400 will not block the light transmitted from the lens 500 on the motor assembly 200 to the photosensitive chip 310, thus ensuring the performance of the lens module 10.

[0050] In some embodiments, such as Figure 1 , Figure 3 , Figure 4 , Figure 6 and Figure 8 As shown, the first part 422 of the flow channel is disposed opposite to the photosensitive chip 310; the heat dissipation structure 400 includes a pump body 410, which is connected to the flow channel 420 and is used to drive the heat dissipation medium 430 to flow along the flow channel 420.

[0051] In this embodiment, the area of ​​the flow channel 420 is divided such that the first part 422 of the flow channel is positioned opposite to the photosensitive chip 310, thereby indirectly defining the positional relationship between the heat dissipation medium 430 flowing in the flow channel 420 and the photosensitive chip 310. This ensures the heat exchange area between the heat dissipation medium 430 and the photosensitive chip 310, enabling the heat dissipation medium 430 to effectively exchange heat with the photosensitive chip 310 when flowing in the flow channel 420, and to carry away the heat, thus providing structural support for improving the heat dissipation efficiency of the photosensitive chip 310.

[0052] The heat dissipation structure 400 includes a pump body 410, which is connected to a flow channel 420. The pump body 410 serves as a power source to drive the heat dissipation medium 430 to flow effectively within the flow channel 420, thereby meeting the requirements for effective heat exchange between the heat dissipation medium 430 and the photosensitive chip 310.

[0053] For example, the pump body 410 is located within the mounting cavity 120.

[0054] For example, when a portion of the heat dissipation structure 400 is located within the mounting cavity 120, the pump body 410 of the heat dissipation structure 400 is located on one side of the gimbal structure 100, that is, the pump body 410 is located on the outside of the gimbal structure 100, and the pump body 410 does not occupy the internal space of the gimbal structure 100.

[0055] In some embodiments, such as Figure 8 As shown, the first part 422 of the flow channel is arranged in a curved manner.

[0056] In this embodiment, the first part 422 of the flow channel is arranged in a curved manner, that is, the internal space of the part of the heat dissipation structure 400 and the photosensitive chip 310 that are opposite to each other is reasonably utilized to increase the length of the first part 422 of the flow channel, increase the heat exchange area between the heat exchange medium flowing in the flow channel 420 and the photosensitive chip 310, which is beneficial to improving the heat dissipation efficiency of the photosensitive chip 310.

[0057] In addition, the first part 422 of the flow channel is arranged in a curved manner, and the heat dissipation medium 430 flowing in the flow channel 420 can partially contact different positions of the photosensitive chip 310, which can make the heat dissipation effect of different positions of the photosensitive chip 310 more balanced, reduce the probability of the junction temperature of the layout area of ​​the photosensitive chip 310 being too high, and help extend the service life of the photosensitive chip 310.

[0058] For example, the first portion 422 of the flow channel is arranged in an "S" shape.

[0059] For example, the first portion 422 of the flow channel is arranged in a "W" shape.

[0060] For example, the first portion 422 of the flow channel is arranged in a spiral shape.

[0061] In some embodiments, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 and Figure 7 As shown, the lens module 10 also includes: a connector 320 located on one side of the gimbal structure 100; a flexible circuit board 330, one end of which is connected to the connector 320, and the other end of which extends into the mounting cavity 120 and is connected to the photosensitive chip 310; the portion of the heat dissipation structure 400 located in the mounting cavity 120 is also fitted with the flexible circuit board 330, and the second portion 424 of the flow channel is positioned opposite to the flexible circuit board 330.

[0062] In this embodiment, the lens module 10 further includes a connector 320 and a flexible circuit board 330, with the flexible circuit board 330 connected between the connector 320 and the photosensitive chip 310.

[0063] One end of the flexible circuit board 330 is connected to the connector 320, and the other end of the flexible circuit board 330 extends into the mounting cavity 120 and is connected to the photosensitive chip 310. That is, the gimbal structure 100 is also provided with a communication port, which connects to the mounting cavity 120, and the other end of the flexible circuit board 330 extends into the mounting cavity 120 through the communication port and is connected to the photosensitive chip 310.

[0064] The portion of the heat dissipation structure 400 located within the mounting cavity 120 is also fitted to the flexible circuit board 330, and the second portion 424 of the flow channel is positioned opposite to the flexible circuit board 330. Thus, the heat dissipation structure 400 can dissipate heat not only for the photosensitive chip 310 but also for the flexible circuit board 330.

[0065] Since the portion of the heat dissipation structure 400 located within the mounting cavity 120 is also in contact with the flexible circuit board 330, the distance between the heat dissipation medium 430 and the flexible circuit board 330 of the heat dissipation structure 400 is reduced, and the contact area between the heat dissipation medium 430 and the flexible circuit board 330 is increased. This allows the heat generated by the flexible circuit board 330 during operation to be transferred to the heat dissipation structure 400 in a timely manner, thereby accelerating heat dissipation and providing structural support for improving the heat dissipation efficiency of the flexible circuit board 330.

[0066] In addition, the second part 424 of the flow channel is arranged opposite to the flexible circuit board 330 to indirectly limit the positional relationship between the heat dissipation medium 430 flowing in the flow channel 420 and the flexible circuit board 330, ensuring the heat exchange area of ​​the heat dissipation medium 430 and the flexible circuit board 330. This allows the heat dissipation medium 430 to effectively exchange heat with the photosensitive chip 310 and the flexible circuit board 330 when it flows in the flow channel 420, and to carry away the heat, providing structural support for improving the heat dissipation efficiency of the photosensitive chip 310 and the flexible circuit board 330.

[0067] In some embodiments, the portion of the heat dissipation structure 400 that is attached to the flexible circuit board 330 is a flexible portion; or both the portion of the heat dissipation structure 400 that is attached to the flexible circuit board 330 and the portion of the heat dissipation structure 400 that is attached to the photosensitive chip 310 are flexible portions.

[0068] In this embodiment, the portion of the heat dissipation structure 400 that is attached to the flexible circuit board 330 is a flexible part. That is, the portion of the heat dissipation structure 400 that is attached to the flexible circuit board 330 can deform or adapt its shape under external force or environmental changes without damaging or losing the original function of the heat dissipation structure 400. For example, the flexible part can adapt to the shape of the flexible circuit board 330.

[0069] Alternatively, the portions of the heat dissipation structure 400 that are attached to the flexible circuit board 330 and the portions of the heat dissipation structure 400 that are attached to the photosensitive chip 310 are both flexible portions. That is, both portions of the heat dissipation structure 400 that are attached to the flexible circuit board 330 and the portions of the heat dissipation structure 400 that are attached to the photosensitive chip 310 can deform or adapt their shape under external force or environmental changes without damaging or losing the original function of the heat dissipation structure 400. For example, the flexible portion can adapt to the shape of the flexible circuit board 330.

[0070] When the motor assembly 200 can drive the photosensitive chip 310 to move relative to the gimbal structure 100, the distance between the photosensitive chip 310 and the pump body 410 changes accordingly, and the shape of the flexible part of the heat dissipation structure 400 and the flexible circuit board 330 also changes accordingly. In this way, the influence of the stiffness of the heat dissipation structure 400 on the movement of the motor assembly 200 can be effectively reduced, thereby reducing the impact of the heat dissipation structure 400 on the image stabilization performance of the lens module 10, and meeting the image quality requirements of the lens module 10.

[0071] In some embodiments, the flexible circuit board 330 is partially bent within the mounting cavity 120.

[0072] In this embodiment, the flexible circuit board 330 is partially bent within the mounting cavity 120.

[0073] Since the portion of the heat dissipation structure 400 that is attached to the flexible circuit board 330 is a flexible part, this flexible part is also bent and arranged accordingly. The shape of the bent flexible part is the same as and matches the shape of the bent flexible circuit board 330. This reduces the space occupied by the flexible circuit board 330 and the heat dissipation structure 400 in the gimbal structure 100, which helps to reduce the overall size of the lens module 10. In addition, when the electronic device is dropped or vibrated, the flexible part of the flexible circuit board 330 and the heat dissipation structure 400 can absorb the impact energy through bending, which helps to improve the structural reliability and durability, extend the service life, reduce the transmission loss of high-frequency signals, and optimize signal transmission performance.

[0074] In some embodiments, the portion of the heat dissipation structure 400 that is attached to the flexible circuit board 330 and the flexible circuit board 330 are an integral structure.

[0075] In this embodiment, the portion of the heat dissipation structure 400 that is attached to the flexible circuit board 330 is an integral structure with the flexible circuit board 330. This structure eliminates the assembly process of the heat dissipation structure 400 and the flexible circuit board 330, simplifies the molding process of the heat dissipation structure 400 and the flexible circuit board 330, and helps improve the processing efficiency of the product. In addition, the integral structure of the portion of the heat dissipation structure 400 and the flexible circuit board 330 ensures the dimensional accuracy of the product, reduces the processing steps of adhering the heat dissipation structure 400 and the flexible circuit board 330, helps reduce the overall thickness of the heat dissipation structure 400 and the flexible circuit board 330, and helps reduce the overall stiffness of the heat dissipation structure 400 and the flexible circuit board 330. This effectively reduces the impact of the stiffness of the heat dissipation structure 400 and the flexible circuit board 330 on the movement of the motor assembly 200, thereby reducing the impact of the heat dissipation structure 400 and the flexible circuit board 330 on the image stabilization performance of the lens module 10, and can meet the imaging quality requirements of the lens module 10.

[0076] In some embodiments, such as Figure 3 As shown, with a portion of the heat dissipation structure 400 located within the mounting cavity 120, the pump body 410 and the connector 320 are located on the same side of the gimbal structure 100.

[0077] In this embodiment, with a portion of the heat dissipation structure 400 located within the mounting cavity 120, the pump body 410 is located on one side of the gimbal structure 100. The connector 320 is located on one side of the gimbal structure 100. That is, both the pump body 410 and the connector 320 are located on the outside of the gimbal structure 100.

[0078] The pump body 410 does not occupy the internal space of the gimbal structure 100, thus avoiding interference between the pump body 410 and the internal components of the gimbal structure 100.

[0079] In addition, the pump body 410 is located on the outside of the gimbal structure 100. Therefore, the heat generated by the operation of the pump body 410 will not accumulate inside the gimbal structure 100, reducing the heat dissipation impact on the internal components of the gimbal structure 100.

[0080] The pump body 410 and connector 320 are located on the same side of the gimbal structure 100. The unified arrangement of the components can reduce the number of openings 110 on the gimbal structure 100, which is beneficial to reducing the overall size of the lens module 10.

[0081] In some embodiments, such as Figure 3 As shown, the portion of the flexible circuit board 330 located between the gimbal structure 100 and the connector 320 is connected to the pump body 410.

[0082] In this embodiment, the portion of the flexible circuit board 330 located between the gimbal structure 100 and the connector 320 is connected to the pump body 410. That is, a portion of the flexible circuit board 330 is located within the mounting cavity 120 and connected to the photosensitive chip 310, while another portion extends outside the gimbal structure 100 and is connected to the connector 320. The pump body 410 of the heat dissipation structure 400 is connected to the portion of the flexible circuit board 330 located outside the gimbal structure 100. In other words, the portion of the flexible circuit board 330 located outside the gimbal structure 100, the pump body 410, and the connector 320 are integrated into a single unit. This reduces the overall size of the portion of the flexible circuit board 330 located outside the gimbal structure 100, the pump body 410, and the connector 320, thereby reducing the overall size of the lens module 10 and consequently lowering the internal space occupancy rate of the lens module 10 within the electronic device.

[0083] In some embodiments, the heat dissipation medium 430 includes air or a heat dissipation fluid.

[0084] In this embodiment, when the heat dissipation medium 430 includes air, the air can exchange heat with the photosensitive chip 310 when it flows in the flow channel 420 and carry away the heat, thereby reducing the junction temperature of the photosensitive chip 310 and accelerating the heat dissipation of the photosensitive chip 310.

[0085] When the heat dissipation medium 430 includes a heat dissipation fluid, the heat dissipation fluid can exchange heat with the photosensitive chip 310 when it flows in the flow channel 420 and carry away the heat, thereby reducing the junction temperature of the photosensitive chip 310 and accelerating the heat dissipation of the photosensitive chip 310.

[0086] For example, the heat dissipation fluid includes any one or a combination of the following: water, oil, and condensate.

[0087] In some embodiments, such as Figure 9 and Figure 10 As shown, when the heat dissipation medium 430 includes air, the pump body 410 is provided with an inlet 411 and an outlet 412, both of which are connected to the flow channel 420. A first check valve 413 is provided at the inlet 411, and a second check valve 414 is provided at the outlet 412. The first check valve 413 is used to conduct flow from the inlet 411 to the flow channel 420, and the second check valve 414 is used to conduct flow from the flow channel 420 to the outlet 412. A piezoelectric element 415 is also provided inside the pump body 410, and the inlet 411 and the outlet 412 are located on the same side of the piezoelectric element 415.

[0088] In this embodiment, when the heat dissipation medium 430 includes air, the pump body 410 is provided with an inlet 411 and an outlet 412, the inlet 411 being connected to the flow channel 420 and the outlet 412 being connected to the flow channel 420.

[0089] A first check valve 413 is provided at the inlet 411 of the pump body 410. The first check valve 413 is used to conduct the flow from the inlet 411 to the flow channel 420.

[0090] A second check valve 414 is provided at the outlet 412 of the pump body 410. The second check valve 414 is used to guide the flow from the flow channel 420 to the outlet 412.

[0091] The inlet 411 and outlet 412 are located on the same side of the piezoelectric body 415. The piezoelectric body 415 can realize the mutual conversion of mechanical energy and electrical energy. When an alternating voltage is applied to the piezoelectric body 415, the piezoelectric body 415 will undergo periodic deformation until it pushes the heat dissipation medium 430 to flow in the flow channel 420. That is to say, the piezoelectric body 415 acts as a power source to drive the heat dissipation medium 430 to flow along the flow channel 420.

[0092] Specifically, the piezoelectric element 415 operates to drive air outside the heat dissipation structure 400 to flow into the flow channel 420 through the first one-way valve 413 at the inlet 411. After entering the flow channel 420, the air flows along the flow channel wall of the flow channel 420 and then flows out of the heat dissipation structure 400 through the second one-way valve 414 at the outlet 412.

[0093] With the pump body 410 located on one side of the gimbal structure 100, the pump body 410 can draw in air from the outside of the gimbal structure 100. The air exchanges heat with the photosensitive chip 310 and is then discharged into the environment outside the gimbal structure 100, thereby reducing the heat accumulated in the gimbal structure 100 and improving heat dissipation efficiency.

[0094] In some embodiments, such as Figure 4 As shown, the lens module 10 also includes a lens 500 disposed on the motor assembly 200. The lens 500 is exposed outside the gimbal structure 100 through the opening 110. The motor assembly 200 can drive the lens 500 to move relative to the gimbal structure 100.

[0095] In this embodiment, the lens module 10 further includes a lens 500, which is disposed on the motor assembly 200 and is movably connected to the motor assembly 200. The motor assembly 200 can drive the lens 500 to move relative to the gimbal structure 100.

[0096] When the image stabilization function of the lens module 10 is used, the motor assembly 200 drives the lens 500 assembly to move relative to the gimbal structure 100, and the image sensor 310 also moves with the motor assembly 200 relative to the gimbal structure 100.

[0097] When the focusing function of the lens module 10 is used, the motor assembly 200 drives the lens 500 to move relative to the gimbal structure 100.

[0098] According to some embodiments of this application, an electronic device is proposed, including a lens module 10 as described in any of the above embodiments.

[0099] The electronic device provided in this application includes the lens module 10 of any of the above embodiments, and therefore has all the beneficial effects of the lens module 10, which will not be described in detail here.

[0100] For example, the electronic device can be a mobile phone, tablet computer, laptop computer, handheld computer, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television (TV), ATM, or self-service machine, etc. The embodiments of this application do not specifically limit it.

[0101] For example, the lens module 10 of the embodiments of this application uses active heat dissipation to dissipate heat from the photosensitive chip 310. Specifically, the heat dissipation structure 400 is attached to the back of the photosensitive chip 310, and the heat dissipation medium 430 flows in the flow channel 420 of the heat dissipation structure 400 to conduct heat away from the photosensitive chip 310, thereby achieving rapid cooling.

[0102] For example, the heat dissipation structure 400 of the embodiments of this application includes a pump body 410, which can be a liquid micropump or an air micropump. The pump body 410 can guide flowing air or flowing liquid to the area below the photosensitive chip 310, thereby quickly removing heat to achieve the purpose of heat dissipation.

[0103] For example, the lens module 10 includes a motor assembly 200, a gimbal structure 100, a photosensitive chip 310, a flexible circuit board 330, a connector 320, and a heat dissipation structure 400. The heat dissipation structure 400 includes a pump body 410, and a flow channel 420 is provided within the heat dissipation structure 400, with a heat dissipation medium 430 disposed within the flow channel 420. The portion of the heat dissipation structure 400 with the flow channel 420 is a flexible circuit board. The motor assembly 200 is used to achieve focusing. The gimbal structure 100 is used to achieve image stabilization. The photosensitive chip 310, the flexible circuit board 330, and the connector 320 are integrated to achieve image imaging. The pump body 410 is the driving structure of the heat dissipation structure 400, realizing the circulation of the heat dissipation medium 430. The flow channel 420 serves to carry the heat dissipation medium 430, providing space for directional flow of the heat dissipation medium 430. The motor assembly 200 is connected to the bracket 600 via adhesive dispensing. The bracket 600 is located within the mounting cavity 120 and is movably connected to the gimbal structure 100, allowing the motor assembly 200 to move relative to the gimbal structure 100 via the bracket 600. The photosensitive chip 310 is bonded to the motor assembly 200 and extracts the imaging signal via a flexible circuit board 330 arranged in a bent configuration. The heat dissipation structure 400 is bonded to the flexible circuit board 330, and the portion bonded between the heat dissipation structure 400 and the flexible circuit board 330 is a flexible part, which is completely fitted to the flexible circuit board 330.

[0104] For example, the heat dissipation structure 400 includes a flexible circuit board and a pump body 410. The flexible circuit board has a flow channel 420, and a heat dissipation medium 430 is disposed within the flow channel 420. The pump body 410 is connected to the flexible circuit board and communicates with the flow channel 420. The flexible circuit board has a hollow structure, with the hollow portion forming the flow channel 420. The pump body 410 drives the heat dissipation medium 430 to circulate within the flow channel 420 of the flexible circuit board, achieving rapid cooling.

[0105] For example, the flexible board is fully bonded to the flexible circuit board 330 and is formed by bending to form a stacked structure with the same shape as the flexible circuit board 330. The pump body 410 is located outside the gimbal structure 100, and one end of the flexible board extends out of the gimbal structure 100 and is connected to the pump body 410.

[0106] For example, by setting up a heat dissipation structure 400, the heat generated by the photosensitive chip 310 can be effectively discharged through the heat dissipation medium 430, thereby achieving rapid cooling of the photosensitive chip 310 and solving the problem of deteriorated imaging effect caused by high temperature of the photosensitive chip 310.

[0107] For example, the heat dissipation structure 400 is fully attached to the flexible circuit board 330, and the gimbal structure 100 is brought out by bending. This can effectively reduce the impact of the stiffness of the heat dissipation structure 400 on the movement of the motor assembly 200, thereby reducing the impact of the heat dissipation structure 400 on the image stabilization performance of the lens module 10.

[0108] For example, the portion of the heat dissipation structure 400 that is attached to the flexible circuit board 330 is an integral structure with the flexible circuit board 330. This reduces the processing steps required to adhere the heat dissipation structure 400 and the flexible circuit board 330, which helps to reduce the overall thickness of the heat dissipation structure 400 and the flexible circuit board 330, and helps to reduce the overall stiffness of the heat dissipation structure 400 and the flexible circuit board 330. This effectively reduces the impact of the stiffness of the heat dissipation structure 400 and the flexible circuit board 330 on the movement of the motor assembly 200, thereby reducing the impact of the heat dissipation structure 400 and the flexible circuit board 330 on the image stabilization performance of the lens module 10, and can meet the imaging quality requirements of the lens module 10.

[0109] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0110] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A lens module, characterized in that, include: A gimbal structure, wherein the gimbal structure has an opening and a mounting cavity is provided inside the gimbal structure, and the mounting cavity communicates with the opening; A motor assembly is disposed within the mounting cavity, the motor assembly is movable relative to the gimbal structure, and the motor assembly is disposed opposite to the opening; A photosensitive chip is disposed within the mounting cavity, and the photosensitive chip is connected to the side of the motor assembly opposite to the opening; A heat dissipation structure, at least a portion of which is disposed within the mounting cavity, wherein the portion of the heat dissipation structure located within the mounting cavity is disposed on the periphery of the photosensitive chip; The portion of the heat dissipation structure located within the mounting cavity has a flow channel, and a flowable heat dissipation medium is provided within the flow channel. The heat dissipation medium is used for heat conduction to the photosensitive chip.

2. The lens module according to claim 1, characterized in that, The portion of the heat dissipation structure located within the mounting cavity is fitted to the side of the photosensitive chip facing away from the motor assembly.

3. The lens module according to claim 1 or 2, characterized in that, The first part of the flow channel is disposed opposite to the photosensitive chip; The heat dissipation structure includes a pump body connected to the flow channel, and the pump body is used to drive the heat dissipation medium to flow along the flow channel.

4. The lens module according to claim 3, characterized in that, Also includes: The connector is located on one side of the gimbal structure; A flexible circuit board, one end of which is connected to the connector, and the other end of which extends into the mounting cavity and is connected to the photosensitive chip; The portion of the heat dissipation structure located within the mounting cavity is also fitted to the flexible circuit board, and the second portion of the flow channel is positioned opposite to the flexible circuit board.

5. The lens module according to claim 4, characterized in that, With a portion of the heat dissipation structure located within the mounting cavity, the pump body and the connector are located on the same side of the gimbal structure.

6. The lens module according to claim 5, characterized in that, The portion of the flexible circuit board located between the gimbal structure and the connector is connected to the pump body.

7. The lens module according to claim 3, characterized in that, The heat dissipation medium includes air or a heat dissipation fluid.

8. The lens module according to claim 7, characterized in that, When the heat dissipation medium includes air, the pump body is provided with an inlet and an outlet, both of which are in communication with the flow channel; A first one-way valve is provided at the inlet, and a second one-way valve is provided at the outlet. The first one-way valve is used to open the flow from the inlet to the flow channel, and the second one-way valve is used to open the flow from the flow channel to the outlet. The pump body is also equipped with a piezoelectric element, and the inlet and the outlet are located on the same side of the piezoelectric element.

9. The lens module according to claim 1 or 2, characterized in that, Also includes: A lens is disposed on the motor assembly, the lens is exposed outside the gimbal structure through the opening, and the motor assembly is capable of driving the lens to move relative to the gimbal structure.

10. An electronic device, characterized in that, include: The lens module as described in any one of claims 1 to 9.

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