An electromagnetic interference shield for an integrated circuit

Abstract

The utility model relates to integrated circuit shield technical field, concretely to an integrated circuit shield of anti -electromagnetic interference, including first shield and second shield, second shield is fixed through welding mode in the ground plane of PCB board, first shield cladding second shield, first shield is equipped with at least two positioning holes, and the PCB board is equipped with locking hole corresponding with the positioning hole, and the locking hole is internal thread structure, and the positioning hole is connected with the locking hole through bolt positioning, second shield sets up the shielding layer, and the shielding layer is used for setting up the electronic component of PCB board edge shielding, first shield is equipped with at least two heat dissipation holes, thereby, the structure of " hierarchical shielding and regional coordination " of the present application is formed, and the inhibition ability of multiple frequency interference, space coupling is effectively promoted.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit shielding technology, specifically to an integrated circuit shielding cover that resists electromagnetic interference. Background Technology

[0002] As electronic devices evolve towards higher speeds, higher frequencies, smaller sizes, and higher integration, electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues have become key factors limiting system reliability and signal integrity. To reduce electromagnetic leakage and prevent external radiation interference, shielding cases are widely used in critical circuit areas such as communication modules (e.g., Wi-Fi, 5G RF modules), main control chips (e.g., CPU, MCU, FPGA), and power management modules (PMIC, LDO).

[0003] Traditional integrated circuit shielding covers primarily connect to the PCB ground plane via a single-layer metal shield structure through welding or press-fitting, providing basic shielding. Structurally, they often employ a combination of electro-foam and a supporting shell, suitable for adjustable circuits, but exhibiting poor shielding consistency. During the research and development process, this application discovered that current mainstream shielding structures still have shortcomings in improving high-frequency shielding capabilities, structural reliability, and control over interference from edge devices.

[0004] Based on this, this application improves upon existing traditional integrated circuit shielding to address the aforementioned technical deficiencies. Utility Model Content

[0005] The purpose of this invention is to provide an integrated circuit shielding cover that resists electromagnetic interference, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An integrated circuit shielding cover for electromagnetic interference protection includes a first shielding cover and a second shielding cover. The second shielding cover is fixed to the ground plane of a PCB board by welding. The first shielding cover covers the second shielding cover. The first shielding cover has at least two positioning holes. The PCB board has locking holes corresponding to the positioning holes. The locking holes have an internal thread structure. The positioning holes and the locking holes are connected by bolts for positioning.

[0008] The second shielding cover is provided with a shielding layer, which is used to shield electronic components located at the edge of the PCB board;

[0009] The first shielding cover has at least two heat dissipation holes.

[0010] The above technical solution produces the following technical effects:

[0011] The second shielding cover of this application is fixed to the grounding layer of the PCB by welding, forming a high-performance local shielding (low impedance grounding, close-range shielding) for the critical IC area in the PCB board; the first shielding cover covers the outside, forming a far-field shielding and thermal management protection layer. Thus, this application forms a structure of "hierarchical shielding and regional coordination", which effectively improves the ability to suppress multi-frequency interference and spatial coupling.

[0012] Furthermore, the shielding layer of the second shield extends to the edge area of ​​the PCB, covering components such as filters and power supplies, forming a complete ground envelope and suppressing common-mode interference introduced by traces at the board edge. Meanwhile, the top of the first shield has multiple heat dissipation holes, forming convection / radiation channels; heat can be quickly dissipated, reducing the temperature rise inside the shield and improving the thermal stability of the components.

[0013] As a further improvement to the electromagnetic interference-resistant integrated circuit shielding of this application, the second shielding is provided with at least one edge hole around its perimeter, which is used to dissipate heat from electronic components at the edge of the PCB board.

[0014] As a further improvement to the electromagnetic interference-resistant integrated circuit shielding of this application, the second shielding is made of nickel-plated aluminum foil material.

[0015] As a further improvement to the electromagnetic interference-resistant integrated circuit shielding of this application, the first shielding includes a nickel-plated copper plate layer, a wave-absorbing material layer, and a thermally conductive and insulating polymer layer.

[0016] As a further improvement to the electromagnetic interference-resistant integrated circuit shielding of this application, a nickel-plated copper plate layer is disposed on the outermost layer of the first shielding along the thickness direction of the first shielding, and a thermally conductive and insulating polymer layer is disposed on the innermost layer of the first shielding.

[0017] As a further improvement to the electromagnetic interference-resistant integrated circuit shielding of this application, the absorbing material layer is a silicon carbide-based composite material.

[0018] As a further improvement to the electromagnetic interference-resistant integrated circuit shielding of this application, the thermally conductive and insulating polymer layer is a PI film.

[0019] As a further improvement to the electromagnetic interference-resistant integrated circuit shielding of this application, the thickness of the first shielding is 0.5-1.5mm. Attached Figure Description

[0020] Figure 1 This is an exploded view of the overall structure of this utility model;

[0021] Figure 2 This is a cross-sectional view of the first shielding cover in the structure of this utility model;

[0022] In the diagram: 1-First shielding cover; 2-Second shielding cover; 3-PCB board;

[0023] 11-Positioning hole; 12-Heat dissipation hole; 13-Nickel-plated copper plate layer; 14-Wave absorption material layer; 15-Thermal conductive and insulating polymer layer;

[0024] 21-Shielding layer; 22-Edge hole;

[0025] 31-Locking hole; 32-Electronic component. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] It is known that existing integrated circuit shielding covers are widely used in the market. However, despite their widespread application, existing technologies still have the following major shortcomings:

[0028] Single-layer shielding cannot achieve tiered regional protection, and existing technologies generally use single-layer shielding structures, making it difficult to simultaneously ensure localized enhanced shielding of critical components and electromagnetic integrity control of the overall module. In particular, high-frequency modules are prone to failure due to external coupling. As a result, some electronic components (such as filter capacitors and connectors near the PCB edge) are easily shielded blind spots, and existing shielding covers cannot effectively cover the PCB edge area, resulting in common-mode interference paths not being blocked.

[0029] The installation methods for shielding covers often suffer from poor precision and are prone to displacement. Common pressing and bonding methods suffer from unstable contact and large assembly tolerances. They are also prone to loosening under strong vibration and thermal cycling environments, reducing the shielding effect. Furthermore, highly integrated circuits tend to generate a lot of heat. Traditional shielding covers are fully enclosed structures, which obstruct the heat dissipation path, reducing the thermal stability of the IC and even causing thermal failure, making loosening more likely.

[0030] Based on this, the motivation for this application arose to improve existing integrated circuit shielding.

[0031] The present application will be described in further detail below with reference to specific embodiments, but the embodiments of the present application are not limited thereto.

[0032] Implementation Method 1

[0033] like Figure 1As shown, in order to solve the technical defects of the existing integrated circuit protective covers mentioned above, this application designs an electromagnetic interference-resistant integrated circuit shield, including a first shield 1 and a second shield 2. The second shield 2 is fixed to the ground plane of the PCB board 3 by welding. The first shield 1 covers the second shield 2. The first shield 1 is provided with at least two positioning holes 11. The PCB board 3 is provided with locking holes 31 corresponding to the positioning holes 11. The locking holes 31 have an internal thread structure. The positioning holes 11 and the locking holes 31 are connected by bolts for positioning.

[0034] Furthermore, the second shielding cover 2 is provided with a shielding layer 21, which is used to shield electronic components located at the edge of the PCB board 3; the second shielding cover 2 thus achieves localized and efficient shielding, and is directly soldered to the PCB ground to form a low impedance path, providing near-field shielding for high-frequency sensitive chips; the self-extended shielding layer 21 covers the edge of the PCB to prevent common-mode interference from propagating to the outside.

[0035] Furthermore, the first shielding cover 1 is provided with at least two heat dissipation holes 12. Thus, the first shielding cover 1 adopts a design principle of overall encapsulation and thermal management. It externally covers the second shielding cover 2, absorbing residual radiated energy, and simultaneously forms a far-field electromagnetic enclosed cavity through its multi-point contact with the PCB ground structure, further blocking interference propagation. Specifically, the second shielding cover 2 contacts the PCB ground through metal welding, constructing an extremely low resistance path (typically <0.1Ω) to ensure reliable shielding effectiveness; the first shielding cover 1 engages with locking holes 31 (internal threads) on the PCB through at least two positioning holes 11, achieving both mechanical and electrical fixation with bolts, thus not only achieving rigid locking of the shielding cover but also ensuring multi-point grounding with the PCB ground network. This effectively avoids poor contact of the press-fit structure under vibration / thermal expansion; reduces the contact inductance between the shielding cover and the ground, and improves high-frequency shielding capability.

[0036] Furthermore, the second shield 2, an integrally formed shielding extension layer, incorporates passive components (such as power filters, inductors, and capacitors) at the PCB edge into the shielding range. This solves the problem of edge coupling blind spots caused by traditional shields avoiding components. The shielding layer 21 is grounded via soldering, forming a complete EMI enclosure boundary. The shielding layer 21 eliminates the path of high-frequency common-mode interference propagating through edge traces; it is particularly suitable for shielding high-speed signal interfaces and connectors near differential signals.

[0037] Furthermore, the top of the first shield 1 is designed with multiple heat dissipation holes 12, which remove heat from the inside of the shield through natural air convection or forced air cooling. Combined with the thermal conductivity of the metal shield itself, the heat from the chip can be conducted upward through the second shield 2 and then dissipated through the first shield. Alternatively, a thermally conductive pad can be placed on the inner surface of the shield for further use.

[0038] Furthermore, the second shielding cover 2 has at least one edge hole 22 around its perimeter. The edge hole 22 is used for heat dissipation of the electronic components at the edge of the PCB board 3. The edge holes 22 around the second shielding cover 2 not only enhance the heat dissipation effect on the electronic components at the edge of the PCB board 3, but also further optimize the shielding effectiveness. The design of the edge holes 22 allows for greater airflow, promotes natural heat convection, and reduces electromagnetic interference problems caused by heat accumulation. In addition, the position and number of the edge holes 22 are carefully arranged to ensure that effective heat dissipation is provided without affecting the overall structural strength and shielding performance of the shielding cover.

[0039] Implementation Method 2

[0040] like Figure 1-2 As shown, unlike Embodiment 1, to further improve the circuit protection capability of the shielding cover in this application, the second shielding cover 2 is made of nickel-plated aluminum foil material, mainly for close-range shielding of local sensitive ICs to avoid common-mode interference and crosstalk; the first shielding cover 1 includes a nickel-plated copper plate layer 13, a wave-absorbing material layer 14, and a thermally conductive and insulating polymer layer 15. The second shielding cover 2, made of nickel-plated aluminum foil material, has good conductivity and shielding effectiveness, effectively blocking electromagnetic interference, while its lightweight nature facilitates processing and installation. The first shielding cover 1 achieves multiple functions through a composite structure design. The nickel-plated copper plate layer 13, located on the outermost layer, provides good conductivity and corrosion resistance, enhancing the shielding effect; the wave-absorbing material layer 14 is a silicon carbide-based composite material, which effectively absorbs electromagnetic waves, further reducing electromagnetic interference; the thermally conductive and insulating polymer layer 15 is a PI film, ensuring both good insulation performance and excellent thermal conductivity, helping to quickly dissipate internal heat.

[0041] Furthermore, along the thickness direction of the first shield 1 (specifically...) Figure 1 (As shown from left to right), the nickel-plated copper plate layer 13 is disposed on the outermost layer of the first shielding cover 1 to form a conductive shell and provide strong EMI shielding capability (excellent conductivity and magnetic permeability). The absorbing material layer 14 in the middle layer is used to absorb high-frequency electromagnetic waves, reduce multi-band reflection, and improve high-frequency shielding capability. The thermally conductive insulating polymer layer 15 is disposed on the innermost layer of the first shielding cover 1 to adhere to the PCB, providing electrical insulation while also providing certain thermal conductivity to protect the circuit.

[0042] Furthermore, the absorbing material layer 14 is a silicon carbide-based composite material, which has excellent wave absorption performance and high temperature resistance. It can effectively absorb electromagnetic waves in a wide frequency range, reduce reflection and interference, and withstand high temperature environments to ensure the stable operation of the shielding cover under harsh conditions.

[0043] Furthermore, the thermally conductive and insulating polymer layer 15 is a PI film, which has excellent insulation properties and good thermal conductivity. It can quickly dissipate heat from inside the shield while ensuring electrical insulation, thereby improving thermal management efficiency.

[0044] Furthermore, the thickness of the first shielding cover 1 is 0.5-1.5mm. This thickness design ensures both the structural strength and shielding effectiveness of the shielding cover, while avoiding the increased weight and cost caused by excessive thickness, thus achieving a balance between performance and cost. It is worth noting that the three-layer composite structure of the first shielding cover 1 in this application is manufactured by molding or lamination processes, and the thickness can be adjusted according to frequency characteristic requirements.

[0045] Other aspects that are the same as in Implementation Method 1 will not be described again in this implementation method.

[0046] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, thereby limiting the scope of this invention to the appended claims and their equivalents.

Claims

1. An integrated circuit shielding cover for electromagnetic interference suppression, characterized in that, It includes a first shielding cover (1) and a second shielding cover (2). The second shielding cover (2) is fixed to the ground plane of the PCB board (3) by welding. The first shielding cover (1) covers the second shielding cover (2). The first shielding cover (1) is provided with at least two positioning holes (11). The PCB board (3) is provided with locking holes (31) corresponding to the positioning holes (11). The locking holes (31) are internally threaded. The positioning holes (11) and the locking holes (31) are connected by bolts. The second shielding cover (2) is provided with a shielding layer (21), which is used to shield the electronic components (32) disposed at the edge of the PCB board (3); The first shield (1) is provided with at least two heat dissipation holes (12).

2. The integrated circuit shielding cover for electromagnetic interference suppression according to claim 1, characterized in that, The second shield (2) has at least one edge hole (22) around its perimeter, which is used to dissipate heat from the electronic components (32) at the edge of the PCB board (3).

3. The integrated circuit shielding cover for electromagnetic interference suppression according to claim 1, characterized in that, The second shield (2) is made of nickel-plated aluminum foil.

4. The integrated circuit shielding cover for electromagnetic interference according to claim 1, characterized in that, The first shield (1) includes a nickel-plated copper plate layer (13), a wave-absorbing material layer (14), and a thermally conductive and insulating polymer layer (15).

5. The integrated circuit shielding cover for electromagnetic interference according to claim 4, characterized in that, Along the thickness direction of the first shield (1), the nickel-plated copper plate layer (13) is disposed on the outermost layer of the first shield (1), and the thermally conductive insulating polymer layer (15) is disposed on the innermost layer of the first shield (1).

6. The electromagnetic interference-resistant integrated circuit shielding cover according to claim 4, characterized in that, The microwave absorbing material layer (14) is a silicon carbide-based composite material.

7. The electromagnetic interference-resistant integrated circuit shielding cover according to claim 4, characterized in that, The thermally conductive and insulating polymer layer (15) is a PI film.

8. The integrated circuit shielding cover for electromagnetic interference according to claim 1, characterized in that, The thickness of the first shield (1) is 0.5-1.5mm.

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