Display panel, display device and preparation method of display panel

Abstract

The invention discloses a display panel, a display device and a preparation method of the display panel, the display panel comprises a display area, a transition area and a hole area, the display area is arranged around the transition area, and the transition area is arranged around the hole area. The display area is used for achieving light-emitting display of the display panel, and the hole area is used for arranging a photosensitive assembly. The display panel further comprises a substrate, a first insulating layer and a pixel definition layer. The pixel defining layer comprises a pixel limiting part and a pixel opening defined by the pixel limiting part, and the pixel opening is used for arranging a light-emitting unit to achieve light-emitting display of the display panel. A first hollow part is arranged on a first insulating layer located between a pixel definition layer and a substrate, the first hollow part is located in a transition area, and the first hollow part and a display area are arranged at an interval, so that the thickness of a brittle film layer of the display panel at the position of the first hollow part is reduced; the first insulating layer is difficult to form cracks and the cracks are difficult to extend to the display area, so that the use performance of the OLED display panel is improved.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Chinese Patent Application No. 202311017132.0, filed on August 10, 2023, entitled “Display Panel, Display Device and Method for Preparing Display Panel”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the display field, and in particular to a display panel, a display device and a method for manufacturing a display panel. Background Art

[0004] Organic Light Emitting Display (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0005] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0006] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, aiming to improve the performance of OLED display products.

[0007] A first aspect of the present application provides a display panel, comprising a display area, a hole area and a transition area between the display area and the hole area, the display panel further comprising: a substrate; a first insulating layer located on the substrate, the first insulating layer having a first hollow portion, the first hollow portion being located in the transition area and spaced apart from the display area, the first hollow portion extending from the transition area to the hole area and an adjacent edge of the transition area; a pixel definition layer located on a side of the first insulating layer away from the substrate, the pixel definition layer comprising a pixel defining portion and a pixel opening enclosed by the pixel defining portion; a light-emitting layer comprising a light-emitting unit located in the pixel opening.

[0008] According to the implementation scheme of the first aspect of the present application, the display panel also includes: a first encapsulation layer, located on the side of the light-emitting unit facing away from the substrate, the first encapsulation layer including a first portion located in the display area; a second encapsulation layer, located on the side of the first encapsulation layer facing away from the substrate; a third encapsulation layer, located on the side of the second encapsulation layer facing away from the substrate, and at least one of the first encapsulation layer and the third encapsulation layer is provided with a blocking groove or a cutting avoidance hole.

[0009] According to any of the aforementioned implementations of the first aspect of the present application, the second encapsulation layer is located in the display area.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes: an isolation structure located on one side of the substrate, the isolation structure includes a second isolation portion located in the transition area, the second isolation portion is spaced apart from the hole area, the first encapsulation layer also includes a second branch located in the transition area, at least part of the second branch is located in the first hollow portion, the second branch is divided by the second isolation portion to form a plurality of sub-portions, and the blocking groove located on the isolation structure is formed between adjacent sub-portions.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the sub-portion includes a first thinned portion located on at least one side of the second isolation portion.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel definition layer includes a second pixel defining portion located in the first hollow portion, and the second isolation portion is located on a side of the second pixel defining portion facing away from the substrate.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first isolation portion located in the display area, and the first isolation portion encloses a first isolation opening.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel definition layer includes a first pixel defining portion located in the display area, the pixel opening includes a first pixel opening enclosed by the first pixel defining portion, and the first pixel opening is connected to the first isolation opening.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a retaining wall, which is located on the side of the first insulating layer facing away from the substrate, and is arranged between the second pixel defining portion, the first pixel defining portion and the first hollow portion and surrounds the transition area in a ring shape.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, there are more than two retaining walls.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting unit includes a first light-emitting unit located in the first isolation opening.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes: a first electrode layer located on a side of the light-emitting layer facing away from the substrate, the first electrode layer including a first electrode located in the first isolation opening.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the first pixel defining portion and the first pixel defining portion light emitting layer include a second light emitting unit located on a side of the second isolation portion facing the hole area.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel defining portion further includes an extension portion connected to the first pixel defining portion, and at least a portion of the extension portion is located on a surface of the retaining wall facing away from the substrate.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the extension portion extends to the transition zone.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the extending portion and the second pixel defining portion are spaced apart.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the third packaging layer includes a cutting avoidance hole located in the hole area.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first hollow portion on the substrate and the orthographic projection of the cutting avoidance hole on the substrate at least partially overlap.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first hollow portion on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the first hollow portion is arranged to penetrate the first insulating layer along the thickness direction of the display panel.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, the first hollow portion includes an upper surface and a lower surface arranged relatively to each other along the thickness direction of the display panel, the upper surface is located on the side of the lower surface away from the substrate, and the hollow portion has a first opening located on the upper surface and a second opening located on the lower surface, and the orthographic projection of the second opening on the substrate is located within the orthographic projection of the first opening on the substrate.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, a third hollow portion located in the transition zone is opened on the first insulating layer, and the third hollow portion surrounds the first hollow portion and is spaced apart from the first hollow portion.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, a plurality of third hollow portions are arranged at intervals.

[0030] An embodiment of the second aspect of the present application provides a display panel, which includes a display area, a hole area and a transition area located between the display area and the hole area, and the display panel also includes: a substrate; a pixel definition layer located on one side of the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion; a light-emitting layer including a light-emitting unit located in the pixel opening; an inorganic encapsulation layer located on a side of the light-emitting unit away from the substrate, the inorganic encapsulation layer including a cutting avoidance hole, and the orthographic projection of the hole area on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate.

[0031] According to the implementation of the second aspect of the present application, the inorganic encapsulation layer includes a first encapsulation layer and a third encapsulation layer, the third encapsulation layer is located on the side of the first encapsulation layer away from the substrate, and the cutting avoidance hole is opened on the first encapsulation layer and / or the third encapsulation layer.

[0032] According to any of the aforementioned embodiments of the second aspect of the present application, the inorganic encapsulation layer includes a blocking groove located in the transition region.

[0033] According to any of the aforementioned embodiments of the second aspect of the present application, the blocking groove is ring-shaped around the hole area.

[0034] According to any of the aforementioned embodiments of the second aspect of the present application, the blocking groove is opened on the first packaging layer, and the cutting avoidance hole is opened on the third packaging layer.

[0035] According to any of the aforementioned implementations of the second aspect of the present application, the blocking groove is arranged to penetrate the first encapsulation layer along the thickness direction of the display panel.

[0036] According to any of the aforementioned embodiments of the second aspect of the present application, the cutting avoidance hole is arranged through the third encapsulation layer along the thickness direction of the display panel.

[0037] According to any of the aforementioned embodiments of the second aspect of the present application, the display panel also includes: an isolation structure located on the substrate, the isolation structure includes a second isolation portion located in the transition area, the second isolation portion is spaced apart from the hole area, and the blocking groove is located on the side of the second isolation portion facing away from the substrate.

[0038] According to any of the aforementioned embodiments of the second aspect of the present application, the display panel also includes: a first insulating layer, located on the substrate, the first insulating layer is provided with a first hollow portion, the first hollow portion is located in the transition zone and is spaced apart from the display zone, and the first hollow portion extends from the transition zone to the hole zone and the adjacent edge of the transition zone.

[0039] According to any of the aforementioned embodiments of the second aspect of the present application, the first hollow portion is arranged to penetrate the first insulating layer along the thickness direction of the display panel.

[0040] According to any of the aforementioned embodiments of the second aspect of the present application, the first hollow portion is ring-shaped around the hole area.

[0041] According to any of the aforementioned embodiments of the second aspect of the present application, the cutting avoidance hole is located in the transition zone.

[0042] According to any of the aforementioned embodiments of the second aspect of the present application, the orthographic projection of the first hollow portion on the substrate and the orthographic projection of the cutting avoidance hole on the substrate at least partially overlap.

[0043] According to any of the aforementioned embodiments of the second aspect of the present application, the orthographic projection of the first hollow portion on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate.

[0044] According to any of the aforementioned embodiments of the second aspect of the present application, a third hollow portion located in the transition zone is opened on the first insulating layer, and the third hollow portion surrounds the first hollow portion and is spaced apart from the first hollow portion.

[0045] According to any of the aforementioned embodiments of the second aspect of the present application, a plurality of third hollow portions are arranged at intervals.

[0046] According to any of the aforementioned embodiments of the second aspect of the present application, the third hollow portion is ring-shaped around the hole area.

[0047] An embodiment of the third aspect of the present application provides a display panel, which includes a display area, a hole area and a transition area located between the display area and the hole area. The display panel also includes: a substrate; a pixel definition layer located on one side of the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion; a light-emitting layer including a light-emitting unit located in the pixel opening; an inorganic encapsulation layer located on a side of the light-emitting unit away from the substrate, the inorganic encapsulation layer including a blocking groove located in the transition area.

[0048] According to an implementation of the third aspect of the present application, the inorganic encapsulation layer includes a first encapsulation layer and a third encapsulation layer, the third encapsulation layer is located on the side of the first encapsulation layer away from the substrate, and the blocking groove is opened on the first encapsulation layer and / or the third encapsulation layer.

[0049] According to an implementation of the third aspect of the present application, the blocking groove is ring-shaped around the hole area.

[0050] According to an implementation of the third aspect of the present application, there are multiple blocking grooves.

[0051] According to any of the aforementioned embodiments of the third aspect of the present application, the inorganic encapsulation layer includes a cutting avoidance hole located in the hole area, and the orthographic projection of the hole area on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate.

[0052] According to an implementation of the second aspect of the present application, the blocking groove is opened on the first packaging layer, and the cutting avoidance hole is opened on the third packaging layer.

[0053] According to an implementation of the third aspect of the present application, the blocking groove is provided through the first packaging layer.

[0054] According to any of the aforementioned embodiments of the third aspect of the present application, the display panel also includes: an isolation structure located on the substrate, the isolation structure includes a second isolation portion located in the transition area, the second isolation portion is spaced apart from the hole area, and the blocking groove is located on the side of the second isolation portion facing away from the substrate.

[0055] According to any of the aforementioned embodiments of the third aspect of the present application, the display panel also includes: a first insulating layer, located on the substrate, the first insulating layer is provided with a first hollow portion, the first hollow portion is located in the transition zone and is spaced apart from the display zone, and the first hollow portion extends from the transition zone to the hole zone and the adjacent edge of the transition zone.

[0056] According to any of the aforementioned embodiments of the third aspect of the present application, the first hollow portion is arranged to penetrate the first insulating layer along the thickness direction of the display panel.

[0057] According to any of the aforementioned embodiments of the third aspect of the present application, the first hollow portion is ring-shaped around the hole area.

[0058] According to any of the aforementioned embodiments of the third aspect of the present application, the cutting avoidance hole is located in the transition zone.

[0059] According to any of the aforementioned embodiments of the third aspect of the present application, the orthographic projection of the first hollow portion on the substrate and the orthographic projection of the cutting avoidance hole on the substrate at least partially overlap.

[0060] According to any of the aforementioned embodiments of the third aspect of the present application, the orthographic projection of the first hollow portion on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate. An embodiment of the fourth aspect of the present application provides a display device, which includes a display panel of any of the aforementioned embodiments.

[0061] An embodiment of a fifth aspect of the present application provides a method for manufacturing a display panel, wherein the display panel includes a display area, a hole area, and a transition area between the display area and the hole area, and the method includes:

[0062] A first insulating layer is prepared on the substrate, wherein the first insulating layer is provided with a first hollow portion, the first hollow portion is located in the transition area and is spaced apart from the display area, and the first hollow portion extends from the transition area to the hole area and the adjacent edge of the transition area;

[0063] A pixel definition layer is prepared on a substrate, wherein the pixel definition layer includes a pixel definition portion and a pixel opening formed by the pixel definition portion;

[0064] A light-emitting layer is prepared on a side of the pixel definition layer facing away from the substrate, wherein the light-emitting layer includes a light-emitting unit located in the pixel opening;

[0065] An inorganic encapsulation layer is prepared on a side of the pixel definition layer facing away from the substrate, the inorganic encapsulation layer includes a cutting avoidance hole located in the hole area, and the orthographic projection of the hole area on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate, or the inorganic encapsulation layer includes a blocking groove located in the transition area;

[0066] Cutting is performed along a cutting path located inside the cutting avoidance hole to remove the film layer structure in the hole area, thereby forming an opening corresponding to the hole area.

[0067] Cutting avoidance holes According to the display panel of the embodiment of the present application, the display panel includes a display area, a transition area and a hole area, the display area is arranged around the transition area, and the transition area is arranged around the hole area. The display area is used to realize the luminous display of the display panel, and the hole area is used to set the photosensitive component. The display panel also includes a substrate, a first insulating layer and a pixel definition layer. The pixel definition layer includes a pixel defining portion, and a pixel opening formed by the pixel defining portion, and the pixel opening is used to set the light-emitting unit to realize the luminous display of the display panel. A first hollow portion is opened on the first insulating layer located between the pixel definition layer and the substrate, and the first hollow portion is located in the transition area and is spaced from the display area, so that the thickness of the brittle film layer of the display panel at the position of the first hollow portion is reduced or the brittle film layer is missing. When the substrate is cut at the first hollow portion, it is difficult for the first insulating layer to form cracks and the cracks are difficult to extend to the display area, thereby improving the performance of the OLED display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0069] Figure 1 is a schematic top view of a display panel provided in an embodiment of the present application;

[0070] Figure 2 yes Figure 1 Sectional view at AA in the middle;

[0071] Figure 3 yes Figure 1 A cross-sectional view of another embodiment at AA;

[0072] Figure 4 yes Figure 1 A cross-sectional view of another embodiment at AA;

[0073] Figure 5 yes Figure 4 A partial enlarged view of

[0074] Figure 6 yes Figure 1 A cross-sectional view of another embodiment at AA;

[0075] Figure 7 yes Figure 1 A cross-sectional view of another embodiment before cutting at AA;

[0076] Figure 8 yes Figure 1 A cross-sectional view of another embodiment before cutting at AA;

[0077] Fig. 9This is a schematic diagram of a method for preparing a display panel provided in an embodiment of the present application.

[0078] Fig.10 is a partial top view of a display panel provided in an embodiment of the present application;

[0079] Fig.11 yes Figure 1 A cross-sectional view of another embodiment at AA;

[0080] Fig.12 yes Figure 1 A cross-sectional view of another embodiment at AA;

[0081] Fig.13 yes Figure 1 A cross-sectional view of another embodiment at AA;

[0082] Fig.14 yes Figure 1 A cross-sectional view of another embodiment at AA;

[0083] Fig.15 is a partial cross-sectional view of a display area of ​​a display panel provided in an embodiment of the present application;

[0084] Fig.16 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0085] Fig.17 It is a schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application.

[0086] Description of reference numerals:

[0087] 10. Display panel; 11. Display area; 12. Transition area; 13. Hole area;

[0088] 100, substrate; 110, substrate; 120, protective film; 121, fourth groove;

[0089] 200, first insulating layer; 210, first hollow portion; 211, first opening; 212, second opening; 220, third hollow portion;

[0090] 300, pixel definition layer; 310, pixel defining portion; 311, first pixel defining portion; 312, second pixel defining portion; 313, extension portion; 320, pixel opening; 321, first pixel opening;

[0091] 400, retaining wall;

[0092] 500, isolation structure; 501, first layer; 502, second layer; 510, first isolation part; 511, first isolation opening; 520, second isolation part;

[0093] 600, light-emitting layer; 610, first light-emitting unit; 620, second light-emitting unit;

[0094] 700, first electrode layer; 710, first electrode; 720, second electrode;

[0095] 810, first packaging layer; 811, first division; 812, second division; 813, first thinning portion; 820, second packaging layer; 830, third packaging layer; 831, third division; 832, fourth division; 833, cutting avoidance hole; 834, second thinning portion; 840, blocking groove. DETAILED DESCRIPTION

[0096] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0097] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0098] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0099] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. The embodiments of the display panel, the display device, and the method for manufacturing a display panel are described below in conjunction with the accompanying drawings.

[0100] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0101] Please also read Figure 1 and Figure 2 , Figure 1 is a schematic top view of a display panel provided in an embodiment of the present application; Figure 2 yes Figure 1 Cross-sectional view at AA in the middle.

[0102] like Figure 1 and Figure 2 As shown, the first aspect of the present application provides a display panel 10, which includes a display area 11, a transition area 12 and a hole area 13. The display area 11 is arranged around the transition area 12, and the transition area 12 is arranged around the hole area 13. The display panel 10 also includes a substrate 100, a first insulating layer 200 and a pixel definition layer 300; the first insulating layer 200 is located on the substrate 100, and the first insulating layer 200 is provided with a first hollow portion 210, the first hollow portion 210 is located in the transition area 12 and is spaced from the display area 11, and the first hollow portion 210 extends from the transition area 12 to the hole area 13 and the adjacent edge of the transition area 12; the pixel definition layer 300 is located on the side of the first insulating layer 200 away from the substrate 100, and the pixel definition layer 300 includes a pixel defining portion 310 and a pixel opening 320 formed by the pixel defining portion 310.

[0103] Optionally, the adjacent edge is a cutting edge of the hole area 13 of the display panel 10 , and the display panel 10 is cut at the adjacent edge to form the hole area 13 .

[0104] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a display area 11, a transition area 12 and a hole area 13, the display area 11 is arranged around the transition area 12, and the transition area 12 is arranged around the hole area 13. The display area 11 is used to realize the luminous display of the display panel 10, and the photosensitive component is arranged under the display panel of the hole area 13. The display panel 10 also includes a substrate 100, a first insulating layer 200 and a pixel definition layer 300. The pixel definition layer 300 includes a pixel defining portion 310, and a pixel opening 320 formed by the pixel defining portion 310, and the pixel opening 320 is used to set the light-emitting unit. A first hollow portion 210 is provided on the first insulating layer 200 between the pixel definition layer 300 and the substrate 100. The first hollow portion 210 is located in the transition area 12 and is spaced apart from the display area 11, so that the thickness of the brittle film layer of the display panel 10 at the position of the first hollow portion 210 is reduced or the brittle film layer is missing. When the substrate 100 is cut at the first hollow portion 210, it is difficult for cracks to form in the first insulating layer 200 and the cracks are difficult to extend to the display area 11, thereby improving the performance of the OLED display panel 10.

[0105] Optionally, the display panel 10 includes an array layer, and the first insulating layer 200 includes an interlayer insulating layer located in the array layer. For example, the array layer includes a metal layer, the metal layer includes a first metal layer, a second metal layer, and a third metal layer stacked, and the first insulating layer 200 includes an interlayer insulating layer located between adjacent metal layers.

[0106] For example, the array layer includes an active layer and a gate layer, and the first insulating layer 200 includes an inter-gate insulating layer between the active layer and the gate layer.

[0107] Optionally, the first insulating layer 200 includes a planarization layer located on a side of the pixel definition layer 300 facing the substrate 100 .

[0108] In some optional embodiments, the pixel defining portion 310 includes a first pixel defining portion 311 located in the display area 11, and the pixel opening 320 includes a first pixel opening 321 enclosed by the first pixel defining portion 311; the display panel 10 also includes a retaining wall 400, the retaining wall 400 is located on the side of the first insulating layer 200 away from the substrate 100, and the retaining wall 400 is arranged between the first pixel defining portion 311 and the first hollow portion 210 and surrounds the transition area 12 in a ring shape.

[0109] In these optional embodiments, the first pixel defining portion 311 is located in the display area 11 to define the light emitting area of ​​the display area 11, that is, the first pixel defining portion 311 encloses and forms a first pixel opening 321, so that the display panel 10 emits light at the first pixel opening 321. The retaining wall 400 is disposed between the first pixel defining portion 311 and the first hollow portion 210. The retaining wall 400 allows a portion of the film layer to be disposed in the display area 11 and blocked at the position of the retaining wall 400, which can improve the problem of water vapor entering the display area 11 from the transition area 12, thereby causing water and oxygen intrusion.

[0110] Optionally, a plurality of retaining walls 400 are arranged at intervals. Arranging a plurality of retaining walls 400 can further extend the water and oxygen intrusion path, and improve the disadvantage of water and oxygen intrusion caused by water vapor entering the display area 11 from the transition area 12 .

[0111] In some optional embodiments, the display panel 10 also includes an isolation structure 500 and a light-emitting layer 600. The isolation structure 500 is located on the side of the pixel defining portion 310 away from the substrate 100. The isolation structure 500 includes a first isolation portion 510 located on the side of the retaining wall 400 away from the transition zone 12. The first isolation portion 510 encloses a first isolation opening 511, and each first pixel opening 321 is located in each first isolation opening 511. The light-emitting layer 600 is located on the side of the pixel defining portion 310 away from the substrate 100. The light-emitting layer 600 includes a first light-emitting unit 610 located in the first isolation opening 511.

[0112] In these optional embodiments, the first isolation portion 510 is disposed in the display area 11 and encloses a plurality of first isolation openings 511 to separate the light-emitting layer 600 to form mutually disconnected first light-emitting units 610, thereby reducing crosstalk of carriers in the light-emitting layer 600 and improving the display effect of the display panel 10. In addition, no precision mask is required to prepare the first light-emitting unit 610, which can reduce the development and use of precision masks and reduce preparation costs.

[0113] Optionally, part of the light emitting layer 600 in the transition area 12 may be etched to form a hollow portion, thereby further reducing the film thickness of the display panel 10 in the transition area 12 and lowering the difficulty of cutting.

[0114] like Figure 2 As shown, in some optional embodiments, the display panel 10 further includes a first electrode layer 700 , which is located on a side of the light emitting layer 600 facing away from the substrate 100 , and includes a first electrode 710 located in the first isolation opening 511 .

[0115] In these optional embodiments, the first electrode layer 700 is separated by the first isolation portion 510 to form mutually spaced first electrodes 710 , each first electrode 710 is located in the first isolation opening 511 , and the mutually spaced first electrodes 710 are electrically connected through the first isolation portion 510 to form a full-surface electrode.

[0116] Optionally, the first electrode layer 700 may be partially etched in the transition region 12 to further reduce the film thickness of the display panel 10 in the transition region 12 and reduce the difficulty of cutting.

[0117] In some optional embodiments, the display panel 10 further includes a first encapsulation layer 810 , which is located on a side of the first electrode layer 700 facing away from the substrate 100 , and includes a first sub-portion 811 located in the display area 11 .

[0118] In these optional embodiments, the first encapsulation layer 810 encapsulates the first electrode layer 700 and the light-emitting layer 600 to reduce the corrosion of water and oxygen on the first electrode layer 700 and the light-emitting layer 600. The first subdivision 811 of the first encapsulation layer 810 is located in the display area 11, improving the encapsulation performance of the display panel 10 in the display area 11.

[0119] Optionally, the first encapsulation layer 810 may be partially etched in the transition region 12 to further reduce the film thickness of the display panel 10 in the transition region 12 and reduce the difficulty of cutting.

[0120] In some optional embodiments, the display panel 10 further includes a second encapsulation layer 820 , which is located on a side of the first encapsulation layer 810 away from the substrate 100 and on a side of the retaining wall 400 away from the transition region 12 .

[0121] In these optional embodiments, the display panel 10 is multi-layered with the first encapsulation layer 810 and the second encapsulation layer 820 to further improve the encapsulation performance of the display panel 10. The second encapsulation layer 820 is blocked at the position of the retaining wall 400, so that the second encapsulation layer 820 is located in the display area 11, which can improve the disadvantage of water vapor entering the display area 11 from the transition area 12 and causing water and oxygen intrusion.

[0122] In some optional embodiments, the display panel 10 also includes a third encapsulation layer 830, which is located on the side of the second encapsulation layer 820 away from the substrate 100, and the third encapsulation layer 830 includes a second hollow portion 833 located in the transition zone 12, or the third encapsulation layer 830 is located in the display zone 11 and the transition zone 12.

[0123] In these optional embodiments, the display panel 10 is packaged in three layers using a first packaging layer 810, a second packaging layer 820, and a third packaging layer 830, so as to further improve the packaging performance of the display panel 10. The third packaging layer 830 is provided with a second hollow portion 833 in the transition region 12, so that the thickness of the brittle film layer of the display panel 10 at the position of the second hollow portion 833 in the transition region 12 is reduced, and when the substrate 100 is cut at the second hollow portion 833, it is difficult for the third packaging layer 830 to form cracks and the cracks are difficult to extend to the display region 11.

[0124] Optionally, the first encapsulation layer 810 includes an inorganic material. The first encapsulation layer 810 is encapsulated by the inorganic material. The first encapsulation layer 810 made of the inorganic material has good compactness and good encapsulation performance.

[0125] Optionally, the second encapsulation layer 820 includes an organic material. The second encapsulation layer 820 is encapsulated by the organic material to further improve the encapsulation performance of the encapsulation layer.

[0126] Optionally, the third encapsulation layer 830 includes inorganic materials, and the first encapsulation layer 810, the second encapsulation layer 820 and the third encapsulation layer 830 are respectively encapsulated with inorganic materials, organic materials and inorganic materials to form a TFE (Thin Film Encapsulation, TFE) thin film encapsulation structure to further improve the encapsulation performance of the encapsulation layer.

[0127] In some optional embodiments, the first sub-portion 811 is located on a side of the first isolation portion 510 close to an edge of the transition region 12 and away from the transition region 12 .

[0128] In these optional embodiments, the first encapsulation layer 810 is separated by the first isolation portion 510, so that the first encapsulation layer 810 cannot extend continuously to the transition zone 12, further reducing the film thickness of the display panel 10 in the transition zone 12 and reducing the difficulty of cutting. When the substrate 100 is cut in the transition zone 12, it is difficult for the first encapsulation layer 810 to form cracks and the cracks are difficult to extend to the display area 11.

[0129] In some optional embodiments, the third encapsulation layer 830 includes a second hollow portion 833 located in the transition region 12 , and an orthographic projection of the first hollow portion 210 on the substrate 100 and an orthographic projection of the second hollow portion 833 on the substrate 100 at least partially overlap.

[0130] In these optional embodiments, the first hollow portion 210 and the second hollow portion 833 at least partially overlap in the orthographic projection of the substrate 100, so that the first hollow portion 210 and the second hollow portion 833 are at least partially connected, and at the overlapping position, the display panel 10 has a smaller thickness, so that the display panel 10 is easier to cut at the overlapping position, and it is difficult for the third encapsulation layer 830 and the first insulating layer 200 to form cracks and the cracks are difficult to extend to the display area 11.

[0131] In some optional embodiments, the orthographic projection of the first hollow portion 210 on the substrate 100 is located within the orthographic projection of the second hollow portion 833 on the substrate 100 .

[0132] In these optional embodiments, the orthographic projection area of ​​the second hollow portion 833 is larger than the orthographic projection area of ​​the first hollow portion 210, so that when the substrate 100 is cut in the first hollow portion 210, the thickness is lower and the cutting difficulty is lower. Moreover, since the area of ​​the second hollow portion 833 is larger, it is more difficult for the third encapsulation layer 830 to form cracks and extend to the display area 11.

[0133] In some optional embodiments, the first hollow portion 210 is disposed through the first insulating layer 200 along the thickness direction of the display panel 10 .

[0134] In these optional embodiments, the first hollow portion 210 is arranged to pass through the first insulating layer 200, further reducing the thickness of the first insulating layer 200 at the position of the first hollow portion 210, reducing the difficulty of cutting the substrate 100 at the position of the first hollow portion 210, and cutting the substrate 100 at the position of the first hollow portion 210. It is more difficult for cracks to appear in the first insulating layer 200 and extend to the display area 11, thereby improving the light-emitting reliability of the display panel 10.

[0135] See also Figure 3 , Figure 3 yes Figure 1 A cross-sectional view of another embodiment at AA.

[0136] like Figure 3 As shown, in some optional embodiments, a third hollow portion 220 located in the transition area 12 is opened on the first insulating layer 200 , and the third hollow portion 220 surrounds the first hollow portion 210 and is spaced apart from the first hollow portion 210 .

[0137] In these optional embodiments, the third hollow portion 220 is arranged around the first hollow portion 210. When other film layers are arranged on the first insulating layer 200, the arrangement of the third hollow portion 220 can increase the water and oxygen intrusion path, making it more difficult for water and oxygen to invade the display area 11 through the transition area 12, thereby ensuring the reliability of the display panel 10.

[0138] Optionally, a plurality of third hollow portions 220 are arranged at intervals. Providing a plurality of third hollow portions 220 can further increase the water and oxygen intrusion path.

[0139] Please also read Figure 4 and Figure 5 , Figure 4 yes Figure 1 A cross-sectional view of another embodiment at AA; Figure 5 yes Figure 4 A partial enlarged view of .

[0140] like Figure 4 and Figure 5 As shown, in some optional embodiments, the pixel defining portion 310 includes a second pixel defining portion 312 located in the first hollow portion 210; the isolation structure 500 includes a second isolation portion 520 located on the second pixel defining portion 312, and the second isolation portion 520 is spaced apart from the hole area 13; the light-emitting layer 600 includes a second light-emitting unit 620 located on the side of the second isolation portion 520 facing the hole area 13.

[0141] In these optional embodiments, a second pixel defining portion 312 and a second isolation portion 520 are disposed in the first hollow portion 210, and a second light-emitting unit 620 is disposed on the side of the second isolation portion 520 facing the hole area 13, so that the film layer structure in the first hollow portion 210 is close to the film layer structure cut in the related technology, and the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0142] Optionally, the first electrode layer 700 includes a second electrode 720 on the side of the second isolation portion 520 facing the hole area 13, and a second electrode 720 is arranged on the side of the second isolation portion 520 facing the hole area 13, so that the film layer structure within the first hollow portion 210 is close to the film layer structure cut in the related technology, and the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0143] In some optional embodiments, the first encapsulation layer 810 includes a second portion 812 located in the transition region 12 , and at least a portion of the second portion 812 is located in the first hollow portion 210 .

[0144] In these optional embodiments, a second section 812 of the first encapsulation layer 810 is disposed in the first hollow portion 210, so that the film layer structure in the first hollow portion 210 is closer to the film layer structure cut in the related art, and the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0145] In some optional embodiments, the second section 812 includes a first thinned portion 813 located on both sides of the second isolation portion 520 .

[0146] In these optional embodiments, the second division 812 forms a first thinning portion 813 on both sides of the second isolation portion 520, that is, the second division 812 is thinner on both sides of the second isolation portion 520. When the substrate 100 is cut on the side of the second isolation portion 520 toward the hole area 13, the generated cracks are easily broken at the first thinning portion 813 and are difficult to continue extending toward the display area 11.

[0147] Optionally, the second division 812 and the first division 811 are spaced apart. When the second division 812 on the first hollow portion 210 cuts the substrate 100 , cracks generated in the second division 812 cannot extend to the first division 811 , thereby ensuring the display reliability of the display panel 10 .

[0148] Optionally, the third encapsulation layer 830 includes a third sub-portion 831 located in the display area 11 and a fourth sub-portion 832 located in the transition area 12, and at least a portion of the fourth sub-portion 832 is located in the first hollow portion 210. The fourth sub-portion 832 of the third encapsulation layer 830 is arranged in the first hollow portion 210, so that the film layer structure in the first preparation groove is closer to the film layer structure cut in the related art, and the substrate 100 can be cut by using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0149] Optionally, the fourth division 832 includes a second thinning portion 834 located on both sides of the second isolation portion 520, that is, the fourth division 832 is thinner on both sides of the second isolation portion 520. When the substrate 100 is cut on the side of the second isolation portion 520 toward the hole area 13, the generated cracks are easily broken in the second thinning portion 834 and are difficult to continue extending toward the display area 11.

[0150] like Figure 4 As shown, optionally, the isolation structure 500 includes a first layer 501, and each first electrode 710 is electrically connected to the first layer 501. The mutually spaced first electrodes 710 are electrically connected through the first layer 501 to form a whole-surface electrode, and the first electrodes 710 and the first layer 501 are more easily overlapped, thereby improving the overlap efficiency of the first electrodes 710.

[0151] In some optional embodiments, the isolation structure 500 further includes a second layer 502 located on a side of the first layer 501 facing away from the substrate 100 , and an orthographic projection of the first layer 501 on the substrate 100 is located within an orthographic projection of the second layer 502 on the substrate 100 .

[0152] In these optional embodiments, the first layer 501 and the second layer 502 are arranged to form an isolation structure 500, the orthographic projection of the first layer 501 arranged close to the substrate 100 on the substrate 100 is located within the orthographic projection of the second layer 502 on the substrate 100, the area of ​​the second layer 502 is larger than the area of ​​the first layer 501, and the second layer 502 covers the surface of the first layer 501 close to the second layer 502, and at this time, the first layer 501 is recessed relative to the second layer 502 in a direction away from the pixel opening 320. When preparing the light-emitting layer 600, the light-emitting layer 600 has a large drop at the edge of the isolation structure 500, and the first layer 501 is recessed relative to the second layer 502, and the light-emitting layer 600 is difficult to connect at the edge of the isolation structure 500, so it breaks, and the light-emitting layer 600 breaks to form a first light-emitting unit 610 and a second light-emitting unit 620 that are disconnected from each other. The second layer 502 is concavely arranged relative to the first layer 501. When preparing the first packaging layer 810 and the third packaging layer 830, the second division 812 forms a first thinning portion 813 with a relatively thin thickness on both sides of the second layer 502, and the fourth division 832 forms a second thinning portion 834 with a relatively thin thickness on both sides of the second layer 502.

[0153] Optionally, the fourth division 832 is disconnected at the retaining wall 400 . When the fourth division 832 on the first hollow portion 210 cuts the substrate 100 , cracks generated by the fourth division 832 cannot extend to the third division 831 , thereby ensuring the display reliability of the display panel 10 .

[0154] See also Figure 2 In some optional embodiments, the first hollow portion 210 includes a first opening 211 and a second opening 212 that are relatively arranged along the thickness direction of the display panel 10, the first opening 211 is located on the side of the second opening 212 away from the substrate 100, and the orthographic projection of the second opening 212 on the substrate 100 is located within the orthographic projection of the first opening 211 on the substrate 100.

[0155] In these optional embodiments, the area of ​​the first opening 211 of the first hollow portion 210 is larger than the area of ​​the second opening 212, so that the first hollow portion 210 is completely exposed toward the side away from the substrate 100, which facilitates cutting of the substrate 100 at the first hollow portion 210 and reduces the possibility of cutting the first insulating layer 200, making it difficult for the first insulating layer 200 to crack and extend toward the display area 11.

[0156] See also Figure 6 , Figure 6 yes Figure 1 A cross-sectional view of another embodiment at AA.

[0157] like Figure 6As shown, optionally, the substrate 100 includes a substrate 110 and a protective film 120; the protective film 120 is located on the substrate 110, and a fourth groove 121 is formed on the protective film 120, and the fourth groove 121 is connected to the first hollow portion 210. The fourth groove 121 is formed on the protective film 120, so that the film thickness of the display panel 10 in the transition area 12 is further reduced, which can reduce the difficulty of cutting the transition area 12, and at the position of the fourth groove 121, the thickness of the display panel 10 is relatively thin, which can reduce the possibility of cracks.

[0158] Optionally, the display panel 10 further includes a pixel electrode exposed by the first pixel opening 321, and one of the pixel electrode and the first electrode 710 serves as an anode of the first light-emitting unit 610, and the other serves as a cathode of the first light-emitting unit 610. In the embodiment of the present application, the pixel electrode is used as the anode of the first light-emitting unit 610, and the first electrode 710 is used as the cathode of the first light-emitting unit 610 for illustration.

[0159] See also Figure 7 and Figure 8 , Figure 7 yes Figure 1 A cross-sectional view of another embodiment before cutting at AA; Figure 8 yes Figure 1 A cross-sectional view of another embodiment before cutting at AA.

[0160] like Figure 7 and Figure 8 As shown, Figure 7 and Figure 8 The motherboard before cutting the hole area 13 of the display panel 10 is Figure 7 and Figure 8 Taking the motherboard as an example, the display panel 10 is circularly cut at the adjacent edge of the transition area 12 and the hole area 13, so as to form the display panel 10 of the embodiment of the present application.

[0161] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made according to actual conditions, and this application does not impose any specific restrictions on it.

[0162] The embodiment of the second aspect of the present application also provides a display device, including the display panel 10 of any of the above-mentioned first aspect embodiments. Since the display device provided by the embodiment of the second aspect of the present application includes the display panel 10 of any of the above-mentioned first aspect embodiments, the display device provided by the embodiment of the second aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned first aspect embodiments, which will not be repeated here.

[0163] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0164] The third aspect of the present application also provides a method for preparing a display panel 10. The display panel 10 may be any of the display panels 10 provided in the first aspect of the present application. Figures 1 to 8 , and see Fig. 9 , Fig. 9 1 is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application. The preparation method comprises:

[0165] Step S01: preparing a first insulating layer on a substrate, wherein a first preparation groove is formed in the first insulating layer, and the first preparation groove is located in the transition area and the hole area and is spaced apart from the display area.

[0166] Step S02: preparing a pixel definition layer on a side of the first insulating layer facing away from the substrate, wherein the pixel definition layer comprises a pixel definition portion and a pixel opening formed by the pixel definition portion.

[0167] Step S03: performing circular cutting on the substrate in the first preparation groove to form a first hollow portion and an opening located in the hole area, wherein the first hollow portion extends from the transition area to adjacent edges of the hole area and the transition area.

[0168] According to the preparation method of the third aspect embodiment of the present application, a first insulating layer 200 is prepared on a substrate 100 through step S01, and a first preparation groove is opened in the transition area 12 of the first insulating layer 200, and the first preparation groove and the display area 11 are arranged at intervals. Then, a pixel opening 320 formed by enclosing the pixel definition layer 300 and the pixel defining portion 310 is prepared through step S02, which is used to set a light-emitting unit to realize the light-emitting display of the display panel 10. Finally, through step S03, the substrate 100 is cut in an annular shape in the first preparation groove, so as to form an opening in the hole area 13 of the display panel 10, so as to set a photosensitive component in the hole area 13 to ensure the photosensitivity effect of the photosensitive component. Since the film thickness of the display panel 10 at the position of the first preparation groove is relatively small, when the substrate 100 is cut in the first preparation groove, it is difficult for the first insulating layer 200 to form cracks and the cracks are difficult to extend to the display area 11, thereby improving the performance of the OLED display panel 10.

[0169] In some optional embodiments, the pixel defining portion 310 includes a first pixel defining portion 311 located in the display area 11 and a second pixel defining portion 312 located in the transition area 12, the second pixel defining portion 312 is annular and is spaced apart from the first pixel defining portion 311, and at least a portion of the second pixel defining portion 312 is disposed in the first preparation groove; before step S03, the method further includes:

[0170] An isolation structure 500 is prepared on the side of the pixel definition layer 300 facing away from the substrate 100 , and the isolation structure 500 includes a first isolation portion 510 located on the first pixel defining portion 311 and two second isolation portions 520 located on the second pixel defining portion 312 and arranged at intervals;

[0171] In step S03, the method further includes:

[0172] The substrate 100 is cut in a circular shape between the two second isolation portions 520 .

[0173] In these optional embodiments, the first isolation portion 510 is disposed in the display area 11 and encloses a plurality of first isolation openings 511 to isolate the light-emitting layer 600 to form mutually disconnected first light-emitting units 610, thereby reducing the crosstalk of carriers in the light-emitting layer 600 and improving the display effect of the display panel 10. In addition, the first light-emitting unit 610 does not need to be prepared using a precision mask, which can reduce the development and use of precision masks and reduce the preparation cost. The two second isolation portions 520 are arranged at intervals on the second pixel defining portion 312. When the substrate 100 is cut, the substrate 100 can be cut in an annular manner between the two second isolation portions 520, reducing the possibility of cutting the first insulating layer 200, so that it is difficult for the first insulating layer 200 to generate cracks and extend to the display area 11.

[0174] In some optional embodiments, the display panel 10 further includes a second light emitting unit 620 on a side of the second isolation portion 520 facing the hole area 13, and in the step of performing annular cutting on the substrate 100 in the first preparation groove, the method further includes:

[0175] The substrate 100 is cut into a circular shape on the second light emitting unit 620 .

[0176] In these optional embodiments, the light-emitting layer 600 is disconnected at the position of the second isolation structure 500 to form a second light-emitting unit 620, so that the film layer structure between the two second isolation parts 520 is close to the film layer structure cut in the related technology. When the substrate 100 is cut on the second light-emitting unit 620, the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0177] In some optional embodiments, the display panel 10 further includes a second electrode 720 on a side of the second isolation portion 520 facing the hole area 13. In step S03, the method further includes:

[0178] The substrate 100 is cut into a circular shape on the second electrode 720 .

[0179] In these optional embodiments, the first electrode layer 700 is disconnected at the position of the second isolation structure 500 to form the second electrode 720, so that the film layer structure between the two second isolation parts 520 is closer to the film layer structure cut in the related technology. When the substrate 100 is cut on the second electrode 720, the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0180] In some optional embodiments, before step S03, the method further includes:

[0181] A first encapsulation material layer is prepared on the side of the pixel definition layer 300 facing away from the substrate 100, and the first encapsulation material layer is patterned to obtain a first sub-portion 811 located in the display area 11 and a second sub-portion 812 located in the transition area 12 and the hole area 13, wherein at least a portion of the second sub-portion 812 is located in the first hollow portion 210;

[0182] In step S03, the method further includes:

[0183] The substrate 100 is cut into a circular shape at the second section 812 .

[0184] In these optional embodiments, a second section 812 of the first packaging layer 810 is disposed in the first preparation groove, so that the film layer structure in the first preparation groove is closer to the film layer structure cut in the related art, and the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0185] In some optional embodiments, before step S03, the method further includes:

[0186] A third encapsulation material layer is prepared on a side of the second sub-portion 812 facing away from the substrate 100, and the third encapsulation material layer is patterned to obtain a third sub-portion 831 located in the display area 11 and a fourth sub-portion 832 located in the transition area 12 and the hole area 13, wherein at least a portion of the fourth sub-portion 832 is located in the first hollow portion 210;

[0187] In step S03, the method further includes:

[0188] The substrate 100 is cut into a circular shape at the fourth section 832 .

[0189] In these optional embodiments, the fourth section 832 of the third encapsulation layer 830 is arranged in the first preparation groove, so that the film layer structure in the first preparation groove is closer to the film layer structure cut in the related technology, and the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0190] Optionally, after the step of preparing a first encapsulation material layer on the side of the pixel definition layer 300 facing away from the substrate 100, the method further includes:

[0191] Prepare a second packaging material layer on a side of the first packaging material layer facing away from the substrate 100;

[0192] A third encapsulation material layer is prepared on the side of the second encapsulation material layer facing away from the substrate 100, and the third encapsulation material layer is patterned to remove at least a portion of the third encapsulation material layer in the transition area 12 and the hole area 13 to obtain a third encapsulation layer 830, wherein the third encapsulation layer 830 includes a second hollow portion 833 located in the transition area 12. In these optional embodiments, after the third encapsulation material layer is prepared, the third encapsulation material layer is cut in the transition area 12 and the hole area 13, so that the third encapsulation material in the transition area 12 and the hole area 13 is removed and the second hollow portion 833 is formed, so that the thickness of the brittle film layer of the display panel 10 at the position of the second hollow portion 833 in the transition area 12 and the hole area 13 is reduced, and when the substrate 100 is cut at the second hollow portion 833, it is difficult for the third encapsulation layer 830 to form cracks and the cracks are difficult to extend to the display area 11.

[0193] The cutting avoidance hole 833 described below is the second hollow portion 833 mentioned above.

[0194] Please also read Figure 1 , Figure 2 and Fig.15 , Fig.15 It is a partial cross-sectional view of a display area of ​​a display panel provided in an embodiment of the present application.

[0195] like Figure 1 , Figure 2 and Fig.15As shown, an embodiment of the present application provides a display panel 10, which includes a display area 11, a transition area 12 and a hole area 13. The display area 11 is arranged around the transition area 12, and the transition area 12 is arranged around the hole area 13. The display panel 10 also includes a substrate 100, a first insulating layer 200 and a pixel definition layer 300; the first insulating layer 200 is located on the substrate 100, and the first insulating layer 200 is provided with a first hollow portion 210, the first hollow portion 210 is located in the transition area 12 and is spaced from the display area 11, and the first hollow portion 210 extends from the transition area 12 to the hole area 13 and the adjacent edge of the transition area 12; the pixel definition layer 300 is located on the side of the first insulating layer 200 away from the substrate 100, and the pixel definition layer 300 includes a pixel defining portion 310 and a pixel opening 320 enclosed by the pixel defining portion 310; the light-emitting layer 600 includes a light-emitting unit located in the pixel opening 320.

[0196] Optionally, the adjacent edge is a cutting edge of the hole area 13 of the display panel 10 , and the display panel 10 is cut at the adjacent edge to form the hole area 13 .

[0197] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a display area 11, a transition area 12 and a hole area 13, the display area 11 is arranged around the transition area 12, and the transition area 12 is arranged around the hole area 13. The display area 11 is used to realize the luminous display of the display panel 10, and the photosensitive component is arranged under the display panel of the hole area 13. The display panel 10 also includes a substrate 100, a first insulating layer 200 and a pixel definition layer 300. The pixel definition layer 300 includes a pixel defining portion 310, and a pixel opening 320 formed by the pixel defining portion 310, and the pixel opening 320 is used to set the light-emitting unit. A first hollow portion 210 is provided on the first insulating layer 200 between the pixel definition layer 300 and the substrate 100. The first hollow portion 210 is located in the transition area 12 and is spaced apart from the display area 11, so that the thickness of the brittle film layer of the display panel 10 at the position of the first hollow portion 210 is reduced or the brittle film layer is missing. When the substrate 100 is cut at the first hollow portion 210, it is difficult for cracks to form in the first insulating layer 200 and the cracks are difficult to extend to the display area 11, thereby improving the performance of the OLED display panel 10.

[0198] like Fig.15As shown, optionally, the display panel 10 includes an array layer disposed on the substrate 100, and the first insulating layer 200 includes an interlayer insulating layer located in the array layer. For example, the array layer includes a metal layer, the metal layer includes a first metal layer, a second metal layer and a third metal layer stacked, and the first insulating layer 200 includes an interlayer insulating layer located between adjacent metal layers. The display panel 10 includes a pixel driving circuit, and the pixel driving circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source and a drain. The storage capacitor includes a first plate and a second plate. As an example, the gate and the first plate can be located in the first metal layer, the second plate can be located in the second metal layer, and the source and the drain can be located in the third metal layer.

[0199] For example, the array layer includes an active layer and a gate layer, and the gate layer is the first metal layer mentioned above. Optionally, the first insulating layer 200 includes an inter-gate insulating layer between the active layer and the gate layer.

[0200] Optionally, the first insulating layer 200 includes a planarization layer located on a side of the pixel definition layer 300 facing the substrate 100 .

[0201] In some optional embodiments, the display panel 10 further includes a first encapsulation layer 810 , which is located on a side of the pixel definition layer 300 facing away from the substrate 100 , and includes a first sub-portion 811 located in the display area 11 .

[0202] In these optional embodiments, the first encapsulation layer 810 encapsulates the first electrode layer 700 and the light-emitting layer 600 to reduce the corrosion of water and oxygen on the first electrode layer 700 and the light-emitting layer 600. The first subdivision 811 of the first encapsulation layer 810 is located in the display area 11, improving the encapsulation performance of the display panel 10 in the display area 11.

[0203] Optionally, the first encapsulation layer 810 may be partially etched in the transition region 12 to further reduce the film thickness of the display panel 10 in the transition region 12 and reduce the difficulty of cutting. In some optional embodiments, the display panel 10 further includes a second encapsulation layer 820, which is located on a side of the first encapsulation layer 810 away from the substrate 100 and on a side of the retaining wall 400 away from the transition region 12.

[0204] In these optional embodiments, the display panel 10 is multi-layered with the first encapsulation layer 810 and the second encapsulation layer 820 to further improve the encapsulation performance of the display panel 10. The second encapsulation layer 820 is blocked at the position of the retaining wall 400, so that the second encapsulation layer 820 is located in the display area 11, which can improve the disadvantage of water vapor entering the display area 11 from the transition area 12 and causing water and oxygen intrusion.

[0205] In some optional embodiments, the display panel 10 also includes a third encapsulation layer 830, which is located on the side of the second encapsulation layer 820 away from the substrate 100, and at least one of the first encapsulation layer 810 and the third encapsulation layer 830 is provided with a blocking groove 840 or a cutting avoidance hole 833.

[0206] In these optional embodiments, the display panel 10 uses a first encapsulation layer 810, a second encapsulation layer 820, and a third encapsulation layer 830 for three-layer encapsulation, further improving the encapsulation performance of the display panel 10. When the hole area 13 is cut, the impact of the cutting of the hole area 13 on the first encapsulation layer 810 and / or the third encapsulation layer 830 can be reduced, avoiding the problem of cutting the first encapsulation layer 810 and / or the third encapsulation layer 830, resulting in cracks in the first encapsulation layer 810 and / or the third encapsulation layer 830 and extending to the display area 11. The blocking groove 840 separates the first encapsulation layer 810 and / or the third encapsulation layer 830 into multiple parts. When the part close to the hole area 13 is cut to generate cracks, the crack extension path is blocked by the blocking groove 840, thereby preventing the cracks from extending to the display area 11.

[0207] Optionally, the first encapsulation layer 810 includes an inorganic material. The first encapsulation layer 810 is encapsulated by the inorganic material. The first encapsulation layer 810 made of the inorganic material has good compactness and good encapsulation performance.

[0208] Optionally, the second encapsulation layer 820 includes an organic material. The second encapsulation layer 820 is encapsulated by the organic material to further improve the encapsulation performance of the encapsulation layer.

[0209] Optionally, the third encapsulation layer 830 includes inorganic materials, and the first encapsulation layer 810, the second encapsulation layer 820 and the third encapsulation layer 830 are respectively encapsulated with inorganic materials, organic materials and inorganic materials to form a TFE (Thin Film Encapsulation, TFE) thin film encapsulation structure to further improve the encapsulation performance of the encapsulation layer.

[0210] like Figure 4 As shown, optionally, the isolation structure 500 includes a second isolation portion 520 located in the transition region, and the second isolation portion 520 is spaced apart from the hole region 13. The second isolation portion 520 is spaced apart from the hole region 13, which means that the second isolation portion 520 is spaced apart from the hole region 13 by a certain distance.

[0211] Optionally, the second isolation portion 520 is located in the first hollow portion 210 , and the second isolation portion 520 is located in the first hollow portion 210 of the transition area 12 , isolating the film layer of the transition area 12 to reduce the extension of cracks caused by cutting of the film layer of the transition area 12 toward the display area 11 .

[0212] Patents / patent applications PCT / CN2023 / 134518, 202310759370.2, 202311117143.6, 202310771071.0, 202310740412.8, 202310707209.0, 202310771124.9, 202310855866.X, 202311017132.0, 202311124847.6, and 202311091555.7 record relevant technical solutions of isolation structures (also called partition structures, etc.) for reference.

[0213] In some optional embodiments, the first encapsulation layer 810 includes a second portion 812 located in the transition region 12 , and at least a portion of the second portion 812 is located in the first hollow portion 210 .

[0214] In these optional embodiments, a second section 812 of the first encapsulation layer 810 is disposed in the first hollow portion 210, so that the film layer structure in the first hollow portion 210 is closer to the film layer structure cut in the related art, and the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0215] Optionally, the second division 812 is separated by the second isolation portion 520 to form two or more sub-divisions that are disconnected from each other, and a blocking groove 840 located on the isolation structure 500 is formed between adjacent sub-divisions. When the transition area 12 is cut, cracks are generated in the second division 812, and adjacent sub-divisions are separated by the blocking groove 840, so that the cracks will not extend and transmit between the multiple sub-divisions, thereby reducing the possibility of the cracks in the second division 812 being transmitted to the display area 11.

[0216] In some optional embodiments, a sub-portion of the second segment 812 includes a first thinned portion 813 located on at least one side of the second isolation portion 520 .

[0217] In these optional embodiments, a sub-portion of the second section 812 forms a first thinning portion 813 on at least one side of the second isolation portion 520, that is, the second section 812 is thinner on at least one side of the second isolation portion 520. When the substrate 100 is cut on the side of the second isolation portion 520 toward the hole area 13, the generated cracks are easily broken at the first thinning portion 813 and are difficult to continue extending toward the display area 11.

[0218] Optionally, the second section 812 and the first section 811 are spaced apart, and when the second section 812 on the first hollow portion 210 cuts the substrate 100, cracks generated in the second section 812 cannot extend to the first section 811, thereby ensuring the display reliability of the display panel 10. In some optional embodiments, the third encapsulation layer 830 includes a cutting avoidance hole 833 located in the transition region 12, and the orthographic projection of the first hollow portion 210 on the substrate 100 and the orthographic projection of the cutting avoidance hole 833 on the substrate 100 at least partially overlap.

[0219] In these optional embodiments, the first hollow portion 210 and the cutting avoidance hole 833 at least partially overlap in the orthographic projection of the substrate 100, so that the first hollow portion 210 and the cutting avoidance hole 833 are at least partially connected, and at the overlapping position, the display panel 10 has a smaller thickness, so that the display panel 10 is easier to cut at the overlapping position, and it is difficult for the third encapsulation layer 830 and the first insulating layer 200 to form cracks and the cracks are difficult to extend to the display area 11.

[0220] In some optional embodiments, the orthographic projection of the first hollow portion 210 on the substrate 100 is located within the orthographic projection of the cutting avoidance hole 833 on the substrate 100 .

[0221] In these optional embodiments, the orthographic projection area of ​​the cutting avoidance hole 833 is larger than the orthographic projection area of ​​the first hollow portion 210, so that when the substrate 100 is cut in the first hollow portion 210, the thickness is lower and the cutting difficulty is lower. Moreover, due to the larger area of ​​the cutting avoidance hole 833, it is more difficult for the third encapsulation layer 830 to form cracks and extend to the display area 11.

[0222] In some optional embodiments, the first hollow portion 210 is disposed through the first insulating layer 200 along the thickness direction of the display panel 10 .

[0223] In these optional embodiments, the first hollow portion 210 is arranged to pass through the first insulating layer 200, further reducing the thickness of the first insulating layer 200 at the position of the first hollow portion 210, reducing the difficulty of cutting the substrate 100 at the position of the first hollow portion 210, and cutting the substrate 100 at the position of the first hollow portion 210. It is more difficult for cracks to appear in the first insulating layer 200 and extend to the display area 11, thereby improving the light-emitting reliability of the display panel 10.

[0224] like Figure 3 As shown, in some optional embodiments, a third hollow portion 220 located in the transition area 12 is opened on the first insulating layer 200 , and the third hollow portion 220 surrounds the first hollow portion 210 and is spaced apart from the first hollow portion 210 .

[0225] In these optional embodiments, the third hollow portion 220 is arranged around the first hollow portion 210. When other film layers are arranged on the first insulating layer 200, the arrangement of the third hollow portion 220 can increase the water and oxygen intrusion path, making it more difficult for water and oxygen to invade the display area 11 through the transition area 12, thereby ensuring the reliability of the display panel 10.

[0226] Optionally, a plurality of third hollow portions 220 are arranged at intervals. Providing a plurality of third hollow portions 220 can further increase the water and oxygen intrusion path.

[0227] Optionally, the third encapsulation layer 830 and / or the first encapsulation layer 810 covers the side wall and the bottom wall of the third hollow portion 220, so that the extension path of the third encapsulation layer 830 and / or the first encapsulation layer 810 is longer, further increasing the water and oxygen intrusion path.

[0228] like Figure 4 and Figure 5 As shown, optionally, the pixel definition layer 300 includes a second pixel defining portion 312 located in the first hollow portion 210; the second isolation portion 520 is located on the second pixel defining portion 312, and the second pixel defining portion 312 in the first hollow portion 210 is retained, so that the film layer structure in the first hollow portion 210 is closer to the film layer structure for cutting in the related technology, and the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0229] In some optional embodiments, the pixel definition layer 300 further includes a first pixel defining portion 311 located in the display area 11 , and the pixel opening 320 includes a first pixel opening 321 enclosed by the first pixel defining portion 311 .

[0230] Optionally, the display panel 10 further includes a retaining wall 400 , which is located on a side of the first insulating layer 200 facing away from the substrate 100 . The retaining wall 400 is disposed between the first pixel defining portion 311 and the first hollow portion 210 and surrounds the transition region 12 in a ring shape.

[0231] In these optional embodiments, the first pixel defining portion 311 is located in the display area 11 to define the light emitting area of ​​the display area 11, that is, the first pixel defining portion 311 encloses and forms a first pixel opening 321, so that the display panel 10 emits light at the first pixel opening 321. The retaining wall 400 is disposed between the first pixel defining portion 311 and the first hollow portion 210. The retaining wall 400 allows a portion of the film layer to be disposed in the display area 11 and blocked at the position of the retaining wall 400, which can improve the problem of water vapor entering the display area 11 from the transition area 12, thereby causing water and oxygen intrusion.

[0232] like Figure 3As shown, optionally, there are more than two retaining walls 400, and the plurality of retaining walls 400 are arranged at intervals. The plurality of retaining walls 400 can further extend the water and oxygen intrusion path and improve the disadvantage of water vapor entering the display area 11 from the transition area 12, thereby causing water and oxygen intrusion.

[0233] In some optional embodiments, the isolation structure 500 is located on the side of the pixel defining portion 310 away from the substrate 100, and the isolation structure 500 includes a first isolation portion 510 located on the side of the retaining wall 400 away from the transition zone 12, the first isolation portion 510 encloses a first isolation opening 511, and the first pixel opening 321 and the first isolation opening 511 are connected.

[0234] like Figure 4 and Figure 5 As shown, optionally, the light emitting unit includes a first light emitting unit 610 located in the first isolation opening 511 .

[0235] In these optional embodiments, the first isolation portion 510 is disposed in the display area 11 and encloses a plurality of first isolation openings 511 to separate the light-emitting layer 600 to form mutually disconnected first light-emitting units 610, thereby reducing crosstalk of carriers in the light-emitting layer 600 and improving the display effect of the display panel 10. In addition, no precision mask is required to prepare the first light-emitting unit 610, which can reduce the development and use of precision masks and reduce preparation costs.

[0236] Optionally, part of the light emitting layer 600 in the transition area 12 may be etched to form a hollow portion, thereby further reducing the film thickness of the display panel 10 in the transition area 12 and lowering the difficulty of cutting.

[0237] In some optional embodiments, the display panel 10 further includes a first electrode layer 700 . The first electrode layer 700 is located on a side of the light emitting layer 600 facing away from the substrate 100 . The first electrode layer 700 includes a first electrode 710 located in the first isolation opening 511 .

[0238] In these optional embodiments, the first electrode layer 700 is separated by the first isolation portion 510 to form mutually spaced first electrodes 710 , each first electrode 710 is located in the first isolation opening 511 , and the mutually spaced first electrodes 710 are electrically connected through the first isolation portion 510 to form a full-surface electrode.

[0239] Optionally, the first electrode layer 700 may be partially etched in the transition region 12 to further reduce the film thickness of the display panel 10 in the transition region 12 and reduce the difficulty of cutting.

[0240] Optionally, the light-emitting layer 600 includes a second light-emitting unit 620 located on a side of the second isolation portion 520 facing the hole region 13 .

[0241] In these optional embodiments, a second pixel defining portion 312 and a second isolation portion 520 are disposed in the first hollow portion 210, and a second light-emitting unit 620 is disposed on the side of the second isolation portion 520 facing the hole area 13, so that the film layer structure in the first hollow portion 210 is close to the film layer structure cut in the related technology, and the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0242] Optionally, the first electrode layer 700 includes a second electrode 720 on the side of the second isolation portion 520 facing the hole area 13, and a second electrode 720 is arranged on the side of the second isolation portion 520 facing the hole area 13, so that the film layer structure within the first hollow portion 210 is close to the film layer structure cut in the related technology, and the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0243] Optionally, the third encapsulation layer 830 includes a third sub-portion 831 located in the display area 11 and a fourth sub-portion 832 located in the transition area 12, and at least a portion of the fourth sub-portion 832 is located in the first hollow portion 210. The fourth sub-portion 832 of the third encapsulation layer 830 is arranged in the first hollow portion 210, so that the film layer structure in the first preparation groove is closer to the film layer structure cut in the related art, and the substrate 100 can be cut by using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0244] Optionally, the fourth division 832 includes a second thinning portion 834 located on both sides of the second isolation portion 520, that is, the fourth division 832 is thinner on both sides of the second isolation portion 520. When the substrate 100 is cut on the side of the second isolation portion 520 toward the hole area 13, the generated cracks are easily broken in the second thinning portion 834 and are difficult to continue extending toward the display area 11.

[0245] like Figure 4 As shown, optionally, the isolation structure 500 includes a first layer 501, and each first electrode 710 is electrically connected to the first layer 501. The mutually spaced first electrodes 710 are electrically connected through the first layer 501 to form a whole-surface electrode, and the first electrodes 710 and the first layer 501 are more easily overlapped, thereby improving the overlap efficiency of the first electrodes 710.

[0246] In some optional embodiments, the isolation structure 500 further includes a second layer 502 located on a side of the first layer 501 facing away from the substrate 100 , and an orthographic projection of the first layer 501 on the substrate 100 is located within an orthographic projection of the second layer 502 on the substrate 100 .

[0247] In these optional embodiments, the first layer 501 and the second layer 502 are arranged to form an isolation structure 500, the orthographic projection of the first layer 501 arranged close to the substrate 100 on the substrate 100 is located within the orthographic projection of the second layer 502 on the substrate 100, the area of ​​the second layer 502 is larger than the area of ​​the first layer 501, and the second layer 502 covers the surface of the first layer 501 close to the second layer 502, and at this time, the first layer 501 is recessed relative to the second layer 502 in a direction away from the pixel opening 320. When preparing the light-emitting layer 600, the light-emitting layer 600 has a large drop at the edge of the isolation structure 500, and the first layer 501 is recessed relative to the second layer 502, and the light-emitting layer 600 is difficult to connect at the edge of the isolation structure 500, so it breaks, and the light-emitting layer 600 breaks to form a first light-emitting unit 610 and a second light-emitting unit 620 that are disconnected from each other. The second layer 502 is concavely arranged relative to the first layer 501. When preparing the first packaging layer 810 and the third packaging layer 830, the second division 812 forms a first thinning portion 813 with a relatively thin thickness on both sides of the second layer 502, and the fourth division 832 forms a second thinning portion 834 with a relatively thin thickness on both sides of the second layer 502.

[0248] Optionally, the fourth division 832 is disconnected at the retaining wall 400 . When the fourth division 832 on the first hollow portion 210 cuts the substrate 100 , cracks generated by the fourth division 832 cannot extend to the third division 831 , thereby ensuring the display reliability of the display panel 10 .

[0249] See also Figure 2 In some optional embodiments, the first hollow portion 210 includes a first opening 211 and a second opening 212 that are relatively arranged along the thickness direction of the display panel 10, the first opening 211 is located on the side of the second opening 212 away from the substrate 100, and the orthographic projection of the second opening 212 on the substrate 100 is located within the orthographic projection of the first opening 211 on the substrate 100.

[0250] In these optional embodiments, the area of ​​the first opening 211 of the first hollow portion 210 is larger than the area of ​​the second opening 212, so that the first hollow portion 210 is completely exposed toward the side away from the substrate 100, which facilitates cutting of the substrate 100 at the first hollow portion 210 and reduces the possibility of cutting the first insulating layer 200, making it difficult for the first insulating layer 200 to crack and extend toward the display area 11.

[0251] like Figure 6As shown, optionally, the substrate 100 includes a substrate 110 and a protective film 120; the protective film 120 is located on the substrate 110, and a fourth groove 121 is formed on the protective film 120, and the fourth groove 121 is connected to the first hollow portion 210. The fourth groove 121 is formed on the protective film 120, so that the film thickness of the display panel 10 in the transition area 12 is further reduced, which can reduce the difficulty of cutting the transition area 12, and at the position of the fourth groove 121, the thickness of the display panel 10 is relatively thin, which can reduce the possibility of cracks.

[0252] Optionally, the display panel 10 further includes a pixel electrode exposed by the first pixel opening 321, and one of the pixel electrode and the first electrode 710 serves as an anode of the first light-emitting unit 610, and the other serves as a cathode of the first light-emitting unit 610. In the embodiment of the present application, the pixel electrode is used as the anode of the first light-emitting unit 610, and the first electrode 710 is used as the cathode of the first light-emitting unit 610 for illustration.

[0253] like Figure 7 and Figure 8 As shown, Figure 7 and Figure 8 The motherboard before cutting the hole area 13 of the display panel 10 is Figure 7 and Figure 8 Taking the motherboard of the embodiment of the present invention as an example, the display panel 10 is circularly cut at the adjacent edges of the transition area 12 and the hole area 13, thereby forming the display panel 10 of the embodiment of the present application. The cutting road is not shown in the figure, and the adjacent edges of the transition area 12 and the hole area 13 serve as the boundaries of the cutting road, and the other boundary is separated from the adjacent edge by a certain width.

[0254] See also Fig.12 and Fig.13 , Fig.12 yes Figure 1 A cross-sectional view of another embodiment at AA; Fig.13 yes Figure 1 A cross-sectional view of another embodiment is shown at AA.

[0255] like Fig.12 As shown, optionally, the pixel defining portion 310 also includes an extension portion 313 connected to the first pixel defining portion 311, and at least a portion of the extension portion 313 is located on the surface of the retaining wall 400 away from the substrate 100, thereby raising a portion of the subsequent third encapsulation layer 830 on the retaining wall 400, reducing the slope of the third encapsulation layer 830, and improving the encapsulation performance of the third encapsulation layer 830.

[0256] like Fig.13 As shown, optionally, the extension portion 313 extends to the transition area 12 , further increasing the invasion path of water and oxygen in the extension portion 313 , thereby reducing the invasion of water and oxygen into the display area 11 .

[0257] Optionally, the extending portion 313 is spaced apart from the second pixel defining portion 312 , so that cracks generated when the second pixel defining portion 312 is cut are unlikely to extend toward the extending portion 313 .

[0258] Please also read Figure 2 and Fig.10 , Fig.10 It is a partial top view of a display panel provided in an embodiment of the present application.

[0259] like Figure 2 and Fig.10 As shown, an embodiment of the present application provides a display panel 10, the display panel 10 includes a display area 11, a hole area 13 and a transition area 12 located between the display area 11 and the hole area 13, and the display panel 10 also includes: a substrate 100; a pixel definition layer 300, located on one side of the substrate 100, the pixel definition layer 300 includes a pixel defining portion 310 and a pixel opening 320 formed by the pixel defining portion 310; a light-emitting layer 600, including a light-emitting unit located in the pixel opening 320; an inorganic encapsulation layer, located on the side of the light-emitting unit away from the substrate 100, the inorganic encapsulation layer includes a cutting avoidance hole 833 at least partially located in the hole area 13, and the orthographic projection of the hole area 13 on the substrate 100 is located within the orthographic projection of the cutting avoidance hole 833 on the substrate 100.

[0260] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a display area 11, a transition area 12 and a hole area 13, wherein the display area 11 is arranged around the transition area 12, and the transition area 12 is arranged around the hole area 13. The display area 11 is used to realize the light-emitting display of the display panel 10, and the photosensitive component is arranged below the display panel in the hole area 13. The display panel 10 also includes a substrate 100, a pixel definition layer 300 and a first encapsulation layer 810. The pixel definition layer 300 includes a pixel defining portion 310, and a pixel opening 320 formed by the pixel defining portion 310, and the pixel opening 320 is used to set a light-emitting unit. The first encapsulation layer 810 encapsulates the first electrode layer 700 and the light-emitting layer 600 to reduce the erosion of water and oxygen on the first electrode layer 700 and the light-emitting layer 600. The first subdivision 811 of the first encapsulation layer 810 is located in the display area 11, which improves the encapsulation performance of the display panel 10 in the display area 11. A cutting avoidance hole 833 is provided on the inorganic encapsulation layer to reduce the film thickness of the display panel 10 at the cutting path position, so as to reduce the difficulty of cutting the hole area 13. Moreover, the orthographic projection of the hole area 13 on the substrate 100 is located within the orthographic projection of the cutting avoidance hole 833 on the substrate 100. When the hole area 13 is cut, the influence of the cutting of the hole area 13 on the inorganic encapsulation layer can be reduced, and the problem of cutting the inorganic encapsulation layer, which causes cracks in the inorganic encapsulation layer and extends to the display area 11, can be avoided.

[0261] Optionally, the inorganic encapsulation layer includes a first encapsulation layer 810 and a third encapsulation layer 830, the third encapsulation layer 830 is located on the side of the first encapsulation layer 810 away from the substrate 100, and the cutting avoidance hole 833 is opened on the first encapsulation layer 810 and / or the third encapsulation layer 830. When the hole area 13 is cut, the impact of the cutting of the hole area 13 on the first encapsulation layer 810 and / or the third encapsulation layer 830 can be reduced, avoiding cutting the first encapsulation layer 810 and / or the third encapsulation layer 830, resulting in cracks in the first encapsulation layer 810 and / or the third encapsulation layer 830 and extending to the display area 11.

[0262] See also Fig.14 , Fig.14 yes Figure 1 A cross-sectional view of another embodiment is shown at AA.

[0263] like Fig.14 As shown, optionally, the inorganic encapsulation layer includes a blocking groove 840 located in the transition area 12, and the blocking groove 840 separates the inorganic encapsulation layer into multiple parts. When the part close to the hole area 13 is cut to produce a crack, the crack extension path is blocked by the blocking groove 840, thereby preventing the crack from extending to the display area 11.

[0264] Optionally, the blocking groove 840 is ring-shaped around the hole area 13 , and the blocking groove 840 isolates the inorganic encapsulation layer around the hole area 13 to further prevent the crack from extending to the display area 11 .

[0265] Optionally, the blocking groove 840 is formed on the first encapsulation layer 810, and the cutting avoidance hole 833 is formed on the third encapsulation layer 830. When the hole area 13 is cut, the effect of the cutting of the hole area 13 on the third encapsulation layer 830 can be reduced, and the problem of cutting the third encapsulation layer 830, which causes cracks in the third encapsulation layer 830 and extending to the display area 11, can be avoided. The blocking groove 840 separates the first encapsulation layer 810 into multiple parts. When a part close to the hole area 13 is cut and cracks are generated, the crack extension path is blocked by the blocking groove 840, thereby preventing the crack from extending to the display area 11.

[0266] Optionally, the blocking groove 840 is arranged to penetrate the first encapsulation layer 810 along the thickness direction of the display panel 10 , so that the first encapsulation layer 810 is completely isolated by the blocking groove 840 , thereby further preventing cracks on the first encapsulation layer 810 from extending to the display area 11 .

[0267] Optionally, the cutting avoidance hole 833 is arranged through the third encapsulation layer 830 along the thickness direction of the display panel 10, so that the third encapsulation layer 830 is completely hollowed out at the cutting avoidance hole 833, further avoiding cutting into the third encapsulation layer 830 during cutting, thereby causing cracks in the third encapsulation layer 830.

[0268] As shown in the figure Fig.13 and Fig.14 As shown, optionally, the display panel 10 further includes: an isolation structure 500, which is located on the substrate 100, and the isolation structure 500 includes a second isolation portion 520 located in the transition area 12, the second isolation portion 520 is spaced apart from the hole area 13, and the blocking groove 840 is located on the side of the second isolation portion 520 away from the substrate 100. The second isolation portion 520 separates the inorganic encapsulation layer to form a blocking groove 840, and the blocking groove 840 separates the inorganic encapsulation layer into multiple parts. When a part close to the hole area 13 is cut to generate a crack, the crack extension path is blocked by the blocking groove 840, thereby preventing the crack from extending to the display area 11.

[0269] In some optional embodiments, the display panel 10 also includes: a first insulating layer 200, located on the substrate 100, the first insulating layer 200 is provided with a first hollow portion 210, the first hollow portion 210 is located in the transition zone 12 and is spaced apart from the display zone 11, and the first hollow portion 210 extends from the transition zone 12 to the hole zone 13 and the adjacent edge of the transition zone 12.

[0270] In these optional embodiments, a first hollow portion 210 is opened on the first insulating layer 200 located between the pixel definition layer 300 and the substrate 100. The first hollow portion 210 is located in the transition area 12 and is spaced apart from the display area 11, so that the thickness of the brittle film layer of the display panel 10 at the position of the first hollow portion 210 is reduced or the brittle film layer is missing. When the substrate 100 is cut at the first hollow portion 210, it is difficult for cracks to form in the first insulating layer 200 and the cracks are difficult to extend to the display area 11, thereby improving the performance of the OLED display panel 10.

[0271] Optionally, the first hollow portion 210 is disposed through the first insulating layer 200 along the thickness direction of the display panel 10 , so that the first insulating layer 200 is completely isolated by the first hollow portion 210 , thereby further preventing cracks from extending on the first insulating layer 200 to the display area 11 .

[0272] Optionally, the first hollow portion 210 is ring-shaped around the hole area 13 , and the first hollow portion 210 isolates the first insulating layer 200 around the hole area 13 , further preventing cracks in the first insulating layer 200 from extending to the display area 11 .

[0273] Optionally, the cutting avoidance hole 833 is located in the transition zone 12. When the transition zone 12 is cut, it is avoided that the inorganic encapsulation layer where the cutting avoidance hole 833 is located is cut, thereby causing cracks in the inorganic encapsulation layer.

[0274] Optionally, the third hollow portion 220 is ring-shaped around the hole area 13 , and the third hollow portion 220 again separates the first insulating layer 200 around the hole area 13 to further prevent cracks in the first insulating layer 200 from extending to the display area 11 .

[0275] like Fig.13 and Fig.14 As shown, the embodiment of the present application provides a display panel 10, which includes a display area 11, a hole area 13 and a transition area 12 located between the display area 11 and the hole area 13, and the display panel 10 also includes: a substrate 100; a first insulating layer 200, which is located on the substrate 100, and the first insulating layer 200 is provided with a first hollow portion 210, the first hollow portion 210 is located in the transition area 12 and is spaced from the display area 11, and the first hollow portion 210 extends from the transition area 12 to the hole area 13 and the adjacent edge of the transition area 12; a pixel definition layer 300, which is located on one side of the substrate 100, and the pixel definition layer 300 includes a pixel defining portion 310 and a pixel opening 320 formed by the pixel defining portion 310; a light-emitting layer 600, which includes a light-emitting unit located in the pixel opening 320; an inorganic encapsulation layer, which is located on the side of the pixel definition layer 300 away from the substrate 100, and the inorganic encapsulation layer includes a blocking groove 840 located in the transition area 12.

[0276] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a display area 11, a transition area 12 and a hole area 13, the display area 11 is arranged around the transition area 12, and the transition area 12 is arranged around the hole area 13. The display area 11 is used to realize the light-emitting display of the display panel 10, and the photosensitive component is arranged under the display panel of the hole area 13. The display panel 10 also includes a substrate 100, a first insulating layer 200, a pixel definition layer 300 and a first encapsulation layer 810. The pixel definition layer 300 includes a pixel defining portion 310, and a pixel opening 320 formed by the pixel defining portion 310, and the pixel opening 320 is used to set the light-emitting unit. A first hollow portion 210 is provided on the first insulating layer 200 between the pixel definition layer 300 and the substrate 100. The first hollow portion 210 is located in the transition area 12 and is spaced apart from the display area 11, so that the thickness of the brittle film layer of the display panel 10 at the position of the first hollow portion 210 is reduced or the brittle film layer is missing. When the substrate 100 is cut at the first hollow portion 210, it is difficult for the first insulating layer 200 to form cracks and the cracks are difficult to extend to the display area 11, thereby improving the performance of the OLED display panel 10. The first encapsulation layer 810 encapsulates the first electrode layer 700 and the light-emitting layer 600 to reduce the erosion of water and oxygen on the first electrode layer 700 and the light-emitting layer 600. The first subsection 811 of the first encapsulation layer 810 is located in the display area 11, which improves the encapsulation performance of the display panel 10 in the display area 11. The blocking groove 840 separates the inorganic encapsulation layer into a plurality of parts. When a portion close to the hole area 13 is cut and cracks are generated, the crack extension path is blocked by the blocking groove 840 , thereby preventing the crack from extending to the display area 11 .

[0277] Optionally, the inorganic encapsulation layer includes a first encapsulation layer 810 and a third encapsulation layer 830, and the blocking groove 840 is opened on the first encapsulation layer 810 and / or the third encapsulation layer 830. The blocking groove 840 separates the first encapsulation layer 810 and / or the third encapsulation layer 830 into multiple parts. When the part close to the hole area 13 is cut and cracks are generated, the crack extension path is blocked by the blocking groove 840, thereby preventing the crack from extending to the display area 11. Optionally, the blocking groove 840 is arranged around the hole area 13, so that cracks generated by the inorganic encapsulation layer on the side of the hole area 13 are difficult to extend to the display area 11.

[0278] Optionally, there are multiple blocking grooves 840 to further prevent the cracks from extending to the display area 11 .

[0279] Optionally, the blocking groove 840 is formed on the first encapsulation layer 810, and the cutting avoidance hole 833 is formed on the third encapsulation layer 830. When the hole area 13 is cut, the effect of the cutting of the hole area 13 on the third encapsulation layer 830 can be reduced, and the problem of cutting the third encapsulation layer 830, which causes cracks in the third encapsulation layer 830 and extending to the display area 11, can be avoided. The blocking groove 840 separates the first encapsulation layer 810 into multiple parts. When a part close to the hole area 13 is cut and cracks are generated, the crack extension path is blocked by the blocking groove 840, thereby preventing the crack from extending to the display area 11.

[0280] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made according to actual conditions, and this application does not impose any specific restrictions on it.

[0281] The embodiment of the present application also provides a display device, including the display panel 10 of any of the above embodiments. Since the display device provided by the embodiment of the present application includes the display panel 10 of any of the above embodiments, the display device provided by the embodiment of the present application has the beneficial effects of the display panel 10 of any of the above embodiments, which will not be repeated here.

[0282] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0283] The present application also provides a method for preparing a display panel 10. The display panel 10 may be the display panel 10 provided in any of the above embodiments. Figures 1 to 15 , and see Fig.16 , Fig.16 1 is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application. The display panel 10 includes a display area 11, a hole area 13, and a transition area 12 located between the display area 11 and the hole area 13. The preparation method includes:

[0284] Step S1: preparing a first insulating layer on a substrate, the first insulating layer having a first hollow portion, the first hollow portion being located in the transition area and spaced apart from the display area, and extending from the transition area to the hole area and an adjacent edge of the transition area.

[0285] Step S2: preparing a pixel definition layer on the substrate, wherein the pixel definition layer includes a pixel definition portion and a pixel opening formed by the pixel definition portion.

[0286] Step S3: preparing a light-emitting layer on the side of the pixel definition layer facing away from the substrate, wherein the light-emitting layer includes a light-emitting unit located in the pixel opening.

[0287] Step S4: Prepare an inorganic encapsulation layer on the side of the pixel definition layer facing away from the substrate, the inorganic encapsulation layer includes a cutting avoidance hole at least partially located in the hole area, the orthographic projection of the hole area on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate, or the inorganic encapsulation layer includes a blocking groove located in the transition area.

[0288] Step S5: cutting along the cutting path located inside the cutting avoidance hole to remove the film layer structure in the hole area, thereby forming an opening corresponding to the hole area.

[0289] According to the preparation method of the embodiment of the present application, the first insulating layer 200 is prepared by step S1. The pixel definition layer 300 is prepared by step S2. The light-emitting layer 600 is prepared by step S3. The inorganic encapsulation layer is prepared by step S4. The hole area 13 is cut by step S5. The pixel definition layer 300 includes a pixel defining portion 310 and a pixel opening 320 formed by the pixel defining portion 310, and the pixel opening 320 is used to set the light-emitting unit. A first hollow portion 210 is opened on the first insulating layer 200 located between the pixel definition layer 300 and the substrate 100. The first hollow portion 210 is located in the transition area 12 and is spaced from the display area 11, so that the thickness of the brittle film layer of the display panel 10 at the position of the first hollow portion 210 is reduced or the brittle film layer is missing. When the substrate 100 is cut at the first hollow portion 210, it is difficult for the first insulating layer 200 to form cracks and the cracks are difficult to extend to the display area 11, thereby improving the performance of the OLED display panel 10. The first encapsulation layer 810 encapsulates the first electrode layer 700 and the light-emitting layer 600 to reduce the erosion of water and oxygen on the first electrode layer 700 and the light-emitting layer 600. The first subdivision 811 of the first encapsulation layer 810 is located in the display area 11, which improves the encapsulation performance of the display panel 10 in the display area 11. A cutting avoidance hole 833 is opened on the inorganic encapsulation layer to reduce the film thickness of the display panel 10 at the cutting path position to reduce the difficulty of cutting the hole area 13. The orthographic projection of the hole area 13 on the substrate 100 is located within the orthographic projection of the cutting avoidance hole 833 on the substrate 100. When the hole area 13 is cut, the impact of the cutting of the hole area 13 on the inorganic encapsulation layer can be reduced, and the problem of cutting the inorganic encapsulation layer causing cracks in the inorganic encapsulation layer and extending to the display area 11 can be avoided. The blocking groove 840 separates the inorganic encapsulation layer into a plurality of parts. When a portion close to the hole area 13 is cut and cracks are generated, the crack extension path is blocked by the blocking groove 840 , thereby preventing the crack from extending to the display area 11 .

[0290] The present application also provides a method for preparing a display panel 10. The display panel 10 may be the display panel 10 provided in any of the above embodiments. Figures 1 to 15 , and see Fig.17 , Fig.17 It is a schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application.

[0291] The preparation method comprises:

[0292] Step S01: preparing a first insulating layer on a substrate, wherein a first preparation groove is formed in the first insulating layer, and the first preparation groove is located in the transition area and the hole area and is spaced apart from the display area.

[0293] Step S02: preparing a pixel definition layer on a side of the first insulating layer facing away from the substrate, wherein the pixel definition layer comprises a pixel definition portion and a pixel opening formed by the pixel definition portion.

[0294] Step S03: performing circular cutting on the substrate in the first preparation groove to form a first hollow portion and an opening located in the hole area, wherein the first hollow portion extends from the transition area to adjacent edges of the hole area and the transition area.

[0295] According to the preparation method of the embodiment of the present application, a first insulating layer 200 is prepared on a substrate 100 through step S01, and a first preparation groove is opened in the transition area 12 of the first insulating layer 200, and the first preparation groove and the display area 11 are arranged at intervals. Then, a pixel opening 320 formed by enclosing a pixel definition layer 300 and a pixel defining portion 310 is prepared through step S02, which is used to set a light-emitting unit to realize the light-emitting display of the display panel 10. Finally, a circular cut is performed on the substrate 100 in the first preparation groove through step S03, so that an opening is formed in the hole area 13 of the display panel 10, so as to set a photosensitive component in the hole area 13 to ensure the photosensitivity effect of the photosensitive component. Since the film thickness of the display panel 10 at the position of the first preparation groove is relatively small, when the substrate 100 is cut in the first preparation groove, it is difficult for the first insulating layer 200 to form cracks and the cracks are difficult to extend to the display area 11, thereby improving the performance of the OLED display panel 10.

[0296] In some optional embodiments, the pixel defining portion 310 includes a first pixel defining portion 311 located in the display area 11 and a second pixel defining portion 312 located in the transition area 12, the second pixel defining portion 312 is annular and is spaced apart from the first pixel defining portion 311, and at least a portion of the second pixel defining portion 312 is disposed in the first preparation groove; before step S03, the method further includes:

[0297] An isolation structure 500 is prepared on the side of the pixel definition layer 300 facing away from the substrate 100 , and the isolation structure 500 includes a first isolation portion 510 located on the first pixel defining portion 311 and two second isolation portions 520 located on the second pixel defining portion 312 and arranged at intervals;

[0298] In step S03, the method further includes:

[0299] The substrate 100 is cut in a circular shape between the two second isolation portions 520 .

[0300] In these optional embodiments, the first isolation portion 510 is disposed in the display area 11 and encloses a plurality of first isolation openings 511 to isolate the light-emitting layer 600 to form mutually disconnected first light-emitting units 610, thereby reducing the crosstalk of carriers in the light-emitting layer 600 and improving the display effect of the display panel 10. In addition, the first light-emitting unit 610 does not need to be prepared using a precision mask, which can reduce the development and use of precision masks and reduce the preparation cost. The two second isolation portions 520 are arranged at intervals on the second pixel defining portion 312. When the substrate 100 is cut, the substrate 100 can be cut in an annular manner between the two second isolation portions 520, reducing the possibility of cutting the first insulating layer 200, so that it is difficult for the first insulating layer 200 to generate cracks and extend to the display area 11.

[0301] In some optional embodiments, the display panel 10 further includes a second light emitting unit 620 on a side of the second isolation portion 520 facing the hole area 13, and in the step of performing annular cutting on the substrate 100 in the first preparation groove, the method further includes:

[0302] The substrate 100 is cut into a circular shape on the second light emitting unit 620 .

[0303] In these optional embodiments, the light-emitting layer 600 is disconnected at the position of the second isolation structure 500 to form a second light-emitting unit 620, so that the film layer structure between the two second isolation parts 520 is close to the film layer structure cut in the related technology. When the substrate 100 is cut on the second light-emitting unit 620, the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0304] In some optional embodiments, the display panel 10 further includes a second electrode 720 on a side of the second isolation portion 520 facing the hole area 13. In step S03, the method further includes:

[0305] The substrate 100 is cut into a circular shape on the second electrode 720 .

[0306] In these optional embodiments, the first electrode layer 700 is disconnected at the position of the second isolation structure 500 to form the second electrode 720, so that the film layer structure between the two second isolation parts 520 is closer to the film layer structure cut in the related technology. When the substrate 100 is cut on the second electrode 720, the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0307] In some optional embodiments, before step S03, the method further includes:

[0308] A first encapsulation material layer is prepared on the side of the pixel definition layer 300 facing away from the substrate 100, and the first encapsulation material layer is patterned to obtain a first sub-portion 811 located in the display area 11 and a second sub-portion 812 located in the transition area 12 and the hole area 13, wherein at least a portion of the second sub-portion 812 is located in the first hollow portion 210;

[0309] In step S03, the method further includes:

[0310] The substrate 100 is cut into a circular shape at the second section 812 .

[0311] In these optional embodiments, a second section 812 of the first packaging layer 810 is disposed in the first preparation groove, so that the film layer structure in the first preparation groove is closer to the film layer structure cut in the related art, and the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0312] In some optional embodiments, before step S03, the method further includes:

[0313] A third encapsulation material layer is prepared on a side of the second sub-portion 812 facing away from the substrate 100, and the third encapsulation material layer is patterned to obtain a third sub-portion 831 located in the display area 11 and a fourth sub-portion 832 located in the transition area 12 and the hole area 13, wherein at least a portion of the fourth sub-portion 832 is located in the first hollow portion 210;

[0314] In step S03, the method further includes:

[0315] The substrate 100 is cut into a circular shape at the fourth section 832 .

[0316] In these optional embodiments, the fourth section 832 of the third encapsulation layer 830 is arranged in the first preparation groove, so that the film layer structure in the first preparation groove is closer to the film layer structure cut in the related technology, and the substrate 100 can be cut using existing cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0317] Optionally, before step S03, the method further includes:

[0318] Remove the second division.

[0319] In these optional embodiments, after removing the second section 812, the film thickness of the transition area 12 is reduced, which facilitates cutting. After removing the second section 812, the problem of cracks in the second section 812 extending toward the display area 11 can be avoided.

[0320] Optionally, after the step of preparing a first encapsulation material layer on the side of the pixel definition layer 300 facing away from the substrate 100, the method further includes:

[0321] Prepare a second packaging material layer on a side of the first packaging material layer facing away from the substrate 100;

[0322] A third encapsulation material layer is prepared on the side of the second encapsulation material layer facing away from the substrate 100, and the third encapsulation material layer is patterned to remove at least a portion of the third encapsulation material layer in the transition area 12 and the hole area 13 to obtain a third encapsulation layer 830, wherein the third encapsulation layer 830 includes a cutting avoidance hole 833 located in the transition area 12. In these optional embodiments, after the third encapsulation material layer is prepared, the third encapsulation material layer is cut in the transition area 12 and the hole area 13, so that the third encapsulation material in the transition area 12 and the hole area 13 is removed and the cutting avoidance hole 833 is formed, so that the thickness of the brittle film layer of the display panel 10 at the position of the cutting avoidance hole 833 in the transition area 12 and the hole area 13 is reduced, and when the substrate 100 is cut at the cutting avoidance hole 833, it is difficult for the third encapsulation layer 830 to form cracks and the cracks are difficult to extend to the display area 11.

[0323] According to the embodiments described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel comprises a display area, a hole area and a transition area between the display area and the hole area, and the display panel further comprises: substrate; A pixel definition layer, located on one side of the substrate, the pixel definition layer comprising a pixel definition portion and a pixel opening formed by the pixel definition portion; a light-emitting layer, comprising a light-emitting unit located in the pixel opening; The inorganic encapsulation layer is located on a side of the light emitting unit away from the substrate, and the inorganic encapsulation layer comprises a cutting avoidance hole, wherein the orthographic projection of the hole area on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate.

2. The display panel according to claim 1, characterized in that: The inorganic encapsulation layer comprises a first encapsulation layer and a third encapsulation layer, the third encapsulation layer is located on a side of the first encapsulation layer away from the substrate, and the cutting avoidance hole is opened on the first encapsulation layer and / or the third encapsulation layer; Preferably, the display panel further includes: The second encapsulation layer is located between the first encapsulation layer and the third encapsulation layer, and the material of the second encapsulation layer includes organic material.

3. The display panel according to claim 2, characterized in that: The inorganic encapsulation layer includes a blocking groove located in the transition region; Preferably, the blocking groove is annular around the hole area; Preferably, the blocking groove is opened on the first packaging layer, and the cutting avoidance hole is opened on the third packaging layer; Preferably, the blocking groove is arranged through the first encapsulation layer along the thickness direction of the display panel; Preferably, the cutting avoidance hole is arranged through the third encapsulation layer along the thickness direction of the display panel; Preferably, the display panel further includes: The isolation structure is located on the substrate, and includes a second isolation portion located in the transition area, the second isolation portion is spaced apart from the hole area, and the blocking groove is located on a side of the second isolation portion away from the substrate.

4. The display panel according to claim 1, characterized in that: Also includes: A first insulating layer, located on the substrate, the first insulating layer is provided with a first hollow portion, the first hollow portion is located in the transition area and is spaced apart from the display area, and the first hollow portion extends from the transition area to the hole area and an adjacent edge of the transition area; Preferably, the first hollow portion is arranged through the first insulating layer along the thickness direction of the display panel; Preferably, the first hollow portion is ring-shaped around the hole area.

5. The display panel according to claim 4, characterized in that: The cutting avoidance hole is located in the transition zone; Preferably, the orthographic projection of the first hollow portion on the substrate and the orthographic projection of the cutting avoidance hole on the substrate at least partially overlap; Preferably, the orthographic projection of the first hollow portion on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate.

6. The display panel according to claim 4, characterized in that: A third hollow portion located in the transition zone is formed on the first insulating layer, and the third hollow portion surrounds the first hollow portion and is spaced apart from the first hollow portion; Preferably, a plurality of the third hollow portions are arranged at intervals; Preferably, the third hollow portion is ring-shaped and surrounds the hole area.

7. A display panel, characterized in that: The display panel comprises a display area, a hole area and a transition area between the display area and the hole area, and the display panel further comprises: substrate; A pixel definition layer, located on one side of the substrate, the pixel definition layer comprising a pixel definition portion and a pixel opening formed by the pixel definition portion; a light-emitting layer, comprising a light-emitting unit located in the pixel opening; The inorganic encapsulation layer is located at a side of the light emitting unit away from the substrate, and the inorganic encapsulation layer comprises a blocking groove located in the transition region.

8. The display panel according to claim 7, characterized in that: The inorganic encapsulation layer comprises a first encapsulation layer and a third encapsulation layer, the third encapsulation layer is located on a side of the first encapsulation layer away from the substrate, and the blocking groove is opened on the first encapsulation layer and / or the third encapsulation layer; Preferably, the blocking groove surrounds the hole area in a ring shape; Preferably, there are multiple blocking grooves; Preferably, the inorganic encapsulation layer comprises a cutting avoidance hole located in the hole area, and the orthographic projection of the hole area on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate; Preferably, the blocking groove is opened on the first packaging layer, and the cutting avoidance hole is opened on the third packaging layer; Preferably, the blocking groove is provided through the first packaging layer.

9. The display panel according to claim 7, characterized in that: The display panel further includes: The isolation structure is located on the substrate, and includes a second isolation portion located in the transition area, the second isolation portion is spaced apart from the hole area, and the blocking groove is located on a side of the second isolation portion away from the substrate.

10. The display panel according to claim 8, characterized in that: Also includes: A first insulating layer, located on the substrate, the first insulating layer is provided with a first hollow portion, the first hollow portion is located in the transition area and is spaced apart from the display area, and the first hollow portion extends from the transition area to the hole area and an adjacent edge of the transition area; Preferably, the first hollow portion is arranged through the first insulating layer along the thickness direction of the display panel; Preferably, the first hollow portion is ring-shaped around the hole area.

11. The display panel according to claim 10, characterized in that: The cutting avoidance hole is located in the transition zone; Preferably, the orthographic projection of the first hollow portion on the substrate and the orthographic projection of the cutting avoidance hole on the substrate at least partially overlap; Preferably, the orthographic projection of the first hollow portion on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate.

12. A display panel, characterized in that: The display panel comprises a display area, a hole area and a transition area between the display area and the hole area, and the display panel comprises: substrate; A first insulating layer, located on the substrate, the first insulating layer is provided with a first hollow portion, the first hollow portion is located in the transition area and is spaced apart from the display area, and the first hollow portion extends from the transition area to the hole area and an adjacent edge of the transition area; A pixel definition layer, located on a side of the first insulating layer away from the substrate, the pixel definition layer comprising a pixel definition portion and a pixel opening formed by the pixel definition portion; The light-emitting layer includes a light-emitting unit located in the pixel opening.

13. The display panel according to claim 12, characterized in that: Also includes: A first encapsulation layer is located on a side of the light-emitting unit away from the substrate; a second encapsulation layer, located on a side of the first encapsulation layer away from the substrate; a third packaging layer, located on a side of the second packaging layer away from the substrate, At least one of the first encapsulation layer and the third encapsulation layer is provided with a blocking groove or a cutting avoidance hole; Preferably, the second encapsulation layer is located in the display area.

14. The display panel according to claim 13, characterized in that: The display panel further includes: an isolation structure, located on one side of the substrate, the isolation structure comprising a second isolation portion located in the transition region, the second isolation portion being spaced apart from the hole region, the first encapsulation layer further comprising a second sub-portion located in the transition region, at least a portion of the second sub-portion being located in the first hollow portion, the second sub-portion being separated by the second isolation portion and forming a plurality of sub-portions, and the blocking groove located on the isolation structure being formed between adjacent sub-portions; Preferably, the sub-portion includes a first thinned portion located on at least one side of the second isolation portion.

15. The display panel according to claim 14, characterized in that: The pixel definition layer includes a second pixel defining portion located in the first hollow portion, and the second isolation portion is located on a side of the second pixel defining portion away from the substrate.

16. The display panel according to claim 15, characterized in that: The isolation structure comprises a first isolation portion located in the display area, the first isolation portion enclosing and forming the first isolation opening; Preferably, the pixel definition layer includes a first pixel defining portion located in the display area, the pixel opening includes a first pixel opening formed by enclosing the first pixel defining portion, and the first pixel opening is connected to the first isolation opening; Preferably, the light emitting unit comprises a first light emitting unit located in the first isolation opening; Preferably, the display panel further comprises: a first electrode layer located on a side of the light-emitting layer away from the substrate, the first electrode layer comprising a first electrode located in the first isolation opening; Preferably, the light emitting unit comprises a second light emitting unit located on a side of the second isolation portion facing the hole area; Preferably, the display panel further comprises a retaining wall, the retaining wall is located on a side of the first insulating layer away from the substrate, the retaining wall is arranged between the first pixel defining portion and the first hollow portion and surrounds the transition region in a ring shape; Preferably, there are more than two retaining walls; Preferably, the pixel defining portion further comprises an extension portion connected to the first pixel defining portion, and at least a portion of the extension portion is located on a surface of the retaining wall away from the substrate; Preferably, the extension portion extends to the transition zone; Preferably, the extending portion is spaced apart from the first pixel defining portion.

17. The display panel according to claim 13, characterized in that: The third encapsulation layer includes the cutting avoidance hole located in the hole area; Preferably, the orthographic projection of the first hollow portion on the substrate and the orthographic projection of the cutting avoidance hole on the substrate at least partially overlap; Preferably, the orthographic projection of the first hollow portion on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate; Preferably, the first hollow portion is arranged to penetrate the first insulating layer along a thickness direction of the display panel.

18. The display panel according to claim 12, characterized in that: The first hollow portion comprises an upper surface and a lower surface which are arranged opposite to each other along the thickness direction of the display panel, the upper surface is located on a side of the lower surface away from the substrate, the hollow portion has a first opening located on the upper surface and a second opening located on the lower surface, and the orthographic projection of the second opening on the substrate is located within the orthographic projection of the first opening on the substrate; Preferably, a third hollow portion located in the transition zone is formed on the first insulating layer, and the third hollow portion surrounds the first hollow portion and is spaced apart from the first hollow portion; Preferably, a plurality of the third hollow portions are arranged at intervals.

19. A display device, characterized in that: A display panel comprising any one of claims 1-18.

20. A method for preparing a display panel, characterized in that: The display panel comprises a display area, a hole area and a transition area between the display area and the hole area, including: A first insulating layer is prepared on the substrate, wherein the first insulating layer is provided with a first hollow portion, the first hollow portion is located in the transition area and is spaced apart from the display area, and the first hollow portion extends from the transition area to the hole area and an adjacent edge of the transition area; Preparing a pixel definition layer on the substrate, wherein the pixel definition layer includes a pixel definition portion and a pixel opening formed by the pixel definition portion; A light-emitting layer is prepared on a side of the pixel definition layer away from the substrate, wherein the light-emitting layer includes a light-emitting unit located in the pixel opening; An inorganic encapsulation layer is prepared on a side of the pixel definition layer facing away from the substrate, the inorganic encapsulation layer comprises a cutting avoidance hole located in the hole area, the orthographic projection of the hole area on the substrate is located within the orthographic projection of the cutting avoidance hole on the substrate, or the inorganic encapsulation layer comprises a blocking groove located in the transition area; Cutting is performed along a cutting path located inside the cutting avoidance hole to remove the film layer structure of the hole area, thereby forming an opening corresponding to the hole area.

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