Display substrate and display device thereof

Abstract

The embodiment of the invention provides a display substrate and related display equipment. A display substrate includes: a first substrate including a first region and a second region; a second substrate on the first region of the first substrate, the second substrate including a display region and a bonding region; a conductive member on at least one of the second region of the first substrate and the bonding region of the second substrate; and a sealing member on the second region of the first substrate and the bonding region of the second substrate, and configured to seal the conductive member. The sealing member includes a central portion and an edge portion at least partially surrounding the central portion. A thermal expansion coefficient of the central portion is closer to a thermal expansion coefficient of the conductive member than a thermal expansion coefficient of the edge portion. The orthographic projection of the edge portion of the sealing member parallel to the first substrate is separated from the orthographic projection of the conductive member on the first substrate.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the field of display technology, and in particular, to a display substrate and a display device thereof. Background Art

[0002] Organic Light-Emitting Diode (OLED) display panels have the advantages of self-luminescence, high efficiency, bright colors, light weight, power saving, and a wide temperature range. They have been widely used in near-eye display devices (for example, VR or AR display devices, electronic viewfinders (Electromagnetic Vortex Flowmeter, EVF), first-person perspective (First Person View, FPV) devices or sights, etc.), and are gradually being used in large-area display, lighting, and vehicle-mounted display fields. Summary of the invention

[0003] Embodiments of the present disclosure provide a display substrate and a related display device.

[0004] According to a first aspect of the present disclosure, a display substrate is provided. The display substrate includes: a first substrate, which includes a first area and a second area; a second substrate, which is located on the first area of ​​the first substrate, and the second substrate includes a display area and a bonding area; a conductive component, which is located on at least one of the second area of ​​the first substrate and the bonding area of ​​the second substrate; a sealing component, which is located on the second area of ​​the first substrate and on the bonding area of ​​the second substrate, and is configured to seal the conductive component. The sealing component includes a central portion and an edge portion at least partially surrounding the central portion. The thermal expansion coefficient of the edge portion of the central portion is closer to the thermal expansion coefficient of the conductive component. The orthographic projection of the edge portion of the sealing component on the first substrate is separated from the orthographic projection of the conductive component on the first substrate.

[0005] In an embodiment of the present disclosure, the edge portion of the sealing member has a uniform size along a direction parallel to the first substrate.

[0006] In an embodiment of the present disclosure, an orthographic projection of the edge portion of the sealing component on the first substrate is located within the first substrate.

[0007] In an embodiment of the present disclosure, the display substrate further comprises: a cover plate located on the display area, wherein an orthographic projection of the cover plate on the first substrate is separated from an orthographic projection of the edge portion of the sealing component on the first substrate.

[0008] In an embodiment of the present disclosure, in a direction perpendicular to the first substrate, a top surface of the cover plate is higher than a height of the sealing member.

[0009] In an embodiment of the present disclosure, an orthographic projection of the central portion of the sealing member on the first substrate is located within an orthographic projection of the edge portion of the sealing member on the first substrate.

[0010] In an embodiment of the present disclosure, the display substrate further comprises: an alignment mark for the cover plate, which is disposed on the second substrate and adjacent to the cover plate. A minimum distance between the edge portion of the sealing member and the conductive member is greater than a minimum distance between the alignment mark and the cover plate.

[0011] In an embodiment of the present disclosure, the minimum distance between the edge portion of the sealing member and the conductive member is greater than twice the minimum distance between the alignment mark and the cover plate.

[0012] In an embodiment of the present disclosure, a minimum distance between the edge portion of the sealing member and the cover plate is greater than the minimum distance between the alignment mark and the cover plate.

[0013] In an embodiment of the present disclosure, a minimum distance between the edge portion of the sealing member and the cover plate is greater than twice the minimum distance between the alignment mark and the cover plate.

[0014] In an embodiment of the present disclosure, the conductive component includes: a first pad on the second substrate; a second pad on the first substrate; and a lead between the first pad and the second pad connecting the first pad and the second pad.

[0015] In an embodiment of the present disclosure, the edge portion of the sealing component has a first portion located between the cover plate and the conductive component, and a minimum distance between the first portion and the cover plate is greater than a minimum distance between the first portion and the conductive component.

[0016] In an embodiment of the present disclosure, the direction parallel to the first substrate includes a first direction and a second direction perpendicular to the first direction. The second pad, the first pad, and the display area are sequentially arranged along the second direction. The width of the edge portion of the sealing member is greater than the maximum dimension of the first pad along the second direction.

[0017] In an embodiment of the present disclosure, the edge portion of the sealing component further includes a second portion not located between the cover plate and the conductive component, wherein the width of the second portion is greater than the width of the first portion and less than twice the maximum dimension of the second gasket along the second direction.

[0018] In an embodiment of the present disclosure, a maximum dimension of the first pad along the second direction is smaller than a maximum dimension of the second pad along the second direction.

[0019] In an embodiment of the present disclosure, the edge portion of the sealing component is a quadrilateral. The quadrilateral includes a first side and a second side arranged opposite to each other along the first direction, and a third side and a fourth side arranged opposite to each other along the second direction. The first side is adjacent to the first pad, and the second side is adjacent to the second pad. The minimum distance between the second pad and the second side along the second direction is greater than the minimum distance between the second pad and the third side or the fourth side along the first direction.

[0020] In an embodiment of the present disclosure, a minimum distance between the second pad and the third side along the first direction is equal to a minimum distance between the second pad and the fourth side along the first direction.

[0021] In an embodiment of the present disclosure, the quadrilateral has rounded corners, and a curvature radius of the rounded corner defined by the first side and the third side or the fourth side is greater than a curvature radius of the rounded corner defined by the second side and the third side or the fourth side.

[0022] In an embodiment of the present disclosure, a minimum distance between the first pad and the third side or the fourth side along the first direction is smaller than a minimum distance between the second pad and the second side along the second direction.

[0023] According to a second aspect of the present disclosure, a display device is provided, comprising a display substrate according to any one of the embodiments in the first aspect.

[0024] Further aspects and scopes of adaptability become apparent from the description provided herein. It should be understood that various aspects of the present application can be implemented individually or in combination with one or more other aspects. It should also be understood that the description and specific embodiments herein are intended for purposes of illustration only and are not intended to limit the scope of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described herein are for illustrative purposes only of selected embodiments, not all possible implementations, and are not intended to limit the scope of the present application, wherein:

[0026] Figure 1A top view of a display substrate is shown;

[0027] Figure 2 shows a top view of a display substrate according to an embodiment of the present disclosure;

[0028] Figure 3 Shown along Figure 1 A cross-sectional view showing the unfilled central portion of the substrate at the center line XX1;

[0029] Figure 4 Shown along Figure 1 A cross-sectional view of the center line XX1 showing the filled center portion of the substrate;

[0030] Figure 5 Shown along Figure 2 A cross-sectional view of the unfilled central portion of the display substrate at the center line YY1;

[0031] Figure 6 Shown along Figure 2 A cross-sectional view of the center line YY1 showing the filled center portion of the substrate;

[0032] Figure 7 shows a top view of a display substrate according to another embodiment of the present disclosure;

[0033] Figure 8 Shows Figure 7 An optical lens diagram of a display substrate in FIG.

[0034] Fig. 9 Shows Figure 7 An optical lens diagram of a sealing member of a display substrate in FIG.

[0035] Fig.10 A schematic structural diagram of a display device according to an embodiment of the present disclosure is shown.

[0036] Throughout the various views of these drawings, corresponding reference numerals indicate corresponding parts or features. The drawings only illustrate the positional relationship of the various elements and are not drawn to scale. DETAILED DESCRIPTION

[0037] First, it should be noted that, unless the context clearly indicates otherwise, the singular form of the words used in this document and the appended claims includes the plural, and vice versa. Thus, when referring to the singular, the plural form of the corresponding term is generally included. Similarly, the words "comprise" and "include" will be interpreted as inclusive rather than exclusive. Similarly, the terms "include" and "or" should be interpreted as inclusive unless otherwise specified herein. Where the term "example" is used in this document, especially when it is located after a group of terms, the "example" is merely exemplary and illustrative and should not be considered exclusive or extensive.

[0038] In addition, it should be noted that when introducing elements of the present application and embodiments thereof, the articles "a", "an", "the" and "said" are intended to indicate the presence of one or more elements; unless otherwise specified, "plurality" means two or more; the terms "comprising", "including", "containing" and "having" are intended to be inclusive and indicate that there may be additional elements besides the listed elements; the terms "first", "second", "third", etc. are used only for descriptive purposes and are not to be understood as indicating or implying relative importance and order of formation.

[0039] It should be understood that when a layer, region, or component is mentioned as being "on" another part, it means that it is directly located on the other part, or there may be other components in between. Conversely, when a component is mentioned as being "directly" located on another component, it means that there are no other components in between. In the embodiments of the present disclosure, the reliability test refers to the periodic change of the operating temperature of the display substrate for a period of time in an environment with a certain humidity. For example, the conditions of the reliability test may include: the humidity is 85; the low temperature is minus 55°C; the high temperature is 85°C above zero; switching between the low temperature and the high temperature every half an hour; and the duration is 240 hours.

[0040] Example embodiments will now be described more fully with reference to the accompanying drawings.

[0041] Figure 1 1 is a top view of a display substrate. Generally, the display substrate 10 includes a first substrate 110 , a second substrate 120 , a conductive component 130 , and a sealing component 140 .

[0042] like Figure 1 As shown, the first substrate 110 includes a first area AA and a second area BB. The second substrate 120 is located on the first area AA of the first substrate 110. The second substrate 120 includes a display area CC and a bonding area DD. The second substrate 140 includes a single crystal silicon substrate. The display panel 10 also includes an organic electroluminescent display device (OLED) located on the single crystal silicon substrate and a pixel driving circuit for driving the OLED.

[0043] like Figure 1 As shown, the conductive component 130 is located on at least one of the second area BB of the first substrate 110 and the bonding area DD of the second substrate 120. The conductive component 130 includes a first pad 1310, a second pad 1320, and a lead 1330 (not shown) connecting the first pad 1310 and the second pad 1320 between the first pad 1310 and the second pad 1320. The lead 1330 will be referred to below. Figure 3 and Figure 4 It is shown and will not be described again here.

[0044] like Figure 1 As shown, the sealing member 140 is located on the second region BB of the first substrate 110 and the bonding region DD of the second substrate 120 and is configured to seal the conductive member 130. The sealing member 140 includes a central portion 1410 (for clarity, the central portion 1410 is shown as transparent) and an edge portion 1420 at least partially surrounding the central portion 1410. Figure 1 In the illustrated substrate 10, the central portion 1410 may be a filling glue, and the edge portion 1420 may be a dam glue. The viscosity of the edge portion 1420 is generally greater than that of the central portion 1410. In other words, the viscosity of the dam glue is greater than that of the filling glue.

[0045] In addition, the size of the edge portion 1420 of the sealing member 140 is uneven in a direction parallel to the first substrate 110. Figure 1 As shown, the width of each side of the edge portion 1420 is uneven. In other existing display substrates, the width of any side of the edge portion 1420 may be uneven. When the temperature changes, the sealing component with such a structure may cause uneven force on the display substrate due to thermal expansion and contraction, resulting in disconnection of electrical connection, thereby affecting the display effect of the display substrate or shortening the service life of the display substrate.

[0046] The thermal expansion coefficient of the center portion 1410 is closer to the thermal expansion coefficient of the conductive component 130 than the thermal expansion coefficient of the edge portion 1420. Figure 1 As shown, the edge portion 1420 contacts the conductive member 130. The edge portion 1420 contacts the first pad P1, the second pad P2, and the lead (not shown). In other existing display substrates, the edge portion 1420 may contact one or both of the first pad P1, the second pad P2, and the lead (not shown).

[0047] The display substrate 10 further includes a cover plate 150 and an alignment mark 150M of the cover plate 150. The cover plate 150 is located on the display region CC of the second substrate 120. Figure 1 As shown, the cover plate 150 contacts the edge portion 1420. Figure 3 and Figure 4 The cross-sectional view shown illustrates the contact between the cover plate 150 and the edge portion 1420 in detail.

[0048] Figure 3 Shown along Figure 1 A cross-sectional view of the unfilled central portion of the display substrate along the center line XX1. Figure 4 Shown along Figure 1 A cross-sectional view of the center line XX1 showing the filled center portion of the substrate. Figure 3As shown, along Figure 1 In the cross-sectional view of the display substrate 30 along the center line XX1, the edge portion 1320 of the sealing member 130 is higher than the top surface of the cover plate 150 in the direction perpendicular to the first substrate 110. Figure 4 As shown, in the display substrate 40 after the central portion 1310 of the sealing member 130 is filled, the central portion 1310 is higher than the top surface of the cover plate 150 in the direction perpendicular to the first substrate 110. This structure causes the packaging component to contact the sealing member 140 (e.g., the central portion 1410) when the display substrate 10, 30 or 40 is packaged. In the direction perpendicular to the first substrate 110, the packaging component exerts a force on the sealing member 140, causing the sealing member 140 to be damaged and lose its sealing function, thereby causing the components in the display substrate 10, 30 or 40 to deteriorate under the action of water and oxygen, affecting the display quality and service life of the display substrate 10, 30 or 40. In addition, due to the effect of thermal expansion and contraction, the edge portion 1420 exerts a force on the cover plate 150 in the direction parallel to the first substrate 110, thereby causing the packaging effect of the cover plate 150 to fail, thereby reducing the display effect and service life of the display device packaged therein.

[0049] When the reliability test of the display substrate 10 is performed, since the thermal expansion coefficient (e.g., linear thermal expansion coefficient) of the edge portion 1420 is much larger than the thermal expansion coefficient (e.g., linear thermal expansion coefficient) of the conductive component 130, the temperature change may cause the electrical connection between the conductive components to be destroyed (i.e., causing a low reliability disconnection), which will cause the display substrate 10 to present an abnormal display or a black screen.

[0050] As described above, the edge portion 1420 is in contact with the conductive component 130 (the first pad P1, the second pad P2, and the lead (not shown)), resulting in a broken line, which in turn causes the display substrate to have a display abnormality or a black screen problem. The present application provides a new display substrate, which avoids the broken line by separating the edge portion of the sealing component 140 from the conductive component 130, thereby avoiding the display abnormality or the black screen problem of the display substrate, thereby improving or enhancing the display quality of the display substrate.

[0051] Refer to the following Figure 2 as well as Figures 5 to 10 The technical solution proposed in this application is further described.

[0052] Figure 2 FIG. 2 shows a top view of a display substrate according to an embodiment of the present disclosure. Figure 2As shown, the display substrate 20 includes a first substrate 210, a second substrate 220, a conductive component 230, and a sealing component 240. The first substrate 210, the second substrate 220, the conductive component 230, the sealing component 240, the cover plate 250 and the alignment mark 250M are respectively Figure 1 The first substrate 110, the second substrate 120, the conductive member 130, the sealing member 140, the cover plate 150, and the alignment mark 150M shown in FIG. 1 are similar.

[0053] like Figure 2 As shown, the conductive component 230 includes: a first pad 2310 on the bonding area DD of the second substrate 220; a second pad 2320 on the second area BB of the first substrate 210; and a lead 1330 (not shown) connecting the first pad 2310 and the second pad 2320 between the first pad 2310 and the second pad 2320. The lead 2330 will be referred to below. Figure 5 and Figure 6 The first pads 2310 are arranged in an array, and the second pads 2320 are also arranged in an array. Figure 2 As shown, the first pads 2310 are arranged in a 1×N array, and the second pads 2320 are arranged in a 2×M array. N and M are integers greater than 1. The first pads 2310 and the second pads 2320 both include functional pads and dummy pads. In the first direction X, the dummy pads are located on both sides of the functional pads.

[0054] The maximum dimension d6 of the first pad 2310 along the second direction is smaller than the maximum dimension d5 of the second pad 2320 along the second direction. Figure 2 As shown, the direction parallel to the first substrate 210 includes a first direction X and a second direction Y perpendicular to the first direction X. The second pad 2320 , the first pad 2310 , and the display area CC are disposed along the second direction Y.

[0055] In an embodiment of the present disclosure, the orthographic projection of the edge portion 2420 on the first substrate 210 may be located within the first substrate 210. The orthographic projection of the center portion 2410 on the first substrate 210 is located within the orthographic projection of the edge portion 2420 on the first substrate 210.

[0056] In an embodiment of the present disclosure, the thermal expansion coefficient of the center portion 2410 is closer to the thermal expansion coefficient of the conductive component 130 than the thermal expansion coefficient of the edge portion 2420. In an embodiment of the present disclosure, the first liner 2310 is configured to have the same or similar thermal expansion coefficient as the second liner 2320.

[0057] In an embodiment of the present disclosure, the density of the central portion 2410 is greater than the density of the edge portion 2420. In an embodiment of the present disclosure, the density of the central portion 2410 is 1.5-2.0 g / cm 3 , the density of the edge part is 1.0-1.5g / cm 3 The main materials of the center portion 2410 and the edge portion 2420 include: silicone, acrylic resin, and epoxy resin. By adjusting the mass ratio of the above three main materials, the density of the center portion 2410 and the edge portion 2420 can be adjusted. Generally, there is a corresponding relationship between the density of the object material and the thermal expansion coefficient. Therefore, the thermal expansion coefficient can be changed by changing the material density.

[0058] In this embodiment, the thermal expansion coefficient of the lead 2330 (eg, comprising aluminum) may be 23.2×10 -6 / °C. The thermal expansion coefficient of the first liner 2310 and the second liner 2320 (for example, including copper) may be 17.5×10 -6 / °C. The thermal expansion coefficient of the central portion 1410 may be 15×10 -6 / °C. The thermal expansion coefficient of the edge portion 1420 may be 61×10 -6 / ℃.

[0059] Figure 2 The display substrate 20 and Figure 1 The main difference between the display substrate 10 in FIG. 1 and FIG. 2 is that the orthographic projection of the edge portion 2420 of the sealing member 240 on the first substrate 210 is separated from the orthographic projection of the conductive member 230 (e.g., the first pad P1, the second pad P2, and the lead (not shown)) on the first substrate 210. The minimum distance d1 between the edge portion 2420 and the conductive member 230 is greater than the minimum distance d2 between the alignment mark 250M and the cover plate 250.

[0060] In an embodiment of the present disclosure, the edge portion 240 may include a first portion EC located between the cover plate 240 and the conductive component 230; and a second portion ES not located between the cover plate 240 and the conductive component 230. The minimum distance d3 between the first portion EC and the cover plate 240 is greater than the minimum distance d1 between the first portion EC and the conductive component 230 (e.g., the first liner 2310). The width of the edge portion 240 (the first portion EC and the second portion ES) is greater than the maximum dimension d6 of the first liner 2310 along the second direction Y and less than 2 times the maximum dimension d7 of the second liner 2320 along the second direction Y. Figure 2As shown, the maximum dimension d7 of the second pad 2320 along the second direction Y is greater than the maximum dimension d6 of the first pad 2310 along the second direction Y. In the embodiment disclosed herein, the width of the edge portion 240 (the first portion EC and the second portion ES) is greater than the maximum dimension d6 of the first pad 2310 along the second direction Y and less than the maximum dimension d7 of the second pad 2320 along the second direction Y.

[0061] In an embodiment of the present disclosure, the edge portion 2420 may be a quadrilateral. The edge portion 2420 includes a first side E1 and a second side E2 disposed opposite to each other along the first direction X, and a third side E3 and a fourth side E4 disposed opposite to each other along the second direction Y. The first side E1 is adjacent to the first pad 2310, and the second side E2 is adjacent to the second pad 2320. Figure 2 As shown, the minimum distance d1 between the edge portion 2420 and the conductive component 230 refers to the distance between the first edge E1 and the first pad 2310. In this embodiment, d2 is greater than 160 μm. In the embodiment of the present disclosure, E1 includes the first portion EC between the cover plate 250 and the conductive component 230. Figure 2 In the display substrate 20 shown, the first side E1 is parallel to the cover plate 250 along the first direction X. The arrangement direction of the array of the first pad 2310 and the second pad 2320 is parallel. In other embodiments of the present disclosure, the first side E1 may be parallel to the cover plate 250 and one or more of the arrangement directions of the array of the first pad 2310 and the second pad 2320. In another embodiment of the present disclosure, the first side E1 may not be parallel to the arrangement direction of the cover plate 250 and the array of the first pad 2310 and the second pad 2320.

[0062] In other embodiments of the present disclosure, the edge portion 240 may not be a quadrilateral. The edge portion 240 may be a circle or other polygon. Here, a hexagon is taken as an example. The edge portion 240 includes a first portion EC located between the cover plate 240 and the conductive component 230; and a second portion ES that is not located between the cover plate 240 and the conductive component 230. The minimum distance d3 between the first portion EC and the cover plate 240 is greater than the minimum distance d1 between the first portion EC and the conductive component 230 (e.g., the first liner 2310). The width of the second portion ES is less than twice the maximum dimension d7 of the second liner 2320 along the second direction Y.

[0063] At least a portion of the edge portion 2420 of the sealing member 240 has a uniform size in a direction parallel to the first substrate 210. Figure 2As shown, the width db of the second side E2, the width dc of the third side E3, and the width dd of the fourth side E4 of the edge portion 2420 are uniform. The width da of the first side E1 of the edge portion 2420 is smaller than the width db of the second side E2, the width dc of the third side E3, and the width dd of the fourth side E4. In this embodiment, the width of the first side E1 is the same as the width of the first portion EC. In other embodiments of the present disclosure, the width of the first side E1 may also be different from the width of the first portion EC. The width of the edge portion 2420 is greater than the maximum dimension d6 of the first pad 2320 along the second direction Y, and is smaller than the maximum dimension d5 of the second pad 2320 along the second direction Y. Figure 2 In the display substrate 20 shown in the figure, the widths da, db, dc, and dd of the first side E1 (the width of the first portion EC), the second side E2, the third side E3, and the fourth side E4 are all greater than the width d6 of the first pad 2310 in the Y direction, and are smaller than the dimension d7 of the second pad P2 in the Y direction. In the embodiment of the present disclosure, the width of the edge portion 2420 is preferably in the range of 1.5 to 2.1 mm. Figure 7 Other embodiments of the edge portion 2420 are described, and will not be repeated here. This edge portion 2420 with uniform width can avoid uneven force on the first substrate 210 and the second substrate 220 of the display substrate 20 caused by thermal expansion and contraction, and avoid electrical connection failure caused by this, thereby improving the display effect of the display substrate 20 and extending the service life. In addition, this structure limits the range of the edge portion 2420 of the sealing component 240, thereby reducing the amount of material used in the sealing component 240 (edge ​​portion 2420 and center portion 2410), and improving related production capacity.

[0064] In an embodiment of the present disclosure, the edge portion 2420 may be a rounded quadrilateral. Figure 2 As shown, the edge portion 2420 is a rounded rectangle. In other embodiments of the present disclosure, the edge portion 2420 may also be a rounded trapezoid. The edge portion 2420 includes a first rounded corner defined by a first side E1, a third side E3, and a fourth side E4. and the second fillet and a third rounded corner defined by the second side E, the third side E3 and the fourth side E4 and the fourth fillet In the embodiment of the present disclosure, the first rounded corner The curvature radius R1 is greater than the third fillet The curvature radius R3 is greater than the fourth fillet The curvature radius R4. Second fillet The curvature radius R2 is also larger than the third fillet The curvature radius R3 is greater than the fourth fillet The radius of curvature is R4. Figure 2 In the display substrate 20 shown in FIG. With the second fillet The radius of curvature is the same as R1 = R2. and the fourth fillet The radius of curvature is the same as R3 = R4. The first fillet Second fillet Third fillet and the fourth fillet The curvature radius of the first fillet satisfies the following condition: (R1=R2)>(R3=R4). The curvature radius R1 can also be The curvature radius R2 is different, the third fillet The curvature radius R3 can be The edge portion 2420 having such a structure can avoid the bonding failure between the first substrate 210 and the second substrate 220 due to the rapid solidification of the edge portion 2420 during the manufacturing process of the edge portion 2420 .

[0065] The orthographic projection of the edge portion 2420 on the first substrate 210 is separated from the orthographic projection of the cover plate 250 on the first substrate 210. This structure can ensure that the sealing component 240 does not apply a force parallel to the first substrate 210 to the cover plate 250, thereby avoiding failure of the cover plate package. Figure 2 As shown, the minimum distance d3 between the edge portion 2420 and the cover plate 250 is greater than the minimum distance d2 between the alignment mark 250M and the cover plate 250. In some embodiments of the present disclosure, the minimum distance d3 between the edge portion 2420 and the cover plate 250 is greater than the minimum distance d2 between the alignment mark 250M and the cover plate 250 and greater than the minimum distance d1 between the edge portion 2420 and the conductive component 230. This structure can limit the range of the edge portion 2420 of the sealing component 240 while avoiding reliability disconnection and cover plate packaging failure, thereby reducing the amount of material used in the sealing component 240 and improving related production capacity. In an embodiment of the present disclosure, the minimum distance d3 refers to the distance between the first portion EC of the first edge E1 and the cover plate 250. In an embodiment of the present disclosure, the minimum distance d3 between the edge portion 2420 and the cover plate 250 is greater than twice the minimum distance d2 between the alignment mark 250M and the cover plate 250. For example, the minimum distance d3 between the edge portion 2420 and the cover plate 250 can be greater than 160μm.

[0066] In a direction parallel to the first substrate 210, the distance d4 between the second pad 2320 and the third side E3 and the fourth side E4 of the edge portion 2420 is greater than the distance d5 between the second pad 2320 and the second side E2 of the edge portion 2420. As described above, in the first pad 2310 and the second pad 2320, in the first direction X, the dummy pads are located on both sides of the functional pads. Relatively speaking, the edge portion 2420 (e.g., cofferdam glue) of the sealing member 240 has less influence on the dummy pads than on the functional pads. Therefore, this structure can further limit the range of the edge portion 2420, thereby reducing the amount of material used in the sealing member 240 and improving the relevant production capacity. Additionally, this structure can limit the width of the sealing portion 2420 along the first direction X, thereby reserving sufficient space for the assembly of the entire machine. Alternatively, the size of the entire machine can be reduced when the assembly space is constant.

[0067] like Figure 2 As shown, the distance between the second pad 2320 and the third side E3 is equal to the distance between the second pad 2320 and the fourth side E4, both are d4, and the distance between the second pad 2320 and the second side E2 is d5. In the embodiment of the present disclosure, d4 is less than d5. The distance between the first pad 2310 and the third side E3 is equal to the distance between the first pad 2310 and the fourth side E4, both are d8. In the embodiment of the present disclosure, d8 is less than d5.

[0068] In the embodiment of the present disclosure, the top surface of the cover plate 250 is higher than the height of the sealing member 230 in the direction parallel to the first substrate 210. Figure 5 and Figure 6 The cross-sectional view shown illustrates the contact between the cover plate 250 and the edge portion 2420 in detail.

[0069] Figure 5 Shown along Figure 2 A cross-sectional view of the unfilled center portion of the display substrate along center line YY1. Figure 6 Shown along Figure 2 The cross-sectional view of the filled central portion of the display substrate along the center line YY1. In the direction perpendicular to the first substrate 210, the edge portion 2320 of the sealing member 230 is lower than the top surface of the cover plate 250. Figure 5 As shown, along Figure 2 In the cross-sectional view of the display substrate 500 along the center line YY1, the edge portion 2320 of the sealing member 230 is lower than the bottom surface of the cover plate 250. In other embodiments of the present disclosure, the edge portion 2320 of the sealing member 230 may be higher than the bottom surface of the cover plate 250 but lower than the top surface of the cover plate 250. In the direction perpendicular to the first substrate 210, the center portion 2310 of the sealing member 230 is also lower than the top surface of the cover plate 250. Figure 6As shown, in the display substrate 60 after the central portion 2310 of the sealing member 130 is filled, the central portion 2310 is lower than the bottom surface of the cover plate 250 in the direction perpendicular to the first substrate 210. In other embodiments of the present disclosure, the central portion 2310 of the sealing member 230 is higher than the bottom surface of the cover plate 250 but lower than the top surface of the cover plate 250. This structure can avoid the generation of force on the sealing member 240 in the direction perpendicular to the first substrate 210 when the display substrate 20, 50 or 60 is assembled as a whole, thereby avoiding the sealing member 140 from being damaged and losing the sealing function or causing the electrical connection therein to fail, thereby improving the display quality of the display substrate 20, 50 or 60 and extending the service life.

[0070] Figure 7 FIG. 2 shows a top view of a display substrate according to another embodiment of the present disclosure. In a direction parallel to the first substrate 210, the width of the edge portion 2420 of the sealing member 240 is uniform. Figure 7 As shown, the width da of the first side E1, the width db of the second side E2, the width dc of the third side E3 and the width dd of the fourth side E4 of the edge portion 2420 are the same. In this embodiment, the width of the first side E1 is the same as the width of the first portion EC. In other embodiments of the present disclosure, the width of the first side E1 and the width of the first portion EC may also be different. This structure is similar to the above Figure 2 The structure shown has the same functions of improving display effect, extending service life, saving sealing materials and increasing relevant production capacity, which will not be described in detail here.

[0071] Figure 8 Shows Figure 7 The sealing member 240 has filled the central portion 2410. Figure 8 As shown, as mentioned above, the orthographic projection of the sealing member 240 on the first substrate 210 is separated from the orthographic projection of the cover plate 250 on the first substrate 210 .

[0072] Fig. 9 Shows Figure 7 The sealing member 240 does not fill the central portion 2410. Fig. 9 As shown, as described above, the orthographic projection of the edge portion 2420 of the sealing member 240 on the first substrate 210 is separated from the orthographic projection of the conductive member 230 (the first pad 2310 , the second pad 2320 , and the lead 2330 ) on the first substrate 210 .

[0073] Fig.10 FIG. 1 shows a schematic diagram of the structure of a display device according to an embodiment of the present disclosure. Fig.10As shown, the display device 300 may include the display substrate 20 , 50 or 60 according to any embodiment of the present disclosure.

[0074] The display device 300 can be any product or component with a display function, such as a VR or AR display device, EVF, aiming device, FPV device, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, etc.

[0075] The display device provided by the embodiment of the present disclosure has the same or similar beneficial effects as the display substrate provided by the aforementioned embodiment of the present disclosure. Since the display substrate has been described in detail in the aforementioned embodiment, it will not be repeated here.

[0076] The foregoing description of the embodiment is provided above for the purpose of illustration and description. It is not intended to be exhaustive or to limit the present application. Each element or feature of a particular embodiment is generally not limited to a particular embodiment, but, in appropriate circumstances, these elements and features are interchangeable and can be used in selected embodiments, even if not specifically shown or described. Also can be changed in many ways. This change cannot be considered to be out of the present application, and all these modifications are included in the scope of the present application.

Claims

1. A display substrate, comprising: A first substrate including a first region and a second region; A second substrate, which is located on the first region of the first substrate, wherein the second substrate includes a display region and a bonding region; a conductive member located on at least one of the second region of the first substrate and a bonding region of the second substrate; as well as a sealing member located on the second region of the first substrate and on the bonding region of the second substrate and configured to seal the conductive member, the sealing member comprising a central portion and an edge portion at least partially surrounding the central portion, wherein the thermal expansion coefficient of the central portion is closer to the thermal expansion coefficient of the conductive component than the thermal expansion coefficient of the edge portion, The orthographic projection of the edge portion of the sealing component on the first substrate is separated from the orthographic projection of the conductive component on the first substrate.

2. The display substrate according to claim 1, wherein: At least a portion of the edge portion of the sealing member has a uniform dimension in a direction parallel to the first substrate.

3. The display substrate according to claim 1, wherein: An orthographic projection of the edge portion of the sealing member on the first substrate is located within the first substrate.

4. The display substrate according to claim 1, further comprising: A cover plate (CG) is located on the display area, wherein an orthographic projection of the cover plate on the first substrate is separated from an orthographic projection of the edge portion of the sealing member on the first substrate. 5 . The display substrate of claim 3 , wherein a top surface of the cover plate is higher than a height of the sealing member in a direction perpendicular to the first substrate. 6 . The display substrate according to claim 1 , wherein an orthographic projection of the central portion of the sealing member on the first substrate is located within an orthographic projection of the edge portion of the sealing member on the first substrate.

7. The display substrate according to claim 4, further comprising: an alignment mark for the cover plate, which is disposed on the second substrate and adjacent to the cover plate, Wherein, a minimum distance between the edge portion of the sealing component and the conductive component is greater than a minimum distance between the alignment mark and the cover plate.

8. The display substrate according to claim 7, wherein: The minimum distance between the edge portion of the sealing member and the conductive member is greater than twice the minimum distance between the alignment mark and the cover plate.

9. The display substrate according to claim 7, wherein: A minimum distance between the edge portion of the sealing member and the cover plate is greater than the minimum distance between the alignment mark and the cover plate.

10. The display substrate according to claim 9, wherein: A minimum distance between the edge portion of the sealing member and the cover plate is greater than twice the minimum distance between the alignment mark and the cover plate.

11. The display substrate according to claim 7, wherein: The conductive component includes: a first pad on the bonding area of ​​the second substrate; a second pad on the second area of ​​the first substrate; and a lead between the first pad and the second pad connecting the first pad and the second pad.

12. The display substrate according to claim 11, wherein: The edge portion of the sealing member has a first portion located between the cover plate and the conductive member, wherein a minimum distance between the first portion and the cover plate is greater than a minimum distance between the first portion and the conductive member.

13. The display substrate according to claim 12, wherein: The direction parallel to the first substrate includes a first direction and a second direction perpendicular to the first direction, wherein the second pad, the first pad, and the display area are arranged in sequence along the second direction, and the width of the edge portion of the sealing part is greater than the maximum dimension of the first pad along the second direction.

14. The display substrate according to claim 13, wherein: The edge portion of the sealing component further includes a second portion that is not located between the cover plate and the conductive component, and a width of the second portion is greater than a width of the first portion and less than twice a maximum dimension of the second gasket along the second direction.

15. The display substrate according to claim 11, wherein: A maximum dimension of the first pad along the second direction is smaller than a maximum dimension of the second pad along the second direction.

16. The display substrate according to claim 15, wherein: The edge portion of the sealing part has a width that is a quadrilateral, and the quadrilateral includes a first side and a second side that are oppositely arranged along the first direction, and a third side and a fourth side that are oppositely arranged along the second direction, wherein the first side is adjacent to the first pad, and the second side is adjacent to the second pad, wherein the minimum distance between the second pad and the second side along the second direction is greater than the minimum distance between the second pad and the third side or the fourth side along the first direction.

17. The display substrate according to claim 16, wherein: A minimum distance between the second pad and the third side along the first direction is equal to a minimum distance between the second pad and the fourth side along the first direction.

18. The display substrate according to claim 16, wherein the quadrilateral has rounded corners, A radius of curvature of a rounded corner defined by the first side and the third side or the fourth side is greater than a radius of curvature of a rounded corner defined by the second side and the third side or the fourth side.

19. The display substrate according to claim 18, wherein: A minimum distance between the first pad and the third side or the fourth side along the first direction is smaller than a minimum distance between the second pad and the second side along the second direction.

20. A display device comprising the display panel according to any one of claims 1 to 19.

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