Endoscope

Abstract

The present invention addresses the problem of providing an endoscope capable of effectively utilizing the internal space of an insertion part. The insertion section (2) has: a support member (71) that supports the imaging optical system (70); an imaging element (72) supported by the support member (71); a first circuit board (73) facing an end surface (72B) of the imaging element (72); a second circuit board (74) disposed orthogonal to the first circuit board (73); a cable (75) connected to the second circuit board (74); a cover member (76); and a terminal member (78) having a hole portion (781) through which the support member (71) and the imaging optical system (70) are inserted, the support member (71) including a cylindrical portion (711) and a square tube portion (712), the cylindrical portion (711) being supported by the hole portion (781), a gap (CL) being provided between the terminal member (78) and the cover member (76), and the diameter of a circumscribed circle (712E) of the square tube portion (712) being equal to or greater than the outer diameter (Da) of the cylindrical portion (711).

Description

Technical Field

[0001] The present invention relates to an endoscope. Background Art

[0002] Patent document 1 describes a camera module comprising: a chip size package having a plurality of connection pads arranged on the back side of a light receiving portion of an image sensor; a circuit substrate having a plurality of connection electrodes electrically and mechanically connected via the connection pads and bumps of the chip size package; and a bottom filler filled in a gap between the chip size package and the circuit substrate.

[0003] Patent document 2 describes a circuit substrate unit, in which a first signal cable is connected to a pad group on the front row side of the surface of the circuit substrate so that a camera element can be mounted on the surface, and the first signal cable connected to the pad group on the front row side and extending toward the rear in the axial direction, and the second signal cable arranged in a vertical row with the first signal cable in the axial direction and connected to the pad group on the rear row side are arranged to overlap in a direction perpendicular to the surface of the circuit substrate.

[0004] Patent document 3 describes an imaging device comprising: a solid-state imaging element; an objective lens unit for imaging a subject on the solid-state imaging element; and a bracket for holding the solid-state imaging element and the objective lens unit. The imaging device makes an area other than a light receiving area that is approximately parallel to a light receiving area of ​​the solid-state imaging element abut against the bracket, and makes the light receiving area and the optical axis center of the objective lens unit approximately perpendicular.

[0005] Patent Document 1: Japanese Patent No. 6038424

[0006] Patent Document 2: Japanese Patent No. 6697244

[0007] Patent Document 3: Japanese Patent Application Publication No. 2005-95432 Summary of the invention

[0008] The technology of the present invention provides an endoscope capable of effectively utilizing the internal space of an insertion portion.

[0009] An endoscope according to one embodiment of the present invention comprises an insertion portion inserted into a subject, the insertion portion having: an imaging optical system; a cylindrical support member that internally supports the imaging optical system; an imaging element that is disposed on the base end side of the insertion portion relative to the imaging optical system and is supported by the support member; a first circuit substrate that includes a first substrate surface that is opposite to the base end side of the insertion portion in the imaging element and a second substrate surface that is on the side opposite to the first substrate surface, and is connected to the imaging element on the first substrate surface; a second circuit substrate that is disposed on the base end side of the insertion portion relative to the first circuit substrate, includes a third substrate surface that intersects with the first substrate surface and a fourth substrate surface that is on the side opposite to the third substrate surface, and a second substrate surface between the third substrate surface and the fourth substrate surface At least one of them is connected to the above-mentioned second substrate surface; a cable is connected to at least one of the above-mentioned third substrate surface and the above-mentioned fourth substrate surface of the above-mentioned second circuit substrate; a covering component, covering a portion of the above-mentioned supporting component, the above-mentioned imaging element, the above-mentioned first circuit substrate, the above-mentioned second circuit substrate and the above-mentioned cable; and an end component, having a hole portion for the above-mentioned supporting component and the above-mentioned imaging optical system to be inserted, the above-mentioned supporting component includes a cylindrical portion supporting the above-mentioned imaging optical system and a square cylindrical portion supporting the above-mentioned imaging element, the above-mentioned cylindrical portion is supported by the above-mentioned hole portion of the above-mentioned end component, a gap is provided between the above-mentioned end component and the above-mentioned covering component or the above-mentioned square cylindrical portion of the above-mentioned supporting component, the above-mentioned covering component covers at least a portion of the above-mentioned square cylindrical portion, and the diameter of the circumscribed circle of the above-mentioned square cylindrical portion is greater than the outer diameter of the above-mentioned cylindrical portion.

[0010] An endoscope according to one embodiment of the present invention comprises an insertion portion inserted into a subject, wherein the insertion portion has: an imaging optical system; a cylindrical support member that internally supports the imaging optical system; an imaging element that is disposed on the proximal side of the insertion portion relative to the imaging optical system and is supported by the support member; a first circuit substrate that includes a first substrate surface that is opposite to the proximal side of the insertion portion in the imaging element and a second substrate surface that is on the opposite side of the first substrate surface and is connected to the imaging element on the first substrate surface; a cable that is disposed on the proximal side of the insertion portion relative to the first circuit substrate and is electrically connected to the first circuit substrate; and a covering member that covers a portion of the supporting member. The imaging element, the first circuit substrate and the cable are respectively provided on a surface of the first substrate and a terminal part, wherein the terminal part comprises a hole for inserting the supporting part and the imaging optical system, the supporting part comprises a cylindrical part for supporting the imaging optical system and a square cylindrical part for supporting the imaging element, the cylindrical part is supported by the hole of the terminal part, a gap is provided between the terminal part and the covering part or the square cylindrical part of the supporting part, a plurality of terminals electrically connected to the imaging element are provided on a surface of the first substrate, and when observed along the axial direction of the insertion part, the total area of ​​the plurality of terminals is less than 30% of the area of ​​the end face on the terminal side of the insertion part in the imaging element.

[0011] Effects of the Invention

[0012] According to the technique of the present invention, the internal space of the insertion portion of the endoscope can be effectively utilized. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 1 is a schematic diagram showing an endoscope 1 as one embodiment of the technology of the present invention.

[0014] Figure 2 Yes means Figure 1 FIG. 1 is a schematic cross-sectional view of the internal structure of the distal end portion 7 of the endoscope 1 shown.

[0015] Figure 3 is along Figure 2 Schematic diagram of the cross section taken along line AA.

[0016] Figure 4 is along Figure 2 Schematic diagram of the cross section taken along line BB.

[0017] Figure 5 This is a schematic diagram of the image pickup element 72 viewed from the distal end side along the axial direction.

[0018] Figure 6 This is a schematic diagram of the imaging element 72 and the first circuit board 73 as viewed from the distal end side along the axial direction.

[0019] Figure 7 Yes means Figure 2 Schematic diagram of a modified example of the BB cross section.

[0020] Figure 8 is along Figure 2 Schematic diagram of the cross section taken along line CC.

[0021] Fig. 9 is a schematic diagram showing a modified example of the covering member 76, which is similar to Figure 4 The corresponding figure.

[0022] Fig.10 1 is a schematic cross-sectional view showing a first modified example of the terminal end portion 7 .

[0023] Fig.11 1 is a schematic cross-sectional view showing a second modified example of the terminal portion 7 .

[0024] Fig.12 It is a schematic cross-sectional view showing a third modified example of the terminal portion 7 .

[0025] Fig.13 It is a schematic cross-sectional view showing a fourth modified example of the terminal portion 7 .

[0026] Explanation of symbols

[0027] 1-endoscope, 2-insertion portion, 3-operation portion, 4-universal cord, 5-flexible portion, 6-bending portion, 7-terminal portion, 8, 9-angle buttons, 10-air and water supply buttons, 12-treatment instrument introduction port, 70-imaging optical system, 70B-lens frame, 71-support member, 72-imaging element, 72A, 72B, 712S-end surface, 72a-peripheral area, 73-first circuit substrate, 73T, 73t, 74t-terminals, 74-second circuit substrate , 75-cable, 76-covering part, 76A, 711A, 712A-outer circumference, 76B, 711B-inner circumference, 77-exterior part, 78-end part, 711-cylindrical portion, 712-square cylindrical portion, 712B, 712a-recessed portion, 712c-opening, 712D-bonding area, 712E-circumscribed circle, 731-first substrate surface, 732-second substrate surface, 741-third substrate surface, 742-fourth substrate surface, 781-hole portion. DETAILED DESCRIPTION

[0028] Figure 1 1 is a schematic diagram showing an endoscope 1 as one embodiment of the technology of the present invention. Figure 1The endoscope 1 in the figure includes a long insertion portion 2 inserted into a subject, an operation portion 3 connected to the base end of the insertion portion 2 and used for holding and operating the endoscope 1, and a universal cord 4 for connecting the endoscope 1 to system components such as a light source device and a processor device (not shown). The endoscope 1 is not particularly limited, and may be, for example, an upper endoscope for observing the stomach or duodenum, a lower endoscope (colon endoscope) for observing the large intestine, or a bronchoscope.

[0029] The insertion portion 2 is composed of a soft portion 5, a bending portion 6, and a terminal portion 7 which are sequentially connected from the base end to the terminal end. The soft portion 5 is flexible and can be bent in any direction along the insertion path of the insertion portion 2. The operation portion 3 is provided with angle buttons 8, 9, a treatment instrument introduction port 12, an air and water supply button 10, a suction button 11, and the like.

[0030] The bending portion 6 is bent in each direction, up and down and left and right, by operating the angle knobs 8 and 9. A treatment instrument such as forceps is inserted from the treatment instrument introduction port 12 and is led out from a forceps channel port (not shown) provided in the distal end portion 7. In addition, the distal end portion 7 is provided with an observation window (not shown) for photographing the observed part in the body and an illumination window (not shown) for illuminating the observed part.

[0031] The insertion portion 2 is moved along its axial direction and inserted into the subject, and the bending portion 6 of the insertion portion 2 is bent in the upward, downward, leftward and rightward directions by rotating the angle knobs 8 and 9 of the operation portion 3. As a result, the terminal portion 7 of the insertion portion 2 can be directed to a desired direction in the body, and an observation image can be obtained through an observation window provided at the terminal portion 7. Hereinafter, the axial direction of the insertion portion 2 is referred to as the axial direction. In addition, the side of the operation portion 3 in the axial direction is recorded as the base end side, and the side of the terminal portion 7 in the axial direction is recorded as the terminal side.

[0032] Figure 2 Yes means Figure 1 FIG. 1 is a schematic cross-sectional view of the internal structure of the distal end portion 7 of the endoscope 1 shown.

[0033] like Figure 2 As shown in FIG. 1 , the terminal portion 7 includes a terminal component 78 disposed at the most distal side and a cylindrical outer component 77 disposed at the proximal side of the terminal component 78. The terminal component 78 and the outer component 77 are cylindrical in shape, and components required for imaging, a light guide, and a treatment instrument channel are disposed therein. The terminal component 78 is provided with a cylindrical hole 781 extending from the end surface on the proximal side to the end surface on the distal side.

[0034] As components required for imaging, the terminal portion 7 includes: an imaging optical system 70; a cylindrical supporting member 71 that internally supports the imaging optical system 70; an imaging element 72 that is disposed on the base end side relative to the imaging optical system 70 and is supported by the supporting member 71; a first circuit substrate 73; a second circuit substrate 74; a cable 75; and a covering member 76 that covers a portion of the supporting member 71, the imaging element 72, the first circuit substrate 73, the second circuit substrate 74, and the cable 75.

[0035] In the example shown in the figure, the imaging optical system 70 includes: a cylindrical lens frame 70B, the diameter of which is larger on the distal end side than on the proximal end side; and a lens group (four lenses 70A in the example shown in the figure) supported inside the lens frame 70B. Figure 2 2 shows the maximum diameter Db of the imaging optical system 70 . In this specification, the maximum diameter Db is defined as the outer diameter of the imaging optical system 70 .

[0036] The support member 71 includes a cylindrical portion 711 that internally supports the small diameter portion of the base end side of the lens frame 70B, and a square tube portion 712 that supports the image sensor 72. The cylindrical portion 711 is disposed on the distal end side of the square tube portion 712.

[0037] Figure 3 is along Figure 2 A schematic cross-sectional view of the AA line. Figure 3 In the figure, the imaging optical system 70 and the terminal member 78 are omitted.

[0038] like Figure 3 As shown, the cylindrical portion 711 has an outer peripheral surface 711A, the cross section of which is perpendicular to the axial direction and is circular, and an inner peripheral surface 711B, the cross section of which is perpendicular to the axial direction and is circular. The small diameter portion of the base end side of the lens frame 70B constituting the imaging optical system 70 is supported on the inner peripheral surface 711B. Figure 2 ] The outer diameter Df of the portion of the imaging optical system 70 (the small diameter portion of the lens frame 70B) supported by the inner peripheral surface 711B is shown in FIG.

[0039] like Figure 2 As shown, the portion of the imaging optical system 70 that is outside the support member 71 and the cylindrical portion 711 of the support member 71 are inserted into the hole 781 of the terminal member 78, and the cylindrical portion 711 is supported on the inner peripheral surface of the hole 781. The outer diameter Da of the cylindrical portion 711 ( Figure 3 The diameter of the outer peripheral surface 711A in Figure 2 ) is larger than the maximum diameter Db of the imaging optical system 70. Thus, the imaging optical system 70 is configured not to be directly supported by the hole portion 781 of the terminal member 78.

[0040] The supporting methods of the cylindrical portion 711 and the hole portion 781 and the supporting methods of the imaging optical system 70 and the cylindrical portion 711 are not particularly limited, and for example, any one of fitting, bonding, and screwing, or a combination of two or more of these supporting methods may be used.

[0041] Figure 4 is along Figure 2 A schematic cross-sectional view of the BB line. Figure 4 In the figure, the imaging optical system 70 and the end member 78 are omitted. Figure 3 and Figure 4 As shown, the cross section of the outer peripheral surface 712A of the square tube portion 712 perpendicular to the axial direction is a polygon larger than a quadrilateral (in Figure 3 and Figure 4 In the example, the four corners of the square are chamfered into an octagon.) In addition, the outer peripheral surface 712A may be a polygon having more than four sides and the corners of which are chamfered into a curved shape (R shape) instead of a straight line.

[0042] like Figure 4 As shown, a rectangular plate-shaped recessed portion 712B is provided on the end surface on the base end side of the square tube portion 712. An opening 712C communicating with the internal space SP of the cylindrical portion 711 is formed on the bottom surface of the recessed portion 712B.

[0043] Figure 5 The image pickup element 72 is a schematic diagram of the image pickup element 72 viewed from the end side along the axial direction. The image pickup element 72 is a component formed by packaging a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. Figure 5 As shown in FIG. 1 , the image pickup element 72 is rectangular in shape when viewed along the axial direction. Figure 4 In the recessed portion 712B shown, the imaging element 72 is supported by the square tube portion 712 .

[0044] like Figure 4 As shown, a bonding area 712D (the area between the rectangular frame of the single-point dashed line in the figure and the outer peripheral edge of the recess 712B) for bonding the imaging element 72 is provided on the bottom surface of the recess 712B. The imaging element 72 is supported by the square tube 712 by being bonded to the recess 712B in the bonding area 712D. The imaging element 72 can also be supported by the square tube 712 by being embedded in the recess 712B. The imaging element 72 can be embedded in the recess 712B and further supported by the square tube 712 by being bonded to the bonding area 712D. The imaging element 72 can also be supported by the square tube 712 by bonding its side to the side wall of the recess 712B.

[0045] The peripheral area 72a (see FIG. 7A ) of the end surface 72A on the distal end side of the imaging element 72 is in a rectangular frame shape. Figure 5 )and Figure 4 From the viewpoint of reducing the diameter of the insertion portion 2 and increasing the light receiving area of ​​the imaging element 72, the area of ​​the peripheral region 72a is preferably 50% or less of the area of ​​the end face 72A.

[0046] like Figure 2 As shown, the first circuit substrate 73 includes a first substrate surface 731 that is opposite to the end surface 72B on the base end side of the imaging element 72 and a second substrate surface 732 on the side opposite to the first substrate surface 731 (base end side), and is connected to the imaging element 72 on the first substrate surface 731. The first circuit substrate 73 is a rigid substrate having a bending rigidity greater than that of the imaging element 72, for example, in the form of a plate having a plurality of wirings stacked from the first substrate surface 731 toward the second substrate surface 732 via an insulating layer. For example, a ceramic substrate, a glass substrate, or a silicon substrate is used for the first circuit substrate 73. The first circuit substrate 73 is in a state where the first substrate surface 731 and the second substrate surface 732 intersect in the axial direction (in a direction parallel to the first substrate surface 731). Figure 2 In the example, it is configured in a state perpendicular to the axial direction).

[0047] A plurality of terminals are two-dimensionally arranged on the end surface 72B of the imaging element 72. Furthermore, terminals 73T corresponding to the plurality of terminals of the imaging element 72 are two-dimensionally arranged on the first substrate surface 731 of the first circuit substrate 73 (see FIG. 1 ). Figure 6 ). In addition, each terminal of the end surface 72B of the imaging element 72 is electrically and mechanically connected to the terminal 73T corresponding to the terminal on the first substrate surface 731 of the first circuit substrate 73 through the solder ball H. In order to make these connections firm, it is preferable to provide an underfill between the imaging element 72 and the first circuit substrate 73.

[0048] Figure 6 This is a schematic diagram of the imaging element 72 and the first circuit substrate 73 observed from the end side along the axial direction. A plurality of (35 in the example of the figure) terminals 73T are arranged in two dimensions on the first substrate surface 731 of the first circuit substrate 73. As an example, the total area of ​​the plurality of terminals 73T when observed along the axial direction is less than 30% of the area of ​​the end surface 72A on the end side of the imaging element 72. Thus, it is possible to prevent the circuit formed on the first circuit substrate 73 from becoming complicated. In the case where the total area of ​​the plurality of terminals 73T exceeds 30% of the area of ​​the end surface 72A of the imaging element 72, the mechanical connection between the imaging element 72 and the first circuit substrate 73 can be made more secure.

[0049] exist Figure 6, the length 72X of the long side of the imaging element 72, the length 73X of two of the four sides of the first circuit substrate 73 along the long side, the length 72Y of the short side of the imaging element 72, and the length 73Y of two of the four sides of the first circuit substrate 73 along the short side.

[0050] When viewed along the axial direction, the size of the first circuit substrate 73 is larger than the size of the imaging element 72. The size of the first circuit substrate 73 being larger than the size of the imaging element 72 means that the length 73X is larger than the length 72X and the length 73Y is larger than the length 72Y, the length 73X is the same as the length 72X and the length 73Y is larger than the length 72Y, or the length 73X is larger than the length 72X and the length 73Y is the same as the length 72Y.

[0051] exist Figure 6 In the example, the length 73X is greater than the length 72X and the length 73Y is greater than the length 72Y, and the entire imaging element 72 overlaps with the first circuit board 73 when viewed along the axial direction.

[0052] Furthermore, when viewed along the axial direction, the size of the first circuit substrate 73 is larger than Figure 2 The dimensions of the first circuit board 73 referred to here are the length 73X and the length 73Y.

[0053] exist Figure 3 FIG. 7 shows the circumscribed circle 712E of the outer peripheral surface 712A of the square tube portion 712. Figure 3 As shown, the diameter of the circumscribed circle 712E is larger than the outer diameter Da of the cylindrical portion 711 ( Figure 3 The diameter of the outer peripheral surface 711A in Figure 2 ). However, if Figure 7 As shown, the diameter of the circumscribed circle 712E may be the same as the outer diameter of the cylindrical portion 711 . Figure 7 Yes means Figure 2 Schematic diagram of a modified example of the BB cross section.

[0054] The second circuit substrate 74 is provided on the proximal side relative to the first circuit substrate 73 and includes a second circuit substrate 74 intersecting with the first substrate surface 731 (at Figure 2 In the example, the third substrate surface 741 (orthogonal) and the fourth substrate surface 742 (on the side opposite to the third substrate surface 741) are perpendicular to each other. Figure 2 In the example, a substrate surface that is orthogonal to the first substrate surface 731).

[0055] The second circuit substrate 74 is connected to the second substrate surface 732 of the first circuit substrate 73 on the third substrate surface 741 and the fourth substrate surface 742. The second circuit substrate 74 is a rigid substrate having a greater bending rigidity than the imaging element 72, and is, for example, in the form of a plate on which a plurality of wirings are stacked via an insulating layer from the third substrate surface 741 toward the fourth substrate surface 742. For example, a ceramic substrate, a glass substrate, or a silicon substrate is used for the second circuit substrate 74.

[0056] A plurality of terminals 73t are provided on the second substrate surface 732 of the first circuit substrate 73. Terminals 74t are provided on the third substrate surface 741 and the fourth substrate surface 742 of the second circuit substrate 74. The terminals 73t and 74t are electrically and mechanically connected by solder Hb.

[0057] A terminal (not shown) electrically connected to the terminal 74t is provided on the third substrate surface 741 of the second circuit substrate 74, and a wiring is connected to the terminal. A terminal (not shown) electrically connected to the terminal 74t is provided on the fourth substrate surface 742 of the second circuit substrate 74, and a wiring is connected to the terminal. The wiring connected to the respective terminals of the third substrate surface 741 and the fourth substrate surface 742 is bundled to form a cable 75, and extends to the universal cord 4.

[0058] In addition, the second circuit substrate 74 may be connected to the second substrate surface 732 of the first circuit substrate 73 only on one of the third substrate surface 741 and the fourth substrate surface 742. Furthermore, the second circuit substrate 74 may be connected to the cable 75 only on one of the third substrate surface 741 and the fourth substrate surface 742.

[0059] At least one of the length 73X and the length 73Y of the first circuit board 73 may be equal to the axial length 74L of the second circuit board 74 (the length along the third board surface 741 and the fourth board surface 742). Figure 2 ) are the same, but preferably different. For example, when the length 74L is greater than at least one of the length 73X and the length 73Y, the connection between the cable 75 and the second circuit substrate 74 becomes easy. In addition, when the length 74L is less than at least one of the length 73X and the length 73Y, the posture of the second circuit substrate 74 relative to the first circuit substrate 73 can be easily stabilized.

[0060] The thickness 73D of the first circuit board 73 (see Figure 2 ) and the thickness 74D of the second circuit substrate 74 (reference Figure 2) may be the same, but are preferably different. For example, by making the thickness 74D of the second circuit substrate 74 smaller than the thickness 73D of the first circuit substrate 73, the space around the second circuit substrate 74 can be effectively utilized. Furthermore, when the thickness 74D of the second circuit substrate 74 is larger than the thickness 73D of the first circuit substrate 73, the rigidity of the connection body between the first circuit substrate 73 and the second circuit substrate 74 can be increased, thereby improving durability.

[0061] Figure 8 is along Figure 2 Schematic diagram of the cross section cut along the CC line. Figure 8 As shown, the second circuit substrate 74 is arranged at the approximate center of the first circuit substrate 73 along the short side of the imaging element 72. The arrangement is not limited to this, and for example, the second circuit substrate 74 may be arranged at one end of the first circuit substrate 73 along the short side of the imaging element 72.

[0062] like Figure 4 and Figure 8 As shown in FIG. 1 , for example, the cover member 76 is in the shape of a square tube whose cross section perpendicular to the axial direction is a square frame. The cover member 76 is made of metal, for example. Figure 2 As shown, the cover member 76 surrounds the square tube portion 712 of the support member 71, the imaging element 72, the first circuit board 73, the second circuit board 74, and the cable 75, and covers them.

[0063] like Figure 4 As shown, the inner circumferential surface 76B of the covering member 76 is in direct or indirect contact with the outer circumferential surface 712A of the square tube portion 712. For example, by fitting the square tube portion 712 inside the covering member 76, it is possible to set the structure in which the outer circumferential surface 712A is in direct contact with the inner circumferential surface 76B. Alternatively, it is also possible to set the structure as follows: the outer circumferential surface 712A of the square tube portion 712 is bonded to the inner circumferential surface 76B by an adhesive, so that the outer circumferential surface 712A is in indirect contact with the inner circumferential surface 76B. In this way, by directly or indirectly contacting the outer circumferential surface 712A of the square tube portion 712 with the inner circumferential surface 76B of the covering member 76, the square tube portion 712 can be reinforced.

[0064] like Figure 8As shown, the inner peripheral surface 76B of the cover member 76 is in direct or indirect contact with the four side surfaces of the first circuit substrate 73. For example, by fitting the first circuit substrate 73 inside the cover member 76, a structure in which the side surface of the first circuit substrate 73 is in direct contact with the inner peripheral surface 76B can be set. In addition, by bonding the side surface of the first circuit substrate 73 to the inner peripheral surface 76B by an adhesive, a structure in which the side surface of the first circuit substrate 73 is in indirect contact with the inner peripheral surface 76B can be set. In this way, by directly or indirectly contacting the side surface of the first circuit substrate 73 with the inner peripheral surface 76B of the cover member 76, the first circuit substrate 73 can be reinforced.

[0065] In addition, Figure 6 When the length 73X shown is the same as the length 72X, the inner peripheral surface 76B of the cover member 76 is in direct or indirect contact with the two side surfaces of the first circuit substrate 73 (the side surfaces along the long sides of the imaging element 72). Figure 6 When the length 73Y is equal to the length 72Y, the inner peripheral surface 76B of the cover member 76 is in direct or indirect contact with the two side surfaces (side surfaces along the short sides of the imaging element 72) of the first circuit board 73. Even in this case, the first circuit board 73 can be reinforced.

[0066] exist Figure 4 The outer diameter Dc of the covering member 76 is shown in FIG. The outer diameter Dc is larger than the maximum diameter Db of the imaging optical system 70 (see FIG. Figure 2 ). In addition, the circumscribed circle 712E of the square tube portion 712 (refer to Figure 3 ) is larger than the outer diameter Da of the cylindrical portion 711. As a result, Figure 2 As shown, a gap CL is provided between the cover member 76 and the square tube portion 712 and the terminal member 78 .

[0067] Fig. 9 is a schematic diagram showing a modified example of the covering member 76, which is similar to Figure 4 The corresponding figure. Fig. 9 As shown, the cross-sectional shape of the outer peripheral surface 76A of the covering member 76 may not be a rectangle but a circle.

[0068] For example, the distal end portion 7 of the endoscope 1 configured as above is manufactured as follows. First, an assembly in which the support member 71, the imaging element 72, the first circuit substrate 73, the second circuit substrate 74, the cable 75, and the cover member 76 are assembled is manufactured. Next, the imaging optical system 70 is inserted into the cylindrical portion 711 of the support member 71 of the assembly, and the optical position of the imaging element 72 and the imaging optical system 70 is adjusted using the imaging image of the imaging element 72, and the imaging optical system 70 is fixed to the cylindrical portion 711. Next, the assembly in which the imaging optical system 70 is fixed is inserted into the hole portion 781 of the distal end member 78, and the cylindrical portion 711 and the distal end member 78 are fixed in a state in which the distal end surface of the imaging optical system 70 is aligned with the distal end surface of the distal end member 78.

[0069] The optical positions of the imaging element 72 and the imaging optical system 70 may deviate due to assembly errors of components or individual differences between the imaging element 72 and the imaging optical system 70. Figure 2 In the embodiment, if the imaging optical system 70 is located closer to the imaging element 72, the cylindrical portion 711 and the terminal member 78 need to be fixed in a state where the end surface of the terminal side of the cover member 76 and the square cylindrical portion 712 is closer to the terminal member 78. Since the gap CL is provided at the terminal portion 7, even if there is a deviation in the optical position of the imaging element 72 and the imaging optical system 70, the terminal surface of the imaging optical system 70 can be made consistent with the terminal surface of the terminal member 78.

[0070] Furthermore, in the endoscope 1, the outer peripheral surface 712A of the square tube portion 712 is in contact with the inner peripheral surface 76B of the cover member 76. Therefore, the unit including the support member 71, the imaging element 72, the first circuit substrate 73, the second circuit substrate 74 and the cable 75 can be protected, and the durability can be improved. The interior of the support member 71 is filled with an adhesive such as an insulating epoxy resin to ensure the watertightness of the imaging element 72 and the like.

[0071] Furthermore, in the endoscope 1, the side surface of the first circuit substrate 73 is in contact with the inner peripheral surface 76B of the covering member 76. Furthermore, the imaging element 72 is not in contact with the covering member 76. Therefore, the imaging element 72 between the supporting member 71 and the first circuit substrate 73 can be more securely protected. In particular, when the total area of ​​the plurality of terminals 73T is 30% or less of the area of ​​the end surface 72A of the imaging element 72, the mechanical connection strength between the imaging element 72 and the first circuit substrate 73 is reduced, and thus the protective effect based on the contact between the square tube portion 712 and the first circuit substrate 73 and the covering member 76 can be improved. Furthermore, when the area of ​​the peripheral region 72a of the imaging element 72 is 50% or less of the area of ​​the end surface 72A, the mechanical connection strength between the imaging element 72 and the square tube portion 712 is reduced, and thus the protective effect based on the contact between the square tube portion 712 and the covering member 76 can be improved.

[0072] Furthermore, in the endoscope 1, the covering member 76 covers the entire second circuit board 74. Therefore, even when the strength of the second circuit board 74 is reduced, such as when the length 74L of the second circuit board 74 is large or the thickness 74D of the second circuit board 74 is small, the second circuit board 74 can be reinforced by the covering member 76.

[0073] Fig.10 2 is a schematic cross-sectional view showing a first modified example of the terminal end portion 7. Fig.10 In, with Figure 2 The difference is that the outer diameter Da of the cylindrical portion 711 is the same as the diameter of the circumscribed circle 712E of the square cylindrical portion 712 , and the imaging element 72 is supported by an end surface 712S on the base end side of the square cylindrical portion 712 .

[0074] exist Fig.10 In the modified example shown, the thickness of the square tube portion 712 is thin, so the imaging element 72 is supported by the end surface 712S on the base end side of the square tube portion 712. For example, the imaging element 72 is bonded to the end surface 712S on the base end side of the square tube portion 712 by an adhesive. Fig.10 In the illustrated modification, a gap CL is provided between the cover member 76 and the end member 78. Fig.10 In the variation shown, Figure 2 Compared with the structure of FIG. 7 , the outer diameter of the covering member 76 can be reduced, so the insertion portion 2 can be made thinner.

[0075] exist Fig.10 In the modified example shown, it is preferable that the side surface of the imaging element 72 does not contact the cover member 76. This can prevent the force from the cover member 76 from directly acting on the imaging element 72.

[0076] Fig.11 FIG. 2 is a schematic cross-sectional view showing a second modified example of the terminal end portion 7. Fig.11 In, with Figure 2 The difference is that a recess 712a is added to the end of the base end side and the outer peripheral side of the square tube 712, and the tip end of the covering member 76 is in direct or indirect contact with the recess 712a. Fig.11 In the modified example shown, the covering member 76 covers a portion of the square tube portion 712, there is no gap between the covering member 76 and the end member 78, and a gap CI is provided between the square tube portion 712 and the end member 78. Fig.11 The variation shown is Figure 2 Compared with the structure shown, the outer diameter of the covering member 76 can be reduced, so the diameter of the terminal end portion 7 can be reduced.

[0077] Fig.12: is a cross-sectional schematic diagram showing a third modified example of the terminal portion 7. Fig.12 In, with Figure 2 The difference is that a recess 712a is added to the end of the base end side and the outer peripheral side of the square tube 712, the terminal end of the covering member 76 is in direct or indirect contact with the recess 712a, and the imaging element 72 is supported by the end surface 712S on the base end side of the square tube 712. Fig.12 In the modified example shown, there is no gap between the cover member 76 and the end member 78, but a gap CL is provided between the square tube portion 712 and the end member 78. Fig.12 The variation shown is Figure 2 Compared with the structure shown, the diameter of the terminal end portion 7 can be reduced.

[0078] Fig.13 : is a schematic cross-sectional view showing a fourth modified example of the terminal portion 7. Fig.13 In, with Figure 2 The difference is that the concave portion 712B formed in the square tube portion 712 is formed deeper, and the imaging element 72, the first circuit substrate 73 and the second circuit substrate 74 are moved toward the end side. Fig.13 In the modified example shown, the distance Lb between the end surface 712S on the base end side of the support member 71 and the first substrate surface 731 of the first circuit substrate 73 is smaller than the distance La between the imaging element 72 and the first substrate surface 731 (in other words, the thickness of the solder ball H). According to this structure, for example, when the end surface 712S of the square tube portion 712 and the first substrate surface 731 are bonded by an adhesive, the peeling of the adhesive can be suppressed.

[0079] In the configuration example of the terminal portion 7 described above, the second circuit board 74 is not essential and may be deleted. In this case, the terminal 73t of the first circuit board 73 is configured to be connected to the cable 75.

[0080] As described above, at least the following matters are described in this specification. In the following, components corresponding to the above-mentioned embodiment are shown in brackets, but the present invention is not limited thereto. (1)

[0082] An endoscope includes an insertion portion (insertion portion 2) inserted into a subject.

[0083] The above-mentioned inserting part has:

[0084] Imaging optical system (imaging optical system 70);

[0085] A cylindrical support member (support member 71) internally supports the imaging optical system;

[0086] An imaging element (imaging element 72) provided on the proximal end side of the insertion portion relative to the imaging optical system and supported by the supporting member;

[0087] A first circuit substrate (first circuit substrate 73) including a first substrate surface (first substrate surface 731) facing a surface (end surface 72B) on the base end side of the insertion portion of the imaging element and a second substrate surface (second substrate surface 732) on the opposite side to the first substrate surface, and connected to the imaging element on the first substrate surface;

[0088] A second circuit substrate (second circuit substrate 74) is provided on the proximal end side of the insertion portion relative to the first circuit substrate, and includes a third substrate surface (third substrate surface 741) intersecting the first substrate surface and a fourth substrate surface (fourth substrate surface 742) on the side opposite to the third substrate surface, and is connected to the second substrate surface on at least one of the third substrate surface and the fourth substrate surface;

[0089] a cable (cable 75) connected to at least one of the third substrate surface and the fourth substrate surface of the second circuit substrate;

[0090] a covering member (covering member 76) covering a portion of the supporting member, the imaging element, the first circuit substrate, the second circuit substrate, and the cable; and

[0091] The terminal member (terminal member 78) has a hole (hole 781) through which the supporting member and the imaging optical system are inserted.

[0092] The supporting member includes a cylindrical portion (cylindrical portion 711) supporting the imaging optical system and a square cylindrical portion (square cylindrical portion 712) supporting the imaging element.

[0093] The cylindrical portion is supported by the hole portion of the terminal member.

[0094] A gap (gap CL) is provided between the terminal member and the square tube portion of the cover member or the support member.

[0095] The covering member covers at least a portion of the square tube portion.

[0096] The diameter of the circumscribed circle of the square cylindrical portion (circumscribed circle 712E) is equal to or larger than the outer diameter (outer diameter Da) of the cylindrical portion. (2)

[0098] The endoscope according to (1), wherein:

[0099] The outer diameter (maximum diameter Db) of the imaging optical system is smaller than the outer diameter (outer diameter Da) of the cylindrical portion. (3)

[0101] The endoscope according to (1) or (2), wherein:

[0102] The imaging element is supported by an end surface (end surface 712S) on the proximal end side of the insertion portion in the supporting member.

[0103] The side surface of the first circuit substrate is in direct or indirect contact with the cover member. (4)

[0105] The endoscope according to (1) or (2), wherein:

[0106] When viewed in the axial direction of the insertion portion, the dimensions of the first circuit board (length 73X and length 73Y) are larger than the dimension (outer diameter Df) of a portion of the imaging optical system supported by the supporting member. (5)

[0108] The endoscope according to (4), wherein:

[0109] The side surface of the first circuit substrate is in direct or indirect contact with the cover member. (6)

[0111] The endoscope according to (1) or (2), wherein:

[0112] When viewed along the axial direction of the insertion portion, the first circuit board has a size larger than that of the imaging element. (7)

[0114] The endoscope according to (6), wherein:

[0115] The side surface of the first circuit substrate is in direct or indirect contact with the cover member. (8)

[0117] The endoscope according to (1) or (2), wherein:

[0118] A distance (distance Lb) between an end surface (end surface 712S) on the proximal side of the insertion portion in the support member and the first substrate surface of the first circuit substrate is smaller than a distance (distance La) between the imaging element and the first substrate surface. (9)

[0120] The endoscope according to (1) or (2), wherein:

[0121] When viewed in the axial direction of the insertion portion, the outer diameter (outer diameter Dc) of the covering member is larger than the outer diameter (maximum diameter Db) of the imaging optical system. (10)

[0123] The endoscope according to (1) or (2), wherein:

[0124] The thickness (thickness 73D) of the first circuit board is different from the thickness (thickness 74D) of the second circuit board. (11)

[0126] The endoscope according to (10), wherein:

[0127] The thickness of the second circuit substrate is smaller than the thickness of the first circuit substrate. (12)

[0129] The endoscope according to (1) or (2), wherein:

[0130] The first length (at least one of the length 73X and the length 74X) of the first circuit substrate along the first substrate surface and the second substrate surface is different from the second length (length 74L) of the second circuit substrate along the third substrate surface and the fourth substrate surface. (13)

[0132] The endoscope according to (12), wherein:

[0133] The second length is greater than the first length. (14)

[0135] The endoscope according to (1) or (2), wherein:

[0136] A plurality of terminals (terminals 73T) electrically connected to the imaging element are provided on the first substrate surface.

[0137] When viewed in the axial direction of the insertion portion, the total area of ​​the plurality of terminals is 30% or less of the area of ​​an end surface (end surface 72A) on the distal end side of the insertion portion in the imaging element. (15)

[0139] The endoscope according to (1) or (2), wherein:

[0140] The imaging element is supported by the supporting member by bonding.

[0141] The area of ​​the region (peripheral region 72a) of the imaging element that is bonded to the supporting member is 50% or less of the area of ​​the end surface (end surface 72A) of the imaging element on the distal end side of the insertion portion. (16)

[0143] An endoscope includes an insertion portion (insertion portion 2) inserted into a subject.

[0144] The above-mentioned inserting part has:

[0145] Imaging optical system (imaging optical system 70);

[0146] A cylindrical support member (support member 71) internally supports the imaging optical system;

[0147] An imaging element (imaging element 72) provided on the proximal end side of the insertion portion relative to the imaging optical system and supported by the supporting member;

[0148] A first circuit substrate (first circuit substrate 73) including a first substrate surface (first substrate surface 731) facing a surface (end surface 72B) on the base end side of the insertion portion of the imaging element and a second substrate surface (second substrate surface 732) on the opposite side to the first substrate surface, and connected to the imaging element on the first substrate surface;

[0149] a cable (cable 75) provided on the proximal end side of the insertion portion relative to the first circuit substrate and electrically connected to the first circuit substrate;

[0150] a covering member (covering member 76) covering a portion of the supporting member, the imaging element, the first circuit substrate, and the cable; and

[0151] The terminal member (terminal member 78) has a hole (hole 781) through which the supporting member and the imaging optical system are inserted.

[0152] The supporting member includes a cylindrical portion (cylindrical portion 711) supporting the imaging optical system and a square cylindrical portion (square cylindrical portion 712) supporting the imaging element.

[0153] The cylindrical portion is supported by the hole portion of the terminal member.

[0154] A gap (gap CL) is provided between the terminal member and the square tube portion of the cover member or the support member.

[0155] A plurality of terminals (terminals 73T) electrically connected to the imaging element are provided on the first substrate surface.

[0156] When viewed in the axial direction of the insertion portion, the total area of ​​the plurality of terminals is 30% or less of the area of ​​an end surface (end surface 72A) on the distal end side of the insertion portion in the imaging element. (17)

[0158] The endoscope according to (16), wherein:

[0159] The imaging element is supported by the supporting member by bonding.

[0160] The area of ​​the region (peripheral region 72a) of the imaging element that is bonded to the supporting member is 50% or less of the area of ​​the end surface (end surface 72A) of the imaging element on the distal end side of the insertion portion. (18)

[0162] The endoscope according to (16) or (17), comprising:

[0163] The second circuit substrate (second circuit substrate 74) is provided on the proximal end side of the insertion portion relative to the first circuit substrate, and includes a third substrate surface (third substrate surface 741) intersecting the first substrate surface and a fourth substrate surface (fourth substrate surface 742) on the opposite side to the third substrate surface, and is connected to the second substrate surface on at least one of the third substrate surface and the fourth substrate surface.

[0164] The cable is connected to at least one of the third substrate surface and the fourth substrate surface of the second circuit substrate.

[0165] The covering member covers a portion of the supporting member, the imaging element, the first circuit board, the second circuit board, and the cable. (19)

[0167] The endoscope according to (18), wherein:

[0168] The covering member covers at least a portion of the square tube portion. (20)

[0170] The endoscope according to (19), wherein:

[0171] The diameter of the circumscribed circle of the square cylindrical portion (circumscribed circle 712E) is equal to or larger than the outer diameter (outer diameter Da) of the cylindrical portion. (twenty one)

[0173] The endoscope according to (20), wherein:

[0174] The outer diameter (maximum diameter Db) of the imaging optical system is smaller than the outer diameter (outer diameter Da) of the cylindrical portion. (twenty two)

[0176] The endoscope according to (18), wherein:

[0177] The imaging element is supported by an end surface (end surface 712S) on the proximal end side of the insertion portion in the supporting member.

[0178] The side surface of the first circuit substrate is in direct or indirect contact with the cover member. (twenty three)

[0180] The endoscope according to (18), wherein:

[0181] When viewed in the axial direction of the insertion portion, the dimensions of the first circuit board (length 73X and length 73Y) are larger than the dimension (outer diameter Df) of a portion of the imaging optical system supported by the supporting member. (twenty four)

[0183] The endoscope according to (23), wherein:

[0184] The side surface of the first circuit substrate is in direct or indirect contact with the cover member. (25)

[0186] The endoscope according to (18), wherein:

[0187] When viewed along the axial direction of the insertion portion, the first circuit board has a size larger than that of the imaging element. (26)

[0189] The endoscope according to (25), wherein:

[0190] The side surface of the first circuit substrate is in direct or indirect contact with the cover member.

Claims

1. An endoscope, characterized in that: The device comprises an insertion portion to be inserted into a subject, The insert portion has: Camera optical system; A cylindrical support member that supports the imaging optical system internally; an imaging element provided on the proximal end side of the insertion portion relative to the imaging optical system and supported by the supporting member; a first circuit substrate including a first substrate surface facing the base end side of the insertion portion of the imaging element and a second substrate surface on the opposite side of the first substrate surface, and connected to the imaging element on the first substrate surface; a second circuit substrate, which is arranged on the proximal end side of the insertion portion relative to the first circuit substrate, and includes a third substrate surface intersecting the first substrate surface and a fourth substrate surface on the side opposite to the third substrate surface, and is connected to the second substrate surface on at least one of the third substrate surface and the fourth substrate surface; a cable connected to at least one of the third substrate surface and the fourth substrate surface of the second circuit substrate; a covering member that covers a portion of the supporting member, the imaging element, the first circuit substrate, the second circuit substrate, and the cable; and The terminal member has a hole through which the supporting member and the imaging optical system are inserted. The support member includes a cylindrical portion that supports the imaging optical system and a square cylindrical portion that supports the imaging element. The cylindrical portion is supported by the hole portion of the terminal member, A gap is provided between the terminal member and the square tube portion of the covering member or the supporting member, The covering member covers at least a portion of the square tube portion. The diameter of the circumscribed circle of the square tube portion is greater than the outer diameter of the cylindrical portion.

2. The endoscope according to claim 1, wherein: The outer diameter of the imaging optical system is smaller than the outer diameter of the cylindrical portion.

3. The endoscope according to claim 1 or 2, wherein: The imaging element is supported by an end surface of the support member on the proximal end side of the insertion portion. The side surface of the first circuit substrate is in direct or indirect contact with the cover member.

4. The endoscope according to claim 1 or 2, wherein: When viewed in the axial direction of the insertion portion, the first circuit board has a size larger than a size of a portion of the imaging optical system supported by the supporting member.

5. The endoscope according to claim 4, wherein: The side surface of the first circuit substrate is in direct or indirect contact with the cover member.

6. The endoscope according to claim 1 or 2, wherein: When viewed along the axial direction of the insertion portion, the size of the first circuit board is larger than the size of the imaging element.

7. The endoscope according to claim 6, wherein: The side surface of the first circuit substrate is in direct or indirect contact with the cover member.

8. The endoscope according to claim 1 or 2, wherein: A distance between an end surface on a proximal end side of the insertion portion of the support member and the first substrate surface of the first circuit substrate is smaller than a distance between the imaging element and the first substrate surface.

9. The endoscope according to claim 1 or 2, wherein: When viewed along the axial direction of the insertion portion, the outer diameter of the covering member is larger than the outer diameter of the imaging optical system.

10. The endoscope according to claim 1 or 2, wherein: The thickness of the first circuit substrate is different from the thickness of the second circuit substrate.

11. The endoscope according to claim 10, wherein: The thickness of the second circuit substrate is smaller than the thickness of the first circuit substrate.

12. The endoscope according to claim 1 or 2, wherein: A first length of the first circuit substrate in a direction along the first substrate surface and the second substrate surface is different from a second length of the second circuit substrate in a direction along the third substrate surface and the fourth substrate surface.

13. The endoscope according to claim 12, wherein: The second length is greater than the first length.

14. The endoscope according to claim 1 or 2, wherein: A plurality of terminals electrically connected to the imaging element are provided on the first substrate surface. When viewed in the axial direction of the insertion portion, the total area of ​​the plurality of terminals is 30% or less of the area of ​​an end surface on the distal end side of the insertion portion in the imaging element.

15. The endoscope according to claim 1 or 2, wherein: The imaging element is supported by the supporting member by bonding, The area of ​​a region of the imaging element that is bonded to the supporting member is 50% or less of the area of ​​an end surface of the imaging element on the distal end side of the insertion portion.

16. An endoscope, characterized in that: The device comprises an insertion portion to be inserted into a subject, The insert portion has: Camera optical system; A cylindrical support member that supports the imaging optical system internally; an imaging element provided on the proximal end side of the insertion portion relative to the imaging optical system and supported by the supporting member; a first circuit substrate including a first substrate surface facing the base end side of the insertion portion of the imaging element and a second substrate surface on the opposite side of the first substrate surface, and connected to the imaging element on the first substrate surface; a cable provided on the proximal end side of the insertion portion relative to the first circuit substrate and electrically connected to the first circuit substrate; a covering member that covers a portion of the supporting member, the imaging element, the first circuit substrate, and the cable; and The terminal member has a hole through which the supporting member and the imaging optical system are inserted. The support member includes a cylindrical portion that supports the imaging optical system and a square cylindrical portion that supports the imaging element. The cylindrical portion is supported by the hole portion of the terminal member, A gap is provided between the terminal member and the square tube portion of the covering member or the supporting member, A plurality of terminals electrically connected to the imaging element are provided on the first substrate surface. When viewed in the axial direction of the insertion portion, the total area of ​​the plurality of terminals is 30% or less of the area of ​​an end surface on the distal end side of the insertion portion in the imaging element.

17. The endoscope according to claim 16, wherein: The imaging element is supported by the supporting member by bonding, The area of ​​a region of the imaging element that is bonded to the supporting member is 50% or less of the area of ​​an end surface of the imaging element on the distal end side of the insertion portion.

18. The endoscope according to claim 16 or 17, comprising: a second circuit substrate, which is arranged on the proximal end side of the insertion portion relative to the first circuit substrate, and includes a third substrate surface intersecting the first substrate surface and a fourth substrate surface on the side opposite to the third substrate surface, and is connected to the second substrate surface on at least one of the third substrate surface and the fourth substrate surface, The cable is connected to at least one of the third substrate surface and the fourth substrate surface of the second circuit substrate. The covering member covers a portion of the supporting member, the imaging element, the first circuit board, the second circuit board, and the cable.

19. The endoscope according to claim 18, wherein: The covering member covers at least a portion of the square tube portion.

20. The endoscope according to claim 19, wherein: The diameter of the circumscribed circle of the square tube portion is greater than the outer diameter of the cylindrical portion.

21. The endoscope according to claim 20, wherein: The outer diameter of the imaging optical system is smaller than the outer diameter of the cylindrical portion.

22. The endoscope according to claim 18, wherein: The imaging element is supported by an end surface of the support member on the proximal end side of the insertion portion. The side surface of the first circuit substrate is in direct or indirect contact with the cover member.

23. The endoscope according to claim 18, wherein: When viewed in the axial direction of the insertion portion, the first circuit board has a size larger than a size of a portion of the imaging optical system supported by the supporting member.

24. The endoscope according to claim 23, wherein: The side surface of the first circuit substrate is in direct or indirect contact with the cover member.

25. The endoscope according to claim 18, wherein: When viewed along the axial direction of the insertion portion, the size of the first circuit board is larger than the size of the imaging element.

26. The endoscope according to claim 25, wherein: The side surface of the first circuit substrate is in direct or indirect contact with the cover member.

Images