Three-dimensional printing method, device and equipment and storage medium

Abstract

The embodiment of the invention relates to a three-dimensional printing method and device, equipment and a storage medium, and the method comprises the steps that a target exposure image and an adjacent exposure image are obtained, and the adjacent exposure image is the next frame of exposure image corresponding to the target exposure image; determining a top image area based on the target exposure image and the adjacent exposure image, the top image area being an image area different from the adjacent exposure image in the target exposure image; determining a real model height and an estimated forming height corresponding to the top image area; and if the real model height is not equal to the pre-estimated forming height, adjusting the forming thickness corresponding to the top-layer image area in the three-dimensional printing process, so that the actual forming height corresponding to the top-layer image area is equal to the real model height. According to the embodiment of the invention, the vertical printing precision can be improved.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the technical field of three-dimensional printing, and in particular to a three-dimensional printing method, apparatus, device and storage medium. Background Art

[0002] Three-dimensional printing is a rapid prototyping technology. The principle of three-dimensional printing based on photocuring is to horizontally cut the three-dimensional model layer by layer from bottom to top with a fixed layer thickness as the interval to obtain multiple layer contour data, and then fill each layer contour data to generate an exposure image. The multiple exposure images are then used one by one as the current exposure image, and the following printing operation is performed based on the current exposure image: ultraviolet light is used to irradiate the resin material through the current exposure image to solidify it, so as to finally print the model layer by layer on the printing platform.

[0003] However, there is often a difference between the molding height and the actual height of the 3D model, resulting in low vertical printing accuracy. Summary of the invention

[0004] In order to solve the above technical problems or at least partially solve the above technical problems, the embodiments of the present disclosure provide a three-dimensional printing method, device, equipment and storage medium.

[0005] A first aspect of an embodiment of the present disclosure provides a three-dimensional printing method, the method comprising:

[0006] Acquire a target exposure image and an adjacent exposure image, wherein the adjacent exposure image is a next frame exposure image corresponding to the target exposure image;

[0007] Determine a top layer image region based on the target exposure image and the adjacent exposure images, wherein the top layer image region is an image region in the target exposure image that is different from the adjacent exposure images;

[0008] Determine the actual model height and estimated forming height corresponding to the top layer image area;

[0009] If the real model height is not equal to the estimated molding height, the molding thickness corresponding to the top layer image area is adjusted during the 3D printing process so that the actual molding height corresponding to the top layer image area is equal to the real model height.

[0010] A second aspect of the embodiments of the present disclosure provides a three-dimensional printing device, the device comprising:

[0011] A first acquisition module is used to acquire a target exposure image and an adjacent exposure image, wherein the adjacent exposure image is a next frame exposure image corresponding to the target exposure image;

[0012] A first determination module is used to determine a top-level image region based on a target exposure image and adjacent exposure images, wherein the top-level image region is an image region in the target exposure image that is different from the adjacent exposure image;

[0013] The second determination module is used to determine the real model height and the estimated forming height corresponding to the top layer image area;

[0014] The adjustment module is used to adjust the molding thickness corresponding to the top layer image area during the three-dimensional printing process if the real model height is not equal to the estimated molding height, so that the actual molding height corresponding to the top layer image area is equal to the real model height.

[0015] A third aspect of an embodiment of the present disclosure provides an electronic device, the server comprising: a processor and a memory, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the processor executes the method of the first aspect above.

[0016] A fourth aspect of an embodiment of the present disclosure provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the method of the first aspect described above can be implemented.

[0017] Compared with the prior art, the technical solution provided by the embodiments of the present disclosure has the following advantages:

[0018] The disclosed embodiment can obtain a target exposure image and an adjacent exposure image, wherein the adjacent exposure image is the next frame exposure image corresponding to the target exposure image; determine the top layer image area based on the target exposure image and the adjacent exposure image, wherein the top layer image area is an image area in the target exposure image that is different from the adjacent exposure image; determine the real model height and the estimated molding height corresponding to the top layer image area; if the real model height is not equal to the estimated molding height, adjust the molding thickness corresponding to the top layer image area during the three-dimensional printing process so that the actual molding height corresponding to the top layer image area is equal to the real model height. It can be seen that by adopting the above technical solution, the top layer image area can be identified from the target exposure image, and the molding thickness corresponding to the top layer image area can be adjusted during the three-dimensional printing process so that the actual molding height corresponding to the top layer image area is equal to the real model height, thereby solving the problem in the prior art that the actual molding height is not equal to the real model height, and thus the vertical printing accuracy can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0021] Figure 1 It is a structural schematic diagram of a three-dimensional model provided by the relevant technology;

[0022] Figure 2 It is a structural schematic diagram of another three-dimensional model provided by the related art;

[0023] Figure 3 is a flow chart of a three-dimensional printing method provided by an embodiment of the present disclosure;

[0024] Figure 4 is a schematic diagram of the structure of a batch of three-dimensional models provided by an embodiment of the present disclosure;

[0025] Figure 5 is a structural schematic diagram of a three-dimensional model provided by an embodiment of the present disclosure;

[0026] Figure 6 is a schematic diagram of the structure of another three-dimensional model provided by an embodiment of the present disclosure;

[0027] Figure 7 is a structural schematic diagram of another three-dimensional model provided by an embodiment of the present disclosure;

[0028] Figure 8 is a structural schematic diagram of another three-dimensional model provided by an embodiment of the present disclosure;

[0029] Fig. 9 is a flow chart of another three-dimensional printing method provided by an embodiment of the present disclosure;

[0030] Fig.10 is a structural schematic diagram of a three-dimensional printing device provided by an embodiment of the present disclosure;

[0031] Fig.11 It is a structural schematic diagram of an electronic device in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0032] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0033] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0034] The applicant has found through research that the main reason for the difference between the formed height and the actual height of the three-dimensional model is that the actual height of the three-dimensional model has no integer multiple relationship with the fixed layer thickness. For example, Figure 1 It is a structural schematic diagram of a three-dimensional model provided by related technology. Figure 2 This is a structural diagram of another three-dimensional model provided by the related art, see Figure 1 and Figure 2 , layerID represents the serial number of the slice, and the height of the part less than a fixed layer thickness h obtained by subtracting the integer multiple of the fixed layer thickness h from the real height of the 3D model hexp is defined as the remaining height hoffset. Figure 1 When the remaining height hoffset is less than 0.5 times the fixed layer thickness h, the printing ends after the printing operation based on the first n exposure images, resulting in the generated printed model's molding height hori being less than the actual height hexp of the 3D model. Figure 2 , when the remaining height is greater than 0.5 times the fixed layer thickness h, after printing based on the first n exposure images, the printing operation is continued based on the n+1 exposure image. Since a printing layer with a fixed layer thickness h is generated by a fixed exposure intensity when printing based on each layer of exposure images, the molding height of the generated printed model is greater than the true height hexp of the three-dimensional model. Therefore, when the true height of the three-dimensional model does not have an integer multiple relationship with the fixed layer thickness, there will be a difference between the molding height of the model and the actual height, and the vertical accuracy is low. In order to solve the above technical problems, the present disclosure provides a three-dimensional printing method, device, medium and electronic device. Below, a three-dimensional printing method provided by the present disclosure is first described in detail.

[0035] Figure 3 1 is a flow chart of a three-dimensional printing method provided by an embodiment of the present disclosure, and the method can be performed by an electronic device. The electronic device can be exemplarily understood as a device such as a mobile phone, a tablet computer, a laptop computer, a desktop computer, a smart TV, etc. Figure 3 As shown, the method provided in this embodiment includes the following steps:

[0036] S310: Acquire a target exposure image and an adjacent exposure image, wherein the adjacent exposure image is a next frame exposure image corresponding to the target exposure image.

[0037] Specifically, the three-dimensional model is sliced ​​from bottom to top with a fixed slice thickness as the interval to obtain N (N is a positive integer greater than 1) slice layers (for example Figure 4 12 slice layers QP) and the exposure images corresponding to each slice layer are shown in FIG. If the target exposure image is the exposure image corresponding to the nth slice layer, then when 1≤n<N, the adjacent exposure image is the exposure image corresponding to the n+1th slice layer, and when n=N, the blank exposure image can be used as the adjacent exposure image.

[0038] It should also be noted that, in the case of printing a single 3D model, the exposure image is obtained by slicing the 3D model alone. In the case of printing multiple 3D models together (for example, Figure 4 The exposure image is obtained by slicing the three 3D models together.

[0039] S320, determining a top-level image region based on the target exposure image and the adjacent exposure images, wherein the top-level image region is an image region in the target exposure image that is different from the adjacent exposure images.

[0040] Specifically, the top image area is the image area corresponding to the top of the three-dimensional model. It should be noted that the top mentioned here includes the local top (e.g. Figure 5 The local top 510 in the middle) and the top of the highest point (e.g. Figure 5 The highest top 520).

[0041] It can be understood that if a certain image area in the target exposure image cannot find the same image area in the adjacent exposure image, it means that the height of the part of the 3D model from which the image area is cut is not enough to obtain the corresponding image area when the slice is performed next time, that is, the image area corresponds to at least part of the top in the 3D model. Based on this, the top image area can be determined by comparing the target exposure image and the adjacent exposure image.

[0042] In some embodiments, S320 may include: performing Boolean subtraction of the target exposure image from the adjacent exposure images to obtain a Boolean subtraction result; and determining the top layer image region based on the Boolean subtraction result.

[0043] In one example, determining the top-level image region based on the Boolean subtraction result may include: directly using the Boolean subtraction result as the top-level image region. In this way, the determination method of the top-level image region can be simple and convenient.

[0044] In another example, determining the top-level image region based on the Boolean subtraction result may include: sequentially performing corrosion processing, noise elimination processing, and dilation and restoration processing on the Boolean subtraction result to obtain the top-level image region.

[0045] It can be understood that the top of the 3D model generally includes two types. The first type is present only in the slice layer corresponding to the target exposure image and does not exist at all in the slice layer corresponding to the adjacent exposure image (e.g. Figure 5 The top 510 shown in the figure), the top image area corresponding to the top layer of this type can be directly obtained by Boolean subtraction; the second type is present in both the slice layer corresponding to the target exposure image and the slice layer corresponding to the adjacent exposure image (such as Figure 6 The local top 610 shown in the figure is different in area between the target exposure image and the adjacent exposure image, so it can also be obtained as the detection result in the Boolean subtraction process. This is also the top image area we expect to obtain. However, in order to eliminate the interference of the slope and other noises, further filtering can be performed, that is, the Boolean subtraction result is first eroded with a parameter α to eliminate noise, and then expanded and restored to achieve the purpose of filtering noise. In this way, the top image area obtained can be more accurate.

[0046] Of course, AI (neural network model) can be used to determine the top layer image area based on the target exposure image and the adjacent exposure images. This application does not limit this.

[0047] S330, determining the actual model height and the estimated forming height corresponding to the top layer image area.

[0048] Specifically, the estimated building height refers to the height of the printed model after exposing the top layer image area with the estimated exposure intensity to obtain the estimated building thickness, wherein the estimated building thickness is a fixed slice layer thickness.

[0049] For example, if the three-dimensional model is sliced ​​from bottom to top with a fixed slice layer thickness h as the spacing, the estimated molding thickness corresponding to each exposure image is h. At this time, if the target exposure image is the exposure image corresponding to the nth slice layer, the estimated molding height hori = n*h.

[0050] Specifically, the real model height is the height of the top corresponding to the top layer image area in the three-dimensional model.

[0051] In some embodiments, determining the real model height corresponding to the top-level image region includes:

[0052] S331, sampling pixels in the top-level image area to obtain a plurality of sampling points.

[0053] Specifically, the sampling points are two-dimensional pixel points sampled in the top-level image area.

[0054] S332. For each sampling point, determine the three-dimensional point corresponding to the sampling point on the three-dimensional model corresponding to the top-level image area, determine the intersection of a straight line passing through the three-dimensional point and extending in the model height direction with the surface of the three-dimensional model, and determine the height corresponding to the sampling point if the difference between the height of the intersection point on the three-dimensional model and the estimated forming height is less than or equal to the estimated forming thickness.

[0055] Specifically, the model height direction is a direction perpendicular to the slice layer. For example, if the plane where the slice layer is located is a plane parallel to the XY plane, then the model height direction is the Z direction.

[0056] Specifically, the height of the intersection point on the three-dimensional model refers to the height of a horizontal plane where the intersection point is located and is parallel to the slice layer.

[0057] Specifically, the three-dimensional point corresponding to the sampling point can be determined according to the mapping relationship between the image coordinates of the pixel points in the top-level image area and the three-dimensional coordinates of the three-dimensional point on the three-dimensional model.

[0058] S333. Determine the real model height corresponding to the top-level image area based on the height corresponding to each sampling point.

[0059] Specifically, the average value of the heights corresponding to the sampling points can be used as the real model height corresponding to the top image area. Of course, the heights corresponding to the sampling points can also be calculated by removing the minimum height and the maximum height, and then the average value is used as the real model height corresponding to the top image area. This application does not limit this.

[0060] For example, see Figure 7 and Figure 8 , randomly collect 3 sampling points from the top image area (such as Figure 7 and Figure 8 ), the three-dimensional coordinates of the three 3D points are obtained according to the image coordinates of the three sampling points, and for each 3D point, a straight line is emitted vertically upward from Z=-∞ at the X-coordinate and Y-coordinate of the 3D point to determine the intersection of the straight line and the surface of the 3D model (e.g. Figure 7 and Figure 8 The square point shown in ), save the Z coordinate of the intersection point in the Z coordinate list, and select the height within the estimated forming layer thickness range from the Z coordinate of the intersection point as the height corresponding to the sampling point (for example Figure 7 and Figure 8 The heights corresponding to the three sampling points are the same), and finally the heights corresponding to the sampling points are averaged to obtain the true model height hexp of the top corresponding to the top image area.

[0061] It can be understood that by setting pixel sampling for the top-level image area to obtain multiple sampling points, determining the heights corresponding to the sampling points, and determining the real model height corresponding to the top-level image area based on the heights corresponding to the sampling points, the method of determining the real model height is simple, convenient, and not bloated, which is conducive to reducing the difficulty of determining the real model height.

[0062] Optionally, the area of ​​the top layer image region is positively correlated with the number of sampling points.

[0063] It can be understood that by setting the area of ​​the top-level image region to be positively correlated with the number of sampling points, when the area of ​​the top-level image region is relatively large, a sufficient number of sampling points can be sampled to determine the real model height corresponding to the top-level image region, which is beneficial to reducing the risk of low accuracy of the calculated real model height due to a small number of sampling points; when the area of ​​the top-level image region is relatively large, a small number of sampling points can be sampled to determine the real model height corresponding to the top-level image region, reducing the amount of calculation and improving the efficiency of determining the real model height.

[0064] Of course, AI may also be used to determine the actual model height corresponding to the top-level image area, and this application does not limit this.

[0065] S340: If the real model height is not equal to the estimated molding height, adjusting the molding thickness corresponding to the top layer image area during the three-dimensional printing process so that the actual molding height corresponding to the top layer image area is equal to the real model height.

[0066] Specifically, the actual molding height is the actual molding height of the top portion of the printed model corresponding to the top layer image region obtained after the top layer image region is exposed. It should be noted that the actual molding height is equal to the real model height, which means that the error between the two is within a preset error range, and the preset error range can be set by those skilled in the art according to actual conditions, and is not limited here.

[0067] Specifically, in the photocuring process, the greater the exposure intensity, the greater the molding thickness obtained by curing a layer of material. Conversely, the smaller the exposure intensity, the smaller the molding thickness obtained by curing a layer of material. Therefore, the exposure intensity can be adjusted by adjusting the image grayscale of the top-layer image area, thereby adjusting the molding thickness corresponding to the top-layer image area.

[0068] It is understandable that when the real model height is not equal to the estimated molding height, if the molding thickness corresponding to the top layer image area is not adjusted as in the related art, the molding thickness corresponding to the top layer image area will be the same as the molding thickness corresponding to other image areas in the target exposure image, both of which are estimated molding thicknesses, resulting in inconsistency between the real model height corresponding to the top layer image area and the estimated molding height, resulting in low vertical printing accuracy. However, in the embodiment of the present disclosure, when the real model height is not equal to the estimated molding height, the molding thickness corresponding to the top layer image area can be adjusted so that the actual molding height corresponding to the top layer image area is equal to the real model height, thereby improving the vertical printing accuracy.

[0069] The disclosed embodiment can identify the top layer image area from the target exposure image, and adjust the molding thickness corresponding to the top layer image area during the three-dimensional printing process so that the actual molding height corresponding to the top layer image area is equal to the real model height, thereby solving the problem in the prior art that the actual molding height is not equal to the real model height. In this way, the vertical printing accuracy can be improved.

[0070] Fig. 9 1 is a flow chart of another three-dimensional printing method provided by an embodiment of the present disclosure. The embodiment of the present disclosure is optimized on the basis of the above embodiment, and the embodiment of the present disclosure can be combined with various optional solutions in one or more of the above embodiments.

[0071] like Fig. 9 As shown, the three-dimensional printing method may include the following steps.

[0072] S910, acquiring a target exposure image and an adjacent exposure image, wherein the adjacent exposure image is a next frame exposure image corresponding to the target exposure image.

[0073] Specifically, S910 is similar to S310 and will not be described in detail here.

[0074] S920. Determine a top-level image region based on the target exposure image and the adjacent exposure images, wherein the top-level image region is an image region in the target exposure image that is different from the adjacent exposure images.

[0075] Specifically, S920 is similar to S320 and will not be described in detail here.

[0076] S930: Determine the actual model height and the estimated forming height corresponding to the top layer image area.

[0077] Specifically, S930 is similar to S330 and will not be described in detail here.

[0078] S940: Determine the remaining height based on the actual model height and the estimated forming height.

[0079] Specifically, see Figure 7If the estimated forming height is less than the actual model height, the remaining height is the difference between the actual model height and the estimated forming height, that is, hoffset = hexp-hori. Figure 8 If the estimated forming height is greater than the actual model height, first subtract the estimated forming thickness from the estimated forming height to obtain the intermediate estimated forming height, and then subtract the intermediate estimated forming height from the actual model height to obtain the remaining height, that is, hoffset = hexp - (hori - h).

[0080] S950. If the estimated molding height is less than the actual model height, the estimated molding thickness is obtained by exposing with the estimated exposure intensity based on the target exposure image, and the compensated molding thickness is obtained by exposing with the compensation exposure intensity based on the top layer image area, wherein the compensated molding thickness is equal to the remaining height.

[0081] Specifically, the molding thickness corresponding to the top layer image area is the sum of the estimated molding thickness and the compensated molding thickness.

[0082] In some embodiments, the compensated molding thickness is obtained based on the top layer image area being exposed with the compensating exposure intensity, including: if the target exposure image is the last layer exposure image, then after exposing with the estimated exposure intensity based on the target exposure image to obtain the estimated molding thickness, the compensated molding thickness is obtained by directly exposing with the compensating exposure intensity based on the top layer image area.

[0083] Specifically, the target exposure image being the last exposure image means that the target exposure image is the exposure image corresponding to the Nth slice layer.

[0084] Specifically, the estimated exposure intensity is the exposure intensity at which the material is irradiated with the target exposure image so that the thickness of a layer of the cured material becomes the estimated molding thickness.

[0085] Specifically, the compensation exposure intensity is an exposure intensity that irradiates the material through the top layer image area so that the thickness of a layer of solidified material is the compensation molding thickness, wherein the compensation molding thickness is equal to the residual height.

[0086] In other embodiments, the compensatory molding thickness is obtained based on the top layer image area exposed with the compensatory exposure intensity, including: if the target exposure image is not the last layer exposure image, then after exposing with the estimated exposure intensity based on the target exposure image to obtain the estimated molding thickness, the compensatory molding thickness is obtained based on the top layer image area and the adjacent exposure images exposed with the compensatory exposure intensity; the method also includes: exposing with the first compensatory exposure intensity based on the adjacent exposure images to obtain the first compensatory molding thickness, wherein the sum of the compensatory molding thickness and the first compensatory molding thickness is the estimated molding thickness.

[0087] Specifically, the first finishing exposure intensity is the exposure intensity at which the material is irradiated by adjacent exposure images so that the thickness of a layer of solidified material is the first finishing molding thickness, wherein the first finishing molding thickness is the difference between the estimated molding thickness and the remaining height.

[0088] For example, Figure 7 As shown in FIG. 1 , if the estimated forming height hori is less than the real model height hexp, if the forming thickness corresponding to the top image area is not adjusted, the actual height of the part corresponding to the top image area after forming will be less than the real model height of the three-dimensional model, so it is necessary to compensate for an exposure action with a thickness of the remaining height hoffset and an exposure image used as the top image area. Specifically, if n=N, then after directly exposing the estimated forming thickness based on the target exposure image with the estimated exposure intensity, an additional exposure action is added to compensate for the forming thickness of the remaining height hoffset and the exposure image used as the top image area. If n<N, after exposing the estimated forming thickness based on the target exposure image with the estimated exposure intensity, the exposure action corresponding to the adjacent exposure images needs to be divided into two sub-processes, wherein the forming thickness of the first sub-process is the remaining height hoffset, and the exposure image used is the Boolean result of the top image area and the adjacent image area; the forming thickness of the second sub-process is the difference between the estimated forming thickness h and the remaining height hoffset (i.e., h-hoffset), and the exposure image used is the adjacent image area.

[0089] It can be understood that by dividing the exposure action of adjacent exposure images into two sub-processes, there is no need to add an additional step of exposing the top-layer image area with a compensated exposure intensity to obtain a compensated molding thickness, so that the adjustment of the molding thickness of the top-layer image area will not increase the exposure steps and will not affect the normal printing of other three-dimensional models that are three-dimensionally printed together.

[0090] S960. If the estimated molding height is greater than the actual model height, exposing the top layer image area with a loss exposure intensity to obtain a loss molding thickness, wherein the loss molding thickness is equal to the remaining height.

[0091] Specifically, the molding thickness corresponding to the top layer image area is the loss molding thickness, that is, the remaining height.

[0092] In some embodiments, the loss forming thickness is obtained by exposing the top layer image area with a loss exposure intensity, including: if the target exposure image is the last layer exposure image, the loss forming thickness is obtained by directly exposing the top layer image area with a loss exposure intensity.

[0093] Specifically, the loss exposure intensity is the exposure intensity that irradiates the material through the top layer image area so that the thickness of a layer of cured material is the loss molding thickness.

[0094] In other embodiments, the loss molding thickness is obtained based on exposing the top layer image area with a loss exposure intensity, including: if the target exposure image is not the last layer exposure image, the loss molding thickness is obtained based on the top layer image area and the adjacent exposure image with a loss exposure intensity; the method also includes: based on the adjacent exposure image, exposing with a second compensating exposure intensity to obtain a second compensating molding thickness, wherein the sum of the compensating molding thickness and the second compensating molding thickness is the estimated molding thickness.

[0095] Specifically, the second finishing exposure intensity is the exposure intensity at which the thickness of a layer of material solidified by irradiating the material with adjacent exposure images is the second finishing molding thickness, wherein the second finishing molding thickness is the difference between the estimated molding thickness and the remaining height.

[0096] For example, see Figure 8 , if the estimated forming height hori is greater than the real model height hexp, if the forming thickness corresponding to the top image area is not adjusted, the actual height of the part corresponding to the top image area after forming will be greater than the real model height of the three-dimensional model. Therefore, it is necessary to replace the original exposure action with the estimated forming thickness h and the exposure image used as the top image area with an exposure action with a forming thickness of the remaining height hoffset and an exposure image used as the top image area. Specifically, if n=N, then the forming thickness of the exposure action of the last layer is directly modified to the remaining height hoffset, and the exposure image is replaced by the target exposure image to the top image area. If n<N, the exposure action corresponding to the adjacent exposure images needs to be divided into two sub-processes, where the forming thickness of the first sub-process is the remaining hoffset, and the exposure image used is the Boolean result of the top image area and the adjacent exposure image; the forming thickness of the second sub-process is the difference between the estimated forming thickness h and the remaining height hoffset (i.e., h-hoffset), and the exposure image used is the adjacent image area.

[0097] It can be understood that by dividing the exposure action of adjacent exposure images into two sub-processes, there is no need to add an additional step of exposing the top-layer image area with a loss exposure intensity to obtain a loss molding thickness, so that the adjustment of the molding thickness of the top-layer image area will not increase the exposure steps and will not affect the normal printing of other three-dimensional models that are three-dimensionally printed together.

[0098] The disclosed embodiment can, when the estimated molding height is less than the actual model height, obtain a compensated molding thickness based on the top layer image area exposed with a compensated exposure intensity; when the estimated molding height is greater than the actual model height, obtain a loss molding thickness based on the top layer image area exposed with a loss exposure intensity, thereby adjusting the molding thickness corresponding to the top layer image area, thereby making the actual molding height corresponding to the top layer image area consistent with the actual model height of the three-dimensional model, thereby improving the vertical printing accuracy.

[0099] Fig.10 is a schematic diagram of the structure of a three-dimensional printing device provided by an embodiment of the present disclosure, and the three-dimensional printing device can be understood as the above-mentioned electronic device or a part of the functional modules in the above-mentioned electronic device. Fig.10 As shown, the three-dimensional printing device 1000 includes:

[0100] A first acquisition module 1010 is used to acquire a target exposure image and an adjacent exposure image, wherein the adjacent exposure image is a next frame exposure image corresponding to the target exposure image;

[0101] A first determining module 1020 is configured to determine a top-level image region based on the target exposure image and the adjacent exposure image, wherein the top-level image region is an image region in the target exposure image that is different from the adjacent exposure image;

[0102] A second determination module 1030 is used to determine the real model height and the estimated forming height corresponding to the top layer image area;

[0103] The adjustment module 1040 is used to adjust the molding thickness corresponding to the top layer image area during the three-dimensional printing process if the real model height is not equal to the estimated molding height, so that the actual molding height corresponding to the top layer image area is equal to the real model height.

[0104] In another embodiment of the present disclosure, the first determining module 1020 may include:

[0105] A first processing submodule, configured to perform a Boolean subtraction of the target exposure image from the adjacent exposure image to obtain a Boolean subtraction result;

[0106] The second processing submodule is used to perform corrosion processing, noise elimination processing and expansion and restoration processing on the Boolean subtraction result in sequence to obtain the top layer image area.

[0107] In yet another embodiment of the present disclosure, the second determining module 1030 may include:

[0108] A sampling submodule, used for sampling pixels of the top-level image area to obtain a plurality of sampling points;

[0109] A first determination submodule is used to determine, for each sampling point, a three-dimensional point corresponding to the sampling point on the three-dimensional model corresponding to the top-level image area, determine an intersection point between a straight line passing through the three-dimensional point and extending in a model height direction and a surface of the three-dimensional model, and determine a height whose difference between the height of the intersection point on the three-dimensional model and the estimated forming height is less than or equal to the estimated forming thickness as the height corresponding to the sampling point;

[0110] The second determining submodule is used to determine the real model height corresponding to the top-level image area based on the height corresponding to each sampling point.

[0111] In yet another embodiment of the present disclosure, the area of ​​the top-level image region is positively correlated with the number of the sampling points.

[0112] In yet another embodiment of the present disclosure, the adjustment module 1040 may include:

[0113] A third determination submodule, configured to determine a remaining height based on the actual model height and the estimated forming height;

[0114] A first exposure submodule is configured to, if the estimated molding height is less than the real model height, expose the target exposure image with an estimated exposure intensity to obtain an estimated molding thickness, and expose the top layer image area with a compensation exposure intensity to obtain a compensated molding thickness, wherein the compensated molding thickness is equal to the remaining height;

[0115] The second exposure submodule is used to expose the top layer image area with loss exposure intensity to obtain a loss molding thickness if the estimated molding height is greater than the actual model height, wherein the loss molding thickness is equal to the remaining height.

[0116] In another embodiment of the present disclosure, the first exposure submodule may include:

[0117] A first exposure unit, configured to obtain the compensated molding thickness by exposing the top layer image area and the adjacent exposure images with the compensation exposure intensity if the target exposure image is not the last exposure image;

[0118] The device also includes: a third exposure submodule, which is used to expose with a first complementary exposure intensity based on the adjacent exposure images to obtain a first complementary molding thickness, wherein the sum of the compensation molding thickness and the first complementary molding thickness is the estimated molding thickness.

[0119] In another embodiment of the present disclosure, the second exposure submodule may include:

[0120] A second exposure unit, configured to obtain the loss molding thickness by exposing the top layer image area and the adjacent exposure images with the loss exposure intensity if the target exposure image is not the last exposure image;

[0121] The device also includes: a fourth exposure submodule, which is used to expose with a second complementary exposure intensity based on the adjacent exposure images to obtain a second complementary molding thickness, wherein the sum of the compensation molding thickness and the second complementary molding thickness is the estimated molding thickness.

[0122] The device provided in this embodiment can execute the method of any of the above embodiments, and its execution method and beneficial effects are similar, which will not be repeated here.

[0123] An embodiment of the present disclosure further provides an electronic device, which includes: a memory, in which a computer program is stored; and a processor, for executing the computer program. When the computer program is executed by the processor, the method of any of the above embodiments can be implemented.

[0124] For example, Fig.11 Schematic diagram of the structure of an electronic device in the embodiment of the present disclosure. Fig.11 , which shows a schematic diagram of the structure of an electronic device 1100 suitable for implementing the embodiment of the present disclosure. The electronic device 1100 in the embodiment of the present disclosure may include but is not limited to mobile terminals such as mobile phones, notebook computers, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), vehicle-mounted terminals (such as vehicle-mounted navigation terminals), etc., and fixed terminals such as digital TVs, desktop computers, etc. Fig.11 The electronic device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present disclosure.

[0125] like Fig.11 As shown, the electronic device 1100 may include a processing device (e.g., a central processing unit, a graphics processing unit, etc.) 1101, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1102 or a program loaded from a storage device 1108 to a random access memory (RAM) 1103. In the RAM 1103, various programs and data required for the operation of the electronic device 1100 are also stored. The processing device 1101, the ROM 1102, and the RAM 1103 are connected to each other via a bus 1104. An input / output (I / O) interface 1105 is also connected to the bus 1104.

[0126] Typically, the following devices may be connected to the I / O interface 1105: an input device 1106 including, for example, a touch screen, a touch pad, a keyboard, a mouse, a camera, a microphone, an accelerometer, a gyroscope, etc.; an output device 1107 including, for example, a liquid crystal display (LCD), a speaker, a vibrator, etc.; a storage device 1108 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1109. The communication device 1109 may allow the electronic device 1100 to communicate with other devices wirelessly or by wire to exchange data. Although Fig.11 The electronic device 1100 is shown with various devices, but it should be understood that it is not required to implement or possess all the devices shown. More or fewer devices may be implemented or possessed instead.

[0127] In particular, according to an embodiment of the present disclosure, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present disclosure includes a computer program product, which includes a computer program carried on a non-transitory computer-readable medium, and the computer program contains program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication device 1109, or installed from a storage device 1108, or installed from a ROM 1102. When the computer program is executed by the processing device 1101, the above-mentioned functions defined in the method of the embodiment of the present disclosure are executed.

[0128] It should be noted that the computer-readable medium disclosed above may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present disclosure, a computer-readable storage medium may be any tangible medium containing or storing a program that may be used by or in combination with an instruction execution system, device or device. In the present disclosure, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, in which a computer-readable program code is carried. This propagated data signal may take a variety of forms, including but not limited to an electromagnetic signal, an optical signal, or any suitable combination of the above. The computer readable signal medium may also be any computer readable medium other than a computer readable storage medium, which may send, propagate or transmit a program for use by or in conjunction with an instruction execution system, apparatus or device. The program code contained on the computer readable medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (radio frequency), etc., or any suitable combination of the above.

[0129] In some embodiments, the client and the server may communicate using any currently known or future developed network protocol such as HTTP (HyperText Transfer Protocol), and may be interconnected with any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network ("LAN"), a wide area network ("WAN"), an internet (e.g., the Internet), and a peer-to-peer network (e.g., an ad hoc peer-to-peer network), as well as any currently known or future developed network.

[0130] The computer-readable medium may be included in the electronic device, or may exist independently without being incorporated into the electronic device.

[0131] The computer-readable medium carries one or more programs. When the one or more programs are executed by the electronic device, the electronic device:

[0132] Acquire a target exposure image and an adjacent exposure image, wherein the adjacent exposure image is a next frame exposure image corresponding to the target exposure image;

[0133] Determine a top layer image region based on the target exposure image and the adjacent exposure images, wherein the top layer image region is an image region in the target exposure image that is different from the adjacent exposure images;

[0134] Determine the actual model height and estimated forming height corresponding to the top layer image area;

[0135] If the real model height is not equal to the estimated molding height, the molding thickness corresponding to the top layer image area is adjusted during the 3D printing process so that the actual molding height corresponding to the top layer image area is equal to the real model height.

[0136] Computer program code for performing the operations of the present disclosure may be written in one or more programming languages ​​or a combination thereof, including, but not limited to, object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., through the Internet using an Internet service provider).

[0137] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present disclosure. In this regard, each square box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some implementations as replacements, the functions marked in the square box can also occur in a sequence different from that marked in the accompanying drawings. For example, two square boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each square box in the block diagram and / or flow chart, and the combination of the square boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0138] The units involved in the embodiments described in the present disclosure may be implemented by software or hardware, wherein the name of a unit does not, in some cases, limit the unit itself.

[0139] The functions described above herein may be performed at least in part by one or more hardware logic components. For example, without limitation, exemplary types of hardware logic components that may be used include: field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), and the like.

[0140] In the context of the present disclosure, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0141] The embodiments of the present disclosure also provide a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the method of any of the above embodiments can be implemented. The execution method and beneficial effects are similar and will not be repeated here.

[0142] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0143] The above description is only a specific embodiment of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A three-dimensional printing method, characterized in that: include: Acquire a target exposure image and an adjacent exposure image, wherein the adjacent exposure image is a next frame exposure image corresponding to the target exposure image; Determining a top layer image region based on the target exposure image and the adjacent exposure image, wherein the top layer image region is an image region in the target exposure image that is different from the adjacent exposure image; Determine the actual model height and the estimated forming height corresponding to the top layer image area; If the real model height is not equal to the estimated forming height, the forming thickness corresponding to the top layer image area is adjusted during the 3D printing process so that the actual forming height corresponding to the top layer image area is equal to the real model height.

2. The method according to claim 1, characterized in that: The determining of the top layer image area based on the target exposure image and the adjacent exposure image comprises: Perform a Boolean subtraction of the target exposure image from the adjacent exposure image to obtain a Boolean subtraction result; The Boolean subtraction result is sequentially subjected to corrosion processing, noise elimination processing and expansion restoration processing to obtain the top layer image area.

3. The method according to claim 2, characterized in that The determining the real model height corresponding to the top-level image area includes: Performing pixel sampling on the top-level image area to obtain a plurality of sampling points; For each sampling point, determine the three-dimensional point corresponding to the sampling point on the three-dimensional model corresponding to the top-level image area, determine the intersection of a straight line passing through the three-dimensional point and extending in the model height direction with the surface of the three-dimensional model, and determine the height of the intersection point on the three-dimensional model whose difference with the estimated forming height is less than or equal to the estimated forming thickness as the height corresponding to the sampling point; The real model height corresponding to the top layer image area is determined based on the height corresponding to each of the sampling points.

4. The method according to claim 3, characterized in that The area of ​​the top layer image region is positively correlated with the number of the sampling points.

5. The method according to claim 1, characterized in that If the real model height is not equal to the estimated forming height, adjusting the forming thickness corresponding to the top layer image area during the three-dimensional printing process so that the actual forming height corresponding to the top layer image area is equal to the real model height, including: determining a remaining height based on the actual model height and the estimated forming height; If the estimated molding height is less than the real model height, exposing with the estimated exposure intensity based on the target exposure image to obtain the estimated molding thickness, and exposing with the compensation exposure intensity based on the top layer image area to obtain the compensation molding thickness, wherein the compensation molding thickness is equal to the remaining height; If the estimated forming height is greater than the actual model height, a loss forming thickness is obtained by exposing the top layer image area with a loss exposure intensity, wherein the loss forming thickness is equal to the remaining height.

6. The method according to claim 5, characterized in that The exposing the top layer image area with a compensation exposure intensity to obtain a compensation molding thickness comprises: If the target exposure image is not the last exposure image, exposing the top layer image area and the adjacent exposure images with the compensation exposure intensity to obtain the compensation molding thickness; The method further includes: exposing with a first complementary exposure intensity based on the adjacent exposure images to obtain a first complementary molding thickness, wherein the sum of the compensation molding thickness and the first complementary molding thickness is an estimated molding thickness.

7. The method according to claim 5, characterized in that The step of exposing the top layer image area with a loss exposure intensity to obtain a loss forming thickness comprises: If the target exposure image is not the last exposure image, exposing the top layer image area and the adjacent exposure image with the loss exposure intensity to obtain the loss forming thickness; The method further includes: exposing with a second complementary exposure intensity based on the adjacent exposure images to obtain a second complementary molding thickness, wherein the sum of the compensation molding thickness and the second complementary molding thickness is an estimated molding thickness.

8. A three-dimensional printing device, characterized in that: include: A first acquisition module, used to acquire a target exposure image and an adjacent exposure image, wherein the adjacent exposure image is a next frame exposure image corresponding to the target exposure image; A first determining module, configured to determine a top-level image region based on the target exposure image and the adjacent exposure image, wherein the top-level image region is an image region in the target exposure image that is different from the adjacent exposure image; A second determination module is used to determine the real model height and the estimated forming height corresponding to the top layer image area; The adjustment module is used to adjust the molding thickness corresponding to the top layer image area during the three-dimensional printing process if the real model height is not equal to the estimated molding height, so that the actual molding height corresponding to the top layer image area is equal to the real model height.

9. An electronic device, characterized in that: include: A processor and a memory, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the processor executes the method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

Images