Liquid replenishment device and semiconductor process apparatus

CN119495591BActive Publication Date: 2026-06-23BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Filing Date
2023-08-15
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

In existing semiconductor process equipment, the liquid source is not completely decomposed before entering the process chamber, which leads to defects and excessive particles in the silicon dioxide film.

Method used

A decomposer is installed upstream of the ignition chamber to decompose the liquid source twice through the inner and outer cavity structure. Combined with oxygen and hydrogen supply pipelines, this ensures that the liquid source is completely decomposed before entering the process chamber.

Benefits of technology

It significantly improved the decomposition rate of the liquid source, reduced the possibility of defects in the silica film, and improved the preparation quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a liquid supplementing device and a semiconductor process equipment, and relates to the technical field of semiconductors, and is designed to solve the problem of incomplete decomposition of a liquid source before entering a process chamber. The liquid supplementing device is applied to the semiconductor process equipment, the semiconductor process equipment comprises an ignition chamber and a process chamber, the liquid supplementing device comprises a liquid source input assembly and a decomposer, the decomposer has a decomposition chamber, the decomposition chamber is used for decomposing the liquid source, an inlet of the decomposition chamber is communicated with an outlet of the liquid source input assembly, an outlet of the decomposition chamber is used for communicating with an inlet of the ignition chamber, and an outlet of the ignition chamber is communicated with a gas inlet of the process chamber of the semiconductor process equipment. The liquid supplementing device provided by the application can improve the decomposition rate of the liquid source before entering the process chamber.
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